BOB device and optical communication equipment

Abstract

The invention provides a BOB device and optical communication equipment, and belongs to the technical field of optical communication. The BOB device includes an optical component, a circuit board, and a dielectric material layer. The optical assembly comprises a transmission module and a plurality of signal pins, the transmission module is connected with the plurality of signal pins, the circuit board comprises a plurality of bonding pads, and the plurality of bonding pads are in one-to-one correspondence with the plurality of signal pins. The plurality of signal pins are connected with the plurality of bonding pads, and the dielectric material layer is used for wrapping the plurality of signal pins. By adopting the BOB device disclosed by the invention, the optical component and the circuit board can be connected by using the pin in a high-speed optical communication scene.

Description

Technical Field

[0001] The present disclosure relates to the field of optical communication technologies, and particularly to an optical component on board (BOB) device and an optical communication device. Background Art

[0002] In the field of optical communication, an optical communication device is disposed on a circuit board, and the optical communication device realizes the transmission and reception of optical signals through an optical component.

[0003] In a low-rate optical communication scenario, the optical component is connected to the circuit board through bent pins. However, optical communication devices are often applied to high-rate optical communication scenarios. Therefore, in high-rate optical communication scenarios, a connection solution for the optical component and the circuit board is also required. Summary of the Invention

[0004] The present disclosure provides a BOB device and an optical communication device, which can be applied to high-rate optical communication scenarios.

[0005] In a first aspect, the present disclosure provides a BOB device. The BOB device includes an optical component, a circuit board, and a dielectric material layer. The optical component includes a transmission module and a plurality of signal pins. The transmission module is connected to the plurality of signal pins. The circuit board includes a plurality of pads, and the plurality of pads correspond to the plurality of signal pins one by one. The plurality of signal pins are connected to the plurality of pads. The dielectric material layer is configured to wrap the plurality of signal pins and is located above the plurality of pads.

[0006] In the solution shown in the present disclosure, the plurality of signal pins are wrapped by the dielectric material layer and are not suspended in the air. The relative dielectric constant of the dielectric material layer is greater than that of air, which can reduce the transient impedance of the signal pins. Therefore, the impedance continuity of the signal pins can be improved, and the link bandwidth can be increased. So, the BOB device can be applied to high-rate optical communication scenarios. Moreover, since the plurality of signal pins are wrapped by the dielectric material layer, the external radiation of the plurality of signal pins will also be reduced, making the BOB device applicable to high-rate optical communication scenarios.

[0007] In an optional manner, when there are components and / or wires in adjacent areas of the plurality of pads on the surface of the circuit board, the dielectric material layer is located above the plurality of pads and has no contact with the circuit board. When there are no components or wires in adjacent areas of the plurality of pads on the surface of the circuit board, the dielectric material layer is located above the plurality of pads.

[0008] In this way, setting the dielectric material layer will not affect other components and / or wires on the circuit board.

[0009] In an alternative manner, the dielectric material layer includes a dielectric material and a radiation shielding material. In this way, the dielectric material is used to reduce the transient impedance of the signal pins, and the radiation shielding material can reduce the external radiation of the signal pins. Therefore, by connecting the optical component to the circuit board through the pins, it can be applied to high-speed optical transmission scenarios.

[0010] In an alternative manner, the circuit board further includes a plurality of anti-pads, the plurality of anti-pads correspond to the plurality of pads one by one, and each anti-pad in the plurality of anti-pads surrounds the corresponding pad in the plurality of pads.

[0011] In the solution shown in the present disclosure, the anti-pad can increase the distance between the pad and the ground, improve the transient impedance of the pin of the signal pin, improve the impedance continuity of the signal pin, and increase the link bandwidth.

[0012] In an alternative manner, the shape of each pad in the plurality of pads is circular, and the shape of each anti-pad is circular; the radius of each anti-pad is greater than 40 thousandths of an inch (mil) and less than 200 mil.

[0013] In an alternative manner, the thickness of the dielectric material layer wrapping each signal pin in the plurality of signal pins is the same. In this way, the thickness of the dielectric material layer can be made uniform, and the implementation difficulty is low.

[0014] In an alternative manner, the transmission module includes a transmitting unit, the plurality of signal pins are used to transmit signals, and the transmitting unit is connected to the plurality of signal pins; or,

[0015] The transmission module includes a receiving unit, the plurality of signal pins are used to receive signals, and the receiving unit is connected to the plurality of signal pins; or,

[0016] The transmission module includes a transmitting unit and a receiving unit, the plurality of signal pins include first signal pins and second signal pins, the first signal pins are used to transmit signals, the second signal pins are used to receive signals, the transmitting unit is connected to the first signal pins, and the receiving unit is connected to the second signal pins.

[0017] In the solution shown in the present disclosure, the signal pins for transmitting signals are wrapped with a dielectric material layer to reduce the transient impedance of the signal pins for transmitting signals and increase the transmitting link bandwidth, so it can be applied to high-speed optical transmission scenarios. Or, the signal pins for receiving signals are wrapped with a dielectric material layer to reduce the transient impedance of the signal pins for receiving signals and increase the receiving link bandwidth, so it can be applied to high-speed optical receiving scenarios. Or, the signal pins for transmitting and receiving signals are wrapped with a dielectric material layer to reduce the transient impedance of the signal pins for transmitting and receiving signals and increase the transmitting and receiving link bandwidth, so it can be applied to high-speed optical communication scenarios.

[0018] In an alternative embodiment, the optical component further includes a ground pin and a backlight current detection pin. The transmitting unit is connected to the ground pin and the backlight current detection pin, and the dielectric material layer is further configured to wrap the ground pin and the backlight current detection pin.

[0019] In the solution shown in the present disclosure, the distance between the ground pin and the backlight current detection pin and the signal pin is relatively small, and the dielectric material layer is further configured to wrap the ground pin and the backlight current detection pin, making it easier to design the dielectric material layer.

[0020] In an alternative embodiment, the relative dielectric constant of the dielectric material layer ranges from 6 to 30.

[0021] In an alternative embodiment, the first signal pin is a bent pin. In this way, the pin for transmitting the signal is set as a bent pin, making it easier to insert when the pin for transmitting the signal is inserted into the pad of the circuit board.

[0022] In a second aspect, the present disclosure provides an optical communication device, which includes a BOB device as described in the first aspect or any alternative embodiment. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 is a schematic diagram of a bidirectional optical sub-assembly (BOSA) provided by an exemplary embodiment of the present disclosure;

[0024] Figure 2 is a schematic side view structure diagram of a BOB device provided by an exemplary embodiment of the present disclosure;

[0025] Figure 3 is another schematic structure diagram of a BOB device provided by an exemplary embodiment of the present disclosure;

[0026] Figure 4 is a schematic top view structure diagram of a BOB device provided by an exemplary embodiment of the present disclosure;

[0027] Figure 5 is another schematic side view structure diagram of a BOB device provided by an exemplary embodiment of the present disclosure;

[0028] Figure 6 is a schematic impedance calculation diagram provided by an exemplary embodiment of the present disclosure;

[0029] Figure 7 is another schematic top view structure diagram of a BOB device provided by an exemplary embodiment of the present disclosure;

[0030] Figure 8It is another schematic side view structure diagram of the BOB device provided by an exemplary embodiment of the present disclosure.

[0031] Illustration

[0032] 1. Optical component; 2. Circuit board; 3. Dielectric material layer;

[0033] 11. Transmission module; 12. Signal pin; 13. Ground pin; 14. Backlight current detection pin;

[0034] 111. Transmitting unit; 112. Receiving unit; 121. First signal pin; 122. Second signal pin;

[0035] 21. Pad; 22. Anti-pad. Detailed implementation manners

[0036] To make the objectives, technical solutions, and advantages of the present disclosure clearer, the following will further describe the embodiments of the present disclosure in detail with reference to the accompanying drawings.

[0037] The following will explain some term concepts related to the embodiments of the present disclosure.

[0038] BOSA is a component capable of transmitting and receiving optical signals. BOSA is connected to an optical fiber. BOSA includes a transmitting unit, a beam splitting unit, and a receiving unit. Refer to the Figure 1 schematic optical path diagram shown. In Figure 1 , the transmitting unit transmits signals through light with wavelength λ 1 , and the receiving unit receives signals through light with wavelength λ 2 .

[0039] In the field of optical communication, optical communication devices are important devices. Generally, optical components are directly assembled on the circuit boards inside optical communication devices. The circuit boards are connected to the optical components to achieve signal transmission and supply power to the optical components. For example, the optical communication device is an optical network terminal (ONT) or an optical network unit (ONU), etc. In low-rate optical communication scenarios, the optical components are connected to the circuit boards through bent pins, but this is not applied to high-rate optical communication scenarios because the bent pins are relatively long and suspended in the air, resulting in a relatively high transient impedance, thus leading to a relatively low link bandwidth. Therefore, in high-rate optical communication scenarios, a connection solution for optical components and circuit boards is also required.

[0040] Here, the circuit board inside the optical communication device can also be referred to as a printed circuit board (PCB) or a wiring board.

[0041] In traditional technologies, in high-speed optical communication scenarios, optical components are assembled on the circuit board within an optical communication device through flexible printed circuits (FPCs). However, FPC connections are more costly than pin connections.

[0042] In the embodiments of the present disclosure, a BOB device is provided. In this BOB device, the optical component is connected to the circuit board of the communication device through pins, and this BOB device can be applied to high-speed optical communication scenarios. For example, high-speed optical communication scenarios include, but are not limited to, 10-gigabit-capable symmetric passive optical network (XGS PON), 50G passive optical network (PON), or scenarios greater than 50G.

[0043] Figure 2 A side view of a BOB device is provided. The BOB device includes an optical component 1, a circuit board 2, and a dielectric material layer 3. The optical component 1 includes a transmission module 11 and a plurality of signal pins 12. The transmission module 11 is electrically connected to the plurality of signal pins 12 and can transmit electrical signals. The plurality of signal pins 12 are used to transmit signals between the transmission module 11 and the circuit board 2. For example, the plurality of signal pins 12 include two signal pins 12, and the two signal pins 12 are used to transmit a pair of differential signals.

[0044] The circuit board 2 is the circuit board of the optical communication device. The circuit board 2 includes a plurality of pads 21. The number of the plurality of pads 21 is the same as the number of the plurality of signal pins 12, and the plurality of pads 21 correspond to the plurality of signal pins 12 one by one. The pins of the plurality of signal pins 12 are inserted into the plurality of pads 21 to achieve connection with the plurality of pads 21.

[0045] The dielectric material layer 3 wraps the plurality of signal pins 12. Optionally, the dielectric material layer 3 wraps each signal pin 12 as a whole. Optionally, the dielectric material layer 3 includes a plurality of dielectric material sub-layers, and the plurality of dielectric material sub-layers correspond to the plurality of signal pins 12 one by one. Each dielectric material sub-layer is used to wrap one signal pin 12.

[0046] Figure 2In the shown solution, the transient impedance of multiple signal pins 12 is "inversely proportional" to the relative permittivity of the environment where the multiple signal pins 12 are located. This "inverse proportion" is not an inverse proportion in the strict sense. After the relative permittivity is greater than a certain value, the transient impedance of the multiple signal pins 12 may no longer change. In the present disclosure, the multiple signal pins 12 are wrapped by a dielectric material layer 3 and are not suspended in the air. The relative permittivity of the dielectric material layer 3 is greater than that of the air. Therefore, the transient impedance of the signal pins can be reduced, thereby improving the impedance continuity of the multiple signal pins 12, and further increasing the link bandwidth. So it can be applied to high-speed optical transmission scenarios. Moreover, since the multiple signal pins 12 are wrapped by the dielectric material layer 3, the external radiation of the multiple signal pins 12 will also be reduced, enabling the BOB device to be applied to high-speed optical transmission scenarios.

[0047] It should be noted that Figure 2 the signal pin 12 shown in

[0048] is a signal pin 12 for transmitting signals.

[0049] In an optional manner, the dielectric material layer 3 is located above the multiple pads 21, and the dielectric material layer 3 is in contact with or not in contact with the circuit board 2.

[0050] In an optional manner, in order to prevent the dielectric material 3 from affecting other components of the circuit board 2, when there are components and / or wires in the adjacent areas of the multiple pads 21 on the surface of the circuit board 2, the dielectric material layer 3 is located above the multiple pads 21, and the dielectric material layer 3 is not in contact with the circuit board 2, that is, there is a distance between the dielectric material layer 3 and the circuit board 2. The value of this distance is set according to the influence of the dielectric material layer 3 on the components and wires in the adjacent areas, and generally this distance is set to have no influence on the components and wires.

[0050] When there are no components or wires in the adjacent areas of the multiple pads 21 on the surface of the circuit board 2, the dielectric material layer 3 is located above the multiple pads 21, and the dielectric material layer 3 is in contact with or not in contact with the circuit board 2.

[0051] It should be noted that when there are components and / or wires in the adjacent areas of the multiple pads 21 on the surface of the circuit board 2, even if the dielectric material layer 3 is in contact with the circuit board 2 and the influence on the components and wires is relatively small, the dielectric material layer 3 can also be set to be in contact with the circuit board 2.

[0052] In an alternative approach, the pins of the transmitting section in the optical component 1 are wrapped with a dielectric material layer 3. The transmission module 11 includes a transmitting unit 111. A plurality of signal pins 12 are pins for transmitting signals, and the transmitting unit 111 is connected to the plurality of signal pins 12. The dielectric material layer 3 wraps the plurality of signal pins 12. In this way, the pins for transmitting signals are wrapped by the dielectric material layer 3 and are not suspended in the air, which can reduce the transient impedance of the pins for transmitting signals, thereby improving the impedance continuity of the pins for transmitting signals, and further enhancing the transmission link bandwidth. Therefore, this BOB device can be applied to high-speed optical transmission scenarios.

[0053] Optionally, in this approach, the transmission module 11 further includes a receiving unit 112, and the receiving unit 112 is connected to the circuit board 2 through a flexible printed circuit board or other means.

[0054] In an alternative approach, the pins of the receiving section in the optical component 1 are wrapped with a dielectric material layer 3. The transmission module 11 includes a receiving unit 112. A plurality of signal pins 12 are pins for receiving signals, and the receiving unit 112 is connected to the plurality of signal pins 12. The dielectric material layer 3 wraps the plurality of signal pins 12. In this way, the pins for receiving signals are wrapped by the dielectric material layer 3 and are not suspended in the air, which can reduce the transient impedance of the pins for receiving signals, thereby improving the impedance continuity of the pins for receiving signals, and further enhancing the receiving link bandwidth. Therefore, this BOB device can be applied to high-speed optical receiving scenarios.

[0055] Optionally, in this approach, the transmission module 11 further includes a transmitting unit 111, and the transmitting unit 111 is connected to the circuit board 2 through a flexible printed circuit board or other means.

[0056] In an alternative approach, the pins of both the receiving section and the transmitting section in the optical component 1 are wrapped with a dielectric material layer 3. Refer to Figure 3 , Figure 3A side view of the BOB device is provided. The transmission module 11 includes a transmitting unit 111 and a receiving unit 112. The plurality of signal pins 12 include a first signal pin 121 and a second signal pin 122. The first signal pin 121 is a pin for transmitting signals, and the second signal pin 122 is a pin for receiving signals. The transmitting unit 111 is connected to the first signal pin 121, and the receiving unit 112 is connected to the second signal pin 122. The dielectric material layer 3 includes a first dielectric material sub-layer and a second dielectric material sub-layer. The first dielectric material sub-layer wraps the first signal pin 121, and the second dielectric material sub-layer wraps the second signal pin 122. In this way, both the pin for transmitting signals and the pin for receiving signals are wrapped by the dielectric material layer 3 and are not suspended in the air, reducing the transient impedance of the pin for transmitting signals and the pin for receiving signals, thereby improving the impedance continuity of the pin for transmitting signals and the pin for receiving signals, and further increasing the transceiver link bandwidth. Therefore, it can be applied to high-speed optical transceiver scenarios.

[0057] It should be noted that Figure 3 only one first signal pin 121 is shown, because when viewed from the side view, the two first signal pins 121 overlap.

[0058] It should also be noted that when the pins of the receiving part in the optical component 1 are wrapped by the dielectric material layer 3, the pins of the receiving part are long pins, that is, the receiving unit 112 is connected to the circuit board 2 using long pins, and the long pins refer to pins with a length greater than a certain value. Figure 3 The dielectric material sub-layer that wraps the second signal pin 122 is not shown in

[0059] Optionally, in the above three optional ways, there are two pins for transmitting signals, which are used to transmit a pair of differential signals, and there are two pins for receiving signals, which are used to receive a pair of differential signals.

[0060] In an optional way, when the transmitting part of the optical component 1 is wrapped by the dielectric material layer 3, the optical component 1 further includes a ground pin 13 and a backlight current detection pin 14. The circuit board 2 further includes two other pads, which are used to connect to the ground pin 13 and the backlight current detection pin 14. Refer to Figure 4 the top view of the BOB device shown. The dielectric material layer 3 is also used to wrap the ground pin 13 and the backlight current detection pin 14.

[0061] It should be noted that Figure 4 the BOB device shown only shows various pins and the dielectric material layer 3, and the rest of the content is not shown. In addition, Figure 5 a side view of the BOB device is also shown, in Figure 5 which the two signal pins 12 overlap.

[0062] Optionally, the transmitting unit 111 is respectively connected to the ground pin 13 and the backlight current detection pin 14, and the dielectric material layer 3 wraps each pin connected to the transmitting unit 111 as a whole. Alternatively, the dielectric material layer 3 includes a plurality of dielectric material sub-layers, and the plurality of dielectric material sub-layers correspond one-to-one to the pins connected to the transmitting unit 111, and each dielectric material sub-layer is used to wrap one pin connected to the transmitting unit 111.

[0063] In an alternative embodiment, the optical component 1 further includes a power supply pin, the receiving unit 112 is connected to the power supply pin, and the dielectric material layer 3 is further used to wrap the power supply pin.

[0064] In an alternative embodiment, the dielectric material layer 3 includes a dielectric material and a radiation shielding material. The dielectric material is used to change the transient impedance of the signal pin 12, and the radiation shielding material is used to reduce the energy radiated outward by the signal pin 12. The dielectric material and the radiation shielding material are mixed to form the dielectric material layer 3.

[0065] Optionally, the radiation shielding material is uniformly distributed in the dielectric material.

[0066] Optionally, the dielectric material is any material used to change the impedance. For example, the dielectric material is silicon dioxide or titanium dioxide, etc. The embodiments of the present disclosure are not listed one by one.

[0067] Optionally, the radiation shielding material is any material capable of shielding the radiation of the signal pin 12. For example, the radiation shielding material is ferrite or magnetic metal, etc. The embodiments of the present disclosure are not listed one by one.

[0068] Optionally, the concentration of the radiation material is set according to actual needs.

[0069] In an alternative embodiment, the thickness of the dielectric material layer 3 wrapping each signal pin 12 among the plurality of signal pins 12 is the same. In this way, the impedance continuity of the signal pin 12 can be uniformly improved.

[0070] In an alternative embodiment, the relative dielectric constant of the dielectric material layer 3 can be set according to actual needs, so that after the dielectric material layer 3 is set, the impedance continuity of the signal pin 12 can be improved. For example, the relative dielectric constant of the dielectric material layer 3 ranges from 6 to 30.

[0071] In an alternative embodiment, the pins for transmitting signals in the BOB device are all bent pins. The bent pins refer to the pins with a bent shape. The pins for transmitting signals are set as bent pins so that the pins for transmitting signals are inserted into the pad 21 in a direction close to perpendicular to the circuit board 2. For example, the bending degree of the bent pin is close to 90 degrees.

[0072] In an alternative manner, the pin for receiving a signal in the BOB device may be located below the optical component 1 and perpendicular to the circuit board 2, so the pin for receiving a signal may be vertical.

[0073] In an alternative manner, during the fabrication of the BOB device, the dielectric material layer 3 may be filled with the dielectric material layer 3 at the positions of the plurality of signal pins 12 of the optical component 1 after inserting the plurality of signal pins 12 of the optical component 1 into the pads 21 of the circuit board 2, such that the dielectric material layer 3 wraps the plurality of signal pins 12.

[0074] Alternatively, during the fabrication of the BOB device, after the optical component 1 is fabricated, the signal pins 12 of the optical component 1 are wrapped with the dielectric material layer 3, and then the signal pins 12 of the optical component 1 are inserted into the pads 21 of the circuit board 2 to realize the connection between the optical component 1 and the circuit board 2.

[0075] In the embodiments of the present disclosure, the connection manner between the signal pin 12 and the circuit board 2 is similar to that of a coaxial cable. Refer to Figure 6 , the pin of the signal pin 12 and the part of the pad 21 that transmits signals with the pin are equivalent to the inner shaft, and the position where the ground is located on the circuit board 2 is equivalent to the outer shaft. The impedance is related to the diameter (inner diameter) of the inner shaft and the diameter (outer diameter) of the outer shaft, and is represented by formula (1).

[0076]

[0077] In formula (1), Z represents the impedance of the pin of the signal pin 12, ε represents the dielectric constant of the material of the circuit board 2, D2 represents the outer diameter, and D1 represents the inner diameter. This is only an exemplary equivalence. The pin of the signal pin 12 and the part of the pad 21 that transmits signals with the pin may not be exactly circular, and the position where the ground is located on the circuit board 2 may not be exactly circular.

[0078] It can be seen from formula (1) that there is a material for the circuit board 2 that will cause the transient impedance of the pin of the signal pin 12 to decrease. In order to increase the transient impedance of the pin of the signal pin 12, the circuit board 2 further includes a plurality of anti-pads 22, and the plurality of anti-pads 22 correspond to the plurality of pads 21 one by one. Refer to Figure 7 . Each of the plurality of anti-pads 22 surrounds the corresponding pad 21.

[0079] In this way, by designing the anti-pads 22 around the pads 21, the distance between the pads 21 and the ground is increased, that is, D2 in formula (1) is increased. Therefore, the transient impedance of the signal pin 12 can be increased, the impedance continuity can be improved, and thus the bandwidth of the transmission link can be enhanced.

[0080] Optionally, each pad 21 is circular, and the shape of each anti-pad 22 is circular. The radius of each anti-pad 22 is greater than 40 mil and less than 200 mil. Mil is a unit representing one thousandth of a foot.

[0081] Optionally, the shape of each anti-pad 22 is circular, and the radius of each anti-pad 22 is greater than 50 mil.

[0082] It should be noted that the radius of the anti-pad 22 is set according to actual needs, and any radius that can improve impedance continuity can be applied to the embodiments of the present disclosure. Figure 7 The shown BOB device only shows various pins and the dielectric material layer 3, and the rest is not shown.

[0083] In an alternative manner, Figure 8 A further side view structural schematic diagram of the BOB device is also shown. Refer to Figure 8 , on the circuit board 2, a chip and some other components are arranged on the right side of the plurality of pads 21 for signal processing.

[0084] In the embodiments of the present disclosure, an optical communication device is further provided. The optical communication device includes the BOB device described above, and the optical communication device is an ONT or an ONU, etc.

[0085] In the present disclosure, terms such as "first" and "second" are used to distinguish between identical or similar items with basically the same functions. It should be understood that there is no logical or temporal dependence between "first" and "second", nor are the quantity and execution order limited. It should also be understood that although the following description uses terms such as "first" and "second" to describe various elements, these elements should not be limited by the terms. These terms are only used to distinguish one element from another. For example, without departing from the scope of various examples, the first signal pin can be called the second signal pin, and similarly, the second signal pin can be called the first signal pin. The first signal pin and the second signal pin can both be signal pins, and in some cases, they can be separate and different signal pins.

[0086] The meaning of the term "plurality" in the present disclosure refers to two or more.

[0087] The term "and / or" in the present disclosure represents three cases. For example, "A and / or B" represents three cases: A, B, and A and B.

[0088] The above description is only an exemplary embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present disclosure can easily think of various equivalent modifications or substitutions, and these modifications or substitutions should be covered within the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.

Claims

1. An optical component on board BOB device, It is characterized in that The BOB device comprises an optical component (1), a circuit board (2) and a dielectric material layer (3); The optical component (1) comprises a transmission module (11) and a plurality of signal pins (12), wherein the transmission module (11) is connected to the plurality of signal pins (12); The circuit board (2) comprises a plurality of solder pads (21), and the plurality of solder pads (21) correspond one-to-one to the plurality of signal pins (12); The plurality of signal pins (12) are connected to the plurality of pads (21); The dielectric material layer (3) is used to wrap the plurality of signal pins (12) and is located above the plurality of pads (21).

2. The BOB device according to claim 1, It is characterized in that In the case where there are components and / or wires in the vicinity of the plurality of pads (21) on the surface of the circuit board (2), the dielectric material layer (3) is located above the plurality of pads (21) and has no contact with the circuit board (2); In a case where no components or wires exist in an area adjacent to the plurality of solder pads (21) on the surface of the circuit board (2), the dielectric material layer (3) is located above the plurality of solder pads (21).

3. The BOB device according to claim 1 or 2, It is characterized in that The dielectric material layer (3) comprises a dielectric material and a radiation shielding material.

4. The BOB device according to any one of claims 1 to 3, It is characterized in that The circuit board (2) further comprises a plurality of anti-soldering pads (22), wherein the plurality of anti-soldering pads (22) correspond one-to-one to the plurality of soldering pads (21); Each anti-pad (22) among the plurality of anti-pads (22) surrounds a corresponding pad (21) among the plurality of pads (21).

5. The BOB device according to claim 4, It is characterized in that Each of the plurality of pads (21) is circular in shape, and each of the anti-pads (22) is circular in shape; The radius of each anti-pad (22) is greater than 40 thousandths of an inch (mil) and less than 200 mil.

6. The BOB device according to any one of claims 1 to 5, It is characterized in that The dielectric material layer (3) wraps around each of the plurality of signal pins (12) to the same thickness.

7. The BOB device according to any one of claims 1 to 6, It is characterized in that The transmission module (11) comprises a sending unit (111), the plurality of signal pins (12) are used to send signals, and the sending unit (111) is connected to the plurality of signal pins (12); or, The transmission module (11) comprises a receiving unit (112), the plurality of signal pins (12) are used to receive signals, and the receiving unit (112) is connected to the plurality of signal pins (12); or, The transmission module (11) comprises a sending unit (111) and a receiving unit (112); the plurality of signal pins (12) comprise a first signal pin (121) and a second signal pin (122); the first signal pin (121) is used for sending a signal; the second signal pin (121) is used for receiving a signal; the sending unit (111) is connected to the first signal pin (121); and the receiving unit (112) is connected to the second signal pin (121).

8. The BOB device according to claim 7, It is characterized in that The optical component (1) further comprises a ground pin (13) and a backlight current detection pin (14); The sending unit (111) is connected to the ground pin (13) and the backlight current detection pin (14); The dielectric material layer (3) is also used to wrap the ground pin (13) and the backlight current detection pin (14).

9. The BOB device according to any one of claims 1 to 8, It is characterized in that The relative dielectric constant of the dielectric material layer (3) is in the range of 6 to 30.

10. The BOB device according to claim 7 or 8, It is characterized in that The first signal pin (121) is a bent pin.

11. An optical communication device, It is characterized in that The optical communication equipment comprises the optical component-on-board (BOB) device according to any one of claims 1 to 10.

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