Alloy plate forming die and forming process

Abstract

The invention belongs to the technical field of alloy plate forming, and discloses an alloy plate forming die and a forming technology.The alloy plate forming die comprises a female die, a male die and a pressing machine, the female die is provided with a containing groove, the containing groove is configured to contain an alloy base material heated to the solid solution temperature, the male die is provided with a boss, and the pressing machine drives the male die to move towards the female die; cooling passages are arranged in the female die and / or the male die, and the cooling passages are used for circulation of cooling liquid. According to the alloy plate forming die, the alloy base material heated to the solid solution temperature can be forged and pressed through the alloy plate forming die, solid solution operation and quenching operation can be conducted synchronously in the forging and pressing process, and therefore time consumed by solid solution operation, forging and pressing operation and quenching operation is shortened, and the production efficiency of alloy plates is improved; the solid solution, forging and quenching operations can be completed by only one alloy plate forming die, so that the production cost of the alloy plate can be reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of alloy plate forming, and in particular to an alloy plate forming die and a forming process. Background Art

[0002] At present, the alloy plate forming process generally includes the steps of casting, solid solution, forging, quenching, cooling, aging, etc. Among them, since the solid solution, forging, quenching and other steps are carried out separately, each step takes a long time, which causes the entire process to take a lot of time, which in turn leads to low production efficiency of alloy plates. Moreover, since each step needs to be completed by special equipment, the production cost of alloy plates is high. Summary of the Invention

[0003] The object of the present invention is to provide an alloy plate forming die and a forming process to improve the production efficiency of the alloy plate and reduce the production cost of the alloy plate.

[0004] To achieve this object, the present invention adopts the following technical solutions:

[0005] In one aspect, the present invention provides an alloy plate forming die, comprising:

[0006] a concave die provided with a receiving groove configured to receive an alloy substrate heated to a solution temperature;

[0007] A punch and a press, wherein the punch is provided with a boss, and the press is configured to drive the punch toward or away from the die, and / or drive the die toward or away from the punch, so that the boss can be inserted into the receiving groove to forge the alloy substrate, or removed from the receiving groove, and a cooling passage is provided inside the die and / or the punch, and the cooling passage is used to circulate a coolant.

[0008] Preferably, a first cooling passage is provided inside the die, and the first cooling passage includes a first liquid inlet passage, a first connecting passage, and a first liquid outlet passage. The first connecting passage is connected between the first liquid inlet passage and the first liquid outlet passage. The first connecting passage is provided on the side of the receiving groove away from the punch, and the upstream end of the first connecting passage extends to directly below one side of the receiving groove along the first horizontal direction, and the downstream end of the first connecting passage extends to directly below the other side of the receiving groove along the first horizontal direction.

[0009] Preferably, the first connecting passage is arranged adjacent to the bottom of the accommodating groove.

[0010] Preferably, a plurality of the first cooling passages are provided inside the die, and the plurality of the first cooling passages are arranged at intervals along a second horizontal direction, and the second horizontal direction is arranged at an angle to the first horizontal direction.

[0011] Preferably, the die includes a carrier and a first enclosure, the first enclosure is mounted on the outer periphery of the carrier, and the first enclosure and the carrier form the receiving groove, the first connecting passage is arranged inside the carrier, a second cooling passage is arranged inside the first enclosure, and the second cooling passage surrounds the outer periphery of the receiving groove.

[0012] Preferably, the die further comprises a first mounting platform, the carrier and the first surrounding platform are mounted on the first mounting platform, the first liquid inlet passage is formed by a first liquid inlet pipe, the first liquid inlet pipe comprises a first pipe and a second pipe, one end of the first pipe is connected to the first liquid inlet joint, the other end of the first pipe is connected to the second pipe, the second pipe is inserted into the carrier and connected to the upstream end of the first connecting passage;

[0013] The first liquid outlet passage is formed by a first liquid outlet pipe, which includes a third pipe and a fourth pipe. One end of the third pipe is connected to the first liquid outlet joint, and the other end of the third pipe is connected to the fourth pipe. The fourth pipe is inserted into the carrier and connected to the downstream end of the first connecting passage. The first mounting platform is respectively provided with a first accommodating groove and a second accommodating groove on both sides along the first horizontal direction. The first pipe and the third pipe are respectively arranged in the first accommodating groove and the second accommodating groove.

[0014] Preferably, the second pipe and the fourth pipe both extend in a vertical direction and are both arranged adjacent to the side wall of the carrier.

[0015] Preferably, a third cooling passage is provided inside the punch, and the third cooling passage includes a second liquid inlet passage, a second connecting passage, and a second liquid outlet passage. The second connecting passage is connected between the second liquid inlet passage and the second liquid outlet passage. The boss is formed with a table surface, and the table surface is used to press the alloy substrate. The upstream end of the second connecting passage extends to directly above one side of the table surface along the first horizontal direction, and the downstream end of the second connecting passage extends to directly above the other side of the table surface along the first horizontal direction.

[0016] Preferably, the second connecting passage is arranged adjacent to the table top.

[0017] Another aspect of the present invention provides an alloy plate forming process, comprising:

[0018] After the alloy substrate is heated to the solution temperature, the alloy substrate is placed in the receiving groove of the alloy plate forming mold as described above;

[0019] The press drives the punch to move toward the die to complete die closing, and after die closing, the alloy substrate is subjected to forging and solution treatment simultaneously;

[0020] When the alloy substrate is subjected to forging and solution treatment, the coolant circulates in the cooling passage to simultaneously perform quenching on the alloy substrate.

[0021] Beneficial effects of the present invention:

[0022] In the present invention, the alloy plate forming die can forge the alloy substrate heated to the solid solution temperature. During the forging process, the alloy substrate at the solid solution temperature is subjected to extremely high pressure, so that the non-matrix phase inside the alloy substrate can be dissolved and dispersed in the alloy substrate, thereby being able to simultaneously complete the forging and solid solution operations. Moreover, since the alloy plate forming die in the present invention itself is provided with a cooling passage, the quenching operation can be carried out simultaneously during the forging process, thereby shortening the time spent on solid solution, forging and quenching operations, thereby improving the production efficiency of the alloy plates. In addition, since the present invention only requires one alloy plate forming die to complete solid solution, forging and quenching operations, the production cost of the alloy plates can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is one of the structural schematic diagrams of the alloy plate forming die and the coolant circulation machine in the embodiment of the present invention;

[0024] Figure 2 This is a second structural diagram of the alloy plate forming die and the coolant circulation machine in an embodiment of the present invention;

[0025] Figure 3 is a top view of an alloy plate forming die in an embodiment of the present invention;

[0026] Figure 4 It is along Figure 3 Cross-sectional view along line AA;

[0027] Figure 5 This is one of the exploded views of the alloy plate forming die in the embodiment of the present invention;

[0028] Figure 6 yes Figure 5 A partial enlarged view of point B in the middle;

[0029] Figure 7 yes Figure 5 A partial enlarged view of point C in the middle;

[0030] Figure 8This is the second exploded view of the alloy plate forming die in the embodiment of the present invention;

[0031] Figure 9 yes Figure 8 A partial enlarged view of point D in the middle;

[0032] Figure 10 yes Figure 8 A partial enlarged view of point E in the middle;

[0033] Figure 11 is a structural schematic diagram of a first mounting platform in an embodiment of the present invention;

[0034] Figure 12 2 is a schematic structural diagram of a first liquid inlet pipe, a first liquid outlet pipe, and a first connecting pipe in an embodiment of the present invention;

[0035] Figure 13 is a structural schematic diagram of a second mounting platform in an embodiment of the present invention;

[0036] Figure 14 2 is a schematic structural diagram of the second liquid inlet pipe, the second liquid outlet pipe and the second connecting pipe in an embodiment of the present invention;

[0037] Figure 15 2 is a schematic structural diagram of the first enclosure and the third liquid outlet joint in an embodiment of the present invention;

[0038] Figure 16 is a front view of the first enclosure in an embodiment of the present invention;

[0039] Figure 17 It is along Figure 16 Cross-sectional view along the midline FF.

[0040] In the picture:

[0041] 1. Concave mold; 11. Receiving tank; 12. First cooling passage; 121. First liquid inlet passage; 122. First connecting passage; 1221. First docking passage; 1222. Second docking passage; 123. First liquid outlet passage; 13. Carrier; 14. First enclosure; 1411. First cooling branch; 1412. Second cooling branch; 142. Third liquid inlet pipe; 143. Fourth liquid inlet pipe; 144. Third liquid outlet pipe; 145. Fourth liquid outlet pipe; 15. First mounting platform; 151. First receiving tank; 152. Second receiving tank; 161. First liquid inlet pipe; 1611. First pipe; 1612. Second pipe; 162. First liquid outlet pipe; 1621. Third pipe; 1622. Fourth pipe; 163. First connecting pipe; 17. Sleeve; 18. Base;

[0042] 2. Punch; 21. Boss; 211. Table; 22. Third cooling passage; 221. Second liquid inlet passage; 222. Second connecting passage; 2221. Third docking passage; 2222. Fourth docking passage; 223. Second liquid outlet passage; 23. Guide rod; 24. Second enclosure; 25. Second mounting platform; 251. Third accommodating groove; 252. Fourth accommodating groove; 26. Connecting seat; 271. Second liquid inlet pipe; 2711. Fifth pipe; 2712. Sixth pipe; 272. Second liquid outlet pipe; 2721. Seventh pipe; 2722. Eighth pipe; 273. Second connecting pipe;

[0043] 31. First liquid inlet connector; 32. First liquid outlet connector; 33. Second liquid inlet connector; 34. Second liquid outlet connector; 35. Third liquid inlet connector; 36. Third liquid outlet connector;

[0044] 100. Coolant circulation machine; 101. First liquid supply pipe; 102. First liquid return pipe; 103. Second liquid supply pipe; 104. Second liquid return pipe; 105. Third liquid supply pipe; 106. Third liquid return pipe. DETAILED DESCRIPTION

[0045] The present invention will be further described in detail below with reference to the accompanying drawings and examples. It will be understood that the specific embodiments described herein are intended only to illustrate the present invention and are not intended to limit the present invention. It should also be noted that, for ease of description, the accompanying drawings only illustrate portions relevant to the present invention, not all structures.

[0046] In the description of the present invention, unless otherwise expressly specified or limited, the terms "connected," "connected," and "fixed" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention in specific circumstances.

[0047] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Furthermore, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0048] In the description of this embodiment, terms such as "upper," "lower," "right," and "left" are used to refer to positions or locations based on those shown in the accompanying drawings. These terms are intended solely to facilitate description and simplify operation, and are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first" and "second" are used solely for descriptive purposes and have no special meaning.

[0049] See also Figures 1 to 17 The present embodiment provides an alloy plate forming die, which includes a die 1, a punch 2 and a press (not shown in the figure), wherein the die 1 is provided with a receiving groove 11, the receiving groove 11 is configured to accommodate an alloy substrate heated to a solid solution temperature, the punch 2 is provided with a boss 21, and the press is configured to drive the punch 2 to move toward or away from the die 1 so that the boss 21 can be inserted into the receiving groove 11 to forge the alloy substrate, or moved out of the receiving groove 11. Moreover, in the present embodiment, cooling passages are provided inside the die 1 and the punch 2, and the cooling passages are used to circulate a coolant.

[0050] It can be understood that in other optional embodiments, the press can also be configured to drive the die 1 to move toward or away from the punch 2 so that the boss 21 can be inserted into the receiving groove 11 to forge the alloy substrate, or, in other optional embodiments, the press can also be configured to drive the punch 2 to move toward or away from the die 1, and drive the die 1 to move toward or away from the punch 2, so that the punch 2 and the die 1 can move relative to or away from each other, so that the boss 21 can be inserted into the receiving groove 11 to forge the alloy substrate. This embodiment does not impose any specific restrictions on this.

[0051] It is worth noting that the punch 2 is provided with four guide rods 23, and the die 1 is provided with four sleeves 17. The guide rods 23 and the sleeves 17 both extend in the vertical direction. The four guide rods 23 correspond one to one with the four sleeves 17. When the punch 2 moves toward the die 1, the guide rods 23 can extend into the sleeves 17, thereby providing a guiding effect on the movement of the punch 2, thereby ensuring that the boss 21 can be accurately inserted into the accommodating groove 11.

[0052] Of course, in other optional embodiments, the punch 2 may be provided with a sleeve 17, and correspondingly, the die 1 may be provided with a guide rod 23, which is not specifically limited in this embodiment.

[0053] In addition, in other optional embodiments, the number of guide rods 23 and sleeves 17 may also be set to two, three, or five or more, and this embodiment does not impose any specific limitation on this.

[0054] From the above, in this embodiment, the alloy plate forming die can forge the alloy substrate heated to the solid solution temperature. During the forging process, the alloy substrate at the solid solution temperature is subjected to extremely high pressure, so that the non-matrix phase inside the alloy substrate can be dissolved and dispersed in the alloy substrate, and thus the forging and solid solution operations can be completed simultaneously. Moreover, since the alloy plate forming die in this embodiment itself is provided with a cooling passage, the quenching operation can be carried out simultaneously during the forging process, thereby shortening the time of solid solution, forging and quenching operations, and thus improving the production efficiency of the alloy plate. In addition, since the present embodiment only requires one alloy plate forming die to complete the solid solution, forging and quenching operations, the production cost of the alloy plate can be reduced.

[0055] Of course, in other optional embodiments, the cooling passage may be provided only inside the die 1 or the punch 2, and this embodiment does not impose any specific limitation on this.

[0056] It should also be noted that the press is a hydraulic press in the prior art. Since the specific structure of the press is prior art, this embodiment will not elaborate on it.

[0057] Based on the above, this embodiment further provides an alloy plate forming process, which includes:

[0058] S1, after the alloy substrate is heated to the solution temperature, the alloy substrate is placed in the receiving groove 11 of the alloy plate forming mold as described above;

[0059] S2. The press drives the punch 2 to move toward the die 1 to complete the die closing. After the die closing, the alloy substrate is forged and solution-hardened simultaneously. When the alloy substrate is forged and solution-hardened, the coolant circulates in the cooling passage to quench the alloy substrate simultaneously.

[0060] For example, this embodiment is described using an aluminum alloy plate as an example. The aluminum alloy substrate needs to be heated to the solution temperature first. After the aluminum alloy substrate is heated to the solution temperature, the aluminum alloy substrate is placed in the receiving groove 11 of the alloy plate forming die as described above. After that, the press drives the punch 2 to move toward the die 1 to complete the mold closing. After the mold closing, the aluminum alloy substrate is simultaneously forged and solutionized. Specifically, after the mold closing, the boss 21 of the punch 2 can apply sufficient pressure to the aluminum alloy substrate placed in the receiving groove 11, so that while the aluminum alloy substrate is transformed from the original material form to the forging billet, the non-matrix phase inside the aluminum alloy substrate can be dissolved and dispersed in the aluminum alloy substrate. Moreover, during the forging and solutionizing operations on the aluminum alloy substrate, a coolant circulates in the cooling passage, so that the aluminum alloy substrate can be cooled simultaneously to perform a quenching operation on the aluminum alloy substrate. For example, in this embodiment, the cooling rate of the aluminum alloy substrate is 15-25°C / s, thereby completing the quenching process of the forging billet.

[0061] Based on the content mentioned above, a first cooling passage 12 is provided inside the die 1. Specifically, the first cooling passage 12 includes a first liquid inlet passage 121, a first connecting passage 122, and a first liquid outlet passage 123. The first connecting passage 122 is connected between the first liquid inlet passage 121 and the first liquid outlet passage 123. The first connecting passage 122 is provided on the side of the receiving tank 11 away from the punch 2. Moreover, the upstream end of the first connecting passage 122 extends to directly below the side of the receiving tank 11 along the first horizontal direction, and the downstream end of the first connecting passage 122 extends to directly below the other side of the receiving tank 11 along the first horizontal direction, so that the coolant flowing along the first connecting passage 122 can pass from the bottom of the receiving tank 11. Moreover, since the coolant can flow from one side of the receiving tank 11 along the first horizontal direction to the other side of the receiving tank 11 along the first horizontal direction, the alloy substrate can be cooled more effectively.

[0062] Moreover, the first connecting passage 122 is arranged adjacent to the bottom of the receiving tank 11. For example, in this embodiment, the distance between the first connecting passage 122 and the bottom of the receiving tank 11 is 11.5 mm, so that the coolant flowing along the first connecting passage 122 is closer to the alloy substrate, thereby being able to more effectively cool the alloy substrate.

[0063] In addition, a plurality of first cooling passages 12 are provided inside the die 1, and the plurality of first cooling passages 12 are arranged at intervals along the second horizontal direction. For example, in this embodiment, twelve first cooling passages 12 are provided inside the die 1, and the twelve first cooling passages 12 are arranged at intervals along the second horizontal direction, wherein the second horizontal direction is arranged at an angle to the first horizontal direction, thereby increasing the heat dissipation area and more effectively cooling the alloy substrate.

[0064] Illustratively, in this embodiment, the second horizontal direction is perpendicular to the first horizontal direction, so that the alloy substrate placed in the containing tank 11 can be sufficiently cooled.

[0065] It is worth noting that the plurality of first connecting branches are evenly arranged along the second horizontal direction, so as to evenly dissipate heat from the alloy substrate, thereby more fully cooling the alloy substrate.

[0066] Furthermore, in this embodiment, the die 1 includes a carrier 13 and a first enclosure 14, the first enclosure 14 is sleeved on the outer periphery of the carrier 13, and the first enclosure 14 and the carrier 13 form a receiving tank 11, the first connecting passage 122 is arranged inside the carrier 13, and a second cooling passage is arranged inside the first enclosure 14, and the second cooling passage surrounds the outer periphery of the receiving tank 11. The coolant flowing along the second cooling passage can assist in cooling the alloy substrate, thereby more efficiently quenching the alloy substrate.

[0067] It is worth noting that, in this embodiment, the second cooling passage includes a first cooling branch 1411 and a second cooling branch 1412, wherein the first cooling branch 1411 surrounds half of the receiving tank 11, and the second cooling branch 1412 surrounds the other half of the receiving tank 11. That is, in this embodiment, the first cooling branch 1411 and the second cooling branch 1412 are jointly surrounded by the outer periphery of the receiving tank 11, thereby assisting in cooling the alloy substrate, and thereby more efficiently quenching the alloy substrate.

[0068] It is also worth noting that in this embodiment, two second cooling passages are provided, and the two second cooling passages are arranged at intervals in the vertical direction. Specifically, in this embodiment, two first cooling branches 1411 and two second cooling branches 1412 are provided, and the two first cooling branches 1411 are arranged at intervals in the vertical direction, and the two second cooling branches 1412 are arranged at intervals in the vertical direction, thereby more effectively assisting in cooling the alloy substrate, and thus more efficiently quenching the alloy substrate.

[0069] Of course, in other optional embodiments, only one second cooling passage may be provided, or more than three second cooling passages may be provided, and the more than three second cooling passages may be arranged at intervals in the vertical direction. This embodiment does not impose any specific limitation on this.

[0070] Furthermore, the die 1 also includes a first mounting platform 15 and a base 18, the carrier 13 and the first surrounding platform 14 are installed on the first mounting platform 15, the first mounting platform 15 is installed on the base 18, the first liquid inlet passage 121 is formed by a first liquid inlet pipe 161, the first liquid inlet pipe 161 includes a first pipe 1611 and a second pipe 1612, one end of the first pipe 1611 is connected to the first liquid inlet joint 31, and the other end of the first pipe 1611 is connected to the second pipe 1612, the second pipe 1612 is inserted into the carrier 13, and is connected to the upstream end of the first connecting passage 122.

[0071] The first liquid outlet passage 123 is formed by a first liquid outlet pipe 162, which includes a third pipe 1621 and a fourth pipe 1622. One end of the third pipe 1621 is connected to the first liquid outlet joint 32, and the other end of the third pipe 1621 is connected to the fourth pipe 1622. The fourth pipe 1622 is inserted into the carrier 13 and connected to the downstream end of the first connecting passage 122. Based on the above, the first mounting platform 15 is respectively provided with a first accommodating groove 151 and a second accommodating groove 152 on both sides along the first horizontal direction. The first pipe 1611 and the third pipe 1621 are respectively arranged in the first accommodating groove 151 and the second accommodating groove 152, thereby realizing the arrangement of the first cooling passage 12 inside the die 1.

[0072] Illustratively, in this embodiment, the first pipe 1611 and the third pipe 1621 both extend along the first horizontal direction.

[0073] Based on the content mentioned above, in this embodiment, twelve first cooling passages 12 are provided inside the die 1. Correspondingly, twelve first accommodating grooves 151 and twelve second accommodating grooves 152 are respectively provided on both sides of the first mounting platform 15 along the first horizontal direction. The twelve first accommodating grooves 151 are arranged at intervals along the second horizontal direction, and the twelve second accommodating grooves 152 are arranged at intervals along the second horizontal direction. All first accommodating grooves 151 are arranged with first pipes 1611, and all second accommodating grooves 152 are arranged with third pipes 1621. Moreover, all first pipes 1611 are connected to the same first liquid inlet joint 31, and all third pipes 1621 are connected to the same first liquid outlet joint 32. The first liquid inlet joint 31 is connected to the coolant circulation machine 100 through the first liquid supply pipe 101, and the first liquid outlet joint 32 is connected to the coolant circulation machine 100 through the first liquid return pipe 102, thereby realizing the circulation of the coolant.

[0074] In addition, illustratively, in this embodiment, the first connecting passage 122 is formed by a first connecting pipe 163 , which is arranged in the carrier 13 , and whose two ends are respectively connected to the second pipe 1612 and the fourth pipe 1622 .

[0075] It is understandable that in other optional embodiments, the first connecting passage 122 may be formed directly by processing a channel inside the carrier 13, and this embodiment does not impose any specific limitation on this.

[0076] Moreover, whether arranging a pipe for forming the first connecting passage 122 inside the carrier 13 or directly opening a hole for forming the first connecting passage 122 inside the carrier 13, the methods are all existing technologies, so this embodiment will not be described in detail.

[0077] Furthermore, the second pipe 1612 and the fourth pipe 1622 both extend in the vertical direction and are both arranged adjacent to the side wall of the carrier 13. Specifically, the second pipe 1612 is adjacent to the side wall of the carrier 13 on one side along the first horizontal direction. Exemplarily, the distance between the second pipe 1612 and the side wall is 10 mm. The fourth pipe 1622 is adjacent to the side wall of the carrier 13 on the other side along the first horizontal direction. Exemplarily, the distance between the fourth pipe 1622 and the side wall is 10 mm, thereby enabling more effective heat dissipation and cooling of the alloy substrate.

[0078] In addition, a first docking passage 1221 is formed on the upstream side of the first connecting passage 122, and a second docking passage 1222 is formed on the downstream side of the first connecting passage 122. The first docking passage 1221 and the second docking passage 1222 are docked with the second pipe 1612 and the fourth pipe 1622 respectively. It can be understood that the first docking passage 1221 and the second docking passage 1222 also extend in the vertical direction and are both arranged adjacent to the side wall of the carrier 13.

[0079] Based on the content mentioned above, a third cooling passage 22 is provided inside the punch 2. In this embodiment, the third cooling passage 22 includes a second liquid inlet passage 221, a second connecting passage 222, and a second liquid outlet passage 223. The second connecting passage 222 is connected between the second liquid inlet passage 221 and the second liquid outlet passage 223.

[0080] It can be understood that the bottom end of the boss 21 forms a table 211, which is used to press the alloy substrate. In this embodiment, the upstream end of the second connecting passage 222 extends to directly above one side of the table 211 along the first horizontal direction, and the downstream end of the second connecting passage 222 extends to directly above the other side of the table 211 of the boss 21 along the first horizontal direction. As a result, the coolant flowing through the second connecting passage 222 can pass above the table 211 of the boss 21. Moreover, since the coolant can flow from one side of the table 211 along the first horizontal direction to the other side of the table 211 along the first horizontal direction, the alloy substrate can be cooled more effectively.

[0081] In addition, the punch 2 also includes a second platform 24, which is sleeved on the outer periphery of the boss 21. It can be understood that the bottom of the boss 21 extends out of the second platform 24, and the part of the boss 21 extending out of the second platform 24 can be moved into the accommodating groove 11 and press against the alloy substrate.

[0082] As shown above, the second connecting passage 222 is arranged inside the boss 21 and is arranged adjacent to the table 211 of the boss 21. For example, in this embodiment, the distance between the second connecting passage 222 and the table 211 of the boss 21 is 11.5 mm, so that the coolant flowing along the second connecting passage 222 is closer to the alloy substrate, thereby being able to more effectively cool the alloy substrate.

[0083] In addition, a plurality of third cooling passages 22 are provided inside the punch 2, and the plurality of third cooling passages 22 are arranged at intervals along the second horizontal direction. For example, in this embodiment, twelve third cooling passages 22 are provided inside the punch 2, and the twelve third cooling passages 22 are arranged at intervals along the second horizontal direction. Based on the foregoing, the second horizontal direction is perpendicular to the first horizontal direction, thereby increasing the heat dissipation area and more effectively cooling the alloy substrate.

[0084] It is worth noting that the plurality of second connecting branches are evenly arranged along the second horizontal direction, so as to evenly dissipate heat from the alloy substrate, thereby more fully cooling the alloy substrate.

[0085] Furthermore, the punch 2 also includes a second mounting platform 25 and a connecting seat 26, wherein the boss 21 and the second surrounding platform 24 are both installed on the bottom of the second mounting platform 25, the second mounting platform 25 is installed on the bottom of the connecting seat 26, and the connecting seat 26 is installed at the movable end of the press. The second liquid inlet passage 221 is formed by a second liquid inlet pipe 271, and the second liquid inlet pipe 271 includes a fifth pipe 2711 and a sixth pipe 2712. One end of the fifth pipe 2711 is connected to the second liquid inlet joint 33, and the other end of the fifth pipe 2711 is connected to the sixth pipe 2712. The sixth pipe 2712 is inserted into the boss 21 and is connected to the upstream end of the second connecting passage 222.

[0086] The second liquid outlet passage 223 is formed by the second liquid outlet pipe 272, which includes a seventh pipe 2721 and an eighth pipe 2722. One end of the seventh pipe 2721 is connected to the second liquid outlet joint 34, and the other end of the seventh pipe 2721 is connected to the eighth pipe 2722. The eighth pipe 2722 is inserted into the boss 21 and connected to the downstream end of the second connecting passage 222. Based on the above, the second mounting platform 25 is respectively provided with a third accommodating groove 251 and a fourth accommodating groove 252 on both sides along the first horizontal direction, and the fifth pipe 2711 and the seventh pipe 2721 are respectively arranged in the third accommodating groove 251 and the fourth accommodating groove 252, thereby realizing the arrangement of the third cooling passage 22 inside the punch 2.

[0087] Illustratively, in this embodiment, the fifth pipe 2711 and the seventh pipe 2721 both extend along the first horizontal direction.

[0088] Based on the content mentioned above, in this embodiment, twelve third cooling passages 22 are provided inside the punch 2. Correspondingly, twelve third accommodating grooves 251 and twelve fourth accommodating grooves 252 are respectively provided on both sides of the second mounting platform 25 along the first horizontal direction. The twelve third accommodating grooves 251 are arranged at intervals along the second horizontal direction, and the twelve fourth accommodating grooves 252 are arranged at intervals along the second horizontal direction. All third accommodating grooves 251 are arranged with fifth pipes 2711, and all fourth accommodating grooves 252 are arranged with seventh pipes 2721. Moreover, all fifth pipes 2711 are connected to the same second liquid inlet joint 33, and all seventh pipes 2721 are connected to the same second liquid outlet joint 34. The second liquid inlet joint 33 is connected to the coolant circulation machine 100 through the second liquid supply pipe 103, and the second liquid outlet joint 34 is connected to the coolant circulation machine 100 through the second liquid return pipe 104, thereby realizing the circulation of the coolant.

[0089] In addition, illustratively, in this embodiment, the second connecting passage 222 is formed by a second connecting pipe 273 , which is arranged in the boss 21 , and whose two ends are respectively connected to the sixth pipe 2712 and the eighth pipe 2722 .

[0090] It is understandable that in other optional embodiments, the second connecting passage 222 may be formed directly by machining a hole inside the boss 21 , and this embodiment does not impose any specific limitation on this.

[0091] Moreover, whether arranging a pipe for forming the second connecting passage 222 inside the boss 21 or directly opening a hole for forming the second connecting passage 222 inside the boss 21, the methods are all existing technologies, so this embodiment will not elaborate on them.

[0092] Furthermore, the sixth pipe 2712 and the eighth pipe 2722 both extend in the vertical direction and are both arranged adjacent to the side wall of the boss 21. Specifically, the sixth pipe 2712 is adjacent to the side wall of the boss 21 on one side along the first horizontal direction. Exemplarily, the distance between the sixth pipe 2712 and the side wall is 10 mm. The eighth pipe 2722 is adjacent to the side wall of the boss 21 on the other side along the first horizontal direction. Exemplarily, the distance between the eighth pipe 2722 and the side wall is 10 mm, thereby enabling more effective heat dissipation and cooling of the alloy substrate.

[0093] Correspondingly, a third docking passage 2221 is formed on the upstream side of the second connecting passage 222, and a fourth docking passage 2222 is formed on the downstream side of the second connecting passage 222. The third docking passage 2221 and the fourth docking passage 2222 are docked with the sixth pipe 2712 and the eighth pipe 2722 respectively. It can be understood that the third docking passage 2221 and the fourth docking passage 2222 also extend in the vertical direction and are both arranged adjacent to the side wall of the boss 21.

[0094] In addition, for the second cooling passage, the upstream end of the first cooling branch 1411 is connected to the third liquid inlet joint 35 through the third liquid inlet pipe 142, and the upstream end of the second cooling branch 1412 is connected to the fourth liquid inlet joint through the fourth liquid inlet pipe 143. The downstream end of the first cooling branch 1411 is connected to the third liquid outlet joint 36 through the third liquid outlet pipe 144, and the downstream end of the second cooling branch 1412 is connected to the fourth liquid outlet joint through the fourth liquid outlet pipe 145. The third liquid inlet joint 35 is connected to the cooling liquid circulation machine 100 through the third liquid supply pipe 105, and the third liquid outlet joint 36 is connected to the cooling liquid circulation machine 100 through the third liquid return pipe 106, thereby realizing the circulation of the cooling liquid.

[0095] For example, in this embodiment, the first cooling branch 1411 and the second cooling branch 1412 are both formed by channels opened inside the first enclosure 14. Of course, in other optional embodiments, the first cooling branch 1411 and the second cooling branch 1412 can also be formed by pipes arranged inside the first enclosure 14, and this embodiment does not impose any specific restrictions on this.

[0096] It can be understood that whether it is directly opening a channel inside the first enclosure 14 to form the first cooling branch 1411 and the second cooling branch 1412, or arranging pipes inside the first enclosure 14 to form the first cooling branch 1411 and the second cooling branch 1412, the method is the existing technology, so this embodiment will not elaborate on it.

[0097] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention and are not intended to limit the embodiments of the present invention. A person skilled in the art would be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is not necessary and impossible to enumerate all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the claims of the present invention.

Claims

1. Alloy plate forming die, characterized in that: include: A concave mold (1) is provided with a receiving groove (11), wherein the receiving groove (11) is configured to receive an alloy substrate heated to a solid solution temperature; A punch (2) and a press, wherein the punch (2) is provided with a boss (21), and the press is configured to drive the punch (2) to move toward or away from the die (1), and / or to drive the die (1) to move toward or away from the punch (2), so that the boss (21) can be inserted into the receiving groove (11) to forge the alloy substrate, or moved out of the receiving groove (11), and a cooling passage is provided inside the die (1) and / or the punch (2), and the cooling passage is used to circulate a cooling liquid.

2. The alloy plate forming die according to claim 1, characterized in that: A first cooling passage (12) is arranged inside the die (1), and the first cooling passage (12) comprises a first liquid inlet passage (121), a first connecting passage (122), and a first liquid outlet passage (123); the first connecting passage (122) is connected between the first liquid inlet passage (121) and the first liquid outlet passage (123); the first connecting passage (122) is arranged on a side of the receiving groove (11) away from the punch (2); an upstream end of the first connecting passage (122) extends to a position directly below one side of the receiving groove (11) along a first horizontal direction, and a downstream end of the first connecting passage (122) extends to a position directly below the other side of the receiving groove (11) along the first horizontal direction.

3. The alloy plate forming die according to claim 2, characterized in that: The first connecting passage (122) is arranged adjacent to the bottom of the containing groove (11).

4. The alloy plate forming die according to claim 2, characterized in that: A plurality of the first cooling passages (12) are arranged inside the die (1), and the plurality of the first cooling passages (12) are arranged at intervals along a second horizontal direction, and the second horizontal direction is arranged at an angle to the first horizontal direction.

5. The alloy plate forming die according to claim 2, characterized in that: The die (1) comprises a carrier (13) and a first enclosure (14), wherein the first enclosure (14) is sleeved on the outer circumference of the carrier (13), and the first enclosure (14) and the carrier (13) form the receiving groove (11), the first connecting passage (122) is arranged inside the carrier (13), and a second cooling passage is arranged inside the first enclosure (14), and the second cooling passage surrounds the outer circumference of the receiving groove (11).

6. The alloy plate forming die according to claim 5, characterized in that: The die (1) further comprises a first mounting platform (15), the carrier (13) and the first surrounding platform (14) are mounted on the first mounting platform (15), the first liquid inlet passage (121) is formed by a first liquid inlet pipe (161), the first liquid inlet pipe (161) comprises a first pipe (1611) and a second pipe (1612), one end of the first pipe (1611) is connected to the first liquid inlet joint (31), the other end of the first pipe (1611) is connected to the second pipe (1612), the second pipe (1612) is inserted into the carrier (13), and is butt-connected and connected to the upstream end of the first connecting passage (122); The first liquid outlet passage (123) is formed by a first liquid outlet pipe (162), the first liquid outlet pipe (162) comprising a third pipe (1621) and a fourth pipe (1622), one end of the third pipe (1621) is connected to the first liquid outlet joint (32), the other end of the third pipe (1621) is connected to the fourth pipe (1622), the fourth pipe (1622) is inserted into the carrier (13) and is butt-connected and connected to the downstream end of the first connecting passage (122), the first mounting platform (15) is provided with a first accommodating groove (151) and a second accommodating groove (152) on both sides along the first horizontal direction, the first pipe (1611) and the third pipe (1621) are arranged in the first accommodating groove (151) and the second accommodating groove (152), respectively.

7. The alloy plate forming die according to claim 6, characterized in that: The second pipe (1612) and the fourth pipe (1622) both extend in the vertical direction and are both arranged adjacent to the side wall of the carrier (13).

8. The alloy plate forming die according to claim 1, characterized in that: A third cooling passage (22) is arranged inside the convex mold (2), and the third cooling passage (22) comprises a second liquid inlet passage (221), a second connecting passage (222), and a second liquid outlet passage (223); the second connecting passage (222) is connected between the second liquid inlet passage (221) and the second liquid outlet passage (223); the boss (21) is formed with a table surface (211), and the table surface (211) is used to press the alloy substrate; the upstream end of the second connecting passage (222) extends to just above one side of the table surface (211) along the first horizontal direction, and the downstream end of the second connecting passage (222) extends to just above the other side of the table surface (211) along the first horizontal direction.

9. The alloy plate forming die according to claim 8, characterized in that: The second connecting passage (222) is arranged adjacent to the table surface (211).

10. Alloy plate forming process, characterized in that: include: After the alloy substrate is heated to the solution temperature, the alloy substrate is placed in a receiving groove (11) of the alloy plate forming die according to any one of claims 1 to 9; The press drives the male die (2) to move toward the female die (1) to complete the die closing, and after the die closing, the alloy substrate is subjected to forging and solution treatment simultaneously; When the alloy substrate is subjected to forging and solution treatment, the coolant circulates in the cooling passage to simultaneously perform quenching on the alloy substrate.

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