False chip replacement method, system and device and computer readable storage medium

Abstract

The invention provides a false wafer replacement method, system and device and a computer readable storage medium, and the method comprises the steps: obtaining false wafer alarm data of a machine, screening available false wafers according to the false wafer alarm data, and dispatching the available false wafers to the machine, replacing the false wafers of a whole wafer transmission box is not needed, and only part of the false wafers are replaced. And the waste of false sheets is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processes, and particularly to a method, system, device and computer-readable storage medium for replacing dummy wafers. Background Art

[0002] Currently, manual monitoring is adopted to regularly inspect the usage times of dummy wafers on the machine platform. When the usage times of the dummy wafers reach the limit, an operator manually operates the machine platform to load a new dummy wafer.

[0003] However, in the prior art, all dummy wafers are replaced, that is, after the machine platform alarms, a whole box of dummy wafers is replaced. When there are multiple types of dummy wafers in the machine platform, when one type of dummy wafer alarms, the entire replacement of dummy wafers will be carried out, resulting in waste of some dummy wafers due to different usage frequencies.

[0004] Therefore, it is necessary to provide a new method, system, device and computer-readable storage medium for replacing dummy wafers to solve the above problems existing in the prior art. Summary of the Invention

[0005] The purpose of the present invention is to provide a method, system, device and computer-readable storage medium for replacing dummy wafers, and replace some dummy wafers to reduce the waste of dummy wafers.

[0006] To achieve the above purpose, the method for replacing dummy wafers of the present invention includes:

[0007] Obtain the dummy wafer alarm data of the machine platform;

[0008] Screen available dummy wafers according to the dummy wafer alarm data;

[0009] Dispatch the available dummy wafers to the machine platform.

[0010] Optionally, before screening the available dummy wafers according to the dummy wafer alarm data, it further includes:

[0011] Control the loading of non-dummy wafers on the machine platform.

[0012] Optionally, the control of the loading of non-dummy wafers on the machine platform includes:

[0013] Judge whether there is a first-state wafer or a second-state wafer in the machine platform, where the first-state wafer is a batch of wafers undergoing a process flow, and the second-state wafer is a list of batches of wafers that have not started the process flow;

[0014] If it is judged that there is the first-state wafer in the machine platform, the machine platform continues to perform the process flow on the first-state wafer until all the first-state wafers complete the process flow, and then re-judge whether there is the first-state wafer or the second-state wafer in the machine platform;

[0015] If it is determined that there is a wafer in the second state in the machine tool, remove the wafer in the second state, and then re-determine whether there is a wafer in the first state or a wafer in the second state in the machine tool;

[0016] Optionally, the dummy wafer replacement method further includes:

[0017] If it is determined that there is no wafer in the first state and no wafer in the second state in the machine tool, change the machine tool from the normal working condition to the shutdown condition, and instruct the machine tool to enter the dummy wafer replacement state.

[0018] Optionally, after dispatching the available dummy wafers to the machine tool, it further includes:

[0019] Release the non-dummy wafer loading control of the machine tool.

[0020] Optionally, dispatching the available dummy wafers to the machine tool includes:

[0021] Determine the dummy wafer replacement mode of the machine tool according to the model of the machine tool;

[0022] Dispatch the available dummy wafers to the machine tool according to the mode to replace the corresponding dummy wafers.

[0023] Optionally, the mode includes a first mode and a second mode. When it is determined that the dummy wafer replacement mode of the machine tool is the first mode according to the model of the machine tool, dispatch the available dummy wafers; when it is determined that the dummy wafer replacement mode of the machine tool is the second mode according to the model of the machine tool, dispatch an empty wafer transfer cassette and the available dummy wafers.

[0024] Optionally, the dummy wafer alarm data includes the type, location and description of the dummy wafer alarm.

[0025] The present invention also provides a dummy wafer replacement system, including an acquisition unit, a screening unit and a dispatching unit. The acquisition unit is used to acquire the dummy wafer alarm data of the machine tool; the screening unit is used to screen the available dummy wafers according to the dummy wafer alarm data, and the dispatching unit is used to dispatch the available dummy wafers to the machine tool.

[0026] Optionally, the dummy wafer replacement system further includes a mode determination unit, and the mode determination unit is used to determine the dummy wafer replacement mode of the machine tool according to the model of the machine tool.

[0027] The present invention also provides a device, including:

[0028] A processor;

[0029] A memory for storing instructions executable by the processor;

[0030] Wherein, when the processor is configured to execute the instructions of the memory, the dummy wafer replacement method is implemented.

[0031] The present invention also provides a computer-readable storage medium, including computer instructions, which implement the dummy wafer replacement method when executed by a processor.

[0032] The beneficial effects of the present invention are as follows: available dummy wafers are screened according to the dummy wafer alarm data, and the available dummy wafers are dispatched to the machine tool. It is not necessary to replace all the dummy wafers in the entire wafer cassette, but only to replace some of the dummy wafers, reducing the waste of dummy wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 is a flowchart of the dummy wafer replacement method in some embodiments of the present invention;

[0034] Figure 2 is a flowchart of the dummy wafer replacement method in some specific embodiments of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0035] To make the objectives, technical solutions, and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings of the present invention. Apparently, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention. Unless otherwise defined, the technical terms or scientific terms used herein shall have the ordinary meanings understood by those of ordinary skill in the art in the field to which the present invention belongs. The terms such as "including" used herein mean that the elements or items appearing before this word cover the elements or items listed after this word and their equivalents, without excluding other elements or items.

[0036] In view of the problems existing in the prior art, embodiments of the present invention provide a dummy wafer replacement method. Referring to Figure 1 , the dummy wafer replacement method includes the following steps:

[0037] S1: Obtain the dummy wafer alarm data of the machine tool, where the dummy wafer alarm data includes the type, position, and description of the dummy wafer alarm;

[0038] S2: Screen available dummy wafers according to the dummy wafer alarm data;

[0039] S3: Dispatch the available dummy wafers to the machine tool.

[0040] In some embodiments, dispatching the available dummy wafers to the machine tool includes:

[0041] Judge the mode of replacing dummy wafers of the machine tool according to the model of the machine tool;

[0042] Dispatch the available dummy wafers to the machine tool according to the pattern to replace the corresponding dummy wafers. The pattern includes a first pattern and a second pattern. When it is determined according to the model of the machine tool that the pattern of replacing the dummy wafer of the machine tool is the first pattern, the available dummy wafers are dispatched; when it is determined according to the model of the machine tool that the pattern of replacing the dummy wafer of the machine tool is the second pattern, an empty wafer cassette and the available dummy wafers are dispatched. Since the methods of dispatching dummy wafers for different machine tools may vary, by judging the model of the machine tool, the correctness of subsequent dispatching of dummy wafers can be ensured. And compared with the prior art, only some dummy wafers can be replaced, avoiding the waste caused by excessive replacement of dummy wafers due to different usage frequencies when multiple types of dummy wafers are used together.

[0043] In some embodiments, before screening the available dummy wafers according to the dummy wafer alarm data, it further includes: controlling the loading of non-dummy wafers on the machine tool, and after dispatching the available dummy wafers to the machine tool, releasing the control of the loading of non-dummy wafers on the machine tool, that is, non-dummy wafers can be dispatched to the machine tool. Compared with the prior art, controlling the loading of non-dummy wafers on the machine tool before screening the available dummy wafers according to the dummy wafer alarm data can prevent products from entering the machine tool when the dummy wafers have not been replaced completely, resulting in machine tool alarms or product scrapping.

[0044] Specifically, the control of the loading of non-dummy wafers on the machine tool includes:

[0045] Judge whether there is a first-state wafer or a second-state wafer in the machine tool. The first-state wafer is a batch of wafers undergoing a process flow, and the second-state wafer is a list of batches of wafers that have not started the process flow;

[0046] If it is judged that there is the first-state wafer in the machine tool, the machine tool continues to perform the process flow on the first-state wafer until all the first-state wafers complete the process flow, and then re-judge whether there is the first-state wafer or the second-state wafer in the machine tool;

[0047] If it is judged that there is the second-state wafer in the machine tool, remove the second-state wafer, and then re-judge whether there is the first-state wafer or the second-state wafer in the machine tool; and after removing the second-state wafer, no new batches of wafers are dispatched to the machine tool.

[0048] In some embodiments, the dummy wafer replacement method further includes: if it is determined that there is no first-state wafer and second-state wafer, changing the machine from the normal operating condition to the shutdown condition, and instructing the machine to enter the dummy wafer replacement state. Compared with the prior art, during the dummy wafer replacement process, changing the machine from the normal operating condition to the shutdown condition, that is, calculating the dummy wafer replacement event into the shutdown, avoids affecting the overall equipment effectiveness (OEE) of the equipment and avoids affecting the calculation of the normal production capacity of the machine due to the dummy wafer replacement.

[0049] Figure 2 It is a flowchart of the dummy wafer replacement method in some specific embodiments of the present invention.

[0050] Refer to Figure 2 , after an alarm is issued when the number of dummy wafers on the machine is insufficient, the Equipment Automation Program (EAP) obtains the dummy wafer alarm data of the machine;

[0051] The Manufacturing Execution System (MES) determines whether there is a first-state wafer or a second-state wafer. The first-state wafer is a batch of wafers undergoing a process flow, and the second-state wafer is a list batch of wafers that have not started the process flow; the Manufacturing Execution System can help implement production plan management, production process control, product quality management, workshop inventory management, project kanban management, etc., and improve the enterprise's manufacturing execution ability. It is mainly oriented to the enterprise's normal manufacturing layer, can quickly issue production plans and monitor the execution of production plans, and is defined as "a management information system for the workshop layer located between the upper-layer plan management system and the lower-layer industrial control". It provides the current status of plan execution, tracking, and all resources (people, equipment, materials, customer requirements, etc.) for operators or managers, aiming to solve the black box problem of the factory production process and achieve the visualization and controllability of the production process. Among them, the Manufacturing Execution System can monitor the operating status of the underlying equipment, collect the status data of equipment and instruments, trigger new events after analysis, calculation, and processing, so as to conveniently and reliably connect the control system and the information system together and timely feedback the production status to the planning layer.

[0052] If the manufacturing execution system determines that there are wafers in the first state, it continues the process flow for the wafers in the first state until all wafers in the first state complete the process flow. Then, the manufacturing execution system re-determines whether there are wafers in the first state or the second state. If the manufacturing execution system determines that there are wafers in the second state, it removes the wafers in the second state. Then, the manufacturing execution system re-determines whether there are wafers in the first state or the second state;

[0053] If the manufacturing execution system determines that there are no wafers in the first state and the second state, it changes the machine from the normal working condition to the shutdown condition and instructs the machine to enter the dummy wafer replacement state. At the same time, the manufacturing execution system and the real-time dispatching system (Real time dispatch, RTD) enter the dummy wafer replacement state;

[0054] The manufacturing execution system filters available dummy wafers based on the dummy wafer alarm data obtained by the equipment automation system;

[0055] The manufacturing execution system determines the dummy wafer replacement mode of the machine according to the model of the machine;

[0056] The Sense Decide Respond (SDR) system dispatches the available dummy wafers to the machine according to the mode to replace the corresponding dummy wafers, that is, only dispatches the available dummy wafers. The available dummy wafers in the wafer transfer cassette are dispatched into the machine, and the alarm dummy wafers in the machine are transferred into the wafer transfer cassette. Then, the manufacturing execution system performs accounting; or the Sense Decide Respond dispatches an empty wafer transfer cassette and new dummy wafers, that is, dispatches an empty wafer transfer cassette and available dummy wafers. The alarm dummy wafers in the machine are transferred into the empty wafer transfer cassette, and the available dummy wafers are transferred into the machine. Then, the manufacturing execution system performs accounting;

[0057] After dispatching the available dummy wafers to the machine, the manufacturing execution system and the real-time dispatching system release the non-dummy wafer loading control of the machine.

[0058] The present invention also provides a dummy wafer replacement system, including an acquisition unit, a screening unit, and a dispatching unit. The acquisition unit is used to acquire the dummy wafer alarm data of the machine; the screening unit is used to filter available dummy wafers according to the dummy wafer alarm data, and the dispatching unit is used to dispatch the available dummy wafers to the machine. Among them, the dummy wafer alarm data includes the type, location, and description of the dummy wafer alarm. The location is the location of the dummy wafer in the machine, and the description is the self-information and number of the dummy wafer.

[0059] In some embodiments, the dummy wafer replacement system further includes a mode determination unit configured to determine the dummy wafer replacement mode of the machine according to the model of the machine tool, and the dispatching unit dispatches the available dummy wafers to the machine tool according to the mode to replace the corresponding dummy wafers.

[0060] In some embodiments, the dummy wafer replacement system further includes a control unit configured to control the loading of non-dummy wafers on the machine tool.

[0061] In some embodiments, the control unit includes a status wafer determination unit configured to determine whether there is a first status wafer or a second status wafer in the machine tool. The first status wafer is a batch of wafers undergoing a process flow, and the second status wafer is a list of batch wafers that have not started the process flow. If the status wafer determination unit determines that there is a first status wafer in the machine tool, the machine tool continues the process flow for the first status wafer until all the first status wafers complete the process flow. Then, the status wafer determination unit re-determines whether there is a first status wafer or a second status wafer in the machine tool. If the status wafer determination unit determines that there is a second status wafer in the machine tool, the second status wafer is removed. Then, the status wafer determination unit re-determines whether there is a first status wafer or a second status wafer in the machine tool. If the status wafer determination unit determines that there is no first status wafer or second status wafer, the machine tool is changed from a normal working condition to a shutdown condition, and the machine tool is instructed to enter the dummy wafer replacement state.

[0062] In some embodiments, the dummy wafer replacement system further includes a control release unit configured to release the control of the non-dummy wafer loading on the machine tool.

[0063] In some embodiments, the dispatching unit includes a mode determination unit and a dispatching subunit. The mode determination unit is configured to determine the dummy wafer replacement mode of the machine according to the model of the machine tool. The dispatching subunit is configured to dispatch the available dummy wafers to the machine tool according to the mode to replace the corresponding dummy wafers.

[0064] The present invention also provides a device, including:

[0065] A processor;

[0066] A memory for storing processor-executable instructions;

[0067] Wherein, when the processor is configured to execute the instructions of the memory, the dummy wafer replacement method is implemented.

[0068] The present invention also provides a computer-readable storage medium, including computer instructions, which, when executed by a processor, implement the method for replacing dummy chips.

[0069] In the embodiments provided in the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. The device embodiments described above are merely illustrative. For example, the division of units is only a logical function division. In actual implementation, there may be other division methods. For another example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the displayed or discussed mutual coupling or direct coupling or communication connection can be through some communication interfaces. The indirect coupling or communication connection of devices or units can be in electrical, mechanical or other forms. The units described as separate components may or may not be physically separated. The components displayed as units may or may not be physical units, that is, they can be located in one place or distributed to multiple network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0070] In addition, each functional unit in the embodiments provided in the present application can be integrated in a processing unit, or each unit can exist physically alone, or two or more units can be integrated in one unit.

[0071] If the functions are implemented in the form of software function units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on such an understanding, the technical solution of the present application, in essence, or the part that contributes to the prior art or a part of this technical solution can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes several instructions to enable a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods in various embodiments of the present application.

[0072] A computer-readable storage medium may, for example, but is not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination of the above. More specific examples of the computer-readable storage medium include: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM), or a flash memory, an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In this document, the computer-readable storage medium may be any tangible medium that contains or stores a program that can be used by or in conjunction with an instruction execution system, apparatus, or device.

[0073] The program code contained on the computer-readable storage medium can be transmitted by any appropriate medium, including but not limited to wireless, wire, optical fiber, or any suitable combination of the above.

[0074] The computer program code for performing the operations of this specification can be written in one or more programming languages or combinations thereof, such as Java, Smalltalk, C++, C language, etc. The program code can be executed entirely on the user's computer, partially on the user's computer, executed as an independent software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server.

[0075] Although the embodiments of the present invention have been described in detail above, it is obvious to those skilled in the art that various modifications and changes can be made to these embodiments. However, it should be understood that such modifications and changes are all within the scope and spirit of the present invention as described in the claims. Moreover, the present invention described herein may have other embodiments and can be implemented or realized in various ways.

Claims

1. A method for replacing dummy wafers, characterized in that, it includes: Obtaining the dummy wafer alarm data of the machine; Screening available dummy wafers according to the dummy wafer alarm data; Dispatching the available dummy wafers to the machine.

2. The dummy wafer replacement method according to claim 1, characterized in that, before screening the available dummy wafers according to the dummy wafer alarm data, it further includes: Controlling the loading of non-dummy wafers on the machine.

3. The dummy wafer replacement method according to claim 2, characterized in that, the controlling the loading of non-dummy wafers on the machine includes: Judging whether there is a first-state wafer or a second-state wafer in the machine, the first-state wafer is the batch wafer undergoing the process flow, and the second-state wafer is the list batch wafer that has not started the process flow; If it is judged that there is the first-state wafer in the machine, the machine continues the process flow for the first-state wafer until all the first-state wafers complete the process flow, and then re-judges whether there is the first-state wafer or the second-state wafer in the machine; If it is judged that there is the second-state wafer in the machine, the second-state wafer is removed, and then re-judges whether there is the first-state wafer or the second-state wafer in the machine.

4. The dummy wafer replacement method according to claim 3, characterized in that, it further includes: If it is judged that there is no first-state wafer and second-state wafer in the machine, the machine is changed from the normal working condition to the shutdown condition, and the machine is instructed to enter the dummy wafer replacement state.

5. The dummy wafer replacement method according to claims 2 to 4, characterized in that, after dispatching the available dummy wafers to the machine, it further includes: Removing the control on the loading of non-dummy wafers on the machine.

6. The dummy wafer replacement method according to claim 1, characterized in that, dispatching the available dummy wafers to the machine includes: Judging the dummy wafer replacement mode of the machine according to the model of the machine; Dispatching the available dummy wafers to the machine according to the mode to replace the corresponding dummy wafers.

7. The dummy wafer replacement method according to claim 1, characterized in that, the mode includes a first mode and a second mode. When it is judged according to the model of the machine that the dummy wafer replacement mode of the machine is the first mode, the available dummy wafers are dispatched; when it is judged according to the model of the machine that the dummy wafer replacement mode of the machine is the second mode, an empty wafer cassette and the available dummy wafers are dispatched.

8. The dummy wafer replacement method according to claim 1, characterized in that, the dummy wafer alarm data includes the type, location and description of the dummy wafer alarm.

9. A dummy wafer replacement system, characterized in that, it includes an acquisition unit, a screening unit and a dispatching unit. The acquisition unit is used to acquire the dummy wafer alarm data of the machine; the screening unit is used to screen available dummy wafers according to the dummy wafer alarm data, and the dispatching unit is used to dispatch the available dummy wafers to the machine.

10. The dummy wafer replacement system according to claim 9 further includes a mode judgment unit, and the mode judgment unit is used to judge the dummy wafer replacement mode of the machine according to the model of the machine.

11. A device, characterized in that, it includes: A processor; A memory for storing instructions executable by the processor; Wherein, when the processor is configured to execute the instructions of the memory, the dummy chip replacement method according to any one of claims 1 to 8 is implemented.

12. A computer-readable storage medium, Characterized in that, It includes computer instructions, and when the computer instructions are executed by a processor, the dummy chip replacement method according to any one of claims 1 to 8 is implemented.

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