Packaging structure of optoelectronic chip and use method thereof

Abstract

The invention relates to the technical field of chip packaging, and discloses a packaging structure of a photoelectronic chip and a using method thereof.The packaging structure comprises a base, the top of the base is fixedly connected with an air pressure box, the top of the base is fixedly connected with an electric telescopic rod, and when the electric telescopic rod drives a pressure applying plate to reach the bottommost part, the pressure applying plate is pressed; a pressure applying plate drives the inclined plane of an inclined panel to make contact with the outer wall of a rotating column, the state shown in the figure 7 is shown, at the moment, the rotating column is pressed to force a blocking sliding plate to slide downwards along the inner wall of a sliding frame, at the moment, an exhaust port and the inner wall of a first air pressure pipe form a circulation gap, and high-pressure gas in an air pressure box can be transmitted to a first air pressure telescopic rod through the first air pressure pipe; the first air pressure telescopic rod drives the cutting knife to slide downwards along the inner wall of the sliding rail through the U-shaped rod, redundant parts of the pins of the electronic chip are removed, it is guaranteed that the lengths of the multiple pins of the electronic chip are equal to the length of the side wall of the electronic chip, and accurate cutting of the pins of the electronic chip is achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging equipment, and particularly to a packaging structure for optoelectronic chips and a method for using the same. Background Art

[0002] For traditional SOP packaging and DIP packaging, the packaging is mostly carried out through six processes, which can be roughly divided into back thinning, wafer cutting, wafer mounting, wire bonding, plastic encapsulation laser printing, and trimming and forming. In recent years, with the continuous development of circuit integration technology, electronic products are increasingly developing towards miniaturization, intelligence, high performance, and high reliability. The packaging technology not only affects the performance of the product, but also restricts the miniaturization of the product.

[0003] In order to adapt to the applications of various devices, the shapes of chips have gradually become diverse, which results in that when trimming and forming the chip pins, different chips need to be manually adjusted before the pins can be accurately cut, affecting the processing efficiency of the equipment. For the above problems, the following solutions are proposed. Summary of the Invention

[0004] To solve the above technical problems, the present invention provides a packaging structure for optoelectronic chips, including a base, a pneumatic box fixedly connected to the top of the base, an electric telescopic rod fixedly connected to the top of the base, a pressing plate fixedly connected to the end of the electric telescopic rod away from the base, a plurality of inclined plates fixedly connected to the bottom of the pressing plate, and a pneumatic telescopic tube penetratingly connected to the top of the pneumatic box;

[0005] An extrusion mechanism, the extrusion mechanism includes an electronic chip, a pneumatic cylinder for extruding and clamping the electronic chip, a piston block I, a fixed column, a sliding column, and a cutting component for cutting the pins of the electronic chip;

[0006] The cutting component includes a fixed block fixedly connected to the outer wall of the fixed column, a sliding track fixedly connected to the bottom of the fixed block, a cutting knife slidably connected to the inner wall of the sliding track, and a U-shaped rod fixedly connected to the top of the cutting knife. Before use, the electronic chip is placed on the top of the pneumatic box, and then the power supply of the electric telescopic rod is turned on. As the electric telescopic rod contracts, the electric telescopic rod drives the pressing plate to move downward synchronously, compressing the air inside the pneumatic telescopic tube. The gas inside the pneumatic telescopic tube is transmitted into a plurality of pneumatic cylinders through the pneumatic box, forcing the piston block I to move outward along the inner wall of the pneumatic cylinder. The piston block I drives the sliding column to contact the side wall of the electronic chip through the fixed column, presenting a state as shown in Figure 1 . And as the sliding column contacts the side wall of the electronic chip, the piston block I is blocked and cannot move outward horizontally. As the pressing plate continues to move downward, high-pressure gas will be formed inside the pneumatic box.

[0007] Preferably, the cutting assembly further includes a first spring fixedly connected to the bottom of the U-shaped rod. One end of the first spring away from the U-shaped rod is fixedly connected to the top of the fixed block. An L-shaped plate is fixedly connected to the side wall of the fixed block, and a sliding frame is fixedly connected to one end of the L-shaped plate away from the fixed block.

[0008] Preferably, the cutting assembly further includes a first pneumatic tube penetrating and connected to the top of the sliding frame. One end of the first pneumatic tube away from the sliding frame is penetratingly connected to the outer wall of the pneumatic box. A blocking slide plate is slidably connected to the inner wall of the sliding frame.

[0009] Preferably, one end of the pneumatic telescopic tube away from the pneumatic box is fixedly connected to the bottom of the pressing plate. A low-pressure assembly is fixedly connected to the side wall of the sliding track, and a limiting assembly is fixedly connected to the inner wall of the fixed column.

[0010] Preferably, the cutting assembly further includes a rotating column rotatably connected to the side wall of the blocking slide plate. An exhaust port is opened at the top of the blocking slide plate. A second spring is fixedly connected to the side wall of the blocking slide plate. A first pneumatic telescopic rod penetrates and connects to the bottom of the sliding frame. One end of the second spring away from the blocking slide plate is fixedly connected to the side wall of the L-shaped plate. When the electric telescopic rod drives the pressing plate to reach the bottommost position, the inclined surface of the inclined panel driven by the pressing plate contacts the outer wall of the rotating column, presenting a state as shown in Figure 7 . At this time, the rotating column is pressed, forcing the blocking slide plate to slide downward along the inner wall of the sliding frame. At this time, a flow gap is formed between the exhaust port and the inner wall of the first pneumatic tube. At this time, the high-pressure gas inside the pneumatic box can be transmitted to the first pneumatic telescopic rod through the first pneumatic tube, so that the first pneumatic telescopic rod drives the cutting knife to slide downward along the inner wall of the sliding track through the U-shaped rod, removing the redundant parts of the pins of the electronic chip. Through the above characteristics of driving the cutting knife to move outward synchronously by the fixed column, it is ensured that the lengths of multiple pins of the electronic chip and the side wall of the electronic chip are equal, realizing precise cutting of the pins of the electronic chip.

[0011] Preferably, the limiting assembly includes a first hydraulic cylinder opened on the inner wall of the fixed column. The inner wall of the first hydraulic cylinder is slidably connected to the outer wall of the sliding column. A sliding groove is opened on the side wall of the first hydraulic cylinder. A limiting plate is slidably connected to the inner wall of the sliding groove. A third spring is fixedly connected to the side wall of the sliding column. A number of limiting teeth are opened on the inner wall of the pneumatic cylinder. Using the above characteristics of the sliding column contacting the outer wall of the electronic chip, a limiting assembly is arranged inside the device. When the sliding column contacts the outer wall of the electronic chip, it presents a state as shown in Figure 8In this state, the sliding column will horizontally move to the right along the inner wall of the first hydraulic cylinder, causing the liquid inside the first hydraulic cylinder to enter the inside of the sliding groove, forcing the limiting plate to slide outward along the inner wall of the sliding groove. The outward-moving limiting plate will enter the inner wall of the limiting tooth opening. At this time, due to the limitation of the limiting plate, the first piston block will not be able to move outward continuously. Through the application of the above components, it is avoided that the first piston block causes excessive pressure on the outer shell of the electronic chip due to the excessive pressure of the high-pressure gas inside the air pressure box, resulting in cracks on the outer wall of the electronic chip and affecting the cutting effect of the device on the electronic chip.

[0012] Preferably, the low-pressure component includes a U-shaped mounting plate fixedly connected to the side wall of the sliding track. One end of the U-shaped mounting plate away from the sliding track is rotatably connected to a rotating plate. One end of the rotating plate away from the U-shaped mounting plate is rotatably connected to a sliding round rod. A pressure-receiving plate is slidably connected to the outer wall of the sliding round rod. Taking advantage of the characteristic that the fixed column drives the sliding track to move outward, a low-pressure component is arranged inside the device. When the sliding track moves outward, the sliding track drives the rotating plate to move synchronously through the U-shaped mounting plate. At this time, the pin part of the electronic chip will enter the inside of the U-shaped mounting plate, presenting a state as Figure 9 In this state, during this process, the fifth spring will force the second piston block to drive the support round rod and the pressure-receiving plate to move upward, so that the top of the pressure-receiving plate contacts the bottom of the pin of the electronic chip.

[0013] Preferably, the low-pressure component further includes a second hydraulic cylinder fixedly connected to the top of the U-shaped mounting plate. A second piston block is slidably connected to the inner wall of the second hydraulic cylinder. The top of the second piston block is fixedly connected to a support round rod. One end of the support round rod away from the second piston block is fixedly connected to the bottom of the pressure-receiving plate. When cutting downward under pressure at the top, the pressure applied downward by the cutting tool will act on the position of the pin of the electronic chip and on the top of the pressure-receiving plate. When the pressure-receiving plate transmits the force received to the second piston block through the support round rod at this time, the second piston block is pressed and slides downward along the inner wall of the second hydraulic cylinder. The rotating baffle and the circulation port will present a state as Figure 10 In this state, the gap formed between the rotating baffle and the circulation port is too small, resulting in difficulty for the liquid at the bottom of the second piston block to reach the top of the second piston block through the above gap. The second piston block can absorb the pressure transmitted by the pressure-receiving plate. Through the application of the above components, it is ensured that there is a load-bearing position at the cutting position of the pin of the electronic chip, and the electronic chip is prevented from being deformed due to excessive pressure.

[0014] Preferably, the low-pressure component further includes a circulation port opened at the top of the second piston block. A rotating baffle is rotatably connected to the inner wall of the circulation port. A fourth spring is fixedly connected to the inner wall of the rotating baffle. A fifth spring is fixedly connected to the bottom of the second piston block. Using the characteristic that the second piston block absorbs the impact force of the cutting knife, a rotating baffle and a circulation port are provided inside the device. Among them, when the second piston block moves downward, due to the too small gap between the rotating baffle and the circulation port, the downward movement speed of the second piston block is slow. When the fifth spring drives the second piston block to move upward, at this time, the rotating baffle will swing downward along the inner wall of the circulation port, presenting the state of G in Figure 7 As shown in. At this time, the gap between the rotating baffle and the circulation port expands. The second piston block can drive the pressure-receiving plate to quickly press against the bottom of the electronic chip pins through the support round rod. The top of the pins contacts the inner bottom of the U-shaped mounting plate to form a clamping state, avoiding the left-right tilt of the electronic chip caused by the difference in the position between the cutting knife and the pins when the cutting knife cuts downward, resulting in deviation of the cutting position; in addition, at this time, the electric telescopic rod extends, so that each component inside the device is reset, and the remaining pin parts inside the top of the air pressure box will pass through the inclined surface inside the air pressure box and finally flow out from the through hole position of the base, presenting the state of F in Figure 3 As shown in.

[0015] A method for using an encapsulation structure of an optoelectronic chip includes the following steps:

[0016] S1: Install the device: Place the electronic chip on the top of the air pressure box, and then turn on the power supply of the electric telescopic rod;

[0017] S2: Start the device: As the electric telescopic rod contracts, the electric telescopic rod drives the pressure-applying plate to move downward synchronously, compressing the air inside the air pressure telescopic tube. The gas inside the air pressure telescopic tube is transmitted into several air pressure cylinders through the air pressure box, forcing the first piston block to move outward along the inner wall of the air pressure cylinder. The first piston block drives the sliding column to contact the side wall of the electronic chip through the fixed column.

[0018] The present invention has the following beneficial effects:

[0019] (1) Aiming at the problem of differences in the shapes of electronic chips, the present invention provides an extrusion mechanism and a cutting component inside the device. Before use, place the electronic chip on the top of the air pressure box, and then turn on the power supply of the electric telescopic rod. As the electric telescopic rod contracts, the electric telescopic rod drives the pressure-applying plate to move downward synchronously, compressing the air inside the air pressure telescopic tube. The gas inside the air pressure telescopic tube is transmitted into several air pressure cylinders through the air pressure box, forcing the first piston block to move outward along the inner wall of the air pressure cylinder. The first piston block drives the sliding column to contact the side wall of the electronic chip through the fixed column, presenting the state of Figure 1the state. After the sliding column contacts the side wall of the electronic chip, the piston block 1 is blocked and cannot move horizontally outward. As the pressing plate continues to move downward, high-pressure gas will be formed inside the air pressure box. When the electric telescopic rod drives the pressing plate to reach the bottom, the inclined surface of the inclined panel driven by the pressing plate contacts the outer wall of the rotating column, presenting as Figure 7 the state. At this time, the rotating column is pressed, forcing the blocking slide plate to slide downward along the inner wall of the sliding frame. At this time, a flow gap is formed between the exhaust port and the inner wall of the air pressure pipe 1. The high-pressure gas inside the air pressure box can be transmitted to the air pressure telescopic rod 1 through the air pressure pipe 1, so that the air pressure telescopic rod 1 drives the cutting knife to slide downward along the inner wall of the sliding track through the U-shaped rod, removing the redundant part of the electronic chip pin. Through the characteristic of driving the cutting knife to move outward synchronously by the fixing column, it is ensured that the lengths of multiple pins of the electronic chip are equal to the side wall of the electronic chip, realizing precise cutting of the electronic chip pins.

[0020] (2) The present invention utilizes the above-mentioned characteristic that the sliding column contacts the outer wall of the electronic chip, and a limiting component is arranged inside the device. When the sliding column contacts the outer wall of the electronic chip, it presents as Figure 8 the state. The sliding column will move horizontally to the right along the inner wall of the hydraulic cylinder 1, causing the liquid inside the hydraulic cylinder 1 to enter the sliding groove, forcing the limiting plate to slide outward along the inner wall of the sliding groove. The outward-sliding limiting plate will enter the inner wall of the limiting tooth opening. At this time, due to the limitation of the limiting plate, the piston block 1 will not be able to move outward continuously. Through the application of the above components, it is avoided that the piston block 1 is under excessive pressure due to the high-pressure gas inside the air pressure box, resulting in excessive pressure on the outer shell of the electronic chip by the fixing column and the sliding column, causing cracks on the outer wall of the electronic chip and affecting the cutting effect of the device on the electronic chip.

[0021] (3) The present invention utilizes the above-mentioned characteristic that the fixing column drives the sliding track to move outward, and a low-pressure component is arranged inside the device. When the sliding track moves outward, the sliding track drives the rotating plate to move synchronously through the U-shaped mounting plate. At this time, the pin part of the electronic chip will enter the inside of the U-shaped mounting plate, presenting as Figure 9 the state. During this process, the spring 5 will force the piston block 2 to drive the supporting round rod and the pressing plate to move upward, so that the top of the pressing plate contacts the bottom of the electronic chip pin. When cutting downward under pressure at the top, the pressure applied downward by the cutting knife will act on the position of the electronic chip pin and on the top of the pressing plate. At this time, when the pressing plate transmits the force received to the piston block 2 through the supporting round rod, the piston block 2 is pressed and slides downward along the inner wall of the hydraulic cylinder 2, and the rotating baffle and the communication port will present as Figure 10In the state where the gap formed between the rotating baffle and the circulation port is too small, it is difficult for the liquid at the bottom of the second piston block to reach the top of the second piston block through the above gap. The second piston block can absorb the pressure transmitted by the pressure receiving plate. Through the application of the above components, the cutting position of the electronic chip pins is guaranteed, and there are load-bearing positions to avoid deformation of the electronic chip due to excessive pressure.

[0022] (4) The present invention utilizes the characteristic that the second piston block absorbs the impact force of the cutting tool. There is a rotating baffle and a circulation port inside the device. Among them, when the second piston block moves downward, due to the too small gap between the rotating baffle and the circulation port, the downward movement speed of the second piston block is slow. When the fifth spring drives the second piston block to move upward, at this time, the rotating baffle will swing downward along the inner wall of the circulation port, presenting the state as shown in Figure 7 G in the figure. At this time, the gap between the rotating baffle and the circulation port expands, and the second piston block can drive the pressure receiving plate to quickly adhere to the bottom of the electronic chip pins through the support round rod. The top of the pins contacts the bottom inner wall of the U-shaped mounting plate to form a clamping state, avoiding the situation where when the cutting tool cuts downward, due to the difference in the positions of the cutting tool and the pins, the electronic chip tilts left and right, resulting in deviation of the cutting position; in addition, at this time, the electric telescopic rod extends, causing each component inside the device to reset, and the remaining pin parts inside the top of the air pressure box will pass through the inclined surface inside the air pressure box and finally flow out from the through hole position of the base, presenting the state as shown in Figure 3 F in the figure. Description of the Drawings

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0024] Figure 1 It is a schematic cross-sectional view of the overall structure of the present invention;

[0025] Figure 2 It is a schematic diagram of the overall structure of the present invention;

[0026] Figure 3 It is a schematic cross-sectional view of the extrusion mechanism of the present invention;

[0027] Figure 4 It is a schematic cross-sectional view of the internal components of the extrusion mechanism of the present invention;

[0028] Figure 5 It is a schematic cross-sectional view of the cutting component of the present invention;

[0029] Figure 6 For the present invention Figure 6 An enlarged schematic view of A in the figure;

[0030] Figure 7 For the present invention Figure 4 Enlarged schematic diagram of B in the present invention;

[0031] Figure 8 Cross-sectional schematic diagram of the limiting component of the present invention;

[0032] Figure 9 Cross-sectional schematic diagram of the low-voltage component of the present invention;

[0033] Figure 10 For the present invention Figure 9 Schematic diagram of B in the present invention;

[0034] Figure 11 Schematic diagram of the working state of the low-voltage component of the present invention;

[0035] Figure 12 Schematic diagram of the working process of the present invention.

[0036] In the attached drawings, the list of components represented by each reference numeral is as follows:

[0037] In the figure: 1, base; 11, air pressure box; 12, electric telescopic rod; 13, pressing plate; 14, inclined panel; 15, air pressure telescopic tube; 2, extrusion mechanism; 21, electronic chip; 22, air pressure cylinder; 23, piston block one; 24, fixed column; 25, sliding column; 3, cutting component; 31, fixed block; 32, sliding track; 33, cutting knife; 34, U-shaped rod; 35, spring one; 36, L-shaped plate; 37, sliding frame; 38, air pressure tube one; 39, blocking slide plate; 310, rotating column; 311, exhaust port; 312, spring two; 313, air pressure telescopic rod one; 4, limiting component; 41, hydraulic cylinder one; 42, sliding groove; 43, limiting plate; 44, spring three; 45, limiting tooth opening; 5, low-voltage component; 51, U-shaped mounting plate; 52, rotating plate; 53, sliding round rod; 54, pressure receiving plate; 55, hydraulic cylinder two; 56, piston block two; 57, supporting round rod; 58, circulation port; 59, rotating baffle; 510, spring four; 511, spring five. Detailed implementation manners

[0038] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0039] Example 1, please refer to Figure 1 - Figure 7, the present invention is a packaging structure for an optoelectronic chip, including a base 1. A pneumatic box 11 is fixedly connected to the top of the base 1. An electric telescopic rod 12 is fixedly connected to the top of the base 1. One end of the electric telescopic rod 12 away from the base 1 is fixedly connected to a pressing plate 13. A plurality of inclined panels 14 are fixedly connected to the bottom of the pressing plate 13. A pneumatic telescopic tube 15 is connected through the top of the pneumatic box 11;

[0040] An extrusion mechanism 2, the extrusion mechanism 2 includes an electronic chip 21, a pneumatic cylinder 22 for extruding and clamping the electronic chip 21, a first piston block 23, a fixed column 24, a sliding column 25, and a cutting assembly 3 for cutting the pins of the electronic chip 21;

[0041] The cutting assembly 3 includes a fixed block 31 fixedly connected to the outer wall of the fixed column 24. A sliding track 32 is fixedly connected to the bottom of the fixed block 31. A cutting knife 33 is slidably connected to the inner wall of the sliding track 32. A U-shaped rod 34 is fixedly connected to the top of the cutting knife 33. Before use, the electronic chip 21 is placed on the top of the pneumatic box 11. Subsequently, the power supply of the electric telescopic rod 12 is turned on. As the electric telescopic rod 12 contracts, the electric telescopic rod 12 drives the pressing plate 13 to move downward synchronously, compressing the air inside the pneumatic telescopic tube 15. The gas inside the pneumatic telescopic tube 15 is introduced into a plurality of pneumatic cylinders 22 through the pneumatic box 11, forcing the first piston block 23 to move outward along the inner wall of the pneumatic cylinder 22. The first piston block 23 drives the sliding column 25 to contact the side wall of the electronic chip 21 through the fixed column 24, presenting a state as Figure 1 . And as the sliding column 25 contacts the side wall of the electronic chip 21, the first piston block 23 is blocked and cannot move outward horizontally. As the pressing plate 13 continues to move downward, high-pressure gas will be formed inside the pneumatic box 11.

[0042] Example two, please refer to Figure 8 - Figure 12 , the present invention is a packaging structure for an optoelectronic chip. On the basis of Example one, the cutting assembly 3 further includes a first spring 35 fixedly connected to the bottom of the U-shaped rod 34. One end of the first spring 35 away from the U-shaped rod 34 is fixedly connected to the top of the fixed block 31. An L-shaped plate 36 is fixedly connected to the side wall of the fixed block 31. One end of the L-shaped plate 36 away from the fixed block 31 is fixedly connected to a sliding frame 37.

[0043] The cutting assembly 3 further includes a first pneumatic tube 38 connected through the top of the sliding frame 37. One end of the first pneumatic tube 38 away from the sliding frame 37 is connected through the outer wall of the pneumatic box 11. A blocking slide plate 39 is slidably connected to the inner wall of the sliding frame 37.

[0044] One end of the pneumatic telescopic tube 15 away from the pneumatic box 11 is fixedly connected to the bottom of the pressing plate 13. A low-pressure assembly 5 is fixedly connected to the side wall of the sliding track 32. A limiting assembly 4 is fixedly connected to the inner wall of the fixed column 24.

[0045] The cutting assembly 3 further includes a rotating column 310 rotatably connected to the side wall of the blocking slide plate 39. An exhaust port 311 is opened at the top of the blocking slide plate 39. A second spring 312 is fixedly connected to the side wall of the blocking slide plate 39. A first pneumatic telescopic rod 313 is connected through the bottom of the sliding frame 37. One end of the second spring 312 away from the blocking slide plate 39 is fixedly connected to the side wall of the L-shaped plate 36. When the electric telescopic rod 12 drives the pressing plate 13 to reach the bottom, the inclined surface of the inclined panel 14 driven by the pressing plate 13 contacts the outer wall of the rotating column 310, presenting a state as shown in Figure 7 . At this time, the rotating column 310 is pressed, forcing the blocking slide plate 39 to slide downward along the inner wall of the sliding frame 37. At this time, a flow gap is formed between the exhaust port 311 and the inner wall of the first pneumatic tube 38. At this time, the high-pressure gas inside the pneumatic box 11 can be transmitted to the first pneumatic telescopic rod 313 through the first pneumatic tube 38, so that the first pneumatic telescopic rod 313 drives the cutting knife 33 to slide downward along the inner wall of the sliding track 32 through the U-shaped rod 34, removing the redundant parts of the pins of the electronic chip 21. By the characteristic of driving the cutting knife 33 to move outward synchronously through the fixing column 24, it is ensured that the lengths of multiple pins of the electronic chip 21 and the side wall of the electronic chip 21 are equal, realizing precise cutting of the pins of the electronic chip 21.

[0046] The limiting assembly 4 includes a first hydraulic cylinder 41 opened on the inner wall of the fixing column 24. The inner wall of the first hydraulic cylinder 41 is slidably connected to the outer wall of the sliding column 25. A sliding groove 42 is opened on the side wall of the first hydraulic cylinder 41. A limiting plate 43 is slidably connected to the inner wall of the sliding groove 42. A third spring 44 is fixedly connected to the side wall of the sliding column 25. A number of limiting tooth openings 45 are opened on the inner wall of the pneumatic cylinder 22. By using the characteristic that the sliding column 25 contacts the outer wall of the electronic chip 21, a limiting assembly 4 is arranged inside the device. When the sliding column 25 contacts the outer wall of the electronic chip 21, it presents a state as shown in Figure 8 . The sliding column 25 will horizontally move to the right along the inner wall of the first hydraulic cylinder 41, so that the liquid inside the first hydraulic cylinder 41 enters the inside of the sliding groove 42, forcing the limiting plate 43 to slide outward along the inner wall of the sliding groove 42. The outward moving limiting plate 43 will enter the inner wall of the limiting tooth opening 45. At this time, due to the limitation of the limiting plate 43, the first piston block 23 will not be able to move outward continuously. Through the application of the above components, it is avoided that the first piston block 23 causes excessive pressure on the outer shell of the electronic chip 21 due to excessive pressure of the high-pressure gas inside the pneumatic box 11, resulting in cracks on the outer wall of the electronic chip 21 and affecting the cutting effect of the device on the electronic chip 21.

[0047] The low-voltage component 5 includes a U-shaped mounting plate 51 fixedly connected to the side wall of the sliding track 32. One end of the U-shaped mounting plate 51 away from the sliding track 32 is rotatably connected to a rotating plate 52. One end of the rotating plate 52 away from the U-shaped mounting plate 51 is rotatably connected to a sliding round rod 53. A pressure-receiving plate 54 is slidably connected to the outer wall of the sliding round rod 53. Utilizing the characteristic that the fixed column 24 drives the sliding track 32 to move outward, a low-voltage component 5 is provided inside the device. When the sliding track 32 moves outward, the sliding track 32 drives the rotating plate 52 to move synchronously through the U-shaped mounting plate 51. At this time, the pin part of the electronic chip 21 will enter the inside of the U-shaped mounting plate 51, presenting a state as shown in Figure 9 . During this process, the spring five 511 will force the piston block two 56 to drive the support round rod 57 and the pressure-receiving plate 54 to move upward, so that the top of the pressure-receiving plate 54 contacts the bottom of the pin of the electronic chip 21.

[0048] The low-voltage component 5 further includes a second hydraulic cylinder 55 fixedly connected to the top of the U-shaped mounting plate 51. A piston block two 56 is slidably connected to the inner wall of the second hydraulic cylinder 55. A support round rod 57 is fixedly connected to the top of the piston block two 56. One end of the support round rod 57 away from the piston block two 56 is fixedly connected to the bottom of the pressure-receiving plate 54. When the top is pressed and cut downward, the pressure applied by the cutting knife 33 downward will act on the pin position of the electronic chip 21 and on the top of the pressure-receiving plate 54. At this time, when the pressure-receiving plate 54 transmits the force received to the piston block two 56 through the support round rod 57, the piston block two 56 is pressed and slides downward along the inner wall of the second hydraulic cylinder 55, and the rotating baffle 59 and the flow port 58 will present a state as shown in Figure 10 . The gap formed between the rotating baffle 59 and the flow port 58 is too small, resulting in difficulty for the liquid at the bottom of the piston block two 56 to reach the top of the piston block two 56 through the above gap. The piston block two 56 can absorb the pressure transmitted by the pressure-receiving plate 54. Through the application of the above components, it is ensured that there is a load-bearing position at the cutting position of the pin of the electronic chip 21, preventing the electronic chip 21 from being deformed due to excessive pressure.

[0049] The low-voltage component 5 further includes a flow port 58 opened at the top of the piston block two 56. A rotating baffle 59 is rotatably connected to the inner wall of the flow port 58. A spring four 510 is fixedly connected to the inner wall of the rotating baffle 59. A spring five 511 is fixedly connected to the bottom of the piston block two 56. Utilizing the characteristic that the piston block two 56 absorbs the impact force of the cutting knife 33, a rotating baffle 59 and a flow port 58 are provided inside the device. Among them, when the piston block two 56 moves downward, due to the too small gap between the rotating baffle 59 and the flow port 58, the downward movement speed of the piston block two 56 is slow. When the spring five 511 drives the piston block two 56 to move upward, at this time, the rotating baffle 59 will swing downward along the inner wall of the flow port 58, presenting a state as shown in Figure 7The state of G in the figure. At this time, the gap between the rotating baffle 59 and the circulation port 58 expands. The second piston block 56 can drive the pressure receiving plate 54 to quickly press against the bottom of the pins of the electronic chip 21 through the support round rod 57. The top of the pins contacts the inner bottom wall of the U-shaped mounting plate 51, forming a clamping state. When the cutting knife 33 cuts downward, due to the difference in the position between the cutting knife 33 and the pins, the electronic chip 21 may tilt left and right, resulting in a deviation in the cutting position. In addition, at this time, the electric telescopic rod 12 extends, causing each component inside the device to reset. The remaining pin parts inside the top of the air pressure box 11 will pass through the inclined surface inside the air pressure box 11 and finally flow out from the through hole position of the base 1, presenting as Figure 3 the state of F in the figure.

[0050] The usage method of the packaging structure of the optoelectronic chip includes the following steps:

[0051] S1: Install the device: Place the electronic chip 21 on the top of the air pressure box 11, and then turn on the power supply of the electric telescopic rod 12;

[0052] S2: Start the device: As the electric telescopic rod 12 contracts, the electric telescopic rod 12 drives the pressure application plate 13 to move downward synchronously, compressing the air inside the air pressure telescopic tube 15. The gas inside the air pressure telescopic tube 15 is transmitted into several air pressure cylinders 22 through the air pressure box 11, forcing the first piston block 23 to move outward along the inner wall of the air pressure cylinder 22. The first piston block 23 drives the sliding column 25 to contact the side wall of the electronic chip 21 through the fixed column 24.

[0053] A specific application of this embodiment is: Before use, place the electronic chip 21 on the top of the air pressure box 11, and then turn on the power supply of the electric telescopic rod 12. As the electric telescopic rod 12 contracts, the electric telescopic rod 12 drives the pressure application plate 13 to move downward synchronously, compressing the air inside the air pressure telescopic tube 15. The gas inside the air pressure telescopic tube 15 is transmitted into several air pressure cylinders 22 through the air pressure box 11, forcing the first piston block 23 to move outward along the inner wall of the air pressure cylinder 22. The first piston block 23 drives the sliding column 25 to contact the side wall of the electronic chip 21, presenting as Figure 1 the state in the figure. After the sliding column 25 contacts the side wall of the electronic chip 21, the first piston block 23 is blocked and cannot move horizontally outward. As the pressure application plate 13 continues to move downward, high-pressure gas will be formed inside the air pressure box 11. When the electric telescopic rod 12 drives the pressure application plate 13 to reach the bottom, the pressure application plate 13 drives the inclined surface of the inclined panel 14 to contact the outer wall of the rotating column 310, presenting as Figure 7At this state, the rotating column 310 is pressed, forcing the blocking slide plate 39 to slide downward along the inner wall of the sliding frame 37. At this time, a flow gap is formed between the exhaust port 311 and the inner wall of the first pneumatic tube 38. At this time, the high-pressure gas inside the pneumatic box 11 can be transmitted to the first pneumatic telescopic rod 313 through the first pneumatic tube 38, so that the first pneumatic telescopic rod 313 drives the cutting knife 33 to slide downward along the inner wall of the sliding track 32 through the U-shaped rod 34, removing the redundant parts of the pins of the electronic chip 21. Through the feature of driving the cutting knife 33 to move outward synchronously by the fixing column 24, it is ensured that the lengths of multiple pins of the electronic chip 21 and the side wall of the electronic chip 21 are equal, realizing precise cutting of the pins of the electronic chip 21.

[0054] Using the feature that the above-mentioned sliding column 25 contacts the outer wall of the electronic chip 21, a limiting component 4 is arranged inside the device. When the sliding column 25 contacts the outer wall of the electronic chip 21, it presents as Figure 8 At this state, the sliding column 25 will horizontally move to the right along the inner wall of the first hydraulic cylinder 41, so that the liquid inside the first hydraulic cylinder 41 enters the inside of the sliding groove 42, forcing the limiting plate 43 to slide outward along the inner wall of the sliding groove 42. The outward-moving limiting plate 43 will enter the inner wall of the limiting tooth opening 45. At this time, due to the limitation of the limiting plate 43, the first piston block 23 will not be able to move outward continuously. Through the application of the above components, it is avoided that the first piston block 23 causes excessive pressure on the outer shell of the electronic chip 21 due to the excessive pressure of the high-pressure gas inside the pneumatic box 11, resulting in cracks on the outer wall of the electronic chip 21 and affecting the cutting effect of the device on the electronic chip 21.

[0055] Using the feature that the above-mentioned fixing column 24 drives the sliding track 32 to move outward, a low-pressure component 5 is arranged inside the device. When the sliding track 32 moves outward, the sliding track 32 drives the rotating plate 52 to move synchronously through the U-shaped mounting plate 51. At this time, the pin part of the electronic chip 21 will enter the inside of the U-shaped mounting plate 51, presenting as Figure 9 At this state, in this process, the fifth spring 511 will force the second piston block 56 to drive the supporting round rod 57 and the pressure-receiving plate 54 to move upward, so that the top of the pressure-receiving plate 54 contacts the bottom of the pin of the electronic chip 21; when cutting downward under pressure at the top, the pressure applied downward by the cutting knife 33 will act on the pin position of the electronic chip 21 and act on the top of the pressure-receiving plate 54. At this time, when the pressure-receiving plate 54 transmits the force received to the second piston block 56 through the supporting round rod 57, the second piston block 56 is pressed and slides downward along the inner wall of the second hydraulic cylinder 55, and the rotating baffle 59 and the communication port 58 will present as Figure 10In the state where the gap formed between the rotating baffle 59 and the circulation port 58 is too small, it is difficult for the liquid at the bottom of the second piston block 56 to reach the top of the second piston block 56 through the above gap. The second piston block 56 can absorb the pressure transmitted by the pressure receiving plate 54. Through the application of the above components, the cutting position of the pins of the electronic chip 21 is guaranteed, and there are load-bearing positions to prevent the electronic chip 21 from being deformed due to excessive pressure.

[0056] Utilizing the characteristic that the second piston block 56 absorbs the impact force of the cutting tool 33, a rotating baffle 59 and a circulation port 58 are provided inside the device. Among them, when the second piston block 56 moves downward, due to the too small gap between the rotating baffle 59 and the circulation port 58, the downward movement speed of the second piston block 56 is slow. When the spring five 511 drives the second piston block 56 to move upward, at this time, the rotating baffle 59 will swing downward along the inner wall of the circulation port 58, presenting as Figure 7 the state of G in. At this time, the gap between the rotating baffle 59 and the circulation port 58 expands, and the second piston block 56 can drive the pressure receiving plate 54 to quickly adhere to the bottom of the pins of the electronic chip 21 through the support round rod 57. The top of the pins contacts the inner wall bottom of the U-shaped mounting plate 51 to form a clamping state, preventing the electronic chip 21 from tilting left and right when the cutting tool 33 cuts downward, resulting in deviation of the cutting position due to the difference in the positions of the cutting tool 33 and the pins. In addition, at this time, the electric telescopic rod 12 extends, causing each component inside the device to reset, and the remaining pin parts inside the top of the air pressure box 11 will pass through the inclined surface inside the air pressure box 11 and finally flow out from the through hole position of the base 1, presenting as Figure 3 the state of F in.

[0057] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not elaborate on all details and do not limit the invention to the specific embodiments described. Obviously, many modifications and variations can be made according to the content of this specification. These embodiments are selected and specifically described in this specification to better explain the principle and practical application of the present invention, so that those skilled in the art in the relevant technical field can understand and utilize the present invention well. The present invention is only limited by the claims and their full scope and equivalents.

Claims

1. A packaging structure for an optoelectronic chip, comprising a base (1), the top of the base (1) being fixedly connected to a pressure box (11), the top of the base (1) being fixedly connected to an electric telescopic rod (12), the end of the electric telescopic rod (12) away from the base (1) being fixedly connected to a pressure plate (13), the bottom of the pressure plate (13) being fixedly connected to a plurality of inclined panels (14), the top of the pressure box (11) being through-connected to a pressure telescopic tube (15), characterized in that: Also includes: A pressing mechanism (2), the pressing mechanism (2) comprising an electronic chip (21), a pneumatic cylinder (22) for pressing and clamping the electronic chip (21), a piston block (23), a fixed column (24), a sliding column (25), and a cutting assembly (3) for cutting the pins of the electronic chip (21); The cutting assembly (3) comprises a fixed block (31) fixedly connected to the outer wall of the fixed column (24); a sliding track (32) is fixedly connected to the bottom of the fixed block (31); a cutting knife (33) is slidably connected to the inner wall of the sliding track (32); and a U-shaped rod (34) is fixedly connected to the top of the cutting knife (33).

2. The packaging structure of an optoelectronic chip according to claim 1, characterized in that: The cutting assembly (3) further comprises a spring (35) fixedly connected to the bottom of the U-shaped rod (34); one end of the spring (35) away from the U-shaped rod (34) is fixedly connected to the top of the fixed block (31); an L-shaped plate (36) is fixedly connected to the side wall of the fixed block (31); and one end of the L-shaped plate (36) away from the fixed block (31) is fixedly connected to a sliding frame (37).

3. The packaging structure of an optoelectronic chip according to claim 2, characterized in that: The cutting assembly (3) further comprises an air pressure pipe (38) which is connected to the top of the sliding frame (37). The end of the air pressure pipe (38) which is away from the sliding frame (37) is connected to the outer wall of the air pressure box (11). A blocking slide (39) is slidably connected to the inner wall of the sliding frame (37).

4. The packaging structure of an optoelectronic chip according to claim 3, characterized in that: One end of the air pressure expansion tube (15) away from the air pressure box (11) is fixedly connected to the bottom of the pressure plate (13), the side wall of the sliding track (32) is fixedly connected to the low pressure component (5), and the inner wall of the fixed column (24) is fixedly connected to the limiting component (4).

5. The packaging structure of an optoelectronic chip according to claim 4, characterized in that: The cutting assembly (3) further comprises a rotating column (310) rotatably connected to the side wall of the blocking slide (39); an exhaust port (311) is provided at the top of the blocking slide (39); a second spring (312) is fixedly connected to the side wall of the blocking slide (39); a pneumatic telescopic rod (313) is through-connected to the bottom of the sliding frame (37); and one end of the second spring (312) away from the blocking slide (39) is fixedly connected to the side wall of the L-shaped plate (36).

6. The packaging structure of an optoelectronic chip according to claim 5, characterized in that: The limiting component (4) includes a hydraulic cylinder (41) disposed on the inner wall of a fixed column (24), the inner wall of the hydraulic cylinder (41) being slidably connected to the outer wall of a sliding column (25), a sliding groove (42) being disposed on the side wall of the hydraulic cylinder (41), a limiting plate (43) being slidably connected to the inner wall of the sliding groove (42), a spring (44) being fixedly connected to the side wall of the sliding column (25), and a plurality of limit teeth (45) being disposed on the inner wall of the pneumatic cylinder (22).

7. The packaging structure of an optoelectronic chip according to claim 6, characterized in that: The low-voltage component (5) comprises a U-shaped mounting plate (51) fixedly connected to the side wall of the sliding track (32); one end of the U-shaped mounting plate (51) away from the sliding track (32) is rotatably connected to a rotating plate (52); one end of the rotating plate (52) away from the U-shaped mounting plate (51) is rotatably connected to a sliding round rod (53); and a pressure plate (54) is slidably connected to the outer wall of the sliding round rod (53).

8. The packaging structure of an optoelectronic chip according to claim 7, characterized in that: The low-pressure assembly (5) further comprises a hydraulic cylinder (55) fixedly connected to the top of the U-shaped mounting plate (51), a piston block (56) being slidably connected to the inner wall of the hydraulic cylinder (55), a supporting round rod (57) being fixedly connected to the top of the piston block (56), and an end of the supporting round rod (57) away from the piston block (56) being fixedly connected to the bottom of the pressure plate (54).

9. The packaging structure of an optoelectronic chip according to claim 8, characterized in that: The low-pressure component (5) also includes a flow port (58) opened at the top of the second piston block (56), a rotating baffle (59) is rotatably connected to the inner wall of the flow port (58), a spring four (510) is fixedly connected to the inner wall of the rotating baffle (59), and a spring five (511) is fixedly connected to the bottom of the second piston block (56).

10. A method for using a packaging structure of an optoelectronic chip, using the packaging structure of an optoelectronic chip as claimed in claim 9, characterized in that: The following steps are included: S1: Installing the equipment: placing the electronic chip (21) on the top of the air pressure box (11), and then connecting the power supply of the electric telescopic rod (12); S2: Start the device: As the electric telescopic rod (12) contracts, the electric telescopic rod (12) drives the pressure plate (13) to move downward synchronously, compressing the air inside the pneumatic telescopic tube (15). The gas inside the pneumatic telescopic tube (15) is transmitted to the interior of a plurality of pneumatic cylinders (22) through the pneumatic box (11), forcing the piston block 1 (23) to move outward along the inner wall of the pneumatic cylinder (22). The piston block 1 (23) drives the sliding column (25) through the fixed column (24) to contact the side wall of the electronic chip (21).

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