Optical transceiver

Abstract

The optical transceiver comprises a tube socket, the tube socket comprises a first base part and a second base part which intersect and are connected with each other, and a first side part and a second side part which are arranged at intervals in a first direction, and the first side part and the second side part are connected with the first base part and the second base part and define an accommodating cavity with a first opening; the tube cap is connected with the tube seat and covers the first opening; the photoelectric chip is arranged in the accommodating cavity, and the photoelectric chip is arranged on the first base part; the electric connecting piece penetrates through the second base part and extends into the containing cavity, one end of the electric connecting piece penetrates through the containing cavity and is electrically connected with the photoelectric chip, and the other end of the electric connecting piece is located outside the containing cavity. The photoelectric chip is arranged on the first base part so as to be separated from the electric connecting piece on the second base part, so that the photoelectric chip has a large heat dissipation area, the heat dissipation performance is improved, meanwhile, the first side part and the second side part can also be used for being in contact with the photoelectric chip and serve as heat dissipation surfaces of the photoelectric chip, and the heat dissipation effect can be further improved.

Description

Technical Field

[0001] This application belongs to the field of lasers, and particularly relates to an optical transceiver. Background Art

[0002] In the coaxial packaging of an airtight transistor outline (TO), the cap and the base are usually welded on the same plane. Since the large surface of the base needs to connect the pins, heat dissipation is required on the side surface of the base at this time. However, the side surface area of the base is small and the distance from the encapsulated chip is far, so a good heat dissipation effect cannot be achieved. Summary of the Invention

[0003] Objective of the Invention: The embodiments of this application provide an optical transceiver, aiming to solve the above problems.

[0004] Technical Solution: An optical transceiver described in the embodiments of this application includes:

[0005] A base, the base includes a first base portion, a second base portion that intersect and are connected to each other, and a first side portion and a second side portion that are spaced apart in a first direction. The first side portion and the second side portion are both connected to the first base portion and the second base portion and enclose a receiving cavity with a first opening;

[0006] A cap, the cap is connected to the base and covers the first opening;

[0007] An optoelectronic chip, the optoelectronic chip is disposed in the receiving cavity and is disposed on the first base portion;

[0008] An electrical connector, the electrical connector passes through the second base portion and extends into the receiving cavity. One end of the electrical connector penetrates into the receiving cavity and is electrically connected to the optoelectronic chip, and the other end is located outside the receiving cavity.

[0009] In some embodiments, the base has a first welding end face surrounding the first opening, the cap has a second welding end face, the first welding end face and the second welding end face are located in the same plane, and the base and the cap are hermetically connected through the first welding end face and the second welding end face.

[0010] In some embodiments, the first base portion has a first welding sub-face facing the cap, the second base portion has a second welding sub-face facing the cap, the first side portion has a third welding sub-face facing the cap, the second side portion has a fourth welding sub-face facing the cap, and the first welding sub-face, the second welding sub-face, the third welding sub-face, and the fourth welding sub-face are located in the same plane and are sequentially connected to form the first welding end face.

[0011] In some embodiments, the tube cap includes a first cap portion, a second cap portion, and a third side portion and a fourth side portion that are connected to each other and spaced apart in the first direction, the third side portion and the fourth side portion are both connected to the first cap portion and the second cap portion and enclose an optical path cavity having a second opening, the optical path cavity is connected to the accommodating cavity, and the second welding end surface surrounds the second opening;

[0012] The first cap portion has a fifth welding sub-surface facing the first base portion, the second cap portion has a sixth welding sub-surface facing the second base portion, the third side portion has a seventh welding sub-surface facing the first side portion, and the fourth side portion has an eighth welding sub-surface facing the second side portion, and the fifth welding sub-surface, the sixth welding sub-surface, the seventh welding sub-surface and the eighth welding sub-surface are located in the same plane and are connected in sequence to form the second welding end surface.

[0013] In some embodiments, the first cap portion is extended along a side away from the second cap portion to form a first combining portion, the first combining portion having a first combining surface facing the first welding sub-surface and a first extrusion surface away from the first welding sub-surface, the first combining surface and the fifth welding sub-surface are located in the same plane and connected, and the first extrusion surface is parallel to the first welding sub-surface;

[0014] The second cap portion is extended along a side away from the first cap portion to form a second combining portion, the second combining portion having a second combining surface facing the second welding sub-surface and a second extrusion surface away from the second welding sub-surface, the second combining surface and the sixth welding sub-surface are located in the same plane and are connected, and the second extrusion surface is parallel to the second welding sub-surface.

[0015] In some embodiments, the first base has a first surface and a second surface corresponding to each other in the second direction, the second base has a third surface and a fourth surface corresponding to each other in the third direction, and the second surface is connected to the third surface;

[0016] The first cap portion is opposite to the third surface in the third direction, the second cap portion is opposite to the second surface in the second direction, and the first direction, the second direction and the third direction intersect each other.

[0017] In some embodiments, the tube cap is provided with an optical port, the optical port faces the optoelectronic chip, the optical port is sealed with a first optical window, and the optoelectronic chip is used to emit or receive laser light toward the first optical window.

[0018] In some embodiments, the tube cap is provided with an observation port, and the observation port is sealed with a second light window.

[0019] In some embodiments, the optical transceiver further comprises:

[0020] A lens, which is disposed on a side of the first optical window away from the optoelectronic chip, and is configured to couple the laser emitted or received by the optoelectronic chip.

[0021] In some embodiments, the optical transceiver further includes:

[0022] A monitoring chip, which is disposed in the accommodation cavity, and the monitoring chip is connected to the second base, and the monitoring chip is electrically connected to the optoelectronic chip and the electrical connector respectively.

[0023] Beneficial effects: The optical transceiver according to the embodiment of the present application includes a header, the header includes a first base, a second base that intersect and are connected to each other, and a first side portion and a second side portion that are spaced apart in a first direction. Both the first side portion and the second side portion are connected to the first base and the second base and enclose an accommodation cavity with a first opening; a tube cap, which is connected to the header and covers the first opening; an optoelectronic chip, which is disposed in the accommodation cavity and is at least connected to the first base; an electrical connector, which is connected to the second base, and one end of the electrical connector passes through the accommodation cavity and is electrically connected to the optoelectronic chip. That is, the optoelectronic chip is disposed on the first base to be spaced from the electrical connector on the second base, so that the optoelectronic chip has a larger heat dissipation area, improves the heat dissipation performance. At the same time, the first side portion and the second side portion can also be used to contact the optoelectronic chip and serve as the heat dissipation surface of the optoelectronic chip, which is beneficial to further improving the heat dissipation effect. Description of the Drawings

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present application. For those skilled in the art, without creative efforts, other drawings can be obtained according to these drawings.

[0025] Figure 1 is a schematic structural diagram of the optical transceiver according to Embodiment 1 of the present application;

[0026] Figure 2 is a schematic internal cross-sectional structural diagram of the optical transceiver according to Embodiment 1 of the present application;

[0027] Figure 3 is a schematic structural diagram of the header, optoelectronic chip, electrical connector and monitoring chip according to Embodiment 1 of the present application;

[0028] Figure 4 is a schematic structural diagram of the header according to Embodiment 1 of the present application;

[0029] Figure 5 is a schematic structural diagram of the tube cap according to Embodiment 1 of the present application;

[0030] Figure 6 It is a schematic structural diagram of an optical transceiver with a coupling lens according to Embodiment 1 of the present application;

[0031] Figure 7 It is a schematic structural diagram of an optical transceiver with a coupling lens according to Embodiment 2 of the present application;

[0032] Reference numerals: 1, optical transceiver; 10, base; 100, first base portion; 1000, first surface; 1001, second surface; 1002, extension portion; 1003, support portion; 101, second base portion; 1010, third surface; 1011, fourth surface; 102, first side portion; 103, second side portion; 104, accommodation cavity; 105, first opening; 106, first welding end face; 1060, first welding sub-face; 1061, second welding sub-face; 1062, third welding sub-face; 1063, fourth welding sub-face; 20, tube cap; 200, first cap portion; 2000, first engaging portion; 2001, first engaging surface; 2002, first pressing surface; 201, second cap portion; 2010, second engaging portion; 2011, second engaging surface; 2012, second pressing surface; 202, third side portion; 203, fourth side portion; 204, optical path cavity; 205, second opening; 206, second welding end face; 2060, fifth welding sub-face; 2061, sixth welding sub-face; 2062, seventh welding sub-face; 2063, eighth welding sub-face; 207, welding protrusion; 208, optical port; 209, observation port; 30, optoelectronic chip; 300, laser; 301, spacer; 40, electrical connector; 400, insulating portion; 401, connecting portion; 50, first optical window; 60, second optical window; 70, lens; 80, monitoring chip; 90, positioning groove; X, first direction; Y, second direction; Z, third direction. Detailed implementation manners

[0033] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative efforts shall fall within the protection scope of the present application.

[0034] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more features. In the description of the present application, the meaning of "a plurality" is two or more, and at least one means it can be one, two, or more, unless otherwise specifically defined.

[0035] It should also be noted that in the description of the present application, "vertical" means completely vertical at 90° or almost completely vertical. For example, within the range of an included angle of 80° to 100°, it is considered vertical. Similarly, "parallel" means completely parallel or almost completely parallel. For example, within a range of 10° of complete parallelism, it is considered parallel.

[0036] The applicant notes that with the rise in the demand for 1550nm lidar and the application of silicon photonics technology in optical modules, high-power lasers are applied therein to achieve better heat dissipation in a low-cost manner, which will have a positive impact on the light source output power of 1550nm lidar and silicon photonics optical modules. The traditional hermetic transistor package (Transistor Outline, abbreviated as TO) is coaxial packaging, and the metal cap and the header are sealed and welded on the same plane. The bottom surface of the header with a larger area is mostly used for pin extraction and soldering with a flexible board, and it cannot achieve good heat dissipation. Only the side surface of the header can be used for heat dissipation, but the side surface area is small and far from the chip, resulting in poor heat dissipation performance.

[0037] In view of this, an embodiment of the present application discloses an optical transceiver that can solve at least one of the above defects.

[0038] Embodiment 1:

[0039] Refer to Figures 1 to 5, the optical transceiver 1 has a first direction X. The optical transceiver 1 includes a base 10, a cap 20, an optoelectronic chip 30, and an electrical connector 40. Among them, the base 10 includes a first base portion 100, a second base portion 101 that intersect and are connected to each other, and a first side portion 102 and a second side portion 103 that are spaced apart in the first direction X. Both the first side portion 102 and the second side portion 103 are connected to the first base portion 100 and the second base portion 101 and enclose a receiving cavity 104 having a first opening 105. The cap 20 is connected to the base 10 and covers the first opening 105. The optoelectronic chip 30 is disposed in the receiving cavity 104, and the optoelectronic chip 30 is at least connected to the first base portion 100. The electrical connector 40 is connected to the second base portion 101. One end of the electrical connector 40 passes through the receiving cavity 104 and is electrically connected to the optoelectronic chip 30, and the other end is located outside the receiving cavity 104.

[0040] The optoelectronic chip 30 is disposed on the first base portion 100 to be spaced apart from the electrical connector 40 on the second base portion 101, so that the optoelectronic chip 30 has a larger heat dissipation area, improving the heat dissipation performance. At the same time, the first side portion 102 and the second side portion 103 can also be used to contact the optoelectronic chip 30 and serve as the heat dissipation surfaces of the optoelectronic chip 30, which is beneficial to further improving the heat dissipation effect.

[0041] It should be noted that in this embodiment, the intersection of the first base portion 100 and the second base portion 101 means that there is an angle between the first base portion 100 and the second base portion 101 that is not 0° or 180°, so that the electrical connector 40 and the optoelectronic chip 30 are spaced apart from each other in structure, avoiding the electrical connector 40 occupying the heat dissipation surface of the optoelectronic chip 30. On this basis, after the first side portion 102 and the second side portion 103 are connected to the cap 20, neither the first side portion 102 nor the second side portion 103 is occupied by the electrical connector 40, that is, the optoelectronic chip 30 can also conduct heat and contact the first side portion 102 and / or the second side portion 103 to further expand the contact heat dissipation surface, thereby improving the overall heat dissipation effect.

[0042] Further, referring to Figures 1 to 5 , in some embodiments, the base 10 has a first welding end face 106 surrounding the first opening 105, and the cap 20 has a second welding end face 206. The first welding end face 106 and the second welding end face 206 are parallel to each other and connected to each other. In this embodiment, the base 10 and the cap 20 are respectively in a wedge-shaped structure, and the two can be hermetically combined through the first welding end face 106 and the second welding end face 206.

[0043] In addition, in this embodiment, taking the optoelectronic chip 30 disposed in the accommodation cavity 104 as an example, it can be understood that the optoelectronic chip 30 may include a laser 300 and a detector (not shown in the figure) integrated in the accommodation cavity 104 to receive and transmit optical signals. In other embodiments, if this product is only an optical transmitter, that is, the optoelectronic chip 30 can be set as the laser 300; if this product is only an optical receiver, that is, the optoelectronic chip 30 can be set as the detector.

[0044] Specifically, referring to Figure 2 、 Figure 3 and Figure 4 , the optical transceiver 1 further has a second direction Y and a third direction Z, and the first direction X, the second direction Y and the third direction Z intersect pairwise. The first base 100 has a corresponding first surface 1000 and a second surface 1001 in the second direction Y, the second base 101 has a corresponding third surface 1010 and a fourth surface 1011 in the third direction Z, and the second surface 1001 is connected to the third surface 1010; the first base 100 has a first welding sub-surface 1060 facing the tube cap 20, the second base 101 has a second welding sub-surface 1061 facing the tube cap 20, the first side portion 102 has a third welding sub-surface 1062 facing the tube cap 20, the second side portion 103 has a fourth welding sub-surface 1063 facing the tube cap 20, and the first welding sub-surface 1060, the second welding sub-surface 1061, the third welding sub-surface 1062 and the fourth welding sub-surface 1063 are connected in sequence to form a first welding end face 106.

[0045] Referring to Figure 2 and Figure 5 , in some embodiments, the tube cap 20 includes a first cap portion 200, a second cap portion 201 connected to each other, and a third side portion 202 and a fourth side portion 203 spaced apart in the first direction X. Both the third side portion 202 and the fourth side portion 203 are connected to the first cap portion 200 and the second cap portion 201 and enclose an optical path cavity 204. The optical path cavity 204 communicates with the accommodation cavity 104. The second welding end face 206 surrounds the second opening 205. The first cap portion 200 faces the third surface 1010 in the third direction Z, and the second cap portion 201 faces the second surface 1001 in the second direction Y.

[0046] Specifically, the first cap portion 200 has a fifth welding sub-surface 2060 facing the first base 100, the second cap portion 201 has a sixth welding sub-surface 2061 facing the second base 101, the third side portion 202 has a seventh welding sub-surface 2062 facing the first side portion 102, the fourth side portion 203 has an eighth welding sub-surface 2063 facing the second side portion 103, and the fifth welding sub-surface 2060, the sixth welding sub-surface 2061, the seventh welding sub-surface 2062 and the eighth welding sub-surface 2063 are connected in sequence to form an overall second welding end face 206.

[0047] It should be noted that, referring to Figure 5 , in order to increase the contact surfaces of the first cap portion 200, the third side portion 202, and the fourth side portion 203 with the socket 10, the first cap portion 200, the third side portion 202, and the fourth side portion 203 extend on the plane where the second welding end face 206 is located to form a first engaging portion 2000. The first engaging portion 2000 has a first engaging surface 2001 facing the first welding sub-surface 1060 and a first pressing surface 2002 facing away from the first welding sub-surface 1060. The first engaging surface 2001 and the fifth welding sub-surface 2060 are located in the same plane and are connected. The first pressing surface 2002 is parallel to the first welding sub-surface 1060. The above-mentioned fifth welding sub-surface 2060 actually includes the side surface of the first engaging portion 2000 facing the socket 10;

[0048] Similarly, the second cap portion 201, the third side portion 202, and the fourth side portion 203 extend on the plane where the second welding surface is located to form a second engaging portion 2010. The second engaging portion 2010 has a second engaging surface 2011 facing the second welding sub-surface 1061 and a second pressing surface 2012 facing away from the second welding sub-surface 1061. The second engaging surface 2011 and the sixth welding sub-surface 2061 are located in the same plane and are connected. The second pressing surface 2012 is parallel to the second welding sub-surface 1061. The above-mentioned sixth welding sub-surface 2061 actually includes the side surface of the second engaging portion 2010 facing the socket 10.

[0049] It should be noted that the overall socket 10 can be machined or stamped from a metal material with a high thermal conductivity coefficient. Specifically, metal materials such as copper, aluminum, silver, tungsten, etc. can be flexibly adopted according to actual needs. The first base portion 100, the second base portion 101, the first side portion 102, and the second side portion 103 of the socket 10 can actually be integrally formed, and at this time, the first welding end face 106 is formed when the socket 10 is formed.

[0050] Similarly, the overall cap 20 can also be machined or stamped from a metal material. Specifically, metal materials such as copper, aluminum, etc. can be flexibly adopted according to actual needs. The first cap portion 200, the second cap portion 201, the third side portion 202, the fourth side portion 203, the first engaging portion 2000, and the second engaging portion 2010 of the cap 20 can actually be integrally formed, and at this time, the second welding end face 206 is formed when the cap 20 is formed; the cap 20 usually also undergoes surface treatment such as tin plating, nickel plating, etc. to improve its corrosion resistance and connection performance.

[0051] In this embodiment, through the settings of the first side portion 102, the second side portion 103, the third side portion 202, and the fourth side portion 203, the first welding end face 106 and the second welding end face 206 that are parallel and fitted to each other are formed. While being compatible with the conventional resistance welding socket 10 and cap 20 equipment, a higher airtightness yield and reliability can be obtained. Compared with only setting the first base portion 100, the second base portion 101, the first cap portion 200, and the second cap portion 201, the need for multiple welding surfaces during welding is avoided, the requirements for the resistance welding process are reduced, and the welding reliability and production efficiency are improved.

[0052] To facilitate the mutual connection of the socket 10 and the cap 20 by resistance welding, the first pressing surface 2002 and the second pressing surface 2012 are used for the resistance welding equipment to abut against, which is beneficial to make the first joint surface 2001, the second joint surface 2011, and the overall second welding end face 206 stably abut against the first welding end face 106.

[0053] In addition, referring to Figure 5 , in some embodiments, the cap 20 encloses an optical path cavity 204 having a second opening 205. The second welding end face 206 is provided with a welding convex portion 207 facing the first welding end face 106, and the welding convex portion 207 surrounds the second opening 205. In this embodiment, the cap 20 and the socket 10 are welded by a resistance welding process to ensure the airtightness of the accommodation cavity 104 and the optical path cavity 204, and the welding convex portion 207 improves the sealing effect when the two are melt-connected by resistance welding.

[0054] Exemplarily, referring to Figure 2 and Figure 3 , a support portion 1003 is formed on the second surface 1001 of the socket 10. The optoelectronic chip 30 includes a laser 300 (Laser Diode, abbreviated as LD) and a pad 301 (Laser Diode Submount, abbreviated as LDSM). The pad 301 is fixed on the support portion 1003, and the laser 300 is fixed on the pad 301. Specifically, the laser 300 can be connected to the pad 301 by gold-tin soldering, and the pad 301 can be fixed to the support portion 1003 by silver glue or gold-tin soldering and other methods.

[0055] The pad 301 can provide mechanical support and protection for the laser 300, preventing the laser 300 from being affected by external impacts or vibrations, thereby extending the life and stability of the laser 300. At the same time, the pad 301 can dissipate heat from the laser 300 in time to maintain its stable operating temperature. In addition, the pad 301 has precise dimensions and geometric shapes, and can provide accurate optical positioning to accurately arrange the laser 300, so as to ensure the precise alignment between the laser diode and other optical elements, and obtain high-quality laser output.

[0056] In some embodiments, referring to Figure 1, Figure 2 and Figure 3 , the electrical connector 40 is arranged to penetrate through the pin of the second base 101, and an insulating part 400 is provided between the outside of the pin and the second base 101. The insulating part 400 can adopt a glass insulator and is fixed to the socket 10 by high-temperature sintering. In this embodiment, the electrical connector 40 is electrically connected to the spacer 301 through the connecting part 401, so as to electrically connect the laser 300. The connecting part 401 can adopt a gold-tin solder sheet, solder paste, etc. In addition, the electrical connector 40 can also be directly connected to the spacer 301 by gold wire bonding. In other embodiments, the electrical connector 40 can also adopt a multi-layer ceramic substrate, which will not be elaborated here.

[0057] In addition, in some embodiments, referring to Figure 3 , the optical transceiver 1 further includes a monitoring chip 80 (Monitor Photodiode, abbreviated as MPD). The monitoring chip 80 is arranged in the receiving cavity 104 and connected to the third surface 1010. The monitoring chip 80 can be fixed to the third surface 1010 by silver glue. The monitoring chip 80 can be electrically connected to the optoelectronic chip 30 and the electrical connector 40 respectively through wire bonding only. The monitoring chip 80 can monitor the backlight intensity output by the laser 300, that is, by installing on the back of the laser 300, converting the optical signal into an electrical signal to monitor the backlight intensity of the laser 300 in real time, so as to provide a feedback signal for controlling and adjusting the output power and stability of the laser 300.

[0058] In addition, in order to further improve the heat dissipation effect of the laser 300, in other embodiments, a thermoelectric cooler (abbreviated as TEC) can also be added to the support part 1003 for the laser 300 and the spacer 301 to be connected, and elements such as a thermistor can also be set to detect the temperature of the laser 300 part in real time to improve the stability of use.

[0059] In some embodiments, referring to Figure 1 , Figure 2 and Figure 5 , the first cap portion 200 is provided with an optical port 208, the optical port 208 faces the laser 300, and the optical port 208 is sealed with a first optical window 50. The laser 300 can emit laser light toward the first optical window 50 to smoothly export the optical path cavity 204.

[0060] In addition, the second cap portion 201 is provided with an observation port 209, the observation port 209 faces the laser 300, and the observation port 209 is sealed with a second optical window 60. The observation port 209 and the second optical window 60 can be used to observe the components in the receiving cavity 104 such as the laser 300, which is convenient for high-precision mounting with external components and improves the coupling efficiency with external optical components.

[0061] It should be noted that the first optical window 50 and the second optical window 60 can adopt a glass optical window material with a coefficient of thermal expansion intersecting that of the tube cap 20, and are hermetically bonded to the tube cap 20 through high-temperature sintering with AuSn solder or glass solder.

[0062] In some embodiments, referring to Figure 2 and Figure 6 , the optical transceiver 1 further includes a lens 70 (Lens). The lens 70 is disposed on the side of the first optical window 50 away from the laser 300. The lens 70 is used to couple the laser emitted or received by the optoelectronic chip 30. For example, the vertical and horizontal divergence angles of the laser emitted by the laser 300 can be adjusted through the lens 70, so as to be coupled and matched with external optical components.

[0063] It should be noted that the included angle between the first base 100 and the second base 101 is defined to be between 60° and 135°. Within this included angle range, the first base 100 bears the optoelectronic chip 30, and the second base 101 bears the electrical connector 40 without interference. The first base 100 can have sufficient space for the optoelectronic chip 30 to dissipate heat. When the included angle between the first base 100 and the second base 101 is less than 60°, the space between the second surface 1001 and the third surface 1010 is narrow, which is not conducive to installing the optoelectronic chip 30; when the included angle is greater than 135°, the electrical connector 40 passing through the second base 101 may affect the installation of the first base 100 and the overall optical transceiver 1. Therefore, it is preferred that the included angle between the first base 100 and the second base 101 is between 60° and 135°.

[0064] In this embodiment, the first direction X, the second direction Y, and the third direction Z are perpendicular to each other in pairs, that is, the first base 100 and the second base 101 are perpendicular to each other, and the first cap portion 200 and the second cap portion 201 are also perpendicular to each other, so that the optoelectronic chip 30 and the electrical connector 40 are independent of each other, and the internal space layout of the optical transceiver 1 is more reasonable, having a better heat dissipation effect and sufficient installation space.

[0065] In addition, referring to Figure 2 , a positioning groove 90 penetrating through the first surface 1000 and the fourth surface 1011 is provided at the connecting end of the first base 100 and the second base 101. The positioning groove 90 is designed to correspond to and fit a coaxial packaging device to quickly position and install the socket 10.

[0066] In addition, in this embodiment, a single-channel laser 300 is taken as an example. In other embodiments, multiple lasers 300 and applications with multiple optical signal channels can also be set. At the same time, in other embodiments, an optical receiver or a combination of a laser 300 and an optical receiver can also be arranged in the accommodation cavity 104, which will not be elaborated here one by one.

[0067] Embodiment 2:

[0068] Reference Figure 7 In this embodiment, the difference from Embodiment 1 is that, by way of example, one end of the first base 100 away from the second base 101 is connected with an extension portion 1002 in the third direction Z. Correspondingly, a smaller lens 70 than that in Embodiment 1 can be directly coupled to the extension portion 1002 to adapt to different processing methods.

[0069] In addition, in other embodiments, the lens 70 can also be directly built into the tube cap 20, which will not be elaborated herein.

[0070] The above has introduced in detail an optical transceiver provided by the embodiments of the present application, and specific examples have been used to illustrate the principle and implementation manner of the present application. The description of the above embodiments is only used to help understand the technical solution and its core idea of the present application; those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. An optical transceiver (1), characterized in that, it includes: a header (10), the header (10) includes a first base (100), a second base (101) that intersect and are connected to each other, and a first side (102) and a second side (103) that are spaced apart in a first direction (X), the first side (102) and the second side (103) are both connected to the first base (100) and the second base (101) and enclose a receiving cavity (104) having a first opening (105); a ferrule (20), the ferrule (20) is connected to the header (10) and covers the first opening (105); an optoelectronic chip (30), the optoelectronic chip (30) is disposed in the receiving cavity (104), and the optoelectronic chip (30) is disposed on the first base (100); an electrical connector (40), the electrical connector (40) passes through the second base (101) and extends into the receiving cavity, one end of the electrical connector (40) is disposed in the receiving cavity (104) and is electrically connected to the optoelectronic chip (30), and the other end is outside the receiving cavity.

2. The optical transceiver (1) according to claim 1, characterized in that, the header (10) has a first welding end face (106) surrounding the first opening (105), the ferrule (20) has a second welding end face (206), the first welding end face (106) and the second welding end face (206) are in the same plane, and the header (10) and the ferrule (20) are hermetically connected through the first welding end face (106) and the second welding end face (206).

3. The optical transceiver (1) according to claim 2, characterized in that, the first base (100) has a first welding sub-face (1060) facing the ferrule (20), the second base (101) has a second welding sub-face (1061) facing the ferrule (20), the first side (102) has a third welding sub-face (1062) facing the ferrule (20), the second side (103) has a fourth welding sub-face (1063) facing the ferrule (20), the first welding sub-face (1060), the second welding sub-face (1061), the third welding sub-face (1062) and the fourth welding sub-face (1063) are in the same plane and are sequentially connected to form the first welding end face (106).

4. The optical transceiver (1) according to claim 3, characterized in that, The tube cap (20) comprises a first cap portion (200), a second cap portion (201) connected to each other, and a third side portion (202) and a fourth side portion (203) arranged at intervals in the first direction (X); the third side portion (202) and the fourth side portion (203) are both connected to the first cap portion (200) and the second cap portion (201) and enclose an optical path cavity (204) having a second opening; the optical path cavity (204) is connected to the accommodating cavity (104); and the second welding end surface (206) surrounds the second opening (205); The first cap portion (200) has a fifth welding sub-surface (2060) facing the first base portion (100), the second cap portion (201) has a sixth welding sub-surface (2061) facing the second base portion (101), the third side portion (202) has a seventh welding sub-surface (2062) facing the first side portion (102), the fourth side portion (203) has an eighth welding sub-surface (2063) facing the second side portion (103), and the fifth welding sub-surface (2060), the sixth welding sub-surface (2061), the seventh welding sub-surface (2062) and the eighth welding sub-surface (2063) are located in the same plane and are sequentially connected to form the second welding end surface (206).

5. The optical transceiver (1) according to claim 4, It is characterized in that The first cap portion (200) is provided with a first combining portion (2000) extending along a side away from the second cap portion (201); the first combining portion (2000) has a first combining surface (2001) facing the first welding sub-surface (1060) and a first extrusion surface (2002) away from the first welding sub-surface (1060); the first combining surface (2001) and the fifth welding sub-surface (2060) are located in the same plane and connected to each other, and the first extrusion surface (2002) is parallel to the first welding sub-surface (1060); The second cap portion (201) is provided with a second joining portion (2010) extending along a side away from the first cap portion (200), the second joining portion (2010) having a second joining surface (2011) facing the second welding sub-surface (1061) and a second extrusion surface (2012) away from the second welding sub-surface (1061), the second joining surface (2011) and the sixth welding sub-surface (2061) are located in the same plane and are connected, and the second extrusion surface (2012) is parallel to the second welding sub-surface (1061).

6. The optical transceiver (1) according to claim 4, It is characterized in that The first base (100) has a corresponding first surface (1000) and a second surface (1001) in the second direction (Y), the second base (101) has a corresponding third surface (1010) and a fourth surface (1011) in the third direction (Z), and the second surface (1001) is connected to the third surface (1010); The first cap portion (200) is opposite to the third surface (1010) in the third direction (Z), the second cap portion (201) is opposite to the second surface (1001) in the second direction (Y), and the first direction (X), the second direction (Y) and the third direction (Z) intersect pairwise.

7. The optical transceiver (1) according to claim 1, characterized in that, an optical port (208) is formed in the tube cap (20), the optical port (208) faces the optoelectronic chip (30), a first optical window (50) is sealed on the optical port (208), and the optoelectronic chip (30) is configured to emit or receive laser light toward the first optical window (50).

8. The optical transceiver (1) according to claim 1, characterized in that, an observation port (209) is formed in the tube cap (20), and a second optical window (60) is sealed on the observation port (209).

9. The optical transceiver (1) according to claim 7, characterized in that, the optical transceiver (1) further comprises: a lens (70), the lens (70) is disposed on a side of the first optical window (50) away from the optoelectronic chip (30), and the lens (70) is configured to couple the laser light emitted or received by the optoelectronic chip (30).

10. The optical transceiver (1) according to claim 1, characterized in that, the optical transceiver (1) further comprises: a monitoring chip (80), the monitoring chip (80) is disposed in the accommodation cavity (104), and the monitoring chip (80) is connected to the second base portion (101), and the monitoring chip (80) is electrically connected to the optoelectronic chip (30) and the electrical connector (40) respectively.

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