Exhaust device, exhaust system and wafer processing equipment

Abstract

The invention provides an exhaust device, an exhaust system and wafer processing equipment. The two ends of the air exhaust device are in fluid connection with a machining cavity of the wafer machining equipment and an air duct outside the wafer machining equipment respectively, and the air exhaust device comprises a first air exhaust pipe, a second air exhaust pipe and a third air exhaust pipe, the branch pipe is arranged at the communicating hole of the first exhaust pipe and is in fluid communication with the first exhaust pipe through the communicating hole, and the branch pipe is configured to be connected with the air pressure detector; and the second exhaust pipe is at least partially nested in the first exhaust pipe, the side wall of the second exhaust pipe at least covers the communicating hole, and a buffer gap is formed between the side wall of the second exhaust pipe and the side wall of the first exhaust pipe at the communicating hole, so that the situation that airflow carries machining dust to impact into the branch pipe is avoided. According to the technical scheme, the airflow speed at the branch pipe is remarkably reduced, vortex is effectively prevented, and dust deposition of the branch pipe and the pressure measuring air pipe is avoided.

Description

Technical Field

[0001] The present application relates to the technical field of wafer processing, and particularly relates to an exhaust device, an exhaust system and a wafer processing apparatus. Background Art

[0002] For a wafer processing apparatus, specifically, for example, a wafer thinning apparatus, in order to eliminate the dust floating in the apparatus chamber ground off by grinding, an exhaust is provided. To ensure effective dust elimination, a certain wind pressure needs to be achieved. Usually, the wind pressure of the exhaust duct is detected. A hole is opened on the side wall of the exhaust duct, and a differential pressure transmitter is connected through a pressure measuring air pipe for wind pressure detection. When the wind pressure is insufficient, an alarm will be given to remind the staff to perform maintenance. However, due to the accumulation of dust in the pressure measuring air pipe, false alarms may occur. Summary of the Invention

[0003] The present application provides an exhaust system and a wafer processing apparatus to solve or alleviate at least some of the problems in the background art.

[0004] According to one aspect of the present application, there is provided an exhaust device for an exhaust system of a wafer processing apparatus. Both ends of the exhaust device are fluidly connected to a processing chamber of the wafer processing apparatus and a duct outside the wafer processing apparatus respectively. The exhaust device includes:

[0005] A first exhaust duct having a communication hole opened on its side wall;

[0006] A branch pipe disposed at the communication hole of the first exhaust duct and fluidly connected to the first exhaust duct through the communication hole. The branch pipe is configured to be connected to a wind pressure detector;

[0007] A second exhaust duct at least partially nested in the first exhaust duct. The side wall of the second exhaust duct at least covers the communication hole. There is a buffer gap between the side wall of the second exhaust duct and the side wall of the first exhaust duct at the communication hole to prevent the air flow carrying processing dust from impacting into the branch pipe.

[0008] In an optional or preferred embodiment, the side wall of the second exhaust duct radially contracts inward at the communication hole to form the buffer gap.

[0009] In an optional or preferred embodiment, the radial dimension of the buffer gap is 5% to 10% of the inner wall radius of the first exhaust duct.

[0010] In an alternative or preferred embodiment, the second exhaust duct is provided with axially extending discharge holes, one end of each discharge hole being in fluid communication with the buffer gap, and the other end opening towards the air inlet of the exhaust device and being in fluid communication with a collector inside the wafer processing equipment, so as to discharge the droplets at the buffer gap.

[0011] In an alternative or preferred embodiment, at the air outlet of the exhaust device, the first exhaust duct extends axially beyond the second exhaust duct.

[0012] In an alternative or preferred embodiment, one end of the second exhaust duct facing the air outlet of the exhaust device is configured with a semi-cylindrical structure, the semi-cylindrical structure covering the communication hole, and a groove recessed away from the communication hole is provided on the outer surface of the semi-cylindrical structure, and the buffer gap is formed between the groove and the side wall of the first exhaust duct.

[0013] In an alternative or preferred embodiment, the groove extends circumferentially along the outer surface of the semi-cylindrical structure around the axis of the semi-cylinder to be in fluid communication with the airflow inside the semi-cylindrical structure.

[0014] In an alternative or preferred embodiment, the second exhaust duct is axially divided into a first zone and a second zone, the outer diameter of the first zone being smaller than that of the second zone so that the outer contour of the second exhaust duct forms a stepped shape, the first zone being closer to the air outlet of the exhaust device than the second zone and covering the communication hole, and the buffer gap is formed between the first zone and the side wall of the first exhaust duct.

[0015] In an alternative or preferred embodiment, the second exhaust duct includes a separate first pipe section and a second pipe section, the first pipe section and the second pipe section are respectively nested into the first exhaust duct from both ends of the first exhaust duct, and the ends of the first pipe section and the second pipe section cross and overlap at the communication hole to form a fluid communication labyrinth structure, and the buffer gap is formed by the labyrinth structure.

[0016] In an alternative or preferred embodiment, the first pipe section is axially divided into a first sub-zone and a second sub-zone, the second sub-zone being closer to the communication hole than the first sub-zone, and the outer diameter of the second sub-zone being smaller than that of the first sub-zone;

[0017] The first pipe section is axially divided into a third partition and a fourth partition. The third partition is closer to the communication hole than the fourth partition, and the outer diameter of the third partition is smaller than that of the fourth partition. The third partition includes a double-layer cylindrical structure with a radial interval, and at least part of the second partition is inserted into the double-layer cylindrical structure to form the labyrinth structure between the second partition, the third partition, and the side wall of the first exhaust pipe.

[0018] According to another aspect of the present application, there is provided an exhaust system for a wafer processing apparatus, the exhaust system including:

[0019] The exhaust device described in the foregoing aspect,

[0020] A connecting pipe that fluidly connects the exhaust device to the processing chamber of the wafer processing apparatus;

[0021] A wind pressure detector connected to a branch pipe of the exhaust device to detect the wind pressure in the exhaust device.

[0022] According to another aspect of the present application, there is provided a wafer processing apparatus, including:

[0023] A housing;

[0024] A wafer processing unit disposed in the housing, the wafer processing unit including a processing chamber;

[0025] The exhaust system described in the foregoing aspect, the exhaust device of the exhaust system is disposed at the top of the housing, and the connecting pipe of the exhaust system extends upward from the processing chamber to the exhaust device.

[0026] According to the exhaust device, exhaust system, and wafer processing apparatus of the present application, by providing a double-layer exhaust pipe structure and forming a buffer gap between the double-layer exhaust pipe structures and at the communication hole where the branch pipe is provided, the speed of the airflow at the branch pipe can be significantly reduced, the generation of eddy currents can be effectively prevented, the accumulation of dust and silicon mud in the branch pipe and the pressure measuring gas pipe can be avoided to cause blockage, the detection accuracy of the wind pressure detector can be ensured, false alarms can be avoided, and further the equipment shutdown and maintenance caused by false alarms can be avoided, the safe and effective operation of the equipment can be ensured, the effective working time of the equipment can be increased, and thus the wafer processing efficiency can be improved. Description of the Drawings

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments recorded in the embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings.

[0028] Figure 1 Shows a partial schematic view of a wafer processing apparatus according to an embodiment of the present application;

[0029] Figure 2 Shows a cross-sectional schematic view of an exhaust device;

[0030] Figure 3 Shows Figure 2 the air flow schematic diagram in the exhaust device of

[0031] Figure 4 Shows Figure 3 the enlarged view at A in

[0032] Figure 5 Shows Figure 1 the schematic diagram of the exhaust device of an embodiment of the present application in

[0033] Figure 6 Shows Figure 5 the cross-sectional view of the exhaust device in

[0034] Figure 7 Shows Figure 6 the air flow schematic diagram in the exhaust device of

[0035] Figure 8 Shows Figure 1 the cross-sectional schematic view of the exhaust device of another embodiment of the present application in

[0036] Figure 9 Shows Figure 8 the air flow schematic diagram in the exhaust device of

[0037] Figure 10 Shows Figure 1 the cross-sectional schematic view of the exhaust device of another embodiment of the present application in

[0038] Figure 11 Shows Figure 10 the air flow schematic diagram in the exhaust device of

[0039] Reference numerals:

[0040] Wafer processing equipment 100, housing 110, base 120, wafer processing unit 130, turntable 131, carrier table 1310, grinding unit 132, rough grinding spindle unit 1321, fine grinding spindle unit 1322, processing chamber 133, exhaust device 101, connecting pipe 102, connector 103, exhaust duct 10, first exhaust duct 1, second exhaust duct 2, discharge hole 200, semi-cylindrical structure 201, first pipe section 21, end of the first pipe section 211, second pipe section 22, end of the second pipe section 221, communication hole 31, branch pipe 3, wind pressure detector 4, joint 51, drain joint 52, buffer gap G, collector 6. Detailed implementation manners

[0041] In order to enable those skilled in the art to better understand the technical solutions in the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art shall fall within the scope of protection of the embodiments of the present application.

[0042] In the description of the present application, it should be understood that the orientation or positional relationships indicated by the terms "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present application.

[0043] In addition, in the description of the present application, unless otherwise specified and limited, it should be noted that the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it may be a mechanical connection or an electrical connection, or it may be the communication between two elements. It may be directly connected, or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms can be understood according to specific circumstances.

[0044] The wafer processing equipment 100, such as a wafer thinning equipment, usually has an exhaust device 101 in order to eliminate the dust floating in the processing chamber 133 of the equipment after grinding. In order to ensure the effective elimination of dust, the exhaust device 101 needs to reach a certain wind pressure, so the wind pressure of the exhaust duct is usually detected. As Figure 1FIG. 0 shows a partial schematic view of a wafer processing apparatus 100 according to an embodiment of the present application, which can be used to grind and thin the back surface (non-electronic device setting surface) of a wafer. The apparatus mainly includes a housing 110 (only a part of the housing 110 is shown in the figure), a base 120 disposed in the housing 110, and a wafer processing unit 130 disposed on the base 120. The wafer processing unit 130 mainly includes a turntable 131, a carrier 1310 disposed on the turntable 131, and a grinding unit 132 disposed above the carrier 1310. The grinding unit 132 may include a rough grinding spindle unit 1321 and a fine grinding spindle unit 1322 shown in the figure. A plurality of carriers 1310, for example, three (only one can be seen in the figure), may be disposed on the turntable 131, and the carrier 1310 is used to carry the wafer. The three carriers 1310 may correspond to three stations: a rough grinding station below the rough grinding spindle unit 1321, a fine grinding station below the fine grinding spindle unit 1322, and a loading / unloading station seen in the figure. By rotating the turntable 131, the three carriers 1310 can rotate among the three stations so that the wafer can be loaded, rough ground, fine ground, and unloaded in sequence. Although not shown, the wafer processing unit 130 may further include a front-end module for providing a wafer to be processed and receiving the processed wafer, a transfer module for transferring the wafer between the front-end module and the wafer processing unit 130, a cleaning module for cleaning the processed wafer, etc.

[0045] As can be seen from Figure 1 the rough grinding spindle unit 1321, the grinding wheels at the lower ends of the fine grinding spindle unit 1322, and the carrier 1310 at the rough grinding station and the fine grinding station below them are encapsulated in the processing chamber 133 to prevent the scattering of processing dust, such as silicon powder ground from the wafer. The wafer processing apparatus 100 further includes an exhaust system. The exhaust device 101 of the exhaust system is disposed at the top of the housing 110. The connecting pipe 102 of the exhaust system extends substantially vertically upward from the processing chamber 133 to the exhaust device 101. One end of the exhaust device 101 facing away from the connecting pipe 102 can be connected to the air duct of the ventilation system of the factory building where the wafer processing apparatus 100 is located through a connector 103. It should be understood that the illustrated exhaust device 101 is located inside the housing 110. In actual implementation, it may also be partially or completely exposed to the outside of the housing 110. The exhaust system may further include a wind pressure detector 4, which may be integrated, for example, in an electrical box above the top wall of the housing 110. The wind pressure detector 4 is connected to a branch pipe 3 of the exhaust device 101 through a pressure measuring air pipe (see Figure 2), to detect the wind pressure in the exhaust device 101. Only one connecting pipe 102 and one exhaust device 101 near the rough grinding spindle unit 1321 are shown in the figure. In an alternative embodiment, the positions of the connecting pipe 102 and one exhaust device 101 can be located in the center of the rough grinding spindle unit 1321 and the fine grinding spindle unit 1322. Or in a preferred embodiment, the connecting pipe 102 and the exhaust device 101 near the fine grinding spindle unit 1322 can be symmetrically added, so that the two sets of connecting pipes 102 and exhaust devices 101 are respectively used for dust emission at the rough grinding station and the fine grinding station.

[0046] Figure 2 A cross-sectional schematic diagram of an exhaust device 101 is shown. The exhaust device 101 includes an exhaust duct 10. A communication hole 31 is provided in the side wall of the exhaust duct 10. A branch pipe 3 is arranged radially outward from the communication hole 31. The wind pressure detector 4, such as a differential pressure transmitter, is connected through the branch pipe 3 and the joint 51 for wind pressure detection. When the wind pressure is insufficient, the wind pressure detector 4 will give an alarm to remind the staff to carry out maintenance.

[0047] Figure 3 shows Figure 2 the air flow schematic diagram in the exhaust device 101 of Figure 4 is Figure 3 the enlarged view of part A in

[0048] where the arrow indicates the air flow direction. It can be seen that the air flow in the exhaust duct 10 will form a vortex in the branch pipe 3, blowing the dust to the joint 51 and then into the pressure measuring air pipe connected between the joint 51 and the wind pressure detector 4. The dust in the pressure measuring air pipe will be adsorbed on the pipe wall. At the same time, since the humidity of the gas in the processing chamber 133 is relatively high and the temperature is higher than that at the branch pipe 3, when the air flow rises to the branch pipe 3, it will condense into water droplets when encountering the cold. Over time, it will combine with the dust to form silicon mud, thus blocking the pressure measuring air pipe, resulting in the detected wind pressure (or called air flow pressure) being lower than the set value, causing the wafer processing equipment 100 to give a false alarm and misleading the operator to stop the machine for maintenance.

[0049] By providing a double-layer exhaust duct structure in this application and forming a buffer gap G at the communication hole 31 where the branch pipe 3 is provided between the double-layer exhaust duct structures, the velocity of the air flow at the branch pipe 3 can be significantly reduced, effectively preventing the generation of eddy currents, avoiding blockage caused by dust and silicon mud accumulation in the branch pipe 3 and the pressure measuring air pipe, ensuring the detection accuracy of the wind pressure detector, avoiding false alarms, thereby avoiding equipment shutdown and maintenance caused by false alarms, ensuring the safe and effective operation of the equipment, increasing the effective working time of the equipment, and thus improving the wafer processing efficiency.

[0050] As Figures 5 - 7 shown, an exhaust device 101 of a specific embodiment of this application is shown. One end of the second exhaust duct 2 facing the air outlet of the exhaust device 101 (i.e., Figure 5 the upper end in the figure) is configured with a semi-cylindrical structure 201. The semi-cylindrical structure 201 covers the communication hole 31, and a groove recessed radially inward away from the communication hole 31 is provided on the outer surface of the semi-cylindrical structure 201 radially outward. The gap between the groove and the side wall of the first exhaust duct forms the buffer gap G. Specifically, the first exhaust duct 1 and the second exhaust duct 2 can be bonded together. At the air outlet of the exhaust device 101, the first exhaust duct 1 extends axially beyond the second exhaust duct 2 to save materials, reduce weight while ensuring the buffering effect, and avoid the second exhaust duct 2 interfering with the connection between the exhaust device 101 and the factory ventilation system. As Figure 5 shown, the groove extends circumferentially along the outer surface of the semi-cylindrical structure 201 around the axis of the semi-cylindrical structure 201 (the dotted line in the figure) to be in fluid communication with the air flow inside the semi-cylindrical structure 201. Thus, it can be ensured that the air pressure at the buffer gap G is consistent with the air pressure inside the semi-cylindrical structure 201. At the same time, since the upper half of the second exhaust duct 2 is not completely closed, liquids such as distilled water carried in the air flow are not easily accumulated in the buffer gap G. Figure 5 The groove shown in the figure extends along a horizontal arc on the outer peripheral surface of the semi-cylindrical structure 201. In an alternative embodiment, it can also extend along a spiral ascending or spiral descending arc on the outer peripheral surface of the semi-cylindrical structure 201.

[0051] In a preferred embodiment, an exhaust hole (not shown, similar to the exhaust hole 200 in Figure 10 ) extending axially and in fluid communication with the buffer gap G can also be provided in the second exhaust duct 2. For example, one end of the exhaust hole is arranged to open at the lower end surface of the groove, and the other end opens at the air inlet of the exhaust device 101, i.e., the lower end surface. The exhaust hole can be fluidly connected to a collector (not shown, refer to Figure 10 ), such as a water collecting tray, inside the equipment. Thus, even if droplets accumulate at the lower end surface of the groove, they can be drained away and no water accumulation will occur. In a further embodiment, the lower end surface of the groove can extend obliquely towards the exhaust hole, thus being more conducive to guiding the liquid towards the exhaust hole.

[0052] The exhaust device 101 can prevent the formation of eddy currents and effectively prevent impurities from entering the branch pipe 3 and the pressure measuring air pipe. As Figure 7 shown, after adding the second exhaust pipe 2, the air flow mainly passes through the exhaust device 101 axially, and obviously no longer blows into the interior of the branch pipe 3. The air flow speed in the branch pipe 3 is small, even close to 0, and thus no longer affects the accuracy of the wind pressure detector 4.

[0053] Figures 8 - 9 Fig. shows the exhaust device 101 of another specific embodiment of the present application. Similar to Figure 5 the embodiment in, the side wall of the second exhaust pipe 2 radially contracts inward at the communication hole 31. The difference is that the second exhaust pipe 2 does not form a buffer gap G in the form of forming a groove, but forms a buffer gap G in the form of forming a segmented step. Specifically, the second exhaust pipe 2 is axially divided into a first region (the upper part of the second exhaust pipe 2 in Figure 8 ) and a second region (the lower part of the second exhaust pipe 2 in Figure 8 ). The outer diameter of the first region is smaller than that of the second region so that the outer contour of the second exhaust pipe 2 forms a stepped shape. The first region is closer to the air outlet of the exhaust device 101 than the second region (i.e., the first region is located downstream of the second region) and covers the communication hole 31. A buffer gap G is formed between the side wall of the first region and the first exhaust pipe 1. At the air outlet of the exhaust device 101, the second exhaust pipe 2 does not extend axially beyond the first exhaust pipe 1. The first exhaust pipe 1 and the second exhaust pipe 2 can also be fixed together by an adhesive method. The exhaust device 101 can effectively prevent the formation of eddy currents in the branch pipe 3, and has a simple structure and is convenient to manufacture. In a preferred embodiment, an exhaust hole (not shown, similar to the exhaust hole 200 in Figure 10 ) that is fluidly connected to the buffer gap G is axially provided in the second region. The exhaust hole can be fluidly connected to a collector inside the device, such as a water collecting tray, to avoid the accumulation of grinding chips or droplets at the end face of the second region facing the buffer gap G. In a further embodiment, the end face of the second region facing the buffer gap G can be inclined and extended towards the exhaust hole, so as to be more conducive to guiding the liquid to the exhaust hole.

[0054] Figures 10 - 11The exhaust device 101 showing another specific embodiment of the present application is presented. Among them, the second exhaust duct 2 includes a split first duct segment 21 and a second duct segment 22. The first duct segment 21 and the second duct segment 22 are respectively nested into the first exhaust duct 1 from both ends of the first exhaust duct 1, and the ends 211 and 221 of the first duct segment 21 and the second duct segment 22 facing each other overlap at the communication hole 31 to form a fluid-connected labyrinth structure, and this labyrinth structure forms a buffer gap G. The first exhaust duct 1 can be adhered to the first duct segment 21 and the second duct segment 22 respectively. One of the first duct segment 21 and the second duct segment 22 close to the air inlet of the exhaust device 101, for example, the second duct segment 22 located below, can also be provided with a discharge hole 200, and the discharge hole 200 is connected to the drainage joint 52 for drainage. The discharge hole 200 can be connected to a collector 6 inside the device, such as a water collecting tray, through the drainage joint 52, a drain pipe (not shown), etc., and only a square box is used for schematic illustration in the figure. It should be understood that even if a small amount of gas blows in from the discharge hole 200, it has little impact on the differential pressure transmitter. This structure can prevent the formation of eddy currents, effectively prevent processing dust from entering the pressure measuring air pipe, and can also discharge the droplets condensed in the buffer gap G even in a relatively humid environment. From Figure 11 It can be seen that after adding the second exhaust duct 2 including the first duct segment 21 and the second duct segment 22, the air flow no longer blows into the branch duct 3 significantly, effectively preventing the formation of eddy currents in the branch duct 3 and avoiding the accumulation of dust in the branch duct 3 and the pressure measuring air pipe of the wind pressure detector.

[0055] More specifically, the first duct segment 21 is axially divided into a first partition and a second partition. The second partition is closer to the communication hole 31 than the first partition, and the outer diameter of the second partition is smaller than that of the first partition, so that the outer contour of the second duct segment 21 is in a stepped shape. The second partition is, for example, Figure 10 the end 211 of the first duct segment in Figure 10 , and the first partition is the upper part thereof. The second duct segment 22 is axially divided into a third partition and a fourth partition. The third partition is closer to the communication hole 31 than the fourth partition, and the outer diameter of the third partition is smaller than that of the fourth partition. The third partition is, for example, Figure 10 the end 221 of the second duct segment in Figure 10 , and the fourth partition is the part below the third partition. The third partition can include a double-layer cylindrical structure with a radial interval, Figure 10 the inner layer of the double-layer cylindrical structure shown in Figure 10 is longer than the outer layer, and in an alternative embodiment, it can also be set to have the same length or the inner layer is shorter than the outer layer. The second partition is at least partially inserted into this double-layer cylindrical structure to form a labyrinth structure that bends and extends between the second partition, the third partition, and the side wall of the first exhaust duct. In an alternative embodiment, the second partition and the third partition can have other structures to make the labyrinth structure simpler or more complex. For example, the second partition can also be set as a double-layer cylindrical structure, and the third partition can correspondingly be set as a triple-layer cylindrical structure.

[0056] In a preferred embodiment, the radial dimension of the buffer gap G is 5% to 10% of the inner wall radius of the first row of air ducts 1. For example, the inner wall radius of the first row of air ducts 1 is 45 mm, and the outer wall radius of the second row of air ducts 2 at the position opposite to the connection hole 31 is 42 mm. Thus, the radial dimension of the buffer gap G is 3 mm, which is 6.7% of the inner wall radius of the first row of air ducts 1. The above dimension range of the buffer gap G can, while ensuring an effective buffering effect, avoid excessively reducing the cross-sectional area of the internal air flow channel of the exhaust device 101 due to the setting of the second row of air ducts 2 and the buffer gap G, thereby ensuring smooth and efficient exhaust.

[0057] The above embodiments are only used to illustrate the embodiments of the present application, rather than limiting the embodiments of the present application. Those of ordinary skill in the relevant technical field can also make various changes and modifications without departing from the spirit and scope of the embodiments of the present application. Therefore, all equivalent technical solutions also belong to the scope of the embodiments of the present application, and the patent protection scope of the embodiments of the present application shall be defined by the claims.

Claims

1. An exhaust device for an exhaust system of a wafer processing equipment, characterized in that: The two ends of the exhaust device are respectively fluidly connected to the processing chamber of the wafer processing equipment and the air duct outside the wafer processing equipment, and the exhaust device includes: The first exhaust duct has a connecting hole on its side wall; a branch pipe, the branch pipe being arranged at the communicating hole of the first exhaust pipe and being in fluid communication with the first exhaust pipe via the communicating hole, the branch pipe being configured to be connected to a wind pressure detector; A second exhaust duct, the second exhaust duct is at least partially nested in the first exhaust duct, the side wall of the second exhaust duct at least covers the connecting hole, and a buffer gap is provided between the side wall of the second exhaust duct and the side wall of the first exhaust duct at the connecting hole to prevent the airflow from carrying processing dust to impact the branch pipe.

2. The exhaust device according to claim 1, characterized in that: The side wall of the second exhaust pipe contracts radially inward at the communicating hole to form the buffer gap.

3. The exhaust device according to claim 1, characterized in that: The radial dimension of the buffer gap is 5% to 10% of the radius of the inner wall of the first exhaust pipe.

4. The exhaust device according to claim 1, characterized in that: The second exhaust pipe is provided with an axially extending discharge hole, one end of which is connected to the buffer gap fluid, and the other end is opened toward the air inlet of the exhaust device and is connected to the collector fluid inside the wafer processing equipment to discharge droplets in the buffer gap.

5. The exhaust device according to claim 1, characterized in that: At the air outlet of the air exhaust device, the first air exhaust pipe extends axially beyond the second air exhaust pipe.

6. The exhaust device according to any one of claims 1 to 5, characterized in that: A semi-cylindrical structure is constructed at one end of the second exhaust duct facing the air outlet of the exhaust device, the semi-cylindrical structure covers the connecting hole, and a groove recessed away from the connecting hole is provided on the outer surface of the semi-cylindrical structure, the buffer gap is formed between the groove and the side wall of the first exhaust duct.

7. The exhaust device according to claim 6, characterized in that: The groove extends circumferentially along the outer surface of the semi-cylindrical structure around the axis of the semi-cylinder to be in fluid communication with the airflow inside the semi-cylindrical structure.

8. The exhaust device according to any one of claims 1 to 5, characterized in that: The second exhaust duct is divided into a first zone and a second zone along the axial direction. The outer diameter of the first zone is smaller than the outer diameter of the second zone so that the outer contour of the second exhaust duct forms a stepped shape. The first zone is closer to the air outlet of the exhaust device than the second zone and covers the connecting hole. The buffer gap is formed between the first zone and the side wall of the first exhaust duct.

9. The exhaust device according to any one of claims 1 to 4, characterized in that: The second exhaust duct includes a first pipe segment and a second pipe segment, the first pipe segment and the second pipe segment are respectively embedded in the first exhaust duct from both ends of the first exhaust duct, and the ends of the first pipe segment and the second pipe segment cross and overlap at the connecting hole to form a fluid-connected maze structure, and the maze structure forms the buffer gap.

10. The exhaust device according to claim 9, characterized in that: The first pipe section is divided into a first partition and a second partition along the axial direction, the second partition is closer to the communicating hole than the first partition, and the outer diameter of the second partition is smaller than the outer diameter of the first partition; The second pipe section is axially divided into a third partition and a fourth partition, the third partition is closer to the connecting hole than the fourth partition, and the outer diameter of the third partition is smaller than the outer diameter of the fourth partition; the third partition includes a radially spaced double-layer cylindrical structure, and the second partition is at least partially inserted into the double-layer cylindrical structure to form the maze structure between the second partition, the third partition and the side wall of the first exhaust duct.

11. An exhaust system for wafer processing equipment, characterized in that: The exhaust system comprises: The exhaust device according to any one of claims 1 to 10; a connecting pipe, the connecting pipe fluidically connecting the exhaust device to the processing chamber of the wafer processing equipment; A wind pressure detector is connected to the branch pipe of the exhaust device to detect the wind pressure in the exhaust device.

12. A wafer processing equipment, characterized in that: include: shell; a wafer processing unit disposed in the housing, the wafer processing unit comprising a processing chamber; According to the exhaust system of claim 11, the exhaust device of the exhaust system is arranged at the top of the shell, and the connecting pipe of the exhaust system extends upward from the processing chamber to the exhaust device.

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