Memory bank test equipment

Abstract

The invention discloses memory bank test equipment, which is used for performing performance test on a memory bank at a controllable environment temperature, and comprises a test host, the test host is used for testing the memory bank, the test host is provided with a plurality of test areas, and the test areas are used for testing the memory bank. The test area comprises a plurality of slots for inserting the memory banks; the temperature control module comprises a plurality of temperature control units which are in one-to-one correspondence with the plurality of test areas, the plurality of temperature control units are used for heating the memory banks in the corresponding test areas respectively, and first temperature sensors are arranged in the temperature control units and used for monitoring the temperature in the test areas; and the test host and the temperature control unit are electrically connected with the electric control module. According to the invention, the memory bank to be tested can be heated in different areas, and the temperature of the memory bank test area is accurate and controllable.

Description

Technical Field

[0001] The present invention relates to the technical field of memory bar testing, and in particular to a memory bar testing device. Background Art

[0002] In the development and production process of electronic products, memory stick testing is a key link to ensure product quality and stability. Among them, temperature is one of the important factors affecting the operating performance of memory sticks. Therefore, detecting the operating status of memory sticks at different temperatures is an important part of memory testing.

[0003] Most of the existing memory stick temperature testing equipment adopts an overall heating method, that is, the entire motherboard area where the memory stick is inserted is heated by a heating unit. However, due to the differences in heat conduction efficiency at different positions in the test area, differences in heat dissipation conditions, differences in memory stick layouts, and the mutual influence of heat generated by the memory stick itself during the test, in the actual test process, the actual temperature of the memory stick test area has a large error with the set temperature, and there are significant differences in the ambient temperatures of different memory sticks, which affects the accuracy of the test and makes it difficult for the test results to truly reflect the performance of the memory stick under different temperature conditions. Summary of the invention

[0004] In view of the deficiencies in the prior art, the present invention provides a memory stick testing device, which can heat the memory stick to be tested in a partitioned manner, and the temperature of the memory stick test area is precisely controllable.

[0005] The present invention is achieved through the following technical solutions:

[0006] A memory bar testing device is used to perform a performance test on a memory bar under a controllable ambient temperature, the memory bar testing device comprising:

[0007] A test host, the test host is used to test the memory stick, the test host is provided with a plurality of test areas, the test areas include a plurality of slots for inserting the memory stick;

[0008] A temperature control module, the temperature control module comprising a plurality of temperature control units corresponding to the plurality of test areas, the plurality of temperature control units being used to heat the memory bars in the corresponding test areas respectively, and a first temperature sensor being provided in the temperature control unit for monitoring the temperature in the test area;

[0009] The electric control module is electrically connected to the test host and the temperature control unit.

[0010] Furthermore, a speed-adjustable fan and a heating component are sequentially arranged in the temperature control unit along the airflow direction, and a temperature control area is also provided in the temperature control unit, and the temperature control area is located at the downwind outlet of the heating component;

[0011] Driven by the speed-adjustable fan, external airflow enters from the air inlet of the temperature control unit, passes through the heating component and the temperature control area in sequence, and flows out from the air outlet of the temperature control unit;

[0012] A working opening is provided on the bottom plate of the temperature control unit at a position corresponding to the temperature control area, and the memory stick can pass through the working opening.

[0013] Furthermore, the heating assembly includes a heating plate and a heat conductive member, the heating plate is attached to the heat conductive member, a plurality of fins are provided on a side of the heat conductive member away from the heating plate, and the airflow can pass between the plurality of fins.

[0014] Furthermore, the temperature control unit has a heating area, and a mounting plate is arranged in the heating area, and the mounting plate divides the heating area into a first area and a second area. The heating plate is arranged in the first area, the heat conductor is fixedly connected to the mounting plate and is at least partially located in the first area, and the multiple fins are at least partially located in the second area.

[0015] Furthermore, the air outlet of the second area is connected to the temperature control area, the speed-adjustable fan is installed at the air inlet, and the cross-section of the second area gradually decreases along the airflow direction.

[0016] Furthermore, the memory stick testing device also includes a box, the test host is arranged on the box, the temperature control module is rotatably connected to the box and can rotate between a closed position and an open position, when the temperature control module is in the closed position, the temperature control unit is in close contact with the box, the memory stick is at least partially located in the temperature control area, when the temperature control module is in the open position, the test area is exposed to the outside, and the memory stick can be plugged into the slot.

[0017] Furthermore, the memory stick testing device further comprises a flipping mechanism, which is disposed on the box body and is used to drive the temperature control module to rotate between a closed position and an open position;

[0018] The flipping mechanism includes a driving member, a transmission member and a rotating shaft. The temperature control module is fixedly connected to the rotating shaft. The transmission member includes at least one rack and a gear meshing with the at least one rack. The gear is coaxially arranged and fixedly connected to the rotating shaft. The driving member can drive the rack to move along its setting direction to drive the gear to rotate along its axial direction.

[0019] Furthermore, the test host includes a test motherboard, a heat sink attached to the CPU, and a cooling fan. One side of the test motherboard is provided with a plurality of the slots, and the other side is provided with a CPU. The cooling fan is used to discharge the heat of the heat sink out of the test host.

[0020] Furthermore, the test host includes a shell, the CPU, the heat sink and the heat sink fan are all arranged in the shell, and the slot is exposed outside the shell.

[0021] Furthermore, the test host also includes a cover plate, which is arranged above the test main board, and a plurality of test ports corresponding to the test areas are formed on the cover plate, and sealing rings are arranged around the test ports.

[0022] Compared with the prior art, the advantages of the present invention are:

[0023] 1. The present invention divides the test area into multiple areas, and each test area is provided with a corresponding temperature control unit for heating. The memory bars in each test area will not affect each other, thereby improving the temperature uniformity index of the memory bar test environment and greatly reducing the temperature error of the test environment to plus or minus 4°C.

[0024] 2. The present invention sets a speed-regulating fan and a temperature sensor in the temperature control unit, blows the airflow into the temperature control unit and passes through the heating component and the test area in sequence, and controls the speed of the speed-regulating fan by cooperating with the temperature sensor to control the flow rate of the airflow, thereby accurately controlling the temperature in the test area.

[0025] 3. The present invention arranges the temperature control module on the box body in a flippable manner, and the flip mechanism adopts an electric push rod to automatically open and close, which is convenient for testing operations.

[0026] 4. The flipping mechanism in the present invention adopts a transmission mode in which an electric push rod pushes the rack to drive the gear, so that the flipping of the temperature control module is stable and reliable, and the electric push rod has a self-locking function to prevent the temperature control module from falling and causing harm to the tester when the equipment stops working due to power failure or other reasons.

[0027] 5. The test area in the present invention adopts high temperature resistant sealing strips on the upper and lower parts to ensure the independent and stable operation of the test area, and the ambient temperature is accurately controllable to avoid interference from external environmental factors.

[0028] 6. In the present invention, a light curtain and a limit sensor are also installed on the box body. The light curtain ensures that the temperature control module will not be closed when someone is operating it. The limit sensor ensures that the temperature control module will not be forcibly closed when it is displaced, causing damage to the equipment, thereby improving the safety of the equipment.

[0029] 7. The present invention arranges the CPU and the slot of the test motherboard on two opposite sides, so that when the test area is heated, it will not affect the heat dissipation of the CPU on the other side, and will not affect the test efficiency and accuracy.

[0030] 8. The present invention arranges an installation plate in the heating area to divide the heating area into a first area and a second area. The installation plate, the first thermal insulation plate and the second thermal insulation plate enclose the above-mentioned first area. The heating plate is arranged in the first area to ensure that except for the working area of ​​the heating plate, that is, other areas outside the first area will not cause temperature rise due to the heat emitted by the heating plate, thereby damaging the equipment or injuring the tester.

[0031] 9. The temperature control unit in the present invention first heats the airflow through the heating component, and then sends the heated airflow to the working area connected to the test area. The heated airflow is used to heat the memory stick to be tested, which makes it easier to control the temperature in the test area. At the same time, when the heating component directly heats the memory stick, the memory stick is prevented from touching the heating component and being damaged due to crooked insertion or the like. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 A schematic diagram of the closed state structure of a memory stick testing device according to an embodiment of the present invention;

[0033] Figure 2 A schematic diagram of the structure of a memory stick testing device in an open state according to an embodiment of the present invention;

[0034] Figure 3 is a three-dimensional cross-sectional view of a temperature control unit according to an embodiment of the present invention;

[0035] Figure 4 is a cross-sectional view of a temperature control unit according to an embodiment of the present invention;

[0036] Figure 5 An exploded diagram of a test host according to an embodiment of the present invention;

[0037] Figure 6 A partial side view of a memory bar testing device according to an embodiment of the present invention;

[0038] Figure 7 A cross-sectional view of a test host according to an embodiment of the present invention;

[0039] Figure 8 A partial structural schematic diagram of a memory bar testing device according to an embodiment of the present invention;

[0040] Fig. 9 It is a schematic diagram of a partial structure of a memory stick testing device in another state according to an embodiment of the present invention;

[0041] Fig.10A schematic diagram of the structure of a flipping mechanism according to an embodiment of the present invention;

[0042] Fig.11 A cross-sectional view of a memory bar testing device according to an embodiment of the present invention;

[0043] Fig.12 A front view of a memory bar testing device according to an embodiment of the present invention;

[0044] Fig.13 A rear view of a memory bar testing device according to an embodiment of the present invention;

[0045] Fig.14 for Fig.11 A magnified view of part A in FIG.

[0046] Fig.15 FIG. 4 is a cross-sectional view of a temperature control unit according to an embodiment of the present invention.

[0047] Description of reference numerals: 1. Box; 10. Installation space; 11. Front panel; 110. Control button; 111. Emergency stop button; 112. Alarm buzzer; 113. Touch screen; 114. Status indicator light; 12. Rear panel; 120. Power interface; 121. IO interface; 100. Fixing plate; 101. First installation space; 102. Second installation space; 15. Safety light curtain; 16. Limit sensor; 17. Foot support; 18. Bottom plate; 2. Equipment body; 20. Test host; 200. Test main board; 201. Shell; 202. Heat sink; 203. Heat dissipation fan; 204. Cover; 205. Test port; 206. Sealing element; 206a. First sealing ring; 206b. Second sealing ring; 207. Support plate; 21. Test area; 3. Temperature control module; 30. Temperature control unit; 300. Speed-adjusting fan; 301. Heating component; 302. Temperature control area; 303, heating plate; 304, heat conducting member; 305, fin; 306, air inlet; 307, air outlet; 308, first temperature sensor; 309, lower bottom plate; 309a, working port; 31, temperature control cover; 310, heating area; 311, first area; 312, second area; 312a, air inlet; 312b, air outlet; 313, mounting plate; 314, top plate; 315, heat insulation air layer; 316, flow equalizing plate ; 317, wind direction adjustment block; 317a, rotating shaft; 318, protrusion; 321, first heat insulation board; 322, second heat insulation board; 323, third heat insulation board; 4, flip mechanism; 40, driving member; 41, transmission member; 410, rack; 411, gear; 42, rotating shaft; 420, shaft seat; 43, base plate; 44, connecting block; 440, connecting part; 441, connecting port; 5, electronic control module; 50, slide rail; 9, memory bar. DETAILED DESCRIPTION

[0048] The following is a further non-restrictive detailed description of the technical solution of the invention in conjunction with the preferred embodiments and the accompanying drawings. In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or position relationship based on the orientation or position relationship shown in the accompanying drawings. In addition, the terms "first" and "second" are used only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and cannot be understood as limitations on the present invention.

[0049] like Figure 1 As shown, a memory stick test device according to an embodiment of the present invention is used to perform a performance test on a memory stick 9 at a controllable ambient temperature. The memory stick test device includes a device body 2 and a temperature control module 3. The device body 2 is used to perform a performance test on the memory stick 9, and a slot for plugging in the memory stick 9 is provided on the device body 2. The temperature control module 3 is movably disposed on the device body 2, and is capable of heating the memory stick 9 plugged in the slot to perform a performance test at a high temperature. By opening or closing the temperature control module 3, the tester can conveniently plug the memory stick 9 into the device body 2 without affecting the heating effect of the temperature control module 3.

[0050] Specifically, refer to Figure 6 The device body 2 includes a box body 1, a test host 20 and an electric control module 5. The box body 1 has an installation space 10, in which a fixing plate 100 is horizontally installed. The fixing plate 100 is fixed to the box body 1 by screws (not shown in the figure), and the installation space 10 is divided into a first installation space 101 and a second installation space 102 distributed vertically. The test host 20 is arranged in the first installation space 101 and fixed to the fixing plate 100 by screws. The electric control module 5 is arranged in the second installation space 102, and a slide rail 50 is arranged on the bottom plate 18 of the box body 1. The electric control module 5 is slidably arranged on the bottom plate 18 of the box body 1 through the slide rail 50, which is convenient for users to pull out or put the electric control module 5 into the device. The modular design is adopted to facilitate installation and later maintenance.

[0051] Further references Figure 2The test host 20 is used to test the memory stick 9. The test host 20 is provided with a plurality of test areas 21, and the test area 21 includes a plurality of slots for inserting the memory stick 9. In this embodiment, four test areas 21 are arranged along a straight line, and each test area 21 is provided with four slots arranged along the same straight line. It is found through experiments that the heat generated by the four memory sticks 9 during the test process has little effect on the ambient temperature, making it easier for the device to maintain the stability of the ambient temperature in the test area 21.

[0052] Focus on reference Figure 2 The temperature control module 3 includes a plurality of temperature control units 30 corresponding to the plurality of test areas 21. The plurality of temperature control units 30 are used to heat the memory bars 9 in the corresponding test areas 21 respectively. The temperature control units 30 are provided with a first temperature sensor 308 for monitoring the temperature in the test area 21. The test host 20 and the temperature control unit 30 are electrically connected to the electric control module 5, and the four temperature control units 30 can independently control the temperature of the corresponding test area 21, so as to more accurately adjust the test environment temperature and improve the accuracy of the test results.

[0053] Specific, focus on reference Figure 3 and Figure 4 , the temperature control module 3 also includes a temperature control cover 31, and four temperature control units 30 are arranged in a straight line and fixedly connected to the temperature control cover 31 by screws. The temperature control unit 30 is provided with a speed-adjustable fan 300 and a heating component 301 in sequence along the air flow direction. The temperature control unit 30 also has a temperature control area 302, and the temperature control area 302 is located at the downwind of the heating component 301. Driven by the speed-adjustable fan 300, the external airflow enters from the air inlet 306 of the temperature control unit 30, and passes through the heating component 301 and the temperature control area 302 in sequence. The heating component 301 can heat the passing airflow so that the airflow entering the temperature control area 302 is heated, and a working port 309a is opened on the lower bottom plate 309 of the temperature control unit 30 corresponding to the temperature control area 302, and the memory bar 9 can pass through the working port 309a, so that the temperature control unit 30 can heat the memory bar 9 on the corresponding test area 21. Finally, the airflow flows out from the air outlet 307 of the temperature control unit 30 to avoid airflow accumulation and affect the heating effect.

[0054] Optionally, the heating assembly 301 includes a heating plate 303 and a heat conducting member 304, the heating plate 303 is attached to the heat conducting member 304, a plurality of fins 305 are provided on the side of the heat conducting member 304 away from the heating plate 303, and the airflow can pass between the plurality of fins 305. The heat of the heating plate 303 can be transferred to the plurality of fins 305 through the portion attached to the heat conducting member 304, and the airflow will be heated when passing between the plurality of fins 305, and then flow to the temperature control area 302 to heat the test area 21.

[0055] Optional, see Figure 3 The temperature control unit 30 is approximately rectangular, and an air inlet 306 and an air outlet 307 are respectively provided at two ends that are far apart. The temperature control unit 30 has a strip space inside. In addition, a first heat insulation board 321 is fixedly installed in the strip space. The first heat insulation board 321 is vertically arranged to divide the side of the strip space close to the air inlet 306 into a heating area 310. A second heat insulation board 322 and a third heat insulation board 323 are also arranged in the strip space. The heating area 310 is formed by the first heat insulation board 321, the second heat insulation board 322, the third heat insulation board 323 and the speed regulating fan 300, wherein the third heat insulation board 323 is arranged above the bottom plate 309 and is in contact with the bottom plate 309. A mounting plate 313 is provided in the heating area 310, and the mounting plate 313 divides the heating area 310 into a first area 311 and a second area 312. The heating plate 303 is provided in the first area 311, and the heat conducting member 304 is fixedly connected to the mounting plate 313 and at least partially located in the first area 311. The plurality of fins 305 are at least partially located in the second area 312. In this embodiment, the mounting plate 313, the first heat insulating plate 321 and the second heat insulating plate 322 are arranged to form the above-mentioned first area 311, and the heating plate 303 is arranged in the first area 311 to ensure that the temperature of other areas except the working area of ​​the heating plate 303, i.e., the first area 311, will not rise due to the heat emitted by the heating plate 303, thereby damaging the equipment or injuring the tester.

[0056] Optionally, the top plate 314 of the temperature control unit 30 is also made of a heat-insulating material, and a heat-insulating air layer 315 is formed between the top plate 314 and the second heat-insulating plate 322 , so as to further prevent the heating plate 303 from affecting other areas through double medium insulation.

[0057] Furthermore, the air outlet 312b of the second area 312 is connected to the temperature control area 302, and a speed-regulating fan 300 is installed at the air inlet 312a. In addition, the cross-section of the second area 312 gradually decreases along the air flow direction, so that the air flow is accelerated when it flows out from the air outlet 312b, so that the heated air flow has a sufficient flow rate when entering the temperature control area 302, and can better cover the entire temperature control area 302, thereby ultimately making the temperature of the test area 21 more uniform and the test results more accurate.

[0058] Optionally, a wind direction adjustment block 317 is provided near the air outlet 312b, see Fig.15 The wind direction adjustment block 317 is approximately a triangular prism and is rotatably arranged on the lower base plate 309 through a rotating shaft 317a. The relatively turbulent airflow is converted into a relatively smooth airflow after passing through the wind direction adjustment block 317, thereby avoiding uneven heating and improving the accuracy of the test.

[0059] Optionally, a flow equalizer 316 is fixed between the second area 312 and the temperature control area 302. The flow equalizer 316 can make the airflow from the second area 312 to the temperature control area 302 more stable, so that the temperature in the temperature control area 302 is more uniform, so that the ambient temperature of the four memory bars 9 in the test area 21 is consistent, so that the test result is more accurate. Preferably, the flow equalizer 316 is arranged in close contact with the first heat insulation board 321, so that the structure in the temperature control unit 30 is more compact.

[0060] Further reference is made to Figure 7 , the test host 20 is set on the fixed plate 100, and the test area 21 is exposed outside the box 1. The temperature control module 3 is rotatably connected to the box 1 and can rotate between a closed position and an open position. When the temperature control module 3 is in the closed position, the temperature control unit 30 is in close contact with the box 1, and the memory stick 9 is at least partially located in the temperature control area 302. When the temperature control module 3 is in the open position, the test area 21 is exposed outside, and the memory stick 9 can be plugged into the slot. The method of rotating the temperature control module 3 to open or close facilitates the plugging and testing of the memory stick 9.

[0061] Specifically, the memory stick test device further includes a flip mechanism 4 , which is disposed on the housing 1 and is used to drive the temperature control module 3 to rotate between a closed position and an open position, so as to facilitate the insertion and testing of the memory stick 9 .

[0062] Further, focus on Figures 8 to 10 The flip mechanism 4 includes a driving member 40, a transmission member 41 and a rotating shaft 42. The temperature control module 3 is fixedly connected to the rotating shaft 42. The transmission member 41 includes at least one rack 410 and a gear 411 meshing with at least one rack 410. The gear 411 is coaxially arranged and fixedly connected to the rotating shaft 42. The driving member 40 can drive the rack 410 to move along its setting direction to drive the gear 411 to rotate along its axial direction. The temperature control module 3 is fixedly connected to the rotating shaft 42, so that when the rotating shaft 42 rotates, the temperature control module 3 can rotate around the rotating shaft 42.

[0063] In this embodiment, the flip mechanism 4 also includes a base plate 43, which is horizontally fixed in the box body 1. Both ends of the rotating shaft 42 are fixed on the base plate 43 through axle seats 420, and bearings are arranged in the axle seats 420. The rotating shaft 42 is rotatably connected to the two axle seats 420 through the bearings. This is the prior art and will not be described in detail. Two gears 411 are respectively fixed on the two ends of the rotating shaft 42 and are coaxially arranged. Two racks 410 are arranged in parallel and slidably arranged on the base plate 43 through guide rails, and are respectively meshed with the two racks 410. The driving member 40 is also fixed on the base plate 43 by screws, and the output shaft of the driving member 40 can drive the rack 410 to move along the guide rail direction. When the driving member 40 drives the rack 410 to move, the rack 410 drives the gear 411 meshed therewith to rotate, thereby driving the rotating shaft 42 to rotate along its axial direction. In this embodiment, the driving member 40 adopts a large-thrust electric rod, so that the flipping of the temperature control module 3 is stable and reliable, and the electric push rod has a self-locking function to prevent the temperature control module 3 from suddenly falling and closing when the equipment stops working due to power failure or other reasons, causing injury to the tester.

[0064] Optionally, the flip mechanism 4 further includes two connecting blocks 44, which are respectively fixedly connected to the two ends of the rotating shaft 42 and can rotate synchronously with the rotating shaft 42. A connecting portion 440 is also convexly provided on the connecting block 44, and the temperature control upper cover 31 of the temperature control unit 30 is fixed to the connecting portion 440 by screws, so that the temperature control unit 30 can rotate synchronously with the rotating shaft 42. In addition, the connecting block 44 is hollow and has a connecting port 441. The cable of the electric control module 5 can pass through the connecting port 441 to connect with the temperature control unit 30, which is convenient for installation and reduces the size of the device, and is not easy to damage the cable.

[0065] Optional, focus on reference Figure 2 , a safety light curtain 15 and a limit sensor 16 are also provided on the box body 1. The safety light curtain 15 is provided on both sides above the test host 20. When the safety light curtain 15 detects that a tester is operating the equipment, the temperature control module 3 cannot be closed to protect the tester. At the same time, since the temperature control cover 31 will also trigger the safety light curtain 15 during the closing process, the present invention is also provided with a detection system. When the temperature control cover 31 is closed to a certain angle with the test host 20, which is 15° in this embodiment, the safety light curtain 15 will not work to avoid affecting the closing of the temperature control module 3. In this embodiment, the safety light curtain 15 is composed of a photoelectric sensor, which has a simple structure and low cost, and is convenient for later maintenance and replacement.

[0066] During the closing process of the temperature control module 3, if the temperature control cover 31 is closed normally, the protrusion 318 on the temperature control cover 31 and the limit sensor 16 are intertwined and will not trigger the limit sensor 16; if the temperature control cover 31 is offset due to other factors such as external force, when the temperature control cover 31 is closed, the protrusion 318 will trigger the limit sensor 16 to stop the driving component 40 from working, thereby avoiding further closing of the temperature control cover 31 to cause damage to the equipment, thereby improving the safety of the equipment.

[0067] In addition, four foot supports 17 are installed at the bottom of the box 1 to elevate the device to prevent water from entering the device or the bottom from being unable to ventilate and affecting heat dissipation.

[0068] Further, focus on Figure 7 The test host 20 includes a test motherboard 200, a heat sink 202 attached to the CPU, and a heat dissipation fan 203. A plurality of slots are arranged on one side of the test motherboard 200, and a CPU is arranged on the other side. The heat dissipation fan 203 is used to discharge the heat of the heat sink 202 out of the test host 20. During the test process, the memory bar 9 on the test motherboard 200 needs to be heated, and the CPU needs to be cooled, which conflict with each other. Therefore, the present invention arranges the slot and the CPU on both sides of the test motherboard 200 respectively, and arranges a CPU heat dissipation mechanism, namely, a heat sink 202 and a heat dissipation fan 203 on the side where the CPU is arranged to dissipate the CPU, so that the CPU on the test motherboard 200 has a good heat dissipation effect, and will not affect the heating of the memory bar 9 on the slot on the other side, thereby ensuring the accuracy of the test result.

[0069] Specific, focus on reference Figure 6 The test host 20 includes a housing 201, a CPU, a heat sink 202 and a heat sink fan 203 are all arranged in the housing 201, and a slot is exposed outside the housing 201, so that the test host 20 can be disassembled separately for later repair and maintenance.

[0070] In addition, the test host 20 further includes a cover plate 204 and a support plate 207. The support plate 207 is fixedly connected to the housing 201 and forms a heat dissipation space with the housing 201. The test motherboard 200 is fixed on the support plate 207, and the CPU and the heat dissipation block 202 are arranged in the heat dissipation space. Six heat dissipation fans 203 are arranged on one side of the housing 201 to blow air out of the housing 201 to take away the heat of the heat dissipation block 202 and thus dissipate heat for the CPU.

[0071] Further references Fig.11 and Fig.14, the cover plate 204 is arranged above the test mainboard 200, and a plurality of test ports 205 corresponding to the test area 21 are formed on the cover plate 204, and a seal 206 is arranged around the test port 205. In the present embodiment, the seal 206 comprises a first sealing ring 206a and a second sealing ring 206b. When the temperature control module 3 is in the closed position, one side of the first sealing ring 206a abuts against the cover plate 204, and the other side abuts against the lower bottom plate 309 of the temperature control unit 30, and one side of the second sealing ring 206b abuts against the cover plate 204, and the other side abuts against the test mainboard 200. The first sealing ring 206a and the second sealing ring 206b seal the test area 21, so that the test environment of the memory stick 9 in the test area 21 is stable and will not be disturbed by external factors, thereby improving the accuracy of the test results.

[0072] In addition, refer to Fig.12 , Fig.13 In this embodiment, the front panel 11 of the box 1 is provided with a control button 110 electrically connected to the electric control module 5, an emergency stop button 111, an alarm buzzer 112, a touch screen 113 electrically connected to the test mainboard 200, and a status display light 114, wherein the control button 110 is used to control the start and stop of the device, the emergency stop button 111 is used to shut down the device in an emergency state, the alarm buzzer 112 is used to alarm when the device fails, the touch screen 113 is used for the tester to operate and select the test items, and the status display light 114 is provided with four groups, corresponding to the four test areas 21 respectively, and each group of status display lights 114 is provided with 4, corresponding to the four slots one by one, for displaying the test status of the memory stick 9 on the corresponding slot. The rear panel 12 of the box 1 is provided with a power interface 120 and an IO interface 121 electrically connected to the electric control module 5, respectively used for power input and plugging in IO devices or signal output, so that the test results can be exported to an external device for storage or call.

[0073] During operation, first, the temperature control module 3 is in the open state, the staff inserts the memory stick 9 into the slot in the test area 21, starts the control button 110, and the electric control module 5 controls the flip mechanism 4 to close the temperature control cover 31, so that the temperature control area 302 on the temperature control unit 30 is connected and closely connected with the corresponding test area 21, then the heating plate 303 and the speed-adjustable fan 300 in the temperature control unit 30 are started to blow hot air into the test area 21 to heat the memory stick 9, and at the same time, the test motherboard 200 starts testing.

[0074] The above embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present invention. It should be pointed out that, for a person of ordinary skill in the art, several modifications and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention patent shall be subject to the attached claims.

Claims

1. A memory stick test device for performing a performance test on a memory stick (9) at a controllable ambient temperature, characterized in that: The memory bar testing device comprises: A test host (20), the test host (20) being used to test the memory stick (9), the test host (20) being provided with a plurality of test areas (21), the test areas (21) comprising a plurality of slots for plugging the memory stick (9); A temperature control module (3), the temperature control module (3) comprising a plurality of temperature control units (30) corresponding one to the plurality of test areas (21), the plurality of temperature control units (30) being used to heat the memory bars (9) in the corresponding test areas (21) respectively, and a first temperature sensor (308) being provided in the temperature control unit (30) for monitoring the temperature in the test area (21); The electric control module (5), the test host (20) and the temperature control unit (30) are all electrically connected to the electric control module (5).

2. The memory bar testing device according to claim 1, characterized in that: The temperature control unit (30) is provided with a speed-adjustable fan (300) and a heating component (301) in sequence along the airflow direction. The temperature control unit (30) also has a temperature control area (302), and the temperature control area (302) is located at the downwind outlet of the heating component (301); Driven by the speed-adjustable fan (300), external airflow enters from the air inlet (306) of the temperature control unit (30), passes through the heating component (301) and the temperature control area (302) in sequence, and flows out from the air outlet (307) of the temperature control unit (30); A working opening (309a) is provided on the lower bottom plate (309) of the temperature control unit (30) at a position corresponding to the temperature control area (302), and the memory bar (9) can pass through the working opening (309a).

3. The memory bar testing device according to claim 2, characterized in that: The heating component (301) comprises a heating plate (303) and a heat conducting member (304), wherein the heating plate (303) is in contact with the heat conducting member (304), and a plurality of fins (305) are provided on a side of the heat conducting member (304) away from the heating plate (303), and the airflow can pass between the plurality of fins (305).

4. The memory bar testing device according to claim 3, characterized in that: The temperature control unit (30) has a heating area (310), and a mounting plate (313) is arranged in the heating area (310). The mounting plate (313) divides the heating area (310) into a first area (311) and a second area (312). The heating plate (303) is arranged in the first area (311), the heat conducting member (304) is fixedly connected to the mounting plate (313) and is at least partially located in the first area (311), and the plurality of fins (305) are at least partially located in the second area (312).

5. The memory bar testing device according to claim 4, characterized in that: The air outlet (312b) of the second area (312) is connected to the temperature control area (302), and the speed-adjustable fan (300) is installed at the air inlet (312a), and the cross-section of the second area (312) gradually decreases along the airflow direction.

6. The memory bar testing device according to claim 2, characterized in that: The memory stick test device also includes a housing (1), the test host (20) is arranged on the housing (1), the temperature control module (3) is rotatably connected to the housing (1) and can be rotated between a closed position and an open position; when the temperature control module (3) is in the closed position, the temperature control unit (30) is in close contact with the housing (1); the memory stick (9) is at least partially located in the temperature control area (302); when the temperature control module (3) is in the open position, the test area (21) is exposed to the outside, and the memory stick (9) can be plugged into the slot.

7. The memory bar testing device according to claim 5, characterized in that: The memory stick testing device further comprises a flipping mechanism (4), wherein the flipping mechanism (4) is arranged on the box body (1) and is used to drive the temperature control module (3) to rotate between a closed position and an open position; The flip mechanism (4) comprises a driving member (40), a transmission member (41) and a rotating shaft (42); the temperature control module (3) is fixedly connected to the rotating shaft (42); the transmission member (41) comprises at least one rack (410) and a gear (411) meshing with the at least one rack (410); the gear (411) is coaxially arranged and fixedly connected to the rotating shaft (42); the driving member (40) can drive the rack (410) to move along its setting direction to drive the gear (411) to rotate along its axial direction; and the temperature control module (3) is fixedly connected to the rotating shaft (42).

8. The memory bar testing device according to claim 1, characterized in that: The test host (20) comprises a test mainboard (200), a heat sink (202) attached to the CPU, and a heat dissipation fan (203); a plurality of slots are arranged on one side of the test mainboard (200), and a CPU is arranged on the other side; the heat dissipation fan (203) is used to discharge heat from the heat sink (202) out of the test mainboard (20).

9. The memory bar testing device according to claim 8, characterized in that: The test host (20) comprises a housing (201), the CPU, the heat sink (202) and the heat sink fan (203) are all arranged inside the housing (201), and the slot is exposed outside the housing (201).

10. The memory bar testing device according to claim 8, characterized in that: The test host (20) further comprises a cover plate (204), the cover plate (204) being arranged above the test main board (200), and a plurality of test ports (205) corresponding to the test area (21) being formed on the cover plate (204), and sealing members (206) being arranged around the test ports (205).

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