Image sensor driving module, optical assembly, camera module and electronic equipment

Abstract

The invention discloses an image sensor driving module, an optical assembly, a camera module and electronic equipment. The image sensor driving module comprises a driving unit, a fixed seat and a movable seat, the fixed seat bears a fixed part of the driving unit, the movable seat comprises a bearing part, a fixed part and a connecting part, and the bearing part is used for bearing an image sensor and a movable part of the driving unit. The fixed seat comprises a fixed platform and a fixed frame, the fixed seat is provided with an opening located in the side opposite to the fixed platform, and the opening is used for installing the image sensor to the movable seat. According to the invention, decoupling between the image sensor and the image sensor driving module can be realized, and the manufacturing yield of the camera module is improved.

Description

[0001] This application is a divisional application. The application number of the original application is 202211634989.2, and the original application date is December 19, 2022. The entire content of the original application is incorporated herein by reference.

[0002] This application claims the priority of a Chinese patent application with the application number 202210129797.X, titled "Image Sensor Driving Module, Optical Component, Camera Module and Electronic Device", filed with the Chinese Patent Office on February 11, 2022. The entire content of this application is incorporated herein by reference. Technical Field

[0003] Possible embodiments of this application relate to the field of shooting technology, and in particular to an image sensor driving module, an optical component, a camera module and an electronic device. Background Art

[0004] When an electronic device with a camera function (such as a mobile phone, a tablet computer, etc.) takes a picture, the taken picture often becomes blurry, double-imaged or fuzzy due to slight shaking. For example, when a person holds an object, there is generally a certain degree of physiological shaking. When taking a picture, the person is often in a moving state. These irregular, involuntary shakes or motion vibrations will cause the captured image to be unclear, and the user experience is also poor. Therefore, an electronic device with a camera function needs to have an Automatic Focus (AF) function and an Optical Image Stabilization (OIS) function.

[0005] During the design process of the camera module, it is certain to consider setting a driving structure for driving the image sensor to move. The driving structure drives the image sensor to move, which can adjust the specific position and posture of the image sensor, and realize the anti-shake function of the camera module.

[0006] Under the development trend of the thinning and multi-function of electronic devices, during the design process of the camera module, for the driving structure of the image sensor, how to design to achieve decoupling between the image sensor and the image sensor driving structure and improve the manufacturing yield of the camera module is a topic continuously explored by the industry. Summary of the Invention

[0007] This application provides an image sensor driving module, an optical component, a camera module and an electronic device, which can achieve decoupling between the image sensor and the image sensor driving module and improve the manufacturing yield of the camera module.

[0008] In a first aspect, an embodiment of the present application provides an image sensor driving module, which includes a driving unit, a fixed base, and a movable base. The driving unit includes a fixed member and a movable member that can move relative to each other. The fixed base includes a fixed platform and a fixed frame. The fixed platform includes an inner surface and a first bottom surface that face each other. The fixed frame is connected to the fixed platform and protrudes from the inner surface. The fixed member is fixed to the fixed base, and an opening is formed on a side of the fixed frame away from the inner surface. The movable base and the inner surface of the fixed platform are spaced apart or in contact in a suspended manner. The movable base includes a bearing portion, a fixing portion, and a connecting portion. The connecting portion is used to achieve mechanical and electrical connections between the bearing portion and the fixing portion. The fixing portion is connected to the fixed base. The bearing portion includes a first bearing area and a second bearing area. The movable member is disposed in the second bearing area. The first bearing area is used to bear an image sensor. The size of the opening is larger than the size of the image sensor. The opening is used to mount the image sensor onto the first bearing area.

[0009] In the present application, the image sensor driving module is designed as a module architecture independent of the image sensor. The size of the opening of the image sensor driving module is larger than the size of the image sensor. In this way, after the image sensor driving module is assembled into a whole, the image sensor can be assembled onto the bearing portion of the image sensor driving module through the opening of the image sensor driving module. The present application decouples the image sensor driving module and the image sensor, which is beneficial to controlling the manufacturing precision of the image sensor driving module. Since the image sensor is not assembled in the image sensor driving module during the manufacturing and assembly process of the image sensor driving module, the manufacturing process of the image sensor driving module has no impact on the performance of the image sensor. A dedicated image sensor for separate testing can also be used during the testing process of the image sensor driving module. When the image sensor driving module is applied in a camera module, it can ensure the excellent performance of the image sensor in the camera module, and can also improve the manufacturing yield of the camera module and reduce costs.

[0010] In a possible implementation, the bottom surface of the image sensor is fixedly connected to the movable base, and a gap is formed between the side surface of the image sensor and the movable base. Through the gap between the side surface of the image sensor and the movable base in this solution, it can bring convenience to the assembly of the image sensor. It can be understood that the space reserved for the image sensor on the movable base is larger than the outer contour size of the image sensor. During the process of assembling the image sensor from the opening position to the image sensor driving module, it is easy to operate and has a lower precision requirement.

[0011] In a possible implementation, the fixed frame includes a side frame and a top plate. The top plate is disposed opposite to the inner surface of the fixed platform. The side frame is connected between the top plate and the fixed platform, and together with the top plate and the fixed platform forms an enclosed space. The driving unit, the connecting portion, and the second bearing area are located in the enclosed space, and the opening is formed by surrounding the top plate. In this solution, by defining that the fixed frame includes a top plate, the top plate is on the side opposite to the fixed platform and together with the side frame and the fixed platform forms an enclosed space. The second bearing area of the movable seat, the connecting portion, and the driving unit are all accommodated in this enclosed space, so that the fixed seat plays a role in protecting the driving unit and the circuit part on the movable seat. Moreover, the top plate can also be used to assemble other driving units of the camera module.

[0012] In a possible implementation, the top plate is made of a rigid material. The top plate includes a first top surface, and the first top surface is the surface of the top plate away from the fixed platform. The first top surface is used to mount the lens driving module in the camera module. The supporting force of the top plate made of a rigid material is more stable, which can more precisely define the installation position of the lens driving module, and is beneficial to the driving accuracy of the lens driving module of the camera module.

[0013] In a possible implementation, the first bearing area faces the opening, and the opening faces the first bearing area. It can be understood that: in the extending direction of the optical axis, the vertical projection of the opening on the movable seat and the first bearing area have an overlapping relationship; it can also be understood that: the central position of the vertical projection of the opening on the movable seat coincides with the central position of the first bearing area; it can also be understood that: the edge of the vertical projection of the opening on the movable seat is located outside the first bearing area, or the edge of the vertical projection of the opening on the movable seat coincides with the edge of the first bearing area. In the image sensor driving module provided by this solution, the opening faces the first bearing area. During the process of assembling the image sensor, the image sensor is directly fixed by the suction force of the suction cup. By moving the suction cup along the optical axis direction, the image sensor is placed in the first bearing area, and then the image sensor and the bearing part are fixedly connected, making the process of assembling the image sensor easier, improving the positioning accuracy of the image sensor, and ensuring the imaging quality of the camera module.

[0014] In a possible implementation, the first bearing area includes a first central area and a second central area. The second central area is located on the periphery of the first central area. The projection of the second central area on the inner surface of the fixed platform is located between the projection of the first central area on the inner surface of the fixed platform and the projection of the second bearing area on the inner surface of the fixed platform. The first central area is used to mount the image sensor, and the second central area is used to mount the optical element. The optical element can be an IR filter. In this embodiment, both the image sensor and the optical element can be assembled in the first bearing area of the image sensor driving module, which is beneficial to reducing the size of the camera module in the optical axis direction. For an electronic device, the thinness of the electronic device can be achieved.

[0015] In a possible implementation, the movable seat is an integrated circuit board structure. Specifically, the dimension of the movable seat in the optical axis direction of the image sensor is the thickness of the movable seat, and the thicknesses of the second bearing area, the connecting part, and the fixing part are equal. The second bearing area is connected between the connecting part and the first bearing area. At least part of the thickness of the first bearing area is less than the thickness of the second bearing area, so that at least part of the first bearing area is an inner concave structure and forms a receiving space for receiving the image sensor. The integrated circuit board structure means that the movable seat is made by the circuit board manufacturing process at one time, rather than the splicing combination of multiple circuit boards or the composition of a circuit board and other plates. The movable seat being an integrated circuit board structure can minimize the dimension of the movable seat in the optical axis direction. Moreover, the signal interaction between the image sensor and the processor in the electronic device, the power-on of the image sensor, and the power-on of the driving unit can all be realized through the circuit board traces arranged in the movable seat. Transmitting electrical signals and image signals through the circuit board traces in the integrated circuit board structure can ensure the signal quality, reduce signal loss, and is also beneficial to reducing the interference from the outside to the signal, and can improve the imaging quality and imaging efficiency of the camera module.

[0016] In this application, a groove structure can be set on the movable seat of the integrated circuit board architecture. For example: the thickness of the first central area is smaller, and the first central area is an inner concave part; or the thickness of the first bearing area is smaller, and the first bearing area is an inner concave part. The solution of using the inner concave part to carry the image sensor is beneficial to realizing the thinness of the camera module in the optical axis direction.

[0017] In a possible implementation, the fixing member is fixed to the top plate, and the movable member is fixed to the second bearing area and faces the top plate. This solution defines the specific position layout of the driving unit, which is beneficial to realizing the small-size design of the image sensor driving module.

[0018] In a possible implementation, the second bearing area and the connecting part are stacked, and along the optical axis direction, the connecting part is located between the second bearing area and the fixed platform. In this embodiment, by designing the bearing part as a two-board structure (i.e., the second bearing area and the connecting part are respectively formed on two circuit boards), and the architecture in which the second bearing area and the connecting part are stacked, a small-size design of the movable seat in the direction perpendicular to the optical axis can be achieved. When this solution is applied to an electronic device, the board occupation area of the circuit board where the camera module is located can be saved.

[0019] In a possible implementation, the first bearing area includes an assembly area one and an assembly area two. The assembly area one is used to bear the image sensor. The connecting part surrounds the assembly area one and is connected to the edge of the assembly area one. The assembly area two and the second bearing area are interconnected as a whole. The assembly area two and a part of the assembly area one overlap and form an overlapping area. The positions of the mechanical connection and the electrical connection between the assembly area one and the assembly area two are both within the overlapping area.

[0020] In a possible implementation, the assembly area one and the connecting part are of an integrated circuit board structure. This solution defines a specific design solution for the movable seat. Through the design of the positional relationship between the assembly area one and the assembly area two of the first bearing area, it is beneficial to make the structure of the movable seat compact, save the internal space of the image sensor driving module, and is beneficial to achieve a small-size design of the movable seat in the direction perpendicular to the optical axis. When this solution is applied to an electronic device, the board occupation area of the circuit board where the camera module is located can be saved.

[0021] In a possible implementation, the fixing member is fixed to the fixed platform, and the movable member is fixed to the second bearing area facing the fixed platform. This solution provides a specific layout architecture for the driving unit. By bearing the fixing member on the movable plane, it is beneficial to save space and a small-size image sensor driving module in the axial direction can be achieved.

[0022] In a possible implementation, the second bearing area and the connecting part are stacked, and in the optical axis direction, the second bearing area is located between the fixed platform and the connecting part. In this embodiment, by designing the bearing part as a two-board structure (i.e., the second bearing area and the connecting part are respectively formed on two circuit boards), and the architecture in which the second bearing area and the connecting part are stacked, a small-size design of the movable seat in the direction perpendicular to the optical axis can be achieved. When this solution is applied to an electronic device, the board occupation area of the circuit board where the camera module is located can be saved.

[0023] In a possible implementation, the bearing part includes a first plate and a second plate. The first plate is connected to the connecting part. A receiving space is formed around the inner edge of the first plate. The second bearing area is located on the first plate. The second plate includes a first part and a second part. The first part is stacked with the first plate. The second part is located at the bottom of the receiving space. The second part is used to carry the image sensor. The image sensor is electrically connected to the first plate. The signal of the image sensor is transmitted through the first plate, the connecting part and the fixing part. In this solution, the image sensor is connected by the second plate, and the movable part is carried by the first plate. The image sensor is accommodated in the receiving space, which is beneficial to realizing the size in the optical axis direction, making it easy to achieve a small-size structure of the image sensor driving module in the optical axis direction. Moreover, the electrical connection traces for transmitting current and image signals on the movable seat are all arranged in the first plate, and the image sensor is electrically connected to the first plate, which is beneficial to ensuring the accuracy and stability of signal transmission.

[0024] In a possible implementation, the bearing part contacts the fixed platform. The image sensor driving module further includes a holding structure. Part of the holding structure is connected to the bearing part, and part of the holding structure is located on the fixed seat. The holding structure is used to provide a holding force on the bearing part. The holding force is used to keep the contact between the bearing part and the fixed platform. In the specific embodiment of the present application, by setting the holding structure, the contact between the bearing part and the fixed platform is ensured, which can ensure that there is no displacement in the optical axis direction during the movement of the image sensor, improve the smoothness of the movement of the image sensor, and can limit the movement trajectory of the image sensor in a stable plane, avoiding axial vibration or tilt of the image sensor during movement (i.e., reducing the displacement in the optical axis direction of the image sensor and the crosstalk in the rotation direction of the image sensor), and can ensure the quality and stability of the image data obtained by the image sensor. In the design solution where the image sensor moving platform is suspended relative to the bottom plate of the module, a position detection sensor in the optical axis direction needs to be provided on the moving platform. Since there is no displacement of the image sensor in the optical axis direction in this solution, the present application does not need to configure a position detection sensor in the optical axis direction, which can save the cost of the image sensor driving module, simplify the device structure configured on the movable seat, and is beneficial to realizing the small size of the movable seat.

[0025] In a second aspect, an embodiment of the present application provides an optical component, including a lens driving module and the image sensor driving module according to any possible implementation manner of the first aspect. The lens driving module is fixedly connected to the fixed seat. The image sensor driving module is configured to drive the image sensor to move in a plane perpendicular to the optical axis, and the lens driving module is configured to drive the lens module to move axially or tilt. The optical component provided by this solution can drive the image sensor to move and also drive the lens component to achieve focusing, with high integration, which is beneficial to the miniaturization design of the camera module.

[0026] In a possible implementation manner, the lens driving module includes a housing and a driving component installed in the housing. The driving component is configured to achieve focusing of the camera module, and an outer surface of the housing is fixedly connected to the fixed seat. In the optical component provided by this solution, the lens driving module and the image sensor driving module are two independent modular structures. The lens driving module and the image sensor driving module have their own independent drives, and decoupling is achieved between the two. The image sensor driving module can be matched with different types of lens driving modules to form different driving schemes.

[0027] In a third aspect, an embodiment of the present application provides a camera module, including an image sensor, a lens component, and the optical component according to any possible implementation manner of the second aspect. The lens component is connected to the lens driving module, the image sensor is fixed to the image sensor driving module, and the lens component is located on the light incident side of the image sensor. The camera module provided by this solution is beneficial for assembly and has the advantage of low cost.

[0028] In a fourth aspect, an embodiment of the present application provides a camera module, including an image sensor, a lens component, and the image sensor driving module according to any possible implementation manner of the first aspect. The image sensor is fixed to the image sensor driving module, and the lens component is located on the light incident side of the image sensor. The camera module provided by this solution is beneficial for assembly and has the advantage of low cost.

[0029] In a fifth aspect, an embodiment of the present application provides an electronic device, including a processor and the camera module according to the third aspect or the fourth aspect. The processor is electrically connected to the camera module, and the processor is configured to process the image signal output by the image sensor.

[0030] Sixth aspect, an embodiment of the present application provides a camera module, including an image sensor, a lens assembly, a lens driving module, and an image sensor driving module. The lens assembly is located on the light incident side of the image sensor; the lens driving module includes a housing and a driving component installed in the housing, and the driving component is used to drive the lens assembly to move; the image sensor driving module includes a fixed seat, a movable seat, and a driving unit. The driving unit includes a fixed part and a movable part that can move relative to each other. The fixed seat includes a fixed platform and a side frame, and the side frame is connected to the fixed platform. The fixed part is fixed to the fixed seat. The movable seat includes a bearing part, a fixed part, and a connecting part. The connecting part is used to achieve mechanical and electrical connections between the bearing part and the fixed part. The fixed part is connected to the fixed seat, and the bearing part is used to carry the image sensor and the movable part; the lens driving module is located on the side of the side frame away from the fixed platform, and the outer surface of the housing is fixedly connected to the fixed seat. In the optical component provided by this solution, the lens driving module and the image sensor driving module in the camera module are two independent modular structures. The lens driving module and the image sensor driving module have their own independent drives, and decoupling is achieved between the two. The image sensor driving module can be matched with different types of lens driving modules to form different driving schemes. Description of the Drawings

[0031] Figure 1 is a perspective view of an electronic device provided by a possible implementation manner of the present application;

[0032] Figure 2 is Figure 1 a perspective view of the electronic device shown in another direction;

[0033] Figure 3A is a perspective view of a camera module provided by a possible implementation manner of the present application;

[0034] Figure 3B shows a perspective cross-sectional view of a camera module provided by an implementation manner of the present application;

[0035] Figure 4 is a perspective exploded view of a camera module provided by a possible implementation manner of the present application;

[0036] Figure 5 is a perspective exploded view of a camera module provided by a possible implementation manner of the present application;

[0037] Figure 6 is a perspective view of an image sensor driving module provided by a possible implementation manner of the present application;

[0038] Figure 7It is an exploded perspective view of an image sensor driving module provided by a possible implementation manner of the present application;

[0039] Figure 8 It is an exploded perspective view of an image sensor driving module provided by a possible implementation manner of the present application;

[0040] Figure 9 It is a cross-sectional view of an image sensor driving module provided by a possible implementation manner of the present application;

[0041] Figure 10A is Figure 9 A partial enlarged view of the cross-sectional view of the image sensor driving module shown;

[0042] Figure 10B A partial enlarged view of the cross-sectional view of an image sensor driving module provided by a possible implementation manner of the present application;

[0043] Figure 11A It is a schematic diagram of the friction interface between the bearing part and the fixed platform in an image sensor driving module provided by a possible implementation manner of the present application;

[0044] Figure 11B It is a schematic diagram of the friction interface between the bearing part and the fixed platform in an image sensor driving module provided by a possible implementation manner of the present application;

[0045] Figure 11C It is a schematic diagram of the friction interface between the bearing part and the fixed platform in an image sensor driving module provided by a possible implementation manner of the present application;

[0046] Figure 12 It is a schematic diagram of the friction interface between the bearing part and the fixed platform in an image sensor driving module provided by a possible implementation manner of the present application;

[0047] Figure 13 It is a schematic diagram of the friction interface between the bearing part and the fixed platform in an image sensor driving module provided by a possible implementation manner of the present application;

[0048] Figure 14 It is a schematic diagram of the specific form of the contact surface between the bearing part and the fixed plane in an image sensor driving module provided by a possible implementation manner of the present application;

[0049] Figure 15 It is a schematic diagram of the specific form of the contact surface between the bearing part and the fixed plane in an image sensor driving module provided by a possible implementation manner of the present application;

[0050] Figure 16It is a schematic diagram of the specific form of the contact surface between the bearing part and the fixed plane in the image sensor driving module provided by a possible implementation manner of the present application;

[0051] Figure 17 It is a schematic diagram of the specific form of the contact surface between the bearing part and the fixed plane in the image sensor driving module provided by a possible implementation manner of the present application;

[0052] Figure 18 It is a schematic diagram of the specific form of the contact surface between the bearing part and the fixed plane in the image sensor driving module provided by a possible implementation manner of the present application;

[0053] Figure 19 It is a schematic diagram of the specific form of the contact surface between the bearing part and the fixed plane in the image sensor driving module provided by a possible implementation manner of the present application;

[0054] Figure 20 It is a schematic diagram of the specific architecture of the holding structure in the image sensor driving module provided by a possible implementation manner of the present application;

[0055] Figure 21 It is a schematic diagram of the specific architecture of the holding structure in the image sensor driving module provided by a possible implementation manner of the present application;

[0056] Figure 22 It is a schematic diagram of the specific architecture of the holding structure in the image sensor driving module provided by a possible implementation manner of the present application;

[0057] Figure 23A It is a schematic diagram of the specific architecture of the holding structure in the image sensor driving module provided by a possible implementation manner of the present application;

[0058] Figure 23B It is a schematic diagram of the specific architecture of the holding structure in the image sensor driving module provided by a possible implementation manner of the present application;

[0059] Figure 24 It is a schematic diagram of the specific architecture of the holding structure in the image sensor driving module provided by a possible implementation manner of the present application;

[0060] Figure 25A It is a cross-sectional view of the image sensor driving module provided by a possible implementation manner of the present application;

[0061] Figure 25B Same as the Figure 25A shown implementation manner, the detailed structure of the first bearing area is marked in Figure 25B ;

[0062] Figure 26AIt is a cross-sectional view of an image sensor driving module provided by a possible implementation manner of the present application;

[0063] Figure 26B It is a cross-sectional view of an image sensor driving module provided by a possible implementation manner of the present application;

[0064] Figure 27A It is a cross-sectional view of an image sensor driving module provided by a possible implementation manner of the present application;

[0065] Figure 27B It is a cross-sectional view of an image sensor driving module provided by a possible implementation manner of the present application;

[0066] Figure 28A It is a cross-sectional view of an image sensor driving module provided by a possible implementation manner of the present application;

[0067] Figure 28B It is a cross-sectional view of an image sensor driving module provided by a possible implementation manner of the present application;

[0068] Figure 29A It is a cross-sectional view of an image sensor driving module provided by a possible implementation manner of the present application;

[0069] Figure 29B It is a cross-sectional view of an image sensor driving module provided by a possible implementation manner of the present application;

[0070] Figure 30A It is a cross-sectional view of an image sensor driving module provided by a possible implementation manner of the present application;

[0071] Figure 30B It is a cross-sectional view of an image sensor driving module provided by a possible implementation manner of the present application;

[0072] Figure 31A It is a cross-sectional view of an image sensor driving module provided by a possible implementation manner of the present application;

[0073] Figure 31B It is a cross-sectional view of an image sensor driving module provided by a possible implementation manner of the present application. Specific implementation manner

[0074] The following describes the present application in combination with the accompanying drawings in possible implementation manners of the present application.

[0075] Please refer to Figure 1 , Figure 1FIG. 0 is a schematic structural diagram of an electronic device 1000 provided by a possible implementation of the present application in some possible implementations. The electronic device may be an electronic product such as a mobile phone, a tablet computer, a laptop computer, a television, a vehicle-mounted device, a wearable device, a video surveillance device, etc. The wearable device may be a smart bracelet, a smart watch, a wireless earphone, an augmented reality (AR) glasses, an augmented reality helmet, a virtual reality (VR) glasses, a virtual reality helmet, etc. In the possible implementations of the present application, the electronic device is taken as an example of a mobile phone for illustration.

[0076] Please refer to Figure 1 and Figure 2 , Figure 2 is Figure 1 a schematic structural diagram of the electronic device 1000 shown in FIG. 0 from another angle. The electronic device 1000 includes a housing 100, a display screen 200, a front camera assembly 300, a rear camera assembly 400, a main board 500, a processor 600, a memory 700, and a battery 800. The display screen 200 is used to display images, and the display screen 200 may also integrate a touch function. The display screen 200 is installed on the housing 100. The housing 100 may include a frame 1001 and a rear cover 1002. The display screen 200 and the rear cover 1002 are respectively installed on opposite sides of the frame 1001. In this possible implementation, in the external space of the electronic device 1000, the space facing the display screen 200 is defined as the front of the electronic device 1000, and the space facing the rear cover 1002 is the rear of the electronic device 1000.

[0077] In some possible implementations, the front camera assembly 300 is located inside the housing 100 and below the display screen 200. The display screen 200 is provided with a front camera hole 2001, and the front camera assembly 300 collects light in front of the electronic device 1000 through the front camera hole 2001 to achieve shooting. The front camera assembly 300 may include a camera module described in the possible implementations hereinafter, or may include a camera module with other structures.

[0078] In some possible embodiments, the rear cover 1002 is provided with at least one rear camera hole 1003. The rear camera assembly 400 is located inside the housing 100. The rear camera assembly 400 collects light from behind the electronic device 1000 through at least one rear camera hole 1003 to achieve shooting. In the possible embodiments of the present application, "at least one" includes two cases: one and more than one. "More than" includes the number itself. The rear camera assembly 400 includes at least one camera module 4001, for example, it may include one or more of a standard camera module, a telephoto camera module, a wide-angle camera module, an ultra-telephoto camera module, and an ultra-wide-angle camera module. Exemplarily, the rear camera assembly 400 includes a standard camera, a wide-angle camera, and a periscope telephoto camera. The camera module 4001 of the rear camera assembly 400 may include the camera modules described in the possible embodiments hereinafter, or may include camera modules with other structures.

[0079] In some possible embodiments, the rear camera assembly 400 may further include a flash module 4002. The rear cover 1002 is provided with a flash hole 1004. The flash module 4002 is located inside the housing 100 and emits light through the flash hole 1004.

[0080] In some possible embodiments, the main board 500 is located inside the housing 100. The processor 600 and the memory 700 are fixed to the main board 500. The display screen 200, the front camera assembly 300, and the rear camera assembly 400 are coupled to the processor 600. The memory 700 is used to store computer program code. The computer program code includes computer instructions. The processor 600 is used to call the computer instructions to enable the electronic device 1000 to perform corresponding operations. For example, to make the display screen 200 display a target image, and to make the front camera assembly 300 and the rear camera assembly 400 collect the target image, etc. The battery 800 is electrically connected to the main board 500 and is used to supply power to the electronic device 1000. In some possible embodiments, the electronic device 1000 may further include one or more of functional modules such as an antenna module, a mobile communication module, a sensor module, a motor, a microphone module, and a speaker module. These functional modules may be electrically connected to the processor 600 to transmit signals.

[0081] The possible embodiments of the present application provide a camera module, and the camera module may be Figure 1 and Figure 2 the front camera assembly 300 or the rear camera assembly 400 in the embodiments shown. The camera module is electrically connected to the processor 600 in the electronic device. Specifically, the processor 600 is electrically connected to the image sensor in the camera module, and can drive the image sensor and process the image signal output by the image sensor.

[0082] Figure 3AThe following is a three-dimensional assembly diagram of a camera module 10 provided by an embodiment of the present application. Figure 3B The following is a three-dimensional cross-sectional view of a camera module 10 provided by an embodiment of the present application. Figure 4 and Figure 5 The following shows Figure 3A the three-dimensional exploded views of the camera module 10 in two directions provided. Refer to Figure 3A , Figure 3B , Figure 4 and Figure 5 , in an embodiment, the camera module 10 includes an image sensor driving module 2, a lens driving module 3, an image sensor 4, and a lens assembly 5. The lens driving module 3 and the image sensor driving module 2 form an optical component 80, and the image sensor driving module 2 is used to drive the image sensor 4 to move. The lens driving module 3 is used for optical focusing, optical image stabilization, aberration adjustment, etc. of the camera module 10.

[0083] In an embodiment, the image sensor 4 moves on a reference plane, and this reference plane can be coplanar or parallel to the photosensitive surface of the image sensor 4. This reference plane can be a plane perpendicular to the extending direction of the optical axis P. The optical axis P can be understood as the optical axis of the image sensor 4, can also be understood as the optical axis of the lens assembly 5, and can also be understood as the optical axis of the camera module 10. In the camera module, theoretically, the optical axes of the lens assembly 5 and the image sensor 4 can coincide. In the case of assembly errors or design tolerances, the optical axes of the lens assembly 5 and the image sensor 4 can also have relative offsets or tilts. However, whether they coincide or there are offset and tilt phenomena, the extending directions of the optical axes of the lens assembly 5 and the image sensor 4 are the same (the same extending direction can be understood as being basically the same direction, allowing a small range of relative tilts), and they can both be regarded as the optical axis of the camera module 10.

[0084] In an embodiment, the lens driving module 3 includes a housing 31 and a driving component 32. The housing 31 encloses to form an accommodation space, and the housing 31 is used for fixedly connecting with other functional modules (such as the image sensor driving module 2). The driving component 32 is received in the accommodation space of the housing 31, and the driving component 32 is used to drive the lens assembly 5 of the camera module 10 to move. Specifically, the driving component 32 of the lens driving module 3 is used to drive the lens assembly 5 to move or tilt axially (i.e., the direction in which the optical axis P extends), and can achieve optical image stabilization, optical focusing, aberration adjustment, etc. Specifically, the lens driving module 3 can drive the lens assembly 5 to move axially to achieve optical focusing of the camera module 10. The lens driving module 3 can also be used to compensate other optical parameters of the camera module 10, such as aberration, and the aberration can be compensated by driving at least part of the lenses in the lens assembly 5 to move by the lens driving module 3. As Figure 3BAs shown, in one embodiment, the driving component 32 includes a magnetic driving member 321 and a coil driving member 322. The coil driving member 322 is connected to the lens assembly 5, and the magnetic driving member 321 is connected to the housing 31. When the coil driving member 322 is powered on, the coil driving member 322 and the magnetic driving member 321 are coupled to generate an electromagnetic driving force to drive the lens assembly 5 to move. In the specific embodiment of the present application, the driving component 32 of the lens driving module 3 is shielded by the housing 31, and the driving component 32 of the lens driving module 3 does not participate in the driving of the image sensor driving module 2.

[0085] In this solution, the lens driving module 3 and the image sensor driving module 2 in the optical component 80 are two independent modular structures. The image sensor driving module 2 can be matched with different types of lens driving modules 3 to form different driving solutions. The lens driving module and the image sensor driving module have their own independent drives, and decoupling is achieved between them. The image sensor driving module 2 provided by the present application can form a variety of different optical image stabilization solutions with wide adaptability. During the assembly process of one embodiment, the image sensor 4 can be first fixed to the image sensor driving module 2, and then the lens driving module 3 can be fixed to the top surface of the image sensor driving module 2. Specifically, the lens driving module 3 and the image sensor driving module 2 can be fixedly connected by means of adhesive (adhesive layer 801). During the assembly process of another embodiment, the lens driving module 3 and the image sensor driving module 2 can also be fixedly connected as a whole to form the optical component 80, and then the image sensor 4 can be installed in this optical component 80. That is to say, the optical component 80 can be a modular structure independent of the image sensor 4 and the lens assembly 5. The assembly accuracy of the modular structure is easy to control, and the manufacturing cost is low. During the assembly of the optical component 80 with the image sensor 4 and the lens assembly 5, the assembly process can also be simplified, and the positioning accuracy of each optical element after assembly is high, which is beneficial to ensuring the optical stability of the camera module.

[0086] The camera module 10 includes a circuit board 9 for electrically connecting to a processor on the main board in the electronic device. The circuit board 9 can be a flexible circuit board. The circuit board 9 can be a part of the image sensor driving module 2, and the circuit board 9 is used to transmit the signals collected by the image sensor 4 to the processor. A driving circuit can also be provided on the circuit board 9, and the driving circuit is used to drive the image sensor driving module 2 to realize the movement of the image sensor 4.

[0087] Refer to Figure 4 and Figure 5, in a specific embodiment, the image sensor driving module 2 includes a first top surface S1 and a first bottom surface S2 which are oppositely arranged. The first bottom surface S2 is planar and is used to connect to the main board or the middle frame bracket inside the electronic device. The first top surface S1 has a frame-shaped structure. The image sensor driving module 2 includes a first bearing area R1, and the first bearing area R1 is located inside the opening S11 formed by the surrounding of the first top surface S1. The image sensor 4 is installed in the first bearing area R1 from this opening S11. An optical element 6, such as an IR filter, can also be installed in the first bearing area R1. The lens driving module 3 has an overall frame-shaped structure. The area surrounded by the lens driving module 3 is located on the light incident side of the first bearing area R1 of the image sensor driving module 2, that is, directly facing the first bearing area R1 along the optical axis direction. The opening S11 communicates the first bearing area R1 and the area surrounded by the lens driving module 3. The area surrounded by the lens driving module 3 is used to install the lens assembly 5. In one embodiment, part of the lens assembly 5 can be located inside the opening S11. In one embodiment, part of the lens assembly 5 can also extend into the first bearing area R1. The lens driving module 3 includes a second bottom surface S3 and a second top surface S4 which are oppositely arranged. The second bottom surface S3 is the outer surface of the bottom plate of the housing 31, and the second top surface S4 is the outer surface of the top plate of the housing 31. The second bottom surface S3 can be adhesively fixed to the first top surface S1 through an adhesive layer 801, or the second bottom surface S3 can also be fixed to the first top surface S1 through other connection methods, such as screw fixation, welding, etc.

[0088] In another embodiment provided by the present application, the camera module 10 may not be provided with a lens driving module, and only the image sensor driving module 2 is used to adjust the position of the image sensor 4 to achieve functions such as anti-shake or aberration compensation of the camera module 10, providing a camera module 10 with miniaturization and simple structure. When applied to a specific electronic device, it is beneficial to save the space and the board area of the electronic device.

[0089] Such as Figure 3BAs shown in the figure, an image sensor driving module 2 provided by an embodiment of the present application includes a fixed base 21, a driving unit 22, and a movable base 23. The driving unit 22 includes a fixed member 221 and a movable member 222 that can move relative to each other. For example, the fixed member 221 is a magnet, and the movable member 222 is a coil. When the movable member 222 is energized, it interacts with the fixed member 221 to generate a driving force. The fixed base 21 is used to carry the fixed member 221, and the movable base 23 is used to carry the movable member 222 and the image sensor 4. The fixed base 21 includes a fixed platform 211 and a fixed frame 212. The fixed platform 211 includes an opposite inner surface S0 and a first bottom surface S2. The fixed frame 212 is connected to the fixed platform 211 and protrudes from the inner surface S0. The fixed member 221 is fixed to the fixed base 21, and an opening S11 is formed on a side of the fixed frame 212 away from the inner surface. A gap may be provided between the movable base 23 and the inner surface S0 of the fixed platform 211, that is, the two are suspended and spaced apart, or the movable base 23 and the inner surface S0 of the fixed platform 211 may be in contact. The movable base 23 includes a carrying portion 231, a fixing portion 232, and a connecting portion 233. The connecting portion 233 is used to achieve mechanical and electrical connections between the carrying portion 231 and the fixing portion 232. The fixing portion 232 is connected to the fixed base 21, and the fixing portion 232 and the fixed base 21 are relatively fixedly connected. The carrying portion 231 includes a second carrying area R2 and a first carrying area R1. The second carrying area R2 is located outside the first carrying area R1. The second carrying area R2 is used to carry the movable member 222, and the first carrying area R1 is used to carry the image sensor 4. The opening S11 is used to mount the image sensor 4 to the first carrying area R1.

[0090] In the present application, the image sensor driving module 2 is designed as a module architecture independent of the image sensor 4. After the image sensor driving module 2 is assembled as a whole, the image sensor 4 is assembled to the image sensor driving module 2 through the position of the opening S11 of the image sensor driving module 2. The decoupling of the image sensor driving module 2 and the image sensor 4 in the present application is beneficial to controlling the manufacturing precision of the image sensor driving module 2. Since the image sensor 4 is not assembled in the image sensor driving module 2 during the manufacturing and assembly process of the image sensor driving module 2, the manufacturing process of the image sensor driving module 2 has no influence on the performance of the image sensor 4. A dedicated image sensor for separate testing can also be used during the testing process of the image sensor driving module 2. When the image sensor driving module 2 is applied in a camera module, it can ensure the excellent performance of the image sensor 4 in the camera module, improve the manufacturing yield of the camera module, and reduce costs.

[0091] A camera module in the prior art includes a first driving component for driving an image sensor to move and a second driving component for achieving focusing of the camera module. However, generally, the first driving component and the second driving component share some structures in the camera module. For example, the first driving component includes a magnet and a first coil, and a driving force for driving the image sensor to move is generated by the interaction between the magnet and the first coil. The second driving component includes a magnet and a second coil, and the lens assembly is driven to move through the interaction between the magnet and the second coil to achieve focusing. The first driving component and the second driving component share the magnet, and the same magnet is used in combination with both the first coil and the second coil, which not only has a high design difficulty but also a high manufacturing difficulty.

[0092] The first driving component in the prior art includes a housing and a movable circuit board. The movable circuit board is provided with a first coil, electronic devices, and an image sensor. During the process of manufacturing the movable circuit board, the first coil, electronic devices, and the image sensor are directly assembled onto the board, and then the movable circuit board is installed in the housing. During the process of manufacturing the first driving component, the image sensor needs to be attached to the circuit board. For the camera module obtained in this way, the image sensor is coupled with the first driving component and the second driving component. For the camera module, if some components are unqualified or damaged, the whole needs to be replaced, which is not environmentally friendly.

[0093] In this application, by designing an independent image sensor driving module and designing an opening S11 for assembling the image sensor, not only can the decoupling between the image sensor driving module and the image sensor be achieved, but also the decoupling between the image sensor driving module and the lens driving module can be achieved. In the decoupled state, the R & D and design difficulty of the image sensor driving module is lower, and the manufacturing process difficulty is also reduced. This application uses a modular design concept to split the camera module into multiple modules. Even if some components have quality problems, only the module where the faulty component is located needs to be repaired or replaced, and there is no need to replace the entire camera module. Therefore, this application has the advantage of environmental protection, and the cost loss caused by the component yield rate of the whole module is also small.

[0094] The detailed structure of a specific image sensor driving module provided by this application is described as follows. Figure 6 Shown is a three-dimensional assembly diagram of an image sensor driving module 2 provided by an embodiment of this application. Figure 7 and Figure 8 Shown is Figure 6 the three-dimensional exploded views of the image sensor driving module 2 in two directions provided. Figure 9 Shown is Figure 6 the sectional view of the image sensor driving module 2 provided. As Figure 9As shown in the figure, in this embodiment, the fixed base 21 is equivalent to the housing of the image sensor driving module 2. The fixed frame 212 of the fixed base 21 includes a side frame 2122 and a top plate 2121. The top plate 2121 is disposed opposite to the inner surface S0 of the fixed platform 211. The side frame 2122 is connected between the top plate 2121 and the fixed platform 211, and forms an enclosed space 2120 with the top plate 2121 and the fixed platform 211. The driving unit 22, the connecting portion 233, and the second bearing area R2 are located in the enclosed space 2120. The opening S11 is formed by surrounding the top plate 2121. Specifically, the top plate is on the side opposite to the fixed platform 211 and together with the side frame 2122 and the fixed platform 211 forms an enclosed space 2120. The second bearing area R2 of the movable seat 23, the connecting portion 233, and the driving unit 22 are all received in this enclosed space 2120. In this way, the fixed base 21 protects the driving unit 22 and the circuit part on the movable seat 23. Moreover, the top plate 2121 can also be used to assemble other driving units of the camera module. In a possible implementation, the top plate 2121 is made of a rigid material. The top plate 2121 includes a first top surface S1. The first top surface S1 is the surface of the top plate 2121 away from the fixed platform 211. The first top surface S1 is used to mount the lens driving module in the camera module. The support force of the top plate 2121 made of a rigid material is more stable, which can more accurately define the installation position of the lens driving module, and is beneficial to the driving accuracy of the lens driving module of the camera module.

[0095] Figure 6 The driving unit in it is inside the fixed base 21 and cannot be seen because it is blocked by the fixed base 21. The fixed base 21 can be used as an installation carrier, can also protect the driving unit 22 and the movable seat 23, and the fixed base 21 can also be used as a structure for connecting the image sensor driving module 2 and other devices. For example, if the image sensor driving module 2 is installed on the circuit board in the electronic device, it can be realized through the fixed connection between the fixed base 21 and the circuit board.

[0096] Refer to Figure 7 、 Figure 8 and Figure 9 , in an embodiment, the fixed platform 211 is a flat structure. The fixed platform 211 is used to contact part of the movable seat 23. The inner surface of the fixed platform 211 can be a flat structure. The inner surface of the fixed platform 211 can be perpendicular to the optical axis direction of the image sensor 4. The inner surface of the fixed platform 211 can be parallel to the photosensitive surface of the image sensor 4. The outer surface of the fixed platform 211 is the first bottom surface S2 of the image sensor driving module 2 (such as Figure 5As shown in the figure. In one embodiment, the fixed platform 211 is made of a metal material, or the fixed platform 211 has a magnetic conductive material, and the fixed platform 211 can be adsorbed by the magnetic attraction force of the magnetic element. The fixed platform 211 is used to contact a part of the structure on the movable seat 23 that drives the image sensor 4 to move. The movable seat 23 drives the image sensor 4 to move on the fixed platform 211, and during the movement, the contact surface between the fixed platform 211 and the movable seat 23 remains in contact. The fixed platform 211 has a heat conductive material and can be used as a heat dissipation structure to conduct the heat generated by the image sensor and other electronic devices on the movable seat 23.

[0097] Specifically, the fixed platform 211 includes a central area 2111, a connection area 2112, and an edge area 2113. The central area 2111, the connection area 2112, and the edge area 2113 are coplanar. The connection area 2112 is disposed around the periphery of the central area 2111 and is connected between the edge area 2113 and the central area 2111. As Figure 7 shown, the fixed platform 211 can be an integral flat plate-like structure. The dashed box therein schematically represents the separation between the central area 2111, the connection area 2112, and the edge area 2113. Specifically, the separation between these three parts needs to be defined according to their functions, which are described in detail as follows: The central area 2111 is used to contact a part of the area of the movable seat 23. In one embodiment, the part of the structure on the movable seat 23 that bears the image sensor 4 is in a frame shape (or ring shape). A part of the area of the central area 2111 contacts the movable seat 23, and a part of the area of the central area 2111 is disposed opposite to the image sensor 4, and there is a gap between the central area 2111 and the image sensor 4. The edge area 2113 is used to connect the fixed frame 212.

[0098] In one embodiment, the fixed frame 212 includes a top plate 2121 and a side frame 2122. The top plate 2121 has a rectangular frame-like structure. The opening S11 surrounded by the top plate 2121 is used to install or accommodate an optical element (such as an optical lens) or serve as a light passing hole. The size of the outer contour of the opening S11 surrounded by the top plate 2121 is larger than the outer contour of the image sensor, and it is convenient to install the image sensor onto the movable seat 23 through the position of this opening S11.

[0099] The side frame 2122 is connected to the outer edge of the top plate 2121. The side frame 2122 and the top plate 2121 jointly enclose an enclosed space 2120. In this embodiment, the fixing member 221 of the driving unit 22 is fixed inside the top plate 2121 and is located in this enclosed space 2120. In this embodiment, the fixing member 221 is a magnetic driving member. The fixing member 221 includes four strip-shaped magnets, and the four strip-shaped magnets are arranged in pairs opposite to each other. The top plate 2121 includes four side frames, and each side frame is installed with one strip-shaped magnet.

[0100] In one embodiment, the fixing frame 212 is provided with a magnetic conductive structure 2123. Figure 7 In the illustrated embodiment, the magnetic conductive structure 2123 is disposed on the inner surface of the top plate 2121. In other embodiments, the magnetic conductive structure 2123 may also be disposed on the outer surface of the top plate 2121, or may be embedded in the intermediate layer of the top plate 2121. The fixing member 221 is installed inside the magnetic conductive structure 2123. The magnetic conductive structure 2123 is used to achieve magnetic shielding of the image sensor driving module 2. The magnetic conductive structure 2123 is made of a material with magnetic shielding performance. The shape of the magnetic conductive structure 2123 may be the same as that of the top plate 2121. The magnetic conductive structure 2123 may also be disposed on both the top plate 2121 and the side frame 2122 at the same time, that is, the magnetic conductive structure 2123 constitutes a framework surrounding the space 2120, forming an all-round shielding of the magnetic environment inside the image sensor driving module 2. In one embodiment, the magnetic conductive structure 2123 may be a plate-like structure, such as a metal plate, and the metal plate may be fixed to the inner surface of the top plate 2121. In other embodiments, the magnetic conductive structure 2123 may also be a layer structure coated on the surface of the top plate, for example, a magnetic conductive coating formed on the surface of the top plate 2121 by spraying or electroplating. The magnetic conductive structure 2123 may also be a mesh structure, which has electromagnetic shielding function and may also have grounding function. By providing the magnetic conductive structure 2123 inside the fixing frame 212 in the present application, magnetic shielding of the image sensor driving module 2 can be achieved. When the driving unit 22 in the image sensor driving module 2 is in a magnetic driving mode, the magnetic conductive structure 2123 can ensure the stability of the driving signal of the driving unit 22, thereby improving the stability of the movement of the image sensor 4. Moreover, the grounding setting of the magnetic conductive structure 2123 can protect the electronic devices inside the image sensor driving module 2, for example, prevent electrostatic damage to the electronic devices.

[0101] In one embodiment, the fixing frame 212 may be an integrally formed structure, and the top plate 2121, the side frame 2122 and the magnetic conductive structure 2123 are made into an integrated structure by a two-shot injection molding process.

[0102] As Figure 8 shown, a positioning structure 2125 is prominently provided on the inner surface of the top plate 2121 of the fixing frame 212. The positioning structure 2125 protrudes from the inner surface of the top plate 2121 into the surrounding space 2120. The positioning structure 2125 is cylindrical. The top plate 2121 is a rectangular structure. The number of the positioning structures 2125 is four and they are distributed at the four corners of the top plate 2121. The positioning structure 2125 is used to cooperate with the corresponding hole structure on the movable seat 23 to achieve assembly positioning between the fixed seat 21 and the movable seat 23. Through the cooperation of the positioning structure 2125 and the hole structure on the movable seat 23, precise alignment between the movable member 222 and the fixing member 221 of the driving unit 22 during the assembly process can be achieved.

[0103] The driving unit 22 serves as the power source of the image sensor driving module and is used to generate a driving force that can drive the movable seat 23 to move relative to the fixed seat 21. In one implementation, the driving unit 22 is a magnetic structure motor, such as a VCM (Voice Coil Motor), and the fixed member 221 and the movable member 222 are a magnetic driving member and a coil driving member respectively. Figure 7 In the illustrated implementation, the fixed member 221 is a magnetic driving member and the movable member 222 is a coil driving member. In another specific solution, the fixed member 221 is a coil driving member and the movable member 222 is a magnetic driving member. In other implementations, the driving unit 22 can also be other types of drives, such as: SMA (shape memory alloy, shape memory alloy motor), PIEZO (PiezoMotor, piezoelectric motor). In the embodiments of the present application, the movable member 222 and the fixed member 221 of the driving unit 22 can be two independent components (such as the coil and the magnet in a magnetic structure motor), and generate a driving force to drive the image sensor to move under the energized state; in the embodiments of the present application, the movable member 222 and the fixed member 221 of the driving unit 22 can also be an integrated structure, such as a shape memory alloy motor, which can be driven by changing the size of the material through electric heating.

[0104] In one implementation, no electrical connection parts or electronic devices are provided on the fixed seat 21, and all the circuit traces, electronic devices, and components that need to be energized in the camera module 10 are provided on the movable seat 23. The movable seat 23 is equivalent to the main board (or circuit board structure) in the camera module 10 and is used to carry all the devices that need to be powered or transmit signals. Such a solution is beneficial to the miniaturized design of the camera module 10 and is also beneficial to optimizing the signal transmission path and improving signal stability. Especially when the movable seat 23 is an integrated circuit board structure, the traces for transmitting signals or current only need to be arranged inside the integrated circuit board and do not need to be transmitted between different circuit boards or FPCs. Such a signal and current transmission process can ensure signal stability, reduce signal loss, and is also easy to achieve signal isolation to prevent the quality of the image signal from being affected by signal interference.

[0105] Refer to Figure 7 、 Figure 8 and Figure 9, In one embodiment, the movable seat 23 includes a bearing portion 231, a fixing portion 232 and a connecting portion 233. The connecting portion 233 is used to achieve mechanical and electrical connections between the bearing portion 231 and the fixing portion 232. The mechanical connection refers to the connection relationship in terms of structural form, which may include direct connection or indirect connection. The direct connection can also be an integrated architecture. For example, two parts of an integrated circuit board structure can be understood as a direct connection. The indirect connection refers to the connection through other connection structures. For example, two board structures are connected through solder balls. The electrical connection refers to the connection of signal traces, and image signals, electrical signals or other signals can be transmitted through the electrical connection relationship. For example, electrical connection is achieved through the traces in the circuit board, or through FPC electrical connection, etc. The fixing portion 232 is connected to the fixed seat 21. Specifically, the fixing portion 232 can be connected between the fixed platform 211 and the fixed frame 212. In other embodiments, the fixing portion 232 can also be connected to the fixed frame 212, and the fixing portion 232 and the fixed platform 211 are separated by at least a part of the fixed frame 212.

[0106] The movable seat 23 is provided with a hole structure 235. The hole structure 235 is distributed at the corners of the movable seat 23. The hole structure 235 is used to cooperate with the positioning structure 2125 of the fixed seat 21 to achieve the positioning during the assembly process between the movable seat 23 and the fixed seat 21, so as to ensure the positioning accuracy between the fixing member 221 and the movable member 222 of the driving unit 22. The hole structure 235 is distributed between the bearing portion 231 and the connecting portion 233 and is located outside the four corners of the bearing portion 231.

[0107] The movable member 222 of the driving unit 22 is arranged on the bearing portion 231. The bearing portion 231 is also used for assembling the image sensor 4. Specifically, after the image sensor driving module 2 is assembled, the image sensor 4 is placed on the bearing portion 231 from the opening S11 by using an assembling device, such as a chip mounter. During the assembling process, the image sensor 4 is fixed to the bearing portion 231 and electrically connected to the bearing portion 231. The image sensor 4 can be fixed to the bearing portion 231 by adhesive, and then the circuit in the bearing portion 231 of the image sensor 4 is electrically connected by wire bonding. In other embodiments, the image sensor 4 can also be directly connected to the pads on the bearing portion 231 through solder balls, and the electrical connection between the circuit in the image sensor 4 and the bearing portion 231 is achieved through the solder balls and the pads.

[0108] Specifically, refer to Figure 7 、 Figure 8 、 Figure 9 and Figure 10A, the fixing part 232 of the movable seat 23 is assembled between the edge area 2113 of the fixed platform 211 and the side frame 2122 of the fixed frame 212. The outer edge of the fixing part 232 is connected to the circuit board 9. The circuit board 9 can be an integral structure with the fixing part 232, or the circuit board 9 can be connected to the fixing part 232 by plugging. Specifically, a male connector can be provided on the fixing part 232, and a female connector can be provided on the circuit board 9, and the transmission of electrical signals is achieved through the cooperation between the male connector and the female connector. The circuit board 9 is used to be electrically connected to the processor in the electronic device to transmit the signals of the image sensor 4 to the processor. The bearing part 231 and the fixed platform 211 are stacked, and a receiving space 2310 is formed by surrounding the central area position of the bearing part 231. This receiving space 2310 is used to receive the image sensor 4. As Figure 10A shown, the bottom surface of the image sensor 4 is fixedly connected to the movable seat 23 (specifically connected to the reinforcing plate structure 23B), and there is a gap (or spaced space) between the side surface of the image sensor 4 and the movable seat 23, that is, the side surface of the image sensor 4 is not connected to any other structure. In other embodiments, a medium, such as foam, can be filled in the spaced space between the side surface of the image sensor 4 and the movable seat 23. In other embodiments, the receiving space 2310 can also be used to receive other optical elements 6 (such as filters or lenses) or as a light passing channel (that is, no optical element is placed, but it is located on the light incident side of the image sensor 4). As Figure 7 shown, electronic devices 7 are provided on the surface of the bearing part 231 facing away from the fixed platform 211. The electronic devices 7 are distributed on the opposite sides of the receiving space 2310 on the bearing part 231. In order to ensure the structural symmetry of the movable seat 23, the electronic devices 7 can be symmetrically distributed on both sides of the receiving space 2310, which is beneficial to ensuring the smooth movement of the movable seat 23. In one embodiment, the electronic devices 7 and the movable part 222 of the driving unit 22 are installed on the same surface of the bearing part 231, that is, installed on the surface of the bearing part 231 facing the top plate 2121 of the fixed frame 212. In this way, the electronic devices 7 and the movable part 222 on the bearing part 231 are both received in the surrounding space 2120 within the fixed frame 212 (as Figure 8 and Figure 10A shown).

[0109] As Figure 9As shown, the movable member 222 is fixed to the side of the second bearing area R2 of the bearing part 231 facing away from the fixed platform 211, and the movable member 222 faces the top plate 2121. Specifically, in this embodiment, the movable member 222 of the driving unit 22 is a coil driving member. The movable member 222 includes four coils arranged in pairs opposite to each other. All the coils are arranged in one-to-one correspondence with four magnets fixed on the top plate 2121. The coils are arranged on the bearing part 231, and the bearing part 231 is provided with circuit traces inside, which is easy to realize the layout of the power supply lines for the coils. In one embodiment, refer to Figure 7 , Figure 8 , Figure 9 and Figure 10A , a support structure 8 is provided on the bearing part 231, and the movable member 222 surrounds the support structure 8, that is, the support structure 8 is arranged inside each coil. The support structure 8 is a rigid structure and protrudes from the surface of the bearing part 231. It can be understood that the coils are arranged around the support structure 8, and the support structure 8 can protect the coils from being scratched by other structures.

[0110] In this application, the driving unit 22 drives the bearing part 231 to move, while the position of the fixed part 232 remains unchanged. In this way, during the movement of the bearing part 231, the connecting part 233 undergoes elastic deformation. The connecting part 233 is connected between the fixed part 232 and the bearing part 231. In terms of mechanical connection, the connecting part 233 is equivalent to the structure of a spring or a spring sheet. Circuit traces for transmitting signals and current are also provided on the connecting part 233. Through the circuit traces, electrical connection between the bearing part 231 and the fixed part 232 is achieved, that is, the signals on the image sensor 4 can be transmitted to the outside of the image sensor driving module 2. The connecting part 233 is an elongated strip-shaped elastic arm structure connected between the fixed part 232 and the bearing part 231. Specifically, a plurality of strip-shaped elastic arms, that is, the connecting part 233, are formed by removing materials from the movable seat 23. The connecting part 233 has the ability of elastic deformation due to the shape of the material itself. During the process of the bearing part 231 moving relative to the fixed part 232 under the driving force of the driving unit 22, the connecting part 233 can undergo elastic deformation to maintain the mechanical connection and electrical connection between the fixed part 232 and the bearing part 231. In the embodiment of this application, the driving unit 22 can drive the image sensor 4 to move in the X-axis direction and the Y-axis direction. Both the X-axis direction and the Y-axis direction are perpendicular to the optical axis direction of the image sensor 4. When the optical axis direction is regarded as the Z-axis, the X-axis direction, the Y-axis direction and the optical axis direction can form a three-axis rectangular coordinate system, that is, the driving unit 22 drives the image sensor 4 on a plane perpendicular to the optical axis and moves along two mutually perpendicular X-axis and Y-axis directions. During the movement of the bearing part 231, the connecting part 233 generates elastic deformation to ensure that the bearing part 231 can move relative to the fixed part 232.

[0111] In one implementation, the movable seat 23 can be an elastic circuit board structure. The bearing portion 231 and the fixing portion 232 are not elastic, and the connecting portion 233 is elastic. Refer to Figure 10A , Figure 10A is Figure 9 a partial enlarged schematic view of. The connecting portion 233 includes a wire layer 2333 and a metal layer 2334. The wire layer 2333 is used to set the circuit board traces to achieve electrical connection between the bearing portion 231 and the fixing portion 232. The metal layer 2334 can be a metal flexure structure. The metal layer 2334 is used to provide elastic deformation of the connecting portion 233. The presence of the metal layer 2334 ensures the flexibility and strength of the connecting portion 233 and improves the ability of the connecting portion 233 to elastically deform. The wire layer 2333 and the metal layer 2334 can be isolated by an insulating layer ( Figure 10A the insulating layer is omitted in

[0112] Refer to Figure 7 , Figure 8 , Figure 9 and Figure 10A , the movable seat 23 includes an integral circuit board structure 23A and a reinforcing plate structure 23B. The integral circuit board structure 23A includes a fixing portion 232, a connecting portion 233, and a part of the bearing portion (referred to as the first plate 231A). Moreover, the integral circuit board structure 23A is a structure integrally formed by a circuit board manufacturing process, in which a wire layer 2333 and a metal layer 2334 are provided. The metal layer 2334 is used to ensure the strength and elastic deformation ability of the connecting portion 233. The reinforcing plate structure 23B is a part of the bearing portion (referred to as the second plate). The reinforcing plate structure 23B is connected to the bottom surface of a part of the bearing portion (the first plate 231A) of the integral circuit board structure 23A.

[0113] The reinforcing plate structure 23B is used to contact the fixed platform 211, to form a friction interface X, and to conduct heat dissipation. Generally speaking, in this embodiment, the bearing portion 231 includes a first plate 231A and a second plate (reinforcing plate structure 23B). The outer edge of the first plate 231A and the connecting portion 233 are interconnected into an integral structure. The inner edge of the first plate 231A surrounds and forms a receiving space 2310. The first plate 231A is used to bear the movable member 222. The second plate (reinforcing plate structure 23B) includes a first portion 23B1 and a second portion 23B2. The first portion 23B1 is stacked with the first plate 231A. The second portion 23B2 is located at the bottom of the receiving space 2310. The second portion 23B2 is used to bear the image sensor 4 so that the image sensor 4 is received in the receiving space 2310. The second plate (reinforcing plate structure 23B) contacts the fixed platform 211 of the fixed seat 21. The first portion 23B1 of the second plate (reinforcing plate structure 23B) and the first plate 231A are connected by an adhesive layer. The second portion 23B2, the first portion 23B1 is stacked with the first plate 231A. The second portion 23B2 is located between the receiving space and the image sensor 4 and is connected by an adhesive layer. As Figure 9 shown, the image sensor 4 and the first plate 231A are electrically connected and are electrically connected to the first plate 231A through a signal line 41 (such as a gold wire). The position of the signal line 41 is provided with an adhesive structure 61. This part of the adhesive structure 61 is used to fix an optical element 6, such as an IR filter. On the one hand, the adhesive structure 61 can fixedly connect the optical element 6. On the other hand, the adhesive structure 61 can also fix the signal line 41 to ensure the stable reliability of the electrical connection between the image sensor 4 and the wire layer 2333 of the bearing portion 231. This solution transmits the signal of the image sensor through the first plate, the connecting portion and the fixing portion.

[0114] In the direction of the optical axis, the part of the second plate (reinforcing plate structure 23B) facing the opening S11 and the part of the first plate 231A facing the opening S11 together constitute the first bearing area R1 of the bearing portion 231 (as Figure 9 the part marked as R1 between the two dotted lines represents the first bearing area R1 of the bearing portion 231). The part of the first plate 231A facing the top plate 2121 is the second bearing area R2 of the bearing portion 231 (as Figure 9The portion labeled R2 between the two dashed lines represents the second bearing area R2 of the bearing portion 231. In the image sensor driving module 2 provided by this solution, the opening S11 faces the first bearing area R1. During the process of assembling the image sensor 4, the image sensor 4 is directly fixed by the suction force of the suction cup. By moving the suction cup along the optical axis direction, the image sensor 4 is placed in the first bearing area R1, and then the image sensor 4 and the bearing portion 231 are fixedly connected, making the process of assembling the image sensor 4 easier, improving the positioning accuracy of the image sensor 4, and ensuring the imaging quality of the camera module.

[0115] The fact that the opening S11 faces the first bearing area R1 can be understood as follows: in the extending direction of the optical axis, the vertical projection of the opening S11 on the movable seat 23 and the first bearing area R1 have an overlapping relationship; it can also be understood as: the central position of the vertical projection of the opening S11 on the movable seat 23 coincides with the central position of the first bearing area R1; it can also be understood as: the edge of the vertical projection of the opening S11 on the movable seat 23 is located outside the first bearing area R1, or the edge of the vertical projection of the opening S11 on the movable seat 23 coincides with the edge of the first bearing area R1.

[0116] In other embodiments, the opening S11 can also be arranged in a dislocation manner with respect to the first bearing area R1, which can be understood as that part of the area of the first bearing area R1 faces the opening S11, while part of the first bearing area R1 does not face the opening S11. In this embodiment, during the process of assembling the image sensor, the image sensor can be fixed by the suction cup, and the image sensor is placed in the area corresponding to the opening S11 by moving it along the optical axis direction, and then the suction cup is moved along the direction perpendicular to the optical axis to transport the image sensor to the first bearing area.

[0117] Figure 10B It is a partial enlarged view of the cross-sectional view of the image sensor driving module provided by a possible embodiment of the present application. Refer to Figure 10B , there is a gap G between the inner surface S0 of the movable seat 23 and the fixed platform 211, which can be understood as: the movable seat 23 and the inner surface S0 of the fixed platform 211 are spaced apart in a suspended manner.

[0118] Refer to Figure 9 and Figure 10A, the bearing part 231 contacts the fixed platform 211 of the fixed seat 21, and a friction interface X is formed at the contact position between the two. The friction coefficient of the friction interface X is less than 0.3. The friction interface X can be the contact surface between the bearing part 231 and the fixed seat 21 (i.e., the friction interface form is a surface). The friction interface X can also be a medium between the bearing part 231 and the fixed seat 21, such as lubricating oil (i.e., the friction interface form is grease or paste). The friction interface X can also be a layer structure between the bearing part 231 and the fixed seat 21. For example, a friction interface X is formed by arranging a super-slippery material layer between the bearing part 231 and the fixed seat 21 (i.e., the friction interface form is a three-dimensional layer structure). Generally speaking, the relationship between the bearing part 231 and the fixed platform 211 is a sliding friction relationship. A low friction coefficient can be obtained at the friction interface X by setting a solid structure layer, a grease or paste lubricating layer, or a surface treatment method. By limiting the friction coefficient of the sliding friction between the bearing part 231 and the fixed platform 211, the present application can ensure the smooth movement of the image sensor 4 on the basis of limiting the moving plane of the image sensor 4, reduce the friction resistance during the movement of the image sensor 4, and improve the efficiency of driving the image sensor 4 to move.

[0119] In one implementation, at the position of the friction interface X, the bearing part 231 and / or the fixed platform 211 of the fixed seat 21 includes a super-slippery material layer. The super-slippery material layer is a solid structure, and the friction coefficient of the friction interface X is realized to be less than 0.3 through the super-slippery material layer. In the first case, refer to Figure 11A , only the surface of the bearing part 231 is provided with a super-slippery material layer M1. The super-slippery material layer M1 on the surface of the bearing part 231 contacts the surface of the fixed platform 211 of the fixed seat 21, forming a friction interface X and realizing that the friction coefficient of the friction interface X is less than 0.3. This solution does not require a super-slippery material layer to be provided on the fixed seat 21, which is beneficial to saving super-slippery materials and reducing costs. In the second case, refer to Figure 11B , only the surface of the fixed platform 211 of the fixed seat 21 is provided with a super-slippery material layer M2. The area of the super-slippery material layer M2 provided on the fixed platform 211 of the fixed seat 21 needs to be larger than the area of the part of the bearing part 231 that contacts the fixed platform 211, because the bearing part 231 needs to slide on the super-slippery material layer M2. The super-slippery material layer M2 set in this solution needs to consider the area covered during the movement of the bearing part. Since the fixed platform 211 of the fixed seat 21 is a simple flat plate structure and no circuit architecture is provided thereon, setting the super-slippery material layer M2 on the fixed platform 211 has the advantage of being easy to manufacture. In the third case, refer to Figure 11C, super-slippery material layers are provided on the surfaces of the bearing portion 231 and the fixed platform 211 of the fixed seat 21. That is, a super-slippery material layer M1 is provided on the surface of the bearing portion 231, and a super-slippery material layer M2 is provided on the surface of the fixed platform 211. The super-slippery material layer M1 and the super-slippery material layer M2 are in contact, and the area of the super-slippery material layer M2 is larger than the area of the super-slippery material layer M1. This solution combines the first case and the second case to form a friction interface X between the super-slippery material layer M1 and the super-slippery material layer M2. The friction coefficient of the friction interface X provided by this solution can be smaller. The combination between the super-slippery material layer of the solid state structure and the bearing portion 231 and the fixed platform 211 is easier to achieve. For example, it can be directly connected and fixed through an adhesive layer, and has the advantage of being simple and easy in the assembly process.

[0120] Figure 11A , Figure 11B and Figure 11C In the embodiments shown, the super-slippery material layer M1 and the super-slippery material layer M2 can be coating or plating structures provided on the surfaces of the bearing portion 231 and the fixed platform 211, that is, formed by physical spraying or electroplating processes. The super-slippery material layer M1 and the super-slippery material layer M2 can also be separate sheet-like structures. For example, the super-slippery material layer M1 and the super-slippery material layer M2 are micro-nano structures (nano materials), and are connected to the surfaces of the bearing portion 231 and the fixed platform 211 through manufacturing processes such as pasting and physical pressing.

[0121] In one embodiment, referring to Figure 12 , at the position of the friction interface X, a lubricating layer M3 is provided between the bearing portion 231 and the fixed platform 211 of the fixed seat 21. The lubricating layer M3 is in an oil-like, grease-like or paste-like structure, and the friction coefficient of the friction interface X is made less than 0.3 through the lubricating layer M3. This solution realizes the friction interface X with a low friction coefficient by providing a lubricating layer M3 with an oil-like, grease-like or paste-like structure between the bearing portion 231 and the fixed platform 211 of the fixed seat 21. Since the form of the lubricating layer M3 is not fixed, the lubricating layer M3 is added at the contact surface between the bearing portion 231 and the fixed platform 211 of the fixed seat 21, and the lubricating layer M3 can be made to have a smaller size, which is beneficial to realizing the miniaturization in the optical axis direction of the camera module. The design of the lubricating layer M3 is also beneficial to ensuring the flatness of the contact surface. It can be understood that the problem of flatness can be compensated through the lubricating layer M3 to avoid vibration or inclination in the optical axis direction during the movement of the image sensor 4.

[0122] In one embodiment, referring to Figure 13, no super-slippery material layer or lubricating oil is provided between the bearing part 231 and the fixing platform 211 of the fixing seat 21. In this embodiment, the manufacturing process of surface treatment on the contacting surfaces between the bearing part 231 and the fixing platform 211 of the fixing seat 21 is adopted to make the friction coefficient of the friction interface X less than 0.3. The surface treatment methods can be: surface modification techniques, such as polishing; surface alloying techniques, such as carburizing and nitriding; surface conversion film (by chemical methods, enabling the added materials to react with the substrate to form a conversion film) techniques, etc. The surface treatment methods constitute the friction interface X, without the need to add a super-slippery material layer or a lubricating layer, and a smaller size in the optical axis direction can be obtained.

[0123] In other embodiments, a solid super-slippery material layer, grease or paste-like lubricating oil can also be used in combination in the same embodiment, or the solid super-slippery material layer and the surface obtained by the surface treatment manufacturing process can be used in the same embodiment, or the grease or paste-like lubricating oil and the surface obtained by the surface treatment manufacturing process can be used in the same embodiment.

[0124] In this application, by setting the friction coefficient of the friction interface X on the contacting surface between the bearing part 231 and the fixing seat 21, a low-friction coefficient sliding connection between the bearing part 231 and the fixing seat 21 is achieved. During the process of driving the bearing part 231 of the movable seat 23 to move, a friction interface X with a low friction coefficient such as a super-slippery material or a lubricating layer can be used to achieve flexible driving of the image sensor 4, and at the same time, ensure the axial position stability of the image sensor 4 during movement, without phenomena such as axial displacement, vibration or tilt. The contact between the bearing part 231 and the fixing seat 21 is also beneficial for heat conduction. The circuits, coil driving components and the image sensor on the bearing part 231 will generate heat during operation. In the embodiments of this application, heat conduction can be carried out through the contact between the bearing part 231 and the fixing seat 21. The friction interface X includes materials with heat conduction performance. The bearing part 231 can be a heat-conducting material, and the fixing platform 211 of the fixing seat 21 can also be a heat-conducting material. The heat conduction coefficient of the friction interface X is greater than 0.5 W / m·K. This solution is beneficial for ensuring the performance of the image sensor and improving the quality of the image signal by limiting the heat conduction coefficient of the friction interface.

[0125] In a camera module, if the image sensor moving stage is suspended relative to the bottom plate of the module, the space between the moving stage and the bottom plate not only increases the size of the camera module in the optical axis direction, but also easily causes the inclination of the moving stage and the vibration in the optical axis direction, resulting in a decrease in imaging quality. Moreover, the air thermal resistance is relatively large, and the heat of the image sensor and the driving circuit is not easily dissipated, which will cause the junction temperature of the image sensor to be too high (for example, higher than 70 degrees, and even up to 90 degrees), resulting in excessive imaging noise of the image sensor and affecting the imaging quality. In an embodiment of the present application, through the contact between the bearing part 231 and the fixed platform 211, the smooth movement of the image sensor 4 can be ensured, and the movement track of the image sensor 4 is limited to a fixed (stable) plane (for example, a plane perpendicular to the optical axis), avoiding axial vibration or inclination of the image sensor 4 during movement, and ensuring the quality and stability of the image data obtained by the image sensor 4. Moreover, the present application can also reduce the thermal resistance. The heat on the bearing part can be better conducted to one side of the outer surface of the fixed seat through the contact relationship between the bearing part and the fixed part, improving the heat conduction ability of the image sensor driving module 2, optimizing the heat dissipation efficiency of the image sensor 4 and the driving unit 22, and avoiding the decrease in imaging quality caused by excessive temperature during video shooting or long-term photographing of the camera module 10. In a specific embodiment provided by the present application, the operating junction temperature of the image sensor 4 can be controlled below 70 degrees. For example, the operating structure of the image sensor can be less than 50 degrees.

[0126] Refer to Figure 14 , Figure 14 shows the specific structural form of the contact surface between the bearing part 231 and the fixed platform 211. In this embodiment, the contact method between the bearing part 231 and the fixed platform 211 of the fixed seat 21 is the contact between plane and plane. This solution is beneficial to heat conduction. The larger the contact area between the bearing part 231 and the fixed seat 21, the higher the heat conduction efficiency. This solution can improve the heat dissipation ability through the contact of a complete plane. The plane on the bearing part 231 for contacting the fixed seat 21 is the first plane S5, and the plane on the fixed platform 211 of the fixed seat 21 for contacting the bearing part 231 is the second plane S6. Both the first plane S5 and the second plane S6 are continuous and complete plane structures.

[0127] Refer to Figure 15 , Figure 15It represents the specific structural form of the contact surface between the bearing part 231 and the fixed platform 211. The contact mode between the bearing part 231 and the fixed platform 211 of the fixed seat 21 is the contact between a plane and an array of bumps. At the contact position between the bearing part 231 and the fixed platform 211, the structural form of one of the bearing part 231 and the fixed platform 211 is a complete planar structure, and the structural form of the other of the bearing part 231 and the fixed platform 211 is an array of bump structures. As Figure 15 shown, the bearing part 231 includes an array of bump structures S51, and the structure of the fixed platform 211 in contact with the bearing part 231 is the second plane S6. The array of bump structures S51 is arranged corresponding to all regions of the second plane S6. In this solution, by the contact between the array of bump structures S51 and the second plane S6, the problem of the position deviation in the optical axis direction caused by the flatness of the plane-to-plane contact can be solved. The setting of the array of bump structures S51 is relatively easy to control the flatness of the plane formed by the contact positions of the bumps and the plane. During the relative movement, it can be more stable and can also ensure the stability of the friction coefficient. Figure 15 In the shown embodiment, the array of bump structures S51 can also be arranged on the fixed platform 211. Correspondingly, the second plane S6 is arranged on the bearing part 231.

[0128] Refer to Figure 16 , Figure 16 It represents the specific structural form of the contact surface between the bearing part 231 and the fixed platform 211. The contact mode between the bearing part 231 and the fixed platform 211 of the fixed seat 21 is the contact between a plane and multiple bumps. At the contact position between the bearing part 231 and the fixed platform 211, the structural form of one of the bearing part 231 and the fixed platform 211 is a complete planar structure, and the structural form of the other of the bearing part 231 and the fixed platform 211 is multiple bump structures. As Figure 16 shown, multiple bump structures S52 are arranged on the bearing part 231, and the structure of the fixed platform 211 in contact with the bearing part 231 is the second plane S6. The multiple bump structures S52 are arranged corresponding to the partial regions of the second plane S6. In this embodiment, the second plane S6 is in a rectangular shape, and the multiple bump structures S52 are arranged corresponding to the four corner positions of the second plane S6. In other embodiments, the multiple bump structures S52 can also be arranged corresponding to other positions of the second plane S6, such as corresponding to the midpoint positions of each side of the second plane S6, or multiple bump structures S52 are distributed corresponding to each side. Figure 16In the illustrated embodiment, a plurality of bump structures S52 may also be provided on the fixed platform 211. Correspondingly, the second plane S6 is provided on the bearing portion 231. By the cooperation of the bump structures S52 and the plane distributed at local positions in this solution, it is beneficial to adjust the flatness at the friction interface position. For the contact surface position between the fixed platform 211 and the bearing portion 231, high flatness manufacturing precision is not required, and the smooth movement of the image sensor 4 can also be satisfied.

[0129] Refer to Figure 17 , Figure 18 and Figure 19 . These three figures show three specific different structural forms of the contact surface between the bearing portion 231 and the fixed platform 211. In one embodiment, the contact manner between the bearing portion 231 and the fixed platform 211 of the fixed seat 21 is the contact between a plane and a protruding rib structure, or the contact between a protruding rib structure and a protruding rib structure. Compared with the bump structure, the contact area can be increased by the arrangement of the rib structure, which is beneficial to reducing the pressure and avoiding damage to the contacting surfaces due to friction during relative movement, affecting the positioning accuracy in the optical axis direction. Compared with the structure of full-plane contact, the rib structure can also improve the movement in the optical axis direction caused by the flatness problem.

[0130] As Figure 17 shown, at the contact position between the bearing portion 231 and the fixed platform 211 of the fixed seat 21, the structural form of the bearing portion 231 is a protruding rib structure S53, and the structural form of the fixed platform 211 is a complete plane structure S6. The protruding rib structure S53 slides on the plane structure S6 to form a friction interface. In this embodiment, the protruding rib structure S53 is annularly distributed. As Figure 18 shown, the structural form of the bearing portion 231 is also a protruding rib structure S53. The difference from the embodiment shown in Figure 17 is that Figure 18 the protruding rib structure S53 in the embodiment shown is reticularly distributed.

[0131] As Figure 19 shown, at the contact position between the bearing portion 231 and the fixed platform 211 of the fixed seat 21, the structural form of the fixed platform 211 is a protruding rib structure S54. In this solution, the structural form of the bearing portion 231 may be a plane structure S7. The structural form of the bearing portion 231 may also be a structure similar to a rib. In other embodiments, a protruding rib structure may also be provided on the bearing portion 231, and the fixed platform 211 is set as a plane structure.

[0132] Figures 14 to 19Schematically describes the structural forms of several different friction interfaces, which is not a limitation on the structural form of the friction interface of this application. This application can design friction interfaces with different structural forms according to specific design requirements.

[0133] Referring to Figure 10A , in this application, by slidingly contacting the bearing part 231 with the fixed platform 211, a moving platform is provided for the bearing part 231. During the movement of the bearing part 231, it will not leave the fixed platform 211. Therefore, the bearing part 231 needs to have a holding force that can keep the bearing part 231 in contact with the fixed platform 211. Specifically, a holding structure is provided inside the image sensor driving module 2. Part of the holding structure is connected to the bearing part 231, and part of the holding structure is located on the fixed base 21. The holding structure provides a holding force on the bearing part 231, and the holding force is used to keep the bearing part 231 in contact with the fixed platform 211 of the fixed base 21. The setting of the holding structure can be realized through a variety of different implementation schemes, which are specifically described as follows.

[0134] In one implementation, as Figure 10A shown, the holding structure 26 is composed of a connecting part 233 and a fixing part 232. The connecting part 233 is connected to the bearing part 231, and the fixing part 232 is located on the fixed base 21, that is, the fixing part 232 is fixedly connected to the fixed base 21. The part of the structure on the fixed base 21 for fixedly connecting the fixing part 232 can be used as part of the holding structure. In this solution, the connecting part 233 of the movable seat 23 is used as part of the holding structure. The connecting part 233 is an elastic structure, and the elastic force of the connecting part 233 acts on the bearing part 231 to form the holding force. In this implementation, the elastic force of the connecting part 233 is used as the holding force to ensure the contact between the bearing part 231 and the fixed base 21. There is no need to add other holding structures outside the fixed base and the movable seat. The connecting part 233 can not only ensure the movement of the bearing part 231 under the driving force of the driving unit 22, but also has the function of providing the holding force. The design of the dual function of the connecting part 233 is beneficial to the miniaturization of the size of the image sensor driving module 2.

[0135] Referring to Figure 10A , the connection part between the connecting part 233 and the fixing part 232 is the first position 2331, and the connection part between the connecting part 233 and the bearing part 231 is the second position 2332. There is elastic potential energy between the first position 2331 and the second position 2332, and the elastic potential energy forms the holding force. This solution defines a specific formation method of the elastic force of the connecting part 233. By forming elastic potential energy between the first position 2331 and the second position 2332, the necessary assembly positions of the connecting part 233 are utilized, which is beneficial to ensuring the miniaturization of the size of the image sensor driving module 2.

[0136] Specifically, in the direction perpendicular to the fixed platform 211, i.e., the optical axis direction, the distance D1 between the first position 2331 and the fixed platform 211 in the optical axis direction is less than the distance D2 between the second position 2332 and the fixed platform 211 in the optical axis direction. It can be understood that the first position 2331 and the second position 2332 form a stepped structure during the assembly process, and the connecting portion 233 after assembly has a force that pulls the bearing portion 231 towards the fixed platform 211. That is, the elastic tension of the connecting portion 233 acts on the second position 2332 to form the holding force towards the fixed platform 211. In this solution, by determining the distance relationship between the first position 2331, the second position 2332, and the fixed platform 211 during the assembly of the movable seat 23, when ensuring that D1 is less than D2, a pulling force of the second position 2332 towards the fixed platform 211 can be provided, that is, the holding force can be formed. The way to form the holding force in this solution is realized during the assembly process. For the connecting portion 233 of the movable seat 23, there is no need to consider forming the holding force and make special design for its structure during its manufacturing process, which can save the manufacturing cost.

[0137] In other embodiments, as a holding structure, the connecting portion 233 can be designed such that the fixing portion 232 and the bearing portion 231 are not coplanar during the manufacturing process of the movable seat 23. That is, when the connecting portion 233 is in a free state (not subject to any binding force), the first position 2331 at the connection between the connecting portion 233 and the fixing portion 232 and the second position 2332 at the connection between the connecting portion 233 and the bearing portion 231 correspond to different optical axis positions, and there is a height difference in the optical axis direction between the first position 2331 and the second position 2332 before assembly. During the assembly process, the first position 2331 and the second position 2332 can be assembled into a coplanar state, or during the assembly process, the specific physical positions of the first position 2331 or the second position 2332 can be adjusted to store energy in this way, that is, elastic potential energy is stored in the connecting portion 233, and the force of this elastic potential energy acting on the bearing portion 231 is the holding force towards the fixed platform 211. This solution is beneficial to realizing the miniaturization of the size of the image sensor driving module after assembly.

[0138] In one embodiment, refer to Figure 20 and Figure 21, the holding structure 26 includes a magnetic member 24 and a fixed platform 211. The magnetic member 24 is fixed on the carrying portion 231, and at least part of the holding force is constituted by the magnetic attraction force between the magnetic member 24 and the fixed platform 211. In this solution, by arranging a magnetic member on the carrying portion 231 and designing the fixed platform 211 to be able to cooperate with the magnetic member to form a magnetic attraction force, and using the magnetic attraction force as the holding force, the lifespan and stability of the holding force can be ensured. When the elastic force of the connecting portion 233 is used as the holding force, during long-term use, the elastic coefficient of the elastic force will change, resulting in a decrease in the elastic performance of the connecting portion 233. In this case, it may affect the holding force between the carrying portion 231 and the fixed platform 211. If the holding force is not enough to support the friction interface between the two to maintain contact, it will affect the smooth movement of the image sensor 4 and also the heat conduction performance of the image sensor driving module 2. In this solution, by arranging the magnetic member 24 and using the magnetic attraction force as the holding force, the continuous stability of the holding force can be ensured, and the lifespan of the image sensor driving module 2 can be improved.

[0139] In one embodiment, the holding force can include both the elastic force provided by the connecting portion 233 and the magnetic force provided by the magnetic member 24.

[0140] In a specific embodiment, as Figure 20 shown, the magnetic member 24 includes four magnets 241, 242, 243, 244. The four magnets 241, 242, 243, 244 are arranged in a dot-like distribution on the carrying portion 231 and are adjacent to the outer edge of the carrying portion 231. The outer edge of the carrying portion 231 is the edge position of the carrying portion 231 facing the fixing portion 232. In this embodiment, the four magnets 241, 242, 243, 244 are distributed at the four corners of the carrying portion 231. In other embodiments, the magnetic member 24 can include two or three magnets, or the number of magnets can also be greater than or equal to five, and multiple magnets are evenly spaced and distributed at the edge position of the carrying portion 231. Specifically, when there are three magnets, the three magnets can define a plane, which can ensure surface contact of the contact surface between the carrying portion and the fixed seat. When there are four magnets, they can be symmetrically distributed at the four outer corners of the image sensor, which is beneficial to ensuring the smooth movement of the image sensor.

[0141] In a specific embodiment, as Figure 21As shown, the magnetic member 24 includes four magnetic strips 245, 246, 247, 248. The magnetic strips 245, 246, 247, 248 are all strip-shaped and are symmetrically distributed in pairs on the bearing portion 231 and are adjacent to the outer edge of the bearing portion 231. The outer edge of the bearing portion 231 is the edge position of the bearing portion 231 facing the fixing portion 232. In this embodiment, the magnetic strips 245, 246, 247, 248 are located inside the coil, and the coil is the movable member 222 of the driving unit. In other embodiments, the magnetic strips 245, 246, 247, 248 may also be arranged on the periphery of the movable member 222. In other embodiments, the number of magnetic strips may also be two, three or more. The arrangement of the strip-shaped magnetic strips can not only provide a large magnetic attraction force, but also facilitate assembly and fixation.

[0142] In the embodiment of the present application, the magnetic attraction force between the magnetic member 24 disposed on the bearing portion 231 and the fixed seat 21 needs to ensure that the bearing portion 231 can maintain contact with the fixed seat 21 during movement, and the magnetic attraction force also needs to be controlled within a preset range, that is, the magnetic attraction force cannot be too large. If the magnetic attraction force is too large, it may cause the driving unit 22 to be unable to drive the bearing portion 231 to move, or affect the movement efficiency of the bearing portion 231.

[0143] In a specific embodiment, refer to Figure 22 , the holding structure 26 includes a movable member 222 and a fixed platform 211. Specifically, the movable member 222 is a magnetic driving member, and the fixed member 221 is a coil driving member. In this embodiment, the fixed member 221 is fixed on the fixed seat 21, and circuit board traces need to be configured on the fixed seat 21 to supply power to the coil driving member. Generally speaking, in this solution, the movable member 222 forms a magnetic attraction force with the fixed platform 211 as a magnetic member (similar to the structure of the aforementioned magnet and magnetic strip), and the magnetic attraction force between the movable member 222 and the fixed platform 211 constitutes at least part of the holding force. This solution uses a magnetic driving member (movable member 222) to form a holding structure, which is beneficial to the design of miniaturization of the size of the image sensor driving module 2.

[0144] Refer to Figure 23A and Figure 23B, in one implementation, a magnetic member is provided on the fixed platform 211 of the fixed seat 21, and a magnetic attracting member, such as a steel plate, is provided on the bearing portion 231 of the movable seat 23. The holding force is formed by the magnetic attraction between the magnetic member and the magnetic attracting member. Specifically, in this implementation, the holding structure 26 includes a magnetic member 24 and a magnetic attracting member 238. The magnetic attracting member 238 is made of a magnetic conductive material and is a part of the bearing portion 231. The magnetic member 24 is fixed on the fixed seat 21 and is located at the position of the contact surface between the fixed seat 21 and the bearing portion 231. The holding force is formed by the magnetic attraction between the magnetic member 24 and the magnetic attracting member 238. Figure 23A In the shown implementation, the magnetic member 24 is located on the surface of the fixed platform 211 of the fixed seat 21 that faces away from the bearing portion 231. Figure 23B In the shown implementation, the magnetic member 24 is embedded inside the fixed platform 211 of the fixed seat 21. The bearing portion 231 includes a circuit board structure and a magnetic attracting member 238. The magnetic attracting member is fixed to the bottom surface of the circuit board structure to reinforce the strength of the circuit board. The magnetic attracting member 238 is located on the surface of the bearing portion 231 that faces the fixed platform 211. The magnetic attracting member 238 contacts the fixed platform 211 to form a friction interface X. The magnetic attracting member 238 is also used to carry the image sensor 4. In this implementation, the magnetic attracting member 238 and Figure 7 In the shown implementation, the reinforcing plate structure 23B can be of the same structure. However, in this implementation, the magnetic attracting member 238 not only provides structural reinforcement for the bearing portion 231 and can carry the image sensor 4, but also needs to have a magnetic conductive material. The magnetic attracting member 238 needs to cooperate with the magnetic member 24 to generate magnetic attraction, while Figure 7 In the shown implementation, the reinforcing plate structure 23B does not need to form magnetic attraction, and only needs to provide reinforcement for the circuit board structure 23A and carry the image sensor 4.

[0145] Figure 23A and Figure 23BIn the illustrated embodiment, the magnetic member 24 and the magnetic attraction member 238 constitute a partial holding structure 26. Further, the partial holding structure 26 includes a connecting portion 233 and a fixing portion 232. That is to say, in this embodiment, the holding structure 26 ensures the contact reliability between the carrying portion 231 and the fixed platform 211 through the combined action of magnetic force and elastic force. In this solution, by disposing the magnetic member 24 on the fixed platform 211 and correspondingly disposing a magnetic attraction member, such as a steel plate, on the carrying portion 231, this design can reduce the influence of the magnetic member on the driving unit 22 and the image sensor 4, and ensure the moving smoothness of the image sensor 4 and the quality of the generated image signal. By disposing the magnetic member 24 on the surface of the fixed base 21 away from the carrying portion 231, the distance between the magnetic member 24 and the image sensor 4 and the driving unit 22 can be maximized, which is beneficial to reducing the influence of the magnetic member 24 on the driving unit 22 and the image sensor 4, and ensuring the moving smoothness of the image sensor 4 and the quality of the generated image signal. By embedding the magnetic member 24 inside the fixed platform 211, the magnetic member 24 and the fixed platform 211 are combined into one body, which does not affect the overall structure of the image sensor driving module 2 and also facilitates the assembly and positioning between the image sensor driving module 2 and other structures inside the electronic device.

[0146] In a specific embodiment, referring to Figure 24 , the holding structure 26 includes an elastic member 25. One end of the elastic member 25 is connected to the top plate 2121 of the fixing frame 212 of the fixed base 21, and the other end is connected to the carrying portion 231. In the assembled state, the elastic member 25 is in an elastically compressed state, and the elastic member 25 applies an elastic force to the carrying portion 231. This elastic force is directed towards the contact surface between the carrying portion 231 and the fixed base 21. This elastic force is the holding force for ensuring the contact between the carrying portion 231 and the fixed platform 211, and the elastic member 25 can maintain the contact state at the friction interface X. Figure 24 In the illustrated embodiment, the elastic member 25, the connecting portion 233 and the fixing portion 232 together constitute the holding structure 26. That is, the holding force provided by the connecting portion 233 and the holding force of the elastic member 25 are utilized, so that the contact between the carrying portion 231 and the fixed platform 211 can be more stable.

[0147] In this application, the bearing part 231 contacts the fixed platform 211 of the fixed seat 21, and the bearing part 231 also has a holding force. This holding force is used to maintain the contact state between the bearing part 231 and the fixed seat 21. The direction of the holding force is towards the contact surface between the bearing part 231 and the fixed seat 21, so that no matter in what position or environment the image sensor driving module 2 is, the holding force can hold the bearing part 231 against the contact with the fixed seat 21. The holding force needs to be greater than the sum of the gravity of the bearing part 231 and all the structures carried on the bearing part 231. In this way, no matter how the camera module 10 is placed, during the process of driving the image sensor 4 to move, the bearing part 231 can move on a fixed plane, realizing the smooth movement of the image sensor 4, preventing the image sensor 4 from tilting or generating axial movement. This axial movement refers to the direction of the optical axis. It can be understood that the plane where the contact surface between the bearing part 231 and the fixed seat 21 is located is a plane perpendicular to the optical axis. The image sensor driving module 2 provided in this application can drive the image sensor 4 to move on a plane perpendicular to the optical axis.

[0148] Refer to Figure 25A , in one implementation, the movable seat 23 is an integrated circuit board structure, that is, the bearing part 231, the connecting part 233 and the fixing part 232 are formed by an integral molding method. The periphery of the fixing part 232 is used to connect a circuit board (such as an FPC) 9. The circuit board 9 is used for electrically connecting the image sensor 4 and the processor in the electronic device. In this implementation, the circuit board 9 and the fixing part 232 are an integrated circuit board structure. It is formed by the process of integral molding of the circuit board. The manufacturing process is simple, convenient for assembly, and the structural stability is better. The circuit layers in the movable seat 23 only run in the same circuit board, which can ensure the stability of signal transmission and reduce signal loss. The bearing part 231 includes a first area 231C for bearing the movable part 222 and other electronic devices and a second area 231D for bearing the image sensor 4. The dimension of the movable seat 23 in the direction of the optical axis P of the image sensor 4 is the thickness of the movable seat 23. The thickness T1 of the first area 231C, the thickness T2 of the connecting part 233 and the thickness T3 of the fixing part 232 are equal. The movable seat composed of an integrated circuit structure can save space for the image sensor driving module in the thickness direction, which is beneficial to the miniaturized design of the size of the image sensor driving module in the direction of the optical axis of the image sensor.

[0149] The first area 231C is connected between the second area 231D and the connecting part 233. The thickness T4 of the second area 231D is less than the thickness T1 of the first area 231C. The first area 231C surrounds the edge of the second area 231D and jointly encloses a receiving space (since Figure 25AThe accommodation space is occupied by the image sensor 4 (not labeled). The accommodation space is used to accommodate the image sensor 4. The image sensor 4 is connected to the bottom surface and the second region 231D, and can be connected through an adhesive layer. There may be a gap between the side surface of the image sensor 4 and the inner wall of the accommodation space, which facilitates the installation of the image sensor. In this solution, a groove is provided on the bearing portion 231. The groove is used to accommodate the image sensor, which helps to save space in the optical axis direction and is easy to achieve a small-size design in the optical axis direction. The contact surface between the first region 231C and the fixed platform 211 of the fixed seat 21 is coplanar with the contact surface between the second region 231D and the fixed platform 211. In this embodiment, the second region 231D of the bearing portion 231 may be a complete flat plate structure, that is, no through holes or window structures are provided in the second region 231D. In other embodiments, the second region 231D may also be a frame structure, that is, only the edge portion of the image sensor 4 is borne by the second region 231D, and a part of the image sensor 4 and the fixed platform 211 are separated by a gap. The gap may be air or filled with a heat-conducting medium.

[0150] Refer to Figure 25B , Figure 25B and Figure 25A the embodiment shown in Figure 25BThe detailed structure of the first bearing area R1 is marked. The first bearing area R1 includes a first central area R11 and a second central area R12. In the direction of the optical axis extension, the first central area R11 and the second central area R12 are facing the opening S11. The second central area R12 is located on the periphery of the first central area R11 and is connected between the first central area R11 and the second bearing area R2. The first central area R11 is used to mount the image sensor 4, and the second central area R12 is used to mount the optical element 6. The optical element 6 can be an IR filter. In this embodiment, the image sensor 4 or the optical element 6 can be assembled within the first bearing area R of the image sensor driving module 2, which is beneficial to reducing the size of the camera module in the optical axis direction. For an electronic device, it can achieve the thinning of the electronic device. In this embodiment, the movable seat 23 is an integrated circuit board structure. The integrated circuit board structure means that the movable seat 23 is made by a circuit board manufacturing process at one time, rather than the splicing combination of multiple circuit boards or the composition of a circuit board and other plates. The movable seat 23 being an integrated circuit board structure can minimize the size of the movable seat 23 in the optical axis direction. Moreover, the signal interaction between the image sensor 4 and the processor in the electronic device, the power-on of the image sensor 4, and the power-on of the driving unit can all be achieved through the circuit board traces arranged in the movable seat 23. Transmitting electrical signals and image signals through the circuit board traces in the integrated circuit board structure can ensure the signal quality, reduce signal loss, and is also beneficial to reducing the interference of the outside world on the signals, and can improve the imaging quality and imaging efficiency of the camera module. The size of the movable seat 23 in the optical axis direction of the image sensor 4 is the thickness of the movable seat. The thickness T1 of the second bearing area R2, the thickness T2 of the connecting portion 233, and the thickness T3 of the fixing portion 232 are equal.

[0151] At least part of the thickness of the first bearing area R1 is less than the thickness of the second bearing area R2, so that at least part of the first bearing area R1 is an inward concave structure and forms a receiving space for receiving the image sensor 4. Figure 25A and Figure 25BIn the illustrated embodiment, the thickness of the first central region R11 of the first bearing region R1 is less than that of the second central region R12, and the thickness of the second central region R12 is equal to that of the second bearing region R2. The second central region R12 and the first central region R11 jointly enclose a receiving space for receiving the image sensor 4. In other embodiments, the thickness of the first central region R11 may be equal to that of the second central region R12, that is, the first bearing region R1 has a uniform thickness, and the thickness of the first bearing region R1 is less than that of the second bearing region R2. In this way, a receiving space for receiving the image sensor is formed between the second bearing region R2 and the first bearing region R1. Generally speaking, in the present application, a groove structure can be provided on the movable seat 23 of the integrated circuit board architecture. For example, the thickness of the first central region R11 is small, and the first central region R11 is a concave portion; or the thickness of the first bearing region is small, and the first bearing region is a concave portion. The solution of using the concave portion to carry the image sensor is beneficial to realizing the thinning of the size of the camera module in the optical axis direction.

[0152] Referring to Figure 26A , Figure 26A In the illustrated embodiment, the friction interface X between the bearing portion 231 and the fixed platform 211 is a three-dimensional layer structure, and its specific design can be referred to Figure 11A , Figure 11B and Figure 11C the illustrated embodiments. In the extending direction of the optical axis P of the image sensor 4, a height difference is formed between the fixing portion 232 and the bearing portion 231. That is, the vertical distance H1 between the surface of the fixing portion 232 away from the fixed platform 211 and the fixed platform 211 is less than the vertical distance H2 between the surface of the bearing portion 231 away from the fixed platform 211 and the fixed platform 211. In this embodiment, the fixing portion 232 and the fixed platform 211 are connected through an adhesive layer.

[0153] Figure 25A and Figure 26A In the illustrated embodiments, the driving unit 22 is located on the side of the bearing portion 231 away from the fixed platform 211, that is, the driving unit 22 is located between the top plate 2121 of the fixed frame 212 and the bearing portion 231.

[0154] Referring to Figure 26B , there is a gap G between the movable seat 23 and the inner surface S0 of the fixed platform 211, which can be understood as: the movable seat 23 and the inner surface S0 of the fixed platform 211 are spaced apart in a suspended manner.

[0155] Referring to Figure 27AIn one embodiment, the fixing platform 211 of the fixing seat 21 is in the shape of a flat plate, the fixing frame 212 is connected to the edge area of ​​the fixing platform 211, and the fixing frame 212 is used to connect the fixing portion 232 of the movable seat 23. Specifically, the fixing frame 212 includes a first portion 212A and a second portion 212B, the first portion 212A is located between the fixing portion 232 and the fixing platform 211, and supports the fixing portion 232 above the fixing platform 211. The second portion 212B is located on the side of the fixing portion 232 away from the first portion 212A, that is, the first portion 212A and the second portion 212B clamp the fixing portion 232 therebetween. The driving unit 22 is located between the bearing part 231 and the fixed platform 211. The fixing part 221 of the driving unit 22 is fixed on the fixed platform 211, and the movable part 222 is fixed on the surface of the bearing part 231 facing the fixed platform 211. Specifically, the movable part 222 is fixed on the side of the second bearing area R2 of the bearing part 231 that is away from the top plate 2121 (i.e., the surface of the second bearing area R2 facing the fixed platform 211). In this solution, the position of the fixing part 221 on the fixed platform 211 is located at the periphery of the friction interface X between the bearing part 231 and the fixed platform 211. The moving range of the bearing part 231 on the fixed platform 211 is located within the range defined by the fixing part 221 on the fixed platform 211. The bearing part 231 includes three parts, namely the first section A1, the second section A2 and the third section A3. The second section A2 is connected between the first section A1 and the third section A3. The first section A1 is connected to the connecting part 233 and is used to set the movable part 222 and other electronic devices. The third section A3 is used to support the image sensor 4. The first section A1 may be parallel to the third section A3.

[0156] See also Figure 27B There is a gap G between the movable seat 23 and the inner surface S0 of the fixed platform 211, which can be understood as: the movable seat 23 and the inner surface S0 of the fixed platform 211 are suspended and spaced apart.

[0157] Figure 27A In the illustrated embodiment, the fixing frame 212 of the fixing seat 21 includes a top plate 2121, and the top plate 2121 is used to shield the connection portion 233, and the top plate 2121 is used to protect the connection portion 233. Specifically, the top plate is on the side opposite to the fixing platform 211 and together with the side frame 2122 and the fixing platform 211, forms an enclosed space 2120, and the second bearing area R2 of the movable seat 23, the connection portion 233 and the driving unit 22 are all accommodated in this enclosed space 2120, so that the fixing seat 21 has a protective effect on the driving unit 22 and the circuit part on the movable seat 23. Moreover, the top plate 2121 can also be used to assemble other driving units of the camera module.

[0158] In other embodiments, Figure 28AAs shown in the figure, the fixed base 21 may not be provided with a top plate, and the fixing portion 232 of the movable seat 23 may be directly lapped on the top surface 212C of the fixed frame 212. This embodiment is conducive to miniaturizing the image sensor driving module and saving the space of the electronic device. Figure 28A In the embodiment shown in the figure, the area surrounded by the end of the fixed frame 212 away from the fixed platform 211 is an opening S11. During the assembly of the image sensor 4, the image sensor 4 is assembled onto the first bearing area R1 of the bearing portion 231 through this opening S11.

[0159] Refer to Figure 28B There is a gap G between the movable seat 23 and the inner surface S0 of the fixed platform 211. It can be understood that the movable seat 23 and the inner surface S0 of the fixed platform 211 are spaced apart in a suspended manner.

[0160] Refer to Figure 29A In an embodiment, the bearing portion 231 includes a first bearing platform 231E and a second bearing platform 231F. The first bearing platform 231E is used to bear the image sensor 4. The first bearing platform 231E is provided with a receiving groove E1. The image sensor 4 is fixed in the receiving groove E1 of the first bearing platform 231E through an adhesive layer. The first bearing platform 231E is in contact with the fixed platform 211 of the fixed base 21 to form a contact surface. The direction perpendicular to the contact surface is the optical axis P direction. The second bearing platform 231F and the connecting portion 233 are stacked along the optical axis P direction. The movable member 222 of the driving unit 22 is fixed on the second bearing platform 231F, and the fixing member 221 is fixed on the top plate 2121 of the fixed frame 212 of the fixed base 21. The driving unit 22 is located on the side of the second bearing platform 231F away from the connecting portion 233. The first bearing platform 231E and the connecting portion 233 are interconnected into an integral structure. Along the optical axis P direction, the connecting portion 233 is located between the second bearing platform 231F and the contact surface (i.e., the friction interface X). The first bearing platform 231E and the second bearing platform 231F are connected by solder balls, which can achieve both mechanical connection and electrical connection. In this embodiment, by designing the bearing portion 231 as a two-plate structure (i.e., the first bearing platform 231E and the second bearing platform 231F), and the structure in which the second bearing platform 231F and the connecting portion 233 are stacked, a small-size design of the movable seat 23 in the direction perpendicular to the optical axis P can be achieved. When this solution is applied to an electronic device, it can save the board area of the circuit board where the camera module is located. Figure 29AIn the illustrated embodiment, the portion of the second carrying platform 231F facing the top plate 2121 is the second carrying area R2, and the second carrying area R2 and the connecting portion 233 are stacked. Along the direction of the optical axis P, the connecting portion 233 is located between the second carrying area R2 and the fixed platform 211, the first carrying area R1 includes an assembly area R13 and an assembly area R14, the assembly area R13 is used to carry the image sensor 4, the connecting portion 233 surrounds the assembly area R13 and is connected to the edge of the assembly area R13, the assembly area R14 and the second carrying area R2 are interconnected as a whole, the assembly area R14 and part of the assembly area R13 are overlapped and form an overlapping area R111, and the positions of the mechanical connection and electrical connection between the assembly area R13 and the assembly area R14 are both within the overlapping area R111. Figure 29A The portion within the rectangular frame indicated by the dashed line represents the overlapping region R111.

[0161] See also Figure 29B There is a gap G between the movable seat 23 and the inner surface S0 of the fixed platform 211, which can be understood as: the movable seat 23 and the inner surface S0 of the fixed platform 211 are suspended and spaced apart.

[0162] See also Figure 30A and Figure 31A In this embodiment, the first bearing platform 231E and the connecting portion 233 are respectively connected to the top surface and the bottom surface of the second bearing platform 231F. Along the optical axis P direction, the second bearing platform 231F is located between the connecting portion 233 and the fixed platform 211. It can also be understood that: along the optical axis P direction, the second bearing platform 231F is located between the connecting portion and the friction interface. In this embodiment, the first bearing platform 231E and the second bearing platform are directly connected to form a Z-shaped structure. The connecting portion 233 is arranged on the side of the second bearing platform 231F away from the fixed platform 211. The connecting portion 233 is connected to the top surface of the second bearing platform 231F through an adapter plate 233A. The adapter plate 233A and the second bearing platform 231F are connected through solder balls, which can realize both mechanical connection and electrical connection. The driving unit 22 is located between the second bearing platform 231F and the fixed platform 211. The movable part 222 is fixed on the second bearing platform 231F, and the fixed part 221 is fixed to the fixed platform 211.

[0163] like Figure 30A As shown, the portion of the second carrying platform 231F facing the top plate 2121 is the second carrying area R2, and the movable member 222 is fixed on the surface of the second carrying area R2 facing the fixed platform 211. In the optical axis direction, the connecting portion 233 is located between the top plate 2121 and the second carrying area R2. The first carrying platform 231E is the first carrying area R1.

[0164] Figure 30A In the illustrated embodiment, the fixed frame 212 includes a top plate 2121 which is located above the connecting portion 233 and can protect the connecting portion 233. There is a space between the fixing portion 232 and the fixed platform 211 through a part of the fixed frame 212, that is, the fixing portion 232 is fixed within the fixed frame 212.

[0165] Figure 31A In the illustrated embodiment, the fixed frame 212 does not have the top plate 2121, and the fixing portion 232 is fixed on the top surface of the fixed frame 212, that is, the fixing portion 232 is fixed on the surface of the fixed frame 212 away from the fixed platform 211.

[0166] Refer to Figure 30B and Figure 31B , there is a gap G between the movable seat 23 and the inner surface S0 of the fixed platform 211. It can be understood that the movable seat 23 and the inner surface S0 of the fixed platform 211 are spaced apart in a suspended manner.

[0167] The first, second, third, fourth and various numerical numbers involved in this article are only for the convenience of description and are not used to limit the scope of this application.

[0168] It should be understood that in various embodiments of this application, the magnitude of the serial numbers of the above processes does not mean the sequence of execution. The execution sequence of each process should be determined by its function and internal logic, and should not constitute any limitation to the implementation process of the embodiments of this application.

[0169] The above description is only the specific implementation manner of this application, but the protection scope of this application is not limited thereto. Any person skilled in the art within the technical scope disclosed by this application can easily think of changes or substitutions, which should be covered within the protection scope of this application; without conflict, the possible embodiments of this application and the features in the possible embodiments can be combined with each other. Therefore, the protection scope of this application should be subject to the protection scope of the claims.

Claims

1. An image sensor driving module, characterized in that, it includes: a driving unit, including a fixed part and a movable part that can move relative to each other; The fixed platform includes an opposite inner surface and a first bottom surface. The fixed frame is connected to the fixed platform and protrudes from the inner surface. The fixed part is fixed to the fixed frame, and an opening is formed on a side of the fixed frame away from the inner surface; a carrying part, a fixing part and a connecting part. The connecting part is used to realize the mechanical and electrical connection between the carrying part and the fixing part. The fixing part is connected to the fixed frame. The carrying part includes a first carrying area and a second carrying area. The movable part is arranged in the second carrying area. The first carrying area is used to carry the image sensor. The size of the opening is larger than the size of the image sensor, and the opening is used to install the image sensor onto the first carrying area.

2. The image sensor driving module according to claim 1, characterized in that, the fixed frame includes a side frame and a top plate. The top plate and the inner surface of the fixed platform are arranged opposite to each other. The side frame is connected between the top plate and the fixed platform, and forms an enclosed space with the top plate and the fixed platform. The driving unit, the connecting part and the second carrying area are located in the enclosed space, and the opening is formed by surrounding the top plate.

3. The image sensor driving module according to claim 2, characterized in that, the top plate is made of a rigid material. The top plate includes a first top surface, and the first top surface is the surface of the top plate away from the fixed platform. The first top surface is used to install the lens driving module in the camera module.

4. The image sensor driving module according to any one of claims 1-3, characterized in that, the first carrying area is directly opposite to the opening.

5. The image sensor driving module according to any one of claims 1-3, characterized in that, the first carrying area includes a first central area and a second central area. The second central area is located on the periphery of the first central area. The projection of the second central area on the inner surface of the fixed platform is located between the projection of the first central area on the inner surface of the fixed platform and the projection of the second carrying area on the inner surface of the fixed platform. The first central area is used to install the image sensor, and the second central area is used to install optical elements.

6. The image sensor driving module according to any one of claims 1-3, characterized in that, the movable seat is an integrated circuit board structure. The second carrying area is connected between the connecting part and the first carrying area. The thickness of at least part of the first carrying area is less than the thickness of the second carrying area, so that at least part of the first carrying area is an inward concave structure and forms a receiving space for receiving the image sensor.

7. The image sensor driving module according to any one of claims 2-3, characterized in that, the fixed part is fixed to the top plate, and the movable part is fixed to the second carrying area and faces the top plate.

8. The image sensor driving module according to any one of claims 1-3, characterized in that, The second bearing area and the connecting part are stacked, and along the optical axis direction, the connecting part is located between the second bearing area and the fixed platform.

9. The image sensor driving module according to claim 8, wherein, the first bearing area includes an assembly area one and an assembly area two. The assembly area one is used for bearing the image sensor. The connecting part surrounds the assembly area one and is connected to the edge of the assembly area one. The assembly area two and the second bearing area are interconnected as a whole. The assembly area two and a part of the assembly area one overlap and form an overlapping area. The positions of the mechanical connection and the electrical connection between the assembly area one and the assembly area two are both within the overlapping area.

10. The image sensor driving module according to claim 9, wherein, the assembly area one and the connecting part are of an integrated circuit board structure.

11. The image sensor driving module according to any one of claims 1-3, wherein, the fixing member is fixed to the fixed platform, and the movable member is fixed to the second bearing area facing the fixed platform.

12. The image sensor driving module according to any one of claims 1-3, wherein, the second bearing area and the connecting part are stacked. In the optical axis direction, the second bearing area is located between the fixed platform and the connecting part.

13. The image sensor driving module according to any one of claims 1-3, wherein, the bearing part includes a first plate and a second plate. The first plate is connected to the connecting part. A receiving space is formed outside the inner edge of the first plate. The second bearing area is located on the first plate. The second plate includes a first part and a second part. The first part is stacked with the first plate. The second part is located at the bottom of the receiving space. The second part is used for bearing the image sensor. The image sensor is electrically connected to the first plate, and the signal of the image sensor is transmitted through the first plate, the connecting part and the fixing part.

14. The image sensor driving module according to any one of claims 1-3, wherein, the bearing part is in contact with the fixed platform. The image sensor driving module further includes a holding structure. Part of the holding structure is connected to the bearing part, and part of the holding structure is located on the fixed platform. The holding structure is used to provide a holding force on the bearing part, and the holding force is used to keep the bearing part in contact with the fixed platform.

15. An optical component, wherein, it includes a lens driving module and the image sensor driving module according to any one of claims 1-14. The lens driving module is fixedly connected to the fixed frame.

16. The optical component according to claim 15, wherein, the lens driving module includes a housing and a driving component installed in the housing. The driving component is used to realize the focusing of the camera module. The outer surface of the housing is fixedly connected to the fixed frame.

17. A camera module, wherein, Comprising an image sensor, a lens assembly, and an optical component as described in claim 15 or 16, wherein the lens assembly is connected to the lens driving module, the image sensor is fixed to the image sensor driving module, and the lens assembly is located on the light incident side of the image sensor.

18. A camera module, characterized in that it comprises an image sensor, a lens assembly, and an image sensor driving module as described in any one of claims 1-14, the image sensor is fixed to the image sensor driving module, and the lens assembly is located on the light incident side of the image sensor.

19. An electronic device, characterized in that it comprises a processor and a camera module as described in claim 17 or 18, the processor is electrically connected to the camera module, and the processor is used for processing the image signal output by the image sensor.

20. A camera module, characterized in that it comprises: an image sensor and a lens assembly, the lens assembly being located on the light incident side of the image sensor; a lens driving module, comprising a housing and a driving component installed in the housing, the driving component being used for driving the lens assembly to move; and an image sensor driving module, comprising a fixed platform, a fixed frame, a bearing part, a fixing part, a connecting part, and a driving unit, the driving unit comprising a fixed part and a movable part that can move relative to each other, the fixed frame comprising a top plate and side frames, the side frames being connected between the top plate and the fixed platform, the top plate being in a rectangular frame structure, the top plate surrounding to form an opening, the size of the opening being larger than the sizes of the image sensor and the lens assembly, the opening being used for installing the image sensor to a first bearing area, and the inside of the opening being used for accommodating part of the lens assembly, the fixed part being fixed to the fixed seat, the connecting part being used for realizing the mechanical and electrical connection between the bearing part and the fixing part, the fixing part being connected to the fixed frame, the bearing part comprising a first bearing area and a second bearing area, the movable part being arranged in the second bearing area, and the first bearing area being used for bearing the image sensor; the lens driving module is located on the side of the side frame away from the fixed platform, and the outer surface of the housing is fixedly connected to the fixed frame.

Images