An integrated circuit packaging bracket

By using an integrated circuit packaging bracket with an upper and lower support structure, and by employing electrostatic discharge (ESD) guiding components and pin protection components, the problem of poor protection effect of the packaging bracket under low humidity conditions is solved, and ESD protection is achieved in different environments.

CN120072805BActive Publication Date: 2025-10-28SHENZHEN ZHENGYUXING ELECTRONICS CO LTD
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Patent Information

Application Number
CN202510244408.1
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-03-03
Publication Date
2025-10-28
Estimated Expiration
2045-03-03

AI Technical Summary

Technical Problem

Existing integrated circuit packaging brackets have poor adaptability to external environments in terms of anti-static measures, especially under low humidity conditions where the protective effect decreases, making it difficult to meet the protection requirements under normal conditions.

Method used

The structure consists of an upper bracket and a lower bracket. The upper bracket includes an outer frame and a mounting box. The outer frame and the mounting box are equipped with an electrostatic discharge (ESD) guiding component and a pin protection component. The ESD is guided to the storage capacitor through a contact conductive plate and a guide wire. The outer pin is electrically connected to the inner pin when connection is required. The limiting component controls the contact state to achieve ESD guidance and protection.

Benefits of technology

It effectively prevents electrostatic discharge (ESD) damage to integrated circuits under various environmental conditions, especially maintaining good ESD protection under low humidity conditions. It also prevents direct contact damage through pin protection components, ensuring the safety of integrated circuits.

✦ Generated by Eureka AI based on patent content.

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Abstract

This invention relates to the field of integrated circuit packaging technology, specifically to an integrated circuit packaging bracket. It includes a lower bracket with a plurality of evenly distributed internal pins fixedly connected to its outer edge, and an integrated circuit is disposed inside the lower bracket. This device divides the packaging bracket into an upper bracket and a lower bracket, and further divides the upper bracket into an outer frame and a mounting box. When a user picks up the device, their fingers naturally come into contact with the longer outer frame and the contact conductive plate. At this time, static electricity on the user's fingers flows along the contact conductive plate and the guide wires into the storage capacitor, achieving electrostatic discharge (ESD) protection. This avoids the problem of poor adaptability to external environments in traditional devices when achieving ESD protection. Furthermore, since the contact conductive plate and guide wires are made of copper, their conductivity is minimally affected when the humidity is below 20%, still meeting normal ESD protection requirements.
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Description

Technical Field

[0001] This invention relates to the field of integrated circuit packaging technology, and more specifically, to an integrated circuit packaging bracket. Background Technology

[0002] An integrated circuit is a miniature electronic device that integrates multiple electronic components onto a semiconductor material to form a complete circuit system. An integrated circuit package is a structure used to protect and fix the integrated circuit, and it also serves as a bridge for electrical connection between the integrated circuit and external circuits.

[0003] The electrical components inside integrated circuits are extremely delicate. If a user handles the package with static electricity on their hands and their fingers touch the pins, the static electricity can enter the integrated circuit through the pins, potentially damaging its internal components. Therefore, existing package covers incorporate anti-static measures. Common anti-static measures include connecting the pins on the package to an external grounding system to conduct static electricity, or applying an anti-static coating to the outer surface of the package.

[0004] However, grounding requires specific external storage conditions. Without a proper grounding system, effective protection is difficult to achieve. Applying an antistatic coating, on the other hand, is highly dependent on ambient humidity. If the humidity is below 20%, the resistivity of the antistatic coating surface can increase tenfold or even more, leading to a decrease in protective effectiveness. Therefore, existing packaging brackets, when employing antistatic measures, have poor adaptability to external environments and struggle to meet protection requirements under normal conditions. Summary of the Invention

[0005] The purpose of this invention is to provide an integrated circuit packaging bracket to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, one objective of the present invention is to provide an integrated circuit packaging bracket, including a lower bracket, a plurality of evenly distributed inner pins fixedly connected to the outer edge of the lower bracket, an integrated circuit disposed inside the lower bracket, an adhesive layer coated on the top surface of the lower bracket, an upper bracket disposed on the top surface of the lower bracket, the upper bracket including an outer frame and a mounting box, and the lower bracket being bonded to the mounting box by the adhesive layer.

[0007] The outer perimeter of the outer frame is greater than the outer perimeter of the lower support. The outer frame is used for gripping the human hand. An electrostatic guiding component is provided inside the outer frame and the mounting box. The electrostatic guiding component is used to guide and store the static electricity generated when the human touches the outer frame. When the human hand picks up the outer frame, the fingers come into contact with the outer frame, and the static electricity is guided and stored by the electrostatic guiding component.

[0008] Four pin protection components are provided below the outer frame. The pin protection components are used to protect the inner pins and control the connection status between the inner pins and the external circuit. The inner pins are connected to the external circuit through the pin protection components.

[0009] The electrostatic guiding component is also used to control the displacement of the pin protection component by pressing with a human finger, thereby changing the contact state between the pin protection component and the inner pin.

[0010] As a further improvement to this technical solution, four evenly distributed mounting slots are provided on the outer edge of the outer frame. The electrostatic guiding component includes four contact conductive plates that are slidably connected inside the four mounting slots and a storage capacitor that is fixedly connected inside the mounting box. Each of the four contact conductive plates and the storage capacitor is electrically connected to a guide wire.

[0011] As a further improvement to this technical solution, the contact conductive plate and the guide wire are both made of copper, and four evenly distributed connecting tubes are fixedly connected between the outer frame and the mounting box, with the four guide wires respectively disposed inside the four connecting tubes.

[0012] As a further improvement to this technical solution, the pin protection assembly includes a movable plate, the top of which is fixedly connected with several connecting strips, and the bottom of the outer frame is provided with several sliding grooves. The connecting strips are slidably connected inside the sliding grooves, and the top of the connecting strips is fixedly connected to the bottom of the contact conductive plate. The material of the connecting strips is silicon dioxide.

[0013] As a further improvement to this technical solution, a number of outer pin sleeves are fixedly connected to the bottom of the connecting strip, the inner pins are slidably disposed inside the outer pin sleeves, and there is a gap between the inner pins and the outer pin sleeves. The outer pin sleeves and the inner pin sleeves are made of the same material.

[0014] As a further improvement to this technical solution, a conductive block is fixedly connected to the bottom surface of the inner wall of the outer pin sleeve. When the inner pin is connected to an external circuit, the top of the conductive block is in contact with the bottom of the inner pin, and the outer pin sleeve is electrically connected to the inner pin through the conductive block.

[0015] As a further improvement to this technical solution, limit components are provided at both ends of the movable plate. The limit components include a limit frame fixedly connected to one end of the movable plate and a fixing strip fixedly connected to one side of the lower support. The fixing strip is slidably connected inside the limit frame.

[0016] As a further improvement to this technical solution, the top surface of the inner wall of the limiting frame is provided with two limiting grooves, the top surface of the fixing strip is provided with a second mounting groove, a second spring rod is fixedly connected inside the second mounting groove, a limiting ball is fixedly connected to the top of the second spring rod, and the limiting ball is slidably connected to the limiting groove.

[0017] As a further improvement to this technical solution, a number of evenly distributed spring rods are fixedly connected between the contact conductive plate and the first mounting groove, and the inner diameter of the connecting tube is larger than the diameter of the guide wire.

[0018] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0019] In this integrated circuit packaging bracket, the packaging bracket is divided into an upper bracket and a lower bracket. The upper bracket is further divided into an outer frame and a mounting box. When the user picks up the device, their fingers will naturally touch the outer frame with a longer circumference and then the contact conductive plate. At this time, the static electricity on the user's fingers will enter the storage capacitor along the contact conductive plate and the guide wire, thus achieving the effect of electrostatic protection. This avoids the problem of poor adaptability to the external environment when traditional devices achieve electrostatic protection. Furthermore, since the contact conductive plate and the guide wire are made of copper, their conductivity is less affected when the humidity is below 20%, and they can still meet the normal electrostatic protection requirements.

[0020] Furthermore, to prevent users' fingers from directly contacting the inner pins, a pin protection component is installed under the outer frame. The outer pin sleeve protects the inner pins, preventing them from being directly subjected to stress. At the same time, when the device is not connected to an external circuit, the outer pin sleeve and the inner pins are in an open circuit state. Even if there is static electricity on the user's fingers, it cannot enter the inner pins through the outer pin sleeve, thus more effectively protecting the inner pins and integrated circuits.

[0021] Meanwhile, in order to guide users to actively contact the conductive plate with their fingers, a limiting component is set to maintain the open circuit between the outer pin sleeve and the inner pin when the device is not in use. If the user needs to connect the outer pin sleeve and the inner pin, they must press the conductive plate with their finger. This will guide the static electricity of the user's finger into the storage capacitor. After the limiting ball enters the next limiting groove, the outer pin sleeve and the inner pin are connected through the conductive block. Then the user can connect the outer pin sleeve to the external circuit, thereby energizing the device. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0023] Figure 2 This is a three-dimensional structural diagram of the lower support and upper support after disassembly in this invention;

[0024] Figure 3 This is a schematic diagram of the internal structure of the upper support in this invention;

[0025] Figure 4 This is a partial structural diagram of the upper support in this invention;

[0026] Figure 5 This is a side sectional view of a portion of the structure in this invention;

[0027] Figure 6 This is a cross-sectional view of the outer pin sleeve and inner pin before and after connection in this invention;

[0028] Figure 7 This is a side cross-sectional view of the limiting frame and fixing strip in the limiting component of the present invention.

[0029] The meaning of each number in the figure is:

[0030] 1. Lower bracket; 11. Inner pins; 12. Adhesive coating;

[0031] 2. Upper bracket; 21. Outer frame; 211. Mounting slot 1; 212. Slide groove; 22. Mounting box;

[0032] 23. Electrostatic guiding component; 231. Contact conductive plate; 232. Guide wire; 233. Storage capacitor;

[0033] 24. Connecting pipe; 25. Spring rod No. 1;

[0034] 3. Pin protection assembly; 31. Movable board; 32. Connecting strip; 33. Outer pin sleeve; 34. Conductive block;

[0035] 4. Limiting component; 41. Limiting frame; 42. Fixing strip; 421. Second mounting slot; 43. Limiting slot; 44. Second spring rod; 45. Limiting ball. Detailed Implementation

[0036] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0037] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0038] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0039] Example 1

[0040] Please see Figure 1 - Figure 3 As shown, the purpose of this embodiment is to provide an integrated circuit packaging bracket, including a lower bracket 1, a plurality of evenly distributed inner pins 11 fixedly connected to the outer edge of the lower bracket 1, an integrated circuit being disposed inside the lower bracket 1, an adhesive layer 12 being coated on the top surface of the lower bracket 1, an upper bracket 2 being disposed on the top surface of the lower bracket 1, the upper bracket 2 including an outer frame 21 and a mounting box 22, and the lower bracket 1 being bonded to the mounting box 22 through the adhesive layer 12.

[0041] The outer perimeter of the outer frame 21 is greater than the outer perimeter of the lower support 1. The outer frame 21 is used for gripping the human hand. The outer frame 21 and the mounting box 22 are equipped with an electrostatic guiding component 23. The electrostatic guiding component 23 is used to guide and store the static electricity generated when the human touches the outer frame 21. When the human hand picks up the outer frame 21, the fingers come into contact with the outer frame 21, and the static electricity is guided and stored by the electrostatic guiding component 23.

[0042] Four pin protection components 3 are provided below the outer frame 21. The pin protection components 3 are used to protect the inner pin 11 and control the connection status between the inner pin 11 and the external circuit. The inner pin 11 is connected to the external circuit through the pin protection components 3.

[0043] The electrostatic guiding component 23 is also used to control the displacement of the pin protection component 3 by pressing with a human finger, so as to change the contact state between the pin protection component 3 and the inner pin 11.

[0044] The inner pin 11 is electrically connected to the integrated circuit inside the lower bracket 1. The inner pin 11 is used to electrically connect the integrated circuit to the external circuit. When the device is placed, the outer frame 21 is located above the lower bracket 1. Since the outer perimeter of the outer frame 21 is greater than the outer perimeter of the lower bracket 1, when the user picks up the device, he will usually touch the outer frame 21, which has a larger outer perimeter and is easier to pick up. Naturally, the user's fingers will come into contact with the electrostatic discharge guide component 23. If the user's fingers are carrying static electricity, the static electricity will be guided and released by the electrostatic discharge guide component 23 to achieve the effect of electrostatic protection.

[0045] Meanwhile, the pin protection component 3 can effectively prevent the user's finger from directly contacting the inner pin 11, and when the device is not connected to an external circuit, the pin protection component 3 and the inner pin 11 are in an open circuit state, so the static electricity on the user's finger cannot enter the inner pin 11 through the pin protection component 3.

[0046] If it is necessary to connect the inner pin 11 to the external circuit, the user must touch the electrostatic discharge guiding component 23 with their finger and control the pin protection component 3 to connect with the inner pin 11 through the electrostatic discharge guiding component 23. Then, the inner pin 11 is connected to the external circuit through the pin protection component 3. During this process, the static electricity on the user's hand will still be guided and released through the electrostatic discharge guiding component 23, which effectively ensures that the electrostatic protection effect of the device can be achieved normally.

[0047] For further details, please refer to Figure 1 - Figure 5 The outer frame 21 has four evenly distributed mounting slots 211. The electrostatic guiding component 23 includes four contact conductive plates 231 that are slidably connected inside the four mounting slots 211 and a storage capacitor 233 that is fixedly connected inside the mounting box 22. The four contact conductive plates 231 and the storage capacitor 233 are electrically connected by guide wires 232.

[0048] The contact conductive plate 231 and the guide wire 232 are both made of copper. Four evenly distributed connecting tubes 24 are fixedly connected between the outer frame 21 and the mounting box 22. The four guide wires 232 are respectively set inside the four connecting tubes 24.

[0049] The contact conductive plate 231 is located on the outer edge of the outer frame 21 and occupies most of the area of ​​the outer edge of the outer frame 21. It can effectively ensure that the user's fingers can contact the contact conductive plate 231 when picking up the outer frame 21. If the user's fingers are static, the static will enter the guide line 232 along the contact conductive plate 231 and enter the storage capacitor 233 from the guide line 232. This effectively prevents static from entering the inner pin 11 and damaging the integrated circuit. The contact conductive plate 231 and the guide line 232 are made of copper because this material has good conductivity and static will more easily enter the circuit with low resistance.

[0050] The basic structure of the storage capacitor 233 consists of two conductors with an insulating medium sandwiched between them. When static electricity passes through the circuit formed by the contact conductive plate 231, the guide wire 232, and the storage capacitor 233, the storage capacitor 233 can provide a low-impedance path, allowing the static charge to be quickly guided into the capacitor for storage. This effectively prevents static electricity from entering the integrated circuit and damaging its internal components. At the same time, the mounting box 22 can be designed to be openable, so that the user can periodically remove and replace the storage capacitor 233 to transfer the accumulated static electricity in the storage capacitor 233, enabling the static electricity guiding component 23 to achieve a continuous protective effect.

[0051] For details, please refer to Figure 2 , Figure 3 , Figure 4 and Figure 5 The pin protection component 3 includes a movable plate 31, with several connecting strips 32 fixedly connected to the top of the movable plate 31. Several sliding grooves 212 are provided at the bottom of the outer frame 21. The connecting strips 32 slide through and are slidably connected inside the sliding grooves 212. The top of the connecting strips 32 is fixedly connected to the bottom of the contact conductive plate 231. The material of the connecting strips 32 is silicon dioxide.

[0052] The connecting strip 32 is made of silicon dioxide, which is an insulating material. This keeps the outer pin sleeve 33 and the contact conductive plate 231 in an open circuit state, preventing the formation of a new circuit between the outer pin sleeve 33 and the contact conductive plate 231 and thus affecting the normal use of the integrated circuit in the device after power is applied.

[0053] For further details, please refer to Figure 3 , Figure 4 and Figure 5 The bottom of the connecting strip 32 is fixedly connected with several outer pin sleeves 33, and the inner pin 11 is slidably disposed inside the outer pin sleeve 33, and there is a gap between the inner pin 11 and the outer pin sleeve 33. The outer pin sleeve 33 and the inner pin 11 are made of the same material.

[0054] A conductive block 34 is fixedly connected to the bottom surface of the inner wall of the outer pin sleeve 33. When the inner pin 11 is connected to the external circuit, the top of the conductive block 34 is in contact with the bottom of the inner pin 11, and the outer pin sleeve 33 is electrically connected to the inner pin 11 through the conductive block 34.

[0055] When the inner pin 11 is not connected to the external circuit, the inner pin 11 and the outer pin sleeve 33 are in an unconnected state, that is, there is no direct contact between them. Therefore, the outer pin sleeve 33 cannot conduct charge to the inner pin 11 at this time. The outer pin sleeve 33 also plays a protective role for the inner pin 11, which can effectively prevent the inner pin 11 from being directly subjected to external stress and bending. When the inner pin 11 is connected to the external circuit, under the control of the electrostatic guiding component 23, the outer pin sleeve 33 gradually approaches the inner pin 11 until the conductive block 34 is connected to the inner pin 11. During installation, the outer pin sleeve 33 also acts as a pin. It can be installed in the circuit and can introduce current into the integrated circuit through the conductive block 34 and the inner pin 11 to achieve the power-on effect.

[0056] In addition, please see Figure 5 and Figure 7 Both ends of the movable plate 31 are provided with limit components 4. The limit components 4 include a limit frame 41 fixedly connected to one end of the movable plate 31 and a fixing strip 42 fixedly connected to one side of the lower support 1. The fixing strip 42 is slidably connected inside the limit frame 41.

[0057] For more information, please refer to [link / reference]. Figure 6 , Figure 6 The diagram illustrates the change in the connection state between the outer pin sleeve 33 and the inner pin 11. When the outer pin sleeve 33 is not connected to the inner pin 11, there is a gap between the conductive block 34 and the inner pin. After connection, the conductive block 34 and the inner pin 11 are in close contact, thus forming a complete circuit with the outer pin sleeve 33 and the integrated circuit.

[0058] The inner wall of the limiting frame 41 has two limiting grooves 43. The top surface of the fixing strip 42 has a second mounting groove 421. The second mounting groove 421 is fixedly connected to the inside of the second mounting groove 421. The top of the second spring rod 44 is fixedly connected to a limiting ball 45. The limiting ball 45 is slidably connected to the limiting groove 43.

[0059] A number of evenly distributed first spring rods 25 are fixedly connected between the contact conductive plate 231 and the first mounting groove 211, and the inner diameter of the connecting tube 24 is larger than the diameter of the guide wire 232.

[0060] The limiting component 4 is used to control the activity state of the electrostatic guiding component 23. When the user needs the outer pin sleeve 33 to connect with the inner pin 11, the user can press the contact conductive plate 231 with their finger, so that the contact conductive plate 231 drives the moving plate 31 to move towards the inner pin 11 through the connecting strip 32. During this process, the pushing force of the user's finger needs to overcome the combined elastic force of the first spring rod 25 and the second spring rod 44. At this time, the contact conductive plate 231 gradually enters the first mounting groove 211, while the limiting ball 45 is squeezed by the limiting groove 43, causing the second spring rod 44 to retract, until the limiting frame 41 can slide along the fixing strip 42. After that, when the limiting ball 45 enters the next limiting groove 43, the limiting ball 45 is no longer squeezed by the limiting frame 41, and thus abuts against the limiting groove 43. At this time, the user can stop applying pushing force to the contact conductive plate 231, and at this time the conductive block 34 is connected to the inner pin 11.

[0061] In summary, the working principle of this device is as follows: When the device is not in use, the lower support 1 faces downward and the outer frame 21 faces upward. When the user needs to pick up the device, their fingers will naturally touch the outer frame 21. When the user needs to use the device, they need to press the four contact conductive plates 231 with their fingers, thereby connecting the outer pin sleeve 33 with the inner pin 11. When the contact conductive plate 231 is pressed by the user's fingers, if there is static electricity on the user's fingers at this time, the static charge will enter the guide line 232 from the contact conductive plate 231 and enter the storage capacitor 233 through the guide line 232. The storage capacitor 233 can absorb static electricity, thereby realizing the guidance and release of static electricity on the user's fingers.

[0062] As the user's finger presses the conductive contact plate 231, when the pressure exceeds the combined force of the first spring rod 25 and the second spring rod 44, the conductive contact plate 231 moves towards the interior of the first mounting groove 211. Through the connecting strip 32, the moving plate 31 moves along with the conductive contact plate 231. Simultaneously, the limiting frame 41 slides along the fixing strip 42. During this process, the limiting ball 45 is squeezed by the limiting groove 43 and slides into the second mounting groove 421, squeezing the second spring rod 44. After sliding a certain distance, the limiting ball 45 enters the next limiting groove 43. At this time, the limiting ball 45 is no longer squeezed by the inner wall of the limiting frame 41, and the elastic force stored in the second spring rod 44 is released, thereby pushing the limiting ball 45 into the next limiting groove 43 to fix the position of the moving plate 31. At this time, the conductive block 34 on the bottom surface of the inner wall of the outer pin sleeve 33 is connected to the inner pin 11, and the external current can enter the inner pin 11 and the integrated circuit through the outer pin sleeve 33 and the conductive block 34 to achieve the power supply effect.

[0063] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. An integrated circuit packaging bracket, comprising a lower bracket (1), wherein a plurality of uniformly distributed inner pins (11) are fixedly connected to the outer edge of the lower bracket (1), and an integrated circuit is disposed inside the lower bracket (1), characterized in that: The top surface of the lower bracket (1) is coated with an adhesive layer (12), and an upper bracket (2) is provided on the top surface of the lower bracket (1). The upper bracket (2) includes an outer frame (21) and a mounting box (22). The lower bracket (1) is bonded to the mounting box (22) through the adhesive layer (12). The outer perimeter of the outer frame (21) is greater than the outer perimeter of the lower support (1). The outer frame (21) and the mounting box (22) are provided with an electrostatic guiding component (23). The electrostatic guiding component (23) is used to guide and store the static electricity generated when the human body touches the outer frame (21). When the human body picks up the outer frame (21), the fingers come into contact with the outer frame (21), and the static electricity is guided and stored by the electrostatic guiding component (23). Four pin protection components (3) are provided below the outer frame (21). The pin protection components (3) are used to protect the inner pin (11) and control the connection status of the inner pin (11) with the external circuit. The inner pin (11) is connected to the external circuit through the pin protection components (3). The electrostatic guiding component (23) is also used to control the displacement of the pin protection component (3) by pressing with a human finger, so that the pin protection component (3) and the inner pin (11) are in contact. The outer frame (21) has four evenly distributed mounting slots (211) along its outer edge. The electrostatic guiding component (23) includes four contact conductive plates (231) that are slidably connected inside the four mounting slots (211) and a storage capacitor (233) that is fixedly connected inside the mounting box (22). The four contact conductive plates (231) and the storage capacitor (233) are electrically connected by guide wires (232). The pin protection assembly (3) includes a movable plate (31), the top of which is fixedly connected with several connecting strips (32), and the bottom of the outer frame (21) is provided with several sliding grooves (212). The connecting strips (32) slide through and are slidably connected inside the sliding grooves (212). The top of the connecting strips (32) is fixedly connected to the bottom of the contact conductive plate (231). The material of the connecting strips (32) is silicon dioxide. The bottom of the connecting strip (32) is fixedly connected with a number of outer pin sleeves (33), the inner pin (11) is slidably disposed inside the outer pin sleeve (33), and there is a gap between the inner pin (11) and the outer pin sleeve (33). The outer pin sleeve (33) and the inner pin (11) are made of the same material. A conductive block (34) is fixedly connected to the bottom surface of the inner wall of the outer pin sleeve (33). When the inner pin (11) is connected to the external circuit, the top of the conductive block (34) is in contact with the bottom of the inner pin (11), and the outer pin sleeve (33) is electrically connected to the inner pin (11) through the conductive block (34). Both ends of the movable plate (31) are provided with limit components (4). The limit components (4) include a limit frame (41) fixedly connected to one end of the movable plate (31) and a fixing strip (42) fixedly connected to one side of the lower support (1). The fixing strip (42) is slidably connected inside the limit frame (41). The inner wall of the limiting frame (41) has two limiting grooves (43) on its top surface. The top surface of the fixing strip (42) has a second mounting groove (421). A second spring rod (44) is fixedly connected inside the second mounting groove (421). A limiting ball (45) is fixedly connected to the top of the second spring rod (44). The limiting ball (45) is slidably connected to the limiting groove (43).

2. The integrated circuit packaging bracket according to claim 1, characterized in that: The contact conductive plate (231) and the guide wire (232) are both made of copper. Four evenly distributed connecting tubes (24) are fixedly connected between the outer frame (21) and the mounting box (22). The four guide wires (232) are respectively set inside the four connecting tubes (24).

3. An integrated circuit packaging bracket according to claim 2, characterized in that: A number of evenly distributed first spring rods (25) are fixedly connected between the contact conductive plate (231) and the first mounting groove (211), and the inner diameter of the connecting tube (24) is larger than the diameter of the guide wire (232).

Citation Information

Patent Citations

  • Integrated circuit packaging block with resistance to instantaneous electric overload

    CN201796883U

  • Surface mount package with integral electro-static charge dissipating ring using lead frame as ESD device

    US20040195664A1