Assembly method and structure of thick film hybrid integrated circuit in electronic component

Abstract

The invention provides an assembling method and structure of a thick-film hybrid integrated circuit in an electronic component, and the method comprises the following steps: firstly, forming a stress release groove of a pin of the thick-film hybrid integrated circuit on a substrate, arranging a bonding pad on the substrate, and then cutting the pin, and enabling the pin of the thick film hybrid integrated circuit to pass through the stress release groove, connecting the pin with the PCB substrate through the transition piece, and finally completing the assembly of the residual thick film hybrid integrated circuit on the electronic component. The stress release groove is formed in the substrate, and the pin of the thick film hybrid integrated circuit is connected with the substrate through the buffer piece, so that the thick film hybrid integrated circuit is extremely simple to disassemble and maintain on the PCB substrate, quality risks such as substrate bonding pad upwarp and substrate damage cannot be caused, visibility and checkability are achieved, and the method is suitable for large-scale popularization and application. Therefore, the welding state of the non-welding surface of the pin, the condition of metal redundancy causing insulation risk and the state of the glass insulator can be checked after welding, and the reliability of the product is ensured.

Description

Technical Field

[0001] The present application relates to the technical field of thick film hybrid integrated circuit assembly, and in particular to an assembly method and structure of a thick film hybrid integrated circuit in an electronic component. Background Art

[0002] Thick film hybrid integrated circuits are highly reliable circuits. Generally, electronic components are equipped with a large number of thick film hybrid integrated circuits to achieve high reliability output of specific circuit functions by electronic components to meet the needs of electronic complete machines. However, the use environment of electronic components is extremely harsh, and the reliability requirements of electronic complete machines are getting higher and higher. Electronic complete machines and other equipment need to achieve the goal of continuously improving their reliability, which brings challenges to the assembly of thick film hybrid integrated circuits in electronic components. 2 In the strict environmental tests of electronic complete machines, such as random vibration tests with a response spectrum of 5000g or more and shock response spectrum tests with a response spectrum of 5000g or more, cracks appeared in the pin kovar solder joints with glass insulators on thick film hybrid integrated circuits on electronic components, resulting in failure. This problem has seriously affected the need to improve the reliability of electronic complete machines. This problem needs to be solved urgently, otherwise it is impossible to ensure that the electronic complete machine can pass the strict environmental tests smoothly.

[0003] At present, the existing traditional installation of thick film hybrid integrated circuits has the following shortcomings:

[0004] In the existing method, the pins of thick-film hybrid integrated circuits are assembled to the PCB board by blind soldering, which makes it impossible to check the tin penetration rate, metal excess and glass insulator status of the pin solder joints. As a result, the product has always been subject to uncontrollable quality risks, and the product is difficult to repair, resulting in product scrapping from time to time.

[0005] In the existing methods, it is extremely difficult to disassemble and repair thick-film hybrid integrated circuits on PCB substrates, and it may cause various quality risks such as PCB pad warping and PCB board damage.

[0006] In the existing method, the pins of thick-film hybrid integrated circuits are directly inserted into the solder holes of the PCB board for welding, which is essentially a high-stress hard connection. In the rigorous environmental tests of electronic components such as long-term high-intensity random vibration and high-intensity impact, the problem of cracking of the kovar solder joints inside the thick-film hybrid integrated circuit may occur.

[0007] In the existing method, the traditional direct pin cutting method is used to reduce the pins, so that the pins, glass insulators and Kovar ring solder joints of the thick film hybrid integrated circuit are subjected to huge stress, which lays a hidden danger of failure of the Kovar ring solder joints of subsequent products. Summary of the invention

[0008] To solve the above problems, the present application proposes an assembly method and structure of a thick film hybrid integrated circuit in an electronic component, eliminating the installation quality risks and hidden dangers, improving the assembly quality of the thick film hybrid integrated circuit in the electronic component, enhancing the product reliability, and enhancing the reliability of the electronic component.

[0009] The present application is achieved through the following technical solutions:

[0010] The present application proposes an assembly method and structure of a thick film hybrid integrated circuit in an electronic component, and the method includes the following steps:

[0011] (1) First, open a stress relief groove for the pins of the thick film hybrid integrated circuit on the substrate of the electronic component, and set pads on the substrate near the stress relief groove;

[0012] (2) Cut the pins of the thick film hybrid integrated circuit;

[0013] (3) Pass the pins of the thick film hybrid integrated circuit through the stress relief groove, and at the same time fix the thick film hybrid integrated circuit on the substrate;

[0014] (4) Sleeve-weld one end of the transition piece on the pins of the thick film hybrid integrated circuit, and weld the other end of the transition piece on the pad of the substrate;

[0015] (5) Complete the assembly of the remaining thick film hybrid integrated circuits on the electronic component.

[0016] Further, in step (1), the stress relief groove penetrates the substrate, and the width of the stress relief groove is greater than the diameter of the pins of the thick film hybrid integrated circuit.

[0017] Further, in step (2), the pins of the thick film hybrid integrated circuit are cut by means of low-stress laser cutting.

[0018] Further, in step (4), the transition piece includes a copper strip, one end of the copper strip is connected to the end of the pin of the thick film integrated circuit that penetrates the stress relief groove, and the other end of the copper strip is connected to the pad on the substrate.

[0019] Further, the copper strip is in an Ω shape.

[0020] Further, in step (4), the transition piece includes a copper ring and a flexible wire, the copper ring is sleeve-welded on the end of the pin of the thick film integrated circuit that penetrates the stress relief groove, one end of the flexible wire is connected to the copper ring, and the other end of the flexible wire is connected to the pad on the substrate.

[0021] Further, the flexible wire includes a first wire segment, a second wire segment, and a third wire segment. One end of the first wire segment is connected to the copper ring, the other end of the first wire segment is connected to one end of the second wire segment, the other end of the second wire segment is connected to one end of the third wire segment, and the other end of the third wire segment is connected to the pad on the substrate.

[0022] Further, the second wire segment is arc-shaped.

[0023] Further, it includes a thick film hybrid integrated circuit module, a transition piece, and a PCB substrate. The thick film hybrid integrated circuit module includes a thick film hybrid integrated circuit module body and thick film hybrid integrated circuit pins. One end of the thick film hybrid integrated circuit pins is connected to the thick film hybrid integrated circuit module body, the other end of the thick film hybrid integrated circuit pins is connected to one end of the transition piece, and the other end of the transition piece is connected to the PCB substrate.

[0024] Advantages of the present application: (1) By opening stress relief grooves on the PCB substrate in the present invention, it is convenient to install the thick film hybrid integrated circuit pins on the PCB substrate, and the thick film hybrid integrated circuit pins and the PCB substrate are connected through a transition piece with buffering ability, making the disassembly and repair of the thick film hybrid integrated circuit on the PCB substrate extremely simple, and various quality risks such as the warping of the PCB substrate pads and the damage of the PCB substrate will not occur, and it has visibility and inspectability, so that the welding state of the non-welding surface of the pins, the situation of metal excess that causes insulation risks, and the state of the glass insulators can be inspected after welding, ensuring the reliability of the product. This method can completely eliminate these quality risks and hidden dangers, thoroughly improve the assembly quality of the thick film hybrid integrated circuit in the electronic component, enhance the product reliability, and complete the task of enhancing the reliability of the electronic component.

[0025] (2) In the present invention, low-stress laser cutting is performed on the thick film hybrid integrated circuit pins, avoiding the traditional high-stress pin shearing method and avoiding stress on the fragile glass insulators and the solder joints of the pin kovar rings.

[0026] (3) The present invention uses a combination of a copper strip or a copper ring and a flexible wire as the transition piece to connect the thick film hybrid integrated circuit pins to the PCB substrate, resulting in extremely low stress on the thick film hybrid integrated circuit pins, glass insulators, and kovar rings during production, and stress damage to the kovar ring solder joints will not occur during long-term high-strength random vibration and high-strength impact. Description of the Drawings

[0027] Figure 1 is a schematic flow diagram of the present invention;

[0028] Figure 2 is a schematic assembly structure diagram of the present invention;

[0029] Figure 3 This is a schematic structural diagram of the transition piece in Embodiment 2 of the present invention.

[0030] The descriptions of the reference numerals in the figure are as follows:

[0031] 1. Thick film hybrid integrated circuit module body; 2. Glass insulator; 3. Kovar ring solder joint; 4. Thick film hybrid integrated circuit pin; 5. Transition piece; 6. PCB substrate; 7. Stress relief groove; 8. Pad; 9. Copper ring; 10. First wire segment; 11. Second wire segment; 12. Third wire segment. Detailed implementation manners

[0032] Next, the technical solutions in the embodiments of the present application will be clearly and completely described with reference to the accompanying drawings in the embodiments of the present application. The same or similar reference numerals represent the same or similar elements or elements with the same or similar functions throughout. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0033] It should be noted that all directional indications (such as up, down, left, right, front, back,...) in the embodiments of the present application are only used to explain the relative positional relationship and movement conditions between components in a specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications will also change accordingly.

[0034] In addition, the descriptions involving "first", "second", etc. in the present application are only for descriptive purposes, and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the fact that those of ordinary skill in the art can implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the protection scope required by the present invention.

[0035] Please refer to Figure 1-2, this application proposes an assembly method and structure of a thick film hybrid integrated circuit in an electronic component. The structure includes a thick film hybrid integrated circuit module, a transition piece 5, and a PCB substrate 6. The thick film hybrid integrated circuit module includes a thick film hybrid integrated circuit module body 1, a glass insulator 2, a kovar ring, and thick film hybrid integrated circuit pins 4. The glass insulator 2 is arranged on the bottom plate of the thick film hybrid integrated circuit module body 1. The upper end of the thick film hybrid integrated circuit pin 4 passes through the glass insulator 2 and extends into the thick film hybrid integrated circuit module body 1. One end of the thick film hybrid integrated circuit pin 4 placed inside the thick film hybrid integrated circuit module body 1 is connected to the thick film hybrid integrated circuit module body 1 through a kovar ring. The kovar ring is connected to the thick film hybrid integrated circuit module body 1 through a kovar ring solder joint 3. The lower end of the thick film hybrid integrated circuit pin 4 is connected to one end of the transition piece 5, and the other end of the transition piece 5 is connected to the PCB substrate 6. The thick film hybrid integrated circuit pin 4 and the PCB substrate 6 are connected through the transition piece 5 with buffering ability, making the disassembly and repair of the thick film hybrid integrated circuit on the PCB substrate 6 extremely simple, and not causing various quality risks such as the warping of the solder pads of the PCB substrate 6 and the damage of the PCB substrate 6. Moreover, it has visibility and inspectability, enabling the inspection of the soldering state of the non-soldering surface of the pins, the situation of metal residues causing insulation risks, and the state of the glass insulator 2 after soldering, ensuring the reliability of the product. This method can completely eliminate these quality risks and hidden dangers, thoroughly improve the assembly quality of the thick film hybrid integrated circuit in the electronic component, enhance the product reliability, and complete the task of improving the reliability of the electronic component.

[0036] Embodiment 1

[0037] According to the above structure, the present invention discloses an assembly method of a thick film hybrid integrated circuit in an electronic component, including the following steps:

[0038] (1) First, a stress relief groove 7 for the thick film hybrid integrated circuit pins is opened on the substrate of the electronic component, and a solder pad 8 is arranged on the substrate near the stress relief groove 7.

[0039] Specifically, a stress relief groove 7 is opened at the corresponding position for installing the thick film hybrid integrated circuit on the PCB substrate 6 of the electronic component. The stress relief groove 7 penetrates the PCB substrate 6, and the width of the stress relief groove 7 is greater than the diameter of the thick film hybrid integrated circuit pin 4, so that the thick film hybrid integrated circuit pin 4 can smoothly pass through the stress relief groove 7. A solder pad 8 is arranged on the PCB substrate 6 near the stress relief groove 7 for connecting the PCB substrate 6 and the thick film hybrid integrated circuit pin 4.

[0040] (2) Cut the thick film hybrid integrated circuit pin 4.

[0041] Specifically, the traditional method of cutting the pins of a thick film hybrid integrated circuit is to use tools such as flat nose pliers to perform high-stress pin shearing. Using this method is likely to affect the glass insulator 2 and the solder joint 3 of the pin kovar ring. In this application, the pins 4 of the thick film hybrid integrated circuit are cut by low-stress laser, avoiding stress on the fragile glass insulator 2 and the solder joint 3 of the pin kovar ring.

[0042] (3) Pass the pins 4 of the thick film hybrid integrated circuit through the stress relief groove 7, and at the same time fix the thick film hybrid integrated circuit on the substrate.

[0043] Specifically, during installation, the end of the pin 4 of the thick film hybrid integrated circuit away from the thick film hybrid integrated circuit module body 1 passes through the stress relief groove 7, so that one end of the pin 4 of the thick film hybrid integrated circuit extends beyond the side of the PCB substrate 6 away from the thick film hybrid integrated circuit module body 1. At the same time, the entire thick film hybrid integrated circuit is fixed above the PCB substrate 6. This installation method makes the disassembly and repair of the thick film hybrid integrated circuit on the PCB substrate 6 extremely simple, and will not cause various quality risks such as warping of the pads 8 of the PCB substrate 6 and damage to the PCB substrate 6.

[0044] (4) Weld one end of the transition piece 5 to the pin 4 of the thick film hybrid integrated circuit, and weld the other end of the transition piece 5 to the pad 8 on the substrate.

[0045] Specifically, the transition piece 5 has a buffering ability, solving the problem that the rigid connection between the pins 4 of the existing thick film hybrid integrated circuit and the PCB substrate 6 causes high stress on the pins 4 of the thick film hybrid integrated circuit due to vibration or high-intensity impact during use. It should be noted that in this embodiment, the transition piece 5 includes a copper strip. One end of the copper strip is connected to the end of the thick film integrated circuit pin 4 passing through the stress relief groove 7, and the other end of the copper strip is connected to the pad 8 on the substrate. Among them, the copper strip is in a Ω shape. The Ω-shaped copper strip endows the copper strip with buffering performance. This results in extremely low stress on the pins 4, glass insulator 2 and kovar ring of the thick film hybrid integrated circuit during the assembly process, and will not cause stress damage to the kovar ring solder joint 3 during long-term high-strength random vibration and high-strength impact.

[0046] (5) Complete the assembly of the remaining thick film hybrid integrated circuits on the electronic component

[0047] Specifically, the PCB substrate 6 is provided with mounting holes. An installation rod is connected to the bottom plate of the thick film hybrid integrated circuit body 1. One end of the installation rod is connected to the bottom plate of the thick film hybrid integrated circuit body 1, and the other end of the installation rod passes through the mounting hole and extends downward. The end of the installation rod passing through the mounting hole is connected to the PCB substrate 6 through a fastener, so that the thick film hybrid integrated circuit can be fixed on the PCB substrate 6, completing the installation of the thick film hybrid integrated circuit.

[0048] Embodiment 2

[0049] This embodiment discloses an assembly method of a thick film hybrid integrated circuit in an electronic component. As shown Figure 3 in the figure, different from Embodiment 1, the transition piece 5 includes a copper ring 9 and a flexible wire. The copper ring is soldered and sleeved on one end of the pin 4 of the thick film integrated circuit passing through the stress relief groove 7. One end of the flexible wire is connected to the copper ring 9, and the other end of the flexible wire is connected to the pad 8 on the substrate. The flexible wire includes a first wire segment 10, a second wire segment 11, and a third wire segment 12. One end of the first wire segment 10 is connected to the copper ring 9, the other end of the first wire segment 10 is connected to one end of the second wire segment 11, the other end of the second wire segment 11 is connected to one end of the third wire segment 12, and the other end of the third wire segment 12 is connected to the pad 8 on the substrate. Among them, during assembly, the flexible wire is bent closely against the PCB substrate 6 and soldered to the corresponding pad 8 on the PCB substrate 6, so that the second wire segment 11 is arc-shaped, resulting in extremely low stress on the pins 4 of the thick film hybrid integrated circuit, the glass insulator 2, and the kovar ring during assembly, and during long-term high-strength random vibration and high-strength impact, the kovar ring solder joint 3 will not be damaged by stress.

[0050] Of course, the present application can also have many other implementation manners. Based on this implementation manner, other implementation manners obtained by those of ordinary skill in the art without any creative work belong to the scope protected by the present application.

Claims

1. A method for assembling a thick film hybrid integrated circuit in an electronic component, characterized in that, it comprises the following steps: (1) First, a stress relief groove for the pins of the thick film hybrid integrated circuit is formed on the substrate of the electronic component, and pads are arranged on the substrate near the stress relief groove; (2) Cut the pins of the thick film hybrid integrated circuit; (3) Pass the pins of the thick film hybrid integrated circuit through the stress relief groove, and at the same time fix the thick film hybrid integrated circuit on the substrate; (4) Sleeve-weld one end of the transition piece on the pins of the thick film hybrid integrated circuit, and weld the other end of the transition piece on the pad on the substrate; (5) Complete the assembly of the remaining thick film hybrid integrated circuits on the electronic component.

2. The method for assembling a thick film hybrid integrated circuit in an electronic component according to claim 1, characterized in that, in step (1), the stress relief groove penetrates the substrate, and the width of the stress relief groove is greater than the diameter of the pins of the thick film hybrid integrated circuit.

3. The method for assembling a thick film hybrid integrated circuit in an electronic component according to claim 1, characterized in that, in step (2), the pins of the thick film hybrid integrated circuit are cut by a low-stress laser cutting method.

4. The method for assembling a thick film hybrid integrated circuit in an electronic component according to claim 1, characterized in that, in step (4), the transition piece includes a copper strip, one end of the copper strip is connected to the end of the thick film integrated circuit pin passing through the stress relief groove, and the other end of the copper strip is connected to the pad on the substrate.

5. The method for assembling a thick film hybrid integrated circuit in an electronic component according to claim 4, characterized in that, the copper strip is in an Ω shape.

6. The method for assembling a thick film hybrid integrated circuit in an electronic component according to claim 1, characterized in that, in step (4), the transition piece includes a copper ring and a flexible wire, the copper ring is sleeve-welded on the end of the thick film integrated circuit pin passing through the stress relief groove, one end of the flexible wire is connected to the copper ring, and the other end of the flexible wire is connected to the pad on the substrate.

7. The method for assembling a thick film hybrid integrated circuit in an electronic component according to claim 6, characterized in that, the flexible wire includes a first wire segment, a second wire segment and a third wire segment, one end of the first wire segment is connected to the copper ring, the other end of the first wire segment is connected to one end of the second wire segment, the other end of the second wire segment is connected to one end of the third wire segment, and the other end of the third wire segment is connected to the pad on the substrate.

8. The method for assembling a thick film hybrid integrated circuit in an electronic component according to claim 7, characterized in that, the second wire segment is in an arc shape.

9. An assembly structure of a thick film hybrid integrated circuit in an electronic component, characterized in that, It includes a thick film hybrid integrated circuit module, a transition piece, and a PCB substrate. The thick film hybrid integrated circuit module includes a thick film hybrid integrated circuit module body and thick film hybrid integrated circuit pins. One end of the thick film hybrid integrated circuit pins is connected to the thick film hybrid integrated circuit module body, the other end of the thick film hybrid integrated circuit pins is connected to one end of the transition piece, and the other end of the transition piece is connected to the PCB substrate.

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