Antistatic integrated circuit chip packaging device

Abstract

The invention discloses an antistatic integrated circuit chip packaging device, and relates to the technical field of integrated circuit chip processing, the antistatic integrated circuit chip packaging device comprises a workbench, an ion fan and a plurality of chip bodies, and also comprises a chip placing part used for placing the plurality of chip bodies, the chip placement part comprises a carrier mounted on the workbench, a plurality of alignment grooves matched with the corresponding chip bodies are formed in the carrier, and adsorption assemblies matched with the chip bodies are further mounted on the carrier; and the photoetching part is used for carrying out rewiring layer processing on the plurality of chip bodies. The device has the advantages that through the downward moving process of the moving cover, adsorption and fixation of a chip body, stirring, spraying and slicking treatment of epoxy resin can be automatically and orderly completed, the stability of the chip body and the uniformity of epoxy resin filling in the packaging process are ensured, the overall packaging effect is effectively ensured, and the overall packaging efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated circuit chip processing, and particularly relates to an antistatic integrated circuit chip packaging device. Background Art

[0002] An integrated circuit chip is an electronic device that integrates a large number of tiny electronic components, such as transistors, resistors, capacitors, etc., on a small semiconductor silicon wafer through semiconductor manufacturing technology. It can achieve miniaturization and light weight of electronic circuits, greatly improve the performance and reliability of electronic devices, and reduce costs at the same time. During the production process of integrated circuit chips, packaging is an important link in the integrated circuit manufacturing process, which involves connecting the integrated circuit chip (bare chip) to external leads and protecting the chip from physical and chemical damage.

[0003] Currently, for small-sized chips, a fan-out packaging process is generally adopted. During operation, the wafer is first cut into multiple chips, and then the cut chips are arranged in the shape of a wafer on a carrier, and the gaps between the chips are filled with epoxy resin. After that, the redistribution layer technology is used to process each chip, and finally, chip products with protective shells can be obtained by cutting. However, when the current packaging device fills epoxy resin, it is difficult to keep the position of the chips unchanged on the carrier, and the uniformity of epoxy resin filling cannot be ensured, which affects the overall chip quality. Therefore, it is necessary to design an antistatic integrated circuit chip packaging device. Summary of the Invention

[0004] Aiming at the deficiencies of the prior art, the present invention provides an antistatic integrated circuit chip packaging device, which solves the problems raised in the above background art.

[0005] In order to achieve the above purpose, the present invention adopts the following technical solutions: An antistatic integrated circuit chip packaging device, including a workbench, an ion blower, and a plurality of chip bodies, further including: A chip placement part, which is used to place a plurality of chip bodies. The chip placement part includes a carrier installed on the workbench. A plurality of alignment grooves matching the corresponding chip bodies are formed on the carrier, and an adsorption assembly matching the plurality of chip bodies is also installed on the carrier; A lithography part, which is used to perform redistribution layer processing on a plurality of chip bodies. The lithography part includes a mounting frame fixedly installed on the workbench, and a moving cover is installed on the mounting frame through a telescopic cylinder. The ion blower is fixedly installed on the moving cover, and a lithography assembly matching the plurality of chip bodies is installed on the moving cover; The spraying section is used to spray epoxy resin on a plurality of chip bodies placed on a carrier. The spraying section includes two storage cylinders fixedly installed on the top of the moving cover, and output pipes are fixedly connected between the two storage cylinders and the inner wall of the moving cover. Output components are installed between the mounting frame and the two storage cylinders. A positioning component for driving the adsorption component is also installed on the moving cover. The leveling section is used to level the sprayed epoxy resin. The leveling section includes a rotating rod rotatably connected to the moving cover, and a foam squeegee is slidably installed at one end of the rotating rod located inside the moving cover. A driving component that cooperates with the rotating rod and the positioning component is installed on the moving cover.

[0006] Furthermore, the adsorption component includes a positioning ring slidably installed on the workbench. A plurality of pistons are fixedly installed on the upper surface of the positioning ring. Adsorption holes that are hermetically and slidably matched with the corresponding pistons are opened on the side walls of each positioning groove. Two tension springs II are installed between the positioning ring and the bottom of the carrier. A plurality of grooves are opened on the side wall of the carrier, and a plurality of bumps that are slidably matched with the corresponding grooves are fixedly installed on the positioning ring.

[0007] Furthermore, the lithography component includes a lithography machine. A servo motor is fixedly installed on the moving cover, and the output end of the servo motor is fixedly connected to an electric telescopic rod. The output end of the electric telescopic rod is fixedly installed with a cross beam, and a sliding groove is opened on the cross beam. A slider fixedly connected to the lithography machine is slidably installed in the sliding groove. A moving motor is fixedly installed on the side wall of the cross beam, and the output end of the moving motor is fixedly connected to a lead screw that is threadedly connected to the slider.

[0008] Furthermore, a rotating motor is fixedly installed at the bottom of the workbench, and the output end of the rotating motor passes through the workbench and the positioning ring and is fixedly connected to the bottom of the carrier. Two guide sleeves are fixedly installed on the side wall of the moving cover, and two guide posts that are slidably matched with the corresponding guide sleeves are fixedly installed on the workbench.

[0009] Furthermore, the output component includes a pull rod fixedly installed on the mounting frame, and a connecting rod is slidably installed at the bottom of the pull rod. A fixed column is hermetically and slidably installed on the storage cylinder, and a sealing plate that is hermetically and slidably matched with the inside of the storage cylinder is fixedly installed at the bottom of the fixed column. A plurality of stirring blades are also fixedly installed on the side wall of the end of the fixed column located inside the storage cylinder. A convex rod is fixedly installed on the side wall of the connecting rod, and a second spiral groove that cooperates with the convex rod is opened on the inner wall of the fixed column.

[0010] Further, the alignment component includes a lifting ring slidably installed inside the moving cover, and the lifting ring corresponds to the alignment ring in position. A plurality of lifting blocks are fixedly installed on the side wall of the lifting ring. A plurality of lifting grooves slidably engaged with the corresponding lifting blocks are formed on the inner wall of the moving cover, and a compression spring is installed between each lifting groove and the corresponding lifting block.

[0011] Further, the driving component includes a rotating sleeve and a connecting shaft rotatably installed on the moving cover. A fixed gear ring is fixedly installed on the rotating sleeve. A connecting gear ring meshing with the fixed gear ring is rotatably installed on the connecting shaft through a one-way bearing, and a belt transmission structure is installed between the connecting shaft and the rotating rod. A guide rod is fixedly installed on the top of one of the lifting blocks through a plug rod, and a first spiral groove cooperating with the guide rod is formed on the inner wall of the rotating sleeve.

[0012] Further, a T-shaped groove is formed at the bottom of the rotating rod. A T-shaped rod slidably engaged with the T-shaped groove is fixedly installed on the top of the foam squeegee. A round rod is fixedly installed at the bottom of the pull rod. A telescopic groove cooperating with the round rod is formed on the connecting rod, and a first tension spring is installed between the telescopic groove and the round rod.

[0013] Further, the depth of the T-shaped groove is less than the telescopic length of the electric telescopic rod. The depth of the telescopic groove is greater than the maximum distance between the stirring blade and the upper surface of the storage cylinder. The height of the second spiral groove is greater than or equal to the maximum distance between the alignment ring and the lifting ring. The maximum distance between the guide rod and the bottom of the rotating sleeve is less than the depth of the lifting groove.

[0014] Compared with the existing technology, the advantages of the present invention are as follows: 1: Through the cooperation of the adsorption component and the plurality of alignment grooves, a plurality of chip bodies can be effectively positioned and fixed on the carrier, ensuring their stability during the encapsulation process, and avoiding the position deviation of the chip bodies caused by contact during the encapsulation process, which affects the overall encapsulation effect; 2: Through the cooperation of the spraying part and the scraping part, epoxy resin can be evenly filled on the carrier during the encapsulation process, so that it is evenly filled between a plurality of chip bodies, ensuring that the area of the formed protective shell is consistent, thereby ensuring that the overall quality of the encapsulated chip remains consistent; 3: Through the cooperation of the alignment component and the driving component, as the moving cover continuously moves downward, the adsorption and fixation of the chip body, the spraying of epoxy resin, and the scraping treatment can be automatically and orderly completed without the need for separate control by the staff. The automation production effect is achieved with a simple structure, and the production cost can be reduced; 4: Through the design of the output component, as the moving cover moves downward, the stirring, spraying, and stopping spraying of epoxy resin can be automatically completed in cooperation with the overall process, enabling the entire encapsulation process to be completed in an orderly manner, ensuring the overall encapsulation effect, and improving the overall encapsulation efficiency.

[0015] In summary, through the downward movement process of the moving cover, the present invention can automatically and orderly complete the adsorption and fixation of the chip body, the stirring, spraying, and scraping of epoxy resin, ensuring the stability of the chip body during the encapsulation process and the uniformity of epoxy resin filling, effectively ensuring the overall encapsulation effect and improving the overall encapsulation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 FIG. is a schematic structural diagram of an antistatic integrated circuit chip packaging device proposed by the present invention; Figure 2 is Figure 1 a schematic structural diagram from another perspective; Figure 3 is Figure 2 a top view of Figure 4 is Figure 3 a schematic structural diagram of the A-A plane in Figure 5 is Figure 4 an enlarged schematic structural diagram of part a in Figure 6 is Figure 2 a schematic structural diagram of the workbench in Figure 7 is Figure 2 an exploded schematic structural diagram of the carrier in Figure 8 is Figure 2 a schematic structural diagram of the moving cover in Figure 9 is Figure 8 an exploded structural diagram of Figure 10 is Figure 9 a top view of the structure of the fixing column in Figure 11 is Figure 10 a schematic structural diagram of the B-B plane in Figure 12 is Figure 4 an enlarged schematic structural diagram of part b in

[0017] In the figure: 1, workbench; 2, chip body; 3, carrier; 4, alignment groove; 5, guide post; 6, mounting bracket; 7, telescopic cylinder; 8, moving cover; 9, servo motor; 10, electric telescopic rod; 11, cross beam; 12, chute; 13, slider; 14, lithography machine; 15, moving motor; 16, lead screw; 17, rotating motor; 18, storage cylinder; 19, output pipe; 20, pull rod; 21, fixed column; 22, sealing plate; 23, stirring blade; 24, convex rod; 25, connecting rod; 26, first tension spring; 27, rotating rod; 28, foam squeegee; 29, T-shaped rod; 30, T-shaped groove; 31, lifting groove; 32, lifting block; 33, lifting ring; 34, compression spring; 35, insertion rod; 36, rotating sleeve; 37, fixed gear ring; 38, connecting shaft; 39, one-way bearing; 40, connecting gear ring; 41, first spiral groove; 42, guide rod; 43, belt drive structure; 44, adsorption hole; 45, piston; 46, alignment ring; 47, convex block; 48, groove; 49, second tension spring; 50, guide sleeve. Detailed implementation mode

[0018] Referring to Figures 1 - 12 , an antistatic integrated circuit chip packaging device, including a workbench 1, an ion blower, and a plurality of chip bodies 2. The ion blower is fixedly installed on the moving cover 8. The ion blower is an existing product, and when it works, it can blow out a charged air flow to help eliminate the static electricity on the surface of the carrier 3, the moving cover 8, and the workbench 1 during the packaging process. At the same time, all tools, equipment, and workstations in the device that come into contact with the chip body 2 must be grounded to ensure that the static electricity can be effectively conducted away. And the operator needs to wear an antistatic bracelet and ensure good contact between the bracelet and the body. The bracelet is connected to the ground through a grounding wire to eliminate the static electricity on the human body. The entire packaging process should comply with the antistatic measure standards. The chip body 2 is a chip cut from a wafer, and further includes: A chip placement part for placing a plurality of chip bodies 2. The chip placement part includes a carrier 3 installed on the workbench 1. A plurality of alignment grooves 4 matching the corresponding chip bodies 2 are opened on the carrier 3. Through the design of the alignment grooves 4, the placement position of the chip body 2 on the carrier 3 can be limited.

[0019] An adsorption component that cooperates with multiple chip bodies 2 is also installed on the carrier 3. The adsorption component includes an alignment ring 46 slidably installed on the workbench 1. A plurality of pistons 45 are fixedly installed on the upper surface of the alignment ring 46. An adsorption hole 44 that is hermetically and slidably engaged with the corresponding piston 45 is formed on the side wall of each alignment groove 4. Two second tension springs 49 are installed between the alignment ring 46 and the bottom of the carrier 3. A plurality of grooves 48 are formed on the side wall of the carrier 3. A plurality of bumps 47 that are slidably engaged with the corresponding grooves 48 are fixedly installed on the alignment ring 46. After the alignment and placement of multiple chip bodies 2 on the carrier 3 are completed, when the alignment ring 46 moves downward relative to the carrier 3, it can drive a plurality of pistons 45 to move downward simultaneously. At this time, due to the sealing of the chip body 2 in the alignment groove 4, a negative pressure is generated in the adsorption hole 44, and then the chip body 2 can be firmly adsorbed on the carrier 3 to ensure its stability during the packaging process. The cooperation between the bump 47 and the groove 48 is used to limit the moving direction of the alignment ring 46 relative to the carrier 3. The design of the second tension spring 49 is used to keep a plurality of adsorption holes 44 at the bottom of the corresponding alignment grooves 4 when the alignment ring 46 is not under pressure, so as to ensure that after the placement of the chip body 2 is completed, the alignment ring 46 can be moved downward to enable a plurality of adsorption holes 44 to successfully complete the adsorption and fixation of a plurality of chip bodies 2.

[0020] A lithography unit. The lithography unit is used for performing a redistribution layer process on multiple chip bodies 2. The redistribution layer technology is an existing technology, so its specific working principle will not be elaborated here. The lithography unit includes a mounting frame 6 fixedly installed on the workbench 1. A moving cover 8 is installed on the mounting frame 6 through a telescopic cylinder 7. A lithography component that cooperates with multiple chip bodies 2 is installed on the moving cover 8. The lithography component includes a lithography machine 14. A servo motor 9 is fixedly installed on the moving cover 8. The output end of the servo motor 9 is fixedly connected to an electric telescopic rod 10. The output end of the electric telescopic rod 10 is fixedly installed with a cross beam 11. A chute 12 is formed on the cross beam 11. A slider 13 fixedly connected to the lithography machine 14 is slidably installed in the chute 12. A moving motor 15 is fixedly installed on the side wall of the cross beam 11. The output end of the moving motor 15 is fixedly connected to a lead screw 16 threadedly connected to the slider 13. When the servo motor 9 works, the lithography machine 14 can be moved along the cross beam 11 through the cooperation between the lead screw 16 and the slider 13. The lithography machine 14 is an existing product, which is mainly used on this device to perform a re-wiring layer process on the chip body 2 after being filled with epoxy resin. Therefore, its specific structure and working principle will not be elaborated here. After the epoxy resin is filled, the crossbeam 11 can be lowered by starting the electric telescopic rod 10 to move the lithography machine 14 to a certain height from the chip body 2. Then, through the cooperation of the servo motor 9 and the moving motor 15, the lithography machine 14 can be moved relative to multiple chip bodies 2. A rotating motor 17 is fixedly installed at the bottom of the workbench 1, and the output end of the rotating motor 17 passes through the workbench 1 and the alignment ring 46 to be fixedly connected to the bottom of the carrier 3. With the operation of the rotating motor 17, the lithography machine 14 can process any position of multiple chip bodies 2, ensuring the smooth completion of the re-wiring layer. Among them, the electric telescopic rod 10 can specifically adopt an electric telescopic rod of model YMD-608, and the rotating motor 17, the servo motor 9, and the moving motor 15 can all adopt a servo motor of model ACM6004M2H.

[0021] Two guide sleeves 50 are fixedly installed on the side wall of the moving cover 8, and two guide posts 5 that are slidably matched with the corresponding guide sleeves 50 are fixedly installed on the workbench 1. The cooperation between the guide posts 5 and the guide sleeves 50 is used to limit the moving direction of the moving cover 8 relative to the workbench 1. When the telescopic cylinder 7 operates, the moving cover 8 can move relative to the workbench 1, so that before the re-wiring layer is carried out, the lithography machine 14 is first lowered to a certain distance close to the chip body 2, and the moving cover 8 shields multiple chip bodies 2 on the carrier 3, which can prevent dust from entering the moving cover 8 and affecting the re-wiring layer.

[0022] A positioning component for driving the adsorption component is also installed on the moving cover 8. The positioning component includes a lifting ring 33 slidably installed inside the moving cover 8, and the lifting ring 33 corresponds to the alignment ring 46 in position. A plurality of lifting blocks 32 are fixedly installed on the side wall of the lifting ring 33, and a plurality of lifting grooves 31 that are slidably matched with the corresponding lifting blocks 32 are opened on the inner wall of the moving cover 8. A compression spring 34 is installed between each lifting groove 31 and the corresponding lifting block 32. When the moving cover 8 moves downward, the lifting ring 33 first contacts the alignment ring 46 and pushes the alignment ring 46 to move downward against the elastic force of the second tension spring 49, thereby automatically completing the adsorption and fixation of the chip body 2 on the carrier 3.

[0023] The spraying section is used to spray epoxy resin on multiple chip bodies 2 placed on the carrier 3. The spraying section includes two storage cylinders 18 fixedly installed on the top of the moving cover 8, and output pipes 19 are fixedly connected between the two storage cylinders 18 and the inner wall of the moving cover 8. Output components are installed between the mounting frame 6 and the two storage cylinders 18. The output component includes a pull rod 20 fixedly installed on the mounting frame 6, and a connecting rod 25 is slidably installed at the bottom of the pull rod 20. A fixed column 21 is slidably and sealingly installed on the storage cylinder 18, and a sealing plate 22 that is in sealing sliding fit with the inside of the storage cylinder 18 is fixedly installed at the bottom of the fixed column 21. A plurality of stirring blades 23 are also fixedly installed on the side wall of the end of the fixed column 21 located inside the storage cylinder 18. A convex rod 24 is fixedly installed on the side wall of the connecting rod 25. A second spiral groove that cooperates with the convex rod 24 is formed on the inner wall of the fixed column 21. During the operation of the telescopic cylinder 7 that causes the moving cover 8 to move relatively closer, due to the cooperation between the convex rod 24 and the second spiral groove, the fixed column 21 will initially rotate inside the storage cylinder 18. At this time, the epoxy resin and curing agent inside can be stirred by the plurality of stirring blades 23 to make them mix evenly. At the same time, stirring can also reduce the bubbles existing in the epoxy resin to a certain extent; A round rod is fixedly installed at the bottom of the pull rod 20. A telescopic groove that cooperates with the round rod is formed on the connecting rod 25, and a first tension spring 26 is installed between the telescopic groove and the round rod. After the lifting ring 33 contacts the alignment ring 46 and pushes it downward so that the multiple chip bodies 2 are adsorbed and fixed on the carrier 3, the convex rod 24 also moves to the top of the second spiral groove. At this time, the continuous downward movement of the moving cover 8 causes the lifting block 32 to move upward in the lifting groove 31 against the elastic force of the compression spring 34. At the same time, the convex rod 24 pulls the fixed column 21 to drive the sealing plate 22 to move upward in the storage cylinder 18, and the stirred epoxy resin therein is sent out from the output pipe 19 and sprayed on the carrier 3. When the moving cover 8 continues to move downward and the lifting block 32 moves a certain distance in the lifting groove 31 but does not move to the maximum distance, the stirring blade 23 contacts the top of the storage cylinder 18. At this time, the continuous downward movement of the moving cover 8 causes the round rod to move upward relative to the connecting rod 25 against the elastic force of the first tension spring 26. At this time, the spraying action of the epoxy resin stops, and the spraying process is completed.

[0024] The leveling part is used for leveling the sprayed epoxy resin. The leveling part includes a rotating rod 27 rotatably connected to the moving cover 8. A foam squeegee 28 is slidably installed at one end of the rotating rod 27 located inside the moving cover 8. A T-shaped groove 30 is formed at the bottom of the rotating rod 27. A T-shaped rod 29 that is slidably engaged with the T-shaped groove 30 is fixedly installed at the top of the foam squeegee 28. The cooperation between the T-shaped groove 30 and the T-shaped rod 29 can ensure the effective connection and transmission between the foam squeegee 28 and the rotating rod 27. At the same time, when the moving cover 8 moves downward and approaches the workbench 1, the foam squeegee 28 can have a certain upward movement space after contacting the chip body 2, avoiding excessive pressure on the chip body 2 caused by it, which may damage the chip body 2 or result in poor leveling effect of the epoxy resin.

[0025] A driving component that cooperates with the rotating rod 27 and the alignment component is installed on the moving cover 8. The driving component includes a rotating sleeve 36 rotatably installed on the moving cover 8 and a connecting shaft 38. A fixed gear ring 37 is fixedly installed on the rotating sleeve 36. A connecting gear ring 40 meshing with the fixed gear ring 37 is rotatably installed on the connecting shaft 38 through a one-way bearing 39. A belt drive structure 43 is installed between the connecting shaft 38 and the rotating rod 27. A guide rod 42 is fixedly installed at the top of one of the lifting blocks 32 through a plug rod 35. A first spiral groove 41 that cooperates with the guide rod 42 is formed on the inner wall of the rotating sleeve 36. After the spraying process is completed, at this time, the plug rod 35 enters the rotating sleeve 36, and the guide rod 42 is located in the first spiral groove 41. As the moving cover 8 continues to move downward, the cooperation between the guide rod 42 and the first spiral groove 41 causes the rotating sleeve 36 to rotate. At this time, the fixed gear ring 37 rotates to drive the connecting gear ring 40 to rotate. The one-way bearing 39 is in a locked rotation state, so the connecting shaft 38 rotates. Through the operation of the belt drive structure 43, the rotating rod 27 drives the foam squeegee 28 to rotate horizontally on the carrier 3, completing the leveling process of the sprayed epoxy resin and ensuring the uniformity of the epoxy resin filling. When the guide rod 42 moves downward in the rotating sleeve 36, the fixed gear ring 37 drives the connecting gear ring 40 to rotate in the reverse direction. At this time, the one-way bearing 39 is in a rotating state, and the connecting shaft 38 cannot drive the rotating rod 27 to rotate.

[0026] The belt drive structure 43 is a prior art, and its working principle and specific structure will not be elaborated here. The depth of the T-shaped groove 30 is less than the telescopic length of the electric telescopic rod 10. The depth of the telescopic groove is greater than the maximum distance between the stirring blade 23 and the upper surface of the storage cylinder 18. The height of the second spiral groove is greater than or equal to the maximum distance between the alignment ring 46 and the lifting ring 33. The maximum distance between the guide rod 42 and the bottom of the rotating sleeve 36 is less than the depth of the lifting groove 31. The advantage of this dimension design is to ensure that the adsorption and fixation of the chip body 2, the stirring of the epoxy resin, the spraying of the epoxy resin, and the leveling of the epoxy resin can be smoothly and orderly completed during the entire encapsulation process, avoiding mutual conflicts. At the same time, it can also avoid the problem that the cross beam 11 contacts the carrier 3 during the leveling process of the epoxy resin, causing damage to the lithography machine 14 by the epoxy resin.

[0027] In the present invention, the working principle of an antistatic integrated circuit chip packaging device is as follows: Placement of the chip body 2: A plurality of chip bodies 2 cut from the wafer are respectively placed into a plurality of alignment grooves 4 on the carrier 3, and it is ensured that the placement is in place; Adsorption and fixation of the chip body 2: After the placement is completed, the telescopic cylinder 7 is started to make the moving cover 8 approach the workbench 1. After the moving cover 8 moves down a certain distance, the lifting ring 33 contacts the alignment ring 46 and pushes it down, so that a plurality of suction holes 44 generate suction force to effectively adsorb and fix a plurality of chip bodies 2 on the carrier 3. After the alignment ring 46 moves down in place, the continued downward movement of the moving cover 8 causes the lifting block 32 to move upward in the lifting groove 31 against the elastic force of the compression spring 34; Stirring of the epoxy resin: During the downward movement of the moving cover 8 until the lifting block 32 starts to move upward in the lifting groove 31, the downward movement of the moving cover 8 relative to the mounting frame 6 will cause the convex rod 24 to cooperate with the second spiral groove to make the fixed column 21 rotate in the storage cylinder 18. At this time, a plurality of stirring blades 23 stir the epoxy resin located in the storage cylinder 18; Spraying of the epoxy resin: When the lifting block 32 moves upward in the lifting groove 31, the convex rod 24 moves to the top of the second spiral groove. At this time, the continued downward movement of the moving cover 8 will drive the fixed column 21 to move upward in the storage cylinder 18 through the pull rod 20, and the stirred epoxy resin is sprayed onto the carrier 3 through the output pipe 19; Leveling treatment of the epoxy resin: After the spraying treatment is completed, at this time, the insertion rod 35 enters the rotating sleeve 36, and the guide rod 42 is located in the first spiral groove 41. As the moving cover 8 continues to move downward, the cooperation between the guide rod 42 and the first spiral groove 41 makes the rotating sleeve 36 rotate. At this time, the fixed gear ring 37 rotates to drive the connecting gear ring 40 to rotate. The one-way bearing 39 is locked for rotation. Therefore, the connecting shaft 38 rotates, and the operation of the belt drive structure 43 makes the rotating rod 27 drive the foam squeegee 28 to rotate horizontally on the carrier 3, completing the leveling treatment of the epoxy resin at the spraying position; Heavy step line layer processing: After the epoxy resin is leveled, the telescopic cylinder 7 is contracted to move the moving cover 8 upward so that there is a certain distance between the foam squeegee 28 and the upper surface of the carrier 3 (the distance is greater than the thickness of the cross beam 11 and the lithography machine 14). Subsequently, the electric telescopic rod 10 is activated to lower the cross beam 11 to the bottom of the foam squeegee 28. Then, the lithography machine 14 can be started, and the heavy step line layer processing of all chip bodies 2 can be completed through the cooperation of the servo motor 9, the moving motor 15, and the rotating motor 17; Demoulding process: After the heavy step line layer processing is completed, the telescopic cylinder 7 is contracted to move the moving cover 8 upward to reset. After the moving cover 8 moves upward a certain distance, the lifting ring 33 is completely separated from the alignment ring 46. During this process, the elastic force of the second tension spring 49 causes the alignment ring 46 to move upward to reset. Therefore, multiple pistons 45 move upward to reset, releasing the suction force in the suction holes 44. At this time, multiple chip bodies 2 filled with epoxy resin can be taken off the carrier 3 together and sent to the cutting process.

[0028] The above shows and describes the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. What is described in the above embodiments and the specification only illustrates the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements fall within the scope of the present invention claimed.

Claims

1. An antistatic integrated circuit chip packaging device, comprising a workbench (1), an ion blower and a plurality of chip bodies (2), characterized in that: Also includes: A chip placement portion, the chip placement portion is used to place a plurality of chip bodies (2), the chip placement portion comprises a carrier (3) mounted on a workbench (1), a plurality of alignment grooves (4) matching corresponding chip bodies (2) are formed on the carrier (3), and an adsorption component matching the plurality of chip bodies (2) is also mounted on the carrier (3); A photolithography unit, the photolithography unit is used to perform a rewiring layer process on a plurality of chip bodies (2), the photolithography unit comprising a mounting frame (6) fixedly mounted on a workbench (1), a movable cover (8) being mounted on the mounting frame (6) via a telescopic cylinder (7), the ion blower being fixedly mounted on the movable cover (8), and a photolithography assembly matching the plurality of chip bodies (2) being mounted on the movable cover (8); A spray coating section, the spray coating section being used for spraying epoxy resin on a plurality of chip bodies (2) placed on a carrier (3), the spray coating section comprising two storage cylinders (18) fixedly mounted on the top of a movable cover (8), and output pipes (19) fixedly connected between the two storage cylinders (18) and the inner wall of the movable cover (8), output components being mounted between the mounting frame (6) and the two storage cylinders (18), and a positioning component for driving an adsorption component being mounted on the movable cover (8); The scraping part is used to scrape the sprayed epoxy resin, and the scraping part includes a rotating rod (27) rotatably connected to the movable cover (8), and a foam scraper (28) is slidably mounted on one end of the rotating rod (27) located inside the movable cover (8), and a driving component that cooperates with the rotating rod (27) and the alignment component is mounted on the movable cover (8).

2. The antistatic integrated circuit chip packaging device according to claim 1, characterized in that: The adsorption assembly comprises an alignment ring (46) slidably mounted on the workbench (1), a plurality of pistons (45) being fixedly mounted on the upper surface of the alignment ring (46), a side wall of each alignment groove (4) being provided with an adsorption hole (44) which is sealingly and slidably matched with the corresponding piston (45), two tension springs (49) being mounted between the alignment ring (46) and the bottom of the carrier (3), a plurality of grooves (48) being provided on the side wall of the carrier (3), and a plurality of protrusions (47) which are slidably matched with the corresponding grooves (48) being fixedly mounted on the alignment ring (46).

3. The antistatic integrated circuit chip packaging device according to claim 2, characterized in that: The photolithography assembly comprises a photolithography machine (14); a servo motor (9) is fixedly mounted on the movable cover (8); an output end of the servo motor (9) is fixedly connected to an electric telescopic rod (10); a crossbeam (11) is fixedly mounted on the output end of the electric telescopic rod (10); a slide groove (12) is provided on the crossbeam (11); a slider (13) fixedly connected to the photolithography machine (14) is slidably mounted in the slide groove (12); a movable motor (15) is fixedly mounted on a side wall of the crossbeam (11); and an output end of the movable motor (15) is fixedly connected to a lead screw (16) threadedly connected to the slider (13).

4. The antistatic integrated circuit chip packaging device according to claim 2, characterized in that: A rotating motor (17) is fixedly mounted on the bottom of the workbench (1), and the output end of the rotating motor (17) passes through the workbench (1) and the alignment ring (46) and is fixedly connected to the bottom of the carrier (3). Two guide sleeves (50) are fixedly mounted on the side wall of the movable cover (8), and two guide columns (5) that are slidably matched with the corresponding guide sleeves (50) are fixedly mounted on the workbench (1).

5. The antistatic integrated circuit chip packaging device according to claim 3, characterized in that: The output assembly comprises a pull rod (20) fixedly mounted on a mounting frame (6), and a connecting rod (25) is slidably mounted on the bottom of the pull rod (20); a fixed column (21) is sealingly slidably mounted on the storage cylinder (18), and a sealing plate (22) is fixedly mounted on the bottom of the fixed column (21) and is sealingly slidably matched with the inside of the storage cylinder (18); a plurality of stirring blades (23) are also fixedly mounted on the side wall of one end of the fixed column (21) located in the storage cylinder (18); a convex rod (24) is fixedly mounted on the side wall of the connecting rod (25), and a second spiral groove matching the convex rod (24) is provided on the inner wall of the fixed column (21).

6. The antistatic integrated circuit chip packaging device according to claim 5, characterized in that: The alignment component comprises a lifting ring (33) slidably mounted inside the movable cover (8), and the lifting ring (33) corresponds to the alignment ring (46) in position, a plurality of lifting blocks (32) are fixedly mounted on the side wall of the lifting ring (33), a plurality of lifting grooves (31) slidably matched with the corresponding lifting blocks (32) are formed on the inner wall of the movable cover (8), and a compression spring (34) is installed between each lifting groove (31) and the corresponding lifting block (32).

7. The antistatic integrated circuit chip packaging device according to claim 6, characterized in that: The driving assembly comprises a rotating sleeve (36) and a connecting shaft (38) rotatably mounted on the movable cover (8); a fixed gear ring (37) is fixedly mounted on the rotating sleeve (36); a connecting gear ring (40) meshing with the fixed gear ring (37) is rotatably mounted on the connecting shaft (38) via a one-way bearing (39); a belt transmission structure (43) is installed between the connecting shaft (38) and the rotating rod (27); a guide rod (42) is fixedly mounted on the top of one of the lifting blocks (32) via an insertion rod (35); and a first spiral groove (41) matching with the guide rod (42) is provided on the inner wall of the rotating sleeve (36).

8. The antistatic integrated circuit chip packaging device according to claim 7, characterized in that: The bottom of the rotating rod (27) is provided with a T-shaped groove (30), the top of the foam scraper (28) is fixedly mounted with a T-shaped rod (29) that slidably cooperates with the T-shaped groove (30), the bottom of the pull rod (20) is fixedly mounted with a round rod, the connecting rod (25) is provided with a telescopic groove that cooperates with the round rod, and a tension spring (26) is installed between the telescopic groove and the round rod.

9. The antistatic integrated circuit chip packaging device according to claim 8, characterized in that: The depth of the T-shaped groove (30) is less than the telescopic length of the electric telescopic rod (10), the depth of the telescopic groove is greater than the maximum distance between the stirring blade (23) and the upper surface of the storage cylinder (18), the height of the second spiral groove is greater than or equal to the maximum distance between the alignment ring (46) and the lifting ring (33), and the maximum distance between the guide rod (42) and the bottom of the rotating sleeve (36) is less than the depth of the lifting groove (31).

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