Connector, circuit board assembly, circuit board assembly preparation method and computing device

Abstract

The embodiment of the invention belongs to the technical field of computing equipment, and provides a connector, a circuit board assembly, a circuit board assembly preparation method and computing equipment. The circuit board assembly comprises a circuit board and a connector, the circuit board comprises a plurality of grounding holes and a plurality of signal holes, welding flux is arranged in the grounding holes, the connector comprises a plurality of grounding pins and a plurality of signal pins, the grounding pins and the grounding holes are arranged in a one-to-one correspondence mode, and the signal pins and the signal holes are arranged in a one-to-one correspondence mode; the plurality of signal pins are respectively crimped in the plurality of signal holes, and the grounding pins are welded with the grounding holes through solder. According to the circuit board assembly provided by the embodiment of the invention, on the premise that the signal transmission integrity is not influenced, the retention force between the circuit board in the circuit board assembly and the connector can be improved, so that the reliability of connection between the circuit board and the connector is relatively high.

Description

Technical Field

[0001] This application relates to the technical field of computing devices, and in particular, to a connector, a circuit board assembly, a method for preparing a circuit board assembly, and a computing device. Background Art

[0002] As the high-speed signal rate is getting higher and higher, the requirements for parameters affecting signal integrity, such as impedance consistency, return loss, insertion loss, and crosstalk, when the circuit board assembly transmits high-speed signals are also getting higher and higher. Therefore, crimp connectors are increasingly used in circuit board assemblies.

[0003] However, due to the fact that the diameters of the crimp pins and the crimp holes are getting smaller and smaller, the lengths of the crimp pins are getting smaller and smaller, and the holding force between the crimp pins of the crimp connector and the circuit board is getting smaller and smaller. The small holding force between the crimp pins of the crimp connector and the circuit board makes the connection between the crimp connector and the circuit board unreliable. Summary of the Invention

[0004] Embodiments of this application provide a connector, a circuit board assembly, a method for preparing a circuit board assembly, and a computing device, which can improve the holding force between the circuit board and the connector on the premise that the signal transmission integrity is not affected, so that the connection between the circuit board and the connector is relatively reliable.

[0005] In a first aspect of the embodiments of this application, a circuit board assembly is provided, including a circuit board and a connector. The circuit board includes a plurality of ground holes and a plurality of signal holes, and solder is disposed in the ground holes. The connector includes a plurality of ground pins and a plurality of signal pins. The plurality of ground pins are arranged in one-to-one correspondence with the plurality of ground holes, and the plurality of signal pins are arranged in one-to-one correspondence with the plurality of signal holes. The plurality of signal pins are respectively crimped in the plurality of signal holes, and the ground pins are welded to the ground holes through the solder.

[0006] For the circuit board assembly provided by the embodiments of this application, by providing a circuit board and a connector, the connector includes a plurality of ground pins and a plurality of signal pins, the circuit board includes a plurality of ground holes and a plurality of signal holes, the ground holes are arranged in one-to-one correspondence with the ground pins, and the signal holes are arranged in one-to-one correspondence with the signal pins. The signal pins are respectively crimped in the signal holes. By crimping the signal pins and the signal holes, the impedance consistency between the respective signal pins is relatively high, and crimping can reduce the return loss and insertion loss between the connector and the circuit board, so that the signal integrity when the connector and the circuit board transmit signals is relatively high. There is solder in the ground holes, and the ground pins are welded to the ground holes through the solder. By welding the ground pins and the ground holes, a reliable connection can be generated between the interfaces of the ground pins and the ground holes to improve the holding force between the circuit board and the connector. Thus, the holding force between the circuit board and the connector in the circuit board assembly can be improved without affecting the signal integrity between the connector and the circuit board, so that the connection between the circuit board and the connector is relatively reliable.

[0007] In a possible implementation manner, for the circuit board assembly provided in the embodiments of the present application, a first copper layer is provided in the grounding hole, and the size of the first copper layer along the extending direction of the grounding hole is equal to the depth of the grounding hole; the length of the grounding pin is greater than or equal to the depth of the grounding hole, and the grounding pin is welded to the first copper layer through solder. The length of the grounding pin can be greater than or equal to the depth of the grounding hole, and both ends of the grounding pin along the thickness direction can extend out of the grounding hole, so as to facilitate welding the grounding pin and the grounding hole.

[0008] In a possible implementation manner, for the circuit board assembly provided in the embodiments of the present application, a second copper layer is provided in the signal hole, and the size of the second copper layer along the extending direction of the signal hole is less than the depth of the signal hole; the signal pin abuts against the second copper layer. By making the depth of the second copper layer less than the depth of the signal hole, signal reflection can be reduced and signal integrity can be improved.

[0009] In a possible implementation manner, for the circuit board assembly provided in the embodiments of the present application, the depth of the signal hole is greater than the size of the signal pin along the extending direction of the signal hole. That is to say, when the signal pin is crimped with the signal hole, the signal pin will not extend out of the signal hole. Thus, it is possible to prevent the solder from flowing through the signal pin into the signal hole during welding, so that the signal pin and the grounding pin are short-circuited.

[0010] In a possible implementation manner, for the circuit board assembly provided in the embodiments of the present application, the size of the second copper layer along the extending direction of the signal hole is less than or equal to 1.1 mm. Since connecting the grounding pin and the grounding hole by welding can improve the reliability of the connection between the connector and the circuit board, the holding force between the signal pin and the signal hole does not need to be large. Therefore, the depth of the second copper layer can be set to be small to further reduce signal reflection.

[0011] In a possible implementation manner, for the circuit board assembly provided in the embodiments of the present application, the radius of the grounding hole is greater than or equal to the radius of the signal hole. Setting the radius of the grounding hole to be greater than or equal to the radius of the signal hole can increase the holding force between the connector and the circuit board while increasing signal integrity.

[0012] In a possible implementation manner, for the circuit board assembly provided in the embodiments of the present application, the radius of the signal hole is 0.1 mm - 0.3 mm. When the radius of the signal hole is too small, the radius of the signal pin corresponding to the signal hole is also too small, and the strength of the signal pin is small, and the signal pin is prone to the phenomenon of reverse pin during the process of being inserted into the signal hole. When the radius of the signal hole is too large, the insertion loss and return loss during the connection between the signal pin and the signal hole are large, which is not conducive to improving signal integrity.

[0013] In a possible implementation, for the circuit board assembly provided by the embodiments of the present application, two adjacent signal holes form a signal hole pair, and one ground hole or two ground holes are provided between two adjacent signal hole pairs. When one ground hole is provided between two adjacent signal hole pairs and the two signal hole pairs share one ground hole, the number of vias on the circuit board can be reduced, and at the same time, the volume of the corresponding connector can also be reduced; or when two ground holes are provided between two adjacent signal hole pairs and each signal hole pair has its own ground hole, the anti-interference ability between the signal hole pairs can be increased.

[0014] A second aspect of the embodiments of the present application provides a method for manufacturing a circuit board assembly, including forming ground pins and signal pins on a connector; forming ground holes and signal holes on a circuit board; pressing the signal pins into the signal holes and soldering the ground pins to the ground holes.

[0015] In a possible implementation, for the method for manufacturing a circuit board assembly provided by the embodiments of the present application, soldering the ground pins to the ground holes includes: soldering the ground pins to the ground holes using reflow soldering or laser soldering.

[0016] In a possible implementation, for the method for manufacturing a circuit board assembly provided by the embodiments of the present application, before pressing the signal pins into the signal holes, it includes: printing solder on the ground holes.

[0017] In a possible implementation, for the method for manufacturing a circuit board assembly provided by the embodiments of the present application, soldering the ground pins to the ground holes includes: soldering the ground pins to the ground holes using wave soldering.

[0018] A third aspect of the embodiments of the present application provides a computing device, including the circuit board assembly of any one of the above embodiments, and the connector of the circuit board assembly is used for electrically connecting to another circuit board.

[0019] In a possible implementation, the computing device provided by the embodiments of the present application includes at least two of the above circuit board assemblies, and the connector in one circuit board assembly is electrically connected to the connector in another circuit board assembly.

[0020] In a possible implementation, the computing device provided by the embodiments of the present application includes a backplane assembly and a plurality of first circuit board assemblies. The backplane assembly includes a backplane and a plurality of backplane connectors, and each first circuit board assembly includes a first circuit board and a first connector; the first connectors in each first circuit board assembly are respectively electrically connected to the backplane connectors in the backplane assembly.

[0021] In a possible implementation, the computing device provided by the embodiments of the present application includes a second circuit board assembly and a third circuit board assembly. The second circuit board assembly includes a second circuit board and a second connector, and the third circuit board assembly includes a third circuit board and a third connector; the second connector is electrically connected to the third connector.

[0022] A fourth aspect of the embodiments of the present application provides a connector, including a connector body, a ground pin, and a signal pin. The connector body has a first surface facing the circuit board. Both the ground pin and the signal pin are provided on the connector body. The length of the ground pin is greater than the length of the signal pin, and the length of the ground pin protruding from the first surface is greater than the length of the signal pin protruding from the first surface, so that the signal pin can be crimped in the signal hole of the circuit board, and the ground pin can be soldered in the ground hole of the circuit board.

[0023] In conjunction with the accompanying drawings, according to the embodiments described below, these and other aspects, implementation forms, and advantages of the exemplary embodiments will become apparent. It should be understood that the description and the drawings are only for illustration and do not constitute a definition of the limitations of the present application. Please refer to the appended claims for details. Other aspects and advantages of the present application will be described below, and some will be apparent from the description, or will be learned through the practice of the present application. In addition, the aspects and advantages of the present application can be achieved and obtained through the means and combinations specifically pointed out in the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 is a schematic structural diagram of the connector provided by the embodiments of the present application;

[0025] Figure 2 is a schematic structural diagram of the circuit board assembly provided by the embodiments of the present application;

[0026] Figure 3 is an exploded schematic diagram of the circuit board assembly provided by the embodiments of the present application;

[0027] Figure 4 is Figure 2 an enlarged view of part A in

[0028] Figure 5 is Figure 2 an enlarged view of part B in

[0029] Figure 6 is a top view of the circuit board in the circuit board assembly provided by the embodiments of the present application Figure 1 ;

[0030] Figure 7 is a top view of the circuit board in the circuit board assembly provided by the embodiments of the present application Figure 2 ;

[0031] Figure 8 Top view of the circuit board in the circuit board assembly provided by the embodiment of the present application Figure 3 ;

[0032] Figure 9 Flow chart of the method for manufacturing the circuit board assembly provided by the embodiment of the present application;

[0033] Figure 10 Structural schematic of the computing device provided by the embodiment of the present application Figure 1 ;

[0034] Figure 11 Structural schematic of the computing device provided by the embodiment of the present application Figure 2 。

[0035] Description of reference numerals:

[0036] 10, computing device;

[0037] 100, circuit board assembly; 100a, backplane assembly; 100b, first circuit board assembly; 100c, second circuit board assembly; 100d, third circuit board assembly;

[0038] 110, circuit board; 110a, backplane; 110b, first circuit board; 110c, second circuit board; 110d, third circuit board;

[0039] 111, ground hole; 1111, solder; 1112, first copper layer; 1113, first pad; 1113a, first solder joint; 1114, second pad; 1114a, second solder joint;

[0040] 112, signal hole; 1121, second copper layer;

[0041] 113, top surface;

[0042] 114, bottom surface;

[0043] 115, signal hole pair;

[0044] 120, connector; 120a, backplane connector; 120b, first connector; 120c, second connector; 120d, third connector;

[0045] 121, ground pin;

[0046] 122, signal pin; 1221, support arm; 1222, fish-eye hole;

[0047] 123, connector body;

[0048] D1, ground hole depth;

[0049] D2, first copper layer depth;

[0050] D3. Ground pin length;

[0051] D4. Signal hole depth;

[0052] D5. Depth of the second copper layer;

[0053] D6. Support arm length;

[0054] L1. First spacing;

[0055] L2. Second spacing;

[0056] R1. Ground hole radius;

[0057] R2. Signal hole radius;

[0058] F1. Pressure;

[0059] F2. Resilient force;

[0060] Z. Thickness direction. Detailed implementation manners

[0061] The terms used in the implementation manners part of this application are only for explaining the specific embodiments of this application, rather than aiming to limit this application. The implementation manners of the embodiments of this application will be described in detail below with reference to the drawings.

[0062] As the high-speed signal rate is getting higher and higher, the requirements for parameters affecting signal integrity such as impedance consistency, return loss, insertion loss, and crosstalk when the circuit board assembly transmits high-speed signals are also getting higher and higher. Therefore, press-fit connectors are increasingly used in circuit board assemblies.

[0063] A circuit board assembly generally includes a circuit board and a press-fit connector. The press-fit connector includes a plurality of press-fit pins, and the circuit board includes a plurality of press-fit holes. The press-fit pins are press-fitted into the press-fit holes one by one, so that while electrically connecting the connector and the circuit board, the connector is fixed to the circuit board (mechanically connected).

[0064] Specifically, the press-fit pins may include ground pins or signal pins. The press-fit pins are in interference fit with the press-fit holes, that is to say, there is friction between the press-fit pins and the press-fit holes, and this friction can hold the press-fit pins in the press-fit holes. Thus, the connector is fixed to the circuit board. Press-fitting can avoid problems such as soldering defects and void soldering during the soldering process. Therefore, through press-fitting, the impedance consistency between the press-fit pins is relatively high, and press-fitting can reduce the return loss and insertion loss between the connector and the circuit board. In addition, the pin diameter of the press-fit pins is small, and the radius of the press-fit holes is also small, so that the crosstalk when adjacent press-fit pins transmit signals is small.

[0065] However, with the increasing requirements for signal integrity, the diameters of the press-fit pins and press-fit holes are getting smaller, and the lengths of the press-fit pins are getting shorter. As a result, the contact area between the press-fit pins and the press-fit holes is getting smaller, and the frictional force between the press-fit pins and the inner walls of the press-fit holes is also getting smaller. Thus, the retention force between the press-fit pins of the press-fit connector and the circuit board is getting smaller. The small retention force between the press-fit pins of the press-fit connector and the circuit board makes the connection between the press-fit connector and the circuit board unreliable.

[0066] Based on this, the embodiments of the present application provide a connector, a circuit board assembly, a method for preparing a circuit board assembly, and a computing device, which can improve the retention force between the circuit board and the connector on the premise of not affecting the signal transmission integrity, so that the connection between the circuit board and the connector is more reliable.

[0067] Figure 1 Schematic diagram of the structure of the connector provided by the embodiment of the present application; Figure 2 Schematic diagram of the structure of the circuit board assembly provided by the embodiment of the present application; Figure 3 Exploded view of the circuit board assembly provided by the embodiment of the present application, Figure 4 is Figure 2 Enlarged view of part A in Figure 5 is Figure 2 Enlarged view of part B in

[0068] Referring to Figures 1 to 5 As shown, the circuit board assembly 100 includes a circuit board 110 and a connector 120. The connector 120 includes a plurality of ground pins 121 and a plurality of signal pins 122. The circuit board 110 includes a plurality of ground holes 111 and a plurality of signal holes 112. The ground holes 111 are arranged in one-to-one correspondence with the ground pins 121, and the signal holes 112 are arranged in one-to-one correspondence with the signal pins 122; the signal pins 122 are press-fitted into the signal holes 112 one by one, and there is solder 1111 in the ground holes 111, and the ground pins 121 are soldered to the ground holes 111 through the solder 1111. The connector 120 can be a high-speed press-fit connector.

[0069] Specifically, the connector 120 further includes a connector body 123, and the connector body 123 has a first surface facing the circuit board. The ground pins 121 and the signal pins 122 are both arranged on the connector body 123. The ground pins 121 and the signal pins 122 are both connected to the connector body 123. The length of the ground pins 121 is greater than the length of the signal pins 122. The length of the ground pins 121 protruding from the first surface is greater than the length of the signal pins 122 protruding from the first surface, so that the signal pins 122 can be press-fitted into the signal holes 112 of the circuit board 110, and the ground pins 121 can be soldered to the ground holes 111 of the circuit board 110.

[0070] The signal pin 122 is used for electrically connecting with the signal hole 112 of the circuit board 110 to transmit signals between the circuit board 110 and the connector 120. The ground pin 121 is used for electrically connecting with the ground hole 111 of the circuit board 110 to ground the connector 120 and the circuit board 110, thereby reducing the interference to the signals transmitted by other signal pins 122 and signal holes 112 when signals are transmitted between the signal pin 122 and the signal hole 112.

[0071] The arrangement of the ground hole 111 and the signal hole 112 on the circuit board 110 is set according to the signals transmitted between the connector 120 and the circuit board 110.

[0072] Figure 6 The top view of the circuit board in the circuit board assembly provided by the embodiment of the present application Figure 1 。

[0073] See Figure 6 As shown, the ground hole 111 and the signal hole 112 are arranged at intervals on the circuit board 110. That is to say, there is a ground hole 111 between two adjacent signal holes 112. Thus, the interference between adjacent signal holes 112 can be reduced. The ground pins 121 on the connector 120 and the ground holes 111 on the circuit board 110 are arranged in one-to-one correspondence, and the signal pins 122 on the connector 120 and the signal holes 112 on the circuit board 110 are arranged in one-to-one correspondence.

[0074] Next, the structure of the signal pin 122 and the connection method between the signal pin 122 and the signal hole 112 will be described.

[0075] The signal pin 122 has a "fish-eye type" structure. The signal pin 122 includes two support arms 1221 and a fish-eye hole 1222 formed by the two support arms 1221. The diameter of the signal hole 112 is smaller than the first distance L1 between the two support arms 1221 ( Figure 3 ). When the signal pin 122 is crimped into the signal hole 112, the side wall of the signal hole 112 exerts a pressure F1 on the two support arms 1221. Both support arms 1221 generate elastic deformation towards the fish-eye hole 1222, so that the first distance L1 between the two support arms 1221 becomes a second distance L2 equal to the diameter of the signal hole 112. Both support arms 1221 are in contact with the side wall of the signal hole 112, and a holding force between the signal pin 122 and the side wall of the signal hole 112 is formed by the resilience F2 of the two support arms 1221.

[0076] By crimping the signal pin 122 to the signal hole 112, the signal pin 122 can be electrically connected to the signal hole 112 in the circuit board 110. Thus, signals can be transmitted between the circuit board 110 and the connector 120. Crimping results in a relatively high impedance consistency among the respective signal pins 122, and crimping can reduce the return loss and insertion loss between the connector 120 and the circuit board 110, making the signal integrity relatively high when the connector 120 and the circuit board 110 transmit signals.

[0077] Next, the connection method of the ground pin 121 and the ground hole 111 will be described.

[0078] Since the ground pin 121 and the ground hole 111 are only used to ground the connector 120 and the circuit board 110 and do not need to transmit signals, there is no need to consider the impact of soldering on signal integrity. Therefore, the ground pin 121 and the ground hole 111 can be connected by soldering to increase the holding force between the ground pin 121 and the ground hole 111.

[0079] Please continue to refer to Figure 4 As shown, the ground hole 111 is filled with solder 1111. One end of the ground pin 121 extends into the connector body 123 to connect with the connector body 123. The other end of the ground pin 121 is a columnar pin. The columnar pin of the ground pin 121 is inserted into the ground hole 111, and then the solder 1111 is solidified to electrically connect the ground pin 121 and the ground hole 111. By connecting the ground hole 111 and the ground pin 121 through soldering, the atoms in the solder 1111 can enter the base materials of the ground pin 121 and the ground hole 111 during the solidification process of the solder 1111 to generate a metal compound between the ground pin 121 and the ground hole 111. Therefore, while electrically connecting the ground hole 111 and the ground pin 121, a reliable connection can be generated between the interfaces of the ground pin 121 and the ground hole 111 to increase the holding force between the circuit board 110 and the connector 120.

[0080] Thus, by crimping to connect the signal pin 122 and the signal hole 112 and by soldering to connect the ground hole 111 and the ground pin 121, the holding force between the circuit board 110 and the connector 120 in the circuit board assembly 100 can be increased without affecting the signal integrity between the connector 120 and the circuit board 110, making the connection between the circuit board 110 and the connector 120 relatively reliable.

[0081] In addition, in Figure 6 the illustrated embodiment, the ground holes 111 and the signal holes 112 are arranged at intervals on the circuit board 110. That is to say, there are connection points for increasing the holding force between every two signal holes 112, and the acting force between the connector 120 and the circuit board 110 is uniform.

[0082] The circuit board assembly 100 provided by the embodiment of the present application includes a circuit board 110 and a connector 120. The connector 120 includes a plurality of ground pins 121 and a plurality of signal pins 122. The circuit board 110 includes a plurality of ground holes 111 and a plurality of signal holes 112. The ground holes 111 are arranged in one-to-one correspondence with the ground pins 121, and the signal holes 112 are arranged in one-to-one correspondence with the signal pins 122. The signal pins 122 are crimped into the signal holes 112 one by one. By crimping the signal pins 122 and the signal holes 112, the impedance consistency between the signal pins 122 is relatively high, and the crimping can reduce the return loss and insertion loss between the connector 120 and the circuit board 110, so that the signal integrity during signal transmission between the connector 120 and the circuit board 110 is relatively high. The ground holes 111 are filled with solder 1111, and the ground pins 121 are soldered to the ground holes 111 through the solder 1111. By soldering the ground pins 121 and the ground holes 111, a reliable connection can be generated between the interfaces of the ground pins 121 and the ground holes 111 to improve the holding force between the circuit board 110 and the connector 120. Therefore, the holding force between the circuit board 110 and the connector 120 in the circuit board assembly 100 can be improved without affecting the signal integrity between the connector 120 and the circuit board 110, making the connection between the circuit board 110 and the connector 120 relatively reliable.

[0083] See Figures 2 to 4 As shown, the ground holes 111 are filled with a first copper layer 1112, and the size of the first copper layer 1112 along the extension direction of the ground holes 111 is equal to the depth of the ground holes 111. The length of the ground pins 121 is greater than or equal to the depth of the ground holes 111, and the ground pins 121 are soldered to the first copper layer 1112 through the solder 1111.

[0084] The ground holes 111 are through holes extending along the thickness direction Z of the circuit board 110. The size of the ground holes 111 along the thickness direction Z is the ground hole depth D1. The inner wall of the ground holes 111 is plated with a metal copper layer, and the metal copper layer on the inner wall of the ground holes 111 is the first copper layer 1112. In some implementation manners, the size of the first copper layer 1112 along the thickness direction Z is the first copper layer depth D2, and the first copper layer depth D2 is equal to the ground hole depth D1, that is, the first copper layer 1112 covers the inner wall of the ground holes 111 along the thickness direction Z. The top surface 113 of the circuit board 110 has a first pad 1113, and the bottom surface 114 of the circuit board 110 has a second pad 1114. One end of the first copper layer 1112 is connected to the first pad 1113, and the other end of the first copper layer 1112 is connected to the second pad 1114.

[0085] The length of the grounding pin 121 is the grounding pin length D3, and the grounding pin length D3 needs to be greater than or equal to the grounding hole depth D1. Both ends of the grounding pin 121 along the thickness direction Z can extend out of the grounding hole 111, so as to facilitate the welding of the grounding pin 121 and the grounding hole 111.

[0086] Specifically, the grounding pin 121 can be welded to the first copper layer 1112 in the grounding hole 111 by wave soldering, reflow soldering or laser soldering.

[0087] When using wave soldering to weld the grounding pin 121 and the grounding hole 111, first align the grounding pin 121 of the connector 120 with the grounding hole 111 of the circuit board 110, and align the signal pin 122 of the connector 120 with the signal hole 112 of the circuit board 110;

[0088] Then, insert the grounding pin 121 into the grounding hole 111, and insert the signal pin 122 into the signal hole 112. While the signal pin 122 is inserted into the signal hole 112, it is crimped with the signal hole 112;

[0089] Finally, use wave soldering to weld the grounding pin 121 and the grounding hole 111. Since the grounding pin 121 extends out of the bottom surface 114 of the circuit board 110, when the solder 1111 contacts the end of the grounding pin 121 and the second solder pad 1114, the solder 1111 climbs along the thickness direction Z on the grounding pin 121 and the first copper layer 1112 to fill the gap between the grounding pin 121 and the first copper layer 1112, and the solder 1111 solidifies to weld the grounding pin 121 and the first copper layer 1112. At the same time when the solder 1111 solidifies, first solder joints 1113a and second solder joints 1114a are respectively formed on the first solder pad 1113 and the second solder pad 1114.

[0090] When using laser soldering or reflow soldering to weld the grounding pin 121 and the grounding hole 111, first print the paste-like solder 1111 on the first solder pad 1113;

[0091] Then, align the grounding pin 121 of the connector 120 with the grounding hole 111 of the circuit board 110, and align the signal pin 122 of the connector 120 with the signal hole 112 of the circuit board 110;

[0092] Secondly, insert the grounding pin 121 into the grounding hole 111, and insert the signal pin 122 into the signal hole 112. While the signal pin 122 is inserted into the signal hole 112, it is crimped with the signal hole 112;

[0093] Finally, the ground pin 121 and the ground hole 111 are welded using laser soldering or reflow soldering. The paste solder 1111 melts under the action of the high temperature of laser soldering or reflow soldering. Since the ground pin 121 extends out of the top surface 113 of the circuit board 110, it is convenient for the melted solder 1111 to climb along the thickness direction Z on the ground pin 121 and the first copper layer 1112 to fill the gap between the ground pin 121 and the ground hole 111. The solder 1111 solidifies to weld the ground pin 121 and the first copper layer 1112. At the same time when the solder 1111 solidifies, a first solder joint 1113a and a second solder joint 1114a are respectively formed on the first pad 1113 and the second pad 1114.

[0094] When connecting the ground pin 121 and the ground hole 111 by soldering, while electrically connecting the ground pin 121 and the ground hole 111, the connector 120 is reliably connected to the circuit board 110.

[0095] See Figure 2 、 Figure 3 and Figure 5 As shown, the signal hole 112 has a second copper layer 1121 inside. The size of the second copper layer 1121 along the extending direction of the signal hole 112 is smaller than the depth of the signal hole 112; the signal pin 122 abuts against the second copper layer 1121.

[0096] The signal hole 112 is a through hole extending along the thickness direction Z of the circuit board 110. The inner wall of the signal hole 112 is plated with a metal copper layer. The metal copper layer on the inner wall of the signal hole 112 is the second copper layer 1121. The second copper layer 1121 abuts against the support arm 1221. Thus, the signal pin 122 can be electrically connected to the signal hole 112.

[0097] The size of the signal hole 112 along the thickness direction Z is the signal hole depth D4. The size of the second copper layer 1121 along the thickness direction Z is the second copper layer depth D5. The size of the support arm 1221 in the signal pin 122 along the thickness direction Z is the support arm length D6. In some implementation manners, the second copper layer depth D5 is smaller than the signal hole depth D4. The support arm 1221 abuts against the second copper layer 1121, and the support arm length D6 is equal to or slightly larger than the second copper layer depth D5. By making the second copper layer depth D5 smaller than the signal hole depth D4, signal reflection can be reduced and signal integrity can be improved.

[0098] Since connecting the ground pin 121 and the ground hole 111 by soldering can improve the connection reliability between the connector 120 and the circuit board 110, the holding force between the signal pin 122 and the signal hole 112 does not need to be large. Therefore, the second copper layer depth D5 can be made smaller to further reduce signal reflection. In some implementation manners, the second copper layer depth D5 is less than or equal to about 1.1 mm.

[0099] Please continue to refer to Figure 6 where the radius of the ground via 111 is the ground via radius R1, and the radius of the signal via 112 is the signal via radius R2. The ground via radius R1 can be set relatively large, and the ground pin 121 cooperating with the ground via 111 is also relatively thick. Thus, the contact area between the ground via 111 and the ground pin 121 through solder can be increased, and the holding force between the ground via 111 and the ground pin 121 can be further increased. The signal via radius R2 can be set relatively small, and the signal pin 122 cooperating with the signal via 112 is also relatively thin. Thus, the return loss and insertion loss during the insertion of the signal pin 122 into the signal via 112 can be reduced, and the signal integrity when the signal pin 122 and the signal via 112 transmit signals can be increased. In addition, setting the ground via 111 relatively large can also reduce the crosstalk when adjacent signal vias 112 transmit signals, and can further increase the signal integrity when the signal pin 122 and the signal via 112 transmit signals.

[0100] Therefore, setting the ground via radius R1 to be greater than or equal to the signal via radius R2 can increase the holding force between the connector 120 and the circuit board 110 while increasing the signal integrity.

[0101] In some implementation manners, the signal via radius R2 is in the range of about 0.1 mm to about 0.3 mm. When the signal via radius R2 is too small, the radius of the signal pin 122 corresponding to the signal via 112 is also too small, and the strength of the signal pin 122 is small. The signal pin 122 is prone to the phenomenon of needle inversion during the insertion process into the signal via 112. When the signal via radius R2 is too large, the insertion loss and return loss when the signal pin 122 is connected to the signal via 112 are large, which is not conducive to improving the signal integrity.

[0102] When transmitting high-speed signals, differential pair transmission can be used. The differential pair includes two signal branches. One signal branch is used to transmit the positive signal, and the other signal branch is used to transmit the negative signal. Subtracting the negative signal from the positive signal can obtain a useful signal with twice the intensity. In addition, the interference levels received on the two signal branches are close, and after the interference signals on the two signal branches are subtracted, it is equivalent that there is no interference between the two signal branches. This process is called the coupling of the differential pair. Therefore, the differential pair has a high signal strength and good anti-interference ability, and is usually used in circuit board components with high requirements for signal quality.

[0103] Figure 7 Top view of the circuit board in the circuit board component provided by the embodiment of the present application Figure 2 .

[0104] Refer to Figure 7 As shown, two adjacent signal vias 112 form a signal via pair 115, and one ground via 111 can be arranged between two adjacent signal via pairs 115.

[0105] The connector 120 has a pair of signal pins (not shown in the figure) corresponding to the pair of signal holes 115. The pair of signal holes 115 is electrically connected to the pair of signal pins one by one to transmit differential signals.

[0106] The connector 120 has a ground pin 121 corresponding to the ground hole 111. The ground pin 121 is electrically connected to the ground hole 111 to ground the connector 120 to the circuit board 110, thereby reducing the interference between adjacent pairs of signal holes 115 when transmitting signals. Two pairs of signal holes 115 share one ground hole 111, which can reduce the number of vias on the circuit board 110 and also reduce the volume of the corresponding connector 120.

[0107] Figure 8 The top view of the circuit board in the circuit board assembly provided by the embodiment of the present application Figure 3 。

[0108] See Figure 8 As shown, two ground holes 111 can be provided between two adjacent pairs of signal holes 115. The connector 120 has two ground pins 121 corresponding to the two ground holes 111. The ground pins 121 are electrically connected to the ground holes 111 one by one to ground the connector 120 to the circuit board 110, thereby further reducing the interference between adjacent pairs of signal holes 115 when transmitting signals.

[0109] Each pair of signal holes 115 has its own ground hole 111, which can increase the anti-interference ability between the pairs of signal holes 115. In addition, since the ground pins 121 and the ground holes 111 are welded, providing two ground holes 111 between two adjacent pairs of signal holes 115 can further increase the holding force between the connector 120 and the circuit board 110.

[0110] Figure 9 The flowchart of the method for manufacturing the circuit board assembly provided by the embodiment of the present application.

[0111] See Figure 9 As shown, the embodiment of the present application also provides a method for manufacturing a circuit board assembly for manufacturing the circuit board assembly 100 provided by the above embodiment.

[0112] Among them, the specific structure of the circuit board assembly 100 has been described in detail in the above embodiment and will not be repeated here.

[0113] The method for manufacturing the circuit board assembly includes:

[0114] S101. Form ground pins 121 and signal pins 122 on the connector 120.

[0115] A plurality of ground pins 121 and signal pins 122 are connected to the connector body 123. The ground pins 121 are columnar pins for facilitating soldering to the ground holes 111. The signal pins 122 are in a "fish-eye type" structure for facilitating crimping to the signal holes 112. Among them, the ground pins 121 and the signal pins 122 can be arranged at intervals; one ground pin 121 can be arranged between the signal pin pairs formed by two signal pins 122; two ground pins 121 can be arranged between the signal pin pairs formed by two signal pins 122, which are specifically arranged according to the specific requirements of the signals transmitted by the connector 120 and the circuit board 110.

[0116] S102. Form ground holes 111 and signal holes 112 on the circuit board 110.

[0117] The ground holes 111 need to be arranged in one-to-one correspondence with the ground pins 121 on the connector 120, and the signal holes 112 need to be arranged in one-to-one correspondence with the signal pins 122 on the connector 120. Among them, the depth D2 of the first copper layer in the ground hole 111 needs to be equal to the depth D1 of the ground hole, and the depth D5 of the second copper layer in the signal hole 112 needs to be less than the depth D4 of the signal hole.

[0118] S103. Crimp the signal pins 122 into the signal holes 112 and solder the ground pins 121 to the ground holes 111.

[0119] Align the signal pins 122 with the signal holes 112 one by one, and align the ground pins 121 with the ground holes 111 one by one. Insert the signal pins 122 into the signal holes 112 and insert the ground pins 121 into the ground holes 111. Among them, in some implementation manners, the crimping of the signal pins 122 and the signal holes 112 is completed while the signal pins 122 are inserted into the signal holes 112. Solder 1111 is coated on the first copper layer 1111 of the ground hole 111, and the solder 1111 is cured to solder the ground pins 121 and the ground holes 111.

[0120] Exemplarily, reflow soldering or laser soldering can be used to solder the ground pins 121 to the ground holes 111.

[0121] Before using reflow soldering or laser soldering to solder the ground pins 121 and the ground holes 111, solder 1111 needs to be printed on the ground holes 111.

[0122] Specifically, first print paste-like solder 1111 on the first solder pad 1113 on the top surface 113 of the circuit board 110;

[0123] Then, insert the ground pins 121 into the ground holes 111 and insert the signal pins 122 into the signal holes 112. The signal pins 122 are crimped to the signal holes 112 while being inserted into the signal holes 112;

[0124] Finally, the ground pin 121 and the ground hole 111 are welded using laser soldering or reflow soldering. The paste solder 1111 melts under the action of the high temperature of laser soldering or reflow soldering, and the melted solder 1111 climbs along the thickness direction Z on the ground pin 121 and the first copper layer 1112 to fill the gap between the ground pin 121 and the ground hole 111, and the solder 1111 solidifies to weld the ground pin 121 and the ground hole 111.

[0125] Exemplarily, wave soldering can also be used to solder the ground pin 121 into the ground hole 111.

[0126] Specifically, the ground pin 121 is inserted into the ground hole 111, and the signal pin 122 is inserted into the signal hole 112. While the signal pin 122 is inserted into the signal hole 112, it is crimped to the signal hole 112.

[0127] Then, wave soldering is used to solder the ground pin 121 and the ground hole 111. The molten solder 1111 climbs along the thickness direction Z on the ground pin 121 and the first copper layer 1112 to fill the gap between the ground pin 121 and the ground hole 111, and the solder 1111 solidifies to weld the ground pin 121 and the ground hole 111.

[0128] Figure 10 Schematic diagram of the structure of the computing device provided by the embodiment of the present application Figure 1 ; Figure 11 Schematic diagram of the structure of the computing device provided by the embodiment of the present application Figure 2 。

[0129] See Figure 10 and Figure 11 As shown, the embodiment of the present application further provides a computing device 10, including the circuit board assembly 100 provided by the above implementation, and the connector 120 of the circuit board assembly 100 is used for electrical connection with another circuit board.

[0130] In some implementation manners, the computing device 10 may include at least two circuit board assemblies 100 provided by the above implementation, and the connector 120 in one circuit board assembly 100 is electrically connected to the connector 120 in another circuit board assembly 100. Specifically, the connector 120 in one circuit board assembly 100 may be inserted into the connector 120 in another circuit board assembly 100.

[0131] In Figure 10 the implementation manner shown, the computing device 10 is a "backplane architecture", and the backplane architecture means that other circuit board assemblies in the computing device 10 are all supported and interconnected by one circuit board assembly. Specifically, please continue to refer to Figure 10As shown, the computing device 10 includes a backplane assembly 100a and a plurality of first circuit board assemblies 100b. The first circuit board assemblies 100b can be a main board assembly, a switch board assembly, a GPU (Graphics Processing Unit) board assembly, a network card daughter board assembly, etc.

[0132] The backplane assembly 100a includes a backplane 110a and a plurality of backplane connectors 120a, and the first circuit board assembly 100b includes a first circuit board 110b and a first connector 120b.

[0133] The first connector 120b in each first circuit board assembly 100b is respectively plugged into a different backplane connector 120a in the backplane assembly 100a, thereby electrically connecting the first circuit board assembly 100b and the backplane assembly 100a.

[0134] In Figure 10 the implementation shown, the backplane connector 120a can be a straight plug female connector, and the first connector 120b can be a bent male connector. The straight plug female connector is plugged into the bent male connector to connect the first circuit board assembly 100b and the backplane assembly 100a; the backplane connector 120a can be a straight plug male connector, and the first connector 120b can be a bent female connector. The straight plug male connector is plugged into the bent female connector to connect the first circuit board assembly 100b and the backplane assembly 100a.

[0135] In Figure 11 the implementation shown, the computing device 10 is a "non-backplane architecture". Please continue to refer to Figure 11 As shown, the computing device 10 includes a second circuit board assembly 100c and a third circuit board assembly 100d.

[0136] The second circuit board assembly 100c includes a second circuit board 110c and a second connector 120c. The third circuit board assembly 100d includes a third circuit board 110d and a third connector 120d. The second connector 120c is plugged into the third connector 120d, thereby electrically connecting the second circuit board assembly 100c and the third circuit board assembly 100d.

[0137] In Figure 11 the implementation shown, one of the second connector 120c and the third connector 120d is a bent female connector, and the other is a bent male connector. The bent female connector is plugged into the bent male connector to connect the second circuit board assembly 100c and the third circuit board assembly 100d.

[0138] In the description of the embodiments of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it may be a fixed connection, or an indirect connection through an intermediate medium, or the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific situations.

[0139] In the description of the embodiments of the present application, the terms "first", "second", "third", "fourth", etc. (if any) in the specification, claims, and the above drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0140] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the embodiments of the present application, and are not intended to limit them; although the technical solutions of the present application have been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A circuit board assembly, characterized in that, comprising: a circuit board, the circuit board including a plurality of ground holes and a plurality of signal holes, solder being disposed in the ground holes, and a connector, the connector including a plurality of ground pins and a plurality of signal pins, the plurality of ground pins being arranged in one-to-one correspondence with the plurality of ground holes, and the plurality of signal pins being arranged in one-to-one correspondence with the plurality of signal holes; the plurality of signal pins are respectively crimped in the plurality of signal holes, and the ground pins are soldered to the ground holes through the solder.

2. The circuit board assembly according to claim 1, characterized in that, a first copper layer is provided in the ground hole, and the dimension of the first copper layer along the extending direction of the ground hole is equal to the depth of the ground hole; the length of the ground pin is greater than or equal to the depth of the ground hole, and the ground pin is soldered to the first copper layer through the solder.

3. The circuit board assembly according to claim 1 or 2, characterized in that, a second copper layer is provided in the signal hole, and the dimension of the second copper layer along the extending direction of the signal hole is smaller than the depth of the signal hole; the signal pin abuts against the second copper layer.

4. The circuit board assembly according to any one of claims 1 to 3, characterized in that, the radius of the ground hole is greater than or equal to the radius of the signal hole.

5. A method for manufacturing a circuit board assembly, characterized in that, for manufacturing the circuit board assembly according to claim 1, the method for manufacturing the circuit board assembly includes: forming ground pins and signal pins on the connector; forming ground holes and signal holes on the circuit board; and crimping the signal pins into the signal holes and soldering the ground pins to the ground holes.

6. The method for manufacturing a circuit board assembly according to claim 5, characterized in that, the step of soldering the ground pins to the ground holes includes: soldering the ground pins to the ground holes using reflow soldering or laser soldering.

7. The method for manufacturing a circuit board assembly according to claim 6, characterized in that, before the step of crimping the signal pins into the signal holes and soldering the ground pins to the ground holes, it includes: printing solder on the ground holes.

8. The method for manufacturing a circuit board assembly according to claim 5, characterized in that, the step of soldering the ground pins to the ground holes includes: soldering the ground pins to the ground holes using wave soldering.

9. A computing device, characterized in that, comprising the circuit board assembly according to any one of claims 1 to 4, and the connector of the circuit board assembly is used for electrically connecting to another circuit board.

10. A connector, characterized in that, comprising: a connector body having a first surface for facing the circuit board; ground pins, and A signal pin, both the ground pin and the signal pin are arranged on the connector body, and the length of the ground pin is greater than that of the signal pin; the length of the ground pin protruding from the first surface is greater than that of the signal pin protruding from the first surface, so that the signal pin can be crimped in the signal hole of the circuit board, and the ground pin can be soldered in the ground hole of the circuit board.

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