Liquid cooling heat dissipation assembly and server device
By designing a liquid-cooled cooling component for servers, the traditional air-cooled server has solved the problems of high energy consumption, high noise and low heat dissipation efficiency, and efficient heat dissipation of the central processor, voltage regulator and dual inline memory modules is achieved, reducing system energy consumption and noise.
Patent Information
- Application Number
- CN202510273722.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-07
- Publication Date
- 2025-05-30
AI Technical Summary
Traditional air-cooled servers have high energy consumption, high noise and low heat dissipation efficiency, making it difficult to effectively solve the heat dissipation problems of CPU, DIMM and power supply modules.
A liquid-cooled heat dissipation component is designed, including a processor cold plate, a liquid inlet water collection pipe and a memory cold plate. By forming a cooling flow path, the coolant flows through the processor cold plate, a liquid inlet water collection pipe and a memory cold plate in sequence, realizing synchronous heat dissipation of the central processor, voltage regulator and dual inline memory module.
Through the design of liquid-cooled cooling components, the heat dissipation efficiency of the server is significantly improved, the energy consumption and noise of the system are reduced, and the performance is more stable and the service life is longer.
Smart Images
Figure CN120066219A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of computer devices, and particularly to a liquid cooling heat dissipation component and a server device. Background Art
[0002] With the continuous development of artificial intelligence (AI), AI products emerge in an endless stream, and the market's demand for computing power is increasing day by day. To improve the computing speed, the performance of the server must be correspondingly improved. However, the chip computing power of high-performance servers is usually accompanied by higher power consumption, and high-performance chips require more efficient heat dissipation methods.
[0003] In recent years, countries around the world have actively promoted energy conservation and carbon reduction, making the energy consumption problem of data centers a major concern. Traditional air-cooled servers mainly rely on high-speed rotating fans to cool internal heat-generating components. However, this heat dissipation method not only has high energy consumption and high noise, but also has low heat dissipation efficiency. Among them, in traditional servers, the central processing unit (CPU) and the dual in-line memory module (DIMM) are usually the main high-power heat-generating components, and in an environment of high-power CPUs, the power supply module responsible for stable power supply (such as a voltage regulator, VR) usually generates more heat.
[0004] Therefore, how to effectively solve the heat dissipation problems of the CPU, DIMM, and power supply module has become an important direction in the current research on server heat dissipation technology. Summary of the Invention
[0005] Based on this, it is necessary to provide a liquid cooling heat dissipation component and a server device for the problems of high energy consumption, high noise, and low heat dissipation efficiency of air-cooled servers.
[0006] In a first aspect, a liquid cooling heat dissipation component is provided for cooling a central processing unit, a plurality of voltage regulators, and one or more dual in-line memory modules. The liquid cooling heat dissipation component includes:
[0007] At least one processor cold plate for thermally contacting the central processing unit and allowing a coolant to flow through;
[0008] At least one inlet liquid collecting pipe fluidly connected to at least one of the processor cold plates and for thermally contacting a plurality of the voltage regulators; and
[0009] At least one memory cold plate fluidly connected to at least one of the inlet liquid collecting pipes and for thermally contacting the one or more dual in-line memory modules;
[0010] Wherein, at least one of the processor cold plates, at least one of the liquid inlet header pipes, and at least one of the memory cold plates together form a cooling flow path for the coolant to sequentially flow through at least one of the processor cold plates, at least one of the liquid inlet header pipes, and at least one of the memory cold plates in the cooling flow path.
[0011] In a second aspect, a server device is provided, comprising:
[0012] A main board;
[0013] A central processing unit disposed on the main board;
[0014] A plurality of voltage regulators disposed on the main board;
[0015] One or more dual in-line memory modules disposed on the main board; and
[0016] A liquid cooling heat dissipation assembly, comprising:
[0017] At least one processor cold plate, in thermal contact with the central processing unit and for allowing a coolant to flow therethrough;
[0018] At least one liquid inlet header pipe, fluidly connected to at least one of the processor cold plates and in thermal contact with a plurality of the voltage regulators; and
[0019] At least one memory cold plate, fluidly connected to at least one of the liquid inlet header pipes and in contact with the one or more dual in-line memory modules;
[0020] Wherein, at least one of the processor cold plates, at least one of the liquid inlet header pipes, and at least one of the memory cold plates together form a cooling flow path for the coolant to sequentially flow through at least one of the processor cold plates, at least one of the liquid inlet header pipes, and at least one of the memory cold plates in the cooling flow path.
[0021] The above liquid cooling heat dissipation assembly and server device can effectively dissipate heat from the central processing unit, voltage regulators, and dual in-line memory modules synchronously through an integrated liquid cooling heat dissipation assembly design. Among them, the processor cold plate is in thermal contact with the central processing unit, the memory cold plate is in thermal contact with the dual in-line memory module, and the liquid inlet header pipe is in thermal contact with the voltage regulator. A cooling flow path is formed among the processor cold plate, the liquid inlet header pipe, and the memory cold plate for the coolant to sequentially flow through the processor cold plate, the liquid inlet header pipe, and the memory cold plate in the cooling flow path, so as to effectively dissipate heat from the central processing unit, voltage regulators, and dual in-line memory modules synchronously. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] Figure 1 FIG. is a partial perspective view of a server device according to an embodiment of the present invention.
[0023] Figure 2 for Figure 1 Schematic diagram of an exploded view of a server device.
[0024] Figure 3 for Figure 1 A schematic top view of a server device.
[0025] Figure Number:
[0026] 1. Server device; 6. Dual in-line memory module; 7. Voltage regulator; 8. Central processing unit; 9. Motherboard; 10. Liquid cooling component;
[0027] 110, processor cold plate; 111, memory cold plate; 112, flow manifold; 113, liquid inlet water collecting pipe; 114, heat sink; 115, thermal pad; 116, liquid outlet water collecting pipe; 117, flow collecting manifold;
[0028] P1, main liquid inlet pipe; P2, diversion pipe; P3, connecting pipe; P4, collecting pipe; P5, main liquid outlet pipe. DETAILED DESCRIPTION
[0029] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.
[0030] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.
[0031] In addition, if the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In the description of this application, if the term "plural" appears, the meaning of "plural" is at least two, such as two, three, etc., unless otherwise specifically defined.
[0032] In this application, unless otherwise clearly specified and defined, if terms such as "installed", "connected", "linked", "fixed", etc. appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0033] In this application, unless otherwise clearly specified and defined, if there is a description such as a first feature being "on" or "under" a second feature, its meaning can be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature can be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature can be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.
[0034] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or there can also be an intermediate element. If an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. If so, the terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used in this application are only for illustrative purposes and do not represent the only implementation.
[0035] Please refer to Figures 1 to 3 , Figure 1 a partial perspective view of a server device according to an embodiment of the present invention, Figure 2 is Figure 1 an exploded view of the server device of Figure 3 and Figure 1 is a top view of the server device of
[0036] The server device 1 of this embodiment includes a main board 9, two central processing units 8, multiple voltage regulators 7, multiple dual in-line memory modules 6, and a liquid cooling heat dissipation component 10. The central processing units 8, the voltage regulators 7, and the dual in-line memory modules 6 are all arranged on the main board 9. The liquid cooling heat dissipation component 10 is used to cool these central processing units 8, these voltage regulators 7, and these dual in-line memory modules 6.
[0037] The liquid cooling heat dissipation component 10 may include two processor cold plates 110, multiple memory cold plates 111, a flow splitting manifold 112, two inlet liquid collecting pipes 113, two heat dissipation plates 114, multiple thermal conductive pads 115, two outlet liquid collecting pipes 116, and a liquid collecting manifold 117.
[0038] These processor cold plates 110 are respectively in thermal contact with these central processing units 8 and are used for a coolant to flow through, and these memory cold plates 111 are in thermal contact with these dual in-line memory modules 6 and are used for the coolant to flow through.
[0039] The flow splitting manifold 112 is in fluid communication with a coolant distribution unit (Coolant Distribution Unit, CDU, not shown) through a main inlet liquid pipe P1, and is respectively in fluid communication with these two processor cold plates 110 through two flow splitting pipes P2 in a parallel design manner. The flow splitting manifold 112 is used to split the coolant flowing in from the main inlet liquid pipe P1, and guide the coolant to these two processor cold plates 110 through these two flow splitting pipes P2, so as to effectively dissipate the heat of these central processing units 8. In an exemplary embodiment, the coolant distribution unit may include a heat exchanger for cooling the coolant.
[0040] These two processor cold plates 110 are respectively in fluid communication with the corresponding inlet liquid collecting pipes 113 through a communication pipe P3, so that the coolant can flow from the processor cold plates 110 into the inlet liquid collecting pipes 113. Among them, these two inlet liquid collecting pipes 113 are respectively in thermal contact with some of the voltage regulators 7 to effectively dissipate the heat of these voltage regulators 7.
[0041] In this embodiment, these two liquid inlet header pipes 113 are in thermal contact with the voltage regulator 7 through the heat dissipation plates 114 and the thermal pads 115. Specifically, these two heat dissipation plates 114 are respectively in thermal contact with these two liquid inlet header pipes 113 and are respectively in thermal contact with the voltage regulator 7. Moreover, these thermal pads 115 are provided between the corresponding liquid inlet header pipes 113 and the heat dissipation plates 114, and these thermal pads 115 are thermally coupled to the liquid inlet header pipes 113 and the heat dissipation plates 114. Thereby, the heat generated by the voltage regulator 7 can be transferred to the liquid inlet header pipes 113 in a heat conduction manner through the thermal pads 115 and the heat dissipation plates 114, and then the heat is carried away by the coolant flowing through the liquid inlet header pipes 113, so as to effectively dissipate the heat of the voltage regulator 7. Among them, the heat dissipation plates and the thermal pads can be selected, and the present invention is not limited thereto.
[0042] These liquid inlet header pipes 113 and these liquid outlet header pipes 116 are respectively located at opposite ends of these memory cold plates 111 and are in fluid communication with these memory cold plates 111. In other words, these memory cold plates 111 are connected and located between the liquid inlet header pipes 113 and the liquid outlet header pipes 116. Among them, these liquid inlet header pipes 113 are used to divide the coolant flowing in from the communication pipe P3 and guide the coolant to each memory cold plate 111, so as to effectively dissipate the heat of these dual in-line memory modules 6 through these memory cold plates 111.
[0043] These liquid outlet header pipes 116 are used to collect the coolant in these memory cold plates 111 and are respectively in fluid communication with the manifold 117 through two collecting pipes P4. The manifold 117 is used to collect the coolant flowing in from these two collecting pipes P4 and is in fluid communication with the coolant distribution unit through a main liquid outlet pipe P5, so as to guide the coolant from the liquid outlet header pipes 116 to the coolant distribution unit. Among them, the heat exchanger of the coolant distribution unit can cool the coolant.
[0044] Through the above configuration, a cooling flow path can be formed between the processor cold plate 110, the liquid inlet header pipes 113, and the memory cold plates 111, so that the coolant sequentially flows through the processor cold plate 110, the liquid inlet header pipes 113, and the memory cold plates 111 in the cooling flow path, thereby effectively dissipating the heat of the central processing unit 8, the voltage regulator 7, and the dual in-line memory modules 6 synchronously.
[0045] In this embodiment, the liquid outlet collecting pipe 116 can also be in thermal contact with some of the voltage regulators 7 to effectively dissipate the heat of these voltage regulators 7. In addition, the liquid outlet collecting pipe 116 can also be in thermal contact with the voltage regulators 7 through a heat dissipation plate and a thermal conductive pad. Thereby, the heat generated by the voltage regulators 7 can be transferred to the liquid outlet collecting pipe 116 in a heat conduction manner through the thermal conductive pad and the heat dissipation plate, and then the heat is carried away by the coolant flowing through the liquid outlet collecting pipe 116, so as to effectively dissipate the heat of the voltage regulators 7. Thus, as Figure 3 shown, the processor cold plate 110, the liquid inlet collecting pipe 113, the memory cold plate 111, and the liquid outlet collecting pipe 116 can jointly form a cooling flow path for the coolant to sequentially flow through the processor cold plate 110, the liquid inlet collecting pipe 113, the memory cold plate 111, and the liquid outlet collecting pipe 116 in the cooling flow path, so as to effectively dissipate the heat of the central processing unit 8, the voltage regulators 7, and the dual in-line memory module 6 synchronously.
[0046] The total liquid inlet pipe P1 and the total liquid outlet pipe P5 of this embodiment can be polytetrafluoroethylene (PTFE) corrugated pipes, but the present invention is not limited thereto. In addition, the total liquid inlet pipe P1 and the total liquid outlet pipe P5 can be connected to the coolant distribution unit through UQD04 quick connectors (not otherwise labeled).
[0047] The flow splitting manifold 112 and the flow collecting manifold 117 of this embodiment can be stainless steel manifolds, but the present invention is not limited thereto. In addition, the flow splitting pipe P2 can be connected to the flow splitting manifold 112 through a UQD02 quick connector, and the flow collecting pipe P4 can be connected to the flow collecting manifold 117 through a UQD02 quick connector (not otherwise labeled). Among them, a set of quick connectors consists of two parts, namely a male head and a female head. The male head includes a spring washer, and there can be a trapezoidal boss at the connection to provide strengthening and fixing effects. The female head can be composed of a main body, a nozzle, and a quick-twist nut. The main body and the nozzle are firmly connected through a boss structure. The nozzle has a layer of pagoda structure to enhance the connection strength. There are multiple turns of threads behind the pagoda, and the hose is fastened to the nozzle through the quick-twist nut, making the installation convenient. Thereby, the structure of the quick connector is simple and easy to disassemble and repair.
[0048] The materials of the processor cold plate 110 and the heat dissipation plate 114 of this embodiment can be copper, but the present invention is not limited thereto. Additionally, the material of the memory cold plate 111 can be stainless steel, but the present invention is not limited thereto.
[0049] In this embodiment, the pipe fittings can be connected to the cold plate, the manifold, and the water collecting pipe by using the fixed method of a flare fitting. For example, the main liquid inlet pipe P1 and the shunt manifold 112 can be connected by a flare fitting, and the processor cold plate 110 and the shunt pipe P2 can also be connected by a flare fitting. The flare fitting can adopt a model with a nut for locking. The flare fitting nozzle is provided with three layers of flares, which have a large joint area, strong bearing capacity, and high connection strength. Under the action of repeated loads, there will be no loosening and displacement phenomenon. The multi-turn thread behind the flare layer can cooperate with a quick-release nut to fix the hose to strengthen the fastening effect.
[0050] The present invention is not limited to the number of the processor cold plate, the memory cold plate, the liquid inlet water collecting pipe, and the liquid outlet water collecting pipe. In different embodiments of the present invention, the number of these components can be adjusted to be single or multiple according to actual design requirements. For example, the number of processor cold plates can be adjusted according to the number of central processing units to be cooled.
[0051] According to the liquid cooling heat dissipation component and the server device including the same in the above embodiment, through the integrated liquid cooling heat dissipation component design scheme, the central processing unit, the voltage regulator, and the dual in-line memory module can be effectively cooled synchronously. Among them, the processor cold plate is in thermal contact with the central processing unit, the memory cold plate is in thermal contact with the dual in-line memory module, and the liquid inlet water collecting pipe and the liquid outlet water collecting pipe are in thermal contact with the voltage regulator. A cooling flow path is formed among the processor cold plate, the liquid inlet water collecting pipe, the memory cold plate, and the liquid outlet water collecting pipe, so that the coolant sequentially flows through the processor cold plate, the liquid inlet water collecting pipe, the memory cold plate, and the liquid outlet water collecting pipe in the cooling flow path, thereby effectively cooling the central processing unit, the voltage regulator, and the dual in-line memory module synchronously.
[0052] In addition, compared with the traditional server using air cooling, the liquid cooling heat dissipation component and the server device including the same disclosed in the present invention adopt a liquid cooling solution, and its heat conduction performance is 15 to 25 times that of the air cooling solution, which can achieve heat dissipation with a higher heat flux density, can cope with high-power central processing units, dual in-line memory modules, and voltage regulators, and has more stable performance and longer service life.
[0053] Moreover, compared with the traditional server using air cooling, the liquid cooling heat dissipation component and the server device including the same disclosed in the present invention have a more compact liquid cooling system design, dissipate heat by liquid flow, are not limited by space, and have a better heat dissipation effect.
[0054] Furthermore, for traditional servers that only use air cooling, the central processing unit, dual in-line memory modules, and voltage regulators are often difficult points for heat dissipation and often participate in fan speed control, thus becoming risk points for heat dissipation control speed. The liquid cooling heat dissipation component disclosed in the present invention and the server device including the same have a liquid cooling design that can cover the heat sources on the motherboard to a great extent, can well solve this problem, and thus reduce the power consumption of the system fan. In addition, compared with the liquid cooling solution with a cold plate only on the central processing unit, the power consumption of the fan of the liquid cooling heat dissipation component and the server device disclosed in the present invention can be reduced by up to 20%.
[0055] When performing simulation tests on the liquid cooling heat dissipation component and the server device including the same in the above embodiments, system simulations are respectively performed with the inlet temperature of the coolant being 40°C and the flow rate being 1.2L / min and 1.6L / min, and the inlet temperature of the coolant being 47°C and the flow rate being 1.6L / min and 2L / min. Among them, the power consumption of the central processing unit (CPU) is 600W, the power consumption of the dual in-line memory module (DIMM) is 16.08W, and the power consumption of the voltage regulator (VR) is 98.142W. The simulation results show that the highest temperatures of these central processing units are from 63.1°C to 70.1°C, all lower than the specified 72°C, the temperatures of these dual in-line memory modules are from 61.7°C to 67.7°C, all lower than the specified 75°C, and the temperatures of the voltage regulators are from 65.4°C to 72.4°C, also lower than the specified 90°C. It can be seen from this that the simulation results meet the specification requirements of each component and have sufficient margins.
[0056] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope recorded in this specification.
[0057] The above-described embodiments only represent several implementation manners of the present application. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the patent application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several deformations and improvements can still be made, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.
Claims
1. A liquid cooling heat sink assembly for cooling a central processing unit, a plurality of voltage regulators and one or more dual in-line memory modules, characterized in that: The liquid cooling heat dissipation component comprises: At least one processor cold plate, used for thermally contacting the central processing unit and for circulating a cooling liquid; at least one inlet header in fluid communication with at least one of the processor cold plates and configured to thermally contact a plurality of the voltage regulators; and at least one memory cold plate in fluid communication with at least one of the inlet headers and configured to thermally contact the one or more dual in-line memory modules; Among them, at least one processor cold plate, at least one liquid inlet collecting pipe and at least one storage cold plate together form a cooling flow path, so that the coolant can flow through at least one processor cold plate, at least one liquid inlet collecting pipe and at least one storage cold plate in sequence in the cooling flow path.
2. The liquid cooling heat dissipation assembly according to claim 1, characterized in that: The liquid cooling heat dissipation assembly further includes at least one heat dissipation plate, wherein at least one heat dissipation plate is used for thermally contacting at least one liquid inlet manifold and a plurality of voltage regulators.
3. The liquid cooling heat dissipation assembly according to claim 2, characterized in that: The liquid cooling heat dissipation component further includes at least one thermal conductive pad, wherein the at least one thermal conductive pad is thermally coupled and disposed between the at least one liquid inlet collecting pipe and the at least one heat dissipation plate.
4. The liquid cooling heat dissipation assembly according to claim 1, characterized in that: The liquid-cooling heat dissipation component also includes at least one liquid outlet collecting pipe, wherein the at least one liquid outlet collecting pipe and the at least one liquid inlet collecting pipe are respectively located at opposite ends of the at least one storage cold plate and are fluidly connected to the at least one storage cold plate, and the at least one liquid outlet collecting pipe is used for thermally contacting a plurality of the voltage regulators, and the at least one processor cold plate, the at least one liquid inlet collecting pipe, the at least one storage cold plate and the at least one liquid outlet collecting pipe jointly form the cooling flow path, so that the coolant flows sequentially through the at least one processor cold plate, the at least one liquid inlet collecting pipe, the at least one storage cold plate and the at least one liquid outlet collecting pipe in the cooling flow path.
5. The liquid cooling heat dissipation assembly according to claim 4, characterized in that: The liquid cooling heat dissipation assembly further includes a flow distribution manifold and a flow collection manifold, wherein at least one of the processor cold plates includes two processor cold plates, at least one of the memory cold plates includes a plurality of memory cold plates, at least one of the liquid inlet manifold includes two liquid inlet manifolds, and at least one of the liquid outlet manifold includes two liquid outlet manifolds; Wherein, the diverter manifold is used to connect a heat exchanger through a total liquid inlet pipe fluid, the diverter manifold is respectively connected to the two processor cold plates through two diverter pipes, the two processor cold plates are respectively connected to the two liquid inlet collecting pipes through two connecting pipes, a plurality of storage cold plates are connected between the two liquid inlet collecting pipes and the two liquid outlet collecting pipes, the two liquid outlet collecting pipes are respectively connected to the collecting manifold through two collecting pipes, and the collecting manifold is used to connect the heat exchanger through a total liquid outlet pipe fluid.
6. A server device, characterized in that: include: A motherboard; A central processing unit, disposed on the mainboard; A plurality of voltage regulators are arranged on the mainboard; One or more dual in-line memory modules, arranged on the mainboard; as well as A liquid cooling heat dissipation component, comprising: At least one processor cold plate, in thermal contact with the central processor and for circulating a cooling fluid; at least one liquid inlet header in fluid communication with at least one of the processor cold plates and in thermal contact with a plurality of the voltage regulators; as well as at least one memory cold plate in fluid communication with at least one of the inlet headers and in contact with the one or more dual in-line memory modules; Among them, at least one processor cold plate, at least one liquid inlet collecting pipe and at least one storage cold plate together form a cooling flow path, so that the coolant can flow through at least one processor cold plate, at least one liquid inlet collecting pipe and at least one storage cold plate in sequence in the cooling flow path.
7. The server device according to claim 6, characterized in that: The liquid cooling heat dissipation component further includes at least one heat dissipation plate, and at least one heat dissipation plate is in thermal contact with at least one liquid inlet manifold and a plurality of the voltage regulators.
8. The server device according to claim 7, characterized in that: The liquid cooling heat dissipation component further includes at least one thermal conductive pad, and the at least one thermal conductive pad is thermally coupled and arranged between at least one liquid inlet collecting pipe and at least one heat dissipation plate.
9. The server device according to claim 6, characterized in that: The liquid-cooling heat dissipation component also includes at least one liquid outlet water collecting pipe, at least one liquid outlet water collecting pipe and at least one liquid inlet water collecting pipe are respectively located at opposite ends of at least one storage cold plate and fluidly connected to at least one storage cold plate, at least one liquid outlet water collecting pipe thermally contacts a plurality of the voltage regulators, and at least one processor cold plate, at least one liquid inlet water collecting pipe, at least one storage cold plate and at least one liquid outlet water collecting pipe jointly form the cooling flow path, so that the coolant flows sequentially through at least one processor cold plate, at least one liquid inlet water collecting pipe, at least one storage cold plate and at least one liquid outlet water collecting pipe in the cooling flow path.
10. The server device according to claim 9, characterized in that: The liquid cooling heat dissipation assembly further includes a flow distribution manifold and a flow collection manifold, the at least one processor cold plate includes two processor cold plates, the at least one memory cold plate includes a plurality of memory cold plates, the at least one liquid inlet water collecting pipe includes two liquid inlet water collecting pipes, and the at least one liquid outlet water collecting pipe includes two liquid outlet water collecting pipes; Wherein, the diversion manifold is fluidically connected to a heat exchanger through a total liquid inlet pipe, the diversion manifold is fluidically connected to the two processor cold plates through two diversion pipes, the two processor cold plates are fluidically connected to the two liquid inlet collecting pipes through two connecting pipes, a plurality of storage cold plates are connected between the two liquid inlet collecting pipes and the two liquid outlet collecting pipes, the two liquid outlet collecting pipes are fluidically connected to the collecting manifold through two collecting pipes, and the collecting manifold is fluidically connected to the heat exchanger through a total liquid outlet pipe.