A transport gripper for a silicon wafer processing production line

Abstract

The present invention relates to the technical field of manipulators, and discloses a transportation gripper for a silicon wafer processing production line. One side position on the surface of the fixed gripper plate is fixedly connected with a movable gripper arm. One side position at the top of the fixed gripper plate is fixedly connected with a lifting motor. Both sides at the bottom of the fixed gripper plate are movably connected with lifting screw rods. The surface of the lifting screw rod far away from the fixed gripper plate is movably sleeved with a main gripper frame. The top position of the main gripper frame is movably connected with an auxiliary limiting frame. The top position of the auxiliary limiting frame is fixedly connected with a gripper motor. By providing a scroll pump, an auxiliary limiting frame, a limiting connecting rod, a gripper adjusting rod, a special-shaped auxiliary block, and a gripper motor, it is beneficial to drive the auxiliary limiting frame to lift by the gripper motor when grasping the silicon wafer, so that the auxiliary limiting frame drives the limiting connecting rod and the gripper adjusting rod to rise. At this time, the scroll pump is pushed down to approach the top of the silicon wafer to complete adsorption and grasping, avoiding stress breakage of the silicon wafer caused by physical clamping.

Description

Technical Field

[0001] The present invention relates to the technical field of manipulators, and more particularly to a transport gripper for a silicon wafer processing production line. Background Art

[0002] Silicon wafers are the core basic materials for semiconductor manufacturing, mainly used in the production of electronic components such as integrated circuits (ICs), solar cells (PVs), sensors, etc. In a silicon wafer processing production line, it is mainly a systematic process of processing high-purity silicon ingots (single crystal / polycrystal) into silicon wafers for semiconductors or photovoltaics, including core processes such as crystal growth → slicing → grinding → polishing → cleaning → inspection. In the production process, the transport gripper is the core component of the automated handling system. Grabbing and fixing the silicon rod and then slicing it is a key pre-process, which directly determines the thickness, flatness, and surface quality of the silicon wafer.

[0003] However, for the existing transport grippers used in silicon wafer processing production lines, when actually transporting and grabbing silicon wafers, local stress may be generated at the edges of the clamped silicon wafers, resulting in microcracks or warping (especially for ultra-thin silicon wafers <100 μm), thus reducing the yield rate of silicon wafers and affecting subsequent lithography or deposition processes. In addition, the existing transport grippers generally can only grab silicon wafers with specific shapes or sizes, and cannot clamp silicon wafers with damaged edges or non-standard shapes, with large limitations, often requiring manual assistance, increasing the operation steps of silicon wafer production and the labor intensity of workers. Moreover, traditional grippers can only grab and transport silicon wafers, and after the silicon rod is sliced into wafers, the local temperature of the silicon wafers will increase due to cutting friction. Therefore, the high-temperature silicon wafers may damage the precision transmission gripper or detection sensor, seriously affecting the service life of the gripper. Summary of the Invention

[0004] In order to overcome the above-mentioned defects of the prior art, an embodiment of the present invention provides a transport gripper for a silicon wafer processing production line to solve the technical problems raised in the background art.

[0005] To achieve the above object, the present invention provides the following technical solution: A transport gripper for a silicon wafer processing production line, including a fixed gripper plate, characterized in that: One side of the surface of the fixed gripper plate is fixedly connected with a movable gripper arm, One side of the top of the fixed gripper plate is fixedly connected with a lifting motor, Both sides of the bottom of the fixed gripper plate are movably connected with lifting screw rods, The side surface of the lifting screw rod far from the fixed gripper plate is movably sleeved with a main gripper frame, The top of the main gripper frame is movably connected with an auxiliary limit frame, The top of the auxiliary limit frame is fixedly connected with a gripper motor, The gripper motor is located at the position of the hole opened in the middle of the fixed gripper plate, The bottom of the auxiliary limit frame and at the positions around the edge are all fixedly connected with limit connecting rods, The limit connecting rods are all movably sleeved inside the main gripper frame, The bottom of the limit connecting rod is fixedly connected with a fixed collar, The surface of the fixed collar and near the position fixedly connecting the limit connecting rod are all movably connected with gripper adjusting rods, The bottom of the fixed collar is fixedly sleeved with a scroll pump, The bottom of the main gripper frame and near the positions around the edge are all fixedly connected with main connecting rods, The bottom of the main connecting rod is fixedly connected with an auxiliary frame, The scroll pump is movably sleeved in the middle of the auxiliary frame, The four surrounding positions of the top of the scroll pump are all fixedly connected with regularly arranged first exhaust ducts, One end of the first exhaust duct far from the scroll pump is fixedly connected with an air flow diversion box, The air flow diversion boxes are all fixedly connected to the positions around the surface of the auxiliary frame, The surface of the air flow diversion box is fixedly connected with a second exhaust duct, The auxiliary frame and near the surface are all movably connected with special-shaped auxiliary blocks. By providing a scroll pump, an auxiliary limit frame, a limit connecting rod, a gripper adjusting rod, a special-shaped auxiliary block, and a gripper motor, it is beneficial to drive the auxiliary limit frame to lift by the gripper motor when grasping the silicon wafer, so that the auxiliary limit frame drives the limit connecting rod and the gripper adjusting rod to rise. At this time, the scroll pump is pushed down to approach the top of the silicon wafer to complete adsorption and grasping, avoiding stress breakage of the silicon wafer caused by physical clamping.

[0006] In a preferred embodiment, auxiliary grippers are movably connected to both sides of the bottom of the special-shaped auxiliary block. One end of the second exhaust duct away from the air flow diversion box is fixedly connected to one side of the surface of the auxiliary gripper. The bottom of the gripper motor is drivingly connected to an adjustment screw rod, and the adjustment screw rod is movably sleeved at the center of the gripper main frame. A main gear is provided inside the fixed gripper plate and near one side fixedly connected to the lifting motor, and the lifting motor is drivingly connected to the main gear. The main gear is drivingly connected to a transmission hollow gear near the middle of the fixed gripper plate, and the transmission hollow gear is drivingly connected to a sub-gear on the side away from the main gear. The main gear and the sub-gear are both fixedly connected to the top positions of the lifting screw rods movably connected to both sides of the bottom of the fixed gripper plate. By providing the lifting motor, the main gear, the transmission hollow gear, the sub-gear, and the lifting screw rod, it is beneficial to drive the main gear to rotate by the lifting motor, so that the main gear drives the transmission hollow gear and the sub-gear to rotate, thereby causing the lifting screw rods at the bottom positions of the main gear and the sub-gear to rotate together, making the gripper descend close to the silicon wafer to be grabbed.

[0007] In a preferred embodiment, the gripper adjustment rod includes a first side rod, a first limit shaft is movably connected to the top of the first side rod, a second side rod is movably connected to the other side of the first limit shaft, first limit holes are provided on the surfaces of the first side rod and the second side rod and near the bottom positions, and second limit holes are provided on the surfaces of the first side rod and the second side rod and at positions below the first limit holes. By providing the first side rod, the second side rod, the first limit holes, and the second limit holes, it is beneficial to drive the special-shaped auxiliary block to drive the auxiliary grippers to open to both sides through the first limit holes and the second limit holes provided on the first side rod and the second side rod when the gripper adjustment rod is driven to move up and down.

[0008] In a preferred embodiment, connecting arms are provided around the surface of the fixed collar, and mounting holes are provided in the connecting arms at the positions where the gripper adjustment rods are movably connected. By providing the fixed collar, it is beneficial to drive the scroll pump to move up and down, facilitating the grasping operation of the silicon wafer.

[0009] In a preferred embodiment, an exhaust head is provided at the top of the scroll pump, an adsorption tube is provided at the bottom of the scroll pump, a pipeline inner cavity is provided inside the adsorption tube, a negative pressure head is fixedly connected to the bottom of the adsorption tube, a negative pressure cavity is provided inside the negative pressure head, and regularly arranged suction slots are provided at the bottom of the negative pressure cavity. By providing the negative pressure head, the negative pressure cavity, and the suction slots, it is beneficial to adsorb and grab the silicon wafer through the suction slots at the bottom of the negative pressure head after the scroll pump is started, reducing the damage to the silicon wafer caused by physical clamping.

[0010] In a preferred embodiment, circular through holes are provided around the top of the main gripper frame at positions where the movable socket limiting connecting rods are located, and lifting threaded holes are provided at positions on the top of the main gripper frame near the circular through holes and at positions where the lifting screw rods are movably sleeved. A threaded hole is provided at the central position of the main gripper frame. By providing the lifting threaded holes and the threaded hole, it is beneficial to drive the main gripper frame to lift through the lifting screw rods inside the lifting threaded holes, and drive the scroll pump to move up and down through the adjusting screw rods inside the threaded hole.

[0011] In a preferred embodiment, auxiliary grooves are provided at positions on the auxiliary frame where the special-shaped auxiliary blocks are movably connected. Circular shaft holes are provided on the inner wall positions of the auxiliary grooves. A telescopic pump hole is provided at the central position of the top of the auxiliary frame. Oval holes are provided at positions around the telescopic pump hole on the auxiliary frame. An auxiliary plug is fixedly connected to the top position of the special-shaped auxiliary block. A second limiting shaft is fixedly connected inside the auxiliary plug. Connecting shafts are provided inside the positions where the special-shaped auxiliary blocks are close to each other. The connecting shafts are all movably connected to one side inside the gripper adjusting rod. By providing the special-shaped auxiliary blocks, it is beneficial to limit the auxiliary gripper to open and close in all directions through the special-shaped auxiliary blocks when the gripper adjusting rod moves up and down, so as to complete the grasping operation of the silicon wafer.

[0012] In a preferred embodiment, connecting heads are fixedly connected to one side positions of the top of the auxiliary gripper. Both sides of the surface of the connecting head are movably connected to the bottom position of the connecting guide rod. Regularly arranged air jet holes are provided at one side positions of the top of the auxiliary gripper. An auxiliary connecting rod frame is movably connected inside the connecting guide rod at the bottom of the special-shaped auxiliary block and close to the gripper adjusting rod. The auxiliary connecting rod frame is movably connected to the bottom position of the gripper adjusting rod. By providing the auxiliary connecting rod frame and the air jet holes, it is beneficial to push the auxiliary gripper when the gripper adjusting rod moves up and down, and perform auxiliary support and cooling operations on the adsorbed and grasped silicon wafer through the air jet holes.

[0013] The technical effects and advantages of the present invention:

[0014] By providing a scroll pump, an adsorption tube, a negative pressure head, an exhaust head, an auxiliary gripper, and air jet holes, the present invention is beneficial for adsorbing and grasping the silicon wafer to be transported through the adsorption tube and the negative pressure head at the bottom of the scroll pump during the transportation of the silicon wafer. After successful grasping, the gas discharged from the negative pressure head is guided to the auxiliary gripper, so that the air jet holes provided in the auxiliary gripper push the gas at the bottom of the adsorbed and grasped silicon wafer, making the adsorbed and grasped silicon wafer more stably fixed, preventing excessive physical contact between the silicon wafer and the gripper, thereby reducing the stress generated at the edge of the clamped silicon wafer, increasing the yield rate of the silicon wafer, and reducing the influence on subsequent lithography or deposition processes;

[0015] The present invention is provided with a scroll pump, an adsorption tube, a first exhaust duct, a second exhaust duct, and an auxiliary gripper, which is beneficial for grasping the silicon wafer by means of air pressure adsorption and air flow pushing during grasping, thereby avoiding the problem of being unable to clamp silicon wafers with damaged edges or non-standard shapes, and reducing the limitations of the use of the gripper.

[0016] The present invention is provided with a scroll pump, an exhaust head, a first exhaust duct, an air flow diversion box, and a second exhaust duct, which is beneficial for when the scroll pump is operating, sending air flow into the interior of the first exhaust duct through the exhaust head position, and guiding the air flow into the air flow diversion box through the first exhaust duct, so that the air flow is discharged through the guidance of the second exhaust duct, and further enabling the high-temperature silicon wafer grasped by the gripper to be cooled by wind, thereby avoiding high-temperature damage to the precision transmission gripper or the detection sensor, and increasing the service life of the gripper. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0018] Figure 2 It is a schematic sectional view of the overall structure of the present invention.

[0019] Figure 3 It is a schematic sectional view of the fixed gripper plate structure of the present invention.

[0020] Figure 4 It is a schematic sectional view of the auxiliary frame structure of the present invention.

[0021] Figure 5 It is a schematic diagram of the internal structure of the gripper of the present invention.

[0022] Figure 6 It is a schematic diagram of the gripper adjusting rod structure of the present invention.

[0023] Figure 7 It is a schematic diagram of the fixed collar structure of the present invention.

[0024] Figure 8 It is a schematic diagram of the scroll pump structure of the present invention.

[0025] Figure 9 It is a schematic sectional view of the main frame structure of the gripper of the present invention.

[0026] Figure 10 It is a schematic diagram of the auxiliary gripper structure of the present invention.

[0027] The reference numerals are: 1, fixed gripping plate; 2, movable gripping arm; 3, lifting motor; 4, lifting screw rod; 5, main gripping frame; 501, circular through hole; 502, lifting threaded hole; 503, threaded hole; 6, auxiliary limiting frame; 7, gripping motor; 8, limiting connecting rod; 9, fixed collar; 901, connecting arm; 902, mounting hole; 10, main connecting rod; 11, auxiliary frame; 1101, auxiliary groove; 1102, circular shaft hole; 1103, telescopic pump hole; 1104, elliptical hole; 12, gripping adjusting rod; 1201, first side rod; 1202, second side rod; 1203, first limiting shaft; 1204, first limiting hole; 1205, second limiting hole; 13, scroll pump; 1301, exhaust head; 1302, adsorption tube; 1303, inner cavity of pipeline; 1304, negative pressure head; 1305, negative pressure cavity; 1306, air suction slot hole; 14, first exhaust duct; 15, air flow guiding box; 16, second exhaust duct; 17, special-shaped auxiliary block; 1701, auxiliary plug; 1702, second limiting shaft; 1703, connecting shaft; 18, connecting guide rod; 19, auxiliary gripper; 1901, connecting head; 1902, air jet hole; 20, main gear; 21, transmission hollow gear; 22, sub-gear; 23, adjusting screw rod; 24, auxiliary connecting rod frame. Detailed implementation manners

[0028] Next, the technical solutions in the present invention will be clearly and completely described in conjunction with the accompanying drawings in the present invention. In addition, the forms of the respective structures described in the following embodiments are merely examples. A transport gripper for a silicon wafer processing production line according to the present invention is not limited to the respective structures described in the following embodiments. All other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present invention.

[0029] Refer to Figures 1 - 10As shown in the figure, the present invention provides a transportation gripper for a silicon wafer processing production line, including a fixed gripper plate 1, characterized in that: a movable gripper arm 2 is fixedly connected to one side of the surface of the fixed gripper plate 1, a lifting motor 3 is fixedly connected to one side of the top of the fixed gripper plate 1, lifting screw rods 4 are movably connected to both sides of the bottom of the fixed gripper plate 1, a gripper main frame 5 is movably sleeved on the surface of one side of the lifting screw rod 4 away from the fixed gripper plate 1, an auxiliary limiting frame 6 is movably connected to the top of the gripper main frame 5, a gripper motor 7 is fixedly connected to the top of the auxiliary limiting frame 6, the gripper motor 7 is located at the position of the hole opened in the middle of the fixed gripper plate 1, limiting connecting rods 8 are fixedly connected to the bottom of the auxiliary limiting frame 6 and around the edge, the limiting connecting rods 8 are all movably sleeved inside the gripper main frame 5, a fixed collar 9 is fixedly connected to the bottom of the limiting connecting rod 8, gripper adjusting rods 12 are movably connected to the surface of the fixed collar 9 and near the position where the limiting connecting rod 8 is fixedly connected, a scroll pump 13 is fixedly sleeved at the bottom of the fixed collar 9, main connecting rods 10 are fixedly connected to the bottom of the gripper main frame 5 and near the edge around, an auxiliary frame 11 is fixedly connected to the bottom of the main connecting rod 10, the scroll pump 13 is movably sleeved in the middle of the auxiliary frame 11, regularly arranged first exhaust ducts 14 are fixedly connected to the four surrounding positions of the top of the scroll pump 13, one end of the first exhaust duct 14 away from the scroll pump 13 is fixedly connected to an air flow diversion box 15, the air flow diversion boxes 15 are fixedly connected to the four surrounding positions of the surface of the auxiliary frame 11, second exhaust ducts 16 are fixedly connected to the surface positions of the air flow diversion boxes 15, and special-shaped auxiliary blocks 17 are movably connected to the auxiliary frame 11 and near the surface position.

[0030] In this embodiment: By providing a scroll pump 13, an auxiliary limiting frame 6, a limiting connecting rod 8, a gripper adjusting rod 12, a special-shaped auxiliary block 17, and a gripper motor 7, it is beneficial to drive the auxiliary limiting frame 6 to lift by the gripper motor 7 when grasping the silicon wafer, so that the auxiliary limiting frame 6 drives the limiting connecting rod 8 and the gripper adjusting rod 12 to rise. At this time, the scroll pump 13 is pushed down to approach the top of the silicon wafer to complete adsorption and grasping, avoiding stress damage to the silicon wafer caused by physical clamping.

[0031] Refer to Figures 1 - 5As shown in the figure, auxiliary grippers 19 are movably connected to both sides of the bottom of the special-shaped auxiliary block 17. One end of the second exhaust duct 16 away from the air flow diversion box 15 is fixedly connected to one side of the surface of the auxiliary gripper 19. The bottom of the gripper motor 7 is drivingly connected to an adjusting screw rod 23. The adjusting screw rod 23 is movably sleeved at the center of the gripper main frame 5. A main gear 20 is provided inside the fixed gripper plate 1 and near one side fixedly connected to the lifting motor 3. The lifting motor 3 is drivingly connected to the main gear 20. The main gear 20 is drivingly connected to a transmission hollow gear 21 near the middle of the fixed gripper plate 1. The transmission hollow gear 21 is drivingly connected to a sub-gear 22 on the side away from the main gear 20. The main gear 20 and the sub-gear 22 are both fixedly connected to the top of the lifting screw rods 4 movably connected to both sides of the bottom of the fixed gripper plate 1.

[0032] In this embodiment: By providing the lowering motor 3, the main gear 20, the transmission hollow gear 21, the sub-gear 22, and the lifting screw rods 4, it is beneficial to drive the main gear 20 to rotate through the lowering motor 3, so that the main gear 20 drives the transmission hollow gear 21 and the sub-gear 22 to rotate, thereby enabling the lifting screw rods 4 at the bottom positions of the main gear 20 and the sub-gear 22 to rotate together, causing the gripper to descend close to the silicon wafer to be grabbed.

[0033] Refer to Figure 6 As shown in the figure, the gripper adjusting rod 12 includes a first side rod 1201. A first limiting shaft 1203 is movably connected to the top of the first side rod 1201. The other side of the first limiting shaft 1203 is movably connected to a second side rod 1202. First limiting holes 1204 are provided on the surfaces of the first side rod 1201 and the second side rod 1202 and near the bottom positions. Second limiting holes 1205 are provided on the surfaces of the first side rod 1201 and the second side rod 1202 and at the positions below the first limiting holes 1204.

[0034] In this embodiment: By providing the first side rod 1201, the second side rod 1202, the first limiting holes 1204, and the second limiting holes 1205, it is beneficial to drive the special-shaped auxiliary block 17 through the first limiting holes 1204 and the second limiting holes 1205 opened by the first side rod 1201 and the second side rod 1202 when the gripper adjusting rod 12 is driven to move up and down, causing the auxiliary grippers 19 to open to both sides.

[0035] Refer to Figure 7 As shown in the figure, connecting arms 901 are provided around the surface of the fixed collar 9. Mounting holes 902 are provided at the positions where the connecting arms 901 are movably connected to the gripper adjusting rod 12.

[0036] In this embodiment: By providing the fixed collar 9, it is beneficial to drive the scroll pump 13 to move up and down, facilitating the grasping operation of the silicon wafer.

[0037] Refer to Figure 8As shown, an exhaust head 1301 is provided at the top position of the scroll pump 13, an adsorption pipe 1302 is provided at the bottom position of the scroll pump 13, a pipe inner cavity 1303 is provided inside the adsorption pipe 1302, a negative pressure head 1304 is fixedly connected to the bottom position of the adsorption pipe 1302, a negative pressure cavity 1305 is provided inside the negative pressure head 1304, and regularly arranged air suction slot holes 1306 are provided at the bottom position of the negative pressure cavity 1305.

[0038] In this embodiment: By providing the negative pressure head 1304, the negative pressure cavity 1305, and the air suction slot holes 1306, it is beneficial to adsorb and grasp the silicon wafer through the air suction slot holes 1306 at the bottom of the negative pressure head 1304 after the scroll pump 13 is started, reducing the damage to the silicon wafer caused by physical clamping.

[0039] Refer to Figure 9 As shown, circular through holes 501 are provided around the top of the gripper main frame 5 and at the positions where the limiting connecting rods 8 are movably sleeved, lifting threaded holes 502 are provided at the top of the gripper main frame 5 and on the side close to the circular through holes 501 and at the positions where the lifting screw rods 4 are movably sleeved, and a threaded hole 503 is provided at the center position of the gripper main frame 5.

[0040] In this embodiment: By providing the lifting threaded holes 502 and the threaded hole 503, it is beneficial to drive the gripper main frame 5 to lift through the lifting screw rods 4 inside the lifting threaded holes 502, and drive the scroll pump 13 to move up and down through the adjusting screw rods 23 inside the threaded hole 503.

[0041] Refer to Figures 9 - 10 As shown, auxiliary slots 1101 are provided at the positions where the auxiliary frame 11 is movably connected to the special-shaped auxiliary block 17, circular shaft holes 1102 are provided on the inner wall positions of the auxiliary slots 1101, a telescopic pump hole 1103 is provided at the center position of the top of the auxiliary frame 11, elliptical holes 1104 are provided at the positions around the telescopic pump hole 1103 of the auxiliary frame 11, an auxiliary plug 1701 is fixedly connected to the top position of the special-shaped auxiliary block 17, a second limiting shaft 1702 is fixedly connected inside the auxiliary plug 1701, connecting shafts 1703 are provided inside the special-shaped auxiliary block 17 on the side close to each other, and the connecting shafts 1703 are all movably connected to one side position inside the gripper adjusting rod 12.

[0042] In this embodiment: By providing the special-shaped auxiliary block 17, it is beneficial to limit the auxiliary gripper 19 to open and close in all directions through the special-shaped auxiliary block 17 when the gripper adjusting rod 12 moves up and down, thereby completing the grasping operation of the silicon wafer.

[0043] Refer to Figure 10As shown, connection heads 1901 are fixedly connected to one side of the top of the auxiliary gripper 19. Both sides of the surface of the connection head 1901 are movably connected to the bottom of the connection guide rod 18. Regularly arranged air jet holes 1902 are provided on one side of the top of the auxiliary gripper 19. An auxiliary link frame 24 is movably connected inside the connection guide rod 18 at the bottom of the special-shaped auxiliary block 17 and near one side of the gripper adjusting rod 12. The auxiliary link frame 24 is movably connected to the bottom of the gripper adjusting rod 12.

[0044] In this embodiment: By providing the auxiliary link frame 24 and the air jet holes 1902, it is beneficial to push the auxiliary gripper 19 when the gripper adjusting rod 12 moves up and down, and through the air jet holes 1902, auxiliary support and cooling operations are performed on the wafers to be grabbed.

[0045] Working principle of the present invention: Firstly, when in use, rotate the moving gripper arm 2 so that the moving gripper arm 2 drives the fixed gripper plate 1 to move to the top position of the silicon wafer to be grasped. Then, turn on the lifting motor 3 so that the lifting motor 3 drives the main gear 20 to rotate. At this time, the main gear 20 drives the transmission hollow gear 21 and the auxiliary gear 22 to rotate. At this time, the lifting screw 4 at the bottom of the main gear 20 and the auxiliary gear 22 rotates inside the lifting threaded hole 502 at the top of the gripper main frame 5. At this time, the rotation of the lifting screw 4 drives the gripper main frame 5 and the auxiliary frame 11 to descend. Then, when the auxiliary gripper 19 reaches the top position of the silicon wafer, turn off the lifting motor 3 at this time. Then, turn on the gripper motor 7 at the top of the auxiliary limiting frame 6 so that the gripper motor 7 drives the adjusting screw 23 to rotate inside the threaded hole 503, causing the auxiliary limiting frame 6 to drive the gripper motor 7 to descend under the restriction of the limiting connecting rod 8. Then, when the auxiliary limiting frame 6 drives the limiting connecting rod 8 to descend, at this time, the limiting connecting rod 8 drives the fixed collar 9 fixedly sleeved on the top of the scroll pump 13 to descend. Then, the fixed collar 9 drives the scroll pump 13 into the position inside the telescopic pump hole 1103 opened in the auxiliary frame 11. Then, when the fixed collar 9 descends, it pushes the gripper adjusting rod 12 to descend inside the elliptical hole 1104. Then, when the gripper adjusting rod 12 descends, the connecting guide rod 18 drives the auxiliary grippers 19 to move away from each other under the restriction of the special-shaped auxiliary block 17 and the auxiliary connecting rod frame 24. At this time, the auxiliary grippers 19 open to the surroundings. Then, the special-shaped auxiliary block 17 inclines inside the auxiliary groove 1101 under the restriction of the auxiliary plug 1701 and the second limiting shaft 1702. Then, the scroll pump 13 drives the adsorption tube 1302 and the negative pressure head 1304 to approach the top of the silicon wafer. Then, turn on the scroll pump 13 so that the scroll pump 13 evacuates the air inside the pipe cavity 1303 and the negative pressure cavity 1305, causing the air inside the negative pressure cavity 1305 to form a negative pressure due to evacuation. Then, the suction slot hole 1306 at the bottom of the negative pressure head 1304 adsorbs and grasps the silicon wafer. Then, turn on the gripper motor 7 again so that the gripper motor 7 drives the adjusting screw 23 to rotate in the reverse direction. Then, the auxiliary limiting frame 6 drives the limiting connecting rod 8, the fixed collar 9, and the scroll pump 13 to rise. Then, when the scroll pump 13 drives the silicon wafer to rise, at this time, the auxiliary grippers 19 are reset due to the rise of the gripper adjusting rod 12. Then, the first exhaust duct 14 on the surface of the exhaust head 1301 sends the air evacuated by the scroll pump 13 into the air flow diversion box 15. Then, the second exhaust duct 16 on the surface of the air flow diversion box 15 sends the air flow into the auxiliary grippers 19. Then, the air holes 1902 opened in the auxiliary grippers 19 eject the air flow. Then, the silicon wafer adsorbed at the bottom of the scroll pump 13 is supported by the air flow ejected from the air holes 1902. At this time, the silicon wafer is cooled and grasped by the air flow sprayed at the bottom. Then, rotate the moving gripper arm 2 again to drive the fixed gripper plate 1 to move so that the fixed gripper plate 1 moves the grasped silicon wafer to an appropriate position. At this time, place the silicon wafer according to the above operation.

[0046] Finally, the above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

Claims

1. A transport gripper for a silicon wafer processing production line, comprising a fixed gripper plate (1), characterized in that: One side of the surface of the fixed gripper plate (1) is fixedly connected with a movable gripper arm (2). One side of the top of the fixed gripper plate (1) is fixedly connected with a lifting motor (3). Both sides of the bottom of the fixed gripper plate (1) are movably connected with lifting screw rods (4). The surface of the side of the lifting screw rod (4) far away from the fixed gripper plate (1) is movably sleeved with a main gripper frame (5). The top of the main gripper frame (5) is movably connected with an auxiliary limiting frame (6). The top of the auxiliary limiting frame (6) is fixedly connected with a gripper motor (7). The gripper motor (7) is located at the position of the hole opened in the middle of the fixed gripper plate (1). The bottom of the auxiliary limiting frame (6) and around the edge are all fixedly connected with limiting connecting rods (8). The limiting connecting rods (8) are all movably sleeved inside the main gripper frame (5). The bottom of the limiting connecting rod (8) is fixedly connected with a fixed collar (9). The surface of the fixed collar (9) and near the position fixedly connecting the limiting connecting rod (8) are all movably connected with gripper adjusting rods (12). The bottom of the fixed collar (9) is fixedly sleeved with a scroll pump (13). The bottom of the main gripper frame (5) and near the edge are all fixedly connected with main connecting rods (10). The bottom of the main connecting rod (10) is fixedly connected with an auxiliary frame (11). The scroll pump (13) is movably sleeved in the middle of the auxiliary frame (11). The top of the scroll pump (13) is fixedly connected with regularly arranged first exhaust ducts (14) around. One end of the first exhaust duct (14) far away from the scroll pump (13) is fixedly connected with an air flow guiding box (15). The air flow guiding boxes (15) are all fixedly connected to the positions around the surface of the auxiliary frame (11). The surface of the air flow guiding box (15) is fixedly connected with second exhaust ducts (16). The auxiliary frame (11) and near the surface are all movably connected with special-shaped auxiliary blocks (17).

2. The transport gripper for a silicon wafer processing production line according to claim 1, characterized in that: Both sides of the bottom of the special-shaped auxiliary block (17) are movably connected with auxiliary grippers (19). One end of the second exhaust duct (16) far away from the air flow guiding box (15) is fixedly connected to one side of the surface of the auxiliary gripper (19). The bottom of the gripper motor (7) is drivingly connected with an adjusting screw rod (23). The adjusting screw rod (23) is movably sleeved at the center position of the main gripper frame (5). Inside the fixed gripper plate (1) and near the side fixedly connecting the lifting motor (3), a main gear (20) is opened. The lifting motor (3) is drivingly connected with the main gear (20). The main gear (20) is drivingly connected with a driving hollow gear (21) near the middle position of the fixed gripper plate (1). The driving hollow gear (21) is drivingly connected with a sub-gear (22) at the side far away from the main gear (20). The main gear (20) and the sub-gear (22) are both fixedly connected to the top positions of the lifting screw rods (4) movably connected to both sides of the bottom of the fixed gripper plate (1).

3. The transport gripper for a silicon wafer processing production line according to claim 1, characterized in that: The gripper adjusting rod (12) includes a first side rod (1201). A first limiting shaft (1203) is movably connected to the top of the first side rod (1201). The other side of the first limiting shaft (1203) is movably connected to a second side rod (1202). First limiting holes (1204) are formed on the surfaces of the first side rod (1201) and the second side rod (1202) near the bottom. Second limiting holes (1205) are formed on the surfaces of the first side rod (1201) and the second side rod (1202) at positions located at the bottoms of the formed first limiting holes (1204).

4. The transport gripper for a silicon wafer processing production line according to claim 1, characterized in that: Connecting arms (901) are formed around the surface of the fixed collar (9). Mounting holes (902) are formed at positions where the connecting arms (901) are movably connected to the gripper adjusting rod (12).

5. The transport gripper for a silicon wafer processing production line according to claim 1, characterized in that: An exhaust head (1301) is formed at the top of the scroll pump (13). An adsorption pipe (1302) is formed at the bottom of the scroll pump (13). A pipe inner cavity (1303) is formed inside the adsorption pipe (1302). A negative pressure head (1304) is fixedly connected to the bottom of the adsorption pipe (1302). A negative pressure cavity (1305) is formed inside the negative pressure head (1304). Regularly arranged suction slot holes (1306) are formed at the bottom of the negative pressure cavity (1305).

6. The transport gripper for a silicon wafer processing production line according to claim 1, wherein: Circular through holes (501) are formed around the top of the gripper main frame (5) at positions where the limiting connecting rods (8) are movably sleeved. Lifting threaded holes (502) are formed at positions on the top of the gripper main frame (5) near one side of the circular through holes (501) where the lifting screw rods (4) are movably sleeved. A threaded hole (503) is formed at the center of the gripper main frame (5).

7. The transport gripper for a silicon wafer processing production line according to claim 1, characterized in that: Auxiliary slots (1101) are formed at positions where the auxiliary frame (11) is movably connected to the special-shaped auxiliary blocks (17). Circular shaft holes (1102) are formed on the inner walls of the auxiliary slots (1101). A telescopic pump hole (1103) is formed at the center of the top of the auxiliary frame (11). Oval holes (1104) are formed around the telescopic pump hole (1103) formed on the auxiliary frame (11). An auxiliary plug (1701) is fixedly connected to the top of the special-shaped auxiliary block (17). A second limiting shaft (1702) is fixedly connected inside the auxiliary plug (1701). Connecting shafts (1703) are formed inside the special-shaped auxiliary blocks (17) on the mutually close sides. The connecting shafts (1703) are all movably connected to one side inside the gripper adjusting rod (12).

8. The transport gripper for a silicon wafer processing production line according to claim 2, characterized in that: On one side at the top of the auxiliary gripper (19), a connection head (1901) is fixedly connected. On both sides of the surface of the connection head (1901), it is movably connected to the bottom of the connection guide rod (18). On one side at the top of the auxiliary gripper (19), regularly arranged air jet holes (1902) are provided. Inside the connection guide rod (18) at the bottom of the special-shaped auxiliary block (17) and near one side of the gripper adjusting rod (12), an auxiliary connecting rod frame (24) is movably connected. The auxiliary connecting rod frame (24) is movably connected to the bottom of the gripper adjusting rod (12).

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