A wafer alignment system, a wafer bonding apparatus, and a wafer bonding alignment method.

Abstract

This application provides a wafer alignment system, wafer bonding equipment, and wafer bonding alignment method. The wafer alignment system includes a hot plate; a limiting mechanism disposed on the hot plate, wherein the limiting mechanism includes at least two support components that together form a limiting region to support and limit the wafer, and the support components move up and down in a direction perpendicular to the hot plate; and an auxiliary alignment mechanism disposed around the hot plate, wherein the auxiliary alignment mechanism includes at least two pairs of support cantilever arms, all of which rotate synchronously to enter and exit the limiting region, and the two support cantilever arms in each pair rotate synchronously in opposite directions to enter and exit the limiting region. This application reduces the formation of bubbles and voids between the first wafer and the second wafer during the bonding process.

Description

Technical Field

[0001] This application relates to the field of semiconductor equipment technology, and in particular to a wafer alignment system, wafer bonding equipment and wafer bonding alignment method. Background Technology

[0002] Wafer bonding is a wafer-level packaging technology used in the fabrication of microelectromechanical systems (MEMS), nanoelectromechanical systems (NEMS), microelectronics, and optoelectronics to ensure mechanically stable and hermetically sealed packaging. Typically, wafer bonding involves aligning the wafer and substrate before bonding. Therefore, reliable alignment of the wafer and substrate is a crucial preliminary step in the wafer bonding process. In the bonding equipment's process chamber, wafers and substrates of the same size are typically aligned using multiple pins with arc-shaped internal supports at the lower edge of the substrate. Then, a vacuum suction robot transfers the wafer above the substrate and, after calibration, places it on the substrate surface.

[0003] As wafer and carrier sizes continue to increase, air residue remains between the wafer and carrier during the wafer's descent and bonding process. Even after creating a vacuum in the process chamber, voids will still form between the wafer and carrier. Furthermore, due to the unavoidable warpage of both wafers and carriers, air bubbles may accumulate between them after bonding due to van der Waals forces. Once these bubbles are trapped between the wafer and carrier, even after the process chamber is evacuated, they cannot escape and will continue to form voids, significantly impacting the final electrical and mechanical properties of the bonded wafer. Summary of the Invention

[0004] One embodiment of this application discloses a wafer alignment system, comprising: a hot plate; a limiting mechanism disposed on the hot plate, wherein the limiting mechanism includes at least two support components that together form a limiting region to support and limit the wafer, the support components moving up and down in a direction perpendicular to the hot plate; and an auxiliary alignment mechanism disposed around the hot plate, wherein the auxiliary alignment mechanism includes at least two pairs of support cantilevers, all of which rotate synchronously to enter and exit the limiting region, and the two support cantilevers of each pair of support cantilevers rotate synchronously in opposite directions to enter and exit the limiting region.

[0005] In another embodiment of this application, the limiting mechanism further includes a first driving mechanism, wherein the first driving mechanism drives the support component to move up and down in a direction perpendicular to the hot plate.

[0006] In another embodiment of this application, the auxiliary alignment mechanism further includes a rotating mechanism that matches the support cantilever, the rotating mechanism driving the support cantilever to rotate.

[0007] In another embodiment of this application, the wafer alignment system further includes a synchronization mechanism connected to all the rotating mechanisms, which synchronously drives all the rotating mechanisms, thereby synchronously driving all the support cantilever arms.

[0008] In another embodiment of this application, the synchronization mechanism includes a synchronization connection component and a second drive mechanism. The synchronization connection component connects the second drive mechanism and all the rotating mechanisms simultaneously. The second drive mechanism performs a telescopic movement in the vertical direction, thereby synchronously driving all the rotating mechanisms through the synchronization connection component.

[0009] In another embodiment of this application, the synchronous connection assembly includes a frame and a crossbar that spans the frame laterally, wherein the second drive mechanism is connected to the crossbar and all the rotating mechanisms are connected to the frame.

[0010] In another embodiment of this application, the rotating mechanism includes: a top block abutting against the frame, a fixed seat slidably connected to the top block, a drive column, a moving block driven by the drive column and moving up and down in the vertical direction, a rotating shaft connected to the supporting cantilever, and spiral guide grooves symmetrically formed on the sidewalls of the two rotating shafts located on the same side of the hot plate, and guide ends of the two moving blocks located on the same side of the hot plate extending into the spiral guide grooves.

[0011] This application also discloses a wafer bonding apparatus, comprising: a cavity, and a cover connected to the cavity, wherein the cavity and the cover house a wafer alignment system as described in any of the preceding embodiments.

[0012] This application also provides a wafer bonding alignment method using the aforementioned wafer bonding equipment, characterized in that it includes:

[0013] The support assembly is raised to a first preset height, and all the support cantilever arms are rotated synchronously to outside the limiting area. The first wafer is placed on the support assembly, and the first wafer is located in the limiting area, wherein the support assembly supports and limits the first wafer.

[0014] All the support cantilever arms are rotated synchronously to the limiting area, and the second wafer is placed on the support cantilever arms, such that the second wafer is located in the limiting area, wherein the support cantilever arms support the second wafer, and the support assembly limits the second wafer;

[0015] The support assembly is lowered to a second preset height, so that the hot plate heats the first wafer and the cavity is evacuated.

[0016] The support assembly is raised to a third preset height, which is less than or equal to the first preset height. Simultaneously, all the support cantilever arms are rotated outside the limiting area, so that the second wafer falls onto the first wafer.

[0017] Compared with the prior art, the beneficial effects of this application are:

[0018] In this application, the wafer alignment system, through the design of a limiting mechanism and an auxiliary alignment mechanism, can perform alignment operations on two wafers of the same size. For two wafers to be bonded, it facilitates the removal of air between the two wafers during the vacuuming operation, thereby preventing the generation of air bubbles between the two wafers. Based on the wafer alignment system, the wafer bonding equipment and corresponding bonding method can significantly improve the bonding quality.

[0019] In this application, the synchronization mechanism of the wafer alignment system can synchronously drive all the support arms to rotate, and each pair of support arms rotates in opposite directions, which can reduce the impact of friction on wafer stability during the support arm process and ensure that the two wafers to be aligned do not collide.

[0020] This application is applicable to wafer bonding equipment for various wafer sizes, such as 4-inch, 6-inch, 8-inch, and 12-inch. Attached Figure Description

[0021] Figure 1 This is a three-dimensional view of the wafer alignment system of this application from one perspective, wherein, Figure 1 Synchronization connection components are omitted.

[0022] Figure 2 This is a perspective view of the wafer alignment system of this application from another angle, wherein, Figure 2 The synchronous connection component is shown;

[0023] Figure 3 A top view of the wafer alignment system;

[0024] Figure 4 This is a partial side view of the wafer alignment system;

[0025] Figure 5 A perspective view of the first drive mechanism that drives the support assembly to move up and down in the vertical direction;

[0026] Figure 6 A 3D diagram to support the components;

[0027] Figure 7 This is a three-dimensional schematic diagram of the support components included in yet another variation of the wafer alignment system of this application;

[0028] Figure 8A three-dimensional schematic diagram to aid in the alignment mechanism;

[0029] Figure 9 A magnified view of the alignment mechanism to aid in the alignment process;

[0030] Figure 10 This is a three-dimensional schematic diagram of the wafer alignment system of this application placing the first wafer;

[0031] Figure 11 This is a three-dimensional schematic diagram of the wafer alignment system of this application when the first wafer and the second wafer are placed;

[0032] Figure 12 A magnified view of a supporting cantilever that supports a second wafer to isolate the first wafer from the second wafer;

[0033] Figure 13 This is a three-dimensional schematic diagram of another state when the first wafer and the second wafer are placed in the wafer alignment system of this application;

[0034] Figure 14 This is a three-dimensional schematic diagram of another state when the first wafer and the second wafer are placed in the wafer alignment system of this application;

[0035] Figure 15 A perspective view of the housing and base of a wafer bonding device when they are in place. Implementation

[0036] The present application will now be described in detail with reference to the embodiments shown in the accompanying drawings. However, it should be noted that these embodiments are not intended to limit the present application. All equivalent changes or substitutions in function, method, or structure made by those skilled in the art based on these embodiments are within the scope of protection of the present application.

[0037] It should be understood that in this application, the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," and "radial," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this technical solution and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this technical solution.

[0038] This application discloses a wafer alignment system, referring to... Figure 1 and Figure 2 As shown, the wafer alignment system includes: a hot plate 20; a limiting mechanism 30 passing through the hot plate 20; and an auxiliary alignment mechanism 40 surrounding the hot plate 20.

[0039] The limiting mechanism 30 includes at least two supporting components 32 that jointly form a limiting area 200 for limiting and supporting the wafer, and a first driving mechanism 31 that drives the supporting component 32 to move up and down in a direction perpendicular to the hot plate 20. The limiting area 200 is circular to match the wafer, preferably.

[0040] The auxiliary alignment mechanism 40 includes at least two pairs of supporting cantilever arms 42, and the supporting cantilever arms 42 can enter and exit the limiting area 200 by rotation. Those skilled in the art can understand that when the supporting cantilever arms 42 enter and exit the limiting area 200 by rotation, there is of course no interference with the limiting mechanism 30. The auxiliary alignment mechanism 40 further includes a rotating mechanism 41 that matches the supporting cantilever arms 42, and the rotating mechanism 41 drives the supporting cantilever arms 42 to rotate. The wafer alignment system of the present application further includes a synchronization mechanism 5, and the synchronization mechanism 5 synchronously drives all the rotating mechanisms 41, so as to synchronously drive all the supporting cantilever arms 42 to rotate synchronously.

[0041] Refer Figure 1 And Figure 3 As shown, in this embodiment, the hot plate 20 in the present application may include a preheating groove 22 that at least partially accommodates the first wafer 50 and is formed on the surface of the hot plate 20. The shape of the preheating groove 22 matches the wafer design, preferably circular. The supporting component 30 is arranged around the groove 22, and the limiting area 200 formed by the supporting component 30 is preferably less than or equal to the preheating groove. <​​​​​

[0043] Reference Figure 1 、 Figure 5 and Figure 6 As shown, the support component 32 includes a column 331 fixedly connected to the pallet 37, and a supporting member 332 movably connected to the column 331. The supporting member 332 includes a side wall 3321 and a step 3322. The side wall 3321 can limit the wafer, so that the wafer falls within the limiting area 200. Those skilled in the art can understand that the side wall 3321 faces the center of the limiting area 200, so that multiple support components 32 can form the limiting area 200. The step 3322 can support the wafer, and when the wafer is placed on the support component 32, it is supported by the step 3322. Preferably, the side wall 3321 can be an arc-shaped side wall to better limit the wafer. The steps 3322 formed at the top of the support component 32 are preferably located on the same horizontal plane, and the lengths of the columns 331 of the support components 32 to the support columns 36 are equal.

[0044] Those skilled in the art should understand that the shape of the supporting member 332 of the support component 32 in this application can be variable, that is, the supporting member 332 at least includes a step 3322 for supporting the wafer and a side wall 3321 for limiting the wafer.

[0045] As an optional implementation manner, reference Figure 7 As shown, this application also discloses another specific embodiment of a wafer alignment system. The main difference from the wafer alignment systems disclosed in the foregoing embodiments is that in this embodiment, only two support components 32 are required to implement the limiting area 200. The support component 32 includes a supporting member 342 and a column 341. The supporting member 342 includes a side wall 3421 and a step 3422. The bottom of the supporting member 342 is connected to two columns 341, and the lengths of the multiple columns 341 are equal and are connected to the pallet 37 as Figure 3 shown.

[0046] Those skilled in the art can understand that Figure 7 the supporting member 342 in Figure 6 and the supporting member 332 in

[0047] can both implement the functions of supporting and limiting the wafer, but the specific shapes can be very different. The support component 32 of the limiting mechanism �0 in this application is intended to implement the functions of supporting and limiting the wafer. The support can be achieved through the step, and the limit can be achieved through the side wall. The specific shapes and settings can be flexibly set [[ID=?]] Figure 7 Similarly, those skilled in the art can understand that the specific number of columns can be flexibly changed according to actual design requirements. For example,

[0048] Regarding the specific number of the support components 32, those skilled in the art should know that when the side wall 3321 is preferably arc-shaped, at least 2 support components 32 are required to enclose the limiting area. When the side wall 3321 is a plane, at least 3 support components 32 are required to enclose the limiting area. In this application, taking the number of the support components 32 being preferably 4 as an example, it can balance the cost and achieve the function of firmly limiting and supporting the wafer.

[0049] Refer to Figure 1 and Figure 5 As shown, the first driving mechanism 31 of this application can be a cylinder or a linear motor. The limiting mechanism 30 further includes a mounting seat 303 fixedly connected to the bottom plate 15. A bending portion 3031 is formed at the top of the mounting seat 303 close to the bottom plate 15, and the bending portion 3031 is continuously penetrated by screws through the bending portion 3031 and the bottom plate 15. The first driving mechanism 31 drives the sliding seat 301 to move up and down along the Figure 5 direction of the bidirectional arrow d in the figure. A track and a slider (not shown) that moves linearly along the track are provided between the sliding seat 301 and the mounting seat 303. In view of the sliding connection technology configured between the sliding seat 301 and the mounting seat 303 being a mature prior art, it is not described in detail in this embodiment.

[0050] The sliding seat 301 is connected to the plate body 302. A first mounting plate 304 is provided at the top of the plate body 302, and a driving column �37 is formed on the first mounting plate 304 vertically. The driving column 337 includes a connecting cylinder 3372 axially sleeved between a driving shaft 3372 and a passive shaft 3373. A second mounting plate 306 is provided above the first mounting plate 304, and a longitudinal bellows 305 is provided between the second mounting plate 306 and the first mounting plate 304. The second mounting plate 306 is fixed to the bottom of the bottom plate 15 by screws. The support plate <37> forms a screw hole 3374, and the top end of the passive shaft <3373> is screwed and fixed to the screw hole 3374. When the first driving mechanism 31 moves in the vertical direction, it drives the sliding seat 3 <0>1 to perform a lifting movement relative to the mounting seat 303, and finally drives the support plate 37 to move up and down in the vertical direction to synchronously drive the four support columns 3 to move up and down in the vertical direction (i.e., Figure 5 the direction of the bidirectional arrow d in the figure).

[0051] Refer to Figure 2As shown, the synchronization mechanism 5 disclosed in the present application includes a synchronization connection component 51 and a second driving mechanism 52. The synchronization connection component 51 includes a frame body 511 and a crossbar 512 that horizontally straddles the frame body 511. The synchronization connection component 51 is simultaneously connected to the second driving mechanism 52 and all the rotating mechanisms 41. Specifically, the frame body 511 is connected to all the rotating mechanisms 41, and the crossbar 512 is connected to the second driving mechanism 52. The second driving mechanism 52 makes a telescopic movement in the vertical direction, thereby synchronously driving all the rotating mechanisms 41 through the synchronization connection component 51, and further synchronously driving all the support cantilever 42.

[0052] Those skilled in the art should know that the synchronization connection component 51 is not limited to the form shown in this embodiment. The synchronization connection component 51 can also be reasonably derived and understood as any deformation member that can uniformly conduct the driving force output by the second driving mechanism 52, as long as it can be simultaneously connected to the second driving mechanism 52 and all the rotating mechanisms 41. For example, the synchronization connection component 51 may only include the frame body 511, and the second driving mechanism is connected to the frame body 511.

[0053] The synchronization connection component 51 and the second driving mechanism 52 and all the rotating mechanisms 41 can be fixedly connected by screws or can be integrated. The present application does not make special limitations on the specific connection method.

[0054] Refer Figure 4 、 Figure 8 and Figure 9 As shown, the rotating mechanism 41 includes: a top block 421 that abuts against the frame body 51, a fixed seat 422 that is slidably connected to the top block 421. A slider 423 is formed on the inner side of the top block 421 close to the fixed seat 422. The fixed seat 422 forms a guide rail in the vertical direction, and the slider 423 slides along the track. A driving column 426, a moving block 427 that is driven by the driving column 426 and makes a lifting movement in the vertical direction (i.e., the direction of the double-headed arrow e in Figure 8 ), a rotating shaft 4301 that connects the support cantilever 42. Spiral guiding grooves 4300 are symmetrically formed on the side walls of the two rotating shafts 4301 on the same side of the hot plate 20. The guiding ends 4400 of the two moving blocks 427 on the same side of the hot plate 20 are connected and extend into the spiral guiding grooves 4300. A bending portion 4221 is formed at the top of the fixed seat 422, and the bending portion 4221 is fixedly connected to the bottom of the bottom plate 15 by screws. The driving column 426 includes a driving shaft 4263 that is vertically connected to the top block 4 and a driven shaft 4261 in the vertical direction. A connecting cylinder 4262 is axially sleeved between the driving shaft 4263 and the driven shaft 4261. The driving shaft 4263 is vertically connected to the top block 421, and the driving shaft 4263 is sleeved with a bellows 425 and a mounting plate 424. The mounting plate 424 and the bellows 425 are connected to the top block 421. The mounting plate 424 is provided with a plurality of through holes, and the mounting plate 424 is fixedly connected to the bottom of the bottom plate 15 by screws passing through the aforementioned through holes.

[0055] The drive shaft 4263 extends vertically through the base plate 15 and into the bonding cavity 100. The passive shaft 4261 extends through the moving block 427 and is screwed and fixed by the nut 4264. In this embodiment, by providing the bellows 425, the vibration generated by the vertical movement of the drive column 426 can be offset, thereby further improving the smoothness and stability of the rotation of the rotating shaft 4301 and the support cantilever 42, reducing the vibration generated by the support cantilever 42 on the second wafer 60 during the closing and opening process, thereby avoiding the second wafer 60 located above from jumping during the synchronous alignment process.

[0056] For example, the second drive mechanism 52 is supported by the base plate 15. The second drive mechanism 52 forms a drive rod 521 that extends and retracts in the vertical direction. The drive rod 521 transmits the driving force output by the second drive mechanism 52 evenly to the frame 511 through the crossbar 512, thereby driving the four top blocks 421 to slide synchronously relative to the fixed seat 422 in a horizontal posture through the frame 511. The end of the moving block 427 passes through the horizontally arranged moving block 427, and the moving block 427 is connected to the guide end 4400 through a connecting block. The connecting block includes a first bent portion 4281 connecting the guide end 4400 and a second bent portion 4282 connected to the moving block 427 by screws. The guide end 4400 can be configured as a bearing, and the first bent portion 4281 forms a pin (not shown) axially connected to the guide end 4400. The pin passes laterally through the screw hole 42811 of the first bend 4281 and connects to the guide end 4400. The pin is secured to the first bend 4281 by a bolt assembly. A notch 4302 is formed at the top of the rotating shaft 4301 to movably connect to the support cantilever 42.

[0057] The rotating mechanism 41 also includes a retaining bracket to keep the height of the rotating shaft 4301 constant in the vertical direction during rotation. The retaining bracket includes: a support plate 435; a vertical plate 429 perpendicular to the support plate 435 and parallel to and perpendicular to the horizontal plane; the side of the vertical plate 429 forms a positioning block 431 through which the rotating shaft 4301 passes vertically. The bottom free end 4303 of the rotating shaft 4301, away from the supporting cantilever 4, extends into the support plate 435. A bearing 433 is sleeved between the bottom free end 4303 and the support plate 435, thereby allowing the rotating shaft 4301 to rotate along the shaft 401 (or shaft 402) within the support plate 435, thereby driving the supporting cantilever 42 along... Figure 8 The direction of arrow a or arrow b rotates within the same horizontal plane. The abutment plate 435 is fixed within the cavity and connected to the base plate 15 by screws. When the drive rod 521 of the second drive mechanism 52 extends and retracts in the vertical direction, the support remains fixed while the rotating shaft 4301 rotates.

[0058] The specific manner in which the wafer alignment system disclosed in this application performs wafer alignment operations can be referred to Figure 10-12 .

[0059] Step 1, as Figure 10 shown, the first driving mechanism 31 synchronously drives the support component 32 of the limiting mechanism 30 to rise to a first preset height; all the support cantilever arms 42 included in the auxiliary alignment mechanism 40 synchronously rotate to a first state; the first wafer 50 is placed on the support component 32 of the limiting mechanism 30, and it is ensured that the first wafer 50 is located in the circular limiting area 200, and the support component 32 supports and limits the first wafer 50.

[0060] Regarding the first preset height here, those skilled in the art should understand that the first preset height should be such that the limiting mechanism 30 can support and limit the first wafer 50 without affecting the subsequent support of the second wafer 60 on the first wafer 50 by the auxiliary alignment mechanism 40.

[0061] The first state here can be referred to as the open state, that is, all the support cantilever arms 42 synchronously rotate outside the limiting area 200 so that there is no interference between the support cantilever arms 42 and the first wafer 50 during the placement process of the first wafer 50.

[0062] Step 2, as Figure 11 shown, all the support cantilever arms 42 synchronously rotate to a second state; as Figure 12 shown, the second wafer 60 is placed on the support cantilever arms 42, and it is ensured that the second wafer is located in the circular limiting area 200 surrounded by the limiting mechanism 30, so as to achieve a concentric circle distribution of the first wafer 50 and the second wafer 60 from a top view angle.

[0063] The second state here can be referred to as the closed state, that is, all the support cantilever arms 42 should synchronously rotate inside the limiting area 200 so as to support the second wafer 60.

[0064] Referring to Figure 12 shown, the limiting component 32 of the limiting mechanism 30 simultaneously limits both the first wafer 50 and the second wafer 60, that is, the first wafer 50 and the second wafer 60 are concentrically arranged, and the first wafer 50 and the second wafer 60 fall within the limiting area; the limiting component 32 of the limiting mechanism 30 only supports the first wafer 50, and the support cantilever arms 42 only support the second wafer 60, so that there is a partial space between the first wafer 50 and the second wafer 60.

[0065] Based on the specific implementation manner of the wafer alignment system disclosed in the foregoing embodiments, this application also discloses a wafer bonding device.

[0066] Refer Figure 1 to Figure 15As shown, this application discloses a wafer bonding device, such as... Figure 1 As shown, the wafer bonding equipment may also include a support plate 11 below the hot plate 20 to support the hot plate 20, and a clamping pad 111 between the support plate 11 and the base plate 15. Figure 15 As shown, the wafer bonding apparatus disclosed in this application may further include a cavity 10 and an openable cover 70 connected to the cavity, housing the wafer alignment system as disclosed in any of the above specific embodiments. The wafer bonding apparatus described in this application can be wafer bonding apparatus of various sizes such as 4-inch, 6-inch, 8-inch, and 12-inch.

[0067] This application Figure 15 The cover 70 shown is only a schematic diagram and does not represent a specific structure. The relevant design of the cover 70 is known to those skilled in the art, and this application does not impose any specific limitations.

[0068] The wafer alignment system included in the wafer bonding equipment disclosed in this application is as described in the foregoing embodiments and will not be repeated here.

[0069] This application, based on a wafer bonding apparatus using the aforementioned wafer alignment system, also discloses a wafer alignment method. See below for details. Figures 10 to 14 As shown, the wafer alignment system of this application is applied in a bonding device to perform alignment operations on the first wafer 50 and the second wafer 60 in a detailed manner.

[0070] Step 1, as follows Figure 10 As shown, the first driving mechanism 31 synchronously drives the support component 32 of the limiting mechanism 30 to rise to the first preset height; all the support cantilever 42 included in the auxiliary alignment mechanism 40 synchronously rotate to the first state; the first wafer 50 is placed on the support component 32 of the limiting mechanism 30, and the first wafer 50 is ensured to be located in the circular limiting area 200, and the support component 32 supports and limits the first wafer 50.

[0071] The first preset height here should be understood by those skilled in the art to be sufficient to enable the limiting mechanism 30 to support and limit the first wafer 50, and not to affect the subsequent support of the second wafer 60 located on the first wafer 50 by the auxiliary alignment mechanism 40.

[0072] The first state here can be called the open state, that is, all the support cantilever arms 42 rotate synchronously to outside the limit area 200, so that the first wafer 50 will not interfere with the support cantilever arms 42 during placement.

[0073] Step two, as Figure 11 As shown, all supporting cantilever arms 42 rotate synchronously to the second state; as Figure 12As shown, the second wafer 60 is placed on the support cantilever 42, and the second wafer is ensured to be located in the circular limiting area 200 enclosed by the limiting mechanism 30, so that the first wafer 50 and the second wafer 60 are distributed in a concentric circle shape when viewed from above.

[0074] The second state here can be called the closed state, that is, all the support cantilever 42 should rotate synchronously to within the limit area 200 so as to provide support for the second wafer 60.

[0075] Reference Figure 12 As shown, the limiting component 32 of the limiting mechanism 30 simultaneously limits both the first wafer 50 and the second wafer 60, thus ensuring that the first wafer 50 and the second wafer 60 are concentrically arranged; the limiting component 32 of the limiting mechanism 30 only supports the first wafer 50, and the supporting cantilever 42 only supports the second wafer 60, thereby creating a partial space between the first wafer 50 and the second wafer 60.

[0076] Step 3, refer to Figure 13 Simultaneously, the limiting component 32 of the limiting mechanism 30 descends to the second preset height, and the first wafer 50 is preheated by the hot plate 20. At the same time, a vacuuming action is performed to extract the air from the bonding cavity 10 to create a vacuum state in the bonding cavity 10. Here, those skilled in the art should know that the cover 70 and the cavity 10 should be in a closed state at this time in order to perform the vacuuming action.

[0077] Here, those skilled in the art should understand that the second preset height can be adjusted according to actual conditions, as long as it ensures that the first wafer 50 descends to a certain height and can be well heated by the heating plate 20. Preferably, the second preset height allows the first wafer 50 to fully contact the heating plate 20, thereby obtaining the best heating effect.

[0078] In this step, the hot plate 20 preheats the first wafer 50. The first wafer 50 and / or the second wafer 60 to be bonded have been pre-coated with bonding adhesive before the aforementioned steps one to three. Preheating the first wafer 50 can reduce the generation of bubbles in the bonding adhesive in the subsequent bonding process and improve the bonding quality.

[0079] Step four, refer to Figure 14 The limiting component 32 of the limiting mechanism 30 rises synchronously to the third preset height, which is less than or equal to the first preset height; all supporting cantilever arms 42 rotate to the first state, that is, enter the limiting area, so that the second wafer 60 falls on the first wafer 50, and the second wafer 60 and the first wafer 50 are in a close fit.

[0080] Subsequently, bonding operations can be performed on the first wafer 50 and the second wafer 60.

[0081] Here, the third preset height is preferably equal to the first preset height, so that the second wafer 60 is always in the limiting area defined by the limiting mechanism 30 during the falling process, thereby ensuring that the centers of the first wafer 50 and the second wafer 60 can remain concentric.

[0082] Optionally, the first wafer 50 is a semiconductor wafer, such as a silicon-based wafer or a gallium nitride wafer; the second wafer 60 is a carrier wafer, such as glass, sapphire, or silicon carbide. The second wafer 60 serves as a substrate to provide support for the first wafer 50. Optionally, the first wafer 50 and the second wafer 60 can also be homogeneous wafers, that is, both the first wafer 50 and the second wafer 60 are semiconductor wafers; furthermore, both the first wafer 50 and the second wafer 60 can be standard-thickness silicon-based wafers, or both can be thinned silicon-based wafers, or the first wafer 50 can be a thinned silicon-based wafer while the second wafer 60 is a standard-thickness silicon-based wafer, etc.

[0083] The detailed descriptions listed above are merely specific descriptions of feasible implementation methods of this application and are not intended to limit the scope of protection of this application. All equivalent implementation methods or modifications made without departing from the spirit of the art of this application should be included within the scope of protection of this application.

[0084] It will be apparent to those skilled in the art that this application is not limited to the details of the exemplary embodiments described above, and that this application can be implemented in other specific forms without departing from the spirit or essential characteristics of this application. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this application is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this application. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0085] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A wafer alignment system, characterized in that, include: Hot plate; A limiting mechanism is provided on the hot plate, wherein the limiting mechanism includes at least two support components that together form a limiting area to support and limit the wafer, and the support components move up and down in a direction perpendicular to the hot plate; An auxiliary alignment mechanism is arranged around the hot plate. The auxiliary alignment mechanism includes at least two pairs of support arms. The support arms rotate synchronously to enter and exit the limiting area. The two support arms of each pair of support arms rotate synchronously in opposite directions to enter and exit the limiting area.

2. The wafer alignment system according to claim 1, characterized in that, The limiting mechanism further includes a first driving mechanism, wherein the first driving mechanism drives the support component to move up and down in a direction perpendicular to the hot plate.

3. The wafer alignment system according to claim 1, characterized in that, The auxiliary alignment mechanism also includes a rotating mechanism that matches the support cantilever, the rotating mechanism driving the support cantilever to rotate.

4. The wafer alignment system according to claim 3, characterized in that, It also includes a synchronization mechanism that connects all the rotating mechanisms and drives all the rotating mechanisms synchronously, thereby driving all the supporting cantilever in a synchronous manner.

5. The wafer alignment system according to claim 4, characterized in that, The synchronization mechanism includes a synchronization connection component and a second drive mechanism. The synchronization connection component connects the second drive mechanism and all the rotating mechanisms. The second drive mechanism performs a telescopic movement in the vertical direction, thereby synchronously driving all the rotating mechanisms through the synchronization connection component.

6. The wafer alignment system according to claim 5, characterized in that, The synchronous connection assembly includes a frame and a crossbar that spans the frame laterally, wherein the second drive mechanism is connected to the crossbar and all the rotating mechanisms are connected to the frame.

7. The wafer alignment system according to claim 6, characterized in that, The rotating mechanism includes: a top block abutting against the frame, a fixed seat slidably connected to the top block, a drive column, a moving block driven by the drive column and moving up and down in the vertical direction, a rotating shaft connected to the supporting cantilever, two rotating shafts located on the same side of the hot plate having spiral guide grooves symmetrically formed on their sidewalls, and two moving blocks located on the same side of the hot plate having guide ends extending into the spiral guide grooves.

8. A wafer bonding apparatus, characterized in that, include: A cavity, and a cover connected to the cavity, wherein the cavity and the cover house the wafer alignment system as described in any one of claims 1 to 7.

9. A wafer bonding alignment method using the wafer bonding equipment according to claim 8, characterized in that, include: The support assembly is raised to a first preset height, and all the support cantilever arms are rotated synchronously to outside the limiting area. The first wafer is placed on the support assembly, and the first wafer is located in the limiting area, wherein the support assembly supports and limits the first wafer. All the support cantilever arms are rotated synchronously to the limiting area, and the second wafer is placed on the support cantilever arms, such that the second wafer is located in the limiting area, wherein the support cantilever arms support the second wafer and the support assembly limits the second wafer; The support assembly is lowered to a second preset height, so that the hot plate heats the first wafer and the cavity is evacuated. Raise the support assembly to a third preset height, which is less than or equal to the first preset height, and simultaneously rotate all support cantilever arms outside the limiting area so that the second wafer falls onto the first wafer.

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