Measurement system, machine tool, optical device, measurement method, computer program, and recording medium

Abstract

An optical device, which is attached to a main shaft instead of a tool in a machine tool that machines a workpiece using the tool detachably attached to the main shaft of a machining head while moving a stage on which the workpiece is placed and the machining head, comprises: a direction changing member capable of changing the traveling direction of measurement light; and a light receiving unit that receives return light from each of the plurality of reference members, the return light being generated by irradiating each of the plurality of reference members with the measurement light the traveling direction of which has been changed by the direction changing member. The light receiving unit receives return light generated by irradiating measurement light to each of at least one reference member disposed on a workpiece placed on a stage, and at least one other reference member disposed on the workpiece placed on the stage or the stage, among a plurality of reference members.

Description

Technical Field

[0001] The present invention relates to, for example, a technical field of a machine tool, a measurement system for a machine tool, a measurement method, an optical device, a measurement method, a computer program, and a recording medium. Background Art

[0002] A machine tool that calculates movement errors generated in translational movement and rotational movement of a first mechanical part and a second mechanical part is described in Patent Document 1. In such a machine tool, appropriately calculating the movement errors is a technical problem.

[0003] Prior Art Documents

[0004] Patent Documents

[0005] Patent Document 1: U.S. Patent Publication No. 2018 / 0174317 Summary of the Invention

[0006] According to a first aspect, there is provided an optical device that is assembled on a spindle in place of a tool in a machine tool that moves at least one of a stage on which a workpiece is placed and a machining head, and machines the workpiece with the tool that is detachably assembled on the spindle of the machining head. The optical device includes: a direction changing member that can change a traveling direction of measurement light; and a light receiving unit that receives return light from each of a plurality of reference members, the return light being generated by irradiating each of the plurality of reference members with the measurement light whose traveling direction has been changed by the direction changing member. The light receiving unit receives the return light generated by irradiating at least one reference member disposed on the workpiece placed on the stage and each of the other at least one reference member disposed on the workpiece placed on the stage or the stage with the measurement light.

[0007] According to a second aspect, there is provided a measuring system for a machine tool in which at least one of a table on which a workpiece is placed and a machining head is moved while machining the workpiece with a tool that is detachably assembled to a spindle of the machining head. The measuring system includes: an optical device that is assembled to the spindle in place of the tool and has a direction changing member capable of changing a traveling direction of measuring light, the optical device receiving return light from each of at least four reference members that is generated by irradiating each of the at least four reference members with the measuring light whose traveling direction has been changed by the direction changing member; and an arithmetic unit that calculates a position of the optical device based on a light receiving result of the return light from each of the at least four reference members by the optical device assembled to the spindle, the optical device receiving the return light generated by irradiating at least one reference member disposed on the workpiece placed on the table and each of at least three reference members disposed on the workpiece placed on the table or on the table with the measuring light.

[0008] According to a third aspect, there is provided a machine tool including: the measuring system provided by the first aspect; the machining head; the table; and a driving device that moves at least one of the machining head and the placing device.

[0009] According to a fourth aspect, there is provided a measuring method for a machine tool in which at least one of a table on which a workpiece is placed and a machining head is moved while machining the workpiece with a tool that is detachably assembled to a spindle of the machining head. The measuring method includes: irradiating each of at least four reference members with measuring light using an optical device assembled to the spindle in place of the tool; receiving, by the optical device, return light from each of the at least four reference members that is generated by irradiating each of the at least four reference members with the measuring light; and calculating a position of the optical device based on a light receiving result of the return light from each of the at least four reference members by the optical device, the at least four reference members being respectively disposed on the workpiece placed on the table or on the table, and at least one of the at least four reference members being disposed on the workpiece placed on the table.

[0010] According to a fifth aspect, there is provided a computer program that causes a computer to execute the measuring method provided by the fourth aspect.

[0011] According to a sixth aspect, there is provided a recording medium that records the computer program provided by the fifth aspect.

[0012] According to the seventh aspect, there is provided an optical device which is assembled on the spindle in place of a tool in a machine tool that moves at least one of a stage on which a workpiece is placed and a machining head, and processes the workpiece with a tool that is detachably assembled on the spindle of the machining head. The optical device includes: a direction-changing member capable of changing the traveling direction of measurement light; and a light-receiving unit that receives return light from each of at least four reference members, the return light being generated by irradiating each of the at least four reference members with the measurement light whose traveling direction has been changed by the direction-changing member. The light-receiving unit receives the return light generated by irradiating at least one reference member disposed on the workpiece placed on the stage and each of at least three reference members disposed on the workpiece placed on the stage or on the stage with the measurement light. The light-receiving result of the return light by the light-receiving unit is used to calculate the position of the optical device.

[0013] According to the eighth aspect, there is provided a machine tool that moves at least one of a stage on which a workpiece is placed and a machining head, and processes the workpiece with a tool that is detachably assembled on the spindle of the machining head. The machine tool includes an arithmetic unit that calculates the position of the optical device based on the light-receiving result of the optical device. The optical device is assembled on the spindle in place of the tool and receives return light from each of at least four reference members, the return light being generated by irradiating each of the at least four reference members with measurement light. The arithmetic unit calculates the position of the optical device based on the light-receiving result of the return light by the optical device. The return light is generated by irradiating at least one reference member disposed on the workpiece placed on the stage and each of at least three reference members disposed on the workpiece placed on the stage or on the stage with the measurement light.

[0014] According to a ninth aspect, there is provided a measurement system for a machine tool, in which the machine tool moves at least one of a table on which a workpiece is placed and a machining head, and simultaneously machines the workpiece using a tool that is detachably assembled to a spindle of the machining head. The measurement system includes: an optical device that receives return light from a reference member generated by irradiating the reference member with measurement light, in a state where the spindle is in a first space other than a second space occupied by the workpiece placed on the table, each time the table or the machining head moves to a plurality of different positions; and an arithmetic unit that calculates a position related to the spindle in the first space based on a light reception result of the return light from the reference member received by the optical device each time the table or the machining head moves to a plurality of different positions, and calculates a position related to the spindle in the second space based on the calculated position related to the spindle in the first space.

[0015] According to a tenth aspect, there is provided a measurement system for a machine tool, in which the machine tool moves at least one of a table on which a workpiece is placed and a machining head, and simultaneously machines the workpiece using a tool that is detachably assembled to a spindle of the machining head. The measurement system includes: an optical device that is assembled to the spindle in place of the tool and receives return light from a reference member generated by irradiating the reference member disposed on the workpiece placed on the table or the table with measurement light; and an arithmetic unit that calculates a position of the optical device based on a temperature of at least one of the workpiece and the table detected by a temperature detector capable of detecting the temperature of at least one of the workpiece and the table, and a light reception result of the return light from the reference member by the optical device.

[0016] According to the eleventh aspect, there is provided a measurement system for a machine tool, in which the machine tool moves at least one of a table on which a workpiece is placed and a machining head, and at the same time, the workpiece is machined using a tool that is detachably assembled on the spindle of the machining head. The measurement system includes: an optical device that is assembled on the spindle instead of the tool and receives return light from a reference member generated by irradiating the reference member with measurement light; and an arithmetic unit that calculates the position of the optical device based on the light reception result of the return light from the reference member by the optical device assembled on the spindle. The optical device includes a direction changing member that can change the traveling direction of the measurement light. The arithmetic unit controls the direction changing member to change the traveling direction of the measurement light by the direction changing member and scan a first area that can be irradiated with the measurement light using the measurement light. The optical device receives return light from the first area generated by scanning the first area with the measurement light. The arithmetic unit calculates the direction of the reference member relative to the optical device based on the light reception result of the return light from the first area by the optical device, and controls the direction changing member based on the direction of the reference member to irradiate the reference member with the measurement light.

[0017] According to the twelfth aspect, there is provided a measurement system for a machine tool, in which the machine tool moves at least one of a table on which a workpiece is placed and a machining head, and at the same time, the workpiece is machined using a tool that is detachably assembled on the spindle of the machining head. The measurement system includes: an optical device that is assembled on the spindle instead of the tool and has a direction changing member that can change the traveling direction of measurement light. The optical device receives return light from each of at least four reference members that is generated by irradiating each of the at least four reference members arranged on at least one of the table and the workpiece with the measurement light whose traveling direction has been changed by the direction changing member; and an arithmetic unit that calculates the distance between the optical device and each of the at least four reference members based on the light reception result of the return light from each of the at least four reference members, and generates information for controlling the machine tool based on the calculated distance.

[0018] According to the thirteenth aspect, a machine tool is provided that moves at least one of a stage on which a workpiece is placed and a machining head, and simultaneously machines the workpiece using a tool that is detachably assembled to the spindle of the machining head. The machine tool includes a calculation unit that calculates distances between the optical device and each of the at least four reference members based on a light reception result of an optical device that is assembled to the spindle in place of the tool and receives return light from each of the at least four reference members generated by irradiating measurement light to each of the at least four reference members disposed on at least one of the stage and the workpiece. The machine tool controls at least one of the stage and the machining head based on a command value related to the movement of at least one of the stage and the machining head and the calculated distances.

[0019] The effects and other advantages of the present invention will become clear from the embodiments described below. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a perspective view showing the appearance of the machining system in the present embodiment.

[0021] Figure 2 It is a block diagram showing the system configuration of the machining system in the present embodiment.

[0022] Figure 3 It is a sectional view showing the structure of the machining head in the present embodiment.

[0023] Figure 4 It is a sectional view showing the structure of the machining head in the present embodiment.

[0024] Figure 5 It is a sectional view showing a machining head in which a measuring device (particularly a measuring head) is assembled in the present embodiment.

[0025] Figure 6 It is a sectional view showing a machining head in which a measuring device (particularly a measuring head) is assembled in the present embodiment.

[0026] Figure 7 It is a sectional view showing an optical system that irradiates measurement light to a measurement object and receives return light from the measurement object.

[0027] Figure 8 It is a sectional view showing the structure of the optical system included in the measuring head in the present embodiment.

[0028] Fig. 9 It is a sectional view showing a reference member and a measuring head that measures the reference member.

[0029] Fig.10(a) shows a top view of a plurality of reference members. Fig.10 (b) shows a side view of a plurality of reference members.

[0030] Fig.11 From (a) to Fig.11 (e) respectively show side views of a measuring head that irradiates measurement light onto the reference members.

[0031] Fig.12 is a flowchart showing the process of a movement error calculation operation for calculating a movement error generated during translational movement of at least one of a processing head and a stage.

[0032] Fig.13 Schematically shows a measuring head performing global scanning.

[0033] Fig.14 Schematically shows a measuring head performing local scanning.

[0034] Fig.15 Shows a measurement coordinate system.

[0035] Fig.16 Shows a measurement coordinate system that moves within a machine coordinate system as the stage moves.

[0036] Fig.17 Shows three measurement points and four reference members.

[0037] Fig.18 Shows the positions of the measurement points in the measurement coordinate system.

[0038] Fig.19 Shows the positions of the measurement points in the machine coordinate system.

[0039] Fig. 20 Shows the movement error in the machine coordinate system.

[0040] Fig.21 is a flowchart showing the process of a movement error calculation operation for calculating a movement error generated during rotational movement of at least one of a processing head and a stage.

[0041] Fig. 22 Shows the positional relationship between the measuring head and the reference members.

[0042] Fig.23 Shows the positions of the reference members in the machine coordinate system.

[0043] Fig.24 Shows the movement error in the machine coordinate system.

[0044] Fig.25 is a sectional view showing the positional relationship between the stage, the workpiece, and the measuring head.

[0045] Fig.26 It is a sectional view showing the positional relationship among the stage, the workpiece, and the measuring head.

[0046] Fig. 27 It shows the movement error calculated by interpolation.

[0047] Fig.28 It is a sectional view showing the positional relationship among the stage, the workpiece, and the measuring head.

[0048] Fig.29 It shows the movement error calculated by interpolation.

[0049] Fig.30 It is a sectional view showing the positional relationship among the stage, the workpiece, and the measuring head.

[0050] Fig.31 It shows the case of combining the positions of measurement points in multiple spaces.

[0051] Fig.32 (a) of shows the measuring head in the first state where no workpiece is placed on the stage, Fig.32 (b) of shows the measuring head in the second state where a workpiece is placed on the stage.

[0052] Fig.33 (a) of and Fig.33 (b) of are respectively a top view and a side view showing the reference element of the workpiece and the reference member.

[0053] Fig.34 (a) of and Fig.34 (b) of are respectively a side view and a top view showing the reference element of the workpiece and the reference member.

[0054] Fig.35 (a) of and Fig.35 (b) of respectively show the reference element points of the workpiece.

[0055] Fig.36 (a) of and Fig.36 (b) of respectively show the reference element points of the workpiece.

[0056] Fig.37 It shows the reference element points of the workpiece.

[0057] Fig.38 It schematically shows the structure of the machining system in the fourth modification example.

[0058] Fig.39 It is a sectional view showing an example of the measuring head included in the machining system in the fourth modification example.

[0059] Fig.40(a) of and (b) of 40 are cross-sectional views showing an example of a measuring head included in the machining system in the fourth modification example.

[0060] Fig.41 It is a cross-sectional view showing the positional relationship between the measuring head and the reference member.

[0061] Fig.42 (a) of and Fig.42 (b) of are cross-sectional views showing the measuring head of the rotary moving stage and the reference member disposed on the stage following the rotary movement.

[0062] Fig.43 It is a graph showing the distance between the measuring head and the reference member calculated from the return light of the reference member in the state where the stage is rotating and moving, corresponding to the movement locus of the reference member.

[0063] Fig.44 It is a cross-sectional view showing the first specific example of the measuring head in the seventh modification example.

[0064] Fig.45 (a) of and Fig.45 (b) of are cross-sectional views showing the second specific example of the measuring head in the seventh modification example.

[0065] Fig.46 (a) of and Fig.46 (b) of are cross-sectional views showing the third specific example of the measuring head in the seventh modification example.

[0066] Fig.47 It is a cross-sectional view showing the fourth specific example of the measuring head in the seventh modification example.

[0067] Fig.48 It is a cross-sectional view showing the fifth specific example of the measuring head in the seventh modification example.

[0068] Fig.49 It is a cross-sectional view showing the sixth specific example of the measuring head in the seventh modification example.

[0069] Fig.50 It shows a pivot point located at a position away from the rotation axis of the main shaft.

[0070] Fig.51 (a) to Fig.51 (c) of are cross-sectional views showing the situation where the posture of the main shaft changes when the pivot point is on the rotation axis of the main shaft.

[0071] Fig.52 (a) to Fig.52 (c) of are cross-sectional views showing the situation where the posture of the main shaft changes when the pivot point is at a position away from the rotation axis of the main shaft.

[0072] Fig.53 It is a cross-sectional view showing the structure of the measuring device according to the ninth modification example.

[0073] Fig.54 It is a cross-sectional view showing the structure of the first specific example of the measuring device according to the ninth modification example.

[0074] Fig.55 It is a cross-sectional view showing the structure of the second specific example of the measuring device according to the ninth modification example.

[0075] Fig.56 It is a cross-sectional view showing the structure of the third specific example of the measuring device according to the ninth modification example.

[0076] Fig.57 It is a cross-sectional view of a measuring head that repeatedly performs a unit measuring operation of irradiating a reference member with measuring light and receiving the returning light from the reference member.

[0077] Fig.58 It is a cross-sectional view of a measuring head that repeatedly performs a unit measuring operation of irradiating a reference member with measuring light and receiving the returning light from the reference member.

[0078] Fig.59 It is a block diagram showing the system configuration of a processing system according to the eleventh modification example.

[0079] Fig.60 It is a cross-sectional view of a workpiece with thermal expansion.

[0080] Fig.61 (a) to Fig.61 (d) are respectively cross-sectional views showing an example of a temperature sensor.

[0081] Fig.62 (a) and Fig.62 (b) are respectively cross-sectional views of workpieces placed on a stage via a support member.

[0082] Fig.63 It is a cross-sectional view showing the positional relationship between the reference member FM and each of the measuring head and the processing head.

[0083] Fig.64 It is a cross-sectional view showing the positional relationship between the reference member FM and each of the measuring head and the processing head.

[0084] Fig.65 It is a block diagram showing the system configuration of a processing system according to the twelfth modification example.

[0085] Fig.66 It is a block diagram showing the system configuration of a processing system according to the thirteenth modification example.

[0086] Fig.67 It is a block diagram showing the system configuration of the machining system in the fourteenth modified example.

[0087] Explanation of reference numerals in the drawings

[0088] 1: Machine tool

[0089] 11: Machining head

[0090] 111: Spindle

[0091] 112: Head housing

[0092] 113: Tool

[0093] 12: Head drive system

[0094] 13: Position measuring device

[0095] 14: Stage device

[0096] 141: Stage

[0097] 142: Stage drive system

[0098] 143: Position measuring device

[0099] 16: Machining control device

[0100] 2: Measuring system

[0101] 20: Measuring device

[0102] 21: Measuring light source

[0103] 22: Measuring head

[0104] 221: Head housing

[0105] 222: Optical system

[0106] 2228: Galvanometer mirror

[0107] W: Workpiece

[0108] FM: Reference member

[0109] ML: Measuring light

[0110] RL: Return light

[0111] RB: Reference light Detailed implementation manners

[0112] Hereinafter, embodiments of a measurement system, a machine tool, an optical device, a measurement method, a computer program, and a recording medium will be described with reference to the drawings. Hereinafter, a processing system SYS that can process a workpiece W as an example of an object will be used to describe embodiments of the measurement system, the machine tool, the optical device, the measurement method, the computer program, and the recording medium.

[0113] In addition, in the following description, a mechanical coordinate system, an XYZ orthogonal coordinate system defined by mutually orthogonal X, Y, and Z axes, is used to describe the positional relationship of various components constituting the processing system SYS. In addition, in the following description, for the sake of convenience of explanation, an example in which the X-axis direction and the Y-axis direction of the mechanical coordinate system are horizontal directions (i.e., specified directions in a horizontal plane) and the Z-axis direction of the mechanical coordinate system is a vertical direction (i.e., a direction orthogonal to the horizontal plane, substantially an up-and-down direction) will be used for explanation. Additionally, the rotational directions (in other words, tilting directions) around the X, Y, and Z axes may be referred to as the θX direction, the θY direction, and the θZ direction, respectively.

[0114] In addition, in the following description, unless otherwise stated, the X-axis, the Y-axis, and the Z-axis respectively refer to the X-axis in the mechanical coordinate system, the Y-axis in the mechanical coordinate system, and the Z-axis in the mechanical coordinate system.

[0115] (1) Configuration of the machining system SYS in this embodiment

[0116] First, the structure of the processing system SYS in the present embodiment will be described.

[0117] (1-1) Overall structure of the processing system SYS

[0118] First, with reference to Figure 1 and Figure 2 , the overall structure of the processing system SYS in the present embodiment will be described. Figure 1 is a perspective view showing the appearance of the processing system SYS (particularly the machine tool 1) in the present embodiment. Figure 2 is a block diagram showing an example of the system structure of the processing system SYS in the present embodiment.

[0119] As shown in Figure 1 and Figure 2 , the processing system SYS includes a machine tool 1 and a measurement system 2. In addition, in Figure 1 , the illustration of the measurement system 2 is omitted for easy viewing of the drawings. Therefore, it can also be regarded as Figure 1 mainly showing the appearance of the machine tool 1. Additionally, a device including at least a part of the measurement system 2 and the machine tool 1 may be referred to as a machine tool. That is, the machine tool 1 may also include at least a part of the measurement system 2.

[0120] (1-1-1) Structure of Machine Tool 1

[0121] Machine tool 1 is a machining device capable of machining a workpiece W. In order to machine the workpiece W, the machine tool 1 includes: a machining head 11, a head drive system 12, a head position measuring device 13, a stage device 14, a tool changing device 15, and a machining control device 16.

[0122] The machining head 11 is a machining device for machining the workpiece W. The machining head 11 includes a spindle 111 and a head housing 112. Hereinafter, in addition to referring to Figure 1 and Figure 2 in addition, also refer to Figure 3 and Figure 4 to describe the machining head 11. Figure 3 and Figure 4 are respectively sectional views showing the structure of the machining head 11. In addition, the machining head 11 may be simply referred to as the head, or may also be called the spindle head. In addition, Figure 1 a vertical machine tool is shown as an example in , but the machine tool 1 is not limited to a vertical machine tool. The machine tool 1 may also be any well-known machine tool. For example, the machine tool 1 may be a horizontal machine tool or a composite machine tool.

[0123] As Figure 1 and Figure 3 to Figure 4 shown, the spindle 111 is a member capable of rotating about the rotation axis RX. In the said case, the spindle 111 may be, for example, a member extending along the rotation axis RX (i.e., a member having a long side shape). In addition, in Figure 1 the example shown, the rotation axis RX of the spindle 111 is parallel to the Z axis. However, the spindle 111 may also rotate about a rotation axis RX intersecting the Z axis (for example, a rotation axis RX orthogonal to the Z axis or inclined with respect to the Z axis). The spindle 111 may also be called a spindle.

[0124] As Figure 4 shown, a tool 113 for machining the workpiece W (i.e., a machining tool) can be assembled on the spindle 111. Specifically, as Figure 3 and Figure 4 shown, the spindle 111 includes an assembly portion 1111 for assembling the tool 113. The tool 113 is assembled on the spindle 111 via the assembly portion 1111. The tool 113 assembled on the assembly portion 1111 can be disassembled from the assembly portion 1111. That is, the tool 113 can be assembled on the spindle 111 detachably.

[0125] In addition, the state of "the first object is assembled on the second object" in the present embodiment may also include at least one of the state of "the first object is directly assembled on the second object (i.e., the first object is assembled on the second object in such a way that the first object comes into contact with the second object)" and the state of "the first object is indirectly assembled on the second object (i.e., the first object is assembled on the second object without the first object coming into contact with the second object)". The state of "the first object is indirectly assembled on the second object" may include the state of "the first object is assembled on the second object via a third object different from the first object and the second object".

[0126] In Figure 3 and Figure 4 In the example shown, the spindle 111 includes an assembly portion 1111 formed with a hole 1112 (e.g., a tapered hole) for the tool 113 to be inserted (or embedded) at the front end of the spindle 111 (specifically, the front end on the workpiece W side). In this case, the tool 113 is assembled on the spindle 111 by inserting (or embedding) the shank 1131 of the tool 113 having a shape complementary to the hole 1112 into the hole 1112 of the assembly portion 1111. The assembly portion 1111 may also hold the tool 113 assembled thereon. In this case, in order to hold the tool 113, the assembly portion 1111 may include at least one of a mechanical chuck, an electrostatic chuck, an oil pressure chuck, and a vacuum suction chuck, etc.

[0127] When the spindle 111 rotates in a state where the tool 113 is assembled on the spindle 111, the tool 113 also rotates about the rotation axis RX. As a result, the rotating tool 113 comes into contact with the workpiece W, thereby machining the workpiece W. Thus, the machine tool 1 (especially the machining head 11) can machine the workpiece W using the spindle 111 and the tool 113.

[0128] The head housing 112 is a housing that houses the spindle 111. The head housing 112 may house the spindle 111 in a housing space formed inside the head housing 112. The spindle 111 housed in the head housing 112 may also be supported by the head housing 112 via an unillustrated shaft support member (e.g., a bearing).

[0129] Returning to Figure 1 and Figure 2In this case, the head drive system 12 moves the machining head 11. In addition, the head drive system 12 may also be referred to as a driving device. For example, the head drive system 12 can move the machining head 11 along at least one of the X-axis, Y-axis, and Z-axis. That is, for example, the head drive system 12 can move the machining head 11 along at least one of the following translation axes, namely, the translation axis along the X-axis, the translation axis along the Y-axis, and the translation axis along the Z-axis. In addition, the movement along at least one of the following translation axes, namely, the translation axis along the X-axis, the translation axis along the Y-axis, and the translation axis along the Z-axis, may also be referred to as a translational movement. In the following description, the translation axis along the X-axis, the translation axis along the Y-axis, and the translation axis along the Z-axis are respectively referred to as translation axis (X), translation axis (Y), and translation axis (Z). In the following description, unless otherwise specified, the translation axis may refer to at least one of translation axis (X), translation axis (Y), and translation axis (Z).

[0130] For example, the head drive system 12 can move the machining head 11 along at least one of the θX direction, θY direction, and θZ direction on the basis of or instead of moving along at least one of the translation axis along the X-axis, the translation axis along the Y-axis, and the translation axis along the Z-axis. That is, the head drive system 12 can rotate the machining head 11 about at least one of the rotation axes along the X-axis, the rotation axes along the Y-axis, and the rotation axes along the Z-axis on the basis of or instead of moving the machining head 11 along at least one of the following translation axes, namely, the translation axis along the X-axis, the translation axis along the Y-axis, and the translation axis along the Z-axis. In addition, the movement along at least one of the θX direction (the direction about the rotation axis along the X-axis), θY direction (the direction about the rotation axis along the Y-axis), and θZ direction (the direction about the rotation axis along the Z-axis) may also be referred to as a rotational movement. In the following description, the rotation axis about the X-axis, the rotation axis about the Y-axis, and the rotation axis about the Z-axis are respectively referred to as rotation axis (X), rotation axis (Y), and rotation axis (Z). In the following description, unless otherwise specified, the rotation axis may also refer to at least one of rotation axis (X), rotation axis (Y), and rotation axis (Z). In addition, the action of moving the machining head 11 along the rotation direction about the rotation axis can also be regarded as equivalent to the action of changing the posture of the machining head 11.

[0131] In Figure 1In the example shown, the head drive system 12 moves the processing head 11 along the translation axis (X) and the translation axis (Z), respectively. In this case, the head drive system 12 may include, for example: a column 121, which is a wall-shaped member extending upward along the Z-axis from a base 140 that is a base of a stage device 14 described later; an X guide member 122, which is assembled (or formed) on the column 121 and extends along the X-axis; an X block member 123, which is assembled on the X guide member 122 and can move along the X guide member 122; a servo motor 124, which generates a driving force for moving the X block member 123; a Z guide member 125, which is assembled (or formed) on the X block member 123 and extends along the Z-axis; a Z block member (not shown in Figure 1 ), which is assembled on the Z guide member 125 and can move along the Z guide member 125; and a servo motor 126, which generates a driving force for moving the Z block member. The processing head 11 (particularly the head housing 112) may also be assembled on the Z block member. As a result, the processing head 11 moves along the translation axis (X) together with the movement of the X block member 123, and moves along the translation axis (Z) together with the movement of the Z block member.

[0132] When the head drive system 12 moves the processing head 11, the relative positional relationship between the processing head 11 and a stage 141 (and further, a workpiece W placed on the stage 141) described later changes. Therefore, the relative positional relationship between the processing position where the processing head 11 performs processing and the workpiece W changes. That is, the processing position moves relative to the workpiece W. The machine tool 1 can move the processing head 11 while processing the workpiece W. Specifically, the machine tool 1 can set a processing position at a desired position of the workpiece W by moving the processing head 11, and simultaneously process the desired position of the workpiece W. However, in the case where the processing position can be set at a desired position of the workpiece W by moving the stage 141 described later, the machine tool 1 can also process the workpiece W without moving the processing head 11.

[0133] The head position measuring device 13 can measure the position of the processing head 11. As an example of the head position measuring device 13, an encoder can be cited.

[0134] The stage device 14 includes a base 140, a stage 141, and a stage drive system 142. The stage 141 and the stage drive system 142 are supported by the base 140.

[0135] The workpiece W is placed on the stage 141. Therefore, the stage 141 may also be referred to as a placement device. The stage 141 can support the workpiece W placed on the stage 141. The stage 141 can also hold the workpiece W placed on the stage 141. In this case, in order to hold the workpiece W, the stage 141 may include at least one of a mechanical chuck, an electrostatic chuck, a vacuum adsorption chuck, etc.

[0136] The stage 141 is disposed at a position where it can face the processing head 11 (especially the spindle 111). In Figure 1 In the example shown, the stage 141 is disposed below the processing head 11 (especially the spindle 111). However, the stage 141 may also be disposed at a position different from the position below the processing head 11 (especially the spindle 111).

[0137] The stage drive system 142 moves the stage 141. In addition, the stage drive system 142 may also be referred to as a drive device. The stage drive system 142 can, for example, move the stage 141 along at least one of the X-axis, Y-axis, and Z-axis. That is, the stage drive system 142 can, for example, move the stage 141 along at least one of the translation axis (X), translation axis (Y), and translation axis (Z).

[0138] For example, the stage drive system 142 can move the stage 141 along at least one of the θX direction, θY direction, and θZ direction on the basis of or instead of moving the stage 141 along at least one of the translation axis (X), translation axis (Y), and translation axis (Z). That is, the stage drive system 142 can rotate the stage 141 around at least one of the rotation axis (X), rotation axis (Y), and rotation axis (Z) on the basis of or instead of moving the stage 141 along at least one of the translation axis (X), translation axis (Y), and translation axis (Z). In addition, the action of moving the stage 141 along the rotation direction around at least one of the rotation axis (X), rotation axis (Y), and rotation axis (Z) can also be regarded as equivalent to the action of changing the posture of the stage 141.

[0139] In Figure 1In the example shown, the stage driving system 142 moves the stage 141 along the translation axis (Y), and rotates the stage 141 about the rotation axis (X) and the rotation axis (Z), respectively. In this case, the stage driving system 142 may include, for example: a Y guiding member 1421 assembled (or formed) on the base 140 and extending along the Y axis; a trunnion (Y block member) 1422 assembled on the Y guiding member 1421 and capable of moving along the Y guiding member 1421; a servo motor 1423 that generates a driving force for moving the trunnion 1422; a cradle 1424 assembled on the trunnion 1422 and capable of rotating about the rotation axis (X) relative to the trunnion 1422; and a servo motor (not shown) that generates a driving force for rotating the cradle 1424. The stage 141 may be assembled on the cradle 1424 such that it can rotate about the rotation axis (Z) relative to the cradle 1424 using the driving force generated by the servo motor (not shown). As a result, the stage 141 moves along the translation axis (Y) together with the movement of the trunnion 1422, rotates about the rotation axis (X) together with the rotation of the cradle 1424, and rotates about the rotation axis (Z). In addition, in this case, the rotation axis (X) may also be referred to as the A axis. Additionally, the rotation axis (Z) may also be referred to as the C axis.

[0140] When the stage driving system 142 moves the stage 141, the relative positional relationship between the machining head 11 and the stage 141 (and thus, the workpiece W placed on the stage 141) changes. Therefore, the relative positional relationship between the machining position where the machining head 11 performs machining and the workpiece W changes. That is, the machining position moves relative to the workpiece W. The machine tool 1 can move the stage 141 while machining the workpiece W. Specifically, the machine tool 1 can set the machining position at a desired position of the workpiece W by moving the stage 141 and machine the desired position of the workpiece W at the same time. However, in the case where the machining position can be set at the desired position of the workpiece W by moving the machining head 11, the machine tool 1 can also machine the workpiece W without moving the stage 141.

[0141] The position measuring device 143 can measure the position of the stage 141. As an example of the position measuring device 143, an encoder can be cited.

[0142] The tool changing device 15 is a device capable of changing the tool 113 assembled on the main spindle 111. For example, the tool changing device 15 can take out one tool 113 to be assembled on the main spindle 111 from a tool magazine (not shown) that houses a plurality of tools 113, and assemble the taken-out one tool 113 on the main spindle 111. That is, the tool changing device 15 can function as an assembling device capable of assembling the tool 113 on the main spindle 111. The tool changing device 15 can also disassemble the tool 113 assembled on the main spindle 111 and house the disassembled tool 113 in a tool magazine (not shown). That is, the tool changing device 15 can also function as a disassembling device capable of disassembling the tool 113 from the main spindle 111. In addition, an automatic tool changer (ATC: Automatic Tool Changer) used in a machining center or the like can also be used as the tool changing device 15.

[0143] The machining control device 16 controls the operation of the machine tool 1. For example, the machining control device 16 can control the operation of the machining head 11 included in the machine tool 1 (for example, the rotation of the main spindle 111). For example, the machining control device 16 can also control the operation of the head drive system 12 included in the machine tool 1 (for example, the movement of the machining head 11). For example, the machining control device 16 can also control the operation of the stage drive system 142 included in the machine tool 1 (for example, the movement of the stage 141). For example, the machining control device 16 can also control the operation of the tool changing device 15 included in the machine tool 1 (that is, the replacement of the tool 113 and the measuring head 22 assembled on the main spindle 111).

[0144] The processing control device 16 may include, for example, an arithmetic device and a storage device. The processing control device 16 including such an arithmetic device may also be referred to as an arithmetic unit. The arithmetic device may include, for example, at least one of a Central Processing Unit (CPU) and a Graphics Processing Unit (GPU). The storage device may include, for example, a memory. The processing control device 16 functions as a device for controlling the operation of the machine tool 1 by executing a computer program with the arithmetic device. The computer program is a computer program for causing the arithmetic device to perform (i.e., execute) the actions to be described later that the processing control device 16 should perform. That is, the computer program is a computer program for causing the processing control device 16 to function so that the machine tool 1 performs the actions to be described later. The computer program executed by the arithmetic device may be recorded in the storage device (i.e., recording medium) included in the processing control device 16, or may be recorded in any storage medium (such as a hard disk or a semiconductor memory) built in or externally connectable to the processing control device 16. Alternatively, the arithmetic device may download the computer program to be executed from a device external to the processing control device 16 via a network interface. In addition, the processing control device 16 may not include a storage device.

[0145] The processing control device 16 may not be provided inside the machine tool 1. For example, the processing control device 16 may be provided outside the machine tool 1 as a server or the like. In such a case, the processing control device 16 and the machine tool 1 may be connected via a wired network and / or a wireless network (or a data bus and / or a communication line). As the wired network, for example, a network using an interface of a serial bus system represented by at least one of Institute of Electrical and Electronics Engineers (IEEE) 1394, RS-232x, RS-422, RS-423, RS-485, and universal serial bus (USB) may be adopted. As the wired network, a network using an interface of a parallel bus system may also be adopted. As the wired network, a network using an interface based on Ethernet (registered trademark) represented by at least one of 10BASE-T, 100BASE-TX, and 1000BASE-T may also be adopted. As the wireless network, a network using radio waves may be adopted. As an example of the network using radio waves, a network based on IEEE802.1x (for example, at least one of a wireless local area network (LAN) and Bluetooth (registered trademark)) may be cited. As the wireless network, a network using infrared rays may also be adopted. As the wireless network, a network using optical communication may also be adopted. In such a case, the processing control device 16 and the machine tool 1 may also be configured to be able to transmit and receive various information via the network. In addition, the processing control device 16 can also transmit information such as commands or control parameters to the machine tool 1 via the network. The machine tool 1 may also include a receiving device that receives information such as commands or control parameters from the processing control device 16 via the network. The machine tool 1 may also include a transmitting device (i.e., an output device that outputs information to the processing control device 16) that transmits information such as commands or control parameters to the processing control device 16 via the network. Alternatively, a first control device that performs a part of the processing performed by the processing control device 16 may be provided inside the machine tool 1, and on the other hand, a second control device that performs another part of the processing performed by the processing control device 16 may be provided outside the machine tool 1.

[0146] In the machining control device 16, an arithmetic model that can be constructed by machine learning can be installed by executing a computer program with an arithmetic device. As an example of an arithmetic model that can be constructed by machine learning, for example, an arithmetic model including a neural network (so-called artificial intelligence (AI: Artificial Intelligence)) can be cited. In the said case, the learning of the arithmetic model can include the learning of parameters of the neural network (for example, at least one of weights and biases). The machining control device 16 can also use the arithmetic model to control the operation of the machine tool 1. That is, the operation of controlling the operation of the machine tool 1 can also include the operation of controlling the operation of the machine tool 1 using the arithmetic model. In addition, in the machining control device 16, an arithmetic model constructed and completed by offline machine learning using teacher data can also be installed. Further, the arithmetic model installed in the machining control device 16 can be updated by online machine learning on the machining control device 16. Or, the machining control device 16 can control the operation of the machine tool 1 based on or instead of the arithmetic model installed in the machining control device 16, using an arithmetic model installed in an external device of the machining control device 16 (especially a device provided outside the machine tool 1).

[0147] In addition, as a recording medium for recording the computer program executed by the processing control device 16, a compact disc read only memory (CD-ROM), a compact disc recordable (CD-R), a compact disc rewritable (CD-RW), a flexible disk, a magnet optical (MO), a digital versatile disc read only memory (DVD-ROM), a digital versatile disc random access memory (DVD-RAM), a digital versatile disc-recordable (DVD-R), a DVD+R, a digital versatile disc-rewritable (DVD-RW), a DVD+RW, a Blu-ray (registered trademark), or other optical discs such as a magnetic medium such as a magnetic tape, an optical disk, a semiconductor memory such as a USB memory, and any other medium capable of storing a program may be used. The recording medium may include a device capable of recording a computer program (for example, a general-purpose device or a dedicated device installed with a computer program in a state capable of being executed in at least one of software and firmware). Further, each process or function included in the computer program may be implemented by a logical processing block realized in the processing control device 16 by executing the computer program through the processing control device 16 (i.e., a computer), may be implemented by hardware such as a prescribed gate array (field programmable gate array (FPGA), application specific integrated circuit (ASIC)) included in the processing control device 16, or may be implemented in a form in which a logical processing block and a partial hardware module realizing a part of the elements of the hardware are mixed.

[0148] (1-1-2) Configuration of Measurement System 2

[0149] The measurement system 2 can measure a measurement object. In order to measure the measurement object, the measurement system 2 includes a measurement device 20 and a measurement control device 24.

[0150] The measuring device 20 can measure a measurement object. For example, the measuring device 20 can measure the characteristics of the measurement object. The characteristics of the measurement object can include, for example, at least one of the position of the measurement object, the shape of the measurement object, the distance between the measuring device 20 and the measurement object, the direction of the measurement object observed from the measuring device 20, the reflectivity of the measurement object, the transmittance of the measurement object, the temperature of the measurement object, the internal structure of the measurement object, and the surface roughness of the measurement object.

[0151] In the following description, an example in which the measuring device 20 measures at least the position of the measurement object will be used for explanation. The position of the measurement object can include the position of the surface of the measurement object. The position of the surface of the measurement object can include the position of at least a part of the surface of the measurement object. In addition, the position of the measurement object can also refer to the position of the measurement object in the machine coordinate system used as a reference in the processing system SYS (i.e., the absolute position). Alternatively, the position of the measurement object can also refer to the position of the measurement object relative to the measuring device 20 (i.e., the relative position). Alternatively, the position of the measurement object can also refer to the position of the measurement object in the measurement coordinate system described later, which is used in the measuring device 20 as a coordinate system different from the machine coordinate system.

[0152] In addition, as will be described in detail later, in the present embodiment, in order to measure the position of the measurement object, the measuring device 20 measures the distance between the measuring device 20 and the measurement object (specifically, the distance between the measurement head 22 described later and the measurement object), and the measurement control device 24 calculates the position of the measurement object based on the distance. Therefore, the operation of measuring at least the position of the measurement object can also be substantially regarded as an operation of measuring the distance from the measurement head 22 to the measurement object required to calculate the position of the measurement object.

[0153] The position of the surface of the measurement object changes depending on the shape of the surface of the measurement object. Therefore, the operation of measuring the position of the measurement object can also be regarded as equivalent to the operation of measuring the shape of the measurement object. The shape of the measurement object can include at least one of the one-dimensional shape, two-dimensional shape, and three-dimensional shape of the measurement object.

[0154] The measurement object can include, for example, a workpiece W processed by the processing head 11. The measurement object can also include, for example, any object placed on the stage 141. Any object placed on the stage 141 can include, for example, the workpiece W. The measurement object can also include a reference member FM used in the movement error calculation operation described later. The measurement object can also include, for example, the stage 141.

[0155] The measuring device 20 can be capable of measuring a measurement object in a non-contact manner. The measuring device 20 can also be capable of measuring a measurement object optically. The measuring device 20 can also be capable of measuring a measurement object electrically. The measuring device 20 can also be capable of measuring a measurement object magnetically. The measuring device 20 can also be capable of measuring a measurement object thermally. The measuring device 20 can also be capable of measuring a measurement object acoustically. The measuring device 20 can also be capable of measuring a measurement object using a probe that physically contacts the measurement object.

[0156] In the following description, an example in which the measuring device 20 can optically measure a measurement object will be used for the description. In this case, the measuring device 20 may also be referred to as an optical measuring device. Specifically, in the following description, an example will be used in which the measuring device 20 measures a measurement object by irradiating the measurement object with measurement light ML and receiving at least a part of the light from the measurement object irradiated with the measurement light ML. The light from the measurement object irradiated with the measurement light ML is light from the measurement object generated by the irradiation of the measurement light ML. In the following description, the light that enters the measuring device 20 (i.e., the light received by the measuring device 20) among the light from the measurement object irradiated with the measurement light ML is referred to as "return light RL".

[0157] In addition, the light from the measurement object generated by the irradiation of the measurement light ML may include specularly reflected light generated in the measurement object by the irradiation of the measurement light ML. The light from the measurement object generated by the irradiation of the measurement light ML may also include, in addition to or instead of the specularly reflected light, diffusely reflected light generated in the measurement object by the irradiation of the measurement light ML. The light from the measurement object generated by the irradiation of the measurement light ML may also include, in addition to or instead of at least one of the specularly reflected light and the diffusely reflected light, diffracted light generated in the measurement object by the irradiation of the measurement light ML.

[0158] In the present embodiment, in order to optically measure a measurement object, the measuring device 20 may, for example, also include a measurement light source 21, a measurement head 22, and an output interface 23. In addition, the structure and operation of the measuring device 20 will be described in detail later, and an outline thereof will be briefly described here. The measurement light source 21 can generate the measurement light ML. The measurement head 22 is assembled on the processing head 11. That is, the measurement head 22 is disposed on the processing head 11. The measurement head 22 assembled on the processing head 11 may also be fixed to the processing head 11. The measurement head 22 assembled on the processing head 11 may also be detachable from the processing head 11. In addition, in Figure 1In order to simplify the drawings, the measuring head 22 assembled on the machining head 11 is not shown, but the measuring head 22 assembled on the machining head 11 is shown in Figure 5 to Figure 6 etc., for a detailed description of the structure and operation of the measuring device 20 later. The measuring head 22 irradiates the measurement object with the measurement light ML. Further, the measuring head 22 receives the return light RL from the measurement object irradiated with the measurement light ML. In addition, the measuring head 22 may also be referred to as an optical device. The output interface 23 can output the measurement result of the measuring head 22 on the measurement object (that is, the light reception result of the return light RL from the measurement object) to the measurement control device 24.

[0159] In addition, the measuring device 20 may not include the measurement light source 21. For example, the measurement light source 21 may also be a light source arranged outside the measuring device 20. For example, the measurement light source 21 may be arranged outside the machine tool 1. For example, the measurement light source 21 may be arranged outside the measuring system 2. For example, the measurement light source 21 may be arranged outside the measuring device 20 (typically outside the measuring system 1) and at a specified position inside the machine tool 1. As an example of a specified position outside the measuring device 20 (typically outside the measuring system 1) and inside the machine tool 1, for example, a specified position outside or inside the housing of the machine tool 1 that houses at least one of the machining head 11, the head drive system 12, the stage device 14, and the machining control device 16, etc. can be cited. For example, the measurement light source 21 may be arranged outside the measuring device 20 and at a specified position inside the measuring system 2. As an example of a specified position outside the measuring device 20 and inside the measuring system 2, for example, a specified position outside or inside the housing of the measuring system 2 that houses the measurement control device 24, etc. can be cited. In the above case, the measuring head 22 of the measuring device 20 can also irradiate the measurement object with the measurement light ML generated by the measurement light source 21 arranged outside the measuring device 20.

[0160] In the present embodiment, as will be described in detail later, the measuring head 22 can be assembled on the spindle 111 of the machine tool 1. That is, on the spindle 111, in addition to assembling the tool 113, the measuring head 22 included in the measuring device 20 can also be assembled. In this case, the tool changing device 15 can also function as an assembling device capable of assembling the measuring head 22 on the spindle 111. That is, the tool changing device 15 can also take out the measuring head 22 from a tool magazine (not shown) that houses not only the tool 113 but also the measuring head 22 (or a head magazine (not shown) that houses the measuring head 22 and is different from the tool magazine that houses the tool 113), and assemble the taken-out measuring head 22 on the spindle 111. In addition, the tool changing device 15 can also function as a disassembling device capable of disassembling the measuring head 22 from the spindle 111. That is, the tool changing device 15 can also disassemble the measuring head 22 assembled on the spindle 111 from the spindle 111 and house the disassembled measuring head 22 in a tool magazine or a head magazine not shown. In addition, the measuring head 22 may not be assembled on the spindle 111. For example, the measuring head 22 can also be assembled on the head housing 112.

[0161] The measurement control device 24 controls the operation of the measurement system 2. For example, the measurement control device 24 can also control the measurement device 20 to measure the object to be measured. Furthermore, as described above, since the measuring head 22 is assembled on the machine tool 1 (especially the spindle 111), the head drive system 12 of the machine tool 1 moves the measuring head 22. Therefore, the measurement control device 24 can also control the machine tool 1 (especially the head drive system 12) together with the machining control device 16 to move the measurement device 20 to a desired position. That is, the measurement control device 24 can also control the movement of the machining head 11 together with the machining control device 16. Furthermore, when the object to be measured moves together with the stage 141, the measurement control device 24 can also control the machine tool 1 (especially the stage drive system 142) together with the machining control device 16 to move the object to be measured to a desired position. That is, the measurement control device 24 can also control the movement of the stage 141 together with the machining control device 16.

[0162] In addition, since the measuring head 22 is assembled on the machine tool 1 (spindle 111), the measuring control device 24 may not control the head drive system 12. In such a case, the machining control device 16 may control the head drive system 12. Additionally, since the measuring head 22 is assembled on the machine tool 1 (spindle 111), the machining control device 16 may also not control the head drive system 12. In such a case, the measuring control device 24 may control the head drive system 12. Additionally, the measuring control device 24 may not control the stage drive system 142. In such a case, the machining control device 16 may control the stage drive system 142. Additionally, the machining control device 16 may also not control the stage drive system 142. In such a case, the measuring control device 24 may control the stage drive system 142.

[0163] In the present embodiment, the measuring control device 24 performs a movement error calculation operation. The movement error calculation operation may include the following operations: calculating a movement error (in other words, a motion error) generated during the movement of at least one of the machining head 11 and the stage 141 based on the measurement result of the measuring head 22 on the measurement object. The movement error calculation operation may include the following operations: generating information related to the movement error generated during the movement of at least one of the machining head 11 and the stage 141 as information for controlling the machine tool 1 based on the measurement result of the measuring head 22 on the measurement object. The movement error calculation operation may include the following operations: generating information for controlling the machine tool 1 (particularly information different from the information related to the movement error) based on the calculated movement error (information related to the generated movement error). In such a case, the measuring control device 24 may output the generated information to the machining control device 16. The machining control device 16 may control the machine tool 1 based on the information. In addition, regarding the movement error calculation operation, reference is made to Fig. 9 etc. which will be described in detail later, so the description here is omitted. In addition, the movement error may also be referred to as a spatial accuracy error.

[0164] In addition, the measurement control device 24 that performs the movement error calculation operation may also be referred to as a movement error calculation device, a calculation device, or an arithmetic device. The measurement system 2 including the measurement device 20 and the measurement control device 24 may also be referred to as a movement error calculation system, a calculation system, or an arithmetic system. The system including the measurement control device 24 and the reference member FM (to be described later) for performing the movement error calculation operation may also be referred to as a movement error calculation system, a calculation system, or an arithmetic system. The system including the measurement control device 24 and the reference member FM may also be referred to as the measurement system 2. The system including the reference member FM, the measurement device 20, and the measurement control device 24 may also be referred to as a movement error calculation system, a calculation system, or an arithmetic system. The system including the reference member FM, the measurement device 20, and the measurement control device 24 may also be referred to as the measurement system 2. The system including the measuring head 22 and the measurement control device 24 may also be referred to as the measurement system 2.

[0165] The measurement control device 24 may, for example, also include an arithmetic device and a storage device. The measurement control device 24 including such an arithmetic device may also be referred to as an arithmetic unit. The arithmetic device may include, for example, at least one of a CPU (Central Processing Unit) and a GPU (Graphics Processing Unit). The storage device may include, for example, a memory. The measurement control device 24 functions as a device for controlling the operation of the measurement device 20 by the arithmetic device executing a computer program. Further, as described above, when the measurement control device 24 controls at least a part of the operation of the machine tool 1 (for example, at least one of the head drive system 12 and the stage drive system 142), the measurement control device 24 functions as a device for controlling the operation of the machine tool 1 by the arithmetic device executing a computer program. However, when the measurement control device 24 may not control at least a part of the operation of the machine tool 1, the measurement control device 24 may not function as a device for controlling the operation of the machine tool 1. The computer program is a computer program for causing the arithmetic device to perform (i.e., execute) the operations to be described later that the measurement control device 24 should perform. That is, the computer program is a computer program for causing the measurement control device 24 to function so that the measurement device 20 (and further, the machine tool 1) performs the operations to be described later. The computer program executed by the arithmetic device may be recorded in the storage device (i.e., recording medium) included in the measurement control device 24, or may be recorded in any storage medium (such as a hard disk or a semiconductor memory) built in or externally connectable to the measurement control device 24. Alternatively, the arithmetic device may download the computer program to be executed from a device external to the measurement control device 24 via a network interface. In addition, the measurement control device 24 may not include a storage device.

[0166] The measurement control device 24 may not be provided inside the measurement system 2. For example, the measurement control device 24 may be provided outside the measurement system 2 as a server or the like. In such a case, the measurement control device 24 and the measurement system 2 may be connected via a wired network and / or a wireless network (or a data bus and / or a communication line). As the wired network, for example, a network using an interface in a serial bus manner represented by at least one of IEEE1394, RS-232x, RS-422, RS-423, RS-485, and USB may be adopted. As the wired network, a network using an interface in a parallel bus manner may also be adopted. As the wired network, a network using an interface based on Ethernet (registered trademark) represented by at least one of 10BASE-T, 100BASE-TX, and 1000BASE-T may also be adopted. As the wireless network, a network using radio waves may be adopted. As an example of the network using radio waves, a network based on IEEE802.1x (for example, at least one of wireless LAN and Bluetooth (registered trademark)) may be cited. As the wireless network, a network using infrared rays may also be adopted. As the wireless network, a network using optical communication may also be adopted. In such a case, the measurement control device 24 and the measurement system 2 may also be configured to be able to transmit and receive various information via the network. In addition, the measurement control device 24 may be able to transmit information such as commands or control parameters to the measurement system 2 via the network. The measurement system 2 may include a receiving device that receives information such as commands or control parameters from the measurement control device 24 via the network. The measurement system 2 may include a transmitting device (i.e., an output device that outputs information to the measurement control device 24) that transmits information such as commands or control parameters to the measurement control device 24 via the network. Alternatively, a first control device that performs a part of the processing performed by the measurement control device 24 may be provided inside the measurement system 2, and on the other hand, a second control device that performs another part of the processing performed by the measurement control device 24 may be provided outside the measurement system 2.

[0167] At least a part of the processing performed by the measurement control device 24 may also be performed by the machining control device 16. As an example, the machining control device 16 may also perform at least a part of the movement error calculation operation performed by the measurement control device 24. Conversely, at least a part of the processing performed by the machining control device 16 may also be performed by the measurement control device 24.

[0168] The processing system SYS may also include a control device that can function as the measurement control device 24 and can function as the processing control device 16, instead of the measurement control device 24 and the processing control device 16. That is, the processing system SYS may also include a control device that integrates the measurement control device 24 and the processing control device 16. As an example, the machine tool 1 may also include a control device that can function as the measurement control device 24 and can function as the processing control device 16, instead of the processing control device 16. In this case, the measurement system 2 may or may not include the measurement control device 24. As another example, the measurement system 2 may also include a control device that can function as the measurement control device 24 and can function as the processing control device 16, instead of the measurement control device 24. In this case, the machine tool 1 may or may not include the processing control device 16.

[0169] In the measurement control device 24, an operation model that can be constructed by machine learning can be installed by executing a computer program through an arithmetic device. As an example of an operation model that can be constructed by machine learning, for example, an operation model including a neural network (so-called artificial intelligence (AI: Artificial Intelligence)) can be cited. In this case, the learning of the operation model may include the learning of parameters of the neural network (for example, at least one of weights and biases). The measurement control device 24 may also use the operation model to control the operation of the measurement system 2. That is, the operation of controlling the operation of the measurement system 2 may also include the operation of controlling the operation of the measurement system 2 using the operation model. In addition, in the measurement control device 24, an operation model constructed and completed by offline machine learning using teacher data can also be installed. In addition, the operation model installed in the measurement control device 24 can also be updated by online machine learning on the measurement control device 24. Or, the measurement control device 24 may control the operation of the measurement system 2 based on or instead of the operation model installed in the measurement control device 24, using the operation model installed in an external device of the measurement control device 24 (especially a device provided outside the measurement system 2).

[0170] In addition, as a recording medium for recording a computer program executed by the measurement control device 24, at least one of optical discs such as CD-ROM, CD-R, CD-RW, floppy disks, MO, DVD-ROM, DVD-RAM, DVD-R, DVD+R, DVD-RW, DVD+RW, and Blu-ray (registered trademark), magnetic media such as magnetic tapes, magneto-optical disks, semiconductor memories such as USB memories, and any other medium capable of storing a program can be used. The recording medium may include a device capable of recording a computer program (for example, a general-purpose device or a dedicated device in which a computer program is installed in a state capable of being executed in at least one of software and firmware). Furthermore, each process or function included in the computer program can be implemented by a logical processing block implemented in the measurement control device 24 by executing the computer program by the measurement control device 24 (i.e., a computer), can also be implemented by hardware such as a prescribed gate array (FPGA (Field Programmable Gate Array), ASIC (Application Specific Integrated Circuit)) included in the measurement control device 24, or can also be implemented in a form in which a logical processing block and a partial hardware module implementing a part of the elements of the hardware are mixed.

[0171] The output device 25 is a device that outputs information to the outside of the measurement system 2. For example, the output device 25 can output information in the form of an image. That is, the output device 25 may include a display device (so-called monitor) capable of displaying an image. For example, the output device 25 can also output information in the form of sound. That is, the output device 25 may also include a sound output device (so-called speaker) capable of outputting sound. For example, the output device 25 can also output information to paper. That is, the output device 25 may also include a printing device (so-called printer) capable of printing desired information on paper. For example, the output device 25 can also output information in the form of data to a recording medium that can be externally connected to the measurement system 2. For example, the output device 25 can also output (i.e., transmit) information in the form of data via a communication line. That is, the output device 25 can also function as a communication device. In addition, the measurement system 2 may not include the output device 25.

[0172] (1-2) Structure of the measuring device 20 (measuring head 22)

[0173] Subsequently, with reference to Figure 5 the structure of the measuring device 20 will be described in more detail. Figure 5 is a cross-sectional view of the processing head 11 in which the measuring device 20 (particularly the measuring head 22) is assembled.

[0174] As Figure 5 shown, the measuring head 22 is assembled on the processing head 11. Specifically, the measuring head 22 includes a head housing 221, and the head housing 221 is assembled on the processing head 11. In Figure 5In the example shown, the measuring head 22 is assembled on the spindle 111 of the machining head 11. That is, the measuring head 22 is assembled on the spindle 111 in place of the tool 113. Specifically, the head housing 221 is assembled on the assembly portion 1111 included in the spindle 111. Figure 5 In the example shown, since the spindle 111 includes the assembly portion 1111 formed with the hole 1112, the head housing 221 is assembled on the spindle 111 by inserting (or fitting) the shank 220 having a protruding portion corresponding to the head housing 221 with a shape complementary to the hole 1112 into the hole 1112 of the assembly portion 1111. The assembly portion 1111 can also hold the head housing 221. In such a case, in order to hold the head housing 221, the assembly portion 1111 can also include at least one of a mechanical chuck, a hydraulic chuck, an electrostatic chuck, and a vacuum chuck.

[0175] The head housing 221 (i.e., the measuring head 22) assembled on the assembly portion 1111 can be detached from the assembly portion 1111. That is, the head housing 221 (i.e., the measuring head 22) is assembled on the spindle 111 in a detachable manner. For example, when the measuring head 22 is assembled on the spindle 111, the tool 113 is detached from the spindle 111. On the other hand, when the tool 113 is assembled on the spindle 111, the measuring head 22 is detached from the spindle 111. In addition, as described above, the assembly and disassembly of the head housing 221 and the assembly and disassembly of the tool 113 are performed by the tool changing device 15. However, at least one of the assembly and disassembly of the measuring head 22 with respect to the spindle 111 and the assembly and disassembly of the tool 113 with respect to the spindle 111 can also be manually performed by an operator of the machining system SYS.

[0176] However, the measuring head 22 can also be assembled on a part of the machining head 11 different from the spindle 111. As long as the measuring head 22 can measure the object to be measured, the measuring head 22 can also be assembled on a part of the machining head 11 different from the spindle 111. For example, as shown in the sectional view of the machining head 11 on which the measuring device 20 (particularly the measuring head 22) is assembled, Figure 6 the measuring head 22 can also be assembled on the head housing 112 of the machining head 11. The head housing 221 can also be assembled on the head housing 112 of the machining head 11. The head housing 221 can also be assembled on the machining head 11 at a position away from the rotation axis RX of the spindle 111 in a direction intersecting with the rotation axis RX. Figure 6 In the example shown, the head housing 221 is assembled on the side surface of the head housing 112.

[0177] In the case where the measuring head 22 is assembled to a part of the machining head 11 different from the main spindle 111, the measuring head 22 may also be non-detachable from the machining head 11. That is, the measuring head 22 may also be assembled to the machining head 11 in a non-removable manner. The measuring head 22 may also be kept assembled to the machining head 11 during machining of the workpiece W by the machining head 11 using the tool 113. In addition, the measuring head 22 may always be kept assembled to the machining head 11. However, even in the case where the measuring head 22 is assembled to a part of the machining head 11 different from the main spindle 111, the measuring head 22 may be assembled to the machining head 11 in a removable manner.

[0178] The measuring head 22 may also be assembled to a position fixed relative to the machining head 11. That is, the measuring head 22 may be assembled to the machining head 11 in such a manner that the positional relationship between the machining head 11 and the measuring head 22 is fixed (i.e., does not change). The measuring head 22 may be directly fixedly assembled to the machining head 11. The measuring head 22 may be indirectly fixedly assembled to the machining head 11. For example, the measuring head 22 may be fixed to the other end of a support member whose one end is directly fixed to the machining head 11. Both the state where the measuring head 22 is directly fixed to the machining head 11 and the state where the measuring head 22 is directly fixed to the machining head 11 correspond to the state where the measuring head 22 is assembled to a position fixed relative to the machining head 11. In addition, when the measuring head 22 is assembled to the machining head 11, generally, the positional relationship between the machining head 11 and the measuring head 22 is fixed as long as the measuring device 20 does not include a drive system for moving the measuring head 22 independently of the machining head 11. In addition, in the case where the measuring head 22 is assembled to the main spindle 111 of the machining head 11, since the main spindle 111 can rotate about the rotation axis RX, when the measuring head 22 is assembled to the main spindle 111, a mechanical fixing mechanism or the like may be used to lock the rotation of the main spindle 111.

[0179] However, the measuring head 22 may not be assembled at a position where the positional relationship with the machining head 11 is fixed. The positional relationship between the machining head 11 and the measuring head 22 may also be variable. The measuring device 20 may also include a drive system for moving the measuring head 22 independently of the machining head 11. For example, the drive system may also be configured to relatively move the machining head 11 and the measuring head 22 along the rotation axis RX. In the case where the measuring head 22 is assembled on the head housing 112 of the machining head 11 as described above, during the machining in which the machining head 11 machines the workpiece W using the tool 113, the measuring head 22 may interfere with the machining of the workpiece W. Specifically, for example, if the measuring head 22 contacts the workpiece W (or other object) before the tool 113 contacts the workpiece W, the tool 113 cannot contact the workpiece W, and as a result, the measuring head 22 will interfere with the machining of the workpiece W. Therefore, the positional relationship between the machining head 11 and the measuring head 22 during at least a part of the measuring period in which the measuring device 20 measures the measurement object and the positional relationship between the machining head 11 and the measuring head 22 during at least a part of the machining period in which the machining head 11 machines the workpiece W may also be different. For example, it may also be that during at least a part of the machining period, the positional relationship between the machining head 11 and the measuring head 22 is set to a first relationship in which the measuring head 22 does not interfere with the machining of the workpiece W, and during at least a part of the measuring period, the positional relationship between the machining head 11 and the measuring head 22 is set to a second relationship different from the first relationship (for example, a second relationship in which the measuring device 20 can use the measuring head 22 to measure the measurement object).

[0180] At this time, in the case where the positional relationship between the machining head 11 and the measuring head 22 is variable, the measurement control device 24 may also use the head position measuring device 13 to measure the movement amounts of the machining head 11 and the measuring head 22 along the rotation axis RX respectively. Furthermore, the measurement control device 24 may also measure the movement error along the movement axis in advance, and when calculating the movement error of the machine tool 1 by performing the movement error calculation operation, reflect the movement error measured in advance.

[0181] In addition, the drive system for moving the measuring head 22 is not limited to along the rotation axis RX, and may also be configured to relatively move the machining head 11 and the measuring head 22 along a direction different from the direction along the rotation axis RX.

[0182] When the measuring head 22 is assembled on the machining head 11, the measuring head 22 also moves along with the movement of the machining head 11. That is, the measuring head 22 moves in the same way as the machining head 11. Therefore, the head drive system 12 that moves the machining head 11 can also be regarded as functioning as a head drive system for moving the measuring head 22. In the above case, due to the movement of the measuring head 22, the relative positional relationship between the measuring position where the measuring head 22 performs measurement and the measurement object changes. That is, the measuring position moves relative to the measurement object. The machine tool 1 can move the measuring head 22 by moving the machining head 11 and simultaneously measure the measurement object. Specifically, the machining system SYS can set the measuring position at the desired position of the measurement object by moving the measuring head 22 and simultaneously measure the desired position of the measurement object. However, when the measurement object is the stage 141 or an object placed on the stage 141, the relative positional relationship between the measuring position where the measuring head 22 performs measurement and the measurement object also changes due to the movement of the stage 141. Therefore, when the measuring position can be set at the desired position of the measurement object by moving the stage 141, the machining system SYS can also measure the measurement object without moving the measuring head 22.

[0183] When the measuring head 22 is assembled on the main shaft 111, the measuring head 22 can rotate around the rotation axis RX along with the rotation of the main shaft 111. At this time, the measurement control device 24 can also previously obtain the movement error accompanying the rotational movement of the main shaft 111, and can also reflect the previously measured movement error when calculating the movement error of the machine tool 1 by performing the movement error calculation operation.

[0184] The measuring head 22 further includes an optical system 222. The optical system 222 is housed in the housing space inside the head housing 221. Therefore, the optical system 222 is assembled on the machining head 11 via the head housing 221. If the optical system 222 is housed in the head housing 221 in this way, it is possible to prevent excess substances (such as cutting chips or cutting fluid, etc.) generated during the machining of the workpiece W from adhering to the optical system 222.

[0185] In addition, the measuring head 22 may also include a measurement light source 21. For example, the measurement light source 21 may also be housed in the internal space of the head housing 221. In the above case, it can also be regarded that the measurement light source 21 constitutes a part of the optical system 222. Additionally, the measurement light source 21 may not be assembled on the machining head 11, or may be assembled on a part of the machining head 11 different from the main shaft 111. When the measuring device 202 includes a plurality of measurement light sources 21 (such as the measurement light source 21#1 and the measurement light source 21#2 described later), at least one of the plurality of measurement light sources 21 may not be assembled on the machining head 11, or may be assembled on a part of the machining head 11 different from the main shaft 111.

[0186] The optical system 222 is configured to irradiate the measurement object with the measurement light ML from the measurement light source 21. Further, the optical system 222 is configured to receive the return light RL from the measurement object. Specifically, as shown in the sectional view of the optical system 222 that irradiates the measurement object with the measurement light ML and receives the return light RL from the measurement object, that is Figure 7 as shown, the measurement light ML generated by the measurement light source 21 enters the optical system 222 from the measurement light source 21 via an optical transmission member (not shown) such as an optical fiber. The optical system 222 emits the measurement light ML incident on the optical system 222 toward the measurement object. That is, the optical system 222 irradiates the measurement object with the measurement light ML.

[0187] When the measurement light ML irradiates the measurement object, light is emitted from the measurement object due to the irradiation of the measurement light ML. The light generated due to the irradiation of the measurement light ML may include the reflected light of the measurement light ML irradiated on the measurement object. The light generated due to the irradiation of the measurement light ML may also include the scattered light of the measurement light ML irradiated on the measurement object. The light generated due to the irradiation of the measurement light ML may also include the transmitted light of the measurement light ML irradiated on the measurement object. The light generated due to the irradiation of the measurement light ML may also include the diffracted light of the measurement light ML irradiated on the measurement object.

[0188] At least a part of the light generated due to the irradiation of the measurement light ML enters the optical system 222 as the return light RL from the measurement object. Specifically, the light component traveling along the optical path of the measurement light ML among the light generated due to the irradiation of the measurement light ML enters the optical system 222 as the return light RL. In the said case, the optical path of the measurement light ML emitted from the optical system 222 and incident on the measurement object and the optical path of the return light RL emitted from the measurement object and incident on the optical system 222 may also be the same. That is, the optical path of the measurement light ML between the optical system 222 and the measurement object and the optical path of the return light RL between the optical system 222 and the measurement object may also be the same. As an example, when the measurement light ML is perpendicularly incident on the measurement object, the return light RL may also be light mainly composed of the specular reflection light of the measurement light ML. However, when the measurement light ML is perpendicularly incident on the measurement object, the return light RL may also include light other than the specular reflection light of the measurement light ML (for example, at least one of the diffuse reflection light, scattered light, transmitted light, and diffracted light of the measurement light ML). As another example, when the measurement light ML is obliquely incident (in other words, non-perpendicularly incident) on the measurement object, the return light RL may also be light mainly composed of the diffuse reflection light of the measurement light ML. However, when the measurement light ML is obliquely incident on the measurement object, the return light RL may also include light other than the diffuse reflection light of the measurement light ML (for example, at least one of the specular reflection light, scattered light, transmitted light, and diffracted light of the measurement light ML).

[0189] Here, refer to Figure 8 The structure of the optical system 222 that irradiates the measurement object with the measurement light ML and receives the return light RL will be described in further detail. Figure 8 It is a cross-sectional view showing the structure of the optical system 222.

[0190] As Figure 8 shown, the optical system 222 includes a beam splitter 2221, a beam splitter 2222, a light detector (measurement unit) 2223, a beam splitter 2224, a reflector 2225, a light detector (measurement unit) 2226, a reflector 2227, and a galvanometer mirror 2228.

[0191] In addition, as will be described in detail in the ninth modification example later, at least one of the measurement light source 21, the beam splitters 2221 and 2222, the photodetectors 2223 and 2226, and the mirror 2225 may not be housed in the head housing 221. In other words, at least one of the measurement light source 21, the beam splitters 2221 and 2222, the photodetectors 2223 and 2226, and the mirror 2225 may not be assembled on the machining head 11, or may be assembled on a part of the machining head 11 different from the main shaft 111. At least one of the measurement light source 21, the beam splitters 2221 and 2222, the photodetectors 2223 and 2226, and the mirror 2225 may also be housed in a housing different from the head housing 221 assembled on the main shaft 111 of the machining head 11. In such a case, the housing different from the head housing 221 may not be assembled on the machining head 11, or may be assembled on a part of the machining head 11 different from the main shaft 111, or may be assembled outside or inside a housing that houses at least one of the machining head 11, the head drive system 12, the stage device 14, the measurement device 20, the machining control device 16, and the measurement control device 24 of the machine tool 1. In addition, at least one of the measurement light source 21, the beam splitters 2221 and 2222, the photodetectors 2223 and 2226, and the mirror 2225 is not limited to being disposed inside the machine tool 1, and may be disposed outside the machine tool 1.

[0192] The measurement light ML from the measurement light source 21 is incident on the beam splitter 2221. In the present embodiment, two measurement lights ML respectively generated by two measurement light sources 21 (specifically, the measurement light source 21#1 and the measurement light source 21#2) are incident on the beam splitter 2221. Therefore, the measurement device 20 includes the measurement light source 21#1 and the measurement light source 21#2. The two measurement light sources 21 may respectively emit two measurement lights ML that are phase-synchronized with each other and have interference properties. However, the measurement device 20 may also include a single measurement light source 21.

[0193] The oscillation frequencies of the two measurement light sources 21 are different. Therefore, the two measurement lights ML respectively emitted by the two measurement light sources 21 become two measurement lights ML with different frequencies. When the measurement light source 21 generates pulsed light as the measurement light ML, the two measurement lights ML respectively emitted by the two measurement light sources 21 become two measurement lights ML with different pulse frequencies (for example, the number of pulsed lights per unit time, which is the reciprocal of the emission period of the pulsed light). As an example, the measurement light source 21#1 may emit the measurement light ML with a pulse frequency of 25 GHz, and the measurement light source 21#2 may emit the measurement light ML with a pulse frequency of 25 GHz + α (for example, +100 kHz). In addition, in the following description, the measurement light ML generated by the measurement light source 21#1 is referred to as "measurement light ML#1", and the measurement light ML generated by the measurement light source 21#2 is referred to as "measurement light ML#2". However, the oscillation frequencies of the two measurement light sources 21 may also be the same.

[0194] The measurement light source 21 includes an optical frequency comb light source. The optical frequency comb light source is a light source that can generate light (hereinafter referred to as "optical frequency comb") including frequency components arranged at equal intervals on the frequency axis as pulsed light. In the above case, the measurement light source 21 emits pulsed light including frequency components arranged at equal intervals on the frequency axis as the measurement light ML. However, the measurement light source 21 may also include a light source different from the optical frequency comb light source.

[0195] The two measurement lights ML#1 and ML#2 incident on the beam splitter 2221 are emitted toward the beam splitter 2222. That is, the beam splitter 2221 emits the measurement light ML#1 and the measurement light ML#2 incident on the beam splitter 2221 from different directions toward the same direction (i.e., the direction where the beam splitter 2222 is disposed).

[0196] The beam splitter 2222 emits a part of the measurement light ML#1 incident on the beam splitter 2222, that is, the measurement light ML#1-1, toward the photodetector 2223. The beam splitter 2222 emits another part of the measurement light ML#1 incident on the beam splitter 2222, that is, the measurement light ML#1-2, toward the beam splitter 2224. The beam splitter 2222 emits a part of the measurement light ML#2 incident on the beam splitter 2222, that is, the measurement light ML#2-1, toward the photodetector 2223. The beam splitter 2222 emits another part of the measurement light ML#2 incident on the beam splitter 2222, that is, the measurement light ML#2-2, toward the beam splitter 2224.

[0197] The measurement light ML#1-1 and the measurement light ML#2-1 emitted from the beam splitter 2222 are incident on the photodetector 2223. The photodetector 2223 receives the measurement light ML#1-1 and the measurement light ML#2-1. The photodetector 2223 receives and detects the measurement light ML#1-1 and the measurement light ML#2-1. In addition, the state of "the object receiving light" in the present embodiment may refer to the state of "light being incident on the object". Therefore, the state of "the object receiving light" in the present embodiment may refer to the state of "an object capable of detecting light receiving light", or may also refer to the state of "an object incapable of detecting light receiving light". In particular, the photodetector 2223 receives and detects the interference light generated by the interference of the measurement light ML#1-1 and the measurement light ML#2-1. In addition, the action of receiving the interference light generated by the interference of the measurement light ML#1-1 and the measurement light ML#2-1 can also be regarded as equivalent to the action of receiving the measurement light ML#1-1 and the measurement light ML#2-1. The detection result in the photodetector 2223 (i.e., the light receiving result of the interference light) is output to the measurement control device 24 via the output interface 23 as part of the measurement result of the measurement device 20.

[0198] The measurement light ML#1-2 and the measurement light ML#2-2 emitted from the beam splitter 2222 are incident on the beam splitter 2224. The beam splitter 2224 emits at least a part of the measurement light ML#1-2 incident on the beam splitter 2224 toward the mirror 2225. The beam splitter 2224 emits at least a part of the measurement light ML#2-2 incident on the beam splitter 2224 toward the mirror 2227.

[0199] The measurement light ML#1-2 emitted from the beam splitter 2224 is incident on the mirror 2225. The measurement light ML#1-2 incident on the mirror 2225 is reflected by the reflecting surface of the mirror 2225 (the reflecting surface may also be referred to as the reference surface). Specifically, the mirror 2225 reflects the measurement light ML#1-2 incident on the mirror 2225 toward the beam splitter 2224. That is, the mirror 2225 emits the measurement light ML#1-2 incident on the mirror 2225 as its reflected light, i.e., the measurement light ML#1-3, toward the beam splitter 2224. The measurement light ML#1-3 emitted from the mirror 2225 is incident on the beam splitter 2224. The beam splitter 2224 emits the measurement light ML#1-3 incident on the beam splitter 2224 toward the beam splitter 2222. The measurement light ML#1-3 emitted from the beam splitter 2224 is incident on the beam splitter 2222. The beam splitter 2222 emits the measurement light ML#1-3 incident on the beam splitter 2222 toward the photodetector 2226.

[0200] On the other hand, the measurement light ML#2-2 emitted from the beam splitter 2224 toward the mirror 2227 is incident on the galvanometer mirror 2228 via the mirror 2227. The galvanometer mirror 2228 can change the traveling direction of the measurement light ML#2-2 emitted from the galvanometer mirror 2228 toward the measurement object, so that the irradiation position of the measurement light ML (in this case, the measurement light ML#2-2) on the measurement object changes. Therefore, the galvanometer mirror 2228 can also be referred to as a direction-changing member or a direction-changing device. The galvanometer mirror 2228 may include a scanning mirror 22281 that can be referred to as a reflecting member or a deflecting member. The scanning mirror 22281 is a tilt-angle variable mirror whose angle with respect to the optical path of the measurement light ML#2-2 incident on the scanning mirror 22281 can be changed. The scanning mirror 22281 can change the angle with respect to the optical path of the measurement light ML#2-2 incident on the scanning mirror 22281 by rotating around a rotation axis that intersects the optical path on the incident side of the measurement light ML#2-2 incident on the scanning mirror 22281. In addition, the scanning mirror 22281 can also be tilted or swung around a rotation axis that intersects the optical path on the incident side of the measurement light ML#2-2 incident on the scanning mirror 22281. The scanning mirror 22281 can be such that it can change the traveling direction of the measurement light ML#2-2 by rotating around a first rotation axis that intersects the optical path on the incident side of the measurement light ML#2-2 incident on the scanning mirror 22281, so that the irradiation position of the measurement light ML#2-2 on the measurement object changes along the X axis. The scanning mirror 22281 can also be such that it can change the traveling direction of the measurement light ML#2-2 by rotating around a second rotation axis that intersects the optical path on the incident side of the measurement light ML#2-2 incident on the scanning mirror 22281 and intersects the first rotation axis, so that the irradiation position of the measurement light ML#2-2 on the measurement object changes along the Y axis. Alternatively, the galvanometer mirror 2228 may include a first scanning mirror and a second scanning mirror as the scanning mirror 22281. The first scanning mirror can change the traveling direction of the measurement light ML#2-2 by rotating around the first rotation axis, so that the irradiation position of the measurement light ML#2-2 on the measurement object changes along the X axis. The second scanning mirror can change the traveling direction of the measurement light ML#2-2 by rotating around the second rotation axis, so that the irradiation position of the measurement light ML#2-2 on the measurement object changes along the Y axis. In this case, the second rotation axis of the second scanning mirror may be in a twisted relationship with the first rotation axis of the first scanning mirror.

[0201] The galvanometer mirror 2228 can also change the traveling direction of the measurement light ML#2-2 starting from the pivot point PV of the galvanometer mirror 2228. The pivot point PV can be an imaginary point on the reflecting surface of the scanning mirror 22281. In addition, when the galvanometer mirror 2228 includes a plurality of scanning mirrors 22281, the pivot point PV can also be an imaginary point on the reflecting surface of one scanning mirror 22281 among the plurality of scanning mirrors 22281 that is closest to the measurement object on the optical path of the measurement light ML#2-2. For example, the pivot point can be the center point of the reflecting surface of the scanning mirror 22281. For example, the pivot point can also be the incident point of the measurement light ML#2-2 on the scanning mirror 22281. The pivot point PV can also be the emission point of the measurement light ML#2-2 from the scanning mirror 22281. The pivot point PV can also be a point on the rotation axis of the scanning mirror 22281.

[0202] In addition, the pivot point PV may not be an imaginary point on the reflecting surface of the scanning mirror 22281. For example, the pivot point PV can also be an imaginary point that serves as a reference (starting point) for calculating the distance to the measurement object. In the said case, as an example, the pivot point PV can be a point on the reflecting surface of the scanning mirror 22281 or a specified point of the optical system 222. In addition, there can be a plurality of pivot points PV. For example, the pivot point PV can be on each surface scanned by the measurement light ML#2-2. For example, when the galvanometer mirror 2228 includes a first scanning mirror and a second scanning mirror as described above, the pivot point related to the XZ plane can be on the first rotation axis of the first scanning mirror, and the pivot point PV related to the YZ plane can be on the second rotation axis of the second scanning mirror. In addition, since the pivot point PV can also be said to be a reference of the measuring device 20 (measurement head 22), it can also be called a reference point or a measurement reference point.

[0203] In this way, since the galvanometer mirror 2228 can change the irradiation position of the measurement light ML#2-2 on the measurement object, the measuring device 20 can sequentially irradiate the measurement light ML#2-2 on a plurality of parts of the measurement object. As a result, the measuring device 20 can measure a plurality of parts of the measurement object relatively quickly. That is, the measuring device 20 can perform multi-point measurement of the measurement object. In addition, the plurality of parts sequentially irradiated with the measurement light ML#2-2 on the measurement object may not be arranged in sequence along a specified direction.

[0204] The measurement head 22 irradiates the measurement object with measurement light ML#2-2 that is parallel light. In this case, the optical system 222 can be designed such that the measurement light ML#2-2 emitted from the galvanometer mirror 2228 becomes parallel light. However, as will be described later in the fourth modification example, the measurement head 22 can also irradiate the measurement object with measurement light ML#2-2 that is convergent light. In this case, the optical system 222 can also include a condensing optical system that condenses the measurement light ML#2-2 emitted from the galvanometer mirror 2228. As an example of the condensing optical system, an fθ lens can be cited.

[0205] When the measurement light ML irradiates the measurement object, return light RL is emitted from the measurement object as at least a part of the light generated by irradiating the measurement object with the measurement light ML. The return light RL is incident on the optical system 222 (specifically, the galvanometer mirror 2228). Here, as described above, the return light RL is the light component that travels along the optical path of the measurement light ML among the lights generated due to the irradiation of the measurement light ML. Therefore, between the optical system 222 (especially the galvanometer mirror 2228) and the measurement object, the optical path of the return light RL can also coincide with the optical path of the measurement light ML#2-2. That is, between the optical system 222 and the measurement object, the optical path of the return light RL and the optical path of the measurement light ML#2-2 can also be coaxial. For example, the galvanometer mirror 2228 can irradiate the measurement object with the measurement light ML#2-2 in such a manner that the measurement light ML#2-2 is perpendicularly incident on the measurement object. When the measurement light ML#2-2 is perpendicularly incident on the measurement object, typically, between the optical system 222 and the measurement object, the optical path of the return light RL coincides with the optical path of the measurement light ML#2-2. However, the galvanometer mirror 2228 can also irradiate the measurement object with the measurement light ML#2-2 in such a manner that the measurement light ML#2-2 is obliquely incident on the measurement object. Even in this case, as described above, between the optical system 222 and the measurement object, the optical path of the return light RL mainly composed of the diffuse reflection light of the measurement light ML coincides with the optical path of the measurement light ML#2-2.

[0206] The return light RL incident on the galvanometer mirror 2228 is incident on the photodetector 2226 via the galvanometer mirror 2228, the reflector 2227, the beam splitter 2224, and the beam splitter 222. Therefore, it can also be regarded that the photodetector 2226 receives the return light RL via the galvanometer mirror 2228.

[0207] As described above, in addition to the return light RL, the measurement lights ML#1-3 are also incident on the photodetector 2226. That is, the return light RL that travels through the measurement object and is directed toward the photodetector 2226 and the measurement lights ML#1-3 that are directed toward the photodetector 2226 without passing through the measurement object are incident on the photodetector 2226. In addition, the measurement lights ML#1-3 incident on the photodetector 2226 are used as the reference light RB. Therefore, in the following description, the measurement lights ML#1-3 incident on the photodetector 2226 are referred to as the reference light RB. The photodetector 2226 receives the reference light RB and the return light RL. The photodetector 2226 receives and detects the reference light RB and the return light RL. In particular, the photodetector 2226 receives and detects the interference light generated by the interference of the reference light RB and the return light RL. In addition, the operation of receiving the interference light generated by the interference of the reference light RB and the return light RL is equivalent to the operation of receiving the reference light RB and the return light RL. The detection result of the photodetector 2226 (i.e., the light reception result of the interference light) is output to the measurement control device 24 via the output interface 23 as part of the measurement result of the measurement device 20.

[0208] The measurement control device 24 acquires the detection results of the photodetector 2223 and the photodetector 2226 via the output interface 23. The measurement control device 24 generates measurement data of the measurement object based on the detection results of the photodetector 2223 and the photodetector 2226 (i.e., the measurement result of the measurement device 20).

[0209] In the present embodiment, as described below, the measurement control device 24 can first calculate the distance between the measurement head 22 and the measurement object based on the detection results of the photodetector 2223 and the photodetector 2226. That is, the measurement control device 24 can generate measurement data related to the distance between the measurement head 22 and the measurement object. Further, the measurement control device 24 can also calculate the position of the measurement object based on the distance between the measurement head 22 and the measurement object. That is, the measurement control device 24 can also generate measurement data related to the position of the measurement object. Further, the measurement control device 24 can also calculate the shape of the measurement object based on the position of the measurement object (in particular, the positions of the respective parts of the measurement object). That is, the measurement control device 24 can also generate measurement data related to the shape of the measurement object.

[0210] Specifically, since the pulse frequency of the measurement light ML#1 is different from that of the measurement light ML#2, the pulse frequency of the measurement light ML#1-1 is different from that of the measurement light ML#2-1. Therefore, the interference light of the measurement light ML#1-1 and the measurement light ML#2-1 becomes interference light of pulsed light that appears synchronously with the timing when the pulsed light constituting the measurement light ML#1-1 and the pulsed light constituting the measurement light ML2#2-1 are incident on the photodetector 2223 simultaneously. Similarly, the pulse frequency of the reference light RB is different from that of the return light RL. Therefore, the interference light of the reference light RB and the return light RL becomes interference light of pulsed light that appears synchronously with the timing when the pulsed light constituting the reference light RB and the pulsed light constituting the return light RL are incident on the photodetector 2226 simultaneously. Here, the position (position on the time axis) of the pulsed light of the interference light detected by the photodetector 2226 varies corresponding to the positional relationship between the measurement head 22 and the measurement object (that is, substantially the positional relationship between the processing head 11 and the measurement object). The reason is that the interference light detected by the photodetector 2226 is the interference light of the return light RL that travels toward the photodetector 2226 via the measurement object and the reference light RB that travels toward the photodetector 2226 without passing through the measurement object. On the other hand, the position (position on the time axis) of the pulsed light of the interference light detected by the photodetector 2223 does not vary corresponding to the positional relationship between the measurement head 22 and the measurement object (that is, substantially the positional relationship between the processing head 11 and the measurement object). Therefore, it can be said that the time difference between the pulsed light of the interference light detected by the photodetector 2226 and the pulsed light of the interference light detected by the photodetector 2223 indirectly represents the positional relationship between the measurement head 22 and the measurement object. Specifically, it can be said that the time difference between the pulsed light of the interference light detected by the photodetector 2226 and the pulsed light of the interference light detected by the photodetector 2223 indirectly represents the distance between the measurement head 22 and the measurement object in the direction along the optical path of the measurement light ML emitted from the optical system 222 (that is, the direction along the traveling direction of the measurement light ML). Therefore, the measurement control device 24 can calculate the distance between the measurement head 22 and the measurement object in the direction along the optical path of the measurement light ML emitted from the optical system 222 based on the time difference between the pulsed light of the interference light detected by the photodetector 2226 and the pulsed light of the interference light detected by the photodetector 2223.

[0211] Furthermore, since the irradiation position of the measurement light ML#2-2 on the measurement object is determined by the driving state of the galvanometer mirror 2228, the measurement control device 24 can calculate the direction of the irradiated portion relative to the measurement head 22 (e.g., the direction of the irradiated portion relative to the pivot point PV) based on information related to the driving state of the galvanometer mirror 2228. That is, the measurement control device 24 can calculate the direction in which the measurement light ML#2-2 is emitted from the measurement head 22 as the direction of the irradiated portion relative to the measurement head 22 based on information related to the driving state of the galvanometer mirror 2228. As an example of the information related to the driving state of the galvanometer mirror 2228, information related to the rotation angle of the scanning mirror 22281 included in the galvanometer mirror 2228 can be cited. Here, the galvanometer mirror 2228 may also include a rotation angle detector for detecting the rotation angle of the scanning mirror 22281. As such a rotation angle detector, for example, at least one of a rotary encoder and an angle detection device that optically detects the angle by irradiating the scanning mirror 22281 with light can also be used. Furthermore, if the movement error is corrected, the measurement control device 24 can use the head position measurement device 13 capable of measuring the position of the processing head 11 (measurement head 22) to determine the position of the measurement head 22 in the machine coordinate system. As a result, the measurement control device 24 can calculate the position of the irradiated portion in the machine coordinate system (e.g., the position in a three-dimensional coordinate space) based on the distance between the measurement head 22 and the irradiated portion, the direction of the irradiated portion relative to the measurement head 22, and the position of the measurement head 22 in the machine coordinate system. That is, the measurement control device 24 can generate measurement data representing the position of the irradiated portion in the machine coordinate system.

[0212] The measurement head 22 can also irradiate measurement light ML#2-2 to multiple parts of the measurement object. For example, the galvanometer mirror 2228 can also change the irradiation position of the measurement light ML#2-2 on the measurement object so that the measurement head 22 irradiates measurement light ML#2-2 to multiple parts of the measurement object. For example, at least one of the processing head 11 (measurement head 22) and the stage 141 can also move so that the measurement head 22 irradiates measurement light ML#2-2 to multiple parts of the measurement object. When the measurement light ML#2-2 irradiates multiple parts of the measurement object, the measurement control device 24 can generate measurement data representing the positions of the multiple parts of the measurement object. As a result, the measurement control device 24 can generate measurement data representing the shape of the measurement object based on the measurement data representing the positions of the multiple parts. For example, the measurement control device 24 can generate measurement data representing the shape of the measurement object by calculating a three-dimensional shape, that is, a three-dimensional shape composed of an imaginary plane (or curved surface) formed by connecting the multiple parts whose positions have been determined.

[0213] In addition, in this way, the measuring device 20 can measure the object to be measured by irradiating the object to be measured with the measuring light ML and receiving the return light RL from the object to be measured irradiated with the measuring light ML. In particular, in the above example, the measuring device 20 can measure the object to be measured by receiving the interference light of the return light RL and the reference light RB. Therefore, the measuring device 20 can also be regarded as an interference-type measuring device. However, as long as the object to be measured can be measured, the measuring device 20 does not have to be an interference-type measuring device. For example, the measuring device 20 can also be a triangulation-type measuring device. The measuring device 20 can also be a stereoscopic-type measuring device. The measuring device 20 can also be a phase-shift method measuring device. The measuring device 20 can also be a confocal-type measuring device. The measuring device 20 can also be a Time of Flight (ToF)-type measuring device. The measuring device 20 can also be a Frequency Modulated Continuous Wave (FMCW)-type measuring device.

[0214] (2) Movement error calculation operation

[0215] Next, the movement error calculation operation performed by the measurement control device 24 will be described.

[0216] (2-1) Overview of the motion error calculation operation

[0217] As described above, the movement error calculation operation is an operation for calculating the movement error generated during the movement of at least one of the processing head 11 and the stage 141 based on the measurement result obtained by the measurement head 22. As described above, the measurement head 22 receives the interference light of the reference light RB and the return light RL. Therefore, the movement error calculation operation can also be regarded as an operation for calculating the movement error generated during the movement of at least one of the processing head 11 and the stage 141 based on the light reception result of the interference light of the reference light RB and the return light RL.

[0218] As an example, the movement error of the processing head 11 may include an error equivalent to the difference (i.e., offset) between the actual position and the target position of the processing head 11: the actual position of the processing head 11 is the position of the processing head 11 when the head drive system 12 moves the processing head 11 based on a drive control signal for controlling the head drive system 12 to move the processing head 11 (spindle 111) to a desired target position. In addition, in the following description, the drive control signal for controlling the head drive system 12 is referred to as the head drive control signal. When the processing head 11 can translate along a translation axis, the movement error of the processing head 11 may include an error equivalent to the difference (i.e., offset) between the actual position and the target position of the processing head 11: the actual position of the processing head 11 is the position of the processing head 11 when the head drive system 12 moves the processing head 11 to translate along the translation axis based on the head drive control signal for controlling the head drive system 12 to move the processing head 11 to a desired target position. That is, the movement error of the processing head 11 may also include the movement error generated during the translational movement of the processing head 11. When the processing head 11 can rotate about a rotation axis, it may include an error equivalent to the difference (i.e., offset) between the actual position and the target position of the processing head 11: the actual position of the processing head 11 is the position of the processing head 11 when the head drive system 12 rotates the processing head 11 about the rotation axis based on the head drive control signal for controlling the head drive system 12 to move the processing head 11 to a desired target position. That is, the movement error of the processing head 11 may also include the movement error generated during the rotational movement of the processing head 11.

[0219] The movement error of the stage 141 may include an error equivalent to the difference (i.e., offset) between the actual position of the stage 141 and the target position of the stage 141: the actual position of the stage 141 is the position of the stage 141 when the stage driving system 142 moves the stage 141 based on a drive control signal for controlling the stage driving system 142 to move the stage 141 to a desired target position. In addition, in the following description, the drive control signal for controlling the stage driving system 142 is referred to as a stage drive control signal. When the stage 141 can move along a translation axis, the error may include an error equivalent to the difference (i.e., offset) between the actual position of the stage 141 and the target position of the stage 141: the actual position of the stage 141 is the position of the stage 141 when the stage driving system 142 moves the stage 141 in a translational movement along the translation axis based on a stage drive control signal for controlling the stage driving system 142 to move the stage 141 to a desired target position. That is, the movement error of the stage 141 may also include a movement error generated in the translational movement of the stage 141. When the stage 141 can rotate about a rotation axis, the error may include an error equivalent to the difference (i.e., offset) between the actual position of the stage 141 and the target position of the stage 141: the actual position of the stage 141 is the position of the stage 141 when the stage driving system 142 rotates the stage 141 about the rotation axis based on a stage drive control signal for controlling the stage driving system 142 to move the stage 141 to a desired target position. That is, the movement error of the stage 141 may also include a movement error generated in the rotational movement of the stage 141.

[0220] Here, in a situation where a movement error of the machining head 11 occurs and the movement error of the machining head 11 is not corrected, even if the head driving system 12 moves the machining head 11 based on a head drive control signal for controlling the head driving system 12 to move the machining head 11 to a desired target position, the machining head 11 may move to a position different from the desired target position due to the movement error. Therefore, the machine tool 1 may not be able to move the machining head 11 with good accuracy. As a result, the machine tool 1 may not be able to machine the workpiece W placed on the stage 141 with good accuracy. Further, in a case where the measuring head 22 or a later-described measuring head 22d-1 is assembled on the machining head 11, since the measuring head 22 or the later-described measuring head 22d-1 assembled on the machining head 11 may not move with good accuracy, the measuring system 2 may not be able to appropriately measure the workpiece W placed on the stage 141.

[0221] Similarly, in a situation where a movement error of the stage 141 has occurred and the movement error of the stage 141 has not been corrected, even if the stage driving system 142 moves the stage 141 based on a stage driving control signal for controlling the stage driving system 142 to move the stage 141 to a desired target position, the stage 141 may move to a position different from the desired target position due to the movement error. Therefore, the machine tool 1 may not be able to move the stage 141 with good accuracy. As a result, the machine tool 1 may not be able to machine the workpiece W placed on the stage 141 with good accuracy. Further, in a case where the measuring head 22 or a measuring head 22d-1 described later is assembled on the machining head 11, the measuring system 2 may not be able to appropriately measure the workpiece W placed on the stage 141.

[0222] Therefore, in the present embodiment, the processing system SYS can calculate the movement error by performing a movement error calculation operation, and move at least one of the processing head 11 and the stage 141 to correct (e.g., cancel) the movement error. That is, the processing system SYS can control the movement of the processing head 11 so that the processing head 11 moves in the same manner as when no movement error of the processing head 11 occurs even when a movement error of the processing head 11 occurs. The processing system SYS can control the movement of the stage 141 so that the stage 141 moves in the same manner as when no movement error of the stage 141 occurs even when a movement error of the stage 141 occurs. As a result, when the head drive system 12 moves the processing head 11 based on a head drive control signal for controlling the head drive system 12 to move the processing head 11 to a desired position, the head drive system 12 can accurately move the processing head 11 to the desired position. Therefore, compared with the case where the movement error calculation operation is not performed, the machine tool 1 can move the processing head 11 with good accuracy. As a result, compared with the case where the movement error calculation operation is not performed, the machine tool 1 can machine the workpiece W with good accuracy. Further, when the measuring head 22 or the measuring head 22d-1 described later is assembled on the processing head 11, compared with the case where the movement error calculation operation is not performed, the measuring system 2 can appropriately measure the workpiece W placed on the stage 141. Similarly, when the stage drive system 142 moves the stage 141 based on a stage drive control signal for controlling the stage drive system 142 to move the stage 141 to a desired position, the stage drive system 142 can accurately move the stage 141 to the desired position. Therefore, compared with the case where the movement error calculation operation is not performed, the machine tool 1 can move the stage 141 with good accuracy. As a result, compared with the case where the movement error calculation operation is not performed, the machine tool 1 can machine the workpiece W with good accuracy. Further, when the measuring head 22 or the measuring head 22d-1 described later is assembled on the processing head 11, compared with the case where the movement error calculation operation is not performed, the measuring system 2 can appropriately measure the workpiece W placed on the stage 141.

[0223] The processing system SYS can perform the movement error calculation operation before the machine tool 1 starts machining the workpiece W. In such a case, after the machine tool 1 starts machining the workpiece W, the machine tool 1 can move at least one of the processing head 11 and the stage 141 to correct (e.g., cancel) the movement error calculated in the movement error calculation operation. Therefore, the machine tool 1 can move the processing head 11 with good accuracy. That is, the machine tool 1 can machine the workpiece W with good accuracy.

[0224] However, the machining system SYS can also perform the movement error calculation operation during at least a part of the period when the machine tool 1 is machining the workpiece W. In other words, the machining system SYS can also perform the movement error calculation operation after the machine tool 1 starts machining the workpiece W. In other words again, the machining system SYS can also perform the movement error calculation operation during at least a part of the period from when the machine tool 1 starts machining the workpiece W to when the machine tool 1 finishes machining the workpiece W. Furthermore, the machining system SYS can also perform the movement error calculation operation after the machine tool 1 finishes machining the machined workpiece W.

[0225] In the present embodiment, in order to calculate the movement error, as Fig. 9 shown, the measuring head 22 irradiates the reference member FM with the measuring light ML and receives the return light RL from the reference member FM. Then, the measurement control device 24 calculates the distance between the measuring head 22 and the reference member FM based on the measurement result in the measuring head 22 (i.e., the light receiving result of the interference light of the reference light RB and the return light RL). Then, the measurement control device 24 calculates the movement error based on the distance between the measuring head 22 and the reference member FM. In addition, a specific example of the operation of calculating the movement error based on the distance between the measuring head 22 and the reference member FM will be described in detail later.

[0226] In Fig.10 (a) and Fig.10 (b) of Fig.10 (a) and Fig.10 (b) of

[0227] In the present embodiment, a plurality of reference members FM can be further arranged on the workpiece W and the stage 141. In the example shown in Fig.10 (a) and Fig.10 (b) of

[0228] A plurality of reference members FM can also be arranged on the workpiece W and the stage 141 in such a way that at least N (where N is a constant representing an integer of 1 or more) reference members FM are included within the measurement range of the measuring head 22 at an arbitrary position within the machine coordinate system. A plurality of reference members FM can be arranged on the workpiece W and the stage 141 in such a way that at least N reference members FM are included within the measurement range of the measuring head 22 that can move within the machine coordinate system. In addition, the measurement range of the measuring head 22 can refer to an area that can be scanned by the measurement light ML whose traveling direction is changed by the galvanometer mirror 2228. Further, "N" is a variable representing the minimum number of reference members FM included in the measurement range of the measuring head 22, typically a variable representing an integer of 1 or more. In addition, N can also be a variable representing an integer of 4 or more.

[0229] As an example, a plurality of reference members FM can be arranged on the workpiece W and the stage 141 in such a way that at least N first reference members FM are included within the measurement range of the measuring head 22 at a first position within the machine coordinate system. Further, a plurality of reference members FM can also be arranged on the workpiece W and the stage 141 in such a way that at least N second reference members FM are included within the measurement range of the measuring head 22 at a second position different from the first position within the machine coordinate system. In addition, at least N second reference members FM can be different from at least N first reference members FM. Alternatively, a part of at least N second reference members FM can be the same as a part of at least N first reference members FM. Alternatively, all of at least N second reference members FM can be the same as all of at least N first reference members FM.

[0230] As another example, in a situation where the stage 141 is at a third position within the machine coordinate system, a plurality of reference members FM can also be arranged on the workpiece W and the stage 141 in such a way that at least N third reference members FM are included within the measurement range of the measuring head 22. Further, in a situation where the stage 141 is at a fourth position different from the third position within the machine coordinate system, a plurality of reference members FM can also be arranged on the workpiece W and the stage 141 in such a way that at least N fourth reference members FM are included within the measurement range of the measuring head 22. In addition, at least N fourth reference members FM can be different from at least N third reference members FM. Alternatively, a part of at least N fourth reference members FM can also be the same as a part of at least N third reference members FM. Alternatively, all of at least N fourth reference members FM can be the same as all of at least N third reference members FM.

[0231] As an example of the variable N, 4 can be cited. In such a case, the plurality of reference members FM can be arranged on the workpiece W and the stage 141 in such a manner that at least four reference members FM are included within the measurement range of the measurement head 22 at a desired position within the machine coordinate system. The plurality of reference members FM can also be arranged on the workpiece W and the stage 141 in such a manner that at least four reference members FM are included within the measurement range of the measurement head 22 that moves within the machine coordinate system.

[0232] In addition, one of the reasons for citing 4 as an example of the variable N can be the principle of multi-sided measurement used in the first movement error calculation operation as described later. In such a case, based on the lengths of the lines (i.e., the distances between the measurement head 22 and the reference members FM) connecting the measurement head 22 and the reference points FM, the position of the measurement head 22 is calculated, and the movement error is calculated based on the position of the measurement head 22. In the present embodiment, not only the position of the measurement head 22 but also the position of the reference member FM is an unknown parameter. Therefore, in order to set the minimization problem described later, at least four reference members FM are required. However, depending on the method of setting the minimization problem, the number of reference members FM can also be three or less.

[0233] Here, when the reference members FM are arranged on each of the stage 141 and the workpiece W, the possibility of including at least N reference members FM within the measurement range of the measurement head 22 is higher than when the reference members FM are arranged only on the stage 141.

[0234] For example, Fig.11 (a) of shows the measurement head 22 that irradiates the measurement light ML to the reference member FM above the workpiece W in a state where the reference member FM is arranged on each of the stage 141 and the workpiece W. On the other hand, for example, Fig.11 (b) of shows the measurement head 22 that irradiates the measurement light ML to the reference member FM above the workpiece W in a state where the reference member FM is arranged on the stage 141 but not on the workpiece W. As shown in Fig.11 (b) of, when the reference member FM is not arranged on the workpiece W, the measurement head 22 located above the workpiece W may not be able to irradiate the measurement light ML to the reference member FM arranged on the stage 141. The reason is that, as shown in Fig.11 (b) of, the measurement light ML may be blocked by the workpiece W. On the other hand, as shown in Fig.11 (a) of, when the reference member FM is also arranged on the workpiece W, even when the measurement head 22 located above the workpiece W cannot irradiate the measurement light ML to the reference member FM arranged on the stage 141, the measurement head 22 can irradiate the measurement light ML to the reference member FM arranged on the workpiece W. That is, in the state shown in Fig.11 (a) of, compared with Fig.11 The possibility that at least N reference members FM are included in the measurement range of the measurement head 22 becomes higher compared to the situation shown in (b) of .

[0235] Furthermore, Fig.11 (c) of shows the measurement head 22 that irradiates the reference member FM with the measurement light ML above the workpiece W in a situation where the reference member FM is arranged on the workpiece W but not on the stage 141. In such a case, as Fig.11 shown in (c) of , when the reference member FM is arranged on the workpiece W, even when the measurement head 22 located above the workpiece W cannot irradiate the reference member FM arranged on the stage 141 with the measurement light ML, the measurement head 22 can irradiate the reference member FM arranged on the workpiece W with the measurement light ML. That is, in the situation shown in (c) of , compared with the situation shown in (b) of , the possibility that at least N reference members FM are included in the measurement range of the measurement head 22 becomes higher. Fig.11 the situation shown in (c) of , compared with Fig.11 the situation shown in (b) of , the possibility that at least N reference members FM are included in the measurement range of the measurement head 22 becomes higher.

[0236] In addition, Fig.11 (d) of shows the measurement head 22 that irradiates the reference member FM with the measurement light ML from the side of the workpiece W in a situation where the reference member FM is arranged on the workpiece W but not on the stage 141. In such a case, when the reference member FM is not arranged on the stage 141, depending on the positional relationship between the measurement head 22 and the workpiece W, it is possible that the measurement head 22 located on the side of the workpiece W cannot irradiate the reference member FM arranged on the workpiece W (especially its upper surface) with the measurement light ML. On the other hand, as Fig.11 shown in (e) of , when the reference member FM is also arranged on the stage 141, even when the measurement head 22 located on the side of the workpiece W cannot irradiate the reference member FM arranged on the workpiece W with the measurement light ML, the measurement head 22 can irradiate the reference member FM arranged on the stage 141 with the measurement light ML. That is, in the situation shown in (e) of , compared with Fig.11 the situation shown in (d) of , the possibility that at least N reference members FM are included in the measurement range of the measurement head 22 becomes higher. However, the frequency at which the measurement head 22 irradiates the reference member FM with the measurement light ML from the side of the workpiece W is sometimes lower than the frequency at which the measurement head 22 irradiates the reference member FM with the measurement light ML above the workpiece W. Therefore, even in the situation shown in (d) of , in the situation of "the measurement head 22 irradiates the reference member FM with the measurement light ML above the workpiece W" with a relatively high occurrence frequency, the Fig.11 situation shown in (d) of , the Fig.11 effect that "the possibility that at least N reference members FM are included in the measurement range of the measurement head 22 becomes higher" can be enjoyed in the situation of "the measurement head 22 irradiates the reference member FM with the measurement light ML above the workpiece W" with a relatively high occurrence frequency. Fig.11The configuration of the reference member FM shown in (c) is beneficial, and this has not changed. It can be said that Fig.11 (e) emphasizes the additional effect that can be achieved by arranging the reference member FM on both the stage 141 and the workpiece W in the situation where "the measuring head 22 irradiates the reference member FM with the measuring light ML on the side of the workpiece W" which does not occur very frequently.

[0237] Returning again to Fig.10 (a) and Fig.10 (b), the reference member FM can be directly arranged on the stage 141 or the workpiece W. Alternatively, the reference member FM can also be arranged on the stage 141 or the workpiece W via a support member capable of supporting the reference member FM. That is, the reference member FM can also be indirectly arranged on the stage or the workpiece W via the support member. Specifically, the support member that supports the reference member FM can be directly arranged on the stage 141 or the workpiece W. As an example of the support member capable of supporting the reference member FM, a jig can be cited. In Fig.10 the example shown in (b), each reference member FM is arranged on the stage 141 or the workpiece W via a rod-shaped support member. In addition, the member including the reference member FM and the support member that supports the reference member FM can also be referred to as the reference member FM.

[0238] The plurality of reference members FM can include at least two reference members FM arranged at at least two different positions along the X-axis of the machine coordinate system. That is, the plurality of reference members FM can include at least two reference members FM with different positions along the X-axis of the machine coordinate system. In other words, the plurality of reference members FM can include at least two reference members FM separated from each other along the X-axis of the machine coordinate system. For example, at least two reference members FM separated from each other along the X-axis of the machine coordinate system can be arranged on the workpiece W. For example, at least two reference members FM separated from each other along the X-axis of the machine coordinate system can be arranged on the stage 141. For example, at least one reference member FM arranged on the workpiece W and at least one reference member FM arranged on the stage 141 can be separated from each other along the X-axis of the machine coordinate system.

[0239] The plurality of reference members FM may also include at least two reference members FM respectively arranged at at least two different positions along the Y-axis of the mechanical coordinate system. That is, the plurality of reference members FM may also include at least two reference members FM with different positions along the Y-axis of the mechanical coordinate system. In other words, the plurality of reference members FM may also include at least two reference members FM separated from each other along the Y-axis of the mechanical coordinate system. For example, at least two reference members FM separated from each other along the Y-axis of the mechanical coordinate system may also be arranged on the workpiece W. For example, at least two reference members FM separated from each other along the Y-axis of the mechanical coordinate system may also be arranged on the stage 141. For example, at least one reference member FM arranged on the workpiece W and at least one reference member FM arranged on the stage 141 may be separated from each other along the Y-axis of the mechanical coordinate system.

[0240] The plurality of reference members FM may also include at least two reference members FM respectively arranged at at least two different positions along the Z-axis of the mechanical coordinate system. That is, the plurality of reference members FM may also include at least two reference members FM with different positions along the Z-axis of the mechanical coordinate system. In other words, the plurality of reference members FM may also include at least two reference members FM separated from each other along the Z-axis of the mechanical coordinate system. Since the Z-axis is the vertical direction, the plurality of reference members FM may also include at least two reference members FM with different heights. For example, at least two reference members FM with different heights may also be arranged on the workpiece W. For example, at least two reference members FM with different heights may also be arranged on the stage 141. For example, the height of at least one reference member FM arranged on the workpiece W and the height of at least one reference member FM arranged on the stage 141 may also be different.

[0241] The height of the reference member FM can be adjusted by a support member (such as a fixture) that supports the reference member FM. For example, at least two reference members FM respectively supported by at least two rod-shaped support members with different lengths (heights) may also be arranged on the workpiece W. For example, at least two reference members FM respectively supported by at least two rod-shaped support members with different lengths (heights) may also be arranged on the stage 141.

[0242] The reference member FM can be a member with known characteristics. For example, the reference member FM can be a member with a known shape. For example, the reference member FM can be a member with known dimensions. For example, the reference member FM can be a member with a known reflectivity (reflectivity distribution). For example, the reference member FM can be a member with a known transmittance (transmittance distribution). For example, the reference member FM can be a retroreflective member capable of retroreflecting the incident measurement light ML. The retroreflective member can be a corner cube or a spherical lens. As an example of the retroreflective member, the reference member FM can be a Spherically Mounted Retroreflector (SMR). In addition, the reference member FM can be referred to as a reflector or a retroreflective member. In addition, the reference member FM can also be referred to as a target. For example, the reference member FM can be a marker. For example, the reference member FM can be an Augmented Reality (AR) tag or a barcode.

[0243] The reference member FM can be a member having at least one feature point within the measurement range of the measurement head 22. Here, the state of having at least one feature point within the measurement range can refer to the state of having at least one feature point within the region corresponding to the measurement range on the surface of the reference member FM. The feature point can be a part of the reference member FM that satisfies the following conditions: the feature point can be distinguished from other parts of the reference member FM outside the feature point. For example, the feature point can be a part of the reference member FM that satisfies the following conditions: the characteristics of the feature point can be distinguished from the characteristics of other parts of the reference member FM outside the feature point. As the feature point, the vertex or corner of a region of the reference member FM that can be distinguished from other regions can be used. As the feature point, the boundary of a region of the reference member FM that can be distinguished from other regions can also be used. In the case of using the reference member FM having at least one feature point within the measurement range of the measurement head 22 like this, it has the advantage of being able to reduce measurement errors.

[0244] (2-2) Specific flow of motion error calculation

[0245] Next, the specific process of the movement error calculation operation will be described. As described above, the movement error includes at least one of the movement error generated during the translational movement of the processing head 11, the movement error generated during the rotational movement of the processing head 11, the movement error generated during the translational movement of the stage 141, and the movement error generated during the rotational movement of the stage 141. Hereinafter, for the sake of convenience of explanation, the first movement error calculation operation for calculating the movement error generated during the translational movement of at least one of the processing head 11 and the stage 141, and the second movement error calculation operation for calculating the movement error generated during the rotational movement of at least one of the processing head 11 and the stage 141 will be described in sequence.

[0246] (2-2-1) For calculating the movement error generated in the translation movement of at least one of the processing head 11 and the stage 141 Detailed process of calculating the first moving error of the difference

[0247] First, the first movement error calculation operation for calculating the movement error generated during the translational movement of at least one of the processing head 11 and the stage 141 will be described.

[0248] In the case of calculating the movement error generated during the translational movement of the processing head 11 (measurement head 22), each time the processing head 11 makes a translational movement and stops, the measurement head 22 can change the traveling direction of the measurement light ML by using the galvanometer mirror 2228, and irradiate the measurement light ML to each of at least N reference members FM included in the measurement range of the measurement head 22. That is, each time the processing head 11 translates to a plurality of different positions, the measurement head 22 can irradiate the measurement light ML whose traveling direction has been changed by the galvanometer mirror 2228 to each of at least N reference members FM included in the measurement range of the measurement head 22. As a result, each time the processing head 11 makes a translational movement and stops, the measurement head 22 receives the return light RL from each of at least N reference members FM. The measurement control device 24 can calculate the movement error generated during the translational movement of the processing head 11 based on the light reception results of the return light RL from each of at least N reference members FM received by the measurement head 22 each time the processing head 11 translates to a plurality of different positions. In particular, the measurement control device 24 can also calculate the movement error generated during the translational movement of the processing head 11 in the space where the processing head 11 translates to a plurality of different positions based on the light reception results of the return light RL from each of at least N reference members FM received by the measurement head 22 each time the processing head 11 translates to a plurality of different positions.

[0249] In addition, during the translational movement of the processing head 11 (when the processing head 11 is not stopped), the measuring head 22 can also irradiate the measurement light ML to each of at least N reference members FM included in the measurement range of the measuring head 22 by sequentially changing the traveling direction of the measurement light ML using the galvanometer mirror 2228. In such a case, the measurement control device 24 can also calculate the movement error generated during the translational movement of the processing head 11 in the space where the processing head 11 is translated to a plurality of different positions based on the light reception results of the return light RL from each of at least N reference members FM received by the measuring head 22 whenever the processing head 11 is translated to a plurality of different positions.

[0250] In the case of calculating the movement error generated during the translational movement of the stage 141, whenever the stage 141 performs translational movement and stops, the measuring head 22 can irradiate the measurement light ML to each of at least N reference members FM included in the measurement range of the measuring head 22 by using the galvanometer mirror 2228 to change the traveling direction of the measurement light ML. That is, whenever the stage 141 is translated to a plurality of different positions, the measuring head 22 can irradiate the measurement light ML, whose traveling direction has been changed using the galvanometer mirror 2228, to each of at least N reference members FM included in the measurement range of the measuring head 22. As a result, whenever the stage 141 performs translational movement and stops, the measuring head 22 receives the return light RL from each of at least N reference members FM. The measurement control device 24 can calculate the movement error generated during the translational movement of the stage 141 based on the light reception results of the return light RL from each of at least N reference members FM received by the measuring head 22 whenever the stage 141 is translated to a plurality of different positions. In particular, the measurement control device 24 can calculate the movement error generated during the translational movement of the stage 141 in the space where the stage 141 is translated to a plurality of different positions based on the light reception results of the return light RL from each of at least N reference members FM received by the measuring head 22 whenever the stage 141 is translated to a plurality of different positions.

[0251] In addition, during the translational movement of the stage 141 (that is, when the stage 141 is not stopped), the measuring head 22 can also irradiate the measurement light ML to each of at least N reference members FM included in the measurement range of the measuring head 22 by sequentially changing the traveling direction of the measurement light ML using the galvanometer mirror 2228. In such a case, the measurement control device 24 can also calculate the movement error generated during the translational movement of the stage 141 in the space where the stage 141 is translated to a plurality of different positions based on the light reception results of the return light RL from each of at least N reference members FM received by the measuring head 22 whenever the stage 141 is translated to a plurality of different positions.

[0252] In addition, when calculating the movement error generated during the translational movement, the workpiece W is placed on the stage 141. For example, when calculating the movement error generated during the translational movement, the workpiece W provided with the reference member FM may also be placed on the stage 141. For example, when calculating the movement error generated during the translational movement, the workpiece W not provided with the reference member FM may also be placed on the stage 141. However, when calculating the movement error generated during the translational movement, the workpiece W may not be placed on the stage 141 either. Hereinafter, for the sake of convenience of explanation, the first movement error calculation operation performed when the workpiece W provided with the reference member FM is placed on the stage 141 will be described. However, even when the workpiece W not provided with the reference member FM is placed on the stage 141 or when the workpiece W is not placed on the stage 141, the processing system SYS can calculate the movement error generated during the translational movement by performing the first movement error calculation operation shown below.

[0253] Hereinafter, with reference to Fig.12 , the flow of the first movement error calculation operation for calculating the movement error generated during the translational movement of at least one of the processing head 11 (measurement head 22) and the stage 141 will be described. Fig.12 is a flowchart showing the flow of the first movement error calculation operation for calculating the movement error generated during the translational movement of at least one of the processing head 11 and the stage 141.

[0254] As Fig.12 shown, first, the measurement control device 24 moves at least one of the processing head 11 and the stage 141 to the initial position within the machine coordinate system and then stops at the initial position (step S101). That is, the measurement control device 24 controls at least one of the head drive system 12 and the stage drive system 142 so that at least one of the processing head 11 and the stage 141 moves to the initial position within the machine coordinate system (step S101). More specifically, under the control of the measurement control device 24, the processing control device 16 controls at least one of the head drive system 12 and the stage drive system 142 so that at least one of the processing head 11 and the stage 141 moves to the initial position within the machine coordinate system (step S101). In addition, in step S101, the measurement control device 24 may also move at least one of the processing head 11 and the stage 141 translationally.

[0255] Specifically, the measurement control device 24 can also move the processing head 11 to an initial head position as an example of an initial position. In such a case, under the control of the measurement control device 24, the processing control device 16 that controls the head drive system 12 generates a head drive control signal for controlling the head drive system 12 to move the processing head 11 to the initial head position based on the initial head position in the machine coordinate system. In addition, the information related to the initial head position for generating the head drive control signal can also be regarded as a command value related to the movement of the processing head 11. The head drive control signal itself can also be regarded as a command value related to the movement of the processing head 11. Then, under the control of the measurement control device 24, the processing control device 16 controls the head drive system 12 based on the generated drive control signal. As a result, the head drive system 12 moves the processing head 11 so that the processing head 11 moves to the initial head position. As a result, the processing head 11 stops at the initial head position after moving to the initial head position.

[0256] However, at this moment, since the movement error of the processing head 11 has not been corrected, the processing head 11 does not necessarily actually lie (i.e., stop) at the initial head position. That is, the actual position of the processing head 11 in the machine coordinate system does not necessarily coincide with the initial head position in the machine coordinate system.

[0257] The initial head position can be the position at the end of the movement range where the processing head 11 can move along the translation axis within the machine coordinate system. For example, the processing head 11 can move along the translation axis (X) and the translation axis (Z) respectively. In such a case, the initial head position can be the position at the +X side end of the movement range where the processing head 11 can move along the translation axis (X) within the machine coordinate system. The initial head position can also be the position at the -X side end of the movement range where the processing head 11 can move along the translation axis (X) within the machine coordinate system. The initial head position can also be the position at the +Z side end of the movement range where the processing head 11 can move along the translation axis (Z) within the machine coordinate system. The initial head position can also be the position at the -Z side end of the movement range where the processing head 11 can move along the translation axis (Z) within the machine coordinate system. Alternatively, as the initial head position, the current position of the processing head 11 can also be used. In such a case, in step S101, the measurement control device 24 does not necessarily have to move the processing head 11. However, the initial head position is not limited to the positions illustrated here.

[0258] The measurement control device 24 can also move the stage 141 to the initial stage position, which is an example of the initial position. In this case, under the control of the measurement control device 24, the processing control device 16 that controls the stage drive system 142 generates a stage drive control signal for controlling the stage drive system 142 to move the stage 141 to the initial stage position based on the initial stage position in the machine coordinate system. In addition, the information related to the initial stage position for generating the stage drive control signal can also be regarded as an instruction value related to the movement of the stage 141. The stage drive control signal itself can also be regarded as an instruction value related to the movement of the stage 141. Then, under the control of the measurement control device 24, the processing control device 16 controls the stage drive system 142 based on the generated drive control signal. As a result, the stage drive system 142 moves the stage 141 so that the stage 141 moves to the initial stage position. As a result, the stage 141 stops at the initial stage position after moving to the initial stage position.

[0259] However, at this moment, since the movement error of the stage 141 has not been corrected, the stage 141 may not actually be located (i.e., stopped) at the initial stage position. That is, the actual position of the stage 141 in the machine coordinate system may not be the same as the initial stage position in the machine coordinate system.

[0260] The initial stage position can be the position at the end of the movement range where the stage 141 can move along the translation axis within the machine coordinate system. For example, the stage 141 can move along the translation axis (Y). In this case, the initial stage position can be the position at the +Y side end of the movement range where the stage 141 can move along the translation axis (Y) within the machine coordinate system. The initial stage position can also be the position at the -Y side end of the movement range where the stage 141 can move along the translation axis (Y) within the machine coordinate system. Alternatively, as the initial stage position, the current position of the stage 141 can also be used. In this case, in step S101, the measurement control device 24 may not have to move the stage 141. However, the initial stage position is not limited to the positions illustrated here.

[0261] Then, the measurement control device 24 performs a global scan (step S102). Specifically, the measurement control device 24 controls the measurement head 22 to perform a global scan (step S102). As a result, the measurement head 22 performs a global scan (step S102).

[0262] As shown in the measurement head 22 that performs a global scan Fig.13As shown, the global scan is an operation of scanning a global scan area GSA corresponding to the measurement range of the measurement head 22 using the measurement light ML. To perform the global scan, the measurement control device 24 controls the galvanometer mirror 2228 of the measurement head 22 to scan the global scan area GSA using the measurement light ML. As a result, the measurement head 22 receives the return light RL from the global scan area GSA. That is, the photodetector 2226 of the measurement head 22 receives the return light RL from the global scan area GSA.

[0263] As described above, when the measurement control device 24 calculates the distance between the measurement object and the measurement head 22, the photodetector 2226 receives the interference light of the return light RL and the reference light RB. On the other hand, when the measurement head 22 performs a global scan, the photodetector 2226 can receive the return light RL but does not receive the reference light RB. That is, the photodetector 2226 may also not receive the interference light of the return light RL and the reference light RB. When the measurement head 22 performs a global scan, the measurement light source 21#1 that generates the measurement light ML#1, which is the reference light RB incident on the photodetector 2226, may also not generate the measurement light ML#1. In other words, the measurement light source 21#1 may also not emit the measurement light ML#1. Alternatively, a light shielding member that shields the measurement light ML#1 may be inserted on the optical path of the measurement light ML#1 between the measurement light source 21#1 and the photodetector 2226.

[0264] Then, the measurement control device 24 calculates the direction of the local scan area LSA with respect to the measurement head 22 based on the result of the global scan (step S103). As Fig.13 shown, the local scan area LSA is the area where the reference member FM is located within the global scan area GSA. Therefore, in step S103, it can be considered that the measurement control device 24 calculates the direction of the reference member FM existing within the global scan area GSA with respect to the measurement head 22 based on the result of the global scan.

[0265] In particular, the local scan area LSA is an area smaller than the global scan area GSA. Therefore, the local scan area LSA is the area where the reference member FM is located within the global scan area GSA and is an area corresponding to a part of the global scan area GSA.

[0266] In order to calculate the direction of the local scanning area LSA, the measurement control device 24 obtains the detection result in the optical detector 2226 (i.e., the light reception result of the return light RL) as the result of the global scanning. Here, there is a high possibility that the intensity of the return light RL when the measurement light ML irradiates the reference member FM is different from the intensity of the return light RL when the measurement light ML does not irradiate the reference member FM. Conversely, the reflectivity (reflectivity distribution) of the reference member FM can be set so that the intensity of the return light RL when the measurement light ML irradiates the reference member FM is different from the intensity of the return light RL when the measurement light ML does not irradiate the reference member FM. Typically, there is a high possibility that the intensity of the return light RL when the measurement light ML irradiates the reference member FM is higher than the intensity of the return light RL when the measurement light ML does not irradiate the reference member FM. Conversely, the reflectivity (reflectivity distribution) of the reference member FM can be set so that the intensity of the return light RL when the measurement light ML irradiates the reference member FM is higher than the intensity of the return light RL when the measurement light ML does not irradiate the reference member FM. In the said case, as an example, the measurement control device 24 can determine the period during which the measurement light ML irradiates the reference member FM based on the detection result in the optical detector 2226 (i.e., the light reception result of the return light RL). That is, the measurement control device 24 can distinguish the period during which the measurement light ML irradiates the reference member FM from the period during which the measurement light ML does not irradiate the reference member FM. Then, the measurement control device 24 can calculate the direction in which the measurement light ML is emitted from the galvanometer mirror 2228 during the period when the measurement light ML irradiates the reference member FM, as the direction of the reference member FM relative to the measurement head 22. That is, the measurement control device 24 can also calculate the direction in which the measurement light ML is emitted from the galvanometer mirror 2228 during the period when the measurement light ML irradiates the reference member FM, as the direction of the local scanning area LSA relative to the measurement head 22. As an example of the information related to the drive state of the galvanometer mirror 2228, the information related to the rotation angle of the scanning mirror 22281 included in the galvanometer mirror 2228 can be cited.

[0267] As described above, when at least N reference members FM are included in the measurement range of the measurement head 22, the measurement control device 24 can calculate the directions of at least N local scanning areas LSA where at least N reference members FM are located respectively. In the present embodiment, an example in which the variable N is set to 4 in the case of performing the first movement error calculation operation will be described. In the said case, the plurality of reference members FM can also be arranged on the workpiece W and the stage 141 in such a manner that at least four reference members FM are included in the measurement range of the measurement head 22. The measurement control device 24 can calculate the directions of at least four local scanning areas LSA where at least four reference members FM are located respectively within the measurement range (i.e., within the global scanning area GSA).

[0268] However, even when the directions of the respective local scanning areas LSA are calculated, the measurement head 22 can receive the interference light of the return light RL (i.e., the return light RL from the reference member FM) from the global scanning area GSA and the reference light RB. In such a case, the measurement control device 24 can calculate the distance between the local scanning area LSA where the reference member FM is located and the measurement head 22 based on the light reception result of the interference light of the return light RL and the reference light RB. Then, the measurement control device 24 can calculate the position of the local scanning area LSA in the machine coordinate system based on the calculated distance to the local scanning area LSA, the direction of the local scanning area LSA calculated based on the intensity of the return light RL, and the position of the processing head 11 in the machine coordinate system (i.e., the position of the measurement head 22 assembled on the processing head 11). In addition, the position of the processing head 11 in the machine coordinate system can be obtained from the position measuring device 13 capable of measuring the position of the processing head 11.

[0269] In addition, the number of reference members FM included in the local scanning area LSA is not limited to one. That is, at least two reference members FM may exist in one local scanning area LSA. In such a case, the measurement control device 24 can calculate the direction of the single local scanning area LSA where at least two reference members FM are located. In such a case, the measurement control device 24 may not calculate the directions of the N local scanning areas LSA where the at least N reference members FM are respectively located. For example, when the measurement range of the measurement head 22 includes at least N reference members FM, the measurement control device 24 can calculate the directions of less than N and more than two local scanning areas LSA.

[0270] Then, the measurement control device 24 performs local scanning (step S104). Specifically, the measurement control device 24 controls the measurement head 22 to perform local scanning (step S104). As a result, the measurement head 22 performs local scanning (step S104).

[0271] As shown in the measurement head 22 performing local scanning Fig.14As shown, local scanning is an operation of scanning each of at least four local scanning areas LSA using the measurement light ML. To perform local scanning, the measurement control device 24 scans each of the at least four local scanning areas LSA using the measurement light ML based on the direction of each of the at least four local scanning areas LSA determined in step S103. Specifically, the measurement control device 24 controls the galvanometer mirror 2228 to emit the measurement light ML in the direction of one local scanning area LSA determined in step S103. Further, the measurement control device 24 controls the galvanometer mirror 2228 to scan one local scanning area LSA using the measurement light ML emitted in the direction of one local scanning area LSA determined in step S103. As a result, the measurement head 22 scans one local scanning area LSA using the measurement light ML and receives the return light RL from one local scanning area LSA. That is, the light detector 2226 of the measurement head 22 receives the return light RL from one local scanning area LSA. The measurement control device 24 repeats the above operation the number of times corresponding to the number of local scanning areas LSA.

[0272] Then, the measurement control device 24 calculates the direction of the reference member FM relative to the measurement head 22 based on the result of local scanning (step S105). That is, the measurement control device 24 calculates the direction of each of the at least four reference members FM relative to the measurement head 22 based on the result of local scanning (step S105).

[0273] In order to calculate the directions of at least four reference members FM respectively, the measurement control device 24 acquires the detection result in the optical detector 2226 (i.e., the light reception result of the return light RL) as the result of local scanning. Here, as described above, it is highly likely that the intensity of the return light RL when the measurement light ML irradiates the reference member FM is different from the intensity of the return light RL when the measurement light ML does not irradiate the reference member FM. In such a case, the measurement control device 24 can determine the period during which the measurement light ML for scanning one local scanning area LSA irradiates one reference member FM located in one local scanning area LSA based on the light reception result of the return light RL from one local scanning area LSA. That is, the measurement control device 24 can distinguish the period during which the measurement light ML for scanning one local scanning area LSA irradiates one reference member FM located in one local scanning area LSA from the period during which the measurement light ML for scanning one local scanning area LSA does not irradiate one reference member FM located in one local scanning area LSA. Then, the measurement control device 24 can calculate the direction in which the measurement light ML exits from the galvanometer mirror 2228 during the period when the measurement light ML irradiates one reference member FM located in one local scanning area LSA, as the direction of one reference member FM located in one local scanning area LSA relative to the measurement head 22, based on the information related to the driving state of the galvanometer mirror 2228 during the period when the measurement light ML irradiates one reference member FM located in one local scanning area LSA. The measurement control device 24 repeats the above operation the number of times corresponding to the number of local scanning areas LSA. As a result, the directions of at least four reference members FM respectively relative to the measurement head 22 can be calculated.

[0274] In addition, the scanning pitch of the measurement light ML in the local scanning may also be narrower than the scanning pitch of the measurement light ML in the global scanning. For example, the measurement head 22 may also scan the global scanning area GSA with the measurement light ML at a first scanning pitch. On the other hand, for example, the measurement head 22 may also scan each local scanning area LSA with the measurement light ML at a second scanning pitch that is narrower than the first scanning pitch. In addition, the scanning pitch of the measurement light ML may refer to the interval between a plurality of scanning points (irradiation points) irradiated with the measurement light ML. Since the measurement head 22 receives the return light RL from each scanning point (irradiation point), the scanning pitch of the measurement light ML may also be regarded as equivalent to the period in which the photodetector 2226 detects the return light RL. In the said case, for global scanning, the measurement head 22 may irradiate each of a plurality of scanning points (irradiation points) distributed in a relatively coarse state within the global scanning area GSA that is wider than the local scanning area LSA with the measurement light ML. As a result, the measurement head 22 may roughly search for the position where the reference member FM exists within the global scanning area GSA (i.e., the position of the local scanning area LSA). On the other hand, for local scanning, the measurement head 22 may also irradiate each of a plurality of scanning points (irradiation points) distributed in a relatively dense state within the local scanning area LSA that is narrower than the global scanning area GSA with the measurement light ML. As a result, the measurement head 22 may carefully search for the position where the reference member FM exists within the local scanning area LSA. As a result, compared with the case where the scanning pitch of the measurement light ML in the local scanning is not narrower than the scanning pitch of the measurement light ML in the global scanning, the measurement control device 24 can calculate the direction of the reference member FM more quickly.

[0275] However, the measurement control device 24 may not necessarily perform local scanning. That is, the measurement control device 24 may not perform the operations of steps S103 to S104. In the said case, the measurement control device 24 may also calculate the direction of at least four reference members FM with respect to the measurement head 22 based on the result of the global scanning in step S105. Specifically, the measurement control device 24 acquires the detection result in the photodetector 2226 (i.e., the light reception result of the return light RL) as the result of the global scanning. Here, as described above, it is highly likely that the intensity of the return light RL when the measurement light ML is irradiated onto the reference member FM is different from the intensity of the return light RL when the measurement light ML is not irradiated onto the reference member FM. In the said case, the measurement control device 24 may determine the period during which the measurement light ML is irradiated onto the reference member FM based on the detection result in the photodetector 2226 (i.e., the light reception result of the return light RL). Then, the measurement control device 24 may calculate the direction in which the measurement light ML is emitted from the galvanometer mirror 2228 during the period when the measurement light ML is irradiated onto the reference member FM as the direction of the reference member FM with respect to the measurement head 22 based on the information related to the driving state of the galvanometer mirror 2228 during the period when the measurement light ML is irradiated onto the reference member FM.

[0276] In addition, without performing local scanning, the measurement head 22 can also scan the global scanning area GSA with the measurement light ML at a relatively narrow scanning pitch used in local scanning.

[0277] In addition, in step S105, the measurement control device 24 can also calculate the direction of the reference member FM with respect to the measurement head 22 without using the results of global scanning and local scanning. For example, when the position of the reference member FM in the machine coordinate system is known, the direction of the reference member FM with respect to the measurement head 22 can also be calculated based on its position. In addition, the position of the reference member FM in the machine coordinate system may not be known. For example, when the machine tool 1 includes a camera, the measurement control device 24 can also analyze the image captured by the camera to calculate the direction of the reference member FM with respect to the measurement head 22.

[0278] In addition, in step S105, the measurement control device 24 can calculate the position of each reference member FM on the basis of or instead of calculating the direction of each reference member FM. When calculating the position of each reference member FM, the direction of each reference member FM is determined. Therefore, the operation of calculating the direction of each reference member FM in step S105 may also include the operation of calculating the position of each reference member FM. In order to calculate the position of each reference member FM, the measurement head 22 can receive the interference light of the return light RL (i.e., the return light RL from the reference member FM) from the local scanning area LSA and the reference light RB. In this case, the measurement control device 24 can calculate the distance between the reference member FM and the measurement head 22 based on the light receiving result of the interference light of the return light RL and the reference light RB. Then, the measurement control device 24 can calculate the position of the reference member FM in the machine coordinate system based on the calculated distance to the reference member FM, the direction of the reference member FM calculated according to the intensity of the return light RL, and the position of the processing head 11 in the machine coordinate system (i.e., the position of the measurement head 22 assembled on the processing head 11).

[0279] Then, the measurement control device 24 controls the measurement head 22 to irradiate the reference member FM with the measurement light ML (step S106). That is, the measurement control device 24 controls the measurement head 22 to irradiate each of at least four reference members FM with the measurement light ML (step S106). As a result, the measurement head 22 irradiates each of at least four reference members FM with the measurement light ML (step S106). As a result, the measurement head 22 receives the return light RL from each of at least four reference members FM (step S106).

[0280] In order to measure the measurement light ML irradiated to each of at least four reference members FM, the measurement control device 24 irradiates the measurement light ML to each of the at least four reference members FM based on the direction of each of the at least four reference members FM determined in step S105. Specifically, the measurement control device 24 controls the galvanometer mirror 2228 to emit the measurement light ML toward the direction of one reference member FM determined in step S105. As a result, the measurement head 22 irradiates the measurement light ML to one reference member FM and receives the return light RL from one reference member FM. That is, the photodetector 2226 of the measurement head 22 receives the return light RL from one reference member FM. The measurement control device 24 repeats the above operation the number of times corresponding to the number of reference members FM included in the measurement range of the measurement head 22.

[0281] Then, the measurement control device 24 determines whether to move either the processing head 11 or the stage 141 (step S107). In particular, in step S107, the measurement control device 24 determines whether to translate either the processing head 11 or the stage 141 along the translation axis. Conversely, during the operations of steps S102 to S106, the processing head 11 and the stage 141 do not move respectively. During the operations of steps S102 to S106, the processing head 11 and the stage 141 stop respectively.

[0282] For example, when the number of translational movements of either the processing head 11 or the stage 141 is less than the necessary number of movements, the measurement control device 24 may determine to move either the processing head 11 or the stage 141. For example, when the number of translational movements of either the processing head 11 or the stage 141 has reached or exceeded the necessary number of movements, the measurement control device 24 may determine not to move either the processing head 11 or the stage 141.

[0283] If the determination result in step S107 determines to move either the processing head 11 or the stage 141 (step S107: Yes), the measurement control device 24 moves either the processing head 11 or the stage 141 within the machine coordinate system (step S108). In particular, the measurement control device 24 translates either the processing head 11 or the stage 141 along the translation axis within the machine coordinate system (step S108). For example, the measurement control device 24 may translate the processing head 11 along at least one of the translation axis (X) and the translation axis (Z) within the machine coordinate system. For example, the measurement control device 24 may also translate the stage 141 along the translation axis (Y) within the machine coordinate system on the basis of or instead of translating the processing head 11.

[0284] In step S108, the measurement control device 24 does not simultaneously translate the machining head 11 and the stage 141. For example, in step S108, when the measurement control device 24 translates the machining head 11, it does not translate the stage 141 in parallel with the translation of the machining head 11. On the other hand, in step S108, when the measurement control device 24 translates the stage 141, it does not translate the machining head 11 in parallel with the translation of the stage 141. However, the measurement control device 24 may also simultaneously translate the machining head 11 and the stage 141 in step S108.

[0285] In step S108, the measurement control device 24 can move the machining head 11 in such a way that the machining head 11 moves to a desired head position that has not yet been designated as the movement destination of the machining head 11. As described above, in a state where the machining head 11 is stopped, the measuring head 22 irradiates the reference member FM with the measurement light ML. Therefore, the measurement control device 24 can move the machining head 11 in such a way that the machining head 11 moves to a desired head position that satisfies the following condition, that is, the measuring head 22 has not irradiated the reference member FM with the measurement light ML in a state where the machining head 11 is stopped at the desired head position.

[0286] As an example of the purpose of translating either the machining head 11 or the stage 141 in step S108, it can also be regarded as setting the relative positional relationship between the machining head 11 and the stage 141 to each of at least a plurality of different positional relationships. As a result, as will be described later, the measurement control device 24 can set a plurality of measurement points MP for calculating the movement error, and can appropriately calculate the movement error generated during the translation based on the positions of the plurality of measurement points MP. Furthermore, when either the machining head 11 or the stage 141 is translated in step S108, compared with the case where neither the machining head 11 nor the stage 141 is translated in step S208, the space for calculating the movement error in the machine coordinate system can be expanded. The reason is that as either the machining head 11 or the stage 141 is translated, the measurement point MP is translated in the machine coordinate system. Therefore, as an example of the purpose of translating either the machining head 11 or the stage 141 in step S108, it can also be regarded as expanding the space for calculating the movement error in the machine coordinate system.

[0287] When moving the processing head 11 to the desired head position in the machine coordinate system, under the control of the measurement control device 24, the processing control device 16 that controls the head drive system 12 generates a head drive control signal for controlling the head drive system 12 to move the processing head 11 to the desired head position based on the desired head position in the machine coordinate system. In addition, the information related to the desired head position used to generate the head drive control signal can also be regarded as an instruction value related to the movement of the processing head 11. The head drive control signal itself can also be regarded as an instruction value related to the movement of the processing head 11. Then, under the control of the measurement control device 24, the processing control device 16 controls the head drive system 12 based on the generated head drive control signal. As a result, the head drive system 12 moves the processing head 11 in such a way that the processing head 11 moves to the desired head position. As a result, the processing head 11 stops at the desired head position after moving to the desired head position.

[0288] However, at this moment, since the movement error of the processing head 11 has not been corrected, the processing head 11 may not actually be located (i.e., stopped) at the desired head position. That is, the actual position of the processing head 11 in the machine coordinate system may not be the same as the desired head position in the machine coordinate system.

[0289] In step S108, the measurement control device 24 can move the stage 141 in such a way that the stage 141 moves to a desired stage position that has not been designated as the movement destination of the stage 141. As described above, in the state where the stage 141 is stopped, the measurement head 22 irradiates the reference member FM with the measurement light ML. Therefore, the measurement control device 24 can move the stage 141 to a desired stage position that satisfies the following condition, that is, the condition that the measurement head 22 has not irradiated the reference member FM with the measurement light ML in the state where the stage 141 stops at the desired stage position.

[0290] When moving the stage 141 to the desired stage position in the machine coordinate system, under the control of the measurement control device 24, the processing control device 16 that controls the stage drive system 142 generates a stage drive control signal for controlling the stage drive system 142 to move the stage 141 to the desired stage position based on the desired stage position in the machine coordinate system. In addition, the information related to the desired stage position used to generate the stage drive control signal can also be regarded as an instruction value related to the movement of the stage 141. The stage drive control signal itself can also be regarded as an instruction value related to the movement of the stage 141. Then, under the control of the measurement control device 24, the processing control device 16 controls the stage drive system 142 based on the generated drive control signal. As a result, the stage drive system 142 moves the stage 141 in such a way that the stage 141 moves to the desired stage position. As a result, the stage 141 stops at the desired stage position after moving to the desired stage position.

[0291] However, at this moment, since the movement error of the stage 141 has not been corrected, the stage 141 may not actually be located (i.e., stopped) at the desired stage position. That is, the actual position of the stage 141 in the machine coordinate system may not be the same as the desired stage position in the machine coordinate system.

[0292] Then, the measurement control device 24 calculates the direction of the local scan area LSA with respect to the measurement head 22 (step S109). That is, the measurement control device 24 calculates the direction of at least four local scan areas LSA with respect to the measurement head 22 (step S109). However, in step S109, the measurement control device 24 calculates the direction of the local scan area LSA without using the result of the global scan. That is, after at least one of the processing head 11 and the stage 141 moves in step S108, the measurement control device 24 may not perform the global scan again. As a result, the time required for the movement error calculation operation can be shortened.

[0293] In step S109, the measurement control device 24 calculates the direction of at least four local scan areas LSA with respect to the measurement head 22 after at least one of the processing head 11 and the stage 141 moves in step S108, based on the reference member direction information related to the direction of at least four reference members FM with respect to the measurement head 22 before at least one of the processing head 11 and the stage 141 moves in step S108, and the movement information related to at least one of the movement amount and the movement direction of at least one of the processing head 11 and the stage 141 in step S108. Specifically, the measurement control device 24 can, based on the reference member direction information and the movement information, estimate in which direction a reference member FM that was in one direction with respect to the measurement head 22 before at least one of the processing head 11 and the stage 141 moves in step S108 is located with respect to the measurement head 22 after at least one of the processing head 11 and the stage 141 moves in step S108, thereby calculating the direction of one local scan area LSA with respect to the measurement head 22 after at least one of the processing head 11 and the stage 141 moves in step S108. The reference member direction information can be obtained as a result of the operation in step S105. On the other hand, the movement information can also be generated based on at least one of the head drive control signal and the stage drive control signal. Alternatively, the movement information can also be generated based on the measurement result of at least one of the head position measuring device 13 that measures the position of the processing head 11 and the position measuring device 143 that measures the position of the stage 141. The measurement control device 24 can repeat the above operation the number of times corresponding to the number of local scan areas LSA. As a result, the direction of at least four local scan areas LSA with respect to the measurement head 22 is calculated.

[0294] In addition, by moving at least one of the processing head 11 and the stage 141, the relative positional relationship between the processing head 11 and the stage 141 changes. Specifically, by moving at least one of the processing head 11 and the stage 141, the relative positional relationship between the processing head 11 and the stage 141 changes from the first positional relationship to the second positional relationship. In such a case, the reference member direction information used in step S109 can also be regarded as information related to the directions of at least four reference members FM relative to the measuring head 22 when the relative positional relationship between the processing head 11 and the stage 141 is the first positional relationship. The movement information used in step S109 can also be regarded as information related to at least one of the movement amount and the movement direction of at least one of the processing head 11 and the stage 141 required to change the relative positional relationship between the processing head 11 and the stage 141 from the first positional relationship to the second positional relationship. It can also be regarded that in step S109, based on the reference member direction information and the movement information, the measurement control device 24 calculates (for example, estimates) the directions of at least four local scan areas LSA relative to the measuring head 22 when the relative positional relationship between the processing head 11 and the stage 141 is the second positional relationship.

[0295] However, the measurement control device 24 may also perform a global scan again (step S102) after moving at least one of the processing head 11 and the stage 141 in step S108, and calculate the direction of the local scan area LSA relative to the measuring head 22 based on the result of the global scan (step S103).

[0296] After calculating the direction of the local scan area LSA in step S109 (or step S103), the measurement control device 24 performs a local scan (step S104), and calculates the direction of the reference member FM relative to the measuring head 22 based on the result of the local scan (step S105).

[0297] However, even after at least one of the processing head 11 and the stage 141 moves in step S108, the measurement control device 24 may not necessarily perform a partial scan. That is, the measurement control device 24 may not perform the operations of step S109 and step S104. In such a case, the measurement control device 24 may also, in step S105, based on the reference member direction information and the movement information, calculate the directions of each of at least four reference members FM relative to the measurement head 22 after at least one of the processing head 11 and the stage 141 moves in step S108. Specifically, the measurement control device 24 may, based on the reference member direction information and the movement information, estimate in which direction a reference member FM that was in one direction relative to the measurement head 22 before at least one of the processing head 11 and the stage 141 moved in step S108 is located relative to the measurement head 22 after at least one of the processing head 11 and the stage 141 moves in step S108, and thereby calculate the direction of a reference member FM relative to the measurement head 22 after at least one of the processing head 11 and the stage 141 moves in step S108. The measurement control device 24 repeats the above operation the number of times corresponding to the number of reference members FM. As a result, the directions of each of at least four reference members FM relative to the measurement head 22 are calculated.

[0298] In addition, due to the movement of at least one of the processing head 11 and the stage 141, the relative positional relationship between the processing head 11 and the stage 141 changes. Specifically, due to the movement of at least one of the processing head 11 and the stage 141, the relative positional relationship between the processing head 11 and the stage 141 changes from a first positional relationship to a second positional relationship. In such a case, it can also be considered that in step S105, the measurement control device 24, based on the reference member direction information and the movement information, calculates (for example, estimates) the directions of each of at least four reference members FM relative to the measurement head 22 when the relative positional relationship between the processing head 11 and the stage 141 is the second positional relationship.

[0299] Then, the measurement control device 24 controls the measurement head 22 to irradiate the reference member FM with the measurement light ML (step S106). That is, the measurement control device 24 controls the measurement head 22 to irradiate each of at least four reference members FM with the measurement light ML (step S106). In particular, in step S106, the measurement control device 24 controls the measurement head 22 to irradiate each of at least four reference members FM with the measurement light ML as parallel light (step S106). As a result, the measurement head 22 irradiates each of at least four reference members FM with the measurement light ML (step S106). As a result, the measurement head 22 receives the return light RL from each of at least four reference members FM (step S106).

[0300] Thus, in the present embodiment, every time the processing head 11 moves and stops along the translation axis, the measuring head 22 receives the return light RL from each of at least four reference members FM. In other words, every time the processing head 11 translates along the translation axis to a plurality of different positions, the measuring head 22 receives the return light RL from each of at least four reference members FM. That is, every time the processing head 11 sequentially translates along the translation axis to a plurality of different positions and stops, the measuring head 22 receives the return light RL from each of at least four reference members FM.

[0301] Similarly, in the present embodiment, every time the stage 141 moves and stops along the translation axis, the measuring head 22 receives the return light RL from each of at least four reference members FM. In other words, every time the stage 141 translates along the translation axis to a plurality of different positions, the measuring head 22 receives the return light RL from each of at least four reference members FM. That is, every time the stage 141 sequentially translates along the translation axis to a plurality of different positions and stops, the measuring head 22 receives the return light RL from each of at least four reference members FM. In particular, when the stage 141 moves, the reference member FM disposed on the stage 141 or on the workpiece W placed on the stage 141 also moves. Therefore, it can also be said that every time the stage 141 moves and stops along the translation axis, the measuring head 22 receives the return light RL from each of at least four reference members FM that move as the stage 141 moves.

[0302] When at least one of the processing head 11 and the stage 141 is translated in step S108, in order to eliminate the influence of the backlash component generated during the translation of at least one of the processing head 11 and the stage 141, the measurement control device 24 may also translate at least one of the processing head 11 and the stage 141 in the same moving direction and with the same orientation. For example, the measurement control device 24 may first perform an X scanning movement operation, which repeatedly performs an operation of sequentially moving the processing head 11 by a desired movement amount along the translation axis (X), so that the processing head 11 moves from one end of the movement range where the processing head 11 can move along the translation axis (X) in the machine coordinate system to the other end. Then, the measurement control device 24 may perform a Y stepping movement operation of moving the stage 141 by a specified movement amount along the translation axis (Y) in the second orientation. Then, the measurement control device 24 may alternately repeat the X scanning movement operation and the Y stepping movement operation until the stage 141 moves from one end of the movement range where the stage 141 can move along the translation axis (Y) in the machine coordinate system to the other end. Then, the measurement control device 24 may perform a Z stepping movement operation of moving the processing head 11 by a desired movement amount along the translation axis (Z) in the third orientation. Then, the measurement control device 24 may alternately repeat the X scanning movement operation and the Y stepping movement operation again until the stage 141 moves from one end of the movement range where the stage 141 can move along the translation axis (Y) in the machine coordinate system to the other end. Thereafter, the same operation may be repeated until the processing head 11 moves from one end of the movement range where the processing head 11 can move along the translation axis (Z) in the machine coordinate system to the other end.

[0303] On the other hand, when the determination result in step S107 determines, for example, not to move the processing head 11 and the stage 141 (step S107: No), the measurement control device 24 calculates the actual position of the measurement point MP after the measurement head 22 measures the reference member FM based on the light reception result of the return light RL in step S106 (step S110). That is, the measurement control device 24 calculates the actual position of the measurement head 22 at the time of measuring the reference member FM as the actual position of the measurement point MP based on the light reception result of the return light RL in step S106 (step S110). In the present embodiment, the position of the reference point FP of the measurement head 22 is used as the position of the measurement point MP. That is, in the present embodiment, the position of the reference point FP of the measurement head 22 is used as the position of the measurement head 22. Therefore, in the following description, unless otherwise stated, the position of the measurement head 22 refers to the position of the reference point FP of the measurement head 22. The reference point FP is a part of the measurement head 22 that serves as a reference for calculating the distance between the measurement head 22 and the object to be measured. As an example of the reference point FP of the measurement head 22, the pivot point PV can be cited. In the above case, in step S110, the measurement control device 24 calculates the actual position of the reference point FP of the measurement head 22 based on the light reception result of the return light RL in step S106.

[0304] When the processing head 11 moves, the positional relationship between the processing head 11 and the stage 141 changes. Therefore, when the processing head 11 moves, the positional relationship between the measurement head 22 assembled on the processing head 11 and the stage 141 also changes. Therefore, the positional relationship between the measurement point MP and the stage 141 changes. Similarly, when the stage 141 moves, the positional relationship between the processing head 11 and the stage 141 changes. Therefore, when the stage 141 moves, the positional relationship between the measurement head 22 assembled on the processing head 11 and the stage 141 changes. Therefore, the positional relationship between the measurement point MP and the stage 141 changes. Therefore, the measurement point MP can also be regarded as a point that relatively moves with respect to the stage 141 as at least one of the processing head 11 and the stage 141 moves in step S101 or step S108. The measurement point MP can also be regarded as a point that relatively moves with respect to the workpiece W placed on the stage 141 as at least one of the processing head 11 and the stage 141 moves in step S101 or step S108. The measurement point MP can also be regarded as a point that relatively moves with respect to the reference member FM arranged on the stage 141 as at least one of the processing head 11 and the stage 141 moves in step S101 or step S108. The measurement point MP can also be regarded as a point that relatively moves with respect to the reference member FM on the workpiece W placed on the stage 141 as at least one of the processing head 11 and the stage 141 moves in step S101 or step S108.

[0305] Here, as described above, whenever at least one of the processing head 11 and the stage 141 moves in step S101 or step S108, the measuring head 22 receives the return light RL from at least four reference members FM. Therefore, the measurement control device 24 can calculate the position of the measurement point MP that moves as at least one of the processing head 11 and the stage 141 moves, based on the return light RL from at least four reference members FM received by the measuring head 22 whenever at least one of the processing head 11 and the stage 141 moves in step S101 or step S108. In addition, in the following description, for the sake of convenience of explanation, the measurement point MP whose position is calculated based on the return light RL from at least four reference members FM received by the measuring head 22 after at least one of the processing head 11 and the stage 141 moves to the j-th time in step S101 or step S108 is referred to as the measurement point MP#j. That is, the measurement point MP when the number of times the measuring head 22 performs the action of measuring at least four reference members FM in step S106 is the j-th time is referred to as the measurement point MP#j. In addition, "j" is a variable representing the number of times at least one of the processing head 11 and the stage 141 moves in step S101 or step S108. "j" is a variable representing the number of times the measuring head 22 performs the action of measuring at least four reference members FM in step S106.

[0306] For example, the movement of at least one of the processing head 11 and the stage 141 in step S101 is the first movement. In this case, the measurement control device 24 can calculate the position of the reference point FP of the measuring head 22 as the position of the measurement point MP#1 based on the light reception result of the return light RL received by the measuring head 22 after at least one of the processing head 11 and the stage 141 first moves and stops. Furthermore, the first movement of at least one of the processing head 11 and the stage 141 in step S108 performed thereafter is the second movement. In this case, the measurement control device 24 can calculate the position of the reference point FP of the measuring head 22 as the position of the measurement point MP#2 based on the light reception result of the return light RL received by the measuring head 22 after at least one of the processing head 11 and the stage 141 second moves and stops.

[0307] After that, it will be referred to Fig.17A detailed description will be given. In step S110, in order to calculate the positions of the respective measurement points MP, the measurement control device 24 first calculates the distances between the measurement head 22 located at each measurement point MP and each of at least four reference members FM based on the light reception results of the return lights RL from each of the at least four reference members FM. The measurement control device 24 repeats the operation of calculating the distances the number of times corresponding to the number of measurement points MP (i.e., the number of times at least one of the processing head 11 and the stage 141 moves). Then, the measurement control device 24 calculates the positions of the multiple measurement points MP based on the calculated distances.

[0308] In the following description, an example in which at least one of the processing head 11 and the stage 141 moves J times during the first movement error calculation operation will be described. In this case, in step S110, the measurement control device 24 calculates the positions of the measurement points MP#1 to MP#J respectively.

[0309] In the present embodiment, in the case of performing the first movement error calculation operation, in order to calculate the positions of the measurement points MP#1 to MP#J, the measurement control device 24 can newly form (in other words, define) a measurement coordinate system different from the machine coordinate system within the machine coordinate system. The measurement control device 24 can also calculate the positions of the measurement points MP#1 to MP#J in the measurement coordinate system in step S110.

[0310] As long as it is a coordinate system formed within the machine coordinate system, the measurement coordinate system can be any coordinate system. However, the measurement control device 24 can also generate a measurement coordinate system that can reduce the number of unknown parameters that the measurement control device 24 should calculate in order to calculate the positions of the measurement points MP#1 to MP#J as the measurement coordinate system.

[0311] In Fig.15 an example of the measurement coordinate system is shown. As Fig.15 shown, the measurement control device 24 can also generate a coordinate system with the measurement point MP#1 as the origin as the measurement coordinate system. In this case, as Fig.15 shown, as the position (X p1 , Y p1 , Z p1 ) of the measurement point MP#1 in the measurement coordinate system, the position (0, 0, 0) can be used. As a result, the number of unknown parameters that the measurement control device 24 should calculate in order to calculate the positions of the measurement points MP#1 to MP#J is reduced.

[0312] The measurement control device 24 may also generate a measurement coordinate system in which the axis connecting the measurement point MP#1 and the measurement point MP#2 is the first axis (first measurement coordinate axis). In such a case, the movement of at least one of the processing head 11 and the stage 141 for moving the measurement head 22 from the measurement point MP#1 to the measurement point MP#2 may be a movement based on a drive control signal for moving at least one of the processing head 11 and the stage 141 along any one of the X-axis, Y-axis, and Z-axis (first machine coordinate axis) of the machine coordinate system. In such a case, the first measurement coordinate axis of the measurement coordinate system can be used as an axis corresponding to the first machine coordinate axis of the machine coordinate system. For example, in the case where the processing head 11 is moved based on a head drive control signal for moving the processing head 11 along the X-axis of the machine coordinate system in order to move the measurement head 22 from the measurement point MP#1 to the measurement point MP#2, the measurement control device 24 may generate a coordinate system in which the axis connecting the measurement point MP#1 and the measurement point MP#2 is the X-axis as the measurement coordinate system. For example, in the case where the stage 141 is moved based on a stage drive control signal for moving the stage 141 along the Y-axis of the machine coordinate system in order to move the measurement head 22 from the measurement point MP#1 to the measurement point MP#2, the measurement control device 24 may also generate a coordinate system in which the axis connecting the measurement point MP#1 and the measurement point MP#2 is the Y-axis as the measurement coordinate system. For example, in the case where the processing head 11 is moved based on a head drive control signal for moving the processing head 11 along the Z-axis of the machine coordinate system in order to move the measurement head 22 from the measurement point MP#1 to the measurement point MP#2, the measurement control device 24 may also generate a coordinate system in which the axis connecting the measurement point MP#1 and the measurement point MP#2 is the Z-axis as the measurement coordinate system.

[0313] In addition, in the following description, for the sake of convenience of explanation, the following example is used for the explanation: As Fig.15 shown, in order to move the measurement head 22 from the measurement point MP#1 to the measurement point MP#2, the processing head 11 is moved based on a head drive control signal for moving the processing head 11 along the X-axis of the machine coordinate system. As a result, the measurement control device 24 generates a measurement coordinate system in which the axis connecting the measurement point MP#1 and the measurement point MP#2 is the X-axis. In such a case, as Fig.15 shown, as the position (X p2 , Y p2 , Z p2 ) of the measurement point MP#2 in the measurement coordinate system, the position (X p2 , 0, 0) may also be used. That is, the number of unknown parameters that the measurement control device 24 should calculate in order to calculate the positions of the measurement point MP#1 to the measurement point MP#J is reduced.

[0314] The measurement control device 24 can also generate a coordinate system in which an axis orthogonal to the first measurement coordinate axis along the plane including the measurement point MP#1, the measurement point MP#2, and the measurement point MP#3 becomes a second axis (second measurement coordinate axis) as the measurement coordinate system. In this case, the movement of at least one of the processing head 11 and the stage 141 for moving the measurement head 22 from the measurement point MP#2 to the measurement point MP#3 can also be a movement based on the following drive control signal: the drive control signal is for moving at least one of the processing head 11 and the stage 141 along any other axis (second mechanical coordinate axis) orthogonal to the first mechanical coordinate axis and being one of the X-axis, Y-axis, and Z-axis of the mechanical coordinate system, and on the other hand, not moving at least one of the processing head 11 and the stage 141 along the remaining one axis (third mechanical coordinate axis) orthogonal to the first mechanical coordinate axis and being one of the X-axis, Y-axis, and Z-axis of the mechanical coordinate system. In this case, the second measurement coordinate axis of the measurement coordinate system can be used as the axis corresponding to the second mechanical coordinate axis of the mechanical coordinate system. For example, in order to move the measurement head 22 from the measurement point MP#2 to the measurement point MP#3, the stage 141 is moved based on the stage drive control signal for moving the stage 141 along the Y-axis of the mechanical coordinate system, and on the other hand, the processing head 11 is not moved based on the head drive control signal for moving the processing head 11 along the Z-axis of the mechanical coordinate system. In this case, the measurement control device 24 can generate a coordinate system in which an axis orthogonal to the X-axis of the measurement coordinate system along the plane including the measurement point MP#1, the measurement point MP#2, and the measurement point MP#3 becomes the Y-axis as the measurement coordinate system. For example, in order to move the measurement head 22 from the measurement point MP#2 to the measurement point MP#3, the processing head 11 is moved based on the head drive control signal for moving the processing head 11 along the Z-axis of the mechanical coordinate system, and on the other hand, the stage 141 is not moved based on the stage drive control signal for moving the stage 141 along the Y-axis of the mechanical coordinate system. In this case, the measurement control device 24 can generate a coordinate system in which an axis orthogonal to the X-axis of the measurement coordinate system along the plane including the measurement point MP#1, the measurement point MP#2, and the measurement point MP#3 becomes the Z-axis as the measurement coordinate system.

[0315] In addition, in the following description, for the sake of convenience of explanation, the following example is used for the explanation: as Fig.15 shown, in order to move the measurement head 22 from the measurement point MP#2 to the measurement point MP#3, the stage 141 is moved based on the stage drive control signal for moving the stage 141 along the Y-axis of the mechanical coordinate system, and on the other hand, the processing head 11 is not moved based on the head drive control signal for moving the processing head 11 along the Z-axis of the mechanical coordinate system. As a result, the measurement control device 24 generates a measurement coordinate system in which an axis orthogonal to the X-axis of the measurement coordinate system along the plane including the measurement point MP#1, the measurement point MP#2, and the measurement point MP#3 becomes the Y-axis. In this case, as Fig.15As shown, the position (X p3 , Y p3 , Z p3 ) of the measurement point MP#3 in the measurement coordinate system can also use the position (X p3 , Y p3 , 0). That is, the number of unknown parameters that the measurement control device 24 should calculate to calculate the positions of the measurement points MP#1 to MP#J is reduced.

[0316] In addition, at the moment when the first measurement coordinate axis and the second measurement coordinate axis are determined, the remaining one axis (the third measurement coordinate axis) of the measurement coordinate system is also determined. Specifically, the measurement control device 24 can use the axis orthogonal to the first measurement coordinate axis and the second measurement coordinate axis as the third measurement coordinate axis of the measurement coordinate system.

[0317] The measurement coordinate system can also be formed as a coordinate system that moves within the machine coordinate system as the stage 141 moves. For example, as shown in Fig.16 which shows the measurement coordinate system that moves within the machine coordinate system as the stage 141 moves, the measurement coordinate system can also move along the Y-axis of the machine coordinate system as the stage 141 moves along the Y-axis of the machine coordinate system. On the other hand, when the stage 141 does not move, the measurement coordinate system may not move within the machine coordinate system. In addition, the measurement coordinate system can be called a coordinate system based on the reference member FM or a coordinate system based on the stage 141.

[0318] After the measurement coordinate system is formed, the measurement control device 24 calculates the positions of the measurement points MP#1 to MP#J in the measurement coordinate system. In this embodiment, in the first movement error calculation operation, as an example, the measurement control device 24 can use the principle of trilateration to calculate the positions of the measurement points MP#1 to MP#J. Hereinafter, with reference to Fig.17 , the operation of calculating the positions of the measurement points MP#1 to MP#J using the principle of trilateration will be described.

[0319] Fig.17 Schematically shows the positional relationship between three measurement points MP (specifically, measurement point MP#1, measurement point MP#2, and measurement point MP#3) and four reference members FM (specifically, reference member FM#1, reference member FM#2, reference member FM#3, and reference member FM#4). In this case, the unknown parameters to be calculated by trilateration are: the position (X p1 , Y p1 , Z p1 ) of the measurement point MP#1, the position (X p2 , Y p2 , Z p2 ) of the measurement point MP#2, the position (X ) of the measurement point MP#3p3 , Y p3 , Z p3 ), the position (X t1 , Y t1 , Z t1 ) of the reference member FM#1, the position (X t2 , Y t2 , Z t2 ) of the reference member FM#3, the position (X t3 , Y t3 , Z t3 ) of the reference member FM#3, the position (X t4 , Y t4 , Z t4 ) of the reference member FM#4, the distance d between the measurement point MP#1 and the reference member FM#1 1 , the distance d between the measurement point MP#1 and the reference member FM#2 2 , the distance d between the measurement point MP#1 and the reference member FM#3 3 , and the distance d between the measurement point MP#1 and the reference member FM#4 4 . In this case, the measurement control device 24 calculates a total of 25 unknown parameters using the principle of trilateration measurement.

[0320] In addition, the distance between the measurement point MP#2 and the reference member FM#1 can be calculated as follows: for the distance d between the measurement point MP#1 and the reference member FM#1 as an unknown parameter 1 , add or subtract the difference between the distance between the measuring head 22 at the measurement point MP#1 and the reference member FM#1 calculated based on the received light result of the return light RL and the distance between the measuring head 22 at the measurement point MP#2 and the reference member FM#1 calculated based on the received light result of the return light RL. Therefore, the measurement control device 24 may not use the distance between the measurement point MP#2 and the reference member FM#1 as an unknown parameter. For the same reason, the measurement control device 24 may not use the distances between each of the measurement points MP#2 and MP#3 and each of the reference members FM#1 to FM#4 as unknown parameters.

[0321] However, when the measurement control device 24 can calculate the distance between the reference point FP of the measuring head 22 and the reference member FM (i.e., the distance between the measurement point MP and the reference member FM) as the distance between the measuring head 22 and the reference member FM based on the received light result of the return light RL, the measurement control device 24 may not use the distances d 1 to d 4 as unknown parameters. Hereinafter, for the sake of convenience of explanation, the distances d 1 to d4 An example of an unknown parameter will be described.

[0322] In order to calculate the unknown parameter, as an example, the measurement control device 24 can solve the minimization problem shown in Equation 1. The minimization problem shown in Equation 1 is a minimization problem using the principle of multi-sided measurement. The variable i in Equation 1 is a variable for identifying four reference members FM#1 to FM#4. The "d" in Equation 1 ij " represents the difference between the first distance and the second distance. The first distance is the distance between the measuring head 22 at the measurement point MP#i and the reference member #i calculated based on the light receiving result of the return light RL. The second distance is the distance between the measuring head 22 at the measurement point MP#j and the reference member #i calculated based on the light receiving result of the return light RL. That is, the "d" in Equation 1 ij " represents the actual change amount of the second distance between the measurement point MP#j and the reference member #i relative to the first distance between the measurement point MP#i and the reference member #i. The "f" in Equation 1 ij (x) is shown in Equation 2. The ||T i -P j || represents the second distance between the measurement point MP#j and the reference member #i calculated based on the light receiving result of the return light RL. Therefore, the "f" shown in Equation 2 ji (x) represents the ideal (in other words, theoretical) change amount of the second distance between the measurement point MP#j and the reference member #i relative to the first distance between the measurement point MP#i and the reference member #i. The operation of solving the minimization problem shown in Equation 1 is an operation of calculating the unknown parameter that satisfies the following condition, that is, the actual change amount of the second distance between the measurement point MP#j and the reference member #i relative to the first distance between the measurement point MP#i and the reference member #i, and the ideal change amount of the second distance between the measurement point MP#j and the reference member #i relative to the first distance between the measurement point MP#i and the reference member #i become the smallest.

[0323] [Equation 1]

[0324]

[0325] [Equation 2]

[0326] f ij (x) = ||T i -P j || - d i

[0327] Here, in Fig.17In the example shown, since three measurement points MP#1 to MP#3 and four reference members FM#1 to FM#4 are used, the function "f" shown in Equation 2 can be used to generate a set of simultaneous equations including 3 × 4 = 12 equations. On the other hand, since the number of unknown parameters is 25, the number of equations is short by 13 (= 25 - 12). In such a case, every time a new measurement point MP is added, three unknown parameters corresponding to the position of the measurement point MP are increased, but four equations can be newly generated using "f" shown in Equation 2. Therefore, the measurement control device 24 can also set the number of measurement points MP (i.e., the variable J) to generate a set of simultaneous equations including the same number or more equations than the number of unknown parameters. That is, the measurement control device 24 can also set the number of times (i.e., the variable J) of moving at least one of the machining head 11 and the stage 141 in step S108 to generate a set of simultaneous equations including the same number or more equations than the number of unknown parameters. ij (x)" to generate a set of simultaneous equations including 3 × 4 = 12 equations. On the other hand, since the number of unknown parameters is 25, the number of equations is short by 13 (= 25 - 12). In such a case, every time a new measurement point MP is added, three unknown parameters corresponding to the position of the measurement point MP are increased, but four equations can be newly generated using "f" shown in Equation 2. Therefore, the measurement control device 24 can also set the number of measurement points MP (i.e., the variable J) to generate a set of simultaneous equations including the same number or more equations than the number of unknown parameters. That is, the measurement control device 24 can also set the number of times (i.e., the variable J) of moving at least one of the machining head 11 and the stage 141 in step S108 to generate a set of simultaneous equations including the same number or more equations than the number of unknown parameters. ji (x)". Therefore, the measurement control device 24 can also set the number of measurement points MP (i.e., the variable J) to generate a set of simultaneous equations including the same number or more equations than the number of unknown parameters. That is, the measurement control device 24 can also set the number of times (i.e., the variable J) of moving at least one of the machining head 11 and the stage 141 in step S108 to generate a set of simultaneous equations including the same number or more equations than the number of unknown parameters. Fig.12 step S108 to generate a set of simultaneous equations including the same number or more equations than the number of unknown parameters.

[0328] Alternatively, as described above, in the case of forming (defining) a measurement coordinate system as shown in Fig.15 , the number of unknown parameters is reduced. Specifically, in the case of forming (defining) a measurement coordinate system as shown in Fig.15 , the X position (X p1 ) of the measurement point MP#1, the Y position (Y p1 ) of the measurement point MP#1, the Z position (Z p1 ) of the measurement point MP#1, the Y position (Y p2 ) of the measurement point MP#2, the Z position (Z p2 ) of the measurement point MP#2, and the Z position (Z p3 ) of the measurement point MP#3 are not unknown parameters. Therefore, the number of unknown parameters is reduced from 25 to 19. Therefore, the number of equations required to solve the minimization problem shown in Equation 1 is reduced.

[0329] To solve the minimization problem, the measurement control device 24 calculates the distance between the measurement head 22 located at the measurement point MP#j and the reference member FM#i based on the light reception result of the return light RL from the reference member FM#i by the measurement head 22 located at the measurement point MP#j. The measurement control device 24 performs the operation of calculating the distance between the measurement head 22 located at the measurement point MP#j and the reference member FM#i in all combination modes of the measurement point MP#j and the reference member FM#i. Then, the measurement control device 24 uses the calculated distance to solve the minimization problem shown in Equation 1. As a result, as shown in Fig.18As shown, the measurement control device 24 can calculate the positions of the measurement points MP#1 to MP#J in the measurement coordinate system.

[0330] In addition, although not shown, the measurement control device 24 can also calculate the position of the reference member FM in the measurement coordinate system by solving the minimization problem. That is, the measurement control device 24 can also calculate the positions of at least four reference members FM in the measurement coordinate system by solving the minimization problem.

[0331] Fig.18 The positions of the measurement points MP#1 to MP#J shown can also be regarded as the positions of the measurement points MP#1 to MP#J in the space where at least one of the processing head 11 and the stage 141 moves along the translation axis. That is, Fig.18 The positions of the measurement points MP#1 to MP#J shown can also be regarded as the positions of the measurement points MP#1 to MP#J in the space where at least one of the processing head 11 and the stage 141 is translated to a plurality of different positions along the translation axis.

[0332] Then, the measurement control device 24 converts the positions of the measurement points MP#1 to MP#J in the measurement coordinate system into the positions of the measurement points MP#1 to MP#J in the machine coordinate system respectively. Specifically, since the measurement control device 24 forms a measurement coordinate system in the machine coordinate system, the measurement control device 24 can generate a coordinate transformation matrix for converting the position of any one of the machine coordinate system and the measurement coordinate system into the position of any other one of the machine coordinate system and the measurement coordinate system. The measurement control device 24 can also use the coordinate transformation matrix to convert the position of the measurement point MP#j in the measurement coordinate system into the position of the measurement point MP#j in the machine coordinate system. The measurement control device 24 can also convert the positions of the measurement points MP#1 to MP#J in the measurement coordinate system into the positions of the measurement points MP#1 to MP#J in the machine coordinate system respectively by repeatedly performing the above conversion operation for all the measurement points MP#1 to MP#J.

[0333] Or, in Fig.15When the measurement point MP#1 shown is used as the origin of the measurement coordinate system, and the X-axis, Y-axis, and Z-axis of the measurement coordinate system respectively correspond to the X-axis, Y-axis, and Z-axis of the machine coordinate system, the measurement control device 24 can also convert the position of the measurement point MP#j in the measurement coordinate system to the position of the measurement point MP#j in the machine coordinate system by adding the coordinate value representing the position of the measurement point MP#j in the measurement coordinate system to the coordinate value representing the position of the measurement point MP#1 in the machine coordinate system. The position of the measurement point MP#1 in the machine coordinate system (especially the positions along the X-axis and Z-axis respectively) can also be calculated based on the measurement results of the head position measurement device 13 that measures the position of the machining head 11 after the machining head 11 is moved according to the head drive control signal for controlling the head drive system 12 to move the machining head 11 to the initial head position. Alternatively, as the position of the measurement point MP#1 in the machine coordinate system (especially the positions along the X-axis and Z-axis respectively), the initial head position can also be used, where the initial head position is used to generate the head drive control signal for controlling the head drive system 12 to move the machining head 11 to the initial head position. Furthermore, the position of the measurement point MP#1 in the machine coordinate system (especially the position along the Y-axis) can also be calculated based on the measurement results of the position measurement device 143 that measures the position of the stage 141 after the stage 141 is moved according to the stage drive control signal for controlling the stage drive system 142 to move the stage 141 to the initial stage position. Alternatively, as the position of the measurement point MP#1 in the machine coordinate system (especially the position along the Y-axis), the initial stage position can also be used, where the initial stage position is used to generate the stage drive control signal for controlling the stage drive system 142 to move the stage 141 to the initial stage position.

[0334] As a result, as Fig.19 shown, the measurement control device 24 can calculate the positions of the measurement points MP#1 to MP#J in the machine coordinate system. Fig.19 The positions of the measurement points MP#1 to MP#J shown can be regarded as the positions of the measurement points MP#1 to MP#J in the space where at least one of the machining head 11 and the stage 141 moves along the translation axis. That is, Fig.19 the positions of the measurement points MP#1 to MP#J shown can also be regarded as the positions of the measurement points MP#1 to MP#J in the space where at least one of the machining head 11 and the stage 141 is translated along the translation axis to a plurality of different positions. In particular, Fig.19 the positions of the measurement points MP#1 to MP#J shown can be regarded as the actual positions of the measurement points MP#1 to MP#J in the space where at least one of the machining head 11 and the stage 141 moves along the translation axis. That is, Fig.19The positions of the measurement points MP#1 to MP#J shown can be regarded as the actual positions of the measurement points MP#1 to MP#J in a space where at least one of the processing head 11 and the stage 141 is translated along the translation axis to a plurality of different positions respectively.

[0335] In addition, in the above description, after calculating the positions of the measurement points MP#1 to MP#J in the measurement coordinate system, the measurement control device 24 calculates the positions of the measurement points MP#1 to MP#J in the machine coordinate system. However, the measurement control device 24 can also calculate the positions of the measurement points MP#1 to MP#J in the machine coordinate system without calculating the positions of the measurement points MP#1 to MP#J in the measurement coordinate system. For example, when the stage 141 does not move along the translation axis, the position of the reference point FP of the measurement head 22 in the machine coordinate system after the at least one of the processing head 11 and the stage 141 moves for the j-th time in step S101 or step S108 can be directly used as the position of the measurement point MP#j in the machine coordinate system.

[0336] Returning to Fig.12 In, then, based on the actual position of the measurement point MP#j in the machine coordinate system calculated in step S110, the measurement control device 24 calculates the movement error generated during the translational movement of at least one of the processing head 11 and the stage 141 (step S111).

[0337] Specifically, the movement error generated during the translational movement of the processing head 11 is equivalent to the difference between the actual position and the target position of the processing head 11. Similarly, the movement error generated during the translational movement of the stage 141 is equivalent to the difference between the actual position and the target position of the stage 141. Here, as described above, in the present embodiment, an example is described in which the processing head 11 can be translated along the translation axis (X) and the translation axis (Z) respectively, and the stage 141 is translated along the translation axis (Y). Therefore, hereinafter, the operation of calculating the movement error generated when the processing head 11 is translated along the translation axis (X) and the translation axis (Z) respectively and the stage 142 is translated along the translation axis (Y) will be specifically described. However, as will be described in detail later, even when the processing head 11 is translated along the translation axis (Y), the measurement control device 24 can calculate the movement error generated when the processing head 11 is translated along the translation axis (Y) by performing the same operation as the operation described below. Similarly, even when the stage 141 is translated along at least one of the translation axis (X) and the translation axis (Z), the measurement control device 24 can calculate the movement error generated when the stage 141 is translated along at least one of the translation axis (X) and the translation axis (Z) by performing the same operation as the operation described below.

[0338] Here, Fig.19 The X position of the measurement point MP#j shown represents the actual X position of the measurement head 22 when the measurement head 22 is located at the measurement point MP#j. Fig.19 The Y position of the measurement point MP#j shown represents the actual Y position of the stage 141 when the measurement head 22 is located at the measurement point MP#j. Fig.19 The X position of the measurement point MP#j shown represents the actual Z position of the measurement head 22 when the measurement head 22 is located at the measurement point MP#j.

[0339] Furthermore, since the measurement head 22 is assembled on the processing head 11, Fig.19 the X position of the measurement point MP#j shown can be substantially regarded as representing the actual X position x_actual#j of the processing head 11 when the measurement head 22 is located at the measurement point MP#j. Specifically, as the position of the processing head 11, the tool tip point (Tool CenterPoint (TCP)) is usually used. The measurement head 22 can also be assembled on the processing head 11 in such a way that the reference point FP of the measurement head 22 is located at the tool tip point. In such a case, Fig.19 the X position of the measurement point MP#j shown represents the actual X position x_actual#j of the processing head 11 itself when the measurement head 22 is located at the measurement point MP#j. Similarly, Fig.19 the Z position of the measurement point MP#j shown represents the actual Z position z_actual#j of the processing head 11 itself when the measurement head 22 is located at the measurement point MP#j. On the other hand, when the reference point FP of the measurement head 22 is displaced by a prescribed X displacement amount in the X-axis direction of the machine coordinate system with respect to the tool tip point, the position obtained by adding the prescribed X displacement amount to Fig.19 the X position of the measurement point MP#j shown is used as the actual X position x_actual#j of the processing head 11 when the measurement head 22 is located at the measurement point MP#j. Similarly, when the reference point FP of the measurement head 22 is displaced by a prescribed Z displacement amount in the Z-axis direction of the machine coordinate system with respect to the tool tip point, the position obtained by adding the prescribed Z displacement amount to Fig.19 the Z position of the measurement point MP#j shown is used as the actual Z position z_actual#j of the processing head 11 when the measurement head 22 is located at the measurement point MP#j.

[0340] Thus, the measurement control device 24 can calculate the positions of the processing head 11 and the stage 141 respectively when the measurement head 22 is located at the measurement point MP#j, based on the position of the measurement point MP#j calculated in step S110. In such a case, as the movement error generated during the translational movement of the processing head 11, the measurement control device 24 can calculate the difference between the actual X position x_actual#j of the processing head 11 calculated based on the measurement point MP#j and the commanded X position x_command#j that the processing head 11 should originally be at when the measurement head 22 is located at the measurement point MP#j, as the movement error Δx#j. As the movement error generated during the translational movement of the stage 141, the measurement control device 24 can also calculate the difference between the actual Y position y_actual#j of the stage 141 calculated based on the measurement point MP#j and the commanded Y position y_command#j that the stage 141 should originally be at when the measurement head 22 is located at the measurement point MP#j, as the movement error Δy#j. As the movement error generated during the translational movement of the processing head 11, the measurement control device 24 can also calculate the difference between the actual Z position z_actual#j of the processing head 11 calculated based on the measurement point MP#j and the commanded Z position z_command#j that the processing head 11 should originally be at when the measurement head 22 is located at the measurement point MP#j, as the movement error Δz#j.

[0341] In addition, the movement error of the processing head 11 can also be simply referred to as the difference between the actual position of the processing head 11 and the commanded position of the processing head 11. That is, the movement error of the processing head 11 can also be simply referred to as the difference in coordinate values between the point where the processing head 11 actually is and the point where the processing head 11 should originally be. Similarly, the movement error of the stage 141 can also be simply referred to as the difference between the actual position of the stage 141 and the commanded position of the stage 141. That is, the movement error of the stage 141 can also be simply referred to as the difference in coordinate values between the point where the stage 141 actually is and the point where the stage 141 should originally be.

[0342] As the X position x_command#j in the command and the Z position z_command#j in the command, the target position of the processing head 11 used when generating the head drive control signal for controlling the head drive system 12 can also be used. As the X position x_command#j in the command and the Z position z_command#j in the command, the measurement result of the head position measuring device 13 that measures the position of the processing head 11 can also be used. As the X position x_command#j in the command and the Z position z_command#j in the command, the target position calculated based on the target movement amount of the processing head 11 that can be utilized when generating the head drive control signal for controlling the head drive system 12 can also be used. In addition, the X position x_command#j in the command and the Z position z_command#j in the command can also be regarded as command values related to the movement of the processing head 11.

[0343] As the Y position y_command#j in the command, the target position of the stage 141 used when generating the stage drive control signal for controlling the stage drive system 142 can also be used. As the Y position y_command#j in the command, the measurement result of the position measuring device 143 that measures the position of the stage 141 can also be used. As the Y position y_command#j in the command, the target position calculated based on the target movement amount of the stage 141 that can be utilized when generating the stage drive control signal for controlling the stage drive system 142 can also be used. In addition, the Y position y_command#j in the command can also be regarded as a command value related to the movement of the stage 141.

[0344] As a result, the measurement control device 24 can calculate the movement error Δx#j along the translation axis (X), the movement error Δy#j along the translation axis (Y), and the movement error Δz#j along the translation axis (Z) as the movement errors generated when moving the processing head 11 and the stage 141 in such a way that the processing head 11 is located at the X position x_command#j and the Z position z_command#j in the command and the stage 141 is located at the Y position y_command#j in the command. That is, the measurement control device 24 can generate information related to the movement error including the movement error Δx#j, the movement error Δy#j, and the movement error Δz#j.

[0345] In addition, in the case where it is not the processing head 11 but the stage 141 that can move along the translation axis (X), as the movement error of the stage 141, the measurement control device 24 can also calculate the difference between the actual X position x_actual#j of the stage 141 calculated based on the measurement point MP#j and the commanded X position x_command#j that the stage 141 should originally be at when the measuring head 22 is at the measurement point MP#j as the movement error Δx#j. In the above case, as the commanded X position x_command#j, the target position of the stage 141 used when generating the stage drive control signal for controlling the stage drive system 142 can also be used. As the commanded X position x_command#j, the measurement result of the position measurement device 143 that measures the position of the stage 141 can also be used. As the commanded X position x_command#j, the target position calculated based on the target movement amount of the stage 141 that can be utilized when generating the stage drive control signal for controlling the stage drive system 142 can also be used. In addition, the commanded X position x_command#j can also be regarded as a command value related to the movement of the stage 141.

[0346] In addition, in the case where it is not the stage 141 but the processing head 11 that can move along the translation axis (Y), as the movement error of the processing head 11, the measurement control device 24 can also calculate the difference between the actual Y position y_actual#j of the processing head 11 calculated based on the measurement point MP#j and the commanded Y position y_command#j that the processing head 11 should originally be at when the measuring head 22 is at the measurement point MP#j as the movement error Δy#j. In the above case, as the commanded Y position y_command#j, the target position of the processing head 11 used when generating the head drive control signal for controlling the head drive system 12 can also be used. As the commanded Y position y_command#j, the measurement result of the head position measurement device 13 that measures the position of the processing head 11 can also be used. As the commanded Y position y_command#j, the target position calculated based on the target movement amount of the processing head 11 that can be utilized when generating the head drive control signal for controlling the head drive system 12 can also be used. In addition, the commanded Y position y_command#j can also be regarded as a command value related to the movement of the processing head 11

[0347] In addition, in the case where the stage 141, rather than the processing head 11, can move along the translation axis (Z), as the movement error of the stage 141, the measurement control device 24 can also calculate the difference between the actual Z position z_actual#j of the stage 141 calculated based on the measurement point MP#j and the commanded Z position z_command#j that the stage 141 should originally be at when the measurement head 22 is at the measurement point MP#j, as the movement error Δz#j. In the said case, as the commanded Z position z_command#j, the target position of the stage 141 used when generating the stage drive control signal for controlling the stage drive system 142 can also be used. As the commanded Z position z_command#j, the measurement result of the position measurement device 143 that measures the position of the stage 141 can also be used. As the commanded Z position z_command#j, the target position calculated based on the target movement amount of the stage 141 that can be utilized when generating the stage drive control signal for controlling the stage drive system 142 can also be used. In addition, the commanded Z position z_command#j can also be regarded as a command value related to the movement of the stage 141.

[0348] The measurement control device 24 can also repeat the above operation the number of times corresponding to the number of measurement points MP. As a result, the measurement control device 24 can calculate the movement errors at each position in the machine coordinate system. In other words, the measurement control device 24 can calculate the movement errors at each position in the space where at least one of the processing head 11 and the stage 141 moves along the translation axis. The measurement control device 24 can calculate the movement errors at each position in the space where at least one of the processing head 11 and the stage 141 translates to a plurality of different positions along the translation axis. That is, the measurement control device 24 can calculate the movement errors (Δx#1, Δy#1, Δz#1) generated at the first position (x_command#1, y_comand#1, z_command#1) in the machine coordinate system, the movement errors (Δx#2, Δy#2, Δz#2) generated at the second position (x_command#2, y_comand#2, z_command#2) in the machine coordinate system, …, and the movement errors (Δx#J, Δy#J, Δz#J) generated at the Jth position (x_command#J, y_comand#J, z_command#J) in the machine coordinate system. The measurement control device 24 can calculate the movement errors (Δx#1, Δy#1, Δz#1) generated when at least one of the processing head 11 and the stage 141 moves to be located at the first position (x_command#1, y_comand#1, z_command#1) in the machine coordinate system, the movement errors (Δx#2, Δy#2, Δz#2) generated when at least one of the processing head 11 and the stage 141 moves to be located at the second position (x_command#2, y_comand#2, z_command#2) in the machine coordinate system, …, and the movement errors (Δx#J, Δy#J, Δz#J) generated when at least one of the processing head 11 and the stage 141 moves to be located at the Jth position (x_command#J, y_comand#J, z_command#J) in the machine coordinate system.

[0349] In addition, the measurement control device 24 can generate, based on or instead of the movement errors (Δx#j, Δy#j, Δz#j), a function representing the movement errors generated at an arbitrary position in the machine coordinate system as information related to the movement errors. Specifically, the measurement control device 24 can also calculate a function that outputs the movement errors at the position when the coordinate information representing an arbitrary position in the machine coordinate system is input. In this case, the measurement control device 24 can generate the function itself. The measurement control device 24 can also generate the parameters (such as coefficients, etc.) of the function.

[0350] The measurement control device 24 may also generate, as information related to the movement error, a function representing the actual position of the processing head 11 when the processing head 11 is moved based on the head drive control signal that moves the processing head 11 to the desired position in the mechanical coordinate system, or instead of the movement error (Δx#j, Δy#j, Δz#j). The measurement control device 24 may also generate, as information related to the movement error, a function representing the actual position of the stage 141 when the stage 141 is moved based on the stage drive control signal that moves the stage 141 to the desired position in the mechanical coordinate system, or instead of the movement error (Δx#j, Δy#j, Δz#j). In the above case, the measurement control device 24 may generate the function itself. The measurement control device 24 may also generate parameters (such as coefficients, etc.) of the function.

[0351] After generating the information related to the movement error, the measurement control device 24 may generate error correction information for correcting the movement error based on the information related to the movement error.

[0352] For example, the measurement control device 24 may generate a correction value C#j for correcting the commanded X position x_command#j, the commanded Y position y_command#j, and the commanded Z position z_command#j as error correction information. Specifically, when the machining head 11 is moved based on a head drive control signal that moves the machining head 11 to a desired position in the mechanical coordinate system, the machining head 11 is actually located at a position obtained by adding a movement error Δx#j to the commanded X position x_command#j instead of the commanded X position x_command#j. Therefore, it is assumed that if the position obtained by subtracting the movement error Δx#j from the commanded X position x_command#j is used as a new commanded X position x_command#j, the machining head 11 is located at the commanded X position x_command#j. Therefore, the measurement control device 24 may also set the movement error Δx#j as the correction value Cx#j for correcting the commanded X position x_command#j. For the same reason, the measurement control device 24 may also set the movement error Δy#j as the correction value Cy#j for correcting the Y position y_command#j on the command. The measurement control device 24 may also set the movement error Δz#j as the correction value Cz#j for correcting the Z position z_command#j on the command. That is, the measurement control device 24 may also generate error correction information including a plurality of information groups of arbitrary positions (x_command#j, y_comand#j, z_command#j) in the machine coordinate system and the correction values ​​(Cx#j, Cy#j, Cz#j) at the positions.

[0353] For example, the measurement control device 24 may also generate, as error correction information, a function representing the correction value C#j at an arbitrary position within the machine coordinate system. For example, the measurement control device 24 may generate a function such as a function that outputs at least one of the correction value Cx#j, the correction value Cy#j, and the correction value Cz#j when at least one of the commanded X position x_command#j, the commanded Y position y_command#j, and the commanded Z position z_command#j is input. As an example of such a function, a function representing at least one of the correction value Cx#j, the correction value Cy#j, and the correction value Cz#j in terms of a power can be cited. As an example of a function representing at least one of the correction value Cx#j, the correction value Cy#j, and the correction value Cz#j in terms of a power, the function "Cx#j = ax × X + bx × X 2 +…" can be cited. In the above case, the "X" in the function represents the commanded X position x_command#j, and "ax" and "bx" represent coefficients. In such a case, the measurement control device 24 may generate the function itself. The measurement control device 24 may also generate the parameters of the function (such as the coefficient ax and the coefficient bx, etc.).

[0354] The measurement control device 24 may also output the error correction information as information for controlling the machine tool 1 to the machine tool 1 (specifically, the machining control device 16). In such a case, the machining control device 16 may control the translational movement of at least one of the machining head 11 and the stage 141 based on the error correction information. Specifically, the machining control device 16 may also correct the commanded position of at least one of the machining head 11 and the stage 141 based on the error correction information, and use the corrected commanded position to generate a drive control signal for causing at least one of the machining head 11 and the stage 141 to perform translational movement. As a result, the machine tool 1 can translate the machining head 11 so that the machining head 11 is located at the originally commanded position before correction in the same manner as when no movement error occurs during the translational movement of the machining head 11 even when a movement error occurs during the translational movement of the machining head 11. That is, the machine tool 1 can translate the machining head 11 with good accuracy. Similarly, the machine tool 1 can translate the stage 141 so that the stage 141 is located at the originally commanded position before correction in the same manner as when no movement error occurs during the translational movement of the stage 141 even when a movement error occurs during the translational movement of the stage 141. That is, the machine tool 1 can translate the stage 141 with good accuracy. As a result, the machine tool 1 can machine the workpiece W with good accuracy.

[0355] The machining control device 16 may also correct the measurement result of the head position measuring device 13 that measures the position of the machining head 11 based on the error correction information, instead of controlling the translational movement of the machining head 11 based on the error correction information. Specifically, the machining control device 16 generally controls the head drive system 12 based on the head drive control signal so that the position of the machining head 11 measured by the head position measuring device 13 becomes the position on the command. That is, the machining control device 16 generally moves the machining head 11 until the position of the machining head 11 measured by the head position measuring device 13 becomes the position on the command. Therefore, in the case where a movement error of the machining head 11 occurs, as the measurement result of the position of the machining head 11, the head position measuring device 13 outputs the position on the command of the machining head 11 that does not reflect the movement error, rather than the actual position of the machining head 11 that reflects the movement error. In the above case, the machining control device 16 may also correct the position of the machining head 11 measured by the head position measuring device 13 based on the error correction information, so that the measurement result of the head position measuring device 13 represents the actual position of the machining head 11 that reflects the movement error. As a result, the machining control device 16 can translate the machining head 11 until the corrected position of the machining head 11 becomes the position on the command.

[0356] In addition, the head position measuring device 13 may detect the movement amount of the machining head 11 based on or instead of detecting the position of the machining head 11. In this case, the machining control device 16 may also correct the measurement result of the head position measuring device 13 that measures the movement amount of the machining head 11 based on the error correction information. That is, the machining control device 16 may also correct the movement amount of the machining head 11 measured by the head position measuring device 13 based on the error correction information.

[0357] The processing control device 16 may also correct the measurement result of the position measuring device 143 that measures the position of the stage 141 based on the error correction information, instead of controlling the translational movement of the stage 141 based on the error correction information. Specifically, the processing control device 16 generally controls the stage drive system 142 based on the stage drive control signal so that the position of the stage 141 measured by the position measuring device 143 becomes the commanded position. That is, the processing control device 16 generally moves the stage 141 until the position of the stage 141 measured by the position measuring device 143 becomes the commanded position. Therefore, when a movement error of the stage 141 occurs, as the measurement result of the position of the stage 141, the position measuring device 143 outputs the commanded position of the stage 141 that does not reflect the movement error instead of the actual position of the stage 141 that reflects the movement error. In the above case, the processing control device 16 may also correct the position of the stage 141 measured by the position measuring device 143 based on the error correction information so that the measurement result of the position measuring device 143 represents the actual position of the stage 141 that reflects the movement error. As a result, the processing control device 16 can translate the stage 141 until the corrected position of the stage 141 becomes the commanded position.

[0358] In addition, the stage position measuring device 143 may detect the movement amount of the stage 141 based on or instead of detecting the position of the stage 141. In the above case, the processing control device 16 may also correct the measurement result of the stage position measuring device 143 that measures the movement amount of the stage 141 based on the error correction information. That is, the processing control device 16 may also correct the movement amount of the stage 141 measured by the stage position measuring device 143 based on the error correction information.

[0359] The measurement control device 24 can also generate machining path correction information for correcting the machining path based on information related to the movement error, as information for controlling the machine tool 1, where the machining path represents the machining path of the machine tool 1 for the workpiece W. The machining path can also represent, for example, the movement path of the tool tip point. The machining path can also represent, for example, the movement path of the tool tip point relative to the workpiece W. The machining path can also represent, for example, the movement path of the machining position where the machine tool 1 machines the workpiece W. The machining path can also represent, for example, the movement path of the machining position where the machine tool 1 machines the workpiece W relative to the workpiece W. Such a machining path is usually generated based on the three-dimensional shape of the workpiece W before machining and the target three-dimensional shape of the workpiece W after machining. The machining path correction information can also be information for correcting the machining path generated based on the three-dimensional shape of the workpiece W before machining and the target three-dimensional shape of the workpiece W after machining. In such a case, the measurement control device 24 can also generate machining path correction information for correcting the machining path so that even when a movement error occurs during the translational movement of at least one of the machining head 11 and the stage 141, the workpiece W is machined in the same manner as when no movement error occurs during the translational movement of at least one of the machining head 11 and the stage 141. The machining control device 16 of the machine tool 1 can also correct the machining path based on the machining path correction information. Alternatively, the measurement control device 24 can correct the machining path and output the corrected machining path to the machining control device 16 as information for controlling the machine tool 1. As a result, even when a movement error occurs during the translational movement of at least one of the machining head 11 and the stage 141, the machine tool 1 can machine the workpiece W in the same manner as when no movement error occurs during the translational movement of at least one of the machining head 11 and the stage 141.

[0360] The measurement control device 24 may also generate measurement route correction information for correcting a measurement route based on information related to a movement error, for example, the measurement route that represents the measurement path of the measurement system 2 for measuring the three-dimensional shape of the workpiece W when the measurement system 2 measures the workpiece W. The measurement route may also represent the movement path of the tool tip point in the same manner as the machining route. The measurement route may also represent the movement path of the tool tip point relative to the workpiece W in the same manner as the machining route. For example, the measurement route may also represent the movement path of the measurement positions where the measurement system 2 measures the workpiece W. For example, the measurement route may also represent the movement path of the reference point FP of the measuring head 22. For example, the measurement route may also represent the movement path of the pivot point PV of the measuring head 22. For example, the measurement route may also represent the movement path of the measurement positions where the measurement system 2 measures the workpiece W relative to the workpiece W. The measurement position may also refer to the irradiation position of the measurement light ML on the surface of the workpiece W. Such a measurement route is usually generated based on the three-dimensional shape of the workpiece W. The measurement route correction information may also be information for correcting the measurement route generated based on the three-dimensional shape of the workpiece W. In such a case, the measurement control device 24 may generate measurement route correction information for correcting the measurement route so that the workpiece W is measured in the same manner as when no movement error occurs in the translational movement of at least one of the machining head 11 and the stage 141 even when a movement error occurs in the translational movement of at least one of the machining head 11 and the stage 141. The machining control device 16 of the machine tool 1 may also correct the measurement route based on the measurement route correction information. Alternatively, the measurement control device 24 may correct the measurement route and output the corrected measurement route to the machining control device 16 as information for controlling the machine tool 1. As a result, even when a movement error occurs in the translational movement of at least one of the machining head 11 and the stage 141, the machine tool 1 can translate at least one of the machining head 11 and the stage 141 in the same manner as when no movement error occurs in the translational movement of at least one of the machining head 11 and the stage 141. As a result, even when a movement error occurs in the translational movement of at least one of the machining head 11 and the stage 141, the measurement system 2 can measure the workpiece W in the same manner as when no movement error occurs in the translational movement of at least one of the machining head 11 and the stage 141. In addition, the measurement control device 24 may also generate measurement route correction information for correcting a measurement route based on information related to a movement error, for example, the measurement route that represents the measurement path of the measurement system 2 for measuring at least one of the position, orientation, and dimensions of the workpiece W described later. Furthermore, the machining control device 16 may also correct the measurement route based on the generated measurement route correction information.

[0361] The measurement control device 24 can also generate drive correction information for correcting the drive control signal as information for controlling the machine tool 1 based on information related to the movement error. The drive control signal is generated by the machining control device 16 to control the translational movement of at least one of the machining head 11 and the stage 141. That is, the measurement control device 24 can also generate drive correction information for correcting the drive control signal as information for controlling the machine tool 1 based on information related to the movement error. The drive control signal is generated by the machining control device 16 to control at least one of the head drive system 12 and the stage drive system 142. In this case, the measurement control device 24 can generate drive correction information for correcting the drive control signal generated by the machining control device 16 so that even when a movement error occurs during the translational movement of at least one of the machining head 11 and the stage 141, the workpiece W is machined in the same manner as when no movement error occurs during the translational movement of at least one of the machining head 11 and the stage 141. The machining control device 16 of the machine tool 1 can also correct the drive control signal based on the drive correction information. As a result, even when a movement error occurs during the translational movement of at least one of the machining head 11 and the stage 141, the machine tool 1 can machine the workpiece W in the same manner as when no movement error occurs during the translational movement of at least one of the machining head 11 and the stage 141.

[0362] The measurement control device 24 may also correct the drive control signal generated by the machining control device 16 based on information related to the movement error. For example, the measurement control device 24 may also obtain the drive control signal generated by the machining control device 16 from the machining control device 16 and correct the obtained drive control signal. In such a case, the measurement control device 24 may correct the drive control signal generated by the machining control device 16 so that the workpiece W is machined in the same manner as in the case where no movement error occurs during the translational movement of at least one of the machining head 11 and the stage 141. The measurement control device 24 may also output the corrected drive control signal as information for controlling the machine tool 1 to the machining control device 16. Therefore, the operation of correcting the drive control signal may also be regarded as equivalent to the operation of generating information for controlling the machine tool 1. The machining control device 16 of the machine tool 1 may also control at least one of the head drive system 12 and the stage drive system 142 based on the drive control signal (corrected drive signal) corrected by the measurement control device 24. As a result, even when a movement error occurs during the translational movement of at least one of the machining head 11 and the stage 141, the machine tool 1 can machine the workpiece W in the same manner as in the case where no movement error occurs during the translational movement of at least one of the machining head 11 and the stage 141. Further, in such a case, the measurement control device 24 may control at least one of the head drive system 12 and the stage drive system 142 based on the corrected drive control signal (corrected drive signal) instead of the machining control device 16.

[0363] The measurement control device 24 can also generate a drive control signal based on information related to the movement error. In this case, the measurement control device 24 can generate a drive control signal such that even when a movement error occurs during the translational movement of at least one of the machining head 11 and the stage 141, the workpiece W is machined in the same manner as when no movement error occurs during the translational movement of at least one of the machining head 11 and the stage 141. The measurement control device 24 can also output the generated drive control signal to the machining control device 16 as information for controlling the machine tool 1. Therefore, the action of generating the drive control signal can also be regarded as equivalent to the action of generating information for controlling the machine tool 1. The machining control device 16 of the machine tool 1 can also control at least one of the head drive system 12 and the stage drive system 142 based on the drive control signal generated by the measurement control device 24. As a result, even when a movement error occurs during the translational movement of at least one of the machining head 11 and the stage 141, the machine tool 1 can machine the workpiece W in the same manner as when no movement error occurs during the translational movement of at least one of the machining head 11 and the stage 141. Further, in this case, the measurement control device 24 can control at least one of the head drive system 12 and the stage drive system 142 based on the generated drive control signal instead of the machining control device 16.

[0364] (2-2-2) For calculating the movement error generated in the rotational movement of at least one of the processing head 11 and the stage 141 Detailed process of calculating the second moving error

[0365] Next, a second movement error calculation operation for calculating a movement error generated during the rotational movement of at least one of the machining head 11 and the stage 141 will be described. Further, in the following description, the parts different from the first movement error calculation operation in the second movement error calculation operation will be mainly described. Therefore, in order to omit redundant description, the description of the parts in the second movement error calculation operation that are the same as the first movement error calculation operation will be omitted. That is, in the following description, unless otherwise specified, the same operations as the first movement error calculation operation can also be performed.

[0366] When calculating the movement error generated during the rotational movement of the processing head 11, each time the processing head 11 makes a rotational movement and stops, the measuring head 22 can change the traveling direction of the measuring light ML by using the galvanometer mirror 2228, and irradiate the measuring light ML to each of at least N reference members FM included in the measuring range of the measuring head 22. That is, each time the processing head 11 rotates and moves to a plurality of different positions, the measuring head 22 can irradiate the measuring light ML, whose traveling direction has been changed by using the galvanometer mirror 2228, to each of at least N reference members FM included in the measuring range of the measuring head 22. As a result, each time the processing head 11 makes a rotational movement and stops, the measuring head 22 receives the return light RL from each of at least N reference members FM. The measurement control device 24 can calculate the movement error generated during the rotational movement of the processing head 11 based on the light reception results of the return light RL from each of at least N reference members FM received by the measuring head 22 each time the processing head 11 rotates and moves to a plurality of different positions. In particular, the measurement control device 24 can calculate the movement error generated during the rotational movement of the processing head 11 in the space where the processing head 11 rotates and moves to a plurality of different positions based on the light reception results of the return light RL from each of at least N reference members FM received by the measuring head 22 each time the processing head 11 rotates and moves to a plurality of different positions.

[0367] d In addition, during the rotational movement of the processing head 11 (in a state where the processing head 11 does not stop), the measuring head 22 can also change the traveling direction of the measuring light ML by sequentially using the galvanometer mirror 2228, and irradiate the measuring light ML to each of at least N reference members FM included in the measuring range of the measuring head 22. In such a case, the measurement control device 24 can also calculate the movement error generated during the rotational movement of the processing head 11 in the space where the processing head 11 rotates and moves to a plurality of different positions based on the light reception results of the return light RL from each of at least N reference members FM received by the measuring head 22 each time the processing head 11 rotates and moves to a plurality of different positions.

[0368] When calculating the movement error generated during the rotational movement of the stage 141, each time the stage 141 makes a rotational movement and stops, the measuring head 22 can also change the traveling direction of the measuring light ML by using the galvanometer mirror 2228, and irradiate the measuring light ML to each of at least N reference members FM included in the measuring range of the measuring head 22. That is, each time the stage 141 rotates and moves to a plurality of different positions, the measuring head 22 can irradiate the measuring light ML whose traveling direction has been changed by the galvanometer mirror 2228 to each of at least N reference members FM included in the measuring range of the measuring head 22. As a result, each time the stage 141 makes a rotational movement and stops, the measuring head 22 receives the return light RL from each of at least N reference members FM. The measurement control device 24 can calculate the movement error generated during the rotational movement of the stage 141 based on the light reception results of the return light RL from each of at least N reference members FM received by the measuring head 22 each time the stage 141 rotates and moves to a plurality of different positions. In particular, the measurement control device 24 can calculate the movement error generated during the rotational movement of the stage 141 in the space where the stage 141 rotates and moves to a plurality of different positions based on the light reception results of the return light RL from each of at least N reference members FM received by the measuring head 22 each time the stage 141 rotates and moves to a plurality of different positions.

[0369] In addition, during the rotational movement of the stage 141 (that is, in a state where the stage 141 does not stop), the measuring head 22 can also change the traveling direction of the measuring light ML by sequentially using the galvanometer mirror 2228, and irradiate the measuring light ML to each of at least N reference members FM included in the measuring range of the measuring head 22. In such a case, the measurement control device 24 can also calculate the movement error generated during the rotational movement of the stage 141 in the space where the stage 141 rotates and moves to a plurality of different positions based on the light reception results of the return light RL from each of at least N reference members FM received by the measuring head 22 each time the stage 141 rotates and moves to a plurality of different positions.

[0370] When calculating the movement error generated during rotational movement, the workpiece W is placed on the stage 141. For example, when calculating the movement error generated during rotational movement, the workpiece W provided with the reference member FM can be placed on the stage 141. For example, when calculating the movement error generated during rotational movement, the workpiece W not provided with the reference member FM can also be placed on the stage 141. However, when calculating the movement error generated during rotational movement, the workpiece W may not be placed on the stage 141 either. Hereinafter, for the sake of convenience of explanation, the first movement error calculation operation performed when the workpiece W provided with the reference member FM is placed on the stage 141 will be described. However, even when the workpiece W not provided with the reference member FM is placed on the stage 141 or when the workpiece W is not placed on the stage 141, the processing system SYS can calculate the movement error generated during rotational movement by performing the first movement error calculation operation shown below.

[0371] Hereinafter, with reference to Fig.21 , the flow of the second movement error calculation operation for calculating the movement error generated during the rotational movement of at least one of the machining head 11 (measurement head 22) and the stage 141 will be described. Fig.21 is a flowchart showing the flow of the second movement error calculation operation for calculating the movement error generated during the rotational movement of at least one of the machining head 11 and the stage 141.

[0372] In addition, as described above, in the present embodiment, the stage 141 performs rotational movement, and on the other hand, the machining head 11 does not perform rotational movement. Therefore, the following description can be said to be mainly an operation for calculating the movement error generated during the rotational movement of the stage 141. However, even when the machining head 11 performs rotational movement, the movement error generated during the rotational movement of the machining head 11 can be calculated by performing the following operations. The reason is that the rotational movement of the machining head 11 and the rotational movement of the stage 141 can both be regarded as the relative rotational movement of the stage 141 with respect to the machining head 11. That is, by regarding the rotational movement of the machining head 11 as the relative rotational movement of the stage 141 with respect to the machining head 11, the measurement system 2 can calculate the movement error generated during the rotational movement of the machining head 11 by the following operations.

[0373] As Fig.21 shown, first, the measurement control device 24 moves at least one of the machining head 11 and the stage 141 to the initial position within the machine coordinate system and then stops at the initial position (step S201). That is, the measurement control device 24 controls at least one of the head drive system 12 and the stage drive system 142 so that at least one of the machining head 11 and the stage 141 moves to the initial position within the machine coordinate system (step S201). In addition, the operation of step S201 can also be the same as the Fig.12The operation is the same as that of step S101. Therefore, the detailed description of the operation of step S201 is omitted.

[0374] However, in step S201, the measurement control device 24 corrects (i.e., cancels) the movement error generated in the translational movement of at least one of the processing head 11 and the stage 141 based on the error correction information generated in the first movement error calculation operation (i.e., information for correcting the movement error generated in the translational movement of at least one of the processing head 11 and the stage 141). That is, the measurement control device 24 causes at least one of the processing head 11 and the stage 141 to translate based on the error correction information generated in the first movement error calculation operation. Therefore, in the present embodiment, the processing system SYS preferably performs the second movement error calculation operation after performing the first movement error calculation operation. In this case, even if a movement error occurs in the translational movement of the processing head 11, the processing head 11 can move to the initial position and stop. That is, the actual position of the processing head 11 in the machine coordinate system coincides with the initial head position in the machine coordinate system. Similarly, even if a movement error occurs in the translational movement of the stage 141, the stage 141 can move to the initial stage position and stop. That is, the actual position of the stage 141 in the machine coordinate system coincides with the initial stage position in the machine coordinate system.

[0375] Alternatively, in the second movement calculation operation, the measurement control device 24 may also correct the movement error generated in the translational movement of at least one of the processing head 11 and the stage 141 without using the error correction information generated in the first movement error calculation operation. In such a case, the measurement control device 24 may use the position calculated based on any one of the measurement points MP#1 to MP#J calculated in the first movement error calculation operation as the initial position. As an example, the measurement control device 24 may also use the position calculated based on the measurement point MP#m (where m is a variable representing an integer of 1 or more and J or less) calculated in the first movement error calculation operation as the initial position. Specifically, as described above, the measurement control device 24 may calculate the actual X position x_actual#m of the processing head 11 after moving according to the head drive control signal generated based on the X position x_command#m in the command, the actual Y position y_actual#m of the stage 141 after moving according to the stage drive control signal generated based on the Y position y_command#m in the command, and the actual Z position z_actual#m of the processing head 11 after moving according to the head drive control signal generated based on the Z position z_command#m in the command, based on the position of the measurement point MP#m. In such a case, the measurement control device 24 may use the X position x_actual#m and the Z position z_actual#m as the initial head position, and use the Y position y_actual#m as the initial stage position. In such a case, the measurement control device 24 may move the processing head 11 to the X position x_actual#m and the Z position z_actual#m based on the head drive control signal, and move the stage 141 to the Y position y_actual#m based on the stage drive control signal, where the head drive control signal is generated based on the X position x_command#m and the Z position z_command#m in the command, and the stage drive control signal is generated based on the Y position y_command#m in the command.

[0376] In any case, in step S201 of the second movement error calculation operation, the processing head 11 and the stage 141 are positioned based on information related to the movement error generated by the first movement error calculation operation. In this case, information related to the actual positions of the processing head 11 and the stage 141 after movement in step S201 is known information to the measurement control device 24. In this regard, it can also be said that the second movement error calculation operation is different from the first movement error calculation operation in which information related to the actual positions of the processing head 11 and the stage 141 after movement in step S101 is unknown information to the measurement control device 24. In addition, when the measurement control device 24 moves at least one of the processing head 11 and the stage 141 by the second movement error calculation operation, it may not use information related to the movement error generated by the first movement error calculation operation.

[0377] Then, the measurement control device 24 performs a global scan (step S202). In addition, the operation of step S202 may also be the same as the operation of step S102 of the above. Fig.12 Therefore, the detailed description of the operation of step S202 is omitted.

[0378] Then, the measurement control device 24 calculates the directions of at least N local scan areas LSA with respect to the measuring head 22 based on the results of the global scan (step S203). In addition, the operation of step S203 may also be the same as the operation of step S103 of the above. Fig.12 Therefore, the detailed description of the operation of step S203 is omitted.

[0379] In addition, in the present embodiment, an example in which the variable N is set to 3 in the case of performing the second movement error calculation operation is described. In this case, the plurality of reference members FM can be arranged on the workpiece W and the stage 141 in such a manner that at least three reference members FM are included within the measurement range of the measuring head 22. The measurement control device 24 can calculate the directions of at least three local scan areas LSA in which at least three reference members FM are located respectively within the measurement range (i.e., within the global scan area GSA).

[0380] Then, the measurement control device 24 performs a local scan (step S204). In addition, the operation of step S204 may also be the same as the operation of step S104 of the above. Fig.12 Therefore, the detailed description of the operation of step S204 is omitted.

[0381] Then, the measurement control device 24 calculates the directions of at least three reference members FM with respect to the measuring head 22 based on the results of the local scan (step S205). In addition, the operation of step S205 may also be the same as the operation of the above. Fig.12The operation of step S105 is the same. Therefore, the detailed description of the operation of step S205 is omitted.

[0382] Then, the measurement control device 24 controls the measurement head 22 to irradiate the measurement light ML on at least three reference members FM (step S206). In addition, the operation of step S206 can also be the same as the Fig.12 operation of step S106. Therefore, the detailed description of the operation of step S206 is omitted.

[0383] Then, the measurement control device 24 determines whether to translate at least one of the processing head 11 and the stage 141 (step S207). In addition, the operation of step S207 can also be the same as the Fig.12 operation of step S107. Therefore, the detailed description of the operation of step S207 is omitted.

[0384] When the determination result in step S207 determines, for example, that at least one of the processing head 11 and the stage 141 is to be translated (step S207: Yes), the measurement control device 24 translates at least one of the processing head 11 and the stage 141 within the machine coordinate system (step S208). Specifically, when the determination result in step S207 determines, for example, that the processing head 11 is to be translated (step S207: Yes), the measurement control device 24 translates the processing head 11 within the machine coordinate system (step S208). When the determination result in step S207 determines, for example, that the stage 141 is to be translated (step S207: Yes), the measurement control device 24 translates the stage 141 within the machine coordinate system (step S208). In addition, the operation of step S208 can also be the same as the Fig.12 operation of step S108. Therefore, the detailed description of the operation of step S208 is omitted.

[0385] However, in step S208, the measurement control device 24 corrects (i.e., cancels) the movement error generated in the translational movement of at least one of the processing head 11 and the stage 141 based on the error correction information generated in the first movement error calculation operation (i.e., information for correcting the movement error generated in the translational movement of at least one of the processing head 11 and the stage 141). That is, the measurement control device 24 causes at least one of the process...

Claims

1. An optical device, in a machine tool that moves at least one of a stage for mounting a workpiece and a machining head, and simultaneously machines the workpiece using a tool that is detachably assembled on the spindle of the machining head, is assembled on the spindle in place of the tool, The optical device comprises: a direction-changing member capable of changing the traveling direction of measurement light; and a light-receiving unit that receives return light from each of the plurality of reference members, which is generated by receiving the measurement light whose traveling direction has been changed by the direction-changing member through irradiation of each of the plurality of reference members, The light-receiving unit receives the return light generated by irradiating the measurement light to each of at least one reference member disposed on the workpiece mounted on the stage and at least one other reference member disposed on the workpiece or the stage mounted on the stage.

2. A measurement system for use in a machine tool that moves at least one of a stage for mounting a workpiece and a machining head, and simultaneously machines the workpiece using a tool that is detachably assembled on the spindle of the machining head, The measurement system comprises: an optical device that is assembled on the spindle in place of the tool and has a direction-changing member capable of changing the traveling direction of measurement light, the optical device receiving return light from each of at least four reference members, which is generated by receiving the measurement light whose traveling direction has been changed by the direction-changing member through irradiation of each of the at least four reference members; with 251813 1PWCN; 154419-CN-1543-PCT and an arithmetic unit that calculates the position of the optical device based on the light-receiving results of the return light from each of the at least four reference members by the optical device assembled on the spindle, The optical device receives the return light generated by irradiating the measurement light to each of at least one reference member disposed on the workpiece mounted on the stage and at least three reference members disposed on the workpiece or the stage mounted on the stage.

3. The measurement system according to claim 2, wherein the arithmetic unit generates at least one of information related to a movement error generated during the movement of the stage and information related to a movement error generated during the movement of the machining head based on the calculated position of the optical device.

4. The measurement system according to claim 3, wherein the arithmetic unit generates at least one of information for correcting the movement error of the stage and information for correcting the movement error generated during the movement of the machining head based on the information related to the movement error.

5. The measurement system according to any one of claims 2 to 4, wherein whenever the stage or the machining head moves to a plurality of different positions, the optical device receives return light from each of at least four reference members, which is generated by receiving the measurement light whose traveling direction has been changed by the direction-changing member through irradiation of each of the at least four reference members, The operation unit calculates the position of the optical device in the space where the stage or the processing head moves to a plurality of different positions based on the light reception results of the return light from each of the at least four reference members received by the optical device each time the stage or the processing head moves to a plurality of different positions.

6. The measurement system according to claim 5, wherein, the operation unit generates at least one of information related to a movement error generated during the movement of the stage in the space and information related to a movement error generated during the movement of the processing head in the space based on the calculated position of the optical device in the space.

7. The measurement system according to claim 6, wherein, the operation unit generates at least one of information for correcting a movement error generated during the movement of the stage in the space and information for correcting a movement error generated during the movement of the processing head in the space based on the calculated position of the optical device in the space.

8. The measurement system according to claim 6 or 7, wherein, in a state where the optical device is located in a first space outside a second space occupied by the workpiece placed on the stage, each time the stage or the processing head moves to a plurality of different positions, the optical device receives return light from each of the at least four reference members generated by irradiating each of the at least four reference members with the measurement light whose traveling direction has been changed by the direction changing member, the operation unit generates information related to the movement error in the second space based on the information related to the movement error in the first space, and the information related to the movement error in the first space is generated based on the light reception result in the optical device in a state where the optical device is located in the first space.

9. The operation system according to claim 8, wherein, when the at least four reference members are set as a second reference member group and at least four reference members arranged on the stage when the workpiece is not placed on the stage are set as a first reference member group, in a first state where the workpiece is not placed on the stage, each time the stage or the processing head moves to a plurality of different positions, the optical device receives return light from each of the first reference member group generated by irradiating each reference member of the first reference member group with the measurement light whose traveling direction has been changed by the direction changing member, and in a second state where the workpiece is placed on the stage and the optical device is located in the first space, each time the stage or the processing head moves to a plurality of different positions, the optical device receives return light from each of the second reference member group generated by irradiating each reference member of the second reference member group with the measurement light whose traveling direction has been changed by the direction changing member. The operation unit generates information related to the movement error in the second space generated when the workpiece is placed on the stage, based on the following information related to the movement error, that is, information related to the movement error generated based on the light reception result in the optical device in the first condition, and information related to the movement error in the first space, that is, information related to the movement error in the first space generated based on the light reception result in the optical device in the second condition.

10. The measurement system according to claim 9, wherein, 251813 1PWCN; 154419-CN-1543-PCT in the first condition, the optical device is in a third space, and the third space includes the space occupied by the workpiece when the workpiece is placed on the stage and the space other than the space occupied by the workpiece when the workpiece is placed on the stage.

11. The measurement system according to any one of claims 2 to 10, wherein, The operation unit calculates the position of at least one reference member disposed on the workpiece placed on the stage based on the light reception result of the return light from each of the at least four reference members by the optical device.

12. The measurement system according to claim 11, wherein, The operation unit generates at least one of information related to the movement error generated during the movement of the stage in the space where the stage moves to a plurality of different positions and information related to the movement error generated during the movement of the processing head in the space where the processing head moves to a plurality of different positions, which are generated based on the light reception result of the return light from each of the at least four reference members received by the optical device whenever the stage moves to a plurality of different positions and whenever the processing head moves to a plurality of different positions, calculates the position of the at least one reference member based on the generated movement error in the space and the light reception result of the return light from the at least one reference member disposed on the workpiece in the optical device.

13. The measurement system according to any one of claims 2 to 12, wherein, 251813 1PWCN; 154419-CN-1543-PCT The operation unit calculates the position of the workpiece based on the light reception result of the return light from each of the at least four reference members by the optical device.

14. The measurement system according to any one of claims 2 to 13, wherein, The operation unit generates information for correcting the processing path of the workpiece in the machine tool based on the light reception result of the return light from each of the at least four reference members by the optical device.

15. The measurement system according to claim 13 or 14, wherein, The at least one reference member is disposed on a reference feature of the workpiece placed on the stage. The arithmetic unit calculates the position of the reference feature of the workpiece as the position of the workpiece based on the light reception results of the return light from each of the at least four reference members by the optical device.

16. The measuring system according to any one of claims 2 to 15, wherein, At least two of the at least four reference members are respectively disposed on the workpiece placed on the stage, The arithmetic unit calculates the positions of the at least two reference members respectively disposed on the workpiece placed on the stage based on the light reception results of the return light from each of the at least four reference members by the optical device.

17. The measuring system according to claim 16, wherein, The arithmetic unit generates information related to a movement error generated during the movement of the stage in the space where the stage moves to a plurality of different positions, based on the light reception results of the return light from each of the at least four reference members received by the optical device whenever the stage moves to a plurality of different positions, and information related to a movement error generated during the movement of the processing head in the space where the processing head moves to a plurality of different positions, based on the light reception results of the return light from each of the at least four reference members received by the optical device whenever the processing head moves to a plurality of different positions, at least one of which, The arithmetic unit calculates the positions of the at least two reference members based on the generated movement error in the space and the light reception results of the return light from the at least two reference members disposed on the workpiece in the optical device.

18. The measuring system according to any one of claims 2 to 17, wherein, At least two of the at least four reference members are respectively disposed on the workpiece placed on the stage, The arithmetic unit calculates at least one of the position, posture and size of the workpiece based on the light reception results of the return light from each of the at least four reference members by the optical device.

19. The measuring system according to claim 18, wherein, The arithmetic unit generates information for correcting the machining path of the workpiece in the machine tool based on the calculation result of at least one of the position, posture and size of the workpiece.

20. The measuring system according to claim 18 or 19, wherein, The at least two reference members are respectively disposed on the reference feature of the workpiece placed on the stage, The arithmetic unit calculates the position of the reference feature of the workpiece based on the light reception results of the return light from each of the at least four reference members. The arithmetic unit calculates at least one of the position of the workpiece, the posture of the workpiece, and the dimensions of the workpiece based on the position of the reference element calculated.

21. The measurement system according to any one of claims 2 to 20, wherein, the arithmetic unit calculates the position of the optical device based on the temperature of at least one of the workpiece and the stage detected by a temperature detector capable of detecting the temperature of at least one of the workpiece and the stage, and the light reception result of the optical device for the return light from each of the at least four reference members.

22. The measurement system according to any one of claims 2 to 21, wherein, the at least four reference members are at least four first reference members, the optical device irradiates the second reference member with the measurement light at each of a first time and a second time different from the first time, and calculates the distance between the optical device and the second reference member based on the light reception result of the return light from the second reference member generated thereby, the arithmetic unit calculates the position of the optical device based on the difference in the position of the processing head as follows, that is, the distance between the optical device and the second reference member calculated based on the light reception result of the return light from the second reference member at the first time, and the difference in the position of the processing head when the distance between the optical device and the second reference member calculated based on the light reception result of the return light from the second reference member at the second time becomes substantially the same, and the light reception result of the optical device for the return light from each of the at least four first reference members, the second reference member is disposed on the workpiece placed on the stage or the 251813 1PWCN; 154419-CN-1543-PCT stage, the second reference member is the same reference member as at least one of the at least four first reference members, or the second reference member is a reference member different from each of the at least four first reference members.

23. The measurement system according to any one of claims 2 to 22, wherein, the arithmetic unit calculates the distance between the optical device and each of the at least four reference members based on the light reception result of the return light from each of the at least four reference members by the optical device, the arithmetic unit calculates the position of the optical device based on the calculated distance between the optical device and each of the at least four reference members.

24. The measurement system according to claim 23, wherein, the arithmetic unit calculates the distance between the optical device and each of the at least four reference members based on the temperature of at least one of the workpiece and the stage detected by a temperature detector capable of detecting the temperature of at least one of the workpiece and the stage, and the light reception result of the optical device for the return light from each of the at least four reference members, the arithmetic unit calculates the position of the optical device based on the calculated distance between the optical device and each of the at least four reference members.

25. The measuring system according to claim 23 or 24, wherein, the at least four reference members are at least four first reference members, the optical device irradiates the second reference member with the measurement light at each of a first time and a second time different from the first time, and calculates the distance between the optical device and the second reference member based on the light reception result of the return light from the second reference member thus generated, the arithmetic unit calculates the distances between the optical device and each of the at least four first reference members based on the difference in the position of the processing head as follows, that is, the distance between the optical device and the second reference member calculated based on the light reception result of the return light from the second reference member at the first time, and the difference in the position of the processing head when the distance between the optical device and the second reference member calculated based on the light reception result of the return light from the second reference member at the second time becomes substantially the same, and the light reception result of the return light from each of the at least four first reference members by the optical device, the arithmetic unit calculates the position of the optical device based on the calculated distances between the optical device and each of the at least four first reference members, the second reference member is disposed on the workpiece placed on the stage or on the stage, the second reference member is the same reference member as at least one of the at least four first reference members, or the second reference member is a reference member different from each of the at least four first reference members.

26. The measuring system according to any one of claims 22 to 24, wherein, the position of the optical device is a reference point on the optical device side that serves as a reference for calculating the distance.

27. The measuring system according to any one of claims 2 to 26, wherein, the arithmetic unit controls the direction changing member to scan a first area capable of being irradiated with the measurement light by changing the traveling direction of the measurement light through the direction changing member, the optical device receives the return light from the first area generated by scanning the first area with the measurement light, the arithmetic unit calculates the direction of the at least four reference members relative to the optical device based on the light reception result of the return light from the first area by the optical device, the arithmetic unit controls the direction changing member based on the direction obtained by the calculation to irradiate each of the at least four reference members with the measurement light.

28. The measuring system according to claim 27, wherein, the arithmetic unit calculates the directions of at least four second areas smaller than the first area and where the at least four reference members are respectively present relative to the optical device based on the light reception result of the return light from the first area by the optical device, The arithmetic unit controls the direction changing member based on the directions of the at least four second regions to scan each of the at least four second regions with the measurement light. The optical device receives the return light from each of the at least four second regions generated by scanning each of the at least four second regions with the measurement light. The arithmetic unit calculates the directions of the at least four reference members relative to the optical device based on the light receiving results of the return light from each of the at least four second regions by the optical device.

29. The measuring system according to claim 27 or 28, wherein, 251813 1PWCN; 154419-CN-1543-PCT When the directions of the at least four reference members relative to the optical device obtained by the calculation are set as the directions of the at least four reference members relative to the optical device in the case where the relative position relationship between the stage and the processing head is the first position relationship, The arithmetic unit calculates the directions of the at least four reference members relative to the optical device in the case of the second position relationship based on the directions of the at least four reference members relative to the optical device in the case of the first position relationship and at least one of the movement amount and the movement direction of at least one of the stage and the processing head required to change the relative position relationship between the stage and the processing head from the first position relationship to the second position relationship. In the case of the second position relationship, the arithmetic unit controls the direction changing member based on the calculated directions of the at least four reference members to irradiate each of the at least four reference members with the measurement light. The optical device receives the return light from each of the at least four reference members generated by irradiating each of the at least four reference members with the measurement light whose traveling direction has been changed by the direction changing member in the case of the second position relationship.

30. The measuring system according to claim 29, wherein, The arithmetic unit calculates the directions of at least four second regions, which are smaller than the first region and where the at least four reference members are respectively located, relative to the optical device in the case of the second position relationship based on the directions of the at least four reference members relative to the optical device in the case of the first position relationship and at least one of the movement amount and the movement direction of at least one of the stage and the processing head required to change from the first position relationship to the second position relationship. 251813 1PWCN; 154419-CN-1543-PCT In the case of the second position relationship, the arithmetic unit controls the direction changing member based on the calculated directions of the at least four second regions relative to the optical device to scan each of the at least four second regions with the measurement light. The optical device receives return light from each of the at least four second regions generated by scanning each of the at least four second regions with the measurement light in the case of the second positional relationship. Based on the light reception result of the return light from each of the at least four second regions by the optical device, the arithmetic unit calculates the direction of the at least four reference members with respect to the optical device in the case of the second positional relationship.

31. The measurement system according to claim 29 or 30, wherein, the arithmetic unit calculates the position of the optical device in the first positional relationship and the position of the optical device in the second positional relationship based on the light reception result of the return light from each of the at least four reference members by the optical device in the first positional relationship and the light reception result of the return light from each of the at least four reference members in the second positional relationship. Based on the calculated position of the optical device in the first positional relationship and the calculated position of the optical device in the second positional relationship, the movement error in the space through which the stage or the processing head has moved as the change is made from the first positional relationship to the second positional relationship is calculated.

32. The measurement system according to any one of claims 2 to 31, wherein, the movement of the stage or the processing head includes translational movement along at least one of a first translation axis, a second translation axis, and a third translation axis that are orthogonal to each other. Whenever the stage or the processing head is translated to a plurality of different positions, the optical device receives return light from each of the at least four reference members generated by irradiating each of the at least four reference members with the measurement light whose traveling direction has been changed by the direction changing member. Based on the light reception result of the return light from each of the at least four reference members received by the optical device whenever the stage or the processing head is translated to a plurality of different positions, the arithmetic unit calculates the position of the optical device in the space where the stage or the processing head is translated to a plurality of different positions. Based on the calculated position of the optical device in the space, the arithmetic unit generates information related to the movement error generated in the translational movement of the stage in the space and information related to the movement error generated in the translational movement of the processing head in the space.

33. The measurement system according to claim 32, wherein, Whenever the processing head is translated to a plurality of different positions along at least one of the first translation axis to the third translation axis, the optical device receives return light from each of the at least four reference members. The arithmetic unit calculates the position of the optical device in a space where the optical device is translated to a plurality of different positions along at least one of the first to third translation axes based on the light reception results of the return light from each of the at least four reference members received by the optical device each time the processing head is translated to a plurality of different positions. The arithmetic unit calculates information related to a movement error generated during the translation movement of the processing head in the space along at least one of the first to third translation axes based on the calculated position of the optical device in the space.

34. The measurement system according to claim 32 or 33, wherein, Each time the stage is translated to a plurality of different positions along at least one of the first to third translation axes, the optical device receives the return light from each of the at least four reference members that move as the stage is translated. The arithmetic unit calculates the position of the optical device relative to at least one of the at least four reference members in a space where the optical device is translated to a plurality of different positions along at least one of the first to third translation axes based on the light reception results of the return light from each of the at least four reference members received by the optical device each time the stage is translated to a plurality of different positions. The arithmetic unit calculates a movement error generated during the translation movement of the stage in the space along at least one of the first to third translation axes based on the calculated position of the optical device in the space.

35. The measurement system according to any one of claims 32 to 34, wherein, The movement of the stage or the processing head includes, in addition to the translation movement, a rotational movement about at least one of the first, second, and third rotation axes that are orthogonal to each other. Each time the stage or the processing head is rotated to a plurality of different positions about at least one of the first to third rotation axes, the optical device receives, at each of at least three position relationships where the relative position relationship between the stage and the processing head is different, the return light from each of the at least three reference members generated by irradiating each of the at least three reference members with the measurement light whose traveling direction has been changed by the direction changing member. The arithmetic unit calculates the position of each of the at least three reference members at each rotational movement based on the light reception results of the return light from each of the at least three reference members received by the optical device at each of the at least three position relationships. The operation unit calculates at least one of the movement errors generated during the rotational movement of the processing head about at least one of the first to third rotational axes and the movement errors generated during the rotational movement of the stage about at least one of the first to third rotational axes, based on the positions of the at least three reference members at each of the rotational movements calculated. The at least three reference members are respectively disposed on the workpiece placed on the stage or on the stage. At least one of the at least three reference members is the same reference member as at least one of the at least four reference members, or each of the at least three reference members is a different reference member from each of the at least four reference members. The stage or the processing head is positioned in the at least three positional relationships based on information related to the movement errors generated during the translational movement.

36. The measuring system according to any one of claims 2 to 35, wherein, 251813 1PWCN; 154419-CN-1543-PCT Before the machine tool starts machining the workpiece, the optical device receives the return light from each of the at least four reference members, which is generated by irradiating each of the at least four reference members with the measurement light in a state where the workpiece is placed on the stage. The operation unit calculates the position of the optical device based on the light reception results of the return light from each of the at least four reference members by the optical device before the machine tool starts machining the workpiece.

37. The measuring system according to any one of claims 2 to 36, wherein, The optical device irradiates one of the at least four reference members with the measurement light traveling along one optical path between the optical device and the workpiece. The optical device receives, as the return light, the light traveling along the one optical path in the light from the one reference member generated by irradiating the one reference member with the measurement light.

38. The measuring system according to any one of claims 2 to 37, wherein, The measurement light is parallel light.

39. The measuring system according to any one of claims 2 to 38, wherein, The measuring system further includes a light detector that detects interference light generated by interference between the return light from each of the at least four reference members received by the optical device and a reference light.

40. The measuring system according to claim 39, wherein, The light detector is disposed inside the optical device.

41. The measuring system according to claim 39, wherein, 251813 1PWCN; 154419-CN-1543-PCT the light detector is disposed outside the optical device.

42. The measuring system according to any one of claims 2 to 41, wherein, The direction changing member has a reflecting member. The reflection member can change the traveling direction of the measurement light by rotating about a rotation axis that intersects the optical path on the incident side of the measurement light incident on the reflection member.

43. The measurement system according to claim 42, wherein, the optical device further includes an irradiation optical system that irradiates the workpiece with the measurement light emitted from the direction changing member, when the reflector rotates about the rotation axis, the deflection angle of the measurement light emitted from the irradiation optical system is larger than the deflection angle of the measurement light emitted from the direction changing member.

44. The measurement system according to claim 43, wherein, the irradiation optical system includes a first optical system that forms a real image of the reflection member or a second optical system that forms a virtual image of the reflection member.

45. The measurement system according to any one of claims 42 to 44, wherein, the rotation axis is a first rotation axis, the reflection member can change the traveling direction of the measurement light by rotating about a second rotation axis that intersects the optical path on the incident side of the measurement light incident on the reflection member and intersects the first rotation axis.

46. The measurement system according to any one of claims 42 to 45, wherein, the optical device can change the range of change in the traveling direction of the measurement light 251813 1PWCN; 154419-CN-1543-PCT emitted from the direction changing member.

47. The measurement system according to claim 46, wherein, the optical device can change the range of change in the traveling direction of the measurement light by changing the assembly angle of the direction changing member relative to the optical device.

48. The measurement system according to claim 46 or 47, wherein, the optical device can change the range of change in the traveling direction of the measurement light by changing the incident direction of the measurement light incident on the direction changing member.

49. The measurement system according to claim 48, wherein, the optical device includes: a first reflective optical element that reflects the measurement light toward the direction changing member in such a way that the measurement light is incident on the direction changing member from a first incident direction; a second reflective optical element that reflects the measurement light toward the direction changing member in such a way that the measurement light is incident on the direction changing member from a second incident direction different from the first incident direction; and an optical path switching optical element that switches the optical path of the measurement light between a first optical path that makes the measurement light travel toward the first reflective optical element and a second optical path that makes the measurement light travel toward the second reflective optical element, the measurement light incident on the direction changing member from the first incident direction is reflected by the reflection member and travels in a traveling direction within a first range of change in the traveling direction, The measurement light incident on the direction-changing optical system from the second incident direction is reflected by the reflection member and travels in a traveling direction within a range of a second traveling direction that is at least partially different from the range of the change in the first traveling direction.

50. The measurement system according to any one of claims 42 to 49, wherein, the direction-changing member is a first direction-changing member, the reflection member is a first reflection member, the optical device includes a second direction-changing member that can change the traveling direction of the measurement light using a second reflection member that can rotate about a second rotation axis that intersects the optical path on the incident side of the measurement light incident on the reflection member and intersects the first rotation axis, the measurement light emitted from the second direction-changing member is incident on the first direction-changing member.

51. The measurement system according to claim 49, wherein, the optical device further includes a relay optical system disposed on the optical path of the measurement light between the first direction-changing member and the second direction-changing member and making the first direction-changing member and the second direction-changing member in an optically conjugate relationship.

52. A machine tool, comprising: the measurement system according to any one of claims 2 to 51; the machining head; the stage; and a driving device that moves at least one of the machining head and the mounting device.

53. A measurement method for a machine tool that moves at least one of a stage on which a workpiece is mounted and a machining head while machining the workpiece using a tool detachably assembled on the spindle of the 251813 1PWCN ； 154419-CN-1543-PCT spindle of the machining head, the measurement method comprising: irradiating measurement light to each of at least four reference members using an optical device assembled on the spindle in place of the tool; receiving, by the optical device, return light from each of the at least four reference members generated by irradiating the measurement light to each of the at least four reference members; and calculating the position of the optical device based on the light-receiving result of the return light from each of the at least four reference members by the optical device, the at least four reference members are respectively disposed on the workpiece mounted on the stage or on the stage, at least one of the at least four reference members is disposed on the workpiece mounted on the stage.

54. A computer program that causes a computer to execute the measurement method according to claim 53.

55. A recording medium that records the computer program according to claim 54.

56. An optical device that is assembled on the spindle of a machining head in place of a tool in a machine tool that moves at least one of a stage on which a workpiece is mounted and a machining head while machining the workpiece using a tool detachably assembled on the spindle of the machining head, the optical device comprising: a direction-changing member that can change the traveling direction of measurement light; and The light-receiving unit receives the light in the direction 251813 1PWCN by irradiating each of at least four reference members; the light-receiving unit receives the return light from each of the at least four reference members, which is generated by the measurement light whose traveling direction is changed by the change member, the light-receiving unit receives the return light generated by irradiating the measurement light to each of at least one reference member disposed on the workpiece placed on the stage among the at least four reference members, and at least three reference members disposed on the workpiece placed on the stage or on the stage, the light-receiving result of the return light by the light-receiving unit is used to calculate the position of the optical device.

57. A machine tool that moves at least one of a stage on which a workpiece is placed and a machining head, and simultaneously machines the workpiece with a tool that can be detachably assembled on the spindle of the machining head, the machine tool includes an arithmetic unit that calculates the position of the optical device based on the light-receiving result of the optical device. The optical device is assembled on the spindle instead of the tool and receives the return light from each of at least four reference members generated by irradiating the measurement light to each of the at least four reference members, the arithmetic unit calculates the position of the optical device based on the light-receiving result of the return light by the optical device. The return light is generated by irradiating the measurement light to each of at least one reference member disposed on the workpiece placed on the stage among the at least four reference members, and at least three reference members disposed on the workpiece placed on the stage or on the stage.

58. A measurement system for a machine tool, the machine tool moves at least one of a stage on which a workpiece is placed and a machining head, and simultaneously machines the workpiece with a tool that can be detachably assembled on the spindle of the machining head, the measurement system includes: an optical device that receives the return light from the reference member generated by irradiating the measurement light to the reference member whenever the stage or the machining head moves to a plurality of different positions in a state where the spindle is in a first space other than a second space occupied by the workpiece placed on the stage; and an arithmetic unit that calculates the position related to the spindle in the first space based on the light-receiving result of the return light from the reference member received by the optical device whenever the stage or the machining head moves to a plurality of different positions, and calculates the position related to the spindle in the second space based on the calculated position related to the spindle in the first space.

59. A measurement system for a machine tool, the machine tool moves at least one of a stage on which a workpiece is placed and a machining head, and simultaneously machines the workpiece with a tool that can be detachably mounted on the spindle of the machining head, the measurement system includes: An optical device is assembled on the spindle instead of the tool and receives the return light from the reference member generated by irradiating the reference member disposed on the workpiece placed on the stage or the reference member on the stage with measurement light; and An arithmetic unit calculates the position of the optical device based on the temperature of at least one of the workpiece and the stage detected by a temperature detector capable of detecting the temperature of at least one of the workpiece and the stage, and the light receiving result of the optical device for the return light from the reference member.

60. A measurement system for use in a machine tool, the machine tool moving at least one of a stage on which a workpiece is placed and a machining head, and machining the workpiece with a tool detachably assembled on the spindle of the machining head. The measurement system comprises: An optical device is assembled on the spindle instead of the tool and receives the return light from the reference member generated by irradiating the reference member with measurement light; and An arithmetic unit calculates the position of the optical device based on the light receiving result of the optical device assembled on the spindle for the return light from the reference member. The optical device includes a direction changing member capable of changing the traveling direction of the measurement light. The arithmetic unit controls the direction changing member to change the traveling direction of the measurement light by the direction changing member and scan a first area capable of irradiating the measurement light with the measurement light. The optical device receives the return light from the first area generated by scanning the first area with the measurement light. The arithmetic unit calculates the direction of the reference member relative to the optical device based on the light receiving result of the optical device for the return light from the first area. The arithmetic unit controls the direction changing member based on the direction of the reference member to irradiate the reference member with the measurement light.

61. A measurement system for use in a machine tool, the machine tool moving at least one of a stage on which a workpiece is placed and a machining head, and machining the workpiece with a tool detachably assembled on the ； 154419-CN-1543-PCT spindle of the machining head. The measurement system includes: An optical device is assembled on the spindle instead of the tool and has a direction changing member capable of changing the traveling direction of the measurement light. The optical device receives the return light from each of at least four reference members generated by irradiating each of the at least four reference members disposed on at least one of the stage and the workpiece with the measurement light whose traveling direction has been changed by the direction changing member. and An arithmetic unit calculates the distance between the optical device and each of the at least four reference members based on the light receiving result of the optical device for the return light from each of the at least four reference members, and generates information for controlling the machine tool based on the calculated distance.

62. The measuring system according to claim 61, wherein, the optical device receives the return light generated by irradiating the measurement light to each of at least one reference member disposed on the workpiece placed on the stage among the at least four reference members, and each of at least three reference members disposed on the workpiece placed on the stage or the stage.

63. The measuring system according to claim 61 or 62, wherein, the information for controlling the machine tool includes information related to the movement error generated during the movement of the stage or the machining head.

64. The measuring system according to any one of claims 61 to 63, wherein, the information for controlling the machine tool includes information for correcting the movement error of the stage or the machining head.

65. A machine tool that moves at least one of a stage on which a workpiece is placed and a machining head, and simultaneously machines the workpiece using a tool that is detachably assembled on the spindle of the machining head, the machine tool includes an arithmetic unit that calculates the distance between the optical device and each of the at least four reference members based on the light receiving result of an optical device that is assembled on the spindle instead of the tool and receives the return light from each of the at least four reference members generated by irradiating the measurement light to each of the at least four reference members disposed on at least one of the stage and the workpiece, and controls at least one of the stage and the machining head based on the command value related to the movement of at least one of the stage and the machining head and the calculated distance.

66. The machine tool according to claim 65, wherein, the arithmetic unit calculates the distance based on the light receiving result of the return light by the optical device, and the return light is generated by irradiating the measurement light to each of at least one reference member disposed on the workpiece placed on the stage among the at least four reference members, and each of at least three reference members disposed on the workpiece placed on the stage or the stage.

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