Aluminum busbar structure with high welding strength and manufacturing method thereof

Abstract

The invention provides an aluminum busbar structure with high welding strength and a manufacturing method thereof, and relates to the technical field of electronic manufacturing, the aluminum busbar structure with high welding strength comprises an aluminum base body, the base body is provided with a first connecting area for welding, and the surface of the first connecting area is sequentially provided with a nickel layer, a copper layer, a bright nickel layer and a fog tin layer from inside to outside. According to the invention, through the multi-layer electroplating structure, the welding strength of the aluminum material and the PCB bonding pad is improved, and the cost and the weight are reduced. A compact oxide film is easily formed on the surface of the aluminum material, so that the weldability is poor, and the strength is difficult to guarantee by direct welding. The nickel layer and the aluminum substrate form good binding force, and the problem that the binding force of a plating layer is poor due to an oxidation film on the surface of the aluminum is solved. The copper layer serves as a middle layer for welding. And the bright nickel layer improves the corrosion resistance. The fog tin layer can be well wetted with solder paste on the PCB bonding pad and form reliable welding spots. Through the synergistic effect of the four-layer structure, the problem that the weldability of the aluminum material is poor is solved, and the welding strength and reliability are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic manufacturing, and particularly to an aluminum busbar structure with high welding strength and a manufacturing method thereof. Background Art

[0002] With the rapid development of the new energy vehicle industry, the demand for battery controllers is continuously increasing. A busbar is required in a battery controller to connect a battery module and a PCB (printed circuit board). Conventionally, a busbar is usually made of copper because copper has excellent electrical conductivity and weldability. However, with the continuous improvement of the requirements for driving range and lightweight in new energy vehicles, the problems of high cost and large density of copper gradually emerge, and the use of copper is not conducive to the lightweight design of vehicles.

[0003] To reduce cost and weight, aluminum busbars are gradually being applied. Aluminum has the advantages of low cost and light weight, but a dense oxide film is easily formed on its surface, resulting in low welding strength and affecting the reliability of the battery controller.

[0004] In the prior art, to improve the weldability of aluminum, some surface treatment methods are usually adopted, such as:

[0005] 1. Mechanical treatment: removing the oxide film on the surface of aluminum by means of grinding, sandblasting, etc. However, this method is likely to damage the surface of aluminum, and the treated surface is easily re-oxidized.

[0006] 2. Chemical treatment: removing the oxide film on the surface of aluminum by chemical agents. However, it is difficult to control the uniformity of the treatment, and impurities may be introduced, affecting the welding quality.

[0007] 3. Electroplating: electroplating a metal layer with good weldability, such as nickel, copper, tin, etc., on the surface of aluminum. However, due to the existence of the oxide film on the surface of aluminum, it is difficult to obtain a coating with good adhesion by direct electroplating.

[0008] 4. Ultrasonic welding: This technology can be used to connect different metal materials, including aluminum and copper. Ultrasonic welding does not require the use of solder, which can reduce pollution, but has high requirements for the cleanliness of the welding surface, and the connection strength is limited, making it inapplicable to high-current occasions.

[0009] 5. Riveting: Riveting is a mechanical connection method that can connect aluminum and copper together. The riveting process is simple and the cost is low, but the connection resistance is large, making it inapplicable to high-current transmission.

[0010] Currently, it is difficult for the prior art to simultaneously meet the requirements of low cost, high-current transmission, and high reliability. Therefore, it is necessary to improve the existing busbar technology to overcome the defects of the prior art. Summary of the Invention

[0011] To overcome the problems existing in the related technologies, one of the objectives of the present invention is to provide an aluminum busbar structure with high welding strength. The aluminum busbar structure with high welding strength constructs a multi-layer electroplated layer structure on the surface of the aluminum substrate, realizing high-strength and reliable welding between the aluminum and the PCB pad. At the same time, the cost and weight of the busbar are reduced, meeting the requirements of new energy vehicles for high performance and lightweight of the busbar. To overcome the problems of low welding strength and poor reliability of the aluminum busbar, and high cost and large weight of the copper busbar in the prior art.

[0012] An aluminum busbar structure with high welding strength, comprising:

[0013] An aluminum substrate, the aluminum substrate has a first connection area for welding, and on the surface of the aluminum substrate located in the first connection area, there are successively arranged a nickel layer, a copper layer, a bright nickel layer and a matte tin layer from inside to outside.

[0014] Further, the thickness of the copper layer is 1 to 2 microns.

[0015] The selection of the copper layer with a thickness range of 1 to 2 microns not only ensures that the copper layer can provide sufficient conductive paths, reduce resistance and energy loss, but also avoids the problems of increased cost and stress caused by too thick a copper layer, achieving a balance among conductivity, economy and reliability.

[0016] Further, the thickness of the bright nickel layer is 3 to 4 microns.

[0017] The selection of the bright nickel layer with a thickness range of 3 to 4 microns ensures good corrosion resistance while avoiding the problem of excessive internal stress caused by too thick a bright nickel layer, ensuring the stability and reliability of the coating.

[0018] Further, the thickness of the matte tin layer is 5 to 8 microns.

[0019] The selection of the bright nickel layer with a thickness range of 5 to 8 microns ensures good wettability and solderability, while avoiding the problems of tin whisker growth or solder joint bridging caused by too thick a tin layer, improving the reliability and yield rate of welding.

[0020] Further, the aluminum substrate is also provided with a second connection area for mechanical fixed connection with the casing, and the second connection area is provided with threaded holes or studs for installing fasteners.

[0021] By providing the second connection area with threaded holes or studs on the aluminum substrate, reliable mechanical connection between the busbar and the casing is realized, ensuring the stability of the busbar during the operation of the vehicle and avoiding loosening or falling off of the busbar caused by factors such as vibration.

[0022] Further, a bending portion is provided between the first connection region and the second connection region, and the bending portion is used to release stress.

[0023] By providing a bending portion between the first connection region and the second connection region, the assembly stress, thermal stress, and vibration stress of the Busbar can be effectively released, avoiding cracking or fatigue failure of the welding points caused by stress concentration, improving the long-term reliability of the Busbar, and preventing problems such as cracking and fatigue failure of the welding points.

[0024] Further, the bending portion is U-shaped.

[0025] The U-shaped bending portion has a large bending angle and a small bending radius, which can achieve large deformation in a small space, thereby effectively absorbing and releasing stress. The U-shaped bending portion is easy to process and can effectively release stress, making it a practical and efficient stress release structure.

[0026] Further, the material of the aluminum substrate is aluminum alloy.

[0027] Compared with pure aluminum, aluminum alloy has higher strength and better processing performance, is more suitable for the working environment of automotive battery controllers, and can meet the mechanical property requirements of the Busbar.

[0028] The second object of the present invention is to provide a manufacturing method for an aluminum busbar structure for manufacturing the aluminum busbar structure with high welding strength as described above, including the following steps:

[0029] Provide an aluminum substrate;

[0030] Perform pretreatment on the surface of the aluminum substrate;

[0031] Perform the following steps on the surface of the pretreated aluminum substrate in sequence from inside to outside:

[0032] Nickel plating to form a nickel layer;

[0033] Perform electroplating copper to form a copper layer;

[0034] Perform electroplating bright nickel to form a bright nickel layer;

[0035] Perform electroplating matte tin to form a matte tin layer.

[0036] Further, the nickel plating is carried out by electroplating or electroless plating.

[0037] The beneficial effects of the present invention are:

[0038] A kind of aluminum busbar structure with high welding strength provided by the present invention. By setting a multi-layer structure of nickel layer, copper layer, bright nickel layer and matte tin layer on the aluminum substrate, the welding strength and reliability between the aluminum busbar and the PCB pad are significantly improved. Compared with the traditional copper substrate, the aluminum substrate has the advantages of low cost and light weight. However, a dense oxide film is easily formed on the surface of aluminum, resulting in poor solderability and it is difficult to ensure the strength by direct welding. The nickel layer, as a transition layer, can form a good bonding force with the aluminum substrate, solving the problem of poor bonding force of the coating caused by the oxide film on the aluminum surface. The copper layer has good electrical conductivity and solderability and can be used as an intermediate layer for welding. The bright nickel layer can improve corrosion resistance. The matte tin layer has good wettability and solderability and can be well wetted with the solder paste on the PCB pad to form a reliable solder joint. Through the synergistic effect of these four-layer structures, the problem of poor solderability of aluminum is overcome, and the welding strength and reliability are improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 is a schematic diagram of the aluminum busbar structure with high welding strength provided in this application.

[0040] Reference numerals:

[0041] 100, aluminum substrate; 110, first connection area; 120, second connection area; 130, bending part. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0042] The preferred embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although the preferred embodiments of the present invention are shown in the drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided so that the present invention will be more thorough and complete, and can fully convey the scope of the present invention to those skilled in the art.

[0043] Example 1

[0044] This embodiment provides a kind of aluminum busbar structure with high welding strength and its manufacturing method. This busbar structure is used in the automotive battery management controller to connect the battery module and the PCB.

[0045] As Figure 1As shown in the figure, the busbar structure includes an aluminum substrate 100, and the aluminum substrate 100 is made of 6061 aluminum alloy sheet with a thickness of 2 mm. The aluminum alloy sheet is processed into the shape of a Busbar through a stamping process, and a first connection area 110 for welding and a second connection area 120 for mechanical fixed connection with the chassis are stamped on the Busbar. The first connection area 110 is a plane for subsequent welding with the PCB pad. The second connection area 120 is provided with threaded holes for installing bolts to achieve fixed connection with the chassis. A U-shaped bending part 130 with a bending radius of 5 mm is stamped between the first connection area 110 and the second connection area 120 for releasing the stress after assembly.

[0046] The following treatments are carried out on the aluminum substrate 100:

[0047] 1. Pretreatment:

[0048] Degreasing: Immerse the aluminum Busbar in an alkaline degreasing agent (mainly composed of sodium hydroxide, sodium carbonate and trisodium phosphate) at 55 °C for 8 minutes to remove the oil stain on the surface.

[0049] Water washing: Rinse with deionized water for 2 minutes to remove the residual degreasing agent.

[0050] Alkaline etching: Immerse the aluminum Busbar in a sodium hydroxide solution with a concentration of 80 g / L and treat it at 50 °C for 2 minutes to remove the oxide film on the surface.

[0051] Water washing: Rinse with deionized water for 2 minutes to remove the residual alkaline etching solution.

[0052] Pickling: Immerse the aluminum Busbar in a nitric acid solution with a concentration of 250 ml / L and treat it at room temperature for 45 seconds to further remove the oxide film and activate the surface.

[0053] Water washing: Rinse with deionized water for 2 minutes to remove the residual pickling solution.

[0054] Activation: Immerse the aluminum Busbar in an activation solution containing fluoride ions (mainly composed of sodium fluoride and hydrochloric acid) and treat it at room temperature for 40 seconds to further activate the surface and improve the coating adhesion.

[0055] Water washing: Rinse with deionized water for 2 minutes to remove the residual activation solution.

[0056] 2. Coating:

[0057] Electroless nickel plating: The pretreated aluminum Busbar is placed in an electroless nickel plating solution. The main components of the plating solution are nickel sulfate, sodium hypophosphite, sodium citrate, and sodium acetate. The pH value is 5.0, and the temperature is 90 degrees Celsius. Control the deposition time to make the nickel layer thickness reach 5 microns. A uniform and dense nickel layer is formed on the aluminum substrate as the bottom layer for subsequent coatings. The nickel layer has good adhesion and can firmly bond the aluminum substrate and the subsequent coatings. It provides a good foundation for subsequent electroplating of copper and improves the bonding force of the copper layer. The nickel layer acts as a barrier layer to prevent the diffusion of copper atoms into the aluminum substrate and form brittle intermetallic compounds (such as CuAl2), which affect the welding performance and long-term reliability.

[0058] Water washing: Rinse with deionized water for 2 minutes to remove the residual electroless nickel plating solution.

[0059] Electroplating copper: The aluminum Busbar after electroless nickel plating is used as the cathode, and a pure copper plate is used as the anode and placed in an acidic copper sulfate plating solution for electroplating. Control the current density to be 2 A / dm 2 , and the electroplating time is 45 seconds to make the copper layer thickness reach 1.5 microns. The copper layer is the transition layer between the nickel layer and the bright nickel layer, further improving the bonding force of the coating. Copper has good electrical conductivity and thermal conductivity, which can reduce the contact resistance and improve the electrical conductivity. The copper layer can improve the solderability of the coating because copper has good wettability with tin. The copper layer has a certain ductility, which can buffer stress and improve the fatigue resistance of the coating.

[0060] Water washing: Rinse with deionized water for 2 minutes to remove the residual electroplated copper solution.

[0061] Electroplating bright nickel: The aluminum Busbar after electroplating copper is used as the cathode, and a pure nickel plate is used as the anode and placed in a Watts nickel plating solution containing a brightener for electroplating. Control the current density to be 3 A / dm 2 , and the electroplating time is 60 seconds to make the bright nickel layer thickness reach 3.5 microns. Bright nickel can prevent the growth of copper-tin intermetallic compounds and improve long-term reliability. A relatively hard support layer is formed between the bright nickel layer and the matte tin layer to prevent the matte tin layer from deforming excessively during the welding process.

[0062] Water washing: Rinse with deionized water for 2 minutes to remove the residual electroplated bright nickel solution.

[0063] Electroplating matte tin: The aluminum Busbar after electroplating bright nickel is used as the cathode, and a pure tin plate is used as the anode and placed in a stannous sulfate plating solution for electroplating. Control the current density to be 1 A / dm 2, The electroplating time is 420 seconds, making the thickness of the matte tin layer reach 7 microns. The matte tin layer has excellent solderability, which is the key to achieving reliable soldering with the PCB pads. The matte tin layer has good wettability and can form good solder joints with the solder. The matte tin layer is relatively soft and can adapt to a certain amount of deformation to release the soldering stress. The matte tin layer can prevent the oxidation of the underlying metal and maintain good solderability.

[0064] Water washing: Rinse with deionized water for 2 minutes to remove the residual electroplated matte tin solution.

[0065] Drying: Put the electroplated aluminum Busbar into an oven and dry it at 80 degrees Celsius for 30 minutes.

[0066] The finally obtained aluminum Busbar structure has a nickel layer, a copper layer, a bright nickel layer, and a matte tin layer deposited on the surface of the first connection area 110 from the inside to the outside in sequence. The thicknesses of each plating layer are 5 microns, 1.5 microns, 3.5 microns, and 7 microns respectively. After the sample undergoes high and low temperature cycling tests, a microcomputer-controlled electronic universal testing machine is used to conduct a vertical tensile test on the welded Busbar and PCBA, record the maximum force value, and the average tensile force is about 716.41N to 741.31N. This Busbar structure has good welding strength and reliability, and each plating layer has good bonding force with the adjacent plating layer, ensuring the firmness of the entire plating system. It can meet the usage requirements of automotive battery management controllers.

[0067] Example 2

[0068] This example provides another aluminum Busbar structure with high welding strength and its manufacturing method.

[0069] As Figure 1 shown, this Busbar structure includes an aluminum substrate 100. The aluminum substrate 100 is made of 1060 pure aluminum sheet with a thickness of 1.5 mm. The aluminum sheet is processed into the shape of a Busbar through a stamping process, and a first connection area 110 for soldering and a second connection area 120 for mechanical fixed connection with the casing are stamped on the Busbar. The first connection area 110 is a flat surface with protrusions for subsequent soldering with the PCB pads. The second connection area 120 is provided with studs for installing nuts to achieve fixed connection with the casing. A U-shaped bending part 130 with a bending radius of 4 mm is stamped between the first connection area 110 and the second connection area 120 for releasing the stress after assembly.

[0070] The following treatments are performed on the aluminum substrate 100:

[0071] 1. Pretreatment:

[0072] Degreasing: Immerse the aluminum Busbar in an alkaline degreasing agent at 60 degrees Celsius for 6 minutes.

[0073] Water washing: Rinse with deionized water for 2 minutes.

[0074] Alkaline etching: Immerse the aluminum Busbar in a sodium hydroxide solution with a concentration of 60 g / L and treat it at a temperature of 45 °C for 1.5 minutes.

[0075] Water washing: Rinse with deionized water for 2 minutes.

[0076] Pickling: Immerse the aluminum Busbar in a nitric acid solution with a concentration of 200 ml / L and treat it at room temperature for 30 seconds.

[0077] Water washing: Rinse with deionized water for 2 minutes.

[0078] Activation: Immerse the aluminum Busbar in an activation solution containing fluoride ions and treat it at room temperature for 30 seconds.

[0079] Water washing: Rinse with deionized water for 2 minutes.

[0080] Nickel electroplating: Use the pretreated aluminum Busbar as the cathode and a pure nickel plate as the anode, and place them in a Watts nickel plating solution for electroplating. Control the current density at 2.5 A / dm 2 , and the electroplating time is 192 seconds to make the nickel layer thickness reach 8 microns.

[0081] Water washing: Rinse with deionized water for 2 minutes.

[0082] 2. Coating:

[0083] Copper electroplating: Use the aluminum Busbar after nickel electroplating as the cathode and a pure copper plate as the anode, and place them in an acidic copper sulfate plating solution for electroplating. Control the current density at 1.5 A / dm 2 , and the electroplating time is 85 seconds to make the copper layer thickness reach 2 microns.

[0084] Water washing: Rinse with deionized water for 2 minutes.

[0085] Bright nickel electroplating: Use the aluminum Busbar after copper electroplating as the cathode and a pure nickel plate as the anode, and place them in a Watts nickel plating solution containing a brightener for electroplating. Control the current density at 4 A / dm 2 , and the electroplating time is 45 seconds to make the bright nickel layer thickness reach 4 microns.

[0086] Water washing: Rinse with deionized water for 2 minutes.

[0087] Matte tin electroplating: Use the aluminum Busbar after bright nickel electroplating as the cathode and a pure tin plate as the anode, and place them in a stannous sulfate plating solution for electroplating. Control the current density at 1.2 A / dm 2 , and the electroplating time is 333 seconds to make the matte tin layer thickness reach 6 microns.

[0088] Water washing: Rinse with deionized water for 2 minutes.

[0089] Drying: Put the electroplated aluminum Busbar into an oven and dry it at 70 °C for 40 minutes.

[0090] For the finally obtained aluminum busbar structure, on the surface of the first connection area 110, a nickel layer, a copper layer, a bright nickel layer and a matte tin layer are sequentially deposited from the inside to the outside, and the thicknesses of each plating layer are 8 μm, 2 μm, 4 μm and 6 μm respectively.

[0091] Example 3

[0092] This example provides another aluminum busbar structure with high welding strength and its manufacturing method.

[0093] As Figure 1 shown, the busbar structure includes an aluminum substrate 100. The aluminum substrate 100 is made of 6063 aluminum alloy profile. The aluminum profile is processed into the shape of a Busbar through cutting and stamping processes, and a first connection area 110 for welding and a second connection area 120 for mechanical fixed connection with the chassis are stamped on the Busbar. The first connection area 110 is a plane. The second connection area 120 is provided with threaded holes. A U-shaped bending part 130 is provided between the first connection area 110 and the second connection area 120, and the bending radius is 6 mm.

[0094] The following treatments are performed on the aluminum substrate 100:

[0095] 1. Pretreatment:

[0096] Degreasing: Immerse the aluminum Busbar in an alkaline degreasing agent at 65 °C for 10 minutes.

[0097] Water washing: Rinse with deionized water for 2 minutes.

[0098] Alkaline etching: Immerse the aluminum Busbar in a sodium hydroxide solution with a concentration of 100 g / L and process it at 55 °C for 3 minutes.

[0099] Water washing: Rinse with deionized water for 2 minutes.

[0100] Pickling: Immerse the aluminum Busbar in a nitric acid solution with a concentration of 300 ml / L and process it at room temperature for 60 seconds.

[0101] Water washing: Rinse with deionized water for 2 minutes.

[0102] Activation: Immerse the aluminum Busbar in an activation solution containing fluoride ions and process it at room temperature for 60 seconds.

[0103] Water washing: Rinse with deionized water for 2 minutes.

[0104] Zinc immersion treatment: The pretreated aluminum Busbar is placed in a zinc immersion solution and treated at room temperature for 60 seconds to form a thin zinc layer, improving the adhesion of the subsequent nickel plating.

[0105] Water washing: Rinse with deionized water for 2 minutes.

[0106] 2. Coating:

[0107] Electroless nickel plating: The aluminum Busbar after zinc immersion treatment is placed in an electroless nickel plating solution. The main components of the plating solution are nickel sulfate, sodium hypophosphite, sodium citrate, and sodium acetate, with a pH value of 4.8 and a temperature of 88 °C. Control the deposition time to make the nickel layer thickness reach 10 μm.

[0108] Water washing: Rinse with deionized water for 2 minutes.

[0109] Copper electroplating: The aluminum Busbar after electroless nickel plating is used as the cathode, and a pure copper plate is used as the anode and placed in an acidic copper sulfate plating solution for electroplating. Control the current density to be 2.5 A / dm 2 , and the electroplating time is 24 seconds to make the copper layer thickness reach 1 μm.

[0110] Water washing: Rinse with deionized water for 2 minutes.

[0111] Bright nickel electroplating: The aluminum Busbar after copper electroplating is used as the cathode, and a pure nickel plate is used as the anode and placed in a Watts nickel plating solution containing a brightener for electroplating. Control the current density to be 3.5 A / dm 2 , and the electroplating time is 49 seconds to make the bright nickel layer thickness reach 3 μm.

[0112] Water washing: Rinse with deionized water for 2 minutes.

[0113] Matte tin electroplating: The aluminum Busbar after bright nickel electroplating is used as the cathode, and a pure tin plate is used as the anode and placed in a stannous sulfate plating solution for electroplating. Control the current density to be 0.8 A / dm 2 , and the electroplating time is 600 seconds to make the matte tin layer thickness reach 8 μm.

[0114] Water washing: Rinse with deionized water for 2 minutes.

[0115] Drying: The electroplated aluminum Busbar is placed in an oven and dried at a temperature of 75 °C for 45 minutes.

[0116] The finally obtained aluminum busbar structure has a zinc layer, a nickel layer, a copper layer, a bright nickel layer, and a matte tin layer deposited on the surface of the first connection region 110 in sequence from the inside to the outside, and the thicknesses of each coating layer are less than 1 μm, 10 μm, 1 μm, 3 μm, and 8 μm respectively.

[0117] Unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present application. In all examples shown and discussed herein, any specific value should be construed as merely exemplary and not as a limitation. Thus, other examples of exemplary embodiments may have different values. It should be noted that like reference numerals and letters denote like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.

[0118] In addition, it should be noted that the use of terms such as "first" and "second" is only for the convenience of distinction. Without further declaration, these terms have no special meaning and thus should not be construed as limiting the scope of protection of the present application.

[0119] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A high welding strength aluminum busbar structure, characterized in that: include: An aluminum substrate (100) is provided with a first connection area (110) for welding, and a nickel layer, a copper layer, a bright nickel layer and a matte tin layer are sequentially provided on the surface of the aluminum substrate (100) located in the first connection area (110) from the inside to the outside.

2. The aluminum busbar structure with high welding strength according to claim 1 is characterized in that: The copper layer has a thickness of 1 to 2 micrometers.

3. The aluminum busbar structure with high welding strength according to claim 1 is characterized in that: The thickness of the bright nickel layer is 3 to 4 microns.

4. The aluminum busbar structure with high welding strength according to claim 1 is characterized in that: The thickness of the matte tin layer is 5 to 8 microns.

5. The aluminum busbar structure with high welding strength according to any one of claims 1 to 4, characterized in that: The aluminum substrate (100) is also provided with a second connection area (120) for mechanically fixing the connection with the housing, and the second connection area (120) is provided with a threaded hole or a stud for installing a fastener.

6. The aluminum busbar structure with high welding strength according to claim 5, characterized in that: A bent portion (130) is provided between the first connection area (110) and the second connection area (120), and the bent portion (130) is used to release stress.

7. The aluminum busbar structure with high welding strength according to claim 6 is characterized in that: The bent portion (130) is U-shaped.

8. The aluminum busbar structure with high welding strength according to any one of claims 1 to 4, characterized in that: The material of the aluminum material substrate (100) is aluminum alloy.

9. A method for manufacturing an aluminum busbar structure, characterized in that: The method for manufacturing the aluminum busbar structure with high welding strength according to any one of claims 1 to 8 comprises the following steps: Providing an aluminum substrate (100); Pre-treating the surface of the aluminum substrate (100); Nickel plating to form a nickel layer; Electroplating copper to form a copper layer; Electroplating bright nickel to form a bright nickel layer; Matte tin is electroplated to form a matte tin layer.

10. The method for manufacturing an aluminum busbar structure according to claim 9, characterized in that: The nickel plating is performed by electroplating or chemical plating.

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