Nanoimprint method and device, electronic equipment and medium

Abstract

The embodiment of the invention discloses a nanoimprint method and device, electronic equipment and a medium. The method comprises the steps that a grating structure diagram is obtained; wherein the grating structure diagram comprises parameter information of each grating structure region in a plurality of grating structure regions; according to the parameter information of each grating structure area, the gluing thickness corresponding to the grating structure area is determined; and according to the gluing thickness corresponding to each grating structure area, spraying nano-imprinting glue on the corresponding grating structure area on the wafer by adopting an ink-jet printing process, and baking and imprinting the corresponding nano-imprinting glue.

Description

Technical Field

[0001] Embodiments of the present disclosure relate to the field of nanoimprint technology, and more specifically, to a nanoimprint method, a nanoimprint device, an electronic device, and a computer-readable storage medium. Background Art

[0002] The nanoimprint process is often used in the production of optical waveguide lenses. The current process route is to uniformly coat the nanoimprint glue on the surface of the wafer by spin coating. Moreover, in order to completely reproduce the grating structure on the template, the thickness of the spin-coated glue is usually greater than the grating structure height in the grating structure area. Therefore, the imprinted grating structure will not directly grow on the surface of the wafer, and there will be a thin layer formed by the excess glue material between the grating structure and the wafer (Wafer), and this thin layer is called the residual glue layer, such as Figure 3 the residual glue layer shown.

[0003] However, the spin coating process can only coat the glue evenly on the whole surface, resulting in serious waste of the glue material; moreover, since the designs of different grating structure areas are often inconsistent, the film thickness of the glue material on the surface of the wafer is the same after spin coating, which leads to inconsistent thickness of the residual glue layer after imprinting and seriously affects the optical performance of the optical waveguide lens. Summary of the Invention

[0004] The purpose of the embodiments of the present disclosure is to provide a nanoimprint method, device, electronic device, and medium.

[0005] According to the first aspect of the embodiments of the present disclosure, a nanoimprint method is provided, and the method includes:

[0006] Obtain a grating structure diagram; wherein, the grating structure diagram includes parameter information of each of the plurality of grating structure areas;

[0007] Determine the glue coating thickness corresponding to the grating structure area according to the parameter information of each grating structure area;

[0008] Spray nanoimprint glue on the corresponding grating structure area of the wafer by using an inkjet printing process according to the glue coating thicknesses respectively corresponding to the grating structure areas, and bake and imprint the corresponding nanoimprint glue.

[0009] Optionally, the parameter information includes the grating structure height and the duty cycle.

[0010] Optionally, the step of spraying nanoimprint glue on the corresponding grating structure area of the wafer by using an inkjet printing process according to the glue coating thicknesses respectively corresponding to the grating structure areas, and baking and imprinting the corresponding nanoimprint glue includes:

[0011] Determine the nozzle required for the inkjet printing process and the material of the nanoimprint glue;

[0012] Obtain the nozzle parameters of the nozzle and the waveform parameters during inkjet printing;

[0013] Under the waveform parameters and the nozzle parameters, use the nozzle to spray the nanoimprinting glue of the material with the coating thickness on the corresponding grating structure area on the wafer, and bake and imprint the sprayed nanoimprinting glue.

[0014] Optionally, the method further includes:

[0015] Adjust the printing parameters of the nozzle so that the nanoimprinting glue of the material with the coating thickness is sprayed on the corresponding grating structure area on the wafer;

[0016] Wherein, the printing parameters include the volume of the nanoimprinting glue sprayed by the nozzle and / or the printing resolution of the nozzle.

[0017] Optionally, the method further includes:

[0018] Adjust the printing resolution of the nozzle by means of skip printing and / or rotating the rotation angle of the nozzle;

[0019] Wherein, the skip printing is to print multiple times between the nozzle holes of the nozzle.

[0020] According to a second aspect of the embodiments of the present disclosure, a nanoimprinting device is provided, and the device includes:

[0021] An acquisition module, configured to acquire a grating structure diagram; wherein, the grating structure diagram includes parameter information of each of the multiple grating structure areas;

[0022] A determination module, configured to determine the coating thickness corresponding to the grating structure area according to the parameter information of each grating structure area;

[0023] A nanoimprinting module, configured to spray nanoimprinting glue on the corresponding grating structure area on the wafer by using an inkjet printing process according to the coating thicknesses respectively corresponding to the grating structure areas, and bake and imprint the corresponding nanoimprinting glue.

[0024] Optionally, the parameter information includes the grating structure height and the duty cycle.

[0025] Optionally, the nanoimprinting module is specifically configured to:

[0026] Determine the nozzle and the material of the nanoimprinting glue required for the inkjet printing process;

[0027] Obtain the nozzle parameters of the nozzle and the waveform parameters during inkjet printing;

[0028] Using the nozzle under the waveform parameters and the nozzle parameters, spray the nanoimprinting glue with the coating thickness on the corresponding grating structure area on the wafer, and bake and imprint the sprayed nanoimprinting glue.

[0029] According to a third aspect of the embodiments of the present disclosure, there is provided an electronic device, which includes:

[0030] A memory for storing executable computer instructions;

[0031] A processor for executing the nanoimprinting method according to the first aspect above under the control of the executable computer instructions.

[0032] According to a fourth aspect of the embodiments of the present disclosure, there is provided a computer-readable storage medium, on which computer instructions are stored, and when the computer instructions are run by a processor, the nanoimprinting method according to the first aspect above is executed.

[0033] One beneficial effect of the embodiments of the present disclosure is that it first obtains the parameter information of each grating structure area among multiple grating structure areas, then determines the coating thickness corresponding to the grating structure area according to the parameter information of each grating structure area, and then sprays nanoimprinting glue on the corresponding grating structure area on the wafer by using an inkjet printing process according to the coating thicknesses respectively corresponding to the grating structure areas, and bakes and imprints the corresponding nanoimprinting glue. That is to say, the inkjet printing process is used instead of the spin coating process, and nanoimprinting glue is only sprayed on demand in different grating structure areas respectively, which not only saves the glue material, but also can control the residual glue layers in different grating structure areas at the same level, thereby improving the optical performance of the optical waveguide lens.

[0034] Through the following detailed description of the exemplary embodiments of the present specification with reference to the accompanying drawings, other features and advantages of the present specification will become clear. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] The drawings incorporated in the specification and constituting a part of the specification illustrate the embodiments of the present specification, and together with the description are used to explain the principles of the present specification.

[0036] Figure 1 is a schematic diagram of the hardware configuration of an electronic device according to an embodiment of the present disclosure;

[0037] Figure 2 is a schematic flowchart of the nanoimprinting method according to an embodiment of the present disclosure;

[0038] Figure 3 is a schematic diagram of the structure of an optical waveguide lens;

[0039] Figure 4Schematic diagram of coating a nanoimprint resist according to the spin coating process in the prior art;

[0040] Figure 5 Schematic diagram of spraying a nanoimprint resist according to the inkjet printing process of an embodiment of the present disclosure;

[0041] Figure 6 Principle block diagram of a nanoimprint device according to an embodiment of the present disclosure;

[0042] Figure 7 Principle block diagram of an electronic device according to an embodiment of the present disclosure. Detailed implementation manners

[0043] Various exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. It should be noted that: Unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions and values set forth in these embodiments do not limit the scope of the embodiments of the present disclosure.

[0044] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way a limitation on the present disclosure, its application, or its use.

[0045] Technologies, methods, and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such technologies, methods, and devices should be regarded as part of the specification.

[0046] In all the examples shown and discussed here, any specific value should be construed as merely exemplary and not as a limitation. Therefore, other examples of the exemplary embodiments may have different values.

[0047] It should be noted that: Like reference numerals and letters denote like items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0048] <Hardware configuration>

[0049] Figure 1 Block diagram of the hardware configuration of an electronic device 1000 according to an embodiment of the present disclosure.

[0050] In one embodiment, the electronic device 1000 may be a server or a terminal device. Among them, the server may be an integrated server or a distributed server spanning multiple computers or computer data centers. The terminal device may be a portable computer, a desktop computer, a wearable device, etc., or any other device having a computing device such as a processor and a storage device such as a memory. This embodiment does not make any limitations in this regard.

[0051] Such as Figure 1As shown, the electronic device 1000 may include a processor 1100, a memory 1200, an interface device 1300, a communication device 1400, a display device 1500, an input device 1600, a speaker 1700, a microphone 1800, and so on.

[0052] The processor 1100 may be a mobile processor. The memory 1200 includes, for example, a ROM (Read Only Memory), a RAM (Random Access Memory), a non-volatile memory such as a hard disk, and so on. The interface device 1300 includes, for example, a USB interface, a headphone interface, and so on. The communication device 1400 can perform wired or wireless communication, for example. The communication device 1400 may include a short-range communication device, for example, any device that performs short-range wireless communication based on short-range wireless communication protocols such as the Hilink protocol, WiFi (IEEE 802.11 protocol), Mesh, Bluetooth, ZigBee, Thread, Z-Wave, NFC, UWB, LiFi, etc. The communication device 1400 may also include a long-range communication device, for example, any device that performs WLAN, GPRS, 2G / 3G / 4G / 5G long-range communication. The display device 1500 is, for example, a liquid crystal display screen, a touch display screen, and so on. The input device 1600 may include, for example, a touch screen, a keyboard, and so on. The electronic device 1000 can output audio information through the speaker 1700 and can collect audio information through the microphone 1800.

[0053] Although multiple devices are shown for the electronic device 1000 in Figure 1 , this disclosure may only relate to some of the devices. For example, the electronic device 1000 only relates to the memory 1200 and the processor 1100.

[0054] Applied to the embodiments of this disclosure, the memory 1200 of the electronic device 1000 is used to store instructions for controlling the processor 1100 to execute the nanoimprinting method provided in the embodiments of this disclosure.

[0055] In the above description, those skilled in the art can design instructions according to the solutions disclosed in this disclosure. How the instructions control the processor to operate is well known in the art and will not be described in detail here.

[0056] <Method Embodiment>

[0057] Figure 2 A nanoimprinting method according to an embodiment of this disclosure is shown. The nanoimprinting method can be implemented by the Figure 1 shown electronic device. As Figure 2 shown, the nanoimprinting method of this embodiment may include the following steps S2100 to step S2300:

[0058] As Figure 2As shown, the nanoimprinting method of this embodiment may include the following steps S2100 to S2300:

[0059] Step S2100, obtaining a grating structure diagram.

[0060] Wherein, the grating structure diagram includes parameter information of each of the plurality of grating structure regions.

[0061] Specifically, taking the grating structure coupling region, pupil expansion region, and coupling out region in the optical waveguide lens as examples, the grating structure diagram obtained by the electronic device includes parameter information of the coupling region, parameter information of the pupil expansion region, and parameter information of the coupling out region.

[0062] Wherein, the parameter information includes the grating structure height and the duty cycle. The duty cycle represents the ratio value between the transparent region and the opaque region in the corresponding grating structure region. Generally, the grating structure heights and duty cycles corresponding to different grating structure regions are different. Exemplarily, the grating structure diagram may include: the grating structure height of the coupling region is 100 nanometers, the duty cycle is A%, the grating structure height of the pupil expansion region is 200 nanometers, the duty cycle is B%, the grating structure height of the coupling out region is 300 nanometers, and the duty cycle is C%.

[0063] After performing step S2100 to obtain the grating structure diagram, enter:

[0064] Step S2200, determining the glue coating thickness corresponding to the grating structure region according to the parameter information of each of the grating structure regions.

[0065] In this embodiment, since the inconsistent grating structure height or duty cycle of different grating structure regions will result in inconsistent residual glue layer thicknesses of the imprinted grating structure regions, after the electronic device obtains the grating structure height and duty cycle of each grating structure region among the multiple grating structure regions, the glue coating thickness corresponding to the grating structure region can be calculated according to the grating structure height and duty cycle of each grating structure region, so as to spray nanoimprinting glue on the corresponding grating structure region of the wafer by using an inkjet printing process and bake and imprint the corresponding nanoimprinting glue in subsequent steps. That is to say, in order to accurately determine the glue coating thickness corresponding to the grating structure region, the glue coating thickness corresponding to the grating structure region is determined based on both the grating structure height and the duty cycle of the grating structure region.

[0066] In the related art, refer to Figure 4, taking the grating structure heights corresponding to the three grating structure regions as different, and the grating structure height of the coupling region 301 being 100 nanometers, the grating structure height of the pupil expansion region 302 being 200 nanometers, and the grating structure height of the coupling-out region 303 being 300 nanometers as an example. Since it uses the spin-coating method to uniformly coat the nanoimprinting glue on the wafer surface, that is, coating the glue evenly on the whole surface, it causes serious waste of the glue material. Moreover, in order to completely replicate the grating structure on the template, the thickness of the coated glue film usually needs to be greater than 300 nanometers, which makes the residual glue layer in the pupil expansion region more than 100 nanometers, and the thickness of the residual glue layer in the coupling region more than 200 nanometers. That is to say, the thicknesses of the residual glue layers in the three grating structure regions are inconsistent, which greatly reduces the optical performance of the optical waveguide lens.

[0067] In this embodiment, referring to Figure 5 , for example, the thickness of the coated glue corresponding to the coupling region 301 is 100 nanometers, the thickness of the coated glue corresponding to the pupil expansion region 302 is 200 nanometers, and the thickness of the coated glue corresponding to the coupling-out region 303 is 300 nanometers. Then, based on the subsequent steps, the inkjet printing process can be used to spray 100 nanometers of nanoimprinting glue on the coupling region of the wafer, spray 200 nanometers of nanoimprinting glue on the pupil expansion region of the wafer, and spray 300 nanometers of nanoimprinting glue on the coupling-out region of the wafer. That is, only spray the nanoimprinting glue on the grating structure regions, and do not spray the nanoimprinting glue on the non-grating structure regions, which saves the glue material; moreover, the thickness of the nanoimprinting glue sprayed on each grating structure region is determined according to the grating structure height and duty cycle of the grating structure region, realizing on-demand spraying of the nanoimprinting glue, and the residual glue layers in different grating structure regions can be controlled at the same level to improve the optical performance of the optical waveguide lens.

[0068] After performing step S2200 to determine the thickness of the coated glue corresponding to each of the grating structure regions according to the parameter information of each of the grating structure regions, enter:

[0069] Step S2300, according to the thickness of the coated glue corresponding to each of the grating structure regions, use the inkjet printing process to spray the nanoimprinting glue on the corresponding grating structure region of the wafer, and bake and imprint the corresponding nanoimprinting glue.

[0070] In an optional embodiment, this step S2300 of using the inkjet printing process to spray the nanoimprinting glue on the corresponding grating structure region of the wafer according to the thickness of the coated glue corresponding to each of the grating structure regions, and baking and imprinting the corresponding nanoimprinting glue can further include the following steps S2310 to step S2330:

[0071] Step S2310, determine the nozzle required for the inkjet printing process and the material of the nanoimprinting glue.

[0072] Among them, the material of the nanoimprinting glue is usually a resin material.

[0073] Step S2320, obtain the nozzle parameters of the nozzle and the waveform parameters during inkjet printing.

[0074] Among them, the nozzle parameters include, for example but not limited to, the number of nozzle holes and the nozzle hole pitch. Exemplarily, the number of nozzle holes is 12, that is, the nozzle includes 12 nozzle holes; the nozzle hole pitch is 1 mm, that is, the distance between any two nozzles is 1 mm.

[0075] Step S2330, use the nozzle to spray the nanoimprint resist of the material with the coating thickness on the corresponding grating structure area on the wafer under the waveform parameters and the nozzle parameters, and bake and imprint the sprayed nanoimprint resist.

[0076] In this step S2330, adjust the printing parameters of the nozzle so as to spray the nanoimprint resist of the material with the coating thickness on the corresponding grating structure area on the wafer.

[0077] Among them, the printing parameters include the volume of the nanoimprint resist sprayed by the nozzle and / or the printing resolution of the nozzle.

[0078] The volume of the nanoimprint resist sprayed by the nozzle above refers to the size of the nanoimprint resist sprayed by the nozzle.

[0079] The printing resolution of the nozzle above refers to the maximum number of dots that can be sprayed per inch in the horizontal and vertical directions when the nozzle sprays.

[0080] Optionally, the printing resolution of the nozzle can be adjusted by means of skip printing and / or rotating the rotation angle of the nozzle.

[0081] Among them, skip printing is to print multiple times between the nozzle holes of the nozzle to increase the printing density. For example, the distance between the nozzle holes in the nozzle is 1 mm, that is, the minimum spacing for one printing is 1 mm, and skip printing can be to print again at 0.5 mm, so that the density is doubled.

[0082] According to the embodiments of the present disclosure, it first obtains the parameter information of each grating structure area among multiple grating structure areas, then determines the coating thickness corresponding to the grating structure area according to the parameter information of each grating structure area, and then sprays nanoimprint resist on the corresponding grating structure area on the wafer according to the coating thicknesses respectively corresponding to the grating structure areas, and bakes and imprints the corresponding nanoimprint resist. That is to say, the inkjet printing process is used instead of the spin coating process, and nanoimprint resist is only sprayed on demand in different grating structure areas respectively, which not only saves the glue material, but also can control the residual glue layers in different grating structure areas at the same level, thereby improving the optical performance of the optical waveguide lens.

[0083] <Example>

[0084] Next, a nanoimprinting method of an example is shown. In this example, the nanoimprinting method includes:

[0085] Step S3100: Spray an adhesion promoter on the grating structure area of the wafer and perform baking.

[0086] Step S3200: Obtain the grating structure height and duty cycle of the coupling-in area, the grating structure height and duty cycle of the pupil-expansion area, and the grating structure height and duty cycle of the coupling-out area.

[0087] Step S3300: Determine the photoresist coating thickness of the coupling-in area according to the grating structure height and duty cycle of the coupling-in area, determine the photoresist coating thickness of the pupil-expansion area according to the grating structure height and duty cycle of the pupil-expansion area, and determine the photoresist coating thickness of the coupling-out area according to the grating structure height and duty cycle of the coupling-out area.

[0088] Step S3400: Determine the nozzle of the inkjet printing process and the material of the nanoimprinting photoresist.

[0089] Step S3500: Obtain the nozzle parameters of the nozzle and the waveform parameters during inkjet printing.

[0090] Step S3600: According to the photoresist coating thickness of the coupling-in area, use the nozzle to spray the nanoimprinting photoresist of the corresponding coating thickness of the material on the corresponding coupling-in area of the wafer under the waveform parameters and nozzle parameters; according to the photoresist coating thickness of the pupil-expansion area, use the nozzle to spray the nanoimprinting photoresist of the corresponding coating thickness of the material on the corresponding pupil-expansion area of the wafer under the waveform parameters and nozzle parameters; and, according to the photoresist coating thickness of the coupling-out area, use the nozzle to spray the nanoimprinting photoresist of the corresponding coating thickness of the material on the corresponding coating thickness of the wafer under the waveform parameters and nozzle parameters.

[0091] In this step S3600, the printing parameters of the nozzle can be adjusted to spray the nanoimprinting photoresist of the corresponding coating thickness of the material on the corresponding coupling-in area of the wafer; the printing parameters of the nozzle can be adjusted to spray the nanoimprinting photoresist of the corresponding coating thickness of the material on the corresponding pupil-expansion area of the wafer; and, the printing parameters of the nozzle can be adjusted to spray the nanoimprinting photoresist of the corresponding coating thickness of the material on the corresponding coupling-in area of the wafer.

[0092] Step S3700: After spraying, enter alignment and imprinting.

[0093] According to this example, the inkjet printing process not only enables the spraying of nanoimprint glue only in the coupling-in area, pupil expansion area, and coupling-out area, without spraying nanoimprint glue in the non-structural area, thus saving glue materials, but also the coating thickness of the nanoimprint glue sprayed in each grating structure area is determined according to the grating structure height and duty cycle of the grating structure area, realizing on-demand spraying of nanoimprint glue, and enabling the residual glue layers in different grating structure areas to be controlled at the same level, so as to improve the optical performance of the optical waveguide lens. For example, the thickness of the nanoimprint glue sprayed in the grating structure area with a high duty cycle is higher than that sprayed in the grating structure area with a low duty cycle; and for another example, the thickness of the nanoimprint glue sprayed in the grating structure area with a high structure height is higher than that sprayed in the grating structure area with a low structure height.

[0094] <Device Embodiment>

[0095] Figure 6 is a schematic diagram of the principle of a nanoimprint device according to an embodiment. Referring to Figure 6 as shown, the nanoimprint device 600 includes an acquisition module 610, a determination result 620, and a nanoimprint module 630.

[0096] The acquisition module 610 is used to acquire a grating structure diagram; wherein, the grating structure diagram includes parameter information of each of the grating structure areas in a plurality of grating structure areas;

[0097] The determination module 620 is used to determine the coating thickness corresponding to the grating structure area according to the parameter information of each of the grating structure areas;

[0098] The nanoimprint module 630 is used to spray nanoimprint glue with the corresponding coating thickness in the corresponding grating structure area on the wafer by using the inkjet printing process, and bake and imprint the corresponding nanoimprint glue.

[0099] In one embodiment, the parameter information includes the grating structure height and the duty cycle.

[0100] In one embodiment, the nanoimprint module 630 is specifically used for: determining the nozzle and the material of the nanoimprint glue required for the inkjet printing process; acquiring the nozzle parameters of the nozzle and the waveform parameters during inkjet printing; using the nozzle to spray the nanoimprint glue of the material with the coating thickness in the corresponding grating structure area on the wafer under the waveform parameters and the nozzle parameters, and baking and imprinting the sprayed nanoimprint glue.

[0101] In one embodiment, the nanoimprint module 630 is specifically used for: adjusting the printing parameters of the nozzle so as to spray the nanoimprint glue of the material with the coating thickness in the corresponding grating structure area on the wafer;

[0102] Among them, the inkjet printing parameters include the volume of the nanoimprinting glue sprayed by the nozzle and / or the printing resolution of the nozzle.

[0103] In one embodiment, the printing resolution of the nozzle is adjusted by skipping printing and / or rotating the rotation angle of the nozzle.

[0104] Among them, the skipping printing is to print multiple times between the nozzle holes of the nozzle.

[0105] According to an embodiment of the present disclosure, first, parameter information of each grating structure region among multiple grating structure regions is obtained, then, according to the parameter information of each grating structure region, the glue coating thickness corresponding to the grating structure region is determined. Furthermore, according to the glue coating thicknesses respectively corresponding to each grating structure region, an inkjet printing process is used to spray nanoimprinting glue on the corresponding grating structure region of the wafer, and the corresponding nanoimprinting glue is baked and imprinted. That is to say, the inkjet printing process is used instead of the spin coating process, and nanoimprinting glue is only sprayed on demand in different grating structure regions respectively, which not only saves the glue material, but also can control the residual glue layers in different grating structure regions at the same level, thereby improving the optical performance of the optical waveguide lens.

[0106] <Device Embodiment>

[0107] Figure 7 is a schematic diagram of the hardware structure of an electronic device according to an embodiment. As Figure 7 shown, the electronic device 700 includes a processor 710 and a memory 720.

[0108] The memory 720 can be used to store executable computer instructions.

[0109] The processor 710 can be used to execute the nanoimprinting method according to the embodiment of the method of the present disclosure under the control of the executable computer instructions.

[0110] The electronic device 700 can be the electronic device 1000 as Figure 1 shown, or can also be a device with other hardware structures, which is not limited herein.

[0111] In another embodiment, the electronic device 700 can include the above nanoimprinting device 600.

[0112] In one embodiment, each module of the above nanoimprinting device 600 can be implemented by the processor 710 running computer instructions stored in the memory 720.

[0113] <Computer-readable Storage Medium>

[0114] Embodiments of the present disclosure also provide a computer-readable storage medium, on which computer instructions are stored, and when the computer instructions are run by a processor, the nanoimprinting method provided by the embodiments of the present disclosure is executed.

[0115] The present disclosure may be a system, a method, and / or a computer program product. The computer program product may include a computer-readable storage medium having thereon computer-readable program instructions for causing a processor to implement various aspects of the present disclosure.

[0116] A computer-readable storage medium may be a tangible device that can retain and store instructions for use by an instruction execution device. A computer-readable storage medium may be, for example, but is not limited to, an electrical storage device, a magnetic storage device, an optical storage device, an electromagnetic storage device, a semiconductor storage device, or any suitable combination of the foregoing. More specific examples (a non-exhaustive list) of the computer-readable storage medium include: a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), a static random access memory (SRAM), a portable compact disc read-only memory (CD-ROM), a digital versatile disc (DVD), a memory stick, a floppy disk, a mechanically encoded device such as a punch card or raised structures in grooves having instructions stored thereon, and any suitable combination of the foregoing. The computer-readable storage medium as used herein is not construed as being a transient signal per se, such as a radio wave or other freely propagating electromagnetic wave, an electromagnetic wave propagated through a waveguide or other transmission medium (e.g., an optical pulse through an optical fiber cable), or an electrical signal transmitted through a wire.

[0117] The computer-readable program instructions described herein may be downloaded from a computer-readable storage medium to respective computing / processing devices, or may be downloaded to an external computer or external storage device via a network, such as the Internet, a local area network, a wide area network, and / or a wireless network. The network may include copper transmission cables, optical fiber transmission, wireless transmission, routers, firewalls, switches, gateway computers, and / or edge servers. A network adapter card or network interface in each computing / processing device receives the computer-readable program instructions from the network and forwards the computer-readable program instructions for storage in a computer-readable storage medium in each computing / processing device.

[0118] The computer program instructions for performing the operations of the present disclosure may be assembly instructions, instruction set architecture (ISA) instructions, machine instructions, machine-related instructions, microcode, firmware instructions, state-setting data, or source code or object code written in any combination of one or more programming languages, including object-oriented programming languages such as Smalltalk, C++, etc., and conventional procedural programming languages such as the "C" language or similar programming languages. The computer-readable program instructions may be executed entirely on the user's computer, partially on the user's computer, executed as a stand-alone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or, alternatively, may be connected to an external computer (e.g., through the Internet using an Internet service provider). In some embodiments, by using the state information of the computer-readable program instructions to customize an electronic circuit, such as a programmable logic circuit, a field-programmable gate array (FPGA), or a programmable logic array (PLA), the electronic circuit can execute the computer-readable program instructions to implement various aspects of the present disclosure.

[0119] Aspects of the present disclosure are described herein with reference to the flowchart and / or block diagram of methods, apparatus (systems), and computer program products according to embodiments of the present disclosure. It should be understood that each block of the flowchart and / or block diagram, and the combinations of blocks in the flowchart and / or block diagram, can be implemented by computer-readable program instructions.

[0120] These computer-readable program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing apparatus to produce a machine such that the instructions, when executed by the processor of the computer or other programmable data processing apparatus, create a means for implementing the functions / acts specified in one or more blocks of the flowchart and / or block diagram. These computer-readable program instructions can also be stored in a computer-readable storage medium, which instructions cause a computer, a programmable data processing apparatus, and / or other devices to operate in a particular manner, such that the computer-readable medium storing the instructions comprises a manufacture, which includes instructions for implementing various aspects of the functions / acts specified in one or more blocks of the flowchart and / or block diagram.

[0121] Computer-readable program instructions may also be loaded onto a computer, other programmable data processing apparatus, or other device, causing a series of operational steps to be performed on the computer, other programmable data processing apparatus, or other device to produce a computer-implemented process such that the instructions executed on the computer, other programmable data processing apparatus, or other device implement the functions / acts specified in one or more boxes of the flowchart and / or block diagram.

[0122] The flowcharts and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of the present disclosure. In this regard, each block in the flowchart or block diagram may represent a module, a segment of code, or a portion of an instruction, which contains one or more executable instructions for implementing the specified logical function. In some alternative implementations, the functions noted in the blocks may occur out of the order noted in the figures. For example, two consecutive blocks may in fact be executed substantially in parallel, or they may sometimes be executed in the reverse order, depending upon the functionality involved. It should also be noted that each block of the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, can be implemented by special purpose hardware-based systems that perform the specified functions or acts, or by combinations of special purpose hardware and computer instructions. It is well known to those skilled in the art that implementation by hardware, implementation by software, and implementation by a combination of software and hardware are equivalent.

[0123] The embodiments of the present disclosure have been described above. The above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The choice of terms used herein is intended to best explain the principles of the embodiments, the practical application, or improvements made to the technology in the market, or to enable other ordinary skilled persons in the art to understand the embodiments disclosed herein. The scope of the present disclosure is defined by the appended claims.

Claims

1. A nanoimprinting method, characterized in that, the method comprises: obtaining a grating structure diagram; wherein, the grating structure diagram includes parameter information of each of the plurality of grating structure regions; determining the coating thickness corresponding to each grating structure region according to the parameter information of each grating structure region; spraying a nanoimprinting adhesive on the corresponding grating structure region on the wafer by using an inkjet printing process according to the coating thicknesses respectively corresponding to the grating structure regions, and baking and imprinting the corresponding nanoimprinting adhesive.

2. The method according to claim 1, characterized in that, the parameter information includes the grating structure height and the duty cycle.

3. The method according to claim 1, characterized in that, the step of spraying a nanoimprinting adhesive on the corresponding grating structure region on the wafer by using an inkjet printing process according to the coating thicknesses respectively corresponding to the grating structure regions, and baking and imprinting the corresponding nanoimprinting adhesive includes: determining the nozzle and the material of the nanoimprinting adhesive required for the inkjet printing process; obtaining the nozzle parameters of the nozzle and the waveform parameters during inkjet printing; spraying the nanoimprinting adhesive of the material with the coating thickness on the corresponding grating structure region on the wafer by using the nozzle under the waveform parameters and the nozzle parameters, and baking and imprinting the sprayed nanoimprinting adhesive.

4. The method according to claim 3, characterized in that, the method further comprises: adjusting the printing parameters of the nozzle so as to spray the nanoimprinting adhesive of the material with the coating thickness on the corresponding grating structure region on the wafer; wherein, the printing parameters include the volume of the nanoimprinting adhesive sprayed by the nozzle and / or the printing resolution of the nozzle.

5. The method according to claim 4, characterized in that, the method further comprises: adjusting the printing resolution of the nozzle by means of interlaced printing and / or rotating the rotation angle of the nozzle; wherein, the interlaced printing is to print multiple times between the nozzle orifices.

6. A nanoimprinting device, characterized in that, the device comprises: an obtaining module, configured to obtain a grating structure diagram; wherein, the grating structure diagram includes parameter information of each of the plurality of grating structure regions; a determining module, configured to determine the coating thickness corresponding to each grating structure region according to the parameter information of each grating structure region; a nanoimprinting module, configured to spray a nanoimprinting adhesive on the corresponding grating structure region on the wafer by using an inkjet printing process according to the coating thicknesses respectively corresponding to the grating structure regions, and bake and imprint the corresponding nanoimprinting adhesive.

7. The device according to claim 6, characterized in that, the parameter information includes the grating structure height and the duty cycle.

8. The device according to claim 6, characterized in that, the nanoimprinting module is specifically configured to: determine the nozzle and the material of the nanoimprinting adhesive required for the inkjet printing process; obtain the nozzle parameters of the nozzle and the waveform parameters during inkjet printing; Using the nozzle under the waveform parameters and the nozzle parameters, spray the nanoimprint resist of the material with the coating thickness on the corresponding grating structure area on the wafer, and bake and imprint the sprayed nanoimprint resist.

9. An electronic device, characterized in that, the electronic device includes: a memory for storing executable computer instructions; a processor for executing the nanoimprint method according to any one of claims 1-5 under the control of the executable computer instructions.

10. A computer-readable storage medium having computer instructions stored thereon, and when the computer instructions are run by a processor, the nanoimprint method according to any one of claims 1-5 is executed.

Images