An anomaly tracing method for an LED product reliability test board

Abstract

This invention discloses an anomaly tracing method for an LED product reliability test board, comprising: preparing a reliability test board, wherein the reliability test board is provided with traceability information for anomalies in previous processes; conducting reliability tests on the reliability test board to determine the test state of the reliability test board, and recording the anomaly information at the anomaly location on the reliability test board according to the traceability information when the test state is abnormal; and identifying the source of the anomaly based on the anomaly information. This method, through the overall packaging process compared to the previous single-LED chip packaging process, avoids the situation where, during reliability testing, anomalies occur on the reliability test board. Since individual LED chips lack any manufacturing process information, it is only possible to identify which LED chips are abnormal, but it is impossible to trace the source of the anomaly to which process or production equipment it occurred in, thus hindering effective improvement of the abnormal areas and enhancing the quality and reliability of LED products.

Description

[0001] The present application relates to the technical field of LED, in particular to an abnormal tracing method of LED product reliability experiment board.

[0002] As a high-efficiency and energy-saving light source, LED is widely used in lighting, display, backlight and other fields. With the rapid development of LED technology, its reliability and life become the key indicators of product quality. In order to ensure the stability and durability of LED products in actual use, reliability experiment becomes an indispensable link in the production process. The reliability experiment board, as a special circuit board for testing the reliability and performance of LED products, simulates various environmental conditions and working states that the LED products may encounter in actual use, and evaluates the stability and service life of the LED products in long-term use.

[0003] The existing LED product reliability experiment board is to strip the whole LED support after packaging into single lamp beads, then screen and code the light, and then paste it on the corresponding experiment PCB board through SMT paster for reliability experiment test. However, in this process, since the single lamp bead has been disturbed after the above process, it is impossible to know which whole LED support it is stripped from, and the lamp bead itself has no any production process information, so that when the experiment is abnormal, it is impossible to trace which process, which machine or which mold in the previous stage is the problem, so that the abnormal source cannot be traced.

[0004] In order to solve the technical problem that the LED product reliability experiment board cannot trace the abnormal source due to the packaging process when the reliability experiment is abnormal, the present application provides an abnormal tracing method of LED product reliability experiment board.

[0005] To achieve the above purpose, the present application provides an abnormal tracing method of LED product reliability experiment board, comprising the following steps:

[0006] Preparation of reliability experiment board, the reliability experiment board is provided with traceable information of abnormality in the previous process;

[0007] The reliability experiment board is subjected to reliability experiment, the experiment state of the reliability experiment board is determined, and when the experiment state is abnormal state, the abnormal information of the abnormal position on the reliability experiment board is recorded according to the traceable information;

[0008] According to the abnormal information, the abnormal source is confirmed.

[0009] ​​​The abnormality tracing method of the LED product reliability experiment board as described above, the step of preparing the reliability experiment board, comprising:

[0010] Preparation of a whole piece of LED support;

[0011] Preparation of a PCB experiment board corresponding to the lamp bead position of the whole piece of LED support;

[0012] Place the lamp beads of the whole piece of LED support one by one corresponding to the lamp bead coordinate position of the PCB experiment board, and perform overall packaging to obtain the reliability experiment board.

[0013] The abnormality tracing method of the LED product reliability experiment board as described above, the tracing information comprising production process information of the whole piece of LED support and lamp bead coordinate position information of the PCB experiment board.

[0014] The abnormality tracing method of the LED product reliability experiment board as described above, the abnormality information comprising coordinate position information of the abnormal lamp bead and production process information of the corresponding whole piece of LED support.

[0015] The abnormality tracing method of the LED product reliability experiment board as described above, before the step of performing reliability experiment on the reliability experiment board and determining the experiment state of the reliability experiment board, further comprising:

[0016] Abnormality test before performing reliability experiment on the reliability experiment board.

[0017] The abnormality tracing method of the LED product reliability experiment board as described above, the step of performing abnormality test on the reliability experiment board before experiment, comprising:

[0018] Electrical test on the reliability experiment board;

[0019] If the lamp bead appears abnormal conditions such as dimming, dead lamp, etc., the reliability experiment board is unqualified product.

[0020] The abnormality tracing method of the LED product reliability experiment board as described above, the step of performing reliability experiment on the reliability experiment board and determining the experiment state of the reliability experiment board, comprising:

[0021] When the reliability experiment board reaches the corresponding experiment node, perform electrical test on the reliability experiment board again;

[0022] If the lamp bead appears abnormal conditions such as dimming, dead lamp, etc., the experiment state of the reliability experiment board is abnormal state.

[0023] The abnormality tracing method of the LED product reliability experiment board as described above, the reliability experiment is a preset experiment time interval or a specific experiment condition of the corresponding experiment node.

[0024] Compared with the prior art, the abnormality tracing method of the LED product reliability experiment board has the following beneficial effects:

[0025] 1. The abnormality tracing method is mainly realized by improving the packaging process of the reliability experiment board. Compared with the single lamp bead packaging process, the overall packaging process can avoid the abnormality of the reliability experiment board during the reliability experiment. Since there is no production process information on the single lamp bead, it is only known that which lamp beads have abnormalities, but the abnormal source of the lamp bead cannot be traced to which process or which production equipment, so that the existing abnormal place cannot be improved effectively, and the quality and reliability of the LED product are improved.

[0026] 2. The reliability experiment board is packaged on the PCB experiment board together with the whole bracket. This structure can increase the adhesion of the LED lamp bead and the PCB experiment board, prevent the loosening or falling of the single lamp bead due to bumping, reduce the experimental misjudgment proportion caused by the loosening of the lamp bead due to bumping, and improve the accuracy of the experimental results. BRIEF DESCRIPTION OF DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiment description.

[0028] Figure 1 The flowchart of the abnormality tracing method of the LED product reliability experiment board of the present application;

[0029] Figure 2 The specific flowchart of step S1 in the embodiment; Figure 1

[0030] The specific flowchart before step S2 in the embodiment; Figure 3 Figure 1 The specific flowchart of step S20 in the embodiment;

[0031] Figure 4 Figure 3 The specific flowchart of step S2 in the embodiment.

CONCRETE EMBODIMENT

[0032] Figure 5 Figure 1 The specific flowchart of step S2 in the embodiment.

CONCRETE EMBODIMENT

[0033] ​​In order to make the technical problems, technical solutions and beneficial effects solved by the present application clearer, the present application will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and do not limit the present application.

[0034] Please refer to Figures 1 to 5 The embodiment of the present application proposes an abnormality tracing method of an LED product reliability experiment board, which comprises steps S1-S3, wherein:

[0035] S1, preparing a reliability experiment board, wherein the reliability experiment board is provided with traceable information of abnormality of a previous process.

[0036] Specifically, this step is a key step. The reliability experiment board prepared by this step is provided with traceable information of abnormality of a previous process, so that when abnormality occurs during the experiment, the source of the abnormality in the LED product preparation process can be traced according to the traceable information, so that the LED product preparation process can be improved and the reliability of the LED product can be improved.

[0037] Further, as a preferred embodiment of the present application but not as a limitation, the step S1 further comprises steps S11-S13, wherein:

[0038] S11, preparing a whole LED support;

[0039] S12, preparing a PCB experiment board corresponding to the lamp bead position of the whole LED support;

[0040] S13, placing the lamp beads of the whole LED support one by one in correspondence with the lamp bead coordinate positions of the PCB experiment board, and performing overall packaging to obtain the reliability experiment board.

[0041] Specifically, in the embodiment of the present application, the whole LED support prepared by step S11 is by default an LED support that has been encapsulated, i.e. the whole LED support is a support that constitutes a whole LED lamp bead by encapsulating single LED lamp beads. Preparing a whole LED support and encapsulating single lamp beads to form a whole LED support are prior art means, and the process of preparing a whole LED support and encapsulation will not be described here. It is worth noting that the whole LED support records production process information during production, and the production process information can include but is not limited to mold number of production process and machine number corresponding to the process.

[0042] In the preparation of the PCB experimental board, the size of the PCB experimental board is designed according to the size of the whole LED support, and more importantly, the pad layout for welding the lamp beads on the PCB experimental board is designed according to the position of the lamp beads on the whole LED support, that is, the pads on the PCB experimental board are one-to-one corresponding to the positions of the lamp beads on the whole LED support, and in addition, coordinate information is also arranged on the PCB experimental board, which is used to identify the specific coordinate position of the lamp beads. In the embodiment of the application, the size of the whole LED support, and the position of the lamp beads on the LED support and the spacing between the lamp beads can be set according to the parameters of the actual production equipment, or can be set according to the actual design requirements of the user. For this, the embodiment of the application does not make specific limitation.

[0043] In addition, when the whole LED support is packaged with the PCB experimental board, the lamp beads of the whole LED support need to be placed one-to-one corresponding to the coordinate positions of the lamp beads of the PCB experimental board, and then packaged by an STM pick-and-place machine, so that the prepared reliability experimental board has the production process information of the whole LED support and the lamp bead position information of the whole LED support, that is, the prepared reliability experimental board has traceable traceability information of the previous process exception, and in the subsequent reliability experiment, the source of the abnormality can be traced.

[0044] In this embodiment, compared with the previous single lamp bead packaging process, the whole packaging process can avoid the situation that when the reliability experimental board appears abnormal during the reliability experiment, there is no production process information on the single lamp bead, so it can only be known that which lamp beads have abnormality, but it cannot be determined that the abnormality source of the lamp bead is in which process or in which production equipment, so that the place where the abnormality exists cannot be effectively improved, and the quality and reliability of the LED product are improved. At the same time, the whole packaging process also avoids the tedious process of packaging single lamp beads one by one, greatly improving the experimental test efficiency of the reliability experiment.

[0045] In addition, the LED lamp beads are packaged together with the whole support on the PCB experimental board, which can increase the adhesion of the LED lamp beads and the PCB experimental board, prevent the loosening or falling off of single lamp beads due to bumping, reduce the proportion of experimental misjudgment caused by the loosening of lamp beads due to bumping, and improve the accuracy of experimental results.

[0046] Further, as a preferred embodiment of the present scheme but not limited, the traceability information includes the production process information of the whole LED support and the coordinate position information of the lamp beads of the PCB experimental board.

[0047] S2, performing a reliability experiment on the reliability experiment board, determining an experimental state of the reliability experiment board, and recording abnormal information of an abnormal position on the reliability experiment board according to the trace information when the experimental state is an abnormal state.

[0048] Specifically, since the reliability experiment board prepared by the foregoing step is provided with the trace information, when the reliability experiment is performed on the reliability experiment board, if an abnormality occurs during the experiment, i.e., the experimental state of the reliability experiment is an abnormal state, corresponding abnormal information can be recorded according to the trace information on the reliability experiment board.

[0049] The abnormal information includes coordinate position information of an abnormal lamp bead and production process information of a corresponding whole LED support.

[0050] In this embodiment, by recording the coordinate position information of the abnormal lamp bead and the production process information of the corresponding whole LED support, the source of the problem can be quickly located, so that the production process can be adjusted in time, and large-scale screening of the entire batch of products is avoided when an abnormality occurs, thereby improving the abnormal solution efficiency.

[0051] Further, as a preferred embodiment of the present scheme but not limited, before the step S2 of performing a reliability experiment on the reliability experiment board to determine the experimental state of the reliability experiment board, the step S20 is further included, wherein:

[0052] S20, performing an abnormality test on the reliability experiment board before the reliability experiment.

[0053] Further, as a preferred embodiment of the present scheme but not limited, the step S20 includes steps S201-S202, wherein:

[0054] S201, performing an electrical test on the reliability experiment board.

[0055] S202, if abnormal conditions such as dimming, dead lamp, etc. of the lamp bead occur, the reliability experiment board is unqualified product.

[0056] In this embodiment, the abnormality test is performed on the reliability experiment board before the reliability experiment, so as to find potential defects or abnormal conditions that may exist in the reliability experiment board in advance. If it is found that the reliability experiment board indeed has abnormal conditions, the abnormal source can be determined in advance for improvement. In addition, by screening the reliability experiment board with problems, the accuracy and reliability of subsequent experimental results can be ensured.

[0057] Further, as a preferred embodiment of the present scheme but not limited, the step S2 further includes steps S21-S22, wherein:

[0058] S21, when the reliability experiment board proceeds to the corresponding experiment node, the reliability experiment board is tested again.

[0059] S22, if the lamp bead appears abnormal conditions such as dim, dead lamp, etc., the experiment state of the reliability experiment board is an abnormal state.

[0060] The reliability experiment includes but is not limited to environmental life experiment, electrical characteristic experiment, optical characteristic experiment, and the corresponding experiment node is a preset experiment time interval or a specific experiment condition.

[0061] Specifically, the reliability experiment board performs related reliability experiments such as environmental life experiment, electrical characteristic experiment and optical characteristic experiment, and when the reliability experiment board proceeds to the corresponding experiment node, the reliability experiment board is tested again. If the lamp bead on the reliability experiment board appears abnormal conditions such as dim, dead lamp, etc., the abnormal information of the abnormal position is recorded according to the traceability information of the reliability experiment board, that is, the coordinate position information corresponding to the abnormal lamp bead of the reliability experiment board and the production process information of the corresponding whole LED support are recorded.

[0062] In addition, if necessary, the corresponding mold or equipment can be improved according to the abnormal information, and the reliability experiment board produced by the improved mold or equipment is tested again, so that the stability and reliability of the final LED product can meet the design requirements.

[0063] S3, according to the abnormal information, the abnormal source is confirmed.

[0064] Specifically, according to the abnormal information, that is, according to the coordinate position information corresponding to the abnormal lamp bead of the reliability experiment board and the production process information of the corresponding whole LED support, reverse investigation is performed to determine the abnormal source, so that the abnormal position can be improved.

[0065] In order to better understand, the lamp bead coordinate information on the PCB experiment board is defined as X axis 1, 2, 3, 4, …, Y axis 1, 2, 3, 4, … for example, and in actual use, the lamp bead coordinate information on the PCB experiment board can also be defined in other forms such as letters, and the present embodiment will not be expanded here.

[0066] If an abnormal situation occurs to the (3,4) lamp bead of the reliability test board during the experiment, it indicates that the lamp bead at the 3rd row and the 4th column of the reliability test board is abnormal, and in combination with the production process information on the whole LED support, it can be determined which mold and which production equipment of the whole LED support are abnormal, and it can also be determined that an abnormality occurs when the lamp bead at the 3rd row and the 4th column is packaged, and then the abnormal information can be reversely investigated to determine the abnormal source.

[0067] Those skilled in the art should understand that the above description is provided in combination with specific content, and the specific implementation of the present application is not limited to these descriptions. Since the industry naming is not the same, it is not limited to the above naming, and it is not limited to the English naming. Any method, structure, etc. similar to or identical to the present application, or any technical deduction or replacement under the premise of the concept of the present application, should be considered within the protection scope of the present application.

Claims

1. An abnormality trace method of an LED product reliability test board, characterized by, The application relates to a method for determining the abnormality source of a reliability experiment board. The method comprises the following steps: Preparation of a reliability experiment board provided with traceable information of previous process abnormalities; Reliability experiment of the reliability experiment board, determination of the experimental state of the reliability experiment board, and recording of abnormal information of abnormal positions on the reliability experiment board according to the traceable information when the experimental state is an abnormal state; Confirmation of the abnormal source according to the abnormal information. The step of preparing the reliability experiment board comprises the following steps: Preparation of a whole LED support; Preparation of a PCB experiment board corresponding to the lamp bead position of the whole LED support; 2. The abnormality tracing method of an LED product reliability experiment board according to claim 1, wherein One-to-one placement of the lamp beads of the whole LED support and the lamp bead coordinate positions of the PCB experiment board, and overall packaging to obtain the reliability experiment board.

3. The method of claim 1, wherein the LED product reliability board abnormality trace method is characterized by, The traceable information comprises production process information of the whole LED support and lamp bead coordinate position information of the PCB experiment board.

4. The method of claim 1, wherein the LED product reliability board abnormality trace method is characterized by, The abnormal information comprises coordinate position information of abnormal lamp beads and production process information of the corresponding whole LED support. Before the step of reliability experiment of the reliability experiment board and determination of the experimental state of the reliability experiment board, the method further comprises the following step:

5. The method of claim 4, wherein the LED product reliability board abnormality trace method is characterized by, Abnormality test before the reliability experiment of the reliability experiment board. The abnormality test before the reliability experiment of the reliability experiment board comprises the following steps: Electrical test of the reliability experiment board; 6. The method of claim 1, wherein the method further comprises: If abnormal conditions such as dimness or dead lamp of the lamp beads occur, the reliability experiment board is unqualified. The step of reliability experiment of the reliability experiment board and determination of the experimental state of the reliability experiment board comprises the following steps: When the reliability experiment board reaches a corresponding experimental node, the reliability experiment board is subjected to electrical test again; 7. The method of claim 6, wherein the LED product reliability board abnormality trace method is characterized by, If abnormal conditions such as dimness or dead lamp of the lamp beads occur, the experimental state of the reliability experiment board is an abnormal state. The reliability experiment is a preset experimental time interval or a specific experimental condition.

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