Touch sensor module, window stack structure including the same, and image display apparatus

Abstract

The touch sensor module includes a touch sensor layer including a visual area, a bending area, and a pad area; a flexible circuit board electrically connected to the touch sensor layer on the pad area of the touch sensor layer; a support structure covering the touch sensor layer on the bending area; and an optical layer disposed on the visual area of the touch sensor layer. The optical layer partially covers the support structure on a portion of the bending area adjacent to the visual area.

Description

[0001] Cross-reference and priority claims of related applications

[0002] This application claims priority to Korean Patent Application No. 10-2019-0100065, filed with the Korean Intellectual Property Office (KIPO) on August 16, 2019, the entire disclosure of which is incorporated herein by reference. Technical Field

[0003] This invention relates to a touch sensor module, a window stack structure including the same, and an image display device. More specifically, this invention relates to a touch sensor module including sensing electrodes and an insulating structure, and a window stack structure and image display device including the same. Background Technology

[0004] With the development of information technology, there is an increasing demand for display devices with thinner dimensions, lighter weight, and higher power efficiency. These display devices can include flat panel display devices, such as liquid crystal display (LCD) devices, plasma display panel (PDP) devices, electroluminescent display devices, organic light-emitting diode (OLED) display devices, etc.

[0005] Touch panels or touch sensors have also been developed that allow users to input instructions by selecting commands displayed on the screen using their fingers or input tools. These touch panels or touch sensors can be integrated with display devices to enable both display and information input functions within a single electronic device.

[0006] As flexible displays capable of bending or folding are developed, touch sensors with appropriate characteristics, structures, and configurations for such displays are also required. Furthermore, considering the reliability of connections to motherboards, circuit boards, and other components in image display devices, appropriate placement and structural design of the touch sensor may be necessary. Summary of the Invention

[0007] According to one aspect of the present invention, a touch sensor module with improved electrical and mechanical reliability is provided.

[0008] According to one aspect of the present invention, a window stack structure including a touch sensor module with improved electrical and mechanical reliability is provided.

[0009] According to one aspect of the present invention, an image display device is provided that includes a touch sensor module having improved electrical and mechanical reliability.

[0010] The above aspects of the present invention will be achieved by one or more of the following features or configurations:

[0011] (1) A touch sensor module, comprising: a touch sensor layer including a visual region, a curved region and a pad region; a flexible circuit board electrically connected to the touch sensor layer on the pad region of the touch sensor layer; a support structure covering the touch sensor layer on the curved region; and an optical layer disposed on the visual region of the touch sensor layer, the optical layer partially covering the support structure on the portion of the curved region adjacent to the visual region.

[0012] (2) The touch sensor module according to (1) above, wherein the touch sensor layer includes: a sensing electrode disposed on the visual area; and traces branching from the sensing electrode to extend to the curved area and the pad area.

[0013] (3) The touch sensor module according to (2) above, wherein the end of the trace is electrically connected to a flexible circuit board on the pad area.

[0014] (4) The touch sensor module according to (1) above, wherein the support structure includes a base layer and a support layer formed on the base layer, and the support layer includes an adhesive material.

[0015] (5) The touch sensor module according to (4) above, wherein the support structure extends to the pad area to partially cover the flexible circuit board.

[0016] (6) The touch sensor module according to (1) above further includes an adhesive layer formed on the bottom surface of a portion of the visual area of ​​the touch sensor layer.

[0017] (7) The touch sensor module according to (6) above further includes a lower support structure formed on the bottom surface of a portion of the touch sensor layer in the curved region.

[0018] (8) The touch sensor module according to (7) above, wherein the lower support structure includes a lower base layer and a lower support layer formed on the lower base layer and bonded to the bottom surface of the touch sensor layer, and the lower support layer includes an adhesive material.

[0019] (9) The touch sensor module according to (8) above, wherein the modulus of the lower base layer is greater than the modulus of the lower support layer.

[0020] (10) The touch sensor module according to (1) above, wherein the flexible circuit board includes: a core layer; an upper wiring formed on the top surface of the core layer; and a lower wiring formed on the bottom surface of the core layer.

[0021] (11) The touch sensor module according to (10) above, wherein the core layer of the flexible circuit board extends to the bending region, and a portion of the core layer in the bending region is provided as a support structure.

[0022] (12) The touch sensor module according to (11) above further includes: a conductive intermediate structure inserted between the flexible circuit board and the touch sensor layer.

[0023] (13) The touch sensor module according to (12) above, wherein the conductive intermediate structure extends over the bending region and the pad region, and the conductive intermediate structure is inserted between the support structure and the touch sensor layer over the bending region.

[0024] (14) The touch sensor module according to (1) above, wherein the optical layer includes at least one selected from the group consisting of a polarizing plate, a polarizer, a delay film, a reflective sheet, a brightness enhancement film and a refractive index matching film.

[0025] (15) A window stack structure, comprising: a window substrate; and a touch sensor module according to the above exemplary embodiment on the surface of the window substrate.

[0026] (16) An image display device, comprising: a display panel; and a touch sensor module on the display panel according to the above-illustrative embodiment.

[0027] (17) The image display device according to (16) above further includes a motherboard below the display panel, wherein the touch sensor layer of the touch sensor module and the flexible circuit board are bent together with the support structure at the bending area to be electrically connected to the motherboard.

[0028] A touch sensor module according to an embodiment of the present invention may include a support structure that partially covers the touch sensor layer and the flexible printed circuit board. When the touch sensor module is folded or bent, the support structure can prevent delamination of the flexible printed circuit board and also prevent damage to the sensing electrodes or traces in the bent area.

[0029] In some embodiments, the touch sensor module may further include an optical film disposed on the touch sensor layer. The optical film may cover, for example, the ends of a support structure in a bending region. Therefore, when bending stress is applied, the support structure can be prevented from being lifted and detached by the optical film.

[0030] In some implementations, an adhesive layer may be selectively formed only under a portion of the touch sensor layer in the visual region to maintain flexibility in the curved region, and additional structures such as a display panel may be incorporated in the visual region.

[0031] Touch sensor modules can be manufactured as substrate-free thin films and can be effectively applied to image display devices such as flexible displays. Attached Figure Description

[0032] Figure 1 This is a schematic cross-sectional view showing a touch sensor module according to an exemplary embodiment.

[0033] Figure 2 and Figure 3 This is a schematic top plan view illustrating a touch sensor layer according to an exemplary embodiment.

[0034] Figures 4 to 7 This is a schematic cross-sectional view illustrating a touch sensor module according to some exemplary embodiments.

[0035] Figure 8 This is a schematic diagram illustrating a window stacking structure and an image display device according to an exemplary embodiment.

[0036] Figure 9 This is a schematic cross-sectional view illustrating an image display device combined with a touch sensor module according to an exemplary embodiment. Detailed Implementation

[0037] According to an exemplary embodiment of the present invention, a touch sensor module is provided, which includes a touch sensor layer, an optical layer, a flexible circuit board and an adhesive structure, and has improved mechanical and electrical stability.

[0038] According to an exemplary embodiment of the present invention, a window stack structure including a touch sensor module and an image display device are also provided.

[0039] The invention will now be described in detail with reference to the accompanying drawings. However, those skilled in the art will understand that such embodiments described with reference to the drawings are provided to further understand the spirit of the invention and do not limit the subject matter to be protected as disclosed in the detailed specification and appended claims.

[0040] In the accompanying drawings, for example, two directions parallel to the top surface of the touch sensor layer and perpendicular to each other are defined as a first direction and a second direction. For example, the first direction may correspond to the length direction of the touch sensor module and the second direction may correspond to the width direction of the touch sensor module. Additionally, a direction perpendicular to the first and second directions may be defined as a third direction. For example, the third direction may correspond to the thickness direction of the touch sensor module.

[0041] Figure 1 This is a schematic cross-sectional view showing a touch sensor module according to an exemplary embodiment.

[0042] Reference Figure 1The touch sensor module may include a touch sensor layer 100, an optical layer 150 disposed on the touch sensor layer 100, and a flexible circuit board 160. The touch sensor module may also include a support structure 170, which partially covers the flexible circuit board 160 and the touch sensor layer 100.

[0043] The touch sensor layer 100 may include, for example, a base insulating layer and sensing electrodes and traces formed on the base insulating layer. (See reference...) Figure 2 and Figure 3 The components and structure of the touch sensor layer 100 are described in more detail.

[0044] The touch sensor layer 100 or touch sensor module may include a visual region VA, a curved region BA, and a pad region PA. The visual region VA may include the central region of the touch sensor layer 100, and the pad region PA may be located at one end of the touch sensor layer 100. The curved region BA may be located between the visual region VA and the pad region PA.

[0045] The visual area VA may include, for example, the display area of ​​an image display device or an active area that can sense user touch.

[0046] A flexible printed circuit board (FPCB) 160 may be disposed on a portion of the touch sensor layer 100 in the pad area PA and may be electrically connected to traces included in the touch sensor layer 100. In an embodiment, the pad portions formed at the ends of the traces and the circuit wiring included in the flexible circuit board 160 may be electrically connected to each other via a conductive intermediate structure 168 such as an anisotropic conductive film (ACF).

[0047] The flexible circuit board 160 may include a core layer 165 comprising, for example, a resin or liquid crystal polymer, and circuit wiring printed on the core layer 165. The circuit wiring may include upper wiring 164 and lower wiring 162, which are formed on the upper and lower surfaces of the core layer 165, respectively. The flexible circuit board 160 may also include an upper cover film and a lower cover film covering the upper wiring 164 and the lower wiring 162, respectively.

[0048] For example, a portion of the lower cover film can be removed to expose a portion of the lower wiring 162, which can be bonded to the conductive intermediate structure 168.

[0049] The touch sensor layer 100 may further include a passivation layer that protects the sensing electrodes and traces. In this case, a portion of the passivation layer formed in the pad area PA connected to the flexible circuit board 160 may be removed.

[0050] The support structure 170 can be formed on or attached to the flexible circuit board 160 in the pad area PA, and can extend to the bending area BA to partially cover the touch sensor layer 100. Therefore, the support structure 170 can jointly or partially cover the ends of the touch sensor layer 100 and the flexible circuit board 160.

[0051] In some implementations, the support structure 170 can substantially completely cover the curved area BA.

[0052] The support structure 170 can be used as a protective pattern to prevent damage to the sensing electrodes and traces, such as delamination, cracks, etc., caused when the flexible circuit board 160 is separated, folded or bent due to external stress in the bending region BA.

[0053] The support structure 170 may have a multi-layer structure. For example, the support structure 170 may include a base layer 172 and a support layer 174 formed on the surface of the base layer 172. The support layer 174 may include, for example, acrylic, silicone, urethane and / or rubber-based adhesive materials, and may jointly hold the flexible circuit board 160 and the touch sensor layer 100 in the bending region BA and the pad region PA.

[0054] The substrate layer 172 may include a polymer material having a greater modulus or elasticity than that of the support layer 174. For example, the substrate layer 172 may include a polymer film comprising cyclic olefin polymers (COP), polyethylene terephthalate (PET), polyacrylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyphenylene sulfide (PPS), polyallyl compounds, polyimide (PI), polyurethane (PU), cellulose acetate propionate (CAP), polyethersulfone (PES), cellulose triacetate (TAC), polycarbonate (PC), cyclic olefin copolymers (COC), polymethyl methacrylate (PMMA), etc.

[0055] For example, the support structure 170 may be strip-shaped, including a support layer 174 formed by applying an adhesive material to the base layer 172.

[0056] The touch sensor module may further include an optical layer 150. The optical layer 150 may include film or layer structures well-known in the art for improving image visibility in image display devices. Non-limiting examples of the optical layer 150 may include polarizing plates, polarizers, retardation films, reflective sheets, brightness-enhancing films, refractive index matching films, etc. These may be used individually or in a multilayer structure.

[0057] In an exemplary embodiment, the optical layer 150 may be located at substantially the same layer or the same level as the support structure 170, and may cover the visual area VA of the touch sensor layer 100.

[0058] In an exemplary embodiment, the end of the optical layer 150 may extend onto the support structure 170 formed in the curved region BA. Therefore, the ends of the optical layer 150 and the support structure 170 may overlap each other.

[0059] The optical layer 150 may extend partially into the bending region BA to hold the end of the support structure 170, thereby preventing the end of the support structure 170 from being lifted or peeled off when the touch sensor layer 100 is bent.

[0060] In some embodiments, the adhesive layer for bonding the optical layer 150 may be further formed at the visual layer VA on the top surface of the touch sensor layer 100.

[0061] An adhesive layer 80 may be formed on the bottom surface of the touch sensor layer 100 in the visual region VA. In an exemplary embodiment, the adhesive layer 80 may be formed in the visual region VA and may not extend into the bending region BA. Therefore, additional structures such as a display panel may be incorporated in the visual region VA while facilitating bending operations in the bending region BA.

[0062] Figure 2 and Figure 3 This is a schematic top plan view illustrating a touch sensor layer according to an exemplary embodiment.

[0063] Reference Figure 2 The touch sensor layer 100 may include a substrate insulating layer 90 and sensing electrodes 110 and 120 and traces 130 and 135 disposed on the substrate insulating layer 90. In an exemplary embodiment, the sensing electrodes 110 and 120 may be arranged to operate via mutual capacitance. The substrate insulating layer 90 may serve as a base layer or support layer for forming the sensing electrodes 110 and 120 and the traces 130 and 135.

[0064] Sensing electrodes 110 and 120 may be arranged in the visual region VA of the touch sensor layer 100. In an exemplary embodiment, sensing electrodes 110 and 120 may include a first sensing electrode 110 and a second sensing electrode 120.

[0065] The first sensing electrode 110 can be arranged, for example, along a second direction (e.g., the width direction). Therefore, a row of first sensing electrodes extending along the second direction can be formed by a plurality of first sensing electrodes 110. The plurality of rows of first sensing electrodes can be arranged along a first direction.

[0066] In some embodiments, adjacent first sensing electrodes 110 in the second direction can be physically or electrically connected to each other via a connecting portion 115. For example, the connecting portion 115 can be integrally formed with the first sensing electrodes 110 at the same level as the first sensing electrodes 110.

[0067] The second sensing electrode 120 may be arranged along a first direction (e.g., the length direction). In some embodiments, the second sensing electrode 120 may each be physically separated into island-shaped unit electrodes. In this case, adjacent second sensing electrodes 120 in the first direction may be electrically connected to each other via bridging electrodes 125.

[0068] Multiple second sensing electrodes 120 can be connected to each other via bridging electrodes 125 and can be arranged in a first direction to form a row of second sensing electrodes extending in the first direction. Furthermore, multiple rows of second sensing electrodes can be arranged along a second direction.

[0069] The sensing electrodes 110 and 120 and / or the bridging electrode 125 may comprise metals, alloys, or transparent conductive oxides.

[0070] For example, sensing electrodes 110 and 120 and / or bridging electrode 125 may be formed of silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), tin (Sn), zinc (Zn), molybdenum (Mo), calcium (Ca), or alloys thereof (e.g., silver-palladium-copper (APC) alloy or copper-calcium (CuCa) alloy). These may be used individually or in combination.

[0071] The sensing electrodes 110 and 120 and / or the bridging electrode 125 may include transparent conductive oxides, such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium zinc tin oxide (IZTO), cadmium tin oxide (CTO), etc.

[0072] In some embodiments, sensing electrodes 110 and 120 and / or bridging electrode 125 may have a multilayer structure including a transparent conductive oxide layer and a metal layer. For example, sensing electrodes 110 and 120 and / or bridging electrode 125 may have a three-layer structure of a transparent conductive oxide layer-metal layer-transparent conductive oxide layer. In this case, flexibility can be improved and resistance can be reduced through the metal layer, while corrosion resistance and transparency can be improved through the transparent conductive oxide layer.

[0073] In some embodiments, the bridging electrode 125 may be formed on an insulating layer (not shown). The insulating layer may at least partially cover the connection portion 115 included in the first sensing electrode 110, and at least partially cover the second sensing electrode 120 surrounding the connection portion 115. The bridging electrode 125 may penetrate the insulating layer and may be electrically connected to the second sensing electrodes 120 adjacent to each other, with the connection portion 115 inserted therebetween.

[0074] The insulating layer may include inorganic insulating materials such as silicon oxide or silicon nitride, or organic insulating materials such as acrylic resins or siloxane resins.

[0075] Traces 130 and 135 may include a first trace 130 extending from each first row of sensing electrodes and a second trace 135 extending from each second column of sensing electrodes.

[0076] like Figure 2 As shown, traces 130 and 135 can extend from the periphery of the visual region VA and are collected in the pad region PA via the curved region BA.

[0077] For example, the first trace 130 may branch from each first sensing electrode row from two lateral portions of the touch sensor layer 100 and may extend in a first direction. The first trace 130 may bend upon entering the bending region BA to extend in a second direction. The first trace 130 may again bend in the first direction to extend in the pad region PA in the first direction.

[0078] In some embodiments, the first traces 130 may be alternately distributed on two lateral portions of the touch sensor layer. The first traces 130 may be uniformly distributed on the two lateral portions of the touch sensor layer, so that the stress generated during the bending operation described below can be uniformly distributed. Additionally, the first traces 130 may be alternately arranged on the two lateral portions, thereby increasing the alignment margin between adjacent first traces 130.

[0079] The second trace 135 may branch from each of the second sensing electrode rows and may extend in the bending region BA in a second direction. The second trace 135 may be bent again in the first direction to extend to the pad region PA in the first direction.

[0080] The ends of traces 130 and 135 can be used as pad portions that can be collected in the pad area PA and electrically connected to the flexible circuit board 160. The first pad portion 140 and the second pad portion 145 can be defined by the ends of the first trace 130 and the second trace 135 respectively and can be disposed in the pad area PA.

[0081] Traces 130 and 135 may include conductive materials that are substantially the same as or similar to the conductive materials of sensing electrodes 110 and 120.

[0082] In an exemplary embodiment, the flexible circuit board 160 may be electrically connected to pad portions 140 and 145 on the pad region PA. In some embodiments, a conductive intermediate structure 168, such as an anisotropic conductive film (ACF), may be disposed between the flexible circuit board 160 and the pad portions 140 and 145.

[0083] For reference Figure 1 As described, the support structure 170 can jointly cover the curved area BA and the pad area PA in a plan view. The support structure 170 can enhance the adhesion between the flexible circuit board 160 and the touch sensor layer 100, thereby preventing mechanical failures such as separation or breakage of the flexible circuit board 160 and / or traces 130 and 135.

[0084] As described above, the optical layer 150 can cover the visual area VA and can extend to the bending area BA to cover the end of the support structure 170. Therefore, the end of the support structure 170 can be prevented from being lifted or peeled off when bent.

[0085] Reference Figure 3 The sensing electrodes 127 and traces 137 of the touch sensor layer can be arranged to be operable in a self-capacitance type.

[0086] The touch sensor layer may include sensing electrodes 127, each of which may be arranged in an independent island pattern. Additionally, traces 137 may branch from each sensing electrode 127 to extend to a pad area PA. The ends of the traces 137 may be collected in the pad area PA and may be electrically connected to the flexible circuit board 160.

[0087] As described above, the support structure 170 can collectively cover the touch sensor layer 100 and the flexible circuit board 160 on the pad area PA and the curved area BA. Additionally, the optical layer 150 and the support structure 170 can overlap on the portion of the curved area BA adjacent to the visual area VA.

[0088] Figures 4 to 7 This is a schematic cross-sectional view illustrating a touch sensor module according to some exemplary embodiments. (Regarding references...) Figure 1 Detailed descriptions of those substantially the same or similar elements and / or structures are omitted here.

[0089] Reference Figure 4 The lower support structure 85 can be combined with the bottom surface of a portion of the touch sensor layer 100 in the curved region BA and the pad region PA.

[0090] In some embodiments, the lower support structure 85 may have substantially the same or similar elements and structures as the support structure 170. For example, the lower support structure 85 may include a lower base layer 81 and a lower support layer 83, the lower support layer 83 including an adhesive material, and the lower support layer 83 may be attached to the bottom surface of the touch sensor layer 100.

[0091] An adhesive layer 80 can be formed on the bottom surface of the touch sensor layer 100 in the visual region VA, and a lower support layer 85 can be formed on the bottom surface of the bending region BA. Therefore, bending stability can be enhanced by the lower support layer 85 with an improved modulus, and additional structures such as a display panel can be bonded by the adhesive layer 80.

[0092] Reference Figure 5 The touch sensor module can be combined with the display panel 200 using the adhesive layer 80 in the visual area VA.

[0093] In some implementations, such as reference Figure 4 The lower support structure 85 can be formed below the touch sensor layer 100 in the curved region BA and the pad region PA.

[0094] Reference Figure 6 A portion of the flexible circuit board 160 can be essentially used as a support structure.

[0095] In an exemplary embodiment, the core layer 165 included in the flexible circuit board 160 may selectively extend to the bending region BA to serve as a support structure to protect the touch sensor layer 100.

[0096] In some embodiments, a conductive intermediate structure 168 (e.g., ACF) disposed beneath the flexible circuit board 160 may also extend to the bending region BA to be inserted between the touch sensor layer 100 and the core layer 165. Thus, the core layer 165 can be stably attached to the bending region BA via the conductive intermediate structure 168, and the traces 130 and 135 in the bending region BA can be protected.

[0097] In the portion of the curved region BA adjacent to the visual region VA, the optical layer 150 may cover the end of the core layer 165.

[0098] As described above, the core layer 165 and conductive intermediate structure 168 of the flexible circuit board 160 can extend to the bending region BA, thereby further protecting and supporting the traces with virtually no additional structure.

[0099] refer to Figure 7 For reference Figure 4The lower support structure 85 can be bonded to the bottom surface of the touch sensor layer 100 in the curved region BA and the pad region PA. The lower support structure 85 may include a lower base layer 81 and a lower support layer 83 including an adhesive material, and the lower support layer 83 may be attached to the bottom surface of the touch sensor layer 100.

[0100] Therefore, a support effect can be provided by the core layer 165 of the flexible circuit board 160 above the touch sensor layer 100, and bending stability can be provided by the lower support structure 85 below the touch sensor layer 100.

[0101] For reference Figure 5 As described above, the display panel 200 can be bonded using the adhesive layer 80.

[0102] Figure 8 This is a schematic diagram illustrating a window stacking structure and an image display device according to an exemplary embodiment.

[0103] refer to Figure 8 The window stack structure 190 may include a window substrate 180 and a touch sensor module according to the exemplary embodiment described above. The touch sensor module may include, for example, reference... Figure 2 and Figure 3 The optical layer 150 and the touch sensor layer 100 are stacked on the visual region VA of the touch sensor layer 100. For ease of description, in Figure 8 The diagrams of the support structure 170 and the flexible circuit board 160 are omitted. See reference [link / reference]. Figure 9 To describe in more detail.

[0104] The window substrate 180 may include, for example, a hard coating or thin or ultra-thin glass (e.g., ultra-thin glass (UTG)). In one embodiment, a light-shielding pattern 185 may be formed on a peripheral portion of one surface of the window substrate 180. The light-shielding pattern 185 may include, for example, a color-printed pattern and may have a single-layer or multi-layer structure. The bezel portion or non-display area of ​​the image display device may be defined by the light-shielding pattern 185.

[0105] Optical layer 150 may include various optical films or optical structures included in the image display device. In some embodiments, optical layer 150 may include a coated polarizer or polarizing plate. A coated polarizer may include a liquid crystal coating that may include a cross-linked liquid crystal compound and a dichroic dye. In this case, optical layer 150 may include an alignment layer for providing the alignment of the liquid crystal coating.

[0106] For example, a polarizing plate may include a polyvinyl alcohol polarizer and a protective film attached to at least one surface of the polyvinyl alcohol polarizer.

[0107] The optical layer 150 can be directly attached to the surface of the window substrate 180, or it can be attached via the first adhesive layer 60.

[0108] The touch sensor layer 100 may be included in the window stack structure 190 in the form of a film or a panel. In one embodiment, the touch sensor layer 100 may be bonded to the optical layer 150 via a second adhesive layer 70.

[0109] like Figure 8 As shown, the window substrate 180, optical layer 150, and touch sensor layer 100 can be arranged sequentially from the viewer's side. In this case, the sensing electrodes of the touch sensor layer 100 can be disposed below the optical layer 150, which includes a polarizer or polarizing plate, thereby effectively preventing the viewer from seeing the electrode pattern.

[0110] The image display device may include a display panel 200 and a window stack structure 190 disposed on the display panel. The window stack structure 190 may include a touch sensor module according to an exemplary embodiment.

[0111] The display panel 200 may include a pixel electrode 210, a pixel limiting layer 220, a display layer 230, an opposing electrode 240, and an encapsulation layer 250 disposed on a panel substrate 205.

[0112] The panel substrate 205 may include a flexible resin material. In this case, the image display device may be a flexible display.

[0113] A pixel circuit including a thin-film transistor (TFT) can be formed on the panel substrate 205, and an insulating layer covering the pixel circuit can be formed. The pixel electrode 210 can be electrically connected to, for example, the drain electrode of the TFT on the insulating layer.

[0114] The pixel defining layer 220 can be formed on the insulating layer, and the pixel electrode 210 can be exposed through the pixel defining layer 220, thereby defining a pixel area. The display layer 230 can be formed on the pixel electrode 210, and the display layer 230 may include, for example, a liquid crystal layer or an organic light-emitting layer.

[0115] The counter electrode 240 can be disposed on the pixel defining layer 220 and the display layer 230. The counter electrode 240 can be used as a common electrode or cathode, for example, in an image display device. The encapsulation layer 250 can be disposed on the counter electrode 240 to protect the display panel 200.

[0116] For reference Figure 5The display panel 200 can be bonded to the touch sensor layer 100 via an adhesive layer 80. For example, the thickness of the adhesive layer 80 can be greater than the thickness of each of the first adhesive layer 60 and the second adhesive layer 70. At temperatures ranging from -20°C to 80°C, the viscoelasticity of the adhesive layer 80 can be about 0.2 MPa or less. In this case, noise from the display panel 200 can be blocked, and interface stress during bending can be reduced, thereby preventing damage to the window stack structure 190. In this embodiment, the viscoelasticity of the adhesive layer 80 can be in the range of about 0.01 MPa to about 0.15 MPa.

[0117] Figure 9 This is a schematic cross-sectional view showing an image display device combined with a touch sensor module according to an exemplary embodiment. For example, Figure 9 The drive circuit connection of the touch sensor module via a flexible circuit board is shown.

[0118] refer to Figure 9 The image display device includes a display panel 200 and a motherboard 300, and may include a touch sensor module according to the exemplary embodiment described above. The touch sensor module may include a touch sensor layer 100 and an optical layer 150 disposed on the visual area VA of the touch sensor layer 100.

[0119] For reference Figure 1 The bending can begin from the bending region BA of the touch sensor layer 100, and the bending can occur along a first direction in a third direction (e.g., the thickness direction of the image display device). Therefore, the pad portion of the trace included in the pad region PA can be electrically connected to the motherboard 300 via the flexible circuit board 160. The flexible circuit board 160 can be connected to, for example, bonding pads 350 formed on the bottom surface of the motherboard 300.

[0120] In this implementation, the ends of the touch sensor module or touch sensor layer 100 (e.g., pad areas PA and / or bent areas BA) can be bent by 180 degrees or more. Therefore, the ends can extend again in the first direction. The ends can face the non-bent portion of the touch sensor layer 100 in a third-party upward direction.

[0121] As described above, even under severe bending, the support structure 170 can secure the combination between the flexible circuit board 160 and the touch sensor layer 100, thereby suppressing breakage or separation of circuits, wiring, electrodes, etc. Furthermore, the optical layer 150 can cover and hold the ends of the support structure 170, thereby preventing the support structure 170 from detaching in the bending initiation region.

[0122] For example, in a touch sensor module according to an exemplary embodiment, trace breakage can be prevented even when the bending radius is 0.2R or greater. Preferably, the mechanical and operational reliability of the trace can be maintained even when the bending radius is 1R or greater.

Claims

1. A touch sensor module, comprising: The touch sensor layer includes a visual area, a curved area, and a pad area; A flexible circuit board is electrically connected to the touch sensor layer in the pad area of ​​the touch sensor layer; A support structure covering the touch sensor layer on the curved area, wherein the support structure does not cover the visual area; and An optical layer is disposed on the visual area of ​​the touch sensor layer, the optical layer partially covering only one end portion of the support structure on the portion of the curved area adjacent to the visual area. The support structure and the optical layer are located on the same layer or at the same level.

2. The touch sensor module according to claim 1, wherein, The touch sensor layer includes: Sensing electrodes arranged on the visual area; and Traces branching from the sensing electrode and extending to the curved region and pad region.

3. The touch sensor module according to claim 2, wherein, The end of the trace is electrically connected to a flexible circuit board on the pad area.

4. The touch sensor module according to claim 1, wherein, The support structure includes a base layer and a support layer formed on the base layer, and the support layer includes an adhesive material.

5. The touch sensor module according to claim 4, wherein, The support structure extends to the pad area to partially cover the flexible circuit board.

6. The touch sensor module of claim 1, further comprising an adhesive layer formed on the bottom surface of the touch sensor layer in a portion of the visual area.

7. The touch sensor module of claim 6 further includes a lower support structure formed on the bottom surface of a portion of the touch sensor layer in a curved region.

8. The touch sensor module according to claim 7, wherein, The lower support structure includes a lower base layer and a lower support layer formed on the lower base layer and bonded to the bottom surface of the touch sensor layer, and the lower support layer includes an adhesive material.

9. The touch sensor module according to claim 8, wherein, The modulus of the lower base layer is greater than that of the lower support layer.

10. The touch sensor module according to claim 1, wherein, The flexible circuit board includes: a core layer; an upper wiring formed on the top surface of the core layer; and a lower wiring formed on the bottom surface of the core layer.

11. The touch sensor module according to claim 10, wherein, The core layer of the flexible circuit board extends to the bending region, and A portion of the core layer in the curved region is provided as a support structure.

12. The touch sensor module of claim 11 further includes a conductive intermediate structure inserted between the flexible circuit board and the touch sensor layer.

13. The touch sensor module according to claim 12, wherein, The conductive intermediate structure extends in the bending region and the pad region, and The conductive intermediate structure is inserted between the support structure and the touch sensor layer in the curved region.

14. The touch sensor module according to claim 1, wherein, The optical layer includes at least one selected from the group consisting of a polarizing plate, a polarizer, a retardation film, a reflective sheet, a brightness enhancement film, and a refractive index matching film.

15. A window stacking structure, comprising: Window substrate; and The touch sensor module according to claim 1 is located on the surface of the window substrate.

16. An image display device, comprising: Display panel; as well as The touch sensor module according to claim 1 on the display panel.

17. The image display device according to claim 16, further comprising a motherboard located below the display panel. in, The touch sensor layer and flexible circuit board of the touch sensor module are bent together with the support structure at the bending area to be electrically connected to the motherboard.

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