Method for reducing insertion loss of surface acoustic wave filter

Abstract

The invention discloses a method for reducing the insertion loss of a surface acoustic wave filter, and relates to the technical field of filter processing, and the method comprises the steps: collecting a piezoelectric material for the surface acoustic wave filter, measuring the parameters of the material, and calculating the loss of the material; forming an initial electrode layout scheme of the surface acoustic wave filter based on a topological optimization algorithm according to the piezoelectric material parameters; calculating an inter-electrode coupling coefficient based on the initial electrode layout structure, and calculating and reducing the insertion loss of the filter according to the inter-electrode coupling coefficient; the electrode parameters are imported into coupling simulation software, the propagation process of the surface acoustic wave in the filter under the action of multiple physical fields is simulated, and the performance of the filter is optimized; and manufacturing the optimized surface acoustic wave filter, calculating the loss in the theoretical manufacturing process, and adjusting and optimizing the manufacturing process according to the theoretical loss and the actual loss. The insertion loss of the surface acoustic wave filter is reduced by selecting the piezoelectric material with low loss and continuously adjusting the layout structure of the electrodes.

Description

Technical Field

[0001] The present invention relates to the technical field of filter processing, and particularly relates to a method for reducing the insertion loss of a surface acoustic wave filter. Background Art

[0002] With the wide application of 5G technology and the exploration of future communication technologies such as 6G, the performance requirements for filters in communication systems are becoming increasingly stringent. 5G networks use higher frequency bands, and signals themselves face greater attenuation during transmission. This requires filters to have lower insertion loss to ensure that the signals still have sufficient strength for subsequent processing and transmission after filtering, thereby improving the overall performance and coverage of the system. In future communication systems, high data transmission rates and efficient utilization of spectrum resources are crucial. Surface acoustic wave filters with low insertion loss contribute to achieving higher data transmission efficiency and better spectrum management. Based on this, the present invention proposes a method for reducing the insertion loss of a surface acoustic wave filter. Summary of the Invention

[0003] The present invention provides a method for reducing the insertion loss of a surface acoustic wave filter, including: S10. Collect piezoelectric materials for surface acoustic wave filters, measure material parameters, and calculate the loss of the materials themselves; S20. Based on the piezoelectric material parameters, form an initial electrode layout scheme for the surface acoustic wave filter using a topology optimization algorithm; S30. Based on the initial electrode layout structure, calculate the coupling coefficient between electrodes, and calculate and reduce the insertion loss of the surface acoustic wave filter according to the coupling coefficient between electrodes; S40. Import the electrode parameters into coupling simulation software, simulate the propagation process of surface acoustic waves in the filter under the action of multi-physical fields, and optimize the filter performance; S50. Manufacture the optimized surface acoustic wave filter, calculate the theoretical loss, and adjust and optimize the manufacturing process according to the theoretical loss and the actual loss.

[0004] For the method for reducing the insertion loss of a surface acoustic wave filter as described above, calculate the energy loss of the piezoelectric material, and select the piezoelectric material with an energy loss lower than a preset value as the filter substrate. The energy loss of the piezoelectric material includes dielectric loss, mechanical loss, thermal loss, scattering loss, and substrate coupling loss.

[0005] For the method for reducing the insertion loss of a surface acoustic wave filter as described above, based on the topology optimization algorithm, determine the electrode layout area in the surface acoustic wave filter, discretize it into a finite number of units, and for each unit, set the initial material properties; assume that the entire electrode layout area is filled with a virtual isotropic material in the initial state, and its elastic modulus material parameter is a known value, and use the material density of each unit as the design variable.

[0006] A method for reducing the insertion loss of a surface acoustic wave filter as described above, wherein the minimization of the energy loss of surface acoustic wave propagation is used as the objective function, and through iterative calculation, the presence or absence of each unit material is continuously adjusted to determine the distribution range and density of the interdigital electrodes, that is, the optimal material distribution.

[0007] A method for reducing the insertion loss of a surface acoustic wave filter as described above, wherein the theoretical value of the insertion loss is minimized by adjusting the electrode parameters, and a numerical optimization algorithm is used to search for the optimal electrode parameter combination within the parameter range to achieve fine control of the insertion loss.

[0008] A method for reducing the insertion loss of a surface acoustic wave filter as described above, wherein the determined electrode parameters are imported into a multi-physics field coupling simulation software, and the interaction of piezoelectric effect, elasticity mechanics, and electricity in the software is simulated; in the simulation, the geometric structure, material properties, and boundary conditions of the filter are set, and the propagation process of surface acoustic waves in the filter is simulated, and the parameters are fine-tuned through the simulation results to optimize the performance of the filter.

[0009] A method for reducing the insertion loss of a surface acoustic wave filter as described above, wherein the theoretical losses include material loss, structural loss, radiation loss, and manufacturing process loss.

[0010] The present invention also provides a system for reducing the insertion loss of a surface acoustic wave filter, including: Collection and measurement module: Collect piezoelectric materials for surface acoustic wave filters, measure material parameters, and calculate the losses of the materials themselves; Initial electrode layout module: Form an initial electrode layout scheme for the surface acoustic wave filter based on the piezoelectric material parameters using a topology optimization algorithm; Insertion loss module: Based on the initial electrode layout structure, calculate the coupling coefficient between electrodes, and calculate and reduce the insertion loss of the surface acoustic wave filter according to the coupling coefficient between electrodes; Coupling simulation and optimization module: Import the electrode parameters into the coupling simulation software, simulate the propagation process of surface acoustic waves in the filter under the action of multi-physics fields, and optimize the performance of the filter; Optimized manufacturing process module: Manufacture the optimized surface acoustic wave filter, calculate the losses in the theoretical manufacturing process, and adjust and optimize the manufacturing process according to the theoretical losses and actual losses.

[0011] The present invention also provides a computer storage medium, including: at least one memory and at least one processor; The memory is used to store one or more program instructions; The processor is used to run one or more program instructions to execute a method for reducing the insertion loss of a surface acoustic wave filter as described in any one of the above.

[0012] The beneficial effects achieved by the present invention are as follows: By selecting piezoelectric materials with low self-loss and continuously adjusting the layout structure of the electrodes, the insertion loss of the surface acoustic wave filter is reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments recorded in the present invention. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings.

[0014] Figure 1 It is a flowchart of a method for reducing the insertion loss of a surface acoustic wave filter provided in Embodiment 1 of the present application.

[0015] Figure 2 It is a schematic diagram of a system for reducing the insertion loss of a surface acoustic wave filter provided in Embodiment 2 of the present application. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0016] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0017] Embodiment 1 As Figure 1 shown, Embodiment 1 of the present application provides a method for reducing the insertion loss of a surface acoustic wave filter, including: S10. Collect piezoelectric materials for surface acoustic wave filters, measure material parameters, and calculate the self-loss of the materials.

[0018] The material properties have a profound impact on the performance of the surface acoustic wave filter. A wide variety of piezoelectric materials commonly used in surface acoustic wave filters are widely collected, including quartz, lithium niobate, lithium tantalate, barium titanate, lead zirconate titanate, etc., as well as some new piezoelectric composite materials, including polymer-based piezoelectric composite materials, nanostructured piezoelectric materials, magnetoelectric composite materials, piezoelectric ceramic composite materials, etc. For each material, high-precision measurement equipment and advanced testing technologies are used to determine its elastic constant , dielectric constant and piezoelectric constant . The elastic constant determines the elastic response of the material and is measured by the ultrasonic pulse echo method; the dielectric constant reflects the electrical properties of the material and is measured by an impedance analyzer at a specific frequency; the piezoelectric constant Evaluate the mechanical - to - electrical energy conversion ability of the material, which is obtained using the quasi - static method.

[0019] The dielectric loss, mechanical loss, and thermal loss of the piezoelectric material itself will cause energy loss. The specific formula is , where \(W\) represents the total energy loss of the piezoelectric material within a certain time \(t\), represents the dielectric loss caused by the domain rotation under the electric field, etc., is the angular frequency of the electric field, is the vacuum permittivity, is the relative permittivity of the material, is the tangent of the dielectric loss angle, and \(E\) is the electric field strength. represents the mechanical loss caused by the internal friction of the mechanical vibration inside the material during the propagation of the surface acoustic wave, etc., represents the stress, represents the strain rate, represents the tangent of the mechanical loss angle. represents the thermal loss including heat conduction, heat exchange with the outside world, and the thermo - elastic effect, is the thermal conductivity, is the temperature gradient, is the thermo - elastic coefficient, and \(u\) is the displacement amplitude of the surface acoustic wave. The thermal loss caused by the thermo - elastic effect is proportional to the square of the frequency and the square of the displacement amplitude of the surface acoustic wave. represents the scattering loss caused by the surface roughness, defects, etc. that the surface acoustic wave encounters, is the surface adsorption coefficient, is the wave number of the surface acoustic wave, is the root - mean - square of the surface roughness, and \(I\) is the intensity of the surface acoustic wave. represents the substrate coupling loss caused by the coupling of the surface acoustic wave energy into the substrate material, is the elastic coefficient of the substrate material, and \(H\) is the coupling coefficient.

[0020] Calculate the energy loss of the piezoelectric material, and select the piezoelectric material with an energy loss lower than the preset value as the filter substrate. The energy loss of the piezoelectric material includes dielectric loss, mechanical loss, thermal loss, scattering loss, and substrate coupling loss. This material selection method breaks through the limitations of traditional empirical or limited material comparison, starting from the essential characteristics of the material, and lays a solid foundation for reducing the insertion loss.

[0021] S20. Based on the piezoelectric material parameters, form the initial electrode layout scheme of the surface acoustic wave filter using the topology optimization algorithm.

[0022] The topology optimization algorithm can seek the optimal material distribution of the surface acoustic wave filter under given design regions and conditions to optimize the structural performance. According to this algorithm, the possible layout regions of the electrodes in the surface acoustic wave filter are determined and discretized into a finite number of elements. For each element, the initial material properties are set. Assume that the entire design region is filled with a virtual isotropic material in the initial state, and the material parameters such as the elastic modulus are known values. Take the material density of each element as the design variable, denoted as , where n is the total number of elements. Initially, the material densities of all elements can be set to the same value.

[0023] Taking the minimization of the energy loss of surface acoustic wave propagation as the objective function, according to the material density of element i in the design region being , the objective function F can be expressed as , , where, represents the energy loss of surface acoustic wave propagation when the material density of element i is , represents the volume of element i, is the stress tensor, is the elastic stiffness coefficient tensor, which describes the linear relationship between stress and strain during elastic deformation of the material. Among them, i, j, k, l are the indices of the tensor, each related to the three-dimensional space direction and can each take values of 1, 2, 3, corresponding to the three directions of the space rectangular coordinate system. is the strain variable, used to describe the deformation degree of each point inside the material. k, l are the indices and can each take values of 1, 2, is the strain tensor, is the electric polarization intensity, is the vacuum permittivity, is the electric susceptibility, E is the electric field strength, is the voltage constant tensor, i, j, k are the indices, taking values among 1, 2, 3. When the material is stressed in a certain direction to generate strain, determines the component magnitudes of the resulting electric polarization intensity in each direction. is the strain tensor component, which is part of the strain tensor , specifically referring to the components with indices j and k. represents the constraint condition, which is the total electrode mass limit, is the set upper limit of the total electrode mass.

[0024] A material interpolation model is adopted to describe the relationship between the element material properties and the design variables. The interpolation formula is , is the elastic modulus of element i, is the elastic modulus of the solid material, and p is the penalty factor. The value range of p is from 3 to 5.

[0025] Calculate the sensitivity of the objective function to each design variable. The specific formula is , where \(F\) is the objective function, \(K\) is the stiffness matrix, which is related to the material properties and the geometric shape of the structure, and is used to establish the relationship between force and displacement. \(\mathbf{u}\) is the displacement field, which describes the displacement of each node of the structure under the action of force. \(\rho\) is the design variable, representing the material density, \(\mathbf{p}\) is the adjoint variable, an auxiliary variable introduced to solve the sensitivity. Its dimension is the same as that of the displacement field , and \(T\) represents the transpose operation of the matrix.

[0026] According to the sensitivity information, adopt a suitable optimization algorithm to update the design variable, , where \(r\) represents the number of iterations, \(\alpha\) is the step size parameter, and \(\rho_{max}\) and \(\rho_{min}\) are the upper and lower bounds of the design variable \(\rho\) at the \(r\)-th iteration, respectively, and need to be adjusted according to the specific situation of the problem and the convergence situation during the iteration process. After each iteration, the design variable \(\rho\) is restricted to the range \([0, 1]\) to ensure the physical meaning of the material density. At the same time, check whether the convergence criterion is met. If the change amount of the objective function is less than a certain threshold \(\epsilon\), that is \(\vert F(\rho^{(r)}) - F(\rho^{(r - 1)})\vert\lt\epsilon\), or the maximum number of iterations is reached, then stop the iteration and obtain the optimal material distribution; otherwise, continue the next iteration.

[0027] Through iterative calculation, continuously adjust the presence or absence of materials in each element, and gradually generate the initial interdigital electrode layout structure. In each iteration, according to the objective function and the constraint conditions, use the sensitivity analysis method to update the element state. After multiple iterations, determine the approximate distribution range and density of the interdigital electrodes, and form the initial electrode layout plan.

[0028] Post-process the obtained optimal material distribution. Use a visualization tool to display the material density distribution in the form of a graph to visually observe the electrode layout. Perform smoothing processing or thresholding operation on the result, convert the material density into a clear electrode layout plan, and regard the elements with material density greater than a certain threshold as the electrode region, and the elements with density less than the threshold as the non-electrode region.

[0029] S30. Based on the initial electrode layout structure, calculate the coupling coefficient between electrodes, and calculate and reduce the insertion loss of the surface acoustic wave filter according to the coupling coefficient between electrodes.

[0030] Based on the electrode layout structure generated in step S20, the specific parameters of the electrodes are calculated in detail. Calculate the ratio of the length L of the interdigital electrode to the wavelength of the surface acoustic wave relationship , where , v is the propagation speed of the surface acoustic wave in the selected material, which can be obtained from the relationship between the material elastic constant and the density , is the material elastic constant, is the material density.

[0031] Calculate the coupling coefficient between electrodes , and the formula is , is the frequency change amount, is the center frequency under the initial electrode structure, is the center frequency after adjusting the electrode structure.

[0032] According to the calculated ratio relationship and the coupling coefficient between electrodes , calculate the insertion loss, and adjust parameters such as the electrode width w and the spacing s. The insertion loss formula is , where is the characteristic impedance of the input and output ports, is the equivalent resistance, is the angular frequency, . The equivalent resistance has the relationship with the electrode width w and the spacing s as , is the reference resistance, is the reference width, is the reference spacing, m, n are empirical exponents. By adjusting the electrode parameters to minimize the theoretical value of the insertion loss, use the numerical optimization algorithm to search for the optimal electrode parameter combination within a certain parameter range to achieve fine control of the insertion loss.

[0033] S40. Import the electrode parameters into the coupling simulation software to simulate the propagation process of the surface acoustic wave in the filter under the action of multiple physical fields, and optimize the filter performance.

[0034] Import the electrode parameters determined in step S30 into the multi-physical field coupling simulation software, and simulate the interaction of multiple physical fields such as piezoelectric effect, elasticity mechanics, and electricity in the software. In the simulation, set the geometric structure, material properties, and boundary conditions of the filter, and simulate the propagation process of the surface acoustic wave in the filter. The constitutive equation of the piezoelectric effect is , , where is the stress tensor, is the elastic stiffness coefficient under the constant electric field, E is the constant electric field, is the strain tensor, is the voltage constant tensor, is the electric field strength, is the electric displacement vector, is the strain tensor component, is the dielectric constant under constant strain, is the constant strain condition, is the component of the electric field strength vector E in the j direction. The equilibrium equations of elasticity are , , denotes the partial derivative with respect to the coordinate direction corresponding to the j index and the contraction operation, is the body force density, represents the spatial coordinate variable, and j takes values 1, 2, 3, corresponding to the x, y, and z directions respectively. In terms of electricity, the formula is , represents the curl operation, E represents the electric field strength vector, represents the partial derivative of the magnetic induction intensity B with respect to time t.

[0035] Through the above equations and the corresponding boundary conditions and initial conditions, numerical solutions are carried out in the software to obtain the distributions of physical quantities such as stress, strain, electric field, and electric displacement during the propagation of surface acoustic waves, and the propagation process of surface acoustic waves in the filter under the interaction of physical fields is simulated in the software.

[0036] Based on the simulation results, the energy distribution and propagation characteristics of surface acoustic waves are analyzed. With the help of the post-processing module, a cloud map of energy density and a propagation trajectory map of surface acoustic waves are generated to visually present the energy distribution and propagation situation. If it is found through simulation that the energy loss is large in a certain area, such as the concentrated energy loss at the electrode edge, the shape of the electrode in this area is appropriately adjusted, or the electrode position is adjusted to make the propagation of surface acoustic waves smoother. Through multiple simulations and parameter fine-tuning, the performance of the filter is optimized.

[0037] S50. Manufacture an optimized surface acoustic wave filter, calculate the losses in the theoretical manufacturing process, and adjust and optimize the manufacturing process according to the theoretical losses and actual losses.

[0038] According to the parameters optimized in step S40, a dedicated manufacturing process flow is designed. For the characteristics of the selected piezoelectric material, the process parameters such as photolithography and etching are optimized. In the photolithography process, a suitable photoresist and exposure light source are selected, and the exposure time and dose are precisely controlled to ensure the transfer accuracy of the electrode pattern. The exposure dose D of the photoresist is calculated by the formula , is the intensity of the exposure light source, and t is the exposure time. Different photoresists have their specific photosensitive curves, and the optimal exposure dose of different photoresists under a specific exposure light source is determined through experiments , and the optimal exposure time is determined to be , so as to determine the intensity of the exposure light source.

[0039] In the etching process, select a suitable etching solution and etching method according to the material properties, and control the etching rate and uniformity. The etching rate formula is , where is a constant related to the material and the etching solution, a is the empirical exponent of the etching solution concentration C, b is the empirical exponent of the etching temperature G, p is the etching time of the empirical exponent. Measure the etching depth h at different etching solution concentrations, temperatures and times through experiments, and the etching rate , by adjusting the etching solution concentration C, the etching temperature G and the etching time , make the etching rate stable at the target value.

[0040] The loss in the actual manufacturing process is , is the material loss in the manufacturing process, is the weight of the material loss, is the attenuation coefficient of the material, d is the propagation distance of the surface acoustic wave, J is the quality factor of the material, is the structural loss in the manufacturing process, is the weight of the structural loss, is the shape factor of the electrode, including the influence of the aspect ratio of the electrode, the interdigital shape, etc. on the loss, is the coupling coefficient between the electrode and the piezoelectric material, which affects the energy exchange efficiency between the surface acoustic wave and the electrode, is the frequency of the surface acoustic wave. The higher the frequency, the greater the possible loss related to the structure. is the radiation loss in the manufacturing process, is the weight of the radiation loss, N is the geometric size of the filter, is the wavelength of the surface acoustic wave, is the wave impedance of the piezoelectric material, and z is the wave impedance of the environmental medium. is the manufacturing process loss, is the weight of the manufacturing process loss, is the reference factor, which adjusts the relationship between the photolithography accuracy factor , the etching uniformity factor , and the material surface roughness factor . The lower the photolithography accuracy, the more uneven the etching, and the rougher the material surface.

[0041] After manufacturing the sample, use a high-precision network analyzer and other test equipment to measure its insertion loss . Compare the measurement results with the simulation calculation results For comparative analysis, there are relatively large deviations, and the reasons for the deviations are analyzed. These include electrode size deviations caused by insufficient precision in the photolithography and etching processes, or differences between the actual characteristics of the material and the simulated settings. In response to the reasons for the deviations, the manufacturing process parameters or electrode design parameters are adjusted again, and the manufacturing and testing processes are repeated. After multiple adjustments to the manufacturing process and sample testing, the deviation between the insertion loss of the final sample and the simulated value is controlled within the set deviation threshold, meeting the design requirements and ensuring that the designed filter achieves low insertion loss in actual manufacturing.

[0042] Embodiment 2 As Figure 2 shown, Embodiment 2 of the present application provides a system for reducing the insertion loss of a surface acoustic wave filter, including: Collection and measurement module: Collect piezoelectric materials for surface acoustic wave filters, measure material parameters, and calculate the losses of the materials themselves.

[0043] Initial electrode layout module: Based on the piezoelectric material parameters, form an initial electrode layout scheme for the surface acoustic wave filter using a topology optimization algorithm.

[0044] Insertion loss module: Based on the initial electrode layout structure, calculate the coupling coefficient between electrodes, and calculate and reduce the insertion loss of the surface acoustic wave filter according to the coupling coefficient between electrodes.

[0045] Coupling simulation and optimization module: Import electrode parameters into coupling simulation software, simulate the propagation process of surface acoustic waves in the filter under the action of multiple physical fields, and optimize the filter performance.

[0046] Optimized manufacturing process module: Manufacture the optimized surface acoustic wave filter, calculate the losses in the theoretical manufacturing process, and adjust and optimize the manufacturing process according to the theoretical losses and actual losses.

[0047] Corresponding to the above embodiment, an embodiment of the present invention provides a computer storage medium, including: at least one memory and at least one processor; The memory is used to store one or more program instructions; The processor is used to run one or more program instructions to execute a method for reducing the insertion loss of a surface acoustic wave filter.

[0048] Corresponding to the above embodiment, an embodiment of the present invention provides a computer-readable storage medium. The computer storage medium contains one or more program instructions, and the one or more program instructions are used to be executed by a processor to execute a method for reducing the insertion loss of a surface acoustic wave filter.

[0049] The embodiments disclosed by the present invention provide a computer-readable storage medium. Computer program instructions are stored in the computer-readable storage medium. When the computer program instructions run on a computer, the computer is caused to execute the above method for reducing the insertion loss of a surface acoustic wave filter.

[0050] In an embodiment of the present invention, the processor may be an integrated circuit chip with the ability to process signals. The processor may be a general-purpose processor, a digital signal processor (DSP for short), an application specific integrated circuit (ASIC for short), a field programmable gate array (FPGA for short), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components.

[0051] It can implement or execute the various methods, steps, and logic block diagrams disclosed in the embodiments of the present invention. The general-purpose processor may be a microprocessor or the processor may also be any conventional processor, etc. The steps of the method disclosed in combination with the embodiments of the present invention can be directly embodied as being executed by a hardware decoding processor, or executed by a combination of hardware and software modules in the decoding processor. The software module may be located in a mature storage medium in the art such as a random access memory, a flash memory, a read-only memory, a programmable read-only memory, or an electrically erasable programmable memory, a register, etc. The processor reads the information in the storage medium and combines its hardware to complete the steps of the above method.

[0052] The storage medium may be a memory, for example, it may be a volatile memory or a non-volatile memory, or may include both volatile and non-volatile memories.

[0053] Among them, the non-volatile memory may be a read-only memory (ROM for short), a programmable read-only memory (PROM for short), an erasable programmable read-only memory (EPROM for short), an electrically erasable programmable read-only memory (EEPROM for short), or a flash memory.

[0054] The volatile memory may be a Random Access Memory (RAM) which is used as an external cache. By way of example but not limitation, many forms of RAM are available, such as Static RAM (SRAM), Dynamic RAM (DRAM), Synchronous DRAM (SDRAM), Double Data Rate SDRAM (DDR SDRAM), Enhanced SDRAM (ESDRAM), Synchlink DRAM (SLDRAM), and Direct Rambus RAM (DRRAM).

[0055] The storage media described in the embodiments of the present invention are intended to include but not limited to these and any other suitable types of memory.

[0056] Those skilled in the art should be aware that in one or more of the above examples, the functions described in the present invention can be implemented by a combination of hardware and software. When applying software, the corresponding functions can be stored in a computer-readable medium or transmitted as one or more instructions or codes on a computer-readable medium. The computer-readable medium includes computer storage media and communication media, where the communication media includes any medium that facilitates the transfer of a computer program from one place to another. The storage media can be any available medium that can be accessed by a general or special purpose computer.

[0057] The specific embodiments described above further elaborate on the purpose, technical solutions, and beneficial effects of the present invention. It should be understood that the above description is only for the specific embodiments of the present invention and is not used to limit the protection scope of the present invention. Any modifications, equivalent replacements, improvements, etc. made on the basis of the technical solutions of the present invention should be included in the protection scope of the present invention.

Claims

1. A method for reducing insertion loss of a surface acoustic wave filter, characterized in that: include: S10, collecting piezoelectric materials for surface acoustic wave filters, measuring material parameters, and calculating the loss of the materials themselves; S20, forming an initial electrode layout scheme for the surface acoustic wave filter based on a topology optimization algorithm according to the piezoelectric material parameters; S30, calculating the inter-electrode coupling coefficient based on the initial electrode layout structure, and calculating and reducing the insertion loss of the surface acoustic wave filter according to the inter-electrode coupling coefficient; S40, importing the electrode parameters into the coupling simulation software, simulating the propagation process of the surface acoustic wave in the filter under the action of multi-physical fields, and optimizing the filter performance; S50, manufacturing an optimized surface acoustic wave filter, calculating theoretical loss, and adjusting and optimizing the manufacturing process according to the theoretical loss and actual loss.

2. A method for reducing insertion loss of a surface acoustic wave filter as claimed in claim 1, characterized in that: Calculate the energy loss of the piezoelectric material and select the piezoelectric material with energy loss lower than the preset value as the filter substrate. The energy loss of the piezoelectric material includes dielectric loss, mechanical loss, thermal loss, scattering loss, and substrate coupling loss.

3. A method for reducing insertion loss of a surface acoustic wave filter as claimed in claim 1, characterized in that: Based on the topology optimization algorithm, the electrode layout area in the surface acoustic wave filter is determined and discretized into a finite number of units. For each unit, the initial material properties are set. It is assumed that the entire motor layout area is filled with a virtual isotropic material in the initial state, and its elastic modulus material parameter is a known value. The material density of each unit is used as a design variable.

4. A method for reducing insertion loss of a surface acoustic wave filter as claimed in claim 3, characterized in that: Taking the minimization of surface acoustic wave propagation energy loss as the objective function, through iterative calculation, the presence or absence of each unit material is continuously adjusted to determine the distribution range and density of the interdigitated electrodes, that is, the optimal material distribution.

5. A method for reducing insertion loss of a surface acoustic wave filter as claimed in claim 4, characterized in that: By adjusting the electrode parameters to minimize the theoretical value of insertion loss, a numerical optimization algorithm is used to search for the optimal electrode parameter combination within the parameter range to achieve refined control of the insertion loss.

6. A method for reducing insertion loss of a surface acoustic wave filter as claimed in claim 5, characterized in that: The determined electrode parameters are imported into the multi-physics field coupling simulation software, and the piezoelectric effect, elastic mechanics, and electrical multi-physics field interactions are simulated in the software; in the simulation, the filter geometry, material properties, and boundary conditions are set, and the propagation process of surface acoustic waves in the filter is simulated. Through the simulation results, the parameters are fine-tuned to optimize the filter performance.

7. A system for reducing insertion loss of a surface acoustic wave filter, characterized in that: include: Collection and measurement module: collect piezoelectric materials used in surface acoustic wave filters, measure material parameters, and calculate the loss of the material itself; Initial electrode layout module: forms the initial electrode layout scheme of the surface acoustic wave filter based on the topology optimization algorithm according to the piezoelectric material parameters; Insertion loss module: Based on the initial electrode layout structure, the inter-electrode coupling coefficient is calculated, and the insertion loss of the surface acoustic wave filter is calculated and reduced according to the inter-electrode coupling coefficient; Coupling simulation optimization module: import electrode parameters into coupling simulation software, simulate the propagation process of surface acoustic waves in the filter under the action of multi-physical fields, and optimize the filter performance; Optimize manufacturing process module: manufacture optimized surface acoustic wave filters, calculate theoretical losses, and adjust and optimize the manufacturing process based on theoretical losses and actual losses.

8. A computer storage medium, characterized in that: include: at least one memory and at least one processor; The memory is used to store one or more program instructions; A processor, used for running one or more program instructions to execute a method for reducing insertion loss of a surface acoustic wave filter as described in any one of claims 1-6.

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