Vacuum-pumping negative pressure detection device for semiconductor packaging

Abstract

The invention provides a vacuumizing negative pressure detection device for semiconductor packaging. The vacuumizing negative pressure detection device is mainly characterized in that a vacuumizing module, a detection module and a pipe body are respectively arranged on a body; the body is provided with an internal space, the vacuumizing module is communicated with the internal space, the pipe body is provided with two openings in the same axial direction, one opening is connected with the body and is communicated with the internal space, and the other opening is connected with a package; wherein the pipe body is internally provided with a first channel and a second channel, the first channel is communicated with the internal space, and the second channel penetrates through the body and is connected with the detection module. When the device is used for a semiconductor packaging product, airflow in the semiconductor packaging product directly passes through the second channel to the detection module, and the detection module is used for detecting abnormity, so that damage to an internal product or breakage of the packaging product caused by blind vacuumizing is avoided.

Description

Technical Field

[0001] The present invention relates to a vacuum pumping device for semiconductor packaging, and particularly to a vacuum negative pressure detection device for semiconductor packaging. Background Art

[0002] In traditional semiconductor packaging technology, a vacuum pumping device is mainly connected to a vacuum generating device and a semiconductor packaging product. The vacuum generating device evacuates the semiconductor packaging product through the vacuum pumping device.

[0003] However, the vacuum generating device needs to operate for a fixed time after each startup, and the pressures suitable for different semiconductor packaging products are not the same. This causes the vacuum generating device to easily evacuate blindly, resulting in damage to internal products or rupture of the semiconductor packaging product. Summary of the Invention

[0004] In view of the above deficiencies of the prior art, the main object of the present invention is to provide a vacuum negative pressure detection device for semiconductor packaging, which improves the structure and technology of the vacuum pumping device for semiconductor packaging to avoid blindly evacuating and causing rupture of the semiconductor packaging product.

[0005] To solve the above problems of the prior art, the main technical solution adopted by the present invention is to make the aforementioned vacuum negative pressure detection device for semiconductor packaging include: A body having an internal space; A vacuum pumping module provided on the body; A tube having a first opening and a second opening on the same axis. The first opening is connected to the body. An internal portion between the first opening and the second opening of the tube has a first channel and a second channel. The first channel communicates with the internal space of the body, and the second channel penetrates the body; A detection module provided on the body and connected to the second channel of the tube.

[0006] Preferably, the body has a top side, a front side, and a rear side. The vacuum pumping module, the tube, and the detection module are respectively provided on the top side, the front side, and the rear side of the body.

[0007] Preferably, the tube includes an outer tube and an inner tube, and the inner tube is provided inside the outer tube.

[0008] Preferably, the outer tube and the inner tube of the tube are integrally injection molded or injection molded from a metal.

[0009] Preferably, the front end of the inner tube is flush with the front end of the outer tube.

[0010] Preferably, further, the front end of the inner tube protrudes and is exposed outside the outer tube.

[0011] Preferably, the first channel is formed between the outer tube and the inner tube, and the second channel is formed inside the inner tube.

[0012] Preferably, a control module and a vacuum generator are further provided. The control module is connected to the detection module and the vacuum generator, and the vacuum generator is connected to the vacuum pumping module.

[0013] Preferably, the control module includes a detector and an electro-control proportional valve. The detector is connected to the detection module and the electro-control proportional valve, and the electro-control proportional valve is connected to the vacuum generator.

[0014] Preferably, the outer tube has a first section and a second section. The first section and the second section respectively have a front end and a rear end that are opposite to each other. The front end of the first section is connected to the rear end of the second section, and the rear end of the first section is sleeved with the body. Wherein, the second section of the outer tube is in a duckbill shape.

[0015] With the above structure of the present invention, when used for a semiconductor packaging product, the semiconductor packaging product is evacuated through the first channel of the tube body, the internal space of the body and the vacuum pumping module. The air flow inside the semiconductor packaging product directly passes through the second channel to the detection module, and the abnormality can be detected by the detection module, so as to achieve the purpose of avoiding the rupture of the semiconductor packaging product caused by blind evacuation. Description of the Drawings

[0016] Figure 1 It is a perspective view of an embodiment of the vacuum negative pressure detection device of the present invention. Figure 2 It is an embodiment of the present invention Figure 1 The schematic A-A' side sectional view. Figure 3 It is an embodiment of the present invention Figure 2 The partial enlarged view of part C in the embodiment. Figure 4 It is an embodiment of the present invention Figure 2 The partial enlarged view of part D in the embodiment. Figure 5 It is an embodiment of the present invention Figure 1 The schematic B-B' front sectional view. Figure 6 It is a block diagram of the application state of an embodiment of the present invention. Detailed Description of the Invention

[0017] Regarding an embodiment of the present invention, a vacuum negative pressure detection device for a semiconductor package is provided. Please refer to Figure 1 and Figure 2 , which includes a body 10, a vacuum pumping module 20, a tube body 30, and a detection module 40. The vacuum pumping module 20, the tube body 30, and the detection module 40 are disposed on the body 10. The body 10 has an internal space 11. The tube body 30 forms a first opening 301 and a second opening 302 at the front and rear opposite ends in the same axial direction. The first opening 301 is connected to the body 10 and communicates with the internal space 11. The interior between the first opening 301 and the second opening 302 of the tube body 30 has a first channel C1 and a second channel C2. The first channel C1 communicates with the internal space 11. The second channel C2 penetrates the body 10, and the second channel C2 is not in communication with the internal space 11. The detection module 40 is connected to the second channel C2 of the tube body 30.

[0018] Therefore, with the foregoing structure of the present invention, when used for a semiconductor package product, the semiconductor package product is evacuated through the first channel C1 of the tube body 30, the internal space 11 of the body 10, and the vacuum pumping module 20, and the air flow in the semiconductor package product will directly pass through the second channel C2 to the detection module 40. Abnormalities can be detected by the detection module 40, avoiding the rupture of the semiconductor package product caused by blind evacuation.

[0019] As Figure 1 and Figure 2 shown, in this embodiment, the body 10 is in a rectangular shape and has a top side 12, a front side 13, and a rear side 14. The vacuum pumping module 20, the tube body 30, and the detection module 40 are respectively disposed on the top side 12, the front side 13, and the rear side 14 of the body 10. Openings are respectively formed on the top side 12, the front side 13, and the rear side 14 of the body 10. The two openings are respectively located at the central positions of the top side 12, the front side 13, and the rear side 14, and both of the two openings communicate with the internal space 11. The vacuum pumping module 20 is sleeved with the opening on the top side 12 of the body 10 and communicates with the internal space 11 of the body 10. In this embodiment, the first opening 301 of the tube body 30 is sleeved with the opening on the front side 13 of the body 10, and the second channel C2 of the tube body 30 penetrates through the opening on the front side 13 and the opening on the rear side 14 of the body 10 at the same time to be connected to the detection module 40.

[0020] Please refer to Figure 2, in this embodiment, the tube body 30 further includes a hollow outer tube 31 and a hollow inner tube 32. The outer tube 31 is disposed on the front side 13 of the body 10, and the inner tube 32 is inserted into the outer tube 31. In this embodiment, the outer tube 31 and the inner tube 32 can be integrally injection-molded or injection-molded from a metal.

[0021] In this embodiment, the outer tube 31 has a first section 311 and a second section 312. The first section 311 and the second section 312 respectively have a front end and a rear end that are opposite to each other. The front end of the first section 311 is connected to the rear end of the second section 312, and the rear end of the first section 311 is sleeved with the opening of the front side 13 of the body 10. In this embodiment, an opening is formed at the rear end of the first section 311 of the outer tube 31, and the opening constitutes the first opening 301 of the aforementioned tube body 30.

[0022] As Figure 2 and Figure 3 shown, in this embodiment, the inner tube 32 also has a front end and a rear end that are opposite to each other. In this embodiment, the front end of the inner tube 32 can be flush with the front end of the second section 312 of the outer tube 31; but further, in this embodiment, the front end and the rear end of the inner tube 32 can respectively protrude and be exposed outside the outer tube 31, and the rear end of the inner tube 32 penetrates through the opening of the front side 13 and the opening of the rear side 14 of the body 10. In this embodiment, another opening is formed at the front end of the inner tube 32, and the opening at the front end of the inner tube 32 and the front end of the second section 312 of the outer tube 31 constitute the second opening 302 of the tube body 30.

[0023] In this embodiment, the first channel C1 is formed between the outer tube 31 and the inner tube 32, and the second channel C2 is formed by the interior of the inner tube 32. When the present invention is in use, the second section 312 of the outer tube 31 and the front end of the inner tube 32 are placed in the semiconductor packaging product, and vacuum is drawn through the first channel C1 between the outer tube 31 and the inner tube 32, the internal space 11 of the body 10, and the vacuum pumping module 20. At the same time, the airflow in the semiconductor packaging product will directly pass through the second channel C2 in the inner tube 32 to the detection module 40, and the detection module 40 can detect an abnormality and perform pre-treatment to avoid blindly drawing vacuum and causing the semiconductor packaging product to rupture.

[0024] As Figure 2 and Figure 3As shown, in this embodiment, a front protection unit 50 is further provided. The front protection unit 50 is disposed on the front side 13 of the body 10, and a through hole is formed in the front protection unit 50. The front protection unit 50 is sleeved on the outer tube 31 through the through hole. The front protection unit 50 is used to protect the outer tube 31 to prevent the outer tube 31 from being broken due to external impact.

[0025] As Figure 2 and Figure 3 shown, in this embodiment, the detection module 40 includes a rear protection unit 41 and a connection terminal 42. The rear protection unit 41 is disposed on the rear side 14 of the body 10. The connection terminal 42 is disposed on the rear protection unit 41. The rear protection unit 41 has an opposite front side and a rear side. The front side of the rear protection unit 41 is adjacent to the rear side 14 of the body 10. A connection through hole is formed in the front side of the rear protection unit 41, and a connection port is formed in the rear side of the rear protection unit 41. The connection through hole communicates with the connection port. The rear protection unit 41 is sleeved on the rear end of the inner tube 32 through the connection through hole on the front side. Moreover, the connection terminal 42 is sleeved with the connection port to communicate the second channel C2 in the inner tube 32 with the connection terminal 42. In this embodiment, the rear protection unit 41 is used to protect the inner tube 32 to prevent the inner tube 32 from being broken due to external impact.

[0026] As Figure 3 shown, in this embodiment, a front sealing ring 60 and a rear sealing ring 61 are further provided. The front sealing ring 60 is sleeved on the outer tube 31 and is located between the front protection unit 50 and the body 10. The rear sealing ring 61 is sleeved on the inner tube 32 and is located between the rear protection unit 41 and the body 10. The front sealing ring 60 and the rear sealing ring 61 are used to prevent external air from entering the internal space 11 of the body 10, which can improve the vacuum pumping effect of the present invention.

[0027] Please refer to Figure 2 and Figure 5 simultaneously. Further, in this embodiment, the specific shape of the first section 311 of the outer tube 31 is cylindrical, and the specific shape of the second section 312 of the outer tube 31 is duckbill-shaped. Such a structural design can increase the pressure resistance of the outer tube 31 and also make the outer tube 31 have a good vacuum pumping effect. As Figure 4 and Figure 5As shown, in this embodiment, the first channel C1 is formed by a first spacing and a second spacing between the inner wall surface of the outer tube 31 and the outer wall surface of the inner tube 32. The first spacing is the distance in the vertical direction, and the second spacing is the distance in the horizontal direction. When the outer tube 31 is in a duckbill shape, the distance of the second spacing is greater than the distance of the first spacing; the second channel C2 is formed by the inner diameter of the inner tube 32.

[0028] As Figure 5 shown, in this embodiment, a first connecting portion 70 and a second connecting portion 71 are further provided. The body 10 further has a right side 15 and a left side 16. The first connecting portion 70 and the second connecting portion 71 are respectively disposed on the right side 15 and the left side 16 of the body 10. The first connecting portion 70 and the second connecting portion 71 are used to connect to a machine platform so that the present invention is disposed on the machine platform. In this embodiment, the first connecting portion 70 and the second connecting portion 71 can be fixed to the machine platform by a plurality of screws.

[0029] To illustrate the specific application mode of the embodiment of the present invention, please refer to Figure 6 shown, a control module 80 and a vacuum generator 90 are further provided. The control module 80 is connected to the connection terminal 42 of the detection module 40 and the vacuum generator 90. The vacuum generator 90 is connected to the vacuum pumping module 20. In this embodiment, the vacuum pumping module 20 is a gas valve. The vacuum generator 90 extracts the air in the semiconductor packaging product through the first channel C1, the internal space 11, and the gas valve. In this embodiment, the control module 80 includes a detector 81 and an electro-controlled proportional valve 82. The detector 81 is connected to the connection terminal 42 of the detection module 40 and the electro-controlled proportional valve 82. The electro-controlled proportional valve 82 is connected to the vacuum generator 90.

[0030] The detector 81 generates a detection signal according to the airflow in the semiconductor packaging product. And when the detector 81 determines that the detection signal exceeds a preset threshold, the detector 81 transmits a control signal to the electro-controlled proportional valve 82. The electro-controlled proportional valve 82 adjusts the vacuum generator 90 according to the control signal to achieve a pressure value in the optimal vacuum state. By means of the control module 80 and the vacuum generator 90, the pressure applicable to different semiconductor packaging products can be adapted, so as to greatly reduce the chance of the semiconductor packaging product being broken when using the present invention.

Claims

1. A vacuum negative pressure detection device for semiconductor packaging, characterized in that, it includes: a body having an internal space; a vacuum pumping module provided on the body; a pipe body having a first opening and a second opening on the same axis, the first opening is connected to the body, and there is a first channel and a second channel inside between the first opening and the second opening of the pipe body, the first channel is communicated with the internal space of the body, and the second channel penetrates the body; a detection module provided on the body and connected to the second channel of the pipe body.

2. The vacuum negative pressure detection device for semiconductor packaging according to claim 1, characterized in that, the body has a top side, a front side and a rear side, and the vacuum pumping module, the pipe body and the detection module are respectively arranged on the top side, the front side and the rear side of the body.

3. The vacuum negative pressure detection device for semiconductor packaging according to claim 1, characterized in that, the pipe body includes an outer pipe and an inner pipe, and the inner pipe is arranged inside the outer pipe.

4. The vacuum negative pressure detection device for semiconductor packaging according to claim 3, characterized in that, the outer pipe and the inner pipe of the pipe body are integrally injection molded or injection molded from a metal.

5. The vacuum negative pressure detection device for semiconductor packaging according to claim 3 or 4, characterized in that, the front end of the inner pipe is flush with the front end of the outer pipe.

6. The vacuum negative pressure detection device for semiconductor packaging according to claim 5, characterized in that, furthermore, the front end of the inner pipe protrudes and is exposed outside the outer pipe.

7. The vacuum negative pressure detection device for semiconductor packaging according to claim 6, characterized in that, the first channel is formed between the outer pipe and the inner pipe, and the second channel is formed by the inside of the inner pipe.

8. The vacuum negative pressure detection device for semiconductor packaging according to claim 1, characterized in that, further provided is a regulation module and a vacuum generator, the regulation module is connected to the detection module and the vacuum generator, and the vacuum generator is connected to the vacuum pumping module.

9. The vacuum negative pressure detection device for semiconductor packaging according to claim 8, characterized in that, the regulation module includes a detector and an electro-control proportional valve, the detector is connected to the detection module and the electro-control proportional valve, and the electro-control proportional valve is connected to the vacuum generator.

10. The vacuum negative pressure detection device for semiconductor packaging according to claim 3, characterized in that, the outer pipe has a first section and a second section, the first section and the second section respectively have a front end and a rear end opposite to each other, the front end of the first section is connected to the rear end of the second section, and the rear end of the first section is sleeved with the body; wherein, the second section of the outer pipe is in a duckbill shape.

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