Wafer coating pretreatment device and method
By designing a wafer coating pre-processing device including an operating table, cleaning cabinet, lifting mechanism, sliding mechanism and ventilation mechanism, the problem of manual cleaning is not thorough enough, and efficient and thorough wafer cleaning is achieved, suitable for large-scale production, and the yield rate and operation safety are improved.
Patent Information
- Application Number
- CN202510270356.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-07
- Publication Date
- 2025-05-30
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
In the prior art, manual cleaning of wafer coating is not thorough enough, resulting in dust residue, which may damage the wafer, and is not suitable for large-scale production, reducing yield.
A wafer coating pretreatment device is designed, including an operating table, a cleaning cabinet, a lifting mechanism, a sliding mechanism and a ventilation mechanism. A roller is installed at the bottom of the operating table for easy movement; a sliding mechanism is set up in the inner wall of the cleaning cabinet, and the brush wheel and electrostatic wheel are driven by an electric push rod to perform sliding cleaning; the ventilation mechanism ensures air circulation and cleaning through the fan and filter box.
It improves the efficiency and thoroughness of wafer surface cleaning, reduces dust residue, protects wafers, is suitable for large-scale production, improves yield, and ensures the health and safety of operators.
Smart Images
Figure CN120072632A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of wafer coating, and particularly relates to a wafer pre-treatment device and method before coating. Background Art
[0002] Wafer coating is a technology for covering one or more layers of thin films on the surface of a wafer to improve its performance. This technology is widely used in semiconductor manufacturing and is one of the important process steps in the integrated circuit manufacturing process. The basic principle of the wafer coating process is to use chemical reactions or physical methods to form a uniform and functionally specific thin film on the surface of the wafer. According to the different thin film materials, wafer coating can be divided into two types: metal coating and non-metal coating. Metal coating is commonly used for preparing conductive layers, heat insulation layers, etc., while non-metal coating is widely used for preparing insulating layers, optical layers, etc. During the wafer coating process, first, the surface of the wafer needs to be cleaned and processed to improve the adhesion and uniformity of the thin film. Then, according to the material and properties of the required thin film, a suitable coating process is selected for coating. After coating, subsequent processing such as annealing, heat treatment, etc. is also required to improve the performance and stability of the thin film. The wafer coating technology can not only improve the electrical performance of the chip, protect the chip from the external environment, but also enhance the wear resistance and mechanical strength of the wafer. At the same time, with the continuous progress of technology and the increasing environmental protection requirements, the wafer coating technology is also constantly developing in the direction of higher precision, higher efficiency, and lower cost.
[0003] Wafer coating is an important process in the wafer processing. Before wafer coating, the wafer needs to be pre-treated to remove dust and impurities on the surface. The existing cleaning methods usually use manual cleaning, which is time-consuming and laborious and the cleaning is not thorough enough, resulting in a large amount of dust residue. At the same time, it may damage the wafer, which is not conducive to the large-scale production of wafers and reduces the yield rate of wafers, and is not conducive to users' use.
[0004] Therefore, it is necessary to design and transform the wafer pre-treatment device to effectively prevent the problems existing in the above background art. Summary of the Invention
[0005] The present invention provides a wafer pre-treatment device and method before coating to solve the problems raised in the above background art.
[0006] To solve the above technical problems, the technical solution of the present invention is as follows: An embodiment of the present invention provides a wafer pre - coating treatment device and method, including: an operating table, rollers are fixedly installed at the four corners of the bottom of the operating table, a cleaning cabinet is arranged on the top of the operating table, cover plates are movably connected to the fronts of the operating table and the cleaning cabinet through hinge pins, lifting mechanisms are arranged on both sides of the operating table, the lifting structures are used to adjust the height of the cleaning cabinet, a sliding mechanism is arranged on the inner wall surface of the cleaning cabinet, the sliding mechanism is used to slide - clean the wafer, a ventilation mechanism is arranged on the back of the cleaning cabinet, the ventilation mechanism is used to exhaust the inside of the cleaning cabinet, the sliding mechanism includes sliding boxes, the two sliding boxes are arranged on both sides of the inner wall of the cleaning cabinet, vertical rods are slidably connected to both ends of the sliding boxes, the top and bottom of the vertical rods are fixedly connected to the inner wall surface of the cleaning cabinet through connecting plates, a connecting rod is fixedly connected to the top of the sliding box, an inclined rod is fixedly connected to the inner side of the connecting rod, an electric push rod is fixedly connected to the top of the inclined rod, and the electric push rod is fixedly installed on the top of the cleaning cabinet.
[0007] Through the above - mentioned technical solution, the rollers installed at the four corners of the bottom of the operating table greatly improve the mobility of the device, facilitating rapid transfer between different working areas and improving production efficiency. The cover plates arranged on the fronts of the operating table and the cleaning cabinet, which are movably connected through hinge pins, are convenient to open and close, providing a convenient passage for the loading and unloading of wafers and ensuring safety during the operation process. The setting of the lifting mechanism enables the height of the cleaning cabinet to be flexibly adjusted according to actual needs, adapting to different operating environments and enhancing the versatility of the device. The application of the sliding mechanism on the inner wall of the cleaning cabinet realizes efficient sliding cleaning of the wafer surface, effectively removing dust and impurities on the wafer and laying a good foundation for the coating process. The setting of the ventilation mechanism ensures the circulation and exhaust of the air inside the cleaning cabinet, protecting the health and safety of the operators. The sliding boxes are arranged on both sides of the inner wall of the cleaning cabinet, providing a stable sliding track for the wafer. The vertical rods are fixedly connected to the inner wall of the cleaning cabinet through connecting plates, ensuring the stability of the sliding boxes in the vertical direction. This design not only enhances the load - bearing capacity of the sliding mechanism but also guarantees the smoothness and accuracy of the wafer during the sliding process. The inclined rod fixedly connected to the inner side of the connecting rod and the electric push rod installed on the top of the inclined rod together constitute the power system for the up - and - down movement of the sliding cleaning.
[0008] Further, the lifting mechanism includes lifting boxes, the lifting boxes are fixedly installed on both sides of the operating table, motors are fixedly installed on the outer sides of the two lifting boxes, the output ends of the motors are fixedly connected with gears, and racks are engaged with the surfaces of the gears.
[0009] Through the above technical solution, the lifting mechanism is exquisitely designed and efficient. The lifting boxes are fixedly installed on both sides of the operating table, providing a solid foundation for the entire lifting system. The motor is ingeniously installed outside the lifting box, and its output end is directly connected to the gear. This design is not only compact in structure but also has high transmission efficiency. The precise meshing of the gear and the rack ensures the smoothness and accuracy of the lifting action, enabling the height of the cleaning cabinet to be accurately adjusted to the required position. This electric lifting method not only greatly saves manpower and improves work efficiency compared with the traditional manual adjustment but also realizes the fine adjustment of the height of the cleaning cabinet through the precise control of the motor, meeting the requirements of different working environments and processes, and further enhancing the flexibility and accuracy of the pre-treatment of wafer coating.
[0010] Furthermore, sliding bars are fixedly connected to both sides of the rack. The surface of the sliding bars is slidably connected to sliding grooves, and the outer sides of the sliding grooves are fixedly connected to both sides of the inner wall of the lifting box. A square plate is fixedly connected to the top of the rack. Limit tubes are fixedly connected to both sides of the operating table. A limit rod is slidably connected inside the limit tube, and a positioning rod is fixedly connected to the top of the limit rod. The positioning rod is fixedly connected to the cleaning cabinet.
[0011] Through the above technical solution, the lifting mechanism realizes the precise adjustment of the height of the cleaning cabinet through the precise cooperation of the rack and the gear. The sliding bars fixedly connected to both sides of the rack slide smoothly in the sliding grooves. This design not only enhances the stability of the rack during the lifting process, preventing shaking or deviation caused by uneven force, but also ensures the linearity and accuracy of the lifting action. The fixed connection between the outer sides of the sliding grooves and the inner wall of the lifting box provides a solid support for the sliding bars, further enhancing the stability of the entire lifting mechanism. The square plate fixedly connected to the top of the rack, as a connecting component, enhances the integrity of the structure. The limit tubes fixedly connected to both sides of the operating table, the limit rods slidably connected inside, and the positioning rods fixedly connected to the tops of the limit rods together form a stable guiding and limiting system. This system ensures that the cleaning cabinet does not deviate from the predetermined trajectory during the lifting process and can remain stable even at the maximum or minimum height. The fixed connection between the positioning rod and the cleaning cabinet tightly combines the lifting mechanism and the cleaning cabinet, forming an integral structure, further enhancing the stability and reliability of the device.
[0012] Furthermore, a moving wheel is slidably connected inside the sliding box. The inner sides of multiple moving wheels are movably connected to a moving plate, and a brush wheel and an electrostatic wheel are movably connected to the bottom of the moving plate through a connecting plate.
[0013] Through the above technical solution, the moving wheels are arranged inside the sliding box, enabling the moving plate to move smoothly and smoothly within the sliding box. This design not only improves the flexibility of the wafer during the cleaning process but also ensures that the wafer can uniformly and comprehensively come into contact with the cleaning medium. The dual cleaning effects of the brush wheel and the electrostatic wheel: The brush wheel removes impurities and contaminants on the wafer surface through physical friction, while the electrostatic wheel further removes tiny particles and residues using the principle of electrostatic adsorption. This dual cleaning mechanism not only improves the cleaning efficiency but also ensures that the cleanliness of the wafer surface meets the requirements before coating.
[0014] Furthermore, support plates are fixedly connected to the inner sides of the two sliding boxes. A motor is fixedly installed inside one of the support plates. The output end of the motor is fixedly connected to a screw rod. The end of the screw rod away from the motor is movably connected to one of the support plates through a bearing seat. The screw rod is threadedly connected to the moving plate.
[0015] Through the above technical solution, the motor and the screw rod are supported by the two support plates. The operation of the motor and the screw rod drives the moving plate to move, so that the moving plate slides inside the sliding box through the moving wheels, thereby achieving the horizontal movement of the cleaning device and horizontally cleaning the surface of the wafer, which is convenient for the user to use.
[0016] Furthermore, the ventilation mechanism includes a reinforcement plate fixedly installed on the back of the cleaning cabinet. A blower is fixedly installed on the top of the reinforcement plate. The input end of the blower is communicated with a filter box. The top of the filter box is movably connected to a sealing plate through a pin.
[0017] Through the above technical solution, the reinforcement plate is an important part of the ventilation mechanism. It is fixedly installed on the back of the cleaning cabinet. The main function of the reinforcement plate is to provide additional support and stability to ensure that the ventilation mechanism can be firmly installed on the device. The blower is fixedly installed on the top of the reinforcement plate. Its function is to generate an air flow to help realize the gas exchange function of the ventilation mechanism. The blower may be a key component for driving the gas to circulate inside the device or be discharged outside. Filter box: The input end of the blower is communicated with the filter box. The main function of the filter box is to filter the gas entering the device, removing impurities or contaminants therein to ensure that the gas environment during the pre-treatment of the wafer before coating is clean. Sealing plate: The top of the filter box is movably connected to a sealing plate through a pin. The main function of the sealing plate is to close the filter box to prevent external impurities or contaminants from entering the inside of the filter box. At the same time, it can also prevent gas leakage during the filtering process. The pin connection enables the sealing plate to be opened or closed, facilitating the replacement or cleaning of the filter medium inside the filter box.
[0018] Furthermore, a protective net is fixedly installed on the inner wall surface of the filter box. A filter cotton is arranged on the left side of the protective net, and a heating wire is arranged on the left side of the filter cotton. The number of the heating wires is several and they are evenly distributed in a rectangle.
[0019] Through the above technical solution, a protective net is fixedly installed on the inner wall surface of the filter box. The main function of the protective net is to prevent larger impurities or particulate matters from entering the interior of the filter box and damaging components such as the filter cotton or the heating wire. It plays a role in preliminary filtration and protecting the internal components. Filter cotton: A filter cotton is arranged on the left side of the protective net. The filter cotton is a commonly used filtering material with good filtering effect and air permeability. It can further remove tiny particulate matters and pollutants in the gas, ensuring that the gas entering the device is cleaner. Heating wire: A heating wire is arranged on the left side of the filter cotton. The number of the heating wires is several and they are evenly distributed in a rectangle. The main function of the heating wire is to heat the gas inside the filter box to prevent the water vapor in the gas from condensing into water droplets, thus avoiding the adverse effects of water droplets on the wafer coating process. At the same time, the heating wire can also help increase the temperature of the gas, making it more suitable for the requirements of wafer pre - coating treatment.
[0020] Furthermore, the output end of the blower is communicated with the cleaning cabinet through an air duct. A fixed pipe is communicated with the top of the cleaning cabinet. Two fans are fixedly installed inside the two fixed pipes. A dust suction plate is fixedly connected to the top of the fixed pipe.
[0021] Through the above technical solution, the air is filtered and heated by the blower and then enters the interior of the cleaning cabinet. The high temperature takes away the dust floating in the air, is discharged through the fan and adsorbed on the surface of the dust suction plate, thereby making the air inside the cleaning cabinet purer and improving the stability of wafer coating.
[0022] A method for pre - treatment of wafer coating includes the following steps: S1: By starting the motor, the motor rotates to drive the gear to rotate, thereby driving the rack to move. The rack moves upward along the slide bar and is limited by the limiting rod, thereby driving the cleaning cabinet to move upward. The wafer is placed on the top of the operating table through the cover plate, and then the motor is reversed to reset the cleaning cabinet, thereby achieving the sealing of the cleaning cabinet. S2: Start the electric push rod to drive the inclined rod to move downward, thereby driving the sliding box to move downward along the vertical rod through the connecting rod, and making the brush wheel and the static wheel fit with the surface of the wafer. Then start the motor, the motor rotates to drive the screw rod to rotate, thereby enabling the moving plate to move inside the sliding box through the moving wheel, and driving the brush wheel and the static wheel to move, improving the cleaning efficiency. S3: By starting the fan, the fan rotates to efficiently filter the air through the protective net and filter cotton inside the filter box, heats the air through the heating wire, then enters the inside of the cleaning cabinet, and is discharged through the fan, thereby taking away the dust inside the cleaning cabinet and facilitating the user to use.
[0023] The above solution of the present invention has at least the following beneficial effects: 1. In the present invention, by starting the motor, the motor rotates to drive the gear to rotate, thereby driving the rack to move. The rack moves upward along the slide bar and is limited by the limit rod, thereby driving the cleaning cabinet to move upward. The wafer is placed on the top of the operating table through the cover plate, and then the motor is reversed to reset the cleaning cabinet, thereby achieving the sealing of the cleaning cabinet.
[0024] 2. In the present invention, by starting the electric push rod, the electric push rod drives the inclined rod to move downward, thereby driving the sliding box to move downward along the vertical rod through the connecting rod, and making the brush wheel and the static wheel fit with the surface of the wafer. Then the motor is started, and the motor rotates to drive the screw rod to rotate, so that the moving plate moves inside the sliding box through the moving wheel, thereby driving the brush wheel and the static wheel to move, improving the cleaning efficiency.
[0025] 3. In the present invention, by starting the fan, the fan rotates to efficiently filter the air through the protective net and filter cotton inside the filter box, heats the air through the heating wire, then enters the inside of the cleaning cabinet, and is discharged through the fan, thereby taking away the dust inside the cleaning cabinet and facilitating the user to use. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] Figure 1 is the front view schematic diagram of the structure of the present invention; Figure 2 is the schematic diagram of the structure of the cleaning cabinet of the present invention; Figure 3 is the present invention Figure 2 The enlarged schematic diagram of part A therein; Figure 4 is the schematic diagram of the electric push rod structure of the present invention; Figure 5 is the present invention Figure 4 The enlarged schematic diagram of part B therein; Figure 6 is the schematic diagram of the operating table structure of the present invention: Figure 7 is the present invention Figure 6 The enlarged schematic diagram of part C therein.
[0027] Description of the reference numerals: 1. Operating table; 2. Roller; 3. Cleaning cabinet; 4. Cover plate; 5. Lifting mechanism; 51. Lifting box; 52. Motor; 53. Gear; 54. Rack; 55. Slide bar; 56. Slide groove; 57. Square plate; 58. Limiting tube; 59. Limiting rod; 510. Positioning rod; 6. Sliding mechanism; 61. Sliding box; 62. Vertical rod; 63. Connecting rod; 64. Inclined rod; 65. Electric push rod; 66. Movable wheel; 67. Movable plate; 68. Brush wheel; 69. Static wheel; 610. Support plate; 611. Motor; 612. Screw; 7. Ventilation mechanism; 71. Reinforcing plate; 72. Fan; 73. Filter box; 74. Sealing plate; 75. Protection net; 76. Filter cotton; 77. Heating wire; 78. Fixed tube; 79. Fan; 710. Dust suction plate. Detailed implementation manners
[0028] The exemplary embodiments of the present invention will be described in more detail with reference to the accompanying drawings. Although the exemplary embodiments of the present invention are shown in the drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided so that the present invention can be more thoroughly understood and the scope of the present invention can be fully conveyed to those skilled in the art.
[0029] As Figures 1 to 7 shown, an embodiment of the present invention provides a wafer pre - coating treatment device and method, including: an operating table 1, rollers 2 are fixedly installed at the four corners of the bottom of the operating table 1, a cleaning cabinet 3 is arranged on the top of the operating table 1, cover plates 4 are movably connected to the front surfaces of the operating table 1 and the cleaning cabinet 3 through hinge pins, lifting mechanisms 5 are arranged on both sides of the operating table 1, and the lifting structures are used to adjust the height of the cleaning cabinet 3. A sliding mechanism 6 is arranged on the inner wall surface of the cleaning cabinet 3, and the sliding mechanism 6 is used to slide - clean the wafer. A ventilation mechanism 7 is arranged on the back of the cleaning cabinet 3, and the ventilation mechanism 7 is used to exhaust the inside of the cleaning cabinet 3. The rollers 2 installed at the four corners of the bottom of the operating table 1 greatly improve the moving flexibility of the device, facilitate rapid transfer between different working areas, and improve production efficiency. The cover plates 4 arranged on the front surfaces of the operating table 1 and the cleaning cabinet 3 are movably connected through hinge pins, which are convenient for opening and closing, provide a convenient passage for the insertion and removal of the wafer, and ensure safety during the operation process. The setting of the lifting mechanism 5 enables the height of the cleaning cabinet 3 to be flexibly adjusted according to actual needs, adapts to different operating environments, and enhances the versatility of the device. The application of the sliding mechanism 6 on the inner wall of the cleaning cabinet 3 realizes efficient sliding cleaning of the wafer surface, effectively removes dust and impurities on the wafer, and lays a good foundation for the coating process. The setting of the ventilation mechanism 7 ensures the air circulation and exhaust inside the cleaning cabinet 3, and guarantees the health and safety of the operators.
[0030] As Figures 1 to 7As shown in the figure, the lifting mechanism 5 includes a lifting box 51. The lifting box 51 is fixedly installed on both sides of the operating table 1. A motor 52 is fixedly installed on the outer sides of the two lifting boxes 51. The output end of the motor 52 is fixedly connected to a gear 53. A rack 54 is meshed with the surface of the gear 53. The lifting mechanism 5 is exquisitely designed and efficient. The lifting box 51 is fixedly installed on both sides of the operating table 1, providing a stable foundation for the entire lifting system. The motor 52 is ingeniously installed on the outer side of the lifting box 51, and its output end is directly connected to the gear 53. This design is not only compact in structure but also high in transmission efficiency. The precise meshing of the gear 53 and the rack 54 ensures the smoothness and accuracy of the lifting action, enabling the height of the cleaning cabinet 3 to be precisely adjusted to the required position. This electric lifting method not only greatly saves manpower and improves work efficiency compared with the traditional manual adjustment but also realizes the fine adjustment of the height of the cleaning cabinet 3 through the precise control of the motor 52, meeting the requirements of different working environments and processes, and further enhancing the flexibility and accuracy of the pre-treatment of wafer coating. Both sides of the rack 54 are fixedly connected with slide bars 55. The surface of the slide bars 55 is slidably connected with slide grooves 56. The outer sides of the slide grooves 56 are fixedly connected to both sides of the inner wall of the lifting box 51. The top of the rack 54 is fixedly connected with a square plate 57. Both sides of the operating table 1 are fixedly connected with limiting tubes 58. A limiting rod 59 is slidably connected inside the limiting tubes 58. The top of the limiting rod 59 is fixedly connected with a positioning rod 510. The positioning rod 510 is fixedly connected to the cleaning cabinet 3. The lifting mechanism 5 realizes the precise adjustment of the height of the cleaning cabinet 3 through the precise cooperation of the rack 54 and the gear 53. The slide bars 55 fixedly connected to both sides of the rack 54 slide smoothly in the slide grooves 56. This design not only enhances the stability of the rack 54 during the lifting process, preventing shaking or deviation caused by uneven force, but also ensures the linearity and accuracy of the lifting action. The fixed connection between the outer sides of the slide grooves 56 and the inner wall of the lifting box 51 provides a solid support for the slide bars 55, further enhancing the stability of the entire lifting mechanism 5. The square plate 57 fixedly connected to the top of the rack 54, as a connecting component, enhances the integrity of the structure. The limiting tubes 58 fixedly connected to both sides of the operating table 1, the limiting rods 59 slidably connected inside, and the positioning rods 510 fixedly connected to the tops of the limiting rods 59 together form a stable guiding and limiting system. This system ensures that the cleaning cabinet 3 does not deviate from the predetermined trajectory during the lifting process and can maintain stability even at the maximum or minimum height. The fixed connection between the positioning rod 510 and the cleaning cabinet 3 tightly combines the lifting mechanism 5 and the cleaning cabinet 3 together, forming an integral structure, further enhancing the stability and reliability of the device.
[0031] As Figures 1 to 7As shown, the sliding mechanism 6 includes a sliding box 61. Two sliding boxes 61 are arranged on both sides of the inner wall of the cleaning cabinet 3. Both ends of the sliding box 61 are slidably connected with vertical rods 62. The top and bottom of the vertical rods 62 are fixedly connected to the surface of the inner wall of the cleaning cabinet 3 through connecting plates. The top of the sliding box 61 is fixedly connected with a connecting rod 63. The inner side of the connecting rod 63 is fixedly connected with an inclined rod 64. The top of the inclined rod 64 is fixedly connected with an electric push rod 65. The electric push rod 65 is fixedly installed on the top of the cleaning cabinet 3. The sliding boxes 61 are arranged on both sides of the inner wall of the cleaning cabinet 3, providing a stable sliding track for the wafer. The vertical rods 62 are fixedly connected to the inner wall of the cleaning cabinet 3 through connecting plates, ensuring the stability of the sliding box 61 in the vertical direction. This design not only enhances the load-bearing capacity of the sliding mechanism 6 but also ensures the smoothness and accuracy of the wafer during sliding. The inclined rod 64 fixedly connected to the inner side of the connecting rod 63 and the electric push rod 65 installed on the top of the inclined rod 64 together constitute the power system for the up and down movement of sliding cleaning. The inside of the sliding box 61 is slidably connected with moving wheels 66. The inner sides of multiple moving wheels 66 are movably connected with a moving plate 67. The bottom of the moving plate 67 is movably connected with a brush wheel 68 and an electrostatic wheel 69 through connecting plates. The moving wheels 66 are arranged inside the sliding box 61, enabling the moving plate 67 to move smoothly and freely inside the sliding box 61. This design not only improves the flexibility of the wafer during cleaning but also ensures that the wafer can uniformly and comprehensively contact the cleaning medium. The dual cleaning functions of the brush wheel 68 and the electrostatic wheel 69: The brush wheel 68 removes impurities and contaminants on the surface of the wafer through physical friction, while the electrostatic wheel 69 further removes tiny particles and residues using the principle of electrostatic adsorption. This dual cleaning mechanism not only improves the cleaning efficiency but also ensures that the cleanliness of the wafer surface meets the requirements before coating. The inner sides of the two sliding boxes 61 are fixedly connected with support plates 610. A motor 611 is fixedly installed on the inner side of one of the support plates 610. The output end of the motor 611 is fixedly connected with a screw rod 612. The end of the screw rod 612 away from the motor 611 is movably connected to one of the support plates 610 through a bearing seat. The screw rod 612 is threadedly connected to the moving plate 67. The motor 611 and the screw rod 612 are supported by the two support plates 610. The operation of the motor 611 and the screw rod 612 drives the moving plate 67 to move, so that the moving plate 67 slides inside the sliding box 61 through the moving wheels 66, achieving the horizontal movement of the cleaning device, and thus horizontally cleaning the surface of the wafer for the convenience of the user.
[0032] As Figures 1 to 7As shown, the ventilation mechanism 7 includes a reinforcement plate 71 which is fixedly installed on the back of the cleaning cabinet 3. At the top of the reinforcement plate 71, a blower 72 is fixedly installed. The input end of the blower 72 is communicated with a filter box 73. The top of the filter box 73 is movably connected with a sealing plate 74 through a pin. The reinforcement plate 71 is an important part of the ventilation mechanism 7. It is fixedly installed on the back of the cleaning cabinet 3. The main function of the reinforcement plate 71 is to provide additional support and stability to ensure that the ventilation mechanism 7 can be firmly installed on the device. The blower 72 is fixedly installed at the top of the reinforcement plate 71. Its function is to generate air flow to help achieve the gas exchange function of the ventilation mechanism 7. The blower 72 may be a key component for driving the gas to circulate inside the device or be discharged outside. Filter box 73: The input end of the blower 72 is communicated with the filter box 73. The main function of the filter box 73 is to filter the gas entering the device, remove impurities or pollutants therein, and ensure that the gas environment during the pre-treatment process of wafer coating is clean. Sealing plate 74: The top of the filter box 73 is movably connected with a sealing plate 74 through a pin. The main function of the sealing plate 74 is to close the filter box 73, prevent external impurities or pollutants from entering the inside of the filter box 73, and also prevent gas leakage during the filtering process.The shaft pin connection enables the sealing plate 74 to be opened or closed, facilitating the replacement or cleaning of the filter medium in the filter box 73. A protective net 75 is fixedly installed on the inner wall surface of the filter box 73. A filter cotton 76 is arranged on the left side of the protective net 75, and a heating wire 77 is arranged on the left side of the filter cotton 76. The number of heating wires 77 is several and they are evenly distributed in a rectangle. A protective net 75 is fixedly installed on the inner wall surface of the filter box 73. The main function of the protective net 75 is to prevent larger impurities or particles from entering the interior of the filter box 73 and causing damage to components such as the filter cotton 76 or the heating wire 77. It plays a role in preliminary filtration and protection of internal components. Filter cotton 76: A filter cotton 76 is arranged on the left side of the protective net 75. The filter cotton 76 is a commonly used filter material with good filtration effect and air permeability. It can further remove tiny particles and pollutants in the gas, ensuring that the gas entering the device is cleaner. Heating wire 77: A heating wire 77 is arranged on the left side of the filter cotton 76. The number of heating wires 77 is several and they are evenly distributed in a rectangle. The main function of the heating wire 77 is to heat the gas inside the filter box 73 to prevent the water vapor in the gas from condensing into water droplets, thereby avoiding adverse effects on the wafer coating process. At the same time, the heating wire 77 can also help increase the temperature of the gas, making it more suitable for the requirements of wafer coating pretreatment. The output end of the fan 72 is connected to the cleaning cabinet 3 through an air duct. A fixed pipe 78 is connected to the top of the cleaning cabinet 3. Two fans 79 are fixedly installed inside the two fixed pipes 78. The top of the fixed pipe 78 is fixedly connected to a dust suction plate 710. After the air is filtered and heated by the fan 72, it enters the interior of the cleaning cabinet 3. The floating dust in the air is taken away by high temperature, discharged through the fan 79 and adsorbed on the surface of the dust suction plate 710, thereby making the air inside the cleaning cabinet 3 purer and improving the stability of wafer coating.
[0033] In an embodiment of the present invention, the user starts the motor 52. The rotation of the motor 52 drives the gear 53 to rotate, thereby driving the rack 54 to move. The rack 54 moves along the slide bar 55 towards the top and is limited by the limit rod 59, thereby driving the cleaning cabinet 3 to move towards the top. The wafer is placed on the top of the operation table 1 through the cover plate 4. Then, the motor 52 is reversed to reset the cleaning cabinet 3. At the same time, the electric push rod 65 is started, and the electric push rod 65 drives the inclined rod 64 to move towards the bottom. Thereby, through the connecting rod 63, the sliding box 61 moves along the vertical rod 62 towards the bottom, and the brush wheel 68 and the static wheel 69 are attached to the surface of the wafer. Then, the motor 611 is started. The rotation of the motor 611 drives the screw rod 612 to rotate, so that the moving plate 67 moves inside the sliding box 61 through the moving wheel 66, thereby driving the brush wheel 68 and the static wheel 69 to move, improving the cleaning efficiency. Then, the blower 72 is started. The blower 72 rotates to filter the air efficiently through the protective net 75 and the filter cotton 76 inside the filter box 73. The air is heated by the heating wire 77 and then enters the inside of the cleaning cabinet 3 and is discharged through the fan 79, thereby taking away the dust inside the cleaning cabinet 3, facilitating the user to use.
[0034] The above is the preferred embodiment of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the principle described in the present invention, several improvements and refinements can be made, and these improvements and refinements should also be regarded as the protection scope of the present invention.
Claims
1. A wafer coating pre-treatment device, characterized in that: include: An operating table (1) is provided, wherein rollers (2) are fixedly mounted at the four corners of the bottom of the operating table (1), a cleaning cabinet (3) is arranged on the top of the operating table (1), and a cover plate (4) is movably connected to the front of the operating table (1) and the cleaning cabinet (3) via an axle pin, and lifting mechanisms (5) are arranged on both sides of the operating table (1), and the lifting structures are used to adjust the height of the cleaning cabinet (3), and a sliding mechanism (6) is arranged on the surface of the inner wall of the cleaning cabinet (3), and the sliding mechanism (6) is used to slide and clean wafers, and a ventilation mechanism (7) is arranged on the back of the cleaning cabinet (3), and the ventilation mechanism (7) is used to ventilate the cleaning cabinet. (3) for exhausting the interior, the sliding mechanism (6) comprises a sliding box (61), two sliding boxes (61) are arranged on both sides of the inner wall of the cleaning cabinet (3), both ends of the sliding box (61) are slidably connected to a vertical rod (62), the top and bottom of the vertical rod (62) are fixedly connected to the surface of the inner wall of the cleaning cabinet (3) through a connecting plate, the top of the sliding box (61) is fixedly connected to a connecting rod (63), the inner side of the connecting rod (63) is fixedly connected to an inclined rod (64), the top of the inclined rod (64) is fixedly connected to an electric push rod (65), and the electric push rod (65) is fixedly installed on the top of the cleaning cabinet (3).
2. A wafer coating pre-treatment device according to claim 1, characterized in that: The lifting mechanism (5) comprises a lifting box (51), the lifting box (51) being fixedly mounted on two sides of the operating table (1), a motor (52) being fixedly mounted on the outer sides of the two lifting boxes (51), a gear (53) being fixedly connected to the output end of the motor (52), and a rack (54) being meshed on the surface of the gear (53).
3. A wafer coating pre-treatment device according to claim 2, characterized in that: Both sides of the rack (54) are fixedly connected with a slide bar (55), the surface of the slide bar (55) is slidably connected with a slide groove (56), the outer side of the slide groove (56) is fixedly connected to both sides of the inner wall of the lifting box (51), the top of the rack (54) is fixedly connected with a square plate (57), both sides of the operating table (1) are fixedly connected with a limit tube (58), the inside of the limit tube (58) is slidably connected with a limit rod (59), the top of the limit rod (59) is fixedly connected with a positioning rod (510), and the positioning rod (510) is fixedly connected to the cleaning cabinet (3).
4. The wafer coating pre-treatment device according to claim 1, characterized in that: The sliding box (61) is slidably connected to a moving wheel (66) inside, a plurality of moving wheels (66) are movably connected to a moving plate (67) inside, and a brush wheel (68) and an electrostatic wheel (69) are movably connected to the bottom of the moving plate (67) via a connecting plate.
5. The wafer coating pre-treatment device according to claim 1, characterized in that: The inner sides of the two sliding boxes (61) are fixedly connected to support plates (610), the inner side of one of the support plates (610) is fixedly mounted with a motor (611), the output end of the motor (611) is fixedly connected to a screw rod (612), one end of the screw rod (612) away from the motor (611) is movably connected to one of the support plates (610) via a bearing seat, and the screw rod (612) is threadedly connected to the movable plate (67).
6. The wafer coating pre-treatment device according to claim 1, characterized in that: The ventilation mechanism (7) comprises a reinforcement plate (71), the reinforcement plate (71) being fixedly mounted on the back of the cleaning cabinet (3), a fan (72) being fixedly mounted on the top of the reinforcement plate (71), an input end of the fan (72) being connected to a filter box (73), and a top of the filter box (73) being movably connected to a sealing plate (74) via a shaft pin.
7. The wafer coating pre-treatment device according to claim 6, characterized in that: A protective net (75) is fixedly mounted on the surface of the inner wall of the filter box (73), a filter cotton (76) is arranged on the left side of the protective net (75), a heating wire (77) is arranged on the left side of the filter cotton (76), and the number of the heating wires (77) is several and evenly distributed in a rectangular shape.
8. The wafer coating pre-treatment device according to claim 6, characterized in that: The output end of the fan (72) is connected to the cleaning cabinet (3) via an air duct, the top of the cleaning cabinet (3) is connected to a fixed pipe (78), fans (79) are fixedly installed inside the two fixed pipes (78), and a dust collection plate (710) is fixedly connected to the top of the fixed pipe (78).
9. A method for wafer pretreatment according to claims 1 to 8, characterized in that: The following steps are involved: S1: By starting the motor (52), the motor (52) rotates to drive the gear (53) to rotate, thereby driving the rack (54) to move, and the rack (54) moves toward the top along the slide bar (55), and is limited by the limit rod (59), thereby driving the cleaning cabinet (3) to move toward the top, and placing the wafer through the cover plate (4) to the top of the operating table (1), and then reversing the motor (52) to reset the cleaning cabinet (3), thereby achieving sealing of the cleaning cabinet (3); S2: starting the electric push rod (65), so that the electric push rod (65) drives the inclined rod (64) to move toward the bottom, thereby moving the sliding box (61) toward the bottom along the vertical rod (62) through the connecting rod (63), and making the brush wheel (68) and the electrostatic wheel (69) fit the surface of the wafer, thereby starting the motor (611), and the motor (611) rotates to drive the screw rod (612) to rotate, so that the moving plate (67) moves inside the sliding box (61) through the moving wheel (66), thereby driving the brush wheel (68) and the electrostatic wheel (69) to move, thereby improving the cleaning efficiency; S3: By starting the fan (72), the fan (72) rotates to filter the air efficiently through the protective net (75) and the filter cotton (76) inside the filter box (73), and then heats the air through the heating wire (77). The air then enters the interior of the cleaning cabinet (3) and is discharged through the fan (79), thereby removing dust inside the cleaning cabinet (3) and facilitating use by the user.