Chip temperature control device and chip temperature control method
Patent Information
- Application Number
- CN202280100886.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2022-12-22
- Publication Date
- 2025-05-27
AI Technical Summary
In molecular detection chips, especially when there are large-area circuit chips, it is difficult to achieve temperature control accuracy and uniformity. This is mainly due to the poor thermal conductivity of the packaging substrate, which leads to increased temperature differences and unevenness within the chip.
Design a chip temperature control device, including a molecular detection chip, a heat sink and a packaging substrate. The heat sink is placed under the chip in contact with its bottom surface. The packaging substrate is placed under the chip in contact with the heat sink, and assists in heat dissipation through heat conductors and temperature controls. , improve temperature uniformity and accuracy.
It effectively improves the temperature control accuracy and temperature uniformity of the chip, reduces the temperature difference within the chip surface, and improves the temperature control performance of molecular detection.
Smart Images
Figure CN120051740A_ABST
Abstract
Description
Chip temperature control device and chip temperature control method Technical Field
[0001] The present application relates to the field of molecular diagnosis technology, for example, to a chip temperature control device and a chip temperature control method. Background Art
[0002] Chip-based molecular diagnostic products (such as gene sequencing chips) have high requirements for reaction temperature control because biochemical reactions are involved in molecular detection. The control of reaction temperature includes two aspects: temperature accuracy and uniformity.
[0003] Chips include those without circuitry and those with circuitry. Chips without circuitry lack their own heat source, so their temperature is entirely dependent on external temperature control structures. These chips can generally meet the requirements for high-precision and high-uniformity temperature control more easily through appropriate heat plate designs. Chips with circuitry, on the other hand, generate heat from their own circuit units, making it difficult to achieve uniform heat distribution. This increases the difficulty of temperature control, especially for large-area chips.
[0004] The temperature control structures in related technologies all include a molecular detection chip and a packaging substrate, with the molecular detection chip in direct contact with the packaging substrate. The packaging substrate, as the first heat-conducting medium, has poor thermal conductivity, which directly affects the accuracy of temperature control and the temperature uniformity within the molecular detection chip. For example, for molecular detection chips with larger areas, the larger the area, the greater the power consumption, further leading to reduced temperature control accuracy and increased temperature differences and non-uniformity within the chip surface.
[0005] Summary of the Invention
[0006] The present application provides a chip temperature control device, which has high temperature control accuracy for the chip and good temperature uniformity within the chip surface.
[0007] An embodiment of the present application provides a chip temperature control device, comprising: a molecular detection chip; a heat sink, the heat sink being arranged below the molecular detection chip and abutting against the bottom surface of the molecular detection chip; and a packaging substrate, the packaging substrate being arranged below the molecular detection chip and abutting against the heat sink.
[0008] The embodiment of the present application provides a chip temperature control method, which has high temperature control accuracy for the chip and good temperature uniformity within the chip surface.
[0009] An embodiment of the present application provides a chip temperature control method for use in the above-mentioned chip temperature control device. The chip temperature control method includes:
[0010] The heat generated by the molecular detection chip is directly transferred to the heat sink;
[0011] The heat sink transfers heat directly to the thermal conductor. BRIEF DESCRIPTION OF THE DRAWINGS
[0012] FIG1 is a schematic diagram of a chip temperature control device provided in one embodiment of the present application;
[0013] FIG2 is an exploded view of a chip temperature control device provided in one embodiment of the present application;
[0014] FIG3 is a top view of a package substrate of a chip temperature control device provided in a first embodiment of the present application;
[0015] FIG4 is a cross-sectional view of a package substrate of a chip temperature control device provided in a first embodiment of the present application;
[0016] FIG5 is a schematic diagram of a chip temperature control device provided by another embodiment of the present application;
[0017] FIG6 is a cross-sectional view of a packaging substrate of a chip temperature control device provided in another embodiment of the present application.
[0018] In the picture:
[0019] 100. Molecular detection chip;
[0020] 200, heat sink;
[0021] 300, packaging substrate; 310, through hole; 311, first hole; 312, second hole;
[0022] 400, heat conducting parts;
[0023] 500, temperature control unit;
[0024] 600. Heat dissipation component. DETAILED DESCRIPTION
[0025] In the description of this application, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, they cannot be understood as limitations on this application. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance. Among them, the terms "first position" and "second position" are two different positions.
[0026] In the description of this application, it should be noted that, unless otherwise specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they can refer to fixed or detachable connections; mechanical or electrical connections; direct or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this application in specific contexts.
[0027] The present application provides a chip temperature control device, as shown in Figures 1, 2 and 5, which includes a molecular detection chip 100, a heat sink 200 and a packaging substrate 300. In some embodiments, the molecular detection chip 100, the heat sink 200 and the packaging substrate 300 are arranged in sequence from top to bottom. It should be noted that the top to bottom here is based on the position of the chip temperature control device in Figures 1, 2 and 5. Of course, the position of the chip temperature control device can also be adjusted according to demand and is not limited to being set in the vertical direction, as long as the relative relationship between the multiple components of the chip temperature control device remains consistent.
[0028] The molecular detection chip 100 is a chip containing a silicon-based integrated circuit and a biosensor array. In some embodiments, the molecular detection chip 100 is a gene sequencing chip, and the number of detection circuit arrays in the gene sequencing chip is greater than 64.
[0029] The heat sink 200 is arranged on the lower bottom surface of the molecular detection chip 100. The heat sink 200 has good thermal conductivity and is configured to conduct heat generated during the operation of the molecular detection chip 100. In some embodiments, the heat sink 200 is a metal sheet. For example, the heat sink 200 can be a copper sheet or an aluminum sheet. In some embodiments, the heat sink 200 is a graphite sheet. Of course, in addition to the graphite sheet, other non-metallic sheets with good thermal conductivity can also be used as the heat sink 200. In some embodiments, the heat sink 200 includes a metal sheet and a graphite sheet, and the metal sheet and the graphite sheet are stacked. In the embodiment of the present application, there is no restriction on the number of metal sheets and graphite sheets, and they can be flexibly arranged according to needs. When there are multiple metal sheets and graphite sheets, there is no requirement for the arrangement order of the metal sheets and graphite sheets.
[0030] For example, the thickness of the heat sink 200 is between 5um and 10mm, for example, the thickness of the heat sink 200 can be 5um, 10um, 1mm, 7mm or 10mm. For example, the molecular detection chip 100 is a rectangular piece, and correspondingly, the heat sink 200 is a rectangular piece, and the size of the heat sink 200 is the same as the size of the molecular detection chip 100, or the size of the heat sink 200 is smaller than the size of the molecular detection chip 100, so as to provide sufficient space for the wire connection between the molecular detection chip 100 and the packaging substrate 300. Of course, the heat sink 200 is not limited to a rectangular piece. When the shape of the molecular detection chip 100 changes, the shape of the heat sink 200 is adjusted accordingly, which is conducive to improving the heat dissipation effect of the molecular detection chip 100.
[0031] Continuing with reference to Figures 1 and 5, the packaging substrate 300 is disposed below the molecular detection chip 100. In some embodiments, the packaging substrate 300 is a printed circuit board PCB, the thickness of the printed circuit board PCB is between 0.1 mm and 10 mm, and an electrical connection is established between the packaging substrate 300 and the molecular detection chip 100 via a metal wire or a metal ball. The packaging substrate 300 is provided with a through hole 310 along the thickness direction. In some embodiments, at least a portion of the through hole 310 is located below the molecular detection chip 100. For example, the through hole 310 can be arranged to be directly opposite the molecular detection chip 100 for rapid heat conduction. The size of the through hole 310 can be set to be smaller than the size of the molecular detection chip 100 or equal to the size of the molecular detection chip 100 as required.
[0032] In some embodiments, as shown in Figures 3 and 4, the through-hole 310 is a straight through-hole, i.e., the shapes and sizes of the multiple cross-sections of the through-hole 310 in the height direction are the same, and the opening size of the through-hole 310 is smaller than the size of the molecular detection chip 100. The opening size of the through-hole 310 can be larger than, smaller than, or equal to the size of the heat sink 200. When assembling the molecular detection chip 100, the heat sink 200, and the packaging substrate 300, the heat sink 200 is first attached to the lower surface of the molecular detection chip 100, and then placed on the annular top surface of the packaging substrate 300 with the heat sink 200 at the bottom and the molecular detection chip 100 at the top. The heat sink 200 covers the top opening of the through-hole 310 of the packaging substrate 300.
[0033] In some parallel embodiments, as shown in Figures 5 and 6, the through-hole 310 is a stepped hole. For example, the through-hole 310 includes a first hole 311 and a second hole 312 connected in a stepped manner. The first hole 311 is larger than the second hole 312, thereby forming a stepped surface at the junction of the first hole 311 and the second hole 312. The first hole 311 is larger than the heat sink 200, so that at least a portion of the heat sink 200 can be positioned within the first hole 311. In other words, the thickness of the heat sink 200 can be less than the depth of the first hole 311, or it can be equal to or greater than the depth of the first hole 311. When assembling the molecular detection chip 100, the heat sink 200, and the packaging substrate 300, the heat sink 200 is first attached to the bottom surface of the molecular detection chip 100. Then, the heat sink 200 is placed within the through-hole 310 of the packaging substrate 300 with the heat sink 200 at the bottom and the molecular detection chip 100 at the top. This arrangement helps improve the structural compactness and stability of the entire chip temperature control device. For example, the thickness of the heat sink 200 is smaller than the depth of the first hole 311 of the stepped through hole 310 . The heat sink 200 is placed in the first hole 311 , and at least a portion of the molecular detection chip 100 is also placed in the first hole 311 .
[0034] It should be noted that the cross-sectional shape of the first hole 311 and the cross-sectional shape of the second hole 312 can be the same or different. For example, the cross-sectional shape of the first hole 311 can be the same as the cross-sectional shape of the heat sink 200. For example, the size of the second hole 312 can be smaller than the size of the molecular detection chip 100 to prevent the molecular detection chip 100 from falling through the hole 310. The size of the heat sink 200 can be larger than the size of the second hole 312, or smaller than or equal to the size of the second hole 312.
[0035] In some embodiments, the chip temperature control device further includes a heat conductor 400, which is in the shape of an elongated strip. The top of the heat conductor 400 passes through the through-hole 310 and abuts against the heat sink 200. The heat conductor 400 is a block-shaped structure made of a material with good thermal conductivity. In some embodiments, the heat conductor 400 includes a metal block. For example, the heat conductor 400 can be an aluminum block or a copper block. In some embodiments, the heat conductor 400 can also be a graphite block. In some embodiments, the heat conductor 400 includes a metal block and a graphite block, and the metal block and the graphite block are connected to each other. In the embodiment of the present application, there is no limit on the number of metal blocks and graphite blocks, and they can be flexibly arranged according to needs. In addition, in the embodiment of the present application, there is no limit on the shape of the heat conductor 400, as long as it can pass through the through-hole 310 and abut against the heat sink 200. In addition, in some other embodiments, the heat conductor 400 includes an aluminum block and a thermally conductive silicone pad arranged in a stacked manner.
[0036] For example, in order to improve the contact performance and heat transfer performance between the thermal conductor 400 and the heat sink 200, a contact strengthening structure is provided between the top surface of the thermal conductor 400 and the bottom surface of the heat sink 200. The contact strengthening structure can be a single-layer structure. In some embodiments, the contact strengthening structure is thermally conductive silicone. In some embodiments, the contact strengthening structure is thermally conductive silicone grease. In some embodiments, the contact strengthening structure is graphite film. Of course, in some other embodiments, the contact strengthening structure can also be a multi-layer structure. The contact strengthening structure includes a plurality of stacked strengthening layers. Each strengthening layer can be made of thermally conductive silicone, thermally conductive silicone grease, or graphite film according to needs.
[0037] In addition, in the embodiments of the present application, the form of the thermally conductive silicone is not limited, and the thermally conductive silicone can be liquid, gel or solid; the shape of the thermally conductive silicone is not limited, and the thermally conductive silicone can be granular or sheet-like.
[0038] For example, in order to improve the contact performance and heat transfer performance between the molecular detection chip 100 and the heat sink 200 , thermally conductive silica gel, thermally conductive silicone grease or graphite film may be disposed between the molecular detection chip 100 and the heat sink 200 .
[0039] In some embodiments, the chip temperature control device further includes a heat dissipation component 600, which is configured to dissipate heat from the heat conducting member 400. In some embodiments, the heat dissipation component 600 includes a heat sink, such as an aluminum heat sink with comb teeth or needle-like structures, or a fan.
[0040] In some embodiments, the chip temperature control device further includes a temperature control element 500, which is disposed between the thermal conductor 400 and the heat sink 600. The temperature control element 500 can provide a temperature source, such as a heat source or a cold source, thereby significantly improving the performance of the chip temperature control structure. In some embodiments, the temperature control element 500 is a semiconductor cooling heater or a resistive heater.
[0041] A chip temperature control device according to an exemplary embodiment of the present application will be described below with reference to FIG. 1 to FIG. 4 .
[0042] As shown in Figures 1 to 4, the chip temperature control device includes a molecular detection chip 100, a heat sink 200, a packaging substrate 300, a thermal conductor 400, a temperature control unit 500, and a heat dissipation assembly 600. The heat sink 200 is bonded to the bottom surface of the molecular detection chip 100 using thermally conductive silicone. The packaging substrate 300 is provided with a through hole 310. The through hole 310 is a straight through hole, that is, the shape and size of multiple cross-sections of the through hole 310 in the height direction are the same, and the opening size of the through hole 310 is smaller than the size of the molecular detection chip 100, and the opening size of the through hole 310 is also smaller than the size of the heat sink 200. The heat sink 200 is bonded to the annular top surface of the packaging substrate 300 and covers the top opening of the through hole 310 in the packaging substrate 300. The top end of the thermal conductor 400 passes through the through hole 310 and abuts against the heat sink 200. A contact strengthening structure is provided between the thermal conductor 400 and the heat sink 200. The contact strengthening structure can be at least one of thermally conductive silicone, thermally conductive grease, or graphite film. The temperature control unit 500 is a semiconductor cooling and heating element. The temperature control unit 500 is located on the side of the thermal conductor 400 away from the heat sink 200 and abuts against the thermal conductor 400. The heat dissipation assembly 600 is located on the side of the temperature control unit 500 away from the thermal conductor 400 and includes a radiator. The radiator can be an aluminum radiator with comb-shaped or needle-like structures, or a fan.
[0043] The following describes a chip temperature control device according to another exemplary embodiment of the present application with reference to FIG. 5 and FIG. 6 .
[0044] As shown in Figures 5 and 6, the chip temperature control device includes a molecular detection chip 100, a heat sink 200, a packaging substrate 300, a thermal conductor 400, a temperature control unit 500, and a heat dissipation assembly 600. The heat sink 200 is bonded to the lower bottom surface of the molecular detection chip 100 by thermally conductive silicone. A through hole 310 is provided on the packaging substrate 300. The through hole 310 is a stepped hole. For example, the through hole 310 includes a first hole 311 and a second hole 312 connected in a stepped manner. The size of the first hole 311 is larger than the size of the second hole 312, thereby forming a stepped surface at the connection between the first hole 311 and the second hole 312. The size of the first hole 311 is larger than the size of the heat sink 200, and at least a portion of the heat sink 200 is placed in the first hole 311. The top of the thermal conductor 400 passes through the through hole 310 and abuts against the heat sink 200. A contact strengthening structure is provided between the thermal conductor 400 and the heat sink 200. The contact strengthening structure can be at least one of thermally conductive silicone, thermally conductive grease, or graphite film. The temperature control unit 500 is a semiconductor cooling and heating element. The temperature control unit 500 is located on the side of the thermal conductor 400 away from the heat sink 200 and abuts against the thermal conductor 400. The heat dissipation assembly 600 is located on the side of the temperature control unit 500 away from the thermal conductor 400 and includes a radiator. The radiator can be an aluminum radiator with comb-shaped or needle-like structures, or a fan.
[0045] This application also discloses a chip temperature control method, which is used in the above-mentioned chip temperature control device. The chip temperature control method includes the following steps:
[0046] The heat generated by the molecular detection chip 100 during operation is directly transferred to the heat sink 200;
[0047] The heat sink 200 transfers heat directly to the heat conducting member 400 .
[0048] Subsequently, with the assistance of the heat dissipation assembly 600 , the heat conducted to the heat-conducting element 400 and the temperature control unit 500 can be released into the air or other media.
[0049] The chip temperature control device and temperature control method effectively enhance the heat dissipation effect of the chip and improve the chip temperature control performance by adding a heat sink 200 to the back of the molecular detection chip 100 and opening a through hole 310 on the packaging substrate 300 to allow the heat sink 200 and the heat conductor 400 to directly contact each other.
[0050] The chip temperature control device provided in this application includes a molecular detection chip, a heat sink, and a packaging substrate. The heat sink is disposed below the molecular detection chip and abuts the bottom surface of the molecular detection chip. The packaging substrate is disposed below the molecular detection chip and abuts the heat sink. By disposing a heat sink between the molecular detection chip and the packaging substrate, the chip temperature control device allows the heat generated by the molecular detection chip to be quickly dissipated through the heat sink, thereby enhancing the heat dissipation effect of the molecular detection chip and improving the chip's temperature control performance in terms of accuracy and uniformity.
Claims
1. A chip temperature control device, comprising: Molecular detection chip (100); a heat sink (200), the heat sink (200) being arranged below the molecular detection chip (100) and abutting against the bottom surface of the molecular detection chip (100); A packaging substrate (300) is provided below the molecular detection chip (100) and abuts against the heat sink (200).
2. The chip temperature control device according to claim 1, wherein: The packaging substrate (300) is provided with a penetration hole (310); The chip temperature control device further comprises a heat conducting member (400), the top end of the heat conducting member (400) passing through the through hole (310) and abutting against the heat sink (200).
3. The chip temperature control device according to claim 2, wherein: The heat sink (200) is at least partially disposed in the through hole (310).
4. The chip temperature control device according to claim 3, wherein: The through hole (310) comprises a first hole (311) and a second hole (312) connected in a stepped manner, the size of the first hole (311) is larger than the size of the second hole (312), and the heat sink (200) is at least partially disposed in the first hole (311).
5. The chip temperature control device according to claim 3, wherein: The thickness of the heat sink (200) is smaller than the depth of the through hole (310), and the molecular detection chip (100) is at least partially placed in the through hole (310).
6. The chip temperature control device according to claim 2, wherein: The heat sink (200) is arranged above the packaging substrate (300), and the bottom surface of the heat sink (200) abuts against the top surface of the packaging substrate (300).
7. The chip temperature control device according to claim 4, wherein: The size of the second hole (312) is smaller than the size of the molecular detection chip (100).
8. The chip temperature control device according to claim 2, wherein: The heat conducting member (400) includes at least one of a metal block and a graphite block.
9. The chip temperature control device according to claim 2, wherein: The heat conducting member (400) comprises an aluminum block and a heat conducting silica gel pad which are stacked.
10. The chip temperature control device according to claim 2, wherein: A contact strengthening structure is provided between the top surface of the heat conducting member (400) and the bottom surface of the heat sink (200); the contact strengthening structure is a single-layer structure, and the contact strengthening structure is one of a heat-conducting silica gel layer, a heat-conducting silicone grease layer and a graphite film.
11. The chip temperature control device according to claim 2, wherein: A contact strengthening structure is provided between the top surface of the heat conducting member (400) and the bottom surface of the heat sink (200), wherein the contact strengthening structure comprises a plurality of stacked strengthening layers, and each strengthening layer comprises one of the following: a thermally conductive silicone layer, a thermally conductive silicone grease layer, and a graphite film.
12. The chip temperature control device according to any one of claims 2 to 11, further comprising a heat dissipation component (600), wherein the heat dissipation component (600) is configured to dissipate heat for the heat conducting member (400).
13. The chip temperature control device according to claim 12, wherein: The heat dissipation assembly (600) includes a heat sink.
14. The chip temperature control device according to claim 12, further comprising a temperature control unit (500), wherein the temperature control unit (500) is arranged between the heat conducting member (400) and the heat dissipation component (600).
15. The chip temperature control device according to claim 14, wherein: The temperature control unit (500) is a semiconductor cooling and heating plate or a resistance heating plate.
16. The chip temperature control device according to any one of claims 1 to 11, wherein: The size of the heat sink (200) is smaller than or equal to the size of the molecular detection chip (100).
17. The chip temperature control device according to any one of claims 1 to 11, wherein: The heat sink (200) includes at least one of a metal sheet and a graphite sheet.
18. A chip temperature control method, used in the chip temperature control device according to any one of claims 2 to 15, the chip temperature control method comprising: The heat generated by the molecular detection chip (100) during operation is directly transferred to the heat sink (200); The heat sink (200) transfers heat directly to the heat conducting member (400).