Manufacturing method of circuit board coil

Abstract

The invention discloses a method for manufacturing a circuit board coil, which comprises the following steps of: marking the outline of a target coil on a copper plate, forming a mask of which the outline is matched with the marked outline of the target coil on the copper plate, and carrying out ion etching on the copper plate on which the mask is formed so as to separate the copper plate based on the outline of the target coil. According to the method for manufacturing the circuit board coil through the ion etching technology, the manufacturing cost is low, the precision is high, the application requirements of high-precision electronic products can be met, and the circuit board coil with the needed size and shape can be designed according to the actual requirements in the manufacturing process.

Description

Technical Field

[0001] The present invention relates to the technical field of coils, and particularly to a manufacturing method of a circuit board coil. Background Art

[0002] The circuit board coil is one of the common components in modern electronic technology, and mainly functions to store magnetic fields or generate electromagnetic waves, etc. At present, the methods for manufacturing circuit board coils mainly include traditional methods such as printing, fully automatic winding machines, and stamping. Although these methods can achieve production, there is still room for improvement: 1. High manufacturing cost. The manufacturing cost of traditional methods is relatively high, which restricts the large-scale popularization and application. 2. Low precision of the coil. Due to the limitations of materials and equipment in traditional manufacturing methods, the precision of the manufactured coils is not high, which limits their application in electronic products. 3. The size and shape of the manufactured coils cannot be flexibly adjusted. The size and shape of the coils manufactured by traditional manufacturing methods are fixed and cannot be flexibly adjusted to adapt to the changing requirements. Summary of the Invention

[0003] An embodiment of the present invention provides a manufacturing method of a circuit board coil for the deficiencies in the prior art, including:

[0004] Mark the outline of the target coil on the copper plate;

[0005] Form a mask on the copper plate, and the outline of the mask matches the outline of the marked target coil;

[0006] Perform ion etching on the copper plate with the mask formed thereon to separate the copper plate based on the outline of the target coil;

[0007] Remove the mask to obtain the circuit board coil.

[0008] As a preferred solution, the performing ion etching on the copper plate with the mask formed thereon to separate the copper plate based on the outline of the target coil specifically includes:

[0009] Put the copper plate with the mask formed thereon into an ion etching device, and expose one side of the copper plate with the mask formed thereon under the etching gun;

[0010] Etch the copper plate with the mask formed thereon through the ion etching device to penetrate the upper and lower surfaces of the copper plate.

[0011] As a preferred solution, the gas used in the ion etching device is CF 4 and O 2 .

[0012] As a preferred solution, the ratio of CF 4 and O 2 is 4:1.5.

[0013] As a preferred embodiment, CF 4 and O 2 The flow rate of the mixed gas formed is 1200 - 1500 sccm, the chamber temperature is 24 - 30 degrees Celsius, the chamber pressure is 60 - 80 mtorr, the source power is 4000 - 5000 W, and the bias power is 250 - 300 W.

[0014] As a preferred embodiment, after removing the mask to obtain the circuit board coil, it further includes:

[0015] Electroplating the circuit board coil.

[0016] As a preferred embodiment, the electroplating of the circuit board coil specifically includes:

[0017] Placing the circuit board coil in an electroplating device for gold plating.

[0018] As a preferred embodiment, the marking of the contour of the target coil on the copper plate specifically includes:

[0019] Marking the contour of the target coil on the surface of the copper plate with an electron beam machine.

[0020] As a preferred embodiment, the target coil includes a spiral planar coil, a first connection portion, and a second connection portion; the planar coil includes a spiral coil portion, a first end portion connected to the first end of the spiral coil portion, and a second end portion connected to the second end of the spiral coil portion;

[0021] One end of the first connection portion is connected to the first end portion of the planar coil, and the other end of the first connection portion is connected to a region of the spiral coil portion adjacent to and spaced from the first end portion of the planar coil;

[0022] One end of the second connection portion is connected to the second end portion of the planar coil, and the other end of the second connection portion is connected to a region of the spiral coil portion adjacent to and spaced from the second end portion of the planar coil;

[0023] Then, after removing the mask to obtain the circuit board coil, it further includes:

[0024] Removing the regions of the circuit board coil corresponding to the first connection portion and the second connection portion.

[0025] As a preferred embodiment, after removing the mask to obtain the circuit board coil, it further includes:

[0026] Forming a first tear line at the connection between the region of the circuit board coil corresponding to the first connection portion and the region of the circuit board coil corresponding to the spiral coil portion;

[0027] A second tear line is formed at the connection between the area of the circuit board coil corresponding to the second connection part and the area of the circuit board coil corresponding to the spiral coil part.

[0028] Compared with the prior art, the beneficial effects of the embodiments of the present invention are as follows: A manufacturing method of a circuit board coil according to an embodiment of the present invention marks the outline of a target coil on a copper plate, forms a mask on the copper plate with a contour matching the marked outline of the target coil, and then performs ion etching on the copper plate formed with the mask to separate the copper plate based on the outline of the target coil and remove the mask, obtaining the circuit board coil. The manufacturing cost of the circuit board coil by the ion etching technology in the embodiments of the present invention is low and the precision is high, which can meet the application requirements of high-precision electronic products, and the circuit board coil with required dimensions and shapes can also be designed according to actual needs during manufacturing. Description of the Drawings

[0029] Figure 1 is a schematic flow chart of the manufacturing method of the circuit board coil in the embodiment of the present invention;

[0030] Figure 2 is a schematic structural diagram of a target coil in an embodiment provided by the present invention;

[0031] Figure 3 is a schematic structural diagram of a target coil in another embodiment provided by the present invention. Detailed Embodiments

[0032] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0033] Please refer to Figure 1 , which is a schematic flow chart of the manufacturing method of the circuit board coil in the embodiment of the present invention.

[0034] The manufacturing method of the circuit board coil according to the embodiment of the present invention includes:

[0035] Step S101, marking the outline of the target coil on the copper plate;

[0036] Step S102, forming a mask on the copper plate, the contour of the mask matching the marked outline of the target coil;

[0037] Step S103: Ion-etch the copper plate formed with the mask to separate the copper plate based on the contour of the target coil;

[0038] Step S104: Remove the mask to obtain a circuit board coil.

[0039] In the embodiment of the present invention, by marking the contour of the target coil on the copper plate, forming a mask on the copper plate whose contour matches the marked contour of the target coil, then ion-etching the copper plate formed with the mask to separate the copper plate based on the contour of the target coil, and removing the mask to obtain a circuit board coil. The embodiment of the present invention has low manufacturing cost and high precision for manufacturing the circuit board coil by ion-etching technology, can meet the application requirements of high-precision electronic products, and can also design the circuit board coil with the required size and shape according to actual needs during manufacturing.

[0040] Please refer to Figure 2 , in a specific implementation, the target coil 1 includes a spiral planar coil.

[0041] In an optional implementation manner, the step S101 "mark the contour of the target coil on the copper plate" specifically includes:

[0042] Mark the contour of the target coil on the surface of the copper plate with an electron beam machine.

[0043] In this embodiment, an electron beam machine is used to mark the contour of the target coil on the surface of the copper plate, that is, draw the required coil shape on the surface of the copper plate. Of course, other methods can also be used to mark the contour of the target coil on the copper plate, and no more details will be elaborated here.

[0044] In the step S102 "form a mask on the copper plate, and the contour of the mask matches the marked contour of the target coil", the mask can be formed by using a photoresist, for example. The contour of the mask matches the marked contour of the target coil, that is, the mask pattern is the same as the shape and size of the target coil. By setting the mask, the target coil area is protected from being etched during the subsequent ion-etching process.

[0045] In an optional implementation manner, the step S103 "ion-etch the copper plate formed with the mask to separate the copper plate based on the contour of the target coil" specifically includes:

[0046] Put the copper plate formed with the mask into an ion-etching device, and expose one side of the copper plate formed with the mask under the etching gun;

[0047] Etch the copper plate formed with the mask through the ion-etching device to penetrate the upper and lower surfaces of the copper plate.

[0048] In this embodiment, the copper plate formed with the mask is placed in an ion etching device for ion etching, and the upper and lower surfaces of the copper plate are penetrated during etching, so that a structure with the shape of the target coil can be separated from the copper plate based on the contour of the target coil.

[0049] Specifically, the gas used in the ion etching device is CF 4 and O 2 , and the ratio of CF 4 and O 2 is 4:1.5. The flow rate of the mixed gas formed by CF 4 and O 2 is 1200 - 1500 sccm, the chamber temperature is 24 - 30 °C, the chamber pressure is 60 - 80 mtorr, the source power is 4000 - 5000 W, and the bias power is 250 - 300 W.

[0050] Compared with the traditional manufacturing method, in this embodiment, the copper plate is ion-etched with a mixed gas of CF 4 and O 2 at a ratio of 4:1.5. The flow rate of the mixed gas formed by CF 4 and O 2 is 1200 - 1500 sccm, the chamber temperature is 24 - 30 °C, the chamber pressure is 60 - 80 mtorr, the source power is 4000 - 5000 W, and the bias power is 250 - 300 W. It can quickly form a coil with high manufacturing accuracy. The equipment required for the ion etching technology is simple, and the cost of manufacturing the coil is greatly reduced.

[0051] In an alternative embodiment, after the step S104 "removing the mask to obtain the circuit board coil", the following is further included:

[0052] Electroplating the circuit board coil.

[0053] In this embodiment, by electroplating the circuit board coil, the conductivity of the circuit board coil is increased.

[0054] Specifically, the electroplating of the circuit board coil specifically includes:

[0055] Placing the circuit board coil in an electroplating device for gold plating.

[0056] Please refer to Figure 3 , in an alternative embodiment, the target coil 1 includes a spiral planar coil, a first connecting portion 2, and a second connecting portion 3; the planar coil includes a spiral coil portion 11, a first end portion 12 connected to the first end of the spiral coil portion, and a second end portion 13 connected to the second end of the spiral coil portion;

[0057] One end of the first connecting portion 2 is connected to the first end portion 12 of the planar coil, and the other end of the first connecting portion 2 is connected to a region of the spiral coil portion 11 adjacent to and spaced from the first end portion 12 of the planar coil;

[0058] One end of the second connecting portion 3 is connected to the second end portion 13 of the planar coil, and the other end of the second connecting portion 3 is connected to a region of the spiral coil portion 11 adjacent to and spaced from the second end portion 13 of the planar coil;

[0059] After removing the mask to obtain the circuit board coil, it further includes:

[0060] Removing the regions of the circuit board coil corresponding to the first connecting portion and the second connecting portion.

[0061] In a specific implementation, the inventor found that the spiral planar coil is prone to deformation, and even damaged when the deformation is severe. In the embodiment of the present invention, the first connecting portion and the second connecting portion are designed on the target coil. In this way, the circuit board coil formed based on the target coil can form regions corresponding to the first connecting portion and the second connecting portion on the copper plate to fix the spiral planar coil, thereby improving the structural strength of the planar coil and further avoiding serious deformation of the circuit board coil formed based on the target coil. During the transportation of the circuit board coil, the regions of the circuit board coil corresponding to the first connecting portion and the second connecting portion can still be retained, and when the circuit board coil needs to be used, the regions of the circuit board coil corresponding to the first connecting portion and the second connecting portion are removed to ensure the normal operation of the circuit board coil.

[0062] Specifically, after removing the mask to obtain the circuit board coil, it further includes:

[0063] Forming a first tear line at the connection between the region of the circuit board coil corresponding to the first connecting portion and the region of the circuit board coil corresponding to the spiral coil portion;

[0064] Forming a second tear line at the connection between the region of the circuit board coil corresponding to the second connecting portion and the region of the circuit board coil corresponding to the spiral coil portion.

[0065] In this embodiment, a first tear line and a second tear line are formed in the circuit board coil, so as to facilitate tearing off the area of the circuit board coil corresponding to the first connection part and the area of the circuit board coil corresponding to the second connection part along the first tear line and the second tear line. Of course, the areas of the circuit board coil corresponding to the first connection part and the second connection part can also be removed by auxiliary tools (such as scissors) to ensure the normal operation of the circuit board coil, and no more details will be described here.

[0066] Compared with the prior art, the beneficial effects of the embodiment of the present invention are as follows: A manufacturing method of a circuit board coil in the embodiment of the present invention marks the contour of a target coil on a copper plate, forms a mask on the copper plate whose contour matches the marked contour of the target coil, and then performs ion etching on the copper plate formed with the mask to separate the copper plate based on the contour of the target coil and remove the mask to obtain a circuit board coil. The circuit board coil manufactured by the ion etching technology in the embodiment of the present invention has low manufacturing cost and high precision, can meet the application requirements of high-precision electronic products, and can also design the circuit board coil with the required size and shape according to actual needs during manufacturing. In addition, the embodiment of the present invention can achieve fast, low-cost, high-precision and flexible adjustment, and is suitable for large-scale popularization and application. The ion etching technology described in the present invention can be applied to other fields and has broad application prospects.

[0067] The above are only the preferred embodiments of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the technical principle of the present invention, several improvements and replacements can be made, and these improvements and replacements should also be regarded as the protection scope of the present invention.

Claims

1. A manufacturing method of a circuit board coil, characterized in that, comprising: marking the contour of a target coil on a copper plate; forming a mask on the copper plate, the contour of the mask matching the marked contour of the target coil; performing ion etching on the copper plate formed with the mask to separate the copper plate based on the contour of the target coil; removing the mask to obtain a circuit board coil.

2. The manufacturing method of a circuit board coil according to claim 1, characterized in that, the performing ion etching on the copper plate formed with the mask to separate the copper plate based on the contour of the target coil specifically comprises: placing the copper plate formed with the mask into an ion etching device and exposing one side of the copper plate formed with the mask under an etching gun; etching the copper plate formed with the mask through the upper and lower surfaces of the copper plate by the ion etching device.

3. The manufacturing method of a circuit board coil according to claim 2, characterized in that, The gas used in the ion etching equipment is CF 4 and O 2 .

4. The manufacturing method of a circuit board coil according to claim 3, characterized in that, CF 4 and O 2 The ratio of them is 4:1.

5.

5. The manufacturing method of a circuit board coil according to claim 3, characterized in that, CF 4 and O 2 The flow rate of the mixed gas formed is 1200 - 1500 sccm, the chamber temperature is 24 - 30 degrees Celsius, the chamber pressure is 60 - 80 mtorr, the source power is 4000 - 5000 W, and the bias power is 250 - 300 W.

6. The manufacturing method of a circuit board coil according to claim 1, characterized in that, after removing the mask to obtain a circuit board coil, further comprising: electroplating the circuit board coil.

7. The manufacturing method of a circuit board coil according to claim 6, characterized in that, the electroplating the circuit board coil specifically comprises: placing the circuit board coil into an electroplating device for gold plating.

8. The manufacturing method of a circuit board coil according to claim 1, characterized in that, the marking the contour of a target coil on a copper plate specifically comprises: marking the contour of the target coil on the surface of the copper plate with an electron beam machine.

9. The manufacturing method of a circuit board coil according to any one of claims 1-8, characterized in that, the target coil comprises a spiral planar coil, a first connection part and a second connection part; the planar coil comprises a spiral coil part, a first end part connected to the first end of the spiral coil part and a second end part connected to the second end of the spiral coil part; one end of the first connection part is connected to the first end part of the planar coil, and the other end of the first connection part is connected to an area of the spiral coil part adjacent to and spaced from the first end part of the planar coil; one end of the second connection part is connected to the second end part of the planar coil, and the other end of the second connection part is connected to an area of the spiral coil part adjacent to and spaced from the second end part of the planar coil; then after removing the mask to obtain a circuit board coil, further comprising: removing areas of the circuit board coil corresponding to the first connection part and the second connection part.

10. The manufacturing method of a circuit board coil according to claim 9, characterized in that, after removing the mask to obtain a circuit board coil, further comprising: forming a first tear line at the connection between the area of the circuit board coil corresponding to the first connection part and the area of the circuit board coil corresponding to the spiral coil part; A second tear line is formed at a connection between a region of the circuit board coil corresponding to the second connection portion and a region of the circuit board coil corresponding to the spiral coil portion.

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