Micro LED mass detection device

Abstract

The embodiment of the invention discloses a micro LED (light-emitting diode) mass detection device. The micro LED huge quantity detection device comprises a first polar plate, a second polar plate, a third polar plate, a fourth polar plate and a fifth polar plate, and the first polar plate is used for bearing micro LEDs; the second pole plate is opposite to the first pole plate, the first pole plate and the second pole plate are used for being connected with alternating current signals, and an electric field is formed between the first pole plate and the second pole plate and used for driving the micro LED to emit light; the first detector is arranged on the side, away from the first polar plate, of the second polar plate, and the first detector is used for detecting the luminous intensity, chromaticity or spectrum of the micro LED. According to the technical scheme provided by the embodiment of the invention, the problems that the detection speed is relatively low and the electrodes of the micro LED are easily damaged in the mass detection of the micro LED device are solved.

Description

Technical Field

[0001] Embodiments of the present invention relate to the field of detection technologies, and in particular, to a micro LED mass detection device. Background Art

[0002] With the development of display technologies, people have higher and higher requirements for display screens. The micro LED display technology is a new type of display technology composed of LEDs with a size of less than 100 um arranged together. A display screen is composed of dozens or even millions of micro LED chips. The number of dark spots on the screen is usually required to be less than 8, which requires a transfer yield of micro LEDs to be over 99.9999%. Therefore, the mass detection technology for micro LEDs after transfer is crucial.

[0003] The existing mass detection of micro LED display panels generally uses contact mass detection technology, which has a slow detection speed, and the direct contact of the detection probe is likely to damage the electrodes of the micro LEDs, resulting in electrical defects during subsequent bonding. Summary of the Invention

[0004] Embodiments of the present invention provide a micro LED mass detection device to solve the problems of slow detection speed and easy damage to the electrodes of micro LED devices in mass detection.

[0005] To solve the above technical problems, the present invention adopts the following technical solutions:

[0006] Embodiments of the present invention provide a micro LED mass detection device, including:

[0007] A first electrode plate for carrying micro LEDs;

[0008] A second electrode plate facing the first electrode plate. The first electrode plate and the second electrode plate are used to conduct an alternating current signal, and an electric field is formed between the first electrode plate and the second electrode plate. The electric field is used to drive the micro LEDs to emit light;

[0009] A first detector disposed on the side of the second electrode plate away from the first electrode plate. The first detector is used to detect the luminous intensity, chromaticity or spectrum of the micro LEDs.

[0010] Optionally, the detection device further includes:

[0011] Conductive electrodes respectively connected to the first electrode plate and the second electrode plate;

[0012] An AC power supply is connected to a conductor electrode. The AC power supply is used to transmit an AC signal to the conductor electrode; the AC signal is used to generate an electric field; the electric field is used to excite the micro LEDs located on the first electrode plate to emit light.

[0013] Optionally, the first electrode plate includes:

[0014] A first substrate;

[0015] A first conductive layer provided on one side of the first substrate;

[0016] A transfer adhesive layer provided on the side of the first conductive layer away from the first electrode plate.

[0017] Optionally, the first electrode plate further includes:

[0018] A first insulating layer provided on the side of the first conductive layer away from the first substrate;

[0019] Preferably, the first insulating layer includes an organic or inorganic insulating layer;

[0020] Preferably, the material of the first insulating layer includes SiNx, SiOx, TiO 2 or Al 2 O 3 .

[0021] Optionally, the second electrode plate includes:

[0022] A second substrate;

[0023] A second conductive layer provided on one side of the second substrate.

[0024] Optionally, the second electrode plate further includes:

[0025] A second insulating layer, and the second insulating layer is provided on the side of the second conductive layer away from the second substrate;

[0026] Preferably, the material of the second insulating layer includes an organic or inorganic insulating layer;

[0027] Preferably, the material of the second insulating layer includes SiNx, SiOx, TiO 2 or Al 2 O 3 .

[0028] Optionally, the conductor electrode includes at least a pair of first electrode portions;

[0029] Each pair of first electrode portions includes two first electrode ends, and the first electrode ends are symmetrically arranged at the edge of the first substrate of the first substrate;

[0030] Preferably, the first electrode ends are detachably arranged at the edge of the first substrate;

[0031] Preferably, the positive projection of the first electrode end on the first substrate does not overlap with the positive projection of the micro LED on the first substrate;

[0032] Preferably, the shape of the positive projection of the first electrode end on the first substrate includes a rectangle or an arc.

[0033] Optionally, the conductor electrode includes at least a pair of second electrode portions;

[0034] Each pair of second electrode portions includes two second electrode ends. The second electrode ends are arranged on the side of the second conductive layer close to the second substrate. The second electrode portion penetrates the second substrate, or the second electrode portion extends along the edge of the second substrate to the side of the second substrate far from the second conductive layer;

[0035] Preferably, the positive projection of the second conductive layer on the second substrate completely covers the positive projection of the second electrode end on the second substrate.

[0036] Optionally, the first detector is adjustable in the direction perpendicular to the first electrode plate, and the second electrode plate is fixedly arranged at one end of the first detector close to the first electrode plate;

[0037] Preferably, the micro LED mass detection device further includes: a second detector, the second detector is arranged on the side of the first electrode plate far from the second electrode plate, and the positive projection of the second detector on the first electrode plate and the positive projection of the first detector on the first electrode plate at least partially overlap.

[0038] Optionally, the alternating current signal includes a square wave, a sine wave or a triangular wave;

[0039] The first detector includes a photoelectric sensor, a area array camera, a line scan camera, a TDI camera, an imaging luminance chrominance meter, a spectral luminance chrominance meter or a hyperspectral camera.

[0040] The micro LED mass detection device provided by the embodiment of the present invention uses the first electrode plate to carry the micro LED. By arranging the second electrode plate opposite to the first electrode plate and applying an alternating current signal to the first electrode plate and the second electrode plate, an electric field is formed between the first electrode plate and the second electrode plate. The micro LED located under the driving of the electric field between the first electrode plate and the second electrode plate emits light. The light emission intensity, chromaticity or spectrum of the micro LED is detected by the first detector arranged on the side of the second electrode plate far from the first electrode plate, which improves the mass detection speed of the micro LED chips. On the other hand, by non-contact detection of the micro LED, damage to the electrodes of the micro LED during detection is preferably avoided, solving the problems of slow detection speed and easy damage to the electrodes of the micro LED in the mass detection of the micro LED display panel. Description of the Drawings

[0041] To more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the accompanying drawings required for the description of the embodiments of the present invention. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can also be obtained according to the content of the embodiments of the present invention and these accompanying drawings.

[0042] Figure 1 is a schematic structural diagram of a micro LED mass detection device provided by an embodiment of the present invention;

[0043] Figure 2 is a schematic structural diagram of another micro LED mass detection device provided by an embodiment of the present invention;

[0044] Figure 3 is a schematic structural diagram of yet another micro LED mass detection device provided by an embodiment of the present invention;

[0045] Figure 4 is a schematic structural diagram of the first electrode plate of a micro LED mass detection device provided by an embodiment of the present invention;

[0046] Figure 5 is a schematic structural diagram of the first electrode plate of another micro LED mass detection device provided by an embodiment of the present invention;

[0047] Figure 6 is a schematic structural diagram of the second electrode plate of a micro LED mass detection device provided by an embodiment of the present invention;

[0048] Figure 7 is a schematic structural diagram of the first electrode plate of yet another micro LED mass detection device provided by an embodiment of the present invention;

[0049] Figure 8 is a schematic structural diagram of the first electrode plate of yet another micro LED mass detection device provided by an embodiment of the present invention;

[0050] Figure 9 is a schematic structural diagram of the first electrode plate of yet another micro LED mass detection device provided by an embodiment of the present invention;

[0051] Figure 10 is a schematic structural diagram of the second electrode plate of another micro LED mass detection device provided by an embodiment of the present invention;

[0052] Figure 11 is a schematic structural diagram of the second electrode plate of yet another micro LED mass detection device provided by an embodiment of the present invention;

[0053] Figure 12 It is a schematic structural diagram of the first electrode plate of another micro-LED mass detection device provided by an embodiment of the present invention;

[0054] Figure 13 It is a schematic structural diagram of the first electrode plate of another micro-LED mass detection device provided by an embodiment of the present invention. Specific embodiments

[0055] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present invention, rather than limiting the present invention. In addition, it should be noted that for the sake of description, only parts related to the present invention rather than all structures are shown in the drawings.

[0056] Based on the above technical problems, the following solutions are proposed in this embodiment:

[0057] Figure 1 It is a schematic structural diagram of a micro-LED mass detection device provided by an embodiment of the present invention. Figure 2 It is a schematic structural diagram of another micro-LED mass detection device provided by an embodiment of the present invention. Refer to Figure 1 and Figure 2 For the micro-LED mass detection device provided by the embodiment of the present invention, it includes: a first electrode plate 100, the first electrode plate 100 is used to carry the micro-LED 1; a second electrode plate 200, the second electrode plate 200 is disposed opposite to the first electrode plate 100, the first electrode plate 100 and the second electrode plate 200 are used to conduct an alternating current signal, an electric field is formed between the first electrode plate 100 and the second electrode plate 200, and the electric field is used to drive the micro-LED 1 to emit light; a first detector 300, the first detector 300 is disposed on the side of the second electrode plate 200 away from the first electrode plate 100, and the first detector 300 is used to detect the light intensity, chromaticity or spectrum of the micro-LED 1.

[0058] Specifically, the micro-LED 1 is transferred onto the first electrode plate 100 by mass transfer. The first electrode plate 100 and the second electrode plate 200 are disposed opposite to each other. An alternating current signal can be conducted to the first electrode plate 100 and the second electrode plate 200 through an alternating current power supply 500. The alternating current signal includes a high-frequency alternating current signal. The alternating current signal can be a high-frequency alternating current voltage signal. The first electrode plate 100 and the second electrode plate 200 are disposed opposite to each other and do not directly contact. An alternating electric field will be generated between the first electrode plate 100 and the second electrode plate 200 after conducting the alternating current signal.

[0059] It should be noted that the second electrode plate 200 and the first detector 300 can be arranged separately, or the second electrode plate 200 and the first detector 300 can be detachably connected or fixedly connected, and no limitation is made here. Figure 1 Exemplarily, a case where both the second electrode plate 200 and the first detector 300 are circular is shown. The shape of the second electrode plate 200 can be circular, rectangular, other polygonal, irregular, etc. The shape of the first detector 300 can be circular, rectangular, other polygonal, irregular, etc., and no limitation is made here. The size of the second electrode plate 200 is not limited, and the size of the second electrode plate 200 can be the same as or different from the size of the first electrode plate 100. The size of the second electrode plate 200 can be the same as or different from the size of the first detector 300, and no limitation is made here.

[0060] The micro LED 1 is arranged on one side of the first electrode plate 100 close to the second electrode plate 200. Since the micro LED 1 is located between the first electrode plate 100 and the second electrode plate 200, the micro LED 1 will emit high-frequency induced light under the alternating electric field formed between the first electrode plate 100 and the second electrode plate 200. The first detector 300 is arranged on one side of the second electrode plate 200 far from the first electrode plate 100, and the first detector 300 detects the light emission intensity, chromaticity or spectrum of the micro LED 1. The detection of the micro LED 1 by the first detector 300 includes but is not limited to parameters such as brightness, luminous intensity or luminous flux.

[0061] Exemplarily, through the method of high-frequency electric field coupling, in the positive half-cycle of the alternating current signal, the electric field direction is from the P GaN of the microLED 1 to the N GaN of the micro LED 1. The electrons in the N GaN region of the micro LED 1 and the holes in the P GaN region move towards the multi-quantum (MQWs) direction through diffusion motion, and radiative recombination occurs in the quantum well, causing the micro LED1 to generate electroluminescence. In the negative half-cycle of the alternating current signal, the electric field direction is from the N GaN of the micro LED 1 to the P GaN of the microLED 1, driving the electrons and holes back to the initial state. Through the method of high-frequency electric field coupling, non-contact massive detection of the micro LED 1 is realized, the detection speed is improved, and the physical damage of the micro LED 1 chip detection is reduced.

[0062] The micro LED 1 mass detection device provided in this embodiment uses the first electrode plate 100 to carry the micro LED 1. By arranging the second electrode plate 200 opposite to the first electrode plate 100 and applying an alternating current signal to the first electrode plate 100 and the second electrode plate 200, an electric field is formed between the first electrode plate 100 and the second electrode plate 200. The micro LED 1 located under the drive of the electric field between the first electrode plate 100 and the second electrode plate 200 emits light. The first detector 300 arranged on the side of the second electrode plate 200 away from the first electrode plate 100 detects the luminous intensity, chromaticity or spectrum of the micro LED 1, improving the mass detection speed of the micro LED 1 chip. On the other hand, by performing non-contact detection on the micro LED 1, damage to the electrodes of the micro LED 1 during detection is preferably avoided, solving the problems of slow detection speed and easy damage to the electrodes of the micro LED 1 in the mass detection of the micro LED 1 display panel.

[0063] Optionally, Figure 3 is a schematic structural diagram of another micro LED mass detection device provided by an embodiment of the present invention. On the basis of the above embodiment, refer to Figure 3 , the detection device may further include a conductor electrode 400, the conductor electrode 400 is respectively connected to the first electrode plate 100 and the second electrode plate 200; an alternating current power supply 500, the alternating current power supply 500 is connected to the conductor electrode 400, and the alternating current power supply 500 is used to transmit an alternating current signal to the conductor electrode 400; the alternating current signal is used to generate an electric field; the electric field is used to excite the micro LED 1 located on the first electrode plate 100 to emit light.

[0064] Specifically, the conductor electrodes 400 can be respectively arranged on the first electrode plate 100 and the second substrate, and the conductor electrodes 400 are respectively electrically connected to the first electrode plate 100 and the second electrode plate 200. The alternating current power supply 500 is connected to the first electrode plate 100 and the second electrode plate 200 through the conductor electrode 400. The alternating current power supply 500 is used to transmit an alternating current signal to the conductor electrode 400. The alternating current signal acts to generate an electric field between the first electrode plate 100 and the second electrode plate 200. The micro LED 1 located on the first electrode plate 100 emits light under the action of the electric field.

[0065] Optionally, Figure 4 is a schematic structural diagram of the first electrode plate of a micro LED mass detection device provided by an embodiment of the present invention. Figure 5 is a schematic structural diagram of the first electrode plate 100 of another micro LED mass detection device provided by an embodiment of the present invention. On the basis of the above embodiment, in combination with Figure 4 and Figure 5, the first electrode plate 100 may include: a first substrate 101; a first conductive layer 102 disposed on one side of the first substrate 101; and a transfer adhesive layer 104 disposed on the side of the first conductive layer 102 away from the first electrode plate 100.

[0066] Specifically, the material of the first substrate 101 includes sapphire or glass. The first conductive layer 102 may include an indium tin oxide conductive thin film (Indium Tin Oxides, ITO). Glass through vias (Through Glass Vias, TGV) may be disposed on the first conductive layer 102.

[0067] Exemplarily, on one side of the first substrate 101, an ITO film layer is prepared by using physical vapor deposition (Physical Vapor Deposition, PVD) technology as the first conductive layer 102 for applying an electric field to the micro LED 1. The transfer adhesive layer 104 is prepared on the side of the first conductive layer 102 away from the first electrode plate 100. The transfer adhesive layer 104 is used for massive transfer of the micro LED 1.

[0068] It should be noted that, referring to Figure 4 , the light-emitting side of the micro LED 1 may be disposed on the side away from the first electrode plate 100, or, referring to Figure 5 , the light-emitting side of the micro LED 1 may be disposed on the side close to the first electrode plate 100, and no limitation is made here.

[0069] Optionally, on the basis of the above embodiments, continue to refer to Figure 4 , the first electrode plate 100 may further include: a first insulating layer 103 disposed on the side of the first conductive layer 102 away from the first substrate 101; preferably, the first insulating layer 103 includes an organic or inorganic insulating layer; preferably, the material of the first insulating layer 103 includes SiNx, SiOx, TiO 2 or Al 2 O 3 etc.

[0070] Specifically, the first insulating layer 103 is disposed between the first conductive layer 102 and the transfer adhesive layer 104. By providing the first insulating layer 103, the flatness of the side of the first conductive layer 102 away from the first substrate 101 is better, which is convenient for improving the thickness uniformity of the transfer adhesive layer 104. On the other hand, the first insulating layer 103 has good insulation performance, which can preferably avoid short circuits between the first conductive layer 102 and the pins of the micro LED 1. The first insulating layer 103 may be prepared by chemical vapor deposition (Chemical Vapor Deposition, CVD) technology.

[0071] Optionally,Figure 6 This is a schematic structural diagram of the second electrode plate of a micro LED mass detection device provided by an embodiment of the present invention. Based on the above embodiments, refer to Figure 6 , the second electrode plate 200 may include: a second substrate 201; a second conductive layer 202 disposed on one side of the second substrate 201.

[0072] Specifically, the material of the second substrate 201 includes sapphire or glass. The material of the second conductive layer 202 may include ITO. The second conductive layer 202 may be provided with a glass through hole or a side-wiring structure. The second conductive layer 202 and the first conductive layer 102 located on the first electrode plate 100 form two opposite electrode plates. An alternating current signal acts on the first conductive layer 102 and the second conductive layer 202, and an electric field is formed between the first conductive layer 102 and the second conductive layer 202.

[0073] Optionally, based on the above embodiments, continue to refer to Figure 6 , the second electrode plate 200 may further include: a second insulating layer 203, the second insulating layer 203 is disposed on the side of the second conductive layer 202 away from the second substrate 201; preferably, the material of the second insulating layer 203 includes an organic or inorganic insulating layer; preferably, the material of the second insulating layer 203 includes SiNx, SiOx, TiO 2 or Al 2 O 3 etc.

[0074] Specifically, the second insulating layer 203 is disposed on the side of the second conductive layer 202 away from the second substrate 201. Since the medium between the second electrode plate 200 and the transfer adhesive layer 104 of the first electrode plate 100 is air, and the dielectric constant of air is the lowest, when high-frequency alternating current is applied to the first electrode plate 100 and the second electrode plate 200, by providing the second insulating layer 203, air breakdown can be better avoided, damage to the micro LED 1 can be avoided, and safety can be improved.

[0075] Optionally, Figure 7 This is a schematic structural diagram of the first electrode plate of another micro LED mass detection device provided by an embodiment of the present invention. Figure 8 This is a schematic structural diagram of the first electrode plate of another micro LED mass detection device provided by an embodiment of the present invention. Figure 9 This is a schematic structural diagram of the first electrode plate of another micro LED mass detection device provided by an embodiment of the present invention. Based on the above embodiments, in combination with Figures 7 to 9, the conductor electrode 400 includes at least a pair of first electrode portions 410; each pair of first electrode portions 410 includes two first electrode ends 401, and the first electrode ends 401 are symmetrically arranged on the edge of the first substrate 101; preferably, the first electrode ends 401 are detachably arranged on the edge of the first substrate 101; preferably, the orthographic projection of the first electrode ends 401 on the first substrate 101 does not overlap with the orthographic projection of the micro LED 1 on the first substrate 101; preferably, the shape of the orthographic projection of the first electrode ends 401 on the first substrate 101 includes a rectangle or an arc.

[0076] Specifically, the conductor electrodes 400 are arranged in pairs. The first electrode ends 401 can transmit the first power signal, and the second electrode ends 402 can be used to transmit the second power signal. The first power signal can be a positive-phase signal, and the second power signal can be a negative-phase signal. The first electrode ends 401 are symmetrically arranged on the edge of the first substrate 101, making the electric field intensity more uniform. There is no first insulating layer 103 on the edge of the first substrate 101, and the distance range from the edge of the first insulating layer 103 to the edge of the first substrate 101 includes 1 mm - 10 mm.

[0077] Exemplarily, the first electrode portion 410 can be connected to the first conductive layer 102 on the first plate 100 through n first electrode ends 401. The more the number of the first electrode ends 401, the smaller the potential difference between different regions of the first conductive layer 102 on the first plate 100. The electric field intensity generated between the first electrode and the second electrode is more uniform. Optionally, the first electrode ends 401 can be expanded and connected into two semi-circles, and are pressed down from both sides of the first plate 100, thereby further reducing the voltage drop of the first conductive layer 102 on the first plate 100.

[0078] Optionally, Figure 10 is a schematic structural diagram of the second plate of another micro LED mass detection device provided by an embodiment of the present invention. Figure 11 is a schematic structural diagram of the second plate of yet another micro LED mass detection device provided by an embodiment of the present invention. On the basis of the above embodiments, in combination with Figure 2 , Figure 10 and Figure 11 , the conductor electrode 400 can include at least a pair of second electrode portions 420; each pair of second electrode portions 420 includes two second electrode ends 402, and the second electrode ends 402 are arranged on the side of the second conductive layer 202 close to the second substrate 201. The second electrode portion 420 penetrates through the second substrate 201, or the second electrode portion 420 extends along the edge of the second substrate 201 to the side of the second substrate 201 far from the second conductive layer 202; preferably, the orthographic projection of the second conductive layer 202 on the second substrate 201 completely covers the orthographic projection of the second electrode ends 402 on the second substrate 201.

[0079] Specifically, by setting it in this way, it is avoided that the second electrode end 402 of the second conductive part of the second electrode plate 200 directly overlaps on the surface of the second conductive layer 202, thereby avoiding the influence of the second electrode end 402 on the adjustment of the distance between the first electrode plate 100 and the second electrode plate 200. The scheme of using TGV vias or side-walking wiring metal and metal thimbles can be used to realize the electrical connection between the second conductive layer 202 on the second electrode plate 200 and the power supply.

[0080] It should be noted that the first electrode end 401 of the first conductive layer 102 of the first electrode plate 100 can also be set such that the first electrode end 401 penetrates the first conductive layer 102, or the first electrode part 410 extends along the edge of the first substrate 101 to the side of the first substrate 101 away from the first conductive layer 102. The same structure as the second electrode end 402 of the second electrode plate 200 is adopted to expand the detectable area of the first detector 300 and reduce the proportion of the movement interference area.

[0081] Optionally, based on the above embodiments, continue to refer to Figure 2 and Figure 3 , the first detector 300 is adjustable in the direction perpendicular to the first electrode plate 100, and the second electrode plate 200 is fixedly arranged at one end of the first detector 300 close to the first electrode plate 100.

[0082] Specifically, the first electrode plate 100 can be placed on the wafer stage, and the second electrode plate 200 is arranged on the first detector 300. The second electrode plate 200 is light-transmissive, and the first detector 300 can detect the light emission intensity, chromaticity or spectrum of the micro LED 1 located on the first electrode plate 100 through the second electrode plate 200. The distance between the first electrode plate 100 and the second electrode plate 200 can be greater than zero and less than or equal to 5000 um.

[0083] When the light emission brightness of the micro LED 1 detected by the first detector 300 is greater than or equal to the preset brightness threshold, it is determined that the light emission brightness of the micro LED 1 is a normal device. When the light emission brightness of the micro LED 1 detected by the first detector 300 is less than the preset brightness threshold, it is determined that the light emission brightness of the micro LED 1 is an abnormal device.

[0084] When the deviation value between the light emission chromaticity / spectrum wavelength of the micro LED 1 detected by the first detector 300 and the preset value is less than the threshold, it is determined that the light emission chromaticity of the micro LED 1 is a normal device. When the deviation between the light emission chromaticity / spectrum wavelength of the micro LED 1 detected by the first detector 300 and the preset value is greater than the threshold, it is determined that the light emission chromaticity or spectrum wavelength of the micro LED 1 is an abnormal device.

[0085] Optionally, based on the above embodiments, continue to refer to Figure 2 and Figure 3 , the micro LED 1 mass detection device may further include: a second detector 600, the second detector 600 is disposed on a side of the first electrode plate 100 away from the second electrode plate 200, and a positive projection of the second detector 600 on the first electrode plate 100 overlaps at least partially with a positive projection of the first detector 300 on the first electrode plate 100.

[0086] Specifically, when the light-emitting side of the micro LED 1 is disposed on a side close to the first electrode plate 100, when the first detector 300 is used for detection, the pins of the micro LED 1 itself will block light to a certain extent. By providing the second detector 600, the second detector 600 can clearly detect the light on the light-emitting side of the micro LED 1, further improving the accuracy of the mass detection of the microLED 1 chip.

[0087] It should be noted that the shape of the second detector 600 may be circular or rectangular or other polygon or irregular shape, etc., and no limitation is made here. The size of the second detector 600 and the size of the first detector 300 may be set to be the same or different, and no limitation is made here.

[0088] An alternative implementation Figure 12 is a schematic structural diagram of the first electrode plate of another micro LED mass detection device provided by the embodiments of the present invention. Figure 13 is a schematic structural diagram of the first electrode plate of another micro LED mass detection device provided by the embodiments of the present invention. Continue to combine Figure 2 、 Figures 10 to 13 . When the first electrode portion 410 of the wafer of the first electrode plate 100 does not adopt the above TGV thimble or side-walking wire thimble scheme, there is a high degree of interference in the first electrode portion 410, resulting in the first electrode portion 410 touching the first electrode plate 100 on the first detector 300. In this way, a part of the microLED 1 at the edge of the wafer cannot be detected.

[0089] By setting the number of the first electrode ends 401 of the first electrode plate 100 to N≥4. The first electrode end 401 is in the form of a shrapnel, and the crimping of the first electrode end 401 uses a scheme of electric rotation and automatic downward pressing. Refer to Figure 12, when the first detector 300 needs to detect the micro LED 1 on a certain edge of the wafer, the first electrode terminal 401 on this edge rotates to the periphery of the first electrode plate 100 to clear the interference at the height of the first electrode terminal 401 here. At this time, a total of N≥4 - 1 = 3 first electrode terminals 401 are in contact. On the one hand, it enables better equalization of the potential. On the other hand, it enables the wafer to be stably stressed, preventing warping of one side of the wafer and improving the detection accuracy. See Figure 11 , when the first electrode terminal 401 does not interfere with the first detector 300, the first electrode terminal 401 remains stationary.

[0090] It should be noted that Figure 12 Exemplarily, it is shown that the field of view 601 of the first detector or the second detector is not affected by the interference of the first electrode terminal 401. Figure 13 Exemplarily, when the field of view 602 of the first detector or the second detector is affected by the interference of the first electrode terminal 401, the first electrode terminal 401 adjacent to the field of view 602 rotates to the periphery of the first electrode plate 100 to clear the interference of the first electrode terminal 401 in the height direction on the field of view 602 of the first detector or the second detector.

[0091] Optionally, on the basis of the above embodiments, continue to refer to Figure 3 , the alternating current signal includes square wave, sine wave or triangular wave, etc. The first detector 300 can include area array camera, line scan camera, TDI camera, imaging luminance chrominance meter, spectral type luminance chrominance meter or hyperspectral camera, etc. The second detector 600 can include photoelectric sensor, area array camera, line scan camera, TDI camera, imaging luminance chrominance meter, spectral type luminance chrominance meter or hyperspectral camera, etc.

[0092] Specifically, the measurement methods of the first detector 300 and the second detector 600 can include fixed-shot or flying-shot methods. It should be noted that the first electrode plate 100 can be a wafer. The first electrode plate 100 can be arranged on the stage. The stage can be set to be fixed or movable, and no limitation is made here.

[0093] Note that the above is only the preferred embodiment of the present invention and the applied technical principles. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described here. Various obvious changes, re-adjustments and substitutions can be made by those skilled in the art without departing from the protection scope of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments. Without departing from the concept of the present invention, it can also include more other equivalent embodiments, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A micro-LED mass detection device, characterized in that, it includes: A first electrode plate for carrying micro-LEDs; A second electrode plate facing the first electrode plate. The first electrode plate and the second electrode plate are used to conduct an alternating current signal, and an electric field is formed between the first electrode plate and the second electrode plate. The electric field is used to drive the micro-LEDs to emit light; A first detector disposed on the side of the second electrode plate away from the first electrode plate. The first detector is used to detect the luminous intensity, chromaticity or spectrum of the micro-LEDs.

2. The detection device according to claim 1, characterized in that, the detection device further includes: A conductor electrode connected to the first electrode plate and the second electrode plate respectively; An alternating current power supply connected to the conductor electrode. The alternating current power supply is used to transmit an alternating current signal to the conductor electrode; the alternating current signal is used to generate an electric field; the electric field is used to excite the micro-LEDs located on the first electrode plate to emit light.

3. The detection device according to claim 2, characterized in that, the first electrode plate includes: A first substrate; A first conductive layer disposed on one side of the first substrate; A transfer adhesive layer disposed on the side of the first conductive layer away from the first electrode plate.

4. The detection device according to claim 3, characterized in that, the first electrode plate further includes: A first insulating layer disposed on the side of the first conductive layer away from the first substrate; Preferably, the first insulating layer includes an organic or inorganic insulating layer; Preferably, the material of the first insulating layer includes SiNx, SiOx, TiO 2 or Al 2 O 3 .

5. The detection device according to claim 2, characterized in that, the second electrode plate includes: A second substrate; A second conductive layer disposed on one side of the second substrate.

6. The detection device according to claim 5, characterized in that, the second electrode plate further includes: A second insulating layer disposed on the side of the second conductive layer away from the second substrate; Preferably, the material of the second insulating layer includes an organic or inorganic insulating layer; Preferably, the material of the second insulating layer includes SiNx, SiOx, TiO 2 or Al 2 O 3 .

7. The detection device according to claim 3, characterized in that, the conductor electrode includes at least a pair of first electrode parts; Each pair of the first electrode parts includes two first electrode ends symmetrically disposed on the edge of the first substrate; Preferably, the first electrode ends are detachably disposed on the edge of the first substrate; Preferably, the orthographic projection of the first electrode ends on the first substrate does not overlap with the orthographic projection of the micro-LEDs on the first substrate; Preferably, the shape of the orthographic projection of the first electrode ends on the first substrate includes a rectangle or an arc.

8. The detection device according to claim 5, characterized in that, the conductor electrode includes at least a pair of second electrode parts; Each pair of the second electrode parts includes two second electrode ends, the second electrode ends are arranged on the side of the second conductive layer close to the second substrate, the second electrode parts penetrate through the second substrate, or the second electrode parts extend along the edge of the second substrate to the side of the second substrate far from the second conductive layer; Preferably, the orthographic projection of the second conductive layer on the second substrate completely covers the orthographic projection of the second electrode ends on the second substrate.

9. The detection device according to claim 1, characterized in that the first detector is adjustable in a direction perpendicular to the first electrode plate, and the second electrode plate is fixedly arranged at one end of the first detector close to the first electrode plate; Preferably, the micro LED mass detection device further includes: a second detector, the second detector is arranged on the side of the first electrode plate far from the second electrode plate, and the orthographic projection of the second detector on the first electrode plate and the orthographic projection of the first detector on the first electrode plate at least partially overlap.

10. The detection device according to claim 1, characterized in that the AC signal includes a square wave, a sine wave or a triangular wave; the first detector includes a photoelectric sensor, a area array camera, a line scan camera, a TDI camera, an imaging luminance chrominance meter, a spectral luminance chrominance meter or a hyperspectral camera.

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