Method for improving film flying of circuit of reworked board

Abstract

The invention discloses a method for improving film flying of a circuit of a rework board, and discloses a method for improving film flying of a circuit of a rework board, which can improve the qualified rate of rework with defects such as incomplete etching and virtual light. According to the method for improving rework board circuit film flying, the vacuum film pasting technology is used, the film pasting effect is guaranteed through the vacuum environment of vacuum film pasting, uniform film pasting can be achieved under the condition of no bubbles, and the problems that in traditional pressing and rolling film pasting, the film pasting quality is poor due to the height difference of a machined circuit, and the film pasting quality is poor can be effectively solved. Therefore, the phenomenon that the film is easy to fly during developing and etching during reworking can be avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB processing, and particularly relates to a method for improving the circuit film flying of rework boards. Background Art

[0002] During the circuit production in the PCB manufacturing process, acidic etching solution is used to etch away the copper outside the circuit. However, for some products, abnormalities occur. For example, when the etching is incomplete, rework etching is required.

[0003] When performing rework etching, the circuit film that has been made needs to be protected. The current film pasting method is to use a pressure roller to paste the film. When pasting the film, the height difference caused by the processed circuits on the rework board can easily lead to poor film adhesion, and the film is likely to fly off during development and etching. Summary of the Invention

[0004] The present invention aims to at least solve one of the technical problems existing in the prior art. For this purpose, the present invention provides a method for improving the circuit film flying of rework boards, which can improve the qualification rate of rework for defects such as incomplete etching and virtual light.

[0005] A method for improving the circuit film flying of rework boards according to an embodiment of the present invention includes the following steps: Vacuum film pasting: Use a vacuum film pasting machine to paste a protective film on the rework board; Development: Expose and develop the protective film to remove the protective film at the parts to be processed; Etching: Perform etching treatment on the rework board to process the positions where the etching is not clean; Film stripping: Immerse the rework board in a film stripping solution to strip off the protective film.

[0006] It has at least the following beneficial effects: A method for improving the circuit film flying of rework boards uses a vacuum film pasting process. By ensuring the film pasting effect through the vacuum environment of vacuum film pasting, the film can be evenly pasted without bubbles, which can effectively avoid the poor film pasting quality caused by the height difference of the processed circuits during traditional pressure roller film pasting, and further avoid the situation where the film is likely to fly off during development and etching during rework.

[0007] According to some embodiments of the present invention, in the vacuum film pasting step, the following processes are included: Board preparation: Clean the surface of the rework board by chemical cleaning or mechanical brushing; Board placement: Place the processed rework board stably on the working table of the film pasting machine; Protective film placement: Place the cut protective film on the surface of the rework board to ensure alignment; Vacuum chamber sealing: Close the chamber cover of the vacuum film pasting machine to ensure good sealing; Vacuum pumping: Start the vacuum pump to remove the air in the cavity, form a low-pressure environment, and avoid the residue of air bubbles. Film lamination: In a vacuum state, use the pressure system to evenly laminate the protective film onto the surface of the rework board.

[0008] According to some embodiments of the present invention, in the sheet preparation process, a hot air blower or an oven is also required to thoroughly dry the moisture on the sheet surface.

[0009] According to some embodiments of the present invention, after the film lamination process, a film lamination inspection process is also included. After the film lamination is completed, the quality of the film lamination effect is detected.

[0010] According to some embodiments of the present invention, in the film lamination inspection process, visually inspect whether the protective film is completely adhered and whether the surface is smooth without air bubbles.

[0011] According to some embodiments of the present invention, in the film lamination inspection process, test whether some areas of the protective film are firmly adhered and whether they can be developed normally.

[0012] According to some embodiments of the present invention, before the process of placing the protective film, a protective film preparation process is also included. In the protective film preparation process, preheat the protective film to make it soft and increase the adhesion.

[0013] According to some embodiments of the present invention, in the film lamination process, the lamination temperature is 80°C - 120°C.

[0014] According to some embodiments of the present invention, after the film lamination process, a cooling and solidification process is also included. In the cooling and solidification process, gradually reduce the temperature of the cavity to cool and solidify the protective film and enhance the adhesion.

[0015] Additional aspects and advantages of the present invention will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The following further describes the present invention in conjunction with the drawings and embodiments, where: Figure 1 is the process flow chart of the embodiment of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0017] In the description of the present invention, it should be understood that for the orientation description, such as the orientation or positional relationship indicated by up, down, front, back, left, right, etc., is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.

[0018] In the description of the present invention, if the first and the second are described only for the purpose of distinguishing technical features, they should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features or implicitly specifying the sequence of the indicated technical features.

[0019] In the description of the present invention, unless otherwise clearly defined, terms such as "set", "installed", "connected", etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific content of the technical solution.

[0020] Referring to Figure 1 , the present invention discloses a method for improving the circuit film flying of rework boards, including the following steps: Vacuum film laminating: Use a vacuum film laminating machine to laminate the protective film on the rework board. Developing: Expose and develop the protective film to remove the protective film at the parts to be processed. Etching: Perform etching treatment on the rework board to process the positions where etching is not clean. Film stripping: Immerse the rework board in the film stripping solution to remove the protective film.

[0021] By ensuring the film laminating effect through the vacuum environment of vacuum film laminating, uniform film lamination can be achieved without bubbles, effectively avoiding poor film lamination quality caused by height differences in the processed circuits during traditional roller film lamination, and further avoiding the occurrence of film flying during developing and etching during rework.

[0022] As a further improvement of the above solution, in the vacuum film laminating step, the following processes are included: Board preparation: Clean the surface of the rework board by chemical cleaning or mechanical brushing. Placing the board: Place the processed rework board stably on the working table of the film laminating machine. Placing the protective film: Place the cut protective film on the surface of the rework board to ensure alignment. Vacuum chamber sealing: Close the chamber cover of the vacuum film laminating machine to ensure good sealing. Vacuum pumping: Start the vacuum pump to evacuate the air in the chamber to form a low-pressure environment and avoid bubble residue. Film pressing: In a vacuum state, use the pressure system to uniformly press the protective film onto the surface of the rework board.

[0023] It should be noted that the vacuum film laminating process is an advanced protective film laminating technology, especially in rework processing and high-precision circuit board manufacturing. By eliminating bubbles and ensuring uniform film wrapping, vacuum film laminating can significantly improve film lamination quality and reliability.

[0024] As a further improvement of the above solution, in the sheet preparation process, a hot air blower or an oven is also required to thoroughly dry the moisture on the sheet surface.

[0025] It should be noted that drying the rework sheets can avoid the influence of residual water vapor on the film laminating effect.

[0026] As a further improvement of the above solution, after the film lamination process, a film lamination inspection process is also included. After the film lamination is completed, the quality of the film lamination effect is detected.

[0027] As a further improvement of the above solution, in the film lamination inspection process, it is checked whether the protective film is completely adhered and whether the surface is smooth without bubbles by visual inspection.

[0028] As a further improvement of the above solution, in the film lamination inspection process, it is tested whether some areas of the protective film are firmly adhered and whether it can be developed normally.

[0029] It should be noted that through the film lamination inspection, defects existing in the process of adhering the protective film can be found, such as: Avoiding bubble problems: When bubbles are found during inspection, the film can be re-laminated in time to avoid circuit defects caused by bubbles during development and etching; Repairing the phenomenon of warped film: The problem of warped film may cause film flying during development or etching. After inspection, it can be repaired by local rolling; Ensuring the uniformity of film lamination: Ensuring good adhesion between the film material and the substrate to prevent abnormal subsequent processing caused by uneven film lamination; Discovering problems in advance: Discovering problems in the film lamination link to avoid materials entering expensive subsequent processes (such as etching and electroplating), and reducing the scrap rate; Cost saving: Timely removing the defective film laminated boards to reduce the waste of materials and man-hours caused by rework or scrapping of defective products.

[0030] The quality of film lamination directly affects the accuracy of development and etching. The film lamination inspection can ensure the process accuracy in the following aspects: Line clarity: Avoiding circuit blurring or open circuits caused by poor film lamination.

[0031] Etching protection: Ensuring complete coverage of the thin film to prevent the etching solution from eroding the parts that should not be removed.

[0032] Fine line protection: Particularly crucial for high-precision circuit areas. Inspection can prevent process errors caused by film flying or film damage.

[0033] As a further improvement of the above solution, before the process of placing the protective film, a protective film preparation process is also included. In the protective film preparation process, the protective film is preheated to make it soft and increase the adhesion.

[0034] It is understandable that preheating the protective film can increase the ductility of the protective film and improve the film application quality.

[0035] As a further improvement of the above solution, in the film lamination process, the lamination temperature is 80°C - 120°C.

[0036] It should be noted that the temperature and pressure during lamination are adjustable. In the embodiments of the present invention, the lamination temperature is controlled between 80°C and 120°C to ensure that the protective film fits tightly without bubbles.

[0037] As a further improvement of the above solution, after the film lamination process, a cooling and solidification process is also included. In the cooling and solidification process, the temperature of the cavity is gradually decreased to cool and solidify the protective film and enhance the adhesion.

[0038] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered to be within the scope described in this specification.

[0039] Of course, the present invention is not limited to the above embodiments. Those skilled in the art can make equivalent deformations or substitutions without departing from the spirit of the present invention, and these equivalent deformations or substitutions are all included within the scope defined by the claims of this application.

Claims

1. A method for improving the film flying of the rework board circuit, characterized in that: The following steps are involved: Vacuum lamination: Use a vacuum lamination machine to place the protective film on the reworked board; Development: Expose and develop the protective film to remove the protective film from the area that needs to be processed; Etching: Etching the reworked board to process the uncleanly etched areas; Film stripping: Immerse the reworked board in film stripping solution to remove the protective film.

2. A method for improving film flying on a reworked board circuit according to claim 1, characterized in that: The vacuum lamination process includes the following steps: Board preparation: Clean the surface of the reworked board by chemical cleaning or mechanical brushing; Placing the board: Place the processed reworked board steadily on the working table of the laminating machine; Place the protective film: Place the cut protective film on the surface of the rework board and ensure that the position is aligned; Vacuum chamber sealing: close the chamber cover of the vacuum laminator to ensure good sealing; Vacuuming: Start the vacuum pump to remove the air in the cavity, create a low-pressure environment, and avoid bubbles remaining; Film pressing: Under vacuum condition, the pressure system is used to press the protective film evenly onto the surface of the reworked board.

3. A method for improving film flying on a reworked board circuit according to claim 2, characterized in that: During the board preparation process, a hot air blower or oven is also required to thoroughly dry the moisture on the board surface.

4. A method for improving film flying on a reworked board circuit according to claim 2, characterized in that: After the film lamination process, there is also a film inspection process. After the film is pasted, the quality of the film effect is inspected.

5. A method for improving film flying on a reworked board circuit according to claim 4, characterized in that: During the film inspection process, visual inspection is used to check whether the protective film is fully adhered and whether the surface is smooth and free of bubbles.

6. A method for improving film flying on a reworked board circuit according to claim 5, characterized in that: During the film inspection process, test whether some areas of the protective film are firmly adhered and whether they can be developed normally.

7. A method for improving film flying on a reworked board circuit according to claim 2, characterized in that: Before the protective film placement process, a protective film preparation process is also included. In the protective film preparation process, the protective film is preheated to soften it and increase its adhesion.

8. The method for improving film flying of reworked board circuit according to claim 2, characterized in that: In the film lamination process, the lamination temperature is 80°C-120°C.

9. A method for improving film flying on a reworked board circuit according to claim 2, characterized in that: After the film lamination process, a cooling and curing process is also included. In the cooling and curing process, the cavity temperature is gradually reduced to cool and solidify the protective film to enhance adhesion.

Images