Optimization method of heat dissipation structure of motor controller and heat dissipation structure

Abstract

The invention discloses an optimization method of a heat dissipation structure of a motor controller and the heat dissipation structure, and relates to the technical field of cooling heat dissipation, and the optimization method comprises the steps: designing a physical simulation model of the heat dissipation structure based on initial influence factors; respectively determining change ranges of the influence factors; one influence factor is changed by adopting a control variable method, the influence of the change of the influence factor on the heat dissipation performance and energy consumption of the heat dissipation structure is analyzed, and an actual factor level table is generated; constructing an original orthogonal experiment group based on an orthogonal experiment; excluding experiment groups containing unreasonable influence parameters from the original orthogonal experiment groups to obtain an actual orthogonal experiment group; thermal simulation is carried out on the actual orthogonal experiment groups, and the highest temperature simulation result of the IGBT module and the static pressure difference simulation result of the radiator of each experiment group are obtained; according to all simulation results, determining influence factors with minimum comprehensive indexes of heat dissipation performance and energy consumption, and a combination of levels of the influence factors; according to the method, the performance of the designed heat dissipation structure can be effectively improved.

Description

Technical Field

[0001] The present invention relates to the technical field of cooling and heat dissipation, and particularly relates to an optimization method for a heat dissipation structure of a motor controller and a heat dissipation structure. Background Art

[0002] With the rapid development of automotive electrification, as one of the key components of electric vehicles, the stability and heat dissipation effect of motor controllers have become increasingly important. When designing a high-power motor controller as a driving component of an electric vehicle, it is necessary to fully consider issues such as its structure and heat dissipation. Because the IGBT, as its core component, has a very high heat generation density and will generate a large amount of heat. If effective heat dissipation cannot be achieved, it is extremely easy to burn out the IGBT module, which will ultimately affect the control performance and service life of the high-power motor controller.

[0003] The existing heat dissipation methods for electric vehicle motor controllers mainly include air-cooled heat dissipation and liquid-cooled heat dissipation. The air-cooled heat dissipation device is suitable for heat dissipation of small-capacity power modules, and the radiator efficiency is low, making it difficult to meet the heat dissipation requirements of high power density. The liquid-cooled heat dissipation device is suitable for larger-capacity power modules. One side plate surface of the liquid-cooled radiator is the installation surface, and the fluid conducts convective heat transfer inside the liquid-cooled radiator. Through reasonable flow channel design and turbulator design, a radiator structure with a small volume and light weight can be achieved, while increasing the heat transfer capacity.

[0004] However, in the design of the existing liquid-cooled heat dissipation structure, it is mostly designed in cooperation with the IGBT module based on the shape of the radiator or turbulator. Since there are many factors determining the heat dissipation effect of the heat dissipation structure, it is difficult to effectively make the heat dissipation structure reach the best heat dissipation effect by using this type of design method;

[0005] Chinese Patent with Publication No. CN114530646B discloses a power module with consistent temperature and its radiator design method. This method only compensates for the chip temperature rise caused by the coolant temperature rise by changing the parameters of the radiator turbulator, making the temperature of the power half-bridge composed of chips consistent, which is beneficial to improving the output performance of the power half-bridge. However, this method still does not consider relevant influencing factors such as the heat dissipation flow channel in the heat dissipation structure, resulting in the performance of the finally designed heat dissipation structure still unable to reach the best state. In addition, this method aims to improve the heat dissipation effect, and it considers less about the energy consumption of the radiator, and ultimately it is difficult to achieve the goal of a motor controller radiator with strong heat dissipation ability and low energy consumption.

[0006] Therefore, we propose a method that can improve the performance of the designed heat dissipation structure. Summary of the Invention

[0007] The purpose of the present invention is to provide an optimization method for a heat dissipation structure of a motor controller and a heat dissipation structure, which can effectively improve the performance of the designed heat dissipation structure.

[0008] The present invention is realized through the following technical solutions:

[0009] An optimization method for the heat dissipation structure of a motor controller, comprising:

[0010] Based on the influencing factors in the initial radiator, the influencing factors in the turbulator posts, and the coolant flow rate, design a physical simulation model of the heat dissipation structure;

[0011] Respectively determine the influencing factors in the radiator, the influencing factors in the turbulator posts, and the change range of the coolant flow rate;

[0012] Adopt the method of controlling variables to change one of the influencing factors, analyze the influence of the change of this influencing factor on the heat dissipation performance and energy consumption of the heat dissipation structure, and generate an actual factor level table;

[0013] Based on the orthogonal experiment, construct an original orthogonal experimental group according to the actual factor level table;

[0014] Exclude the experimental groups with unreasonable influencing parameters in the original orthogonal experimental group to obtain an actual orthogonal experimental group;

[0015] Conduct thermal simulation for the actual orthogonal experimental group to obtain the highest temperature simulation results of the IGBT module and the static pressure difference simulation results of the radiator for each experimental group;

[0016] According to all the simulation results, determine the influencing factor with the smallest comprehensive index of heat dissipation performance and energy consumption, and the combination of its levels.

[0017] Further, the influencing factors in the radiator include the substrate thickness of the radiator, the flow channel size parameters, the number of flow channels, the inlet and outlet diameters, and the partition thickness.

[0018] Further, the influencing factors in the turbulator posts include the shape, height, and arrangement form of the turbulator posts.

[0019] Further, the generation process of the actual factor level table specifically includes:

[0020] Establish control variable groups for each influencing factor, and conduct thermal simulations respectively under the simulation initial conditions of the same pressure, temperature, coolant type, and IGBT thermal power consumption;

[0021] For the simulation results, analyze the change amounts of the highest temperature of the IGBT module and the static pressure difference of the radiator when each influencing factor changes within its respective preset range;

[0022] Exclude the influencing factors for which both the change amount of the highest temperature of the IGBT module and the change amount of the static pressure difference of the radiator are less than 10% of the difference between the maximum and minimum values of their respective change amounts, and use the remaining influencing factors as the main influencing factors;

[0023] For each of the main influencing factors, an original factor level table is established;

[0024] When each of the main influencing factors varies within its respective preset range, levels that cause the maximum temperature of the IGBT module to exceed its allowable value or the static pressure difference of the radiator to be higher than the upper limit of the designed static pressure difference are excluded, and an actual factor level table is obtained.

[0025] Further, the process of determining the influencing factor with the smallest comprehensive index of heat dissipation performance and energy consumption and its combination of levels specifically includes:

[0026] The simulation results of each experimental group are normalized according to the following formula:

[0027]

[0028] where x′ represents the value after data normalization; x represents the original value; x min represents the minimum value of the data; x max represents the maximum value of the data;

[0029] For all experimental groups, the comprehensive performance index of the radiator is calculated according to the following formula respectively, and the experimental group with the smallest comprehensive performance value is selected as the structure and parameters with the best comprehensive performance index of heat dissipation and energy saving:

[0030] A = m 1 x 1 ′ + m 2 x 2 ′;

[0031] In the formula, A represents the comprehensive performance value of the radiator; m 1 , m 2 represent weights, and m 1 + m 2 = 1; x 1 ′ represents the value after normalization of the maximum temperature of the IGBT module; x 2 ′ represents the value after normalization of the static pressure difference of the radiator.

[0032] A heat dissipation structure for a motor controller, characterized in that it is obtained based on the above optimization method of the heat dissipation structure of the motor controller, and includes a radiator and spoiler columns; the radiator includes a substrate, a heat dissipation flow channel is provided on one side plate surface of the substrate, multiple spoiler columns are distributed in the heat dissipation flow channel, and the spoiler columns are all perpendicular to the plate surface of the substrate; the other side plate surface of the substrate is fixedly connected to the IGBT module, and the installation position of the IGBT module corresponds to the heat dissipation flow channel.

[0033] Further, the heat dissipation flow channel includes an inlet straight section, a flow disturbance section, an outlet straight section, and a U-shaped connection section. The head end of the inlet straight section communicates with the water inlet on the side of the substrate. The tail end of the inlet straight section communicates with the head end of the flow disturbance section through a U-shaped connection section. The tail end of the flow disturbance section communicates with the head end of the outlet straight section through a U-shaped connection section. The tail end of the outlet straight section communicates with the water outlet of the substrate.

[0034] The position of the flow disturbance section corresponds to the IGBT module, and multiple flow disturbance columns are distributed in the flow disturbance section.

[0035] Further, the flow disturbance section is set as a continuous U-shaped structure, and the width of the straight part in the flow disturbance section is greater than the width of the U-shaped connection part.

[0036] Further, the straight part is connected to the U-shaped connection part through a trapezoidal connection part.

[0037] Further, the density of the flow disturbance columns at both ends of the straight part is greater than the density of the flow disturbance columns in the middle of the straight part.

[0038] The technical solution of the present invention has at least the following advantages and beneficial effects:

[0039] The present invention discloses an optimization method and a heat dissipation structure for a motor controller heat dissipation structure. By combining the influencing factors in the radiator, the influencing factors in the flow disturbance columns, and the coolant flow rate that affect the heat dissipation effect and energy consumption, a physical simulation model is constructed, so that the physical simulation model can accurately simulate the operation effect of the actual heat dissipation structure.

[0040] In addition, the main factors affecting the performance and energy consumption of the heat dissipation structure can be obtained through the control variable method. Subsequently, through orthogonal experiments and corresponding calculations, a combination of influencing factors and their levels with the smallest comprehensive index of heat dissipation performance and energy consumption is obtained. The heat dissipation structure designed according to this combination of influencing factors and their levels has the optimal heat dissipation and energy-saving comprehensive performance; fully combining the influencing factors of the heat dissipation structure, the heat dissipation structure with the optimal comprehensive performance can be optimized. Description of the Drawings

[0041] Figure 1 It is a schematic flowchart of a method of the present invention;

[0042] Figure 2 It is a broken line schematic diagram of the change amount of the highest temperature of IGBT and the static pressure difference of the radiator caused by the change of each influencing factor in the present invention;

[0043] Figure 3 It is a schematic diagram of a heat dissipation structure of the present invention.

[0044] Reference numerals: 1 radiator; 11, substrate; 111, water inlet; 112, water outlet; 12, heat dissipation flow channel; 121, inlet straight section; 122, turbulence section; 1221, straight part; 1222, U-shaped connecting part; 123, outlet straight section; 124, U-shaped connecting section; 2, turbulence post. Detailed implementation manners

[0045] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. The components of the embodiments of the present invention usually described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations.

[0046] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed present invention, but merely represents selected embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts fall within the scope of protection of the present invention.

[0047] It should be noted that: similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0048] In the description of the present invention, it should be noted that if terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" (except for "horizontal" related to "factor" or "influence factor") and other indicated orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, or the orientations or positional relationships in which the application product is usually placed during use, it is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0049] In the description of the present invention, it should also be noted that unless otherwise clearly specified and limited, if terms such as "set", "installed", "connected", "connected" are understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0050] Embodiment 1

[0051] As shown in the attached Figure 1 An optimization method for the heat dissipation structure of a motor controller, comprising:

[0052] S1. Based on the influencing factors in the initial radiator 1, the influencing factors in the turbulator 2, and the coolant flow rate, design a physical simulation model of the heat dissipation structure;

[0053] The design of this physical simulation model is based on the spatial dimension requirements of the motor controller (length * width * height greater than 198mm * 196mm * 17mm) and the heat dissipation requirements (the allowable working temperature of the IGBT is 90°C), and is designed using Solidworks;

[0054] Respectively determine the influencing factors in the radiator 1, the influencing factors in the turbulator 2, and the variation range of the coolant flow rate;

[0055] Specifically, the influencing factors in the radiator 1 include the substrate thickness of the radiator 1, the flow channel size parameters, the number of flow channels, the inlet and outlet diameters, and the partition thickness; the influencing factors in the turbulator 2 include the shape, height, and arrangement form of the turbulator;

[0056] The influencing factors in the radiator 1, the influencing factors in the turbulator 2, the variation range of the coolant flow rate, and the reference values of each influencing factor are shown in Table 1. It should be noted that the coolant flow rate is also an influencing factor;

[0057] Table 1 Reference values and variation ranges of each influencing factor

[0058]

[0059] S2. Use the control variable method to change one of the influencing factors, analyze the influence of the change of this influencing factor on the heat dissipation performance and energy consumption of the heat dissipation structure, and generate an actual factor level table;

[0060] When using the control variable method, only one factor is changed each time, and other factors remain unchanged. Analyze the influence of 10 factors including the substrate thickness, flow channel width, flow channel length, number of flow channels, inlet and outlet diameters, partition thickness, turbulator shape, turbulator height, turbulator arrangement form, and coolant flow rate on the maximum temperature of the IGBT module and the static pressure difference of the radiator, and screen out the main influencing factors and their levels of the heat dissipation effect and energy consumption of the radiator 1.

[0061] Specifically:

[0062] S21. Thermal simulation based on the control variable method. Establish control variable groups for each influencing factor, and use Solidworks software to conduct thermal simulations respectively.

[0063] The same initial conditions are adopted for the thermal simulation of the radiator 1 model in SolidWorks:

[0064] 1) The initial ambient pressure is 101.325 kPa, and the initial temperature is 20.05 °C;

[0065] 2) The coolant type is water;

[0066] 3) The IGBT thermal power consumption is 3 × 4170 W;

[0067] 4) The outlet ambient pressure is 101.325 kPa.

[0068] S22. Screening of the main influencing factors. For the simulation results, analyze the changes in the maximum temperature of the IGBT module and the static pressure difference of the radiator when each influencing factor changes within its respective preset range, as shown in Table 2:

[0069] Table 2 Changes in the maximum temperature of the IGBT and the static pressure difference of the radiator caused by changes in each influencing factor

[0070]

[0071] Based on the data in Table 2, draw a line chart of the changes in the maximum temperature of the IGBT and the static pressure difference of the radiator caused by changes in each influencing factor, as Figure 2 shown. It can be seen from the figure that the changes in the maximum temperature of the IGBT module and the static pressure difference of the radiator for the factors of flow channel length and baffle thickness are both less than 10% of the difference between the maximum and minimum values of the changes in each influencing factor, that is, the changes in the maximum temperature of the IGBT module for these two factors are both less than 6.87 °C and the changes in the static pressure difference of the radiator are both less than 45918.89 Pa. Therefore, both of these factors are excluded. The shape of the turbulator, the width of the flow channel, the thickness of the substrate, the number of flow channels, the height of the turbulator, the diameter of the inlet and outlet, the coolant flow rate, and the arrangement form of the turbulators are taken as the main influencing factors;

[0072] S23. Screening of the levels of each main influencing factor. For each main influencing factor, establish an original factor level table, as shown in Table 3:

[0073] Table 3 Original factor level table

[0074]

[0075] Exclude the levels at which the maximum temperature of the IGBT module exceeds its allowable value or the static pressure difference of the radiator is higher than the upper limit of the designed static pressure difference when each main influencing factor varies within its respective preset range. Specifically, the excluded levels are as follows: for the influencing factor of the turbulator shape, the horizontal circular and water droplet shapes; for the influencing factor of the flow channel width, the level of 24.8 mm; for the influencing factor of the substrate thickness, the level of 15 mm; for the influencing factor of the turbulator height, the level of 12 mm; for the influencing factor of the inlet and outlet diameters, the level of 6 mm; for the influencing factor of the coolant flow rate, the level of 42 L / min; for the influencing factor of the turbulator arrangement form, the levels of diversion + turbulence and turbulence + diversion. Finally, the actual factor level table is obtained, as shown in Table 4:

[0076] Table 4 Actual Factor Level Table

[0077]

[0078] S3. Based on the orthogonal experimental design method, construct the original orthogonal experimental group according to the actual factor level table; specifically, use Minitab to construct the original orthogonal experimental group, as shown in Table 5. Among them, the specific levels of each factor are represented by the combination of letters and numerical numbers, and their values can be obtained from Table 4:

[0079] Table 5 Original Orthogonal Experimental Group Table

[0080]

[0081]

[0082] S4. Exclude the experimental groups with unreasonable influencing parameters in the original orthogonal experimental group to obtain the actual orthogonal experimental group; that is, exclude groups numbered 1, 2, 3, 4, 5, 6, 8, 9, 10, 11, 12, 13, 14, 15, 20, 24, 27, 31 in Table 5. Thus, the actual orthogonal experimental group for thermal simulation can be obtained, as shown in Table 6:

[0083] Table 6 Actual Orthogonal Experimental Group Table

[0084]

[0085]

[0086] S5. Conduct thermal simulation for the actual orthogonal experimental group to obtain the simulation results of the maximum temperature of the IGBT module and the static pressure difference of the radiator for each experimental group; as shown in Table 7:

[0087] Table 7 Simulation Results Table of Orthogonal Experimental Group

[0088]

[0089] S6. Determine the combination of influencing factors and their levels with the minimum comprehensive index of heat dissipation performance and energy consumption based on all simulation results;

[0090] S61. Normalization of simulation results:

[0091] Normalize the simulation results of the maximum temperature of the IGBT module and the static pressure difference of the radiator for each experimental group according to the following formula,

[0092]

[0093] where x′ represents the value after data normalization; x represents the original value; x min represents the minimum value of the data; x max represents the maximum value of the data; and the results are shown in Table 8:

[0094] Table 8 Normalization result table

[0095]

[0096] S62. Determination of the optimal structure and parameters of the comprehensive performance index of heat dissipation and energy conservation:

[0097] For all experimental groups, calculate the comprehensive performance index of radiator 1 according to the following formula respectively, where m 1 = 0.6, m 2 = 0.4,

[0098] A = m 1 x 1 ′ + m 2 x 2 ′;

[0099] In the formula, A represents the comprehensive performance value of radiator 1; m 1 , m 2 represent weights, and m 1 + m 2 = 1; x 1 ′ represents the value after normalization of the maximum temperature of the IGBT module; x 2 ′ represents the value after normalization of the static pressure difference of the radiator; the results are shown in Table 9. Select the 4th group with the minimum comprehensive performance value as the optimal structure and parameters of the comprehensive performance index of heat dissipation and energy conservation, that is, adopt the elliptical turbulator shape, the flow channel width is 26.8 mm, the substrate thickness is 6 mm, the number of flow channels is 6, the turbulator height is 18 mm, the inlet and outlet diameters are 12 mm, the coolant flow rate is 18 L / min, and the turbulator arrangement form is diversion + turbulence + diversion;

[0100] Table 9 Comprehensive performance value table of each experimental group

[0101]

[0102] Example 2

[0103] As Figure 3 shown, a heat dissipation structure for a motor controller, obtained based on an optimization method for a heat dissipation structure of a motor controller, includes: a radiator 1 and spoiler columns 2. The radiator 1 includes a substrate 11. A heat dissipation channel 12 is formed on one side surface of the substrate 11. Multiple spoiler columns 2 are distributed in the heat dissipation channel 12, and the spoiler columns 2 are all perpendicular to the surface of the substrate 11. The other side surface of the substrate 11 is fixedly connected to an IGBT module, and the installation position of the IGBT module corresponds to the heat dissipation channel 12.

[0104] The heat dissipated by the IGBT module installed on the other side surface of the substrate 11 will be transferred to the substrate 11, and heat dissipation is completed through the full contact between the spoiler columns 2 in the heat dissipation channel 12 and the coolant. In addition, the material of the substrate 11 is selected as 6061 aluminum alloy, and the aluminum alloy has a high thermal conductivity, which can effectively conduct the heat of the IGBT to the surface of the radiator 1 for heat dissipation.

[0105] It should be noted that the spoiler columns 2 are fixedly installed in the heat dissipation channel 12, that is, directly fixedly connected to the substrate 11. Therefore, the heat dissipated by the IGBT module will be transferred to the spoiler columns 2 through the substrate 11, and the flowing cooling water will carry away the heat of the spoiler columns 2 to complete the cooling and heat dissipation operation. Moreover, a cover plate will be provided on the substrate 11 to close the heat dissipation channel 12.

[0106] Example 3

[0107] The heat dissipation channel 12 includes an inlet straight section 121, a spoiler section 122, an outlet straight section 123, and a U-shaped connection section 124. The head end of the inlet straight section 121 is communicated with the water inlet 111 on the side surface of the substrate 11. The tail end of the inlet straight section 121 is communicated with the head end of the spoiler section 122 through a U-shaped connection section 124. The tail end of the spoiler section 122 is communicated with the head end of the outlet straight section 123 through a U-shaped connection section 124. The tail end of the outlet straight section 123 is communicated with the water outlet 112 of the substrate 11.

[0108] That is, no spoiler columns 2 are provided in the inlet straight section 121 and the outlet straight section 123. In order to ensure that the cooling water can enter and flow out of the heat dissipation channel 12 without obstruction and ensure the smoother flow of the cooling water in the heat dissipation channel 12. In addition, the inlet straight section 121, the spoiler section 122, and the outlet straight section 123 are connected together through two U-shaped connection sections, so that the overall heat dissipation channel has a continuous U-shaped structure, correspondingly increasing the flow distance of the cooling water and improving the heat dissipation effect of the radiator 1.

[0109] The position of the spoiler section 122 corresponds to the IGBT module, and multiple spoiler columns 2 are distributed in the spoiler section 122; the heat dissipated by the IGBT module can be effectively absorbed through the spoiler section 122 and the spoiler columns 2, and then the heat is taken away by the cooling water, thereby completing the heat dissipation and cooling of the IGBT module.

[0110] In addition, the spoiler section 122 is set as a continuous U-shaped structure, and the width of the straight part 1221 in the spoiler section 122 is greater than the width of the U-shaped connecting part 1222, that is, the overall heat dissipation flow channel is still a continuous U-shaped structure, and there are six straight parts 1221 in the spoiler section 122. The straight parts 1221 at both ends of the spoiler section 122 are respectively connected to the corresponding inlet straight section 121 or outlet straight section 123 through the U-shaped connecting part 1222, which sufficiently increases the flow distance of the cooling water and the coverage area of the heat dissipation flow channel 12, so that more IGBT modules can be installed on the substrate 11, improving the overall heat dissipation effect of the radiator 1.

[0111] In addition, the straight part 1221 of the spoiler section 122 is connected to the U-shaped connecting part 1222 through a trapezoidal connecting part. This trapezoidal connecting part can make the transition between the straight part 1221 and the U-shaped connecting part 1222 of the spoiler section 122 smoother, avoiding blockage during the flow of the cooling water. It should be noted that spoiler columns 2 are also arranged in the trapezoidal connecting part to slow down the flow rate of the cooling water and prevent the cooling water from flowing too fast and impacting the spoiler section 122.

[0112] As needed, the density of the spoiler columns 2 at both ends of the straight part 1221 is greater than the density of the spoiler columns 2 in the middle of the straight part 1221. Since the IGBT module is generally installed in the center of the substrate 11, the heat received in the middle of the spoiler section 122 is usually the largest. Therefore, the spoiler columns 2 in the middle are arranged sparsely, which can slightly increase the flow rate of the cooling water, that is, improve the cooling effect of this part of the spoiler section 122. The flow rate of the cooling water in the part where the spoiler columns 2 are densely arranged is still low, and the heat received by the corresponding part is also low, making the overall heat dissipation effect of the radiator 1 basically the same, ensuring that the ambient temperature around the IGBT module does not fluctuate too much, which is helpful for the stable operation of the IGBT module;

[0113] It should be noted that the arrangement form of the spoiler columns 2 in the straight part 1221 is diversion + spoiler + diversion, that is, the arrangement of the spoiler columns 2 in the diversion part is matrix-ordered arrangement, and the arrangement of the spoiler columns 2 in the spoiler part is staggered arrangement. In addition, the spoiler columns 2 in this arrangement form can effectively disturb the flowing cooling water, thereby preventing particulate matter in the cooling water from depositing inside the heat exchanger and reducing the risk of blockage.

[0114] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A method for optimizing a heat dissipation structure of a motor controller, characterized in that: include: Based on the influencing factors in the initial radiator (1), the influencing factors in the spoiler column (2) and the coolant flow rate, a physical simulation model of the heat dissipation structure is designed; Determine the influencing factors in the radiator (1), the influencing factors in the spoiler (2), and the range of change of the coolant flow rate; Use the control variable method to change one of the influencing factors, analyze the impact of the change of the influencing factor on the heat dissipation performance and energy consumption of the heat dissipation structure, and generate an actual factor level table; Based on orthogonal experiment, the original orthogonal experimental group is constructed according to the actual factor level table; Eliminate the experimental groups with unreasonable influencing parameters in the original orthogonal experimental groups to obtain the actual orthogonal experimental groups; Thermal simulation is performed on the actual orthogonal experimental group to obtain the simulation results of the maximum temperature of the IGBT module and the static pressure difference of the radiator of each experimental group; Based on all simulation results, determine the factors that have the smallest comprehensive index of heat dissipation performance and energy consumption, and the combination of their levels.

2. The method for optimizing the heat dissipation structure of a motor controller according to claim 1, characterized in that: The influencing factors in the heat sink (1) include the substrate thickness of the heat sink, flow channel size parameters, the number of flow channels, inlet and outlet diameters and partition thickness.

3. The method for optimizing the heat dissipation structure of a motor controller according to claim 1, characterized in that: The influencing factors of the spoiler column (2) include the shape, height and arrangement of the spoiler column.

4. The method for optimizing the heat dissipation structure of a motor controller according to claim 1, characterized in that: The generation process of the actual factor level table specifically includes: Establish control variable groups for each influencing factor, and perform thermal simulations under the same initial simulation conditions of pressure, temperature, coolant type, and IGBT thermal power consumption; According to the simulation results, the changes in the maximum temperature of the IGBT module and the static pressure difference of the radiator are analyzed when each influencing factor changes within its own preset range; Eliminate the influencing factors whose IGBT module maximum temperature change and radiator static pressure difference change are both less than 10% of the difference between the maximum and minimum values ​​of their respective changes, and take the remaining influencing factors as the main influencing factors; For each major influencing factor, establish the original factor level table; Excluding the level at which the maximum temperature of the IGBT module exceeds its allowable value or the static pressure difference of the radiator is higher than the upper limit of the static pressure difference required by the design when the main influencing factors vary within their respective preset ranges, the actual factor level table is obtained.

5. The method for optimizing the heat dissipation structure of a motor controller according to claim 1, characterized in that: The process of determining the combination of the factors and their levels that minimize the comprehensive index of heat dissipation performance and energy consumption specifically includes: The simulation results of each experimental group are normalized according to the following formula: Among them, x′ represents the normalized value of the data; x represents the original value; x min Indicates the minimum value of the data; x max Indicates the maximum value of the data; For all experimental groups, the comprehensive performance index of the radiator (1) is calculated according to the following formula, and the experimental group with the smallest comprehensive performance value is selected as the structure and parameters with the best comprehensive performance index of heat dissipation and energy saving: A=m1x1′+m2x2′; Wherein, A represents the comprehensive performance value of the heat sink (1); m1 and m2 represent weights, and m1+m2=1; x1′ represents the normalized value of the maximum temperature of the IGBT module; and x2′ represents the normalized value of the static pressure difference of the heat sink.

6. A heat dissipation structure of a motor controller, characterized in that: Based on the optimization method of the heat dissipation structure of the motor controller as described in any one of claims 1 to 5, the heat sink (1) includes a heat sink (1) and a spoiler column (2); the heat sink (1) includes a substrate (11), a side surface of the substrate (11) is provided with a heat dissipation channel (12), a plurality of spoiler columns (2) are distributed in the heat dissipation channel (12), and the spoiler columns (2) are perpendicular to the surface of the substrate (11); the other side surface of the substrate (11) is fixedly connected to the IGBT module, and the installation position of the IGBT module corresponds to the heat dissipation channel (12).

7. The heat dissipation structure of the motor controller according to claim 6, characterized in that: The heat dissipation channel (12) comprises an inlet straight section (121), a spoiler section (122), an outlet straight section (123) and a U-shaped connecting section (124), wherein the head end of the inlet straight section (121) is connected to the water inlet (111) on the side of the substrate (11), the tail end of the inlet straight section (121) is connected to the head end of the spoiler section (122) via a U-shaped connecting section (124), the tail end of the spoiler section (122) is connected to the head end of the outlet straight section (123) via a U-shaped connecting section (124), and the tail end of the outlet straight section (123) is connected to the water outlet (112) of the substrate (11); The position of the spoiler section (122) corresponds to the IGBT module, and a plurality of spoiler columns (2) are distributed in the spoiler section (122).

8. The heat dissipation structure of the motor controller according to claim 7, characterized in that: The spoiler section (122) is configured as a continuous U-shaped structure, and the width of the straight portion (1221) in the spoiler section (122) is greater than the width of the U-shaped connecting portion (1222).

9. The heat dissipation structure of the motor controller according to claim 8, characterized in that: The straight portion (1221) is connected to the U-shaped connecting portion (1222) via a trapezoidal connecting portion.

10. The heat dissipation structure of the motor controller according to claim 8, characterized in that: The density of the spoiler columns (2) located at both ends of the straight portion (1221) is greater than the density of the spoiler columns (2) in the middle of the straight portion (1221).

Images