Gelatin polymer molecular brush, surface treatment liquid and application thereof

Abstract

The invention relates to a gelatin polymer molecular brush, a surface treatment liquid and an application of the surface treatment liquid in a semiconductor device. The gelatin polymer molecular brush has a structure as shown in a structural formula (I) or (II) or a product obtained after oxidation, coordination and crosslinking of a catechol group of the gelatin polymer molecular brush. The method for processing the surface treatment liquid in the semiconductor device comprises the following specific steps: contacting the surface treatment liquid with the surface of a first material to form a thin film, and bonding the thin film with a second material; wherein the contact method is spraying or dipping, and the first material and the second material are respectively selected from an inorganic material and / or a resin material. The gelatin polymer molecular brush provided by the invention can be used as a main component of a surface treatment liquid for bonding materials, so that the peeling strength between the materials can be ensured and the bonding force and the heat resistance can be improved under the condition of not carrying out browning treatment on the materials, and the gelatin polymer molecular brush can be applied to manufacturing of semiconductor devices, especially multilayer PCBs (Printed Circuit Boards).

Description

Technical Field

[0001] The present invention relates to the technical field of surface treatment, and particularly to a gelatin-based polymer molecular brush, a surface treatment solution, and their applications in semiconductor device processing. Background Art

[0002] With the development of technology, the requirements for high-speed / high-frequency signal transmission performance of multi-layer PCBs (printed circuit boards) are continuously increasing. HVLP copper foil, with its extremely low surface roughness and profile structure, can effectively reduce losses and attenuation in high-speed signal transmission and has excellent circuit etching properties. Therefore, it is widely used in the field of high-frequency and high-speed copper clad laminates.

[0003] However, the smooth surface of HVLP copper foil results in insufficient bonding strength between layers, and usually a browning process is required to increase the contact area. However, the browning solution used in the browning process will cause environmental pollution and ecological damage. With the enhancement of environmental awareness, developing green and environmentally friendly adhesives or surface treatment solutions has become an important topic, which can not only replace mechanical interlocking through chemical action, but also meet environmental requirements and reduce the cost of waste liquid treatment.

[0004] Gelatin, as a natural polymer material derived from collagen, has various functional groups such as amino, hydroxyl, amide, and carboxyl groups. Its molecular weight distribution is broad, it is soluble in hot water, has rich sources, low price, non-toxic and is easy to process, and has great potential in the field of adhesives. In the field of polymers, advanced chemical synthesis methods can form polymer molecular brushes at the molecular scale, that is, grafting polymer chains onto the polymer main chain to form a polymer system with a special structure. This technology provides a new idea for improving gelatin materials.

[0005] Gelatin is widely used in fields such as food, medicine, cosmetics, and biological materials, especially in the biomedical field because of its biocompatibility and biodegradability. However, traditional gelatin materials have limitations in mechanical properties and functionalization, and it is difficult to meet the requirements of some applications. Therefore, combining the application requirements of HVLP copper foil or ordinary copper foil and the characteristics of gelatin, developing a green and environmentally friendly adhesive or surface treatment solution based on gelatin not only has important economic significance, but also can provide a new solution for solving environmental problems in PCB manufacturing. Summary of the Invention

[0006] In the prior art, traditional gelatin materials have certain limitations in mechanical properties and functionalization, and it is difficult to meet some application requirements. Therefore, the present invention provides a gelatin-based polymer molecular brush, a surface treatment solution, and a semiconductor device to solve the above problems.

[0007] To achieve the above object, in a first aspect, the present invention provides a gelatin-based polymer molecular brush having a structure shown in Structural Formula (I) or (II): Formula (I) or Formula (II); wherein, n represents the number of methylene groups and is an integer taken from 0 to 12.

[0008] In one implementation, the gelatin-based polymer molecular brush is a product obtained by oxidizing, coordinating, and crosslinking the structure shown in Structural Formula (I) or (II) and its catechol groups.

[0009] In one implementation, the preparation method of the gelatin-based polymer molecular brush includes the following steps: In a solvent, Compound A having Structural Formula (III) and Compound B having General Formula (IV) or Compound C having General Formula (V) are polymerized by heating reaction, Formula (III) Formula (IV) or Formula (V); wherein, n represents the number of methylene groups and is an integer taken from 0 to 12.

[0010] In one implementation, the solvent does not react with Compound A, Compound B, and Compound C, and the solvent includes any one of hydrocarbon solvents, alcohol solvents, amide solvents, ketone solvents, ether solvents, ester solvents, acetonitrile, and dimethyl sulfoxide.

[0011] In one implementation, Compound B includes any one of 3,4-dihydroxybenzaldehyde, 3,4-dihydroxyphenylacetaldehyde, and 3-(3,4-dihydroxyphenyl)propanal.

[0012] In one implementation, Compound C includes any one of 3,4-dihydroxybenzoic acid, 3,4-dihydroxyphenylacetic acid, 3,4-dihydroxyphenylpropionic acid, 4-(3,4-dihydroxyphenyl)butyric acid, and 5-(3,4-dihydroxyphenyl)valeric acid.

[0013] In a second aspect, the present invention further provides a surface treatment liquid, which includes an organic solvent and / or water, and the above-mentioned gelatin-based polymer molecular brush.

[0014] In one implementation, the organic solvent includes any one of methanol, ethanol, 1-propanol, isopropanol, n-butanol, tert-butanol, ethylene glycol, diethylene glycol, glycerol, diethyl ether, tetrahydrofuran, 1,4-dioxane, ethylene glycol methyl ether, ethylene glycol monobutyl ether, N-methylpyrrolidone, dimethyl sulfoxide, benzene, toluene, xylene, n-hexane, cyclohexane, dichloromethane, chloroform, dichlorobenzene, acetone, and methyl ethyl ketone.

[0015] In a third aspect, the present invention also provides an application of the surface treatment liquid in semiconductor device processing.

[0016] In one implementation, the processing of the surface treatment liquid in a semiconductor device includes the following specific steps: contacting the surface treatment liquid with the surface of a first material, forming a thin film and then bonding it to a second material; wherein, the contacting method is spraying or dipping, and the first material and the second material are respectively selected from inorganic materials and / or resin materials.

[0017] Beneficial effects: The gelatin-based polymer molecular brush provided by the present invention improves the mechanical strength of the gelatin-based material by introducing a specific chemical structure, making it more suitable for application scenarios that require high-strength materials; the gelatin-based polymer molecular brush can be used as the main component of the surface treatment liquid for bonding materials, so that the peel strength between materials can be ensured without the need for material browning treatment, the bonding force is improved, and it has good heat resistance, can be used in the processing of semiconductor devices, especially in the manufacturing of multi-layer PCBs, can provide semiconductor devices with better performance, and can be applied to electronic components for high-frequency communication. Description of the Drawings

[0018] Figure 1 is the synthesis route diagram of the gelatin-based polymer molecular brush PB1 in Example 1; Figure 2 is the synthesis route diagram of the gelatin-based polymer molecular brush PB2 in Example 2; Figure 3 is the synthesis route diagram of the gelatin-based polymer molecular brush PB3 in Example 3; Figure 4 is the pressing schematic diagram of the peel strength test board; Figure 5 is the pressing schematic diagram of the reflow soldering test board.

[0019] The realization, functional characteristics, and advantages of the object of the present invention will be further described in conjunction with the embodiments and with reference to the drawings. Detailed Embodiments

[0020] In order to make the objectives, technical solutions and advantages of the present invention more clear and understandable, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention. In addition, the descriptions of the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. below mean that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic descriptions of the above terms are not necessarily directed to the same embodiment or example. Moreover, the technical features involved in various embodiments of the present invention can be combined with each other as long as they do not conflict with each other.

[0021] The present invention provides a gelatin-based polymer molecular brush, which has a structure shown in Structural Formula (I) or (II): Formula (I) or Formula (II); wherein, n represents the number of methylene groups, and is taken as an integer from 0 to 12. Preferably, the n is taken as an integer from 1 to 5.

[0022] Furthermore, the gelatin-based polymer molecular brush is a product after oxidation, coordination and crosslinking of the structure shown in Structural Formula (I) or (II) and its catechol groups.

[0023] The preparation method of the gelatin-based polymer molecular brush includes the following steps: in a solvent, Compound A having Structural Formula (III) and Compound B having General Formula (IV) or Compound C having General Formula (V) are polymerized by heating reaction, Formula (III) Formula (IV) or Formula (V); wherein, n represents the number of methylene groups, and is taken as an integer from 0 to 12.

[0024] Specifically, the solvent does not react with Compound A, Compound B and Compound C, and the solvent includes any one of hydrocarbon solvents, alcohol solvents, amide solvents, ketone solvents, ether solvents, ester solvents, acetonitrile and dimethyl sulfoxide. Among them, the hydrocarbon solvent includes any one of toluene, xylene and n-hexane; the alcohol solvent includes any one of methanol and ethanol; the amide solvent includes any one of N,N-dimethylformamide, N,N-dimethylacetamide and N-methylpyrrolidone; the ketone solvent includes any one of acetone and cyclohexanone; the ether solvent includes any one of diethyl ether, tetrahydrofuran and 1,4-dioxane; the ester solvent includes any one of ethyl acetate and butyl acetate.

[0025] Preferably, in the preparation process of the heating depolymerization reaction, the mass ratio of the substance represented by the structural formula (I) to the compound represented by the general formula (IV) or (V) is 1:(5-20). Further, the mass ratio of the substance represented by the structural formula (I) to the compound represented by the general formula (IV) or (V) is 1:(5-15). Preferably, the temperature of the heating reaction is 30-120 °C. More preferably, the temperature of the heating reaction is 60-120 °C. The time of the heating reaction is 3-24 hours. More preferably, the time of the heating reaction is 6-12 hours.

[0026] Specifically, the compound B includes any one of 3,4-dihydroxybenzaldehyde, 3,4-dihydroxyphenylacetaldehyde, and 3-(3,4-dihydroxyphenyl)propanal. The compound C includes any one of 3,4-dihydroxybenzoic acid, 3,4-dihydroxyphenylacetic acid, 3,4-dihydroxyphenylpropionic acid, 4-(3,4-dihydroxyphenyl)butyric acid, and 5-(3,4-dihydroxyphenyl)valeric acid.

[0027] The gelatin-based polymer molecular brush having the structures shown in the general formulas (I) and (II) can exhibit various adhesion effects, as shown in the following route: From the above route, it can be seen that the gelatin-based polymer molecular brush provided in the present application having the structures shown in the general formulas (I) and (II) has the following effects: it can adhere to adjacent dopamine molecules through intermolecular hydrogen bonds; it can adhere through coordination with metal cations; it can adhere through π-π interactions between dopamine molecules; it can adhere through thiol reduction; it can aggregate through cation-π interactions; the hydroxyl groups can be oxidized and then intermolecularly aggregated.

[0028] The present invention also provides a surface treatment liquid, which includes an organic solvent and / or water, and the above-mentioned gelatin-based polymer molecular brush. The organic solvent includes any one of methanol, ethanol, 1-propanol, isopropanol, n-butanol, tert-butanol, ethylene glycol, diethylene glycol, glycerol, diethyl ether, tetrahydrofuran, 1,4-dioxane, ethylene glycol methyl ether, ethylene glycol monobutyl ether, N-methylpyrrolidone, dimethyl sulfoxide, benzene, toluene, xylene, n-hexane, cyclohexane, dichloromethane, chloroform, dichlorobenzene, acetone, and butanone. In the preparation process of the surface treatment liquid, the gelatin-based polymer molecular brush can be dissolved in the organic solvent and / or water to obtain the surface treatment liquid required by the present invention.

[0029] The surface treatment liquid provided by the present invention can be used to treat the surface of materials, and can form an organic film on the material surface to improve the adhesion with other materials. The contact time between the surface treatment liquid and the material is aimed at enabling the surface treatment liquid to act on the material surface, preferably 10 seconds to 1 hour, and more preferably 30 seconds to 30 minutes. The temperature of the surface treatment liquid when contacting the material is preferably 20°C to 50°C, and more preferably 25°C to 35°C. After the surface treatment liquid contacts the material, it can be left standing at room temperature, or directly dried with cold air or hot air, or dried at 70°C to 150°C.

[0030] Specifically, the material can be selected from inorganic materials and / or resin materials, and the shape is not limited. The inorganic material is selected from any one of metals, metal oxides, silicon-containing materials, ceramics, and magnetic materials. The resin material is selected from any one of acrylic resin, epoxy resin, modified epoxy resin, polyimide resin, modified polyimide resin, liquid crystal polymer, polyphenylene ether resin, polyphenylene sulfide resin, hydrocarbon resin, and polytetrafluoroethylene resin. The metal is selected from any one of copper, aluminum, titanium, nickel, tin, iron, silver, gold, and their alloys. The metal oxide is selected from any one of copper oxide, cuprous oxide, iron oxide, calcium oxide, sodium oxide, magnesium oxide, barium oxide, aluminum oxide, zinc oxide, manganese heptoxide, manganese zinc ferrite, and nickel zinc ferrite. The silicon-containing material is selected from any one of silicon, glass, silicon carbide, silicon dioxide, glass, and diatomaceous earth. The ceramic contains any one of boron nitride, boron titanium, boron zirconium, magnesium titanate, calcium titanate, barium titanate, aluminum nitride, and silicon nitride.

[0031] The present invention also provides an application of the surface treatment liquid in the processing of semiconductor devices. The processing of the surface treatment liquid in semiconductor devices includes the following specific steps: contacting the surface treatment liquid with the surface of the first material, and bonding with the second material after forming a thin film; wherein, the contact method is spraying or dipping, and the first material and the second material are respectively selected from inorganic materials and / or resin materials.

[0032] The gelatin-based polymer molecular brush provided by the present invention can be used as the main component of the surface treatment liquid for bonding materials, so that the peel strength between materials can be ensured, the bonding force can be improved without performing the browning treatment on the material surface, and it has good heat resistance. It can be applied to the manufacture of PCBs, such as the manufacture of multi-layer laminates, and can also be used for the preparation of semiconductor components, and can also be used for electronic components for high-frequency communication, such as the bonding or metallization of dielectric ceramics.

[0033] Example 1 1.2 g of type A gelatin (purchased from Sigma-Aldrich) was dissolved in 12 mL of N,N-dimethylformamide at 80 °C to form a 10% w / v homogeneous solution. Then, 12 g of 3,4-dihydroxybenzaldehyde was added, and the mixture was stirred until it was completely dissolved and then reacted for 24 hours. Then, the reaction solution was cooled to room temperature, transferred into an 8-14 kDa cut-off dialysis bag, and dialyzed with deionized water at 50 °C for 3 days, changing the deionized water every 6 hours to remove unreacted raw materials and by-products. Then, the gelatin-based polymer brush PB1 was frozen at -80 °C and stored at room temperature to obtain a pale yellow oily substance (3.8 g).

[0034] The molecular weights of gelatin and the polymer brush PB1 after the reaction were measured respectively. The average molecular weight of type A gelatin was 41,200, and the average molecular weight of the polymer brush was 42,100. According to the results of gel permeation chromatography analysis, the oily substance obtained in this example was the gelatin-based polymer brush PB1 shown in the reaction formula.

[0035] Among them, the synthesis route of PB1 is as Figure 1 .

[0036] Example 2 0.8 g of type A gelatin (purchased from Sigma-Aldrich) was dissolved in 8 mL of N,N-dimethylformamide at 80 °C to form a 10% w / v homogeneous solution. Then, 8 g of 3,4-dihydroxybenzoic acid was added, and the mixture was stirred until it was completely dissolved and then reacted for 24 hours. Then, the reaction solution was cooled to room temperature, transferred into an 8-14 kDa cut-off dialysis bag, and dialyzed with deionized water at 50 °C for 4 days, changing the deionized water every 6 hours to remove unreacted raw materials and by-products. Then, the gelatin-based polymer brush PB3 was frozen at -80 °C and stored at room temperature to obtain a white oily substance (4.2 g).

[0037] The molecular weights of gelatin and the polymer brush PB2 after the reaction were measured respectively. The average molecular weight of type A gelatin was 41,200, and the average molecular weight of the polymer brush was 42,900. According to the results of gel permeation chromatography analysis, the oily substance obtained in this example was the gelatin-based polymer brush PB2 shown in the reaction formula.

[0038] Among them, the synthesis route of PB2 is as Figure 2 .

[0039] Example 3 0.8 g of type A gelatin (purchased from Sigma-Aldrich) was dissolved in 8 mL of N,N-dimethylformamide at 80 °C to form a 10% w / v homogeneous solution. Then, 8 g of 3,4-dihydroxybenzoic acid was added, and the mixture was stirred until it was completely dissolved and reacted for 24 hours. Then, the reaction solution was cooled to room temperature, transferred into an 8-14 kDa cut-off dialysis bag, and dialyzed against deionized water at 50 °C for 4 days, with the deionized water being changed every 6 hours to remove unreacted raw materials and by-products. Then, the gelatin-based polymer molecular brush PB3 was frozen at -80 °C and stored at room temperature to obtain a white oily substance (4.2 g).

[0040] The molecular weights of gelatin and the polymer molecular brush PB3 after the reaction were measured respectively. The average molecular weight of type A gelatin was 41,200, and the average molecular weight of the polymer molecular brush was 43,300. According to the results of gel permeation chromatography analysis, the oily substance obtained in this example was the gelatin-based polymer molecular brush PB3 shown in the reaction formula.

[0041] Among them, the synthetic route of PB3 is as Figure 3 .

[0042] Effect test experiment: (1) Preparation of surface treatment solution The gelatin-based polymer molecular brushes prepared in Examples 1 to 3 and 4-(aminomethyl)benzene-1,2-diol (without nitrogen heterocyclic structure) were provided. 5 g of each of the four groups of raw materials was dissolved in 250 g of ethylene glycol monobutyl ether, and then 250 g of deionized water was added respectively. The mixture was stirred at room temperature for 24 hours to prepare surface treatment solutions A, B, C, and D respectively. Then, a blank surface treatment solution E containing no dopa (3,4-dihydroxy-L-phenylalanine) compound, only 250 g of ethylene glycol monobutyl ether and 250 g of deionized water, was prepared. The above surface treatment solutions were all reserved. Among them, 4-(aminomethyl)benzene-1,2-diol is an organic compound with a benzene ring, with an aminomethyl (-CH 2 NH 2 ) and two adjacent hydroxyl groups (-OH) attached to the benzene ring, which helps to form hydrogen bonds or electrostatic interactions and can be used to enhance the adhesion between the polymer and the material surface, and has wide applications in surface modification and adhesion layer formation. 4-(aminomethyl)benzene-1,2-diol was introduced in the comparative experiment to evaluate its effect on enhancing the adhesion force and compare it with the gelatin-based polymer molecular brush provided by the present invention.

[0043] (2) Treatment process Pickling (60 seconds at room temperature) - water washing - alkali washing (30 °C, 60 seconds) - water washing - surface treatment solution (30 °C, 60 seconds) - water washing - drying (100 °C, 10 minutes).

[0044] (3) Fabrication of test plates 1. For the peel strength test, M6 resin (polyphenylene ether resin) is placed on a common copper clad laminate, and then the smooth surface of the common copper foil treated with the surface treatment liquid is placed facing the resin, and the lamination structure is as Figure 4 shown. Finally, lamination is carried out according to the lamination conditions of M6 resin.

[0045] 2. For the heat resistance (lead-free reflow soldering) test, M6 resin (polyphenylene ether resin) is placed on a common copper clad laminate treated with the surface treatment liquid, and then the rough surface of the common copper foil is placed facing the resin, and the lamination structure is as Figure 5 shown. Finally, lamination is carried out according to the lamination conditions of M6 resin.

[0046] (4) Adhesion evaluation test Test according to the standard "IPC-TM-650 No.2.4.8", and use a 7 cm x 8 cm common electrolytic copper foil (1 ounce) to determine the peel strength.

[0047] (5) Heat resistance evaluation test Test according to the standard "IPC-TM-650 No.2.6.8", and use a 7 cm x 8 cm common electrolytic copper foil (1 ounce) to determine the heat resistance (lead-free reflow soldering).

[0048] The test results are shown in Table 1: Table 1. Test data results table of polymer molecular brush The above results show that: the bonding force between the adhesive materials treated with the nitrogen-containing heterocyclic dopamine compound of the present invention is greater than 3.0 Ib / in, and the number of times of resistance to reflow soldering (thermal shock) is more than 10 times, indicating that the mechanical properties and thermal stability of the bonding material obtained by treating with the surface treatment liquid provided by the present invention are better, so that. Among them, for the bonding material treated with 4-(aminomethyl)benzene-1,2-diol (without nitrogen-containing heterocycle), although it can play a certain bonding role, the effect is far less than that of the gelatin-based polymer molecular brush provided by the present invention, and the mechanical properties and thermal stability of the bonding material treated by it do not meet the requirements. Treating the material with a blank treatment liquid without any polymer molecular brush will not endow the bonding material with any bonding ability and thermal stability. The bonding material obtained by treating with the gelatin-based polymer molecular brush provided in this application can still obtain good mechanical properties and thermal stability without the need to brown the pcb substrate by dipping it in a browning solution.

[0049] In summary, the gelatin-based polymer molecular brush provided by the present invention improves the mechanical strength of gelatin-based materials by introducing specific chemical structures, making it more suitable for application scenarios that require high-strength materials; the gelatin-based polymer molecular brush can be used as the main component of a surface treatment solution for bonding materials, ensuring the peel strength between materials and improving the bonding force without the need for browning treatment of the material surface, and having good heat resistance, capable of being used in the processing of semiconductor devices, especially in the manufacture of multilayer PCBs, to provide semiconductor devices with better performance, and can be applied to electronic components for high-frequency communication.

[0050] The above are only the preferred embodiments of the present invention, and do not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, shall be equally included in the patent protection scope of the present invention.

Claims

1. A gelatin polymer molecular brush, characterized in that: Having a structure as shown in structural formula (I) or (II): Formula (I) or Formula (II); Wherein, n represents the number of methylene groups, which is an integer from 0 to 12.

2. The gelatin-based polymer molecular brush according to claim 1, characterized in that: The gelatin-based polymer molecular brush has a structure as shown in structural formula (I) or (II) and is a product of oxidation, coordination and cross-linking of its catechol groups.

3. The gelatin-based polymer molecular brush according to claim 1 or 2, characterized in that: The preparation method of the gelatin polymer molecular brush comprises the following steps: in a solvent, a compound A having a structural formula (III) and a compound B having a general formula (IV) or a compound C having a general formula (V) are polymerized by heating reaction; Formula (III) Formula (IV) or Formula (V); Wherein, n represents the number of methylene groups, which is an integer from 0 to 12.

4. The gelatin-based polymer molecular brush according to claim 3, characterized in that: The solvent does not react with compound A, compound B and compound C, and the solvent includes any one of hydrocarbon solvents, alcohol solvents, amide solvents, ketone solvents, ether solvents, ester solvents, acetonitrile and dimethyl sulfoxide.

5. The gelatin-based polymer molecular brush according to claim 3, characterized in that: The compound B includes any one of 3,4-dihydroxybenzaldehyde, 3,4-dihydroxyphenylacetaldehyde and 3-(3,4-dihydroxyphenyl)propanal.

6. The gelatin-based polymer molecular brush according to claim 3, characterized in that: The compound C includes any one of 3,4-dihydroxybenzoic acid, 3,4-dihydroxyphenylacetic acid, 3,4-dihydroxyphenylpropionic acid, 4-(3,4-dihydroxyphenyl)butyric acid and 5-(3,4-dihydroxyphenyl)pentanoic acid.

7. A surface treatment liquid, characterized in that: The invention comprises an organic solvent and / or water, and the gelatin polymer molecular brush according to any one of claims 1 to 6.

8. The surface treatment liquid according to claim 7, characterized in that: The organic solvent includes any one of methanol, ethanol, 1-propanol, isopropanol, n-butanol, tert-butanol, ethylene glycol, diethylene glycol, glycerol, ether, tetrahydrofuran, 1,4-dioxane, ethylene glycol methyl ether, ethylene glycol monobutyl ether, N-methylpyrrolidone, dimethyl sulfoxide, benzene, toluene, xylene, n-hexane, cyclohexane, dichloromethane, chloroform, dichlorobenzene, acetone and butanone.

9. Use of the surface treatment liquid according to claim 7 or 8 in semiconductor device processing.

10. The use of the surface treatment liquid according to claim 9 in semiconductor device processing, characterized in that: The processing of the surface treatment liquid in a semiconductor device includes the following specific steps: contacting the surface treatment liquid with the surface of a first material, forming a thin film and then bonding it with a second material; wherein the contact method is spraying or dipping, and the first material and the second material are respectively selected from inorganic materials and / or resin materials.

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