Electronic device

Abstract

The embodiment of the invention discloses electronic equipment, and relates to the technical field of electronics. The electronic equipment comprises a circuit board, a shielding frame, a heating device, a thermal interface material layer and a vapor chamber. The circuit board is provided with a first surface, and the shielding frame is connected to the first surface. The heating device is connected to the first surface and located in an area defined by the shielding frame. The thermal interface material layer covers the heating device. And the uniform temperature plate is buckled on the shielding frame and is in contact with the thermal interface material layer. The uniform-temperature plate can be used as a part of shielding of the whole machine and is combined with the shielding frame to form a complete shielding structure, so that the shielding requirement (or isolation requirement) of the heating devices is met, the structure between the uniform-temperature plate and the heating devices is reduced, and only one thermal interface material layer can be arranged between each heating device and the uniform-temperature plate. The thickness of the whole machine can be reduced, the cost is reduced, the heat dissipation distance can be reduced, and the heat dissipation effect is improved.

Description

Technical Field

[0001] This application relates to the field of electronic technologies, and particularly to an electronic device. Background Art

[0002] With the update and iteration of electronic devices, consumers have more and more functional requirements for electronic devices. In order to meet the needs of consumers, more and more electronic components are integrated into electronic devices.

[0003] The integration degree and assembly density of electronic components continue to increase, resulting in a sharp increase in the working power consumption and heat generation of electronic components. Therefore, the heat dissipation requirement of electronic devices also increases accordingly. Thus, heat dissipation components are usually provided inside electronic devices to improve the heat dissipation effect. However, the setting of heat dissipation components increases the overall thickness of the electronic device.

[0004] In addition, some electronic components themselves have relatively large radiation noise or are sensitive to external noise. Therefore, a shielding cover is also provided inside the electronic device to increase the isolation between this part of electronic components and the outside, meeting the electromagnetic compatibility (EMC) requirements of the whole machine. However, the setting of the shielding cover not only increases the overall thickness of the electronic device, but also easily affects the heat dissipation effect of the electronic device. Summary of the Invention

[0005] Embodiments of this application provide an electronic device, which is used to reduce the overall thickness of the electronic device and improve the heat dissipation performance of the electronic device on the basis of meeting the overall EMC of the electronic device.

[0006] Improve the reliability of the integrated circuit.

[0007] To achieve the above object, the embodiments of this application adopt the following technical solutions:

[0008] In a first aspect, an electronic device is provided. The electronic device includes: a circuit board, a shielding frame, a heat-generating device, a thermal interface material layer, and a heat pipe. The circuit board has a first surface, and the shielding frame is connected to the first surface. The heat-generating device is connected to the first surface and is located within the area surrounded by the shielding frame. The thermal interface material layer covers the heat-generating device. The heat pipe is buckled on the shielding frame and is in contact with the thermal interface material layer.

[0009] The electronic device provided by some embodiments of the present application connects a shielding frame on the first surface of the circuit board, and buckles a heat pipe with metallic properties on the shielding frame. The heat pipe can be used as part of the overall shielding of the device, and together with the shielding frame, they form a complete shielding structure. This can meet the shielding requirements (or isolation requirements) for heat-generating components while reducing the structure between the heat pipe and the heat-generating components. In this way, the distance between the heat-generating components and the heat pipe can be reduced, the overall thickness of the electronic device can be decreased, and the front-side heat dissipation of the heat-generating components can be prevented, shortening the heat transfer path and improving the heat conduction efficiency and heat dissipation effect.

[0010] Moreover, only one layer of thermal interface material layer can be provided between each heat-generating component and the heat pipe. That is to say, the combined setting method of the heat pipe and the shielding frame reduces the number of thermal interface material layers required between each heat-generating component and the heat pipe. This can not only reduce the overall thickness of the electronic device and the cost of the electronic device, but also reduce the influence of the thermal interface material layer on heat conduction, shorten the heat dissipation distance, and further improve the heat dissipation performance of the electronic device.

[0011] In a possible design of the first aspect, the electronic device further includes: a clamping portion and a limiting block. The clamping portion is connected to the surface of the heat pipe close to the circuit board. In the direction parallel to the first surface, the clamping portion is partially opposite to the shielding frame. The limiting block is connected to one of the clamping portion and the shielding frame. Wherein, a limiting groove is formed on the other of the clamping portion and the shielding frame. The limiting block extends into the limiting groove. The limiting block and the limiting groove are used to limit the displacement of the heat pipe in the direction perpendicular to the first surface and away from the first surface. In this way, the limiting block and the limiting groove can be used to prevent the heat pipe and the shielding frame from separating, improving the connection stability between the heat pipe and the shielding frame. Moreover, the detachable connection method is adopted to connect the heat pipe and the shielding frame, which is convenient for installing and disassembling the heat pipe and the shielding frame; and in the case of maintenance, it can also avoid damaging the heat pipe and the shielding frame during the process of disassembling the heat pipe and the shielding frame, improving the service life of the heat pipe and the shielding frame.

[0012] In a possible design of the first aspect, the shielding frame has opposite inner and outer sides. The clamping portion is in contact with the inner side of the shielding frame; the limiting groove is formed on the inner side of the shielding frame, and the limiting block is connected to the partial side of the clamping portion opposite to the inner side of the shielding frame. Or, the clamping portion is in contact with the outer side of the shielding frame; the limiting groove is formed on the outer side of the shielding frame, and the limiting block is connected to the partial side of the clamping portion opposite to the outer side of the shielding frame. By applying a certain force in the direction perpendicular to the first surface, the heat pipe can be installed on the shielding frame or disassembled, which is beneficial to reducing the risk of damage to the clamping portion, the limiting block, and the shielding frame, and the structure is simple and easy to implement.

[0013] In a possible design of the first aspect, the number of snap joints is multiple, and the multiple snap joints are arranged at intervals along the circumferential direction of the shielding frame. The number of limiting blocks is multiple, and each snap joint is connected to at least one limiting block. This can provide multiple snap connection points and make the multiple snap connection points arranged at intervals along the circumferential direction of the shielding frame, improving the connection stability between the shielding frame and the heat spreader.

[0014] In a possible design of the first aspect, the snap joint is annular. The number of limiting blocks is multiple, and the multiple limiting blocks are arranged at intervals along the circumferential direction of the shielding frame. This can make the multiple snap connection points between the shielding frame and the heat spreader arranged at intervals along the circumferential direction of the shielding frame, which is beneficial to improving the connection stability between the shielding frame and the heat spreader. Moreover, along the direction parallel to the first surface, the snap joint can also cooperate with the shielding frame to limit the relative position between the shielding frame and the heat spreader, preventing the heat spreader from being misaligned.

[0015] In a possible design of the first aspect, the snap joint and the limiting block are integrally formed. This is beneficial to improving the connection stability between the snap joint and the limiting block and simplifying the installation steps between the heat spreader and the shielding frame.

[0016] In a possible design of the first aspect, the snap joint has elasticity. This is beneficial to improving the service life of the snap joint and reducing costs.

[0017] In a possible design of the first aspect, the shielding frame has a top surface in contact with the heat spreader, and a receiving groove is formed in the top surface of the shielding frame. The snap joint extends into the receiving groove. The receiving groove has two opposite side walls, and the limiting block is connected to the side wall. A limiting groove is formed in the snap joint. By applying a certain force in the direction perpendicular to the first surface, the heat spreader can be installed on the shielding frame or removed from the shielding frame, which is beneficial to reducing the risk of damage to the snap joint, the limiting block, and the shielding frame, and the structure is simple and easy to implement. Moreover, the two side walls of the receiving groove can abut against the snap joint to limit the displacement of the snap joint in the direction parallel to the first surface, preventing the heat spreader from being misaligned.

[0018] In a possible design of the first aspect, the number of limiting blocks is multiple. The number of limiting blocks on the same side wall is at least two, and the at least two limiting blocks are arranged at intervals along the circumferential direction of the shielding frame. This can make the multiple snap connection points between the shielding frame and the heat spreader arranged at intervals along the circumferential direction of the shielding frame, which is beneficial to improving the connection stability between the shielding frame and the heat spreader.

[0019] In a possible design mode of the first aspect, the number of the limiting blocks is multiple. The multiple limiting blocks include at least one limiting block group, and the limiting block group includes two limiting blocks that are opposite to each other and arranged at intervals. The two limiting blocks in the limiting block group are respectively located on two side walls. In this way, the restriction on the displacement of the heat pipe in the direction perpendicular to the first surface and away from the first surface is increased, which is beneficial to further improving the connection stability between the shielding frame and the heat pipe.

[0020] In a possible design mode of the first aspect, the clamping portion is integrally formed with the shielding frame. In this way, it is beneficial to improve the connection stability between the clamping portion and the shielding frame and simplify the installation steps between the heat pipe and the shielding frame.

[0021] In a possible design mode of the first aspect, the shielding frame is elastic. In this way, it is beneficial to improve the service life of the shielding frame and reduce the cost.

[0022] In a possible design mode of the first aspect, the clamping portion is integrally formed with the heat pipe. In this way, it is beneficial to improve the connection stability between the clamping portion and the heat pipe and simplify the installation steps between the heat pipe and the shielding frame.

[0023] In a possible design mode of the first aspect, the number of the heating devices is multiple, and the multiple heating devices include a first heating device. Relative to the first surface, the surface of the first heating device on the side away from the circuit board is lower than the surface of the shielding frame on the side away from the circuit board. The electronic device further includes: a boss connected to the surface of the heat pipe close to the circuit board. The heat pipe is in contact with the thermal interface material layer through the boss. The setting of the boss basically makes up for the height difference between the first heating device and the shielding frame. The boss is used for heat dissipation. By using the boss, the heat dissipation distance between the first heating device and the heat pipe can be reduced, and the heat dissipation performance can be improved.

[0024] In a possible design mode of the first aspect, the number of the first heating devices is multiple, and the number of the bosses is at least one. One of the bosses covers at least one first heating device.

[0025] In a possible design mode of the first aspect, the orthographic projection of the boss on the first surface coincides with the orthographic projection of the first heating device on the first surface. In this way, the space occupation ratio of the boss can be reduced, and the setting of other heating devices can be avoided from being affected.

[0026] In a possible design mode of the first aspect, the boss is integrally formed with the heat pipe. In this way, it is beneficial to improve the connection stability between the boss and the heat pipe and simplify the assembly steps of the electronic device.

[0027] In a possible design mode of the first aspect, the outer boundary of the orthographic projection of the shielding frame on the first surface coincides with the outer boundary of the orthographic projection of the heat pipe on the first surface. In this way, it is beneficial to reduce the space occupation ratio of the heat pipe in the electronic device.

[0028] In a possible design of the first aspect, the outer boundary of the orthographic projection of the shielding frame on the first surface is located within the outer boundary of the orthographic projection of the heat pipe on the first surface. This is beneficial to increasing the heat conduction area of the heat pipe, facilitating the heat pipe to dissipate heat from the heat-generating device more quickly, and improving the heat dissipation effect.

[0029] In a possible design of the first aspect, the heat-generating device includes at least one of a system-on-chip, a power management chip, a charging management chip, a radio frequency chip, a display chip, and a general-purpose memory.

[0030] In a possible design of the first aspect, the electronic device includes: a display screen. The display screen is located on the side of the heat pipe away from the circuit board. The heat conducted from the heat-generating device to the heat pipe can diffuse to the side where the display screen is located. This is beneficial to reducing the temperature on the side where the rear shell is located and improving the user experience. Description of the Drawings

[0031] Figure 1 A structural diagram of an electronic device provided by an embodiment of the present application;

[0032] Figure 2 A partial structural diagram of an electronic device provided by an embodiment of the present application;

[0033] Figure 3 A partial structural diagram of another electronic device provided by an embodiment of the present application;

[0034] Figure 4 A partial structural diagram of yet another electronic device provided by an embodiment of the present application;

[0035] Figure 5 is Figure 4 An exploded schematic diagram of a partial structure of the electronic device shown;

[0036] Figure 6 A partial structural diagram of an electronic device provided by an embodiment of the present application;

[0037] Figure 7 A partial structural diagram of another electronic device provided by an embodiment of the present application;

[0038] Figure 8 A perspective view of a shielding frame and a heat pipe provided by an embodiment of the present application;

[0039] Figure 9 A partial structural diagram of yet another electronic device provided by an embodiment of the present application;

[0040] Figure 10 A perspective view of a heat pipe provided by an embodiment of the present application;

[0041] Figure 11 Another three-dimensional view of the shielding frame and the heat pipe provided by the embodiment of the present application;

[0042] Figure 12 Another partial structure diagram of an electronic device provided by the embodiment of the present application;

[0043] Figure 13 Another partial structure diagram of an electronic device provided by the embodiment of the present application;

[0044] Figure 14 Another partial structure diagram of an electronic device provided by the embodiment of the present application;

[0045] Figure 15 Another partial structure diagram of an electronic device provided by the embodiment of the present application;

[0046] Figure 16 Another partial structure diagram of an electronic device provided by the embodiment of the present application;

[0047] Figure 17 Another partial structure diagram of an electronic device provided by the embodiment of the present application;

[0048] Figure 18 Another structure diagram of an electronic device provided by the embodiment of the present application. Detailed implementation manners

[0049] Next, the technical solutions in the embodiments of the present application will be described with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments provided by the present application belong to the scope of protection of the present application.

[0050] Among them, in the description of the embodiments of the present application, unless otherwise specified, "a plurality of" means two or more than two. "At least one (item)" or its similar expression means any combination of these items, including any combination of a single item (item) or a plural item (item). For example, at least one (item) of a, b, and c can represent: a, b, c, a - b, a - c, b - c, or a - b - c, where a, b, and c can be single or multiple.

[0051] "And / or" describes the association relationship of associated objects, indicating that three relationships can exist. For example, a and / or b can represent: a exists alone, a and b exist simultaneously, and b exists alone, where a and b can be singular or plural. The character " / " generally represents an "or" relationship between the associated objects before and after.

[0052] In addition, for the convenience of clearly describing the technical solutions of the embodiments of the present application, in the embodiments of the present application, terms such as "first" and "second" are used to distinguish identical or similar items with basically the same functions and effects. Those skilled in the art can understand that terms such as "first" and "second" do not limit the quantity and execution order, and "first", "second", etc. do not necessarily mean different. At the same time, in the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or explanations. Any embodiment or design solution described as "exemplary" or "for example" in the embodiments of the present application should not be construed as being more preferred or having more advantages than other embodiments or design solutions. Rather, the use of words such as "exemplary" or "for example" is intended to present relevant concepts in a specific way for easy understanding.

[0053] When describing some embodiments, the expressions "connected" and its derivatives are used. The term "connected" should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or integrated; it can be directly connected or indirectly connected through an intermediate medium. In addition, the use of "based on" means open and inclusive, because a process, step, calculation or other action "based on" one or more of the stated conditions or values can in practice be based on additional conditions or values beyond the stated ones.

[0054] As used in the embodiments of the present application, "parallel", "perpendicular", "equal", "flush" include the stated situations and situations similar to the stated ones, and the range of the similar situations is within an acceptable deviation range, where the acceptable deviation range is determined by those of ordinary skill in the art considering the measurements being discussed and the errors associated with the measurements of specific quantities (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where the acceptable deviation range for approximate parallelism can be, for example, within 5° deviation; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where the acceptable deviation range for approximate perpendicularity can also be, for example, within 5° deviation. "Equal" includes absolute equality and approximate equality, where the acceptable deviation range for approximate equality can be, for example, that the difference between the two equal ones is less than or equal to 5% of either one. "Flush" includes absolute flushness and approximate flushness, where the acceptable deviation range for approximate flushness can be determined according to the actual process.

[0055] In the embodiments of the present application, the terms "upper", "lower", "left", and "right" are not limited to the orientations defined relative to the schematic placement of components in the drawings. It should be understood that these directional terms can be relative concepts, which are used for relative description and clarification, and they can change accordingly with the change of the orientation of the components placed in the drawings. In the drawings, for clarity, the thickness of layers and regions is exaggerated, and the dimensional proportional relationships between the various parts in the illustrations do not reflect the actual dimensional proportional relationships. Therefore, variations in the shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances can be envisioned. Therefore, the exemplary embodiments should not be construed as being limited to the shapes of the regions shown in the present application, but include shape deviations caused by, for example, manufacturing. For example, an etched region shown as a rectangle will generally have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the regions of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0056] In addition, the architectures and scenarios described in the embodiments of the present application are for more clearly illustrating the technical solutions of the embodiments of the present application, and do not constitute a limitation on the technical solutions provided by the embodiments of the present application. Those of ordinary skill in the art know that with the evolution of architectures and the emergence of new scenarios, the technical solutions provided by the embodiments of the present application are equally applicable to similar technical problems.

[0057] The embodiments of the present application provide an electronic device. The electronic device can be a mobile phone, a tablet computer (pad), a smart screen, a speaker, a display, a television, a desktop computer, a laptop computer, a handheld computer, a notebook computer, an ultra-mobile personal computer (UMPC), a netbook, as well as a cellular phone, a personal digital assistant (PDA), an augmented reality (AR) device, a virtual reality (VR) device, an artificial intelligence (AI) device, a smart wearable device (e.g., a smart watch, a smart bracelet), a vehicle-mounted device, a smart home device, and / or a smart city device, etc. The embodiments of the present application do not impose special restrictions on the specific types of the electronic device.

[0058] For the convenience of description below, the electronic device is taken as an example of a mobile phone for illustration, which should not be considered as a specific limitation on the structural form of the electronic device. Figure 1 It is a structural diagram of an electronic device in some embodiments.

[0059] As Figure 1As shown, the electronic device 100 includes a cover plate 1, a display screen 2, a middle frame 3, and a rear case 4. Among them, the display screen 2 has an outgoing light side and a non-outgoing light side facing away from each other. The outgoing light side refers to the side where the display surface of the display screen 2 is located (for example Figure 1 the left side of the display screen 2 in Figure 1 ), and the non-outgoing light side refers to the side opposite to the outgoing light side (for example Figure 1 the right side of the display screen 2 in Figure 1 ). The above cover plate 1 is disposed on the outgoing light side of the display screen 2 and is attached to the display screen 2. The middle frame 3 and the rear case 4 are disposed on the non-outgoing light side of the display screen 2, and the rear case 4 and the display screen 2 are respectively located on both sides of the middle frame 3, and the middle frame 3 and the display screen 2 are disposed within the rear case 4.

[0060] Among them, the display screen 2 can be a liquid crystal display (LCD). In this case, the liquid crystal display includes a liquid crystal display panel and a backlight module. The liquid crystal display panel is disposed between the cover plate 1 and the backlight module, and the backlight module is used to provide light source for the liquid crystal display panel. The above display screen 2 can also be an organic light emitting diode (OLED) display screen, a quantum dot light emitting diode (QLED) display screen, a mini light emitting diode (Mini LED) display screen, or a micro light emitting diode (Micro LED) display screen, etc. Since OLED display screens, QLED display screens, Mini LED display screens, Micro LED display screens, etc. are all self-luminous display screens, there is no need to set a backlight module.

[0061] The above middle frame 3 includes a carrier plate 31 and a frame 32 surrounding the carrier plate 31 for one week. Structures such as a battery and a camera are also included in the electronic device 100 and are disposed on the carrier plate 31.

[0062] Continue to refer to Figure 1 , the electronic device 100 further includes a circuit board 5. The circuit board 5 is located on the non-outgoing light side of the display screen 2. Optionally, as Figure 1 shown, the circuit board 5 is, for example, located between the carrier plate 31 and the rear case 4. Of course, a receiving cavity is, for example, provided on the side of the carrier plate 31 close to the display screen 2, and the circuit board 5 can also be disposed in the receiving cavity.

[0063] In some examples, the circuit board 5 includes, for example, a main circuit board and a secondary circuit board.

[0064] The above-mentioned main circuit board is used to integrate electronic components such as control chips. The control chips include, but are not limited to, system on chip (SOC), charge management chip, power management unit (PMU), radio frequency (RF) chip, display chip, application processor (AP), double data rate synchronous dynamic random access memory (DDR), and universal flash storage (UFS), etc. Among them, the RF chip can also be called a radio frequency power amplifier chip (RF PA). Exemplarily, the main circuit board is electrically connected to the display screen 2, and the main circuit board is used to control the display screen 2 to display images or videos.

[0065] The main circuit board can be a printed circuit board (PCB). Of course, the main circuit board can also be a flexible circuit board, a rigid-flex circuit board, etc. Optionally, the main circuit board can be fixed between the middle frame 3 and the rear shell 4 by means of screw connection, snap connection, gluing, etc.

[0066] The above-mentioned secondary circuit board is integrated with electronic components such as universal serial bus (USB) devices. The USB device can be a USB type-C interface device, a USB type-A interface device, a USB type Micro-B interface device, or a USB type-B interface device. A socket is provided at the position corresponding to the USB device on the frame 32. Accessories such as chargers, headphones, and data cables can be electrically connected to the USB device through this socket to achieve power, signal, and data transmission.

[0067] The secondary circuit board can be a printed circuit board. Of course, the main circuit board can also be a flexible circuit board, a rigid-flex circuit board, etc. The secondary circuit board can also be fixed between the middle frame 3 and the rear shell 4 by means of screw connection, snap connection, gluing, or soldering. The secondary circuit board is arranged at an interval from the main circuit board, and the two are electrically connected.

[0068] During the operation of the electronic device 100, the electronic components on the main circuit board and / or the secondary circuit board will generate heat. The electronic components that generate heat during the operation can be called heat-generating devices 6 (as Figure 2 and Figure 3 shown). The heat-generating device 6 includes, but is not limited to, at least one of the above-mentioned system on chip, power management chip, charge management chip, RF chip, display chip, and universal flash storage.

[0069] As Figure 2 and Figure 3 shown, the above-mentioned circuit board 5 has opposite first surface A1 and second surface A2. The first surface A1 and the second surface A2 are both flat surfaces, for example. The number of the heating devices 6 can be multiple. As Figure 2 shown, the multiple heating devices 6 are all connected to the first surface A1 of the circuit board 5, for example; or, as Figure 3 shown, at least one heating device 6 is connected to the first surface A1 of the circuit board 5, and at least one heating device 6 is also connected to the second surface A2 of the circuit board 5.

[0070] It can be understood that among the above-mentioned multiple heating devices 6, some heating devices 6 themselves have relatively large radiation noise or are sensitive to external noise. This part of the heating devices 6 includes but is not limited to system-on-chip, power management chip, radio frequency chip, etc. For example, the isolation requirement of the system-on-chip is 50 dB. Therefore, it is necessary to shield this part of the heating devices 6 to increase the isolation between this part of the electronic components and the outside, meet the electromagnetic compatibility requirements of the whole machine, and avoid causing the indexes such as the radio frequency sensitivity of the whole machine not to meet the certification and user requirements. Among them, Figure 2 and Figure 3 respectively illustrate two shielding schemes.

[0071] Exemplarily, in the structure shown in Figure 2 , the above-mentioned multiple heating devices 6 are all connected to the first surface A1 of the circuit board 5. A shielding cover 7 is also connected to the first surface A1 of the circuit board 5. The shielding cover 7 covers the multiple heating devices 6 to place the multiple heating devices 6 in the shielding cavity formed by the shielding cover 7 and the circuit board 5, so as to realize the isolation between the heating devices 6 and the outside.

[0072] Exemplarily, in the structure shown in Figure 3 , the above-mentioned multiple heating devices 6 are respectively connected to the first surface A1 and the second surface A2 of the circuit board 5. Among them, the heating devices 6 connected to the first surface A1 do not need to be shielded, for example, and the heating devices 6 connected to the second surface A2 need to be shielded, for example. At this time, continue to refer to Figure 3 , another circuit board is also connected to the second surface A2 of the circuit board 5. By placing the heating devices 6 that need to be shielded in the shielding cavity formed by the two-layer circuit board, the isolation between this part of the heating devices 6 and the outside is realized.

[0073] Since the above-mentioned multiple heating devices 6 generate a large amount of heat during operation, the heat dissipation requirement of the electronic device 100 also increases accordingly. Therefore, it is necessary to set up heat dissipation components inside the electronic device 100 to improve the heat dissipation effect.

[0074] InFigure 2 In the structure shown, the heat dissipation component 8 is disposed, for example, on the side of the shielding cover 7 away from the circuit board 5. Based on the arrangement of the shielding cover 7, a thermal interface material layer 9 needs to be provided between the shielding cover 7 and the heat generating device 6, and between the shielding cover 7 and the heat dissipation component 8. The arrangement of the shielding cover 7 and the two thermal interface material layers 9 increases the overall thickness and cost of the electronic device on the one hand, and increases the heat dissipation distance on the other hand. Moreover, limited by the heat dissipation performance of the thermal interface material layer 9, the heat dissipation effect of the electronic device is easily affected.

[0075] In Figure 3 In the structure shown, part of the heat generating device 6 located in the shielding cavity mainly dissipates heat through its back surface, and the heat dissipation performance of its front surface is blocked, resulting in a poor heat dissipation effect of the electronic device.

[0076] Based on this, some embodiments of the present application improve the shielding method and heat dissipation method of the above-mentioned multiple heat generating devices 6. Among them, Figure 4 FIG. shows a partial structure diagram of an electronic device, Figure 5 FIG. shows Figure 4 an exploded view of the shown partial structure.

[0077] In some examples, in combination with Figure 4 and Figure 5 , the electronic device 100 further includes a shielding frame 10, which is connected to the first surface A1 of the circuit board 5. The shielding frame 10 is, for example, a hollow frame structure, and both opposite ends of the shielding frame 10 (i.e., the end close to the circuit board 5 and the end away from the circuit board 5) are open. The orthographic projection of the shielding frame 10 on the first surface A1 is, for example, a closed figure, and can also be called a ring (including but not limited to a circular ring, a square ring, etc.). The above-mentioned multiple heat generating devices 6 are, for example, located in the area surrounded by the shielding frame 10, that is, the shielding frame 10 surrounds the multiple heat generating devices 6. The material of the shielding frame 10 includes metal materials (including but not limited to copper, iron, etc.), and the shielding frame 10 is applied to the electromagnetic shielding and isolation of the whole machine.

[0078] The connection method between the shielding frame 10 and the circuit board 5 includes but is not limited to welding, snap connection or gluing, etc.

[0079] In some examples, in combination with Figure 4 and Figure 5 , the electronic device 100 further includes a heat pipe 11. The heat pipe 11 is located on the side of the shielding frame 10 away from the circuit board 5 and is buckled on the shielding frame 10. The heat pipe 11 is thermally conductively connected to each heat generating device 6.

[0080] Here, the vapor chamber (VC) 11 can also be called a heat pipe, which has a vacuum cavity. A capillary structure is provided in the vacuum cavity, and a working fluid (including but not limited to pure water or liquid ammonia, etc.) is injected into the vacuum cavity. The working principle of the vapor chamber 11 includes four processes: conduction, evaporation, convection, and solidification. The heat generated by the heat source enters the vacuum cavity through heat conduction. The working fluid near the heat source absorbs heat and vaporizes, taking away a large amount of heat at the same time. The vapor in the vacuum cavity of the vapor chamber 11 diffuses from the high-temperature area to the low-temperature area, and when the vapor contacts the inner wall of the low-temperature area, the vapor will condense into a liquid and release heat energy. The working fluid condensed into a liquid returns to the heat source through the capillary force of the capillary structure, thus completing a heat conduction cycle and forming a vapor-liquid two-phase coexisting cycle system.

[0081] This means that the vapor chamber 11 can absorb the heat generated by the heat-generating device 6 and dissipate the heat, realizing the heat dissipation of the electronic device 100.

[0082] Further, one end of the shielding frame 10 away from the circuit board 5 is closed by the vapor chamber 11. One end of the shielding frame 10 close to the circuit board 5 is closed by the circuit board 5. That is to say, the circuit board 5, the shielding frame 10, and the vapor chamber 11 together enclose a shielding cavity, separating the multiple heat-generating devices 6 located in the shielding cavity from the outside. Among them, the material of the vapor chamber 11 includes a metal material, and the metal material includes but is not limited to copper.

[0083] Utilizing the metal characteristics of the vapor chamber 11, the structure formed by combining the vapor chamber 11 and the shielding frame 10 can be used as a shielding cover, which cooperates with the circuit board 5 to achieve the shielding and isolation of the heat-generating device 6. This saves the part of the shielding cover located between the heat-generating device 6 and the vapor chamber 11, which is beneficial to reducing the overall thickness and heat dissipation distance of the machine.

[0084] In some examples, combined with Figure 4 and Figure 5 , the electronic device 100 further includes a thermal interface material layer 9. The thermal interface material layer 9 is located between the heat-generating device 6 and the vapor chamber 11 and covers the heat-generating device 6. One side surface of the thermal interface material layer 9 is in contact with the heat-generating device 6, and the other side surface is in contact with the vapor chamber 11. The thermal interface material layer 9 and the heat-generating device 6 are arranged in a one-to-one correspondence, for example. That is, the number of the thermal interface material layer 9 and the heat-generating device 6 is the same, and a thermal interface material layer 9 is provided between each heat-generating device 6 and the vapor chamber 11.

[0085] Optionally, the material of the thermal interface material layer 9 includes but is not limited to a thermal interface material (TIM).

[0086] In this way, the heat generated by the heat-generating device 6 can be conducted to the heat pipe 11 through the thermal interface material layer 9, and the heat can be dissipated through the heat pipe 11 with a large heat conduction area, so as to cool the heat-generating device 6 and ensure the normal operation of the heat-generating device 6. Among them, the thermal interface material layer 9 can effectively reduce the contact thermal resistance between the heat-generating device 6 and the heat pipe 11, thereby improving the heat dissipation performance and meeting the increasing heat dissipation requirements.

[0087] Moreover, since there is only a layer of thermal interface material layer 9 between the front surface of the heat-generating device 6 (i.e., the surface on the side away from the circuit board 5) and the heat pipe 11, the heat generated by the heat-generating device 6 can be directly conducted to the heat pipe 11 after passing through this layer of thermal interface material layer 9. This can not only prevent the front surface of the heat-generating device 6 from being blocked in heat dissipation, but also greatly shorten the heat transmission path, which is beneficial to the heat being quickly transferred to the heat pipe 11 and then radiated to the outside of the electronic device 100, improving the heat dissipation effect.

[0088] Therefore, for the electronic device 100 provided by some embodiments of the present application, by connecting the shielding frame 10 on the first surface A1 of the circuit board 5 and buckling the heat pipe 11 with metal characteristics on the shielding frame 10, the structure jointly formed by the heat pipe 11 and the shielding frame 10 can be used to replace the shielding cover, and on the basis of meeting the shielding requirements (or isolation degree requirements) for the heat-generating device 6, the structure between the heat pipe 11 and the heat-generating device 6 can be reduced. In this way, the distance between the heat-generating device 6 and the heat pipe 11 can be reduced, the overall thickness of the electronic device 100 can be reduced, and the front surface of the heat-generating device 6 can be prevented from being blocked in heat dissipation, shortening the heat transmission path, and improving the heat conduction efficiency and heat dissipation effect.

[0089] Moreover, only one layer of thermal interface material layer 9 can be provided between each heat-generating device 6 and the heat pipe 11. That is to say, the combined setting method of the heat pipe 11 and the shielding frame 10 reduces the number of thermal interface material layers 9 required to be provided between each heat-generating device 6 and the heat pipe 11. In this way, the overall thickness of the electronic device 100 can be reduced, the cost of the electronic device 100 can be reduced, and the influence of the thermal interface material layer 9 on heat conduction can be reduced, shortening the heat dissipation distance, and further improving the heat dissipation performance of the electronic device 100.

[0090] It has been verified that compared with Figure 2 the structure shown, the overall thickness of the electronic device 100 in the embodiment of the present application is approximately reduced by 0.2 mm, the overall temperature is approximately reduced by 0.5°C - 1°C, and the cost is also reduced. Moreover, the shielding effect that can be achieved by the embodiment of the present application is basically the same as that of Figure 2 the structure shown.

[0091] The above-mentioned heat pipe 11 is, for example, in a flat plate shape. Optionally, the heat pipe 11 can be in a rectangular flat plate shape, a circular flat plate shape, or an irregular flat plate shape. The present application does not limit the specific shape and area of the heat pipe 11, as long as it can be fastened to the shielding frame 10 and enclose one end of the shielding frame 10 away from the circuit board 5.

[0092] In some embodiments, as Figure 6 shown, the outer boundary of the orthographic projection of the shielding frame 10 on the first surface A1 coincides with the outer boundary of the orthographic projection of the heat pipe 11 on the first surface A1. That is, the shape of the outer boundary of the orthographic projection of the shielding frame 10 on the first surface A1 is the same as the shape of the outer boundary of the orthographic projection of the heat pipe 11 on the first surface A1; the area of the region enclosed by the outer boundary of the orthographic projection of the shielding frame 10 on the first surface A1 is equal to the area of the region enclosed by the outer boundary of the orthographic projection of the heat pipe 11 on the first surface A1.

[0093] This is beneficial to reducing the space occupation ratio of the heat pipe 11 in the electronic device 100.

[0094] In other embodiments, as Figure 4 and Figure 7 shown, the outer boundary of the orthographic projection of the shielding frame 10 on the first surface A1 is located within the outer boundary of the orthographic projection of the heat pipe 11 on the first surface A1. That is, the area of the region enclosed by the outer boundary of the orthographic projection of the shielding frame 10 on the first surface A1 is smaller than the area of the region enclosed by the outer boundary of the orthographic projection of the heat pipe 11 on the first surface A1; the edge of the heat pipe 11 protrudes from the shielding frame 10.

[0095] This is beneficial to increasing the heat conduction area of the heat pipe 11, facilitating the heat pipe 11 to dissipate heat from the heat-generating device 6 more quickly, and improving the heat dissipation effect.

[0096] There are various connection methods between the above-mentioned shielding frame and the heat pipe, and specific ones can be selected and set according to actual needs. Optionally, the shielding frame and the heat pipe can be connected by connection methods such as bonding, welding, and clamping. The following combines Figures 8 - 17 , and takes the connection method of clamping between the shielding frame and the heat pipe as an example for illustrative description.

[0097] In some embodiments, as Figure 9 , Figure 12 and Figure 14 shown, the electronic device 100 further includes a clamping portion 12 and a limiting block 13.

[0098] The above clamping portion 12 is connected to the surface of the heat pipe 11 close to the circuit board 5. In the direction parallel to the first surface A1, the clamping portion 12 is partially opposite to the shielding frame 10. That is, the clamping portion 12 protrudes from the heat pipe 11 and extends towards the circuit board 5; a part of the clamping portion 12 and the shielding frame 10 overlap. This facilitates the clamping through the clamping portion 12 and the part of the shielding frame 10 that overlaps with the clamping portion 12.

[0099] The above limiting block 13 is connected to one of the clamping portion 12 and the shielding frame 10. And, a limiting groove A3 is formed on the other of the clamping portion 12 and the shielding frame 10. For example, as Figure 8 、 Figure 10 and Figure 11 shown, the limiting block 13 is connected to the clamping portion 12, and the limiting groove A3 is formed on the shielding frame 10; or, as Figure 14 、 Figure 15 and Figure 16 shown, the limiting block 13 is connected to the shielding frame 10, and the limiting groove A3 is formed on the clamping portion 12.

[0100] Wherein, the limiting block 13 extends into the limiting groove A3. The limiting block 13 and the limiting groove A3 are adapted to each other. Correspondingly, the shape of the limiting groove A3 and the shape of the limiting block 13 are the same or similar. For example, the shape of the limiting groove A3 and the shape of the limiting block 13 are trapezoidal, approximately trapezoidal, columnar, approximately columnar, etc. The size of the limiting groove A3 and the size of the limiting block 13 are, for example, approximately equal, or the size of the limiting groove A3 is slightly larger than the size of the limiting block 13. This can ensure that the limiting block 13 can stably extend into the limiting groove A3.

[0101] Optionally, both the limiting block 13 and the limiting groove A3 extend in the direction parallel to the first surface A1.

[0102] Here, the above limiting block 13 and limiting groove A3 are used to limit the displacement of the heat pipe 11 in the direction perpendicular to the first surface A1 and away from the first surface A1. That is to say, after the limiting block 13 extends into the limiting groove A3, in the case where the heat pipe 11 is displaced in the direction perpendicular to the first surface A1 and away from the first surface A1 (for example, as Figure 9 shown, the heat pipe 11 moves upward in the direction perpendicular to the first surface A1 and is separated from the shielding frame 10), the outer surface of the limiting block 13 will abut against the side wall of the limiting groove A3, giving the heat pipe 11 a downward force in the direction perpendicular to the first surface A1, preventing the heat pipe 11 from moving upward in the direction perpendicular to the first surface A1, preventing the heat pipe 11 from separating from the shielding frame 10, and improving the connection stability between the heat pipe 11 and the shielding frame 10.

[0103] In addition, the connection method between the heat pipe 11 and the shielding frame 10 realized by the snap-in part 12, the limiting block 13, and the limiting groove A3 is a detachable connection method. This facilitates the installation and disassembly of the heat pipe 11 and the shielding frame 10; moreover, in the case of maintenance, it can also avoid damaging the heat pipe 11 and the shielding frame 10 during the disassembly process of the heat pipe 11 and the shielding frame 10, and improve the service life of the heat pipe 11 and the shielding frame 10.

[0104] In some examples, the snap-in part 12 is integrally formed with the heat pipe 11. This is beneficial to improving the connection stability between the snap-in part 12 and the heat pipe 11 and simplifies the installation steps between the heat pipe 11 and the shielding frame 10.

[0105] It can be understood that due to the different setting positions of the limiting block 13 and the limiting groove A3, the setting methods of the shielding frame 10 and the snap-in part 12 can be different. The following will schematically illustrate the setting positions of the limiting block 13 and the limiting groove A3, and the setting methods of the shielding frame 10 and the snap-in part 12 in combination with the drawings.

[0106] In a possible implementation, as Figures 8 - 13 shown, the limiting block 13 is connected to the snap-in part 12, and the limiting groove A3 is opened on the shielding frame 10. Among them, the shielding frame 10 has opposite inner side A4 and outer side A5. For example, both the inner side A4 and the outer side A5 are perpendicular to the first surface A1. At this time, as Figure 12 and Figure 13 shown, the snap-in part 12 can be located within the area surrounded by the shielding frame 10, or, as Figure 9 shown, the snap-in part 12 can be located outside the area surrounded by the shielding frame 10. The orthographic projection of the snap-in part 12 on the first surface A1 is tangent to or has a certain gap with the orthographic projection of the shielding frame 10 on the first surface A1.

[0107] Optionally, in combination with Figure 11 and Figure 12 , the snap-in part 12 can be located within the area surrounded by the shielding frame 10. At this time, the snap-in part 12 is in contact with the inner side A4 of the shielding frame 10, for example. The limiting block 13 can be connected to the partial side surface of the snap-in part 12 facing the inner side A4 of the shielding frame 10 and extends along the direction from the snap-in part 12 to the shielding frame 10. The limiting groove A3 is opened on the inner side A4 of the shielding frame 10. The limiting groove A3 extends along the arrangement direction of the shielding frame 10 and the snap-in part 12. As Figure 12 shown, the bottom wall of the limiting groove A3 is located inside the shielding frame 10, for example, or, as Figure 13 shown, the limiting groove A3 is in the shape of a through hole and penetrates the shielding frame 10. Along the direction from the snap-in part 12 to the shielding frame 10, the size of the limiting block 13 is smaller than the size of the limiting groove A3, for example. Among them, Figure 11Among them, (a) is a three-dimensional structure diagram of the shielding frame 10, Figure 11 and (b) is a three-dimensional structure diagram of the heat pipe 11.

[0108] Optionally, in combination with Figure 8 , Figure 9 and Figure 10 , the clamping portion 12 can be located outside the area surrounded by the shielding frame 10. At this time, the clamping portion 12 is in contact with the outer side surface A5 of the shielding frame 10, for example. The limiting block 13 can be connected to a partial side surface of the clamping portion 12 facing the outer side surface A5 of the shielding frame 10 and extends along the direction of the clamping portion 12 pointing to the shielding frame 10. The limiting groove A3 is opened on the outer side surface A5 of the shielding frame 10. The limiting groove A3 extends along the arrangement direction of the shielding frame 10 and the clamping portion 12. The bottom wall of the limiting groove A3 is located inside the shielding frame 10, for example, or the limiting groove A3 is in the shape of a through hole and penetrates through the shielding frame 10, for example. Along the direction of the clamping portion 12 pointing to the shielding frame 10, the size of the limiting block 13 is smaller than the size of the limiting groove A3, for example. Among them, Figure 8 Among them, (a) is a three-dimensional structure diagram of the shielding frame 10, Figure 8 and (b) is a three-dimensional structure diagram of the heat pipe 11.

[0109] With the above setting method, by applying a certain force in the direction perpendicular to the first surface A1, the heat pipe 11 can be installed on the shielding frame 10 or removed from the shielding frame 10, which is beneficial to reducing the risk of damage to the clamping portion 12, the limiting block 13, and the shielding frame 10, and the structure is simple and easy to implement.

[0110] In this implementation manner, as shown in Figure 8 , Figure 10 and Figure 11 , the number of the limiting blocks 13 is multiple, the number of the limiting grooves A3 is multiple, and the limiting blocks 13 and the limiting grooves A3 are arranged in a one-to-one correspondence, for example. This can provide multiple clamping sites and improve the connection stability between the shielding frame 10 and the heat pipe 11.

[0111] Furthermore, as shown in Figure 8 , Figure 10 and Figure 11 , the number of the clamping portions 12 is one or more.

[0112] As shown in Figure 8 and Figure 11 , when the number of the clamping portions 12 is multiple, at least one limiting block 13 is connected to each clamping portion 12, for example. For example, one, two, three or even more limiting blocks 13 are connected to each clamping portion 12.

[0113] The above-mentioned multiple clamping portions 12 are arranged at intervals along the circumferential direction of the shielding frame 10, for example. For example, along the circumferential direction of the shielding frame 10, the multiple clamping portions 12 are evenly distributed. Also, for example, the multiple clamping portions 12 are at least located on opposite sides of the shielding frame 10.

[0114] In this way, multiple clamping points between the shielding frame 10 and the heat pipe plate 11 can be arranged at intervals along the circumferential direction of the shielding frame 10, which is beneficial to further improve the connection stability between the shielding frame 10 and the heat pipe plate 11. Moreover, along the direction parallel to the first surface A1, the multiple clamping portions 12 can also cooperate with the shielding frame 10 to limit the relative position between the shielding frame 10 and the heat pipe plate 11, avoiding dislocation of the heat pipe plate 11.

[0115] As Figure 10 shown, when the number of the clamping portions 12 is one, the clamping portion 12 is arranged in a ring shape, for example. The shape of the orthographic projection of the clamping portion 12 on the first surface A1 is the same as the shape of the orthographic projection of the shielding frame 10 on the first surface A1. And, the orthographic projection of the shielding frame 10 on the first surface A1 surrounds the orthographic projection of the clamping portion 12 on the first surface A1; or, the orthographic projection of the clamping portion 12 on the first surface A1 surrounds the orthographic projection of the shielding frame 10 on the first surface A1.

[0116] The above-mentioned multiple limiting blocks 13 are arranged at intervals along the circumferential direction of the shielding frame 10, for example. For example, along the circumferential direction of the shielding frame 10, the multiple limiting blocks 13 are evenly distributed. Also, for example, the multiple limiting blocks 13 are at least located on opposite sides of the shielding frame 10.

[0117] In this way, multiple clamping points between the shielding frame 10 and the heat pipe plate 11 can be arranged at intervals along the circumferential direction of the shielding frame 10, which is beneficial to further improve the connection stability between the shielding frame 10 and the heat pipe plate 11. Moreover, along the direction parallel to the first surface A1, the clamping portion 12 can also cooperate with the shielding frame 10 to limit the relative position between the shielding frame 10 and the heat pipe plate 11, avoiding dislocation of the heat pipe plate 11.

[0118] In some examples, the clamping portion 12 and the limiting block 13 are integrally formed. This is beneficial to improve the connection stability between the clamping portion 12 and the limiting block 13 and simplify the installation steps between the heat pipe plate 11 and the shielding frame 10.

[0119] In some examples, the clamping portion 12 has elasticity, that is, the clamping portion 12 can produce elastic deformation. After the limiting block 13 extends into the limiting groove A3, or after the heat pipe plate 11 is removed from the shielding frame 10, the clamping portion 12 can maintain its original state. This is beneficial to improve the service life of the clamping portion 12 and reduce costs.

[0120] In another possible implementation, as Figures 14 - 17As shown, the limiting block 13 is connected to the shielding frame 10, and the limiting groove A3 is formed on the clamping portion 12. Among them, the shielding frame 10 has a top surface A6 in contact with the heat spreader 11. The top surface A6 is, for example, parallel to the first surface A1 and can connect the inner side surface A4 and the outer side surface A5. At this time, a receiving groove A7 is formed on the top surface A6 of the shielding frame 10. The bottom wall of the receiving groove A7 is located inside the shielding frame 10, that is, the receiving groove A7 does not penetrate the shielding frame 10. The clamping portion 12 extends into the receiving groove A7. In Figures 14 - 17 this case, the width of the clamping portion 12 is, for example, less than or slightly less than the width of the receiving groove A7.

[0121] The receiving groove A7 has two opposite side walls A71. After the clamping portion 12 extends into the receiving groove A7, the two side walls A71 of the receiving groove A7 can abut against the clamping portion 12 to limit the displacement of the clamping portion 12 in the direction parallel to the first surface A1. Furthermore, the relative position between the shielding frame 10 and the heat spreader 11 can be limited by the cooperation between the clamping portion 12 and the receiving groove A7 of the shielding frame 10, avoiding misalignment of the heat spreader 11.

[0122] Furthermore, as Figures 14 - 17 shown, the limiting block 13 is connected to the side wall A71 of the receiving groove A7. The limiting block 13 extends, for example, in a direction perpendicular to the side wall A71 of the receiving groove A7. The limiting groove A3 is formed on a part of the side surface of the clamping portion 12 opposite to the limiting block 13. The limiting groove A3 extends, for example, in a direction perpendicular to the side wall A71 of the receiving groove A7, as Figure 14 , Figure 15 and Figure 17 shown. The bottom wall of the limiting groove A3 is, for example, located inside the clamping portion 12, or, as Figure 16 shown, the limiting groove A3 is, for example, in the shape of a through hole and penetrates the clamping portion 12. In the direction perpendicular to the side wall A71 of the receiving groove A7, the size of the limiting block 13 is, for example, smaller than the size of the limiting groove A3.

[0123] With the above setting method, by applying a certain force in the direction perpendicular to the first surface A1, the heat spreader 11 can be installed on the shielding frame 10 or removed from the shielding frame 10, which is beneficial to reducing the risk of damage to the clamping portion 12, the limiting block 13, and the shielding frame 10, and the structure is simple and easy to implement.

[0124] In this implementation, as Figures 14 - 17 shown, the number of the limiting blocks 13 is multiple, the number of the limiting grooves A3 is multiple, and one limiting block 13 extends into one limiting groove A3. This can provide multiple clamping points and improve the connection stability between the shielding frame 10 and the heat spreader 11.

[0125] Furthermore, as Figure 14 and Figure 15As shown, the multiple limiting blocks 13 can all be located on the same side wall A71; or, as Figure 16 and Figure 17 shown, the multiple limiting blocks 13 can also be respectively located on two side walls A71.

[0126] For example, as Figure 14 and Figure 15 shown, when at least two limiting blocks 13 are provided on the same side wall A71, the at least two limiting blocks 13 are arranged at intervals along the circumferential direction of the shielding frame 10. For example, along the circumferential direction of the shielding frame 10, the at least two limiting blocks 13 are evenly distributed. Also for example, the at least two limiting blocks 13 are at least located on opposite sides of the shielding frame 10.

[0127] This can make the multiple clamping sites between the shielding frame 10 and the heat spreader 11 arranged at intervals along the circumferential direction of the shielding frame 10, which is beneficial to further improving the connection stability between the shielding frame 10 and the heat spreader 11.

[0128] Also for example, as Figure 16 and Figure 17 shown, when limiting blocks 13 are provided on both side walls A71, the multiple limiting blocks 13 can include at least one limiting block group 13a, and the number of the limiting block groups 13a can be one, two, three or even more. Among them, each limiting block group 13a includes two limiting blocks 13 that are opposite and spaced apart, the two limiting blocks 13 are respectively located on the two side walls A71 and are arranged opposite to each other; there is a gap between the two limiting blocks 13 to facilitate the clamping portion 12 to pass through the gap and clamp the clamping portion 12 between the two limiting blocks 13.

[0129] At this time, as Figure 17 shown, the two limiting grooves A3 corresponding to the two limiting blocks 13 in the limiting block group 13a are arranged in opposite directions; or, as Figure 16 shown, the two limiting grooves A3 are communicated and form an integral structure.

[0130] This increases the restriction on the displacement of the heat spreader 11 in the direction perpendicular to the first surface A1 and away from the first surface A1, which is beneficial to further improving the connection stability between the shielding frame 10 and the heat spreader 11.

[0131] In some examples, the clamping portion 12 is integrally formed with the shielding frame 10. This is beneficial to improving the connection stability between the clamping portion 12 and the shielding frame 10 and simplifying the installation steps between the heat spreader 11 and the shielding frame 10.

[0132] In some examples, the shielding frame 10 is elastic, that is, the shielding frame 10 can undergo elastic deformation. After the clamping portion 12 extends into the receiving groove A7 so that the limiting block 13 extends into the limiting groove A3, or after the heat dissipation plate 11 is removed from the shielding frame 10, the portions of the shielding frame 10 on opposite sides of the receiving groove A7 can maintain their original shapes. This is beneficial to improving the service life of the shielding frame 10 and reducing costs.

[0133] It can be understood that along the direction perpendicular to the first surface A1 of the circuit board 5, the thicknesses of different heat generating devices 6 may vary.

[0134] In some embodiments, as Figure 17 shown, the heat generating device 6 includes a first heat generating device 61. Relative to the first surface A1, the surface of the first heat generating device 61 on the side away from the circuit board 5 is lower than the surface of the shielding frame 10 on the side away from the circuit board 5. The height of the first heat generating device 61 is, for example, less than the height of the shielding frame 10.

[0135] At this time, as Figure 17 shown, the electronic device 100 further includes: a boss 14 connected to the surface of the heat dissipation plate 11 close to the circuit board 5. The boss 14 is located within the area surrounded by the shielding frame 10, and the heat dissipation plate 11 is in contact with the thermal interface material layer 9 through the boss 14. For example, the height difference between the surface of the first heat generating device 61 on the side away from the circuit board 5 and the surface of the shielding frame 10 on the side away from the circuit board 5, and the height of the boss 14, are equal or approximately equal.

[0136] The setting of the boss 14 basically makes up for the height difference between the first heat generating device 61 and the shielding frame 10. The boss 14 is used for heat dissipation. By using the boss 14, the heat dissipation distance between the first heat generating device 61 and the heat dissipation plate 11 can be reduced, and the heat dissipation performance can be improved.

[0137] Of course, as Figure 17 shown, the heat generating device 6 may further include a second heat generating device 62. Relative to the first surface A1, the surface of the second heat generating device 62 on the side away from the circuit board 5 is flush with the surface of the shielding frame 10 on the side away from the circuit board 5. The height of the second heat generating device 62 is, for example, equal to the height of the shielding frame 10. The second heat generating device 62 can be directly in contact with the heat dissipation plate 11 through the thermal interface material layer 9 without the need to provide a boss 14.

[0138] This means that by connecting the boss 14 to the surface of the heat dissipation plate 11 close to the circuit board 5, the embodiments of the present application can be applied to scenarios where all the heat generating devices 6 are the first heat generating devices 61, and can also be applied to scenarios where the heat generating devices 6 include both the first heat generating device 61 and the second heat generating device 62, improving the practicability of the embodiments of the present application.

[0139] In some examples, such as Figure 17 shown, the number of the above-mentioned first heating devices 61 is multiple, and the number of the bosses 14 is at least one. Among them, one boss 14 covers at least one first heating device 61.

[0140] For example, the number of the bosses 14 is one, and this boss 14 covers the above-mentioned multiple first heating devices 61. Another example is that the number of the bosses 14 is multiple, and a one-to-one correspondence is set between the multiple bosses 14 and the multiple first heating devices 61. Specifically, it can be selected and set according to the layout mode of the heating device 6.

[0141] In some examples, such as Figure 17 shown, the orthographic projection of the boss 14 on the first surface A1 coincides with the orthographic projection of the first heating device 61 on the first surface A1. That is to say, the boss 14 exactly covers the first heating device 61.

[0142] In this way, the space occupation ratio of the boss 14 can be reduced, and the setting of other heating devices 6 can be prevented from being affected.

[0143] In some examples, the boss 14 is integrally formed with the heat spreader 11. This is beneficial to improving the connection stability between the boss 14 and the heat spreader 11 and simplifying the assembly steps of the electronic device 100.

[0144] It can be understood that the relative positional relationship among the above-mentioned heat spreader 11, the circuit board 5 and the display screen 2 includes various types, and can be selected and set according to the actual product requirements. The embodiments of the present application do not limit this.

[0145] In some examples, such as Figure 18 shown, the display screen 2 is located on the side of the heat spreader 11 away from the circuit board 5. That is to say, along the direction perpendicular to the first surface A1, the circuit board 5, the heat spreader 11 and the display screen 2 are arranged in a spaced and stacked manner. Further, the heat spreader 11, the heating device 6 and the circuit board may be located between the carrier plate 31 of the middle frame 3 and the rear shell 4, and the carrier plate 31 is arranged at intervals between the heat spreader 11 and the display screen 2. Or, the heat spreader 11, the heating device 6 and the circuit board may also be located in the accommodation cavity of the carrier plate 31.

[0146] At this time, the heat conducted from the heating device 6 to the heat spreader 11 can diffuse to the side where the display screen 2 is located. This is beneficial to reducing the temperature on the side where the rear shell 4 is located and improving the user experience.

[0147] Of course, the heat spreader 11 may also be located on the side of the circuit board 5 away from the display screen 2. For example, the heat spreader 11, the heating device 6 and the circuit board may be located between the carrier plate 31 and the rear shell 4, and along the direction perpendicular to the first surface A1, the rear shell 4, the heat spreader 11, the circuit board 5 and the carrier plate 31 are arranged in a spaced and stacked manner.

[0148] In the description of this specification, specific features, structures, materials, or characteristics may be combined in a suitable manner in any one or more embodiments or examples.

[0149] As mentioned above, it is only the specific implementation manner of this application, but the protection scope of this application is not limited thereto. Any person skilled in the art within the technical scope disclosed by this disclosure, who thinks of changes or substitutions, should be covered within the protection scope of this application. Therefore, the protection scope of this application shall be subject to the protection scope of the claims.

Claims

1. An electronic device, characterized in that, the electronic device includes: a circuit board having a first surface; a shielding frame connected to the first surface; a heating device connected to the first surface and located within the area enclosed by the shielding frame; a thermal interface material layer covering the heating device; a heat pipe, buckled on the shielding frame and in contact with the thermal interface material layer.

2. The electronic device according to claim 1, characterized in that, the electronic device further includes: a clamping portion connected to a surface of the heat pipe close to the circuit board; in a direction parallel to the first surface, the clamping portion is partially opposite to the shielding frame; a limiting block connected to one of the clamping portion and the shielding frame; wherein, a limiting groove is formed on the other of the clamping portion and the shielding frame, and the limiting block extends into the limiting groove; the limiting block and the limiting groove are used to limit the displacement of the heat pipe in a direction perpendicular to the first surface and away from the first surface.

3. The electronic device according to claim 2, characterized in that, the shielding frame has an inner side surface and an outer side surface opposite to each other; the clamping portion is in contact with the inner side surface of the shielding frame; the limiting groove is formed on the inner side surface of the shielding frame, and the limiting block is connected to a partial side surface of the clamping portion opposite to the inner side surface of the shielding frame; or, the clamping portion is in contact with the outer side surface of the shielding frame; the limiting groove is formed on the outer side surface of the shielding frame, and the limiting block is connected to a partial side surface of the clamping portion opposite to the outer side surface of the shielding frame.

4. The electronic device according to claim 3, characterized in that, the number of the clamping portions is multiple, and the multiple clamping portions are arranged at intervals along the circumferential direction of the shielding frame; the number of the limiting blocks is multiple, and each clamping portion is connected to at least one limiting block.

5. The electronic device according to claim 3, characterized in that, the clamping portion is annular; the number of the limiting blocks is multiple, and the multiple limiting blocks are arranged at intervals along the circumferential direction of the shielding frame.

6. The electronic device according to any one of claims 3-5, characterized in that, the clamping portion and the limiting block are integrally formed.

7. The electronic device according to any one of claims 3-6, characterized in that, the clamping portion has elasticity.

8. The electronic device according to claim 2, characterized in that, the shielding frame has a top surface in contact with the heat pipe, and a receiving groove is formed on the top surface of the shielding frame; the clamping portion extends into the receiving groove; the receiving groove has two opposite side walls, and the limiting block is connected to the side walls; the limiting groove is formed on the clamping portion.

9. The electronic device according to claim 8, characterized in that, the number of the limiting blocks is multiple; the number of the limiting blocks located on the same side wall is at least two, and the at least two limiting blocks are arranged at intervals along the circumferential direction of the shielding frame.

10. The electronic device according to claim 8 or 9, characterized in that, The number of the limiting blocks is multiple, and the multiple limiting blocks include at least one limiting block group, and the limiting block group includes two limiting blocks that are opposite and spaced apart; The two limiting blocks in the limiting block group are respectively located on the two side walls.

11. The electronic device according to any one of claims 8-10, wherein, The clamping portion and the shielding frame are integrally formed.

12. The electronic device according to any one of claims 8-11, wherein, The shielding frame has elasticity.

13. The electronic device according to any one of claims 2-12, wherein, The clamping portion and the heat spreader are integrally formed.

14. The electronic device according to any one of claims 1-13, wherein, The number of the heating devices is multiple, and the multiple heating devices include a first heating device; relative to the first surface, the surface of the first heating device on the side away from the circuit board is lower than the surface of the shielding frame on the side away from the circuit board; The electronic device further includes: a boss connected to the surface of the heat spreader close to the circuit board; The heat spreader is in contact with the thermal interface material layer through the boss.

15. The electronic device according to claim 14, wherein, The number of the first heating devices is multiple, and the number of the bosses is at least one; One boss covers at least one of the first heating devices.

16. The electronic device according to claim 14 or 15, wherein, The orthographic projection of the boss on the first surface coincides with the orthographic projection of the first heating device on the first surface.

17. The electronic device according to any one of claims 14-16, wherein, The boss and the heat spreader are integrally formed.

18. The electronic device according to any one of claims 1-17, wherein, The outer boundary of the orthographic projection of the shielding frame on the first surface coincides with the outer boundary of the orthographic projection of the heat spreader on the first surface, or is located within the outer boundary of the orthographic projection of the heat spreader on the first surface.

19. The electronic device according to any one of claims 1-18, wherein, The heating device includes at least one of a system-on-chip, a power management chip, a charging management chip, a radio frequency chip, a display chip, and a general-purpose memory.

20. The electronic device according to any one of claims 1-19, wherein, The electronic device includes: a display screen; The display screen is located on the side of the heat spreader away from the circuit board.

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