Electromagnetic shielding structure and manufacturing method thereof

Abstract

The invention relates to the field of electromagnetic shielding, and provides an electromagnetic shielding structure and a manufacturing method thereof. The electromagnetic shielding structure comprises a first base layer; the second base layer is adjacent to the first base layer, a flow channel used for pouring liquid metal is defined between the second base layer and the first base layer, the flow channel is used for forming a metal shielding layer, and a containing cavity used for shielding a part to be shielded is defined by the first base layer, the second base layer and the metal shielding layer. The electromagnetic shielding structure can effectively block or weaken the interference of an external electromagnetic field, and protect the to-be-shielded part from the influence of electromagnetic radiation; different application scenes can be flexibly adapted; the manufacturing process of a traditional electromagnetic shielding structure is simplified, and the manufacturing cost is reduced. The electromagnetic shielding structure has the technical effects of efficient electromagnetic shielding, flexible customization, simplified manufacturing process, improved structural stability and the like, and is suitable for various occasions needing electromagnetic shielding protection.

Description

Technical Field

[0001] The invention relates to the field of electromagnetic shielding and provides an electromagnetic shielding structure and a manufacturing method thereof. Background Art

[0002] Microfluidic technology has developed rapidly in recent years, providing many new approaches in the fields of biomedicine, chemical analysis, environmental monitoring, etc. Microfluidic chips and small sensors are crucial in these applications, enabling precise control and analysis of small amounts of liquid. However, with the application of these micro devices, the problem of electromagnetic interference has become increasingly prominent. Electromagnetic interference can seriously affect signal acquisition and transmission, causing the device to fail to work properly. Therefore, how to effectively protect microfluidic devices from electromagnetic interference has become a technical problem that needs to be solved urgently.

[0003] Existing electromagnetic shielding materials, such as metal plates, metal meshes or coatings, have limitations in the application of microfluidic chips and small sensors. First, these harder shielding materials are difficult to adapt to the complex shapes and tiny structures of micro devices. Second, traditional shielding materials are heavy, which is not conducive to the lightweight design of micro devices. In addition, as the size of the device decreases, the difficulty of processing and applying shielding materials also increases accordingly. Summary of the invention

[0004] The embodiment of the present invention provides an electromagnetic shielding structure to solve the defect that the electromagnetic shielding structure in the related art is difficult to meet the requirements of miniaturization and diversified shielding.

[0005] The embodiment of the present invention also provides a method for manufacturing an electromagnetic shielding structure.

[0006] A first aspect of the present invention provides an electromagnetic shielding structure, comprising: First grassroots level; The second base layer is arranged adjacent to the first base layer, and a flow channel for pouring liquid metal is formed between the second base layer and the first base layer. The flow channel is used to form a metal shielding layer. The first base layer, the second base layer and the metal shielding layer form a accommodating cavity for shielding the shielded component.

[0007] According to an embodiment of the present invention, the flow channel is formed with an inlet and an outlet, and the inlet and the outlet are provided with sealing members.

[0008] According to an embodiment of the present invention, the sealing member is a flexible sealing member.

[0009] According to an embodiment of the present invention, the width and height of the flow channel are greater than or equal to 10 microns.

[0010] According to one embodiment of the present invention, the sum of the thickness of the first base layer and the thickness of the second base layer is less than 2 centimeters.

[0011] According to one embodiment of the present invention, the first base layer is a flexible first base layer; and / or, The second base layer is a flexible second base layer.

[0012] According to one embodiment of the present invention, the liquid metal includes a eutectic alloy or a single metal having a low melting point of less than 150 degrees Celsius.

[0013] According to an embodiment of the present invention, a first groove is formed on a side of the first base layer opposite to the second base layer, a second groove is formed on a side of the second base layer opposite to the first base layer, and the first groove and the second groove are arranged to form the flow channel; Alternatively, a first groove is formed on a side of the first base layer opposite to the second base layer, and the first groove and the second base layer are surrounded to form the flow channel; Alternatively, a second groove is formed on a side of the second base layer opposite to the first base layer, and the second groove and the first base layer are surrounded to form the flow channel.

[0014] According to one embodiment of the present invention, the enclosed area of ​​the metal shielding layer is greater than or equal to the component to be shielded.

[0015] A second aspect of the present invention provides a method for manufacturing the electromagnetic shielding structure as described above, comprising: Determining the structural dimensions of the first base layer and the second base layer based on the dimensions of the component to be shielded; The flow channel is formed by surrounding the first base layer and the second base layer; The flow channel is filled with liquid metal.

[0016] According to the electromagnetic shielding structure provided by the embodiment of the first aspect of the present invention, the metal shielding layer is solidified from liquid metal, has excellent conductivity and electromagnetic shielding performance, can effectively block or weaken the interference of external electromagnetic fields, and protect the shielded parts from the influence of electromagnetic radiation. The design of the flow channel can be customized according to the shape, size and electromagnetic shielding requirements of the shielded parts, so that the electromagnetic shielding structure can flexibly adapt to different application scenarios. By pouring liquid metal into the flow channel and solidifying it to form a metal shielding layer, the manufacturing process of the traditional electromagnetic shielding structure is simplified and the manufacturing cost is reduced. The first base layer and the second base layer together constitute the main frame of the electromagnetic shielding structure, providing structural stability and support, making the electromagnetic shielding structure more sturdy and durable. Therefore, the electromagnetic shielding structure of the embodiment of the present invention has technical effects such as efficient electromagnetic shielding, flexible customization, simplified manufacturing process and improved structural stability, and is suitable for various occasions requiring electromagnetic shielding protection.

[0017] According to the method for manufacturing the electromagnetic shielding structure provided by the embodiment of the second aspect of the present invention, by accurately measuring the size of the part to be shielded and determining the structural size of the base layer according to the measurement results, the precise fit between the electromagnetic shielding structure and the part to be shielded can be ensured, and the manufacturing accuracy can be improved. Customizing the shape, size and layout of the flow channel according to the shape and size of the part to be shielded can ensure that the liquid metal can evenly and quickly fill the entire flow channel, thereby improving production efficiency. The manufacturing method is simple and clear, with clear steps, easy to operate and control, which is conducive to reducing manufacturing costs and improving production efficiency. By accurately designing and manufacturing the electromagnetic shielding structure, it can be ensured that the metal shielding layer fits tightly around or above the part to be shielded to form a continuous and closed shielding layer, thereby effectively reducing electromagnetic leakage and improving electromagnetic shielding performance. Therefore, the method for manufacturing the electromagnetic shielding structure provided by the embodiment of the second aspect of the present invention has the advantages of high manufacturing accuracy, optimized flow channel design, simplified manufacturing process and enhanced electromagnetic shielding performance. The method is suitable for scenes where electromagnetic shielding protection is required in various electronic devices, and provides reliable guarantee for the normal operation of electronic devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 is a schematic perspective view of the electromagnetic shielding structure provided by the present invention.

[0020] Figure 2 It is a schematic perspective view of an electromagnetic shielding structure provided by the present invention.

[0021] Figure 3 It is a schematic perspective view of another electromagnetic shielding structure provided by the present invention.

[0022] Figure 4 It is a schematic perspective view of another electromagnetic shielding structure provided by the present invention.

[0023] Figure 5 It is a schematic cross-sectional view of the first flow channel provided by the present invention.

[0024] Figure 6 It is a schematic cross-sectional view of the second flow channel provided by the present invention.

[0025] Figure 7 It is a schematic cross-sectional view of the third flow channel provided by the present invention.

[0026] Figure 8It is a schematic cross-sectional view of the fourth flow channel provided by the present invention.

[0027] Fig. 9 It is a schematic cross-sectional view of the fifth flow channel provided by the present invention.

[0028] Fig.10 It is a schematic flow chart of the method for manufacturing the electromagnetic shielding structure provided by the present invention.

[0029] Reference numerals: 100, first base layer; 102, second base layer; 104, flow channel; 106, accommodating cavity; 108, inlet; 110, outlet. DETAILED DESCRIPTION

[0030] The following embodiments of the present invention are described in further detail in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0031] like Figures 1 to 9 As shown, a first aspect of the present invention provides an electromagnetic shielding structure, comprising: First base layer 100; The second base layer 102 is arranged adjacent to the first base layer 100. A flow channel 104 for pouring liquid metal is formed between the second base layer 102 and the first base layer 100. The flow channel 104 is used to form a metal shielding layer. The first base layer 100, the second base layer 102 and the metal shielding layer form a receiving cavity 106 for shielding the shielded component.

[0032] According to the electromagnetic shielding structure provided by the embodiment of the first aspect of the present invention, the metal shielding layer is solidified from liquid metal, has excellent conductivity and electromagnetic shielding performance, can effectively block or weaken the interference of external electromagnetic fields, and protect the shielded parts from the influence of electromagnetic radiation. The design of the flow channel 104 can be customized according to the shape, size and electromagnetic shielding requirements of the shielded parts, so that the electromagnetic shielding structure can flexibly adapt to different application scenarios. By pouring liquid metal into the flow channel 104 and solidifying it to form a metal shielding layer, the manufacturing process of the traditional electromagnetic shielding structure is simplified and the manufacturing cost is reduced. The first base layer 100 and the second base layer 102 together constitute the main frame of the electromagnetic shielding structure, providing structural stability and support, making the electromagnetic shielding structure more sturdy and durable. Therefore, the electromagnetic shielding structure of the embodiment of the present invention has technical effects such as efficient electromagnetic shielding, flexible customization, simplified manufacturing process and improved structural stability, and is suitable for various occasions requiring electromagnetic shielding protection.

[0033] Please continue to see Figures 1 to 9 The electromagnetic shielding structure of the first embodiment of the present invention is intended to provide an efficient and flexible electromagnetic shielding solution.

[0034] As one of the basic layers of the electromagnetic shielding structure, the first base layer 100 provides structural stability and support. It can be made of any material with sufficient strength and stability, such as metal, alloy, plastic or composite material, etc. The specific material selection depends on the application environment and cost considerations.

[0035] The second base layer 102 is arranged adjacent to the first base layer 100, and the two together constitute the main framework of the electromagnetic shielding structure. Similar to the first base layer 100, the material selection of the second base layer 102 should also consider structural stability and compatibility with liquid metal. Through a specific design or manufacturing process, one or more flow channels 104 for pouring liquid metal are formed between the second base layer 102 and the first base layer 100.

[0036] The flow channel 104 is located between the first base layer 100 and the second base layer 102, and is the area where the liquid metal is poured and solidified. The design of the flow channel 104 should ensure that the liquid metal can be evenly and fully filled and form a continuous metal shielding layer after solidification. The shape, size and number of the flow channel 104 can be customized according to the shape, size and electromagnetic shielding requirements of the shielded part.

[0037] The metal shielding layer is formed by pouring liquid metal into the flow channel 104 and solidifying it. The metal shielding layer has excellent electromagnetic shielding performance and can effectively block or weaken the interference of external electromagnetic fields. The selection of liquid metal should be based on comprehensive considerations of its conductivity, fluidity, solidification speed and cost.

[0038] The accommodating cavity 106 formed by the first base layer 100, the second base layer 102 and the metal shielding layer is used to place the shielded component. The shape and size of the accommodating cavity 106 should be customized according to the shape and size of the shielded component to ensure that the shielded component can be firmly placed in the accommodating cavity 106 and fully protected by the metal shielding layer.

[0039] According to one embodiment of the present invention, the flow channel 104 is formed with an inlet 108 and an outlet 110 , and the inlet 108 and the outlet 110 are provided with sealing members.

[0040] In one embodiment of the present invention, the flow channel 104 of the electromagnetic shielding structure is designed to include an inlet 108 and an outlet 110 , and both ports are equipped with sealing members.

[0041] The flow channel 104 is a key area for liquid metal filling and solidification and is planned between the first base layer 100 and the second base layer 102. In order to ensure that the liquid metal can smoothly enter and fill the entire flow channel 104 while preventing it from overflowing or leaking, a specific inlet 108 and outlet 110 are designed.

[0042] The inlet 108 is located at one end of the flow channel 104 and is used to guide the liquid metal into the flow channel 104. Its design takes into account the fluidity and pouring speed of the liquid metal, ensuring that the metal can fill the entire flow channel 104 evenly and quickly.

[0043] The outlet 110 is located at the other end of the flow channel 104 and is used to discharge excess metal or air after the liquid metal is poured in. By precisely controlling the size and position of the outlet 110, it is further possible to ensure that the liquid metal in the flow channel 104 is evenly distributed and avoid bubbles or cavities.

[0044] Seals are installed at the inlet 108 and the outlet 110. These seals are made of highly elastic and corrosion-resistant materials, such as rubber, silicone or Teflon, to ensure that they can fit tightly around the inlet 108 and the outlet 110 to prevent the liquid metal from leaking during the pouring process.

[0045] Through the designed inlet 108 and outlet 110, the infusion speed and amount of liquid metal can be more accurately controlled, thereby improving the infusion efficiency and ensuring that the flow channel 104 is evenly and fully filled. The installation of the seal effectively prevents the leakage of liquid metal during the infusion process and ensures the integrity and stability of the electromagnetic shielding structure. Since the liquid metal in the flow channel 104 can be evenly and fully filled, the metal shielding layer formed after solidification will have a more continuous and dense microstructure, thereby improving its electromagnetic shielding effect. The seal not only prevents leakage, but also enhances the stability and durability of the electromagnetic shielding structure in complex environments through its elasticity and corrosion resistance.

[0046] According to one embodiment of the invention, the sealing member is a flexible sealing member.

[0047] In one embodiment of the present invention, the seals provided at the inlet 108 and outlet 110 of the flow channel 104 of the electromagnetic shielding structure are designed as flexible seals. This design is intended to further improve the sealing performance, ensure that the liquid metal does not leak during the pouring process, and adapt to the deformation requirements under different working environments.

[0048] Flexible seals are made of materials with high elasticity, corrosion resistance and wear resistance, such as rubber, silicone, Teflon or other synthetic polymer materials. These materials are selected based on their excellent sealing performance and compatibility with liquid metal.

[0049] The design of the flexible seals takes into account the shape, size and working environment of the inlet 108 and outlet 110 of the flow channel 104. They are precisely installed around the inlet 108 and outlet 110, and fit tightly to the edge of the port through their elasticity and plasticity to form an effective sealing barrier. In addition, the flexible seals also have a certain degree of self-adaptability, and can cope with changes in temperature, pressure and vibration in the working environment to maintain a stable sealing effect.

[0050] Due to its high elasticity and plasticity, the flexible seal can fit tightly around the inlet 108 and outlet 110 of the flow channel 104, effectively preventing the leakage of liquid metal during the infusion process. This ensures the integrity and stability of the electromagnetic shielding structure and improves the electromagnetic shielding effect. The flexible seal has a certain degree of adaptability and can cope with changes in temperature, pressure, vibration, etc. in the working environment. This enables the electromagnetic shielding structure to maintain a stable sealing effect in various complex environments and extend its service life. The flexible seal is made of corrosion-resistant and wear-resistant materials and can resist the erosion of liquid metal and other chemicals. This improves the durability of the electromagnetic shielding structure and reduces maintenance and replacement costs. The design of the flexible seal makes the installation and maintenance process easier. They can be easily installed around the inlet 108 and outlet 110 of the flow channel 104 without complicated tools and steps. At the same time, since the flexible seal has a certain degree of adaptability, it is also more convenient and quick to maintain and replace.

[0051] According to one embodiment of the present invention, the width and height of the flow channel 104 are greater than or equal to 10 micrometers.

[0052] In one embodiment of the present invention, the flow channel 104 of the electromagnetic shielding structure is designed to have specific width and height dimensions, that is, the width and height of the flow channel 104 are both greater than or equal to 10 microns. The selection of this design parameter is intended to ensure that the liquid metal can smoothly and evenly fill the entire flow channel 104 and form a continuous and dense metal shielding layer after solidification, thereby providing an effective electromagnetic shielding effect.

[0053] The width and height of the flow channel 104 have an important influence on the fluidity and filling effect of the liquid metal. When the flow channel 104 is too small, the fluidity of the liquid metal may be limited, resulting in uneven filling or defects such as bubbles and cavities. If the flow channel 104 is too large, the amount of liquid metal used and the solidification time may increase, thereby increasing the manufacturing cost.

[0054] Therefore, in this embodiment, a width and height of 10 microns or more are selected as design parameters of the flow channel 104. This size range can ensure that the liquid metal has good fluidity during the pouring process and avoid the increase in manufacturing costs caused by too large a size.

[0055] In addition, the shape and direction of the flow channel 104 are also designed accordingly to ensure that the liquid metal can evenly and quickly fill the entire flow channel 104 along the predetermined path. At the same time, the matching relationship between the flow channel 104 and the inlet 108, the outlet 110 and the seal is also considered to ensure the sealing and stability of the entire electromagnetic shielding structure.

[0056] like Figures 5 to 9 As shown, the flow channel 104 can be designed to be spiral, zigzag, mesh, a flow channel 104 structure with a large cross-sectional area or with pillars, etc.

[0057] The width and height of the flow channel 104 are greater than or equal to 10 microns, which ensures that the liquid metal has good fluidity during the infusion process, and can evenly and quickly fill the entire flow channel 104 to avoid defects such as bubbles and cavities. After the liquid metal is evenly filled and solidified in the flow channel 104, it can form a continuous and dense metal shielding layer, providing an effective electromagnetic shielding effect. The selection of this design parameter helps to improve the overall performance of the electromagnetic shielding structure. The selection of the size of the flow channel 104 avoids problems such as increased liquid metal usage and prolonged solidification time caused by excessive size, which helps to reduce manufacturing costs and improve production efficiency. The design and planning of the flow channel 104, as well as the close cooperation with the inlet 108, outlet 110 and seals, enhance the stability and reliability of the electromagnetic shielding structure, enabling it to maintain a stable shielding effect in various complex environments.

[0058] According to one embodiment of the present invention, the sum of the thickness of the first base layer 100 and the thickness of the second base layer 102 is less than 2 cm.

[0059] In one embodiment of the present invention, the thickness of the two key components of the electromagnetic shielding structure: the first base layer 100 and the second base layer 102 are strictly controlled to ensure that their total thickness is less than 2 cm. This design is intended to achieve lightweight electromagnetic shielding structure while maintaining its necessary structural strength and electromagnetic shielding performance.

[0060] As one of the basic layers of the electromagnetic shielding structure, the first base layer 100 plays an important role in supporting and protecting the internal metal shielding layer. Its material selection usually takes into account structural stability, conductivity and compatibility with liquid metal. In this embodiment, the thickness of the first base layer 100 is optimized to reduce the overall weight as much as possible while meeting the structural requirements.

[0061] The second base layer 102 is arranged adjacent to the first base layer 100, and together they form the main framework of the electromagnetic shielding structure. Similar to the first base layer 100, the material and thickness of the second base layer 102 are also selected and optimized. Its main function is to provide additional structural support and to enclose together with the first base layer 100 to form a flow channel 104 for pouring liquid metal.

[0062] In order to achieve a lightweight design, the thickness of the first base layer 100 and the second base layer 102 is strictly controlled so that their total thickness is less than 2 cm. This size limit ensures that the electromagnetic shielding structure has a small volume and weight while maintaining the necessary performance, making it easy to install and carry.

[0063] In addition, the design of the flow channel 104 also takes into account the need for lightweighting. By optimizing the shape, size and layout of the flow channel 104, the amount of liquid metal can be further reduced, thereby reducing the weight of the entire electromagnetic shielding structure.

[0064] By controlling the thickness of the first base layer 100 and the second base layer 102, and optimizing the design of the flow channel 104, the electromagnetic shielding structure is lightweight. This makes the electromagnetic shielding structure easier to install and carry, and is suitable for various mobile devices and portable electronic devices. Although the thickness is limited, the material selection and structural design of the first base layer 100 and the second base layer 102 ensure that the electromagnetic shielding structure has sufficient structural strength to withstand certain external forces and pressures. The lightweight design does not sacrifice electromagnetic shielding performance. By precisely controlling the size and layout of the flow channel 104 and selecting suitable liquid metal materials, it is ensured that the metal shielding layer has excellent electromagnetic shielding effect. The lightweight design simplifies the manufacturing process, reduces material usage and processing time, thereby improving production efficiency and reducing manufacturing costs.

[0065] According to one embodiment of the present invention, the first base layer 100 is a flexible first base layer 100; and / or, The second base layer 102 is a flexible second base layer 102 .

[0066] In one embodiment of the present invention, the base layer design of the electromagnetic shielding structure is further innovated, wherein the first base layer 100 is designed as a flexible first base layer 100, and / or the second base layer 102 is designed as a flexible second base layer 102. This design is intended to enhance the flexibility and adaptability of the electromagnetic shielding structure, so that it can better adapt to various complex shapes and dynamically changing working environments.

[0067] The introduction of flexible substrates means that the substrate material is no longer limited to traditional rigid materials, but can be made of materials with excellent flexibility and plasticity, such as polydimethylsiloxane, polymer films, rubber, silicone or other flexible synthetic materials. These flexible materials are selected based on their good mechanical properties, chemical stability and compatibility with liquid metal.

[0068] When the first base layer 100 is a flexible first base layer 100, it can be bent, stretched or compressed to a certain extent to adapt to electronic devices or components of different shapes and sizes. This flexibility not only helps to simplify the installation process, but also ensures that the electromagnetic shielding structure and the electronic device form a good fit, thereby improving the shielding effect.

[0069] Similarly, when the second base layer 102 is a flexible second base layer 102, it can also provide similar flexibility and adaptability. In addition, the flexible second base layer 102 can also be used together with the flexible first base layer 100 to form a flow channel 104 with a complex shape to meet the needs of specific application scenarios.

[0070] In practical applications, only the first base layer 100 can be designed as a flexible base layer, or the second base layer 102 can be designed as a flexible base layer, or even both can be designed as flexible base layers according to specific needs. This design flexibility enables the electromagnetic shielding structure to be more widely used in various electronic devices.

[0071] The introduction of flexible substrates enables electromagnetic shielding structures to better adapt to various complex shapes and dynamically changing working environments, improving their flexibility and adaptability. The flexible substrate can be bent, stretched or compressed to a certain extent to ensure a good fit between the electromagnetic shielding structure and the electronic equipment, thereby reducing electromagnetic leakage and improving the shielding effect. The flexibility of the flexible substrate helps to simplify the installation process of the electromagnetic shielding structure, reducing the difficulty and cost of installation. Due to the introduction of flexible substrates, electromagnetic shielding structures can be more widely used in various electronic devices, including those with complex shapes and dynamically changing working environments.

[0072] According to one embodiment of the present invention, the liquid metal includes a eutectic alloy or a single metal having a low melting point of less than 150 degrees Celsius.

[0073] In one embodiment of the present invention, the liquid metal used in the electromagnetic shielding structure is selected to be a eutectic alloy or a single metal with a low melting point, and its melting point is lower than 150 degrees Celsius. This design is intended to optimize the liquid metal infusion process, improve production efficiency, and ensure the stability and reliability of the electromagnetic shielding structure during manufacturing and use.

[0074] Eutectic alloys or elemental metals with low melting points have a series of advantages that make them ideal for use in electromagnetic shielding structures. First, a lower melting point means that a lower heating temperature is required during the infusion process, which helps reduce energy consumption and production costs. Second, liquid metals with low melting points can reach a flow state faster during infusion, thereby accelerating the process of filling the flow channel 104 and improving production efficiency. In addition, these low melting point metals generally have excellent electrical and thermal conductivity after solidification, which is critical to the performance of electromagnetic shielding structures.

[0075] In this embodiment, the eutectic alloy, as a choice of liquid metal, has a certain melting point and can keep the composition unchanged when melted. This property enables the eutectic alloy to flow evenly and stably during the infusion process, avoiding defects such as bubbles or cavities. At the same time, the eutectic alloy usually has good mechanical properties and chemical stability, which can meet the requirements of electromagnetic shielding structure for material properties.

[0076] On the other hand, elemental metals such as gallium and indium are also ideal candidates for liquid metals. These metals are liquid at room temperature and can be poured without additional heating. In addition, they have excellent electrical and thermal conductivity, as well as good chemical stability, and can maintain stable performance in various environments.

[0077] The eutectic alloy or elemental metal with a low melting point makes the infusion process simpler and more efficient, reducing energy consumption and production costs. The liquid metal can reach a flowing state at a relatively low temperature, which accelerates the process of filling the flow channel 104 and improves production efficiency. The liquid metal with a low melting point forms a continuous and dense metal shielding layer after solidification, which has excellent electrical conductivity and thermal conductivity, thereby improving the performance of the electromagnetic shielding structure. The liquid metal with a low melting point can fill the flow channel 104 more evenly during the infusion process, reducing material waste and improving material utilization. Because the liquid metal with a low melting point has excellent performance and stability, the electromagnetic shielding structure can be more widely used in various electronic devices, including those that are temperature-sensitive or require high efficiency.

[0078] According to one embodiment of the present invention, a first groove is formed on a side of the first base layer 100 opposite to the second base layer 102, and a second groove is formed on a side of the second base layer 102 opposite to the first base layer 100, and the first groove and the second groove are arranged to form a flow channel 104; Alternatively, a first groove is formed on a side of the first base layer 100 opposite to the second base layer 102 , and the first groove and the second base layer 102 are surrounded to form a flow channel 104 ; Alternatively, a second groove is formed on a side of the second base layer 102 opposite to the first base layer 100 , and the second groove and the first base layer 100 are surrounded to form the flow channel 104 .

[0079] In one embodiment of the present invention, the base layer design of the electromagnetic shielding structure is further optimized to form a flow channel 104 for pouring liquid metal.

[0080] According to this embodiment, the flow channel 104 can be formed in various ways: The first groove and the second groove are arranged to form a flow channel 104: In this case, a first groove and a second groove are formed on the opposite side of the first base layer 100 and the second base layer 102. The two grooves correspond to each other in relative position, and when the first base layer 100 and the second base layer 102 are tightly combined, they are jointly surrounded to form a closed flow channel 104. Liquid metal can be poured into the flow channel 104 through a preset inlet 108, and form a continuous metal shielding layer after solidification.

[0081] The first groove and the second base layer 102 are arranged to form a flow channel 104: In this design, the first groove is formed only on one side of the first substrate 100, and the second substrate 102 serves as another part of the flow channel 104. The second substrate 102 itself may be a flat surface or a slightly concave-convex surface, but it is tightly combined with the edge of the first groove to form the flow channel 104. This design simplifies the manufacturing process of the second substrate 102 while still ensuring effective infusion and solidification of the liquid metal.

[0082] The second groove and the first base layer 100 are arranged to form a flow channel 104: Similar to the second design, this time a second groove is formed on one side of the second substrate 102, and the first substrate 100 serves as another part of the flow channel 104. This design also simplifies the manufacturing process of one of the substrates while maintaining the integrity of the flow channel 104 and the effective infusion of the liquid metal.

[0083] In these designs, the shape, size and layout of the first groove and the second groove can be customized according to specific needs. They can be straight, curved, rectangular, circular or any other shape to accommodate electronic devices or components of different shapes and sizes. In addition, the width, height and length of the flow channel 104 can also be adjusted as needed to ensure that the liquid metal can evenly and quickly fill the entire flow channel 104.

[0084] The various ways of forming the flow channel 104 make the manufacturing process of the electromagnetic shielding structure more flexible and diverse, and the most suitable design scheme can be selected according to specific needs. By accurately designing the shape, size and layout of the first groove and the second groove, it can be ensured that the liquid metal can evenly and quickly fill the entire flow channel 104 during the pouring process, avoiding defects such as bubbles and cavities. The precise design of the flow channel 104 and the effective pouring of the liquid metal enable the metal shielding layer to fit tightly to the surface of the electronic device or component, thereby reducing electromagnetic leakage and improving the shielding effect. In some designs, by simplifying the manufacturing process of one of the base layers (such as forming a groove only on one side), the production cost can be reduced and the production efficiency can be improved.

[0085] According to one embodiment of the present invention, the enclosed area of ​​the metal shielding layer is greater than or equal to the component to be shielded.

[0086] In one embodiment of the present invention, the design of the electromagnetic shielding structure is further optimized to ensure that the enclosed area of ​​the metal shielding layer is greater than or equal to the area of ​​the shielded component. This design principle is intended to achieve comprehensive and effective electromagnetic shielding protection for the shielded component (such as sensitive components or circuit boards in electronic equipment).

[0087] Specifically, the metal shielding layer is formed by solidifying liquid metal in the flow channel 104, and it is closely attached to the periphery or the top of the shielding part to form a continuous and closed shielding layer. In order to ensure the electromagnetic shielding effect, the enclosed area of ​​the metal shielding layer must be large enough to completely cover the shielding part, and a certain edge extension may be required to enhance the continuity and integrity of the shielding layer.

[0088] In practical applications, the size and shape of the shielding part can be accurately measured, and then the layout and size of the flow channel 104 can be designed according to these sizes and shapes. It is ensured that the metal shielding layer formed by the flow channel 104 after curing can completely cover the shielding part, and it may be necessary to increase a certain shielding layer width around the edge of the shielding part to improve the shielding effect.

[0089] In addition, the thickness of the metal shielding layer is also an important factor affecting the shielding effect. In this embodiment, the thickness of the metal shielding layer can be controlled by adjusting the amount of liquid metal injected and the size of the flow channel 104. A thicker shielding layer generally has a better shielding effect, but it also increases the overall weight and cost. Therefore, it is necessary to determine the optimal thickness of the shielding layer while ensuring the shielding effect, taking into account factors such as weight, cost, and manufacturing process.

[0090] The enclosed area of ​​the metal shielding layer is greater than or equal to the shielded part, ensuring comprehensive and effective electromagnetic shielding protection for the shielded part and reducing the risk of electromagnetic leakage. By increasing the width of the shielding layer around the edge of the shielded part, the continuity and integrity of the shielding layer are enhanced, further improving the shielding effect. By accurately measuring the size and shape of the shielded part and designing the layout and size of the flow channel 104 based on these sizes and shapes, the manufacturing accuracy and adaptability of the electromagnetic shielding structure are improved. Taking into account factors such as weight, cost and manufacturing process, the thickness of the metal shielding layer is controlled by adjusting the infusion amount of liquid metal and the size of the flow channel 104, achieving a balance between shielding effect and manufacturing cost.

[0091] like Fig.10 As shown, a second aspect of the present invention provides a method for manufacturing the electromagnetic shielding structure as described above, comprising: Step 10, determining the structural dimensions of the first base layer 100 and the second base layer 102 based on the dimensions of the component to be shielded; Step 20, using the first base layer 100 and the second base layer 102 to enclose and form a flow channel 104; Step 30 , pouring liquid metal into the flow channel 104 .

[0092] According to the method for manufacturing the electromagnetic shielding structure provided by the embodiment of the second aspect of the present invention, by accurately measuring the size of the part to be shielded and determining the structural size of the base layer according to the measurement results, the precise fit between the electromagnetic shielding structure and the part to be shielded can be ensured, and the manufacturing accuracy can be improved. The shape, size and layout of the flow channel 104 can be customized according to the shape and size of the part to be shielded, so as to ensure that the liquid metal can evenly and quickly fill the entire flow channel 104, thereby improving production efficiency. The manufacturing method is simple and clear, with clear steps, easy to operate and control, which is conducive to reducing manufacturing costs and improving production efficiency. By accurately designing and manufacturing the electromagnetic shielding structure, it can be ensured that the metal shielding layer is tightly fitted around or above the part to be shielded to form a continuous and closed shielding layer, thereby effectively reducing electromagnetic leakage and improving electromagnetic shielding performance. Therefore, the method for manufacturing the electromagnetic shielding structure provided by the embodiment of the second aspect of the present invention has the advantages of high manufacturing accuracy, optimized design of the flow channel 104, simplified manufacturing process and enhanced electromagnetic shielding performance. The method is suitable for scenes requiring electromagnetic shielding protection in various electronic devices, and provides reliable guarantee for the normal operation of electronic devices.

[0093] Please continue to see Fig.10 The second aspect of the present invention provides a method for manufacturing an electromagnetic shielding structure. The method is based on the electromagnetic shielding structure design described above and aims to efficiently manufacture a shielding structure with excellent electromagnetic shielding performance through a series of steps.

[0094] Step 10: Determine the structural dimensions of the first base layer 100 and the second base layer 102 based on the dimensions of the shielded component In this step, it is first necessary to accurately measure the dimensions of the shielded component (such as sensitive components in electronic equipment, circuit boards, etc.). Based on the measurement results and the design requirements of the electromagnetic shielding structure (such as the thickness of the shielding layer, the enclosed area, etc.), the structural dimensions of the first base layer 100 and the second base layer 102 are determined. This includes the length, width, thickness of the base layer, and possible groove size and layout.

[0095] Step 20: Use the first base layer 100 and the second base layer 102 to surround and form a flow channel 104 In this step, the first base layer 100 and the second base layer 102 are precisely aligned and fixed according to the base structure size determined in step 10. Then, the first groove on the first base layer 100 and the second groove on the second base layer 102 (or only the groove on one layer is used to surround the other base layer) are used to form a closed flow channel 104. The shape, size and layout of the flow channel 104 should be customized according to the shape and size of the shielding part to ensure that the liquid metal can evenly and quickly fill the entire flow channel 104.

[0096] Step 30: Pour liquid metal into the flow channel 104 In this step, a suitable liquid metal (such as a eutectic alloy or a single metal with a low melting point) is selected and poured into the flow channel 104 through the preset inlet 108. During the pouring process, the flow rate and the pouring amount of the liquid metal need to be controlled to ensure that it can fill the entire flow channel 104 evenly and without bubbles. After the pouring is completed, wait for the liquid metal to cool and solidify to form a continuous metal shielding layer.

[0097] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. An electromagnetic shielding structure, characterized in that: include: First base layer (100); The second base layer (102) is arranged adjacent to the first base layer (100), and a flow channel (104) for pouring liquid metal is formed between the second base layer (102) and the first base layer (100), and the flow channel (104) is used to form a metal shielding layer. The first base layer (100), the second base layer (102) and the metal shielding layer are arranged to form a receiving cavity (106) for shielding a component to be shielded.

2. The electromagnetic shielding structure according to claim 1, characterized in that: The flow channel (104) is formed with an inlet (108) and an outlet (110), and the inlet (108) and the outlet (110) are provided with sealing members.

3. The electromagnetic shielding structure according to claim 2, characterized in that: The sealing element is a flexible sealing element.

4. The electromagnetic shielding structure according to claim 1, characterized in that: The width and height of the flow channel (104) are greater than or equal to 10 microns.

5. The electromagnetic shielding structure according to claim 1, characterized in that: The sum of the thickness of the first base layer (100) and the thickness of the second base layer (102) is less than 2 centimeters.

6. The electromagnetic shielding structure according to claim 1, characterized in that: The first base layer (100) is a flexible first base layer (100); and / or, The second base layer (102) is a flexible second base layer (102).

7. The electromagnetic shielding structure according to claim 1, characterized in that: The liquid metal includes a eutectic alloy or a single metal with a low melting point of less than 150 degrees Celsius.

8. The electromagnetic shielding structure according to any one of claims 1 to 7, characterized in that: A first groove is formed on a side of the first base layer (100) opposite to the second base layer (102), and a second groove is formed on a side of the second base layer (102) opposite to the first base layer (100), the first groove and the second groove surrounding each other to form the flow channel (104); Alternatively, a first groove is formed on a side of the first base layer (100) opposite to the second base layer (102), and the first groove and the second base layer (102) are surrounded to form the flow channel (104); Alternatively, a second groove is formed on a side of the second base layer (102) opposite to the first base layer (100), and the second groove and the first base layer (100) are arranged to form the flow channel (104).

9. The electromagnetic shielding structure according to any one of claims 1 to 7, characterized in that: The enclosed area of ​​the metal shielding layer is greater than or equal to the component to be shielded.

10. A method for manufacturing an electromagnetic shielding structure according to any one of claims 1 to 9, characterized in that: include: Based on the size of the component to be shielded, determining the structural dimensions of the first base layer (100) and the second base layer (102); The flow channel (104) is formed by enclosing the first base layer (100) and the second base layer (102); Liquid metal is poured into the flow channel (104).

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