Clamping device and wafer cleaning equipment

Abstract

The invention relates to the technical field of wafer processing, in particular to a clamping device and wafer cleaning equipment, and the clamping device is characterized in that a first clamping piece is rotatably connected with a supporting piece, the first clamping piece is provided with a magnetic attraction accessory and a first clamping part protruding upwards, and the first clamping part and the rotating axis of the first clamping piece are eccentrically arranged; the first magnetic attraction part is arranged on the side, facing the wafer, of the first clamping part, the second magnetic attraction part is arranged on the side, back to the wafer, of the first clamping part, the magnetic attraction force of the magnetic attraction assembly to the clamping assembly is adjustable, and when the first acting force between the first magnetic attraction part and the magnetic attraction accessory is larger than the second acting force between the second magnetic attraction part and the magnetic attraction accessory, the first clamping part and the second clamping part are clamped. According to the invention, the clamping of the wafer is realized in a magnetic driving mode, the cost is low, the reliability is high, the surface damage rate and fragment rate of the wafer in the wet cleaning process can be reduced, and the product yield is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer processing, and in particular to a clamping device and wafer cleaning equipment. Background Art

[0002] During the wafer wet cleaning process in chip manufacturing, the process chamber of the single-wafer wet cleaning equipment needs to be equipped with a wafer chuck to support and limit the wafer, thereby ensuring that the wafer remains stable under the action of high-speed rotation and chemical spraying.

[0003] Existing wafer chucks mainly use a non-active clamping limiting method, which supports and limits the wafer through an evenly distributed array of 3 or more support limiting columns. This method can easily cause scratches on the back of the wafer due to friction between the support columns, and there is a risk of the wafer being thrown out of the chuck. It cannot meet the current single-wafer wet cleaning equipment process chamber's requirements for wafer surface damage control and debris control. Summary of the Invention

[0004] In view of this, the purpose of the present application is to provide a clamping device and a wafer cleaning device to solve the problem that the chuck in the existing wafer cleaning process is prone to damage to the wafer and the risk of the wafer being thrown out of the chuck.

[0005] A first aspect of the present invention provides a clamping device, comprising:

[0006] Support members;

[0007] A clamping assembly is mounted on the support member; the clamping assembly includes a limit member, a first clamping member, and a second clamping member, the limit member is in contact with the wafer, the first clamping member and the second clamping member are arranged on both sides of the limit member, the first clamping member is rotatably connected to the support member, the first clamping member is provided with a magnetic adsorption member and an upwardly protruding first clamping portion, and the first clamping portion is eccentrically arranged with respect to the rotation axis of the first clamping member;

[0008] The magnetic attraction component includes a first magnetic attraction component and a second magnetic attraction component that can attract the magnetic attraction component. The first magnetic attraction component is arranged on the side of the first clamping component facing the wafer, and the second magnetic attraction component is arranged on the side of the first clamping component facing away from the wafer. When the first force between the first magnetic attraction component and the magnetic attraction component is greater than the second force between the second magnetic attraction component and the magnetic attraction component, the magnetic attraction component drives the first clamping component to rotate so that the first clamping part moves toward the direction close to the second clamping component to achieve clamping of the wafer.

[0009] Preferably, the support member is formed into a disc-shaped structure; a plurality of the limiting members, the first clamping members and the second clamping members are arranged at intervals around the axis of the support member;

[0010] The first magnetic member is arranged below the support member, and the second magnetic member is installed on an annular sliding member, and the sliding member is arranged around the circumferential side wall of the support member.

[0011] Preferably, at least two of the limiting members are arranged opposite to each other to separate the first clamping member and the second clamping member, and multiple first clamping members and multiple second clamping members are arranged opposite to each other; when the magnetic attraction component drives the first clamping member to rotate, the rotation directions of at least two of the clamping members are opposite.

[0012] Preferably, the first magnetic member and the second magnetic member are permanent magnets, and at least one of the first magnetic member and the second magnetic member can move along a path close to or away from the magnetic member.

[0013] Preferably, at least one of the first magnetic attraction member and the second magnetic attraction member is formed as an electromagnet with adjustable magnetic force;

[0014] When one of the first magnetic member and the second magnetic member is formed as the electromagnet, the other of the first magnetic member and the second magnetic member is formed as a permanent magnet.

[0015] Preferably, the first clamping member comprises:

[0016] A first clamping column, wherein the first clamping portion is formed at the top of the first clamping column, and a first mounting groove and a second mounting groove are formed at the bottom of the first clamping column, wherein the second mounting groove is formed as an annular groove surrounding the first mounting groove;

[0017] A mounting block is installed in the first mounting slot, and a mounting space for accommodating the magnetic adsorption component is provided on a side of the mounting block away from the first clamping column;

[0018] a first base fixed to the support member and partially extending into the second mounting slot, the first base being provided with a connecting hole, the mounting block extending into the first mounting slot through the connecting hole;

[0019] A bearing is sandwiched between the base and the mounting block.

[0020] Preferably, an arc-shaped limiting groove is provided on the first base, and a limiting protrusion is provided on the mounting block that extends into the limiting groove. The rotation of the mounting block can drive the limiting protrusion to slide in the limiting groove, and the limiting protrusion limits the rotation of the mounting block when it abuts against the groove wall of the limiting groove.

[0021] Preferably, the second clamping member comprises:

[0022] a second base, fixedly connected to the support member;

[0023] a second clamping column mounted on the second base, with at least a portion of the second clamping column disposed above the support member, and a protruding second clamping portion formed on a top of the second clamping column;

[0024] A counterweight is installed on the second base so that the first clamping member and the second clamping member have the same weight.

[0025] Preferably, the limiting member includes:

[0026] a third base, fixedly connected to the support member;

[0027] The limiting column is installed on the third base, and at least a part of the limiting column is arranged above the supporting member.

[0028] A second aspect of the present invention provides a wafer cleaning device, comprising the clamping device described in any of the above technical solutions.

[0029] Compared with the prior art, the present invention has the following beneficial effects:

[0030] The clamping device of the present invention includes a clamping assembly installed on a support member; a limit member in the clamping assembly contacts the wafer, a first clamping member and a second clamping member are arranged on both sides of the limit member, the first clamping member is rotatably connected to the support member, a magnetic adsorption member and a first clamping portion protruding upward are provided on the first clamping member, and the first clamping portion is eccentrically arranged with respect to the rotation axis of the first clamping member; the first magnetic adsorption member is arranged on a side of the first clamping member facing the wafer, and the second magnetic adsorption member is arranged on a side of the first clamping member facing away from the wafer, and the magnetic attraction force of the magnetic assembly on the clamping assembly is adjustable, and when the first action force between the first magnetic adsorption member and the magnetic adsorption member is greater than the second magnetic adsorption member, the magnetic attraction force is adjusted. When the second force is applied between the first clamping part and the magnetic adsorption part, the magnetic component drives the first clamping part to rotate so that the first clamping part moves toward the direction close to the second clamping part, thereby realizing active clamping of the wafer; when the first force is less than the second force, the first clamping part moves toward the direction away from the second clamping part, thereby realizing loosening of the wafer, and the limit part supports and limits the wafer. The present invention realizes clamping of the wafer by magnetic drive, which is low in cost and highly reliable. It can reduce the surface damage rate and fragmentation rate of the wafer during the wet cleaning process, thereby improving product yield and meeting the clamping requirements of the wafer cleaning equipment.

[0031] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the specific embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0033] Figure 1 A schematic structural diagram of a clamping device provided in an embodiment of the present invention;

[0034] Figure 2 A schematic structural diagram of a clamping device provided by an embodiment of the present invention from another perspective;

[0035] Figure 3 A schematic structural diagram of the clamping device provided by an embodiment of the present invention from another perspective;

[0036] Figure 4 A schematic structural diagram of the clamping device provided in an embodiment of the present invention from another perspective;

[0037] Figure 5 For the Figure 4 Cross-section taken at AA in the middle;

[0038] Figure 6 For the Figure 4 Cross-section taken at BB in the middle;

[0039] Figure 7 for Figure 5 Schematic diagram of the enlarged structure at F in the middle;

[0040] Figure 8 for Figure 5 Schematic diagram of the enlarged structure at E in the middle;

[0041] Figure 9 for Figure 6 Schematic diagram of the enlarged structure at M in the middle;

[0042] Figure 10 for Figure 6 Schematic diagram of the enlarged structure at N in the middle;

[0043] Figure 11 An exploded view of the structure of the first clamping member in the clamping device provided in an embodiment of the present invention;

[0044] Figure 12 An exploded view of the structure of the first clamping member in the clamping device provided in an embodiment of the present invention from another perspective;

[0045] Figure 13 A schematic structural diagram of a clamping device provided in an embodiment of the present invention in which a second magnetic member slides to drive a first clamping member to rotate;

[0046] Figure 14 for Figure 13 Schematic diagram of the structure from another perspective.

[0047] Icons: 10-first clamping member; 11-first clamping column; 101-first clamping portion; 111-first mounting slot; 112-second mounting slot; 12-mounting block; 121-mounting space; 13-limiting protrusion; 14-sleeve; 15-magnetic adsorption member; 151-pressing block; 16-first base; 161-connecting hole; 162-limiting slot; 17-bearing; 171-gasket; 18-first fastener; 19-protective cover; 20 -Second clamping member; 21-Second clamping column; 211-Second clamping part; 22-Second base; 23-Counterweight block; 24-Second fastener; 30-Limiting member; 31-Third base; 32-Limiting column; 33-Third fastener; 40-Supporting member; 50-First magnetic member; 51-Fixing member; 52-Pressure member; 53-Fourth fastener; 60-Second magnetic member; 61-Sliding member; 62-Mounting member; 63-Fifth fastener. DETAILED DESCRIPTION

[0048] The following detailed description is provided to help the reader gain a comprehensive understanding of the methods, devices, and / or systems described herein. However, various changes, modifications, and equivalents of the methods, devices, and / or systems described herein will be apparent upon understanding the disclosure of this application. For example, the order of operations described herein is merely illustrative and is not limited to the order set forth herein. Rather, except for operations that must occur in a particular order, changes may be made that will be apparent upon understanding the disclosure of this application. Furthermore, descriptions of features known in the art may be omitted for clarity and brevity.

[0049] The features described herein may be implemented in different forms and should not be construed as being limited to the examples described herein. Rather, the examples described herein have been provided merely to illustrate some of the many possible ways to implement the methods, devices, and / or systems described herein that will be apparent upon understanding the disclosure of this application.

[0050] Throughout the specification, when an element (such as a layer, region, or substrate) is described as being “on,” “connected to,” “coupled to,” “over,” or “overlaying” another element, it may be directly “on,” “connected to,” “coupled to,” “over,” or “overlaying” another element, or one or more other elements may be present between them. In contrast, when an element is described as being “directly on,” “directly connected to,” “directly coupled to,” “directly over,” or “directly covering” another element, there may be no other elements intervening therebetween.

[0051] As used herein, the term "and / or" includes any one of the associated listed items and any combination of any two or more items.

[0052] Although terms such as "first," "second," and "third" may be used herein to describe various members, components, regions, layers, or portions, these members, components, regions, layers, or portions are not limited by these terms. Rather, these terms are used only to distinguish one member, component, region, layer, or portion from another member, component, region, layer, or portion. Thus, a first member, component, region, layer, or portion in the examples described herein may also be referred to as a second member, component, region, layer, or portion without departing from the teachings of the examples.

[0053] For ease of description, spatial relational terms such as "above," "upper," "below," and "lower" may be used herein to describe the relationship of one element to another element as shown in the accompanying drawings. Such spatial relational terms are intended to encompass different orientations of the device in use or operation in addition to the orientations depicted in the accompanying drawings. For example, if the device in the accompanying drawings is turned over, an element described as being "above" or "upper" relative to another element would subsequently be "below" or "lower" relative to the other element. Thus, the term "above" includes both the orientations "above" and "below," depending on the spatial orientation of the device. The device may also be positioned in other ways (e.g., rotated 90 degrees or in other orientations), and the spatial relational terms used herein will be interpreted accordingly.

[0054] The terms used herein are intended only to describe various examples and are not intended to limit the present disclosure. Unless the context clearly indicates otherwise, the singular is intended to include the plural. The terms "comprise," "include," and "have" list the presence of stated features, quantities, operations, components, elements, and / or combinations thereof, but do not preclude the presence or addition of one or more other features, quantities, operations, components, elements, and / or combinations thereof.

[0055] Due to manufacturing techniques and / or tolerances, variations in the shapes shown in the drawings may occur. Therefore, the examples described herein are not limited to the specific shapes shown in the drawings but include changes in shapes that occur during manufacturing.

[0056] The features of the examples described herein can be combined in various ways that will be apparent after understanding the disclosure of the present application. In addition, although the examples described herein have various configurations, other configurations are possible as will be apparent after understanding the disclosure of the present application.

[0057] According to a first aspect of the present invention, a clamping device is provided, which includes a support member 40, a clamping assembly, and a magnetic attraction assembly.

[0058] Hereinafter, the specific structures of the above-mentioned components of the clamping device according to the present embodiment will be described.

[0059] In this embodiment, if Figures 1 to 4 As shown, the clamping assembly is installed on the support member 40, and the support member 40 can be formed as a processing platform for cleaning wafers. The clamping assembly is fixed on the support member 40. Preferably, the support member 40 is formed into a disc-shaped structure, such as a circular disc-shaped structure.

[0060] like Figures 1 to 4 、 Figure 13 and Figure 14 As shown, the clamping assembly includes a limiter 30, a first clamping member 10 and a second clamping member 20. Specifically, the limiter 30 contacts the wafer to support and limit the wafer. Preferably, the limiter 30 is supported on the bottom of the wafer.

[0061] The first clamping member 10, the second clamping member 20, and the limiting member 30 are arranged on the same plane parallel to the plane where the support member 40 is located. The first clamping member 10 and the second clamping member 20 are arranged on both sides of the limiting member 30. The limiting member 30 separates the first clamping member 10 and the second clamping member 20, so that the first clamping member 10 and the second clamping member 20 are located on both sides of the wafer in the radial direction. The first clamping member 10 is rotatably connected to the support member 40. The first clamping member 10 is provided with a magnetic adsorption member 15 and an upwardly protruding first clamping portion 101. The first clamping portion 101 is preferably a bump structure located on the top of the first clamping member 10, such as Figure 4 and Figure 14 As shown in comparison, the first clamping portion 101 is eccentrically disposed with respect to the rotation axis of the first clamping member 10 , so that when the first clamping member 10 rotates relative to the support member 40 , the first clamping portion 101 rotates around the rotation axis of the first clamping member 10 .

[0062] In this embodiment, the magnetic attraction member 15 is formed into a block structure. In an optional implementation manner, the magnetic attraction member 15 is a ferromagnetic member formed of iron, cobalt and / or nickel materials; in another optional implementation manner, the magnetic attraction member 15 is a magnet.

[0063] like Figures 1 to 4 、 Figure 13 and Figure 14 As shown, the magnetic attraction assembly includes a first magnetic attraction member 50 and a second magnetic attraction member 60 capable of attracting the magnetic attraction member 15. Specifically, the first magnetic attraction member 50 is arranged on the side of the first clamping member 10 facing the wafer, and the second magnetic attraction member 60 is arranged on the side of the first clamping member 10 facing away from the wafer (that is, in the radial direction of the wafer, the first clamping member 10 is arranged between the first magnetic attraction member 50 and the second magnetic attraction member 60). When the first acting force between the first magnetic attraction member 50 and the magnetic attraction member 15 (that is, the magnetic force of the first magnetic attraction member 50 attracting the magnetic attraction member 15) is large, When there is a second force between the second magnetic member 60 and the magnetic adsorption member 15 (i.e., the magnetic force of the second magnetic member 60 adsorbing the magnetic adsorption member 15), the magnetic assembly drives the first clamping member 10 to rotate so that the first clamping portion 101 moves toward the direction close to the second clamping member 20, thereby clamping the wafer; when the first force as described above is less than the second force as described above, the magnetic assembly drives the first clamping member 10 to rotate so that the first clamping portion 101 moves toward the direction away from the second clamping member 20, thereby loosening the wafer. The present invention achieves clamping of the wafer by magnetic drive, which is low in cost and highly reliable. It can reduce the surface damage rate and fragmentation rate of the wafer during the wet cleaning process, thereby improving product yield and meeting the clamping requirements of the wafer cleaning equipment.

[0064] In this embodiment, if Figure 1 、 Figure 3 、 Figure 5 、 Figure 6 and Figure 10As shown, the first magnetic member 50 is arranged below the support member 40, the first magnetic member 50 is formed into a block structure, the fixing member 51 is formed into an annular structure arranged below the support member 40, and multiple first magnetic members 50 are embedded in the groove of the fixing member 51. A pressing member 52 is provided on the top of the fixing member 51, and the pressing member 52 is formed into an annular plate structure for closing the groove on the fixing member 51. The fixing member 51 and the pressing member 52 are detachably connected, and the connection between the fixing member 51 and the pressing member 52 can preferably be achieved via a fourth fastener 53. The fourth fastener 53 can be a screw, such as a hexagonal countersunk screw.

[0065] In this embodiment, if Figures 1 to 5 and Figure 7 As shown, the second magnetic member 60 is formed into a block-shaped structure and is mounted on an annular sliding member 61, which is disposed around the circumferential sidewall of the support member 40. Preferably, the second magnetic member 60 is disposed in a mounting member 62 having an opening at the top. The mounting member 62 and the sliding member 61 are detachably connected, specifically, by a fifth fastener 63 to achieve relative fixation between the mounting member 62 and the sliding member 61. The fifth fastener 63 is a screw.

[0066] In a preferred embodiment, Figure 2 、 Figure 4 and Figure 14 As shown, a plurality of limiting members 30 , a first clamping member 10 and a second clamping member 20 are spaced apart around the axis of the supporting member 40 to improve the reliability of supporting, limiting and clamping the wafer.

[0067] Furthermore, in this embodiment, at least two limiting members 30 are arranged relative to each other to separate the first clamping member 10 and the second clamping member 20, so that the first clamping member 10 and the second clamping member 20 are not adjacent to each other, and multiple first clamping members 10 and multiple second clamping members 20 are arranged relative to each other to improve the reliability of wafer clamping. Preferably, the number of first clamping members 10 and second clamping members 20 is the same; Figure 4 and Figure 14 As shown, when the magnetic assembly drives the first clamping member 10 to rotate, the rotation directions of at least two clamping members are opposite ( Figure 14 As shown in the figure, the rotation directions of the two first clamping members 10 are clockwise and counterclockwise, so that the force on the wafer is uniform and stable.

[0068] Preferably, the number of the limiting member 30 , the first clamping member 10 and the second clamping member 20 are all set to two.

[0069] In a preferred embodiment, Figure 3 and Figure 13As shown, the first magnetic member 50 and the second magnetic member 60 are permanent magnets, which can be understood as magnets. At least one of the first magnetic member 50 and the second magnetic member 60 can move along a path close to or away from the magnetic member 15. In this way, during the movement of the first magnetic member 50 and / or the second magnetic member 60, the relative magnitudes of the first force and the second force as described above are adjusted, thereby achieving the rotational drive of the first clamping member 10, so that the first clamping portion 101 moves toward or away from the second clamping member 20. For example, see Figure 3 and Figure 13 As shown in the comparison, Figure 13 The arrow in the middle indicates the moving direction of the sliding member 61, and the second magnetic member 60 is relatively Figure 3 The position shown is far away from the first clamping member 10, so that the first force is greater than the second force, thereby driving the first clamping portion 101 to form Figure 14 The rotation direction shown is toward the second clamping member 20 to achieve clamping of the wafer.

[0070] It should be noted that the first magnetic member 50 and / or the second magnetic member 60 may be driven to move up and down by a motor or a cylinder, so as to adjust the relative magnitudes of the first force and the second force.

[0071] In an optional embodiment, at least one of the first magnetic member 50 and the second magnetic member 60 is formed as an electromagnet with adjustable magnetic force. The magnetic force of the electromagnet can be adjusted by controlling the current, so that the first force is greater than or less than the second force, thereby clamping or loosening the wafer. It should be noted that when one of the first magnetic member 50 and the second magnetic member 60 is formed as an electromagnet, the other of the first magnetic member 50 and the second magnetic member 60 is formed as a permanent magnet.

[0072] In this embodiment, if Figure 5 、 Figure 7 、 Figure 11 and Figure 12 As shown, the first clamping member 10 includes a first clamping column 11, a mounting block 12, a first base 16 and a bearing 17, wherein the first clamping column 11 is arranged at the top of the first clamping member 10, the first clamping portion 101 is formed at the top of the first clamping column 11, and the bottom of the first clamping column 11 is provided with a first mounting groove 111 and a second mounting groove 112, the first mounting groove 111 is formed as a blind hole structure, and the second mounting groove 112 is formed as an annular groove surrounding the first mounting groove 111, and the axes of the first mounting groove 111 and the second mounting groove 112 are collinear with the rotation axis of the first clamping member 10.

[0073] Furthermore, if Figure 7 、 Figure 11 and Figure 12As shown, the mounting block 12 is mounted in the first mounting slot 111. A mounting space 121 for accommodating the magnetic adsorption member 15 is provided on the side of the mounting block 12 away from the first clamping column 11. The mounting space 121 is formed as a slot structure opened at the bottom of the mounting block 12. The mounting block 12 is connected to the first clamping column 11 via screws. Specifically, the mounting block 12 is provided with a through hole connected to the mounting space 121. The screw passes through the through hole and extends into the first mounting slot 111 to connect the mounting block 12 to the first clamping column 11. After assembly, the screw is installed above the magnetic adsorption member 15.

[0074] Preferably, the first mounting groove 111 is formed as a square blind hole, and the portion of the mounting block 12 extending into the first mounting groove 111 is formed as a square columnar structure to achieve circumferential limitation of the mounting block 12 and the first clamping column 11 .

[0075] Preferably, if Figure 7 、 Figure 11 and Figure 12 As shown, the first clamping member 10 also includes a pressing block 151, which is formed into a plate-like structure and is arranged below the mounting block 12 to seal the magnetic adsorption member 15 in the mounting space 121. The pressing block 151 and the mounting block 12 can be detachably connected via a first fastener 18, and the first fastener 18 can be a countersunk screw.

[0076] Furthermore, if Figure 7 、 Figure 11 and Figure 12 As shown, the first base 16 is fixed to the support member 40 to realize the installation of the first clamping member 10 on the support member 40, and part of the first base 16 extends into the second mounting groove 112. A connecting hole 161 is opened on the first base 16, and the mounting block 12 extends into the first mounting groove 111 through the connecting hole 161; the bearing 17 is clamped between the base and the mounting block 12, so as to realize the rotational connection between the mounting block 12 and the first clamping column 11 relative to the first base 16. Specifically, the inner ring of the bearing 17 is sleeved on the axial outer wall of the mounting block 12, and the outer ring of the bearing 17 is embedded in the connecting hole 161.

[0077] In this embodiment, the bearing 17 is a deep groove ball bearing 17 , and a plurality of bearings 17 are arranged along the rotation axis of the first clamping member 10 .

[0078] In a preferred embodiment, Figure 7 、 Figure 11 and Figure 12As shown, the first clamping member 10 further includes a sleeve 14 and a washer 171. The sleeve 14 is formed into a cylindrical structure and has external threads on its circumferential outer wall. The connecting hole 161 of the first base 16 has internal threads on a portion of its axial inner wall, allowing the first base 16 to be threadedly connected to the sleeve 14. The inner wall of the sleeve 14 abuts the circumferential outer wall of the outer ring of the bearing 17. A boss is formed on the connecting hole 161, which abuts the end face of the outer ring of the bearing 17 to limit the axial position of one end of the bearing 17. The washer 171 is disposed on the other axial end face of the bearing 17 and abuts the inner ring of the bearing 17 to adjust the axial clearance of the bearing 17. The washer 171 is formed into an annular sheet structure that is sleeved on the mounting block 12 and is axially sandwiched between the bearing 17 and the first clamping column 11.

[0079] Furthermore, in this embodiment, if Figure 7 、 Figure 11 and Figure 12 As shown, the first base 16 is provided with an arc-shaped limiting groove 162, which is connected to the connecting hole 161. The mounting block 12 is provided with a limiting protrusion 13 that extends into the limiting groove 162. The rotation of the mounting block 12 can drive the limiting protrusion 13 to slide in the limiting groove 162. When the limiting protrusion 13 abuts the groove wall of the limiting groove 162, the rotation of the mounting block 12 is restricted, thereby limiting the displacement of the first clamping part 101 and preventing damage to the wafer. Optionally, the limiting protrusion 13 is a screw that is detachably connected to the mounting block 12, which is easy to replace and avoids wear of the limiting protrusion 13, which may reduce the accuracy of limiting the displacement of the first clamping part 101.

[0080] In addition, in this embodiment, Figure 7 、 Figure 11 and Figure 12 As shown, the first clamping member 10 also includes a protective cover 19, which is arranged below the first clamping member 10, and the pressure block 151 is arranged in the protective cover 19. The circumferential side wall of the protective cover 19 is arranged around the part of the magnetic adsorption member 15 and the mounting block 12 extending out of the first base 16 to achieve protection.

[0081] Preferably, the first fastener 18 sequentially passes through the protective cover 19, the pressing block 151, and the mounting block 12 to achieve a fixed connection. When the limiting protrusion 13 is formed as a screw structure as described above, the head of the screw structure extends outside the protective cover 19, so that the depth of the screw structure inserted into the limiting groove 162 can be adjusted from outside the protective cover 19.

[0082] In this embodiment, if Figures 1 to 5 and Figure 8As shown, the second clamping member 20 includes a second base 22, a second clamping column 21, and a counterweight 23. The second base 22 is fixedly connected to the support member 40, thereby achieving the installation of the second clamping member 20 and the support member 40. The second clamping column 21 is mounted on the second base 22. The second clamping column 21 and the second base 22 can be detachably connected via a second fastener 24, so that the second clamping column 21 of different sizes can be replaced to meet the clamping requirements of wafers of different specifications. The second fastener 24 can be a hexagon socket head screw.

[0083] Furthermore, at least part of the second clamping column 21 is arranged above the support member 40 to achieve passive clamping of the wafer. A protruding second clamping portion 211 is formed on the top of the second clamping column 21, and the edge of the wafer can contact the side wall of the second clamping portion 211. When the first clamping portion 101 moves toward the direction close to the second clamping member 20, the distance between the first clamping portion 101 and the second clamping portion 211 is reduced, thereby achieving clamping of the wafer.

[0084] Furthermore, a counterweight 23 is mounted on the second base 22, ensuring that the weight of the first clamp 10 and the second clamp 20 are the same. This ensures dynamic balance during rotation of the clamping device, prevents wafers from being thrown out, and improves wafer cleaning. Preferably, the counterweight 23 is detachably connected to the second base 22, allowing for easy adjustment of the weight of the counterweight 23 to ensure that the weight of the second clamp 20 is the same as that of the first clamp 10.

[0085] In this embodiment, if Figure 6 and Figure 9 As shown, the limiting member 30 includes a third base 31 and a limiting column 32. The third base 31 is fixedly connected to the support member 40, thereby realizing the installation of the limiting member 30 and the support member 40; the limiting column 32 is installed on the third base 31 and at least part of the limiting column 32 is arranged above the support member 40 to realize the support and limitation of the wafer before clamping.

[0086] Preferably, the third base 31 and the limiting pillar 32 are detachably connected via the third fastener 33, so as to facilitate replacement of limiting pillars 32 of different sizes, thereby meeting the support and limiting requirements of wafers of different specifications. The third fastener 33 can be a hexagon socket screw.

[0087] According to the clamping device of the present invention, it includes a clamping assembly installed on a support member; a limit member in the clamping assembly contacts the wafer, a first clamping member and a second clamping member are arranged on both sides of the limit member, the first clamping member is rotatably connected to the support member, a magnetic adsorption member and a first clamping portion protruding upward are provided on the first clamping member, and the first clamping portion is eccentrically arranged with respect to the rotation axis of the first clamping member; the first magnetic adsorption member is arranged on the side of the first clamping member facing the wafer, and the second magnetic adsorption member is arranged on the side of the first clamping member facing away from the wafer, and the magnetic attraction force of the magnetic attraction member on the clamping assembly is adjustable, and when the first action between the first magnetic adsorption member and the magnetic adsorption member When the force is greater than the second force between the second magnetic component and the magnetic adsorption component, the magnetic component drives the first clamping component to rotate so that the first clamping part moves toward the direction close to the second clamping component, thereby realizing active clamping of the wafer; when the first force is less than the second force, the first clamping part moves toward the direction away from the second clamping component, thereby realizing loosening of the wafer, and the limiter supports and limits the wafer. The present invention realizes clamping of the wafer through magnetic drive, has low cost and strong reliability, can reduce the surface damage rate and fragmentation rate of the wafer during the wet cleaning process, thereby improving product yield.

[0088] According to the second aspect of the present invention, a wafer cleaning device is provided, which includes the clamping device as described above, and thus has all the beneficial effects of the clamping device, which will not be described in detail here.

[0089] Finally, it should be noted that the above-described embodiments are only specific implementation methods of the present application, which are used to illustrate the technical solutions of the present application, rather than to limit them. The scope of protection of the present application is not limited thereto. Although the present application has been described in detail with reference to the above-described embodiments, those skilled in the art should understand that any person skilled in the art can modify or easily conceive of changes to the technical solutions described in the above-described embodiments within the technical scope disclosed in the present application, or perform equivalent replacements for some of the technical features thereof. These modifications, changes, or replacements do not deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should be included in the scope of protection of the present application. Therefore, the scope of protection of the present application shall be subject to the scope of protection of the claims.

Claims

1. A clamping device, characterized in that: include: Supports; A clamping assembly is mounted on the support member; the clamping assembly comprises a limit member, a first clamping member and a second clamping member, the limit member contacts the wafer, the first clamping member and the second clamping member are arranged on both sides of the limit member, the first clamping member is rotatably connected to the support member, the first clamping member is provided with a magnetic adsorption member and a first clamping portion protruding upward, and the first clamping portion is eccentrically arranged with respect to the rotation axis of the first clamping member; The magnetic attraction component includes a first magnetic attraction component and a second magnetic attraction component that can attract the magnetic attraction component. The first magnetic attraction component is arranged on the side of the first clamping component facing the wafer, and the second magnetic attraction component is arranged on the side of the first clamping component facing away from the wafer. When the first force between the first magnetic attraction component and the magnetic attraction component is greater than the second force between the second magnetic attraction component and the magnetic attraction component, the magnetic attraction component drives the first clamping component to rotate so that the first clamping part moves toward the direction close to the second clamping component to achieve clamping of the wafer.

2. The clamping device according to claim 1, characterized in that: The support member is formed into a disc-shaped structure; a plurality of the limiting members, the first clamping member and the second clamping member are arranged at intervals around the axis of the support member; The first magnetic attraction member is arranged below the support member, and the second magnetic attraction member is installed on an annular sliding member, and the sliding member is arranged around the circumferential side wall of the support member.

3. The clamping device according to claim 2, characterized in that: At least two of the limiting members are arranged opposite to each other to separate the first clamping member and the second clamping member, and multiple first clamping members and multiple second clamping members are arranged opposite to each other; when the magnetic attraction component drives the first clamping member to rotate, the rotation directions of at least two of the clamping members are opposite.

4. The clamping device according to claim 1, characterized in that: The first magnetic attraction member and the second magnetic attraction member are permanent magnets, and at least one of the first magnetic attraction member and the second magnetic attraction member can move along a path approaching or moving away from the magnetic attraction member.

5. The clamping device according to claim 1, characterized in that: At least one of the first magnetic attraction member and the second magnetic attraction member is formed as an electromagnet with adjustable magnetic force; When one of the first magnetic attraction member and the second magnetic attraction member is formed as the electromagnet, the other of the first magnetic attraction member and the second magnetic attraction member is formed as a permanent magnet.

6. The clamping device according to claim 1, characterized in that: The first clamping member comprises: A first clamping column, wherein the first clamping portion is formed at the top of the first clamping column, a first mounting groove and a second mounting groove are formed at the bottom of the first clamping column, and the second mounting groove is formed as an annular groove surrounding the first mounting groove; A mounting block, mounted in the first mounting groove, wherein a side of the mounting block away from the first clamping column is provided with a mounting space for accommodating the magnetic adsorption component; A first base, fixed to the support member and partially extending into the second mounting groove, a connecting hole is provided on the first base, and the mounting block extends into the first mounting groove through the connecting hole; The bearing is sandwiched between the base and the mounting block.

7. The clamping device according to claim 6, characterized in that: An arc-shaped limiting groove is provided on the first base, and a limiting protrusion extending into the limiting groove is provided on the mounting block. The rotation of the mounting block can drive the limiting protrusion to slide in the limiting groove, and the limiting protrusion restricts the rotation of the mounting block when it abuts against the groove wall of the limiting groove.

8. The clamping device according to claim 1, characterized in that: The second clamping member comprises: A second base, fixedly connected to the support member; A second clamping column is installed on the second base, and at least a portion of the second clamping column is arranged above the support member, and a protruding second clamping portion is formed on the top of the second clamping column; A counterweight block is installed on the second base so that the weight of the first clamping member and the second clamping member are the same.

9. The clamping device according to claim 1, characterized in that: The limiting member comprises: A third base, fixedly connected to the support member; A limiting column is installed on the third base, and at least a part of the limiting column is arranged above the supporting member.

10. A wafer cleaning device, characterized in that: The invention comprises the clamping device according to any one of claims 1 to 9.

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