Backboard connector and storage device

Abstract

The invention provides a backboard connector and a storage device. The backboard connector comprises a bent plug and a straight socket, the bent plug comprises a first shell, a plurality of conductive wafers, a plurality of first differential terminals and a plurality of grounding terminals, the plurality of conductive wafers are arranged in the first shell at intervals, and the first differential terminals and the grounding terminals are electrically connected with the corresponding conductive wafers; the straight socket comprises a second shell, a plurality of second differential terminals and a plurality of torsion grounding terminals, each second differential terminal is provided with a step part, the step part is correspondingly located in the first bayonet, each torsion grounding terminal is provided with a torsion step part, the torsion step part is correspondingly located in the second bayonet, and the torsion step part is located in the second shell. And at least one second differential terminal is arranged between two adjacent torsion grounding terminals of each plugging groove, each step part is parallel to the horizontal plane, and each torsion step part and the horizontal plane are arranged at a preset angle.

Description

Technical Field

[0001] The present disclosure relates to the field of connectors, and particularly to a backplane connector and a storage device. Background Art

[0002] The backplane connector plays an important bridging role inside a high-speed chassis and is a key component in a high-speed transmission link. Currently, with the exponential increase in the data transmission volume of communication systems, the requirement for the transmission rate of the link is getting higher and higher, but the volume of the device remains unchanged or smaller. Therefore, the requirements for the connectors inside the device tend to be high density, high transmission rate, and miniaturization.

[0003] A connector usually consists of a plug and a socket. The plug is one end for connecting a circuit or device, and the socket is the end for receiving the plug. In traditional technologies, multiple power connection terminals are provided inside the plug. One end of the power connection terminal extends outside the plug housing for plugging with the socket. However, since the conductive terminals are metal structural parts and are fixed in the plug housing through snap-fitting or injection molding, the multiple conductive terminals greatly occupy the assembly space inside the plug housing, which is not conducive to the high-density and miniaturized design of the connector. Secondly, when the conductive terminals of the plug or socket are snap-fitted to the housing, in order to avoid interference between the snap-fitting parts of adjacent conductive terminals, the spacing between the multiple conductive terminals is set relatively wide. As a result, the density of the plug or socket distributed inside the housing is small, which is not conducive to the high-density and high-transmission-rate design of the connector.

[0004] Therefore, there is an urgent need for a connector with a relatively high density of conductive terminals and a good transmission rate. Summary of the Invention

[0005] The purpose of the present disclosure is to overcome the deficiencies in the prior art and provide a backplane connector and a storage device with a relatively high density of conductive terminals and a good transmission rate.

[0006] The purpose of the present disclosure is achieved through the following technical solutions:

[0007] A backplane connector, comprising:

[0008] A bent plug and a straight socket, the bent plug is plugged with the straight socket. The bent plug includes a first housing, a plurality of conductive wafers, a plurality of first differential terminals, and a plurality of ground terminals. The plurality of conductive wafers are arranged at intervals inside the first housing. The first housing is provided with an insertion opening. One end of each conductive wafer is located inside the insertion opening. One end of each first differential terminal and one end of each ground terminal are electrically connected to the corresponding conductive wafer. The other end of each first differential terminal and the other end of each ground terminal are each used for electrically connecting to a first circuit board;

[0009] The vertical socket includes a second housing, a plurality of second differential terminals, and a plurality of twisted ground terminals. The second housing is provided with a plurality of insertion slots arranged at intervals. On the inner wall of each insertion slot, a plurality of first clamping slots and second clamping slots are provided at intervals. Each second differential terminal is provided with a stepped portion, and the stepped portion is correspondingly located in the first clamping slot. Each twisted ground terminal is provided with a twisted stepped portion, and the twisted stepped portion is correspondingly located in the second clamping slot. Each conductive wafer in the insertion opening is correspondingly inserted into the insertion slot, so that one end of the second differential terminal and one end of the twisted ground terminal are respectively electrically connected to the conductive wafer, and the other end of the second differential terminal and the other end of the twisted ground terminal are both used for electrically connecting to a second circuit board; and,

[0010] At least one second differential terminal is provided between two adjacent twisted ground terminals in each insertion slot. Each stepped portion is arranged parallel to the horizontal plane, and each twisted stepped portion is arranged at a preset angle with the horizontal plane.

[0011] In one embodiment, the twisted ground terminals are respectively a clockwise twisted ground terminal and a counterclockwise twisted ground terminal. At least one second differential terminal is provided between the adjacent clockwise twisted ground terminal and the counterclockwise twisted ground terminal in each insertion slot. The twisting angle of the twisted stepped portion of the clockwise twisted ground terminal is the same as the twisting angle of the twisted stepped portion of the counterclockwise twisted ground terminal.

[0012] In one embodiment, the second housing includes a base and a plurality of bosses. The plurality of bosses are arranged at intervals on the base. Two adjacent bosses and the base together form the insertion slot. The first clamping slot and the second clamping slot are formed on the base. The bosses are provided with a plurality of first accommodating slots and second accommodating slots arranged at intervals. Each first accommodating slot is respectively communicated with the corresponding first clamping slot and the insertion slot, and each second accommodating slot is respectively communicated with the corresponding second clamping slot and the insertion slot. A part of the second differential terminal is located in the corresponding first accommodating slot, and a part of the twisted ground terminal is located in the second accommodating slot.

[0013] In one embodiment, the twisted ground terminal includes an elastic abutting portion, the twisted stepped portion, and an elastic pressing portion connected in sequence. The elastic abutting portion is located in the second accommodating slot, so that the elastic abutting portion is electrically connected to the conductive wafer when the conductive wafer is inserted into the insertion slot. The twisted stepped portion is located in the second clamping slot, and there is a preset included angle between the twisted stepped portion and the elastic abutting portion after twisting. The elastic pressing portion is located outside the second clamping slot, and the elastic pressing portion is used for electrically connecting to a second circuit board; and / or,

[0014] The adjacent bosses are arranged in a staggered manner, so that the first accommodation grooves of the adjacent bosses are arranged in a staggered manner, and the second accommodation grooves of the adjacent bosses are arranged in a staggered manner.

[0015] In one embodiment, the conductive wafer has a first end and a second end perpendicular to each other. The first end is provided with signal gold fingers and ground gold fingers. The signal gold fingers are electrically connected to the second differential terminals, and the ground gold fingers are electrically connected to the twisted ground terminals. The second end is provided with signal pads and ground pads. The signal pads are electrically connected to the first differential terminals, and the ground pads are electrically connected to the first ground terminals. The signal gold fingers and the signal pads are electrically connected by differential lines.

[0016] In one embodiment, the conductive wafers are a first conductive wafer and a second conductive wafer respectively. A second conductive wafer is provided between every two adjacent first conductive wafers, so that the first conductive wafers and the second conductive wafers are arranged in an alternating manner in the first housing, and the gold fingers of the second conductive wafers and the gold fingers at the relative positions of the first conductive wafers are inclined to each other.

[0017] In one embodiment, the first housing includes an upper base and a lower base. The upper base is connected to the lower base. The insertion interface is opened on the upper base. A plurality of first embedding grooves are opened on the inner side surface of the upper base at intervals. Part of the conductive wafer is located in the first embedding grooves. A plurality of second embedding grooves corresponding to the first embedding grooves one by one are opened on the inner side surface of the lower base. Part of the conductive wafer is located in the second embedding grooves; and,

[0018] A plurality of first installation grooves and second installation grooves are further opened on the groove walls of each second embedding groove at intervals. Part of the first differential terminals is located in the first installation grooves, and part of the ground terminals is located in the second installation grooves.

[0019] In one embodiment, the ground terminal includes two side elastic abutting parts, a first step fixing part and a first crimping part connected in sequence. The two side elastic abutting parts pass through the second installation grooves and then abut against both sides of the conductive wafer respectively. The first step fixing part is located in the corresponding second installation groove. The first crimping part is used for electrically connecting with the first circuit board; and / or,

[0020] The first differential terminal includes a single-side elastic abutting part, a second step fixing part and a second crimping part connected in sequence. The single-side elastic abutting part passes through the first installation groove and then abuts against one side of the conductive wafer. The second step fixing part is located in the corresponding installation groove. The second crimping part is used for electrically connecting with the first circuit board.

[0021] In one embodiment, an anti - tipping boss protrudes from one end of the upper base away from the insertion interface, a socket hole is formed at one end of the lower base, and the anti - tipping boss is sleeved in the socket hole; and / or,

[0022] A clamping boss protrudes from one side of the upper base adjacent to the insertion interface, a clamping hole is formed in the lower base, and the clamping boss is snapped into the clamping hole to clamp the upper base and the lower base; and / or,

[0023] A plurality of guiding bosses are protruded from the inner wall of the insertion interface at intervals, and the guiding bosses are abutted against the outer wall of the insertion slot.

[0024] A storage device includes the backplane connector according to any one of the above embodiments.

[0025] Compared with the prior art, the present disclosure has at least the following advantages:

[0026] 1. For the above - mentioned backplane connector, a plurality of conductive wafers of the bent plug are arranged at intervals in the first housing. One end of the conductive wafer located at the insertion interface is electrically connected to the second differential terminal and the twisted ground terminal of the socket during insertion, and the other end of the conductive wafer is electrically connected to the first differential terminal and the ground terminal. That is, the terminals of the straight socket are electrically connected to the terminals of the bent plug through the conductive wafer. Compared with the traditional technology that requires a plurality of metal conductive parts to be arranged in the plug, in this application, a plurality of conductive wafers are arranged in the first housing. The conductive wafers are in a plate - like structure, and the conductive wafers are integrated with circuits. In this way, the space utilization rate in the first housing is higher, more terminals and conductive wafers can be arranged, so that the terminal density of the bent plug is higher and the transmission rate is better.

[0027] 2. For the above - mentioned backplane connector, a plurality of insertion slots are formed at intervals in the second housing of the straight socket. A first bayonet and a second bayonet are formed on the slot wall of the insertion slot. The stepped portion of the second differential terminal is located in the first bayonet, the twisted ground terminal is located in the second bayonet, and at least one second differential terminal is arranged between two adjacent twisted ground terminals on each insertion slot. The stepped portion of the second differential terminal is arranged parallel to the horizontal plane, and the twisted stepped portion of the twisted ground terminal is arranged at a preset angle with the horizontal plane. That is, the position of the twisted stepped portion installed on the second bayonet is inclined at a certain angle, so that the twisted stepped portion will not interfere with the stepped portion of the adjacent second differential terminal. Under the condition of the limited length of the insertion slot, the inclined setting of the twisted stepped portion can reduce the space occupied by the insertion slot, thereby increasing the number of terminals installed in each insertion slot, and further increasing the terminal density of the socket and further improving the transmission efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] To more clearly illustrate the technical solutions of the embodiments of the present disclosure, the accompanying drawings required for the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present disclosure and should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0029] Figure 1 Schematic diagram of the connection structure of the backplane connector with the first circuit board and the second circuit board in an embodiment;

[0030] Figure 2 For Figure 1 Another schematic diagram of the backplane connector shown;

[0031] Figure 3 For Figure 1 Exploded view of the structure of the bent plug of the backplane connector shown;

[0032] Figure 4 For Figure 1 Exploded view of the structure of the straight socket of the backplane connector shown;

[0033] Figure 5 For Figure 1 Exploded view of the structure of the base of the backplane connector shown;

[0034] Figure 6 For Figure 1 Schematic diagram of the structure of the twisted ground terminal and the second differential terminal of the backplane connector shown;

[0035] Figure 7 For Figure 1 Another schematic diagram of the structure of the twisted ground terminal and the second differential terminal of the backplane connector shown;

[0036] Figure 8 For Figure 1 Schematic diagram of the structure of the conductive wafer of the backplane connector shown;

[0037] Figure 9 For Figure 1 Schematic diagram of the structure of the upper base of the backplane connector shown;

[0038] Figure 10 For Figure 1 Schematic diagram of the structure of the lower base of the backplane connector shown;

[0039] Figure 11 For Figure 1 Schematic diagram of the structure of the first differential terminal and the ground terminal of the backplane connector shown;

[0040] Figure 12 For Figure 1Another schematic diagram of the first differential terminal and the ground terminal of the backplane connector shown;

[0041] Figure 13 is Figure 1 Schematic diagram of the connection structure between the first differential terminal and the ground terminal of the backplane connector shown and the conductive wafer;

[0042] Figure 14 is Figure 1 Another schematic diagram of the backplane connector shown;

[0043] Figure 15 is Figure 1 Another schematic diagram of the backplane connector shown. Detailed implementation manners

[0044] To facilitate the understanding of the present disclosure, the present disclosure will be described more comprehensively below with reference to the relevant drawings. The preferred embodiments of the present disclosure are shown in the drawings. However, the present disclosure can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided so that the understanding of the disclosure content of the present disclosure is more thorough and comprehensive.

[0045] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there can also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only embodiments.

[0046] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this disclosure belongs. The terms used in the description of the present disclosure in this specification are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0047] The present disclosure provides a backplane connector, comprising a bent plug and a straight socket. The bent plug is plugged into the straight socket. The bent plug includes a first housing, a plurality of conductive wafers, a plurality of first differential terminals and a plurality of ground terminals. The plurality of conductive wafers are arranged at intervals within the first housing. The first housing is provided with an insertion opening. One end of each conductive wafer is located within the insertion opening. One end of each first differential terminal and one end of each ground terminal are electrically connected to the corresponding conductive wafer. The other end of each first differential terminal and the other end of each ground terminal are each used for electrically connecting to a first circuit board. The straight socket includes a second housing, a plurality of second differential terminals and a plurality of twisted ground terminals. The second housing is provided with a plurality of insertion slots arranged in spaced columns. A plurality of first bayonet sockets and second bayonet sockets are arranged at intervals on the inner wall of each insertion slot. Each second differential terminal is provided with a stepped portion which is correspondingly located within the first bayonet socket. Each twisted ground terminal is provided with a twisted stepped portion which is correspondingly located within the second bayonet socket. Each conductive wafer within the insertion opening is correspondingly plugged into the insertion slot, so that one end of the second differential terminal and one end of the twisted ground terminal are respectively electrically connected to the conductive wafer. The other end of the second differential terminal and the other end of the twisted ground terminal are each used for electrically connecting to a second circuit board. At least one second differential terminal is provided between two adjacent twisted ground terminals in each insertion slot. Each stepped portion is arranged parallel to the horizontal plane. Each twisted stepped portion is arranged at a preset angle to the horizontal plane.

[0048] For the above-mentioned backplane connector, multiple conductive wafers of the bent plug are spaced apart and arranged in the first housing. One end of the conductive wafer located at the insertion interface is electrically connected to the second differential terminal and the twisted ground terminal of the socket during insertion. The other end of the conductive wafer is electrically connected to the first differential terminal and the ground terminal. That is, the terminals of the straight socket are electrically connected to the terminals of the bent plug through the conductive wafer. Compared with the traditional technology that requires multiple metal conductive parts to be arranged in the plug, in this application, multiple conductive wafers are provided in the first housing. The conductive wafers are in a plate-like structure, and the conductive wafers are integrated with circuits. In this way, the space utilization rate in the first housing is higher, more terminals and conductive wafers can be arranged, so that the terminal density of the bent plug is higher and the transmission rate is better. Multiple spaced-apart insertion slots are provided in the second housing of the straight socket. A first bayonet and a second bayonet are provided on the slot wall of the insertion slot. The stepped portion of the second differential terminal is located in the first bayonet, and the twisted ground terminal is located in the second bayonet. And at least one second differential terminal is provided between two adjacent twisted ground terminals on each insertion slot. The stepped portion of the second differential terminal is arranged parallel to the horizontal plane, and the twisted stepped portion of the twisted ground terminal is arranged at a preset angle with the horizontal plane. That is, the position where the twisted stepped portion is installed on the second bayonet is inclined at a certain angle, so that the twisted stepped portion will not interfere with the stepped portion of the adjacent second differential terminal. Under the condition of the limited length of the insertion slot, the inclined setting of the twisted stepped portion can reduce the space occupied by the insertion slot, thereby increasing the number of terminals installed in each insertion slot, and further increasing the terminal density of the socket and further improving the transmission efficiency.

[0049] To better understand the technical solutions and beneficial effects of the present disclosure, the present disclosure will be further described in detail below with specific embodiments:

[0050] As Figures 1 to 7 shown, a backplane connector 10 in an embodiment includes a bent plug 100 and a straight socket 200. The bent plug 100 is inserted into the straight socket 200. The bent plug 100 includes a first housing 110, multiple conductive wafers 120, multiple first differential terminals 130, and multiple ground terminals 140. The multiple conductive wafers 120 are spaced apart and arranged in the first housing 110. The first housing 110 is provided with an insertion interface 111. One end of each conductive wafer 120 is located in the insertion interface 111. One end of each first differential terminal 130 and one end of each ground terminal 140 are electrically connected to the corresponding conductive wafer 120. The other end of each first differential terminal 130 and the other end of each ground terminal 140 are each used to be electrically connected to a first circuit board 300, so that the first circuit board 300 is conducted with the conductive wafer 120 through the first differential terminals 130 and the ground terminals 140.

[0051] Further, the straight socket 200 includes a second housing 210, a plurality of second differential terminals 220, and a plurality of twisted ground terminals 230. The second housing 210 is provided with a plurality of insertion slots 211 arranged in spaced columns. On the inner wall of each insertion slot 211, a plurality of first clamping openings 212 and second clamping openings 213 are provided at intervals. Each second differential terminal 220 is provided with a stepped portion 221, and the stepped portion 221 is correspondingly located within the first clamping opening 212. Each twisted ground terminal 230 is provided with a twisted stepped portion 232, and the twisted stepped portion 232 is correspondingly located within the second clamping opening 213. Each conductive wafer 120 within the insertion opening 111 is correspondingly inserted into the insertion slot 211, so that one end of the second differential terminal 220 and one end of the twisted ground terminal 230 are respectively electrically connected to the conductive wafer 120. The other ends of the second differential terminal 220 and the twisted ground terminal 230 are both used for electrical connection with the second circuit board 400, so that the second circuit board 400 is electrically connected to the second circuit board 400 through the second differential terminal 220 and the twisted ground terminal 230.

[0052] Further, at least one second differential terminal 220 is provided between two adjacent twisted ground terminals 230 in each insertion slot 211. Each stepped portion 221 is arranged parallel to the horizontal plane, and each twisted stepped portion 232 is arranged at a preset angle with the horizontal plane, that is, there is an included angle between the twisted stepped portion 232 and the horizontal plane where the second housing 210 is installed, so that the twisted stepped portion 232 in each insertion slot 211 occupies less space along the length direction of the insertion slot 211, and thus more terminals can be assembled in each insertion slot 211. Furthermore, the number settings of the first differential terminals 130 and the ground terminals 140 in the angled plug 100 are the same as those of the straight socket 200. That is, when there is one second differential terminal 220 between two twisted ground terminals 230, there is also one first differential terminal 130 between two ground terminals 140 in the angled plug 100, so that the angled plug 100 is adapted to the straight socket 200.

[0053] In this embodiment, a plurality of conductive wafers 120 are arranged at intervals within the first housing 110. The conductive wafers 120 adopt a plate-like structure and have internal integrated circuits. The input end of the conductive wafer 120 is electrically connected to the first differential terminal 130 and the ground terminal 140. The first differential terminal 130 and the ground terminal 140 are electrically connected to the first circuit board 300. The output end of the conductive wafer 120 is electrically connected to the second differential terminal 220 and the twisted ground terminal 230 when the plug and the socket are inserted. The second differential terminal 220 and the twisted ground terminal 230 are electrically connected to the second circuit board 400 to achieve the conduction of the entire circuit. By arranging the conductive wafer 120 with a plate-like structure within the first housing 110, compared with the traditional technology of arranging metal conductive parts within the housing, especially for the structure where the input end and the output end of the angled plug 100 have an included angle, the metal conductive parts within the housing are in an irregular shape, that is, the space utilization rate of the metal conductive parts for the housing is relatively low. In other words, the space utilization rate of the plate-like conductive wafer 120 for the first housing 110 is higher.

[0054] Further, a plurality of insertion slots 211 arranged at intervals are formed within the second housing 210 of the straight socket 200. The groove walls of each insertion slot 211 are provided with a first bayonet 212 and a second bayonet 213 arranged at intervals. The stepped portion 221 of the second differential terminal 220 is located within the first bayonet 212, and the twisted stepped portion 232 of the twisted ground terminal 230 is located within the second bayonet 213. At least one second differential terminal 220 is provided between two adjacent twisted ground terminals 230 in each insertion slot 211, and the stepped portion 221 is arranged parallel to the horizontal plane of the second housing 210 for installation, and the twisted stepped portion 232 is arranged at a preset angle with the horizontal plane of the second housing 210 for installation, that is, there is an included angle between the twisted stepped portion 232 and the horizontal plane of the second housing 210 for installation. In other words, the twisted stepped portion 232 is arranged obliquely with the horizontal plane of the second housing 210 for installation, so that the twisted stepped portion 232 occupies less space along the length direction of each insertion slot 211. In this way, under the condition of the limited length space of the insertion slot 211, the number of terminals that can be assembled in each insertion slot 211 is more, that is, the terminal density of the socket is higher, and further the transmission rate of the connector is faster.

[0055] Further, the number of second differential terminals 220 between two adjacent twisted ground terminals 230 can be designed according to requirements. In this embodiment, the number of second differential terminals 220 between two adjacent twisted ground terminals 230 is two, that is, two second differential terminals 220 form a differential pair for signal transmission. It should be noted that the number of second differential terminals 220 between two adjacent twisted ground terminals 230 needs to be adapted to the electrical connection ends of the conductive wafer 120 to ensure the complete transmission of signals.

[0056] For the above-mentioned backplane connector 10, a plurality of conductive wafers 120 of the angled plug 100 are arranged at intervals within the first housing 110. One end of the conductive wafer 120 located at the insertion interface 111 is electrically connected to the second differential terminal 220 and the twisted ground terminal 230 of the socket during insertion, and the other end of the conductive wafer 120 is electrically connected to the first differential terminal 130 and the ground terminal 140. That is, the terminals of the straight socket 200 are electrically connected to the terminals of the angled plug 100 through the conductive wafers 120. Compared with the conventional technology that requires multiple metal conductive parts to be arranged within the plug, in this application, a plurality of conductive wafers 120 are provided within the first housing 110. The conductive wafers 120 are in a plate-like structure, and the conductive wafers 120 are integrated with circuits. In this way, the space utilization rate within the first housing 110 is higher, more terminals and conductive wafers 120 can be arranged, the terminal density of the angled plug 100 is relatively high, and the transmission rate is relatively good. A plurality of insertion slots 211 arranged at intervals are formed in the second housing 210 of the straight socket 200. A first bayonet 212 and a second bayonet 213 are formed on the slot wall of the insertion slot 211. The stepped portion 221 of the second differential terminal 220 is located within the first bayonet 212, and the twisted ground terminal 230 is located within the second bayonet 213. At least one second differential terminal 220 is provided between two adjacent twisted ground terminals 230 on each insertion slot 211. The stepped portion 221 of the second differential terminal 220 is arranged parallel to the horizontal plane, and the twisted stepped portion 232 of the twisted ground terminal 230 is arranged at a preset angle with the horizontal plane. That is, the position where the twisted stepped portion 232 is mounted on the second bayonet 213 is inclined at a certain angle, so that the twisted stepped portion 232 will not interfere with the stepped portion 221 of the adjacent second differential terminal 220. Under the condition of the limited length of the insertion slot 211, the inclined arrangement of the twisted stepped portion 232 can reduce the space occupied by the insertion slot 211, thereby increasing the number of terminals installed in each insertion slot 211, and further increasing the terminal density of the socket, and further improving the transmission efficiency.

[0057] Such as Figure 6 And Figure 7As shown, in one embodiment, the torsional ground terminals 230 are respectively a clockwise torsional ground terminal and a counterclockwise torsional ground terminal. At least one of the second differential terminals 220 is provided between the adjacent clockwise torsional ground terminal and the counterclockwise torsional ground terminal in each plugging slot 211. The torsional angle of the torsional step portion 232 of the clockwise torsional ground terminal is the same as that of the torsional step portion 232 of the counterclockwise torsional ground terminal. In this embodiment, the overall structures of the clockwise torsional ground terminal and the counterclockwise torsional ground terminal are the same, only the torsional directions in the middle regions are different. The torsional direction of the torsional step portion 232 of the clockwise torsional ground terminal is clockwise, and the torsional direction of the torsional step portion 232 of the counterclockwise torsional ground terminal is counterclockwise. That is, the torsional direction of the torsional step portion 232 of the clockwise torsional ground terminal is opposite to that of the torsional step portion 232 of the counterclockwise torsional ground terminal, and the magnitudes of the torsional angles are the same, so that the clockwise torsional ground terminal and the counterclockwise torsional ground terminal on each plugging slot 211 occupy less space along the length direction of the plugging slot 211, and thus more terminals can be assembled in each plugging slot 211.

[0058] In another embodiment, the torsional ground terminals 230 can all be clockwise torsional ground terminals, that is, the torsional directions of the torsional step portions 232 of the torsional ground terminals 230 are all clockwise, so that the torsional ground terminals 230 occupy less space along the length direction of the plugging slot 211, and more terminals can be assembled in each plugging slot 211.

[0059] In another embodiment, the torsional ground terminals 230 can all be counterclockwise torsional ground terminals, that is, the torsional directions of the torsional step portions 232 of the torsional ground terminals 230 are all counterclockwise, so that the torsional ground terminals 230 occupy less space along the length direction of the plugging slot 211, and more terminals can be assembled in each plugging slot 211.

[0060] Such as Figure 4As shown, in one embodiment, the second housing 210 includes a base 214 and a plurality of bosses 215. The plurality of bosses 215 are spaced apart on the base 214. Two adjacent bosses 215 and the base 214 together form the insertion slot 211. The first bayonet 212 and the second bayonet 213 are formed on the base 214. The bosses 215 are provided with a plurality of first receiving grooves 2151 and second receiving grooves 2152 that are spaced apart. Each first receiving groove 2151 is respectively communicated with the corresponding first bayonet 212 and the insertion slot 211. Each second receiving groove 2152 is respectively communicated with the corresponding second bayonet 213 and the insertion slot 211. A part of the second differential terminal 220 is located in the corresponding first receiving groove 2151, and a part of the twisted ground terminal 230 is located in the second receiving groove 2152. It can be understood that the base 214 and the bosses 215 are injection molded, that is, the base 214 and the bosses 215 are made of plastic material. Two adjacent bosses 215 and the base 214 together form the insertion slot 211. The insertion slots 211 are spaced apart along the arrangement direction of the plurality of bosses 215. The conductive wafers 120 are arranged in one-to-one correspondence with the insertion slots 211. When the angled plug 100 is inserted into the straight socket 200, the conductive wafers 120 at the insertion interface 111 are correspondingly inserted into the insertion slots 211, so that the electrical connection ends of the conductive wafers 120 are respectively abutted against the second differential terminal 220 in the first receiving groove 2151 and the twisted ground terminal 230 in the second receiving groove 2152, thereby enabling the conductive wafers 120 to be electrically connected to the second differential terminal 220 and the twisted ground terminal 230 respectively.

[0061] As Figure 6 and Figure 7As shown, in one embodiment, the twisted ground terminal 230 includes an elastic abutting portion 231, the twisted step portion 232, and an elastic crimping portion 233 that are sequentially connected. The elastic abutting portion 231 is located in the second accommodation groove 2152 so that when the conductive wafer 120 is inserted into the insertion groove 211, the elastic abutting portion 231 is electrically connected to the conductive wafer 120. The twisted step portion 232 is located in the second bayonet 213. After the twisted step portion 232 is twisted, there is a preset angle with the elastic abutting portion 231. The elastic crimping portion 233 is located outside the second bayonet 213, and the elastic crimping portion 233 is used for electrical connection with the second circuit board 400. In this embodiment, the elastic abutting portion 231, the twisted step portion 232, and the elastic crimping portion 233 are an integrally formed structure. The elastic abutting portion 231 is located in the second accommodation groove 2152. When the conductive wafer 120 is inserted into the insertion groove 211, the elastic abutting portion 231 abuts against the electrical connection end of the conductive wafer 120, so that the twisted ground terminal 230 is electrically connected to the conductive wafer 120. The twisted step portion 232 is located in the middle and there is a preset angle between the twisted step portion 232 and the elastic abutting portion 231 after the twisted step portion 232 is twisted, that is, the twisted step portion 232 is inclined with respect to the elastic abutting portion 231. The twisted step portion 232 is located in the second bayonet 213, so that the twisted ground terminal 230 is fixed on the second housing 210. And because the twisted step portion 232 is inclined, the twisted ground terminal 230 occupies less space along the length direction of the insertion groove 211, and thus the number of terminals in each insertion groove 211 is increased. Further, the elastic crimping portion 233 is connected to the twisted step portion 232. The elastic crimping portion 233 is located outside the second bayonet 213. The elastic crimping portion 233 is a fish-eye structure. The elastic crimping portion 233 cooperates with the conductive hole of the second circuit board 400 to press the elastic crimping portion 233 into the conductive hole of the second circuit board 400 to achieve electrical connection.

[0062] As Figure 4 and Figure 5 shown, in one embodiment, two adjacent bosses 215 are arranged in a staggered manner, so that the first accommodation grooves 2151 of two adjacent bosses 215 are arranged in a staggered manner, and the second accommodation grooves 2152 of two adjacent bosses 215 are arranged in a staggered manner. It can be understood that a plurality of bosses 215 are arranged at intervals on one side of the base 214. Two adjacent bosses 215 are arranged in a staggered manner, so that the first accommodation groove 2151 and the second accommodation groove 2152 of one boss 215 are arranged in a staggered manner with the first accommodation groove 2151 and the second accommodation groove 2152 of another boss 215, that is, the terminals in two adjacent bosses 215 are not arranged neatly, that is, the terminals between different columns are arranged with a staggered distance. In this way, the interference of differential terminal signal transmission is reduced, and the signal transmission of the connector is more stable.

[0063] AsFigure 8 As shown, in one embodiment, the conductive wafer 120 has a first end and a second end perpendicular to each other. The first end is provided with a signal gold finger 121 and a ground gold finger 122. The signal gold finger 121 is electrically connected to the second differential terminal 220, and the ground gold finger 122 is electrically connected to the twisted ground terminal 230. The second end is provided with a signal pad 123 and a ground pad 124. The signal pad 123 is electrically connected to the first differential terminal 130, and the ground pad 124 is electrically connected to the first ground terminal 140. The signal gold finger 121 and the signal pad 123 are electrically connected by a differential line 125. It can be understood that the first end and the second end of the conductive wafer 120 are perpendicular to each other, that is, the input end and the output end of the conductive wafer 120 are vertically designed, that is, the plug is a bent design to adapt to the use scenario where the socket is vertically arranged with the first circuit board 300. In this embodiment, the first end of the conductive wafer 120 is provided with a signal gold finger 121 and a ground gold finger 122. The signal gold finger 121 is electrically connected to the second differential terminal 220, and the ground gold finger 122 is electrically connected to the twisted ground terminal 230. The second end of the conductive wafer 120 is provided with a signal pad 123 and a ground pad 124. The first differential terminal 130 passes through the first housing 110 and abuts against the signal pad 123 to realize the electrical connection between the first differential terminal 130 and the conductive wafer 120. The first ground terminal 140 passes through the first housing 110 and is connected to the ground pad 124 to realize the electrical connection between the first ground terminal 140 and the conductive wafer 120. Further, the differential line 125 is the circuit layer on the conductive wafer 120.

[0064] As Figure 3As shown, in one embodiment, the conductive wafers 120 are respectively a first conductive wafer and a second conductive wafer. A second conductive wafer is provided between every two adjacent first conductive wafers, so that the first conductive wafers and the second conductive wafers are arranged in an alternating manner within the first housing 110, and the gold fingers of the second conductive wafers are arranged obliquely with respect to the gold fingers at the corresponding positions of the first conductive wafers. It can be understood that both the first conductive wafer and the second conductive wafer are used for signal transmission. The first conductive wafers and the second conductive wafers are arranged at intervals within the first housing 110, and a second conductive wafer is provided between every two adjacent first conductive wafers, such that the first conductive wafers and the second conductive wafers are arranged in an alternating pattern to form complementary shielding, avoiding signal interference, and thus making signal transmission more stable. Further, in order to reduce the mutual signal interference between the two types of conductive wafers 120 when contacting the socket, the gold fingers at the first end of the second conductive wafer are slightly inclined with respect to the gold fingers of the first conductive wafer. Specifically, the gold fingers of the second conductive wafer are arranged obliquely with respect to the gold fingers at the corresponding positions of the first conductive wafer to form a skew dimension, so as to reduce the signal interference when the two types of conductive wafers 120 are inserted into the socket.

[0065] As Figure 3 , Figure 9 and Figure 10 shown, in one embodiment, the first housing 110 includes an upper base 112 and a lower base 113. The upper base 112 is connected to the lower base 113. The insertion port 111 is opened on the upper base 112. A plurality of first embedding grooves 1121 are provided on the inner side surface of the upper base 112 at intervals. A part of the conductive wafer 120 is located within the first embedding grooves 1121. A plurality of second embedding grooves 1131 are provided on the inner side surface of the lower base 113 corresponding to the first embedding grooves 1121 one by one. A part of the conductive wafer 120 is located within the second embedding grooves 1131; and,

[0066] A plurality of first mounting grooves 1132 and second mounting grooves 1133 are further provided on the groove walls of each of the second embedding grooves 1131 at intervals. A part of the first differential terminal 130 is located within the first mounting grooves 1132. A part of the ground terminal 140 is located within the second mounting grooves 1133.

[0067] In this embodiment, the upper base 112 and the lower base 113 are injection-molded, that is, the upper base 112 and the lower base 113 are made of plastic material. When the conductive chip 120 is assembled, the conductive chip 120 is first partially embedded in the second embedding groove 1131 of the lower base 113, and then the first embedding groove 1121 of the upper base 112 is fitted with the other part of the conductive chip 120, so that the conductive chip 120 is covered by the upper base 112 and the lower base 113, and the first end of the conductive chip 120 passes through the upper base 112 and is exposed outside the insertion port 111, so that when plugged into the socket, the first end of the conductive chip 120 is electrically connected to the terminal of the socket. Then, the upper base 112 and the lower base 113 are locked. At the same time, the end of the first differential terminal 130 passes through the first installation groove 1132 to fix the first differential terminal 130 on the lower base 113, so that the first differential terminal 130 is electrically connected to the conductive chip 120. The end of the first ground terminal 140 passes through the second installation groove 1133 to fix the first ground terminal 140 on the lower base 113, so that the first ground terminal 140 is electrically connected to the conductive chip 120.

[0068] As Figure 11 , Figure 12 and Figure 13 shown, in one of the embodiments, the ground terminal 140 includes two side elastic abutting portions 141, a first stepped fixing portion 142 and a first crimping portion 143 connected in sequence. After the two side elastic abutting portions 141 pass through the second installation groove 1133, they respectively abut against both sides of the conductive chip 120. The first stepped fixing portion 142 is located in the corresponding second installation groove 1133. The first crimping portion 143 is used for electrically connecting to the first circuit board 300. In this embodiment, the two side elastic abutting portions 141, the first stepped fixing portion 142 and the first crimping portion 143 are integrally formed. After the two side elastic abutting portions 141 pass through the second installation groove 1133, they respectively abut against the two side surfaces of the conductive chip 120. Specifically, the two side elastic abutting portions 141 include three elastic feet, and the three elastic feet are distributed in a triangular shape, and there is a gap between adjacent two elastic feet. The conductive chip 120 is inserted between the elastic feet at the end and the two elastic feet at the bottom, so that the connection between the ground terminal 140 and the conductive chip 120 is more stable. Further, the first stepped fixing portion 142 is in a "U" shape, and the first stepped fixing portion 142 is fixed in the second installation groove 1133 to fix the ground terminal 140 to the lower base 113. The first crimping portion 143 is located outside the second installation groove 1133. The first crimping portion 143 is a fish-eye structure. The first crimping portion 143 cooperates with the conductive hole of the first circuit board 300 to press the first crimping portion 143 into the conductive hole of the first circuit board 300 to realize the electrical connection between the ground terminal 140 and the first circuit board 300.

[0069] Furthermore, the ground terminals 140 are arranged in an interleaved manner with the first differential terminals 130. That is, multiple ground terminals 140 are connected to one conductive wafer 120, which are respectively the left ground terminal 140, the middle ground terminal 140, and the right ground terminal 140. The overall shapes and structures of these three ground terminals 140 are the same, and only the number and positions of the fish eyes in the first crimping portion 143 are different to adapt to the conductive holes of the first circuit board 300.

[0070] As Figure 11 , Figure 12 and Figure 13 shown, in one embodiment, the first differential terminal 130 includes a single-sided elastic abutting portion 131, a second step fixing portion 132, and a second crimping portion 133 connected in sequence. The single-sided elastic abutting portion 131 passes through the first mounting groove 1132 and abuts against one side of the conductive wafer 120. The second step fixing portion 132 is located in the corresponding mounting groove, and the second crimping portion 133 is used for electrical connection with the first circuit board 300. In this embodiment, the single-sided elastic abutting portion 131, the second step fixing portion 132, and the second crimping portion 133 are integrally formed structures. The single-sided elastic abutting portion 131 passes through the first mounting groove 1132 and abuts against one side of the conductive wafer 120 to achieve signal transmission. The second step fixing portion 132 is in a "T" shape and is fixed in the first mounting groove 1132 to fix the first differential terminal 130 to the lower base 113. The second crimping portion 133 is located outside the first mounting groove 1132, and the second crimping portion 133 is a fish-eye structure to crimp the second crimping portion 133 with the first circuit board 300 to achieve signal transmission.

[0071] Further, the first differential terminal 130 is in single-sided contact with the signal pad 123 of the conductive chip. To improve the reliability of the contact between the first differential terminal 130 and the conductive chip, a narrow groove structure is provided at one end of the single-sided elastic abutting portion 131 of the first differential terminal 130 away from the second step fixing portion 132. This increases the contact points between the first differential terminal 130 and the conductive chip, thereby improving the reliability of the contact between the first differential terminal 130 and the conductive chip.

[0072] It should be noted that the overall shapes and structures of the first differential terminal 130 and the second differential terminal 220 are the same, both in a "T" shape structure. The difference is that the bending directions of their elastic abutting portions 231 are different, that is, the bending directions of the portions where they abut against the conductive wafer 120 are different to adapt to the electrical connection structure with the conductive wafer 120.

[0073] As Figure 9 and Figure 10As shown, in one embodiment, an anti - tipping boss 1122 protrudes from one end of the upper base 112 away from the insertion interface 111. One end of the lower base 113 is provided with a socket hole 1134, and the anti - tipping boss 1122 is sleeved in the socket hole 1134. It can be understood that an anti - tipping boss 1122 protrudes from one end of the upper base 112 away from the insertion interface 111. When the conductive chip is fixed to the upper base 112 and the lower base 113, the anti - tipping boss 1122 passes through the socket hole 1134 so that the anti - tipping boss 1122 is sleeved in the socket hole 1134, making the connection stability between the upper base 112 and the lower base 113 higher, and at the same time playing a role in preventing tipping.

[0074] As Figure 9 and Figure 10 As shown, in one embodiment, a clamping boss 1123 protrudes from one side of the upper base 112 adjacent to the insertion interface 111. The lower base 113 is provided with a clamping hole 1135, and the clamping boss 1123 is snapped into the clamping hole 1135 to snap - connect the upper base 112 and the lower base 113. It can be understood that when the conductive wafer 120 is fixed to the upper base 112 and the lower base 113, the clamping boss 1123 passes through the clamping hole 1135, so that the upper base 112 and the lower base 113 are snap - connected, and further, the disassembly and assembly convenience of the upper base 112 and the lower base 113 is higher.

[0075] As Figure 9 As shown, in one embodiment, a plurality of spaced - apart guiding bosses 1124 protrude from the inner wall of the insertion interface 111, and the guiding bosses 1124 are in contact with the outer wall of the insertion slot 211. It can be understood that when the insertion interface 111 is inserted into the straight - type plug, the guiding bosses 1124 move along the outer wall of the insertion slot 211 to play a guiding role. Further, a plurality of spaced - apart grooves 1125 are also provided on the outer wall of the insertion interface 111, and the grooves 1125 are arranged in one - to - one correspondence with the guiding bosses 1124 to ensure that the plastic thickness of the upper base 112 at the insertion interface 111 is basically uniform, so as to reduce the deformation amount, ensure stable insertion and at the same time improve the structural strength.

[0076] It can be understood that the bent - type plug 100 and the straight - type socket 200 can be docked and used as an independent unit. When in use, in order to increase the accuracy of the insertion between the bent - type plug 100 and the straight - type socket 200, as Figure 14 and Figure 15As shown, in one of the embodiments, the backplane connector 10 further includes a first guiding member 500 and a second guiding member 600. The first guiding member 500 includes a connecting plate 510 and a guiding post 520. The straight socket 200 is mounted on the connecting plate 510, and the guiding post 520 is connected to the connecting plate 510. The second guiding member 600 includes a mounting plate 610 and a guiding sleeve 620. The guiding sleeve 620 is connected to the mounting plate 610. The angled plug 100 is mounted on the mounting plate 610. The guiding sleeve 620 is provided with a guiding hole 621, and the guiding hole 621 is arranged corresponding to the guiding post 520. In this embodiment, the straight socket 200 is mounted on the mounting area of the connecting plate 510, the angled plug 100 is mounted on the mounting area of the mounting plate 610. The guiding post 520 is arranged at the end of the connecting plate 510, and the guiding post 520 is arranged corresponding to the guiding hole 621 on the guiding sleeve 620. When plugging, the guiding post 520 first enters into the guiding hole 621 to play a guiding role, so that the accuracy of the plugging of the angled plug 100 and the straight socket 200 is higher. Further, in order to meet greater signal transmission, a plurality of straight sockets 200 can be mounted on the connecting plate 510, and a plurality of angled plugs 100 are mounted on the mounting plate 610. The straight sockets 200 and the angled plugs 100 are arranged in one-to-one correspondence. When plugging, the guiding post 520 first enters into the guiding hole 621 to play a guiding role, and then the angled plug 100 is plugged with the corresponding straight socket 200, that is, the angled plugs 100 and the straight sockets 200 are modularly arranged to meet greater signal transmission, and at the same time, the process of aligning each angled plug 100 with the corresponding straight socket 200 during plugging is avoided, thereby improving the convenience of disassembly and assembly of the connector.

[0077] The present application further provides a storage device, including the backplane connector 10 described in any of the above embodiments.

[0078] Compared with the prior art, the present disclosure has at least the following advantages:

[0079] For the above-mentioned backplane connector 10, a plurality of conductive wafers 120 of the angled plug 100 are arranged at intervals within the first housing 110. One end of the conductive wafer 120 located at the insertion interface 111 is electrically connected to the second differential terminal 220 and the twisted ground terminal 230 of the socket during insertion, and the other end of the conductive wafer 120 is electrically connected to the first differential terminal 130 and the ground terminal 140. That is, the terminals of the straight socket 200 are electrically connected to the terminals of the angled plug 100 through the conductive wafer 120. Compared with the conventional technology that requires multiple metal conductive parts to be arranged within the plug, in this application, a plurality of conductive wafers 120 are provided within the first housing 110. The conductive wafers 120 are in a plate-like structure, and the conductive wafers 120 are integrated with circuits. In this way, the space utilization rate within the first housing 110 is higher, more terminals and conductive wafers 120 can be arranged, resulting in a higher terminal density of the angled plug 100 and a better transmission rate. The second housing 210 of the straight socket 200 is provided with a plurality of insertion slots 211 arranged at intervals. The first bayonet 212 and the second bayonet 213 are formed on the slot wall of the insertion slot 211. The stepped portion 221 of the second differential terminal 220 is located within the first bayonet 212, and the twisted ground terminal 230 is located within the second bayonet 213. At least one second differential terminal 220 is provided between two adjacent twisted ground terminals 230 on each insertion slot 211. The stepped portion 221 of the second differential terminal 220 is arranged parallel to the horizontal plane, and the twisted stepped portion 232 of the twisted ground terminal 230 is arranged at a preset angle with respect to the horizontal plane. That is, the position where the twisted stepped portion 232 is mounted on the second bayonet 213 is inclined at a certain angle, so that the twisted stepped portion 232 will not interfere with the stepped portion 221 of the adjacent second differential terminal 220. With the length of the insertion slot 211 limited, the inclined arrangement of the twisted stepped portion 232 can reduce the space occupied by the insertion slot 211, thereby increasing the number of terminals installed in each insertion slot 211, further increasing the terminal density of the socket and further improving the transmission efficiency.

[0080] The above-described embodiments merely represent several implementation manners of the present disclosure. The description thereof is relatively specific and detailed, but it should not be construed as a limitation on the scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present disclosure, several modifications and improvements can still be made, and these all belong to the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure patent shall be subject to the appended claims.

Claims

1. A backplane connector, comprising a curved plug and a straight socket, wherein the curved plug is plugged into the straight socket, characterized in that: The angle plug includes a first shell, a plurality of conductive chips, a plurality of first differential terminals and a plurality of grounding terminals. The plurality of conductive chips are arranged in the first shell at intervals. The first shell is provided with an insertion interface. One end of each of the conductive chips is located in the insertion interface. One end of each of the first differential terminals and one end of each of the grounding terminals are electrically connected to the corresponding conductive chip. The other end of each of the first differential terminals and the other end of each of the grounding terminals are used to be electrically connected to the first circuit board. The straight socket includes a second shell, a plurality of second differential terminals and a plurality of twisted grounding terminals, the second shell is provided with a plurality of plug-in slots arranged in intervals, a plurality of first bayonet holes and second bayonet holes are provided on the slot wall in each of the plug-in slots, each of the second differential terminals is provided with a step portion, the step portion is correspondingly located in the first bayonet hole, each of the twisted grounding terminals is provided with a twisted step portion, the twisted step portion is correspondingly located in the second bayonet hole, each of the conductive chips in the plug-in interface is correspondingly plugged into the plug-in slot, so that one end of the second differential terminal and one end of the twisted grounding terminal are respectively electrically connected to the conductive chip, and the other end of the second differential terminal and the other end of the twisted grounding terminal are both used to be electrically connected to the second circuit board; and, At least one second differential terminal is provided between two adjacent twisted grounding terminals of each of the plug-in slots, each of the step portions is arranged parallel to the horizontal plane, and each of the twisted step portions is arranged at a preset angle to the horizontal plane.

2. The backplane connector according to claim 1, characterized in that: The twisted grounding terminals are respectively a forward twisted grounding terminal and a reverse twisted grounding terminal. At least one second differential terminal is provided between adjacent forward twisted grounding terminals and reverse twisted grounding terminals in each of the plug-in slots. The twisting angle of the twisted step portion of the forward twisted grounding terminal is the same as the twisting angle of the twisted step portion of the reverse twisted grounding terminal.

3. The backplane connector according to claim 1, characterized in that: The second shell includes a base and a plurality of bosses, wherein the plurality of bosses are arranged at intervals on the base, and two adjacent bosses and the base together form the plug-in slot, the first bayonet and the second bayonet are formed on the base, and the boss is provided with a plurality of first receiving grooves and second receiving grooves arranged at intervals, each of the first receiving grooves is respectively connected with the corresponding first bayonet and the plug-in slot, and each of the second receiving grooves is respectively connected with the corresponding second bayonet and the plug-in slot, the second differential terminal portion is located in the corresponding first receiving groove, and the torsional grounding terminal portion is located in the second receiving groove.

4. The backplane connector according to claim 3, characterized in that: The twisted grounding terminal comprises an elastic abutment portion, a twisted step portion and an elastic crimping portion connected in sequence, the elastic abutment portion is located in the second accommodating groove, so that when the conductive chip is inserted into the insertion groove, the elastic abutment portion is electrically connected to the conductive chip, the twisted step portion is located in the second bayonet, and after the twisted step portion is twisted, there is a preset angle between the twisted step portion and the elastic abutment portion, the elastic crimping portion is located outside the second bayonet, and the elastic crimping portion is used to be electrically connected to the second circuit board; and / or, Two adjacent bosses are staggered so that the first receiving grooves of the two adjacent bosses are staggered and the second receiving grooves of the two adjacent bosses are staggered.

5. The backplane connector according to claim 1, characterized in that: The conductive chip has a first end and a second end which are perpendicular to each other. The first end is provided with a signal gold finger and a ground gold finger. The signal gold finger is electrically connected to the second differential terminal, and the ground gold finger is electrically connected to the twisted ground terminal. The second end is provided with a signal pad and a ground pad. The signal pad is electrically connected to the first differential terminal, and the ground pad is electrically connected to the first ground terminal. The signal gold finger is electrically connected to the signal pad through a differential line.

6. The backplane connector according to claim 1, characterized in that: The conductive chips are respectively a first conductive chip and a second conductive chip, and a second conductive chip is provided between every two adjacent first conductive chips, so that the first conductive chips and the second conductive chips are arranged in a staggered manner in the first shell, and the gold fingers of the second conductive chip are arranged to be inclined relative to the gold fingers of the first conductive chip.

7. The backplane connector according to claim 1, characterized in that: The first shell includes an upper base and a lower base, the upper base is connected to the lower base, the plug interface is provided on the upper base, a plurality of first embedding grooves arranged at intervals are provided on the inner side surface of the upper base, the conductive chip portion is located in the first embedding grooves, a plurality of second embedding grooves corresponding to the first embedding grooves are provided on the inner side surface of the lower base, the conductive chip portion is located in the second embedding grooves; and, The groove wall of each second embedding groove is further provided with a plurality of first mounting grooves and second mounting grooves which are arranged at intervals. The first differential terminal is partially located in the first mounting groove, and the grounding terminal is partially located in the second mounting groove.

8. The backplane connector according to claim 7, characterized in that: The ground terminal comprises two elastic abutting parts on both sides, a first step fixing part and a first crimping part connected in sequence, the two elastic abutting parts on both sides respectively abut against two sides of the conductive chip after passing through the second mounting groove, the first step fixing part is located in the corresponding second mounting groove, and the first crimping part is used to be electrically connected to the first circuit board; and / or, The first differential terminal includes a single-sided elastic abutment portion, a second step fixing portion and a second crimping portion connected in sequence, the single-sided elastic abutment portion abuts against one side of the conductive chip after passing through the first mounting groove, the second step fixing portion is located in the corresponding mounting groove, and the second crimping portion is used to be electrically connected to the first circuit board.

9. The backplane connector according to claim 7, characterized in that: An anti-turnover boss is protruded from one end of the upper base away from the plug port, a sleeve hole is opened at one end of the lower base, and the anti-turnover boss is sleeved in the sleeve hole; and / or, A clamping boss is convexly provided on one side of the upper base adjacent to the plug port, and a clamping hole is provided on the lower base, and the clamping boss is clamped into the clamping hole, so that the upper base is clamped with the lower base; and / or, The inner wall of the plug interface is protruded with a plurality of guide bosses arranged at intervals, and the guide bosses abut against the outer wall of the plug slot.

10. A storage device, characterized in that: A backplane connector comprising any one of claims 1 to 9.

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