Flexible circuit board and display module

Abstract

The embodiment of the invention provides a flexible circuit board and a display module. In the flexible circuit board, a first conductive film layer located on a first surface of a flexible substrate comprises a first conductive structure, and a second conductive film layer located on a second surface of the flexible substrate comprises a second conductive structure; in the direction perpendicular to the plane where the flexible circuit board is located, the first conductive structure and the first covering film are not overlapped, and the second conductive structure and the second covering film are not overlapped. The first conductive structure and the second conductive structure are overlapped, and the first conductive film layer and the second conductive film layer are not overlapped with the second part; at least the area, close to the edge of the flexible circuit board, of the first face of the second part is attached to the reinforcing structure. In the embodiment of the invention, the reinforcing structure is arranged on one side, facing the edge of the flexible circuit board, of the double-sided copper exposing region, so that when the flexible circuit board is obtained by cutting and splicing, any cutting position has relatively large thickness and toughness, and the appearance yield and reliability of the flexible circuit board can be further improved.

Description

Technical Field

[0001] This application relates to the field of display technologies, and in particular, to a flexible printed circuit board and a display module. Background Art

[0002] A flexible printed circuit board (FPC) is a circuit board made by bonding a flexible substrate and a conductive film layer together, also known as a flexible board. Among them, the conductive film layer is usually a copper foil. The flexible printed circuit board can be freely bent and the circuits on the flexible substrate are not easily damaged. Therefore, it is widely used in electronic products and can meet the requirements for the development of electronic products towards high density, thinness, and miniaturization. Among them, the electrical reliability and appearance reliability of the flexible printed circuit board are the contents that need attention. Summary of the Invention

[0003] In view of this, embodiments of this application provide a flexible printed circuit board and a display module to solve the above problems.

[0004] In a first aspect, an embodiment of this application provides a flexible printed circuit board, including: A flexible substrate, including opposite first and second surfaces; the flexible substrate includes a connected first part and a second part, and the second part is located on a side of the first part close to the edge of the flexible printed circuit board; A first conductive film layer, located on the first surface of the flexible substrate; the first conductive film layer includes a first conductive structure, and the first conductive structure is attached to the first part; A second conductive film layer, located on the second surface of the flexible substrate; the second conductive film layer includes a second conductive structure, and the second conductive structure is at least attached to the first part; A first cover film, located on a side of the first conductive film layer away from the flexible substrate; in a direction perpendicular to the plane where the flexible printed circuit board is located, the first conductive structure and the first cover film do not overlap; A second cover film, located on a side of the second conductive film layer away from the flexible substrate; in a direction perpendicular to the plane where the flexible printed circuit board is located, the second conductive structure and the second cover film do not overlap; Wherein, in a direction perpendicular to the plane where the flexible printed circuit board is located, the first conductive structure and the second conductive structure overlap, and the first conductive film layer and the second conductive film layer do not overlap with the second part; at least a region of the first surface of the second part close to the edge of the flexible printed circuit board is attached to a reinforcing structure.

[0005] In a second aspect, an embodiment of this application provides a display module, including the flexible printed circuit board provided in the first aspect, and further including a display panel, and the flexible printed circuit board is electrically connected to the display panel.

[0006] In the flexible circuit board provided by the embodiment of the present application, a reinforcing structure is provided on one side of the double-sided copper-exposed area facing the edge of the flexible circuit board. This enables that when the flexible circuit board is obtained by cutting the panel, a relatively large thickness and toughness can be achieved at any cutting position, thereby improving the appearance yield and reliability of the flexible circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0008] Figure 1 Schematic diagram of a flexible circuit board provided by an embodiment of the present application; Figure 2 Schematic diagram of another flexible circuit board provided by an embodiment of the present application; Figure 3 For Figure 1 and Figure 2 a partial schematic diagram in; Figure 4 For Figure 3 a cross-sectional schematic diagram along the A1-A2 direction in; Figure 5 Partial cross-sectional schematic diagram of a flexible circuit board related to an embodiment of the present application; Figure 6 For Figure 1 and Figure 2 another partial schematic diagram in; Figure 7 For Figure 6 a cross-sectional schematic diagram along the B1-B2 direction in; Figure 8 Partial cross-sectional schematic diagram of a flexible circuit board provided by an embodiment of the present application; Figure 9 For Figure 1 and Figure 2 a partial schematic diagram in; Figure 10 Another partial cross-sectional schematic diagram of a flexible circuit board provided by an embodiment of the present application; Figure 11 For Figure 1 and Figure 2 another partial schematic diagram in; Figure 12 For Figure 11 partial enlarged schematic diagram of; Figure 13 For Figure 11 a cross-sectional schematic diagram along the C1-C2 direction in; Figure 14 A partial schematic diagram of a flexible circuit board provided by an embodiment of the present application; Figure 15 Another partial schematic diagram of a flexible circuit board provided by an embodiment of the present application; Figure 16 Another partial schematic diagram of a flexible circuit board provided by an embodiment of the present application; Figure 17 Another partial schematic diagram of a flexible circuit board provided by an embodiment of the present application; Figure 18 Another partial schematic diagram of a flexible circuit board provided by an embodiment of the present application; Figure 19 is Figure 18 a partial enlarged schematic diagram of; Figure 20 is Figure 18 a sectional schematic diagram along the D1-D2 direction in; Figure 21 Another partial sectional schematic diagram of a flexible circuit board provided by an embodiment of the present application; Figure 22 is Figure 11 a sectional schematic diagram along the E1-E2 direction in; Figure 23 is Figure 11 another sectional schematic diagram along the E1-E2 direction in; Figure 24 Another partial sectional schematic diagram of a flexible circuit board provided by an embodiment of the present application; Figure 25 A schematic diagram of a panel provided by an embodiment of the present application; Figure 26 A schematic diagram of a display module provided by an embodiment of the present application; Figure 27 A schematic diagram of a display device provided by an embodiment of the present application. Detailed implementation manners

[0009] For a better understanding of the technical solutions of the present application, the embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0010] It should be clear that the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts belong to the scope of protection of the present application.

[0011] The terms used in the embodiments of the present application are for the purpose of describing specific embodiments only and are not intended to limit the present application. The singular forms "a" and "the" used in the embodiments of the present application and the appended claims are also intended to include the plural forms unless the context clearly dictates otherwise.

[0012] It should be understood that the term "and / or" used herein is merely a description of the relationship between associated objects, indicating that three relationships may exist. For example, A and / or B may represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " herein generally indicates an "or" relationship between the associated objects before and after.

[0013] In the description of this specification, it should be understood that the words "substantially", "approximately", "about", "around", "roughly", "generally" and the like described in the claims and embodiments of the present application refer to what can be generally recognized within a reasonable process operation range or tolerance range, rather than an exact value.

[0014] It should be understood that although terms such as first and second may be used in the embodiments of the present application to describe transistors and the like, these should not be limited to these terms. These terms are only used to distinguish transistors and the like from each other. For example, without departing from the scope of the embodiments of the present application, the first transistor may also be referred to as the second transistor, and similarly, the second transistor may also be referred to as the first transistor. The applicant of this case has provided a solution to the problems existing in the prior art through careful and in-depth research.

[0015] Flexible printed circuit boards are also applied in the display field. In one application scenario, the flexible printed circuit board can connect the pins on the front of the display panel to the rigid printed circuit board (PCB) on the back of the display panel, and then electrically connect the integrated circuit (IC) attached to the front of the display panel to the rigid printed circuit board on the back of the display panel. In one application scenario, an integrated circuit can be provided on the flexible printed circuit board to form a chip on flex (COF), one end of the chip on flex is attached to the pins on the front of the display panel, and the other end is connected to the rigid printed circuit board on the back of the display panel. In addition, the flexible printed circuit board can also be used as the circuit board under the keys of the display device.

[0016] Figure 1 Schematic diagram of a flexible printed circuit board provided for an embodiment of the present application Figure 2 Schematic diagram of another flexible printed circuit board provided for an embodiment of the present application.

[0017] A flexible circuit board may include various types of exposed copper. For example, exposed copper on pads is for achieving soldering with other structures, exposed copper on antennas is for reducing the radio frequency impedance of antenna signal reception and transmission, and exposed copper for grounding is for connecting to the ground terminal to conduct static electricity. Limited by the space of the flexible circuit board, at least part of the exposed copper needs to be arranged near the edge of the flexible circuit board. In addition, the area where at least part of the exposed copper is located is a double-sided exposed copper area. For example, as Figure 1 shown, at least part of the double-sided exposed copper area 10 is arranged at the corner position R1 of the flexible circuit board 01; when there is not enough area at the corner position R1 of the flexible circuit board 01 to arrange the double-sided exposed copper area 10, as Figure 2 shown, a shaped area R2 will be added to the flexible circuit board 01 and the double-sided exposed copper area 10 will be arranged in the shaped area R2.

[0018] Figure 3 is Figure 1 and Figure 2 a partial schematic diagram in Figure 4 is Figure 3 a cross-sectional schematic diagram along the A1 - A2 direction in

[0019] In the embodiments of the present application, in combination with Figure 3 and Figure 4 , the flexible circuit board 01 includes a flexible substrate 11, a first conductive film layer 12, a second conductive film layer 13, a first cover film 14, and a second cover film 15. The flexible substrate 11 includes opposite first surface 1101 and second surface 1102. For example, in the cross-sectional structure shown in Figure 4 , the upper surface of the flexible substrate 11 can be the first surface 1101 and the lower surface can be the second surface 1102. Among them, the first conductive film layer 12 is located on the first surface 1101 of the flexible substrate 11, the first cover film 14 is located on the side of the first conductive film layer 12 away from the flexible substrate 11, the second conductive film layer 13 is located on the second surface 1102 of the flexible substrate 11, and the second cover film 15 is located on the side of the second conductive film layer 13 away from the flexible substrate 11. The flexible circuit board 01 provided by the embodiments of the present application is a double-sided board.

[0020] In the embodiments of the present application, the flexible substrate 11 can be a polyimide (PI) film or a polyester (PET) film, or other specific flexible substrates. The first conductive film layer 12 and the second conductive film layer 13 can be respectively adhered to the first surface 1101 and the second surface 1102 of the flexible substrate 11 through adhesives. It should be noted that for clear illustration, these adhesives are not shown in the drawings provided by the present application.

[0021] In addition, in order to improve the electrical conductivity and corrosion resistance of the flexible circuit board 01, the surfaces of the first conductive film layer 12 away from the flexible substrate 11 and the second conductive film layer 13 away from the flexible substrate 11 can also be gold-plated or immersed in gold. The first conductive film layer 12 described in the embodiments of the present application may include a copper foil disposed on the first surface 1101 of the flexible substrate 11 and the metal gold on its surface, and the second conductive film layer 13 may include a copper foil disposed on the second surface 1102 of the flexible substrate 11 and the metal gold on its surface. In addition, both the first conductive film layer 12 and the second conductive film layer 13 may be copper foils, or other metal foils. For the sake of clear illustration, the specific compositions of the first conductive film layer 12 and the second conductive film layer 13 are not shown in the drawings of the embodiments of the present application; and when there is no special description, the first conductive film layer 12 and the second conductive film layer 13 are taken as copper foils as an example for description.

[0022] The first cover film 14 is located on the surface of the first conductive film layer 12 away from the flexible substrate 11. The first cover film 14 can be attached to the surface of the first conductive film layer 12 away from the flexible substrate 11 to protect the first conductive film layer 12 from mechanical damage and chemical corrosion; the second cover film 15 is located on the surface of the second conductive film layer 13 away from the flexible substrate 11. The second cover film 15 can be attached to the surface of the second conductive film layer 13 away from the flexible substrate 11 to protect the second conductive film layer 13 from mechanical damage and chemical corrosion. The first cover film 14 and the second cover film 15 can be PI films or PET films. Among them, the first cover film 14 can be attached to the first conductive film layer 12 through an adhesive, and the second cover film 15 can be attached to the second conductive film layer 13 through an adhesive. It can be understood that at least one of the first cover film 14 and the second cover film 15 includes a plurality of hollow portions to expose the conductive film layer, thereby realizing copper exposure. It should be noted that for the sake of clear illustration, these adhesives are not shown in the drawings provided in the present application.

[0023] The flexible substrate 11 includes a connected first part 111 and a second part 112. The second part 112 is located on the side of the first part 111 close to the edge EL of the flexible circuit board 01, that is, the second part 112 of the flexible substrate 11 is closer to the edge EL of the flexible circuit board 01 than the first part 111. Among them, the second part 112 can be adjacent to the edge EL of the flexible circuit board 01, then the edge of the second part 112 away from the first part 111 can be flush with the edge EL of the flexible circuit board 01. The area of the flexible substrate 11 can basically represent the area of the flexible circuit board 01, and the edge EL of the flexible circuit board 01 is basically flush with the edge of the flexible substrate 11. Since the second part 112 is located on the side of the first part 111 close to the edge EL of the flexible circuit board 01 and the first part 111 is adjacent to the second part 112, the distance between the first part 111 and the edge EL of the flexible circuit board 01 is small and basically equal to the width of the second part 112.

[0024] The first conductive film layer 12 and the second conductive film layer 13 are designed to be retracted relative to the edge of the flexible substrate 11 to minimize the risk of conductive burrs on the conductive film layer when the flexible circuit board 01 is cut and assembled, for example, to minimize the risk of copper burrs. Therefore, along the direction perpendicular to the plane where the flexible circuit board 01 is located, the first conductive film layer 12 and the second conductive film layer 13 do not overlap with the second portion 112, that is, the width of the first conductive film layer 12 and the second conductive film layer 13 retracted relative to the edge EL of the flexible circuit board 01 is the width of the second portion 112.

[0025] If there are conductive burrs such as copper burrs on the edge EL of the flexible circuit board 01 obtained by cutting and assembling, the conductive burrs will have the risk of overlapping and short-circuiting with other conductive structures. Therefore, the first conductive film layer 12 and the second conductive film layer 13 are designed to be retracted relative to the edge of the flexible substrate 11, which can increase the reliability of the electrical connection of the flexible circuit board 01. Among them, based on the existing lamination and cutting accuracy, the width of the first conductive film layer 12 and the second conductive film layer 13 designed to be retracted relative to the edge of the flexible substrate 11 can be about 0.2mm, that is, the distance between the edge of the first conductive film layer 12 and the second conductive film layer 13 and the edge of the flexible substrate 11 is about 0.2mm, so as to avoid cutting the first conductive film layer 12 and the second conductive film layer 13 during cutting and assembling.

[0026] The first conductive film layer 12 includes a first conductive structure 121 and the second conductive film layer 13 includes a second conductive structure 131. In a direction perpendicular to the plane where the flexible circuit board 01 is located, the first conductive structure 121 overlaps with the second conductive structure 131, and the first conductive structure 121 does not overlap with the first cover film 14, and the second conductive structure 131 does not overlap with the second cover film 15. Among them, the first conductive structure 121 is a structure in the first conductive film layer 12 that is exposed by the hollow portion of the first cover film 14, and the second conductive structure 131 is a structure in the second conductive film layer 13 that is exposed by the hollow portion of the second cover film 15.

[0027] The first conductive structure 121 is attached to the first portion 111, and the second conductive structure 131 is attached to at least the first portion 111. That is, conductive structures exposed by the covering films are provided on opposite surfaces of the first portion 111 of the flexible substrate 11. Therefore, the region where the first portion 111 of the flexible circuit board 01 is located includes a double-sided copper-exposed region formed by the first conductive structure 121 and the second conductive structure 131. When the first conductive film layer 12 includes copper foil and the second conductive film layer 13 includes copper foil, the first covering film 14 exposes the first conductive structure 121 to make it copper-exposed, and the second covering film 15 exposes the second conductive structure 131 to make it copper-exposed; then the region where the first conductive structure 131 is located can be a double-sided copper-exposed region. Among them, the region where the first portion 111 in the flexible substrate 11 is located can be a double-sided copper-exposed region, and copper foils exposed by the covering films are attached to opposite sides of the flexible substrate 11 in the double-sided copper-exposed region.

[0028] The first conductive structure 121 is attached to the first portion 111, then the first surface of the second portion 112 is not attached to the first conductive structure 121. Since the second portion 112 is adjacent to the edge EL of the flexible circuit board 01 and the second portion 112 is not attached to the first conductive film layer 12 and the second conductive film layer 13, in order to increase the space utilization rate of the flexible circuit board 01, the width of the second portion 112 is relatively narrow. Then, the distance between the first portion 111 and the edge EL of the flexible circuit board 01 is very close. Therefore, when both the first conductive film layer 12 and the second conductive film layer 13 include copper foil, the distance between the double-sided copper-exposed region included in the region where the first portion 111 is located and the edge EL of the flexible circuit board 01 is very close.

[0029] Figure 5 It is a partial cross-sectional schematic diagram of a flexible circuit board related to an embodiment of the present application.

[0030] As Figure 5As shown, since the double-sided copper-exposed area including the first conductive structure 121 and the second conductive structure 131 is very close to the edge EL of the flexible circuit board 01, after a hollow portion exposing the first conductive structure 121 is formed in the first cover film 14, the hollow portion can simultaneously expose the first conductive structure 121 and the area of the second portion 112 on the side of the first conductive structure 121 adjacent to the edge EL of the flexible circuit board 01. Then, after the first cover film 14 is attached to the first conductive film layer 12, the hollow portion exposing the first conductive structure 121 can extend to the edge EL of the flexible circuit board 01 in the direction parallel to the plane where the flexible circuit board 01 is located; after a hollow portion exposing the second conductive structure 131 is formed in the second cover film 15, the hollow portion can simultaneously expose the second conductive structure 131 and the area of the second portion 112 on the side of the second conductive structure 131 adjacent to the edge EL of the flexible circuit board 01. Then, after the second cover film 15 is attached to the second conductive film layer 13, the hollow portion exposing the second conductive structure 131 can extend to the edge EL of the flexible circuit board 01 in the direction parallel to the plane where the flexible circuit board 01 is located. The preparation of such a flexible circuit board 01 reduces the difficulty of forming the hollow portion on the cover film. However, Figure 5 the flexible circuit board 01 shown is prone to appearance defects such as lint, breakage, and missing.

[0031] As described above, Figure 5 at least a part of the area of the second portion 112 shown is not attached to the first conductive film layer 12, the second conductive film layer 13, the first cover film 14, and the second cover film 15. Then, the overall thickness of the flexible circuit board 01 in the partial area where the second portion 112 is located is relatively thin. For example, in the area where the second portion 112 shown in Figure 5 is located, the overall thickness of the flexible circuit board 01 is basically the thickness of the flexible substrate 11 and is usually about 25 μm. This results in that when the flexible circuit board 01 is obtained by cutting and pasting the layout, the thickness of some cutting positions is relatively thin and the texture is brittle, and appearance defects such as lint, breakage, and missing are likely to occur under the influence of punching.

[0032] In the embodiment of the present application, as shown in Figure 3 and Figure 4 , the flexible circuit board 01 further includes a reinforcing structure 16, and at least the area of the first surface 1101 of the second portion 112 close to the edge EL of the flexible circuit board 01 is attached to the reinforcing structure 16, that is, there is a reinforcing structure 16 in the area of the flexible substrate 11 close to the edge. Therefore, there is a reinforcing structure 16 on the side of the double-sided copper-exposed area of the flexible circuit board 01 facing the edge EL of the flexible circuit board 01. This makes it such that when the flexible circuit board 01 is obtained by cutting and pasting the layout, any cutting position has a relatively large thickness and toughness, and thus the appearance yield and reliability of the flexible circuit board 01 can be improved.

[0033] In one embodiment of the present application, as Figure 4 shown, the reinforcement structure 16 at least includes a first reinforcement structure 161. The first reinforcement structure 161 and the first cover film 14 are located in the same film layer. Then, the first reinforcement structure 161 is at least located on one side of the first conductive structure 121 facing the edge EL of the flexible circuit board 01. The part of the flexible substrate 11 on the side close to the edge EL of the flexible circuit board 01 in the double-sided copper-exposed area is bonded to the first reinforcement structure 161, and the first reinforcement structure 161 can be prepared simultaneously with the first cover film 14, which can reduce the manufacturing difficulty of the flexible circuit board 01 and lower the cost.

[0034] In some implementation manners, the first reinforcement structure 161 and the first cover film 14 are an integral structure, that is, the first reinforcement structure 161 and the first cover film 14 are a continuous structure. The first cover film 14 and the first reinforcement structure 161 can be regarded as different parts of the cover film on one side of the first surface 1101 of the flexible substrate 11. Among them, the first reinforcement structure 161 is the part of the cover film that is located on the side of the first conductive structure 121 facing the edge EL of the flexible circuit board 01 and is at least bonded to the second part 112. The hollow part on the first cover film 14 can be opened before being bonded to the first conductive film layer 12. Therefore, after the hollow part exposing the first conductive structure 121 is opened, the first reinforcement structure 161 is formed.

[0035] In one embodiment of the present application, as Figure 4 shown, the minimum distance between the first conductive structure 121 and the edge EL of the flexible circuit board 01 is d1, and d1 is greater than or equal to 0.5 mm. Since the first conductive structure 121 is exposed by the first cover film 14 on one side of the first surface 1101 of the flexible substrate 11, the minimum distance between the edge of the hollow part exposing the first conductive structure 121 and the edge EL of the flexible circuit board 01 is greater than or equal to 0.5 mm. When the first reinforcement structure 161 and the first cover film 14 are in the same layer, the minimum distance between the edge of the first reinforcement structure 161 adjacent to the hollow part and the edge EL of the flexible circuit board 01 is d1, and d1 is greater than or equal to 0.5 mm, that is, the width of the first reinforcement structure 161 is basically d1, and d1 is greater than or equal to 0.5 mm.

[0036] In the flexible circuit board 01 provided in this embodiment, when the first cover film 14 is attached to the first conductive film layer 12, due to process errors, there is a certain misalignment between the hollow part exposing the first conductive structure 121 and the alignment of the first conductive structure 121. That is, even if there is a certain misalignment between the alignment of the first reinforcing structure 161 outside the hollow part and the second part 112 due to process errors, since the width of the first reinforcing structure 161 is set to be greater than or equal to 0.5 mm and the existing attachment accuracy is less than 0.5 mm, as long as the misalignment distance of the attachment does not exceed 0.5 mm, the first reinforcing structure 161 and the second part 112 can be attached. Therefore, the risk that the first reinforcing structure 161 is offset to the outside of the area where the flexible circuit board 01 is located is greatly reduced, that is, the risk that the second part 112 cannot be attached to the first reinforcing structure 161 is also greatly reduced.

[0037] In an embodiment of the present application, as Figure 4 shown, there is no reinforcing structure 16 between the second conductive structure 131 and the edge EL of the adjacent flexible circuit board 01, that is, no reinforcing structure 16 is provided on the second surface 1102 of the second part 112 on the side where the second conductive structure 131 faces the edge EL of the flexible circuit board 01.

[0038] Among them, as Figure 4 shown, the minimum distance between the first conductive structure 121 and the edge EL of the flexible circuit board 01 is greater than the minimum distance between the second conductive structure 131 and the edge EL of the flexible circuit board 01. The edge of the second conductive structure 131 facing the edge EL of the flexible circuit board 01 is a part of the edge of the second conductive film layer 13 facing the edge of the flexible circuit board 01, then the area of the second conductive structure 131 is relatively larger, its preparation difficulty is small and the yield of electrical connection with external devices increases.

[0039] Figure 6 For Figure 1 and Figure 2 is another partial schematic diagram in Figure 7 For Figure 6 is a cross-sectional schematic diagram along the B1 - B2 direction in

[0040] In an embodiment of the present application, as Figure 6 and Figure 7 shown, the first reinforcing structure 161 is attached to the second part 112, that is, the first reinforcing structure 161 is not attached to the first conductive film layer 12. Among them, the width by which the first conductive film layer 12 is retracted relative to the edge EL of the flexible circuit board 01 can be 0.2 mm or 0.5 mm.

[0041] In a technical solution corresponding to this embodiment, as Figure 7As shown, there is no reinforcement structure 16 between the second conductive structure 131 and the edge EL of the adjacent flexible circuit board 01, and the first reinforcement structure 161 is not adhered to the first conductive film layer 12. At this time, the width by which the first conductive film layer 12 is retracted relative to the edge EL of the flexible circuit board 01 is greater than the width by which the second conductive film layer 13 is retracted relative to the edge EL of the flexible circuit board 01, so that the distance between the first conductive structure 121 and the edge EL of the flexible circuit board 01 is greater than the distance between the second conductive structure 131 and the edge EL of the flexible circuit board 01. For example, the width by which the first conductive film layer 12 is retracted relative to the edge EL of the flexible circuit board 01 is d1 and d1 = 0.5 mm, and the width by which the second conductive film layer 13 is retracted relative to the edge EL of the flexible circuit board 01 is d2 and d2 = 0.2 mm. When the retraction distance of the first conductive film layer 12 relative to the edge EL of the flexible circuit board 01 is greater, the first reinforcement structure 161 can have a greater width to reduce its manufacturing difficulty, and the difficulty of adhering the first reinforcement structure 161 to the second part 112 of the flexible substrate 11 is reduced.

[0042] Figure 8 FIG. is a partial cross-sectional schematic diagram of a flexible circuit board provided by an embodiment of the present application. It should be noted that, for a clearer illustration of different structures of the flexible circuit board 01, Figure 8 the structures sequentially arranged in the direction Z perpendicular to the plane where the flexible circuit board 01 is located in the flexible circuit board 01 are split, and when these structures are adhered together, they are as Figure 4 shown.

[0043] In an embodiment of the present application, as Figure 8 shown, the second part 112 includes a first sub-part 1121 and a second sub-part 1122, and the second sub-part 1122 is located on the side of the first sub-part 1121 close to the edge EL of the flexible circuit board 01. The first conductive film layer 12 includes a third conductive structure 123 connected to the first conductive structure 121, and the third conductive structure 123 is adhered to the first sub-part 1121. Since the first conductive structure 121 is adhered to the first part 111 and the first sub-part 1121 is located on the side of the first part 111 close to the edge EL of the flexible circuit board 01, the third conductive structure 123 adhered to the first sub-part 1121 is located on the side of the first conductive structure 121 adhered to the first part 111 close to the edge EL of the flexible circuit board 01. That is, the first conductive film layer 12 extends from the first conductive structure 121 towards the edge EL of the flexible circuit board 01 and forms the third conductive structure 123.

[0044] In this embodiment, the first conductive film layer 12 is not adhered to the second sub - part 1122, so as to realize the inward shrinkage of the first conductive film layer 12 relative to the edge EL of the flexible circuit board 01. Among them, part of the first reinforcing structure 161 is adhered to the third conductive structure 123 and part is adhered to the first surface 1101 of the second sub - part 1122. That is, the first reinforcing structure 161 is adhered to the edge part of the first conductive film layer 12 included on the side of the first conductive structure 121 facing the flexible circuit board 01 and the flexible substrate 11 not adhered by the first conductive film layer 12. Therefore, the first reinforcing structure 161 can have a relatively wide width, reducing the manufacturing difficulty.

[0045] In a technical solution corresponding to this embodiment, as Figure 4 and Figure 8 shown, there is no reinforcing structure 16 between the second conductive structure 131 and the edge EL of the adjacent flexible circuit board 01, and part of the first reinforcing structure 161 is adhered to the third conductive structure 123. Among them, the widths of the first conductive film layer 12 and the second conductive film layer 13 that are inwardly shrunk relative to the edge EL of the flexible circuit board 01 can be the same. Then, the first reinforcing structure 161 is adhered to at least part of the edge area of the first conductive film layer 12, so that the distance between the first conductive structure 121 exposed by the hollow part of the first covering film 14 and the edge EL of the flexible circuit board 01 is greater than the width of the inward shrinkage of the first conductive film layer 12 relative to the edge EL of the flexible circuit board 01; the edge of the second conductive structure 131 facing the edge EL of the flexible circuit board 01 is a part of the edge of the first conductive film layer 12 facing the edge EL of the flexible circuit board 01. For example, as Figure 8 shown, the widths of the first conductive film layer 12 and the second conductive film layer 13 that are inwardly shrunk relative to the edge EL of the flexible circuit board 01 are both d3 and d3 = 0.2 mm, while the distance between the first conductive structure 121 and the edge EL of the flexible circuit board 01 is d1 and d1 = 0.5 mm. When the inward shrinkage widths of the first conductive film layer 12 and the second conductive film layer 13 relative to the edge EL of the flexible circuit board 01 are the same, the manufacturing difficulty of the flexible circuit board 01 can be reduced and the effective utilization rates of the first conductive film layer 12 and the second conductive film layer 13 can be higher; in addition, when the width between the first conductive structure 121 and the edge EL of the flexible circuit board 01 is larger, the first reinforcing structure 161 can have a larger width to reduce its manufacturing difficulty, and the adhesion difficulty of the first reinforcing structure 161 is reduced.

[0046] As Figure 4 and Figure 8As shown, when the region between the second conductive structure 131 and the edge EL of the adjacent flexible circuit board 01 does not include the reinforcing structure 16, the edge of the third conductive structure 123 close to the edge EL of the flexible circuit board 01 is aligned with the edge of the second conductive structure 131 close to the edge EL of the flexible circuit board 01 in the direction perpendicular to the plane where the flexible circuit board 01 is located. Therefore, a part of the second conductive structure 131 is attached to the second surface of the first part 111 of the flexible substrate 11 and another part is attached to the second surface of the first sub-part 1121. The first conductive structure 121 is attached to the first surface of the first part 111 of the flexible substrate 11 and the third conductive structure 123 is attached to the first surface of the first sub-part 1121 of the flexible substrate 11. Neither the first surface nor the second surface of the second sub-part 1122 of the flexible substrate 11 is attached to the conductive film layer. For example, as Figure 8 shown, the right edge of the third conductive structure 123 is the edge close to the edge EL of the flexible circuit board 01, the right edge of the second conductive structure 131 is the edge close to the edge EL of the flexible circuit board 01, and the right edge of the third conductive structure 123 is aligned with the right edge of the second conductive structure 131 in the direction perpendicular to the plane where the flexible circuit board is located. In this technical solution, the width by which the first conductive film layer 12 is recessed relative to the edge EL of the flexible circuit board 01 is equal to the width by which the second conductive film layer 13 is recessed relative to the flexible circuit board 01, reducing the manufacturing difficulty of the first conductive film layer 12 and the second conductive film layer 13.

[0047] Figure 9 For Figure 1 and Figure 2 a partial schematic diagram in

[0048] In an embodiment of the present application, as Figure 9 shown, the reinforcing structure 16 includes a second reinforcing structure 162. At least a part of the second surface 1102 of the second part 112 close to the edge EL of the flexible circuit board 01 is attached to the second reinforcing structure 162, and the second reinforcing structure 162 is at least located on one side of the second conductive structure 131 facing the edge EL of the flexible circuit board 01. Both the first surface 1101 and the second surface 1102 of the second part 112 are attached to the reinforcing structure 16. Therefore, the part of the flexible substrate 11 on the side close to the edge EL of the double-sided copper-exposed area is attached to the first reinforcing structure 161 and the second reinforcing structure 162.

[0049] In the flexible circuit board 01 provided in this embodiment, the side of the double-sided copper-exposed area facing the edge EL of the flexible circuit board 01 includes a first reinforcing structure 161 and a second reinforcing structure 162. Therefore, the part of the flexible circuit board 01 on the side of the double-sided copper-exposed area facing the edge EL of the flexible circuit board 01 has greater thickness and toughness, effectively reducing the probability of appearance defects such as lint, breakage, and missing when the flexible circuit board 01 is obtained by cutting and pasting the layout.

[0050] In an embodiment of the present application, as Figure 9 shown, the second reinforcing structure 162 and the second cover film 15 are located in the same film layer. Then, the second reinforcing structure 162 can be prepared simultaneously with the second cover film 15, which can reduce the preparation difficulty of the flexible circuit board 01 and lower the cost.

[0051] In some implementation manners, the second reinforcing structure 162 and the second cover film 15 are an integral structure, that is, the second reinforcing structure 162 and the second cover film 15 are a continuous structure. The second cover film 15 and the second reinforcing structure 162 can be regarded as different parts of the cover film on the side of the second surface 1102 of the flexible substrate 11. Among them, the second reinforcing structure 162 is the part of the cover film located on the side of the second conductive structure 131 facing the edge EL of the flexible circuit board 01 and at least in contact with the second part 112. The hollow part on the second cover film 15 can be opened before being attached to the second conductive film layer 13. Therefore, after the hollow part exposing the second conductive structure 131 is opened, the second reinforcing structure 162 is formed.

[0052] In an embodiment of the present application, as Figure 9 shown, the minimum distance between the second conductive structure 131 and the edge EL of the flexible circuit board 01 is greater than or equal to 0.5 mm. Since the second conductive structure 131 is exposed by the second cover film 15 on the side of the first surface 1101 of the flexible substrate 11, the minimum distance between the edge of the hollow part exposing the second conductive structure 131 and the edge EL of the flexible circuit board 01 is greater than or equal to 0.5 mm. When the second reinforcing structure 162 and the second cover film 15 are in the same layer, the minimum distance between the edge of the second reinforcing structure 162 adjacent to the hollow part and the edge EL of the flexible circuit board 01 is d4 and d4 is greater than or equal to 0.5 mm, that is, the width of the second reinforcing structure 162 is basically d4 and d4 is greater than or equal to 0.5 mm.

[0053] In the flexible circuit board 01 provided in this embodiment, when the second cover film 15 is attached to the second conductive film layer 13, due to process errors, there is a certain misalignment between the alignment of the hollow portion exposing the second conductive structure 131 and the second conductive structure 131. That is, even if there is a certain misalignment between the alignment of the second reinforcing structure 162 outside the hollow portion and the second part 112 due to process errors, but since the width of the second reinforcing structure 162 is set to be greater than or equal to 0.5 mm and the existing attachment accuracy is less than 0.5 mm, as long as the misalignment distance of the attachment does not exceed 0.5 mm, the second reinforcing structure 162 and the second part 112 can be attached. Therefore, the risk that the second reinforcing structure 162 is offset to the outside of the area where the flexible circuit board 01 is located is greatly reduced, that is, the risk that the second part 112 cannot be attached to the second reinforcing structure 162 is also greatly reduced.

[0054] In one implementable manner, as Figure 9 shown, the second conductive film layer 13 includes a fourth conductive structure 133 connected to the second conductive structure 131. The fourth conductive structure 133 is attached to the first sub - part 1121 and the second conductive film layer 13 is not attached to the second sub - part 1122. At this time, the fourth conductive structure 133 can adopt the same inventive concept as the third conductive structure 123 in the above - mentioned embodiment, and will not be elaborated here.

[0055] Figure 10 It is a partial cross - sectional schematic diagram of another flexible circuit board provided by an embodiment of the present application.

[0056] In one implementable manner, as Figure 10 shown, the second reinforcing structure 162 is attached to the second part 112, that is, the second reinforcing structure 162 is not attached to the second conductive film layer 13. At this time, the second reinforcing structure 162 and the second conductive structure 131 can adopt the same inventive concept as the first reinforcing structure 161 and the first conductive structure 121 in the Figure 6 and Figure 7 corresponding embodiments, and will not be elaborated here.

[0057] In an embodiment of the present application, as Figure 9 and Figure 10 shown, the edge of the first conductive structure 121 close to the edge EL of the flexible circuit board 01 is aligned with the edge of the second conductive structure 131 close to the edge EL of the flexible circuit board 01 in the direction perpendicular to the plane where the flexible circuit board 01 is located. For example, as Figure 9 and Figure 10As shown, the right edge of the first conductive structure 121 is the edge close to the edge EL of the flexible circuit board 01, and the right edge of the second conductive structure 131 is the edge close to the edge EL of the flexible circuit board 01. The right edge of the first conductive structure 121 is aligned with the right edge of the second conductive structure 131 in the direction Z perpendicular to the plane where the flexible circuit board 01 is located.

[0058] In a technical solution corresponding to this embodiment, the area of the first conductive structure 121 in the plane parallel to the plane where the flexible circuit board 01 is located is equal to the area of the second conductive structure 131 in the plane parallel to the plane where the flexible circuit board 01 is located. Then, the orthographic projections of the first conductive structure 121 and the second conductive structure 131 on the flexible substrate 11 can coincide. At this time, the process schemes and process precisions for preparing the first conductive structure 121 and the second conductive structure 131 can be the same, which is easy to implement.

[0059] For example, as Figure 9 shown, a part of the first reinforcing structure 161 is attached to the first conductive film layer 12, and a part of the second reinforcing structure 162 is attached to the second conductive film layer 13. Along the direction Z perpendicular to the plane where the flexible circuit board 01 is located, the orthographic projections of the first conductive structure 121 and the second conductive structure 131 on the flexible substrate 11 coincide.

[0060] For example, as Figure 10 shown, the first reinforcing structure 161 is not attached to the first conductive film layer 12, and the second reinforcing structure 162 is not attached to the second conductive film layer 13. Along the direction Z perpendicular to the plane where the flexible circuit board 01 is located, the orthographic projections of the first conductive structure 121 and the second conductive structure 131 on the flexible substrate 11 coincide.

[0061] It should be noted that the above-mentioned coincidence of projections refers to the coincidence of projections within the process error range.

[0062] Figure 11 For Figure 1 and Figure 2 is another partial schematic diagram in Figure 12 For Figure 11 is a partial enlarged schematic diagram of Figure 13 For Figure 11 is a cross-sectional schematic diagram along the C1-C2 direction in

[0063] In an embodiment of the present application, in combination with Figure 11 , Figure 12 and Figure 13 , the reinforcing structure 16 includes a plurality of third reinforcing structures 163, and the third reinforcing structures 163 and the first conductive film layer 12 are located in the same film layer. Then, the third reinforcing structures 163 can be prepared simultaneously with the first conductive film layer 12, so that the flexible circuit board 01 has a simple preparation process flow.

[0064] The third reinforcing structure 163 is at least located on one side of the first conductive structure 121 facing the edge EL of the flexible circuit board 01. The third reinforcing structure 163 includes a first end portion 1631 adjacent to the edge EL of the flexible circuit board 01 and a first connecting portion 1632 away from the edge of the flexible circuit board 01 and connected to the first conductive structure 121. Therefore, the plurality of third reinforcing structures 163 can be regarded as protrusions provided on one side of the first conductive structure 121 facing the edge EL of the flexible circuit board 01 and connected thereto. For example, as Figure 11 shown, there are a plurality of third reinforcing structures 163 between the first conductive structure 121 and the edge EL located above it, a plurality of third reinforcing structures 163 between the first conductive structure 121 and the edge EL located below it, and a plurality of third reinforcing structures 163 between the first conductive structure 121 and the edge EL located on its right side.

[0065] In addition, the width of the first end portion 1631 of the third reinforcing structure 163 in the first direction X can be smaller than the width of the first connecting portion 1632 in the first direction X, where the first direction X is parallel to the extending direction of the edge adjacent to the first end portion 1631 in the flexible circuit board 01. That is, the width of one end of the third reinforcing structure 163 close to the edge of the flexible circuit board 01 is smaller than the width of the end away from the edge of the flexible circuit board 01. For example, as Figure 12 shown, the lower end of the third reinforcing structure 163 between the first conductive structure 121 and the edge EL located below it is the first end portion 1631 and the upper end is the first connecting portion 1632. At this time, the first direction X is parallel to the extending direction of the edge EL and the first direction X is the row direction. Therefore, the width of the first end portion 1631 in the row direction is smaller than the width of the first connecting portion 1632 in the row direction; the right end of the third reinforcing structure 163 between the first conductive structure 121 and the edge EL located on its right side is the first end portion 1631 and the left end is the first connecting portion 1632. At this time, the first direction X is parallel to the extending direction of the edge EL and the first direction X is the column direction. Therefore, the width of the first end portion 1631 in the column direction is smaller than the width of the first connecting portion 1632 in the column direction; combined with Figure 12 and Figure 11 , the upper end of the third reinforcing structure 163 between the first conductive structure 121 and the edge EL located above it is the first end portion 1631 and the lower end is the first connecting portion 1632. At this time, the first direction X is parallel to the extending direction of the edge EL and the first direction X is the row direction. Therefore, the width of the first end portion 1631 in the row direction is smaller than the width of the first connecting portion 1632 in the row direction. It should be noted that the first direction X does not point to a unique direction. It can represent the extending direction of the edge EL of the flexible circuit board 01. When the edges EL of the flexible circuit board 01 in different regions are different, the directions pointed to by the first direction X corresponding to these regions are also different.

[0066] In this embodiment, the third reinforcing structure 163 is attached to the second part 112 of the flexible substrate 11, that is, the part of the flexible substrate 11 located on the side of the double-sided copper-exposed area close to the edge EL of the flexible circuit board 01 is attached to the third reinforcing structure 163, and the third reinforcing structure 163 can be prepared simultaneously with the first conductive film layer 12, which can reduce the manufacturing difficulty of the flexible circuit board 01 and lower the cost. Moreover, the first end 1631 of the third reinforcing structure 163 on the same layer as the first conductive film layer 12 has a smaller width, so the setting of the third reinforcing structure 163 can reduce the probability of conductive burrs appearing in the third reinforcing structure 163 while increasing the thickness and toughness of the cutting position, ensuring the reliability of the flexible circuit board 01.

[0067] In one embodiment of the present application, as Figure 11 shown, the third reinforcing structure 163 and the first conductive structure 121 are an integral structure, that is, the third reinforcing structure 163 and the first conductive structure 121 are a continuous structure. The third reinforcing structure 163 and the first conductive structure 121 can be regarded as different parts of the conductive film layer on one side of the first surface 1101 of the flexible substrate 11. Among them, the third reinforcing structure 163 is the part of the conductive film layer located on the side of the first conductive structure 121 facing the edge EL of the flexible circuit board 01 and at least attached to the second part 112. When patterning the conductive film layer to obtain circuits and conductive structures including the first conductive structure 121, the third reinforcing structure 163 can be obtained simultaneously.

[0068] In one embodiment of the present application, the third reinforcing structure 163 includes a copper film. Specifically, the third reinforcing structure 163 can be a part of the copper film coated or deposited on the first surface 1101 of the flexible substrate 11, or can be a part of the copper film formed after attaching a copper foil to the first surface 1101 of the flexible substrate 11.

[0069] When the third reinforcing structure 163 and the first conductive film layer 12 are located in the same film layer, the first conductive film layer 12 can also include the above-mentioned copper film.

[0070] Figure 14 It is a partial schematic diagram of a flexible circuit board provided by an embodiment of the present application. Figure 15 It is another partial schematic diagram of a flexible circuit board provided by an embodiment of the present application. Figure 16 It is another partial schematic diagram of a flexible circuit board provided by an embodiment of the present application.

[0071] The third reinforcing structure is as Figures 14 to 16As shown, the shape of the third reinforcing structure 163 includes at least one of a triangle, a semi-circle, and a trapezoid. Here, the shape of the third reinforcing structure 163 is the shape of the third reinforcing structure in the plane parallel to the plane where the flexible circuit board 01 is located, that is, the shape of the orthographic projection of the third reinforcing structure on the flexible substrate 11.

[0072] For example, as Figure 14 shown, the shape of the third reinforcing structure 163 is a triangle, and one vertex angle of the triangle is adjacent to or coincides with the edge EL of the flexible circuit board 01, and the other two vertex angles are away from the edge EL of the flexible circuit board 01. For example, as Figure 15 shown, the shape of the third reinforcing structure 163 is a semi-circle, and the arc side of the semi-circle is adjacent to or partially coincides with the edge of the flexible circuit board 01, and the straight side is away from the edge EL of the flexible circuit board 01. For example, as Figure 16 shown, the shape of the third reinforcing structure 163 is a trapezoid, and the shorter bottom side of the trapezoid is adjacent to or coincides with the edge EL of the flexible circuit board 01, and the longer bottom side is away from the edge EL of the flexible circuit board 01.

[0073] Figure 17 This is a partial schematic diagram of another flexible circuit board provided by the embodiment of the present application.

[0074] In an embodiment of the present application, as Figure 17 shown, the reinforcing structure 16 includes both the first reinforcing structure 161 and the third reinforcing structure 163, that is, the first side 1101 of the second part 112 of the flexible substrate 11 includes the first reinforcing structure 161 and the third reinforcing structure 163. In the flexible circuit board 01 provided in this embodiment, the side of the first conductive structure 121 facing the edge EL of the flexible circuit board 01 includes the third reinforcing structure 163 and the first reinforcing structure 161 arranged in a stacked manner. Therefore, when the flexible circuit board 01 is obtained by cutting and pasting the layout, any cutting position has greater thickness and toughness, and thus the appearance yield and reliability of the flexible circuit board 01 can be improved.

[0075] It should be noted that Figure 17 illustrates the way in which the first reinforcing structure 161 is attached to the second sub-part 1122 and the third conductive structure 123 of the first conductive film layer 12. However, the first reinforcing structure 161 can also be attached to the second part 112 and not attached to the first conductive film layer 12.

[0076] In an embodiment of the present application, as Figures 14 to 16As shown, the length of the third reinforcement structure 163 in the second direction is d5 and d5 is greater than or equal to 0.2 mm. The second direction Y is parallel to the arrangement direction of the second part 112 with which the third reinforcement structure 163 is attached and the first part 111 connected thereto. In addition, the second direction Y can also be perpendicular to the extension direction X of the edge EL of the flexible circuit board 01 adjacent to the third reinforcement structure 163.

[0077] When the length of the third reinforcement structure 163 in the second direction is greater than or equal to 0.2 mm, considering the cutting and paneling error, it can ensure that the cutting position is provided with the third reinforcement structure 163 and effectively avoid cutting the second conductive film layer 13; in addition, the third reinforcement structure 163 is easier to prepare.

[0078] Figure 18 It is a partial schematic diagram of another flexible circuit board provided by an embodiment of the present application. Figure 19 is Figure 18 a partial enlarged schematic diagram of Figure 20 is Figure 18 a cross-sectional schematic diagram along the D1-D2 direction in

[0079] In an embodiment of the present application, as Figure 20 shown, the reinforcement structure 16 includes a plurality of fourth reinforcement structures 164, and at least a part of the second surface 1102 of the second part 112 close to the edge EL of the flexible circuit board 01 is attached to the fourth reinforcement structure 164. The first surface 1101 of the second part 112 is attached to the first reinforcement structure 161 and the third reinforcement structure 163, and the second surface 1102 is at least attached to the fourth reinforcement structure 164.

[0080] In an embodiment of the present application, as Figure 20 shown, the fourth reinforcement structure 164 and the second conductive film layer 13 are located in the same film layer. Then the fourth reinforcement structure 164 can be prepared simultaneously with the second conductive film layer 13, so that the flexible circuit board 01 has a simple preparation process flow.

[0081] The fourth reinforcement structure 164 is at least located on the side of the second conductive structure 131 facing the edge EL of the flexible circuit board 01. The fourth reinforcement structure 164 includes a second end portion 1641 adjacent to the edge EL of the flexible circuit board 01 and a second connecting portion 1642 far from the edge of the flexible circuit board 01 and connected to the second conductive structure 131. Therefore, a plurality of fourth reinforcement structures 164 can be regarded as protrusions provided on the side of the second conductive structure 131 facing the edge EL of the flexible circuit board 01 and connected thereto. For example, as Figure 18As shown, between the second conductive structure 131 and the edge EL above it, there are a plurality of fourth reinforcing structures 164; between the second conductive structure 131 and the edge EL below it, there are a plurality of fourth reinforcing structures 164; and between the second conductive structure 131 and the edge EL to its right, there are a plurality of fourth reinforcing structures 164.

[0082] In addition, the width of the second end portion 1641 of the fourth reinforcing structure 164 along the first direction X is smaller than the width of the second connecting portion 1642 along the first direction X, where the first direction X is parallel to the extending direction of the edge adjacent to the second end portion 1641 in the flexible circuit board 01. That is, the width of one end of the third reinforcing structure 163 adjacent to the edge of the flexible circuit board 01 is smaller than the width of the end away from the edge of the flexible circuit board 01. For example, as Figure 19 shown, the lower end of the fourth reinforcing structure 164 between the second conductive structure 131 and the edge EL below it is the second end portion 1641 and the upper end is the second connecting portion 1642. At this time, the first direction X is parallel to the extending direction of the edge EL and the first direction X is the row direction. Therefore, the width of the second end portion 1641 along the row direction is smaller than the width of the second connecting portion 1642 along the row direction; the right end of the fourth reinforcing structure 164 between the second conductive structure 131 and the edge EL to its right is the second end portion 1641 and the left end is the second connecting portion 1642. At this time, the first direction X is parallel to the extending direction of the edge EL and the first direction X is the column direction. Therefore, the width of the second end portion 1641 along the column direction is smaller than the width of the second connecting portion 1642 along the column direction; combined with Figure 19 and Figure 18 , the upper end of the fourth reinforcing structure 164 between the second conductive structure 131 and the edge EL above it is the second end portion 1641 and the lower end is the second connecting portion 1642. At this time, the first direction X is parallel to the extending direction of the edge EL and the first direction X is the row direction. Therefore, the width of the second end portion 1641 along the row direction is smaller than the width of the second connecting portion 1642 along the row direction.

[0083] In this embodiment, at least a part of the fourth reinforcing structure 164 is attached to the second part 112 of the flexible substrate 11, that is, the part of the flexible substrate 11 on the side close to the edge EL of the flexible circuit board 01 in the double-sided copper-exposed area is attached to the fourth reinforcing structure 164, and the fourth reinforcing structure 164 can be prepared simultaneously with the second conductive film layer 13, which can reduce the manufacturing difficulty of the flexible circuit board 01 and lower the cost. Moreover, since the second end portion of the fourth reinforcing structure 164 on the same layer as the second conductive film layer 13 has a smaller width, the setting of the fourth reinforcing structure 164 can improve the thickness and toughness at the cutting position while reducing the probability of conductive burrs appearing in the fourth reinforcing structure 164, ensuring the reliability of the flexible circuit board 01.

[0084] Among them, the fourth reinforcement structure 164 can be an integral structure with the second conductive film layer 13. The specific implementation method can refer to the solution in the above embodiment in which the third reinforcement structure 163 can be an integral structure with the first conductive film layer 13, and will not be elaborated here.

[0085] In addition, the material, length, and shape of the fourth reinforcement structure 164 can also refer to the solution of the material, length, and shape of the third reinforcement structure 163 in the above embodiment, and will not be elaborated here.

[0086] Figure 21 It is a partial cross-sectional schematic diagram of another flexible circuit board provided by an embodiment of the present application.

[0087] And, as Figure 21 shown, one side of the second conductive structure 131 facing the edge EL of the flexible circuit board 01 includes a fourth reinforcement structure 164 and a second reinforcement structure 162 arranged in a stacked manner. The specific implementation method can refer to the solution in the above embodiment in which one side of the first conductive structure 121 facing the edge EL of the flexible circuit board 01 includes a third reinforcement structure 163 and a first reinforcement structure 161 arranged in a stacked manner, and will not be elaborated here.

[0088] Figure 22 For Figure 11 a cross-sectional schematic diagram along the E1-E2 direction in

[0089] In an embodiment of the present application, as Figure 22 shown, in the direction Z perpendicular to the plane where the flexible circuit board 01 is located, the projections of the third reinforcement structure 163 and the fourth reinforcement structure 164 coincide. Then, the part of the flexible circuit board 01 in the area where the third reinforcement structure 163 and the fourth reinforcement structure 164 are located has greater thickness and toughness.

[0090] Figure 23 For Figure 11 another cross-sectional schematic diagram along the E1-E2 direction in

[0091] In an embodiment of the present application, in combination with Figure 18 and Figure 23 , in the direction parallel to the plane where the flexible circuit board 01 is located, the first end 163 of the third reinforcement structure 163 close to the edge EL of the flexible circuit board 01 and the second end 164 of the fourth reinforcement structure 164 close to the edge EL of the flexible circuit board 01 are alternately arranged. Then, more area of the flexible circuit board 01 in the area close to the edge EL of the flexible circuit board 01 includes the reinforcement structure 16.

[0092] Figure 24 It is a partial cross-sectional schematic diagram of another flexible circuit board provided by an embodiment of the present application.

[0093] In one embodiment of the present application, as Figure 9 , Figure 10 , Figure 13 , Figure 20 , Figure 21 and Figure 24 shown, along the direction Z perpendicular to the plane where the flexible circuit board 01 is located, neither the first conductive structure 121 nor the second conductive structure 131 overlaps with the reinforcement structure 16. And along the direction Z perpendicular to the plane where the flexible circuit board 01 is located, the edge of the first conductive structure 121 close to the edge EL of the flexible circuit board 01 is aligned with the edge of the second conductive structure 131 close to the edge EL of the flexible circuit board 01.

[0094] Figure 25 FIG. is a schematic diagram of a panel layout provided by an embodiment of the present application.

[0095] In one embodiment of the present application, when the double-sided copper-exposed areas 10 of adjacent flexible circuit boards 01 in the panel layout are adjacent, the distance between the adjacent double-sided copper-exposed areas 10 belonging to different flexible circuit boards 01 can be d6 and d6 is greater than or equal to 5 mm. In the panel layout, the area between the adjacent double-sided copper-exposed areas 10 belonging to different flexible circuit boards 01 is a waste area. When d6≥5 mm, the difficulty of setting the reinforcement structure in this waste area is reduced, so that when the panel layout is cut to obtain the flexible circuit board 01, the thickness and toughness of the cutting position are greater. In addition, while ensuring the layout utilization rate, the waste area between the adjacent double-sided copper-exposed areas 10 belonging to different flexible circuit boards 01 can have better flatness. Therefore, when the panel layout is cut to obtain the flexible circuit board 01, the flatness of the cutting position is better, the punching stress and the pulling force at the copper-exposed part can be reduced, and the breakage defect can be reduced.

[0096] Figure 26 FIG. is a schematic diagram of a display module provided by an embodiment of the present application.

[0097] The embodiment of the present application also provides a display module 001, as Figure 26 shown, the display module 001 includes the flexible circuit board 01 and the display panel 02 provided in any of the above embodiments, and the flexible circuit board 01 is electrically connected to the display panel 02. Figure 26 The connection manner between the flexible circuit board 01 and the display panel 02 in the display module 001 shown is only for illustrative purposes, and the connection manner between the flexible circuit board 01 and the display panel 02 in the display module 001 can also be other connection manners.

[0098] Figure 27 FIG. is a schematic diagram of a display device provided by an embodiment of the present application.

[0099] The embodiment of the present invention also provides a display device, as Figure 27 shown, the display device includes the above display panel 001. Of course,Figure 27 The display device shown is only for illustrative purposes. The display device can be any electronic device with a display function, such as a mobile phone, a tablet computer, a laptop, an e-reader, or a television, etc.

[0100] The above are only the preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present application shall be included within the scope of protection of the present application.

Claims

1. A flexible circuit board, characterized in that: include: A flexible substrate, comprising a first surface and a second surface opposite to each other; the flexible substrate comprises a first portion and a second portion connected to each other, the second portion being located on a side of the first portion close to an edge of the flexible circuit board; A first conductive film layer, located on a first surface of the flexible substrate; The first conductive film layer includes a first conductive structure, and the first conductive structure is attached to the first portion; A second conductive film layer is located on the second surface of the flexible substrate; the second conductive film layer includes a second conductive structure, and the second conductive structure is at least attached to the first portion; A first covering film is located on a side of the first conductive film layer away from the flexible substrate; Along a direction perpendicular to the plane where the flexible circuit board is located, the first conductive structure and the first covering film do not overlap; A second covering film is located on a side of the second conductive film layer away from the flexible substrate; along a direction perpendicular to the plane where the flexible circuit board is located, the second conductive structure and the second covering film do not overlap; Among them, along the direction perpendicular to the plane where the flexible circuit board is located, the first conductive structure overlaps with the second conductive structure, and the first conductive film layer and the second conductive film layer do not overlap with the second part; at least the area close to the edge of the flexible circuit board in the first surface of the second part is in contact with the reinforcement structure.

2. The flexible circuit board according to claim 1, characterized in that: The reinforcement structure includes at least a first reinforcement structure, and the first reinforcement structure and the first covering film are located in the same film layer.

3. The flexible circuit board according to claim 2, characterized in that: The minimum distance between the first conductive structure and the edge of the flexible circuit board is greater than or equal to 0.5 mm.

4. The flexible circuit board according to claim 2, characterized in that: The reinforcing structure is not included between the second conductive structure and the adjacent edge of the flexible circuit board; A minimum distance between the first conductive structure and an edge of the flexible circuit board is greater than a minimum distance between the second conductive structure and an edge of the flexible circuit board.

5. The flexible circuit board according to claim 4, characterized in that: The second part includes a first sub-part and a second sub-part, and the second sub-part is located on a side of the first sub-part close to the edge of the flexible circuit board; The first conductive film includes a third conductive structure connected to the first conductive structure, and the third conductive structure is in contact with the first sub-portion; A portion of the first reinforcement structure is in contact with the third conductive structure and a portion of the first surface of the second sub-portion is in contact with the third conductive structure.

6. The flexible circuit board according to claim 5, characterized in that: An edge of the third conductive structure close to an edge of the flexible circuit board is aligned with an edge of the second conductive structure close to an edge of the flexible circuit board in a direction perpendicular to a plane where the flexible circuit board is located.

7. The flexible circuit board according to claim 2, characterized in that: The reinforcement structure includes a second reinforcement structure, and at least a portion of the second surface of the second portion close to an edge of the flexible circuit board is in contact with the second reinforcement structure.

8. The flexible circuit board according to claim 7, characterized in that: The second reinforcement structure and the second covering film are located in the same film layer.

9. The flexible circuit board according to claim 7, characterized in that: The minimum distance between the second conductive structure and the edge of the flexible circuit board is greater than or equal to 0.5 mm.

10. The flexible circuit board according to claim 7, characterized in that: An edge of the first conductive structure close to an edge of the flexible circuit board is aligned with an edge of the second conductive structure close to an edge of the flexible circuit board in a direction perpendicular to a plane where the flexible circuit board is located.

11. The flexible circuit board according to claim 1, characterized in that: The reinforcement structure includes a plurality of third reinforcement structures, wherein the third reinforcement structures and the first conductive film layer are located in the same film layer; the third reinforcement structure includes a first end portion adjacent to an edge of the flexible circuit board and includes a first connection portion away from the edge of the flexible circuit board and connected to the first conductive structure; The width of the first end of the third reinforcement structure along a first direction is smaller than the width of the first connecting portion along the first direction, and the first direction is parallel to an extending direction of an edge of the flexible circuit board adjacent to the first end.

12. The flexible circuit board according to claim 11, characterized in that: The third reinforcement structure and the first conductive structure are an integrated structure.

13. The flexible circuit board according to claim 12, characterized in that: The third reinforcement structure includes a copper film.

14. The flexible circuit board according to claim 11, characterized in that: The shape of the third reinforcement structure includes at least one of a triangle, a semicircle, and a trapezoid.

15. The flexible circuit board according to claim 11, characterized in that: The length of the third reinforcing structure along the second direction is greater than or equal to 0.2 mm, and the second direction is parallel to the arrangement direction of the second part to which the third reinforcing structure is attached and the first part connected thereto.

16. The flexible circuit board according to claim 11, characterized in that: The reinforcement structure includes a plurality of fourth reinforcement structures, and at least a portion of the second surface of the second portion close to an edge of the flexible circuit board is in contact with the fourth reinforcement structure.

17. The flexible circuit board according to claim 16, characterized in that: The fourth reinforcement structure and the second conductive film layer are located in the same film layer, the fourth reinforcement structure includes a second end portion adjacent to an edge of the flexible circuit board and includes a second connection portion away from the edge of the flexible circuit board and connected to the first conductive structure; The width of the second end of the fourth reinforcement structure along a first direction is smaller than the width of the second connection portion along the first direction, and the first direction is parallel to an extension direction of an edge of the flexible circuit board adjacent to the second end.

18. The flexible circuit board according to claim 16, characterized in that: In a direction perpendicular to the plane where the flexible circuit board is located, the projections of the third reinforcement structure and the fourth reinforcement structure overlap.

19. The flexible circuit board according to claim 16, characterized in that: In a direction parallel to the plane where the flexible circuit board is located, the end of the third reinforcement structure close to the edge of the flexible circuit board and the end of the fourth reinforcement structure close to the edge of the flexible circuit board are arranged alternately.

20. The flexible circuit board according to claim 7 or 16, characterized in that: Along a direction perpendicular to the plane where the flexible circuit board is located, the first conductive structure and the second conductive structure do not overlap with the reinforcement structure; Along a direction perpendicular to the plane where the flexible circuit board is located, an edge of the first conductive structure close to an edge of the flexible circuit board is aligned with an edge of the second conductive structure close to the edge of the flexible circuit board.

21. A display module, characterized in that: It comprises the flexible circuit board and the display panel according to any one of claims 1 to 20, wherein the flexible circuit board is electrically connected to the display panel.

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