A PCSEL array wire bonding integration method and system

Abstract

This application relates to the field of wire bonding technology, and more specifically, to a PCSEL array wire bonding integration method and system. The method comprises: positioning a PCSEL array, bonding one end of a photon wire bonding array to a surface-emitting light port of the PCSEL array; during wire bonding of PCSEL array samples, obtaining parameter values for the next batch of PCSEL array samples based on the changing characteristics of bonding parameters during the wire bonding process, as well as the difference between the positioning information and the original positioning information; and, after positioning a waveguide array, bonding the other end of the photon wire bonding array to the waveguide array. This application aims to adjust the bonding parameter values and improve the quality of wire bonding integration.

Description

Technical Field

[0001] The present application relates to the field of wire bonding technology, and in particular to a PCSEL array wire bonding integration method and system. Background Art

[0002] With globalization and the rapid development of technology, the amount of data that needs to be processed is rapidly increasing, and the corresponding data processing models and algorithms are also constantly expanding. This results in ever-increasing demands for computing power and power consumption. Optical computing technology, with its inherent parallel processing capabilities and mature wavelength division multiplexing technology, can significantly increase data processing power, capacity, and bandwidth. Optical computing power consumption is expected to be as low as 10-18 J / bit. At the same power consumption, photonic devices are hundreds of times faster than electronic devices. Photonic integration technology, which integrates optical devices on a single chip, is at the core of the future photonic era.

[0003] Currently, materials such as silicon, lithium niobate, and silicon nitride are commonly used in mainstream optical chip integration platforms. However, these materials are indirect bandgap materials, which pose significant challenges in meeting the high-power optical requirements of on-chip devices. Therefore, the integration of III-V materials into photonic integration platforms has become a research hotspot. Photonic crystal surface-emitting lasers (PCSELs) are considered key light source devices in the field of photonic integration due to their numerous advantages, including compact size, high output power, excellent temperature stability, and a wide spectral range.

[0004] In the integration process of PCSEL, in order to achieve on-chip integration, it needs to be input into the grating coupler at a specific angle, which inevitably involves the wire bonding process. In the automated wire bonding process, the docking and bonding process is easily affected by various factors, among which the position deviation and the difference in bonding parameter changes have a particularly significant impact. In the existing process treatment for PCSEL wire bonding integration, due to the differences in bonding materials and process conditions, there will be obvious deviations in the wire bonding position. This not only makes it difficult to guarantee the quality of wire bonding integration for PCSEL arrays, but also greatly increases the difficulty of the integration process, which has hindered the widespread application of PCSEL in the field of photonic integration. Summary of the Invention

[0005] In view of the above, it is necessary to provide a PCSEL array wire bonding integration method and system to solve the above problems.

[0006] In a first aspect, the present application provides a PCSEL array wire bonding integration method, wherein the PCSEL array wire bonding integration structure includes: a substrate layer, an insulating layer, a waveguide array, a metal layer, a PCSEL array, and a photon wire bonding array; a groove is provided on one side of the substrate layer; the insulating layer is provided on the substrate layer; the waveguide array is provided on the insulating layer, connected to the groove, and located on one side of the groove; the metal layer is arranged in the groove of the substrate layer and on the substrate layer; the PCSEL array is located on the metal layer;

[0007] Positioning the PCSEL array and obtaining position deviation values for all bonding positions based on the position difference between the positioning information and the preset position information; bonding one end of the photon wire bonding array to the surface emission light output port of the PCSEL array, and measuring bonding parameter data during the wire bonding process of the PCSEL array sample; obtaining a state sample set based on the weight corresponding to each bonding parameter data of all PCSEL array samples in the same batch;

[0008] Based on the distance between any two PCSEL array samples in the state sample set and the difference between the position deviation values, a distance determination result between the any two PCSEL array samples is obtained; the state sample set is clustered, and the change between each bonding parameter in each cluster cluster compared with the preset parameter value and the proportion of each cluster cluster in the bonding process are compared to obtain the parameter adjustment value of the next batch of PCSEL array samples, thereby obtaining the parameter value of the next batch of PCSEL array samples;

[0009] After positioning the waveguide array, the other end of the photonic wire bonding array is bonded to the waveguide array.

[0010] The photon wire bonding array is divided into a coupling part and a transmission part.

[0011] The positioning of the PCSEL array is specifically as follows:

[0012] The image of the light emitting port of the PCSEL array surface is captured. Based on the shape information of the light emitting port of the PCSEL array surface, template matching is used to obtain the position information of the PCSEL array light outlet in the image, which is mapped to a two-dimensional coordinate system. The PCSEL array is positioned by combining triangulation and camera parameters.

[0013] The coupling portion of the photon wire bonding array is bonded to the surface emission light outlet of the PCSEL array.

[0014] The process of obtaining the state sample set is as follows:

[0015] Based on the numerical value of each bonding parameter of each PCSEL array sample among all PCSEL array samples, each bonding parameter is weighted, and the weighted value is mapped into a multidimensional space as the mapping result of each PCSEL array sample. The set consisting of the mapping results of all batches of PCSEL array samples is used as the state sample set.

[0016] The step of obtaining the distance determination result between any two PCSEL array samples is as follows:

[0017] A sequence consisting of position deviation values of all bonding positions of the PCSEL array is used as a deviation sequence;

[0018] Obtain a distance metric between any two PCSEL array samples in a state sample set; calculate the difference between the deviation sequences of the wire bonding integration process of the arbitrary two PCSEL array samples; and forwardly fuse the distance metric with the difference to serve as a distance determination result between the arbitrary two PCSEL array samples.

[0019] The specific formula for obtaining the parameter adjustment values of the next batch of PCSEL array samples is: ;in, represents the adjustment amount of the t-th bonding parameter, represents the difference between the preset parameter value of the t-th bonding parameter and the mean value of the t-th bonding parameter of all PCSEL array samples in the i-th cluster; represents the number of PCSEL array samples in the i-th cluster; represents the number of all PCSEL array samples, and n represents the number of clusters.

[0020] The parameter values of the next batch of PCSEL array samples are specifically the sum of the parameter value of each bonding parameter before adjustment and the adjustment amount.

[0021] The transmission part of the photon wire bonding array is bonded to the waveguide array.

[0022] In a second aspect, an embodiment of the present application further provides a PCSEL array wire bonding integration system to implement the PCSEL array wire bonding integration method. The system includes a hardware part and a software part, wherein the hardware part includes:

[0023] A visual recognition system is used to locate the PCSEL array and waveguide array and obtain the position deviation values of all bonding positions;

[0024] Bonding equipment, used to bond one end of the photon wire bonding array to the surface emission light output port of the PCSEL array, and to bond the other end of the photon wire bonding array to the waveguide array;

[0025] A control system for obtaining a set of state samples based on weights corresponding to each bonding parameter data of all PCSEL array samples in the same batch;

[0026] Based on the distance between any two PCSEL array samples in the state sample set and the difference between the position deviation values, a distance determination result between the any two PCSEL array samples is obtained; the state sample set is clustered, and the change between each bonding parameter in each cluster cluster compared with the preset parameter value and the proportion of each cluster cluster in the bonding process are compared to obtain the parameter adjustment value of the next batch of PCSEL array samples, thereby obtaining the parameter value of the next batch of PCSEL array samples;

[0027] Testing equipment for quality inspection of bonding locations;

[0028] The software part includes:

[0029] Image recognition and processing software for automatic recognition, positioning, and alignment of PCSEL arrays, waveguide arrays, and photonic wire-bond arrays;

[0030] Data management and analysis software for storing, managing, and analyzing data from the bonding process;

[0031] Bonding control software is used to set parameter values and control the start and stop of bonding equipment.

[0032] This application has at least the following beneficial effects:

[0033] When it comes to the wire bonding integration process of PCSEL arrays, it is considered that the existing wire bonding integration process is difficult to integrate, and the position deviation of the wire bonding process of the same batch during the wire bonding integration process has a great impact on the stability of the bonding process and the bonding quality, resulting in the poor wire bonding integration quality of the PCSEL array by the existing method; therefore, the present application specifically targets the bonding quality difference caused by the bonding position deviation of the same batch under the preset bonding parameters, sets an adjustment node of the preset bonding parameters, and effectively divides the bonding data of the PCSEL array samples before the adjustment node, and the division process fully considers the bonding position difference and the response difference of the real-time collected bonding parameters during the bonding process, and then comprehensively considers the comprehensive difference in bonding parameters caused by the position deviation, and adjusts the bonding parameters in stages, thereby reducing the impact of the sample bonding position difference of the same batch of samples under the preset bonding parameters, which leads to poor bonding; at the same time, the wire bonding integration method of the present application can realize on-chip integration of PCSEL arrays, with low process difficulty, strong practicality, and can be used for large-scale production. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 A flowchart of a PCSEL array wire bonding integration method provided in one embodiment of the present application;

[0035] Figure 2 A schematic diagram of a PCSEL array wire bonding integrated structure provided by one embodiment of the present application;

[0036] Figure 3 A top view of a PCSEL array wire bonding integrated structure provided in one embodiment of the present application;

[0037] Figure 4 A schematic diagram of a laser paraxial array in a PCSEL array provided in one embodiment of the present application;

[0038] Figure 5 A cross-sectional view of a laser in a PCSEL array provided in one embodiment of the present application;

[0039] Figure 6 A top view of a cross section of a grating layer provided for one embodiment of the present application. DETAILED DESCRIPTION

[0040] In the description of the embodiments of this application, words such as "exemplary," "or," and "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of this application should not be construed as being preferred or advantageous over other embodiments or designs. Rather, the use of words such as "exemplary," "or," and "for example" is intended to present the relevant concepts in a concrete manner.

[0041] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the art of this application. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0042] It should also be noted that the terms "first" and "second" in this application and the accompanying drawings are used to distinguish similar objects, rather than to describe a specific order or sequence. The methods disclosed in the embodiments of this application or the methods shown in the flowcharts include one or more steps for implementing the methods. Without departing from the scope of protection of this application, the order of executing multiple steps can be interchanged with each other, and some steps can also be deleted.

[0043] Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.

[0044] The following describes in detail a PCSEL array wire bonding integration method and system provided by the present application with reference to the accompanying drawings.

[0045] See also Figure 1 , which shows a flowchart of a PCSEL array wire bonding integration method provided by one embodiment of the present application, the method comprising the following steps:

[0046] S1, Preliminary Preparation

[0047] S101, structural composition: Figure 2 As shown, the PCSEL array wire bonding integrated structure in the present application includes: a substrate layer 1, an insulating layer 2, a waveguide array 3, a metal layer 4, a PCSEL array 5, and a photon wire bonding array 6; wherein the substrate layer 1 has a groove on one side; the insulating layer 2 is provided on the substrate layer 1 and has the same area as the substrate layer 1; the waveguide array 3 is provided on the insulating layer 2, connected to the groove, and located on one side of the groove; the metal layer 4 is arranged on the substrate layer 1 in the groove of the substrate layer 1, with an area slightly smaller than the groove, and is used to power the PCSEL array 5 and serve as a metal bonding medium for the PCSEL array 5; the PCSEL array 5 is located on the metal layer 4 and serves as an on-chip light source; one end of the photon wire bonding array 6 is connected to the PCSEL array 5 and the other end is connected to the waveguide array 3, and is used to couple the light transmission of the PCSEL array to the waveguide array, ultimately realizing the introduction of the on-chip light source.

[0048] like Figure 3 As shown, the photon wire bonding arrays 6 guide the lasers in the PCSEL array 5 to the waveguide array 3 respectively. The number of the photon wire bonding arrays 6 is the same as that of the PCSEL array 5 and the waveguide array 3.

[0049] like Figure 4 As shown, the PCSEL array 5 is composed of multiple lasers. The lasers include a PCSEL layer 51; an adhesion layer 52, located above the PCSEL layer 51 and serving as a medium to connect the PCSEL layer 51 with a grating layer 53; a grating layer 53, located above the adhesion layer 52 and used to focus the light spot; and a buffer layer 54, located above the grating layer and used to transition the light spot, connecting to the photon wire bonding array 6.

[0050] like Figure 5 As shown, the photonic wire bonding array 6 can be divided into a coupling portion 61 and a transmission portion 62. The coupling portion 61 is a truncated cone, used to couple the light spot and transmit it to the transmission portion 62 to improve the light coupling efficiency; the transmission portion 62 guides the light from the coupling portion to the waveguide array 3.

[0051] like Figure 6 As shown, the grating layer 53 can be divided into a first material 531 and a second material 532. The center of the grating layer is a cylinder composed of the first material 531, and the outermost part is filled with the first material 531. The center is composed of rings formed by alternating first and second materials 531 and 532. The radial width of the first material 531 decreases from the center outward, while the radial width of the second material 532 increases from the center outward.

[0052] S102, material preparation: prepare the materials required for the substrate layer, insulating layer, waveguide array, metal layer, PCSEL array, and photon wire bonding array; specifically, in this application, the substrate layer material is silicon, the insulating layer material is silicon oxide, and the waveguide array material can be selected from silicon, lithium niobate, and silicon nitride; the metal layer material is gold; the optional materials for the PCSEL layer include but are not limited to GaAs material system and InP material system; the adhesion layer uses BCB material; the first material of the grating layer is high-refractive-index silicon, and the second material is low-refractive-index silicon oxide or silicon oxynitride, which can be arranged on the adhesion layer by micro-transfer technology or bonding technology; the photon wire bonding array material is photoresist; the buffer layer material is silicon oxide or silicon oxynitride.

[0053] S103, device preprocessing: The substrate layer is photolithographically defined to form grooves, ensuring that the bottom of the grooves is flat; the insulating layer completely covers the surface of the substrate layer, and the grooves are hollowed out; the waveguide array is defined and etched by photolithography; the metal layer is grown on the substrate layer within the grooves by magnetron sputtering, and its area is slightly smaller than the grooves. The PCSEL array is a conventional PCSEL structure. The PCSEL array is a laser matrix formed by multiple PCSEL lasers, and its light output direction is vertically upward; in the grating layer, after the shape of the first material is defined by DUV or EUV lithography, the second material can be filled into the slit of the first material by PECVD technology and chemical polishing technology. The minimum radial width of the second material does not exceed 14nm. The grating layer acts as a refractive index gradient lens, which can reduce the spot size and thus couple it into the photon wire bonding array; the photon wire bonding array is prepared by photon wire bonding technology.

[0054] S104, Equipment Debugging: Debugging the wire bonding automation equipment, including presetting appropriate bonding parameters, including but not limited to bonding pressure, bonding time, bonding temperature, and ultrasonic power. Specifically, the preset bonding pressure set in this application is 5-20 cN, the preset bonding time is 10-50 ms, the preset bonding temperature is 150-300°C, and the preset ultrasonic power is 20-80 mW. In this embodiment, the preset bonding pressure for the first batch is 15 cN, the preset bonding time is 30 ms, the preset bonding temperature is 250°C, and the preset ultrasonic power is 50 mW.

[0055] S2, bonding process

[0056] S201, Positioning and Calibration: Use the visual recognition system in automatic control technology to accurately position the PCSEL array and waveguide array.

[0057] (1) Image acquisition: The high-resolution industrial camera and light source in the visual recognition system work together. The light source is turned on in advance to provide a clear environment for imaging, reduce shadow and reflection interference, and ensure that the image captured by the camera can clearly present the details and features of the PCSEL array surface emission port and waveguide array. According to factors such as the size, shape, material of the PCSEL array and waveguide array and their contrast with the background, the parameters of the industrial camera, such as aperture size, focal length and exposure time, are finely adjusted to ensure that the outline, marking points and other key features of the PCSEL array and waveguide array are clearly imaged. After completing the preparation work, the industrial camera captures images of the PCSEL array surface emission port and waveguide array according to the set parameters.

[0058] (2) Obtaining position information based on the captured image: The image captured by the industrial camera is quickly transmitted to the image processor via the data transmission interface HDMI. After receiving the image, the image processor first applies a filtering algorithm. In this embodiment, the median filtering algorithm is used to remove noise from the image and improve the image quality. Then, the histogram equalization algorithm is used to highlight the key features such as the edges and contours of the PCSEL array and the waveguide array, which facilitates subsequent feature extraction and analysis. This application adopts a recognition algorithm based on template matching. According to the standard shape and size of the known PCSEL array surface emission port, a corresponding template is made, and its position in the image is determined by template matching. For the PCSEL array, the shape, size, color and texture features of its surface emission port are identified; for the waveguide array, its specific marking points (bonding positions) and boundary contour features are extracted. It should be noted that the median filtering algorithm, the histogram equalization algorithm and the recognition algorithm based on template matching are all existing well-known technologies, and this application will not elaborate on them.

[0059] Based on these extracted features and in conjunction with a pre-defined coordinate system and geometric model, the actual positions of the PCSEL array and waveguide array within the image are calculated. With the image center as the coordinate origin, the two-dimensional coordinate positions of the PCSEL array and waveguide array within the image are determined based on the intercepts of the line connecting the light exit and the origin, and the intercepts of the line connecting the marker and the origin. Using triangulation and camera parameters, these two-dimensional coordinates are converted to three-dimensional coordinates in real space, thereby obtaining the precise position of the PCSEL array and waveguide array within the actual workspace.

[0060] The acquired positioning information of the PCSEL array and waveguide array is compared with the preset position information to calculate the translational deviation (e.g., displacement in the X, Y, and Z directions) and rotational deviation (e.g., rotation angle around the X, Y, and Z axes), providing a basis for automatically adjusting the position of the bonding equipment. The positional deviation corresponding to each position includes translational deviation and rotational deviation. Based on the calculated positional deviation, the bonding equipment position is automatically adjusted to ensure that the two ends of the photonic wire bonding array accurately align with the PCSEL array surface emission port and the waveguide array, ensuring high bonding precision.

[0061] S202, photon wire bonding array bonding: Operate the bonding equipment to precisely bond one end of the photon wire bonding array (the truncated cone coupling portion) to the surface emission port of the PCSEL array. The bonding process strictly follows the preset bonding parameters to ensure that the bonding is firm and does not damage the device. Subsequently, the transmission portion of the photon wire bonding array is bonded to the waveguide array along the designed path to achieve a one-to-one connection. During the bonding process, this application uses the PCSEL array as an example to monitor and adjust the bonding quality in real time.

[0062] (1) Real-time monitoring during the bonding process: The bonding pressure is monitored in real time by a pressure sensor to ensure its stability, and the pressure data is fed back to the control system in real time. The temperature information of the bonding area is collected in real time by a temperature sensor and transmitted to the control system to ensure that the bonding temperature is within the appropriate range. The ultrasonic power information of the bonding area is collected in real time by a power sensor and transmitted to the control system to ensure that the ultrasonic power is within the appropriate range.

[0063] (2) Control and adjustment of bonding parameters: The control system uses an industrial computer as its core and combines it with a programmable logic controller to automatically control the entire bonding process. Based on the data feedback from the pressure sensor, power sensor, and temperature sensor, when the bonding pressure, ultrasonic power, or temperature deviates from the preset range, the control system automatically adjusts the bonding equipment to restore the bonding pressure and temperature to the preset values to ensure a stable bonding process. Considering that the actual wire bonding process varies with the wire bonding integration of different PCSEL arrays, the connection position deviation will affect the bonding effect. Therefore, the parameters of the next batch of PCSEL array samples are adjusted based on the data characteristics of the bonding parameters of each batch of PCSEL array samples.

[0064] First, the node positions for adjusting the preset bonding parameters of a preset number of PCSEL array samples are determined. For example, if the preset number is 10,000, the preset bonding parameters are optimized and adjusted once every 500 samples are produced as a batch. During the wire bonding integration process of each PCSEL array sample, after completing the wire bonding pairing and bonding operations, the bonding parameter data during the bonding process and the position deviation values during the positioning and calibration process are saved. The sequence composed of all position deviation values is used as the deviation sequence of each PCSEL array sample to compare the differences in translational deviation and rotational deviation at different positions during the bonding process of different samples. The collected data for each bonding parameter are organized into a bonding parameter sequence in ascending time order, and the weight of each bonding parameter is obtained using an objective weighting method. The size of the weight reflects the degree to which the corresponding bonding parameter is affected by the bonding position deviation during the wire bonding process and deviates from the normal stable bonding process. The weight of each bonding parameter obtained during the wire bonding integration process of a preset number of PCSEL arrays is used to form a state response array, which reflects the parameter response characteristics of the wire bonding process of each PCSEL array sample caused by position deviation.

[0065] To accurately analyze the changing characteristics of wire bonding states under different bonding parameters during the integration process of the same batch of PCSEL array samples, the PCSEL array samples from the same batch were mapped into a three-dimensional space for clustering. The data in the state response array corresponding to each PCSEL array sample was used as the X-axis, Y-axis, and Z-axis coordinates, and the mapping results were used as the state sample set. The distance determination result between samples was determined by the position deviation during the actual bonding process: a distance metric was obtained for any two PCSEL array samples in the state sample set; the difference between the deviation sequences of the wire bonding integration process of any two PCSEL array samples was calculated; and the result of the forward fusion of the distance metric and the difference was used as the distance determination result between the two PCSEL array samples.

[0066] In this embodiment, the distance measurement between samples adopts Euclidean distance to reflect the difference in state response of samples from different PCSEL arrays; the difference between sequences is calculated using Manhattan distance; and the forward fusion results of multiple variables are calculated using the multiplication method.

[0067] It should be understood that the larger the calculated distance determination result, the greater the response deviation of the two PCSEL array samples to the changes in different bonding parameters during the wire bonding process due to the connection position deviation, which will make the difference in wire bonding effect more significant, and the reference value of the adjustment of bonding parameters in the same batch will also decrease. To this end, the density peak clustering algorithm can be used to cluster the state sample set, calculate the mean value of each bonding parameter of all PCSEL array samples in each cluster during the wire bonding process, and then derive the difference between the preset bonding parameter value and the mean value. It should be noted that the density peak clustering algorithm is an existing well-known technology and is not elaborated in this application.

[0068] The parameter values for the next batch are preset based on the overall change difference of each bonding parameter in each cluster compared to the preset parameter value, as well as the proportion of the cluster in the bonding process. This is because the more PCSEL array samples with the same bonding parameter changes, the more samples are affected by the connection position deviation, which means that the bonding parameter changes of the same batch are more affected by the position deviation, and the difference in bonding effect is more obvious. Therefore, under the preset bonding parameters, the greater the degree of influence of the PCSEL array bonding position deviation on the same batch, the higher the possibility of bonding deviation; accordingly, the adjustment amount of each bonding parameter is obtained, and its formula form is: ;in, represents the adjustment amount of the t-th bonding parameter, represents the difference between the preset bonding parameter value of the t-th bonding parameter and the mean value of the t-th bonding parameter of all PCSEL array samples in the i-th cluster; represents the number of PCSEL array samples in the i-th cluster; represents the number of all PCSEL array samples, and n represents the number of clusters.

[0069] Based on the amount of adjustment for each bonding parameter, according to the formula ; Adjust the preset bonding parameters for the same batch of PCSEL array wire bonding integration, where: represents the adjusted value of the t-th bonding parameter, represents the value of the t-th bonding parameter before adjustment; Indicates the adjustment amount of the tth bonding parameter; if the bonding parameter adjustment amount exceeds the reasonable range during the bonding process, the bonding process is stopped and the operator is prompted to check and handle the problem, or re-bond directly.

[0070] S203, Quality Inspection and Adjustment: After bonding is complete, the bond points are inspected using automated inspection technology. Specifically, an ultrasonic scanning microscope is used to inspect the bond points for defects such as voids and cracks. Tensile testing equipment is used to verify that the bond strength meets standards.

[0071] S3, post-processing

[0072] S301, packaging protection: Use epoxy resin to package the bonded PCSEL array lead bonding integrated structure to effectively protect the bonding area and the entire integrated structure to prevent external environmental factors from adversely affecting its performance.

[0073] S302, Performance Testing: Comprehensive performance testing of the integrated device is conducted, including testing of parameters such as optical transmission efficiency, coupling efficiency, and power loss. Test results are compared with expected indicators to evaluate the effectiveness of the integration solution. If performance does not meet expectations, in-depth analysis is conducted to optimize and improve the integration method.

[0074] Based on the same inventive concept as the above method, an embodiment of the present application further provides a PCSEL array wire bonding integrated system, comprising:

[0075] 1. Hardware

[0076] (1) Visual recognition system: It consists of a high-resolution image acquisition device (such as an industrial camera), an image processor, and a light source. The image acquisition device is responsible for obtaining the position and shape information of the PCSEL array, waveguide array, and photonic wire bonding array; the image processor processes and analyzes the acquired images and calculates the deviation between the actual position of each device and the ideal position; the light source is used to provide a clear imaging environment to ensure the accuracy of image acquisition.

[0077] (2) Bonding equipment: High-precision wire bonding machines with automated control functions that can accurately control parameters such as the motion trajectory, bonding pressure, bonding time, and bonding temperature of the bonding equipment. The bonding equipment must be adapted to the bonding requirements of the photonic wire bonding array and can flexibly replace different types of bonding tools.

[0078] (3) Testing equipment: ultrasonic scanning microscope, tensile testing equipment, optical power meter, etc. Ultrasonic scanning microscope is used to detect internal defects of bonding points; tensile testing equipment is used to detect bonding strength; optical power meter is used to test the optical transmission performance of integrated devices.

[0079] (4) Control system: With industrial computers as the core, combined with programmable logic controllers (PLCs), the entire bonding process is automated. Data from the visual recognition system and detection equipment are received, and according to preset programs and algorithms, the bonding equipment is controlled, bonding parameters are adjusted, and fault diagnosis and alarm functions of the system are realized. Specifically, the bonding parameter control during the wire bonding process is controlled by the programmable logic controller for real-time feedback control. Adjustments to the preset bonding parameters during the same batch production process are calculated and adjusted based on the set adjustment nodes.

[0080] 2. Software

[0081] (1) Image recognition and processing software: This software processes images captured by the visual recognition system and automatically recognizes, locates, and calibrates PCSEL arrays, waveguide arrays, and photonic wire bonding arrays. Advanced image recognition algorithms are used to improve recognition accuracy and speed, ensuring the accuracy of bonding positions.

[0082] (2) Data management and analysis software: This software stores, manages, and analyzes data from the bonding process (including bonding parameters, test data, and performance test data). Through data analysis, it summarizes the bonding data characteristics of the same batch of PCSEL array samples. It adjusts the preset bonding parameters of different adjustment nodes based on the bonding differences caused by position deviations of the same batch of PCSEL array samples. It also generates production reports to facilitate traceability and management of the production process.

[0083] (3) Bonding control software: Users use this software to set bonding parameters, select bonding mode (manual or automatic), and control the start and stop of bonding equipment. The software interface is simple and intuitive, making it easy for operators to set parameters and monitor the process.

[0084] To sum up, when it comes to the wire bonding integration process of PCSEL arrays, the existing wire bonding integration process is difficult to integrate, and the position deviation of the wire bonding process for the same batch during the wire bonding integration process has a great impact on the stability of the bonding process and the bonding quality, resulting in the existing method having poor wire bonding integration quality for PCSEL arrays; therefore, the present application specifically targets the bonding quality difference caused by the bonding position deviation of the same batch under the preset bonding parameters, sets an adjustment node for the preset bonding parameters, and effectively divides the bonding data of the PCSEL array samples before the adjustment node. The division process fully considers the bonding position difference and the response difference of the real-time collected bonding parameters during the bonding process, and then comprehensively considers the comprehensive difference in bonding parameters caused by the position deviation, and adjusts the bonding parameters in stages to reduce the impact of the sample bonding position difference of the same batch of samples under the preset bonding parameters, resulting in poor bonding; at the same time, the wire bonding integration method of the present application can realize on-chip integration of PCSEL arrays, with low process difficulty, strong practicality, and can be used for large-scale production.

[0085] The flowcharts and block diagrams in the accompanying drawings show the possible architecture, functions and operations of the systems, methods and computer program products according to the embodiments of the present application. In this regard, each box in the flowchart or block diagram can represent a module, a program segment or a part of the code, and the part of the module, program segment or code contains one or more executable instructions for realizing the specified logical function. In some alternative implementations, the functions marked in the box can also occur in an order different from that marked in the accompanying drawings. For example, two consecutive boxes can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, which can depend on the functions involved. In the description corresponding to the flowcharts and block diagrams in the accompanying drawings, the operations or steps corresponding to different boxes can also occur in an order different from that disclosed in the description, and sometimes there is no specific order between different operations or steps. For example, two consecutive operations or steps can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, which can depend on the functions involved. Each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, may be implemented by a dedicated hardware-based system that performs the specified function or action, or may be implemented by a combination of dedicated hardware and computer instructions.

[0086] It is obvious to those skilled in the art that the present application is not limited to the details of the above exemplary embodiments, and that the present application can be implemented in other specific forms without departing from the basic features of the present application. Therefore, from any point of view, the above embodiments of the present application should be regarded as exemplary and non-restrictive; modifications to the technical solutions described in the above embodiments, or equivalent replacement of some of the technical features therein, do not deviate from the essence of the corresponding technical solutions within the scope of the technical solutions of the embodiments of the present application, and should be included in the scope of protection of the present application.

Claims

1. A PCSEL array wire bonding integration method, characterized in that: The PCSEL array wire bonding integrated structure includes: a substrate layer, an insulating layer, a waveguide array, a metal layer, a PCSEL array, and a photon wire bonding array; a groove is provided on one side of the substrate layer; the insulating layer is provided on the substrate layer at a position other than the groove; the waveguide array is provided on the insulating layer, connected to the groove, and located on one side of the groove; the metal layer is provided on the substrate layer in the groove; and the PCSEL array is provided on the metal layer. Positioning the PCSEL array and obtaining position deviation values for all bonding positions based on the position difference between the positioning information and the preset position information; bonding one end of the photon wire bonding array to the surface emission light output port of the PCSEL array, and measuring bonding parameter data during the wire bonding process of the PCSEL array sample; obtaining a state sample set based on the weight corresponding to each bonding parameter data of all PCSEL array samples in the same batch; Based on the distance between any two PCSEL array samples in the state sample set and the difference between the position deviation values, a distance determination result between the any two PCSEL array samples is obtained; the state sample set is clustered, and the change between each bonding parameter in each cluster cluster compared with the preset parameter value and the proportion of each cluster cluster in the bonding process are compared to obtain the parameter adjustment value of the next batch of PCSEL array samples, thereby obtaining the parameter value of the next batch of PCSEL array samples; After positioning the waveguide array, the other end of the photonic wire bonding array is bonded to the waveguide array.

2. A PCSEL array wire bonding integration method according to claim 1, characterized in that: The photon wire bonding array is divided into a coupling part and a transmission part.

3. A PCSEL array wire bonding integration method according to claim 1, characterized in that: Positioning the PCSEL array is specifically as follows: The image of the light emitting port of the PCSEL array surface is captured. Based on the shape information of the light emitting port of the PCSEL array surface, template matching is used to obtain the position information of the PCSEL array light outlet in the image, which is mapped to a two-dimensional coordinate system. The PCSEL array is positioned by combining triangulation and camera parameters.

4. A PCSEL array wire bonding integration method according to claim 2, characterized in that: The coupling portion of the photon wire bonding array is bonded to the surface emission light output port of the PCSEL array.

5. A PCSEL array wire bonding integration method according to claim 1, characterized in that: The process of obtaining the state sample set is: Based on the numerical value of each bonding parameter of each PCSEL array sample among all PCSEL array samples, each bonding parameter is weighted, and the weighted value is mapped into a multidimensional space as the mapping result of each PCSEL array sample. The set consisting of the mapping results of all PCSEL array samples in the same batch is taken as the state sample set.

6. A PCSEL array wire bonding integration method according to claim 1, characterized in that: The step of obtaining the distance determination result between any two PCSEL array samples is: A sequence consisting of position deviation values of all bonding positions of the PCSEL array is used as a deviation sequence; Obtain a distance metric between any two PCSEL array samples in a state sample set; calculate the difference between the deviation sequences of the wire bonding integration process of the arbitrary two PCSEL array samples; and forwardly fuse the distance metric with the difference to serve as a distance determination result between the arbitrary two PCSEL array samples.

7. A PCSEL array wire bonding integration method according to claim 1, characterized in that: The parameter adjustment values for the next batch of PCSEL array samples are obtained using the following formula: ;in, represents the adjustment amount of the t-th bonding parameter, represents the difference between the preset parameter value of the t-th bonding parameter and the mean value of the t-th bonding parameter of all PCSEL array samples in the i-th cluster; represents the number of PCSEL array samples in the i-th cluster; represents the number of all PCSEL array samples, and n represents the number of clusters.

8. A PCSEL array wire bonding integration method according to claim 7, characterized in that: The parameter values of the next batch of PCSEL array samples are specifically the sum of the parameter value of each bonding parameter before adjustment and the adjustment amount.

9. A PCSEL array wire bonding integration method according to claim 1, characterized in that: Bond the transmission portion of the photonic wire bonding array to the waveguide array.

10. A PCSEL array wire bonding integration system, which implements the PCSEL array wire bonding integration method according to claim 1, characterized in that: The system includes a hardware part and a software part, wherein the hardware part includes: A visual recognition system is used to locate the PCSEL array and waveguide array and obtain the position deviation values of all bonding positions; Bonding equipment, used to bond one end of the photon wire bonding array to the surface emission light output port of the PCSEL array, and to bond the other end of the photon wire bonding array to the waveguide array; A control system for obtaining a set of state samples based on weights corresponding to each bonding parameter data of all PCSEL array samples in the same batch; Based on the distance between any two PCSEL array samples in the state sample set and the difference between the position deviation values, a distance determination result between the any two PCSEL array samples is obtained; the state sample set is clustered, and the change between each bonding parameter in each cluster cluster compared with the preset parameter value and the proportion of each cluster cluster in the bonding process are compared to obtain the parameter adjustment value of the next batch of PCSEL array samples, thereby obtaining the parameter value of the next batch of PCSEL array samples; Testing equipment for quality inspection of bonding locations; The software part includes: Image recognition and processing software for automatic recognition, positioning, and alignment of PCSEL arrays, waveguide arrays, and photonic wire-bond arrays; Data management and analysis software for storing, managing, and analyzing data from the bonding process; Bonding control software is used to set parameter values and control the start and stop of bonding equipment.

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