Chip implantation composite paper and preparation process thereof

Abstract

The invention discloses chip implantation composite paper and a preparation process thereof, and relates to the field of chip implantation composite paper, the chip implantation composite paper comprises a first layer of fiber paper, a chip and a second layer of fiber paper; embedding grooves are formed in the surfaces, close to each other, of the first-layer fiber paper and the second-layer fiber paper; the depth of the embedded groove is half of the thickness of the chip, and the chip is installed in the embedded groove in an embedded mode. According to the invention, the chip composite paper can absorb mechanical stress and improve the impact resistance; the chip composite paper can solve the problem of heat dissipation when a chip works through the graphene filler embedded in the chip composite paper; and the chip is fixed by utilizing the pore structure on the chip composite paper, the traditional adhesive is not needed, and the flexibility can be kept, so that the chip composite paper is not easy to break.

Description

Technical Field

[0001] The present invention relates to the field of chip-implanted composite paper, and particularly to a chip-implanted composite paper and its preparation process. Background Art

[0002] Chip-implanted composite paper is a cutting-edge application that combines electronic technology and new materials. Its typical structure consists of a superposition of a diversion layer, a chip layer, and a functional material layer (such as absorbent paper, dust-free paper, etc.). For example, in sanitary products, a hierarchical design of "diversion layer + chip + composite core" is adopted to achieve functional zoning and signal conduction.

[0003] Chip-implanted composite paper is generally applied in the following fields: 1. Information security and anti-counterfeiting: In the field of classified documents, the composite paper with an implanted chip can detect illegal carrying behavior in real time. Even if the paper is torn into pieces larger than 2 mm, it can still be tracked and located through low-frequency signals, effectively preventing the leakage of sensitive information.

[0004] 2. Rapid detection carrier: The composite paper enhanced with nano-chitin is used as the substrate of a microfluidic chip. Utilizing its biocompatibility and biodegradable characteristics, it enables rapid detection in fields such as medical diagnosis and environmental monitoring. By optimizing the fiber arrangement and pore structure, the detection sensitivity and stability are improved.

[0005] 3. High-end packaging material: The moisture-proof paper composed of DuPont paper and silica gel is used for the packaging of chip semiconductors. Through multi-layer composite materials, moisture is blocked to protect precision electronic components. Such materials have both flexibility and high strength, meeting the industrial-level sealing requirements.

[0006] However, chip composite paper generally has the following defects during use: First: Structural defects and manufacturing process problems. Bubbles are easily generated during the manufacturing process, resulting in a decline in mechanical properties; poor adhesion at the multi-layer composite interface may cause delamination between layers; Second: The surface of the material is easily worn, and it is prone to breakage under external force impact, reducing the service life; deformation or decomposition may occur under high temperature and high pressure environments; Third: Using traditional adhesives to bond the chip to the surface of the composite paper, the overall flexibility becomes poor after the adhesive cures, resulting in the chip composite paper being prone to brittle fracture.

[0007] Therefore, it is necessary to propose a chip-implanted composite paper and its preparation process to solve the above problems. Summary of the Invention

[0008] The purpose of the present invention is to provide a chip-implanted composite paper and its preparation process to solve the problems raised in the above background art.

[0009] To achieve the above object, the present invention provides the following technical solution: a chip-embedded composite paper, comprising a first layer of fiber paper, a chip and a second layer of fiber paper; The first layer of fiber paper and the second layer of fiber paper are both provided with inner grooves on their adjacent sides; The depth of the embedded groove is half the thickness of the chip, and the chip is embedded in the embedded groove; The chip is externally fixed by pressing a first layer of fiber paper and a second layer of fiber paper.

[0010] The bottom surface of the embedded groove is provided with a plurality of protrusions; The surface of the chip has protrusions; The corresponding protrusions and protrusions are in contact with each other and clamped to achieve the positioning of the chip.

[0011] The surface of the second layer of fiber paper is also provided with a reserved groove; The reserved groove is filled with graphene filler; The reserved slots are provided in plurality, and the plurality of reserved slots are distributed at equal distances.

[0012] The first layer of fiber paper and the second layer of fiber paper are both soaked with wax oil.

[0013] The present invention also discloses a preparation process of chip-embedded composite paper, comprising the following steps: S1: preparing a first layer of fiber paper and a second layer of fiber paper, preparing a plurality of fiber composite papers of the same thickness and length and width, the fiber composite papers need to be soaked with wax oil in advance, and embedded grooves are processed on the surface of the fiber composite papers by using special equipment, and a part of the fiber composite papers are provided with reserved grooves; S2: preparing a connection circuit, and filling the reserved groove with a graphene filler; S3: implanting the chip, placing the chip in the corresponding embedded groove, then overlapping the first layer of fiber paper and the second layer of fiber paper, fixing the first layer of fiber paper and the second layer of fiber paper by low-temperature hot pressing, ensuring that excess air between the first layer of fiber paper and the second layer of fiber paper is discharged during hot pressing, and the protrusions on the chip and the corresponding protrusions are squeezed and fixed to each other, completing the preparation of the chip composite paper.

[0014] Preferably, the dedicated equipment includes an upper substrate and a lower substrate; A rotating shaft is arranged between the upper base plate and the lower base plate, a connecting cylinder is fixedly arranged on the rotating shaft, and pressing plates are arranged on both the upper and lower sides of the connecting cylinder; Templates are fixedly arranged on the mutually adjacent sides of the upper base plate and the lower base plate, and the upper and lower pressing plates correspond to the two templates one by one.

[0015] Preferably, triangular support frames are provided at both ends of the rotating shaft, and the triangular support frames are rotatably connected to the rotating shaft.

[0016] Preferably, an electric push rod is provided between the connecting cylinder and the pressing plate.

[0017] Preferably, capillary pores are provided on the template; Wherein, air cavities are provided inside both the upper substrate and the lower substrate, a suction pump is connected to the air cavity, and the air cavity is communicated with the capillary pores.

[0018] Preferably, ribs for forming reserved grooves on the surface of the second-layer fiber paper are provided on the upper template.

[0019] The technical effects and advantages of the present invention: 1. The chip composite paper can absorb mechanical stress and improve the impact resistance; 2. The chip composite paper can solve the heat dissipation problem during chip operation through the graphene filler embedded in itself; 3. The chip is fixed by using the pore structure on the chip composite paper itself, without the need for traditional adhesives, and can maintain flexibility, making the chip composite paper not easily brittle; 4. The preparation process of the chip composite paper sets a dedicated preparation process flow and dedicated equipment for the chip composite paper, enabling the chip composite paper to be mass-produced; 5. The overall thickness of the first-layer fiber paper and the second-layer fiber paper is the same after combination, and there will be no convex problem. Therefore, the problem of interlayer peeling between the chip and the first-layer fiber paper and the second-layer fiber paper caused by abrasion and external force impact can be reduced; it replaces the existing method of directly pressing two first-layer fiber papers with the same thickness on both sides of the chip, which is prone to convexity; 6. Due to the electrical conductivity and thermal conductivity of the graphene filler, the graphene filler can both connect the chip to the external circuit and dissipate heat from the chip, solving the problem of insufficient heat dissipation capacity of the packaged chip; 7. The first-layer fiber paper and the second-layer fiber paper are infiltrated with wax oil. The setting of the wax oil, on the one hand, increases the firmness during low-temperature hot pressing and fixing of the first-layer fiber paper, the chip, and the second-layer fiber paper, and also increases the hydrophobicity and insulation of the chip composite paper, improving the waterproof ability of the chip composite paper, preventing leakage, having a smooth surface, and not easily showing problems such as abrasion. Due to the hydrophobicity of the wax oil, the phenomenon of air entering and leaving the inside of the chip composite paper in the later stage is also avoided, improving the service life of the chip composite paper; 8. Since the wax oil fully soaks the first layer of fiber paper and the second layer of fiber paper, when the first layer of fiber paper and the second layer of fiber paper are fixed by low-temperature hot pressing, the first layer of fiber paper and the second layer of fiber paper can be completely bonded and fixed, it is not easy to generate air bubbles, and it is even less likely to occur the phenomenon of interlayer peeling; and even if the phenomenon of interlayer peeling occurs, due to the adhesiveness of the wax oil, the first layer of fiber paper or the second layer of fiber paper can be bonded and fixed again in the later stage, making the interlayer peeling phenomenon on the chip composite paper repairable; 9. Since the first layer of fiber paper and the second layer of fiber paper have a certain shaping effect after being soaked by the wax oil, it also enables the first layer of fiber paper and the second layer of fiber paper to be shaped when being fixed by low-temperature hot pressing, and it is not easy to reset again due to the curving effect of the first layer of fiber paper and the second layer of fiber paper themselves. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic structural diagram of the chip-implanted composite paper of the present invention.

[0021] Figure 2 It is a cross-sectional view of the chip-implanted composite paper of the present invention.

[0022] Figure 3 For the present invention Figure 2 The enlarged schematic diagram of the structure at A in

[0023] Figure 4 It is a schematic structural diagram of a perspective view of the special equipment for preparing the chip-implanted composite paper of the present invention.

[0024] Figure 5 It is a schematic structural diagram of another perspective view of the special equipment for preparing the chip-implanted composite paper of the present invention.

[0025] Figure 6 For the present invention Figure 5 The enlarged schematic diagram of the structure at B in

[0026] Figure 7 It is a front view of the special equipment for preparing the chip-implanted composite paper of the present invention.

[0027] Figure 8 It is a three-dimensional cross-sectional view of the special equipment for preparing the chip-implanted composite paper of the present invention.

[0028] Figure 9 It is a schematic structural diagram of the state of the first layer of fiber paper and the second layer of fiber paper before being pressed together of the present invention.

[0029] Figure 10 It is a schematic structural diagram of the state of the first layer of fiber paper and the second layer of fiber paper after being pressed together of the present invention.

[0030] Figure 11 For the present invention Figure 10Schematic enlarged view of the structure at position C in the [Chinese context].

[0031] In the figure: 1. First layer of fiber paper; 2. Chip; 3. Second layer of fiber paper; 4. Protrusion; 5. Embedded groove; 6. Protruding object; 7. Reserved groove; 8. Graphene filler; 9. Upper substrate; 10. Pressing plate; 11. Electric push rod; 12. Connecting cylinder; 13. Rotating shaft; 14. Template; 15. Lower substrate; 16. Capillary pores; 17. Triangular support frame; 18. Suction pump; 19. Connecting frame between upper and lower substrates; 20. Hose; 21. Rib; 22. Air cavity. Specific implementation method

[0032] The present invention provides a chip-implanted composite paper as shown in Figures 1-11 and its preparation process, specifically discloses a chip composite paper that can absorb mechanical stress and improve impact resistance, and the chip composite paper can solve the heat dissipation problem during the operation of the chip 2 through the embedded graphene filler 8 therein. The chip 2 is fixed by using the pore structure on the chip composite paper itself, without the need for traditional adhesives, and can maintain flexibility, making the chip composite paper not easily brittle; The preparation process of the chip composite paper sets a dedicated preparation process flow and dedicated equipment for the chip composite paper, enabling the mass production of the chip composite paper.

[0033] Referring to Figure 1 as shown in [the reference], the chip composite paper includes a first layer of fiber paper 1, a chip 2, and a second layer of fiber paper 3. Embedded grooves 5 are provided on the mutually adjacent surfaces of the first layer of fiber paper 1 and the second layer of fiber paper 3. The depth of the embedded groove 5 is half of the thickness of the chip 2. In this way, when the chip 2 is pressed into the embedded groove 5, the overall thickness of the combination of the first layer of fiber paper 1 and the second layer of fiber paper 3 is consistent after they are combined, and there will be no problem of protrusion. Therefore, it is possible to reduce the problem of interlayer delamination between the chip 2 and the first layer of fiber paper 1 and the second layer of fiber paper 3 caused by wear and external force impact; it replaces the existing method of directly pressing two first layers of fiber paper 1 with the same thickness on both sides of the chip 2, which is prone to protrusion.

[0034] In the present invention, the first layer of fiber paper 1, the second layer of fiber paper 3, and the chip 2 are all fixed by an embedding method without the use of adhesives. Multiple protruding objects 6 are provided on the bottom surface of the embedded groove 5, and the surface of the chip 2 usually has densely arranged protrusions 4. Therefore, when the chip 2 is embedded in the embedded groove 5, the corresponding protrusions 4 and the protruding objects 6 are in mutual contact and clamping, which can realize the positioning of the chip 2 and avoid the phenomenon of the chip 2 moving out of the embedded groove 5.

[0035] It should be noted that the protrusions 4 on the surface of the chip 2 are usually bumps for circuit connection or metal layers generated by electroplating, etc. In the present invention, the characteristics of the surface of the chip 2 are fully utilized to complete the encapsulation and fixation of the chip 2, which has strong practicability and does not cause damage to the first layer of fiber paper 1, the chip 2 and the second layer of fiber paper 3 due to high-temperature encapsulation.

[0036] Among them, a plurality of reserved grooves 7 are provided on the surface of the second layer of fiber paper 3. Both ends of the reserved grooves 7 penetrate through the inner embedded grooves 5 and the outer ring of the second layer of fiber paper 3 respectively. The reserved grooves 7 are used when the chip 2 is connected to an external circuit.

[0037] Reference Figure 2 and Figure 3 As shown in [references], when the first layer of fiber paper 1 and the second layer of fiber paper 3 are overlapped with each other, they are fixed by low-temperature hot pressing or other means. And a graphene filler 8 is filled in the reserved groove 7. One end of the graphene filler 8 is connected to the circuit on the chip 2, and the other end of the graphene filler 8 penetrates through the outer ring of the chip composite paper. Due to the electrical conductivity and thermal conductivity of the graphene filler 8, the graphene filler 8 can not only serve the purpose of connecting between the chip 2 and the external circuit, but also dissipate heat from the chip 2, solving the problem of insufficient heat dissipation capacity of the encapsulated chip 2.

[0038] It is worth mentioning that in the present invention, both the first layer of fiber paper 1 and the second layer of fiber paper 3 are soaked with wax oil, so that the first layer of fiber paper 1 and the second layer of fiber paper 3 are infiltrated with wax oil. The setting of the wax oil, on the one hand, increases the firmness of the first layer of fiber paper 1, the chip 2 and the second layer of fiber paper 3 during low-temperature hot pressing fixation, and also increases the hydrophobicity and insulation of the chip composite paper, improving the waterproof ability of the chip composite paper, preventing leakage of electricity, and having a smooth surface, not prone to problems such as wear. Due to the hydrophobicity of the wax oil, the phenomenon of air entering and leaving the inside of the chip composite paper in the later stage is also avoided, improving the service life of the chip composite paper. Since the wax oil fully soaks the first layer of fiber paper 1 and the second layer of fiber paper 3, when the first layer of fiber paper 1 and the second layer of fiber paper 3 are fixed by low-temperature hot pressing, the first layer of fiber paper 1 and the second layer of fiber paper 3 can be completely bonded and fixed, not easy to generate bubbles, and even less likely to occur interlayer peeling. And even if the interlayer peeling phenomenon occurs, due to the adhesiveness of the wax oil, the first layer of fiber paper 1 or the second layer of fiber paper 3 can be bonded and fixed again in the later stage, making the interlayer peeling phenomenon of the chip composite paper reparable.

[0039] The present invention also discloses a preparation process of a chip-implanted composite paper, which specifically includes the following steps: Step 1: Prepare the first layer of fiber paper 1 and the second layer of fiber paper 3. Prepare several sheets of composite paper with the same thickness, length, and width dimensions, such as fiber paper. The composite paper needs to be soaked with wax oil in advance. A dedicated device is used to process embedded grooves 5 on the surface of the composite paper. The bottom of the embedded groove 5 has protrusions 6. A reserved groove 7 is opened on a part of the composite paper to ensure that the maximum thickness of the composite paper with the embedded groove 5, protrusions 6, and reserved groove 7 is still the same as the thickness of the composite paper before processing. Step 2: Prepare the connection circuit. A graphene filler 8 is filled in the reserved groove 7. Step 3: Implant the chip 2. Place the chip 2 in the corresponding embedded groove 5, and then stack the first layer of fiber paper 1 and the second layer of fiber paper 3 on top of each other. The first layer of fiber paper 1 and the second layer of fiber paper 3 are fixed by low-temperature hot pressing at 40 to 60 degrees Celsius. When hot pressing and fixing, ensure that the excess air between the first layer of fiber paper 1 and the second layer of fiber paper 3 is exhausted. The protrusions 4 on the chip 2 can be squeezed and fitted with the corresponding protrusions 6 to complete the preparation of the chip composite paper.

[0040] In practice, the protrusions 6 can also be set in shapes such as strips and squares according to actual needs, which is convenient for arranging according to the structure of the actual surface of the chip 2 and can be adjusted by those skilled in the art, so no further elaboration is provided here.

[0041] Reference Figure 4 and Figure 5 shown respectively are the structural schematic diagrams of two perspectives of the dedicated device for preparing the chip composite paper.

[0042] In Figure 4 , Figure 5 and Figure 8The dedicated device shown in the figure includes an upper substrate 9, a pressing plate 10, an electric push rod 11, a connecting cylinder 12, a rotating shaft 13, a template 14, and a lower substrate 15. Among them, the upper substrate 9 and the lower substrate 15 are arranged vertically, and are connected by an upper and lower substrate connecting frame 19. The connecting cylinder 12 is arranged at the middle position between the upper substrate 9 and the lower substrate 15. The rotating shaft 13 is fixedly arranged on the connecting cylinder 12. Triangular support frames 17 are arranged at both ends of the rotating shaft 13. The triangular support frames 17 are rotatably connected to the rotating shaft 13. The electric push rod 11 is fixedly connected between the connecting cylinder 12 and the pressing plate 10. Templates 14 are fixedly arranged on the surfaces of the upper substrate 9 and the lower substrate 15 close to each other. A suction pump 18 is arranged on one side of the lower substrate 15. Air cavities 22 are arranged inside both the lower substrate 15 and the upper substrate 9. The suction pump 18 is communicated with the air cavity 22 through a hose 20. Multiple groups of capillary pores 16 are arranged on the surface of the template 14. The capillary pores 16 are communicated with the inside of the air cavity 22. When the suction pump 18 sucks air, a negative pressure adsorption effect is generated at the capillary pores 16, and the first layer of fiber paper 1 or the second layer of fiber paper 3 can be adsorbed and fixed on the template 14. Then, the electric push rod 11 is started to push the pressing plate 10 to move, and the pressing plate 10 thermally presses the first layer of fiber paper 1 or the second layer of fiber paper 3 at a low temperature on the corresponding template 14. Ribs 21 are arranged on the upper template 14, forming the first layer of fiber paper 1 with an embedded groove 5 and the second layer of fiber paper 3 with an embedded groove 5 and a reserved groove 7; the ribs 21 can be pressed on the second layer of fiber paper 3 to form a reserved groove 7.

[0043] It should be noted that the thickness of the template 14 is equal to the depth of the embedded groove 5, and the length and width dimensions of the pressing plate 10 are respectively larger than the length and width dimensions of the first layer of fiber paper 1 and the second layer of fiber paper 3. In this way, when the pressing plate 10 presses the first layer of fiber paper 1 and the second layer of fiber paper 3, the maximum thickness on the first layer of fiber paper 1 and the second layer of fiber paper 3 can be made equal to the original thickness of the first layer of fiber paper 1 and the second layer of fiber paper 3, that is, there is no raised part. In this way, when the chip 2 is embedded in the embedded groove 5 between the first layer of fiber paper 1 and the second layer of fiber paper 3, the thickness of the formed chip composite paper can be consistent, the surface is uniform, and the wear or impact with the outside due to the existence of protrusions can be avoided.

[0044] Since the first layer of fiber paper 1 and the second layer of fiber paper 3 have a certain shaping effect after being soaked with wax oil, it also enables the first layer of fiber paper 1 and the second layer of fiber paper 3 to be shaped when being thermally pressed and fixed at a low temperature, and is not easily reset due to the curving effect of the first layer of fiber paper 1 and the second layer of fiber paper 3 itself.

[0045] When laminating the first layer of fiber paper 1 and the second layer of fiber paper 3, since there are multiple capillary pores 16, the structures on the first layer of fiber paper 1 and the second layer of fiber paper 3 will also be squeezed into the corresponding capillary pores 16 to form protrusions 6, thereby increasing the connection strength between the chip 2 and the first layer of fiber paper 1 and the second layer of fiber paper 3.

[0046] A motor for driving the rotation of the rotating shaft 13 is installed on one of the triangular support frames 17. The motor is not shown in the figure. When the motor drives the rotation of the rotating shaft 13, the connecting cylinder 12, the electric push rod 11 and the pressing plate 10 will also rotate. After rotating 90°, it is convenient to take out the first layer of fiber paper 1 and the second layer of fiber paper 3 from the template 14, which is convenient to use.

[0047] Furthermore, the suction pump 18 can also inflate the air cavity 22 so that the gas is discharged from the capillary pores 16, which can assist the protrusions 6 to break away from the capillary pores 16 and achieve a demolding effect.

[0048] Therefore, the special equipment disclosed in the present invention can not only process the first layer of fiber paper 1 or the second layer of fiber paper 3 with the embedded groove 5 and the protrusion 6, but also facilitate demolding, picking and placing, and can shape the first layer of fiber paper 1 and the second layer of fiber paper 3, with strong practicability.

Claims

1. A chip-embedded composite paper, characterized in that: It comprises a first layer of fiber paper (1), a chip (2) and a second layer of fiber paper (3); The first layer of fiber paper (1) and the second layer of fiber paper (3) are both provided with an embedded groove (5) on the side close to each other; The depth of the embedded groove (5) is half the thickness of the chip (2), and the chip (2) is embedded in the embedded groove (5); The chip (2) is externally fixed by pressing together a first layer of fiber paper (1) and a second layer of fiber paper (3).

2. The chip-embedded composite paper according to claim 1, characterized in that: The bottom surface of the embedded groove (5) is provided with a plurality of protrusions (6); The surface of the chip (2) has a protrusion (4); The corresponding protrusions (4) and the protrusions (6) are mutually abutted and clamped to achieve the positioning of the chip (2).

3. The chip-embedded composite paper according to claim 1, characterized in that: The surface of the second layer of fiber paper (3) is also provided with a reserved groove (7); The reserved groove (7) is filled with a graphene filler (8); The reserved grooves (7) are provided in plurality, and the plurality of reserved grooves (7) are distributed at equal distances.

4. The chip-embedded composite paper according to claim 1, characterized in that: The first layer of fiber paper (1) and the second layer of fiber paper (3) are both soaked in wax oil.

5. A preparation process for chip-embedded composite paper, characterized in that: The method for preparing the chip implantation composite paper according to any one of claims 1 to 4 comprises the following steps: S1: preparing a first layer of fiber paper (1) and a second layer of fiber paper (3), preparing a plurality of fiber composite papers of the same thickness and length and width, the fiber composite papers need to be soaked with wax oil in advance, and using a dedicated device to process an embedded groove (5) on the surface of the fiber composite paper, and a portion of the fiber composite paper has a reserved groove (7); S2: preparing a connection circuit, and filling the reserved groove (7) with a graphene filler (8); S3: implanting the chip (2), placing the chip (2) in the corresponding embedded groove (5), then overlapping the first layer of fiber paper (1) and the second layer of fiber paper (3), fixing the first layer of fiber paper (1) and the second layer of fiber paper (3) by low-temperature hot pressing at 40 to 60 degrees Celsius, ensuring that excess air between the first layer of fiber paper (1) and the second layer of fiber paper (3) is discharged during hot pressing, and the protrusions (4) on the chip (2) and the corresponding protrusions (6) are pressed against each other and fixed by interlocking, thereby completing the preparation of the chip composite paper.

6. The process for preparing a chip-embedded composite paper according to claim 5, characterized in that: The dedicated equipment comprises an upper substrate (9) and a lower substrate (15); A rotating shaft (13) is provided between the upper base plate (9) and the lower base plate (15), a connecting cylinder (12) is fixedly provided on the rotating shaft (13), and pressing plates (10) are provided on both upper and lower sides of the connecting cylinder (12); A template (14) is fixedly provided on the mutually adjacent sides of the upper base plate (9) and the lower base plate (15), and the upper and lower pressing plates (10) correspond to the two templates (14) one by one.

7. The process for preparing a chip-embedded composite paper according to claim 6, characterized in that: Triangular support frames (17) are provided at both ends of the rotating shaft (13), and the triangular support frames (17) are rotatably connected to the rotating shaft (13).

8. The process for preparing a chip-embedded composite paper according to claim 6, characterized in that: An electric push rod (11) is provided between the connecting cylinder (12) and the pressing plate (10).

9. The process for preparing a chip-embedded composite paper according to claim 6, characterized in that: The template (14) is provided with capillary pores (16); Wherein, an air cavity (22) is provided inside the upper substrate (9) and the lower substrate (15), a suction pump (18) is connected to the air cavity (22), and the air cavity (22) is communicated with the capillary pore (16).

10. The process for preparing a chip-embedded composite paper according to claim 6, characterized in that: The upper template (14) is provided with ribs (21) for forming reserved grooves (7) on the surface of the second layer of fiber paper (3).

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