Apparatus and method for processing substrate

Abstract

The present invention provides an apparatus for processing a substrate, comprising: a processing chamber for processing a substrate with a processing solution; a processing solution supply pipe for supplying a liquid for liquid processing to the processing chamber; a mixing unit connected to the treatment solution supply pipe and having a mixing space formed therein; a first liquid conduit for supplying a first liquid to the mixing space; a second liquid conduit for supplying a second liquid to the mixing space; the air inlet pipeline is used for reducing the pressure of the mixing space; a first valve for adjusting the supply of the first liquid to the mixing space; a second valve for adjusting the supply of a second liquid to the mixing space; and an intake valve for adjusting whether to depressurize the mixing space, wherein the mixing unit includes a main body having the mixing space, and first, second, third and outlet ports connected to the first, second, intake and treatment solution supply lines, respectively.

Description

[0001] This application claims priority to and the benefit of Korean Patent Application No. 10-2023-0165732 filed in the Korean Intellectual Property Office on November 24, 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0002] The present invention relates to a substrate processing method and a substrate processing apparatus, and more particularly, to a substrate processing apparatus and a substrate processing method for processing a substrate by using a stable processing solution. Background Art

[0003] Semiconductor processes include processes for cleaning substrates from thin films, foreign matter, particles, etc. These processes are achieved by placing the substrate on a spin head with the patterned side facing up or down, supplying a processing solution to the substrate while the spin head rotates, and then drying the wafer.

[0004] The substrate cleaning process consists of a chemical solution treatment process for etching or delaminating contaminants on the substrate by chemical reaction, a rinsing process for rinsing the substrate treated with the chemical solution with deionized water, and a drying process for drying the rinsed substrate. The chemical solution treatment process uses various types of chemical solutions, one of which is a chemical (sulfuric acid peroxide mixture (SPM)) which is sulfuric acid (H 2 SO 4 ) and hydrogen peroxide solution (H 2 O 2 ). Figure 1 Schematic diagram of an example of a nozzle for mixing SPM. Figure 1 , the nozzle 540 includes a body 550. The body 550 has a mixing space 552 and a discharge port 554. In the mixing space 552, the sulfuric acid solution and the hydrogen peroxide solution are mixed. The mixing space 552 is connected to the sulfuric acid supply line 510 and the hydrogen peroxide solution supply line 520. The sulfuric acid solution supplied through the sulfuric acid supply line 510 and the hydrogen peroxide solution supplied through the hydrogen peroxide solution supply line 520 are mixed. The mixed solution is discharged through the discharge port 554. The discharged mixture is applied to the substrate.

[0005] However, when the SPM is mixed in the nozzle 540 , the SPM is discharged in an unstable mixing reaction state, so that a large amount of SPM may be scattered and a large amount of smoke may be generated. Summary of the invention

[0006] The present invention is directed to providing a substrate processing apparatus and method capable of suppressing scattering of a processing solution and generation of smoke when a stable processing solution is supplied to a substrate to process the substrate.

[0007] The present invention is also directed to providing a substrate processing apparatus and method capable of preventing a processing solution remaining in a nozzle from dripping onto a substrate.

[0008] Problems to be solved by the present invention are not limited to the above-mentioned problems, and those skilled in the art will clearly understand unmentioned problems through the following description.

[0009] An exemplary embodiment of the present invention provides an apparatus for processing a substrate, the apparatus comprising: a processing chamber for processing a substrate with a processing solution; a processing solution supply pipe for supplying a liquid for liquid processing to the processing chamber; a mixing unit connected to the processing solution supply pipe and having a mixing space formed therein; a first liquid pipe for supplying a first liquid to the mixing space; a second liquid pipe for supplying a second liquid to the mixing space; an air intake pipe for decompressing the mixing space; A first valve, wherein the first valve is used to regulate the supply of the first liquid to the mixing space; a second valve, wherein the second valve is used to regulate the supply of the second liquid to the mixing space; and an air intake valve, wherein the air intake valve is used to regulate whether to depressurize the mixing space, wherein the mixing unit includes a main body having the mixing space and a first inlet port, a second inlet port, a third inlet port and an outlet port connected to the mixing space, the outlet port is connected to the treatment solution supply pipeline, the first inlet port is connected to the first liquid pipeline, the second inlet port is connected to the second liquid pipeline, and the third inlet port is connected to the air intake pipeline.

[0010] According to an exemplary embodiment, the second inlet port may be disposed closer to the outlet port than the first inlet port.

[0011] According to an exemplary embodiment, the first inlet port may be disposed farther from the outlet port than the second inlet port and the third inlet port.

[0012] According to an exemplary embodiment, in the second liquid pipe or the second liquid supply source in which the second liquid is stored, a heater for heating the second liquid may be installed, and the third inlet port may be provided between the first inlet port and the second inlet port.

[0013] According to an exemplary embodiment, the outlet port may be located on a first wall among the walls forming the mixing space, the first inlet port, the second inlet port and the air inlet port may be located on a second wall among the walls forming the mixing space, the second wall may be adjacent to the first wall, and the second wall may be perpendicular to the first wall.

[0014] According to an exemplary embodiment, the device may further include: a first driver, the first driver is used to move the first valve in a direction toward or away from the end of the first inlet port, wherein when the first valve is in contact with the first inlet port, the supply of the first liquid can be blocked, and when the first valve is away from the first inlet port, the first liquid is supplied, the device may also include a second driver, the second driver is used to move the second valve in a direction toward or away from the end of the second inlet port, wherein when the second valve is in contact with the second inlet port, the supply of the second liquid can be blocked, and when the second valve is away from the second inlet port, the second liquid is supplied, and the device may also include a third driver, the third driver is used to move the third valve in a direction toward or away from the end of the third inlet port, wherein when the third valve is in contact with the third inlet port, the decompression of the mixing space can be blocked, and when the third valve is away from the third inlet port, the mixing space can be decompressed.

[0015] According to an exemplary embodiment, the mixing unit may further include a controller, and the controller may perform: a mixed solution processing operation, in which the first valve and the second valve are opened to generate a mixed solution in which the first liquid and the second liquid are mixed in the mixing space, and the mixed solution is supplied to the substrate to process the substrate; and a first liquid processing operation, in which, after the mixed solution processing operation, the second valve is closed and the first liquid is supplied from the mixing space to the substrate to process the substrate.

[0016] According to an exemplary embodiment, the controller may perform a decompression operation of closing the first valve and the second valve and opening the third valve to decompress the mixing space and remove the liquid in the mixing space after the first liquid processing operation.

[0017] According to an exemplary embodiment, the first liquid may be a hydrogen peroxide solution (H 2 O 2 ), and the second liquid may be sulfuric acid (H 2 SO 4 ).

[0018] According to an exemplary embodiment, the apparatus may further include a built-in mixer installed on the treatment solution supply pipe.

[0019] Another exemplary embodiment of the present invention provides a method for processing a substrate, the method comprising: a mixed solution processing operation, the mixed solution processing operation is used to generate a mixed solution of the first liquid and the second liquid in the mixing space, and supply the mixed solution to the substrate to process the substrate; a first liquid processing operation, the first liquid processing operation is to supply the first liquid from the mixing space to the substrate to process the substrate after the mixed solution processing operation; and a decompression operation, the decompression operation decompresses the mixing space to remove the mixed solution, the first liquid or the second liquid in the mixing space.

[0020] According to an exemplary embodiment, the mixed solution processing operation may include supplying the first liquid to a position farther from the outlet port than the second liquid.

[0021] According to an exemplary embodiment, the first liquid handling operation may include supplying the first liquid from a location farthest from the outlet port.

[0022] According to an exemplary embodiment, the mixed solution processing operation may include supplying the second liquid at a higher temperature than the first liquid, and the first liquid and the second liquid may be supplied into the mixing space at positions most spaced apart.

[0023] According to an exemplary embodiment, the mixed solution treatment operation may include secondarily mixing the first liquid and the second liquid through a built-in mixer installed in the treatment solution supply pipe.

[0024] According to an exemplary embodiment, the first liquid may be a hydrogen peroxide solution (H 2 O 2 ), and the second liquid may be sulfuric acid (H 2 SO 4 ).

[0025] Another exemplary embodiment of the present invention provides an apparatus for processing a substrate, the apparatus comprising: a processing chamber, the processing chamber being used to perform liquid processing on the substrate; a processing solution supply pipeline, the processing solution supply pipeline being used to supply liquid for liquid processing to the processing chamber; a mixing unit, the mixing unit being connected to the processing solution supply pipeline and having a mixing space formed therein; a hydrogen peroxide solution supply pipeline, the hydrogen peroxide solution supply pipeline being used to supply hydrogen peroxide solution to the mixing space; a sulfuric acid supply pipeline, the sulfuric acid supply pipeline being used to supply sulfuric acid to the mixing space; an air intake pipeline, the air intake pipeline being used to decompress the mixing space; a first valve, the first valve being used to adjust the supply of the hydrogen peroxide solution to the mixing space; and a second valve, The second valve is used to regulate the supply of the sulfuric acid to the mixing space; and an air intake valve, which is used to regulate whether to depressurize the mixing space, wherein the mixing unit includes a main body having the mixing space and a first inlet port, a second inlet port, a third inlet port and an outlet port connected to the mixing space, the outlet port is connected to the treatment solution supply pipeline, the first inlet port is connected to the hydrogen peroxide solution supply pipeline, the second inlet port is connected to the sulfuric acid supply pipeline, the third inlet port is connected to the air intake pipeline, the first inlet port is arranged to be farther away from the outlet port than the second inlet port and the third inlet port, and a heater for heating the sulfuric acid is installed in the sulfuric acid supply pipeline or a sulfuric acid supply source storing the sulfuric acid.

[0026] According to an exemplary embodiment, the second inlet port may be located between the first inlet port and the third inlet port.

[0027] According to an exemplary embodiment, the outlet port may be located on a first wall among the walls forming the mixing space, the first inlet port, the second inlet port and the air inlet port may be located on a second wall among the walls forming the mixing space, the second wall may be adjacent to the first wall, and the second wall may be perpendicular to the first wall.

[0028] According to an exemplary embodiment, the apparatus may further include a built-in mixer installed on the treatment solution supply pipe.

[0029] According to an exemplary embodiment, the device may further include: a first driver, the first driver is used to move the first valve in a direction toward or away from the end of the first inlet port, wherein when the first valve is in contact with the first inlet port, the supply of the hydrogen peroxide solution can be blocked, and when the first valve is away from the first inlet port, the hydrogen peroxide solution is supplied, the device may also include a second driver, the second driver is used to move the second valve in a direction toward or away from the end of the second inlet port, wherein when the second valve is in contact with the second inlet port, the supply of sulfuric acid can be blocked, and when the second valve is away from the second inlet port, the sulfuric acid is supplied, the device may also include a third driver, the third driver is used to move the third valve in a direction toward or away from the end of the third inlet port, wherein when the third valve is in contact with the third inlet port, the decompression of the mixing space can be blocked, and when the third valve is away from the third inlet port, the mixing space is decompressed.

[0030] According to the exemplary embodiment of the present invention, when a substrate is processed by supplying a stable processing solution to the substrate, scattering of the processing solution and generation of smoke can be suppressed.

[0031] According to the exemplary embodiment of the present invention, it is possible to prevent the processing solution remaining in the nozzle from falling onto the substrate.

[0032] The effects of the present invention are not limited to the above-mentioned effects, and those skilled in the art can clearly understand unmentioned effects from the present specification and the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] The various features and advantages of the non-limiting exemplary embodiments of the present specification will become apparent upon reading the detailed description in conjunction with the accompanying drawings. The drawings are for illustrative purposes only and should not be construed as limiting the scope of the claims. Unless expressly stated otherwise, the drawings are not to be considered drawn to scale. Various dimensions in the drawings may be exaggerated for clarity.

[0034] Figure 1 FIG. 1 is a diagram schematically showing an example of a nozzle for mixing SPM.

[0035] Figure 2 is a top plan view schematically illustrating a substrate processing apparatus according to an exemplary embodiment of the present invention.

[0036] Figure 3 It is schematically shown Figure 2 FIG. 1 is a diagram of an exemplary embodiment of a liquid processing chamber.

[0037] Figure 4is a cross-sectional view illustrating a cross section of a mixing unit according to an exemplary embodiment of the present invention.

[0038] Figure 5 is a flowchart illustrating a method of processing a substrate by using a substrate processing apparatus according to an exemplary embodiment of the present invention.

[0039] Figure 6 is a diagram showing a view of a mixing unit during a mixed solution processing operation.

[0040] Figure 7 is a diagram showing a view of a mixing unit during a first liquid processing operation.

[0041] Figure 8 is a diagram showing a view of the mixing unit during a decompression operation.

[0042] Fig. 9 is a diagram illustrating a view of a mixing unit according to another exemplary embodiment of the present invention.

[0043] Fig.10 is a diagram illustrating a view of a mixing unit according to another exemplary embodiment of the present invention.

[0044] Fig.11 is a diagram illustrating a view of a mixing unit according to another exemplary embodiment of the present invention. DETAILED DESCRIPTION

[0045] Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments are provided so that the present disclosure will be thorough and will fully convey the scope to those skilled in the art. Many specific details, such as examples of specific components, devices, and methods, are set forth to provide a thorough understanding of the embodiments of the present disclosure. It will be apparent to those skilled in the art that specific details need not be employed, that example embodiments may be embodied in many different forms, and that neither should be construed as limiting the scope of the present disclosure. In some example embodiments, well-known processes, well-known device structures, and well-known techniques are not described in detail.

[0046] The terms used herein are only used to describe the purpose of specific example embodiments, and are not restrictive. As used herein, unless the context clearly indicates otherwise, the situation where the number is not specified may be intended to include singular and plural forms. The terms "include", "comprise" and "have" are inclusive, and therefore specify the presence of the features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or their groups. Unless the execution order is specifically identified, the method steps, processes and operations described herein should not be interpreted as necessarily requiring them to be performed in the specific order discussed or described. It should also be understood that additional or alternative steps can be adopted.

[0047] When an element or layer is referred to as being "on", "engaged", "connected" or "coupled" to another element or layer, it may be directly "on", "engaged", "connected" or "coupled" to the other element or layer, or there may be intermediate elements or layers. Conversely, when an element is referred to as being "directly on", "directly engaged to", "directly connected to" or "directly coupled to" another element or layer, there may be no intermediate elements or layers. Other words used to describe the relationship between elements (e.g., "between" versus "directly between", "adjacent" versus "directly adjacent", etc.) should be interpreted in a similar manner. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0048] Although the term first, second, third, etc. can be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms can only be used to distinguish an element, component, region, layer and / or section from another region, layer or section. Unless the context clearly indicates, the terms such as "first", "second" and other numerical terms used herein do not imply sequence or order. Therefore, without departing from the teaching of the example embodiments, the first element, component, region, layer or section discussed below can be referred to as the second element, component, region, layer or section.

[0049] For ease of description, spatially relative terms may be used herein to describe the relationship of one element or feature to another element or feature as shown in the figures, such as "inside", "outside", "below", "below", "below", "above", and "above", etc. In addition to the orientations described in the figures, spatially relative terms may be intended to cover different orientations of the device in use or operation. For example, if the device in the accompanying drawings is flipped, the elements described as "below" or "below" other elements or features will be oriented "above" the other elements or features. Therefore, the exemplary term "below" can cover both above and below orientations. The device can be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially relative descriptors used in this article are interpreted accordingly.

[0050] When the terms "same" or "equal" are used in the description of example embodiments, it should be understood that some imprecision may exist. Therefore, when one element or value is referred to as being the same as another element or value, it should be understood that the element or value is the same as the other element or value within a manufacturing or operating tolerance range (e.g., ±10%).

[0051] When the term "about" or "substantially" is used in conjunction with a numerical value, it should be understood that the relevant numerical value includes a manufacturing or operating tolerance (e.g., ±10%) around the numerical value. In addition, when the words "generally" and "substantially" are used in conjunction with geometric shapes, it should be understood that the accuracy of the geometric shapes is not required, but rather a certain degree of freedom in the shapes is allowed within the scope of the present disclosure.

[0052] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the present example embodiments belong. It should also be understood that terms (including those defined in commonly used dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and will not be interpreted in an idealized or overly formal sense unless explicitly defined as such in this article.

[0053] In the present exemplary embodiment, a wafer will be described as an example of an object to be processed. However, the technical concept of the present invention can also be applied to apparatuses for processing other types of substrates in addition to wafers.

[0054] Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

[0055] Figure 2 is a top plan view schematically illustrating a substrate processing apparatus according to an exemplary embodiment of the present invention.

[0056] Reference Figure 2, the substrate processing apparatus includes an indexing module 10, a processing module 20, and a controller 30. According to an exemplary embodiment, the indexing module 10 and the processing module 20 are arranged in one direction. Hereinafter, the direction in which the indexing module 10 and the processing module 20 are arranged is referred to as a first direction 92, and when viewed from above, a direction perpendicular to the first direction 92 is referred to as a second direction 94, and a direction perpendicular to both the first direction and the second direction is referred to as a third direction 96.

[0057] The index module 10 transfers the substrate W from the container 80 in which the substrate W is accommodated to the process module 20, and allows the substrate W that has been completely processed in the process module 20 to be accommodated in the container 80. The longitudinal direction of the index module 10 is set in the second direction 94. The index module 10 includes a loading port 12 and an index frame 14. Based on the index frame 14, the loading port 12 is located on the side opposite to the process module 20. The container 80 accommodating the substrate W is placed on the loading port 12. The loading port 12 can be provided in plurality, and a plurality of loading ports 12 can be provided in the second direction 94.

[0058] As the container 80, an airtight container such as a front opening unified pod (FOUP) may be used. The container 80 may be placed on the load port 12 by a transfer device (not shown) such as an overhead transfer device, an overhead conveyor, or an automatic guided vehicle, or an operator.

[0059] The indexing frame 14 is provided with an indexing robot 120. A guide rail 140 whose longitudinal direction is the second direction 94 is provided inside the indexing frame 14, and the indexing robot 120 may be provided to be movable on the guide rail 140. The indexing robot 120 includes a hand 122 for placing the substrate W, and the hand 122 may be provided to be movable forward and backward, rotatable about the third direction 96, and movable along the third direction 96. A plurality of hands 122 are provided to be spaced apart in the vertical direction, and the hands 122 may be moved forward and backward independently of each other.

[0060] The processing module 20 includes a buffer unit 200, a transfer chamber 300, and a processing chamber 400. The buffer unit 200 provides a space in which a substrate W loaded into the processing module 20 and a substrate W unloaded from the processing module 20 temporarily stay. The processing chamber 400 supplies liquid onto the substrate W to perform a process of liquid-treating the substrate W. The transfer chamber 300 transfers the substrate W between the buffer unit 200 and the liquid-treating chamber 400.

[0061] The transfer chamber 300 may be arranged such that the longitudinal direction is the first direction 92. The buffer unit 200 may be arranged between the index module 10 and the transfer chamber 300. A plurality of liquid processing chambers 400 are provided, and the plurality of liquid processing chambers 400 may be arranged at a lateral portion of the transfer chamber 300. The liquid processing chamber 400 and the transfer chamber 300 may be arranged along the second direction 94. The buffer unit 200 may be located at one end of the transfer chamber 300.

[0062] In one example, the liquid processing chambers 400 are respectively disposed on opposite sides of the transfer chamber 300. On opposite sides of the transfer chamber 300, the liquid processing chambers 400 may be arranged in an A×B arrangement (A and B are each a natural number of 1 or greater) in the first direction 92 and the third direction 96, respectively.

[0063] The transfer chamber 300 includes a transfer robot 320. A guide rail 340 having a longitudinal direction in a first direction 92 is provided in the transfer chamber 300, and the transfer robot 320 may be provided to be movable on the guide rail 340. The transfer robot 320 includes a hand 322 on which a substrate W is placed, and the hand 322 may be provided to be movable forward and backward, rotatable about a third direction 96, and movable along the third direction 96. The plurality of hands 322 are provided to be spaced apart from each other in the vertical direction, and can independently move forward and backward.

[0064] The buffer unit 200 includes a plurality of buffers 220 on which the substrate W is placed. The buffers 220 may be spaced apart from each other in the third direction 96. The front and rear of the buffer unit 200 are open. The front is a surface facing the indexing module 10, and the rear is a surface facing the transfer chamber 300. The indexing robot 120 may approach the buffer unit 200 through the front, and the transfer robot 320 may approach the buffer unit through the rear.

[0065] Figure 3 It is schematically shown Figure 2 FIG. 4 is a diagram of an exemplary embodiment of a process chamber 400. Figure 3 , the process chamber 400 may include a housing 410 , a cup 420 , a support unit 430 , a mixing unit 440 , pipes 451 , 452 , 453 , and 454 , valves 442 a , 443 a , and 444 a , a nozzle unit 470 , and a lift unit 480 .

[0066] The housing 410 is provided in a substantially rectangular parallelepiped shape. The cup 420 , the support unit 430 , and the liquid supply unit 470 are provided in the housing 410 .

[0067] The cup 420 has a processing space with an open top, and the substrate W is subjected to liquid processing in the processing space. The support unit 430 supports the substrate W in the processing space. The nozzle unit 470 supplies liquid to the substrate W supported on the support unit 430. A plurality of types of liquids may be provided and may be sequentially supplied to the substrate W. The lifting unit 480 adjusts the relative height between the cup 420 and the support unit 430.

[0068] According to this example, the cup 420 includes a plurality of recovery containers 422, 424, and 426. Each of the recovery containers 422, 424, and 426 has a recovery space for recovering liquid used to process the substrate. Each of the recovery containers 422, 424, and 426 is arranged in a ring shape around the support unit 430. When the liquid treatment process is in progress, the processing solution scattered due to the rotation of the substrate W is introduced into the recovery space through the inlets 422a, 424a, and 426a of the respective recovery containers 422, 424, and 426. According to this example, the cup 420 includes a first recovery container 422, a second recovery container 424, and a third recovery container 426. The first recovery container 422 is arranged to surround the support unit 430, the second recovery container 424 is arranged to surround the first recovery container 422, and the third recovery container 426 is arranged to surround the second recovery container 424. The second inlet 424a for introducing liquid into the second recovery container 424 may be located above the first inlet 422a for introducing liquid into the first recovery container 422, and the third inlet 426a for introducing liquid into the third recovery container 426 may be located above the second inlet 424a.

[0069] The support unit 430 has a support plate 432 and a drive shaft 434. The upper surface of the support plate 432 may be set to be substantially circular, and its diameter may be larger than the diameter of the substrate W. In the central portion of the support plate 432, a support pin 442a is provided to support the rear surface of the substrate W, and the support pin 442a is provided so that its upper end protrudes from the support plate 432 so that the substrate W is spaced a certain distance from the support plate 432. A chuck pin 432b is provided at the edge of the support plate 442. The chuck pin 432b is provided so as to protrude upward from the support plate 430, and supports the lateral portion of the substrate W so that the substrate W is not separated from the support unit 430 when the substrate W rotates. The drive shaft 434 is driven by a driver 446, connected to the center of the bottom surface of the substrate W, and rotates the support plate 432 relative to its central axis.

[0070] Figure 4 is a cross-sectional view showing a cross section of a mixing unit according to an exemplary embodiment of the present invention. Figure 4The mixing unit 440 includes a body 441 and ports 442, 443, 444, and 445. The body 441 provides a mixing space 441a. The first liquid and the second liquid are supplied to the mixing space 441a. In one example, the first liquid may be a hydrogen peroxide solution (H 2 O 2 In addition, in one example, the second liquid may be sulfuric acid (H 2 SO 4 ) solution. Mixing space 441a may be a flow path through which the first liquid and the second liquid flow. In addition, mixing space 441a may be a mixing space where the first liquid and the second liquid are mixed. Body 441 may include a first wall 441b and a second wall 441c. The first wall 441b may be perpendicular to the second wall 441c. In one example, body 441 may be arranged in a rectangular parallelepiped shape, and second wall 441c may be arranged to have a larger area than first wall 441b. An outlet port 445 may be formed in first wall 441b. A first inlet port 442, a second inlet port 443, and a third inlet port 444 may be formed in second wall 431c. The first inlet port 442, the second inlet port 443, and the third inlet port 444 may be formed along the longitudinal direction. The second inlet port 443 may be arranged closer to the outlet port 445 than the first inlet port 442. In addition, the first inlet port 442 may be arranged farther away from the outlet port 445 than the second inlet port 443 and the third inlet port 444. Therefore, the first inlet port 442, the third inlet port 444, and the second inlet port 443 may be arranged in sequence, and the outlet port 445 may be arranged adjacent to the second inlet port 443. The second wall 441c may be arranged thicker than the first wall 441b. Therefore, the first inlet port 442, the second inlet port 443, and the third inlet port 444 may be arranged longer than the outlet port 445. However, the present invention is not limited thereto, and the thickness of the first wall 441b and the second wall 441c may be freely varied in various other combinations, variations, and situations.

[0071] The first inlet port 442 may be equipped with a first valve 442a to regulate the first inlet port 442. The substrate processing apparatus may further include a first driver (not shown) that moves the first valve 442a in a direction toward or away from an end of the first inlet port 442. Thus, when the first valve 442a contacts the first inlet port 442, supply of the first liquid may be blocked, and when the first valve 442a is away from the first inlet port 442, supply of the first liquid may be enabled.

[0072] The second inlet port 443 may be equipped with a second valve 443a for regulating the second inlet port 443. The substrate processing apparatus may further include a second driver (not shown) that moves the second valve 443a in a direction toward or away from an end of the second inlet port 443. Thus, when the second valve 443a contacts the second inlet port 443, the supply of the second liquid may be blocked, and when the second valve 443a is away from the first inlet port 443, the supply of the second liquid may be enabled.

[0073] The third inlet port 444 may be equipped with a third valve 444a regulating the third inlet port 444. The substrate processing apparatus may further include a third driver (not shown) that moves the third valve 444a in a direction toward or away from an end of the third inlet port 444. Thus, when the third valve 444a contacts the third inlet port 444, decompression of the mixing space 441a may be blocked, and when the third valve 444a is away from the third inlet port 444, decompression of the mixing space 441a may occur.

[0074] The first inlet port 442 is connected to the first liquid pipeline 451 supplying the first liquid. The second inlet port 443 is connected to the second liquid pipeline 452 supplying the second liquid. The third inlet port 444 is connected to the air intake pipeline 453 that decompresses the mixing space 441a. The outlet port 445 is connected to the treatment solution supply pipeline 454, which supplies the liquid for liquid treatment to the treatment chamber 400. The first liquid pipeline 451 connects the mixing unit 440 with the first liquid supply source 451a storing the first liquid. The first liquid pipeline 451 supplies the first liquid to the mixing space 441a. The second liquid pipeline 452 connects the mixing unit 440 with the second liquid supply source 442a storing the second liquid. The second liquid pipeline 452 supplies the second liquid to the mixing space 441a. The second liquid pipeline 452 or the second liquid supply source 452a may be equipped with a heater 452b that heats the second liquid. The air intake pipeline 453 decompresses the mixing space 441a. A decompression member may be installed in the air intake pipeline. In one example, a pump 453a may be provided as a pressure reducing member.

[0075] The mixing unit 440 may further include an inline-mixer 446. The inline-mixer 446 may be installed in the processing solution supply pipe 454. Thus, the first liquid and the second liquid may be mixed once in the mixing space 441a and mixed secondarily in the inline-mixer 446.

[0076] The nozzle unit 470 may include a first nozzle 472 and a second nozzle 474. The first nozzle 472 supplies a treatment solution onto the substrate W. The treatment solution may be a liquid having a temperature higher than room temperature. In one example, the treatment solution may be a sulfuric acid peroxide mixture (SPM). The SPM may be a mixed solution (SPM) of high-temperature sulfuric acid and room-temperature hydrogen peroxide solution. The second nozzle 474 supplies water onto the substrate W. The water may be pure water or deionized water.

[0077] The first nozzle 472 and the second nozzle 474 are supported on different arms 461, respectively, and the arms 461 can move independently. Alternatively, the first nozzle 472 and the second nozzle 474 can be mounted on the same arm and move simultaneously.

[0078] Optionally, in addition to the first nozzle 472 and the second nozzle 474, the nozzle unit 470 may further include one or more nozzles. The additional nozzles may provide different types of processing solutions to the substrate. For example, another type of processing solution may be an acid solution or an alkaline solution for removing foreign matter on the substrate. In addition, another type of processing solution may be an alcohol having a surface tension lower than that of water. For example, the alcohol may be isopropyl alcohol.

[0079] The lifting unit 480 moves the cup 420 in the up-down direction. By the up-down movement of the cup 420, the relative height between the cup 420 and the substrate W changes. This changes the recovery containers 422, 424, and 426 for recovering the processing solution according to the type of liquid supplied onto the substrate W, so that the liquids can be recovered respectively. Different from the description, the cup 420 may be fixedly installed, and the lifting unit 480 may move the support unit 430 in the vertical direction.

[0080] In addition, the mixing unit 440 may further include a controller 500. The controller 500 may control the substrate processing apparatus of the present invention. A method of processing a substrate by using the substrate processing apparatus via the controller 500 is described below.

[0081] Figure 5 is a flowchart illustrating a method of processing a substrate by using a substrate processing apparatus according to an exemplary embodiment of the present invention. Figure 5 , the substrate processing method may include a mixed solution processing operation S100, a first liquid processing operation S200, and a decompression operation S300.

[0082] Figure 6 is a diagram showing a view of a mixing unit during a mixed solution processing operation. Figure 6, during the mixed solution treatment operation S100, the first liquid and the second liquid are mixed. The first liquid and the second liquid can be mixed in the mixing space 441a. In addition, when the built-in mixer 446 is installed, the first liquid and the second liquid can be further mixed. The controller 500 opens the first valve 442a and the second valve 443a, and closes the third valve 444a. The first liquid and the second liquid are supplied to the mixing space 441a and mixed. The mixed solution is then supplied to the substrate W through the outlet port 445 through the treatment solution supply pipeline 454. The substrate W is then treated with the mixed solution. The substrate W can be cleaned by the mixed solution. In one example, the mixed solution can be a sulfuric acid and peroxide mixture (SPM).

[0083] Figure 7 is a diagram showing a view of a mixing unit during a first liquid treatment operation. Figure 7 , after the mixed solution processing operation S100, a first solution processing operation S200 may be performed. During the first liquid processing operation S200, the first liquid cleans the substrate W. The controller 500 opens the first valve 442a, and closes the second valve 443a and the third valve 444a. Only the first liquid is supplied to the mixing space 441a. Then, the first liquid is supplied to the substrate W via the processing solution supply conduit 454 through the outlet port 445. The first liquid may clean any residual mixed solution or second liquid on the substrate W. In addition, during the first liquid processing operation S200, the first liquid may clean the second liquid or mixed solution present in the mixing space 441a.

[0084] Figure 8 is a diagram showing a view of a mixing unit during a decompression operation. Figure 8 , after the first liquid treatment operation S200, a decompression operation S300 may be performed. During the decompression operation S300, the mixing space 441a is decompressed. Thus, the first liquid, the second liquid, or the treatment solution remaining in the mixing space 441a may be removed. In addition, the treatment solution remaining in the nozzle unit 470 may be sucked back to prevent the treatment solution from dripping onto the substrate W.

[0085] According to the exemplary embodiment of the present invention, by mixing the first liquid and the second liquid in the mixing unit 440 in advance, rather than mixing the first liquid and the second liquid in the nozzle, the treatment solution can be supplied in a state where the mixing reaction of the generated treatment solution is stable. This can suppress the scattering of the treatment solution and the generation of smoke when the treatment solution is discharged.

[0086] Additionally, by supplying the first liquid at a greater distance from the outlet port 445 than the second liquid, the efficiency with which the first liquid cleans the second liquid may be increased.

[0087] Furthermore, by supplying the first liquid farthest from the outlet port 445 , cleaning efficiency may be improved by maximizing the range of the mixing space 441 a that the first liquid may clean.

[0088] In addition, by spacing the supply positions of the first liquid and the second liquid as far apart as possible, temperature interference between the first liquid and the hotter second liquid can be avoided. By minimizing the temperature of the second liquid lowered by the first liquid, the temperature of the treatment solution generated by mixing the first liquid and the second liquid can be maintained as high as possible, thereby improving the cleaning efficiency of the treatment solution.

[0089] In the above example, the present invention is described based on the case where the valves 442a, 443a, and 444a contact the ends of the ports 442, 443, 444, and 445 to adjust whether the pipes 451, 452, 453, and 454 are opened or closed. However, the present invention is not limited thereto, and any configuration capable of adjusting whether the mixing space 441a is connected to the respective pipes 451, 452, 453, and 454 is sufficient. Fig. 9 is a diagram showing a view of a mixing unit according to another exemplary embodiment of the present invention. Fig. 9 Valves 442a, 443a and 444a can be respectively set on pipelines 451, 452, 453, and 454 in the form of on / off valves.

[0090] Furthermore, in the above example, the present invention has been described based on the case where the mixing unit 440 includes the body 441 and the ports 442, 443, 444, and 445 as an example. However, the present invention is not limited thereto, and the mixing unit 440 may also be provided in the form of a manifold, such as Fig.10 When the mixing unit 440 is provided in a manifold form, the ports 442, 443, 444 and 445 may be omitted, and the pipes 451, 452 and 453 and the built-in mixer 446 may be directly connected to the manifold pipe 500, which provides a flow path 501 through which the first liquid and the second liquid flow.

[0091] Furthermore, in the above example, the present invention has been described based on the case where the first inlet port 442, the second inlet port 443, and the third inlet port 444 are provided in the second wall 431c as an example. However, the present invention is not limited thereto, and the first inlet port 442, the second inlet port 443, and the third inlet port 444 may also be provided in the form of a four-way valve, such as Fig.11 In this case, the first inlet port 442, the second inlet port 443, the third inlet port 444, and the outlet port 445 may be arranged in directions facing each other.

[0092] The above detailed description illustrates the present invention. In addition, the above description shows and describes exemplary embodiments of the present invention, and the present invention can be used in various other combinations, modifications and environments. That is, changes or modifications can be made within the scope of the inventive concept disclosed herein, within the scope of equivalent written disclosure and / or within the scope of technology or knowledge in the art. The above exemplary embodiments describe the best state for realizing the technical spirit of the present invention, and various changes can be made in the specific application fields and uses of the present invention. Therefore, the above detailed description of the present invention is not intended to limit the present invention to the disclosed exemplary embodiments. In addition, the attached claims should also be interpreted as including other exemplary embodiments.

Claims

1. An apparatus for processing a substrate, the apparatus comprising: a processing chamber for processing a substrate with a processing solution; a processing solution supply conduit for supplying liquid for liquid processing to the processing chamber; a mixing unit connected to the treatment solution supply pipe and having a mixing space formed therein; a first liquid conduit for supplying a first liquid to the mixing space; a second liquid conduit for supplying a second liquid to the mixing space; an air intake duct, the air intake duct being used to decompress the mixing space; a first valve, the first valve being used to regulate the supply of the first liquid to the mixing space; a second valve, the second valve being used to regulate the supply of the second liquid to the mixing space; as well as an air intake valve, the air intake valve is used to adjust whether to decompress the mixing space, wherein the mixing unit comprises a main body having the mixing space and a first inlet port, a second inlet port, a third inlet port and an outlet port connected to the mixing space, The outlet port is connected to the treatment solution supply pipeline, The first inlet port is connected to the first liquid pipeline, The second inlet port is connected to the second liquid pipeline, and The third inlet port is connected to the air intake duct.

2. The device according to claim 1, wherein: The second inlet port is disposed closer to the outlet port than the first inlet port.

3. The device according to claim 1, wherein: The first inlet port is disposed farther from the outlet port than the second inlet port and the third inlet port.

4. The device according to claim 2, wherein: In the second liquid pipe or the second liquid supply source in which the second liquid is stored, a heater for heating the second liquid is installed, and The third inlet port is disposed between the first inlet port and the second inlet port.

5. The apparatus according to claim 1, wherein the outlet port is located on a first of the walls forming the mixing space, The first inlet port, the second inlet port and the air inlet port are located on a second wall among the walls forming the mixing space, The second wall is adjacent to the first wall, and The second wall is perpendicular to the first wall.

6. The apparatus according to claim 1, further comprising: a first actuator for moving the first valve in a direction toward or away from an end of the first inlet port, wherein when the first valve is in contact with the first inlet port, supply of the first liquid is blocked, and when the first valve is away from the first inlet port, the first liquid is supplied, The apparatus further comprises a second actuator for moving the second valve in a direction toward or away from an end of the second inlet port, wherein when the second valve is in contact with the second inlet port, supply of the second liquid is blocked, and when the second valve is away from the second inlet port, the second liquid is supplied, The apparatus further comprises a third actuator for moving the third valve in a direction toward or away from an end of the third inlet port, When the third valve contacts the third inlet port, the decompression of the mixing space is blocked, and when the third valve is away from the third inlet port, the mixing space is decompressed.

7. The device according to claim 1, wherein: The mixing unit further comprises a controller, and the controller performs: a mixed solution processing operation of opening the first valve and the second valve to generate a mixed solution in which the first liquid and the second liquid are mixed in the mixing space, and supplying the mixed solution to the substrate to process the substrate; a first liquid processing operation, which, after the mixed solution processing operation, closes the second valve and supplies the first liquid from the mixing space to the substrate to process the substrate, and A decompression operation is performed after the first liquid processing operation, wherein the first valve and the second valve are closed and the third valve is opened to decompress the mixing space and remove the liquid in the mixing space.

8. The device according to claim 1, wherein: The first liquid is a hydrogen peroxide solution, and The second liquid is sulfuric acid.

9. The apparatus according to claim 1, further comprising: A built-in mixer is installed on the treatment solution supply pipeline.

10. A method for processing a substrate by using the apparatus for processing a substrate according to claim 1, the method comprising: a mixed solution processing operation for generating a mixed solution in which the first liquid and the second liquid are mixed in the mixing space, and supplying the mixed solution to the substrate to process the substrate; a first liquid processing operation, the first liquid processing operation supplying the first liquid from the mixing space to the substrate to process the substrate after the mixed solution processing operation; as well as A decompression operation is performed to decompress the mixing space to remove the mixed solution, the first liquid or the second liquid in the mixing space. 11 . The method of claim 10 , wherein the mixed solution processing operation includes supplying the first liquid to a position farther from the outlet port than the second liquid.

12. The method of claim 10, wherein the first liquid handling operation comprises supplying the first liquid from a location farthest from the outlet port.

13. The method according to claim 10, wherein the mixed solution processing operation comprises supplying the second liquid at a higher temperature than the first liquid, and The first liquid and the second liquid are supplied into the mixing space at positions that are most spaced apart.

14. The method according to claim 10, wherein: The mixed solution treatment operation includes secondary mixing of the first liquid and the second liquid by a built-in mixer installed in the treatment solution supply pipe.

15. The method of claim 10, wherein the first liquid is a hydrogen peroxide solution, and The second liquid is sulfuric acid.

16. An apparatus for processing a substrate, the apparatus comprising: a processing chamber, wherein the processing chamber is used to perform liquid processing on a substrate; a processing solution supply conduit for supplying liquid for liquid processing to the processing chamber; a mixing unit connected to the treatment solution supply pipe and having a mixing space formed therein; a hydrogen peroxide solution supply pipe, the hydrogen peroxide solution supply pipe being used to supply the hydrogen peroxide solution to the mixing space; a sulfuric acid supply pipe for supplying sulfuric acid to the mixing space; an air intake duct, the air intake duct being used to decompress the mixing space; a first valve, the first valve being used to regulate the supply of the hydrogen peroxide solution to the mixing space; a second valve for regulating the supply of the sulfuric acid to the mixing space; as well as an air intake valve, the air intake valve is used to adjust whether to decompress the mixing space, wherein the mixing unit comprises a main body having the mixing space and a first inlet port, a second inlet port, a third inlet port and an outlet port connected to the mixing space, The outlet port is connected to the treatment solution supply pipeline, The first inlet port is connected to the hydrogen peroxide solution supply pipeline, The second inlet port is connected to the sulfuric acid supply pipeline, The third inlet port is connected to the air intake duct, The first inlet port is disposed farther from the outlet port than the second inlet port and the third inlet port, and A heater for heating the sulfuric acid is installed at the sulfuric acid supply pipeline or a sulfuric acid supply source storing the sulfuric acid.

17. The apparatus of claim 16, wherein the second inlet port is located between the first inlet port and the third inlet port.

18. The apparatus of claim 17, wherein the outlet port is located on a first of the walls forming the mixing space, The first inlet port, the second inlet port and the air inlet port are located on a second wall among the walls forming the mixing space, The second wall is adjacent to the first wall, and The second wall is perpendicular to the first wall.

19. The apparatus according to claim 18, further comprising: A built-in mixer is installed on the treatment solution supply pipeline.

20. The apparatus of claim 19, further comprising: a first actuator for moving the first valve in a direction toward or away from an end of the first inlet port, wherein when the first valve is in contact with the first inlet port, supply of the hydrogen peroxide solution is blocked, and when the first valve is away from the first inlet port, the hydrogen peroxide solution is supplied, The apparatus further comprises a second actuator for moving the second valve in a direction toward or away from an end of the second inlet port, wherein when the second valve is in contact with the second inlet port, the supply of the sulfuric acid is blocked, and when the second valve is away from the second inlet port, the sulfuric acid is supplied, The apparatus further comprises a third actuator for moving the third valve in a direction toward or away from an end of the third inlet port, When the third valve contacts the third inlet port, the decompression of the mixing space is blocked, and when the third valve is away from the third inlet port, the mixing space is decompressed.

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