Automated system and method for manufacturing ceramic matrix composites

Abstract

The invention relates to an automated system and method for manufacturing ceramic matrix composites. A method for manufacturing a ceramic matrix composite structure comprises the steps of: (1) picking up plies of a ceramic matrix composite material at a temporary storage location; (2) removing a bottom backing layer from the ply at a backing removal location; (3) after removing the bottom backing layer, placing the ply on a forming surface at a forming location; (4) compacting the plies on the forming surface; (5) removing a top backing layer from the ply after the ply is compacted on the forming surface; and (6) after the plies are compacted on the forming surface, inspecting the plies.

Description

Technical Field

[0001] The present disclosure generally relates to composite material manufacturing, and more particularly to systems and methods for fully automated pick-up, peel, placement, forming, compaction, and inspection processes used during the manufacture of ceramic matrix composites. Background Art

[0002] Ceramic matrix composites have different viscosities and textures than polymer matrix composites, and thus require different processing methods. The ceramic fibers of ceramic matrix composites are more brittle and harder than the carbon fibers of polymer matrix composites. The more brittle and harder fibers, as well as the different organic tackifier component resins of the ceramic fibers, require different processing methods during the manufacture of ceramic matrix composite structures.

[0003] The abstract of WO2020 / 081348Al states: "A system and method for separating a layer from a layer assembly when the layer assembly includes a backing layer and a material layer. The system includes an automated machine having a controller and an end effector. A separation tool is attached to the end effector of the automated machine. The separation tool includes a displacement member having an outer surface configured to create a void between the backing layer and the material layer by displacing a portion of the backing layer. The separation layer further includes a fixing member configured to establish a mechanical connection with the displaced portion of the backing layer".

[0004] Typical ceramic matrix composite structures are manufactured using a hand lay-up process. The disadvantages of manufacturing ceramic matrix composite structures using a hand lay-up process are the variability in the quality and consistency of the ceramic matrix composite structures. Therefore, manual inspection and rework are typically required. Another disadvantage is that the hand lay-up process is time-consuming and requires skilled technicians. The overall result is an increase in cycle time and an increase in the labor cost of manufacturing ceramic matrix composite structures.

[0005] Therefore, those skilled in the art continue to research and develop efforts in ceramic matrix composite manufacturing. Summary of the Invention

[0006] Examples of methods for cleaning ceramic matrix from a compaction roller and systems for compacting ceramic composites are disclosed. The following is a non-exhaustive list of examples that may or may not be claimed according to the subject matter of the present disclosure.

[0007] In an example, the disclosed method includes the steps of: (1) picking up a laminate of a ceramic matrix composite at a staging location; (2) removing a bottom backing layer from the laminate at a backing removal location; (3) placing the laminate on a forming surface at a forming location after removing the bottom backing layer; (4) compacting the laminate on the forming surface; (5) removing a top backing layer from the laminate after compacting the laminate on the forming surface; and (6) inspecting the laminate after compacting the laminate on the forming surface.

[0008] In an example, the disclosed system includes a pick-and-place device, a peeling device, and an inspection device. The pick-and-place device is configured to pick up a ply of a ceramic matrix composite material at a staging position. The pick-and-place device is further configured to place the ply on a forming surface at a forming position. The pick-and-place device is further configured to compact the ply on the forming surface. The peeling device is configured to remove a bottom backing layer from the ply at a backing removal position before the ply is placed on the forming surface. The peeling device is further configured to remove a top backing layer from the ply after the ply is compacted on the forming surface. The inspection device is configured to inspect the ply after the ply is compacted on the forming surface.

[0009] Examples of a portion of an aircraft manufactured according to the method and / or using the system are also disclosed.

[0010] Examples of a ceramic matrix composite structure manufactured according to the method or using the system are further disclosed. Preferably, such a ceramic matrix composite structure relates to a portion of an aircraft. Another aspect of the present invention relates to an aircraft including such a ceramic matrix composite structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Other examples of the system and method will become apparent from the following detailed description, the drawings, and the appended claims.

[0012] Figure 1 is a flow chart of an example of a method for manufacturing a ceramic matrix composite structure;

[0013] Figure 2 is according to Figure 1 is a flow chart of an example of the step of picking up a ply of a ceramic matrix composite material according to the method;

[0014] Figure 3 is according to Figure 1 is a flow chart of an example of the step of removing a bottom backing layer from a ceramic matrix composite material ply according to the method;

[0015] Figure 4 is according to Figure 1 is a flow chart of an example of the step of placing a ceramic matrix composite material ply on a forming surface according to the method;

[0016] Figure 5 is according to Figure 1 is a flow chart of an example of the step of compacting a ceramic matrix composite material ply on a forming surface according to the method;

[0017] Figure 6 is according to Figure 1 is a flow chart of an example of the step of removing a top backing layer from a ceramic matrix composite material ply according to the method;

[0018] Figure 7 is an example of a flowchart of steps for inspecting a ceramic matrix composite laminate on a formed surface according to Figure 1 ;

[0019] Figure 8 is a schematic block diagram of an example of a system for manufacturing a ceramic matrix composite structure;

[0020] Figure 9 is a flowchart of an example of a method for aircraft manufacturing and maintenance; and

[0021] Figure 10 is a schematic block diagram of an example of an aircraft. DETAILED DESCRIPTION

[0022] Generally referring to Figures 1 to 8 , by way of example, the present disclosure relates to methods 1000 and systems 100 for manufacturing ceramic matrix composite (CMC) structures. Examples of the methods 1000 and systems 100 disclosed herein can implement various automated and integrated pick-and-place (PnP) processes, forming and compaction processes, and inspection and rework processes for ceramic matrix composites. Although examples of the methods 1000 and systems 100 provide specific advantages and benefits related to manufacturing ceramic matrix composite structures, one or more parts of the methods 1000 and / or systems 100 can also be used to manufacture other polymer and non-polymer composite structures.

[0023] The specific configuration of the ceramic matrix composite structure, its manufacturing method, and the industry implementing the structure and method can vary. By way of example, the present disclosure describes a ceramic matrix composite structure and a method for manufacturing at least a part of an aircraft. The ceramic matrix composite structure and its manufacturing method can be implemented by an original equipment manufacturer (OEM) according to commercial, military, and space regulations. It is contemplated that the disclosed ceramic matrix composite structure and its manufacturing method can be implemented in many other ceramic matrix composite manufacturing industries.

[0024] First referring to Figure 8 , a ceramic matrix composite (CMC) is a subgroup of composites and a subgroup of ceramics. A ceramic matrix composite includes ceramic reinforcements 252 embedded in a ceramic matrix 254. Both the ceramic reinforcements 252 and the ceramic matrix 254 can include any ceramic material, including carbon fibers and carbon fibers. In one or more examples, the ceramic matrix composite 250 is a ceramic composite and includes ceramic reinforcements 252 and a ceramic matrix 254.

[0025] In one or more examples, the ceramic reinforcements 252 are pre-impregnated with the ceramic matrix 254. In such examples, the laminates 210 of the ceramic matrix composite 250 (such as any one of the plurality of laminates 200) can also be referred to as ceramic matrix composite prepregs.

[0026] In one or more examples, the ceramic reinforcement 252 includes ceramic fibers 253, at least one of such as the following: carbon reinforced fibers, silicon carbide reinforced fibers, alumina reinforced fibers, alumina silica reinforced fibers, aluminum nitride reinforced fibers, silicon nitride reinforced fibers, mullite reinforced fibers, silica / quartz reinforced fibers, basalt reinforced fibers, and zirconia reinforced fibers. Other suitable reinforcement materials are also contemplated for use as the ceramic reinforcement 252.

[0027] In one or more examples, the ceramic matrix 254 includes at least one of a carbon matrix, a silicon carbide matrix, an alumina matrix, an alumina silica matrix, an aluminum nitride matrix, a silicon nitride matrix, a mullite matrix, a geopolymers matrix, and a zirconia matrix. Other suitable matrix materials are also contemplated for use as the ceramic matrix 254.

[0028] In one or more examples, the ceramic matrix 254 includes ceramic particles 256 dispersed in a suspension medium 258 (e.g., a fluid or other vehicle). In one or more examples, the ceramic matrix 254 is an aqueous suspension (e.g., the suspension medium 258 includes an aqueous medium). In one or more examples, the ceramic matrix 254 is a non-aqueous suspension (e.g., the suspension medium 258 includes a non-aqueous medium). The ceramic matrix 254 has various viscosities depending on the suspension medium 258 used. In one or more examples, the ceramic particles 256 include at least one of carbon particles, silicon carbide particles, alumina particles, alumina silica particles, aluminum nitride particles, silicon nitride particles, mullite particles, geopolymers particles, and zirconia particles. Other suitable materials are also contemplated for use as the ceramic particles 256.

[0029] The present disclosure recognizes that ceramic matrix composites have different viscosities and textures than polymer matrix composites (PMCs). As an example, the fiber reinforcement of a fabric-based ceramic matrix composite (e.g., the ceramic reinforcement 252) is more brittle and harder than the fiber reinforcement of a fabric-based polymer matrix composite (PMC). As another example, the matrix material of a fabric-based ceramic matrix composite (e.g., the ceramic matrix 254) has lower viscosity than the matrix material of a fabric-based polymer matrix composite and has different viscosity characteristics. Thus, traditional manufacturing techniques and tools for polymer matrix composites are not suitable for use with ceramic matrix composites, and ceramic matrix composites require different methods and systems for processing.

[0030] In one or more examples, the methods 1000 and systems 100 disclosed herein provide a fully automated process from programming to final inspection specifically designed for the material requirements of ceramic matrix composite laminates. A fully automated process for picking, peeling, placing, forming, compressing, inspecting, and recompressing ceramic matrix composites as needed provides improved quality and repeatability, reduced cycle times, and reduced contact times. In various examples, the automated operations and processes implemented by the methods 1000 and systems 100 include automated robotic path planning, ply picking, ply inspection, bottom film peeling, ply placement, roller compaction, top film peeling, ply inspection, rework compaction, and final ply inspection.

[0031] The present disclosure recognizes that a robotic PnP laying process for fabric-based ceramic matrix composites (e.g., CMC prepregs) requires the controlled placement of plies 210 of the ceramic matrix composite 250 on a forming surface 160, and specialized compaction after placement to remove air pockets and wrinkles, and to conform the ply 210 to the shape or profile of the laying tool before placing each subsequent ply. Accordingly, examples of the methods 1000 and systems 100 include unique tools for automating the picking, placing, and compressing of plies 210, automating the removal of backing films, automated and adaptive compaction path planning, automated ply alignment using state-of-the-art vision systems, in-situ inspection and automated generation of rework paths when necessary, and automated inspection of ply position and ply orientation.

[0032] Figure 1 An example of a method 1000 for manufacturing a ceramic matrix composite structure 260 is shown. Figure 8 An example of a system 100 for manufacturing a ceramic matrix composite structure 260 is shown. The following are examples of the method 1000 according to the present disclosure ( Figure 1 )). In one or more examples, the method 1000 is implemented using the system 100 (e.g., Figure 8 ). The method 1000 includes a plurality of elements, steps, and / or operations. Not all elements, steps, and / or operations described or shown in one example are required in one example. Some or all of the elements, steps, and / or operations described or shown in one example may be combined in various ways with other examples without including the other elements, steps, and / or operations described in those other examples, even if one or more such combinations are not explicitly described or shown herein.

[0033] Reference Figure 8, as will be described in more detail herein, in various examples, system 100 includes a plurality of operating components, including one or more of a pick-and-place (PnP) device 110, a stripping device 180, an inspection device 170, a cleaning device 190, and a tool 164. In various examples, PnP device 110 includes a plurality of operating components, the plurality of operating components including one or more of at least one robot 120, at least one end effector 130, a plurality of clamps 140, at least one gripping sensor 142, at least one laminate sensor 144, and at least one compaction roller 150. In various examples, inspection device 170 includes a plurality of operating components, the plurality of operating components including at least one vision sensor 172.

[0034] Specific reference Figure 1 And generally reference Figure 8 , in one or more examples, one or more steps of method 1000 are electronically controlled or computer-controlled (e.g., under the guidance of or by instructions from computer 500). In these examples, system 100 also includes computer 500, which is adapted (e.g., configured or programmed) to direct or guide one or more operating components of system 100 to perform one or more operating steps implemented by method 1000. Thus, in one or more examples, method 1000 is an electronic controller method or a computer-implemented method.

[0035] Reference Figure 1 And Figure 8 , in one or more examples, method 1000 includes: a step of picking up laminate 210 of ceramic matrix composite 250 at staging location 310 (block 1010). In one or more examples, the step of picking up laminate 210 is performed using PnP device 110 of system 100 (block 1010). In one or more examples, picking up laminate 210 is performed automatically, e.g., under the guidance of computer 500. For example, PnP device 110 is programmed to automatically pick up laminate 210 at staging location 310.

[0036] Reference Figure 8, in one or more examples, the PnP device 110 includes at least one of a robot 120 and an end effector 130. In one or more examples, the robot 120 is any suitable type of programmable and articulated motion platform configured to selectively or controllably move the end effector 130 in three-dimensional space, such as a robotic arm, an overhead gantry, etc. The end effector 130 is coupled to the working end of the robot 120. The end effector 130 is configured or adapted to interact with the laminate 210 during the PnP process. In one or more examples, the end effector 130 includes or takes the form of any suitable gripper end effector for picking up and placing a sheet (e.g., laminate 210) of ceramic matrix composite 250 on the forming surface 160. In one or more examples, the end effector 130 includes one or more tools, sensors, mechanisms, or devices to perform one or more operations on the laminate 210.

[0037] Reference Figure 8 , in one or more examples, the PnP device 110 further includes a plurality of clamps 140. In one or more examples, the clamps 140 are coupled to the end effector 130 or otherwise integrated with the end effector 130. In one or more examples, the clamps 140 are configured to removably or releasably couple to the surface of the laminate 210 during the PnP process. In one or more examples, one or more of the clamps 140 are vacuum clamps. In these examples, the clamps 140 utilize suction generated by a vacuum source to grip the surface of the laminate 210. In one or more examples, one or more of the clamps 140 are electrostatic clamps. In these examples, the clamps 140 utilize electrostatic adhesion to grip the surface of the laminate 210.

[0038] In one or more examples, each laminate 200 (e.g., laminate 210) that is processed to provide the ceramic matrix composite structure 260 is sandwiched between a bottom backing layer 230 (e.g., bottom backing layer) and a top backing layer 232 (e.g., top backing layer). Each laminate 200 (e.g., laminate 210) has a geometry 240, a laminate serial number 242, and a fiber orientation 244. In one or more examples, the method 1000 includes a process for automatically removing the bottom backing layer 230 and the top backing layer 232.

[0039] Again reference Figure 1 and Figure 8, in one or more examples, method 1000 includes: the step of removing the bottom backing layer 230 from the laminate 210 at the backing removal location 312 (block 1020). In one or more examples, the step of removing the bottom backing layer 230 from the laminate 210 is performed using the peeling device 180 of system 100 (block 1020). In one or more examples, the removal of the bottom backing layer 230 from the laminate 210 is performed automatically, for example under the guidance of computer 500. For example, the peeling device 180 is programmed to automatically remove the bottom backing layer 230 from the laminate 210 at the backing removal location 312.

[0040] In one or more examples, the PnP device 110 is used to move the laminate 210 from the staging location 310 to the backing removal location 312. For example, in the case where the laminate 210 is coupled to the fixture 140 of the end effector 130, the robot 120 moves the end effector 130 and the laminate 210 from the staging location 310 to the backing removal location 312, for example in a direction from computer 500.

[0041] Reference Figure 1 and Figure 8 , in one or more examples, method 1000 includes: the step of placing the laminate 210 on the forming surface 160 at the forming location 314 after the bottom backing layer 230 has been removed (block 1030). In one or more examples, the step of placing the laminate 210 on the forming surface 160 is performed using the PnP device 110 (block 1030). In one or more examples, the placement of the laminate 210 is performed automatically, for example under the guidance of computer 500. For example, the PnP device 110 is programmed to automatically place the laminate 210 at a desired or appropriate location on the forming surface 160. In one or more examples, the PnP device 110 is used to move the laminate 210 from the staging location 310 or, in examples where the bottom backing layer 230 has been removed, the backing removal location 312 to the forming location 314. For example, in the case where the laminate 210 is coupled to the fixture 140 of the end effector 130, the robot 120 moves the end effector 130 and the laminate 210 from the staging location 310 or the backing removal location 312 to the forming location 314, for example in a direction from computer 500.

[0042] Still referring to Figure 1 and Figure 8, in one or more examples, method 1000 includes the following steps: After placing the laminate 210 on the end effector 130, compressing the laminate 210 on the forming surface 160 (block 1040). In one or more examples, the step of compressing the laminate 210 on the forming surface 160 is performed using the PnP device 110 (block 1040). In one or more examples, compressing the laminate 210 is performed automatically, for example under the guidance of the computer 500. For example, the PnP device 110 is programmed to automatically compress the laminate 210 according to the compaction path planning 430.

[0043] Referring to Figure 8 , in one or more examples, the PnP device 110 includes a compaction roller 150. In one or more examples, the compaction roller 150 is coupled to the end effector 130 or otherwise integrated with the end effector 130. In one or more examples, the compaction roller 150 is configured to apply a compaction force to the laminate 210, thereby compressing and compacting the laminate 210 against the forming surface 160 and conforming the laminate 210 to the shape 162 of the forming surface 160.

[0044] In one or more examples, the PnP device 110 includes more than one instance of the robot 120 and / or more than one instance of the end effector 130. In one or more examples, the gripper 140 and the compaction roller 150 share a single instance of the end effector 130 (e.g., the same end effector). In one or more examples, the gripper 140 and the compaction roller 150 each have a dedicated instance of the end effector 130 (e.g., different end effectors).

[0045] Referring again to Figure 1 and Figure 8 , in one or more examples, method 1000 includes: after compressing the laminate 210 on the forming surface 160, removing the top backing layer 232 from the laminate 210 (block 1050). In one or more examples, the step of removing the top backing layer 232 from the laminate 210 is performed using the peeling device 180 (block 1050). In one or more examples, removing the top backing layer 232 from the laminate 210 is performed automatically, for example under the guidance of the computer 500. For example, the peeling device 180 is programmed to automatically remove the top backing layer 232 from the laminate 210 at the forming position 314 after the laminate 210 has been compacted.

[0046] Referencing Figure 1 and Figure 8, in one or more examples, method 1000 includes: after laminar sheet 210 is compacted on forming surface 160, the step of inspecting laminar sheet 210 (block 1060). In one or more examples, the step of performing (block 1060) is executed using inspection device 170. In one or more examples, inspecting laminar sheet 210 is automatically performed, for example, under the guidance from computer 500. For example, inspection device 170 is programmed to automatically inspect laminar sheet 210 at forming position 314 after laminar sheet 210 is compacted.

[0047] Generally referring to Figure 1 and Figure 8 and specifically referring to Figure 2 , which shows an example of the step (block 1010) of picking up laminar sheet 210 of ceramic matrix composite 250 at staging position 310 according to one or more examples of method 1000 ( Figure 1 ).

[0048] In one or more examples, the step of picking up laminar sheet 210 (block 1010) includes the step of moving robot 120 to the original position to start the picking operation.

[0049] Referring to Figure 2 and Figure 8 , in one or more examples, the step of picking up laminar sheet 210 (block 1010) includes: the step of staging laminar sheet 210 at staging position 310 (block 1011). In these examples, laminar sheet 210 is physically staged (for example, placed in a substantially flat configuration) in the staging area for being picked up by end effector 130 of PnP device 110.

[0050] Referring to Figure 2 and Figure 8 , in one or more examples, the step of picking up laminar sheet 210 (block 1010) includes the step of moving end effector 130 to staging position 310 (block 1012). In one or more examples, end effector 130 moves from the original position to the picking position relative to the staging area at staging position 310, for example, using robot 120.

[0051] Referring to Figure 2 and Figure 8, in one or more examples, the step of picking up the laminate 210 (block 1010) includes the step of identifying the geometry 240 of the laminate 210 (block 1013). In one or more examples, at least one laminate sensor 144 is used to detect and / or identify the geometry 240 of the laminate 210. In one or more examples, the laminate sensor 144 is coupled to the end effector 130 or otherwise integrated with the end effector 130. In one or more examples, the laminate sensor 144 comprises or takes the form of an imaging device or other suitable vision sensor configured or operative to scan the staging area and identify the geometry 240 of the laminate 210 based on the scan. As an example, the laminate sensor 144 may comprise or take the form of a camera, a charge-coupled device (CCD), a complementary metal-oxide semiconductor (CMOS), a laser scanner, etc.

[0052] Reference Figure 2 and Figure 8 , in one or more examples, the step of picking up the laminate 210 (block 1010) includes the step of positioning the clamp 140 of the end effector 130 based on the geometry 240 of the laminate 210 (block 1014). In these examples, the clamp 140 is movable relative to the end effector 130 such that the clamp 140 can be selectively and appropriately positioned to grip the laminate 210. In one or more examples, the geometry 240 of each laminate 200 (placed to form the ceramic matrix composite structure 260) and the associated position of the clamp 140 corresponding to the laminate 200 are stored in the database 510 and retrieved by the computer 500 from the database 510. The computer 500 then instructs the clamp 140 to move to the appropriate position to pick up the laminate 210.

[0053] Reference Figure 2 and Figure 8 , in one or more examples, the step of picking up the laminate 210 (block 1010) includes the step of moving the end effector 130 to place the clamp 140 in contact with the laminate 210 (block 1015). In these examples, the end effector 130 is moved, for example, by the robot 120 to a vision-corrected position to place the clamp 140 in contact with the laminate 210 for gripping.

[0054] Reference Figure 2 and Figure 8 , in one or more examples, with the clamp 140 in contact with the laminate 210, the step of picking up the laminate 210 (block 1010) includes the step of gripping 1016 the laminate 210 with the clamp 140 (block 1016). In one or more examples, the clamp 140 uses suction or vacuum to grip the laminate 210. In one or more examples, the clamp 140 uses electrostatic adhesion to grip the laminate 210.

[0055] Reference Figure 2 and Figure 8 In one or more examples, the step of picking up the laminate 210 (block 1010) includes the step of detecting whether the laminate 210 is coupled to the fixture 140 (block 1017). In one or more examples, at least one clamping sensor 142 is used to detect the contact and / or proper clamping between the fixture 140 and the laminate 210. In one or more examples, the clamping sensor 142 is coupled to the end effector 130 or otherwise integrated with the end effector 130. In one or more examples, the clamping sensor 142 includes any suitable type of sensor or device that is configured or operates to detect the contact and / or proper clamping between the fixture 140 and the laminate 210, depending on, for example, the type of fixture used and the clamping technique. By way of example, the clamping sensor 142 may include or take the form of a vacuum sensor, a pressure sensor, a contact sensor, a proximity sensor, etc.

[0056] As Figure 2 shown, when it is determined based on the detection (e.g., block 1017) that the correct contact and / or clamping is affirmative (i.e., the contact and / or clamping is sufficient), the robot 120 moves the end effector 130 and thus the laminate 210 held by the end effector 130 to a safe exit position, thereby ending the pick-up operation. However, when it is determined based on the detection (e.g., block 1017) that the correct contact and / or clamping is negative (i.e., the contact and / or clamping is insufficient), the process returns to the step of moving the end effector 130 (block 1012), and the subsequent operating steps are repeated until it is determined that the contact and / or clamping is sufficient.

[0057] Generally referring Figure 1 and Figure 8 and specifically referring Figure 3 ( Figure 3 showing a conventional uniform longitudinal turbulent diaphragm), which shows an example of the step of removing the bottom backing layer 230 from the laminate 210 at the backing removal position 312 (block 1020) according to one or more examples of the method 1000 ( Figure 1 ).

[0058] Reference Figure 3 and Figure 8 In one or more examples, the step of removing the bottom backing layer 230 from the laminate 210 (block 1020) includes the step of positioning 1021 the laminate 210 at the backing removal position 312 to remove the bottom backing layer 230 (block 1021).

[0059] Reference Figure 3 and Figure 8, in one or more examples, the step of removing the bottom backing layer 230 from the laminate 210 (block 1020) includes the step of applying suction 1022 to the bottom backing layer 230 (block 1022).

[0060] Reference Figure 3 and Figure 8 , in one or more examples, the step of removing the bottom backing layer 230 from the laminate 210 (block 1020) includes the step of detecting 1023 the suction (block 1023).

[0061] Reference Figure 3 and Figure 8 , in one or more examples, the step of removing the bottom backing layer 230 from the laminate 210 (block 1020) includes the step of peeling the bottom backing layer 230 from the bottom surface 214 of the laminate 210 (block 1024).

[0062] Generally referring to Figure 1 and Figure 8 And specifically referring to Figure 4 ( Figure 4 showing a non-uniform longitudinal turbulent diaphragm), which shows an example of the step of placing the laminate 210 on the forming surface 160 (block 1030) according to one or more examples of the method 1000.

[0063] Reference Figure 4 and Figure 8 , in one or more examples, the step of placing the laminate 210 on the forming surface 160 (block 1030) includes the step of retrieving 1031 the position data 410 and the orientation data 420 based on the geometry 240 of the laminate 210 and the laminate serial number 242 of the laminate 210 (block 1031).

[0064] Reference Figure 4 and Figure 8 , in one or more examples, the step of placing the laminate 210 on the forming surface 160 (block 1030) includes the step of positioning the laminate 210 relative to the forming surface 160 at the forming position 314 based on the position data 410 and the orientation data 420 (block 1032).

[0065] Reference Figure 4 and Figure 8 , in one or more examples, the step of placing the laminate 210 on the forming surface 160 (block 1030) includes the step of conforming 1033 the laminate 210 to the shape 162 of the forming surface 160 (block 1033).

[0066] Generally referring to Figure 1 and Figure 8 And specifically referring to Figure 5 (Figure 5 shows a conventional uniform transverse turbulent diaphragm), which shows an example of the step (block 1040) of compressing the laminate 210 on the forming surface 160 according to one or more examples of method 1000.

[0067] Reference Figure 5 and Figure 8 , in one or more examples, the step (block 1040) of compressing the laminate 210 on the forming surface 160 includes the step (block 1041) of retrieving a compaction path plan 430 based on the geometry 240 of the laminate 210 and the laminate serial number 242 of the laminate 210.

[0068] Reference Figure 5 and Figure 8 , in one or more examples, the step (block 1040) of compressing the laminate 210 on the forming surface 160 includes the step (block 1042) of positioning the compaction roller 150 into contact with the laminate 210.

[0069] Reference Figure 5 and Figure 8 , in one or more examples, the step (block 1040) of compressing the laminate 210 on the forming surface 160 includes the step (block 1043) of moving the compaction roller 150 across the laminate 210 along the compaction path 432 according to the compaction path plan 430.

[0070] In one or more examples, compressing the laminate 210 includes positioning the compaction roller 150 into contact with the laminate surface of the laminate 210 of the ceramic matrix composite 250 (e.g., the top backing layer 232 before being removed). Compressing the laminate 210 further includes the step of applying a compaction pressure to the laminate 210 using the compaction roller 150 such that the compaction pressure is distributed substantially uniformly over the laminate 210. In the case where the compaction roller 150 is in contact with the laminate 210 and applying the compaction pressure, compressing the laminate 210 further includes, for example, moving the compaction roller 150 across the laminate 210 along the compaction path 432 to conform the laminate 210 to the forming surface 160.

[0071] Generally referring to Figure 1 and Figure 8 and specifically referring to Figure 6 , which shows an example of the step (block 1050) of removing 1050 the top backing layer 232 from the laminate 210 according to one or more examples of method 1000.

[0072] Reference Figure 6 and Figure 8, in one or more examples, the step of removing the top backing layer 232 from the laminate 210 (block 1050) includes the step of retrieving location data 410 and orientation data 420 based on the geometry 240 of the laminate 210 and the laminate serial number 242 of the laminate 210 (block 1051).

[0073] Reference Figure 6 and Figure 8 , in one or more examples, the step of removing the top backing layer 232 from the laminate 210 (block 1050) includes the step of applying suction to the corners of the top backing layer 232 (block 1052).

[0074] Reference Figure 6 and Figure 8 , in one or more examples, the step of removing the top backing layer 232 from the laminate 210 (block 1050) includes the step of detecting the suction (block 1053).

[0075] Reference Figure 6 and Figure 8 , in one or more examples, the step of removing the top backing layer 232 from the laminate 210 (block 1050) includes the step of peeling the top backing layer 232 from the top surface 212 of the laminate 210 (block 1054).

[0076] Generally referring to Figure 1 and Figure 8 And specifically referring to Figure 7 , which shows an example of the step of inspecting 1060 the laminate 210 (block 1060) after the laminate 210 has been compacted on the forming surface 160 according to one or more examples of the method 1000.

[0077] Reference Figure 7 and Figure 8 , in one or more examples, after the laminate 210 has been compacted on the forming surface 160, the step of inspecting 1060 the laminate 210 includes the step of visually inspecting the laminate 210 (block 1061).

[0078] In one or more examples, the laminate 210 is inspected using inspection device 170, such as at least one vision sensor 172. In these examples, results 440 from vision sensor 172, such as measurement data, image data, images, etc., are used to detect nonconformities in laminate 210 after compaction. In one or more examples, results 440 are sent to computer 500 and processed and / or analyzed by computer 500 to determine the type and / or characteristics of any nonconformities. Depending on the type and / or characteristics of the detected nonconformities, recompaction may be necessary. In one or more examples, vision sensor 172 includes or takes the form of an imaging device or other suitable vision sensor that is configured or operative to scan laminate 210 on forming surface 160 after compaction and generate data (e.g., results 444) that can be processed to detect nonconformities. As an example, laminate sensor 144 can include or take the form of a camera, charge-coupled device (CCD), complementary metal-oxide semiconductor (CMOS), laser scanner, line scanner, 2D scanner, 3D scanner, etc.

[0079] Reference Figure 7 and Figure 8 , in one or more examples, after laminate 210 is compacted on forming surface 160, the step of inspecting 1060 laminate 210 (block 1060) includes the step of determining whether recompaction is needed based on results 440 of visual inspection (block 1062).

[0080] As Figure 7 shown, when the determination is negative (i.e., recompaction is not needed), the process ends. However, when the determination is positive (i.e., recompaction is needed), the process proceeds to operational steps involving rework, including recompaction and subsequent inspection.

[0081] Reference Figure 7 and Figure 8 , in one or more examples, after laminate 210 is compacted on forming surface 160, the step of inspecting 1060 laminate 210 includes the step of retrieving recompaction path plan 450 (block 1063). As an example, recompaction path plan 450 is retrieved by computer 500 from database 510.

[0082] Reference Figure 7 and Figure 8 , in one or more examples, after laminate 210 is compacted on forming surface 160, the step of inspecting 1060 laminate 210 includes the step of positioning 1064 compaction roller 150 in contact with laminate 210.

[0083] Reference Figure 7 and Figure 8, in one or more examples, after the laminate 210 is compacted on the forming surface 160, the step of inspecting 1060 the laminate 210 includes the step of moving the compaction roller 150 across the laminate 210 along the recompaction path 452 according to the recompaction path plan 450 (block 1065).

[0084] Reference Figure 7 and Figure 8 , in one or more examples, after the laminate 210 is compacted on the forming surface 160, the step of inspecting 1060 the laminate 210 includes the step of recompacting 1066 the laminate 210 on the forming surface 160 when recompaction is needed.

[0085] Again reference Figure 1 and Figure 8 , in one or more examples, method 1000 includes the following step (block 1070): cleaning 1070 the compaction roller 150 used to compact the laminate 210 on the forming surface 160.

[0086] The present disclosure recognizes that during the compaction of the laminate 210 of the ceramic matrix composite 250, a certain amount of debris, such as from the laminate 210 or other foreign objects, may remain on the compaction roller surface of the compaction roller 150. The debris may include a certain amount of the ceramic matrix 254, such as a certain amount of ceramic particles 256 and / or the suspension medium 258. The debris may also include fragments of the ceramic reinforcement 252. Accordingly, examples of the method 1000 and system 100 disclosed herein provide techniques and mechanisms for easily and effectively cleaning the compaction roller surface of the compaction roller 150 after laminate compaction and / or recompaction.

[0087] Reference Figure 1 , in one or more examples, method 1000 includes: determining whether another one of the laminates 200 of the ceramic matrix composite 250 is added for manufacturing the ceramic matrix composite structure 260 (block 1080). If the determination is affirmative (i.e., another ceramic matrix composite laminate is to be added), the process returns to the step of picking up the laminate 210 to process the next one of the laminates 200 of the ceramic matrix composite 250 (block 1010). However, if the determination is negative (i.e., there is no additional ceramic matrix composite laminate), the process ends with the step of completing the ceramic matrix composite structure 260 (block 1090), and the process ends.

[0088] Now reference Figure 8, the following is an example of a system 100 for manufacturing a ceramic matrix composite structure 260 in accordance with the present disclosure. The system 100 includes a plurality of elements, features, and components. Not all elements, features, and / or components described or shown in one example are required in one example. Some or all of the elements, features, and / or components described or shown in one example can be combined with other examples in various ways without including other elements, features, and / or components described in those other examples, even if one or more such combinations are not explicitly described or shown herein.

[0089] In one or more examples, the PnP device 110 is configured or operative to pick up a ply 210 of a ceramic matrix composite 250 at a staging location 310. The PnP device 110 is further configured or operative to place the ply 210 on a forming surface 160 at a forming location 314. The PnP device 110 is further configured or operative to compact the ply 210 on the forming surface 160.

[0090] In one or more examples, the stripping device 180 is configured or operative to remove a bottom backing layer 230 from the ply 210 at a backing removal location 312 before the ply 210 is placed on the forming surface 160. The stripping device 180 is further configured or operative to remove a top backing layer 232 from the ply 210 after the ply 210 is compacted on the forming surface 160.

[0091] In one or more examples, the inspection device 170 is configured or operative to inspect the ply 210 after the ply 210 is compacted on the forming surface 160.

[0092] In one or more examples, system 100 includes tool 164. Tool 164 includes tool surface 166. In one or more examples, during the layup process described above by method 1000, an initial one of the plies 200 of ceramic matrix composite 250 is placed on tool surface 166 and the ply is compacted on tool surface 166. In these examples, tool surface 166 forms or defines a forming surface 160 at least for the initial ply in the plies 200 formed on tool 164. In one or more examples, during the layup process described above by method 1000, subsequent or additional plies 200 of ceramic matrix composite 250 are placed on the previous ply surface 222 of the previous ply 220 and the ply is compacted on the previous ply surface. In these examples, at least for subsequent or additional plies 200, the previous ply surface 222 forms or defines a forming surface 160. Thus, the shape of tool 164 or the profile of tool surface 166 generally defines the shape 162 or profile 168 of forming surface 160 on which the plies 200 are formed (e.g., placed and compacted). Tool 164 can have any suitable geometry or shape. Similarly, tool surface 166 can have any suitable geometry or profile shape. As an example, tool surface 166 can have any suitable profile, such as flat (e.g., planar), curved, or a combination of flat and curved portions (e.g., simple or complex profiles). Method 1000 and system 100 enable the formation (e.g., placement and compaction) of the individual plies 200 of ceramic matrix composite 250 (e.g., layer by layer) to conform to the shape 162 and / or profile 168 of forming surface 160 and thus to the fabrication of ceramic matrix composite structure 260.

[0093] In one or more examples, PnP device 110 includes robot 120 and end effector 130. End effector 130 is coupled to robot 120 and is configured to interact with ply 210 during one or more of pick, peel, place, compact, and inspection operations.

[0094] In one or more examples, PnP device 110 includes a plurality of fixtures 140, at least one ply sensor 144, and at least one clamping sensor 142. Fixtures 140 are coupled to end effector 130. Each of fixtures 140 is configured or operated to grip or otherwise secure and hold ply 210 during pick, peel, and place operations. At least one ply sensor 144 is configured or operated to identify the geometry 240 of ply 210. At least one clamping sensor 142 is configured or operated to detect whether fixture 140 is coupled to ply 210.

[0095] In one or more examples, the end effector 130 includes a base and at least one arm (such as a plurality of arms). In one or more examples, the clamp 140 is coupled to the base and each arm. In one or more examples, the arms are coupled to the base and extend outwardly from the base. Thus, the base and the arms generally position the clamp 140 to contact and hold the laminate 210. In one or more examples, the arms are movable relative to the base, such as linearly movable and / or rotatably movable. Thus, the movement of the arms relative to the base enables the end effector 130 to selectively or sequentially place different portions of the laminate 210 on the forming surface 160 and controllably cover portions of the laminate 210 over the curved portions of the forming surface 160 and / or the rounded edges of the forming surface 160. Additionally, the movement of the arms relative to the base enables the end effector 130 to apply tension to the laminate 210 during placement and shaping on the forming surface 160, thereby preventing the laminate 210 from sagging during placement. In one or more examples, the clamp 140 is movable relative to the arms and / or the base, such as linearly movable or rotatably movable. Thus, the movement of the clamp 140 relative to the base and / or the arms enables the end effector 130 to selectively position the clamp 140 to pick up and place the laminate 210, for example, based on the geometry 240 of the laminate 210. In one or more examples, with the laminate 210 held by the clamp 140, the robot 120 moves the laminate 210 relative to the forming surface 160 such that a first laminate portion is placed on a first surface portion of the forming surface. Additionally, with the laminate 210 held by the clamp 140, the arms can move relative to the base and the forming surface 160 such that a second laminate portion of the laminate 210 covers the rounded portion of the forming surface 160 between the first surface portion and the second surface portion of the forming surface 160, and the second laminate portion of the laminate 210 is placed on the second surface portion of the forming surface 160.

[0096] In one or more examples, the PnP device 110 includes a compaction roller 150. The compaction roller 150 is coupled to the end effector 130. The compaction roller 150 is configured or operable to apply a compaction force or compaction pressure to the laminate 210 when placed in contact with the laminate 210 and moved along the laminate 210, for example, by the robot 120.

[0097] The present disclosure recognizes the advantages of using a compaction roller with specialized material properties to compact the lamina 200 of a ceramic matrix composite 250 in a manner similar to the smoothing process used during manual layup, and addresses the compaction requirements in ceramic matrix composite manufacturing. In one or more examples, the material for the compaction roller 150 is selected such that the lamina 200 of the ceramic matrix composite 250 can be compacted using the compaction roller 150 to conform the lamina 210 to the shape 162 and / or profile 168 of the forming surface 160 and / or while maintaining the desired thickness of the lamina 210 as the compaction roller 150 is moved across the lamina 210, without causing migration of the ceramic matrix 254 and without causing undesired deformation (e.g., wrinkling, blistering, pleating, corrugating, bridging, or other deformation) of the fabric weave of the ceramic reinforcement 252 of the lamina 210. In one or more examples, the compaction roller 150 includes a compaction roller axis and a compaction roller surface about the compaction roller axis. In one or more examples, the compaction roller includes a core and a covering about the core. In one or more examples, the covering material of the covering includes one of a foam material, a closed-cell foam material, or an inflatable bladder. In one or more examples, the covering material of the covering is impermeable. In one or more examples, the covering material includes at least one of silicone, polyurethane, polyurethane and latex. In one or more examples, the covering material of the compaction roller 150 includes a Shore A hardness between about 1 and 10 (such as between about 3 and 7, such as about 5). Advantageously, the compliance of the roller material of the compaction roller 150 provides pressure uniformity without local high pressure peaks such that the variation in the compaction pressure along the contact interface between the compaction roller 150 and the lamina 210 is less than about 5 PSI, such as less than about 3 PSI. For example, less than about 1 PSI. The softness of the roller material allows the lamina 210 to be smoothed during rolling compaction without enhanced deformation or matrix migration, while effectively eliminating large trapped air bubbles.

[0098] In one or more examples, the system 100 includes a computer 500. The computer 500 is adapted to retrieve position data 410 and orientation data 420 from a database 510, for example, based on the geometry 240 of the lamina 210 and the lamina serial number 242 of the lamina 210. For example, as indicated by the computer 500, based on the position data 410 and the orientation data 420, the lamina 210 is placed (e.g., positioned and oriented) relative to the forming surface 160 at the forming position 314 by the pick-and-place device 110.

[0099] In one or more examples, computer 500 is adapted to retrieve a compaction path plan 430 from database 510, for example, based on the geometry 240 of laminate 210 and the laminate serial number 242 of laminate 210. Robot 120 is configured or operable to move compaction roller 150 across laminate 210 along compaction path 432 according to compaction path plan 430 (e.g., as indicated by computer 500).

[0100] In one or more examples, system 100 includes a cleaning device 190. Cleaning device 190 is configured or operable to clean ceramic matrix 254 (e.g., residues of ceramic particles 256 and / or suspension medium 258) from compaction roller 150. In some cases, cleaning device 190 is configured or operable to also clean residues of ceramic reinforcement 252 and / or other foreign debris from compaction roller 150.

[0101] In one or more examples, inspection device 170 includes at least one vision sensor 172. At least one vision sensor 172 is configured or operable to detect deformations in laminate 210 after laminate 210 has been compacted on forming surface 160.

[0102] In one or more examples, computer 500 is adapted to determine whether recompaction is needed based on results 440 generated by vision sensor 172. Computer 500 is also adapted to retrieve a recompaction path plan 450 from database 510, for example. Robot 120 is configured or operable to move compaction roller 150 across laminate 210 along recompaction path 452 according to recompaction path plan 450, for example, as guided by computer 500.

[0103] Now refer Figure 9 and Figure 10 , examples of method 1000 and system 100 described herein may be associated with or used in the context of an aerospace manufacturing and maintenance method 1100 as shown in the flowchart of Figure 9 and an aircraft 1200 schematically shown in Figure 10 . As an example, aircraft 1200 and / or manufacturing and maintenance method 1100 may include or utilize components manufactured from ceramic matrix composite structures using system 100 and / or manufactured according to method 1000.

[0104] Refer Figure 10, which shows an example of an aircraft 1200. The aircraft 1200 can be any aerial vehicle or platform. In one or more examples, the aircraft 1200 includes a fuselage 1202 having an interior 1206. The aircraft 1200 includes a plurality of on-board systems 1204 (e.g., advanced systems). Examples of the on-board systems 1204 of the aircraft 1200 include a propulsion system 1208, a hydraulic system 1212, an electrical system 1210, and an environmental system 1214. In other examples, the on-board systems 1204 also include one or more control systems coupled to the fuselage 1202 of the aircraft 1200. In other examples, the on-board systems 1204 also include one or more other systems 1216, such as but not limited to communication systems, avionics systems, software distribution systems, network communication systems, passenger information / entertainment systems, guidance systems, radar systems, weapon systems, and the like. The aircraft 1200 can have any number of components made of ceramic matrix composites, such as ceramic matrix composite structures fabricated using the system 100 and / or in accordance with the method 1000.

[0105] Reference Figure 9 , during pre-production of the aircraft 1200, the manufacturing and maintenance method 1100 includes the specification and design of the aircraft 1200 (block 1102) and material procurement (block 1104). During production of the aircraft 1200, component and sub-assembly manufacturing of the aircraft 1200 (block 1106) and system integration (block 1108) occur. Thereafter, the aircraft 1200 undergoes certification and delivery (block 1110) for use (block 1112). Routine maintenance and repair (block 1114) includes modification, reconfiguration, refurbishment, etc. of one or more systems of the aircraft 1200.

[0106] Figure 9 Each process of the manufacturing and maintenance method 1100 shown can be performed or carried out by a system integrator, a third party, and / or an operator (e.g., a customer). For the purposes of this specification, a system integrator can include, but is not limited to, any number of aircraft manufacturers and prime system subcontractors; a third party can include, but is not limited to, any number of suppliers, subcontractors, and vendors; and an operator can be an airline, a leasing company, a military entity, a service organization, etc.

[0107] Examples of the method 1000 and system 100 shown and described herein can be in Figure 9employed during any one or more stages of the manufacturing and maintenance method 1100 shown in the flowchart shown. In an example, components of the aircraft 1200 may be manufactured from a ceramic matrix composite material, which is manufactured using the system 100 and / or in accordance with the method 1000 during part of component and subassembly manufacturing (block 1106) and / or system integration (block 1108). Additionally, components of the aircraft 1200 may be manufactured from a ceramic matrix composite material, and when the aircraft 1200 is in use, the ceramic matrix composite material is manufactured using the system 100 and / or in accordance with the method 1000 (block 1112). Additionally, components of the aircraft 1200 may be manufactured from a ceramic matrix composite material, which is manufactured using the system 100 and / or in accordance with the method 1000 during system integration (block 1108) and certification and delivery (block 1110). Similarly, components of the aircraft 1200 may be manufactured from a ceramic matrix composite material, and when the aircraft 1200 is in use (block 1112) and during servicing and maintenance (block 1114), the ceramic matrix composite material is manufactured using the system 100 and / or in accordance with the method 1000.

[0108] A method (1000) for manufacturing a ceramic matrix composite structure (260) according to an embodiment of the present application (see attached Figures 1 to 7) includes a number of steps, the number of steps including: picking up (1010) a laminate (210) of a ceramic matrix composite material (250) at a staging position (310); removing (1020) a bottom backing layer (230) from the laminate (210) at a backing removal position (312); after removing the bottom backing layer (230), placing (1030) the laminate (210) on a forming surface (160) at a forming position (314); compressing (1040) the laminate (210) on the forming surface (160); after compressing the laminate (210) on the forming surface (160), removing (1050) a top backing layer (232) from the laminate (210); and after compressing the laminate (210) on the forming surface (160), inspecting (1060) the laminate (210). Preferably, picking up (1010) the laminate (210) includes: staging (1011) the laminate (210) at the staging position (310), moving (1012) an end effector (130) to the staging position (310), identifying (1013) the geometry (240) of the laminate (210), positioning (1014) a clamp (140) of the end effector (130) based on the geometry (240) of the laminate (210), and moving (1015) the end effector (130) to place the clamp (140) in contact with the laminate (210). In this method, with the clamp (140) in contact with the laminate (210), the clamp (140) is capable of gripping (1016) the laminate (210). This method further preferably involves detecting (1017) whether the laminate (210) is attached to the clamp (140).

[0109] In this method (1000), removing (1020) the bottom backing layer (230) from the laminate (210) preferably includes positioning (1021) the laminate (210) at the backing removal position (312) to remove the bottom backing layer (230), applying (1022) a suction force to the bottom backing layer (230), detecting (1023) the suction force, and peeling (1024) the bottom backing layer (230) from the bottom surface (214) of the laminate (210). Placing (1030) the laminate (210) on the forming surface (160) optionally includes retrieving (1031) position data (410) and orientation data (420) based on the geometry (240) of the laminate (210) and the laminate serial number (242) of the laminate (210), positioning (1032) the laminate (210) relative to the forming surface (160) at the forming position (314) based on the position data (410) and the orientation data (420), and conforming (1033) the laminate (210) to the shape (162) of the forming surface (160).

[0110] Compacting (1040) the laminate (210) on the forming surface (160) preferably involves retrieving (1041) a compaction path plan (430) based on the geometry (240) of the laminate (210) and the laminate serial number (242) of the laminate (210), positioning (1042) the compaction roller (150) in contact with the laminate (210), and moving (1043) the compaction roller (150) across the laminate (210) along the compaction path (432) according to the compaction path plan (430). Preferably, a cleaning (1070) step is applied to the compaction roller (150) used for compacting the laminate (210) on the forming surface (160).

[0111] Optionally, some steps of the method involve additional sub-steps. For example, removing (1050) the top backing layer (232) from the laminate (210) includes retrieving (1051) position data (410) and orientation data (420) based on the geometry (240) of the laminate (210) and the laminate serial number (242) of the laminate (210), applying (1052) suction to the corners of the top backing layer (232), detecting (1053) the suction, and peeling (1054) the top backing layer (232) from the top surface (212) of the laminate (210). In addition or alternatively, after compacting the laminate (210) on the forming surface (160), inspecting (1060) the laminate (210) may include visually inspecting (1061) the laminate (210), determining (1062) whether recompaction is required based on the result of the visual inspection (440), and when recompaction is required, recompacting (1066) the laminate (210) on the forming surface (160). After compacting the laminate (210) on the forming surface (160), inspecting (1060) the laminate (210) may optionally further involve retrieving (1063) a recompaction path plan (450), positioning (1064) the compaction roller (150) in contact with the laminate (210), and moving (1065) the compaction roller (150) across the laminate (210) along the recompaction path (452) according to the recompaction path plan (450).

[0112] The ceramic matrix composite structure (260) preferably includes a part of the aircraft (1200). This is schematically shown in Figure 10 as shown schematically in

[0113] According to an embodiment of the present application (see Figure 8) The system (100) for manufacturing a ceramic matrix composite structure (260) includes a pick-and-place device (110) configured to pick up a ply (210) of a ceramic matrix composite material (250) at a staging location (310), place the ply (210) on a forming surface (160) at a forming location (314), and compact the ply (210) on the forming surface (160). The system (100) further includes a stripping device (180) configured to be able to remove a bottom backing layer (230) from the ply (210) at a backing removal location (312) before placing the ply (210) on the forming surface (160), and remove a top backing layer (232) from the ply (210) after the ply (210) has been compacted on the forming surface (160). The system (100) also includes an inspection device (170) configured to inspect the ply (210) after the ply (210) has been compacted on the forming surface (160).

[0114] In an exemplary embodiment of the system (100), the pick-and-place device (110) includes a robot (120) and an end effector (130) coupled to the robot (120) and configured to be able to interact with the ply (210). Such a pick-and-place device (110) also preferably includes a plurality of clamps (140) coupled to the end effector (130), at least one ply sensor (144) configured to be able to identify the geometry (240) of the ply (210), and at least one clamping sensor (142) configured to be able to detect whether the clamp (140) is coupled to the ply (210). Optionally, the pick-and-place device (110) also includes a compaction roller (150) coupled to the end effector (130).

[0115] Such a system (100) preferably involves a computer (500) adapted to retrieve a compaction path plan (430) based on the geometry (240) of the ply (210) and the ply serial number (242) of the ply (210). Preferably, the robot (120) is configured to move the compaction roller (150) along a compaction path (432) across the ply (210) according to the compaction path plan (430).

[0116] The system (100) may further include a cleaning device (190) configured to be able to clean ceramic matrix (254) from the compaction roller (150).

[0117] In addition, as another alternative, the system (100) may further include a computer (500) adapted to retrieve position data (410) and orientation data (420) based on the geometry (240) of the laminate (210) and the laminate serial number (242) of the laminate (210). With such a computer (500), the pick-and-place device (110) is preferably configured to place the laminate (210) relative to the forming surface (160) at the forming position (314) based on the position data (410) and the orientation data (420).

[0118] Preferably, the inspection device (170) of the system (100) includes at least one vision sensor (172) configured to detect deformation in the laminate (210) after the laminate (210) has been compacted on the forming surface (160). In such a system (100), a computer (500) is preferably provided and is adapted to determine whether recompaction is required based on the results (440) generated by the vision sensor (172) and to retrieve a recompaction path plan (450). Then, the robot (120) is preferably configured to move the compaction roller (150) along a recompaction path (452) across the laminate (210) according to the recompaction path plan (450). The foregoing detailed description refers to the accompanying drawings that illustrate specific examples described in this disclosure. Other examples with different structures and operations do not depart from the scope of this disclosure. In the different drawings, the same reference numerals may refer to the same features, elements, or components. Throughout this disclosure, any one of a plurality of items may be referred to individually as an item, and a plurality of items may be collectively referred to as items and may be referred to by the same reference numeral. Further, as used herein, features, elements, components, or steps before the word "a" or "an" should be understood as not excluding a plurality of features, elements, components, or steps unless such exclusion is explicitly recited.

[0119] Illustrative, non-exhaustive examples of the subject matter according to this disclosure are provided above, which may or may not be the claimed. References to "examples" herein mean that one or more features, structures, elements, components, characteristics, and / or operational steps described in connection with the example are included in at least one aspect, embodiment, and / or implementation of the subject matter according to this disclosure. Thus, phrases such as "example," "another example," "one or more examples," and similar language throughout this disclosure may or may not refer to the same example. Additionally, the subject matter characterizing any one example may or may not include the subject matter characterizing any other example. Moreover, the subject matter characterizing any one example may or may not be combined with the subject matter characterizing any other example.

[0120] As used herein, a system, apparatus, device, structure, article, element, component, or hardware "configured to" perform a specified function is indeed capable of performing the specified function without any change, rather than merely having the potential to perform the specified function after further modification. In other words, for the purpose of performing the specified function, the system, apparatus, device, structure, article, element, component, or hardware "configured to" perform the specified function is specifically selected, created, implemented, utilized, programmed, and / or designed. As used herein, "configured to" represents an existing characteristic of a system, apparatus, structure, article, element, component, or hardware that enables the system, apparatus, structure, article, element, component, or hardware to perform the specified function without further modification. For purposes of this disclosure, a system, apparatus, device, structure, article, element, component, or hardware described as "configured to" perform a particular function may additionally or alternatively be described as "adapted to" and / or "operable to" perform that function.

[0121] Unless otherwise specified, the terms "first," "second," "third," etc. are used herein only as labels and are not intended to impose an order, position, or hierarchical requirement on the items to which these terms refer. Additionally, a reference to, for example, a "second" item does not require or preclude the presence of, for example, a "first" or lower-numbered item and / or a "third" or higher-numbered item.

[0122] As used herein, the phrase "at least one," when used in conjunction with a list of items, means that different combinations of one or more of the listed items may be used and that only one of each item in the list may be required. For example, "at least one of item A, item B, and item C" may include, but is not limited to, item A or item A and item B. Other examples of "at least one" may be, for example but not limited to, two of item A, one of item B, and ten of item C; four of item B and seven of item C; and other suitable combinations. As used herein, the terms "and / or" and the " / " symbol include any and all combinations of one or more of the associated listed items.

[0123] For purposes of this disclosure, the terms "coupled," "connected," and like terms refer to two or more elements that are joined, linked, fastened, attached, connected, communicated with, or otherwise associated with each other (e.g., mechanically, electrically, fluidically, optically, electromagnetically). In various examples, the elements may be directly or indirectly associated. As an example, element A may be directly associated with element B. Another example, element A may be indirectly associated with element B via, for example, another element C. It should be understood that not all associations between the various disclosed elements must be represented. Thus, there may also be connectors other than those shown in the figures.

[0124] As used herein, the term "approximate" refers to or denotes a condition that is close but not exactly close to the condition that still performs the desired function or achieves the desired result. As an example, the term "approximate" refers to a condition within an acceptable predetermined tolerance or accuracy, such as a condition within 10% of the condition. However, the term "approximate" does not exclude a condition that is exactly the condition. As used herein, the term "substantially" refers to a condition that is substantially the condition that performs the desired function or achieves the desired result.

[0125] The above-mentioned Figure 8 and Figure 10 may represent functional elements, features, or components thereof, and do not necessarily imply any particular structure. Accordingly, the structures shown may be modified, added to, and / or omitted. Additionally, those skilled in the art will understand that not all of the Figure 8 and Figure 10 elements, features, and / or components described and shown in the above reference need to be included in each example, and not all of the elements, features, and / or components described herein must be depicted in each illustrative example. Accordingly, Figure 8 and Figure 10 some of the elements, features, and / or components described and shown in the above may be combined in various ways without the need to include Figure 8 and Figure 10 and other features described and shown in other figures and / or the appended disclosure, even if such combinations or multiple combinations are not explicitly shown herein. Similarly, additional features not limited to the examples presented may be combined with some or all of the features shown and described herein. Unless otherwise explicitly stated, the schematic diagrams of the examples depicted in the above-mentioned Figure 8 and Figure 10 do not imply structural limitations with respect to the illustrative examples. Instead, although an illustrative structure is indicated, it should be understood that the structure may be modified as appropriate. Accordingly, the structures shown may be modified, added to, and / or omitted. Additionally, elements, features, and / or components for similar or at least substantially similar purposes are labeled with the same numbers in each of Figure 8 and Figure 10 and such elements, features, and / or components may not be discussed in detail herein with reference to each of Figure 8 and Figure 10 each. Similarly, not all elements, features, and / or components may be labeled in each of Figure 8 and Figure 10 each, but for consistency, the reference numerals associated therewith may be utilized herein.

[0126] In the above-mentioned Figures 1 to 7 and Figure 9In this context, the boxes may represent operations, steps, and / or portions thereof, and the lines connecting the various boxes do not imply any particular order or dependency of the operations or portions thereof. It should be understood that not all dependencies between the various disclosed operations need to be represented. Figures 1 to 7 and Figure 9 The appended disclosure that describes the operations of the disclosed methods herein should not be construed as necessarily determining the order in which the operations are to be performed. Instead, although an illustrative order is indicated, it should be understood that the order of the operations may be modified as appropriate. Accordingly, the operations shown may be modified, added to, and / or omitted, and certain operations may be performed in a different order or simultaneously. Additionally, those skilled in the art will understand that not all of the described operations need to be performed.

[0127] This application relates to the following clauses:

[0128] Clause 1. A method (1000) for manufacturing a ceramic matrix composite structure (260), the method (1000) comprising:

[0129] Picking up (1010) a laminate (210) of a ceramic matrix composite material (250) at a staging position (310);

[0130] Removing (1020) a bottom backing layer (230) from the laminate (210) at a backing removal position (312);

[0131] After removing the bottom backing layer (230), placing (1030) the laminate (210) on a forming surface (160) at a forming position (314);

[0132] Compacting (1040) the laminate (210) on the forming surface (160);

[0133] After compacting the laminate (210) on the forming surface (160), removing (1050) a top backing layer (232) from the laminate (210); and

[0134] After compacting the laminate (210) on the forming surface (160), inspecting (1060) the laminate (210).

[0135] Clause 2. The method (1000) according to Clause 1, wherein picking up (1010) the laminate (210) comprises:

[0136] Staging (1011) the laminate (210) at the staging position (310);

[0137] Moving (1012) an end effector (130) to the staging position (310);

[0138] Identify (1013) the geometry (240) of the laminate (210);

[0139] Position (1014) the jaws (140) of the end effector (130) based on the geometry (240) of the laminate (210);

[0140] Move (1015) the end effector (130) to place the jaws (140) in contact with the laminate (210);

[0141] Clamp (1016) the laminate (210) with the jaws (140) when the jaws (140) are in contact with the laminate (210); and

[0142] Detect (1017) whether the laminate (210) is coupled to the jaws (140).

[0143] Clause 3. The method (1000) according to Clause 1, wherein removing (1020) the bottom backing layer (230) from the laminate (210) includes:

[0144] Position (1021) the laminate (210) at the backing removal position (312) for removing the bottom backing layer (230);

[0145] Apply (1022) a suction force to the bottom backing layer (230);

[0146] Detect (1023) the suction force; and

[0147] Peel (1024) the bottom backing layer (230) from the bottom surface (214) of the laminate (210).

[0148] Clause 4. The method (1000) according to Clause 1, wherein placing (1030) the laminate (210) on the forming surface (160) includes:

[0149] Retrieve (1031) position data (410) and orientation data (420) based on the geometry (240) of the laminate (210) and the laminate serial number (242) of the laminate (210);

[0150] Position (1032) the laminate (210) relative to the forming surface (160) at the forming position (314) based on the position data (410) and the orientation data (420); and

[0151] Conform (1033) the laminate (210) to the shape (162) of the forming surface (160).

[0152] Clause 5. The method (1000) according to Clause 1, wherein compacting (1040) the laminate (210) on the forming surface (160) comprises:

[0153] Retrieving (1041) a compaction path plan (430) based on the geometry (240) of the laminate (210) and the laminate serial number (242) of the laminate (210);

[0154] Positioning (1042) the compaction roller (150) in contact with the laminate (210); and

[0155] Moving (1043) the compaction roller (150) across the laminate (210) along a compaction path (432) according to the compaction path plan (430).

[0156] Clause 6. The method (1000) according to Clause 5, the method further comprising: cleaning (1070) the compaction roller (150) used for compacting the laminate (210) on the forming surface (160).

[0157] Clause 7. The method (1000) according to Clause 1, wherein removing (1050) the top backing layer (232) from the laminate (210) comprises:

[0158] Retrieving (1051) position data (410) and orientation data (420) based on the geometry (240) of the laminate (210) and the laminate serial number (242) of the laminate (210);

[0159] Applying (1052) suction to the corners of the top backing layer (232);

[0160] Detecting (1053) the suction; and

[0161] Peeling (1054) the top backing layer (232) from the top surface (212) of the laminate (210).

[0162] Clause 8. The method (1000) according to Clause 1, wherein after compacting the laminate (210) on the forming surface (160), inspecting (1060) the laminate (210) comprises:

[0163] Visually inspecting (1061) the laminate (210);

[0164] Determining (1062) whether recompaction is required based on the result of the visual inspection (440); and

[0165] When recompaction is required, recompact (1066) the laminate (210) on the forming surface (160).

[0166] Clause 9. The method (1000) according to Clause 8, wherein, after compacting the laminate (210) on the forming surface (160), inspecting (1060) the laminate (210) further includes:

[0167] Retrieving (1063) a recompaction path plan (450);

[0168] Positioning (1064) the compaction roller (150) in contact with the laminate (210); and

[0169] Moving (1065) the compaction roller (150) across the laminate (210) along a recompaction path (452) according to the recompaction path plan (450).

[0170] Clause 10. Manufacturing a part of an aircraft (1200), including the method (1000) according to Clause 1.

[0171] Clause 11. A ceramic matrix composite structure (260), the ceramic matrix composite structure being manufactured according to the method (1000) of Clause 1.

[0172] Clause 12. A system (100) for manufacturing a ceramic matrix composite structure (260), the system (100) including:

[0173] A pick-and-place device (110), the pick-and-place device being configured to:

[0174] Pick up a laminate (210) of a ceramic matrix composite material (250) at a staging position (310);

[0175] Place the laminate (210) on a forming surface (160) at a forming position (314); and

[0176] Compact the laminate (210) on the forming surface (160);

[0177] A stripping device (180), the stripping device being configured to:

[0178] Remove a bottom backing layer (230) from the laminate (210) at a backing removal position (312) before placing the laminate (210) on the forming surface (160); and

[0179] Remove a top backing layer (232) from the laminate (210) after compacting the laminate (210) on the forming surface (160); and

[0180] An inspection device (170) configured to inspect a laminate (210) after the laminate (210) has been compacted on the forming surface (160).

[0181] Clause 13. The system (100) according to clause 12, wherein the pick-and-place device (110) comprises:

[0182] A robot (120);

[0183] An end effector (130) coupled to the robot (120) and configured to interact with the laminate (210).

[0184] Clause 14. The system (100) according to clause 13, wherein the pick-and-place device (110) further comprises:

[0185] A plurality of clamps (140) coupled to the end effector (130);

[0186] At least one laminate sensor (144) configured to identify the geometry (240) of the laminate (210); and

[0187] At least one clamping sensor (142) configured to detect whether the plurality of clamps (140) are coupled to the laminate (210).

[0188] Clause 15. The system (100) according to clause 13, wherein the pick-and-place device (110) further comprises: a compaction roller (150) coupled to the end effector (130).

[0189] Clause 16. The system (100) according to clause 15, the system further comprising: a computer (500) adapted to retrieve position data (410) and orientation data (420) based on the geometry (240) of the laminate (210) and the laminate serial number (242) of the laminate (210),

[0190] wherein the pick-and-place device (110) places the laminate (210) at the forming position (314) relative to the forming surface (160) based on the position data (410) and the orientation data (420).

[0191] Clause 17. The system (100) according to Clause 15, the system further comprising: a computer (500), the computer being adapted to retrieve a compaction path plan (430) based on the geometry (240) of the laminate (210) and the laminate serial number (242) of the laminate (210),

[0192] wherein the robot (120) moves the compaction roller (150) across the laminate (210) along a compaction path (432) according to the compaction path plan (430).

[0193] Clause 18. The system (100) according to Clause 15, the system further comprising: a cleaning device (190), the cleaning device being configured to clean the ceramic matrix (254) from the compaction roller (150).

[0194] Clause 19. The system (100) according to Clause 15, wherein the inspection device (170) includes at least one vision sensor (172), the at least one vision sensor (172) being configured to detect deformation in the laminate (210) after the laminate (210) has been compacted on the forming surface (160).

[0195] Clause 20. The system (100) according to Clause 19, the system further comprising: a computer (500), the computer being adapted to:

[0196] determine whether recompaction is required based on the results (440) generated by the at least one vision sensor (172); and

[0197] retrieve a recompaction path plan (450),

[0198] wherein the robot (120) moves the compaction roller (150) across the laminate (210) along a recompaction path (452) according to the recompaction path plan (450).

[0199] Furthermore, references throughout this specification to features, advantages, or similar language do not imply that all features and advantages that can be realized with the examples disclosed herein should be or are in any single example. Rather, the language referring to features and advantages is understood to mean that a particular feature, advantage, or characteristic described in connection with an example is included in at least one example. Thus, the discussion of features, advantages, and similar language throughout this disclosure may, but does not necessarily, refer to the same example.

[0200] The described features, advantages, and characteristics of one example can be combined in any suitable way in one or more other examples. Those skilled in the relevant art will recognize that the examples described herein can be practiced without one or more specific features or advantages of a particular example. In other instances, additional features and advantages may be recognized in certain examples that may not exist in all examples. Further, although various examples of system 100 and method 1000 have been shown and described, modifications may be contemplated by those skilled in the art upon reading the specification. This application includes such modifications and is limited only by the scope of the claims.

Claims

1. A method (1000) for manufacturing a ceramic matrix composite structure (260), the method (1000) comprising: picking up (1010) a ply (210) of a ceramic matrix composite material (250) at a temporary storage location (310); removing (1020) a bottom backing layer (230) from the ply (210) at a backing removal location (312); After removing the bottom backing layer (230), placing (1030) the ply (210) on a forming surface (160) at a forming location (314); compacting (1040) the ply (210) on the forming surface (160); After compacting the ply (210) on the forming surface (160), removing (1050) a top backing layer (232) from the ply (210); and After compacting the ply (210) on the forming surface (160), the ply (210) is inspected (1060).

2. The method (1000) according to claim 1, wherein: Picking up (1010) the ply (210) includes: temporarily storing (1011) the layer sheet (210) at the temporary storage position (310); Moving (1012) the end effector (130) to the temporary storage position (310); identifying (1013) a geometric shape (240) of the ply (210); positioning (1014) a fixture (140) of the end effector (130) based on the geometry (240) of the ply (210); moving (1015) the end effector (130) to place the fixture (140) in contact with the ply (210); clamping (1016) the ply (210) with the clamp (140) while the clamp (140) is in contact with the ply (210); and It is detected (1017) whether the ply (210) is coupled to the fixture (140).

3. The method (1000) of claim 1, wherein: Removing (1020) the bottom backing layer (230) from the ply (210) includes: positioning (1021) the ply (210) at the backing removal position (312) for removing the bottom backing layer (230); applying (1022) suction to the bottom backing layer (230); detecting (1023) the suction force; and The bottom backing layer (230) is peeled (1024) from the bottom surface (214) of the ply (210).

4. The method (1000) of claim 1, wherein: Placing (1030) the ply (210) on the forming surface (160) includes: retrieving (1031) position data (410) and orientation data (420) based on a geometry (240) of the ply (210) and a ply sequence number (242) of the ply (210); positioning (1032) the ply (210) at the forming location (314) relative to the forming surface (160) based on the position data (410) and the orientation data (420); and The ply (210) is conformed (1033) to the shape (162) of the forming surface (160).

5. The method (1000) of claim 1, wherein: Compacting (1040) the ply (210) on the forming surface (160) includes: Retrieving (1041) a compaction path plan (430) based on the geometry (240) of the ply (210) and the ply sequence number (242) of the ply (210); positioning (1042) a compaction roller (150) in contact with the ply (210); and The compaction roller (150) is moved (1043) across the ply (210) along a compaction path (432) according to the compaction path plan (430).

6. The method (1000) according to claim 5, further comprising: Cleaning (1070) the compacting roller (150) used to compact the ply (210) on the forming surface (160).

7. The method (1000) of claim 1, wherein: Removing (1050) the top backing layer (232) from the ply (210) includes: retrieving (1051) position data (410) and orientation data (420) based on a geometry (240) of the ply (210) and a ply sequence number (242) of the ply (210); applying (1052) suction to a corner of the top backing layer (232); detecting (1053) the suction force; and The top backing layer (232) is peeled (1054) from the top surface (212) of the ply (210).

8. The method (1000) of claim 1, wherein: After compacting the ply (210) on the forming surface (160), inspecting (1060) the ply (210) comprises: visually inspecting (1061) the ply (210); determining (1062) whether recompacting is required based on the results of the visual inspection (440); and When recompacting is required, the ply (210) is recompacted (1066) on the forming surface (160).

9. The method (1000) according to claim 8, wherein: After compacting the ply (210) on the forming surface (160), inspecting (1060) the ply (210) further comprises: Retrieve (1063) recompact path plan (450); positioning (1064) a compaction roller (150) in contact with the ply (210); and The compaction roller (150) is moved (1065) across the ply (210) along a recompaction path (452) according to the recompaction path plan (450).

10. A system (100) for manufacturing a ceramic matrix composite structure (260), the system (100) comprising: A pick-and-place device (110), the pick-and-place device being configured to: picking up a ply (210) of a ceramic matrix composite material (250) at a temporary storage location (310); placing the ply (210) on a forming surface (160) at a forming location (314); and compacting the ply (210) on the forming surface (160); A stripping device (180), the stripping device being configured to: removing a bottom backing layer (230) from the ply (210) at a backing removal location (312) prior to placing the ply (210) on the forming surface (160); and removing a top backing layer (232) from the ply (210) after compacting the ply (210) on the forming surface (160); and An inspection device (170) is configured to inspect the ply (210) after compacting the ply (210) on the forming surface (160).

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