Array type flexible liquid metal electromagnetic shielding assembly and use method and preparation method thereof
Through the array flexible liquid metal electromagnetic shielding assembly, the problem that electromagnetic shielding materials in the prior art are difficult to adapt to flexible electronic devices is solved, and customized shielding of complex-shaped devices is realized, meeting the needs of electromagnetic interference and electrostatic interference in high-frequency multi-function environments.
Patent Information
- Application Number
- CN202510247438.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-04
- Publication Date
- 2025-05-27
AI Technical Summary
The existing electromagnetic shielding materials are rigid structures, which are difficult to meet the needs of flexible electronic devices and complex-shaped devices, and it is difficult to achieve customized shielding in different areas.
Array-type flexible liquid metal electromagnetic shielding components are adopted, including a flow channel layer, a packaging layer and a shielding flow channel. The shielding flow channel is filled with liquid metal and electrically conduction is achieved through grounding wires. The shielding flow channel is divided into multiple shielding areas and is distributed in an array to meet the shielding needs of different parts.
It realizes efficient electromagnetic shielding of flexible electronic devices and complex-shaped devices, and can be customized for different parts to meet the electromagnetic interference and electrostatic interference needs of precision devices in high-frequency and multi-function environments.
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Figure CN120050919A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical fields of electromagnetic shielding and microfluidics, and particularly relates to an array-type flexible liquid metal electromagnetic shielding component, a using method, and a preparation method thereof. Background Art
[0002] With the wide application of modern electronic devices, systems, and microfluidic devices, electromagnetic interference (EMI) and electrostatic discharge (ESD) pose a serious threat to the normal operation of precision devices. Especially in high-frequency and high-sensitivity electronic devices, systems, and microfluidic devices, electromagnetic interference may cause signal distortion, data loss, or equipment failure; while electrostatic discharge may lead to serious consequences such as circuit damage and component failure. Therefore, effective electromagnetic shielding and electrostatic shielding technologies are the key guarantees for the stable operation of these precision devices.
[0003] In the prior art, most electromagnetic shielding materials are rigid structures, which are difficult to meet the requirements of flexible electronic devices and devices with complex shapes; moreover, in the face of complex systems that require customized shielding of different regions, it is difficult to achieve effective shielding of multiple regions. Summary of the Invention
[0004] The present invention provides an array-type flexible liquid metal electromagnetic shielding component, a using method, and a preparation method thereof, which are used to solve the defect that the electromagnetic shielding material in the prior art is a rigid structure and is difficult to meet the requirements of flexible electronic devices and devices with complex shapes, and to achieve shielding that can be used for precision devices, and to perform customized shielding on different parts of the same device to be shielded, so as to meet the requirements of precision devices for combating electromagnetic interference and electrostatic interference in high-frequency and multi-functional working environments.
[0005] The present invention provides an array-type flexible liquid metal electromagnetic shielding component, including: A flow channel layer; An encapsulation layer, disposed on the outer periphery of the flow channel layer; and both the flow channel layer and the encapsulation layer are flexible materials; Shielding flow channels, disposed on the top of the flow channel layer, with liquid metal filled inside the shielding flow channels; and the shielding flow channels are divided into multiple shielding zones, and the multiple shielding zones are distributed in an array; the structure of the shielding zone is adapted to the electronic device; A ground wire, one end of which is in electrical contact with the liquid metal to achieve electrical conduction, and the other end of the ground wire is grounded.
[0006] According to the array-type flexible liquid metal electromagnetic shielding component provided by the present invention, between the shielding flow channels of different shielding zones, they are connected to form a complete flow channel, or partially connected to form multiple complete flow channels; and grounding wires that are electrically conductive with the liquid metal are provided at the entrances and exits of each group of complete flow channels.
[0007] An array - type flexible liquid metal electromagnetic shielding component provided by the present invention, wherein the height and width of the shielding flow channel are both greater than or equal to 10 micrometers.
[0008] An array - type flexible liquid metal electromagnetic shielding component provided by the present invention, wherein the shielding flow channel includes a meandering flow channel, a grid flow channel, a zig - zag flow channel or a completely covered flow channel.
[0009] An array - type flexible liquid metal electromagnetic shielding component provided by the present invention, wherein the flexible material includes one of polydimethylsiloxane, polyadipic acid and human - body silica gel.
[0010] An array - type flexible liquid metal electromagnetic shielding component provided by the present invention, wherein the grounding wire includes a single - strand or multi - strand wire, and the wire is a metal wire or a wire with a conductive coating.
[0011] An array - type flexible liquid metal electromagnetic shielding component provided by the present invention, wherein the liquid metal includes a eutectic alloy or a single - element metal with a melting point lower than 150 °C.
[0012] The present invention also provides a method for using an array - type flexible liquid metal electromagnetic shielding component, including: Wrapping the device to be shielded from above and below; Or vertically stacking multiple layers of the array - type flexible liquid metal electromagnetic shielding components to form a multi - layer structure.
[0013] The present invention also provides a preparation method for an array - type flexible liquid metal electromagnetic shielding component, which is used to prepare the above - mentioned array - type flexible liquid metal electromagnetic shielding component, including: Processing a mold of a flow channel layer with a shielding flow channel through soft lithography or 3D printing technology, and obtaining the flow channel layer through casting; Bonding the flow channel layer and the encapsulation layer; Pouring and filling liquid metal into the shielding flow channel; Inserting a grounding wire at the inlet and outlet of the liquid metal, and encapsulating the inlet and outlet.
[0014] The preparation method for an array - type flexible liquid metal electromagnetic shielding component according to the present invention further includes: Manufacturing a multi - layer shielding component, preparing the device to be shielded, and stacking them in sequence from top to bottom or from bottom to top.
[0015] The array-type flexible liquid metal electromagnetic shielding component provided by the present invention can flexibly adapt to devices of various complex shapes by using flexible materials for the flow channel layer and the encapsulation layer. The shielding flow channels are arranged on the top of the flow channel layer, and the inside of the shielding flow channels is filled with liquid metal. Multiple shielding areas are distributed in an array, and the structure of the shielding areas is adapted to the electronic devices, enabling the shielding function to be customized for different parts of the same electronic device, meeting the requirements of precision devices for combating electromagnetic interference and electrostatic interference in high-frequency and multi-functional working environments, and capable of providing efficient electromagnetic and electrostatic shielding effects.
[0016] The usage method of the array-type flexible liquid metal electromagnetic shielding component provided by the present invention can wrap the component to be shielded up and down to achieve the best shielding effect; it can also vertically stack multiple shielding components on the component to be shielded to form a multi-layer structure, simultaneously shielding external electromagnetic interference and interference between different components to be shielded.
[0017] The preparation method of the array-type flexible liquid metal electromagnetic shielding component provided by the present invention can prepare an array-type flexible liquid metal electromagnetic shielding component that can flexibly adapt to devices of various complex shapes and can provide efficient electromagnetic and electrostatic shielding effects. At the same time, to meet the customized shielding requirements of different parts, it has flexibility and functional diversity. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.
[0019] Figure 1 It is a schematic structural diagram of the array-type flexible liquid metal electromagnetic shielding component in the embodiment of the present invention; Figure 2 It is one of the schematic structural diagrams of the connection mode of the liquid metal flow channels and the connection mode of the grounding wires in the array-type flexible liquid metal electromagnetic shielding component in the embodiment of the present invention; Figure 3 It is the second of the schematic structural diagrams of the connection mode of the shielding flow channels and the connection mode of the grounding wires in the array-type flexible liquid metal electromagnetic shielding component in the embodiment of the present invention; Figure 4 It is one of the schematic diagrams of the shielding array distribution mode in the array-type flexible liquid metal electromagnetic shielding layer in the embodiment of the present invention; Figure 5 It is the second of the schematic diagrams of the shielding array distribution mode in the array-type flexible liquid metal electromagnetic shielding layer in the embodiment of the present invention; Figure 6This is the third schematic diagram of the shielding array distribution method in the array-type flexible liquid metal electromagnetic shielding layer in the embodiments of the present invention; Figure 7 This is the first schematic diagram of the liquid metal flow channel structure in the array-type flexible liquid metal electromagnetic shielding layer in the embodiments of the present invention; Figure 8 This is the second schematic diagram of the liquid metal flow channel structure in the array-type flexible liquid metal electromagnetic shielding layer in the embodiments of the present invention; Figure 9 This is the third schematic diagram of the liquid metal flow channel structure in the array-type flexible liquid metal electromagnetic shielding layer in the embodiments of the present invention; Figure 10 This is the fourth schematic diagram of the liquid metal flow channel structure in the array-type flexible liquid metal electromagnetic shielding layer in the embodiments of the present invention; Figure 11 This is the fifth schematic diagram of the liquid metal flow channel structure in the array-type flexible liquid metal electromagnetic shielding layer in the embodiments of the present invention; Figure 12 This is the sixth schematic diagram of the liquid metal flow channel structure in the array-type flexible liquid metal electromagnetic shielding layer in the embodiments of the present invention; Figure 13 This is the seventh schematic diagram of the liquid metal flow channel structure in the array-type flexible liquid metal electromagnetic shielding layer in the embodiments of the present invention; Figure 14 This is the eighth schematic diagram of the liquid metal flow channel structure in the array-type flexible liquid metal electromagnetic shielding layer in the embodiments of the present invention; Figure 15 This is the ninth schematic diagram of the liquid metal flow channel structure in the array-type flexible liquid metal electromagnetic shielding layer in the embodiments of the present invention; Figure 16 This is the schematic diagram of the usage method of the array-type flexible liquid metal electromagnetic shielding layer in the embodiments of the present invention; Figure 17 This is the first schematic diagram of the multi-layer stacking application method of the array-type flexible liquid metal electromagnetic shielding layer in the embodiments of the present invention; Figure 18 This is the second schematic diagram of the multi-layer stacking application method of the array-type flexible liquid metal electromagnetic shielding layer in the embodiments of the present invention; Figure 19 This is the third schematic diagram of the multi-layer stacking application method of the array-type flexible liquid metal electromagnetic shielding layer in the embodiments of the present invention.
[0020] Reference numerals: 1. Flow channel layer; 2. Encapsulation layer; 3. Shielding flow channel; 4. Liquid metal; 5. Ground wire; 6. Shielding component; 7. Device to be shielded. Detailed implementation manners
[0021] To make the objectives, technical solutions and advantages of the present invention clearer, the technical solutions in the present invention will be clearly and completely described below with reference to the accompanying drawings in the present invention. Obviously, the described embodiments are some but not all of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present invention without creative efforts shall fall within the protection scope of the present invention.
[0022] In the description of the embodiments of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the embodiments of the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the embodiments of the present invention. In addition, the terms "first", "second", and "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.
[0023] The following will be combined with Figures 1-19 to describe the array-type flexible liquid metal electromagnetic shielding component of the embodiments of the present invention.
[0024] As Figures 1-3 shown, the embodiments of the present invention provide an array-type flexible liquid metal electromagnetic shielding component, which includes a flow channel layer 1, a packaging layer 2, a shielding flow channel 3, a liquid metal 4, and a grounding wire 5. The packaging layer 2 is arranged on the outer periphery of the flow channel layer 1; both the flow channel layer 1 and the packaging layer 2 are flexible materials and can flexibly adapt to devices of various complex shapes.
[0025] The shielding flow channel 3 is arranged on the top of the flow channel layer 1. The inside of the shielding flow channel 3 is filled with the liquid metal 4. The shielding flow channel 3 is divided into multiple shielding areas, and the multiple shielding areas are arranged in an array. Moreover, the structure of the shielding area is adapted to the electronic device. This enables the shielding function to be customized for different parts of the same electronic device, meets the requirements of precision devices for combating electromagnetic interference and electrostatic interference in high-frequency and multi-functional working environments, and can provide an efficient electromagnetic and electrostatic shielding effect.
[0026] One end of the grounding wire 5 is in contact with the liquid metal 4 to achieve electrical conduction, and the other end of the grounding wire 5 is grounded.
[0027] It should be noted that the array - type flexible liquid - metal shielding component 6 can shield both the electrostatic field and the electromagnetic field. Among them, the shielding principle of the electrostatic field is that one end of the grounding wire 5 is connected to the liquid metal 4 and the other end is reliably grounded to ensure that the shielding component 6 and the ground are at the same electric potential, so as to achieve the effect of electrostatic shielding; the shielding principle of the electromagnetic field is that the electrons inside the liquid metal 4 move in the opposite direction with the applied electromagnetic field, thereby reflecting the electromagnetic field entering the shielding layer, so as to achieve the electromagnetic field shielding effect inside the layer.
[0028] In a feasible embodiment of the present invention, between the shielding channels 3 of different shielding regions, they are interconnected to form a complete channel or partially connected to form multiple complete channels; and grounding wires 5 that are electrically connected to the liquid metal 4 are provided at the entrances and exits of each group of the complete channels. The number and shape of the shielding channels 3 can be set according to actual needs.
[0029] Among them, the shape and number of the shielding - area arrays are not limited, mainly to meet the shielding requirements. Moreover, the structure of the shielding channels 3 in each array is not limited, mainly to meet the shielding requirements.
[0030] Furthermore, to ensure the successful perfusion of the liquid metal, the height and width of the shielding channels 3 are both greater than or equal to 10 micrometers.
[0031] Furthermore, as Figures 4-6 shown, within the shielding region, the shape of each sub - array is not limited and can be an irregular triangular partition (as Figure 4 shown), a regularly arranged circular partition (as Figure 5 shown), a regularly arranged rectangular partition (as Figure 6 shown), etc. The number is not limited, mainly to meet the shielding requirements.
[0032] In addition, the structure of the shielding channels in each array is not limited. Referring to Figures 7-15 , it can be a zigzag channel (as Figure 7 and Figure 10 shown), a grid channel (as Figure 8 shown), a meandering channel (as Figure 9 and Figure 11 shown), a fully - covering channel (as Figure 12 shown), an irregular - design channel (as Figure 13 , Figure 14 and Figure 15 shown), etc. The channel width can be designed as a narrow channel or a wide channel (as Figure 9 and Figure 10 shown) on the premise of meeting the minimum design - size requirements. The specific design is mainly to meet the shielding requirements.
[0033] Among them, the flexible material uses an inner flexible silicone material, such as polydimethylsiloxane (PDMS), Eco-flex, human silicone, etc.; the material of the ground wire is a single-strand or multi-strand wire made of a metal with a conductivity greater than 1×10 S / m, such as silver, copper, gold, aluminum, etc., or a single-strand or multi-strand wire with a conductive coating, such as silver-plated copper wire, tin-plated copper wire, etc., and the total outer diameter of the wire is less than 5 mm; the liquid metal filled in the shielding channel is a eutectic alloy or elemental metal with a melting point lower than 150°C, including gallium, gallium-based eutectic alloy, bismuth-based eutectic alloy, etc.
[0034] Among them, the array-type flexible liquid metal electromagnetic shielding component is overall in a flat and thin sheet shape, and the total thickness is less than 5 mm. At the same time, in order to ensure the integrity of the shielding component, the flow channel layer 1 without the shielding channel 3 is at least 40 microns higher than the height of the shielding channel 3, the thickness of the encapsulation layer 2 is at least 5 microns, the top view shape and size are determined by the shielding requirements, and the maximum size is determined by the manufacturing method of the shielding channel. For example, if a soft lithography method is used to manufacture the mold, the maximum size does not exceed the size of the silicon wafer. If a 3D printing method is used to manufacture the mold, the maximum size does not exceed the size of the 3D printing forming platform.
[0035] As Figure 16 and Figure 17 shown, the second aspect embodiment of the present invention is to provide a use method of an array-type flexible liquid metal electromagnetic shielding component. When in use, select two array-type flexible liquid metal electromagnetic shielding components and wrap the device to be shielded up and down, so that both the upper and lower layers of the device to be shielded are electromagnetically shielded to achieve the best shielding effect.
[0036] As Figure 18 shown, further, there can also be a complex use method, vertically stacking multiple layers of array-type flexible liquid metal electromagnetic shielding components to form a multi-layer structure. This arrangement can not only shield external electromagnetic interference but also shield the interference of the devices to be shielded on different layers. After completing the stacking structure of the shielding component 6 and the device to be shielded 7, during operation, it is necessary to reliably ground one end of all the ground wires 5 that do not contact the liquid metal 4 to achieve the effect of simultaneous electromagnetic shielding and electrostatic shielding.
[0037] The third aspect embodiment of the present invention is to provide a preparation method of an array-type flexible liquid metal electromagnetic shielding component, including: S1. Process a mold of the flow channel layer 1 with a shielding channel 3 through soft lithography or 3D printing technology, and obtain the flow channel layer 1 by casting. S2. Bond the flow channel layer 1 and the encapsulation layer 2.
[0038] S3. Pour and fill the liquid metal 4 in the shielding channel 3.
[0039] S4. Insert a grounding wire 5 at the inlet and outlet of the liquid metal 4, and encapsulate the inlet and outlet.
[0040] If multiple layers need to be stacked, after separately manufacturing the array-type flexible liquid metal electromagnetic shielding components, prepare the device to be shielded, and stack them sequentially from top to bottom or from bottom to top.
[0041] Next, taking soft lithography as the mold processing technology, polydimethylsiloxane as the manufacturing material for the flow channel layer or encapsulation layer, and eutectic gallium-indium alloy as the liquid metal in the shielding layer, and a single flow channel as the shielding structure as an example, the manufacturing process of the electromagnetic shielding component will be specifically described: a. Design the structure of the shielding flow channel 3, and process the mold using soft lithography technology; b. Add a sufficient amount of PDMS prepolymer to the center of the mold, evenly cover a layer of silicone film on the mold by spin coating, and cure it at 65 °C for 2.5 h. After demolding, form the flow channel layer 1; c. Punch holes at the reserved inlets and outlets of the flow channels on the demolded flow channel layer 1; d. Add a sufficient amount of PDMS prepolymer to the center of the empty silicon wafer, evenly cover a layer of silicone film on the silicon wafer by spin coating, and cure it at 65 °C for 2.5 h to form the encapsulation layer 2; e. Use plasma treatment to bond the demolded and punched flow channel layer 1 to the encapsulation layer 2 on the empty silicon wafer to encapsulate the flow channels; when bonding, the side with the flow channels faces down; f. At room temperature, start from one of the reserved liquid metal ports, pour the liquid metal 4 into the micro-flow channel until the liquid metal 4 flows out from the other reserved port; continue pouring until the micro-flow channel is filled with liquid metal and then stop pouring; g. Insert one end of the prepared grounding wire at the inlets and outlets of the liquid metal respectively; h. Seal the inlets and outlets of the liquid metal with silicone. After the silicone dries, complete the manufacture of a single-layer shielding component.
[0042] In the description of the embodiments of the present invention, it should be noted that unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.
[0043] In the description of this specification, the descriptions referring to terms such as "one embodiment", "some embodiments", "mode", "specific mode", or "some modes" etc. mean that the specific features, structures, materials or characteristics described in connection with the embodiment or mode are included in at least one embodiment or mode of the embodiments of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or mode. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or modes. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or modes described in this specification and the features of different embodiments or modes.
[0044] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims
1. An array-type flexible liquid metal electromagnetic shielding component, characterized in that: include: Runner layer (1); The encapsulation layer (2) is arranged on the periphery of the flow channel layer (1); and both the flow channel layer (1) and the encapsulation layer (2) are made of flexible materials; A shielding flow channel (3) is arranged on the top of the flow channel layer (1), and the interior of the shielding flow channel (3) is filled with liquid metal (4); the shielding flow channel (3) is divided into a plurality of shielding areas, and the plurality of shielding areas are distributed in an array; the structure of the shielding area is compatible with the electronic device; A grounding wire (5) has one end in contact with the liquid metal (4) to achieve electrical conduction, and the other end of the grounding wire (5) is grounded.
2. The array-type flexible liquid metal electromagnetic shielding component according to claim 1, characterized in that: The shielding flow channels (3) of different shielding areas are interconnected to form a complete flow channel, or partially connected to form multiple complete flow channels; and the inlet and outlet of each group of complete flow channels are provided with a grounding wire that is conductive to the liquid metal (4).
3. The array-type flexible liquid metal electromagnetic shielding assembly according to claim 2, characterized in that: The height and width of the shielding flow channel (3) are both greater than or equal to 10 micrometers.
4. The array-type flexible liquid metal electromagnetic shielding assembly according to claim 1, characterized in that: The shielding flow channel (3) comprises a zigzag flow channel, a grid flow channel, a zigzag flow channel or a completely covered flow channel.
5. The array-type flexible liquid metal electromagnetic shielding assembly according to claim 1, characterized in that: The flexible material includes one of polydimethylsiloxane, polyadipic acid and human silicone.
6. The array-type flexible liquid metal electromagnetic shielding assembly according to claim 1, characterized in that: The grounding wire (5) comprises a single-strand or multi-strand wire, and the wire is a metal wire or a wire with a conductive coating.
7. The array-type flexible liquid metal electromagnetic shielding assembly according to claim 1, characterized in that: The liquid metal (4) comprises a eutectic alloy or a single metal having a melting point below 150°C.
8. A method for using an array-type flexible liquid metal electromagnetic shielding component, characterized in that: include: Wrapping the device to be shielded (7) up and down by an array-type flexible liquid metal electromagnetic shielding component (6); Or multiple layers of the array-type flexible liquid metal electromagnetic shielding components (6) are stacked vertically to form a multi-layer structure.
9. A method for preparing an array-type flexible liquid metal electromagnetic shielding component, used for preparing an array-type flexible liquid metal electromagnetic shielding component as claimed in any one of claims 1 to 7, characterized in that: include: A mold of a flow channel layer (1) having a shielding flow channel (3) is processed by soft lithography or 3D printing technology, and the flow channel layer (1) is obtained by inverting the mold; Laminating the flow channel layer (1) and the packaging layer (2); Pouring and filling the shielding flow channel (3) with liquid metal (4); A grounding wire (5) is inserted into the inlet and outlet of the liquid metal (4), and the inlet and outlet are sealed.
10. The method for preparing an array-type flexible liquid metal electromagnetic shielding component according to claim 9, characterized in that: Also includes: A multi-layer shielding assembly (6) is manufactured, and components to be shielded (7) are prepared and stacked in sequence from top to bottom or from bottom to top.