Electronic device and method for manufacturing electronic device

Abstract

An electronic device according to an embodiment of the present invention comprises: a display panel including a display area and a non-display area surrounding at least a part of the display area; and a protective layer disposed below the display panel, the protective layer including: a first protective portion overlapping the display area and having a first density; and a second protection portion overlapping the non-display area and having a second density, the first density being higher than the second density.

Description

Technical Field

[0001] The present invention relates to an electronic device and a method for manufacturing the electronic device, and more particularly, to an electronic device with improved reliability and a method for manufacturing the electronic device. Background Art

[0002] Electronic devices such as smartphones, digital cameras, notebook computers, navigation systems, and smart TVs provide images to users through display screens.

[0003] An electronic device may include a display panel that provides image information and a protective layer for protecting the display panel from external influences. The protective layer prevents deformation of the display panel caused by external impact and effectively releases heat generated in the display panel, thereby protecting the display panel from external influences. In order to impart various functions for protecting the display panel, the protective layer is applying a structure in which multiple functional layers are stacked.

[0004] On the other hand, research is being conducted on an electronic device to which a single protective layer integrally having various functions for protecting a display panel and a method for manufacturing the same is applicable. Summary of the invention

[0005] An object of the present invention is to provide an electronic device with improved reliability and a method for manufacturing the electronic device.

[0006] According to one embodiment of the present invention, an electronic device includes: a display panel, including a display area and a non-display area surrounding at least a portion of the display area; and a protective layer, arranged below the display panel, the protective layer including: a first protective portion, overlapping with the display area and having a first density; and a second protective portion, overlapping with the non-display area and having a second density, the first density being higher than the second density.

[0007] It may be that the first protection portion and the second protection portion have different thermal conductivities.

[0008] The thermal conductivity of the first protection portion may be greater than or equal to 70 W / mK and less than or equal to 200 W / mK.

[0009] It may be that the first protection portion includes a first base resin and a first filler dispersed in the first base resin, and the second protection portion includes a second base resin and a second filler dispersed in the second base resin.

[0010] It may be that a weight ratio of the first filler with respect to the total weight of the first protecting portion is higher than a weight ratio of the second filler with respect to the total weight of the second protecting portion.

[0011] The substance included in each of the first base resin and the second base resin may be the same as each other, and the substance included in each of the first filler and the second filler may be the same as each other.

[0012] The first filler and the second filler may each have an average diameter of 5 μm or more and 100 μm or less.

[0013] The protection layer may be disposed directly below the display panel.

[0014] The thickness of the first protection portion and the thickness of the second protection portion may be respectively not less than 50 μm and not more than 300 μm.

[0015] It may be that the thickness of the first protection portion and the thickness of the second protection portion are the same.

[0016] It may be that a method for manufacturing an electronic device according to an embodiment of the present invention includes: a step of preparing a display panel including a display area and a non-display area surrounding the display area, and a mask arranged on a first bottom surface of the display panel; a step of configuring ink on the first bottom surface; a step of pressing the ink with a first scraper and applying it on the first bottom surface in a manner overlapping with the display area and the non-display area to form an ink layer; a step of configuring a mold at a distance in one direction with the first bottom surface as a reference in a manner overlapping with the display area; a step of pressing the ink layer with the mold in a direction opposite to the one direction to form a preliminary protective layer; and a step of pressing and flattening the upper surface of the preliminary protective layer overlapping with the display area and the non-display area with a second scraper to form a protective layer.

[0017] The ink layer may include a first ink portion overlapping the display area and a second ink portion overlapping the non-display area, and a density of the first ink portion is substantially the same as a density of the second ink portion.

[0018] The preliminary protection layer may include a first preliminary protection portion overlapping the display area and a second preliminary protection portion overlapping the non-display area, and a thickness of the first preliminary protection portion is thinner than a thickness of the second preliminary protection portion.

[0019] It may be that the protection layer includes a first protection portion overlapping the display area and a second protection portion overlapping the non-display area, and a first density of the first protection portion is higher than a second density of the second protection portion.

[0020] It may be that in the step of applying the ink under pressure with a first scraper to the first bottom, the first scraper moves in a first direction, and a first length of the first scraper in a second direction intersecting the first direction on a plane is longer than a second length of the second scraper in the second direction.

[0021] It may be that the first length is longer than a third length of the display panel in the second direction, and the second length is the same as the third length.

[0022] The ink may be in contact with at least a portion of an upper surface of the mask.

[0023] The ink may include a curable resin, and the step of forming the preliminary protective layer may include the step of thermally curing the curable resin included in the ink.

[0024] The preliminary protective layer may include a first preliminary protective portion overlapping the display area and a second preliminary protective portion overlapping the non-display area, and the step of forming the preliminary protective layer includes the step of thermally curing the first preliminary protective portion.

[0025] It may be that, in the step of forming the preliminary protective layer, one side of the stamp contacts one side of the ink layer, and the temperature of the one side of the stamp is 100° C. or higher.

[0026] According to one embodiment of the present invention, by configuring a protective layer under a display panel in an electronic device so that the density of each overlapping portion with a display area and a non-display area is different, the flatness of the protective layer can be improved while effectively releasing the heat generated in the display panel, thereby improving the reliability of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 is a three-dimensional diagram of an electronic device according to an embodiment of the present invention.

[0028] Figure 2 is an exploded perspective view of an electronic device according to an embodiment of the present invention.

[0029] Figure 3 FIG. 1 is a cross-sectional view showing a partial structure of an electronic device according to an embodiment of the present invention.

[0030] Figure 4 is a cross-sectional view of a display panel according to an embodiment.

[0031] Figure 5 is a cross-sectional view of a portion of a display module according to an embodiment of the present invention.

[0032] Figure 6is an enlarged cross-sectional view of a portion of a display module according to an embodiment of the present invention.

[0033] Figure 7 is a flow chart illustrating a method of manufacturing an electronic device according to an embodiment of the present invention.

[0034] Figure 8a , Figure 8c , Figure 8d , Figure 8e as well as Figure 8g 1 is a cross-sectional view showing a part of steps in a method for manufacturing an electronic device according to an embodiment of the present invention.

[0035] Figure 8b as well as Figure 8f FIG. 1 is a plan view showing a part of steps in a method for manufacturing an electronic device according to an embodiment of the present invention.

[0036] (Explanation of Reference Numerals)

[0037] DD: electronic device DP: display panel

[0038] PL: Protective layer

[0039] PL1: First protection part PL2: Second protection part

[0040] BS: Base resin MP: Filler DETAILED DESCRIPTION

[0041] In this specification, when it is mentioned that a certain constituent element (or region, layer, part, etc.) is "on" another constituent element, "connected to" or "combined to" another constituent element, it means that the certain constituent element can be directly configured / connected / combined on another constituent element, or a third constituent element can be configured between them.

[0042] On the other hand, in the present application, "directly configured" may mean that there is no additional layer, film, region, plate, etc. between a layer, film, region, plate, etc. and other parts. For example, "directly configured" may mean configured between two layers or two parts without using an additional part such as an adhesive part.

[0043] The same reference numerals refer to the same components. In addition, in the drawings, the thickness, proportion and size of the components are exaggerated for the effective description of the technical content. "And / or" includes all combinations that can be defined by the relevant components.

[0044] The terms "first", "second" and the like may be used to describe a variety of constituent elements, but the above constituent elements are not limited by the above terms. The above terms are only used for the purpose of distinguishing one constituent element from another constituent element. For example, without departing from the scope of the present invention, the first constituent element may be named as the second constituent element, and similarly, the second constituent element may be named as the first constituent element. As long as it is not clearly indicated as different in the context, a singular expression includes a plural expression.

[0045] In addition, terms such as “below”, “lower side”, “above”, and “upper side” are used to explain the relationship between components shown in the drawings. The above terms are relative concepts and are explained based on the directions shown in the drawings.

[0046] The terms "including" or "having" should be understood as being used to specify the existence of the features, numbers, steps, tasks, constituent elements, parts or their combinations recorded in the specification, and do not preclude the existence or additional possibilities of one or more other features or numbers, steps, tasks, constituent elements, parts or their combinations.

[0047] Unless otherwise defined, all terms (including technical terms and scientific terms) used in this specification have the same meanings as those generally understood by persons skilled in the art to which the present invention belongs. In addition, terms such as those defined in commonly used dictionaries should be interpreted as having the same meanings as those in the context of the relevant technology, and should not be interpreted as overly idealized or overly formalized meanings unless explicitly defined herein.

[0048] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

[0049] Figure 1 is a perspective view of an electronic device DD according to an embodiment of the present invention. Figure 2 is an exploded perspective view of an electronic device DD according to an embodiment of the present invention.

[0050] The electronic device DD of an embodiment may be a device activated by an electrical signal. For example, the electronic device DD may be a portable phone, a tablet, a car navigation system, a game console, or a wearable device, but is not limited thereto. Figure 1 exemplarily shows that the electronic device DD is a portable phone.

[0051] The electronic device DD may display an image IM through the active area AA-DD. The active area AA-DD may include a plane defined by the first direction DR1 and the second direction DR2. The active area AA-DD may further include a curved surface bent from at least one side of the plane defined by the first direction DR1 and the second direction DR2. Figure 1The electronic device DD of the embodiment shown in the figure is shown to include two curved surfaces respectively bent from two side surfaces of a plane defined by the first direction DR1 and the second direction DR2. However, the shape of the active area AA-DD is not limited thereto. For example, the active area AA-DD may also include only the plane, or the active area AA-DD may also include four curved surfaces respectively bent from at least two, for example, four side surfaces of the plane.

[0052] On the other hand, Figure 1 The first direction to the third direction DR1, DR2, and DR3 are shown in the following drawings. Each direction indicated by the first direction DR1, the second direction DR2, and the third direction DR3 described in this specification is a relative concept and can be converted into other directions.

[0053] In the present specification, the first direction DR1 and the second direction DR2 may be orthogonal to each other, and the third direction DR3 may be a normal direction to a plane defined by the first direction DR1 and the second direction DR2. On the other hand, in the present specification, the meaning of "on a plane" may mean that when observed on the plane defined by the first direction DR1 and the second direction DR2, the thickness direction may mean a normal direction to the plane defined by the first direction DR1 and the second direction DR2, that is, the third direction DR3.

[0054] The electronic device DD may include an active area AA-DD and a peripheral area NAA-DD adjacent to the active area AA-DD. The active area AA-DD may correspond to a display area AA of a display panel DP described later, and the peripheral area NAA-DD is a portion corresponding to a non-display area NAA of the display panel DP.

[0055] The peripheral area NAA-DD, as an area for blocking optical signals, may be an area disposed outside the active area AA-DD and surrounding the active area AA-DD. In one embodiment, the peripheral area NAA-DD may be disposed on the side of the electronic device DD, rather than the front. In one embodiment, the peripheral area NAA-DD may be omitted.

[0056] An electronic device DD according to an embodiment includes a window WM, an upper member UM, a display module DM and a housing HU.

[0057] The electronic device DD of an embodiment may include a window WM configured on the display panel DP. The window WM provides the outside of the electronic device DD. The window WM may cover the front of the display panel DP and protect the display panel DP from external impact and scratches. The window WM may be combined with the upper part UM through an adhesive layer.

[0058] The window WM may include an optically transparent insulating material. For example, the window WM may include a glass film or a synthetic resin film as a base film. The window WM may have a single-layer or multi-layer structure. For example, the window WM may include a plurality of plastic films bonded with an adhesive or include a glass film and a plastic film bonded with an adhesive. The window WM may also include a functional layer such as an anti-fingerprint layer, a phase control layer, and a hard coating layer configured on a transparent film.

[0059] In an electronic device DD of an embodiment, the upper part UM may be arranged below the window WM and above the display module DM. The upper part UM may include an anti-reflection layer and an input sensing sensor. The anti-reflection layer reduces the reflectivity of external light. The input sensing sensor senses the external input of the user. The upper part UM may also include an adhesive layer combining the anti-reflection layer and the input sensing sensor.

[0060] In an electronic device DD of an embodiment, the display module DM may be disposed under the upper member UM. The display module DM may include a display panel DP and a protection layer PL. Alternatively, the display panel DP may be disposed under the upper member UM, and the protection layer PL may be disposed under the display panel DP.

[0061] The display panel DP may include a display area AA displaying an image IM and a non-display area NAA adjacent to the display area AA. That is, the front side of the display panel DP may include the display area AA and the non-display area NAA. The display area AA may be an area generating an image IM displayed in an active area AA-DD of the electronic device DD according to activation of an electrical signal.

[0062] The non-display area NAA may be adjacent to the display area AA. The non-display area NAA may surround the display area AA. A driving circuit or driving wiring for driving the display area AA, various signal lines or pads or electronic components for providing electrical signals to the display area AA, etc. may be configured in the non-display area NAA.

[0063] The display panel DP may include a light emitting element layer DP-ED including organic light emitting elements, quantum dot light emitting elements, micro LED light emitting elements, nano LED light emitting elements, etc. (see Figure 4 ). Light emitting element layer DP-ED (refer to Figure 4 ) can be a composition that essentially generates an image.

[0064] The protective layer PL may be disposed under the display panel DP. The protective layer PL may be a component that supports the display panel DP, absorbs impact applied to the display panel DP, and performs a heat dissipation function to release heat generated in an electronic module (not shown) such as a sensor or a camera disposed under the display panel DP. The protective layer PL includes a first protective portion PL1 and a second protective portion PL2. A detailed description of the protective layer PL is given in Figure 5 Then narrate.

[0065] Although not shown, the electronic device DD may include a flexible circuit substrate electrically connected to the display panel DP and a main circuit substrate connected thereto. The flexible circuit substrate may be configured on the non-display area NAA of the display panel DP and combined with the display panel DP. The flexible circuit substrate may be connected to the main circuit substrate. A portion of the non-display area NAA of the display panel DP adjacent to the flexible circuit substrate may be provided as a bending area. The bending area may be bent with a bending axis parallel to the first direction DR1 as the center. By bending the bending area, the flexible circuit substrate may overlap with a portion of the display panel DP on a plane.

[0066] The electronic device DD of one embodiment may include a housing HU disposed under the display panel DP. The housing HU may contain an electronic module (not shown) and the display panel DP, etc. In the electronic device DD according to one embodiment, the window WM and the housing HU may be combined to form the appearance of the electronic device DD.

[0067] Figure 3 1 is a cross-sectional view showing a partial structure of an electronic device DD according to an embodiment of the present invention.

[0068] Reference Figure 3 According to an embodiment of the present invention, the electronic device DD may include a window WM, an upper part UM, a display panel DP and a protective layer PL. The electronic device DD may include a front surface and a back surface, the front surface of the electronic device DD is defined in the window WM, and the back surface of the electronic device DD is defined in the protective layer PL.

[0069] In one embodiment, the window WM may be a front surface covering the display panel DP. The window WM may include a base substrate WM-BS and a frame pattern WM-BZ. The base substrate WM-BS includes a transparent base layer such as a glass substrate or a transparent film. The frame pattern WM-BZ may have a multilayer structure. The multilayer structure may include a colored color layer and a black light shielding layer. The colored color layer and the black light shielding layer may be formed by evaporation, printing, and coating processes. The frame pattern WM-BZ may also be omitted from the window WM and formed on the upper part UM instead of the base substrate WM-BS.

[0070] In one embodiment, the upper component UM includes an anti-reflection layer UM-1 and an input sensor UM-2. Figure 3 As shown, the window WM and the anti-reflection layer UM-1 can be combined by the first adhesive layer AP1, and the input sensor UM-2 can be combined by the second adhesive layer AP2. On the other hand, at least one of the first adhesive layer AP1 and the second adhesive layer AP2 can be omitted. For example, the second adhesive layer AP2 can be omitted, and the anti-reflection layer UM-1 can be directly configured on the input sensor UM-2.

[0071] The anti-reflection layer UM-1 may reduce the external light reflectivity. The anti-reflection layer UM-1 may include a phase retarder and / or a polarizer. The anti-reflection layer UM-1 may include a polarizing film or a color filter. The color filter may have a predetermined array. The color filter may determine the array in consideration of the luminous color of the pixels included in the display panel DP. The anti-reflection layer UM-1 may also include a segmentation layer adjacent to the color filter.

[0072] The input sensor UM-2 may include a plurality of sensing electrodes (not shown) for sensing external input, traces (not shown) connected to the plurality of sensing electrodes, and an inorganic layer and / or an organic layer for insulating / protecting the plurality of sensing electrodes or traces. The input sensor UM-2 may be a capacitive sensor, but is not particularly limited.

[0073] The input sensor UM-2 can be directly formed on the thin film encapsulation layer through a continuous process when manufacturing the display panel DP. However, it is not limited thereto, and the input sensor UM-2 can also be manufactured from a panel independent of the display panel DP and attached to the display panel DP through an adhesive layer.

[0074] The protective layer PL may be disposed under the display panel DP. The protective layer PL may be a component that supports the display panel DP and performs a heat dissipation function of releasing heat generated in the display panel DP. A detailed description of the protective layer PL is given in Figure 5 Then narrate.

[0075] Figure 4 is a cross-sectional view of a display panel DP according to an embodiment.

[0076] In one embodiment, the display panel DP includes a base layer BL, a circuit layer DP-CL disposed on the base layer BL, a light emitting device layer DP-ED, and an encapsulation layer ENL.

[0077] The base layer BL may include a plastic substrate, a glass substrate, a metal substrate, or an organic / inorganic composite material substrate. For example, the base layer BL may include at least one polyimide layer. Figure 3) may be disposed below the base layer BL.

[0078] The circuit layer DP-CL includes at least one insulating layer, a semiconductor pattern and a conductive pattern. The insulating layer includes at least one inorganic layer and at least one organic layer. The semiconductor pattern and the conductive pattern can constitute a signal line, a pixel driving circuit and a scanning driving circuit. In addition, the circuit layer DP-CL can include a back metal layer.

[0079] The light emitting element layer DP-ED includes a display element, such as a light emitting element. For example, the light emitting element may be an organic light emitting element, a quantum dot light emitting element, a micro LED light emitting element or a nano LED light emitting element. The light emitting element layer DP-ED may also include an organic layer such as a pixel defining film.

[0080] The light emitting element layer DP-ED may be disposed in the display area AA. The non-display area NAA is disposed at the periphery of the display area AA and surrounds the display area AA, and no light emitting element may be disposed in the non-display area NAA.

[0081] The encapsulation layer ENL may be disposed on the light emitting element layer DP-ED to cover the light emitting element layer DP-ED. The encapsulation layer ENL may be disposed on the circuit layer DP-CL in a manner of sealing the light emitting element layer DP-ED. The encapsulation layer ENL may also be a thin film encapsulation layer including a plurality of organic thin films and inorganic thin films. The encapsulation layer ENL may also include a thin film encapsulation layer having a stacked structure of an inorganic layer / organic layer / inorganic layer. The stacked structure of the encapsulation layer ENL is not particularly limited.

[0082] Figure 5 FIG. 1 is a cross-sectional view of a portion of a display module DM according to an embodiment of the present invention. Figure 5 Shown in Figure 2 The cross section shown corresponds to the II' cutting line. Figure 6 is an enlarged cross-sectional view of a portion of a display module DM according to an embodiment of the present invention. Figure 6 It is enlarged to show Figure 5 A cross-sectional view of the WW' region is shown. Figure 6 is a cross-sectional view showing in detail the protection layer PL according to an embodiment of the present invention.

[0083] Reference Figure 5 as well as Figure 6 According to an embodiment of the present invention, a display module DM may include a display panel DP and a protection layer PL.

[0084] The protective layer PL is arranged under the display panel DP. The protective layer PL may be arranged directly under the display panel DP. The protective layer PL may be in contact with the lower surface DP-LF of the display panel DP. No separate adhesive component may be arranged between the protective layer PL and the display panel DP. In one embodiment, a protective layer PL in the form of a single layer may be provided in the DP-LF under the display panel DP. The protective layer PL may be a component that supports the display panel DP, absorbs impact applied to the display panel DP, and performs a heat dissipation function to release heat generated in a structure such as an electronic module (not shown) arranged under the display panel DP. The electronic device DD according to one embodiment can reduce the thickness of the electronic device DD and simplify the components because the protective layer PL in the form of a single layer simultaneously performs impact absorption and heat dissipation functions, and when manufacturing the electronic device DD according to one embodiment, the efficiency can be improved in the process.

[0085] The protective layer PL may include a base resin BS. The base resin BS may include at least one of acrylic resin, urethane resin, fluorine resin, epoxy resin, polyester fiber resin, polyamide resin, and silicon resin. The base resin BS may include a curable resin. For example, the base resin BS may include a thermosetting resin or a photocurable resin.

[0086] The protective layer PL includes a filler MP. The protective layer PL may include a plurality of fillers MP dispersed in a base resin BS. Since the filler MP is included in the protective layer PL, the protective layer PL may perform multiple functions in an electronic device of one embodiment. In one embodiment, the filler MP may include a shielding substance BP, a heat dissipation substance HCP, and a supporting substance PR. The filler MP may be used by mixing two or more of different types or sizes. Since the filler MP includes the shielding substance BP, the protective layer PL may have electromagnetic wave shielding properties. Since the filler MP includes the heat dissipation substance HCP, the protective layer PL may perform a heat dissipation function of releasing heat generated in the display panel DP, etc. The heat dissipation substance HCP may include, for example, at least any one of a thermally conductive metal, a carbon-based heat dissipation substance, and a thermally conductive polymer. Since the filler MP includes the supporting substance PR, the property of the protective layer PL of protecting the display panel DP, etc. from physical impacts applied from outside the display panel DP may be improved.

[0087] exist Figure 6 FIG. 4 shows that the filler MP includes a shielding material BP, a heat dissipation material HCP, and a support material PR, but is not limited thereto. The filler MP may be selected according to the material included in the protective layer PL, the thickness of the protective layer PL, the material included in the electronic device DD (see FIG. 4 ). Figure 3 ) in the components, etc., the protective layer PL can also be in the electronic device DD (refer to Figure 3) further performs other functions. For example, the filler MP may also include a light shielding material, and the protection layer PL further performs a light shielding function of blocking the light emitted from the display panel DP.

[0088] The average diameter of the filler MP may be greater than or equal to 5 μm and less than or equal to 300 μm. For example, the average diameter of each of the shielding material BP, the heat dissipation material HCP, and the supporting material PR may be greater than or equal to 5 μm and less than or equal to 300 μm. The filler MP may have a polydisperse distribution obtained by mixing a plurality of particles having a substantially monodisperse size distribution or a monodisperse distribution. When the average diameter of the filler MP is less than 5 μm, it may be difficult to achieve the shielding, heat dissipation, or supporting properties of the protective layer PL, and when the average diameter of the filler MP exceeds 300 μm, the dispersion properties of the filler MP in the protective layer PL may be reduced and it may be difficult to ensure uniform thin film properties. Figure 6 The average diameter and cross-sectional shape of each of the shielding material BP, the heat dissipation material HCP, and the support material PR are arbitrarily shown in FIG. 1 , but the average diameter and cross-sectional shape of each of the plurality of fillers MP are not limited to Figure 6 As shown, it can have various values ​​or be implemented in various shapes as needed.

[0089] The filler MP may include 90 wt % or less based on the total weight of the protective layer PL. For example, the filler MP may include 50 wt % or more and 90 wt % or less based on the total weight of the protective layer PL. When the content of the filler MP is less than 50 wt %, the heat dissipation characteristics of the protective layer PL may be reduced. In addition, when the content of the filler MP exceeds 90 wt %, the impact absorption characteristics of the protective layer PL may be excessively reduced and the impact absorption characteristics of the protective layer PL as a whole may be reduced, thereby causing a defect in that the display panel DP is damaged due to an external impact.

[0090] The protective layer PL includes a first protective portion PL1 and a second protective portion PL2. The first protective portion PL1 may correspond to the display area AA of the display panel DP. The second protective portion PL2 may correspond to the non-display area NAA of the display panel DP. The first protective portion PL1 may overlap with the display area AA on a plane. The first protective portion PL1 may be configured on the lower side DP-LF of the display panel DP in a manner overlapping with the display area AA. The second protective portion PL2 may overlap with the non-display area NAA on a plane. The second protective portion PL2 may be configured on the lower side DP-LF of the display panel DP in a manner overlapping with the non-display area NAA.

[0091] The first protection part PL1 may include a first base resin BS1 and a first filler MP1, and the second protection part PL2 may include a second base resin BS2 and a second filler MP2. The first base resin BS1 and the second base resin BS2 may each be applicable to the description of the base resin BS, and the first filler MP1 and the second filler MP2 may each be applicable to the description of the filler MP. In an embodiment, the first base resin BS1 and the second base resin BS2 may each include the same substance, and the first filler MP1 and the second filler MP2 may each include the same substance.

[0092] The first protecting portion PL1 has a first density, and the second protecting portion PL2 has a second density having a value lower than the first density. That is, the first density of the first protecting portion PL1 is greater than the second density of the second protecting portion PL2. The weight ratio of the first filler MP1 based on the total weight of the first protecting portion PL1 may be relatively greater than the weight ratio of the second filler MP2 based on the total weight of the second protecting portion PL2. The concentration of the first filler MP1 in the first protecting portion PL1 may be greater than the concentration of the second filler MP2 in the second protecting portion PL2.

[0093] The thickness of the first protection portion PL1 may be substantially the same as the thickness of the second protection portion PL2. The thickness of each of the first protection portion PL1 and the second protection portion PL2 may be greater than 50 μm and less than 300 μm. For example, the thickness of the first protection portion PL1 and the second protection portion PL2 may be greater than 100 μm and less than 200 μm, respectively. On the other hand, in this specification, "substantially the same" includes not only the case where the thickness of the structure is physically exactly the same, but also includes the case where there is a difference in the degree of error range caused by the process despite the same design.

[0094] The thermal conductivity of the first protection portion PL1 may be greater than the thermal conductivity of the second protection portion PL2. In one embodiment, the heat generated in the display area AA of the display panel DP may be greater than the heat generated in the non-display area NAA of the display panel DP, and the heat dissipation function of the first protection portion PL1 corresponding to the display area AA may be higher than the heat dissipation function of the second protection portion PL2 corresponding to the non-display area NAA. The thermal conductivity of the first protection portion PL1 may be greater than 70 W / mK. For example, the thermal conductivity of the first protection portion PL1 may be greater than 70 W / mK and less than 200 W / mK.

[0095] Figure 7 is a flowchart illustrating a method of manufacturing an electronic device according to an embodiment. Figure 8a , Figure 8c , Figure 8d, Figure 8e as well as Figure 8g 1 is a cross-sectional view showing a part of steps in a method for manufacturing an electronic device according to an embodiment of the present invention. Figure 8b as well as Figure 8f is a plan view showing some steps in a method for manufacturing an electronic device according to an embodiment of the present invention. Figures 1 to 6 An embodiment provides a method for manufacturing an electronic device DD including a protective layer PL disposed under a display panel DP. Figure 7 as well as Figure 8a to Figure 8g In describing a method for manufacturing an electronic device according to an embodiment, the same components as those described above are denoted by the same reference numerals and detailed descriptions thereof are omitted.

[0096] Reference Figure 7 According to one embodiment, a method for manufacturing an electronic device includes: a step of preparing a display panel and a mask (S100); a step of configuring ink (S200); a step of forming an ink layer (S300); a step of configuring a mold (S400); a step of forming a preliminary protective layer (S500); and a step of forming a protective layer (S600).

[0097] Reference Figure 7 as well as Figure 8a , Figure 8a The steps of preparing a display panel including a display area and a non-display area surrounding the display area and a mask disposed on a first lower surface of the display panel ( S100 ) and disposing ink on the first lower surface ( S200 ) are summarized.

[0098] The ink INK may be disposed on the lower surface DP-LF of the display panel DP. On the other hand, in this specification, the lower surface DP-LF of the display panel DP may be referred to as the "first lower surface". In one embodiment, the ink INK may be directly disposed on the first lower surface DP-LF. Thus, the display panel DP and the protective layer PL (see Figure 5 ) do not require a separate adhesive layer between the mask and the ink layer, thereby improving the processability of the electronic device. The ink INK can be disposed on the mask MK. At least a portion of the ink INK can be disposed on the upper surface MK-UF of the mask MK. Since at least a portion of the ink INK is directly disposed on the upper surface MK-UF of the mask MK, the ink layer IKL (refer to Figure 8c ) may be relatively wider in plane than the area of ​​the display panel DP in plane.

[0099] The ink INK may include a base resin and a filler dispersed in the base resin. The base resin may include at least one of acrylic resin, urethane resin, fluorine resin, epoxy resin, polyester resin, polyamide resin and silicone resin. In the base resin, acrylic resin, urethane resin, fluorine resin, epoxy resin, polyester resin, polyamide resin or silicone resin may be provided in the form of monomer or oligomer. The base resin included in the ink INK may include a thermosetting resin. The base resin included in the ink INK may be provided in a liquid form before solidification. It may be that the ink INK includes a filler, and the filler includes at least one of a shielding material, a heat dissipation material and a supporting material. However, it is not limited thereto, and the ink INK may also include additional additives such as a shading material.

[0100] Reference Figure 7 , Figure 8b as well as Figure 8c , Figure 8b as well as Figure 8c The step ( S300 ) of applying the ink INK to the first lower surface DP-LF under pressure by the first squeegee SQ1 so as to overlap the display area AA and the non-display area NAA to form the ink layer IKL is schematically shown. Figure 8b FIG. 4 schematically shows a plan view of the display module viewed in the third direction DR3 in the step ( S300 ) of forming the ink layer IKL. Figure 8c A cross-sectional view of a display module in the step ( S300 ) of forming an ink layer IKL is schematically shown.

[0101] The ink layer IKL may be formed by applying the ink INK. The ink INK may be applied to the lower surface DP-LF of the display panel DP by screen printing. In one embodiment, the ink INK may be directly applied to the lower surface DP-LF of the display panel DP.

[0102] The ink INK may be applied to the lower surface DP-LF of the display panel DP by the pressure of the first scraper SQ1. In one embodiment, the first scraper SQ1 may have a shape extending in the second direction DR2, and the first scraper SQ1 may move along the first direction DR1. The first scraper SQ1 may push the ink INK in the first direction DR1 while moving in the first direction DR1. As the ink INK is pushed out by the first scraper SQ1, it may be applied in a manner overlapping with the display area AA and the non-display area NAA. The first length L1 of the first scraper SQ1 in the second direction DR2 may be longer than the third length L3 of the display panel DP in the second direction DR2. Thus, the length of the ink layer IKL formed by the first scraper SQ1 in the second direction DR2 may be longer than the third length L3 of the display panel DP in the second direction DR2. Thus, on a plane, the area of ​​the ink layer IKL may be wider than the area of ​​the display panel DP. Since the first length L1 of the first squeegee SQ1 has a value relatively longer than the third length L3 of the display panel DP, the ink INK may be uniformly applied on the plane, and the thickness of the formed ink layer IKL may be substantially the same on the plane.

[0103] The ink layer IKL may overlap the display area AA and the non-display area NAA. The ink layer IKL may include a first ink portion IKL1 overlapping the display area AA and a second ink portion IKL2 overlapping the non-display area NAA. In the step of forming the ink layer IKL, the first ink portion IKL1 and the second ink portion IKL2 may be formed of the same material by the same process. Thus, the first ink portion IKL1 and the second ink portion IKL2 may have substantially the same thickness value, and the first ink portion IKL1 and the second ink portion IKL2 may have substantially the same density value. The first ink portion IKL1 and the second ink portion IKL2 may substantially constitute one structure.

[0104] Reference Figure 7 , Figure 8d as well as Figure 8e , Figure 8d as well as Figure 8e The schematic diagram shows the first lower surface DP-LF (refer to Figure 8c ) as a reference, a step of arranging a stamp ST at a predetermined spacing distance in one direction (S400) and a step of pressing the ink layer IKL in a direction opposite to the one direction using the stamp ST to form a preliminary protection layer P_PL (S500).

[0105] The stamp ST may be arranged in a manner overlapping the display area AA. The stamp ST may be arranged on the ink layer IKL at a predetermined spacing distance in the third direction DR3. The ink layer IKL may be pressurized in the third direction DR3 by the stamp ST. The first ink portion IKL1 may be pressurized by the stamp ST, and the second ink portion IKL2 may not be pressurized by the stamp ST.

[0106] The preliminary protection layer P_PL may be formed due to the ink layer IKL being pressurized by the stamp ST. The preliminary protection layer P_PL may include a first preliminary protection portion P_PL1 overlapping the display area AA and a second preliminary protection portion P_PL2 overlapping the non-display area NAA. The first preliminary protection portion P_PL1 may be formed due to the first ink portion IKL1 being pressurized by the stamp ST. The second preliminary protection portion P_PL2 may be formed without performing a pressurization process in the second ink portion IKL2. The second preliminary protection portion P_PL2 may have substantially the same physical properties as the second ink portion IKL2. The thickness of the first preliminary protection portion P_PL1 may be thinner than that of the second preliminary protection portion P_PL2. The second preliminary protection part P_PL2 will not be pressurized by the stamp ST, and only the formation step of the first preliminary protection part P_PL1 includes a pressurization process by the stamp ST, so the density of the first preliminary protection part P_PL1 can have a higher value than the density of the second preliminary protection part P_PL2, and the thermal conductivity of the first preliminary protection part P_PL1 can have a higher value than the thermal conductivity of the second preliminary protection part P_PL2.

[0107] The preliminary protection layer P_PL may be formed by curing a portion of the ink layer IKL while being pressed by the stamp ST. Figure 8a ) and the applied ink layer IKL includes a curable resin, and the ink layer IKL is formed by pre-curing or curing the curable resin through the stamp ST. The first preliminary protection portion P_PL1 may be formed by pressurizing and curing the first ink portion IKL1 through the stamp ST.

[0108] The upper surface of the ink layer IKL may be in contact with the lower surface of the stamp ST, and the temperature of the lower surface of the stamp ST in contact with the ink layer IKL may be above 100°C. For example, the temperature of the lower surface of the stamp ST in contact with the ink layer IKL may be above 100°C and below 300°C. Thus, the step of the stamp ST pressurizing the ink layer IKL toward the third direction DR3 may include the step of thermally curing at least a portion of the ink layer IKL through the stamp ST. The first preliminary protection portion P_PL1 may be formed as a result of thermally curing the first ink portion IKL1 through the stamp ST. As the first ink portion IKL1 is thermally cured, the first preliminary protection portion P_PL1 may be formed when forming the protection layer PL (see Figure 8g ) step to improve the flatness.

[0109] Reference Figure 7 , Figure 8f as well as Figure 8g , Figure 8f as well as Figure 8g The schematic diagram shows a step ( S600 ) of pressing and flattening the upper surface of the preliminary protection layer P_PL overlapping the display area AA and the non-display area NAA using the second squeegee SQ2 to form the protection layer PL.

[0110] The protective layer PL may be formed by a step of flattening the upper surface of the preliminary protective layer P_PL by pressing with a second scraper SQ2. The protective layer PL may include a first protective portion PL1 overlapping with the display area AA and a second protective portion PL2 overlapping with the non-display area NAA. The first protective portion PL1 may be formed by flattening the first preliminary protective portion P_PL1 by pressing with the second scraper SQ2. The second protective portion PL2 may be formed by flattening the second preliminary protective portion P_PL2 by pressing with the second scraper SQ2.

[0111] In one embodiment, the second scraper SQ2 may have a shape extending in the second direction DR2, and the second scraper SQ2 may move in the first direction DR1. As the second scraper SQ2 moves in the first direction DR1, the top of the preliminary protective layer P_PL may be pushed out and flattened by the second scraper SQ2. The second scraper SQ2 may move in the display area AA and the non-display area NAA, and the second scraper SQ2 performs the function of flattening the top of each of the first preliminary protective portion P_PL1 overlapping the display area AA and the second preliminary protective portion P_PL2 overlapping the non-display area NAA. The thickness of each of the first protective portion PL1 and the second protective portion PL2 thus formed may be substantially the same.

[0112] The second length L2 of the second scraper SQ2 in the second direction DR2 may be substantially the same as the length of the display panel DP in the second direction DR2. In addition, the second length L2 of the second scraper SQ2 may be longer than the first scraper SQ1 (see Figure 8b ) of the first length L1 (refer to Figure 8b ) is relatively short.

[0113] An electronic device according to an embodiment of the present invention can obtain the effect of reducing the thickness of the electronic device and simplifying the components by including a protective layer that performs multiple functions under the display panel. The display panel produces various side effects due to the inclusion of light-emitting elements. In the past, electronic devices included multiple components such as a shielding layer, a heat dissipation layer, a buffer layer, and a supporting layer under the display panel to supplement them. In contrast, the present invention can obtain the effect of reducing the thickness, simplifying the components, and increasing the efficiency of the manufacturing process by configuring a protective layer that performs the functions that were previously performed by multiple layers. An electronic device according to an embodiment of the present invention can improve the impact resistance of the display panel against external impacts by configuring a protective layer under the display panel.

[0114] In addition, in the case of an electronic device according to an embodiment of the present invention, the protective layer includes a first protective portion and a second protective portion having different density values ​​from each other, thereby improving the reliability of the electronic device. Specifically, the first protective portion overlapping the display area is formed by a stamping process during manufacturing, while on the other hand, the second protective portion overlapping the non-display area does not include the stamping process during manufacturing. Since the first protective portion is formed by a stamping process during manufacturing, the thermal conductivity of the first protective portion can have a relatively high value. Therefore, the electronic device according to an embodiment of the present invention, since it includes the first protective portion, can improve the ability to perform the heat dissipation function of releasing heat released in the display panel in the display area.

[0115] The first protective portion overlapping the display area and the second protective portion overlapping the non-display area both include a planarization step using a second scraper during manufacturing. When the first protective portion overlapping the display area includes a stamping process during manufacturing, the thickness of the first protective portion and the second protective portion may be different, thereby reducing the reliability of the electronic device. However, since the manufacturing method of an electronic device according to an embodiment of the present invention includes a planarization step, the thickness of the protective layer can be uniformly formed in the entire area including the display area and the non-display area, thereby improving the reliability of the electronic device.

[0116] The above description is made with reference to the preferred embodiments of the present invention, but it is understood by those skilled in the art or those with general knowledge in the art that various modifications and changes can be made to the present invention without exceeding the scope of the concept and technical field of the present invention recorded in the attached claims. Therefore, the technical scope of the present invention is not limited by the contents recorded in the detailed description of the specification, but should be limited by the scope of the claims.

Claims

1. An electronic device, characterized in that: include: The display panel comprises a display area and a non-display area surrounding at least a portion of the display area; as well as A protective layer is disposed below the display panel. The protective layer comprises: a first protection portion overlapping the display area and having a first density; as well as a second protection portion overlapping the non-display area and having a second density, The first density is higher than the second density.

2. The electronic device according to claim 1, characterized in that: in, The first protection portion and the second protection portion have different thermal conductivities.

3. The electronic device according to claim 2, characterized in that: in, The thermal conductivity of the first protection portion is 70 W / mK or more and 200 W / mK or less.

4. The electronic device according to claim 1, characterized in that: in, The first protective portion includes a first base resin and a first filler dispersed in the first base resin, The second protective portion includes a second base resin and a second filler dispersed in the second base resin.

5. The electronic device according to claim 4, characterized in that: in, A weight ratio of the first filler with respect to the total weight of the first protecting portion is higher than a weight ratio of the second filler with respect to the total weight of the second protecting portion.

6. The electronic device according to claim 4, characterized in that: in, A substance included in each of the first base resin and the second base resin is the same as each other, and a substance included in each of the first filler and the second filler is the same as each other.

7. The electronic device according to claim 4, characterized in that: in, An average diameter of each of the first filler and the second filler is 5 μm or more and 100 μm or less.

8. The electronic device according to claim 1, characterized in that: in, The protection layer is directly disposed below the display panel.

9. The electronic device according to claim 1, characterized in that: in, The thickness of the first protection portion and the thickness of the second protection portion are respectively 50 μm or more and 300 μm or less.

10. The electronic device according to claim 1, characterized in that: in, The thickness of the first protection portion and the thickness of the second protection portion are the same.

11. A method for manufacturing an electronic device, comprising: A step of preparing a display panel including a display area and a non-display area surrounding the display area, and a mask disposed on a first lower surface of the display panel; The step of disposing ink on the first bottom surface; The step of applying the ink to the first lower surface by pressurizing the ink with a first scraper so as to overlap the display area and the non-display area to form an ink layer; The step of arranging the stamp at a spacing distance in one direction based on the first lower surface in a manner overlapping with the display area; The step of pressing the ink layer in a direction opposite to the one direction using the stamp to form a preliminary protective layer; as well as The step of pressing and flattening the upper surface of the preliminary protective layer overlapping the display area and the non-display area with a second scraper to form a protective layer.

12. The method for manufacturing an electronic device according to claim 11, wherein: The ink layer includes a first ink portion overlapping the display area and a second ink portion overlapping the non-display area. The density of the first ink portion is substantially the same as the density of the second ink portion.

13. The method for manufacturing an electronic device according to claim 11, wherein: The preliminary protection layer includes a first preliminary protection portion overlapping the display area and a second preliminary protection portion overlapping the non-display area. The thickness of the first preliminary protecting portion is thinner than the thickness of the second preliminary protecting portion.

14. The method for manufacturing an electronic device according to claim 11, wherein: The protective layer includes a first protective portion overlapping the display area and a second protective portion overlapping the non-display area, A first density of the first protecting portion is higher than a second density of the second protecting portion.

15. The method for manufacturing an electronic device according to claim 11, wherein: In the step of applying the ink to the first lower surface by pressurizing the ink with a first scraper, the first scraper moves in a first direction, A first length of the first scraper in a second direction intersecting the first direction on a plane is longer than a second length of the second scraper in the second direction.

16. The method for manufacturing an electronic device according to claim 15, wherein: The first length is longer than a third length of the display panel in the second direction, The second length is the same as the third length.

17. The method for manufacturing an electronic device according to claim 11, wherein: The ink contacts at least a portion of an upper surface of the mask.

18. The method for manufacturing an electronic device according to claim 11, wherein: The ink comprises a curable resin, The step of forming the preliminary protective layer includes the step of thermally curing the curable resin included in the ink.

19. The method for manufacturing an electronic device according to claim 18, wherein: The preliminary protection layer includes a first preliminary protection portion overlapping the display area and a second preliminary protection portion overlapping the non-display area. The step of forming the preliminary protective layer includes the step of thermally curing the first preliminary protective portion.

20. The method for manufacturing an electronic device according to claim 18, wherein: In the step of forming the preliminary protective layer, one side of the stamp contacts one side of the ink layer. The temperature of the one surface of the stamp is 100° C. or higher.

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