Copper fiber porous network flow channel enhanced heat dissipation liquid cooling reinforcement case and processing method

Abstract

The invention relates to a copper fiber porous network flow channel enhanced heat dissipation liquid cooling reinforcement case and a processing method thereof. The case is formed by combining a metal weaving process, a copper fiber porous network sintering process and a copper-aluminum dissimilar metal combination process. The copper fiber porous network flow channel enhanced heat dissipation liquid cooling reinforcement case is provided with a flow channel with a high specific surface area, high porosity and a copper flow channel, and can generate a turbulent boundary layer with the Reynolds number of 10800 under the flow of 1L / min. According to the high-density copper fiber spiral network flow channel structure, a turbulent boundary layer can be generated under small flow, the specific surface area of a copper fiber porous network flow channel is far larger than that of a machining forming mode at the present stage, the copper flow channel is combined with the aluminum alloy box body, and the rapid heat transfer and heat dissipation performance is achieved; the device is suitable for severe environments with high power consumption, high integration level, limited cooling liquid flow and the like.

Description

Technical Field

[0001] The present invention relates to the field of, and particularly relates to a copper fiber porous network flow channel for enhancing heat dissipation of a liquid-cooled reinforced chassis and a processing method thereof. Background Art

[0002] Liquid-cooled reinforced computers have the advantages of low noise, high heat dissipation efficiency, small volume, etc., and are the preferred heat dissipation measures in the field of reinforced computers. The liquid-cooled heat dissipation methods mainly include flow channels, immersion, phase change type, etc. Among them, the flow channel type liquid cooling is the most widely used in the field of reinforced computers.

[0003] The heat dissipation mechanism of the liquid-cooled chassis is that the coolant flows through the flow channels of the box body, and the heat of the flow channel structure is carried away through interface heat conduction. Under the condition of the same flow rate, the heat dissipation capacity of the liquid-cooled reinforced chassis is closely related to the interface heat transfer coefficient, the flow channel material, the flow channel surface area, etc. Research shows that when the interface heat transfer coefficient in the turbulent state is higher than that in the laminar state, when the fluid Reynolds number is in the range of 4600-11200, the interface heat transfer coefficient is proportional to the 1.002 power of the Reynolds number; at the same time, the flow channel material directly affects the temperature uniformity of the liquid-cooled reinforced chassis. By increasing the thermal conductivity of the flow channel material, the heat dissipation capacity of the liquid-cooled reinforced chassis will be significantly improved; and the flow channel surface area is positively correlated with the heat dissipation of the liquid-cooled reinforced chassis. At present, the flow channel type liquid-cooled structure forms include S-shaped flow channels, 3D processed porous flow channels, etc. Among them, the processing method of the S-shaped flow channel is mainly CNC processing and welding forming. The cross-sectional area of its flow channel is mostly rectangular, circular, and there are fins locally added to the flow channel, etc., which has the advantages of low cost and short production cycle. The 3D processed porous flow channel can manufacture a special-shaped flow channel structure with a larger flow channel specific surface area (surface area / mass), and the heat dissipation efficiency is better than that of the S-shaped flow channel. At present, the above-mentioned liquid-cooled design methods have the following deficiencies:

[0004] a) The surface area of the S-shaped flow channel is small. The local fin specific surface area (surface area / mass) of the aluminum alloy liquid-cooled chassis is generally 0.001m 2 / kg, and the heat dissipation efficiency is relatively low;

[0005] b) The maximum specific surface area of the 3D processed porous flow channel is about 0.08m 2 / kg, and although the flow channel surface area is increased compared with the S-shaped flow channel, affected by the powder sintering process method, the surface area is still small, and metal powder sintering cannot achieve the combined molding of dissimilar metals, and high thermal conductivity and lightweight cannot be achieved simultaneously;

[0006] c) The fluid Reynolds number in the S-shaped flow channel is about 4200, and it has not fully entered the turbulent state, so the interface heat transfer coefficient is low. If the Reynolds number is increased, the flow rate needs to be increased, and the internal pressure of the flow channel will increase significantly, and the risk of damage and liquid leakage of the liquid-cooled reinforced chassis will further increase;

[0007] d) When processing porous channels by 3D printing, metal powder sintering is required, and it is impossible to achieve the combined forming of dissimilar metals. Moreover, the production cost and cycle are relatively high.

[0008] e) When processing porous channels by 3D printing, it is difficult to discharge the unsintered metal powder in the channels, and the production cost and cycle are relatively high.

[0009] In view of the above technical problems, the present invention provides a copper fiber porous network channel enhanced heat dissipation liquid-cooled reinforced chassis and a processing method. Summary of the Invention

[0010] The purpose of the present invention is to overcome the deficiencies of the prior art and provide a copper fiber porous network channel enhanced heat dissipation liquid-cooled reinforced chassis and a processing method, which have high specific surface area channels, high porosity, copper channels, and can generate a turbulent boundary layer with a Reynolds number of 10,800 at a flow rate of 1 L / min; a high-density copper fiber spiral network channel structure can generate a turbulent boundary layer at a relatively small flow rate. The specific surface area of its copper fiber porous network channel is much higher than the current processing and forming methods, and it realizes the combination of copper channels and aluminum alloy boxes, has fast heat transfer and dissipation performance, and is suitable for harsh environments such as high power consumption, high integration, and limited coolant flow.

[0011] The present invention solves its technical problems through the following technical solutions:

[0012] A copper fiber porous network channel enhanced heat dissipation liquid-cooled reinforced chassis includes a box body assembly, a front panel component, a fluid connector, and a rear panel component. The front panel component is installed at the front end of the box body assembly, and the rear panel component and the fluid connector are installed at the rear end of the box body assembly.

[0013] The box body assembly includes a box body frame, a copper fiber porous network channel, and covers respectively installed on the upper and lower surfaces of the box body frame. Flow channels are respectively made on the upper and lower surfaces of the box body frame, and the copper fiber porous network channels are respectively installed in the flow channels made on the upper and lower surfaces of the box body frame. The copper fiber porous network channel includes a single-layer copper fiber porous network and a copper connecting rod. A plurality of the single-layer copper fiber porous networks are connected by copper connecting rods to form a copper fiber porous network channel. A plurality of copper fiber porous network channels are placed in the flow channels, and the coolant flows through the flow channels and dissipates heat from the box body frame under the action of the plurality of copper fiber porous network channels.

[0014] Further, the flow channel is an S-shaped flow channel.

[0015] Further, the depth of the flow channel is 7 mm.

[0016] Further, the copper connecting rod is a red copper straight rod with a diameter of 0.8 mm and a length the same as that of the copper fiber porous network channel.

[0017] A processing method for a copper fiber porous network flow channel to strengthen heat dissipation of a liquid-cooled reinforced chassis, comprising the following steps:

[0018] Step 1, processing the box frame:

[0019] The box frame is formed by CNC machining. Flow channels are processed on the upper and lower surfaces of the box frame, and the surfaces of the flow channels are treated with a nickel plating process;

[0020] Step 2, processing the copper fiber porous network flow channel:

[0021] 1) Drawing copper wire into copper fiber;

[0022] 2) Generating a spiral structure for the copper fiber;

[0023] 3) Using the reverse spiral cross method to connect several spiral structures to form a single-layer copper fiber porous network;

[0024] 4) Sintering several single-layer copper fiber porous networks and copper connecting rods through a mold by a pre-pressure welding furnace sintering process to form a multi-layer copper fiber porous network:

[0025] (a) The mold is a ceramic mold. The mold includes an upper pressing block and a lower fixing part. The lower fixing part is a hollow structure, and several ventilation holes with a diameter of 2 mm are opened on the side walls at both ends;

[0026] (b) Placing the single-layer copper fiber porous network in the hollow structure of the lower fixing part;

[0027] (c) Placing the copper connecting rod in the gap at the upper end of the single-layer copper fiber porous network;

[0028] (d) Placing the single-layer copper fiber porous network on the upper end of the single-layer copper fiber porous network in (c), and the gap at its lower end matches the copper connecting rod placed in the gap at the upper end of the single-layer copper fiber porous network in (c);

[0029] (e) Repeating (d) can place several single-layer copper fiber porous networks;

[0030] (f) Filling the mold with ammonium chloride protective agent;

[0031] (g) Placing the upper pressing block on the lower fixing part, and several single-layer copper fiber porous networks and ammonium chloride protective agent are sealed in the mold;

[0032] (h) Placing the mold in (g) in a welding furnace. When sintering, filling helium gas in the welding furnace, adjusting the furnace temperature to 850 °C for sintering and forming, to form a multi-layer copper fiber porous network with an overall porosity of 85%, a specific surface area (surface area / mass) of 0.9 m 2 / kg and a thickness of 7 mm;

[0033] (i) After sintering is completed, clean the ammonium chloride protective agent in the middle of the multi-layer copper fiber porous network, and perform nickel plating process on the surface.

[0034] (5) Form a copper fiber porous network flow channel.

[0035] Step 3: Process the cover plate:

[0036] Perform nickel plating process on the inner surfaces of the cover plates facing the upper and lower surfaces of the box frame respectively.

[0037] Step 4: Weld and assemble the box assembly:

[0038] 1) Lay a bottom solder with a thickness of 2 mm on the flow channels where nickel plating process is performed in Step 1.

[0039] 2) Install the copper fiber porous network flow channels processed in Step 2 into the flow channels where the bottom solder is laid respectively.

[0040] 3) Place a top solder with a thickness of 1 mm on the upper surface of the copper fiber porous network flow channels, and the covering area of the top solder is the inner surface of the cover plate.

[0041] 4) Install the cover plates processed in Step 3 on the top ends of the top solder respectively.

[0042] 5) Place the assembled box assembly in a soldering furnace for overall soldering at a temperature of 200 °C.

[0043] Step 5: Install a front panel component at the front end of the box assembly processed in Step 4, and install a fluid connector and a rear panel component at the rear end; thus forming a copper fiber porous network flow channel enhanced heat dissipation liquid-cooled reinforced chassis.

[0044] Furthermore, the flow channels of the box frame in Step 1 are S-shaped flow channels, and the processing depth of the flow channels is 7 mm.

[0045] Furthermore, in Step 2, the diameter of the copper wire is 3 mm, the diameter of the copper fiber is 0.5 mm, the middle diameter of the generated spiral structure is 2 mm, the pitch is 1.5 mm, and the area of the formed single-layer copper fiber porous network is 8 cm × 8 cm and the thickness is 2.5 mm.

[0046] Furthermore, in Step 2, the copper connecting rod is a red copper straight rod, its diameter is 0.8 mm, and its length is the same as the length of the copper fiber porous network flow channel.

[0047] The advantages and positive effects of the present invention are:

[0048] 1. The present invention is applied to the processing of liquid-cooled chassis and liquid-cooled boards of various sizes, and is designed into 3U, 6U or non-standard sizes according to the usage requirements, taking into account the requirements of different working conditions, different usage environments, and different internal board modules for liquid-cooled chassis with high heat dissipation performance.

[0049] 2. The copper connecting rod of the present invention can not only ensure the structural connectivity between different copper fiber spiral structures in the single-layer network spiral network, but also connect adjacent single-layer copper fiber porous networks, so that after sintering, the entire copper fiber porous network flow channel is an interconnected integral structure, enabling heat to be smoothly transferred within the copper fiber porous network flow channel.

[0050] 3. The present invention seals a plurality of single-layer copper fiber porous networks and ammonium chloride protective agent in a mold through an upper pressing block and a lower fixing member, generating a certain pressure on the plurality of single-layer copper fiber porous networks and copper connecting rods to be sintered in the mold, ensuring good contact between the plurality of single-layer copper fiber porous networks and copper connecting rods.

[0051] 4. The material of the copper fiber porous network flow channel of the present invention is purple copper fiber, which enhances the thermal conductivity and temperature uniformity of the liquid-cooled chassis, enables the internal heat to be transferred to the coolant more quickly, and improves the heat dissipation efficiency of the liquid-cooled chassis; and after forming, it is a copper fiber porous network flow channel structure that adheres to each other, and all different holes are interconnected, and the porosity reaches 85%, ensuring smooth flow of the coolant.

[0052] 5. The specific surface area of the copper fiber porous network flow channel of the present invention is 0.9m 2 / kg, which significantly increases the surface area of contact between the coolant and the structure compared with the 3D processed porous flow channel and the S-shaped flow channel.

[0053] 6. The copper fiber porous network flow channel of the present invention can be produced at one time and cut according to the actual size of the flow channel of different liquid-cooled chassis, reducing the production cost.

[0054] 7. The inside of the copper fiber porous network flow channel of the present invention is a high-density copper fiber spiral structure, which can generate a turbulent boundary layer at a flow rate of 1L / min, and the Reynolds number can reach 10800, greatly improving the interfacial heat transfer coefficient between the liquid and the metal. By adjusting the density of the copper fiber porous network flow channel, the porosity and specific surface area are regulated to meet the requirements in different usage environments.

[0055] 8. The inner surface of the cover plate on the upper and lower surfaces of the box body frame of the present invention is subjected to a nickel plating process, and the aluminum alloy box body frame is formed by CNC machining. Flow channels are respectively machined on the upper and lower surfaces of the box body frame, and the surfaces of the flow channels are subjected to a nickel plating process. Using solder as the medium, at 200 °C, the copper fiber porous network flow channel and the aluminum alloy box body frame are fused into an integral whole, which can ensure the tight connection between the copper fiber porous network flow channel and the box body frame, realize the combination and molding of copper-aluminum dissimilar metals, complete the combination of the copper fiber porous network flow channel and the aluminum alloy box body, greatly reduce the thermal resistance of the heat conduction path, and simultaneously achieve high thermal conductivity and light weight of the liquid-cooled reinforced computer case.

[0056] 9. The copper fiber porous network flow channel enhanced heat dissipation liquid-cooled reinforced computer case of the present invention has a structural sequence of box body frame - bottom solder - copper fiber porous network flow channel - top solder - cover plate, realizing the combination and molding of copper-aluminum dissimilar metals. Through actual testing, under the same flow rate, the chip temperature rise of the copper fiber porous network flow channel enhanced heat dissipation liquid-cooled reinforced computer case is reduced by more than 8 °C compared with the traditional liquid-cooled reinforced computer case, and it is applicable to harsh environments with high heat flux density, high ambient temperature, and high device thermal sensitivity.

[0057] 10. The copper fiber porous network flow channel enhanced heat dissipation liquid-cooled reinforced computer case of the present invention has a porosity of 85% for the copper fiber porous network flow channel, and the specific surface area of the copper fiber porous network flow channel (copper fiber network surface area / copper fiber network mass) is 0.9 m 2 / kg, which is much higher than 0.08 m 2 / kg of the 3D processed porous flow channel. Moreover, the total area of the flow channel is 40 times that of the traditional S-shaped flow channel and 9 times that of the 3D processed porous flow channel. The Reynolds number can reach 10800 at a flow rate of 1 L / min, and the combination and molding of the copper fiber porous network flow channel and the aluminum alloy box body frame are realized. Through testing, under the same flow rate, the chip temperature rise is reduced by more than 8 °C compared with the traditional liquid-cooling method, and it is applicable to environments where high-power liquid-cooled reinforced computer cases are assembled, with high temperature and high requirements for heat dissipation indicators.

[0058] 11. The present invention combines the metal braiding process, the copper fiber porous network sintering process and the copper-aluminum dissimilar metal combination process, and has a copper fiber porous network flow channel enhanced heat dissipation liquid-cooled reinforced computer case with a high specific surface area flow channel, high porosity, copper flow channel, and capable of generating a turbulent boundary layer with a Reynolds number of 10800 at a flow rate of 1 L / min. Among them, the high-density copper fiber spiral network flow channel structure can generate a turbulent boundary layer at a relatively small flow rate. The specific surface area of its copper fiber porous network flow channel is much higher than the current processing and forming methods, and the combination of the copper flow channel and the aluminum alloy box body is realized, with fast heat transfer and dissipation performance, and is applicable to harsh environments such as high power consumption, high integration, and limited coolant flow rate. Description of the Drawings

[0059] Figure 1This is a three-dimensional view of the liquid-cooled reinforced chassis with a copper fiber porous network flow channel for enhancing heat dissipation according to the present invention;

[0060] Figure 2 is Figure 1 A partial enlarged schematic view of the cross-section of the copper fiber porous network flow channel;

[0061] Figure 3 This is an exploded schematic view of the box assembly of the liquid-cooled reinforced chassis with a copper fiber porous network flow channel for enhancing heat dissipation according to the present invention;

[0062] Figure 4 This is a schematic view of the box frame of the liquid-cooled reinforced chassis with a copper fiber porous network flow channel for enhancing heat dissipation according to the present invention;

[0063] Figure 5 This is a schematic view of the copper fiber porous network flow channel of the liquid-cooled reinforced chassis with a copper fiber porous network flow channel for enhancing heat dissipation according to the present invention;

[0064] Figure 6 This is a schematic view of the mold for the processing method of the liquid-cooled reinforced chassis with a copper fiber porous network flow channel for enhancing heat dissipation according to the present invention;

[0065] Figure 7 This is a schematic view of the cross-section of the copper fiber porous network flow channel according to the present invention;

[0066] In the figure:

[0067] 1 - box assembly, 2 - front panel component, 3 - fluid connector, 4 - rear panel component, 5 - box frame, 6 - top layer solder, 7 - bottom layer solder, 8 - copper fiber porous network flow channel, 9 - cover plate, 10 - single-layer copper fiber porous network, 11 - copper connecting rod, 12 - lower fixing part, 13 - upper pressing block, 14 - flow channel, 15 - ventilation hole, 16 - ammonium chloride protective agent. Detailed implementation manners

[0068] The present invention will be further described in detail below through specific embodiments. The following embodiments are only descriptive and not restrictive, and the protection scope of the present invention cannot be limited thereby.

[0069] Such as Figures 1 to 5 、 Figure 7As shown in the figure, a liquid-cooled reinforced chassis with a copper fiber porous network flow channel for enhanced heat dissipation includes a box body assembly 1, a front panel component 2, a fluid connector 3, and a rear panel component 4. The front panel component 2 is installed at the front end of the box body assembly 1, and the rear panel component 4 and the fluid connector 3 are installed at the rear end of the box body assembly 1. The box body assembly 1 includes a box body frame 5, a copper fiber porous network flow channel 8, and cover plates 9 respectively installed on the upper and lower surfaces of the box body frame 5. Flow channels 14 are respectively made on the upper and lower surfaces of the box body frame 5, and the copper fiber porous network flow channels 8 are respectively installed in the flow channels 14 made on the upper and lower surfaces of the box body frame 5. The flow channels 14 are S-shaped flow channels 14, and the depth of the flow channels 14 is 7 mm. The copper fiber porous network flow channel 8 includes a single-layer copper fiber porous network 10 and copper connecting rods 11. A number of single-layer copper fiber porous networks 10 are connected by copper connecting rods 11 to form a copper fiber porous network flow channel 8. The copper connecting rods 11 are red copper straight rods with a diameter of 0.8 mm and a length the same as that of the copper fiber porous network flow channel 8. A number of copper fiber porous network flow channels 8 are placed in the flow channels 14, and the coolant flows through the flow channels 14 and dissipates heat from the box body frame 5 under the action of the number of copper fiber porous network flow channels 8.

[0070] As Figures 1 to 7 shown, a processing method for a liquid-cooled reinforced chassis with a copper fiber porous network flow channel for enhanced heat dissipation includes the following steps:

[0071] Step 1: Process the box body frame 5:

[0072] The box body frame 5 is formed by CNC machining. Flow channels 14 are respectively machined on the upper and lower surfaces of the box body frame 5, and nickel plating process treatment is carried out on the surfaces of the flow channels 14. The flow channels 14 are S-shaped flow channels 14, and the machining depth of the flow channels 14 is 7 mm.

[0073] Step 2: Process the copper fiber porous network flow channel 8:

[0074] 1) Draw the copper wire into copper fibers; the diameter of the copper wire is 3 mm, and the diameter of the copper fiber is 0.5 mm;

[0075] 2) Generate a spiral structure for the copper fibers; the middle diameter is 2 mm and the pitch is 1.5 mm;

[0076] 3) Adopt the reverse spiral cross method to connect a number of spiral structures to form a single-layer copper fiber porous network 10; the area of the single-layer copper fiber porous network 10 is 8 cm × 8 cm and the thickness is 2.5 mm;

[0077] 4) Pass a number of single-layer copper fiber porous networks 10 and copper connecting rods 11 through a mold. The copper connecting rods 11 are red copper straight rods with a diameter of 0.8 mm and a length the same as that of the copper fiber porous network flow channel 8, and use a soldering furnace sintering process with pre-pressure to sinter and form a multi-layer copper fiber porous network 7:

[0078] (a) The mold is a ceramic mold, which includes an upper pressing block 13 and a lower fixing part 12. The lower fixing part 12 is of a hollow structure, and the size of the hollow structure matches the size of the copper fiber porous network flow channel 8. A number of ventilation holes with a diameter of 2 mm are provided on the side walls at both its left and right ends; the number of ventilation holes ensures that the temperature inside the mold is the same as that in the soldering furnace;

[0079] (b) Place the single-layer copper fiber porous network 10 in the hollow structure of the lower fixing part 12;

[0080] (c) Place the copper connecting rod 11 in the gap at the upper end of the single-layer copper fiber porous network 10;

[0081] (d) Place the single-layer copper fiber porous network 10 on the upper end of the single-layer copper fiber porous network 10 in (c), and the gap at its lower end matches the copper connecting rod 11 placed in the gap at the upper end of the single-layer copper fiber porous network 10 in (c);

[0082] (e) Repeat (d) to place a number of single-layer copper fiber porous networks 10;

[0083] (f) Fill the mold with ammonium chloride protective agent;

[0084] (g) Place the upper pressing block 13 on the lower fixing part 12, and a number of single-layer copper fiber porous networks 10 and ammonium chloride protective agent are sealed inside the mold;

[0085] (h) Place the mold in (g) in the soldering furnace. When sintering, fill the furnace with helium gas, adjust the temperature in the furnace to 850 °C for sintering and forming, to form a multi-layer copper fiber porous network 7 with a total porosity of 85%, a specific surface area (surface area / mass) of 0.9 m 2 / kg, and a thickness of 7 mm; filling the soldering furnace with helium gas can prevent the oxidation of copper fibers during the sintering process;

[0086] (i) After sintering, clean the ammonium chloride protective agent in the middle of the multi-layer copper fiber porous network 7, and perform nickel plating process treatment on the surface;

[0087] (5) Form the copper fiber porous network flow channel 8;

[0088] The copper connecting rod 11 can not only ensure the structural connectivity between different copper fiber spiral structures in the single-layer network spiral network 10, but also connect adjacent single-layer copper fiber porous networks 10, so that after sintering and forming, the entire copper fiber porous network flow channel 8 is an interconnected integral structure, which can enable heat to be smoothly transferred inside the copper fiber porous network flow channel 8.

[0089] A plurality of single-layer copper fiber porous networks 10 and ammonium chloride protective agents are sealed in a mold through an upper layer pressing block 13 and a lower layer fixing member 12, which generates a certain pressure on the plurality of single-layer copper fiber porous networks 10 and copper connecting rods 11 to be sintered in the mold, thereby ensuring good contact between the plurality of single-layer copper fiber porous networks 10 and the copper connecting rods 11.

[0090] The copper fiber porous network flow channel 8 is made of red copper fiber, which enhances the thermal conductivity and temperature uniformity of the liquid-cooled reinforced chassis, and can transfer internal heat to the coolant more quickly, thereby improving the heat dissipation efficiency of the liquid-cooled reinforced chassis; and after forming, it has a copper fiber porous network flow channel 8 structure that is adhered to each other, different holes are interconnected, and the porosity reaches 85%, ensuring smooth flow of the coolant.

[0091] The specific surface area of ​​the copper fiber porous network flow channel 8 is 0.9m 2 / kg, significantly increasing the surface area of ​​coolant contact with the structure compared to 3D processed porous flow channels and S-shaped flow channels.

[0092] The copper fiber porous network flow channel 8 can be produced in one go and cut according to the actual size of the flow channel of different liquid-cooled reinforced chassis, thereby reducing production costs.

[0093] The copper fiber porous network flow channel 8 has a high-density copper fiber spiral structure inside, which can generate a turbulent boundary layer at a flow rate of 1L / min, and the Reynolds number can reach 10800, greatly improving the interface heat transfer coefficient between the liquid and the metal. By adjusting the density of the copper fiber porous network flow channel 8, the porosity and specific surface area can be regulated to meet the needs of different use environments.

[0094] Step 3, processing the cover plate 9: performing nickel plating process on the inner surfaces of the cover plate 9 facing the upper and lower surfaces of the box frame 5 respectively.

[0095] Step 4: Welding and assembly of box assembly 1:

[0096] 1) Laying a bottom layer of solder 7 with a thickness of 2 mm on the flow channel 14 treated by the nickel plating process in step 1;

[0097] 2) installing the copper fiber porous network flow channels 8 processed in step 2 in the flow channels 14 where the bottom solder 7 is laid;

[0098] 3) A top layer of solder 6 with a thickness of 1 mm is placed on the upper surface of the copper fiber porous network flow channel 8, and the top layer of solder 6 covers the inner surface of the cover plate 9;

[0099] 4) Install the cover plates 9 processed in step 3 on the top of the top layer of solder 6 respectively;

[0100] 5) The assembled box assembly 1 is placed in a welding furnace for integral welding at a temperature of 200°C.

[0101] Step 5: Install the front panel component 2 at the front end of the box component 1 in Step 4, and install the fluid connector 3 and the rear panel component 4 at the rear end; thus forming a copper fiber porous network channel enhanced heat dissipation liquid-cooled and reinforced chassis.

[0102] The inner surfaces of the cover plates 9 on the upper and lower surfaces of the box frame 5 are subjected to nickel plating process, and the aluminum alloy box frame 5 is formed by CNC machining. Flow channels 14 are respectively machined on the upper and lower surfaces of the box frame 5, and the surfaces of the flow channels 14 are subjected to nickel plating process. Using soldering tin as the medium, at 200 °C, the copper fiber porous network channel 8 is fused with the aluminum alloy box frame 5 into an integral body, which can ensure the tight connection between the copper fiber porous network channel 8 and the box frame 5, realize the combination and molding of copper-aluminum dissimilar metals, complete the combination of the copper fiber porous network channel 8 and the aluminum alloy box frame 5, greatly reduce the thermal resistance of the heat conduction path, and simultaneously achieve the high thermal conductivity and light weight of the liquid-cooled and reinforced chassis.

[0103] The copper fiber porous network channel enhanced heat dissipation liquid-cooled and reinforced chassis has a structural sequence of box frame 5 - bottom layer soldering tin 7 - copper fiber porous network channel 8 - top layer soldering tin 6 - cover plate 9, realizing the combination and molding of copper-aluminum dissimilar metals. After actual testing, under the same flow rate, the chip temperature rise of the copper fiber porous network channel enhanced heat dissipation liquid-cooled and reinforced chassis is reduced by more than 8 °C compared with the traditional liquid-cooled and reinforced chassis, and it is applicable to harsh environments such as high heat flux density, high ambient temperature, and high device thermal sensitivity.

[0104] The processing method of the copper fiber porous network channel enhanced heat dissipation liquid-cooled and reinforced chassis includes wire drawing, fiber braided network forming, CNC machining, copper fiber porous network sintering, and tin brazing. The process is simpler and the forming rate is higher than the 3D forming method, has a larger specific surface area, lower economic cost, and the copper fiber porous network channel 8 is more likely to generate a turbulent boundary layer, which can improve the heat dissipation capacity of the liquid-cooled and reinforced chassis.

[0105] Since the internal pores of the copper fiber porous network channel 8 are interconnected, the density between copper fibers is large, and the entire copper fiber porous network channel 8 has a large specific surface area. When the coolant flows through the copper fiber porous network channel 8 of the porous fiber network channel, the coolant continuously frictions and collides with the circular copper fibers. Under the condition of a small flow rate, the fluid boundary layer can also reach the turbulent state, and the structure of the copper fiber porous network channel 8 made of copper fiber material enhances the overall heat dissipation capacity of the liquid-cooled and reinforced chassis.

[0106] For the copper fiber porous network channel enhanced heat dissipation liquid-cooled and reinforced chassis, the porosity of the copper fiber porous network channel 8 is 85%, and the specific surface area (copper fiber network surface area / copper fiber network mass) of the copper fiber porous network channel 8 is 0.9 m 2 / kg, which is much higher than 0.08 m of the 3D processed porous channel 2 / kg, and the total flow channel area is 40 times that of the traditional S-shaped flow channel and 9 times that of the 3D processed porous flow channel. The Reynolds number can reach 10,800 at a flow rate of 1 L / min, and the combined molding of the copper fiber porous network flow channel 8 and the aluminum alloy box frame 5 is achieved. After testing, the chip temperature rise is reduced by more than 8 °C compared with the traditional liquid cooling method under the same flow rate, and it is applicable to the environment of assembling high-power liquid-cooled reinforced chassis, high temperature, and high requirements for heat dissipation indicators.

[0107] The present invention is combined by a metal braiding process, a copper fiber porous network sintering process, and a copper-aluminum dissimilar metal bonding process, and has a high specific surface area flow channel, a high porosity, a copper flow channel, and a copper fiber porous network flow channel for strengthening heat dissipation of a liquid-cooled reinforced chassis that can generate a turbulent boundary layer with a Reynolds number of 10,800 at a flow rate of 1 L / min. Among them, the high-density copper fiber spiral network flow channel structure can generate a turbulent boundary layer at a relatively small flow rate. The specific surface area of its copper fiber porous network flow channel 8 is much higher than the current processing and forming methods, and the copper flow channel is combined with the aluminum alloy box body, having fast heat transfer and heat dissipation performance, and is applicable to harsh environments such as high power consumption, high integration, and limited coolant flow rate.

[0108] Although the embodiments and drawings of the present invention are disclosed for illustrative purposes, those skilled in the art can understand that various substitutions, changes, and modifications are possible without departing from the spirit and scope of the present invention and the appended claims. Therefore, the scope of the present invention is not limited to the content disclosed in the embodiments and drawings.

Claims

1. A copper fiber porous network flow channel enhanced heat dissipation liquid cooling reinforced chassis, characterized in that: The invention comprises a box assembly (1), a front panel component (2), a fluid connector (3) and a rear panel component (4), wherein the front panel component (2) is installed at the front end of the box assembly (1), and the rear panel component (4) and the fluid connector (3) are installed at the rear end of the box assembly (1); The box assembly (1) comprises a box frame (5), a copper fiber porous network flow channel (8), and a cover plate (9) respectively mounted on the upper and lower surfaces of the box frame (5); the upper and lower surfaces of the box frame (5) are respectively provided with flow channels (14), and the copper fiber porous network flow channel (8) is respectively mounted in the flow channels (14) respectively provided on the upper and lower surfaces of the box frame (5); the copper fiber porous network flow channel (8) comprises a single-layer copper fiber porous network (10) and a copper connecting rod (11), and a plurality of the single-layer copper fiber porous networks (10) are connected by the copper connecting rod (11) to form a copper fiber porous network flow channel (8); a plurality of copper fiber porous network flow channels (8) are placed in the flow channel (14), and a coolant flows through the flow channel (14) to dissipate heat from the box frame (5) under the action of the plurality of copper fiber porous network flow channels (8).

2. The copper fiber porous network flow channel enhanced heat dissipation liquid cooling reinforced chassis according to claim 1 is characterized by: The flow channel (14) is an S-shaped flow channel (14).

3. The copper fiber porous network flow channel enhanced heat dissipation liquid cooling reinforced chassis according to claim 1 is characterized by: The flow channel (14) has a depth of 7 mm.

4. The copper fiber porous network flow channel enhanced heat dissipation liquid cooling reinforced chassis according to claim 1, characterized in that: The copper connecting rod (11) is a red copper straight rod with a diameter of 0.8 mm and a length that is the same as the length of the copper fiber porous network flow channel (8).

5. A method for processing a copper fiber porous network flow channel for enhanced heat dissipation and liquid cooling for a reinforced chassis according to claim 1, characterized in that: The following steps are involved: Step 1: Processing the box frame (5): The box frame (5) is formed by CNC processing, and the flow channels (14) are processed on the upper and lower surfaces of the box frame (5), and the surface of the flow channels (14) is treated by nickel plating process; Step 2: Processing the copper fiber porous network flow channel (8): 1) Drawing copper wire into copper fiber; 2) Forming the copper fiber into a spiral structure; 3) connecting the plurality of spiral structures to each other by a reverse spiral crossing method to form a single-layer copper fiber porous network (10); 4) Passing a plurality of single-layer copper fiber porous networks (10) and copper connecting rods (11) through a mold, and sintering them using a pre-pressured welding furnace sintering process to form a multi-layer copper fiber porous network (7): (a) The mold is a ceramic mold, comprising an upper layer pressing block (13) and a lower layer fixing member (12), wherein the lower layer fixing member (12) is a hollow structure, and a plurality of ventilation holes with a diameter of 2 mm are opened on the side walls at the left and right ends; (b) placing a single-layer copper fiber porous network (10) in the hollow structure of the lower fixing member (12); (c) placing a copper connecting rod (11) in the gap at the upper end of the single-layer copper fiber porous network (10); (d) placing a single-layer copper fiber porous network (10) on the upper end of the single-layer copper fiber porous network (10) in (c), with the gap at the lower end thereof matching the copper connecting rod (11) placed in the gap at the upper end of the single-layer copper fiber porous network (10) in (c); (e) repeating (d) to place a plurality of single-layer copper fiber porous networks (10); (f) filling the mold with an ammonium chloride protective agent; (g) placing the upper laminate (13) on the lower fixture (12), and sealing a plurality of single-layer copper fiber porous networks (10) and an ammonium chloride protective agent in the mold; (h) The mold in (g) is placed in a welding furnace. During sintering, helium is filled in the welding furnace and the temperature in the furnace is adjusted to 850°C for sintering to form a mold with an overall porosity of 85% and a specific surface area (surface area / mass) of 0.9 m 2 / kg, a multilayer copper fiber porous network (7) with a thickness of 7 mm; (i) After sintering, the ammonium chloride protective agent in the middle of the multi-layer copper fiber porous network (7) is cleaned and a nickel plating process is performed on the surface; (5) forming a copper fiber porous network flow channel (8); Step 3: Processing the cover plate (9): A nickel plating process is performed on the inner surfaces of the cover plate (9) facing the upper and lower surfaces of the box frame (5); Step 4: Welding and assembly of the box assembly (1): 1) Laying a bottom layer of solder (7) with a thickness of 2 mm on the flow channel (14) treated with the nickel plating process in step 1; 2) installing the copper fiber porous network flow channels (8) processed in step 2 in the flow channels (14) on which the bottom solder (7) is laid; 3) A top layer of solder (6) with a thickness of 1 mm is placed on the upper surface of the copper fiber porous network flow channel (8), and the coverage area of ​​the top layer of solder (6) is the inner surface of the cover plate (9); 4) Installing the cover plates (9) processed in step 3 on the top of the top layer of solder (6); 5) placing the assembled box assembly (1) in a welding furnace for integral welding at a temperature of 200° C.; Step 5: Install the front panel component (2) at the front end of the box assembly (1) in step 4, and install the fluid connector (3) and the rear panel component (4) at the rear end; forming a copper fiber porous network flow channel to enhance the heat dissipation and liquid cooling of the reinforced chassis.

6. The method for processing a copper fiber porous network flow channel to enhance heat dissipation and liquid cooling to strengthen a chassis according to claim 5, characterized in that: In the step 1, the flow channel (14) of the box frame (5) is an S-shaped flow channel (14), and the processing depth of the flow channel (14) is 7 mm.

7. The method for processing a copper fiber porous network flow channel to enhance heat dissipation and liquid cooling to strengthen a chassis according to claim 5, characterized in that: In step 2, the diameter of the copper wire is 3 mm, the diameter of the copper fiber is 0.5 mm, the mean diameter of the generated spiral structure is 2 mm, the pitch is 1.5 mm, and the formed single-layer copper fiber porous network (10) has an area of ​​8 cm×8 cm and a thickness of 2.5 mm.

8. The method for processing a copper fiber porous network flow channel to enhance heat dissipation and liquid cooling to strengthen a chassis according to claim 5, characterized in that: The copper connecting rod (11) in step 2 is a straight copper rod with a diameter of 0.8 mm and a length the same as that of the copper fiber porous network flow channel (8).

Images