Mechanical and photochemical fluid polishing integrated auxiliary machining platform and combined polishing method

Abstract

The invention discloses a mechanical and photochemical fluid polishing integrated auxiliary machining platform and a combined polishing method. The platform comprises a rack, a workpiece transfer mechanism used for clamping and moving a workpiece, a mechanical fluid polishing module and a photocatalysis detection feedback module. The mechanical fluid polishing module comprises a dual-purpose polishing groove body, a mechanical polishing assembly and a photocatalytic fluid polishing assembly. The shading area is arranged in the photocatalytic fluid polishing chamber, the oxidation-reduction potentials inside and outside the shading area are detected respectively, the optical excitation ORP value is obtained by solving the difference, the optical excitation ORP value is maintained in an ideal interval by adjusting the ultraviolet light intensity, and the whole photocatalytic fluid polishing process is kept efficient and reliable; due to the fact that the optical excitation ORP eliminates the influence on the oxidability of original substances which contribute slightly to workpiece surface oxidation in the polishing solution, the increment of hydroxyl free radicals generated due to photocatalysis can be accurately measured, and the control accuracy of the photocatalytic fluid polishing process is improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of compound polishing, and particularly relates to an integrated auxiliary processing platform for mechanical and photochemical fluid polishing and a combined polishing method. Background Art

[0002] Photochemical polishing is a high-precision surface treatment technology that can soften surface materials through photochemical reactions and improve surface processing efficiency. Traditional photochemical polishing platforms usually consist of independent light sources, polishing solutions, and mechanical polishing devices, and have the following problems: 1. Since the materials that require photochemical-assisted processing usually have characteristics such as high hardness and corrosion resistance, it is difficult to improve processing efficiency if only one polishing method is used for polishing. 2. During the photochemical-assisted processing, due to the consumption of electron scavengers (such as H 2 O 2 ), or the attenuation of the light source intensity, the weakening of the photochemical effect on the softening of the metal surface will occur, affecting the processing results, and there is a lack of a method for real-time monitoring of the oxidation intensity of the metal surface during the processing.

[0003] Therefore, there is an urgent need for a processing platform that integrates mechanical and fluid polishing functions, which can achieve rough machining through mechanical material removal, and then perform photochemical-assisted fluid finishing machining to accurately control the photochemical corrosion degree of the metal surface during the processing. Summary of the Invention

[0004] The present invention aims to solve the problems existing in the existing photochemical polishing technology, such as low processing efficiency and inability to realize real-time detection of photochemical corrosion effects, and provides an integrated auxiliary processing platform for mechanical and photochemical fluid polishing and its specific implementation method.

[0005] In a first aspect, the present invention provides an integrated auxiliary processing platform for mechanical and photochemical fluid polishing, which includes a frame, a workpiece transfer mechanism for clamping and moving a workpiece, a mechanical fluid polishing module, and a photocatalytic detection and feedback module.

[0006] The mechanical fluid polishing module includes a dual-purpose polishing tank body, a mechanical polishing component, and a photocatalytic fluid polishing component. The dual-purpose polishing tank body is installed in the middle of the frame and is provided with two independent chambers, namely a mechanical polishing chamber and a photocatalytic fluid polishing chamber. The mechanical polishing component is used to perform mechanical polishing on the workpiece in the mechanical polishing chamber.

[0007] The photocatalytic fluid polishing component includes a jet nozzle and an ultraviolet light source installed in the photocatalytic fluid polishing chamber. The ultraviolet light source with adjustable light intensity is installed at the bottom of the photocatalytic fluid polishing chamber. The jet nozzle is used to spray the surface of the workpiece immersed in the polishing solution in the photocatalytic fluid polishing chamber with TiO 2Polishing liquid of particles and hydrogen peroxide.

[0008] The photocatalytic detection feedback module includes a photocatalytic ORP sensor, a light-shielding cover, a reference ORP sensor, and a light intensity sensor. The light intensity sensor is used to detect the ultraviolet light intensity in the photocatalytic fluid polishing chamber. The light-shielding cover is installed in the photocatalytic fluid polishing chamber to form a light-shielded area where ultraviolet light cannot irradiate. The light-shielded area communicates with other areas in the photocatalytic fluid polishing chamber. The detection part of the reference ORP sensor is located in the light-shielded area; the detection part of the photocatalytic ORP sensor is located in the area outside the light-shielded area of the photocatalytic fluid polishing chamber. During the photocatalytic fluid polishing process, the intensity of the ultraviolet light emitted by the ultraviolet light source is adjusted according to the difference in the redox potential measured by the photocatalytic ORP sensor and the reference ORP sensor.

[0009] Preferably, the detection parts of the photocatalytic ORP sensor and the light intensity sensor are at the same height as the polished surface of the workpiece during the fluid polishing process.

[0010] Preferably, the photocatalytic fluid polishing assembly further includes a polishing liquid circulation assembly; the jet nozzle is installed at the bottom edge of the inner cavity of the photocatalytic fluid polishing chamber and is inclined upward. The polishing liquid circulation assembly includes a fluid driving pump and a pipeline. The fluid outlet at the bottom of the photocatalytic fluid polishing chamber, the fluid driving pump, and the jet nozzle are connected in sequence.

[0011] Preferably, the mechanical polishing assembly includes a grinding and polishing disc and a mechanical polishing driving structure. The grinding and polishing disc is rotatably installed at the bottom of the mechanical polishing chamber and is driven to rotate by the mechanical polishing driving structure.

[0012] Preferably, the photocatalytic detection feedback module further includes a pH sensor for detecting the pH value of the polishing liquid in the photocatalytic fluid polishing chamber. The photocatalytic fluid polishing assembly further includes a pH adjustment assembly. The pH adjustment assembly includes an acidic adjustment release device and an alkaline adjustment release device, both of which are connected to the photocatalytic fluid polishing chamber.

[0013] Preferably, a light source installation area recessed downward is provided in the middle of the bottom surface of the photocatalytic fluid polishing chamber. A protective net is installed at the top opening of the light source installation area. The ultraviolet light source is installed in the light source installation area.

[0014] Preferably, the workpiece transfer mechanism includes a three-axis movement module, a pressurization module, and a clamping structure. The clamping structure is installed on the three-axis movement module through the pressurization module. The pressurization module is used to apply an extrusion force to the workpiece during mechanical polishing.

[0015] Second aspect, the present invention provides a combined mechanical and photochemical fluid polishing method, which uses the aforementioned integrated auxiliary processing platform for mechanical and photochemical fluid polishing; the combined mechanical and photochemical fluid polishing method includes the following steps: Step 1, move and immerse the workpiece into the polishing liquid in the mechanical polishing chamber, and perform mechanical polishing on the workpiece through the mechanical polishing assembly.

[0016] Step 2, move and immerse the workpiece into the polishing liquid in the photocatalytic fluid polishing chamber. Detect the oxidation-reduction potential of the polishing liquid in the environment without ultraviolet light through the reference ORP sensor, and record it as the background ORP value O b ; Detect the oxidation-reduction potential of the polishing liquid where the workpiece is located in the environment with ultraviolet light through the photocatalytic ORP sensor, and record it as the comprehensive ORP value O c . Calculate the photoexcited ORP value ; By dynamically adjusting the luminous intensity of the ultraviolet light source, control the photoexcited ORP value within the photoexcited interval.

[0017] Spray the polishing liquid containing TiO 2 particles and hydrogen peroxide onto the workpiece through the jet nozzle to perform fluid polishing under photocatalytic oxidation reaction.

[0018] Preferably, the material of the workpiece is nickel-based alloy; the surface of the workpiece to be polished is laser cladded.

[0019] Preferably, after the workpiece is immersed in the polishing liquid in the photocatalytic fluid polishing chamber in Step 2, first detect the ultraviolet light intensity in the polishing liquid where the workpiece is located through the light intensity sensor; adjust the luminous intensity of the ultraviolet light source according to the measured ultraviolet light intensity, so that the ultraviolet light intensity measured by the light intensity sensor reaches the preset reference light intensity value.

[0020] The process of controlling the photoexcited ORP value within the photoexcited interval in Step 2 is as follows: when the photoexcited ORP value is less than the lower limit of the preset photoexcited interval, control the ultraviolet light source to increase the light intensity until the photoexcited ORP value is greater than or equal to the photoexcited target value. When the photoexcited ORP value is greater than the upper limit of the preset photoexcited interval, control the ultraviolet light source to weaken the light intensity until the photoexcited ORP value is less than or equal to the photoexcited target value. The photoexcited interval is preferably 4.9 - 5.1; the photoexcited target value is 5.0.

[0021] The beneficial effects of the present invention are: 1. In the present invention, the laser cladding surface of a nickel-based alloy workpiece is successively subjected to mechanical polishing and photocatalytic fluid polishing in a dual-purpose polishing tank, and the switching of the polishing type is automatically completed by means of a workpiece transfer mechanism to move the workpiece, significantly improving the processing efficiency of integrated polishing.

[0022] 2. In the present invention, a light-shielded area is provided in the photocatalytic fluid polishing chamber, and the redox potentials inside and outside the light-shielded area are respectively detected. By taking the difference between the two, the photoexcited ORP value is obtained, and the intensity of ultraviolet light is adjusted so that the photoexcited ORP value is maintained within an ideal range, ensuring the high efficiency and reliability of the entire photocatalytic fluid polishing process; since the photoexcited ORP excludes the influence of the oxidizing property of the original substances in the polishing liquid that contribute little to the oxidation of the workpiece surface, it can accurately measure the increment of hydroxyl radicals generated by photocatalysis, thereby improving the control accuracy of the photocatalytic fluid polishing process in the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of the overall structure of Embodiment 1 of the present invention.

[0024] Figure 2 It is a schematic diagram of the structure of the mechanical fluid polishing module in Embodiment 1 of the present invention.

[0025] Figure 3 It is a schematic diagram of the relative positions of the photocatalytic detection and feedback module and the mechanical fluid polishing module in Embodiment 1 of the present invention.

[0026] Figure 4 It is a schematic diagram of the relative positions of the jet nozzle and the workpiece during photocatalytic fluid polishing in Embodiment 1 of the present invention.

[0027] Reference numerals: 1, frame; 2, mechanical fluid polishing module; 2-1, dual-purpose polishing tank; 2-2, grinding and polishing disc; 2-3, mechanical polishing drive structure; 2-4, jet nozzle; 2-5, ultraviolet light source; 2-6, pH adjustment component; 3, photocatalytic detection and feedback module; 3-1, pH sensor; 3-2, photocatalytic ORP sensor; 3-3, light-shielding cover; 3-4, reference ORP sensor; 3-5, light intensity sensor; 4, workpiece transfer mechanism; 4-1, three-axis movement module; 4-2, pressurization module; 4-3, clamping structure; 5, control module; 6, workpiece. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0028] The following further describes the present invention.

[0029] Embodiment 1 As Figure 1As shown in the figure, an integrated auxiliary processing platform for mechanical and photochemical fluid polishing includes a frame 1, and a mechanical fluid polishing module 2, a photocatalytic detection and feedback module 3, a workpiece transfer mechanism 4, and a control module 5 installed on the frame 1. The workpiece transfer mechanism 4 is located above the mechanical fluid polishing module 2 and is used to clamp and move the position of the workpiece 6, so as to automatically complete the mechanical polishing and photocatalytic fluid polishing of the workpiece 6 before and after.

[0030] As Figure 1 , Figure 2 and Figure 3 shown in the figure, the mechanical fluid polishing module 2 includes a dual-purpose polishing tank body 2-1, a mechanical polishing component, and a photocatalytic fluid polishing component. The dual-purpose polishing tank body 2-1 is fixed in the middle of the frame 1. The dual-purpose polishing tank body 2-1 is provided with two chambers that are independent of each other and both open at the top, namely a mechanical polishing chamber and a photocatalytic fluid polishing chamber.

[0031] The mechanical polishing component is used to perform mechanical polishing on the workpiece 6 in the mechanical polishing chamber, and includes a grinding and polishing disc 2-2 and a mechanical polishing drive structure 2-3. The grinding and polishing disc 2-2 is rotatably installed at the bottom of the inner cavity of the mechanical polishing chamber. The mechanical polishing drive structure 2-3 is used to drive the grinding and polishing disc 2-2 to rotate, so as to polish the workpiece 6 that is immersed in the mechanical polishing chamber and abuts against the grinding and polishing disc 2-2. In this embodiment, the mechanical polishing drive structure 2-3 adopts a motor drive structure.

[0032] The photocatalytic fluid polishing component is used to irradiate the processed surface of the workpiece 6 with ultraviolet light in the photocatalytic fluid polishing chamber, and use a polishing liquid containing hydrogen peroxide to wash it, so as to achieve photocatalytic fluid polishing.

[0033] The photocatalytic fluid polishing component includes a jet nozzle 2-4, an ultraviolet light source 2-5, a polishing liquid circulation component, and a pH adjustment component 2-6.

[0034] In the middle of the bottom surface of the photocatalytic fluid polishing chamber, there is a downwardly concave light source installation area. The light source installation area is integrated with the photocatalytic fluid polishing chamber, and the polishing liquid can enter the light source installation area. A protective net is installed at the top opening of the light source installation area. The ultraviolet light source 2-5 is installed in the light source installation area and is used to emit ultraviolet light upward to photocatalyze the reaction between hydrogen peroxide in the polishing liquid and the processed surface of the metal workpiece 6.

[0035] In this embodiment, the ultraviolet light source 2-5 adopts an ultraviolet lamp with adjustable light intensity, so as to adjust the ultraviolet light intensity irradiated on the surface of the workpiece 6 and adjust the reaction and corrosion rate on the surface of the workpiece 6 during the photocatalytic fluid polishing process.

[0036] The jet nozzle 2-4 is installed at the bottom edge of the inner cavity of the photocatalytic fluid polishing chamber and is inclined upward. The polishing liquid circulation assembly includes a fluid driving pump and a pipeline. The fluid outlet at the bottom of the photocatalytic fluid polishing chamber, the fluid driving pump, and the jet nozzle 2-4 are connected in sequence; the continuous fluid polishing operation of the workpiece 6 is realized by driving the circulation of the polishing liquid in the photocatalytic fluid polishing chamber by the fluid driving pump. During the polishing process, the jet nozzle 2-4 continuously releases the polishing liquid with a pressure of 600 kPa, erodes the metal surface of the workpiece 6, and at the same time plays a role in stirring the polishing liquid to make the polishing liquid as uniform as possible.

[0037] The pH adjustment assembly 2-6 is used to adjust the pH value of the polishing liquid by injecting acidic or alkaline solutions into the photocatalytic fluid polishing chamber, and it includes an acidic adjustment release device and an alkaline adjustment release device. The acidic adjustment release device stores acidic solutions and is connected to the photocatalytic fluid polishing chamber through a regulating valve; the alkaline adjustment release device stores alkaline solutions and is connected to the photocatalytic fluid polishing chamber through a regulating valve.

[0038] The photocatalytic detection and feedback module 3 includes a pH sensor 3-1, a photocatalytic ORP sensor 3-2, a light-shielding cover 3-3, a reference ORP sensor 3-4, and a light intensity sensor 3-5 installed on the frame 1.

[0039] The light-shielding cover 3-3 is installed on the side wall of the photocatalytic fluid polishing chamber. The light-shielding cover 3-3 forms a light-shielded area inside the photocatalytic fluid polishing chamber where ultraviolet light cannot irradiate. The light-shielded area is communicated with other areas inside the photocatalytic fluid polishing chamber, so that the polishing liquid can freely enter and exit the light-shielded area.

[0040] The pH sensor 3-1 is used to detect the pH value of the polishing liquid in the photocatalytic fluid polishing chamber; the reference ORP sensor 3-4 is used to detect the redox potential of the light-shielded area of the photocatalytic fluid polishing chamber; the photocatalytic ORP sensor 3-2 is used to detect the redox potential of the area outside the light-shielded area of the photocatalytic fluid polishing chamber; the light intensity sensor 3-5 is used to detect the ultraviolet light intensity in the photocatalytic fluid polishing chamber. The detection parts of the photocatalytic ORP sensor 3-2 and the light intensity sensor 3-5 are at the same height as the polished surface of the workpiece 6 during the fluid polishing process.

[0041] According to the pH value measured by the pH sensor 3-1, in cooperation with the acidic adjustment release device and the alkaline adjustment release device, the pH value of the polishing liquid can be accurately adjusted.

[0042] The workpiece transfer mechanism 4 includes a three-axis movement module 4-1, a pressurization module 4-2, and a clamping structure 4-3. The three-axis movement module 4-1 includes an X-axis movement platform, a Y-axis movement platform, and a Z-axis movement platform connected in sequence, and a mounting base block installed on the slider structure of the Z-axis movement platform. The clamping structure 4-3 is installed on the mounting base block through the pressurization module 4-2 and is used for clamping the workpiece 6. The pressurization module 4-2 uses a cylinder and is used to apply an extrusion force to the workpiece 6 on the clamping structure 4-3.

[0043] The control module 5 is used to control the workpiece transfer mechanism 4, the mechanical fluid polishing module 2, and the photocatalytic detection and feedback module 3 to perform mechanical and photocatalytic fluid polishing.

[0044] In this embodiment, the workpiece 6 is made of inconel 718 nickel-based alloy, and the machining surface to be polished is laser-clad with metal powder of the same material, and the thickness of the cladding layer is about 0.5 mm.

[0045] In this embodiment, the polishing liquid uses TiO 2 anatase, H 2 O 2 (hydrogen peroxide) and water in a mixed solution in a certain ratio. In the polishing liquid, the mass ratio of TiO 2 anatase, H 2 O 2 and water is preferably 2:5:93.

[0046] In some preferred embodiments, the mechanical fluid polishing module 2 further includes a hydrogen peroxide replenishing device; the hydrogen peroxide output port of the hydrogen peroxide replenishing device is located above the photocatalytic fluid polishing chamber and is used to replenish H 2 O 2 as needed during the process of photocatalytic fluid polishing, so that the concentration of H 2 O 2 in the polishing liquid is maintained within the target range.

[0047] Embodiment 2 A mechanical and photocatalytic fluid combined polishing method, using the working method of the mechanical and photocatalytic fluid polishing integrated auxiliary processing platform in Embodiment 1, the combined polishing method includes the following steps: Step 1: Clamp and fix the workpiece 6 through the clamping structure 4-3 in the workpiece transfer mechanism 4. In this embodiment, the workpiece 6 is a nickel-based alloy.

[0048] Step 2: Send a control instruction through the control module 5 to control the movement of the X-axis movement platform, Y-axis movement platform, and Z-axis movement platform in the three-axis movement module 4-1, drive the workpiece 6 to move and immerse it in the mechanical polishing chamber, and make the machining surface at the bottom of the workpiece 6 contact the grinding and polishing disc 2-2.

[0049] Step 3: Drive the grinding and polishing disc 2-2 to rotate through the mechanical polishing drive structure 2-3 to perform mechanical grinding (rough machining) on the machining surface at the bottom of the workpiece 6. cj seconds, where t cj is the mechanical grinding time. Since the efficiency of mechanical polishing is higher than that of photocatalytic fluid polishing, performing this step before photocatalytic fluid polishing can greatly reduce the overall processing time and improve the processing efficiency.

[0050] Step 4: Send a control instruction through the control module 5 to control the movement of the X-axis moving platform, Y-axis moving platform, and Z-axis moving platform in the three-axis moving module 4-1, driving the workpiece 6 to move and immerse it in a specified position in the photocatalytic fluid polishing chamber.

[0051] Step 5: Detect the ultraviolet light intensity I at the same height of the machining surface of the workpiece 6 through the light intensity sensor 3-5; control the ultraviolet light source 2-5, combined with the light intensity I, to control the light intensity I at 120 mW / cm 2 or above. Detect the pH value V of the polishing fluid through the pH sensor 3-1 ph . Control the acidic adjustment release device and the alkaline adjustment release device, combined with the real-time updated pH value V ph , to control the pH value Vph of the polishing fluid at 7.5 - 8.

[0052] Step 6: The light-shielding cover 3-3 blocks the ultraviolet light irradiation, and detect the redox potential of the polishing fluid containing hydrogen peroxide in the environment without ultraviolet light through the reference ORP sensor 3-4, denoted as the background ORP value O b ; detect the redox potential of the polishing fluid at the same height of the machining surface of the workpiece 6 through the photocatalytic ORP sensor 3-2, denoted as the comprehensive ORP value O c .

[0053] Step 7: Refer to the following formulas (1), (2) and (3). In the case of ultraviolet light irradiation, ultraviolet light can excite TiO 2 to generate electron-hole pairs, and finally generate hydroxyl radicals; hydroxyl radicals can rapidly oxidize the surface of the nickel-based alloy.

[0054] Formula (1) Formula (2) Formula (3) While in the case of no ultraviolet light irradiation, the generation amount of hydroxyl radicals is extremely small and will disappear quickly, and the oxidizing property of hydrogen peroxide in the polishing fluid is not sufficient to rapidly oxidize the surface of the nickel-based alloy.

[0055] Since the comprehensive ORP value O measured in Step 6c The comprehensive oxidation-reduction ability of the reactive polishing solution, which includes the oxidizing property of substances such as hydrogen peroxide itself. However, this part of the oxidizing property contributes very little to the oxidation rate of the workpiece. Therefore, the comprehensive ORP value O is used. c It is not accurate to quantitatively analyze the corrosion degree of the workpiece by the polishing solution. Instead, the increment of the oxidation-reduction potential before and after ultraviolet light irradiation should be used to measure the corrosion degree of the workpiece surface.

[0056] Considering that hydroxyl radicals will quickly disappear without ultraviolet light irradiation, the background ORP value O is obtained by measuring the oxidation-reduction potential in the shaded area. b ; On this basis, the photoexcited ORP value representing the increment of the oxidation intensity received by the metal surface (i.e., concentration increment) is introduced through differential measurement. Thus, the influence of the change in the bulk composition of the solution is eliminated in the quantitative analysis of the corrosion degree of the workpiece surface, and the accurate characterization of the interfacial oxidizing property is realized.

[0057] Since the photoexcited ORP value is positively correlated with the radical concentration and can be used as a direct indicator of the photocatalytic oxidation efficiency, this embodiment can realize the real-time detection and control of the oxidation intensity received by the metal surface during the processing.

[0058] In this embodiment, the photoexcited ORP value is obtained by subtracting the background ORP value O c from the comprehensive ORP value O b . The expression of the photoexcited ORP value is shown in Equation (4) as follows: Equation (4) When the photoexcited ORP value is less than the lower limit of the preset photoexcited interval, the ultraviolet light source is controlled to increase the light intensity until the photoexcited ORP value is greater than or equal to the photoexcited target value. When the photoexcited ORP value is greater than the upper limit of the preset photoexcited interval, the ultraviolet light source is controlled to decrease the light intensity until the photoexcited ORP value is less than or equal to the photoexcited target value, thereby realizing the accurate control of the corrosion degree of the metal surface. In this embodiment, the photoexcited interval is 4.9 - 5.1; the photoexcited target value is 5.0.

[0059] Step 8: Turn on the jet nozzle 2-4 and the polishing fluid circulation component, so that the jet nozzle 2-4 continuously sprays the polishing fluid onto the machining surface at the bottom of the workpiece, and cooperates with the oxidation reaction of the hydroxyl radicals generated under ultraviolet photocatalysis to erode the machining surface at the bottom of the workpiece, realizing the finishing of the machining surface. At the same time, the continuous spraying of the jet nozzle 2-4 makes the abrasive grains in the polishing fluid more evenly dispersed. In this embodiment, the ejection pressure of the jet nozzle is 600 kPa. During the fluid polishing process, 5% H 2 O 2 solution is periodically dropped into the photocatalytic fluid polishing chamber through the mechanical fluid polishing module 2 to reduce the consumption of H 2 O 2 during the polishing process.

[0060] After machining for t lt seconds, the ultraviolet light source 2-5 is turned off, the jet nozzle 2-4 stops spraying the polishing fluid, and the photocatalytic fluid polishing ends, where t lt is the fluid polishing processing time.

[0061] Step 9: Send a control instruction through the control module to control the movement of the X-axis moving platform, Y-axis moving platform, and Z-axis moving platform in the three-axis moving module 4-1, take out the workpiece from the photocatalytic fluid polishing chamber, and disassemble it.

Claims

1. A mechanical and photochemical fluid polishing integrated auxiliary processing platform, comprising a workpiece transfer mechanism (4); characterized in that: It also includes a mechanical fluid polishing module (2) and a photocatalytic detection feedback module (3); The mechanical fluid polishing module (2) comprises a dual-purpose polishing tank (2-1), a mechanical polishing assembly and a photocatalytic fluid polishing assembly; the dual-purpose polishing tank (2-1) is provided with a mechanical polishing chamber and a photocatalytic fluid polishing chamber which are independent of each other; the mechanical polishing assembly is used to perform mechanical polishing on a workpiece (6) in the mechanical polishing chamber; The photocatalytic fluid polishing component comprises a jet nozzle (2-4) and an ultraviolet light source (2-5) installed in a photocatalytic fluid polishing chamber; the ultraviolet light source (2-5) with adjustable light intensity is installed at the bottom of the photocatalytic fluid polishing chamber; the jet nozzle (2-4) is used to spray a polishing liquid containing TiO2 particles and hydrogen peroxide onto the surface of a workpiece immersed in a polishing liquid in the photocatalytic fluid polishing chamber; The photocatalytic detection feedback module (3) comprises a photocatalytic ORP sensor (3-2), a light shield (3-3), a reference ORP sensor (3-4) and a light intensity sensor (3-5); the light intensity sensor (3-5) is used to detect the ultraviolet light intensity in the photocatalytic fluid polishing chamber; the light shield (3-3) is installed in the photocatalytic fluid polishing chamber to form a light shielding area that cannot be irradiated by ultraviolet light; the light shielding area is connected to other areas in the photocatalytic fluid polishing chamber; the detection part of the reference ORP sensor (3-4) is located in the light shielding area; the detection part of the photocatalytic ORP sensor (3-2) is located in the area outside the light shielding area of ​​the photocatalytic fluid polishing chamber; during the photocatalytic fluid polishing process, the ultraviolet light intensity emitted by the ultraviolet light source (2-5) is adjusted by the redox potential difference measured by the photocatalytic ORP sensor (3-2) and the reference ORP sensor (3-4).

2. The integrated mechanical and photochemical fluid polishing auxiliary processing platform according to claim 1 is characterized in that: The detection parts of the photocatalytic ORP sensor (3-2) and the light intensity sensor (3-5) are at the same height as the polished surface of the workpiece (6) during the fluid polishing process.

3. The integrated mechanical and photochemical fluid polishing auxiliary processing platform according to claim 1 is characterized in that: The photocatalytic fluid polishing component also includes a polishing liquid circulation component; the jet nozzle (2-4) is installed at the bottom edge of the inner cavity of the photocatalytic fluid polishing chamber and is arranged obliquely upward; the polishing liquid circulation component includes a fluid drive pump and a pipeline; the fluid outlet at the bottom of the photocatalytic fluid polishing chamber, the fluid drive pump and the jet nozzle (2-4) are connected in sequence.

4. The integrated mechanical and photochemical fluid polishing auxiliary processing platform according to claim 1 is characterized in that: The mechanical polishing assembly comprises a grinding and polishing disc (2-2) and a mechanical polishing drive structure (2-3); the grinding and polishing disc (2-2) is rotatably mounted on the bottom of the mechanical polishing chamber and is driven to rotate by the mechanical polishing drive structure (2-3).

5. The integrated auxiliary processing platform for mechanical and photochemical fluid polishing according to claim 1 is characterized in that: The photocatalytic detection feedback module (3) also includes a pH sensor (3-1) for detecting the pH value of the polishing liquid in the photocatalytic fluid polishing chamber; the photocatalytic fluid polishing component also includes a pH adjustment component (2-6); the pH adjustment component (2-6) includes an acidic adjustment release device and an alkaline adjustment release device, both of which are connected to the photocatalytic fluid polishing chamber.

6. The integrated mechanical and photochemical fluid polishing auxiliary processing platform according to claim 1 is characterized in that: A light source installation area which is recessed downward is provided in the middle of the bottom surface of the photocatalytic fluid polishing chamber; a protective net is installed at the top opening of the light source installation area; and the ultraviolet light source (2-5) is installed in the light source installation area.

7. The integrated mechanical and photochemical fluid polishing auxiliary processing platform according to claim 1 is characterized in that: The workpiece transfer mechanism (4) comprises a three-axis moving module (4-1), a pressurizing module (4-2) and a clamping structure (4-3); the clamping structure (4-3) is installed on the three-axis moving module (4-1) via the pressurizing module (4-2); the pressurizing module (4-2) is used to apply a squeezing force to the workpiece (6) during mechanical polishing.

8. A method for combined mechanical and photochemical fluid polishing, characterized in that: Using the mechanical and photochemical fluid polishing integrated auxiliary processing platform as described in claim 1; the mechanical and photochemical fluid combined polishing method comprises the following steps: Step 1: moving the workpiece (6) into the polishing liquid in the mechanical polishing chamber, and mechanically polishing the workpiece (6) using a mechanical polishing assembly; Step 2: Move the workpiece (6) and immerse it in the polishing liquid in the photocatalytic fluid polishing chamber; detect the redox potential of the polishing liquid in a non-ultraviolet light environment by using the reference ORP sensor (3-4), and record it as the background ORP value O b The photocatalytic ORP sensor (3-2) detects the redox potential in the polishing liquid of the workpiece (6) under the ultraviolet light environment, and records it as the comprehensive ORP value O c ; Calculate the light-excited ORP value ; By dynamically adjusting the luminous intensity of the ultraviolet light source (2-5), the light-excited ORP value Controlled within the light excitation range; Polishing liquid containing TiO2 particles and hydrogen peroxide is sprayed onto the workpiece through a jet nozzle (2-4) to perform fluid polishing under a photocatalytic oxidation reaction.

9. A mechanical and photochemical fluid combined polishing method according to claim 8, characterized in that: The material of the workpiece is a nickel-based alloy; the polished surface of the workpiece is laser clad.

10. The method of mechanical and photochemical fluid combined polishing according to claim 8, characterized in that: Step 2: After the workpiece (6) is immersed in the polishing liquid in the photocatalytic fluid polishing chamber, the ultraviolet light intensity in the polishing liquid where the workpiece (6) is located is first detected by a light intensity sensor (3-5); the luminous intensity of the ultraviolet light source (2-5) is adjusted according to the measured ultraviolet light intensity, so that the ultraviolet light intensity measured by the light intensity sensor (3-5) reaches a preset reference light intensity value; In step 2, the light-stimulated ORP value The process of controlling in the light excitation range is: when the light excitation ORP value When the light intensity is less than the preset lower limit of the light excitation range, the UV light source is controlled to increase the light intensity until the light excitation ORP value reaches Greater than or equal to the light excitation target value; when the light excitation ORP value When the light intensity is greater than the preset upper limit of the light excitation range, the UV light source is controlled to reduce the light intensity until the light excitation ORP value reaches Less than or equal to the light excitation target value.

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