Ball grid array simulation analysis method and device, electronic equipment and storage medium

Abstract

The invention provides a ball grid array simulation analysis method and device, electronic equipment and a storage medium, and is applied to the technical field of computers.The method comprises the steps that after an initial ball grid array model comprising a solder ball model, a via hole model and a signal backflow plane is established, a test signal is applied to the initial ball grid array model; obtaining a first impedance test result of the initial ball grid array model in a target liquid cooling environment, creating a bonding pad model, connecting the bonding pad model with the initial ball grid array model to obtain a target ball grid array model, and applying a test signal to the target ball grid array model to obtain a first impedance test result of the target ball grid array model; and obtaining a second impedance test result of the target ball grid array model in the target liquid cooling environment, and correcting the target ball grid array model according to the first impedance test result and the second impedance test result. The method can perform simulation analysis on the operation performance of the ball grid array in the liquid cooling environment, and corrects the ball grid array model through the simulation analysis result, thereby improving the accuracy of the operation performance of the ball grid array. And it is ensured that the BGA can meet performance requirements in a liquid cooling operation environment.

Description

Technical Field

[0001] This application relates to the field of computer technology, and particularly to a method, device, electronic device and storage medium for ball grid array simulation analysis. Background Art

[0002] With the continuous development of computer technology, new generation high-performance servers have been widely used. While providing users with more excellent computing power services, high-performance servers also pose severe challenges to the thermal design cost of the servers.

[0003] The prior art uses the method of immersion liquid cooling to solve the heat dissipation problem of high-performance servers, which can better balance server performance and thermal design cost. However, the prior art often focuses on improving the thermal efficiency of immersion liquid cooling, and there is a lack of research on the operating performance analysis of the ball grid array (BGA) where the server is directly exposed to the liquid cooling environment, making it difficult to effectively evaluate the impact of the operation of the BGA in the liquid cooling environment on the signal integrity of the server system. Therefore, how to perform simulation analysis on the operating performance of the BGA in the liquid cooling environment has become one of the problems that need to be urgently solved by those skilled in the art. Summary of the Invention

[0004] In view of this, this application is committed to providing a method, device, electronic device and storage medium for ball grid array simulation analysis, performing simulation analysis on the BGA and correcting the BGA according to the analysis results to ensure that the BGA can meet the performance requirements in the liquid cooling operating environment.

[0005] In a first aspect, this application provides a method for ball grid array simulation analysis, including: Creating an initial ball grid array model, where the initial ball grid array model includes a solder ball model and a via model and a signal return plane respectively connected to the solder ball model; Applying a test signal to the initial ball grid array model and obtaining a first impedance test result of the initial ball grid array model in a target liquid cooling environment; Creating a pad model and connecting the pad model to the initial ball grid array model to obtain a target ball grid array model; Applying the test signal to the target ball grid array model and obtaining a second impedance test result of the target ball grid array model in the target liquid cooling environment; Correcting the target ball grid array model according to the first impedance test result and the second impedance test result.

[0006] In an optional implementation manner, correcting the target ball grid array model according to the first impedance test result and the second impedance test result includes: Determine the impedance deviation ranges of the first impedance test result and the second impedance test result relative to a preset target impedance respectively; Modify the target ball grid array model based on each of the impedance deviation ranges.

[0007] In an alternative embodiment, the impedance deviation range includes a first impedance deviation range corresponding to the first impedance test result and a second impedance deviation range corresponding to the second impedance test result; Modifying the target ball grid array model based on each of the impedance deviation ranges includes: If the first impedance deviation range is within a preset impedance deviation range and the second impedance deviation range is within the first impedance deviation range, determine that the ball grid array corresponding to the target ball grid array model is allowed to operate in the target liquid cooling environment; If the first impedance deviation range is not within the preset impedance deviation range, or the second impedance deviation range is not within the first impedance deviation range, adjust the structure of at least one of the solder ball model and the pad model.

[0008] In an alternative embodiment, the pad model includes a signal pad and a reflow pad; Adjusting the structure of the pad model includes: Create an insulating layer adjacent to the signal pad model according to the layout information of the target ball grid array; Set a hollowed-out area in the insulating layer.

[0009] In an alternative embodiment, creating the initial ball grid array model includes: Create a signal solder ball model, a reflow solder ball model, and a via model according to the layout information of the target ball grid array; Connect the first contact surface of the signal solder ball model to the via model; Create a signal return plane and connect the signal return plane to the reflow solder ball model.

[0010] In an alternative embodiment, the method provided in the first aspect of the present application further includes: Create a coaxial body and adjust the equivalent dielectric constant of the coaxial body so that the impedance of the coaxial body matches the target impedance of the test signal; Connect the coaxial body to the signal solder ball model according to a preset contact area.

[0011] In an alternative embodiment, the method provided in the first aspect of the present application further includes: creating a simulation signal source; Applying the test signal to the target ball grid array model includes: Control the simulation signal source to apply the test signal to the target ball grid array model.

[0012] In a second aspect, the present application provides a ball grid array simulation analysis device, including: A first modeling unit for creating an initial ball grid array model, where the initial ball grid array model includes a solder ball model and a via model and a signal return plane respectively connected to the solder ball model; A first test unit for applying a test signal to the initial ball grid array model and obtaining a first impedance test result of the initial ball grid array model in a target liquid cooling environment; A second modeling unit for creating a pad model and connecting the pad model to the initial ball grid array model to obtain a target ball grid array model; A second test unit for applying the test signal to the target ball grid array model and obtaining a second impedance test result of the target ball grid array model in the target liquid cooling environment; A correction unit for correcting the target ball grid array model according to the first impedance test result and the second impedance test result.

[0013] In a third aspect, the present application provides an electronic device, including a memory, a processor, and a computer program stored on the memory and executed by the processor. When the processor executes the computer program, the steps of the ball grid array simulation analysis method according to any one of the first aspects of the present application are implemented.

[0014] In a fourth aspect, the present application provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the steps of the ball grid array simulation analysis method according to any one of the first aspects of the present application are implemented.

[0015] Based on the above content, the ball grid array simulation analysis method provided by the present application, after creating an initial ball grid array model including a solder ball model, a via model, and a signal return plane, applies a test signal to the initial ball grid array model and obtains a first impedance test result of the initial ball grid array model in a target liquid cooling environment. Then, a pad model is created and connected to the initial ball grid array model to obtain a target ball grid array model. A test signal is applied to the target ball grid array model, and a second impedance test result of the target ball grid array model in the target liquid cooling environment is obtained. Finally, the target ball grid array model is corrected according to the first impedance test result and the second impedance test result. Through this method, the operating performance of the ball grid array in a liquid cooling environment can be simulated and analyzed, and the ball grid array model can be corrected through the simulation analysis result, so as to ensure that the BGA can meet the performance requirements in the liquid cooling operating environment.

[0016] Further, the initial ball grid array model provided by this method only includes solder balls and vias. Through the simulation analysis of the initial ball grid array model, the impedance information of the ideal ball grid array in the target liquid cooling environment can be obtained. Correspondingly, compared with the initial ball grid array, the target ball grid array model created by this method adds a pad model to restore the actual BGA structure. By analyzing the test results of the two models, the influence of the pad structure on the operating performance of the BGA can be intuitively determined, providing a reference basis for adjusting the pad structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0018] Figure 1 is a schematic flow chart of a ball grid array simulation analysis method provided by this application.

[0019] Figure 2 is a schematic structural diagram of the initial ball grid array model provided by this application.

[0020] Figure 3 is a schematic structural diagram of the target ball grid array model provided by this application.

[0021] Figure 4 is a schematic diagram of the effect of correcting the pad model according to the ball grid array simulation analysis method provided by this application.

[0022] Figure 5 is a schematic structural diagram of a ball grid array model simulation analysis device provided by this application.

[0023] Figure 6 is a schematic structural diagram of an electronic device provided by this application. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0024] The following will clearly and completely describe the technical solutions in the embodiments of this application with reference to the drawings in the embodiments of this application. Obviously, the described embodiments are only some embodiments of this application, rather than all embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of this application.

[0025] As described above, the prior art focuses on improving the thermal efficiency of immersion liquid cooling, and there is a lack of analysis on the operating performance of BGAs where the server is directly exposed to the liquid cooling environment. It is difficult to effectively evaluate the impact of the operation of BGAs in the liquid cooling environment on the signal integrity of the server system. Therefore, how to perform simulation analysis on the operating performance of BGAs in the liquid cooling environment has become one of the problems that need to be solved urgently by those skilled in the art.

[0026] To solve the above technical problems, the present application provides a ball grid array simulation analysis method, which creates an initial ball grid array model and obtains the first impedance test result of the initial ball grid array model in the target liquid cooling environment, and creates a target ball grid array model and obtains the second impedance test result of the target ball grid array model in the target liquid cooling environment. The target ball grid array model is corrected according to the first impedance test result and the second impedance test result, so as to realize the simulation analysis of the operating performance of the ball grid array in the liquid cooling environment, and correct the ball grid array model through the simulation analysis result, so as to ensure that the BGA can meet the performance requirements in the liquid cooling operating environment.

[0027] The ball grid array simulation analysis method provided by the present application is applied to an electronic device, which can be a local server, a laptop, a PC (personal computer), or other electronic devices that can run software programs and then execute the solder ball simulation analysis method provided by the present application. Of course, in some cases, it can also be a server on the network side.

[0028] See Figure 1 , the ball grid array simulation analysis method provided by the present application includes the following steps: S100. Create an initial ball grid array model.

[0029] In practical applications, the BGA includes pads, vias, and metal wires for connecting pads and vias. In addition, the structure directly related to the operating performance of the BGA also includes solder balls. According to different specific functions, the solder balls can be further divided into signal solder balls and reflow solder balls, which cooperate to provide a complete return path for the signals transmitted by the chip. Correspondingly, based on the classification of the solder balls, the pads can be further divided into signal pads and reflow pads, where the pads connected to the signal solder balls are signal pads, and the pads connected to the reflow solder balls are reflow pads. Of course, the BGA may also include other related structures, which can be implemented according to related technologies and will not be elaborated here one by one.

[0030] Considering that the BGA structure is relatively complex, the simulation analysis method provided by the present application splits the complete BGA, creates an initial ball grid array model containing only part of the structure and a target ball grid array model containing the complete structure, and simulates the two models respectively to obtain the corresponding impedance test results, and finally corrects the ball grid array based on the obtained impedance test results.

[0031] Based on the above core idea, in this step, an initial ball grid array model including partial structures is first created. Specifically, the initial ball grid array model provided in this embodiment includes a solder ball model, a via model, and a signal return plane that are respectively connected to the solder ball model. Based on the foregoing content, it can be known that the initial ball grid array model provided in this application mainly excludes the pad structure, aiming to analyze the performance parameters of the ball grid array in an ideal situation where the pad structure is not set.

[0032] In an alternative embodiment, the BGA is designed based on the BGA layout information in the chip design process. The BGA layout information includes the design information of each component structure of the BGA, such as the outer dimension, layout position, and connection relationship, etc. Based on this, a signal solder ball model, a reflow solder ball model, and a via model can be created according to the BGA layout information.

[0033] Specifically, as mentioned above, the signal solder ball and the reflow solder ball only have differences in specific functions and do not have obvious differences in the outer shape structure. Therefore, a signal solder ball model and a reflow solder ball model can be created based on the design information related to the solder ball recorded in the BGA layout information. In practical applications, the design information related to the solder ball includes the maximum center distance of the solder ball and the height after soldering. Of course, it can also include other information related to creating the solder ball model, which will not be elaborated one by one here. Without exceeding the core idea of this application, it also belongs to the scope protected by this application. As for the creation of the via model, it can also be completed according to the relevant information recorded in the BGA layout information, which will not be elaborated here.

[0034] After the creation of the solder ball model and the via model is completed, the first contact surface of the signal solder ball model can be connected to the via model according to the BGA layout information and the actual connection relationship of the BGA in the chip.

[0035] It should be noted that in the related art, when performing simulation analysis on the BGA, the simulation signal port used to output the test signal is usually directly connected to the signal solder ball model. This simulation method is likely to introduce the interference amount between the solder ball model and the simulation signal port, thus affecting the accuracy of the simulation result. To solve this problem, this application provides a preferred embodiment, that is, a coaxial body is created, and the simulation signal port and the signal solder ball model are connected through the coaxial body, that is, one end of the coaxial body is connected to the simulation signal port, and the other end is connected to the signal solder ball model. It should be emphasized that the coaxial body provided in this application is used to realize the signal transmission between the simulation signal port and the signal solder ball model, and the equivalent dielectric constant of the coaxial body is adjustable to meet the transmission requirements of different test signals.

[0036] It can be understood that in the actual structure of the BGA, there is no coaxial body provided. As mentioned above, the purpose of providing the coaxial body in this application is to eliminate the interference signals that may be introduced by the direct connection between the simulation signal port and the signal solder ball model. Therefore, it is necessary to further configure the coaxial body to achieve the above purpose. Before performing the simulation analysis, the test signals to be used have been determined. Based on this, the signal transmission rate and the preset target impedance corresponding to the test signals can be determined. For example, for the PCIe5.0 signal, its signal transmission rate is 32 Gbps, and the preset target impedance is 85 Ω. By configuring the equivalent dielectric constant of the coaxial body, the impedance of the coaxial body can be changed until the impedance of the coaxial body matches the target impedance of the test signal, that is, the deviation from the target impedance of the test signal is within the preset impedance deviation range (the ideal situation is that the two are the same). The coaxial body provided in this application is also an ideal conductor. By configuring the preset contact area and adjusting the equivalent dielectric constant, the energy loss generated during the transmission of the test signal on the coaxial body can be excluded, and the influence of the introduction of the coaxial body on the simulation results of the solder ball model can be avoided.

[0037] Combined with the subsequent content, it can be seen that this application may need to correct the size of the solder ball model according to the simulation analysis results. To ensure the accuracy of the analysis results, it is required that the size of the contact surface between the coaxial body and the signal solder ball model remains unchanged. Therefore, before connecting the coaxial body to the signal solder ball model, configure the preset contact area between the coaxial body and the signal solder ball model, and connect the coaxial body to the second contact surface of the signal solder ball model according to the preset contact area. It can be understood that the area of the second contact surface is the aforementioned preset contact area. Correspondingly, when adjusting the size of the signal solder ball model subsequently, keep the preset contact area unchanged. The specific value of the preset contact area can be determined by considering factors such as the impedance requirements of the test signal, the adjustment range of the equivalent node constant of the coaxial body, and the design dimensions of the signal solder ball model and the coaxial body. Any value that can meet the test requirements is optional and still falls within the scope of protection of this application without exceeding the core idea of this application. As for the length of the coaxial body, it can be determined according to the wavelength of the test signal and other factors, such as the distance between differential signal lines, which will not be elaborated here.

[0038] In the simulation analysis method provided in this application, the signal return plane is mainly used to cooperate with the signal simulation port to provide a complete signal transmission path for the test signal. Similar to the aforementioned coaxial body, the signal return plane provided in this application is an ideal conductor, and no loss will occur when the test signal is transmitted in it, and the signal return plane will not introduce any impurity signals.

[0039] The composition structure of the BGA also includes reflow solder balls. It can be understood that any signal corresponds to a reference ground, and a corresponding signal transmission loop is required to complete the transmission. This is exactly the function of the reflow solder balls, that is, to provide a reference ground and cooperate with the signal solder balls to form a signal transmission loop.

[0040] According to the above content, the signal return plane can be created based on the reflow solder ball model, that is, the signal return plane is connected to the reflow solder ball model, so as to realize the functions of providing a reference ground and a signal return path through the reflow solder ball model.

[0041] Based on the layout information of the BGA, it can be known that there is no fixed rule for the layout of the reflow solder balls and the signal solder balls. Therefore, for any signal solder ball, it may need to cooperate with a reflow solder ball at a relatively far distance to complete signal transmission. If the signal return plane is created according to the actual layout of the signal solder balls and the reflow solder balls, it may lead to an overly complex model structure and have no positive impact on the simulation results. Based on this, in the simulation analysis method provided in this application, when creating any of the foregoing signal return planes, first, according to the layout information of the BGA structure, determine whether there is a reflow solder ball within a preset range centered on the signal solder ball. If there is a reflow solder ball within the preset range, create a reflow solder ball model corresponding to the reflow solder ball according to the BGA layout information, and create a signal return plane based on the reflow solder ball model. On the contrary, if there is no reflow solder ball within the preset range, in order to avoid creating a signal return plane with an overly complex structure and a too long path, first create a reflow solder ball model within the preset range, and create a signal return plane based on the newly created reflow solder ball model, so as to better realize the test signal transmission. As for the size of the preset range, it can be considered in combination with factors such as the layout information of the BGA and the complexity of the model. The specific setting of the preset range in this application is not limited.

[0042] So far, all the creation work of the initial ball grid array model has been completed. The obtained initial ball grid array model can be seen Figure 2 As shown, the coaxial body is connected to the second contact surface of the signal solder ball model. The first contact surface of the signal solder ball model is connected to the via hole, and the other end of the via hole is connected to the relevant metal wire in the BGA. In addition, the initial ball grid array model also includes a reflow solder ball model and corresponding via holes, and the foregoing signal return plane is not shown.

[0043] S110: Apply a test signal to the initial ball grid array model and obtain the first impedance test result of the initial ball grid array model in the target liquid cooling environment.

[0044] After the creation of the initial ball grid array model is completed, a test signal can be applied to the initial ball grid array to perform passive simulation on the initial ball grid array model, and the group pit test results of the initial ball grid array model in the target liquid cooling environment can be obtained to get the first impedance test result.

[0045] In an alternative embodiment, a simulation signal port can be created or called, and the simulation signal port is connected to the coaxial body and the signal return plane to obtain a complete signal transmission path, and a test signal is applied to the initial ball grid array model through the simulation signal port to obtain the first impedance test result of the initial ball grid array model in the target liquid cooling environment. During the actual test process, the simulation of different operating environments can be changed by configuring the parameters of the test scenario. In this step, the target liquid cooling operating environment is simulated according to the parameters of the target liquid cooling. The specific process of simulating the target liquid cooling environment can be implemented with reference to the related technology and will not be elaborated here.

[0046] In an alternative embodiment, the first impedance test result can be characterized by a first curve, which records the process of the test impedance of the initial ball grid array model changing with time during the test. For example, the abscissa of the first curve records the test time, and the ordinate represents the test impedance corresponding to each test time. It can be understood that through the first curve, the trend of the test impedance of the initial ball grid array model changing with the test time can be seen. At the same time, the maximum and minimum values of the test impedance of the initial ball grid array model during the entire test cycle can also be obtained.

[0047] S120. Create a pad model and connect the pad model to the initial ball grid array model to obtain a target ball grid array model.

[0048] As mentioned above, a complete BGA structure includes pads. Based on the connection relationship between the pads and the solder balls and the functions of the pads, the pads can be divided into signal pads and return pads. Based on this, in this step, a signal pad model and a return pad model need to be created respectively.

[0049] Furthermore, based on the connection relationship between the pads and the solder balls recorded in the BGA layout information, the obtained signal pad model and return pad model are respectively connected to the initial ball grid array model to obtain a target ball grid array model that is consistent with the actual BGA structure.

[0050] See Figure 3 shown. Compared with Figure 2 the provided initial ball grid array model, Figure 3 the target ball grid array model shown also includes the newly added signal pad model and return pad model.

[0051] S130. Apply a test signal to the target ball grid array model and obtain the second impedance test result of the target ball grid array model in the target liquid cooling environment.

[0052] Referring to the process of obtaining the first set of pit test results described above, apply a test signal to the target ball grid array model, perform a passive test on the target ball grid array model, and obtain the impedance test result of the target ball grid array model in the target liquid cooling environment as the second impedance test result.

[0053] Referring to the first impedance test result described above, the second impedance test result obtained in this step can be characterized by a second curve, which records the process of the test impedance of the target ball grid array model changing with time during the test. For example, the abscissa of the second curve records the test time, and the ordinate represents the test impedance corresponding to each test time. It can be understood that through the second curve, the trend of the test impedance of the target ball grid array model changing with the test time can be seen. At the same time, the maximum and minimum values of the test impedance of the target ball grid array model during the entire test cycle can also be obtained.

[0054] S140. Modify the target ball grid array model according to the first impedance test result and the second impedance test result.

[0055] When determining the test signal, the target impedance of the test signal can be determined accordingly. Therefore, the target impedance corresponding to the test signal can be used as the preset target impedance. After determining the first impedance test result and the second impedance test result, the impedance deviation ranges of the first impedance test result and the second impedance test result relative to the preset target impedance can be determined respectively.

[0056] Taking the first impedance test result as an example, it records the maximum and minimum values of the test impedance of the initial ball grid array model in the target liquid cooling environment. Based on the obtained maximum and minimum values and the preset target impedance, the impedance deviation range of the initial ball grid array model in the target liquid cooling environment compared with the preset target impedance can be determined as the first impedance deviation range. Correspondingly, the impedance deviation range of the target ball grid array model in the target liquid cooling environment compared with the preset target impedance can also be obtained as the second impedance deviation range.

[0057] Furthermore, the target ball grid array model can be modified based on the first impedance deviation range and the second impedance deviation range.

[0058] Specifically, if the first impedance deviation range is within the preset impedance deviation range and the second impedance deviation range is within the first impedance deviation range, it indicates that the impact of the pad on the ball grid array is small. Even after adding the pad, the impedance performance of the ball grid array in the target liquid cooling environment can be optimized. Based on this, it can be determined that the ball grid array corresponding to the target ball grid array model is allowed to operate in the target liquid cooling environment, and there is no need to optimize the structure of the ball grid array any further.

[0059] On the contrary, if the first impedance deviation range is not within the preset impedance deviation range, it indicates that even in the ideal case without pads, the ball grid array is difficult to meet the performance requirements for operation in the target liquid cooling environment. Or, if the second impedance deviation range is not within the first impedance deviation range (regardless of whether the first impedance deviation range is within the preset impedance deviation range), it indicates that the impact of the pad on the operation of the ball grid array in the target liquid cooling environment is large, and the ball grid array cannot meet the performance requirements for operation in the target liquid cooling environment when the pad is set. At this time, the BGA structure needs to be optimized.

[0060] It can be seen from the foregoing analysis process that whether the first impedance deviation range is within the preset impedance deviation range has a great impact on the subsequent analysis process. Therefore, as a preferred implementation manner, it is first necessary to determine whether the first impedance deviation range is within the preset impedance deviation range. If the first impedance deviation range is within the preset impedance deviation range, then the subsequent judgment of the relationship between the second impedance deviation range and the first impedance deviation range can be carried out. If the first impedance deviation range is not within the preset impedance deviation range, then the judgment of the relationship between the second impedance deviation range and the first impedance deviation range can be omitted, and the target ball grid array model can be directly optimized and adjusted.

[0061] As for the specific setting of the foregoing preset impedance deviation range, it can be determined in combination with the specific requirements for the BGA performance and the impedance parameter requirements of the test signal during transmission. This application does not make specific limitations on this.

[0062] When optimizing the structure of the target ball grid array model, the structure of at least one of the solder ball model and the pad model can be adjusted. In some application scenarios, it is required that the size of the solder ball remains unchanged. In this case, since the solder ball model cannot be adjusted, only the pad model can be optimized.

[0063] Specifically, when adjusting the solder ball model, the main adjustment is to the external dimensions of the solder ball model, such as the diameter, height after soldering, etc. Of course, other aspects such as the layout position can also be adjusted according to actual requirements, which will not be elaborated here one by one. As for the optimization of the pad model, it mainly focuses on impedance compensation and avoids directly changing the pad structure. In practical applications, compared with air, the equivalent dielectric constant of the cold liquid is larger, resulting in a decrease in the equivalent impedance when the signal flows through the pad in the target liquid cooling environment. Therefore, impedance compensation can be achieved by hollowing out the insulating layer under the signal pad and adjacent to the signal pad. Based on this, combined with Figure 4 as shown, an insulating layer adjacent to the signal pad model can be created according to the layout information of the target ball grid array, and a hollowed-out area is set in the insulating layer. Specifically, taking the center of the signal pad model as the origin, the insulating layer is hollowed out according to a preset radius. By adjusting the size of the preset radius, different hollowed-out areas can be created, thereby achieving different degrees of impedance compensation.

[0064] It can be understood that after optimizing the target ball grid array model, the aforementioned simulation test process can be executed again, which will not be repeated here.

[0065] In summary, this method creates an initial ball grid array model and obtains the first impedance test result of the initial ball grid array model in the target liquid cooling environment, and creates a target ball grid array model and obtains the second impedance test result of the target ball grid array model in the target liquid cooling environment. The target ball grid array model is corrected according to the first impedance test result and the second impedance test result, so as to realize the simulation analysis of the operating performance of the ball grid array in the liquid cooling environment, and correct the ball grid array model through the simulation analysis result, so as to ensure that the BGA can meet the performance requirements in the liquid cooling operating environment.

[0066] Furthermore, the initial ball grid array model provided by this method only includes solder balls and vias. Through the simulation analysis of the initial ball grid array model, the impedance information of the ideal ball grid array in the target liquid cooling environment can be obtained. Correspondingly, compared with the initial ball grid array, the target ball grid array model created by this method adds a pad model, so as to restore the actual BGA structure. By analyzing the test results of the two models, the influence of the pad structure on the operating performance of the BGA can be intuitively determined, thus providing a reference basis for adjusting the pad structure.

[0067] It can be understood that the aforementioned simulation analysis method provided by the embodiment mainly performs passive simulation analysis on the ball grid array. In order to obtain more and more accurate test results, active simulation analysis can also be performed.

[0068] As an alternative implementation, after creating the initial ball grid array model, a simulation signal source can be created and the simulation signal source can be controlled to provide a test signal. The simulation analysis method provided in this embodiment aims to perform active simulation on the simulation model constructed in the foregoing embodiment. Therefore, in this step, a simulation signal source is created, and the simulation signal source can output a test signal. After the creation of the simulation signal source is completed, the obtained simulation signal source is connected to the simulation signal port. As for the specific creation process of the simulation signal source, it can be implemented based on related technologies, and the present application does not make specific limitations thereon.

[0069] Further, it can be carried out according to Figure 1 the relevant steps of the embodiment shown, first applying a test signal to the initial ball grid array model to obtain the corresponding first impedance test result. Further, applying a test signal to the target ball grid array model and obtaining the corresponding second impedance test result. After obtaining the first impedance test result and the second impedance test result, the target ball grid array model can be corrected according to Figure 1 the relevant content of the embodiment shown, which will not be repeated here.

[0070] In summary, the ball grid array simulation analysis method provided in this embodiment can perform active analysis on the ball grid array model. Compared with the passive analysis performed in the foregoing embodiment, the obtained analysis results are more accurate, and various parameters can be tested, so as to more comprehensively analyze the performance of the ball grid array under different operating environments, and can provide a more reliable reference basis for the correction of the ball grid array.

[0071] Next, the ball grid array simulation analysis device provided by the present invention will be introduced. The ball grid array simulation analysis device provided by the present invention belongs to the same inventive concept as the ball grid array simulation analysis method provided in the embodiments of the present application, and can execute the ball grid array simulation analysis method provided in any embodiment of the present application, and has corresponding functional modules and beneficial effects for executing the ball grid array simulation analysis method. For technical details not described in detail in this embodiment, reference can be made to the ball grid array simulation analysis method provided in the embodiments of the present application, which will not be elaborated here.

[0072] See Figure 5 , the ball grid array analysis device provided by the present application includes the following units: The first modeling unit 10 is used to create a ball grid array model, and the ball grid array model includes a solder ball model and a via model and a signal return plane respectively connected to the solder ball model; The first test unit 20 is used to apply a test signal to the ball grid array model and obtain the first impedance test result of the ball grid array model in the target liquid cooling environment; The second modeling unit 30 is used to create a pad model and connect the pad model to the ball grid array model to obtain a target ball grid array model; A second test unit 40 for applying the test signal to the target ball grid array model and obtaining a second impedance test result of the target ball grid array model in the target liquid cooling environment; A correction unit 50 for correcting the target ball grid array model according to the first impedance test result and the second impedance test result.

[0073] Next, with reference to Figure 6 the electronic device provided by the embodiment of the present invention will be described. The electronic device provided by this embodiment may include: at least one processor 100, at least one communication interface 200, at least one memory 300, and at least one communication bus 400; In the embodiment of the present invention, the number of the processor 100, the communication interface 200, the memory 300, and the communication bus 400 is at least one, and the processor 100, the communication interface 200, and the memory 300 complete mutual communication through the communication bus 400; obviously, Figure 6 the communication connection schematic diagram of the shown processor 100, communication interface 200, memory 300, and communication bus 400 is only optional; Optionally, the communication interface 200 may be an interface of a communication module, such as an interface of a GSM module; the processor 100 may be a central processing unit CPU, or a specific integrated circuit ASIC (Application Specific Integrated Circuit), or one or more integrated circuits configured to implement the embodiments of the present invention.

[0074] The memory 300 may include a high-speed RAM memory, and may also include a non-volatile memory, such as at least one disk memory.

[0075] Among them, the processor 100 is specifically configured to execute an application program in the memory to implement the steps of the ball grid array simulation analysis method described above.

[0076] In some embodiments, this embodiment also provides a computer-readable storage medium, such as a floppy disk, an optical disc, a hard disk, a flash memory, a USB flash drive, an SD (Secure Digital Memory Card) card, an MMC (Multimedia Card) card, etc. One or more instructions for implementing the above steps are stored in the computer-readable storage medium. When the one or more instructions are executed by one or more processors, the processor executes the ball grid array simulation analysis method described above. For the related specific implementation, please refer to the foregoing description, and details will not be elaborated here.

[0077] In addition to the above methods and devices, an embodiment of the present application may also be a computer program product, which includes computer program instructions. When the computer program instructions are run by a processor, the processor is caused to execute the steps in the ball grid array simulation analysis method according to various embodiments of the present application described above in this specification.

[0078] The computer program product can be written in any combination of one or more programming languages for programming code to perform the operations of the embodiments of the present application. The programming languages include object-oriented programming languages such as Java, C++, etc., and also include conventional procedural programming languages such as the "C" language or similar programming languages. The programming code can be executed entirely on the user computing device, partially on the user device, executed as an independent software package, partially on the user computing device and partially on a remote computing device, or entirely on a remote computing device or server.

[0079] Those skilled in the art can understand that the content disclosed in the present disclosure can have various variations and improvements. For example, the various devices or components described above can be implemented by hardware, or can be implemented by software, firmware, or some or all combinations of the three.

[0080] In addition, although the present disclosure makes various references to certain units in the system according to the embodiments of the present disclosure, however, any number of different units can be used and run on the client and / or server. The units are only illustrative, and different aspects of the system and method can use different units.

[0081] Flowcharts are used in the present disclosure to illustrate the steps of the methods according to the embodiments of the present disclosure. It should be understood that the previous or subsequent steps do not necessarily proceed precisely in order. On the contrary, they can be processed in reverse order or simultaneously. At the same time, other operations can also be added to these processes.

[0082] Those of ordinary skill in the art can understand that all or part of the steps in the above methods can be completed by instructing relevant hardware through a computer program, and the program can be stored in a computer-readable storage medium such as a read-only memory, etc. Optionally, all or part of the steps of the above embodiments can also be implemented using one or more integrated circuits. Correspondingly, the various modules / units in the above embodiments can be implemented in the form of hardware or in the form of software functional modules. The present disclosure is not limited to any specific form of combination of hardware and software.

[0083] Unless otherwise defined, all terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It should also be understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and should not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0084] The foregoing is a description of the present disclosure and should not be taken as a limitation thereof. Although several exemplary embodiments of the present disclosure have been described, those skilled in the art will readily appreciate that many modifications can be made to the exemplary embodiments without departing from the novel teachings and advantages of the present disclosure. Accordingly, all such modifications are intended to be included within the scope of the present disclosure as defined by the claims. It should be understood that the foregoing is a description of the present disclosure and should not be considered limited to the specific embodiments disclosed, and modifications to the disclosed embodiments as well as other embodiments are intended to be included within the scope of the appended claims. The present disclosure is defined by the claims and their equivalents.

Claims

1. A ball grid array simulation analysis method, characterized in that: include: Creating an initial ball grid array model, the initial ball grid array model including a solder ball model and a via model and a signal return plane respectively connected to the solder ball model; Applying a test signal to the initial ball grid array model, and obtaining a first impedance test result of the initial ball grid array model under a target liquid cooling environment; Creating a pad model, and connecting the pad model with the initial ball grid array model to obtain a target ball grid array model; Applying the test signal to the target ball grid array model, and obtaining a second impedance test result of the target ball grid array model under the target liquid cooling environment; The target BGA model is modified according to the first impedance test result and the second impedance test result.

2. The method according to claim 1, characterized in that Modifying the target ball grid array model according to the first impedance test result and the second impedance test result includes: Respectively determining an impedance deviation range of the first impedance test result and the second impedance test result relative to a preset target impedance; The target BGA model is modified based on each of the impedance deviation ranges.

3. The method according to claim 2, characterized in that The impedance deviation range includes a first impedance deviation range corresponding to the first impedance test result, and a second impedance deviation range corresponding to the second impedance test result; Correcting the target ball grid array model based on each of the impedance deviation ranges includes: If the first impedance deviation range is within a preset impedance deviation range, and the second impedance deviation range is within the first impedance deviation range, determining that the ball grid array corresponding to the target ball grid array model is allowed to operate in the target liquid cooling environment; If the first impedance deviation range is not within the preset impedance deviation range, or the second impedance deviation range is not within the first impedance deviation range, the structure of at least one of the solder ball model and the solder pad model is adjusted.

4. The method according to claim 3, characterized in that The pad model includes a signal pad and a reflow pad; Adjusting the structure of the pad model includes: Creating an insulating layer adjacent to the signal pad model according to the layout information of the target ball grid array; A hollowed-out area is provided in the insulating layer.

5. The method according to claim 1, characterized in that The step of creating an initial ball grid array model comprises: Creating a signal solder ball model, a reflow solder ball model, and a via model according to the layout information of the target ball grid array; Connecting the first contact surface of the signal solder ball model to the via model; A signal reflow plane is created, and the signal reflow plane is connected to the reflow solder ball model.

6. The method according to claim 5, characterized in that The method further comprises: Creating a coaxial body, and adjusting the equivalent dielectric constant of the coaxial body so that the impedance of the coaxial body matches the target impedance of the test signal; The coaxial body is connected to the signal solder ball model according to a preset contact area.

7. The method according to any one of claims 1 to 6, characterized in that: Also includes: Create a simulation signal source; Applying the test signal to the target BGA model comprises: The simulation signal source is controlled to apply the test signal to the target BGA model.

8. A ball grid array simulation analysis device, characterized in that: include: A first modeling unit is used to create an initial ball grid array model, wherein the initial ball grid array model includes a solder ball model and a via model and a signal return plane respectively connected to the solder ball model; A first testing unit, used for applying a test signal to the initial ball grid array model and obtaining a first impedance test result of the initial ball grid array model under a target liquid cooling environment; A second modeling unit is used to create a pad model, and connect the pad model with the initial ball grid array model to obtain a target ball grid array model; A second testing unit, used for applying the test signal to the target BGA model and obtaining a second impedance test result of the target BGA model under the target liquid cooling environment; A correction unit is used to correct the target BGA model according to the first impedance test result and the second impedance test result.

9. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executed by the processor, characterized in that: When the processor executes the computer program, the steps of the ball grid array simulation analysis method according to any one of claims 1 to 7 are implemented.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the ball grid array simulation analysis method according to any one of claims 1 to 7 are implemented.

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