Power module and photovoltaic optimizer

Abstract

The invention provides a power module and a photovoltaic optimizer. The power module comprises a first substrate, a second substrate, a first power device, a second power device, a moving point lead and a grounding lead. The second substrate, the first power device, the second power device, the moving point lead and the grounding lead are all arranged on one side of the first substrate. The first substrate comprises a first insulating layer, a first conducting layer and a second conducting layer. The first conducting layer and the second conducting layer are stacked on the two opposite sides of the first insulating layer. The second substrate comprises a second insulating layer and a first power distribution layer, the second insulating layer is arranged on the side, back to the second conductive layer, of the first conductive layer, and the first power distribution layer is stacked on the side, back to the first conductive layer, of the second insulating layer. The first power device and the second power device are electrically connected with the moving point lead, the first power device and the second power device are alternately switched on and off, the moving point lead and the first power distribution layer share a potential, and the grounding lead and the first conductive layer share a potential. And the moving point lead realizes electromagnetic shielding through the first conductive layer.

Description

Technical Field

[0001] The present application relates to the field of electronic technologies, and particularly to a power module and a photovoltaic optimizer. Background Art

[0002] As the size of the photovoltaic optimizer becomes smaller and smaller, the electromagnetic interference between the power module and other devices in the photovoltaic optimizer becomes more and more serious, resulting in a reduction in the performance of the power module, and even damage to the power module. Currently, an electromagnetic shield for the power module is achieved by arranging a shielding frame outside the power module, which greatly improves the performance of the power module. However, this method requires reserving an installation space for the shielding frame, which is not conducive to the miniaturization design of the power module. Summary of the Invention

[0003] The present application provides a power module and a photovoltaic optimizer. The power module provided by the present application can achieve electromagnetic shielding of the power module on the basis of avoiding setting a shielding frame, which is not only conducive to the miniaturization design of the power module, but also has low processing cost, is easy to manufacture, has a low risk of processing failure, and is highly reliable.

[0004] In a first aspect, an embodiment of the present application provides a power module. The power module includes a first substrate, a second substrate, a first power device, a second power device, a moving point lead, and a grounding lead. The second substrate, the first power device, the second power device, the moving point lead, and the grounding lead are all arranged on one side of the first substrate. The first substrate includes a first insulating layer, a first conductive layer, and a second conductive layer. The first conductive layer and the second conductive layer are laminated on opposite sides of the first insulating layer. The second substrate includes a second insulating layer and a first power distribution layer. The second insulating layer is arranged on the side of the first conductive layer facing away from the first insulating layer, and the first power distribution layer is laminated on the side of the second insulating layer facing away from the first conductive layer. Both the first power device and the second power device are electrically connected to the moving point lead. The first power device and the second power device are alternately turned on and off. The moving point lead and the first power distribution layer are at the same potential, and the grounding lead and the first conductive layer are at the same potential.

[0005] The power module provided by the embodiment of the present application is used to receive direct current and perform maximum power point tracking on the direct current to output maximum power direct current. Among them, through the alternate on and off of the first power device and the second power device, the power module can perform maximum power point tracking on the direct current and output maximum power direct current through the moving point lead. Since the first power device and the second power device are alternately turned on and off, the electrical frequency of the moving point lead continuously changes, and the moving point lead will generate relatively large electromagnetic interference.

[0006] Since the first conductive layer and the second conductive layer are stacked on opposite sides of the first insulating layer, the second insulating layer is disposed on the side of the first conductive layer facing away from the first insulating layer, and the first power distribution layer is stacked on the side of the second insulating layer facing away from the first conductive layer, with the first conductive layer located between the first power distribution layer and the second conductive layer; and since the grounding lead is at the same potential as the first conductive layer, the first conductive layer is grounded through the grounding lead, and the first power distribution layer and the second conductive layer are electromagnetically shielded by the first conductive layer. Since the moving point lead is at the same potential as the first power distribution layer, the moving point lead is electromagnetically shielded from the second conductive layer through the first conductive layer, and the electromagnetic interference caused by the moving point lead is shielded by the first conductive layer, achieving electromagnetic shielding of the moving point lead and thus electromagnetic shielding of the power module.

[0007] Compared with the existing solution of achieving electromagnetic shielding of the power module by setting a shielding frame outside the power module, the present application can not only avoid setting the shielding frame and the need to reserve installation space for the shielding frame, which is beneficial to the miniaturization design of the power module; moreover, it has a simple structure, low processing cost, is easy to manufacture, has a low risk of processing failure, and high reliability.

[0008] In a possible implementation, the projection of the first power distribution layer in the thickness direction of the first substrate is entirely located within the projection of the first conductive layer in the thickness direction of the first substrate.

[0009] The design that the projection of the first power distribution layer in the thickness direction of the first substrate is entirely located within the projection of the first conductive layer in the thickness direction of the first substrate is beneficial to improving the electromagnetic shielding effect of the first conductive layer on the first power distribution layer, and thus beneficial to improving the electromagnetic shielding effect between the second conductive layer and the first power distribution layer through the first conductive layer, and beneficial to improving the electromagnetic shielding effect of the power module.

[0010] In a possible implementation, the second substrate includes a power distribution connection layer, and the power distribution connection layer is stacked between the first conductive layer and the second insulating layer and is electrically connected to the first conductive layer.

[0011] Since the power distribution connection layer is stacked between the first conductive layer and the second insulating layer, the power distribution connection layer is located between the first power distribution layer and the second conductive layer. And since the power distribution connection layer is electrically connected to the first conductive layer, the power distribution connection layer is grounded through the first conductive layer, and the power distribution connection layer can play a role in electromagnetic shielding. The first power distribution layer and the second conductive layer can jointly achieve electromagnetic shielding through the power distribution connection layer and the first conductive layer, which is beneficial to improving the electromagnetic shielding effect.

[0012] In a possible implementation, the moving point lead is laminated on the side of the first power distribution layer facing away from the second insulating layer and is electrically connected to the first power distribution layer; alternatively, the first substrate includes a connecting conductive layer, the connecting conductive layer is laminated on the side of the first insulating layer facing the first conductive layer, the connecting conductive layer is electrically connected to the first power distribution layer, and the moving point lead is laminated on the side of the connecting conductive layer facing away from the first insulating layer and is electrically connected to the connecting conductive layer.

[0013] Through the lamination of the moving point lead and the first power distribution layer, the electrical connection between the moving point lead and the first power distribution layer is realized, and the design of the common potential of the moving point lead and the first power distribution layer is achieved. It is not only simple and stable in structure, but also low in processing cost, which is beneficial to improving the structural stability of the power module.

[0014] Since the connecting conductive layer is electrically connected to the first power distribution layer, the moving point lead is laminated on the connecting conductive layer and is electrically connected to the connecting conductive layer; the moving point lead is electrically connected to the first power distribution layer through the connecting conductive layer, and the moving point lead is at the same potential as the first power distribution layer through the connecting conductive layer. The moving point lead can be arranged on the first substrate, and the arrangement method of the moving point lead is diverse.

[0015] In a possible implementation, the second substrate includes a second power distribution layer, the second power distribution layer is laminated on the side of the second insulating layer facing the first power distribution layer and is electrically connected to the first conductive layer, and the grounding lead is laminated on the side of the second power distribution layer facing away from the second insulating layer and is electrically connected to the second power distribution layer; alternatively, the grounding lead is laminated on the side of the first conductive layer facing away from the first insulating layer and is electrically connected to the first conductive layer.

[0016] Since the second power distribution layer is electrically connected to the first conductive layer, the grounding lead is laminated on the side of the second power distribution layer facing away from the second insulating layer and is electrically connected to the second power distribution layer; the grounding lead is electrically connected to the first conductive layer through the second power distribution layer, the grounding lead is at the same potential as the first conductive layer through the second power distribution layer, and the first conductive layer is grounded through the grounding lead. The grounding lead is arranged on the second substrate, which is convenient for arranging the grounding lead and is beneficial to reducing the wiring difficulty.

[0017] Through the lamination of the grounding lead and the first conductive layer, the electrical connection between the grounding lead and the first conductive layer is realized, and the design of the common potential of the grounding lead and the first conductive layer is achieved. It is not only simple and stable in structure, but also low in processing cost, which is beneficial to improving the structural stability of the power module.

[0018] In a possible implementation, the second substrate includes a third power distribution layer, the third power distribution layer is laminated on the side of the second insulating layer facing the first power distribution layer and is electrically connected to the first power distribution layer, the first power device is laminated on the side of the third power distribution layer facing away from the second insulating layer and is electrically connected to the third power distribution layer, and the second power device is laminated on the side of the first power distribution layer facing away from the second insulating layer and is electrically connected to the first power distribution layer.

[0019] Since the moving lead is electrically connected to the first power distribution layer, and the third power distribution layer is electrically connected to the first power distribution layer, the moving lead is electrically connected to the third power distribution layer through the first power distribution layer. Also, since the first power device is stacked on the side of the third power distribution layer facing away from the second insulating layer and is electrically connected to the third power distribution layer; the first power device is electrically connected to the moving lead through the third power distribution layer and the first power distribution layer. The design of stacking the first power device and the third power distribution layer is beneficial to increasing the connection area between the first power device and the third power distribution layer, beneficial to improving the connection strength between the first power device and the third power distribution layer, and beneficial to improving the structural stability of the power module.

[0020] Since the moving lead is electrically connected to the first power distribution layer, and the second power device is stacked on the side of the first power distribution layer facing away from the second insulating layer and is electrically connected to the first power distribution layer; the second power device is electrically connected to the moving lead through the first power distribution layer. The design of stacking the second power device and the first power distribution layer is beneficial to increasing the connection area between the second power device and the first power distribution layer, beneficial to improving the connection strength between the second power device and the first power distribution layer, and beneficial to improving the structural stability of the power module.

[0021] In a possible implementation, the power module includes a protection device and a mating lead. The second substrate includes a fourth power distribution layer, and the fourth power distribution layer is stacked on the side of the second insulating layer facing the first power distribution layer. The protection device and the mating lead are both stacked on the side of the fourth power distribution layer facing away from the second insulating layer and are both electrically connected to the fourth power distribution layer; alternatively, the first substrate includes a third conductive layer, and the third conductive layer is stacked on the side of the first insulating layer facing the first conductive layer. The protection device and the mating lead are both stacked on the side of the third conductive layer facing away from the first insulating layer and are both electrically connected to the third conductive layer.

[0022] The mating lead is electrically connected to the load device, and the protection device is electrically connected to the load device through the mating lead. When both the first power device and the second power device fail, the protection device plays a role in protecting the load device, preventing the load device from being damaged or burned, which is beneficial to improving the use safety of the power module.

[0023] In a possible implementation, the grounding lead includes a grounding pin, and the moving lead includes a moving pin. The grounding pin and the moving pin are both spaced apart from the first substrate and the second substrate; the power module includes a plastic package, and the plastic package covers the first substrate, the second substrate, the first power device, the second power device, the grounding lead, and the moving lead. The second conductive layer, the grounding pin, and the moving pin are all exposed outside the plastic package.

[0024] The encapsulation of the first substrate, the second substrate, the first power device, the second power device, the ground lead and the moving point lead by the encapsulant realizes the encapsulation of the first substrate, the second substrate, the first power device, the second power device, the ground lead and the moving point lead. The design of the encapsulant is beneficial to improving the structural stability of the power module.

[0025] In a possible implementation, the encapsulant is provided with a first groove, the first groove is located on the side of the ground lead facing the second conductive layer, and the projection of the first groove along the thickness direction of the first substrate overlaps with the projection of the ground lead along the thickness direction of the first substrate. The first groove is used to increase the creepage distance between the second conductive layer and the ground lead.

[0026] The design of the first groove greatly increases the creepage distance between the second conductive layer and the ground lead on the basis of ensuring that the volume of the power module is not increased, which is beneficial to reducing the probability of the power module having a leakage risk and improving the use safety of the power module.

[0027] In a possible implementation, the encapsulant is provided with a first fitting groove, the first fitting groove is located on the side of the ground lead facing away from the second conductive layer, and the projection of the first fitting groove along the thickness direction of the first substrate overlaps with the projection of the first groove along the thickness direction of the first substrate.

[0028] The second conductive layer can be laminated with the heat dissipation substrate. The design of the first fitting groove can prevent the stress when the second conductive layer is laminated with the heat dissipation substrate from concentrating on the part of the encapsulant provided with the first fitting groove, thereby avoiding cracks in the part of the encapsulant provided with the first fitting groove, which is beneficial to improving the reliability of the encapsulant and the structural stability of the power module.

[0029] In a possible implementation, the encapsulant is provided with a second groove, the second groove is located on the side of the moving point lead facing the mating conductive layer, and the projection of the second groove along the thickness direction of the first substrate overlaps with the projection of the moving point lead along the thickness direction of the first substrate. The second groove is used to increase the creepage distance between the second conductive layer and the moving point lead.

[0030] The design of the second groove greatly increases the creepage distance between the second conductive layer and the moving point lead on the basis of ensuring that the volume of the power module is not increased, which is beneficial to reducing the probability of the power module having a leakage risk and improving the use safety of the power module.

[0031] In a possible implementation, the encapsulant is provided with a second fitting groove, the second fitting groove is located on the side of the moving point lead facing away from the mating conductive layer, and the projection of the second fitting groove along the thickness direction of the first substrate overlaps with the projection of the second groove along the thickness direction of the first substrate.

[0032] The design of the second mating groove can prevent the stress from concentrating on the part of the plastic package with the second mating groove when the second conductive layer and the heat dissipation substrate are laminated, thereby avoiding cracks in the part of the plastic package with the second mating groove, which is beneficial to improving the reliability of the plastic package and the structural stability of the power module.

[0033] In a possible implementation, the grounding pin is laminated with the first substrate;

[0034] Alternatively, the grounding pin is perpendicular to the first substrate and extends in a direction away from the first substrate.

[0035] The structure of the grounding pin is diverse, and the design requirements for the grounding pin are low, which is beneficial to reducing the design cost and the manufacturing cost of the power module.

[0036] In a possible implementation, the moving pin is laminated with the first substrate;

[0037] Alternatively, the moving pin is perpendicular to the first substrate and extends in a direction away from the first substrate.

[0038] The structure of the moving pin is diverse, and the design requirements for the moving pin are low, which is beneficial to reducing the design cost and the manufacturing cost of the power module.

[0039] In a possible implementation, the power module includes a heat dissipation substrate, and the heat dissipation substrate is laminated on the side of the second conductive layer facing away from the first insulating layer.

[0040] A large amount of heat is dissipated when the first power device and the second power device are operating. The large amount of heat dissipated by the first power device and the second power device during operation can be transferred from the second conductive layer to the heat dissipation substrate through the first substrate, and then dissipated to the external environment through the heat dissipation substrate, realizing rapid heat dissipation of the first power device and the second power device. The design of the heat dissipation substrate is beneficial to improving the heat dissipation efficiency of the first power device and the second power device and the heat dissipation efficiency of the power module.

[0041] In a second aspect, an embodiment of the present application further provides a photovoltaic optimizer. The photovoltaic optimizer includes a control module and the power module according to any one of the first aspects, and the control module is used to control the first power device and the second power device to be alternately turned on and off. Description of the Drawings

[0042] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the background art, the following will describe the drawings required to be used in the embodiments of the present application or the background art.

[0043] Figure 1 It is a structural block diagram of the photovoltaic optimizer provided by the embodiment of the present application in cooperation with a photovoltaic module and a load device;

[0044] Figure 2 is Figure 1 The structural schematic diagram of the power module of the photovoltaic optimizer shown;

[0045] Figure 3 is Figure 2 The structural schematic diagram of the power module shown with the plastic package omitted;

[0046] Figure 4 is Figure 2 The structural schematic diagram of the power module shown cut along the A-A line;

[0047] Figure 5 is Figure 2 The structural schematic diagram of the substrate of the power module shown;

[0048] Figure 6 is Figure 5 The structural schematic diagram of the substrate shown cut along the B-B line;

[0049] Figure 7 is Figure 2 The structural schematic diagram of the power module shown cut along the C-C line;

[0050] Figure 8 is Figure 2 The structural schematic diagram of the power module shown with the heat dissipation substrate omitted and cut along the A-A line;

[0051] Figure 9 is Figure 2 The structural schematic diagram of the power module in another embodiment;

[0052] Figure 10 is Figure 9 The structural schematic diagram of the power module shown cut along the D-D line;

[0053] Figure 11 is Figure 10 The structural schematic diagram of the power module shown with the plastic package 90 omitted at another angle;

[0054] Figure 12 is Figure 9 The structural schematic diagram of the power module shown cut along the D-D line in another embodiment;

[0055] Figure 13 is Figure 12 The structural schematic diagram of the power module shown with the plastic package omitted at another angle;

[0056] Figure 14 is Figure 9 The structural schematic diagram of the power module shown cut along the D-D line in another embodiment;

[0057] Figure 15 Yes Figure 9 It is a schematic structural diagram of the power module shown in cross-section along the D-D line in another embodiment. Detailed implementation manners

[0058] The embodiments of the present application provide a power module and a photovoltaic optimizer. The power module is applied to the photovoltaic optimizer. The power module provided by the present application can achieve electromagnetic shielding of the power module on the basis of avoiding setting a shielding box, which is not only beneficial to the miniaturized design of the power module, but also has low processing cost, is easy to manufacture, has a low risk of processing failure, and has strong reliability. In the present application, "connected" between feature A and feature B means that feature A is fixedly connected and electrically connected to feature B.

[0059] The embodiments of the present application will be described below with reference to the accompanying drawings in the embodiments of the present application.

[0060] Please refer to Figure 1 , Figure 1 It is a structural block diagram of the cooperation between the photovoltaic optimizer 2000 provided by the embodiments of the present application, the photovoltaic module 1000 and the load device 3000. The photovoltaic module 1000 is used to convert light energy into electrical energy and output direct current electricity. The photovoltaic optimizer 2000 is used to perform maximum power point tracking on the direct current electricity output by the photovoltaic module 1000, and output the maximum power direct current electricity to the load device 3000 to supply the load device 3000. Among them, the photovoltaic module 1000 may be an electronic device that can convert light energy into electrical energy, including but not limited to solar panels, etc. The load device 3000 may be an electronic device that uses direct current electricity, including but not limited to batteries or fans, etc.

[0061] The photovoltaic optimizer 2000 includes a power module 100, an auxiliary device 200 and a control module 300. The power module 100 is electrically connected to the photovoltaic module 1000. Both the auxiliary device 200 and the control module 300 are electrically connected to the power module 100. Among them, the auxiliary device 200 is electrically connected to the load device 3000. The power module 100 receives the direct current electricity output by the photovoltaic module 1000. The power module 100 cooperates with the auxiliary device 200 to perform maximum power point tracking on the direct current electricity output by the photovoltaic module 1000, and output the maximum power direct current electricity to the load device 3000 to supply the load device 3000. That is, the power module 100 is used to perform maximum power point tracking on the direct current electricity and output the maximum power direct current electricity to the load device 3000. The control module 300 is used to control the operation of the power module 100 to ensure that the power module 100 and the auxiliary device 200 cooperate to output the maximum power direct current electricity to the load device 3000. Exemplarily, the auxiliary device 200 is an inductor.

[0062] In some embodiments, the power module 100 includes an input lead 20, a power component 30, a moving point lead 40, a connection lead 50, a mating lead 60, and a ground lead 70. Among them, the power component 30 includes a first power device 31, a second power device 32, and a protection device 33. That is to say, the power module 100 includes the first power device 31, the second power device 32, and the protection device 33. Exemplarily, the first power device 31 can be a switching device including but not limited to transistors, triodes, etc. The second power device 32 can be a switching device including but not limited to transistors, triodes, etc. The protection device 33 can be a switching device including but not limited to circuit breakers, fuses, etc.

[0063] The input lead 20 is electrically connected to the photovoltaic module 1000. The first power device 31 is electrically connected to the input lead 20. The moving point lead 40 is electrically connected to the first power device 31 and is also electrically connected to the auxiliary device 200. The second power device 32 is electrically connected to the moving point lead 40 and is also electrically connected to the connection lead 50. That is to say, both the first power device 31 and the second power device 32 are electrically connected to the moving point lead 40. The connection lead 50 is electrically connected to the load device 3000. The protection device 33 is electrically connected to the mating lead 60. The mating lead 60 is electrically connected to the load device 3000. The control lead 80 is electrically connected to the control module 300 and is also electrically connected to the first power device 31 and the second power device 32. The ground lead 70 is used for grounding.

[0064] It can be understood that the photovoltaic module 1000, the input lead 20, the first power device 31, the moving point lead 40, the auxiliary device 200, and the load device 3000 form a first path. The auxiliary device 200, the load device 3000, the connection lead 50, the second power device 32, and the moving point lead 40 form a second path. The first power device 31 and the second power device 32 are alternately turned on and off, so that the first path and the second path are alternately turned on and off, so as to perform maximum power point tracking on the direct current output by the photovoltaic module 1000 and output the maximum power direct current to the load device 3000 to supply the load device 3000.

[0065] When the first power device 31 is turned on and the second power device 32 is turned off, the direct current output by the photovoltaic module 1000 is transmitted from the input lead 20 to the first power device 31. The first power device 31 converts the voltage of the direct current. The direct current converted by the first power device 31 is transmitted to the load device 3000 through the automatic point lead 40 and the auxiliary device 200 to supply the load device 3000. Among them, the auxiliary device 200 charges and stores energy. When the first power device 31 is turned off and the second power device 32 is turned on, the auxiliary device 200 discharges and outputs direct current; among them, the power of the direct current output by the auxiliary device 20 is equal to the power of the direct current converted by the first power device 31. The direct current output by the auxiliary device 200 returns to the auxiliary device 200 through the load device 3000, the connection lead 50 and the second power device 32. The direct current output by the auxiliary device 200 powers the load device 3000. During the alternating on and off of the first power device 31 and the second power device 32, the load device 3000 operates normally.

[0066] Among them, during the alternating on and off of the first power device 31 and the second power device 32, when the first power device 31 is turned off and the second power device 32 is turned on, the parameters (such as the duty cycle) of the first power device 31 can be adjusted, so as to adjust the power of the direct current converted by the first power device 31 and the power of the direct current received by the load device 3000. When the first power device 31 is turned off and the second power device 32 is turned on, the direct current output by the discharge of the auxiliary device 200 can supply the load device 3000, so as to monitor the direct current received by the load device 3000, and then facilitate the adjustment of the parameters of the first power device 31. By monitoring the power of the direct current received by the load device 3000 and adjusting the parameters of the first power device 31 multiple times to ensure that the power of the direct current received by the load device 3000 is the maximum, the maximum power point tracking of the direct current output by the photovoltaic module 1000 can be realized, and the power of the direct current converted by the first power device 31 can be ensured to be the maximum.

[0067] That is to say, by alternately turning on and off the first power device 31 and the second power device 32, the power module 100 can perform maximum power point tracking on direct current and automatically output maximum power direct current through the lead 40. When the first power device 31 is turned on and the second power device 32 is turned off, the first power device 31 can convert the voltage of the direct current output by the photovoltaic module 1000 and output maximum power direct current. The maximum power direct current is automatically led to the load device 3000 through the auxiliary device 200 to supply the load device 3000; among them, the auxiliary device 200 charges and stores the maximum power direct current. When the first power device 31 is turned off and the second power device 32 is turned on, the auxiliary device 200 outputs maximum power direct current, and the maximum power direct current returns to the auxiliary device 200 through the load device 3000, the connection lead 50, the second power device 32 and the moving point lead 40. The maximum power direct current output by the auxiliary device 200 powers the load device 3000.

[0068] The protection device 33 is electrically connected to the load device 3000 through the cooperation lead 60. The protection device 33 is used to protect the load device 3000. When both the first power device 31 and the second power device 32 fail, the protection device 33 protects the load device 3000, avoiding damage or burning of the load device 3000, which is beneficial to improving the use safety of the power module 100 and the use safety of the photovoltaic optimizer 2000. The control module 300 is electrically connected to the first power device 31 and the second power device 32 through the control lead 80. The control module 300 is used to control the first power device 31 and the second power device 32 to alternately turn on and off, so as to ensure that the power module 100 and the auxiliary device 200 cooperate to output maximum power direct current to the load device 3000.

[0069] Please refer to Figure 2 、 Figure 3 and Figure 4 , Figure 2 is Figure 1 the schematic structural diagram of the power module 100 of the photovoltaic optimizer 2000 shown in Figure 3 is Figure 2 the schematic structural diagram of the power module 100 with the plastic package 90 omitted shown in Figure 4 is Figure 2 the schematic structural diagram of the power module 100 cut along the A-A line shown in

[0070] Such as Figure 2 、 Figure 3 and Figure 4As shown, in some embodiments, the power module 100 further includes a substrate 10, a plastic package 90, and a heat dissipation substrate 90a. That is to say, the power module 100 includes the substrate 10, an input lead 20, a first power device 31, a second power device 32, a protection device 33, a moving point lead 40, a connection lead 50, a mating lead 60, a ground lead 70, a control lead 80, the plastic package 90, and the heat dissipation substrate 90a. Among them, the input lead 20, the first power device 31, the second power device 32, the protection device 33, the moving point lead 40, the connection lead 50, the mating lead 60, the ground lead 70, and the control lead 80 are all arranged on one side of the substrate 10. The plastic package 90 covers part of the substrate 10, part of the input lead 20, the first power device 31, the second power device 32, the protection device 33, part of the moving point lead 40, part of the connection lead 50, part of the mating lead 60, part of the ground lead 70, and part of the control lead 80. The heat dissipation substrate 90a is installed on the other side of the substrate 10 and is located outside the plastic package 90.

[0071] Please refer to Figure 5 and Figure 6 , Figure 5 is Figure 2 a schematic structural diagram of the substrate 10 of the power module 100 shown in Figure 6 is Figure 5 a schematic structural diagram of the substrate 10 cut along the B-B line shown in

[0072] In some embodiments, the substrate 10 includes a first substrate 11 and a second substrate 12. The second substrate 12 is arranged on one side of the first substrate 11. Exemplarily, the first substrate 11 is generally a rectangular plate. In some other embodiments, the first substrate 11 can also be a circular plate, a triangular plate, or various special-shaped plates. For ease of description, the width direction of the first substrate 11 is defined as the first direction (i.e., the X-axis direction shown in the figure), the length direction of the first substrate 11 is defined as the second direction (i.e., the Y-axis direction shown in the figure), and the thickness direction of the first substrate 11 is defined as the third direction (i.e., the Z-axis direction shown in the figure).

[0073] Exemplarily, the first substrate 11 may be a ceramic substrate or an aluminum substrate including, but not limited to, DBC (Direct Bond Copper) substrates, AMB (Active Metal Brazing Substrate) substrates, etc. The first substrate 11 includes a first insulating layer 111, a first conductive layer 112, and a second conductive layer 113. Exemplarily, the first insulating layer 111 may be made of insulating materials including, but not limited to, ceramics, epoxy resins, etc. The first conductive layer 112 and the second conductive layer 113 are made of conductive materials including, but not limited to, copper, aluminum, etc. In the Z-axis direction, the first conductive layer 112 and the second conductive layer 113 are stacked on opposite sides of the first insulating layer 111. Among them, in the Z-axis direction, the projection of the first conductive layer 112 on the first insulating layer 111 is located inside the projection of the second conductive layer 113 on the first insulating layer 111.

[0074] The second substrate 12 is stacked on the side of the first conductive layer 112 of the first substrate 11 facing away from the first insulating layer 111. Exemplarily, the second substrate 12 is generally a rectangular plate. In some other embodiments, the second substrate 12 may also be a circular plate, a triangular plate, or various shaped plates. The second substrate 12 may be a ceramic substrate or an aluminum substrate including, but not limited to, DBC (Direct Bond Copper) substrates, AMB (Active Metal Brazing Substrate) substrates, etc. The second substrate 12 includes a second insulating layer 121, a first power distribution layer 122, a second power distribution layer 123, a third power distribution layer 124, a fourth power distribution layer 125, and a power distribution connection layer 126. Exemplarily, the second insulating layer 121 may be made of insulating materials including, but not limited to, ceramics, epoxy resins, etc. The first power distribution layer 122, the second power distribution layer 123, the third power distribution layer 124, the fourth power distribution layer 125, and the power distribution connection layer 126 are all made of conductive materials including, but not limited to, copper, aluminum, etc.

[0075] In the Z-axis direction, the first power distribution layer 122, the second power distribution layer 123, the third power distribution layer 124, and the fourth power distribution layer 125 are stacked on one side of the second insulating layer 121. That is to say, the second power distribution layer 123, the third power distribution layer 124, and the fourth power distribution layer 125 are stacked on the side of the second insulating layer 121 facing the first power distribution layer 122. In the X-axis direction, the second power distribution layer 123 is located on one side of the first power distribution layer 122, the third power distribution layer 124, and the fourth power distribution layer 125, and is spaced apart from the first power distribution layer 122, the third power distribution layer 124, and the fourth power distribution layer 125. In the Y-axis direction, the third power distribution layer 124 and the fourth power distribution layer 125 are located on opposite sides of the first power distribution layer 122, and are both spaced apart from the first power distribution layer 122. In the Z-axis direction, the power distribution connection layer 126 is stacked on the side of the second insulating layer 121 facing away from the first power distribution layer 122. The projections of the first power distribution layer 122, the second power distribution layer 123, the third power distribution layer 124, and the fourth power distribution layer 125 on the second insulating layer 121 are located within the projection of the power distribution connection layer 126 on the second insulating layer 121.

[0076] Among them, the power distribution connection layer 126 is stacked on the first conductive layer 112 and is electrically connected to the first conductive layer 112 by means including but not limited to welding or gluing. Exemplarily, a first connecting member 1 is provided between the power distribution connection layer 126 and the first conductive layer 112, and the first connecting member 1 is made of materials including but not limited to tin-lead or conductive adhesive. The power distribution connection layer 126 is stacked on the first conductive layer 112 through the first connecting member 1 and is electrically connected to the first conductive layer 112. The second insulating layer 121 is stacked on the side of the power distribution connection layer 126 facing away from the first conductive layer 112. The first power distribution layer 122, the second power distribution layer 123, the third power distribution layer 124, and the fourth power distribution layer 125 are all stacked on the side of the second insulating layer 121 facing away from the first conductive layer 112. The projections of the first power distribution layer 122 in the Z-axis direction (i.e., along the thickness direction of the first substrate 11), the second power distribution layer 123 in the Z-axis direction, the third power distribution layer 124 in the Z-axis direction, and the fourth power distribution layer 125 in the Z-axis direction are all located within the projection of the first conductive layer 112 in the Z-axis direction (i.e., along the thickness direction of the first substrate 11).

[0077] It can be understood that the power distribution connection layer 126 is stacked between the first conductive layer 112 and the second insulating layer 121 and is electrically connected to the first conductive layer 112. The second insulating layer 121 is disposed on a side of the first conductive layer 112 facing away from the first insulating layer 111. In some other embodiments, the power distribution connection layer 126 may also be omitted, and the second insulating layer 121 may also be stacked on a side of the first conductive layer 112 facing away from the first insulating layer 111. In the Z-axis direction, the first conductive layer 112 is located between the second conductive layer 113 and the first power distribution layer 122 and is spaced apart from the second conductive layer 113 and the first power distribution layer 122.

[0078] In some embodiments, a first conductive member 13 is provided between the first power distribution layer 122 and the third power distribution layer 124. Exemplarily, the first conductive member 13 may be an electrical conductive device including but not limited to a cable or a metal member. By means including but not limited to welding or gluing, one end of the first conductive member 13 is stacked on a side of the first power distribution layer 122 facing away from the second insulating layer 121 and is electrically connected to the first power distribution layer 122; the other end is fixedly stacked on a side of the third power distribution layer 124 facing away from the second insulating layer 121 and is electrically connected to the third power distribution layer 124. Through the first conductive member 13, the first power distribution layer 122 is electrically connected to the third power distribution layer 124. It can be understood that the third power distribution layer 124 is stacked on a side of the second insulating layer 121 facing the first power distribution layer 122 and is electrically connected to the first power distribution layer 122.

[0079] In some embodiments, a second conductive member 14 is provided between the second power distribution layer 123 and the first conductive layer 112. Exemplarily, the second conductive member 14 may be an electrical conductive device including but not limited to a cable or a metal member. By means including but not limited to welding or gluing, one end of the second conductive member 14 is stacked on a side of the second power distribution layer 123 facing away from the second insulating layer 121 and is electrically connected to the second power distribution layer 123; the other end is stacked on a side of the first conductive layer 112 facing away from the first insulating layer 111 and is electrically connected to the first conductive layer 112. Through the second conductive member 14, the second power distribution layer 123 is electrically connected to the first conductive layer 112. It can be understood that the second power distribution layer 123 is stacked on a side of the second insulating layer 121 facing the first power distribution layer 122 and is electrically connected to the first conductive layer 112.

[0080] Please refer to Figure 7 and in combination with Figure 1 , Figure 2 , Figure 3 and Figure 4 , Figure 7 which is Figure 2 a schematic cross-sectional view of the power module 100 taken along the line C-C as shown.

[0081] As shown in Figure 3 and Figure 7As shown, in some embodiments, the input lead 20 is disposed on the side of the first substrate 11 facing the second substrate 12. Specifically, by means including but not limited to welding or gluing, the input lead 20 is laminated on the side of the third power distribution layer 124 facing away from the second insulating layer 121 and is electrically connected to the third power distribution layer 124. Exemplarily, a second connecting member 2 is provided between the input lead 20 and the third power distribution layer 124, and the second connecting member 2 is made of materials including but not limited to tin-lead or conductive adhesive. The input lead 20 is laminated on the side of the third power distribution layer 124 facing away from the second insulating layer 121 through the second connecting member 2 and is electrically connected to the third power distribution layer 124. In the X-axis direction, the input lead 20 is located on the side of the third power distribution layer 124 facing away from the second power distribution layer 123. Exemplarily, the number of input leads 20 is multiple. Specifically, the number of input leads 20 is 2. In the Y-axis direction, the multiple input leads 20 are arranged in sequence and spaced apart. In some other embodiments, the number of input leads 20 may also be 3, 4 or more.

[0082] Through the lamination of the input lead 20 and the third power distribution layer 124, the design of electrically connecting the input lead 20 and the third power distribution layer 124 is realized. It is not only simple and stable in structure, but also low in processing cost, which is beneficial to improving the structural stability of the power module. Moreover, the design of laminating the input lead 20 and the third power distribution layer 124 is beneficial to increasing the connection area between the input lead 20 and the third power distribution layer 124, beneficial to improving the connection strength between the input lead 20 and the third power distribution layer 124, and beneficial to improving the structural stability of the power module 100.

[0083] Among them, the input lead 20 includes a first main body portion 21, a first fixing portion 22 and an input pin 23. In the Z-axis direction, the first fixing portion 22 and the input pin 23 are fixedly connected to opposite ends of the first main body portion 21. In the Z-axis direction, the input pin 23 is staggeredly laminated and spaced apart from the first fixing portion 22. Specifically, the first main body portion 21 includes a first section 211, a second section 212 and a third section 213. The first section 211 extends along the X-axis direction and is opposite to and spaced apart from the first substrate 11. In the Z-axis direction, the second section 212 and the third section 213 are located on opposite sides of the first section 211. The second section 212 and the third section 213 are fixedly connected to opposite ends of the first section 211. And both the second section 212 and the third section 213 are inclined relative to the first section 211. In the Z-axis direction, the first fixing portion 22 is located on the side of the second section 212 facing away from the first section 211 and is fixedly connected to the second section 212. In the Z-axis direction, the input pin 23 is located on the side of the third section 213 facing away from the first section 211 and is fixedly connected to the third section 213.

[0084] The second connecting member 2 is stacked between the first fixing portion 22 and the third power distribution layer 124 and is electrically connected to the first fixing portion 22 and the third power distribution layer 124. Through the second connecting member 2, the first fixing portion 22 is stacked on the side of the third power distribution layer 124 facing away from the second insulating layer 121 and is electrically connected to the third power distribution layer 124. In the Z-axis direction, the input pin 23 is stacked and spaced apart from the third power distribution layer 124. The input pin 23 is electrically connected to the photovoltaic module 1000 (such as Figure 1 shown).

[0085] It can be understood that the input pin 23 is spaced apart from the first substrate 11 and the second substrate 12. And the input pin 23 is stacked with the first substrate 11. In some other embodiments, the input pin 23 can also be perpendicular to the first substrate 11 and extend in a direction away from the first substrate 11. The structure of the input pin 23 is diverse, and the design requirements for the input pin 23 are low, which is beneficial to reducing the design cost and the manufacturing cost of the power module 100. It should be noted that in this application, a small deviation is allowed between feature A and feature B being "perpendicular".

[0086] In some embodiments, the first power device 31 is disposed on the side of the first substrate 11 facing the second substrate 12. Specifically, by means including but not limited to welding or gluing, the first power device 31 is stacked on the side of the third power distribution layer 124 facing away from the second insulating layer 121 and is electrically connected to the third power distribution layer 124. Exemplarily, a third connecting member 3 is provided between the first power device 31 and the third power distribution layer 124, and the third connecting member 3 is made of materials including but not limited to tin-lead or conductive glue. In the X-axis direction, the first power device 31 is located between the second power distribution layer 123 and the input lead 20.

[0087] The first power device 31 is stacked on the side of the third power distribution layer 124 facing away from the second insulating layer 121 through the third connecting member 3 and is electrically connected to the third power distribution layer 124. It can be understood that since both the input lead 20 and the first power device 31 are electrically connected to the third power distribution layer 124, the first power device 31 is electrically connected to the input lead 20 through the third power distribution layer 124. The design of stacking the first power device 31 and the third power distribution layer 124 is beneficial to increasing the connection area between the first power device 31 and the third power distribution layer 124, beneficial to improving the connection strength between the first power device 31 and the third power distribution layer 124, and beneficial to improving the structural stability of the power module 100.

[0088] Such as Figure 3 and Figure 4As shown, in some embodiments, the second power device 32 is disposed on the side of the first substrate 11 facing the second substrate 12. Specifically, by means including but not limited to welding or gluing, the second power device 32 is laminated on the side of the first power distribution layer 122 facing away from the second insulating layer 121 and is electrically connected to the first power distribution layer 122. Exemplarily, a fourth connecting member 4 is provided between the second power device 32 and the first power distribution layer 122. The fourth connecting member 4 is made of materials including but not limited to tin-lead or conductive adhesive. The second power device 32 is laminated on the side of the first power distribution layer 122 facing away from the second insulating layer 121 through the fourth connecting member 4 and is electrically connected to the first power distribution layer 122. In the Y-axis direction, the second power device 32 is opposite to and spaced from the first power device 31.

[0089] The design of laminating the second power device 32 with the first power distribution layer 122 is conducive to increasing the connection area between the second power device 32 and the first power distribution layer 122, improving the connection strength between the second power device 32 and the first power distribution layer 122, and enhancing the structural stability of the power module 100.

[0090] In some embodiments, the protection device 33 is disposed on the side of the first substrate 11 facing the second substrate 12. Specifically, by means including but not limited to welding or gluing, the protection device 33 is laminated on the side of the fourth power distribution layer 125 facing away from the second insulating layer 121 and is electrically connected to the fourth power distribution layer 125. Exemplarily, a fifth connecting member 5 is provided between the protection device 33 and the fourth power distribution layer 125. The fifth connecting member 5 is made of materials including but not limited to tin-lead or conductive adhesive. The protection device 33 is laminated on the side of the fourth power distribution layer 125 facing away from the second insulating layer 121 through the fifth connecting member 5 and is electrically connected to the fourth power distribution layer 125. In the X-axis direction, the protection device 33 is located between the second power device 32 and the second power distribution layer 123 and is spaced from the second power device 32 and the second power distribution layer 123. And in the Y-axis direction, the protection device 33 is located on the side of the second power device 32 facing away from the first power device 31. The design of laminating the protection device 33 with the fourth power distribution layer 125 is conducive to increasing the connection area between the protection device 33 and the fourth power distribution layer 125, improving the connection strength between the protection device 33 and the fourth power distribution layer 125, and enhancing the structural stability of the power module 100.

[0091] In some embodiments, the moving lead 40 is disposed on the side of the first substrate 11 facing the second substrate 12. Specifically, by means including but not limited to welding or gluing, the moving lead 40 is laminated on the side of the first power distribution layer 122 facing away from the second insulating layer 121 and is electrically connected to the first power distribution layer 122. Exemplarily, a sixth connecting member 6 is provided between the moving lead 40 and the first power distribution layer 122, and the sixth connecting member 6 is made of materials including but not limited to tin-lead or conductive adhesive. The moving lead 40 is laminated on the side of the first power distribution layer 122 facing away from the second insulating layer 121 through the sixth connecting member 6 and is electrically connected to the first power distribution layer 122. In the X-axis direction, the moving lead 40 is located on the side of the second power device 32 facing away from the second power distribution layer 123 and is spaced apart from the second power device 32. In the Y-axis direction, the moving lead 40 is located on one side of the plurality of input leads 20 and is spaced apart from the plurality of input leads 20.

[0092] Through the lamination of the moving lead 40 and the first power distribution layer 122, the electrical connection between the moving lead 40 and the first power distribution layer 122 is realized, and the design of the common potential of the moving lead 40 and the first power distribution layer 122 is realized. It is not only simple and stable in structure, but also low in processing cost, which is beneficial to improving the structural stability of the power module 100. Moreover, the design of laminating the moving lead 40 and the first power distribution layer 122 is beneficial to increasing the connection area between the moving lead 40 and the first power distribution layer 122, improving the connection strength between the moving lead 40 and the first power distribution layer 122, and improving the structural stability of the power module 100.

[0093] Wherein, the moving lead 40 includes a second main body portion 41, a second fixing portion 42 and a moving pin 43. In the Z-axis direction, the moving pin 43 and the second fixing portion 42 are fixedly connected to opposite ends of the second main body portion 41. In the Z-axis direction, the moving pin 43 and the second fixing portion 42 are staggeredly laminated and spaced apart. Specifically, the second main body portion 41 includes a fourth section 411, a fifth section 412 and a sixth section 413. The fourth section 411 extends along the X-axis direction and is opposite to and spaced apart from the first substrate 11. In the Z-axis direction, the fifth section 412 and the sixth section 413 are located on opposite sides of the fourth section 411. The fifth section 412 and the sixth section 413 are fixedly connected to opposite ends of the fourth section 411. And both the fifth section 412 and the sixth section 413 are inclined relative to the fourth section 411. In the Z-axis direction, the second fixing portion 42 is located on the side of the fifth section 412 facing away from the fourth section 411 and is fixedly connected to the fifth section 412. In the Z-axis direction, the moving pin 43 is located on the side of the sixth section 413 facing away from the fourth section 411 and is fixedly connected to the sixth section 413.

[0094] The sixth connecting member 6 is stacked between the second fixing portion 42 and the first power distribution layer 122 and is electrically connected to the second fixing portion 42 and the first power distribution layer 122. Through the sixth connecting member 6, the second fixing portion 42 is stacked on the side of the first power distribution layer 122 facing away from the second insulating layer 121 and is electrically connected to the first power distribution layer 122. In the Z-axis direction, the moving pin 43 is stacked and spaced apart from the first power distribution layer 122. The moving pin 43 is electrically connected to the auxiliary device 200 (such as Figure 1 as shown). It can be understood that the moving pin 43 is spaced apart from the first substrate 11 and the second substrate 12. And the moving pin 43 is stacked with the first substrate 11.

[0095] Since the moving lead 40 is electrically connected to the first power distribution layer 122 and the third power distribution layer 124 is electrically connected to the first power distribution layer 122, the moving lead 40 is electrically connected to the third power distribution layer 124 through the first power distribution layer 122. Also, since the first power device 31 is stacked on the side of the third power distribution layer 124 facing away from the second insulating layer 121 and is electrically connected to the third power distribution layer 124; the first power device 31 is electrically connected to the moving lead 40 through the first power distribution layer 122 and the third power distribution layer 124. Since the moving lead 40 is electrically connected to the first power distribution layer 122 and the second power device 32 is stacked on the side of the first power distribution layer 122 facing away from the second insulating layer 121 and is electrically connected to the first power distribution layer 122, the second power device 32 is electrically connected to the moving lead 40 through the first power distribution layer 122.

[0096] As Figure 3 shown, in some embodiments, the connecting lead 50 is disposed on the side of the first substrate 11 facing the second substrate 12. Specifically, by means including but not limited to welding or gluing, the connecting lead 50 is stacked on the side of the first power distribution layer 122 facing away from the second insulating layer 121 and is electrically connected to the first power distribution layer 122. For details, reference can be made to the relevant description of the moving lead 40 and will not be elaborated here. In the X-axis direction, the connecting lead 50 is located on the side of the second power device 32 facing away from the second power distribution layer 123 and is spaced apart from the second power device 32. In the Y-axis direction, the connecting lead 50 is located on the side of the moving lead 40 facing away from the plurality of input leads 20 and is spaced apart from the moving lead 40. Through the stacking of the connecting lead 50 and the first power distribution layer 122, the design of electrically connecting the connecting lead 50 and the first power distribution layer 122 is realized, which is not only simple and stable in structure, but also low in processing cost, and is beneficial to improving the structural stability of the power module 100. Moreover, the design of stacking the connecting lead 50 and the first power distribution layer 122 is beneficial to increasing the connection area between the connecting lead 50 and the first power distribution layer 122, beneficial to improving the connection strength between the connecting lead 50 and the first power distribution layer 122, and beneficial to improving the structural stability of the power module 100.

[0097] Among them, the structure of the connection lead 50 can refer to the relevant description of the moving point lead 40. The connection lead 50 includes a third main body portion 51, a third fixing portion 52, and a connection pin 53. In the Z-axis direction, the connection pin 53 and the third fixing portion 52 are fixedly connected to opposite ends of the third main body portion 51. In the Z-axis direction, the connection pin 53 and the third fixing portion 52 are staggeredly stacked and spaced apart. The third fixing portion 52 is stacked on the side of the first power distribution layer 122 facing away from the second insulating layer 121 and is electrically connected to the first power distribution layer 122. In the Z-axis direction, the connection pin 53 and the first power distribution layer 122 are stacked and spaced apart. The connection pin 53 is electrically connected to the load device 3000 (such as Figure 1 as shown). It can be understood that the connection pin 53 is spaced apart from the first substrate 11 and the second substrate 12. And the connection pin 53 is stacked with the first substrate 11. In some other embodiments, the connection pin 53 can also be perpendicular to the first substrate 11 and extend in a direction away from the first substrate 11. The structure of the connection pin 53 is diverse, and the design requirements for the connection pin 53 are low, which is beneficial to reducing the design cost and the manufacturing cost of the power module 100. It can be understood that since both the connection lead 50 and the second power device 32 are electrically connected to the first power distribution layer 122, the connection lead 50 is electrically connected to the second power device 32.

[0098] Such as Figure 1 and Figure 3 as shown, when the first power device 31 is turned on and the second power device 32 is turned off, the direct current output by the photovoltaic module 1000 can be transmitted to the third power distribution layer 124 through a plurality of input leads 20, and then transmitted from the third power distribution layer 124 to the first power device 31. The first power device 31 can perform voltage conversion on the direct current and output the maximum power direct current. The maximum power direct current is transmitted to the first power distribution layer 122 through the first conductive member 13, and then automatically output from the first power distribution layer 122 to the auxiliary device 200 through the point lead 40, and then transmitted from the auxiliary device 200 to the load device 3000 to supply the load device 3000; among them, the auxiliary device 200 charges and stores the maximum power direct current.

[0099] When the first power device 31 is turned off and the second power device 32 is turned on, the auxiliary device 200 discharges and outputs the maximum power direct current. The maximum power direct current is transmitted from the load device 3000 through the connection lead 50 to the second power device 32 through the first power distribution layer 122, and then returns from the second power device 32 to the auxiliary device 200 through the first power distribution layer 122 through the moving point lead 40. The maximum power direct current output by the auxiliary device 200 powers the load device 3000. It can be understood that since the first power device 31 and the second power device 32 are alternately turned on and off, the electrical frequency of the moving point lead 40 continuously changes, and the moving point lead 40 will generate relatively large electromagnetic interference.

[0100] In some embodiments, the mating lead 60 is disposed on the side of the first substrate 11 facing the second substrate 12. Specifically, by means including but not limited to welding or gluing, the mating lead 60 is laminated on the side of the fourth power distribution layer 125 facing away from the second insulating layer 121 and is electrically connected to the fourth power distribution layer 125. For specific details, reference may be made to the relevant description of the moving lead 40, which will not be elaborated here. In the X-axis direction, the mating lead 60 is located on the side of the protection device 33 facing away from the second power distribution layer 123 and is spaced apart from the protection device 33. In the Y-axis direction, the mating lead 60 is located on the side of the connection lead 50 facing away from the moving lead 40 and is spaced apart from the connection lead 50. Exemplarily, the number of mating leads 60 is multiple. Specifically, the number of mating leads 60 is 5. In some other embodiments, the number of mating leads 60 may also be 2, 3, or more. In the Y-axis direction, the multiple mating leads 60 are arranged in sequence and spaced apart. Through the lamination of the mating lead 60 and the fourth power distribution layer 125, the design of electrically connecting the mating lead 60 and the fourth power distribution layer 125 is realized, which is not only simple and stable in structure, but also low in processing cost, and is beneficial to improving the structural stability of the power module 100. Moreover, the design of laminating the mating lead 60 and the fourth power distribution layer 125 is beneficial to increasing the connection area between the mating lead 60 and the fourth power distribution layer 125, beneficial to improving the connection strength between the mating lead 60 and the fourth power distribution layer 125, and beneficial to improving the structural stability of the power module 100.

[0101] Among them, the structure of the mating lead 60 may refer to the relevant description of the moving lead 40. The mating lead 60 includes a fourth main body portion 61, a fourth fixing portion 62, and a mating pin 63. In the Z-axis direction, the mating pin 63 and the fourth fixing portion 62 are fixedly connected to opposite ends of the fourth main body portion 61. In the Z-axis direction, the mating pin 63 and the fourth fixing portion 62 are staggeredly laminated and spaced apart. The fourth fixing portion 62 is laminated on the side of the fourth power distribution layer 125 facing away from the second insulating layer 121 and is electrically connected to the fourth power distribution layer 125. In the Z-axis direction, the mating pin 63 is laminated and spaced apart from the fourth power distribution layer 125. The mating pin 63 is electrically connected to the load device 3000. It can be understood that the mating pin 63 is spaced apart from the first substrate 11 and the second substrate 12. And the mating pin 63 is laminated with the first substrate 11. In some other embodiments, the mating pin 63 may also be perpendicular to the first substrate 11 and extend in a direction away from the first substrate 11. The structure of the mating pin 63 is diverse, and the design requirements for the mating pin 63 are low, which is beneficial to reducing the design cost and beneficial to reducing the manufacturing cost of the power module 100.

[0102] It can be understood that since both the mating lead 60 and the protection device 33 are electrically connected to the fourth power distribution layer 125, the protection device 33 is electrically connected to the mating lead 60 through the fourth power distribution layer 125; and since the mating lead 60 is electrically connected to the load device 3000, the protection device 33 is electrically connected to the load device 3000 through the mating lead 60. Thus, when both the first power device 31 and the second power device 32 fail, the protection device 33 can protect the load device 3000, avoiding damage or burnout of the load device 3000, which is beneficial to improving the use safety of the power module 100.

[0103] As Figure 3 and Figure 4 shown, in some embodiments, the ground lead 70 is disposed on the side of the first substrate 11 facing the second substrate 12. Specifically, by means including but not limited to welding or gluing, the ground lead 70 is laminated on the side of the second power distribution layer 123 facing away from the second insulating layer 121 and is electrically connected to the second power distribution layer 123. Exemplarily, a seventh connector 7 is provided between the ground lead 70 and the second power distribution layer 123, and the seventh connector 7 is made of materials including but not limited to tin-lead or conductive adhesive. The ground lead 70 is laminated on the side of the second power distribution layer 123 facing away from the second insulating layer 121 through the seventh connector 7 and is electrically connected to the second power distribution layer 123. In the X-axis direction, the ground lead 70 is located on the side of the second power distribution layer 123 facing away from the first power distribution layer 122. It can be understood that in the X-axis direction, the ground lead 70 is arranged opposite to the input lead 20, the moving point lead 40, the connection lead 50, and the mating lead 60. Exemplarily, the number of the ground leads 70 is multiple. Specifically, the number of the ground leads 70 is 10. In some other embodiments, the number of the ground leads 70 can also be 1, 2, or more. Along the Y-axis direction, the multiple ground leads 70 are arranged in sequence and spaced apart. One of the ground leads 70 is grounded, and the other ground leads 70 are not grounded. In some other embodiments, it can also be that multiple ground leads 70 are all grounded.

[0104] Through the lamination of the ground lead 70 and the second power distribution layer 123, the design of electrically connecting the ground lead 70 and the second power distribution layer 123 is realized, which is not only simple and stable in structure, but also low in processing cost, and is beneficial to improving the structural stability of the power module 100. Moreover, the design of laminating the ground lead 70 and the second power distribution layer 123 is beneficial to increasing the connection area between the ground lead 70 and the second power distribution layer 123, beneficial to improving the connection strength between the ground lead 70 and the second power distribution layer 123, and beneficial to improving the structural stability of the power module 100. It can be understood that the ground lead 70 is disposed on the second substrate 12, which is convenient for arranging the ground lead 70 and is beneficial to reducing the wiring difficulty.

[0105] Among them, the grounding lead 70 includes a fifth main body portion 71, a fifth fixing portion 72, and a grounding pin 73. In the Z-axis direction, the grounding pin 73 and the fifth fixing portion 72 are fixedly connected to opposite ends of the fifth main body portion 71. In the Z-axis direction, the grounding pin 73 and the fifth fixing portion 72 are staggeredly stacked and spaced apart. Specifically, the fifth main body portion 71 includes a seventh section 711, an eighth section 712, and a ninth section 713. The seventh section 711 extends along the X-axis direction and is opposite to and spaced apart from the first substrate 11. In the Z-axis direction, the eighth section 712 and the ninth section 713 are located on opposite sides of the seventh section 711. The eighth section 712 and the ninth section 713 are fixedly connected to opposite ends of the seventh section 711. And both the eighth section 712 and the ninth section 713 are inclined relative to the seventh section 711. In the Z-axis direction, the fifth fixing portion 72 is located on the side of the eighth section 712 facing away from the seventh section 711 and is fixedly connected to the eighth section 712. In the Z-axis direction, the grounding pin 73 is located on the side of the ninth section 713 facing away from the seventh section 711 and is fixedly connected to the ninth section 713.

[0106] The fifth fixing portion 72 is stacked on the side of the second power distribution layer 123 facing away from the second insulating layer 121 and is electrically connected to the second power distribution layer 123. In the Z-axis direction, the grounding pin 73 is stacked and spaced apart from the second power distribution layer 123. The grounding pin 73 is electrically connected to the load device 3000 (such as Figure 1 shown). It can be understood that the grounding pin 73 is spaced apart from the first substrate 11 and the second substrate 12. And the grounding pin 73 is stacked with the first substrate 11.

[0107] Since the second power distribution layer 123 is electrically connected to the first conductive layer 112, the grounding lead 70 is stacked on the side of the second power distribution layer 123 facing away from the second insulating layer 121 and is electrically connected to the second power distribution layer 123; the grounding lead 70 is electrically connected to the first conductive layer 112 through the second power distribution layer 123. The grounding lead 70 and the first conductive layer 112 are at the same potential, and the first conductive layer 112 is grounded through the grounding lead 70. It can be understood that the grounding lead 70 and the first conductive layer 112 are at the same potential. Also, since the first conductive layer 112 is located between the first power distribution layer 122 and the second conductive layer 113, the first power distribution layer 122 and the second conductive layer 113 achieve electromagnetic shielding through the first conductive layer 112. Since the moving point lead 40 is stacked on the side of the first power distribution layer 112 facing away from the second insulating layer 121 and is electrically connected to the first power distribution layer 112, the moving point lead 40 and the first power distribution layer 112 are at the same potential. The electromagnetic interference generated by the moving point lead 40 is shielded by the first conductive layer 112, achieving electromagnetic shielding of the moving point lead 40, and further achieving electromagnetic shielding of the power module 100. It can avoid damage to the performance of other devices (such as the auxiliary device 200 and the control module 300) of the photovoltaic optimizer 2000 due to the electromagnetic interference of the power module 100, which is beneficial to reducing the distance between the power module 100 and other devices of the photovoltaic optimizer 2000 and is beneficial to the miniaturization design of the photovoltaic optimizer 2000. It can be understood that the moving point lead 40 and the first power distribution layer 112 are at the same potential. The first power distribution layer 122 and the second conductive layer 113 are electromagnetically shielded through the first conductive layer 112, and the moving point lead 40 and the second conductive layer 113 are electromagnetically shielded.

[0108] It can be understood that the design in which the projection of the first power distribution layer 122 in the thickness direction of the first substrate 11 (i.e., the Z-axis direction) is entirely located within the projection of the first conductive layer 112 in the thickness direction of the first substrate 11 is beneficial to improving the electromagnetic shielding effect of the first conductive layer 112 on the first power distribution layer 122, and further beneficial to improving the electromagnetic shielding effect of the second conductive layer 113 and the first power distribution layer 112 through the first conductive layer 112, and beneficial to improving the electromagnetic shielding effect on the power module 100.

[0109] Since the power distribution connection layer 126 is stacked between the first conductive layer 112 and the second insulating layer 121, the power distribution connection layer 126 is located between the first power distribution layer 122 and the second conductive layer 113. Also, since the power distribution connection layer 126 is electrically connected to the first conductive layer 112 and the power distribution connection layer 126 is grounded through the first conductive layer 112, the power distribution connection layer 126 can play a role in electromagnetic shielding. The first power distribution layer 122 and the second conductive layer 113 can jointly achieve electromagnetic shielding through the power distribution connection layer 126 and the first conductive layer 112, which is beneficial to improving the electromagnetic shielding effect.

[0110] Such as Figure 1 AndFigure 3 As shown, in some embodiments, the control lead 80 is disposed on the side of the first substrate 11 facing the second substrate 12. Specifically, by means including but not limited to welding or gluing, the control lead 80 is laminated on the side of the third power distribution layer 124 facing away from the second insulating layer 121 and is electrically connected to the third power distribution layer 124. For specific details, reference may be made to the relevant description of the input lead 20, which will not be elaborated herein. In the X-axis direction, the control lead 80 is located on the side of the first power device 31 facing away from the second power distribution layer 123 and is spaced from the first power device 31. It can be understood that in the X-axis direction, the control lead 80 and the ground lead 70 are arranged in opposite directions. In the Y-axis direction, the control lead 80 is located on the side of the plurality of input leads 20 facing away from the moving point lead 40 and is spaced from the plurality of input leads 20. Exemplarily, the number of control leads 80 is 1. In some other embodiments, the number of control leads 80 may also be 2, 3 or more. By laminating the control lead 80 with the third power distribution layer 124, the design of electrically connecting the control lead 80 and the third power distribution layer 124 is achieved, which is not only simple and stable in structure, but also low in processing cost, and is beneficial to improving the structural stability of the power module 100. Moreover, the design of laminating the control lead 80 with the third power distribution layer 124 is beneficial to increasing the connection area between the control lead 80 and the third power distribution layer 124, beneficial to improving the connection strength between the control lead 80 and the third power distribution layer 124, and beneficial to improving the structural stability of the power module 100.

[0111] Among them, the structure of the control lead 80 may refer to the relevant description of the input lead 20. The control lead 80 includes a sixth main body portion 81, a sixth fixing portion 82 and a control pin 83. In the Z-axis direction, the control pin 83 and the sixth fixing portion 82 are fixedly connected to opposite ends of the sixth main body portion 81. In the Z-axis direction, the control pin 83 and the sixth fixing portion 82 are staggeredly laminated and spaced apart. The sixth fixing portion 82 is laminated on the side of the third power distribution layer 124 facing away from the second insulating layer 121 and is electrically connected to the third power distribution layer 124. In the Z-axis direction, the control pin 83 is laminated and spaced apart from the third power distribution layer 124. The control pin 83 is electrically connected to the control module 300. It can be understood that the control pin 83 is spaced from the first substrate 11 and the second substrate 12. And the control pin 83 is laminated with the first substrate 11. In some other embodiments, the control pin 83 may also be perpendicular to the first substrate 11 and extend in a direction away from the first substrate 11. The structure of the control pin 83 is diverse, and the design requirements for the control pin 83 are low, which is beneficial to reducing the design cost and beneficial to reducing the manufacturing cost of the power module 100.

[0112] Since the first power device 31 is electrically connected to the third power distribution layer 124, and the control lead 80 is electrically connected to the third power distribution layer 124; the control lead 80 is electrically connected to the first power device 31 through the third power distribution layer 124, and the control module 300 can control the on / off of the first power device 31 through the control lead 80. Since the second power device 32 is electrically connected to the first power distribution layer 122, the first power distribution layer 122 is electrically connected to the third power distribution layer 123, and the control lead 80 is electrically connected to the third power distribution layer 123; the control lead 80 is electrically connected to the second power device 32 through the first power distribution layer 122 and the third power distribution layer 123, and the control module 300 can control the on / off of the second power device 32 through the control lead 80. Thus, the control module 300 can control the first power device 31 and the second power device 32 to alternately turn on and off, so as to perform maximum power point tracking on the direct current output by the photovoltaic module 1000.

[0113] Please refer to Figure 8 and combine with Figure 2 and Figure 3 , Figure 8 is Figure 2 a schematic cross-sectional view of the power module 100 shown in

[0114] In some embodiments, the encapsulant 90 is made of insulating materials including plastics or rubbers. The encapsulant 90 covers the first substrate 11, the second substrate 12, the input lead 20, the first power device 31, the second power device 32, the protection device 33, the moving point lead 40, the connection lead 50, the mating lead 60, the ground lead 70 and the control lead 80. Among them, the second conductive layer 113 of the first substrate 11 is exposed outside the encapsulant 90. A part of the first main body 21 and the input pin 23 of the input lead 20 are exposed outside the encapsulant 90. A part of the second main body 41 and the moving point pin 43 of the moving point lead 40 are exposed outside the encapsulant 90. A part of the third main body 51 and the connection pin 53 of the connection lead 50 are exposed outside the encapsulant 90. A part of the fourth main body 61 and the mating pin 63 of the mating lead 60 are exposed outside the encapsulant 90. A part of the fifth main body 71 and the ground pin 73 of the ground lead 70 are exposed outside the encapsulant 90. A part of the sixth main body 81 and the control pin 83 of the control lead 80 are exposed outside the encapsulant 90.

[0115] Through the encapsulation of the first substrate 11, the second substrate 12, the input lead 20, the first power device 31, the second power device 32, the protection device 33, the moving point lead 40, the connection lead 50, the mating lead 60, the ground lead 70 and the control lead 80 by the encapsulant 90, the encapsulation of the first substrate 11, the second substrate 12, the input lead 20, the first power device 31, the second power device 32, the protection device 33, the moving point lead 40, the connection lead 50, the mating lead 60, the ground lead 70 and the control lead 80 is realized. The design of the encapsulant 90 is beneficial to improving the structural stability of the power module 100.

[0116] Among them, the encapsulant 90 includes a first surface 91, a second surface 92, a third surface 93 and a fourth surface 94. In the Z-axis direction, the first surface 91 and the second surface 92 are arranged opposite to each other. In the X-axis direction, the third surface 93 and the fourth surface 94 are arranged opposite to each other. The third surface 93 and the fourth surface 94 are fixedly connected between the first surface 91 and the second surface 92. Among them, the first surface 91 is flush with the surface of the second conductive layer 113 facing away from the first insulating layer 111. The second conductive layer 113 is exposed from the first surface 91 to the encapsulant 90. A part of the first main body 21 and the input pin 23 of the input lead 20 are exposed from the fourth surface 94 to the outside of the encapsulant 90. A part of the second main body 41 and the moving point pin 43 of the moving point lead 40 are exposed from the fourth surface 94 to the outside of the encapsulant 90. A part of the third main body 51 and the connection pin 53 of the connection lead 50 are exposed from the fourth surface 94 to the outside of the encapsulant 90. A part of the fourth main body 61 and the mating pin 63 of the mating lead 60 are exposed from the fourth surface 94 to the outside of the encapsulant 90. A part of the sixth main body 81 and the control pin 83 of the control lead 80 are exposed from the fourth surface 94 to the outside of the encapsulant 90. The fifth main body 71 and the ground pin 73 of the ground lead 70 are exposed from the third surface 93 to the outside of the encapsulant 90.

[0117] In some embodiments, the encapsulant 90 is provided with a first groove 95. In the Z-axis direction, the first groove 95 is located on the side of the ground lead 70 facing the second conductive layer 113. The projection of the first groove 95 in the thickness direction of the first substrate 11 (i.e., in the Z-axis direction) overlaps with the projection of the ground lead 70 in the thickness direction of the first substrate 11 (i.e., in the Z-axis direction). Exemplarily, the first groove 95 is a rectangular groove. In some other embodiments, the first groove 95 may also be a special-shaped groove including but not limited to a cylindrical groove or a spherical groove. The first groove 95 penetrates the encapsulant 90 in the Y-axis direction. And the first groove 95 extends in the Z-axis direction and has an opening, and the opening is located on the first surface 91. The projection of the first groove 95 in the Z-axis direction overlaps with the projection of the fifth main body 71 of the ground lead 70 in the Z-axis direction. In some other embodiments, the first groove 95 may also extend in the X-axis direction and have an opening, and the opening is located on the third surface 93.

[0118] The first groove 95 is used to increase the creepage distance L1 between the second conductive layer 113 and the ground lead 70. The design of the first groove 95 greatly increases the creepage distance L1 between the second conductive layer 113 and the ground lead 70 on the basis of ensuring that the volume of the power module 100 is not increased, which is beneficial to reducing the probability of the leakage risk of the power module 100 and improving the use safety of the power module 100.

[0119] In some embodiments, the plastic package 90 is provided with a second groove 96. In the Z-axis direction, the second groove 96 is located on the side of the moving lead 40 facing the second conductive layer 113. The projection of the second groove 96 in the thickness direction of the first substrate 11 (i.e., in the Z-axis direction) overlaps with the projection of the moving lead 40 in the thickness direction of the first substrate 11 (i.e., in the Z-axis direction). Exemplarily, the second groove 96 is a rectangular groove. In some other embodiments, the second groove 96 may also be a special-shaped groove including but not limited to a cylindrical groove or a spherical groove. The second groove 96 penetrates the plastic package 90 in the Y-axis direction. And the second groove 96 extends in the Z-axis direction and has an opening located on the first surface 91. The projection of the second groove 96 in the Z-axis direction overlaps with the projection of the second main body portion 41 of the moving lead 40 in the Z-axis direction, with the projection of the third main body portion 51 of the connecting lead 50 in the Z-axis direction, with the projection of the fourth main body portion 61 of the mating lead 60 in the Z-axis direction, and with the projection of the sixth main body portion 81 of the control lead 80 in the Z-axis direction. In some other embodiments, the second groove 96 may also extend in the X-axis direction and have an opening located on the fourth surface 94. Wherein, the second groove 96 is symmetrically arranged with respect to the second conductive layer 113 with the first groove 95. In this way, it is beneficial to improve the force uniformity of the plastic package 90, beneficial to improve the structural stability of the plastic package 90, and beneficial to improve the structural stability of the power module 100.

[0120] The second groove 96 can increase the creepage distance L2 between the second conductive layer 113 and the moving point lead 40. That is to say, the second groove 96 is used to increase the creepage distance L2 between the second conductive layer 113 and the moving point lead 40. And the second groove 96 can increase the creepage distance between the second conductive layer 113 and the input lead 20, the creepage distance between the second conductive layer 113 and the connection lead 50, and the creepage distance between the second conductive layer 113 and the control lead 80. Specifically, reference can be made to the creepage distance L2, which will not be elaborated here. That is to say, the second groove 96 is used to increase the creepage distance between the second conductive layer 113 and the input lead 20, the creepage distance between the second conductive layer 113 and the connection lead 50, and the creepage distance between the second conductive layer 113 and the control lead 80. The design of the second groove 96 greatly increases the creepage distance L2 between the second conductive layer 113 and the moving point lead 40, greatly increases the creepage distance between the second conductive layer 113 and the input lead 20, the creepage distance between the second conductive layer 113 and the connection lead 50, and the creepage distance between the second conductive layer 113 and the control lead 80 on the basis of ensuring that the volume of the power module 100 is not increased, which is beneficial to reducing the probability of the occurrence of the leakage risk of the power module 100 and improving the use safety of the power module 100.

[0121] In some embodiments, the plastic package 90 is provided with a first mating groove 97. In the Z-axis direction, the first mating groove 97 is located on the side of the ground lead 70 facing away from the second conductive layer 113. The projection of the first mating groove 97 in the thickness direction of the first substrate 11 (i.e., in the Z-axis direction) overlaps with the projection of the first groove 95 in the thickness direction of the first substrate 11 (i.e., in the Z-axis direction). Exemplarily, the first mating groove 97 is a rectangular groove. In some other embodiments, the first mating groove 97 can also be a special-shaped groove including but not limited to a cylindrical groove or a spherical groove. The first mating groove 97 penetrates the plastic package 90 in the Y-axis direction. The first mating groove 97 extends in the Z-axis direction and has an opening located on the second surface 92. And the first mating groove 97 extends in the X-axis direction and has an opening located on the third surface 93. The projection of the first groove 95 in the Z-axis direction is located in the projection of the first mating groove 97 in the Z-axis direction. In some other embodiments, the projection of the first mating groove 97 in the Z-axis direction can also completely overlap with the projection of the first groove 95 in the Z-axis direction.

[0122] In some embodiments, the encapsulant 90 is provided with a second mating groove 98. In the Z-axis direction, the second mating groove 98 is located on the side of the moving lead 40 facing away from the second conductive layer 113. The projection of the second mating groove 98 in the thickness direction of the first substrate 11 (i.e., in the Z-axis direction) overlaps with the projection of the second groove 96 in the thickness direction of the first substrate 11 (i.e., in the Z-axis direction). Exemplarily, the second mating groove 98 is a rectangular groove. In some other embodiments, the second mating groove 98 can also be a special-shaped groove such as, but not limited to, a cylindrical groove or a spherical groove. The second mating groove 98 penetrates the encapsulant 90 in the Y-axis direction. The second mating groove 98 extends in the Z-axis direction and has an opening located on the second surface 92. And the second mating groove 98 extends in the X-axis direction and has an opening located on the fourth surface 94. The projection of the second groove 96 in the Z-axis direction is located within the projection of the second mating groove 98 in the Z-axis direction. In some other embodiments, the projection of the second mating groove 98 in the Z-axis direction can also completely overlap with the projection of the second groove 96 in the Z-axis direction. Among them, the second mating groove 98 and the first mating groove 97 are symmetrically arranged with respect to the second conductive layer 113. In this way, it is beneficial to improve the force uniformity of the encapsulant 90, beneficial to improve the structural stability of the encapsulant 90, and beneficial to improve the structural stability of the power module 100.

[0123] Please refer to again Figure 3 and Figure 4 In some embodiments, the heat dissipation substrate 90a is disposed on the side of the first substrate 11 facing away from the second substrate 12. Specifically, by means including but not limited to welding or gluing, the heat dissipation substrate 90a is laminated on the side of the second conductive layer 113 facing away from the first insulating layer 111. And the heat dissipation substrate 90a is laminated with the first surface 91 of the encapsulant 90. The heat dissipation substrate 90a is made of heat-conducting materials including but not limited to copper, aluminum, etc. A large amount of heat is generated when the first power device 31, the second power device 32, and the protection device 33 work. The heat generated when the first power device 31, the second power device 32, and the protection device 33 work can sequentially pass through the second substrate 12 and the first substrate 11, and be transferred from the second conductive layer 113 to the heat dissipation substrate 90a, and then be dissipated to the external environment through the heat dissipation substrate 90a, so as to achieve rapid heat dissipation of the first power device 31, the second power device 32, and the protection device 33. The design of the heat dissipation substrate 90a is beneficial to improving the heat dissipation efficiency of the first power device 31, the second power device 32, and the protection device 33, and beneficial to improving the heat dissipation efficiency of the power module 100.

[0124] It can be understood that the second substrate 12 and the heat dissipation substrate 90a are disposed on opposite sides of the first substrate 11. The first power device 31, the second power device 32, and the protection device 33 are all disposed on the side of the second substrate 12 facing away from the first substrate 11. With such a design, the heat generated when the first power device 31, the second power device 32, and the protection device 33 operate will first be transferred from the second substrate 12 to the first substrate 11, and then from the first substrate 11 to the heat dissipation substrate 90a, which is beneficial to increasing the heat diffusion area of the first power device 31, the second power device 32, and the protection device 33 for heat dissipation through the heat dissipation substrate 90a, greatly reducing the overall thermal resistance, and being beneficial to improving the heat dissipation efficiency of the first power device 31, the second power device 32, and the protection device 33.

[0125] It can be understood that in the X-axis direction, the first groove 95 and the second groove 96 are located on opposite sides of the heat dissipation substrate 90a. The first groove 95 is also used to increase the creepage distance L3 between the heat dissipation substrate 90a and the ground lead 70. The design of the first groove 95 can greatly increase the creepage distance L3 between the heat dissipation substrate 90a and the ground lead 70 on the basis of ensuring that the volume of the power module 100 is not increased, which is beneficial to reducing the probability of the power module 100 having a leakage risk and is beneficial to improving the use safety of the power module 100.

[0126] The second groove 96 is also used to increase the creepage distance L4 between the heat dissipation substrate 90a and the moving point lead 40, the creepage distance between the heat dissipation substrate 90a and the input lead 20, the creepage distance between the heat dissipation substrate 90a and the connection lead 50, the creepage distance between the heat dissipation substrate 90a and the mating lead 60, and the creepage distance between the heat dissipation substrate 90a and the control lead 80. The design of the second groove 96 can greatly increase the creepage distance L4 between the heat dissipation substrate 90a and the moving point lead 40, the creepage distance between the heat dissipation substrate 90a and the input lead 20, the creepage distance between the heat dissipation substrate 90a and the connection lead 50, the creepage distance between the heat dissipation substrate 90a and the mating lead 60, and the creepage distance between the heat dissipation substrate 90a and the control lead 80 on the basis of ensuring that the volume of the power module 100 is not increased, which is beneficial to reducing the probability of the power module 100 having a leakage risk and is beneficial to improving the use safety of the power module 100.

[0127] It can be understood that the second conductive layer 113 can be stacked with the heat dissipation substrate 90a. The design of the first mating groove 97 can prevent the stress when the second conductive layer 113 is stacked with the heat dissipation substrate 90a from concentrating on the part of the plastic package 90 provided with the first mating groove 97, thereby avoiding cracks in the part of the plastic package 90 provided with the first mating groove 97, which is beneficial to improving the reliability of the plastic package 90 and is beneficial to improving the structural stability of the power module 100.

[0128] The design of the second mating groove 98 can prevent the stress from concentrating on the part of the encapsulant 90 where the second mating groove 98 is provided when the second conductive layer 113 and the heat dissipation substrate 90a are stacked, thereby avoiding cracks in the part of the encapsulant 90 where the second mating groove 98 is provided, which is beneficial to improving the reliability of the encapsulant 90 and the structural stability of the power module 100.

[0129] Please refer to again Figure 1 、 Figure 2 and Figure 3 As shown in FIGS. 1-3, an embodiment of the present application provides a power module 100. The power module 100 includes a first substrate 11, a second substrate 12, a first power device 31, a second power device 32, a moving point lead 40, and a ground lead 70. The second substrate 12, the first power device 31, the second power device 32, the moving point lead 40, and the ground lead 70 are all disposed on one side of the first substrate 11. The first substrate 11 includes a first insulating layer 111, a first conductive layer 112, and a second conductive layer 113. The first conductive layer 112 and the second conductive layer 113 are stacked on opposite sides of the first insulating layer 111. The second substrate 12 includes a second insulating layer 121 and a first power distribution layer 122. The second insulating layer 121 is disposed on the side of the first conductive layer 112 facing away from the first insulating layer 111, and the first power distribution layer 122 is stacked on the side of the second insulating layer 121 facing away from the first conductive layer 112. The first power device 31 and the second power device 32 are both electrically connected to the moving point lead 40. The first power device 31 and the second power device 32 are alternately turned on and off. The moving point lead 40 and the first power distribution layer 112 are at the same potential, and the ground lead 70 and the first conductive layer 112 are at the same potential.

[0130] The power module 100 provided by the embodiment of the present application is used to receive direct current and perform maximum power point tracking on the direct current to output maximum power direct current. Among them, by alternately turning on and off the first power device 31 and the second power device 32, the power module 100 can perform maximum power point tracking on the direct current and output maximum power direct current through the automatic point lead 40. Since the first power device 31 and the second power device 32 are alternately turned on and off, the electrical frequency of the moving point lead 40 continuously changes, and the moving point lead 40 will generate relatively large electromagnetic interference.

[0131] Since the first conductive layer 112 and the second conductive layer 113 are stacked on opposite sides of the first insulating layer 111, the second insulating layer 121 is disposed on the side of the first conductive layer 112 facing away from the first insulating layer 111, and the first power distribution layer 122 is stacked on the side of the second insulating layer 121 facing away from the first conductive layer 112, the first conductive layer 112 is located between the first power distribution layer 122 and the second conductive layer 113; also, since the grounding lead 70 and the first conductive layer 112 are at the same potential, the first conductive layer 112 is grounded through the grounding lead 70, and the first power distribution layer 122 and the second conductive layer 113 are electromagnetically shielded by the first conductive layer 112. Since the moving point lead 40 and the first power distribution layer 122 are at the same potential, the moving point lead 40 is electromagnetically shielded from the second conductive layer 113 through the first conductive layer 112, and the electromagnetic interference caused by the moving point lead 40 is shielded by the first conductive layer 112, achieving electromagnetic shielding of the moving point lead 40, and further achieving electromagnetic shielding of the power module 100.

[0132] Compared with the existing solution of achieving electromagnetic shielding of the power module 100 by setting a shielding frame outside the power module 100, the present application can not only avoid setting a shielding frame, avoid reserving an installation space for the shielding frame, and is beneficial to the miniaturization design of the power module 100; moreover, the structure is simple, the processing cost is low, it is easy to manufacture, the risk of processing failure is low, and the reliability is strong.

[0133] Please refer to Figure 9 、 Figure 10 and Figure 11 and in combination with Figure 1 、 Figure 3 , Figure 9 is Figure 2 the schematic structural diagram of the power module 100 shown in another embodiment. Figure 10 is Figure 9 the schematic structural diagram of the power module 100 cut along the D-D line. Figure 11 is Figure 10 the schematic structural diagram of the power module 100 with the plastic package 90 omitted from another angle.

[0134] As Figure 9 、 Figure 10 and Figure 11 shown, in some other embodiments, the second power distribution layer 123 (as Figure 3 shown) and the second conductive member 14 (as Figure 3The same is omitted for those shown in the figure. By means including but not limited to welding or gluing, the ground lead 70 is laminated on the side of the first conductive layer 112 of the first substrate 11 facing away from the first insulating layer 111 and is electrically connected to the first conductive layer 112. Exemplarily, an eighth connecting member 8 is provided between the ground lead 70 and the first conductive layer 112. The eighth connecting member 8 is made of materials including but not limited to tin-lead or conductive adhesive. The ground lead 70 is laminated on the side of the first conductive layer 112 facing away from the first insulating layer 111 through the eighth connecting member 8 and is electrically connected to the first conductive layer 112. The number of ground leads 70 is multiple. Specifically, the number of ground leads 70 is 7. In the Y-axis direction, the multiple ground leads 70 are arranged in sequence and spaced apart. And in the X-axis direction, the multiple ground leads 70 are located on the side of the second substrate 12 facing away from the moving point lead 40 and are spaced apart from the second substrate 12. The multiple ground leads 70 are all arranged opposite to the moving point lead 40.

[0135] It can be understood that since the ground lead 70 is laminated on the side of the first conductive layer 112 facing away from the first insulating layer 111 and is electrically connected to the first conductive layer 112, the first conductive layer 112 can also be grounded through the ground lead 70. Moreover, through the lamination of the ground lead 70 and the first conductive layer 112, the electrical connection between the ground lead 70 and the first conductive layer 112 is realized, and the design of the ground lead 70 and the first conductive layer 112 having the same potential is realized. It is not only simple and stable in structure, but also low in processing cost, which is beneficial to improving the structural stability of the power module 100.

[0136] The fourth power distribution layer 125 (such as Figure 3 shown) is omitted. The first substrate 11 further includes a third conductive layer 114, and the third conductive layer 114 is laminated on the side of the first insulating layer 111 facing the first conductive layer 112. In the X-axis direction, the third conductive layer 114 is located on the side of the second substrate 12 facing away from the moving point lead 40 and is spaced apart from the second substrate 12. By means including but not limited to welding or gluing, the protection device 33 is laminated on the side of the third conductive layer 114 facing away from the first insulating layer 111 and is electrically connected to the third conductive layer 114. Exemplarily, a ninth connecting member 9 is provided between the protection device 33 and the third conductive layer 114. The ninth connecting member 9 is made of materials including but not limited to tin-lead or conductive adhesive. The protection device 33 is laminated on the side of the third conductive layer 114 facing away from the first insulating layer 111 through the ninth connecting member 9 and is electrically connected to the third conductive layer 114. In the X-axis direction, the protection device 33 is located between the second substrate 12 and the ground lead 70 and is spaced apart from the second substrate 12 and the ground lead 70.

[0137] The mating leads 60 are stacked on the side of the third conductive layer 114 facing away from the first insulating layer 111 by means including but not limited to welding or gluing, and are electrically connected to the third conductive layer 114. For specific details, reference can be made to the relevant description of the protection device 33, which will not be elaborated here. In the X-axis direction, the mating leads 60 are located on the side of the protection device 33 facing away from the second substrate 12 and are spaced from the protection device 33. In the Y-axis direction, the mating leads 60 are located on one side of the plurality of ground leads 70 and are spaced from the plurality of ground leads 70. The number of mating leads 60 is plural. Specifically, the number of mating leads 60 is 3. The plurality of mating leads 60 are arranged in sequence and spaced apart in the Y-axis direction.

[0138] It can be understood that both the protection device 33 and the mating leads 60 are stacked on the side of the third conductive layer 114 facing away from the first insulating layer 111 and are both electrically connected to the third conductive layer 114. The protection device 33 and the mating leads 60 can be arranged on the first substrate 11 or on the second substrate 12. The arrangement requirements for the protection device 33 and the mating leads 60 are low, which is beneficial to reducing the arrangement cost of the protection device 33 and the mating leads 33, and beneficial to reducing the manufacturing cost of the power module 100. The number of connection leads 50 is plural. Specifically, the number of connection leads 50 is 6. The plurality of connection leads 50 are beneficial to improving the power transmission efficiency between the load device 3000 (as Figure 1 shown) and the first power distribution layer 122, and thus beneficial to improving the power transmission efficiency between the load device 3000 and the second power device 32, and beneficial to improving the performance of the power module 100.

[0139] The first groove 95 can also be a special-shaped groove. Specifically, the first groove 95 includes a first groove 951 and a second groove 952. Both the first groove 951 and the second groove 952 are rectangular grooves. The first groove 951 penetrates the plastic package 90 in the Y-axis direction. The first groove 951 extends in the Z-axis direction and has an opening located on the first surface 91. In the X-axis direction, the second groove 952 is located on the side of the first groove 951 facing away from the first substrate 11 and is communicated with the first groove 951. The second groove 952 penetrates the plastic package 90 in the Y-axis direction. The second groove 952 extends in the Z-axis direction and has an opening located on the first surface 91. And the second groove 952 extends in the X-axis direction and has an opening located on the third surface 93. Among them, in the Z-axis direction, the depth of the first groove 951 is greater than the depth of the second groove 952. It can be understood that the shape of the first groove 95 can be various, which is beneficial to reducing the design cost of the first groove 95 and beneficial to reducing the manufacturing cost of the power module 100.

[0140] The second groove 96 can also be a special-shaped groove. Specifically, the second groove 96 includes a third groove 961 and a fourth groove 962. Both the third groove 961 and the fourth groove 962 are rectangular grooves. The third groove 961 penetrates the encapsulant 90 in the Y-axis direction. The third groove 961 extends in the Z-axis direction and has an opening located on the first surface 91. In the X-axis direction, the fourth groove 962 is located on the side of the third groove 961 facing away from the first substrate 11 and communicates with the third groove 961. The fourth groove 962 penetrates the encapsulant 90 in the Y-axis direction. The fourth groove 962 extends in the Z-axis direction and has an opening located on the first surface 91. And the fourth groove 962 extends in the X-axis direction and has an opening located on the fourth surface 94. Among them, in the Z-axis direction, the depth of the third groove 961 is greater than the depth of the fourth groove 962. It can be understood that the shape of the second groove 96 can be various, which is beneficial to reducing the design cost of the second groove 96 and beneficial to reducing the manufacturing cost of the power module 100.

[0141] Please refer to Figure 12 and Figure 13 , Figure 12 is Figure 9 the schematic structural diagram of the power module 100 shown in the sectional view along the D-D line in another embodiment. Figure 13 is Figure 12 the schematic structural diagram of the power module 100 shown in another angle with the encapsulant 90 omitted.

[0142] In some other embodiments, the first substrate 11 further includes a connecting conductive layer 115, and the connecting conductive layer 115 is laminated on the side of the first insulating layer 111 facing the first conductive layer 112. The connecting conductive layer 115 is electrically connected to the first power distribution layer 122. The moving point lead 40 is laminated on the side of the connecting conductive layer 115 facing away from the first insulating layer 111 and is electrically connected to the connecting conductive layer 115. The connecting lead 50 is laminated on the side of the connecting conductive layer 115 facing away from the first insulating layer 111 and is electrically connected to the connecting conductive layer 115.

[0143] Specifically, in the X-axis direction, the connecting conductive layer 115 is located on the side of the first conductive layer 112 facing away from the third conductive layer 114, and is arranged at intervals with the first conductive layer 115. The connecting conductive layer 115 is located on the side of the second substrate 12 facing away from the ground lead 70, and is arranged at intervals with the second substrate 12. A third conductive member 15 is provided between the connecting conductive layer 115 and the first power distribution layer 122. Exemplarily, the third conductive member 15 may be an electrical conductive device including but not limited to a cable or a metal part. By means including but not limited to welding or gluing, one end of the third conductive member 15 is stacked on the side of the first power distribution layer 122 facing away from the second insulating layer 121, and is electrically connected to the first power distribution layer 122; the other end is stacked on the side of the connecting conductive layer 115 facing away from the first insulating layer 111, and is electrically connected to the connecting conductive layer 115. Through the third conductive member 15, the first power distribution layer 122 is electrically connected to the connecting conductive layer 115.

[0144] The moving point lead 40 is stacked on the side of the connecting conductive layer 115 facing away from the first insulating layer 111, is electrically connected to the connecting conductive layer 115, and is located on the side of the connecting conductive layer 115 facing away from the second substrate 12. Since the connecting conductive layer 115 is electrically connected to the first power distribution layer 122, the moving point lead 40 is stacked on the side of the connecting conductive layer 115 facing away from the first insulating layer 111 and is electrically connected to the connecting conductive layer 115; the moving point lead 40 is also electrically connected to the first power distribution layer 122 through the connecting conductive layer 115. In this way, the moving point lead 40 can be arranged on the first substrate 11, and the arrangement manner of the moving point lead 40 is various.

[0145] The connecting lead 50 is stacked on the side of the connecting conductive layer 115 facing away from the first insulating layer 111, is electrically connected to the connecting conductive layer 115, and is located on the side of the connecting conductive layer 115 facing away from the second substrate 12. In the Y-axis direction, the connecting lead 50 is located on the side of the moving point lead 40 facing away from the first power device 31 and is arranged at intervals with the moving point lead 40. Since the connecting conductive layer 115 is electrically connected to the first power distribution layer 122, the connecting lead 50 is stacked on the side of the connecting conductive layer 115 facing away from the first insulating layer 111 and is electrically connected to the connecting conductive layer 115; the connecting lead 50 is also electrically connected to the first power distribution layer 122 through the connecting conductive layer 115. In this way, the connecting lead 50 can be arranged on the first substrate 11, and the arrangement manner of the connecting lead 50 is various.

[0146] Please refer to Figure 14 and in combination with Figure 10 , Figure 14 is Figure 9 the schematic structural diagram of the power module 100 shown in the sectional view along the D-D line in another embodiment.

[0147] In some other embodiments, the first groove 95, the second groove 96, the first mating groove 97 and the second mating groove 98 of the plastic package 90 can all be omitted. In this way, it is beneficial to increase the connection area between the heat dissipation substrate 90a and the first surface 91 of the plastic package 90, beneficial to increase the connection strength between the heat dissipation substrate 90a and the plastic package, and beneficial to improve the structural stability of the power module 100.

[0148] Please refer to Figure 15 , and in combination with Figure 10 , Figure 15 is Figure 9 a schematic structural diagram of the power module 100 shown in another embodiment cut along the D-D line.

[0149] In some other embodiments, the moving pin 43 can also be perpendicularly arranged with respect to the first substrate 11 and extend in a direction away from the first substrate 11. Specifically, the second main body portion 41 of the moving lead 40 includes a fourth section 411 and a fifth section 412. The sixth section 413 of the second main body portion 41 is omitted. The moving pin 43 is located on a side of the fourth section 411 facing away from the fifth section 412 and is fixedly connected to the fourth section 411. And the moving pin 43 is perpendicularly arranged with respect to the fourth section 411. The moving pin 43 extends in a direction away from the fifth section 412. Since the fourth section 411 extends along the X-axis direction, is opposite to and spaced apart from the first substrate 11, the moving pin 43 is perpendicularly arranged with respect to the fourth section 411 and extends in a direction away from the fifth section 412; the moving pin 43 is perpendicularly arranged with respect to the first substrate 11 and extends in a direction away from the first substrate 11. It can be understood that the structure of the moving pin 43 is diverse, the design requirements for the moving pin 43 are low, which is beneficial to reducing the design cost and beneficial to reducing the manufacturing cost of the power module 100.

[0150] The grounding pin 73 can also be perpendicularly arranged with respect to the first substrate 11 and extend in a direction away from the first substrate 11. Specifically, the fifth main body portion 71 of the grounding lead 70 includes a seventh section 711 and an eighth section 712. The ninth section 713 of the fifth main body portion 71 is omitted. The grounding pin 73 is located on a side of the seventh section 711 facing away from the eighth section 712 and is fixedly connected to the seventh section 711. And the grounding pin 73 is perpendicularly arranged with respect to the seventh section 711. The grounding pin 73 extends in a direction away from the eighth section 712. Since the seventh section 711 extends along the X-axis direction, is opposite to and spaced apart from the first substrate 11, the grounding pin 73 is perpendicularly arranged with respect to the seventh section 711 and extends in a direction away from the eighth section 712; the grounding pin 73 is perpendicularly arranged with respect to the first substrate 11 and extends in a direction away from the first substrate 11. It can be understood that the structure of the grounding pin 73 is diverse, the design requirements for the grounding pin 73 are low, which is beneficial to reducing the design cost and beneficial to reducing the manufacturing cost of the power module 100.

Claims

1. A power module, characterized in that, the power module includes a first substrate, a second substrate, a first power device, a second power device, a moving point lead and a ground lead, and the second substrate, the first power device, the second power device, the moving point lead and the ground lead are all arranged on one side of the first substrate; the first substrate includes a first insulating layer, a first conductive layer and a second conductive layer, and the first conductive layer and the second conductive layer are laminated on opposite sides of the first insulating layer; the second substrate includes a second insulating layer and a first power distribution layer, the second insulating layer is arranged on the side of the first conductive layer facing away from the first insulating layer, and the first power distribution layer is laminated on the side of the second insulating layer facing away from the first conductive layer; both the first power device and the second power device are electrically connected to the moving point lead, the first power device and the second power device are alternately turned on and off, the moving point lead and the first power distribution layer are at the same potential, and the ground lead and the first conductive layer are at the same potential.

2. The power module according to claim 1, characterized in that, the projection of the first power distribution layer in the thickness direction of the first substrate is entirely located within the projection of the first conductive layer in the thickness direction of the first substrate.

3. The power module according to claim 1, characterized in that, the second substrate includes a power distribution connection layer, and the power distribution connection layer is laminated between the first conductive layer and the second insulating layer and is electrically connected to the first conductive layer.

4. The power module according to any one of claims 1 to 3, characterized in that, the moving point lead is laminated on the side of the first power distribution layer facing away from the second insulating layer and is electrically connected to the first power distribution layer; alternatively, the first substrate includes a connection conductive layer, the connection conductive layer is laminated on the side of the first insulating layer facing the first conductive layer, the connection conductive layer is electrically connected to the first power distribution layer, and the moving point lead is laminated on the side of the connection conductive layer facing away from the first insulating layer and is electrically connected to the connection conductive layer.

5. The power module according to claim 4, characterized in that, the second substrate includes a second power distribution layer, the second power distribution layer is laminated on the side of the second insulating layer facing the first power distribution layer and is electrically connected to the first conductive layer, and the ground lead is laminated on the side of the second power distribution layer facing away from the second insulating layer and is electrically connected to the second power distribution layer; alternatively, the ground lead is laminated on the side of the first conductive layer facing away from the first insulating layer and is electrically connected to the first conductive layer.

6. The power module according to claim 4, characterized in that, The second substrate includes a third power distribution layer which is laminated on one side of the second insulating layer facing the first power distribution layer and is electrically connected to the first power distribution layer. The first power device is laminated on one side of the third power distribution layer facing away from the second insulating layer and is electrically connected to the third power distribution layer. The second power device is laminated on one side of the first power distribution layer facing away from the second insulating layer and is electrically connected to the first power distribution layer.

7. The power module according to any one of claims 1 to 3, wherein, the power module includes a protection device and a mating lead. The second substrate includes a fourth power distribution layer which is laminated on one side of the second insulating layer facing the first power distribution layer. The protection device and the mating lead are both laminated on one side of the fourth power distribution layer facing away from the second insulating layer and are both electrically connected to the fourth power distribution layer; alternatively, the first substrate includes a third conductive layer which is laminated on one side of the first insulating layer facing the first conductive layer. The protection device and the mating lead are both laminated on one side of the third conductive layer facing away from the first insulating layer and are both electrically connected to the third conductive layer.

8. The power module according to any one of claims 1 to 3, wherein, the ground lead includes a ground pin, the moving point lead includes a moving point pin, and the ground pin and the moving point pin are both spaced apart from the first substrate and the second substrate; the power module includes a plastic package which encapsulates the first substrate, the second substrate, the first power device, the second power device, the ground lead and the moving point lead. The second conductive layer, the ground pin and the moving point pin are all exposed outside the plastic package.

9. The power module according to claim 8, wherein, the plastic package is provided with a first groove which is located on one side of the ground lead facing the second conductive layer. The projection of the first groove in the thickness direction of the first substrate overlaps with the projection of the ground lead in the thickness direction of the first substrate. The first groove is used to increase the creepage distance between the second conductive layer and the ground lead.

10. The power module according to claim 9, wherein, the plastic package is provided with a first mating groove which is located on one side of the ground lead facing away from the second conductive layer. The projection of the first mating groove in the thickness direction of the first substrate overlaps with the projection of the first groove in the thickness direction of the first substrate.

11. The power module according to claim 8, wherein, the plastic package is provided with a second groove which is located on one side of the moving point lead facing the mating conductive layer. The projection of the second groove in the thickness direction of the first substrate overlaps with the projection of the moving point lead in the thickness direction of the first substrate. The second groove is used to increase the creepage distance between the second conductive layer and the moving point lead.

12. The power module according to claim 11, wherein, The plastic package is provided with a second mating groove, which is located on the side of the moving-point lead away from the mating conductive layer, and the projection of the second mating groove along the thickness direction of the first substrate overlaps with the projection of the second groove along the thickness direction of the first substrate.

13. The power module according to claim 8, wherein, the ground pin is stacked with the first substrate; alternatively, the ground pin is perpendicular to the first substrate and extends in a direction away from the first substrate.

14. The power module according to claim 8, wherein, the moving-point pin is stacked with the first substrate; alternatively, the moving-point pin is perpendicular to the first substrate and extends in a direction away from the first substrate.

15. The power module according to claim 8, wherein, the power module includes a heat dissipation substrate, and the heat dissipation substrate is stacked on the side of the second conductive layer away from the first insulating layer.

16. A photovoltaic optimizer, wherein, the photovoltaic optimizer includes a control module and the power module according to any one of claims 1 to 15, and the control module is used to control the first power device and the second power device to be alternately turned on and off.

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