Liquid circulation device, liquid circulation processing method, and liquid circulation system for use of processing liquid in manufacturing

Abstract

The embodiment of the invention provides a liquid circulation device, a liquid circulation processing method and a liquid circulation system for processing liquid used in the manufacturing process of a part bearing part, and relates to the technical field of processing liquid circulation. The liquid circulation device comprises: a main bath containing a treatment liquid; the bottom of the main bath tank is connected with the bottom of the auxiliary bath tank, so that the treatment liquid can flow to the bottom of the auxiliary bath tank from the bottom of the main bath tank, and the treatment liquid can flow into the auxiliary bath tank; the overflow part is attached to the main bath, and the overflow part is communicated with the main bath, so that the treatment liquid can flow into the overflow part from the main bath. According to the liquid circulation device, different types of impurities and particles can be effectively removed in the process of manufacturing the part bearing part, the liquid circulation device does not need a large independent filtering device, the manufacturing cost and manpower loss are effectively reduced, the liquid circulation device can effectively circulate the treatment liquid, and the production efficiency is improved. Therefore, the treating fluid is possible to be reused, and the production cost is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of processing liquid circulation, and particularly to a liquid circulation device, a liquid circulation processing method, and a liquid circulation system for using a processing liquid in the manufacturing process of a component carrier. Background Art

[0002] In recent years, in the process of manufacturing component carriers, especially the manufacturing of high-end component carriers, high-end component carriers are directly connected to logic chips and have very fine circuit structures. Even very microscopic foreign matters can cause significant damage to product quality and functions. Therefore, how to minimize external foreign matters (FM) has become a huge challenge in the field. For example, in the process of manufacturing component carriers, foreign matters may come from various aspects of the environment. For chemical processes (wet processes), in addition to foreign matters from the external environment, the chemical processes themselves are affected by chemical reactions during production, and many other particles will be generated in the chemical solution tank, thus affecting the product yield. More specifically, foreign matters in the electroless copper plating process can cause a loss of up to 3.6% in the yield of inner layer optical inspection and electrical performance testing of the product.

[0003] The traditional methods adopted in the industry are more about using a filtration system to screen out impurities and particles generated during the production process. However, its filtration means are single and cannot effectively remove all impurities and particles. On the one hand, the traditional filtration system requires a relatively large independent filtration device, increasing the manufacturing cost, and requires manual tracking of the filtration process, such as real-time monitoring of the machine and manual replacement of the filter element, etc., consuming a lot of manpower. On the other hand, the traditional filtration system needs to use an electric pump to transport the liquid from the main bath to the filtration device, which requires strict optical cable design and control software configuration. Moreover, the price of the processing liquid used in the manufacturing process of component carriers is very high. The traditional filtration system can only use the expensive processing liquid once, resulting in waste of the processing liquid that could have been reused again, and also increasing the production cost indirectly. Summary of the Invention

[0004] To solve the above problems, the object of the present invention is to provide a liquid circulation device, a liquid circulation treatment method, and a liquid circulation system for using a treatment liquid in the manufacturing process of a component carrier, which avoid the use of a traditional electric pump, save energy and electricity, and can also achieve the circulation of the treatment liquid. The liquid circulation in the present invention refers to using chemical potions or specially treated treatment liquids (such as DI water) used in the chemical process of the component carrier manufacturing process to form various structures of the component carrier, as well as treating and cleaning the component carrier. The cleaning liquid used in the process of treating and cleaning the component carrier is expensive. Therefore, from the perspective of cost and sustainable development, the liquid circulation of the treatment liquid is introduced into the production and manufacturing process. The liquid circulation device is used to achieve the liquid circulation of the treatment liquid, the liquid circulation treatment method is used to achieve the liquid circulation of the treatment liquid in the liquid circulation device, and the liquid circulation system includes the liquid circulation device for achieving the liquid circulation of the treatment liquid. The liquid circulation device, liquid circulation treatment method, and liquid circulation system using the treatment liquid have different treatment methods for different types of impurities and particles during the manufacturing process of the component carrier, can effectively remove different types of impurities and particles, and the liquid circulation device does not require a large and energy-consuming independent filtering device. Because the electric pump is avoided, the effect of saving energy and electricity is achieved. At the same time, there is no need for manual tracking of the filtering process throughout, effectively reducing the manufacturing cost and manpower loss, and improving the processing speed and frequency, and enabling parallel production of products and liquid treatment. And the liquid circulation device can effectively circulate the treatment liquid, making it possible to reuse the treatment liquid, not only reducing the production cost indirectly, but also providing a solution for the sustainable development of energy in the manufacturing of component carriers.

[0005] In a first aspect, the present invention provides a liquid circulation device for using a treatment liquid in the manufacturing process of a component carrier, including: a main bath filled with the treatment liquid; a sub-bath, the bottom of the main bath is connected to the bottom of the sub-bath, so that the treatment liquid can flow from the bottom of the main bath to the bottom of the sub-bath, and the treatment liquid can flow into the sub-bath; an overflow part attached to the main bath, the overflow part is communicated with the main bath, so that the treatment liquid can flow from the main bath into the overflow part; the overflow part is configured such that when the treatment liquid in the main bath reaches the maximum liquid level, it flows into the overflow part; wherein, the maximum liquid level of the treatment liquid in the main bath is different from the maximum liquid level of the treatment liquid in the sub-bath, and the maximum liquid level of the treatment liquid in the main bath is higher than the maximum liquid level of the treatment liquid in the sub-bath.

[0006] In some possible implementation manners, the liquid circulation device further includes: a main diversion pipe communicated with the main bath, the sub-bath, and the overflow part, so that the treatment liquid can flow out from the sub-bath and the overflow part through the main diversion pipe.

[0007] In some possible implementations, the liquid circulation device further includes: a first passage through which the main flow pipe communicates with the auxiliary bath so that the processing liquid can flow into the auxiliary bath through the first passage; a second passage through which the auxiliary bath communicates with the main flow pipe so that the processing liquid can flow out of the auxiliary bath through the second passage; and a third passage through which the overflow portion communicates with the main flow pipe so that the processing liquid can flow out of the overflow portion through the third passage.

[0008] In some possible implementations, a filtering portion is provided in the first passage, and the processing liquid is filtered before flowing into the auxiliary bath.

[0009] In some possible implementations, a partition is provided in the auxiliary bath. The partition is configured to divide the auxiliary bath into a liquid inlet portion and a liquid outlet portion, and define the maximum liquid level that the processing liquid in the auxiliary bath can reach. When the processing liquid enters from the liquid inlet portion and the maximum liquid level of the processing liquid exceeds the height of the partition, the processing liquid can flow out of the liquid outlet portion through the second passage.

[0010] In some possible implementations, the partition is configured as a telescopic member, and the height of the partition is adjustable.

[0011] In some possible implementations, the liquid inlet portion is configured with a liquid inlet, and the liquid inlet is provided on the bottom wall of the liquid inlet portion.

[0012] In some possible implementations, a filter screen is provided in the liquid inlet portion.

[0013] In some possible implementations, the overflow portion communicates with the main bath through an overflow port, and the overflow port is configured to be close to the upper side of the main bath.

[0014] In some possible implementations, the bottom wall of the main bath is provided as an inclined plane, and the height of the lower pipe wall of the main flow pipe is set to be not greater than the lowest height of the bottom wall.

[0015] In some possible implementations, the liquid circulation device further includes: a main flow conduit configured with a first valve and a second valve, the first valve and the second valve being configured as solenoid valves; a first passage configured with a first diversion conduit and a second diversion conduit, the first diversion conduit being configured to communicate with a portion of the main flow conduit before the first valve, and both the first diversion conduit and the second diversion conduit communicate with the filtration unit; a second passage configured with a third diversion conduit, the third diversion conduit being configured to communicate with a portion of the main flow conduit between the first valve and the second valve; the first diversion conduit is configured with a third valve and a fourth valve, the third valve being set as a solenoid valve and the fourth valve being set as a one-way valve; the second diversion conduit is configured with a fifth valve and a sixth valve, the fifth valve and the sixth valve being set as solenoid valves; the third diversion conduit is configured with a seventh valve and an eighth valve, the seventh valve being set as a solenoid valve and the eighth valve being set as a one-way valve; a third passage configured with a fourth diversion conduit, the fourth diversion conduit communicating with the main flow conduit; the fourth diversion conduit is provided with a ninth valve and a tenth valve, the ninth valve being set as a solenoid valve and the tenth valve being set as a one-way valve.

[0016] In some possible implementations, the filtration unit is configured with a replaceable filter element.

[0017] In some possible implementations, the diameter size of the main flow conduit is configured to be greater than the diameter sizes of the first diversion conduit, the second diversion conduit, the third diversion conduit, and the fourth diversion conduit.

[0018] In some possible implementations, the liquid circulation device further includes: a treatment liquid injection device, one end of which communicates with the liquid supply system and the other end communicates with the main bath, the treatment liquid is supplied by the liquid supply system and can flow into the main bath through the treatment liquid injection device.

[0019] In some possible implementations, the treatment liquid injection device is connected to one end of the fourth passage, and the other end of the fourth passage is connected to the main flow conduit.

[0020] In a second aspect, the present invention provides a liquid circulation method for using a treatment liquid during the manufacturing process of a component carrier, the liquid circulation method being applied to the above liquid circulation device, and the liquid circulation method includes: causing the treatment liquid to flow out of the main bath through the main flow conduit; adjusting the liquid levels of the main bath and the auxiliary bath so that the liquid level of the main bath is higher than that of the auxiliary bath; causing the treatment liquid to flow into the auxiliary bath through the first passage communicating with the main flow conduit for static filtration; causing the treatment liquid filtered through the auxiliary bath to flow into the main flow conduit through the second passage, and then flow back to the main bath through the main flow conduit, or flow into the fourth passage through the main flow conduit and then flow back to the treatment liquid injection part through the fourth passage; and causing the treatment liquid to flow into the main flow conduit through the third passage from the overflow part, and then flow back to the main bath through the main flow conduit, or flow into the fourth passage through the main flow conduit and then flow back to the treatment liquid injection part through the fourth passage.

[0021] In some possible implementations, the step of allowing the processing liquid to flow out of the main bath through the main conduit further includes: when the workpiece to be cleaned is not being cleaned in the main bath, keeping the first valve and the processing liquid injection device closed, opening the third valve and the fourth valve, so that the processing liquid flows from the main bath into the first diversion pipe through the main conduit, and flows into the filtering device through the first diversion pipe and is filtered by the filter element.

[0022] In some possible implementations, the step of allowing the processing liquid to flow into the auxiliary bath through the first passage communicating with the main conduit for static filtration further includes: after the processing liquid is filtered by the filter element in the filtering device for a period of time, opening the fifth valve, so that the processing liquid, relying on gravitational potential energy, flows through the second diversion pipe communicating with the first diversion pipe, through the liquid inlet of the auxiliary bath, and into the liquid inlet part of the auxiliary bath for static filtration.

[0023] In some possible implementations, the step of allowing the processing liquid filtered by the auxiliary bath to flow out through the second passage further includes: opening the seventh valve and the eighth valve, so that the processing liquid in the liquid outlet part of the auxiliary bath flows out through the main conduit communicated with the third diversion pipe.

[0024] In some possible implementations, the liquid circulation processing method further includes: when the workpiece to be cleaned is placed in the main bath for cleaning, closing the valves of the first passage and the second passage, opening the ninth valve and the tenth valve of the fourth diversion pipe configured in the third passage, so that the processing liquid flowing from the main bath into the overflow part through the overflow port flows out through the fourth diversion pipe and via the main conduit.

[0025] In some possible implementations, the liquid circulation processing method further includes: adjusting the liquid levels of the main bath and the auxiliary bath to make the liquid level of the main bath lower than that of the auxiliary bath to obtain the gravitational potential energy of the processing liquid, and at the same time closing the second valve and the processing liquid injection device, so that the processing liquid flowing through the third diversion pipe or the processing liquid flowing through the fourth diversion pipe flows to the main conduit, opening the first valve, and the processing liquid, relying on gravitational potential energy, flows back into the main bath through the main conduit for recycling the processing liquid.

[0026] In some possible implementations, the liquid circulation processing method further includes: opening the fifth valve and the sixth valve to empty the processing liquid in the auxiliary bath.

[0027] In a third aspect, the present invention provides a liquid circulation system for using a processing liquid in the manufacturing process of a component carrier, including: a processor, a memory, a signal transceiver, and a bus. The memory stores machine-readable instructions executable by the processor. When the liquid processing system runs, the processor communicates with the memory through the bus. The processor executes the machine-readable instructions and sends the machine-readable instructions through the signal transceiver to execute the steps of the above-mentioned liquid circulation processing method.

[0028] The technical solution disclosed by the present invention has at least the following technical effects:

[0029] The present invention relates to a liquid circulation device, a liquid circulation treatment method, and a liquid circulation system for using a treatment liquid in the manufacturing process of a component carrier. Through the connection mode among the main bath, the sub-bath, and the overflow part, and in combination with the cooperation of the diversion pipes and valve switches included in each passage, by adjusting the maximum liquid level height of the treatment liquid and relying on the gravitational potential energy to circulate the treatment liquid, after the treatment liquid is filtered through the sub-bath and the overflow part, it can finally be circulated back to the main bath. During the manufacturing process of the component carrier, different treatment methods are adopted for different types of impurities and particles, which can effectively remove different types of impurities and particles. Moreover, this liquid circulation device does not require a large independent filtration device, does not require manual full-process tracking of the filtration process, and does not require a pump device with a large motor power, effectively reducing the manufacturing cost and labor loss. In addition, this liquid circulation device can effectively circulate the treatment liquid, making it possible to reuse the treatment liquid, thereby reducing the production cost indirectly. Description of the Drawings

[0030] In the following description of several specific embodiments of the present invention provided only by way of non-limiting illustration with reference to the accompanying drawings, the present invention will be better understood, and further objects, details, features, and advantages of the present invention will become more apparent. In the drawings:

[0031] Figure 1 A schematic structural diagram of a liquid circulation device for using a treatment liquid in the manufacturing process of a component carrier provided by an embodiment of the present invention is shown;

[0032] Figure 2 A schematic flow chart of a liquid circulation method for using a treatment liquid in the manufacturing process of a component carrier provided by an embodiment of the present invention is shown;

[0033] Figure 3 A schematic structural diagram of a liquid circulation system for using a treatment liquid in the manufacturing process of a component carrier provided by an embodiment of the present invention is shown. Detailed Embodiments

[0034] Now, reference will be made in detail to the exemplary embodiments, examples of which are shown in the accompanying drawings, in which the same reference numerals always denote the same elements. In this regard, the exemplary embodiments may have different forms and should not be construed as limited to the description set forth herein.

[0035] It should also be noted that, for the sake of clarity, not all features of the actual specific embodiments are described and illustrated in the specification and the drawings. Additionally, in order to avoid obscuring the technical solutions of interest to the present invention with unnecessary details, only the arrangement structures closely related to the technical content of the present invention are described and illustrated in the specification and the drawings, while other details that are not closely related to the technical content of the present invention and are known to those skilled in the art are omitted.

[0036] Accordingly, the exemplary embodiments of the present invention will be described in detail below with reference to the accompanying drawings. To make the objectives, technical solutions, and advantages of the exemplary embodiments of the present invention clearer, the exemplary embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However, those of ordinary skill in the art can understand that in the exemplary embodiments of the present invention, many technical details are provided to help readers better understand the present invention. However, even without these technical details and various changes and modifications based on the following exemplary embodiments, the technical solutions claimed by the present invention can still be implemented. The following division of the exemplary embodiments is for convenience of description and should not constitute any limitation on the specific implementation manners of the present invention. The exemplary embodiments can be combined and cross-referenced with each other on the premise of not being contradictory.

[0037] Regarding the disclosure of the present invention, unless otherwise specifically stated, the singular includes the plural and vice versa. The words "and" and "or" should be both conjunctive and disjunctive. The words "any" and "all" both mean "any and all". It should also be understood that although ordinal terms such as "first", "second", and "third" are used herein to describe various elements, components, regions, layers, and / or sections, these elements, components, regions, layers, and / or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer, and / or section from other elements, components, regions, layers, and / or sections. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or are inherent to these processes, methods, products, or devices.

[0038] In the context of the present application, the term "component carrier" may specifically represent any support structure that can accommodate one or more components thereon and / or therein to provide mechanical support and / or electrical connection. In other words, the component carrier can be configured as a mechanical and / or electronic carrier for components. In particular, the component carrier can be one of a printed circuit board, an organic interposer, a metal core substrate, an inorganic substrate, and an IC (integrated circuit) substrate. The component carrier can also be a hybrid board combining different types of the above-mentioned component carriers.

[0039] In an embodiment, the component carrier is configured as one of a printed circuit board, a substrate (in particular an IC substrate), and an interposer. In the context of the present application, the term "printed circuit board" (PCB) may in particular denote a plate-shaped component carrier formed by laminating a plurality of electrically conductive layer structures with a plurality of electrically insulating layer structures, the lamination being effected, for example, by applying pressure and / or by supplying heat energy. As a preferred material for PCB technology, the electrically conductive layer structures are made of copper, while the electrically insulating layer structures may include, for example, resin and / or glass fiber, so-called prepregs, or FR4 material, PID, or ABF. By forming holes through the laminate, for example in a laser-drilling or mechanical-drilling manner, and by partially or completely filling the holes with an electrically conductive material (in particular copper) to form vias or any other through-hole connection, the individual electrically conductive layer structures can be connected to one another in the desired manner. The filled holes connect the entire stack (the through-hole connections extend through a plurality of layers or the entire stack), or, the filled holes connect at least two electrically conductive layers, and the filled holes are referred to as vias. Similarly, optical interconnects may be formed through the respective layers of the stack to receive an electro-optical circuit board (EOCB). In addition to one or more components that may be embedded in the printed circuit board, the printed circuit board is generally configured to receive one or more components on one surface or on opposite two surfaces of the plate-shaped printed circuit board. The one or more components may be connected to the respective main surfaces by soldering. The dielectric part of the PCB may include a resin with reinforcing fibers (such as glass fibers).

[0040] In the context of the present application, the term "substrate" may specifically denote a small component carrier. Relative to a PCB, a substrate may be a relatively small component carrier on which one or more components can be mounted and may serve as a connection medium between one or more chips and another PCB. For example, a substrate may have approximately the same size as the components (especially electronic components) to be mounted thereon (e.g., in the case of a chip-scale package (CSP)). In another embodiment, the substrate may be substantially larger than the allocated components (e.g., flip-chip ball grid array - FCBGA - configuration). More specifically, a substrate may be understood as a carrier for electrical connectors or electrical networks and as a component carrier comparable to a printed circuit board (PCB) but having a considerably high density of lateral and / or vertical connectors. Lateral connectors are, for example, conduction paths, and vertical connectors may be, for example, drilled holes. These lateral and / or vertical connectors are arranged within the substrate and may be used to provide electrical, thermal, and / or mechanical connections between the accommodated components or non-accommodated components (such as bare wafers), especially IC chips, and the printed circuit board or an intermediate printed circuit board. Thus, the term "substrate" also includes an "IC substrate". The dielectric part of the substrate may include a resin having reinforcing particles (such as reinforcing spheres, especially glass spheres).

[0041] In the context of the present application, the term "chemical process" may specifically be referred to as a wet process, which plays a crucial role in the manufacture of various components (such as component carriers) in electronic products. Conductive and insulating structures such as lines, apertures, pads, dielectric layers, solder masks, etc. in the product can be formed and processed quickly and effectively through chemical reactions. In the chemical process, various chemical solutions are used, and at the same time, water with different properties is also used to process or clean the product, so that while the product forms the designed pattern, it also remains clean and free from contamination or damage. Whether it is chemical solution or specially treated water, they are all costly.

[0042] In the context of the present application, the term "main bath" may specifically denote a container for holding a processing liquid and is mainly used for processing semi-finished component carriers (placing the semi-finished component carriers in this container filled with the processing liquid for chemical treatment or cleaning). Therefore, there will be a large amount of impurities (FM, foreign matter) after product processing in the main bath. The accommodation size of the main bath can accommodate at least one whole uncut component carrier. Preferably, the size of the main bath can accommodate at least one basket or one tray of uncut component carriers. Usually, one basket or one tray contains multiple component carriers (6 - 140 pieces). Therefore, when the component carriers are placed in the main bath, a large amount of impurities of different sizes and natures will be left in the bath after the processing liquid has processed a large number of products.

[0043] In the context of the present application, the term "auxiliary bath" may specifically refer to a container for filtering / circulating the processing liquid. As an important part of the entire circulation device, it is arranged corresponding to the main bath, that is, when setting, the relative position, height, and size relationship with the main bath are considered to realize the principle of gravitational potential energy of the entire circulation system, so as to be used intelligently, efficiently, sustainably, and economically in the process of participating in filtering / circulating the processing liquid. The auxiliary bath is mainly used in the present invention to hold the liquid participating in filtration in the main bath. When the position of the held liquid is higher than the position of the main bath, the auxiliary bath serves as a transfer station for filtration or circulation and at least partially participates in the filtration and circulation work of the entire circulation system.

[0044] In the context of the present application, the term "overflow part" may specifically refer to a container for holding the processing liquid overflowing from the main bath. The overflow part is attached to the main bath and is used to participate in the process of filtering / circulating the processing liquid. When the liquid level is higher than the lowest position of the overflow port, the liquid flows into the overflow part through the overflow port and flows to the corresponding pipeline of the circulation device to participate in filtration or circulation. At the same time, the setting of the overflow part can also adjust the height of the liquid level in the main bath in real time, and this structure can also make the production environment cleaner.

[0045] In the context of the present application, the term "liquid level" may specifically refer to the height corresponding to the liquid surface of the processing liquid in the main bath and the auxiliary bath, that is, the maximum liquid level represents the maximum height that the processing liquid can reach in the main bath and the auxiliary bath.

[0046] In the context of the present application, the term "main diversion pipe" may specifically refer to a relatively thick diversion pipe connected to the bottom of the main bath, and the main diversion pipe is also interconnected with other thinner branch diversion pipes.

[0047] In the context of the present application, the term "separator" may specifically refer to a retractable baffle provided in the auxiliary bath for freely adjusting the liquid level in the auxiliary bath and directly participating in the process of filtering / circulating the processing liquid.

[0048] In the context of the present application, the term "valve" may specifically refer to solenoid valves and check valves provided in each passage. The solenoid valve is an industrial device controlled by electricity and is a basic automation component used to control the flow of the processing liquid. The solenoid valve can cooperate with different circuits to achieve the expected control, and the control accuracy and flexibility can be guaranteed. The check valve, also known as the non-return valve or reflux valve, is used to prevent the backflow of the processing liquid. The solenoid valves and check valves in each passage are all used to control the flow of the processing liquid and directly participate in the process of filtering / circulating the processing liquid.

[0049] In the context of this application, the term "filter" may specifically refer to a component provided with a filter medium, and when the treated liquid flows into the filter, the filter medium can filter solid particles and floating impurities in the treated liquid. The filter is connected to at least one guide pipe, so that the treated liquid passing through the filter enters the circulation system after being filtered and cleaned in the filter.

[0050] In the context of the present application, the term "gravitational potential energy" may specifically refer to the energy that the treatment liquid possesses by flowing under the action of gravity. In the present application, the height of the auxiliary bath relative to the main bath is adjustable. When the height difference between the auxiliary bath and the main bath is certain (preferably 7-15 cm), the treatment liquid in the main bath can flow into the auxiliary bath through the passage with the help of gravity potential energy. Conversely, the treatment liquid in the auxiliary bath can also flow back to the main bath through the passage with the help of gravity potential energy.

[0051] Next, a schematic structural diagram of a liquid circulation device for using a processing liquid in a component carrier manufacturing process disclosed in the present invention will be described in detail with reference to the accompanying drawings. Figure 1 , Figure 1 It is a schematic structural diagram of a liquid circulation device for using a processing liquid in a component carrier manufacturing process provided by an embodiment of the present invention.

[0052] like Figure 1 As shown, the liquid circulation device includes a main bath 10, a sub-bath 20 and an overflow portion 30. The main bath 10 is filled with a treatment liquid, and the bottom of the main bath is connected to the bottom of the sub-bath 20, so that the treatment liquid can flow from the bottom of the main bath 10 to the bottom of the sub-bath 20, and the treatment liquid can flow into the sub-bath 20. The overflow portion 30 is attached to the main bath 10, and the overflow portion 30 is connected to the main bath 10, so that the treatment liquid can flow from the main bath 10 into the overflow portion 30.

[0053] Specifically, Figure 1 As shown, the main bath 10 and the auxiliary bath 20 are connected to each other in the following manner. An opening is provided at the bottom of the main bath 10, and the main guide pipe 11 is connected to the opening for guiding out the treatment liquid contained in the main bath 10. The first passage 100 is provided with a first guide pipe 101 having one end connected to the main guide pipe 11, and the other end of the first guide pipe 101 is connected to one end of a second guide pipe 102 provided in the first passage 100 through a filter 13, and the other end of the second guide pipe 102 is connected to a liquid inlet 2021 of a liquid inlet portion 202 of the auxiliary bath 20.

[0054] In order to make the effect of treating liquid filtration more remarkable, a small amount of activated carbon may be attached to the inner surface of the pipes of the first diversion pipe 101 and the second diversion pipe 102 arranged in the first passage 100, so that when the treating liquid flows in the first diversion pipe 101 and the second diversion pipe 102, some impurities and particles carried by it can be adsorbed by the activated carbon inside the pipes. Or a grid or pores may be provided on the inner surface of the pipes of the first diversion pipe 101 and the second diversion pipe 102 arranged in the first passage 100, so that when the treating liquid flows in the first diversion pipe 101 and the second diversion pipe 102, the larger impurities and particles carried by it are blocked in the grid or pores provided on the inner surface of the pipes.

[0055] As described above, the filter part 13 arranged on the first diversion pipe 101 is provided with a replaceable filter element 131, and the filter element can be made of polypropylene material or activated carbon material. The replacement of the filter element 131 can be carried out manually, such as replacing it after the treating liquid circulates a certain number of times in the liquid circulation device or after a specific time. The replacement of the filter element 131 can also be monitored and replaced by a computer program, such as the computer program monitors the model of the filter element 131 to observe whether the filter element 131 is filled with impurities for subsequent manual or manpower-free replacement.

[0056] As described above, at the liquid inlet 2021 of the liquid inlet part 202 of the auxiliary bath 20 connected to the other end of the second diversion pipe 102, when the treating liquid enters the liquid inlet part 202 through the liquid inlet 2021, the treating liquid filtered through the inner surface of the pipes of the first diversion pipe 101 and the second diversion pipe 102 arranged in the first passage 100 and through the filter element 131 of the filter part 13 will be filtered again by the filter screen arranged in the liquid inlet part 202, further adsorbing the impurities and particles in the treating liquid.

[0057] Specifically, as Figure 1 shown, a partition member 201 is arranged in the auxiliary bath 20, and the partition member 201 is configured to divide the auxiliary bath 20 into a liquid inlet part 202 and a liquid outlet part 203. The volume of the liquid outlet part 203 can be the same as or different from the volume of the liquid inlet part 202. The partition member 201 is configured as a telescopic member, that is, the height of the partition member 201 is adjustable. By adjusting the height of the partition member 201 in a telescopic manner, the maximum liquid level that the treating liquid in the auxiliary bath 20 can reach is limited. When the maximum liquid level of the treating liquid in the liquid inlet part 202 exceeds the height of the partition member 201, the treating liquid flows into the liquid outlet part 203. And it flows out through the second passage 200 communicated with the liquid outlet part 203.

[0058] Specifically, as Figure 1As shown, the second passage 200 is configured with a third diversion pipe 204. One end of the third diversion pipe 204 communicates with the liquid outlet portion 203, and the other end communicates with the main diversion pipe 11, so that the processing liquid can enter the main diversion pipe 11 through the third diversion pipe 204 and flow back to the main bath 10.

[0059] As Figure 1 shown, the overflow portion 30 is attached to the main bath 10. The overflow portion 30 communicates with the main bath 10, so that when the processing liquid in the main bath 10 reaches the maximum liquid level, it can flow from the main bath 10 into the overflow portion 30. At the same time, in order to enable the processing liquid to flow smoothly from the main bath 10 to the sub-bath 20, the maximum liquid level of the processing liquid in the main bath 10 is different from the maximum liquid level of the processing liquid in the sub-bath 20, and the maximum liquid level of the processing liquid in the main bath 10 is higher than the maximum liquid level of the processing liquid in the sub-bath 20. At the same time, to adjust the maximum liquid level of the processing liquid in the sub-bath 20 relative to the maximum liquid level of the processing liquid in the main bath 10, the sub-bath 20 as a whole is configured to be able to freely adjust its height.

[0060] Specifically, the overflow portion 30 communicates with the main bath 10 through an overflow port 14. The overflow port 14 is configured to be close to the upper side of the main bath 10. When the liquid level height of the processing liquid in the main bath 10 is sufficient to enable the processing liquid to flow from the main bath 10 into the overflow portion 30 through the overflow port 14, the processing liquid can flow into the main diversion pipe through the third passage 300 communicating with the overflow portion 30, so that the processing liquid can flow out of the overflow portion 30 through the third passage 300.

[0061] Specifically, the third passage 300 is configured with a fourth diversion pipe 301. The fourth diversion pipe 301 communicates with the main diversion pipe 11, that is, the processing liquid in the overflow portion 30 flows into the main diversion pipe 11 through the fourth diversion pipe 301 in the third passage 300.

[0062] As Figure 1 shown, since the first diversion pipe 101 in the first passage 100, the third diversion pipe 204 in the second passage 200, and the fourth diversion pipe 301 in the third passage all communicate with the main diversion pipe 1, the diameter size of the main diversion pipe is configured to be larger than the diameter sizes of the first diversion pipe 101, the second diversion pipe 102, the third diversion pipe 204, and the fourth diversion pipe 301, so as to prevent the flow of the processing liquid in the main diversion pipe 11 from being congested.

[0063] As Figure 1As shown, the liquid circulation device further includes: a main flow pipe is provided with a first valve and a second valve, and the first valve and the second valve are configured as solenoid valves; a first passage is provided with a first diversion pipe and a second diversion pipe, and the first diversion pipe is configured to communicate with a portion of the main flow pipe before the first valve, and both the first diversion pipe and the second diversion pipe communicate with the filtration unit; a second passage is provided with a third diversion pipe, and the third diversion pipe is configured to communicate with a portion of the main flow pipe between the first valve and the second valve; the first diversion pipe is provided with a third valve and a fourth valve, the third valve is set as a solenoid valve, and the fourth valve is set as a check valve; the second diversion pipe is provided with a fifth valve and a sixth valve, and the fifth valve and the sixth valve are set as solenoid valves; the third diversion pipe is provided with a seventh valve and an eighth valve, the seventh valve is set as a solenoid valve, and the eighth valve is set as a check valve; a third passage is provided with a fourth diversion pipe, and the fourth diversion pipe communicates with the main flow pipe; the fourth diversion pipe is provided with a ninth valve and a tenth valve, the ninth valve is set as a solenoid valve, and the tenth valve is set as a check valve.

[0064] Specifically, due to the characteristic that the solenoid valve can cooperate with different circuits to achieve the expected control, it can be switched on and off in cooperation with the control of the computer program to realize the connection and disconnection between each passage and the pipeline, and play different roles at different positions in the liquid circulation device. Due to the characteristic of the check valve to prevent the reverse flow of liquid, it ensures that the flow of the processing liquid in the diversion pipes of the above-mentioned passages will not flow back. The setting methods of the solenoid valves and check valves in the corresponding diversion pipes in this embodiment can be connected by threads, plate connections or flange connections, and the connection methods are not limited here.

[0065] As Figure 1 shown, the liquid circulation device further includes a processing liquid injection device 40, one end of which communicates with a liquid supply system (not shown in the figure), and the other end communicates with the main bath 10. The processing liquid is supplied by the liquid supply system and can flow into the main bath 10 through the injection pipe 401 via the processing liquid injection device 40. The processing liquid injection device 40 is connected to one end of the fourth passage 400, and the other end of the fourth passage 400 communicates with the main flow pipe 11.

[0066] Specifically, the external liquid supply system transports the processing liquid to the processing liquid injection device 40 via the injection pipe 401, and then the processing liquid injection device 40 further inputs the processing liquid through one end of the fourth passage 400 into the first passage. Since the other end of the fourth passage 400 communicates with the main bath 10, the processing liquid can flow into the main bath 10 through the other end of the fourth passage 400 to increase the processing liquid and raise the liquid level in the main bath 10. The present invention also provides a liquid circulation method for a liquid circulation device corresponding to the use of the processing liquid in the manufacturing process of the above-mentioned component carrier. Combining Figure 1 and referring to Figure 2Method steps. A liquid circulation method using a treatment liquid in the manufacturing process of a component carrier includes the following steps:

[0067] Step 201: Let the treatment liquid flow out of the main bath 10 through the main flow conduit 11.

[0068] Specifically, when the workpiece to be cleaned is placed in the main bath 10 for cleaning, impurities and particles generated during the wet production process on the workpiece to be cleaned will dissolve into the treatment liquid in the main bath 10. If the impurities and particles dissolved in the treatment liquid are classified according to density, they can be divided into heavy impurities and particles with a density greater than the treatment liquid, medium impurities with a density equal to the treatment liquid, and light impurities and particles with a density less than the treatment liquid. The heavy impurities and particles with a density greater than the treatment liquid will gradually sink until they adhere to the bottom wall 12 of the main bath 10. As mentioned above, the bottom wall 12 of the main bath 10 is inclined.

[0069] When the workpiece to be cleaned is cleaned and removed from the main bath 10, that is, when the workpiece to be cleaned is not being cleaned in the main bath 10, keep the first valve 111 and the treatment liquid injection device 40 closed, and open the third valve 103 and the fourth valve 104, so that the treatment liquid containing heavy impurities and particles with a density greater than the treatment liquid and medium impurities and particles with a density equal to the treatment liquid flows from the main bath 10 through the main flow conduit 11 into the first diversion pipe 101, and flows into the filtering device 13 through the first diversion pipe 101 and is filtered by the filter element 131.

[0070] Step 202: Adjust the liquid levels of the main bath 10 and the secondary bath 20 so that the liquid level of the main bath 10 is higher than that of the secondary bath 20.

[0071] Specifically, as Figure 1 shown, the main bath 10 and the secondary bath 20 are respectively two components and are generally at the same height. In order for the treatment liquid flowing out of the main bath 1θ to obtain sufficient gravitational potential energy so that it can flow into the secondary bath 20 through the first diversion pipe 101, the filtering part 13 and the second diversion pipe 102 for re-filtering treatment, it is necessary to adjust the liquid levels of the main bath 10 and the secondary bath 20 so that the liquid level of the main bath 10 is higher than that of the secondary bath 20. In other words, the height of the secondary bath 20 can be adjusted relative to the main bath 10. By lowering the height of the secondary bath 20, its liquid level is made lower than that of the main bath 10 by 7 - 15 cm, so that the treatment liquid flowing out of the main bath 10 can obtain sufficient gravitational potential energy. Conversely, the height of the secondary bath 20 can also be raised relative to the main bath 10 so that its liquid level is higher than that of the main bath 10 by 7 - 15 cm, so that the treatment liquid flowing out of the secondary bath 20 can obtain sufficient gravitational potential energy.

[0072] Specifically, in combination with the above, the present invention provides two methods for adjusting the liquid level of the secondary bath 20. The first method is to adjust the height of the partition member 201 in the secondary bath by telescoping, so that the liquid level of the secondary bath 20 is lower than the liquid level of the main bath 10, so that the processing liquid flowing out of the main bath 10 and flowing to the secondary bath 20 obtains sufficient gravitational potential energy. The second method is to use the secondary bath 20 as a whole component, and by adjusting the height of the secondary bath 20, the maximum liquid level that the processing liquid in it can reach is lower than the maximum liquid level of the processing liquid contained in the main bath 10, so that the processing liquid flowing out of the main bath 10 and flowing to the secondary bath 20 obtains sufficient gravitational potential energy. Analyzed from the convenience of operation, the first method is the preferred method for adjusting the liquid level of the secondary bath 20.

[0073] Step 203: Make the processing liquid flow into the secondary bath 20 through the first passage 100 communicated with the main conduit 11 for static filtration.

[0074] Specifically, continuing from the above, when the processing liquid flowing out of the main bath 10 obtains sufficient gravitational potential energy because the maximum liquid level of the processing liquid in the main bath 10 is higher than the maximum liquid level that the processing liquid in the secondary bath 20 can reach, when the processing liquid injection device 40 is closed, the first valve 111 is closed, the third valve 103, the fourth valve 104 and the fifth valve 105 are opened, and the sixth valve 106 is closed, the processing liquid flows out from the main diversion pipe 11, passes through the first diversion pipe in the first passage 100, the filtering part 13 and the second diversion pipe 102, and flows into the liquid inlet part 202 of the secondary tank part 20 from the liquid inlet 2021. When the processing liquid in the liquid inlet part 202 has not reached the maximum liquid level of the liquid inlet part 202, any one of the third valve 103, the fourth valve 104 or the fifth valve 105 is closed to prevent the processing liquid from continuing to enter the liquid inlet part 202, so as to achieve static filtration of the processing liquid that has entered the liquid inlet part 202 through the filter screen.

[0075] Specifically, continuing from the above, the processing liquid before entering the liquid inlet part 202 has been double-filtered through the inner surface settings of the first diversion pipe 101 and the second diversion pipe 102 in the first passage 100 and the filter element 131 in the filtering part 13, removing a part of impurities and particles. After the processing liquid in the liquid inlet part 202 has been statically filtered through the filter screen, impurities and particles in the processing liquid can be further screened out, realizing a substantial purification of the processing liquid.

[0076] Step 204: Make the processing liquid filtered by the secondary bath 20 flow into the main diversion pipe 11 through the second passage 200, flow back to the main bath 10 through the main diversion pipe 11, or flow into the fourth passage 400 through the main diversion pipe 11 and flow back to the processing liquid injection part 40 through the fourth passage 400.

[0077] Specifically, after the processing liquid is statically filtered at the liquid inlet part 202 of the auxiliary tank part 20, open the third valve 103, the fourth valve 104, and the fifth valve 105, so that the processing liquid continues to flow into the liquid inlet part 202, making the processing liquid in the liquid inlet part 202 finally exceed the maximum liquid level of the liquid inlet part 202, that is, the liquid level of the processing liquid exceeds the height of the partition member 201, and then flows into the liquid outlet part 203. At this time, open the third valve 103, the fourth valve 104, and the fifth valve 105, so that the processing liquid can continuously flow into the liquid outlet part 203 until the liquid level of the liquid outlet part 203 is equal to the liquid level of the liquid inlet part 202. Because the density of the impurities and particles carried by the processing liquid flowing into the first passage is greater than that of the processing liquid itself, the newly flowing into the liquid inlet part 202 processing liquid will not bring most of the impurities and particles it carries into the processing liquid that has passed through the filter screen of the liquid inlet part 202 and flowed into the liquid outlet part 202. At this time, open the seventh valve 205 and the eighth valve 206, so that the processing liquid in the liquid outlet part 203 of the auxiliary bath 20 flows into the main flow pipe 11 through the third diversion pipe 204. At this time, the first valve 111 and the second valve 112 provided on the main flow pipe 11 remain closed.

[0078] Specifically, when the filtered processing liquid flows into the main flow pipe 11 again, there are two circulation methods at this time. The first circulation method is to adjust the liquid levels of the main bath 10 and the auxiliary bath 20 so that the liquid level of the main bath 10 is lower than that of the auxiliary bath 20 to obtain the gravitational potential energy of the liquid. At the same time, close the second valve 112 and the processing liquid injection device 40, so that the processing liquid flowing through the third diversion pipe 204 flows to the main flow pipe 11, and open the first valve 111. The processing liquid relies on the gravitational potential energy and flows back to the main bath 10 from the bottom through the main flow pipe 11 to recycle the processing liquid. The second circulation method is to also adjust the liquid levels of the main bath 10 and the auxiliary bath 20 so that the liquid level of the main bath 10 is lower than that of the auxiliary bath 20 to obtain the gravitational potential energy of the processing liquid. Close the first valve 111 and the processing liquid injection device 40, so that the processing liquid flowing through the third diversion pipe 204 flows to the main flow pipe 11, and open the second valve 112. The processing liquid relies on the gravitational potential energy and enters the fourth passage 400, and flows back to the processing liquid injection device 40 through the fourth passage 400 to recycle the processing liquid.

[0079] It should be noted that after the processing liquid is circulated repeatedly for a certain number of times, in order to ensure the quality of the processing liquid, the fifth valve 105 and the sixth valve 106 can also be selected to be opened, so that the processing liquid in the liquid inlet part 202 of the auxiliary bath 20 flows out directly. Similarly, the processing liquid passing through the first diversion pipe 101 and the filtering part 13 from the main flow pipe 11 can also be discharged from the liquid circulation device by opening the sixth valve 106, and just wait for the processing liquid injection device 40 to supplement new processing liquid.

[0080] Step 204': Let the processing liquid flow from the overflow part 30 into the main flow pipe 11 via the third passage 300, flow back to the main bath 10 via the main flow pipe 11, or flow into the fourth passage 400 via the main flow pipe 11 and flow back to the processing liquid injection part 40 via the fourth passage 400.

[0081] Specifically, the overflow part 30 is provided to discharge impurities and particles with a density less than that of the processing liquid. When the workpiece to be cleaned is placed in the main bath 10 for cleaning, the valves of the first passage 100 and the second passage 200 are closed, and at the same time, the first valve 111 is closed, and the ninth valve 302 and the tenth valve 303 of the fourth diversion pipe 301 configured in the third passage 300 are opened, so that the processing liquid flowing from the main bath 10 into the overflow part 30 through the overflow port 14 flows out through the fourth diversion pipe 301 and via the main flow pipe 11. Since the discharged impurities and particles have a density less than that of the processing liquid, such as floating ash and floating dust, etc., adsorption materials, such as activated carbon, etc., can be provided on the tank wall of the secondary bath 20 and the fourth diversion pipe 301 configured in the third passage 300, so as to adsorb floating ash and floating dust with better effect.

[0082] Specifically, close the first valve 111 and the second valve 112 of the main flow pipe until the main flow pipe part between the first valve 111 and the second valve 112 is filled with the processing liquid filtered by the overflow part 30 and the fourth diversion pipe 301, so as to accumulate gravitational potential energy for the processing liquid and convert the gravitational potential energy into potential energy. At this time, by opening the second valve 112, the processing liquid enters the fourth passage 400 by virtue of its potential energy, so as to flow back to the processing liquid injection part 40 to complete the circulation process of the processing liquid. Similarly, the first valve 111 can also be opened to make the processing liquid flow back to the main bath 10 through the bottom, and the circulation process of the processing liquid is also completed.

[0083] After the processing liquid undergoes multiple cycles, its liquid quality is difficult to meet the requirements of recycling. That is, after the processing liquid undergoes a certain number of cycles, the accumulated unfiltered impurities in it are difficult to make the processing liquid meet the requirements of cleaning the component carrier again; or when the quality requirements of the component carrier to be cleaned for the processing liquid are extremely high, the processing liquid no longer has the value of recycling after being used once. Therefore, when the above two situations exist, the processing liquid should be discharged from the liquid circulation device.

[0084] Specifically, when the component carrier is being cleaned in the main bath 10, since the component carrier is placed in the processing liquid in the main bath 10, the liquid level rises, which may cause some of the processing liquid to flow from the main bath 10 into the overflow portion 30 through the overflow port 14. When the cleaning of the component carrier in the main bath 10 is completed and the component carrier is removed from the processing liquid, the liquid level of the processing liquid in the main bath 10 drops. However, at this time, there is still some processing liquid remaining in the overflow portion 30. Therefore, it is necessary to respectively ① drain the remaining processing liquid in the overflow portion and ② drain the remaining processing liquid in the main bath. Specifically:

[0085] ① When the processing liquid no longer needs to be circulated, completely empty the remaining processing liquid in the main bath 10 and the overflow portion 30. At this time, the ninth valve 302 and the tenth valve 303 provided on the fourth diversion pipe 301 need to be opened, so that the remaining processing liquid in the overflow portion 30 flows into the fourth diversion pipe 301, and the remaining processing liquid in the overflow portion 30 is discharged through the waste liquid treatment device (not shown in the figure) connected to the fourth diversion pipe 301.

[0086] ② When the processing liquid no longer needs to be circulated, there are two ways to drain the remaining processing liquid in the main bath 10:

[0087] Way 1: Open the first valve 111 provided on the main diversion pipe 11. Since the bottom wall 12 of the main bath 10 is set as an inclined surface, the remaining processing liquid in the main bath 10 can flow along the inclined surface into the main diversion pipe 11, and the remaining processing liquid in the main bath 10 is discharged through the waste liquid treatment device (not shown in the figure) connected to the outside of the main diversion pipe 11.

[0088] It should be noted that the same waste liquid treatment device can be used to drain the remaining processing liquid in the overflow portion 30 and the remaining processing liquid in the main bath 10. This waste liquid treatment device can be set between the first valve 111 and the second valve 112, and preferably, at the junction of the fourth diversion pipe 301 and the main diversion pipe 11. At this time, only by opening the first valve 111, the remaining processing liquid in the main bath 10 can flow out through this waste liquid treatment device.

[0089] Way 2: Close the first valve 111 provided on the main diversion pipe 11, open the third valve 103 and the fourth valve 104 provided on the first diversion pipe 101 in the first passage 100, and open the sixth valve 106 provided on the second diversion pipe 102, and keep the fifth valve 105 closed. At this time, the remaining processing liquid in the main bath 10 can flow out from the lower end of the second diversion pipe 102 via the first diversion pipe 101.

[0090] Specifically, as described above, after the treatment liquid is repeatedly circulated a certain number of times, in order to ensure the quality of the treatment liquid, the fifth valve 105 and the sixth valve 106 can also be opened to directly discharge the treatment liquid in the liquid inlet part 202 of the auxiliary bath 20. Similarly, the treatment liquid in the liquid outlet part 203 can also flow into the main flow pipe 11 through the seventh valve 205 and the eighth valve 206 provided on the third diversion pipe 203, and the treatment liquid in the liquid outlet part 203 of the auxiliary bath 20 is discharged through the waste liquid treatment device (not shown in the figure) externally connected to the main flow pipe 11.

[0091] In another case, when the component carrier is cleaned in the main bath 10, since the component carrier is placed in the treatment liquid in the main bath 10, the liquid level rises, but does not exceed the height of the overflow port 14. At this time, the treatment liquid in the main bath 10 will not overflow into the overflow part 30. After the component carrier is cleaned in the main bath 10, the component carrier is removed from the treatment liquid. At this time, only the treatment liquid remains in the main bath 10. The first valve 111 provided on the main flow pipe 11 is opened. Since the bottom wall 12 of the main bath 10 is provided as an inclined surface, the treatment liquid remaining in the main bath 10 can flow along the inclined surface into the main flow pipe 11, and the treatment liquid remaining in the main bath 10 is discharged through the waste liquid treatment device (not shown in the figure) externally connected to the main flow pipe 11.

[0092] The present invention also provides a liquid circulation system corresponding to the liquid circulation method of using the treatment liquid in the above-mentioned component carrier manufacturing process, including: a processor 1000, a memory 2000, a signal transceiver 3000, and a bus 4000. The memory 2000 stores machine-readable instructions executable by the processor 1000. When the liquid treatment system runs, the processor 1000 communicates with the memory 2000 through the bus 4000. The processor 1000 executes the machine-readable instructions and sends the machine-readable instructions through the signal transceiver 3000 to execute the steps of the foregoing liquid circulation processing method.

[0093] Specifically, each component in the above system can be integrated together to form an independent part, or exist separately, or two or more components can be integrated to form an independent part. If the function is implemented in the form of a software functional module and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on such an understanding, the technical solution of the present invention, in essence, or the part that contributes to the related technology, or a part of this technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods described in various embodiments of the present invention. The aforementioned storage medium includes: various media such as USB flash drives, mobile hard disks, read-only memories (ROM), random access memories (RAM), magnetic disks, or optical discs that can store program codes.

[0094] Specifically, as described above, the traditional processing liquid filtration device needs to use a large independent pump for filtration and adsorption. However, in the present invention, such a pump is not required. When the component carrier is cleaned in the main bath 10, it is removed from the main bath 10 through a hanging basket or other robotic arm capable of loading the component carrier. At this time, the sensor provided on the hanging basket or the robotic arm sends a signal to the signal transceiver 3000, enabling the liquid circulation system to know that the component carrier has been cleaned and the processing liquid can be circulated or discharged. The processor 1000 can process the preset instructions for circulating or discharging the processing liquid stored in the memory 2000 and transmit them to the signal transceiver 3000 through the bus 4000. The signal transceiver 3000 can control the opening and closing of each valve by wirelessly propagating electrical signals to directly control the start or stop of the liquid circulation. At the same time, the main bath 10 is also provided with a water level sensor, which can sense the change in the water level in the main bath 10 at any time to control the liquid injection device 40 to add liquid or stop adding liquid to create a liquid level difference. At the same time, the signal transceiver 3000 can also complete the adjustment of the height of the secondary bath 20 through the sensor provided on the secondary bath 20 to achieve the purpose of circulating the processing liquid. This process is a fully automatic control process and does not require manual participation.

[0095] The present invention relates to a liquid circulation device, a liquid circulation treatment method, and a liquid circulation system for using a treatment liquid in the manufacturing process of a component carrier. Through the connection mode among the main bath, the sub-bath, and the overflow part, and in combination with the cooperation of the diversion pipes and valve switches included in each passage, by adjusting the maximum liquid level height of the treatment liquid, the treatment liquid is circulated by means of gravitational potential energy. After the treatment liquid is filtered through the sub-bath and the overflow part, it can finally be circulated back to the main bath, realizing different treatment methods for different types of impurities and particles in the wet production process of manufacturing the component carrier, effectively removing different types of impurities and particles. Moreover, this liquid circulation device does not require a large independent filtration device, saves the use of filter elements, reduces costs, and does not require manual tracking of the filtration process throughout, effectively reducing manufacturing costs and labor losses. In addition, this liquid circulation device can effectively circulate the treatment liquid, making it possible to reuse the treatment liquid, thereby reducing production costs indirectly.

[0096] As described above, the above are only various embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention can easily think of changes or substitutions, which should all be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.

Claims

1. A liquid circulation device for a treatment liquid used in the manufacturing process of a component carrier, characterized in that, the liquid circulation device includes: a main bath (10) filled with a treatment liquid therein; a sub-bath (20), the bottom of the main bath (10) is connected to the bottom of the sub-bath (20), such that the treatment liquid can flow from the bottom of the main bath (10) to the bottom of the sub-bath (20), and the treatment liquid can flow into the sub-bath (20); an overflow part (30) attached to the main bath (10), the overflow part (30) is in communication with the main bath (10), such that the treatment liquid can flow from the main bath (10) into the overflow part (30); the overflow part (30) is configured such that when the treatment liquid in the main bath (10) reaches the maximum liquid level, it flows into the overflow part (30); wherein, the maximum liquid level of the treatment liquid in the main bath (10) is different from the maximum liquid level of the treatment liquid in the sub-bath (20), and the maximum liquid level of the treatment liquid in the main bath (10) is higher than the maximum liquid level of the treatment liquid in the sub-bath (20).

2. The liquid circulation device for a treatment liquid used in the manufacturing process of a component carrier according to claim 1, characterized in that, the liquid circulation device further includes: a main diversion pipe (11) in communication with the main bath (10), the sub-bath (20), and the overflow part (30), such that the treatment liquid can flow out of the main bath (10), the sub-bath (20), and the overflow part (30) through the main diversion pipe (11).

3. The liquid circulation device for a treatment liquid used in the manufacturing process of a component carrier according to claim 2, characterized in that, the liquid circulation device further includes: the main diversion pipe (11) is connected to the bottom of the main bath (10), and the treatment liquid can flow out of the main bath (10) through the main diversion pipe (11); a first passage (100), the main diversion pipe (11) is in communication with the sub-bath (20) through the first passage (100), such that the treatment liquid can flow from the main bath (10) into the sub-bath (20) through the first passage (100); a second passage (200), the sub-bath (20) is in communication with the main diversion pipe (11) through the second passage (200), such that the treatment liquid can flow from the sub-bath (20) into the main diversion pipe (11) through the second passage (200); a third passage (300), the overflow part (30) is in communication with the main diversion pipe (11) through the third passage (300), such that the treatment liquid can flow out of the overflow part (30) through the third passage (300).

4. The liquid circulation device for a treatment liquid used in the manufacturing process of a component carrier according to claim 3, characterized in that, a filtering part (13) is provided in the first passage (100), and the treatment liquid is filtered before flowing into the sub-bath (20).

5. The liquid circulation device for using a treatment liquid in the manufacturing process of a component carrier according to claim 3, characterized in that, a partition member (201) is provided in the auxiliary bath (20), and the partition member (201) is configured to divide the auxiliary bath (20) into a liquid inlet part (202) and a liquid outlet part (203), and defines the maximum liquid level that the treatment liquid in the auxiliary bath (20) can reach. When the treatment liquid enters from the liquid inlet part (202) and the maximum liquid level of the treatment liquid exceeds the height of the partition member (201), the treatment liquid can flow out from the liquid outlet part (203) via the second passage (200).

6. The liquid circulation device for using a treatment liquid in the manufacturing process of a component carrier according to claim 5, characterized in that, the partition member (201) is configured as a telescopic member, and the height of the partition member (201) is adjustable.

7. The liquid circulation device for using a treatment liquid in the manufacturing process of a component carrier according to claim 5, characterized in that, the liquid inlet part (202) is configured with a liquid inlet (2021), and the liquid inlet (2021) is provided on the bottom wall of the liquid inlet part (202).

8. The liquid circulation device for using a treatment liquid in the manufacturing process of a component carrier according to claim 1, characterized in that, the overflow part (30) is communicated with the main bath (10) through an overflow port (14), and the overflow port (14) is configured to be close to the upper side of the main bath (10).

9. The liquid circulation device for using a treatment liquid in the manufacturing process of a component carrier according to claim 3, characterized in that, the bottom wall (12) of the main bath (10) is provided as an inclined surface, and the height of the lower pipe wall of the main diversion pipe (11) is set to be not greater than the lowest height of the bottom wall (12).

10. The liquid circulation device for using a treatment liquid in the manufacturing process of a component carrier according to claim 3, characterized in that, the liquid circulation device further includes: the main diversion pipe (11) is configured with a first valve (111) and a second valve (112); the first passage (100) is configured with a first diversion pipe (101) and a second diversion pipe (102), the first diversion pipe (101) is configured to be communicated with the part of the main diversion pipe (11) before the first valve (111), the second diversion pipe (102) is communicated with the bottom of the auxiliary bath (20), and the first diversion pipe (101) and the second diversion pipe (102) are both communicated with the filtering part (13); the second passage (200) is configured with a third diversion pipe (204), and the third diversion pipe (204) is configured to be communicated with the part of the main diversion pipe (11) between the first valve (111) and the second valve (112); the first diversion pipe (101) is configured with a third valve (103) and a fourth valve (104); the second diversion pipe (102) is configured with a fifth valve (105) and a sixth valve (106); The third diversion pipe (204) is configured with a seventh valve (205) and an eighth valve (206); The third passage (300) is configured with a fourth diversion pipe (301), and the fourth diversion pipe (301) communicates with the main diversion pipe (11); The fourth diversion pipe (301) is provided with a ninth valve (302) and a tenth valve (303).

11. The liquid circulation device using a treatment liquid in the manufacturing process of a component carrier according to claim 10, characterized in that, The diameter size of the main diversion pipe (11) is configured to be larger than the diameter sizes of the first diversion pipe (101), the second diversion pipe (102), the third diversion pipe (204), and the fourth diversion pipe (301).

12. The liquid circulation device using a treatment liquid in the manufacturing process of a component carrier according to claim 1, characterized in that, The liquid circulation device further includes: A treatment liquid injection device (40), one end of which communicates with a liquid supply system, and the other end communicates with the main bath (10). The treatment liquid is supplied by the liquid supply system and can flow into the main bath (10) through the treatment liquid injection device (40) via an injection pipe (401).

13. The liquid circulation device using a treatment liquid in the manufacturing process of a component carrier according to claim 12, characterized in that, The treatment liquid injection device (40) is connected to one end of a fourth passage (400), and the other end of the fourth passage (400) is connected to the main diversion pipe (11).

14. A liquid circulation method for using a treatment liquid in the manufacturing process of a component carrier, characterized in that, The liquid treatment method is applicable to a liquid circulation device, and the liquid treatment method includes: Let the treatment liquid flow out of the main bath (10) through the main diversion pipe (11); Adjust the liquid levels of the main bath (10) and the sub-bath (20) so that the liquid level of the main bath (10) is higher than the liquid level of the sub-bath (20); Let the treatment liquid flow into the sub-bath (20) through the first passage (100) communicating with the main diversion pipe (11) for static filtration; Let the treatment liquid filtered by the sub-bath (20) flow into the main diversion pipe (11) through the second passage (200), return to the main bath (10) through the main diversion pipe (11), or flow into the fourth passage (400) through the main diversion pipe (11), and return to the treatment liquid injection part (40) through the fourth passage (400); And, When the treatment liquid reaches the maximum liquid level in the main bath (10), the treatment liquid flows from the main bath (10) into the overflow part (30), so that the treatment liquid flows from the overflow part (30) into the main diversion pipe (11) through the third passage (300), returns to the main bath (10) through the main diversion pipe (11), or flows into the fourth passage (400) through the main diversion pipe (11), and returns to the treatment liquid injection part (40) through the fourth passage (400).

15. A liquid circulation method for using a treatment liquid in the manufacturing process of a component carrier, according to claim 14, characterized in that, the step of allowing the treatment liquid to flow out of the main bath (10) through the main flow conduit (11) further includes: when the part to be cleaned is not being cleaned in the main bath (10), keeping the first valve (111) and the treatment liquid injection device (40) closed, opening the third valve (103) and the fourth valve (104), so that the treatment liquid flows from the main bath (10) into the first diversion pipe (101) through the main flow conduit (11), and flows into the filtering device (13) through the first diversion pipe (101) and is filtered by the filter element (131).

16. A liquid circulation method for using a treatment liquid in the manufacturing process of a component carrier, according to claim 14, characterized in that, the step of adjusting the liquid levels of the main bath (10) and the sub-bath (20) so that the liquid level of the main bath (10) is higher than that of the sub-bath (20) further includes: adjusting the height of the partition member (201) so that the liquid level of the sub-bath (20) is lower than that of the main bath (10) to obtain the gravitational potential energy of the treatment liquid.

17. A liquid circulation method for using a treatment liquid in the manufacturing process of a component carrier according to any one of claims 14 to 16, characterized in that, the step of allowing the treatment liquid to flow into the sub-bath (20) through the first passage (100) communicating with the main flow conduit (11) for static filtration further includes: after the treatment liquid is filtered by the filter element (131) in the filtering device (13) for a period of time, opening the fifth valve (105), so that the treatment liquid, by virtue of the gravitational potential energy, flows through the second diversion pipe (102) communicating with the first diversion pipe (101), through the liquid inlet (2021) of the sub-bath (20), and into the liquid inlet part (202) of the sub-bath (20) for static filtration.

18. A liquid circulation treatment method according to claim 14, characterized in that, the step of allowing the treatment liquid filtered by the sub-bath (20) to flow out through the second passage (200) further includes: opening the seventh valve (205) and the eighth valve (206), so that the treatment liquid in the liquid outlet part (203) of the sub-bath (20) flows out through the main flow conduit (11) communicated with the third diversion pipe (204).

19. A liquid circulation treatment method according to claim 14, characterized in that, the liquid circulation treatment method further includes: when the part to be cleaned is placed in the main bath (10) for cleaning, closing the valves of the first passage (100) and the second passage (200), opening the ninth valve (302) and the tenth valve (303) of the fourth diversion pipe (301) configured in the third passage (300), so that the treatment liquid flowing from the main bath (10) into the overflow part (30) through the overflow port (14) flows out through the fourth diversion pipe (301) and through the main flow conduit (11).

20. The liquid circulation treatment method according to any one of claims 14 to 19, characterized in that, the liquid circulation treatment method further includes: adjusting the liquid levels of the main bath (10) and the sub-bath (20) so that the liquid level of the main bath (10) is lower than that of the sub-bath (20) to obtain the gravitational potential energy of the liquid, and at the same time closing the second valve (112) and the treatment liquid injection device (40), so that the treatment liquid flowing through the third diversion pipe (204) or the treatment liquid flowing through the fourth diversion pipe (301) flows to the main diversion pipe (11), opening the first valve (111), and the treatment liquid returns to the main bath (10) through the main diversion pipe (11) by virtue of the gravitational potential energy to recycle the treatment liquid.

21. The liquid circulation method according to any one of claims 14 to 19, characterized in that, the liquid circulation treatment method further includes: adjusting the liquid levels of the main bath (10) and the sub-bath (20) so that the liquid level of the main bath (10) is lower than that of the sub-bath (20) to obtain the gravitational potential energy of the treatment liquid, closing the first valve (111) and the treatment liquid injection device (40), so that the treatment liquid flowing through the third diversion pipe (204) or the treatment liquid flowing through the fourth diversion pipe (301) flows to the main diversion pipe (11), opening the second valve (112), and the treatment liquid enters the fourth passage (400) by virtue of the gravitational potential energy and returns to the treatment liquid injection device (40) through the fourth passage (400) to recycle the treatment liquid.

22. The liquid circulation treatment method according to claim 14, characterized in that, the liquid circulation treatment method further includes: opening the fifth valve (105) and the sixth valve (106) to empty the treatment liquid in the sub-bath (20).

23. A liquid circulation system for using a treatment liquid in the manufacturing process of a component carrier, characterized in that, the liquid circulation treatment system includes: a processor, a memory, a signal transceiver and a bus, the memory stores machine-readable instructions executable by the processor, when the liquid treatment system runs, the processor communicates with the memory through the bus, the processor executes the machine-readable instructions, and sends the machine-readable instructions through the signal transceiver to execute the steps of the liquid circulation treatment method according to any one of claims 16 to 24.

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