Leveling method and leveling device of probe card and probe card

Abstract

The invention provides a probe card leveling method, a probe card leveling device and a probe card. The probe card comprises a printed circuit board, a multi-layer organic substrate, a mounting table and a probe card head. The multi-layer organic substrate and the mounting table are arranged on the bearing surface of the printed circuit board, and the mounting table surrounds the multi-layer organic substrate; and the probe clamping head is arranged on the mounting surface of the mounting table and is in contact with the contact surface of the multi-layer organic substrate. The leveling method can comprise the following steps: determining a spatial difference between the mounting surface and the contact surface; based on the spatial difference, determining an adjustment parameter for the mounting surface; and performing physical finishing on the mounting surface based on the adjustment parameter, so that the parallelism between the outer surface, in contact with the multilayer organic substrate, of the probe card and the contact surface meets a preset condition after the probe card is set. According to the leveling method, high parallelism between the multiple layers of organic substrates and the probe chuck can be kept, so that the test precision is improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor device testing, and particularly to a method and device for leveling a probe card and a probe card. Background Art

[0002] Wafer testing is an important link in the production process of integrated circuits, playing an important role in selecting defective chips to prevent them from flowing into the next link. A probe card is an important component in the wafer testing link. Currently, a mainstream probe card consists of a printed circuit board, a multi-layer organic substrate, a mounting table, and a probe card head. Among them, the multi-layer organic substrate is mounted on the printed circuit board by, for example, reflow soldering. The mounting table is mounted around the multi-layer organic substrate on the printed circuit board. The probe card head is mounted on the mounting seat and contacts the multi-layer organic substrate. Since the flatness of the multi-layer organic substrate and the printed circuit board after installation cannot be determined during the installation of the mounting seat, there will be a large parallelism error between the surface of the probe card head and the multi-layer organic substrate after the probe card head is mounted on the mounting seat, affecting the test accuracy. Summary of the Invention

[0003] To solve the above technical problems, embodiments of this application provide a new method and device for leveling a probe card and a probe card. The leveling method can adjust the parallelism between the probe card head and the multi-layer organic substrate to meet the test requirements.

[0004] In the first aspect of this application, a method for leveling a probe card is provided. The probe card may include a printed circuit board, a multi-layer organic substrate, a mounting table, and a probe card head. Among them, the multi-layer organic substrate and the mounting table are disposed on the bearing surface of the printed circuit board, and the mounting table surrounds the multi-layer organic substrate. The probe card head is disposed on the mounting surface of the mounting table and contacts the contact surface of the multi-layer organic substrate. Characterized in that the leveling method may include: determining the spatial difference between the mounting surface and the contact surface; determining adjustment parameters for the mounting surface based on the spatial difference; physically trimming the mounting surface based on the adjustment parameters so that the parallelism between the outer surface of the probe card head in contact with the multi-layer organic substrate after being set and the contact surface meets a preset condition.

[0005] According to some embodiments of this application, determining the spatial difference between the mounting surface and the contact surface may include: determining a first mathematical expression of the mounting surface relative to the bearing surface; determining a second mathematical expression of the contact surface relative to the bearing surface; determining the spatial difference based on the first mathematical expression and the second mathematical expression.

[0006] According to some embodiments of the present application, the first mathematical expression may include a first surface equation of the mounting surface in a spatial coordinate system with the bearing surface as the base surface, and the second mathematical expression may include a second surface equation of the contact surface in the spatial coordinate system; determining the spatial difference may include: parallelly comparing the curve values of the first surface equation and the second surface equation corresponding to multiple comparison points on the base surface in the spatial coordinate system; designating the difference value determined based on the curve values as the spatial difference.

[0007] According to some embodiments of the present application, the first surface equation and the second surface equation may be respectively constructed based on multiple feature points of the mounting surface and the contact surface, and the feature points may at least include corner points and center points.

[0008] According to some embodiments of the present application, the difference value may at least include the height difference and the tilt angle.

[0009] According to some embodiments of the present application, the adjustment parameters may include a thinning height for the mounting surface determined based on the height difference, and a thinning angle for the mounting surface determined based on the tilt angle; the physical trimming may include machining the mounting surface based on the thinning height and the thinning angle, and may at least include milling.

[0010] According to some embodiments of the present application, the preset condition may include that the parallelism does not exceed 10 μm.

[0011] According to some embodiments of the present application, the leveling method may further include: determining an additional thickness for the printed circuit board based on the adjustment parameters; the additional thickness is realized by mounting an additional structure on the back surface of the printed circuit board relative to the bearing surface.

[0012] A second aspect of the present application provides a probe card, and the probe card may be determined based on any one of the leveling methods described above.

[0013] In a third aspect of the present application, a leveling device for a probe card is provided. The leveling device may include: a stage; a moving component; a data acquisition component; a processing component; and a control component. Among them, the stage is used to place the probe card; the data acquisition component and the processing component are arranged on the moving component and driven by the moving component to move in a three-dimensional space; the control component is electrically connected to the moving component, the data acquisition component and the processing component, and is used to control the operation of the moving component, the data acquisition component and the processing component; after the data acquisition component acquires the spatial parameters of multiple components of the probe card, it transmits them to the control component, and the control component determines a processing instruction for the components of the probe card based on the spatial parameters and transmits it to the processing component, and the processing component performs mechanical processing on the components based on the processing instruction. The leveling method for a chip provided by the embodiments of the present application can reduce the internal stress of the leveling method by using a plastic encapsulation layer to block the direct contact between the chip and the wiring layer, thereby improving the stability and safety of the product.

[0014] The leveling method for a probe card disclosed in the present application physically trims the mounting base by confirming the differences in the installation of the multi-layer organic substrate and the mounting base compared to the printed circuit board respectively, so that after the probe card head is set on the mounting base, it can have a parallelism within the test requirements with the multi-layer organic substrate, thereby avoiding affecting the test process and improving the test accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0016] Figure 1 is an exemplary schematic diagram of an ideal installation situation of the probe card;

[0017] Figure 2 is an exemplary schematic diagram of an actual installation situation of the probe card;

[0018] Figure 3 is an exemplary flowchart of the leveling method for a probe card according to some embodiments of the present application;

[0019] Figure 4 is an exemplary schematic diagram of the installation surface and the contact surface in a coordinate system according to some embodiments of the present application;

[0020] Figure 5 is an exemplary comparison schematic diagram of the installation surface and the contact surface according to some embodiments of the present application;

[0021] Figure 6 is an exemplary schematic diagram of the installation situation after leveling of the probe card shown in some embodiments of the present application;

[0022] Figure 7 is an exemplary schematic diagram of the final installation situation of the probe card shown in some embodiments of the present application;

[0023] Figure 8 is an exemplary structural diagram of the leveling device of the probe card shown in some embodiments of the present application;

[0024] Figure 9 is an exemplary block diagram of a computing device shown in some embodiments of the present application. Detailed implementation manners

[0025] To make the above objects, features, and advantages of the present application more obvious and understandable, the following provides a detailed description of the specific implementation manners of the present application. Many specific details are set forth in the following description to fully understand the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.

[0026] Unless otherwise defined, all technical and scientific terms used in the present application have the same meaning as commonly understood by those skilled in the technical field to which the present application belongs. The terms used in the specification of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application. The terms "including" or "comprising" and the like used in the present application mean that the elements or items appearing before the word cover the elements or items listed after the word and their equivalents, without excluding other elements or items. The term "and / or" used in the present application includes any and all combinations of one or more of the related listed items.

[0027] The terms "including", "having" and their cognates used in the present application are only intended to indicate specific features, numbers, steps, operations, elements, components or combinations of the foregoing items, and should not be construed as first excluding the existence or increasing the possibility of one or more other features, numbers, steps, operations, elements, components or combinations of the foregoing items.

[0028] It should be noted that the terms "first", "second", "third", etc. used in this application are only for distinguishing descriptions and should not be construed as indicating or implying relative importance. When a component is referred to as "fixed to", "mounted on", or "disposed on" another component, it can be directly on the other component or there may be other intermediate components. When a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be other intermediate components at the same time. The orientation or positional relationship indicated by "vertical", "parallel", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to this application.

[0029] Currently, a mainstream probe card consists of a printed circuit board, a multi-layer organic substrate, a mounting table, and a probe head. With reference to Figure 1 the exemplary schematic diagram showing the ideal mounting situation of the probe card, the multi-layer organic substrate 120 can be disposed on, for example, the printed circuit board 110 by reflow soldering or film bonding. For example, it is disposed on the bearing surface 111 of the printed circuit board. The mounting table 130 (for example, a ring-shaped or ring-like structure) can also be disposed on the printed circuit board 110. For example, by opening a hole in the printed circuit board 110 and achieving threaded connection of the mounting table 130 on the printed circuit board 110 through screws or bolts, etc., and surrounding the multi-layer organic substrate 120. The probe card head 140 can be disposed on the mounting table 130. For example, it is disposed on the mounting surface 131 of the mounting table 130 (such as Figure 1 the concave step surface of the stepped mounting base shown in the figure) through various known connection methods. And, after the probe card head 140 is all set, it will be in contact with the contact surface 121 of the multi-layer organic substrate 120. Ideally, when all the components of the probe card are installed, the parallelism between the outer surface 141 of the probe card head 140 and the contact surface 121 of the multi-layer organic substrate 120 will meet the test requirements. As Figure 1 shown, the outer surface 141 of the probe card head 140 and the contact surface 121 of the multi-layer organic substrate 120 can be in complete parallel contact or parallel within the error.

[0030] However, in actual situations, due to the flatness difference between the multi-layer organic substrate 120 and the printed circuit board 110, combined with the mounting tolerance (e.g., soldering tolerance), a large parallelism error may occur between the outer surface of the multi-layer organic substrate 120 (e.g., the above-mentioned contact surface 121) and the outer surface of the printed circuit board (e.g., the above-mentioned bearing surface 111). After the probe chuck 140 is installed on the mounting table 140, since the parallelism between the multi-layer organic substrate 120 and the printed circuit board 110 cannot be determined, a large parallelism error will occur between the outer surface 141 of the probe chuck 140 and the contact surface 121 of the multi-layer organic substrate 120, thus affecting the test accuracy. Refer to Figure 2 An exemplary schematic diagram showing the actual installation situation of the probe card shown. After installation, the contact surface 121 of the multi-layer organic substrate 120 is inclined to the outer surface 141 of the probe chuck 140, which will result in a reduction in test accuracy.

[0031] Aiming at the deficiencies of the prior art, the present application provides a leveling method for a probe card. This leveling method physically trims the mounting table so that the parallelism between the probe chuck and the multi-layer organic substrate meets the test requirements, improving the test accuracy.

[0032] Some preferred embodiments of the present application are described below. It should be noted that the following description is for illustrative purposes and is not intended to limit the protection scope of the present application. The steps involved in the present application can be precisely executed in sequence, or, various steps can be executed in reverse order or simultaneously. At the same time, other operations can also be added to these processes, or one or several steps can be removed from these processes.

[0033] Figure 3 is an exemplary flowchart of the leveling method of the probe card shown according to some embodiments of the present application. Refer to Figure 3 As shown, the leveling method 300 may include the following steps.

[0034] Step 310, determining the spatial difference between the mounting surface and the contact surface.

[0035] In some embodiments, the spatial difference may be determined based on a first mathematical expression corresponding to the mounting surface and a second mathematical expression corresponding to the contact surface. Refer to Figure 4 For further illustration, as Figure 4As shown, a three-dimensional space coordinate system xyz can be established first. Exemplarily, the bearing surface can be used as the base plane as the xoy plane, and the Z axis can be established in the direction from the bearing surface towards the mounting surface, thereby establishing the three-dimensional space coordinate system. In this way, the mathematical expression of the bearing surface in the three-dimensional space coordinate system (or the zeroth mathematical expression in this application) can be the surface equation of the xoy plane: z = 0. By measuring the coordinate values of multiple characteristic points of the mounting surface and the contact surface in the three-dimensional space coordinate system, the first mathematical expression and the second mathematical expression can be constructed. For example, the first surface equation of the mounting surface in the three-dimensional space coordinate system and the second surface equation of the contact surface in the three-dimensional space coordinate system.

[0036] It can be understood that the mounting table and the multi-layer organic substrate are tangible and specific components. Generally speaking, both have regular external shapes. For example, the mounting table can be an annular stepped component, while the multi-layer organic substrate can be a rectangular component with a certain thickness. In this way, by measuring the coordinate values of several characteristic points of the mounting surface of the mounting table and the contact surface of the multi-layer organic substrate, including but not limited to corner points, center points, equally divided points, etc. Or, measure the coordinate values of a preset number of points (for example, randomly select or select according to a predetermined selection rule, such as selecting a point every 1 centimeter, etc.) on the mounting surface and the contact surface. Subsequently, by using the coordinate values of these points to solve the surface equation, the above-mentioned first surface equation and second surface equation can be obtained. The solution method and process can refer to the existing methods for solving surface equations based on coordinates, and this application does not make specific limitations.

[0037] In some embodiments, the coordinate values of the characteristic points in the three-dimensional space coordinate system can be obtained by relying on a measuring device. Exemplarily, the measuring device can include a height gauge. After measuring the height of these characteristic points with the height gauge, the values of these characteristic points on the Z axis can be obtained. At the same time, based on the coordinates of the measuring points when the height gauge measures the height of the characteristic points, the two-dimensional coordinate points of these characteristic points on the xoy plane can be obtained. In this way, the three-dimensional coordinate values of the characteristic points can be determined.

[0038] Figure 4 Presenting the first surface 410 and the second surface 420 corresponding to the first surface equation and the second surface equation in the form of lines can be an exemplary illustration, rather than a limitation. This can be for the convenience of explanation. And on the other hand, in industrial production, it can be ensured that the mounting surface of the mounting table and the contact surface of the multi-layer organic substrate can be a plane.

[0039] In some embodiments, after determining the first surface equation and the second surface equation, parallel comparison can be performed based on the first surface equation and the second surface equation to obtain the difference value between the curve values corresponding to multiple comparison points on the base plane in the space coordinate system as the spatial difference. The parallel comparison may include performing parallel translation of the above two surface equations in space and then comparing the values after they coincide. For example, reference can be made to Figure 5 for illustration. The first surface 410 can be translated up, down, left, and right in the xoz plane so that the first surface 410 coincides with the second surface 420 at the starting point (e.g., point A). After the coincidence, the curve values can be compared. For example, corresponding to the comparison point P 1 on the XOY plane (i.e., the base plane), a curve value (e.g., function value) of the first surface 410 can be Vp 11 , and the curve value of the second surface 420 can be Vp 12 . Then, the difference value between the curve values of the two surfaces corresponding to the comparison point P 1 can be Vp 12 -Vp 11 . Similarly, corresponding to the comparison point P 2 , the curve value Vp 21 of the first surface 410 and the curve value Vp 22 of the second surface 420 can have a difference value of Vp 22 -Vp 21 . After traversing all the comparison points, the set composed of these difference values can be used to represent the height difference between the first surface 410 and the second surface 420, which can be used to form a part of the spatial difference. At the same time, Figure 5 the included angle θ between the two surfaces shown in

[0040] (e.g., obtained by performing trigonometric calculations based on function values) can be used to represent the inclination angle between the two surfaces. This inclination angle can also be used to form a part of the spatial difference.

[0040] It should be noted that Figure 5 what is shown in 1 is merely exemplary and not restrictive. The above first surface 410 and second surface 420 may also be non-planar in the three-dimensional space coordinate system. At this time, corresponding calculations between the surface values can also be performed based on the same or similar principles as above to obtain the spatial difference. Exemplarily, assuming the expression of the first surface 410 is z 2= g(x, y), then for the same point (x, y) on the xoy plane (i.e., the base plane), the corresponding height difference can be expressed as h(x, y) = |f(x, y) - g(x, y)|. And for the corresponding tilt angle, the normal vectors can be obtained for the two surfaces respectively and then the included angle can be calculated to obtain the tilt angle θ. For example, z 1 = the gradient of f(x, y) can be the normal vector of the first surface 410. Similarly can be the normal vector of the second surface 420. After normalization, the included angle calculation can obtain the tilt angle at the point (x, y): cosθ = n 1 ·n 2 / ‖n 1 ‖·‖n 2 ‖. In this way, after calculating the differences between the curve values corresponding to all points within the range, the height difference and the tilt angle can be determined and designated as the spatial difference.

[0041] Step 320, based on the spatial difference, determine the adjustment parameters for the mounting surface.

[0042] It can be understood that the first surface 410 is adjusted in the three-dimensional space coordinate system based on the spatial difference and can be completely coincident with the second surface 420. Corresponding to the actual situation, the mounting surface and the contact surface will be completely fitted or at least kept parallel. Then the adjustment parameter can be used to change the shape of the mounting surface so that it has the same spatial attitude as the contact surface. And as a real physical component, the adjustment of the mounting table can be to thin it down. Continuing to refer to Figure 5 , the adjustment of the mounting table can be to remove materials from point A on the physical level based on the height difference and the tilt angle so that the expression of the mounting surface in the three-dimensional space coordinate is consistent with the expression of the contact surface in the three-dimensional space coordinate system. For example, mere translation can achieve surface coincidence.

[0043] Based on this, the adjustment parameter can include the thinning height for the mounting surface determined based on the height difference, and the thinning angle for the mounting surface determined based on the tilt angle. Returning to continue referring to Figure 5 , if the two surfaces are to be made to coincide after translation, then corresponding to point P 1 the corresponding height can be removed on the mounting surface. Corresponding to point P2, the corresponding height can be removed on the mounting surface. 12 -Vp 11 For point P2, the corresponding height can be removed on the mounting surface. 22 -Vp 21Removal of the corresponding height. Meanwhile, in order to maintain the smoothness and flatness of the trimmed surface, the external device for material removal can be moved and controlled according to the inclination angle θ.

[0044] Step 330, physically trim the mounting surface based on the adjustment parameters so that after the probe chuck is set, the parallelism between the outer surface in contact with the multi-layer organic substrate and the contact surface meets the preset conditions.

[0045] In some embodiments, the physical trimming may include machining the mounting surface based on the thinning height and the thinning angle to remove part of the material forming the mounting table, so that the corrected mounting surface can be in full contact with the contact surface or remain completely parallel. It can be known that the probe chuck 140 is disposed on the mounting surface. After the mounting surface is corrected and the probe chuck 140 is mounted on the mounting surface, the parallelism between its outer surface 141 and the contact surface 121 of the multi-layer organic substrate 120 will meet the preset conditions. Exemplarily, the preset conditions may include that the parallelism does not exceed 10 μm. For example, the parallelism may be 0 - 10 μm, 0 - 9 μm, 0 - 8 μm, 0 - 7 μm, 0 - 6 μm, 0 - 5 μm, etc., and the present application does not make specific limitations. Or, it may also be other selections within the above range, such as 5 - 10 μm.

[0046] In some embodiments, the physical trimming can be performed by means of milling, grinding, planing, laser, etc., and the devices used may include the machining devices corresponding to these operations. The situation after trimming can be referred to Figure 6 as shown.

[0047] It can be known that when the mounting surface is trimmed, the horizontal accuracy of the tip of the probe carried by the probe chuck 140 will shift. In order to ensure the horizontal accuracy of the tip to meet the test requirements and improve the test accuracy, the attitude of the printed circuit board can be adjusted. Refer to Figure 7 and in combination with Figure 6 , since the mounting surface 131 of the mounting table 130 is cut, the probe chuck 140 is actually in a state where the left side is high and the right side is low (as shown in Figure 6 ). In order to restore the right side of the probe chuck 140 to be flush with the left side, a supplementary structure 150 can be installed on the back surface 112 of the printed circuit board 110 (that is, the side opposite to the bearing surface 111) (as shown in Figure 7 ). The installation position and thickness of the supplementary structure 150 can be realized based on the aforementioned height difference and inclination angle. Exemplarily, Figure 7 the dotted line shown in is the position where the back surface 112 of the printed circuit board 110 is located before the supplement is added, that is, as shown in Figure 6The situation shown in . At this time, the offset of the horizontal accuracy of the probe tip of the probe chuck 140 is caused by the cutting of the mounting base 130. Then, as long as the compensating structure 150 can offset the movement of the spatial position of the probe chuck 140 caused by this part of the chamfering, the horizontal accuracy of the probe tip can be restored. In this way, the compensating structure 150 can determine the physical parameters based on the data used during cutting (that is, the aforementioned height difference and tilt angle). For example, it is determined based on the reverse process operation for the aforementioned steps, and the compensating thickness for the printed circuit board 110 is determined based on the adjustment parameters (especially the height difference), and this compensating thickness is provided by the compensating structure 150.

[0048] The leveling method of the probe card disclosed in the present application, by confirming the installation differences between the multi-layer organic substrate and the mounting base respectively compared with the printed circuit board, physically trims the mounting base, so that after the probe chuck is set on the mounting base, it can have the parallelism within the test requirements with the multi-layer organic substrate, thereby avoiding affecting the test process and improving the test accuracy.

[0049] It should be noted that the descriptions of the above Figure 3 for each step are only for illustration and explanation, and do not limit the scope of application of this specification. For those skilled in the art, various corrections and changes can be made to the Figure 3 for each step under the guidance of this specification. However, these corrections and changes are still within the scope of this specification.

[0050] The present application also discloses a probe card, and the probe card can be determined based on the leveling method as described above.

[0051] The present application also discloses a leveling device for a probe card. The leveling device can execute the leveling method as described above. Referring to Figure 8 , the leveling device 800 can include a stage 810, a moving component 820, a data acquisition component 830, and a processing component 840.

[0052] The stage 810 can be used to place the probe card, including metals, polymer materials, stone materials, etc. that can be used to make the stage 810. Generally, the probe card can be directly carried by the stage 810. For example, the printed circuit board can be first placed on the stage 810, and then other components of the probe card are sequentially installed on the printed circuit board. The stage 810 can include a plurality of limiting structures 811, which can be used to limit the position of the probe card. For example, the placed printed circuit board is clamped to keep the entire probe card in a fixed position during the leveling process.

[0053] The moving component 820 can be used to drive the movement of other components of the leveling device 800. For example, the data acquisition component 830 and / or the processing component 840. A possible implementation may be that the moving component 820 may include a cross-rail structure, such as a cross rail. As Figure 8 shown, the bottom rail 821 disposed at the edge of the stage 810, the lateral rail 822 mounted on the bottom rail, and the free slider 823 disposed on the lateral rail. In Figure 8 the given coordinate system, the lateral rail 822 can slide along the x direction on the bottom rail 821, and the free slider 823 can slide along the y direction on the lateral rail 822. At the same time, a moving stage 824 can be provided on the free slider 823, which can slide along the z direction on the free slider 823. Based on the movement combination of the above-mentioned multiple components, the other components of the leveling device 800 are driven to move.

[0054] The data acquisition component 830 can be disposed on the moving component 820. For example, it can be disposed on the moving stage 824. The data acquisition component 830 can move in a three-dimensional space (e.g., Figure 8 the space defined by the coordinate system in ) under the drive of the moving component 820, while performing relevant data acquisition. For example, as described above, obtaining the coordinate values of multiple feature points on the contact surface of the multi-layer organic substrate and the mounting surface of the mounting seat in the coordinate system. In one implementation, the data acquisition component 830 may include a height gauge.

[0055] The processing component 840 can also be disposed on the moving component 820, such as the moving stage 824. For example, the processing component 840 may include a milling cutter, which is rotatably and fixedly disposed on the moving stage 824. The rotational force is transmitted to the milling cutter through other force transmission components such as hydraulic transmission components, so as to drive the milling cutter to rotate for mechanical processing of the probe card, especially the mounting seat.

[0056] The leveling device 800 may further include a control component. The control component may be electrically connected to the moving component 820, the data acquisition component 830, and the processing component 840 for controlling the operation of the above components. Exemplarily, the control component may control the movement of the moving component 820, and control the data acquisition component to acquire spatial parameters of multiple components of the probe card (especially the contact surface of the multi-layer organic substrate and the mounting surface of the mounting base), and at the same time control the processing component to perform machining on the mounting base of the probe card. In one example, after the data acquisition component 830 controllably acquires relevant spatial parameters, it may transmit these spatial parameters to the control component, and the control component may determine a machining instruction for the components of the probe card (such as the mounting base) based on the spatial parameters and transmit it to the processing component 840. After receiving the machining instruction, the processing component 840 may perform machining on the components of the probe card. The formation of the machining instruction may refer to the foregoing Figure 3 related descriptions, such as the determination of adjustment parameters.

[0057] In some embodiments, the control component may be a computing device, including but not limited to a server, an industrial computer, a desktop computer, a laptop computer, a smart mobile device, a PLD, an MCU, etc. or any combination thereof. Refer to Figure 9 the exemplary block diagram of the computing device shown for implementing the above control component.

[0058] The computing device 900 may include any components used to implement the system described in the embodiments of the present application. For example, the computing device 900 may be implemented by hardware, a software program, firmware, or a combination thereof. For convenience, Figure 9 only one processing device is drawn, but the computing functions described in the embodiments of the present application may be implemented in a distributed manner by a group of similar platforms to disperse the processing load of the system.

[0059] In some embodiments, the computing device 900 may include a processor 910, a memory 920, an input / output component 930, and a communication port 940. In some embodiments, the processor (e.g., CPU) 910 may execute program instructions in the form of one or more processors. In some embodiments, the memory 920 includes different forms of program memory and data memory, such as a hard disk, a read-only memory (ROM), a random access memory (RAM), etc., for storing various data files processed and / or transmitted by a computer. In some embodiments, the input / output component 930 may be used to support input / output between the computing device 900 and other components. In some embodiments, the communication port 940 may be connected to a network for data communication. An exemplary processing device may include program instructions executed by the processor 910 stored in a read-only memory (ROM), a random access memory (RAM), and / or other types of non-temporary storage media. The method and / or process of the embodiment of this specification may be implemented in the form of program instructions. The computing device 900 may also receive the programs and data disclosed in this application via network communication.

[0060] For ease of understanding, Figure 9 Only one processor is drawn as an example. However, it should be noted that the computing device 900 in the embodiment of this specification may include multiple processors, so the operations and / or methods implemented by one processor described in the embodiment of the present application may also be implemented jointly or independently by multiple processors. For example, if in this specification, the processor of the computing device 900 performs steps A and B, it should be understood that steps A and B may also be performed jointly or independently by two different processors of the computing device 900 (for example, the first processor performs step A, the second processor performs step B, or the first and second processors perform steps A and B jointly).

[0061] The present application has described the basic concepts. Obviously, for those skilled in the art, the above detailed disclosure is only for example and does not constitute a limitation of the present application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements and amendments to the present application. Such modifications, improvements and amendments are suggested in the present application, so such modifications, improvements and amendments still belong to the spirit and scope of the exemplary embodiments of the present application.

[0062] Meanwhile, this application uses specific terms to describe the embodiments of this application. For example, "one embodiment", "an embodiment", and / or "some embodiments" mean a certain feature, structure, or characteristic related to at least one embodiment of this application. Therefore, it should be emphasized and noted that "an embodiment" or "one embodiment" or "an alternative embodiment" mentioned twice or more at different positions in this application does not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of this application can be appropriately combined.

[0063] Similarly, it should be noted that, in order to simplify the description of this application disclosure and thus help the understanding of one or more embodiments of the invention, in the previous description of the embodiments of this application, sometimes multiple features are grouped into one embodiment or its description. However, this disclosure method does not mean that the features required by the subject matter of this application are more than those mentioned in the claims. In fact, the features of the embodiment are less than all the features of the single embodiment disclosed above.

[0064] Finally, it should be understood that the embodiments described in this application are only used to illustrate the principles of the embodiments of this application. Other variations may also fall within the scope of this application. Therefore, by way of example and not limitation, alternative configurations of the embodiments of this application can be regarded as consistent with the teachings of this application. Accordingly, the embodiments of this application are not limited to the embodiments explicitly introduced and described in this application. The above are only the preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of this application shall be included in the protection scope of this application.

Claims

1. A method for leveling a probe card, the probe card comprising a printed circuit board, a multi-layer organic substrate, a mounting platform and a probe card head; wherein: The multi-layer organic substrate and the mounting platform are arranged on the bearing surface of the printed circuit board, and the mounting platform surrounds the multi-layer organic substrate; the probe card head is arranged on the mounting surface of the mounting platform and contacts with the contact surface of the multi-layer organic substrate; the leveling method includes: determining a spatial difference between the mounting surface and the contact surface; Based on the spatial difference, determining an adjustment parameter for the mounting surface; The mounting surface is physically trimmed based on the adjustment parameters so that after the probe card head is set, the parallelism between the outer surface in contact with the multi-layer organic substrate and the contact surface meets a preset condition.

2. The leveling method according to claim 1, characterized in that: Determining the spatial difference between the mounting surface and the contact surface includes: determining a first mathematical expression of the mounting surface relative to the bearing surface; determining a second mathematical expression of the contact surface relative to the bearing surface; The spatial difference is determined based on the first mathematical representation and the second mathematical representation.

3. The leveling method according to claim 2, characterized in that: The first mathematical expression includes a first surface equation of the mounting surface in a spatial coordinate system with the bearing surface as a base surface, and the second mathematical expression includes a second surface equation of the contact surface in the spatial coordinate system; and determining the spatial difference includes: Comparing the first surface equation and the second surface equation in parallel with each other, corresponding to curve values ​​of a plurality of comparison points on the base surface in the space coordinate system; A difference value determined based on the curve value is designated as the spatial difference.

4. The leveling method according to claim 3, characterized in that: The first surface equation and the second surface equation are constructed based on a plurality of feature points of the mounting surface and the contact surface, respectively, and the feature points include at least corner points and center points.

5. The leveling method according to claim 3, characterized in that: The difference value includes at least the height difference and the tilt angle.

6. The leveling method according to claim 3, characterized in that: The adjustment parameters include a thinning height for the mounting surface determined based on the height difference, and a thinning angle for the mounting surface determined based on the inclination angle; the physical trimming includes machining the mounting surface based on the thinning height and the thinning angle, including at least milling.

7. The leveling method according to claim 3 / 1, characterized in that: The preset condition includes that the parallelism does not exceed 10 μm.

8. The leveling method according to claim 3, characterized in that: The leveling method further comprises: The additional thickness for the printed circuit board is determined based on the adjustment parameters; the additional thickness is achieved by installing an additional structure on the back side of the printed circuit board relative to the bearing surface.

9. A probe card, characterized in that: The probe card is determined based on the planarization method according to any one of claims 1-8.

10. A probe card leveling device, characterized in that: The leveling device comprises: a stage; a moving component; a data acquisition component; a processing component; and a control component; wherein, The carrier is used to place the probe card; the data acquisition component and the processing component are arranged on the moving component, and are driven by the moving component to move in three-dimensional space; the control component is electrically connected to the moving component, the data acquisition component and the processing component, and is used to control the operation of the moving component, the data acquisition component and the processing component; The data acquisition component transmits the acquired spatial parameters of the multiple components of the probe card to the control component. The control component determines the processing instructions for the components of the probe card based on the spatial parameters and transmits them to the processing component. The processing component performs mechanical processing on the components based on the processing instructions.

Images