Electronic equipment assembly, heat dissipation device and control method of heat dissipation device

Abstract

The invention provides an electronic equipment assembly, a heat dissipation device and a control method of the heat dissipation device. The heat dissipation device is used for being connected with electronic equipment in a matched mode and dissipating heat for the electronic equipment. Wherein the heat dissipation device comprises a heat dissipation device, a control unit and a signal transmission unit, and the signal transmission unit and the heat dissipation device are respectively connected with the control unit; the signal transmission unit is used for receiving temperature information from the electronic equipment, and the control unit is used for controlling the working state of the heat dissipation device according to the temperature information. According to the heat dissipation device provided by the embodiment of the invention, the working state of the heat dissipation device is controlled by acquiring the temperature information of the electronic equipment, intelligent regulation and control of the temperature of the electronic equipment can be realized, and the heat dissipation efficiency and the user experience of the device type heat dissipation device are greatly improved.

Description

Technical Field

[0001] This application relates to the technical field of heat dissipation of electronic devices, and specifically relates to an electronic device component, a heat dissipation device and a control method thereof. Background Art

[0002] With the increasing diversity of the use of electronic devices such as mobile phones, in response to the growing heat dissipation requirements caused by scenarios such as mobile games and live broadcasts, many users will wear a heat dissipation back clip when solving the problem of mobile phone heating. However, the heat dissipation back clip in the conventional technical solution can no longer meet the increasingly high heat dissipation requirements. Summary of the Invention

[0003] In a first aspect of an embodiment of this application, a heat dissipation device for heat dissipation of an electronic device is provided. The heat dissipation device is used to be cooperatively connected with the electronic device and dissipate heat for the electronic device. Among them, the heat dissipation device includes a heat dissipation component, a control unit, and a signal transmission unit. The signal transmission unit and the heat dissipation component are respectively connected to the control unit. The signal transmission unit is used to receive temperature information from the electronic device, and the control unit is used to control the working state of the heat dissipation component according to the temperature information.

[0004] In a second aspect, an embodiment of this application provides a control method for a heat dissipation device. The control method includes:

[0005] Obtain the temperature information of the electronic device;

[0006] Control the working state of the heat dissipation component of the heat dissipation device according to the temperature information.

[0007] In a third aspect, an embodiment of this application provides an electronic device component. The electronic device component includes an electronic device and the heat dissipation device described in the above embodiment. The heat dissipation device is connected to the electronic device, and the heat dissipation device is used to dissipate heat for the electronic device.

[0008] The heat dissipation device provided by the embodiment of this application can realize intelligent regulation of the temperature of the electronic device by obtaining the temperature information of the electronic device, and greatly improve the heat dissipation efficiency and user experience of the heat dissipation device. Brief Description of the Drawings

[0009] In order to more clearly illustrate the technical solutions in the embodiments of this application, the following will briefly introduce the drawings required for description in the embodiments. Obviously, the following drawings are only some embodiments of this application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0010] Figure 1It is a schematic diagram of the overall structure of an embodiment of the electronic device component of the present application;

[0011] Figure 2 is Figure 1 a schematic cross-sectional structure diagram of the electronic device component along line A-A in the embodiment;

[0012] Figure 3 It is a schematic diagram of the structure of an embodiment of the cooling plate of the present application;

[0013] Figure 4 is Figure 3 a schematic cross-sectional structure diagram of the cooling plate along line B-B in the embodiment;

[0014] Figure 5 It is a schematic cross-sectional structure diagram of another embodiment of the cooling plate of the present application;

[0015] Figure 6 It is a schematic diagram of the structure of still another embodiment of the heat dissipation device of the present application;

[0016] Figure 7 It is a schematic diagram of the structure of yet another embodiment of the heat dissipation device of the present application;

[0017] Figure 8 It is a schematic block diagram of the structural composition of an embodiment of the electronic device of the present application;

[0018] Figure 9 It is a schematic flowchart of an embodiment of the control method of the heat dissipation device of the present application;

[0019] Figure 10 It is a schematic flowchart of another embodiment of the control method of the heat dissipation device of the present application;

[0020] Figure 11 It is a schematic flowchart of an embodiment of controlling the working state of the heat dissipation device of the heat dissipation device according to temperature information;

[0021] Figure 12 It is a schematic flowchart of another embodiment of controlling the working state of the heat dissipation device of the heat dissipation device according to temperature information. Detailed implementation manners

[0022] Next, with reference to the drawings and embodiments, the present application will be further described in detail. It should be particularly noted that the following embodiments are only used to illustrate the present application, but do not limit the scope of the present application. Similarly, the following embodiments are only partial embodiments of the present application rather than all embodiments, and all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present application.

[0023] The terms "first", "second", and "third" in the embodiments of the present application are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first", "second", and "third" may explicitly or implicitly include at least one such feature. In the description of the present application, "a plurality of" means at least two, such as two, three, etc., unless otherwise specifically defined. All directional indications (such as up, down, left, right, front, back...) in the embodiments of the present application are only used to explain the relative positional relationship and movement conditions between components in a specific posture (as shown in the drawings). If the specific posture changes, the directional indications will also change accordingly. The terms "including" and "having" and any variations thereof in the embodiments of the present application are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but optionally further includes steps or units not listed, or optionally further includes other steps or components inherent to these processes, methods, products, or devices.

[0024] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in connection with the embodiments can be included in at least one embodiment of the present application. The phrase appears in various places in the specification and is not necessarily referring to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive of other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0025] As used herein, an "electronic device" (or simply "terminal") includes, but is not limited to, a device configured to receive / transmit communication signals via a wired connection (such as via a public switched telephone network (PSTN), digital subscriber line (DSL), digital cable, direct cable connection, and / or another data connection / network) and / or via a wireless interface (such as for a cellular network, wireless local area network (WLAN), digital television network such as DVB-H network, satellite network, AM-FM broadcast transmitter, and / or another communication terminal). A communication terminal configured to communicate via a wireless interface may be referred to as a "wireless communication terminal", "wireless terminal", or "mobile terminal". Examples of mobile terminals include, but are not limited to, satellite or cellular telephones; personal communication system (PCS) terminals that can combine cellular radiotelephone with data processing, facsimile, and data communication capabilities; PDAs that may include radiotelephones, pagers, Internet / intranet access, web browsers, notepads, calendars, and / or global positioning system (GPS) receivers; and conventional laptop and / or palmtop receivers or other electronic devices that include radiotelephone transceivers. A mobile phone is an electronic device configured with a cellular communication module.

[0026] Please refer to Figure 1 and Figure 2 , Figure 1 which is a schematic diagram of the overall structure of an embodiment of the electronic device component of this application. Figure 2 is Figure 1 a schematic cross-sectional structure diagram of the electronic device component along line A-A in the embodiment; it should be noted that the electronic device in this application may include mobile phones, tablet computers, laptop computers, wearable devices, etc. The electronic device component includes a heat dissipation device 100 and an electronic device 200. The heat dissipation device 100 is connected to the electronic device 200, and the heat dissipation device 100 is used to dissipate heat from the electronic device 200.

[0027] Specifically, the heat dissipation device 100 includes a housing 110, a heat dissipation fan 120, and a radiator 130. Optionally, on the one hand, the housing 110 of this embodiment encloses to form a receiving cavity 1101 for receiving devices such as the heat dissipation fan 120 and the radiator 130; on the other hand, the housing 110 is also provided with a mounting groove 1102 for mating connection with the electronic device 200. Additionally, in some other embodiments, the heat dissipation device 100 may also be a structure without the mounting groove 1102, for example, achieving mating connection with the electronic device 200 through magnetic means or the like.

[0028] Among them, the housing 110 is provided with an air inlet 111 and an air outlet 112. The heat dissipation fan 120 circulates the air inside and outside the housing 110 through the air inlet 111 and the air outlet 112; thereby achieving air cooling of the radiator 130. Among them, the positions of the air inlet 111 and the air outlet 112 are not limited to the positions shown in the figure.

[0029] Among them, a cooling plate 140 is covered on the air inlet 111. Please refer to Figure 3 and Figure 4 , Figure 3 which is a schematic diagram of the structure of an embodiment of the cooling plate of this application. Figure 4 is Figure 3 a schematic cross-sectional structure diagram of the cooling plate along line B-B in the embodiment. Among them, the cooling plate 140 of this embodiment includes a substrate 141 and a temperature-lowering material layer 142. The temperature-lowering material layer 142 is embedded in the substrate 141. The cooling plate 140 is provided with a plurality of air inlet holes 1401 penetrating therethrough. The temperature-lowering material layer 142 is communicated with the air inlet holes 1401 through air-permeable holes 1402. When the air flows through the air inlet holes 1401, it contacts the temperature-lowering material layer 142, and is thereby cooled by the temperature-lowering material layer 142. Among them, the opening ratio of the air inlet holes 1401 on the substrate 141 is 20%-80%, which can balance ensuring ventilation capacity and heat dissipation efficiency.

[0030] Optionally, the substrate 141 may be made of a material with a certain strength, such as metal, alloy, plastic, composite material, etc. The cooling material layer 142 may be made of a hydrogel or a hydrogel composite material, such as a composite material of hydrogel and graphite. In some embodiments, the cooling material layer 142 may be a hydrogel composite material with a MOFs structure.

[0031] Among them, MOFs structure is the abbreviation of Metal Organic Framework (English name Metal organic Framework). It is a type of crystalline porous material with a periodic network structure formed by the self-assembly of inorganic metal centers (metal ions or metal clusters) and bridging organic ligands. MOFs is an organic-inorganic hybrid material, also known as a coordination polymer, which is different from inorganic porous materials and general organic complexes. It has the rigidity of inorganic materials and the flexibility of organic materials. The cooling material layer 142 in this embodiment can be a hydrogel or a hydrogel composite material doped or infiltrated into the MOFs structure to form a material layer structure with excellent heat dissipation performance.

[0032] Phase change heat transfer principle based on hydrogel: Hydrogel is a kind of extremely hydrophilic three-dimensional network structure polymer. The existence of the cross-linked network causes the hydrogel to swell a large amount of water, and the water content can exceed 90%. When the electronic product is working, the hydrogel absorbs heat, and the internal water evaporates into water vapor and diffuses into the air, taking away a large amount of heat at the same time. The latent heat of vaporization of water is as high as ~2400J / g, that is, every 1g of water evaporated can take away 2400J of heat, which is 10 times that of commercial phase change heat storage film. Water evaporation takes away heat and cools down; when the heat dissipation device is not working, it spontaneously absorbs water from the air. Therefore, as long as the above materials that can repeatedly absorb and lose water are met, they can be used, and they will not be listed here one by one.

[0033] Please continue reading Figure 3 and Figure 4 In this embodiment, the substrate 141 (on one or both sides) may be provided with a plurality of vents 1402 connected to the cooling material layer 142. The vents 1402 have the same function as the vents 1402 on the inner wall of the air inlet 1401, which is to allow air to contact the cooling material layer 142, thereby increasing the heat dissipation effect. Figure 5 , Figure 5 It is a schematic diagram of the cross-sectional structure of another embodiment of the cooling plate of the present application, wherein the cooling material layer 142 in this embodiment can be leaked from the substrate 141 on the opposite side surfaces of the substrate 141, thereby increasing the contact area between the cooling material layer 142 and the external air.

[0034] The technical solution of this embodiment utilizes the characteristic of high water content of hydrogel to construct a phase change convection cooling inlet screen window of a heat dissipation layer / hydrogel layer / breathable layer, achieving ultra-high heat dissipation performance through the phase change convection of the swollen water in the hydrogel, and designing an enhanced heat dissipation device for the cooling screen window.

[0035] When the heat dissipation device works, the heat transfer path is as follows: when the heat dissipation fan 120 rotates, the inside of the accommodation cavity 1101 of the heat dissipation device is in a negative pressure state, and the external air enters the accommodation cavity 1101 through the air inlet 111. The air exchanges heat fully with the radiator 130 under the traction of the continuously rotating heat dissipation fan 120, and the heated air flows out through the air outlet 112.

[0036] Due to the cooling plate 140 provided with the temperature-lowering material layer 142 at the air inlet 111, when the air with a certain temperature and wind speed flows through the temperature-lowering material layer 142, the temperature-lowering material layer 142 absorbs heat and its temperature rises, the saturated vapor pressure rises, the moisture evaporates, and diffuses into the atmosphere through the breathable layer, taking away a large amount of heat at the same time, so as to achieve the purpose of reducing the air temperature. When the heat dissipation device does not work, the partial pressure of water vapor in the atmosphere is greater than the saturated vapor pressure of the hydrogel, and the water vapor is absorbed by the hydrogel through the breathable layer.

[0037] The function of the air inlet holes 1401 is to provide a channel for the water vapor in the hydrogel / air. When the electronic device generates heat, the hydrogel is heated and the moisture evaporates, overflowing from the air inlet holes 1401 and the breathable holes 1402; when the heat dissipation device is on standby, the water vapor in the air is adsorbed into the hydrogel through the breathable holes. Therefore, the area of the breathable holes determines the resistance of the water vapor passing through, and further affects the heat dissipation and water absorption functions of the hydrogel. The shape of the breathable holes can be a circular array, a strip array, etc., as long as the structural strength can be satisfied.

[0038] The heat dissipation device provided by the embodiment of the present application, through the structure of arranging a cooling plate at the air inlet of the housing, the cooling plate is provided with a temperature-lowering material layer and a plurality of air inlet holes arranged therethrough. When the air flows through the air inlet holes, it can be cooled by the temperature-lowering material layer, thereby improving the refrigeration capacity of the heat dissipation device and being beneficial to enhancing the comfort experience of users.

[0039] Please refer to Figure 6 , Figure 6 which is a schematic structural diagram of another embodiment of the heat dissipation device of the present application. The heat dissipation device 100 in this embodiment can also include a housing 110, a heat dissipation fan 120 and a radiator 130.

[0040] Among them, the housing 110 is provided with an air inlet 111 and an air outlet 112, and the heat dissipation fan 120 circulates the air inside and outside the housing 110 through the air inlet 111 and the air outlet 112; thereby realizing air heat dissipation for the radiator 130.

[0041] Different from the foregoing embodiments, in this embodiment, the cooling plate 140 may be embedded in the air outlet 112, or the substrate of the cooling plate 140 is made into an integral structure with the housing 110. For the detailed structural features of the cooling plate 140, reference may be made to the relevant descriptions of the foregoing embodiments, which will not be elaborated here.

[0042] Please refer to Figure 7 , Figure 7 FIG. is a schematic structural diagram of another embodiment of the heat dissipation device of the present application. The heat dissipation device 100 in this embodiment includes a housing 110, a heat dissipation fan 120, a radiator 130, a cooling plate 140, a thermoelectric cooler 150, a liquid cooling diaphragm 160, and a heat conduction protection sheet 170. The thermoelectric cooler 150 and the heat dissipation fan 120 are respectively attached to the radiator 130. The liquid cooling diaphragm 160 is attached to the side of the thermoelectric cooler 150 facing away from the radiator 130. The liquid cooling diaphragm 160 may be attached to the electronic device through the heat conduction protection sheet 170. Among them, the heat dissipation fan 120, the radiator 130, the cooling plate 140, the thermoelectric cooler 150, and the liquid cooling diaphragm 160 in this embodiment are all heat dissipation components.

[0043] Among them, the thermoelectric cooler 150 (English name: Thermo Electric Cooler, abbreviated as TEC) is made using the Peltier effect of semiconductor materials. The so-called Peltier effect refers to the phenomenon that when a direct current passes through an electric couple composed of two semiconductor materials, one end absorbs heat and the other end releases heat. Heavily doped N-type and P-type bismuth telluride are mainly used as the semiconductor materials of TEC. The bismuth telluride elements are connected in series electrically and generate heat in parallel. TEC includes a number of P-type and N-type pairs (groups), which are connected together through electrodes and sandwiched between two ceramic electrodes; when a current passes through TEC, the heat generated by the current will be transferred from one side of TEC to the other side, generating a "hot" side and a "cold" side on TEC, which is the heating and cooling principle of TEC.

[0044] When a direct current passes through an electric couple composed of P-type and N-type semiconductor materials, one end will absorb heat and the other end will release heat. That is, the cold end and the hot end of TEC. In order to ensure the refrigeration effect of TEC, it is necessary to dissipate the heat of the hot end in time. Otherwise, a large amount of heat at the hot end of TEC will be transferred to the cold end, resulting in the failure of TEC to work.

[0045] The heat dissipation device dissipates heat in time through a matching radiator and heat dissipation fan at the hot end of TEC to ensure the refrigeration capacity of the cold end of TEC. The heat at the hot end of TEC is first transferred to the radiator, and then the fan accelerates the air flow to achieve active air cooling of the radiator.

[0046] The heat exchanged between the radiator and the air is:

[0047] Q = h * A * △t

[0048] Δt = T 散热器 -T 空气

[0049] Q is the heat transfer amount between the radiator and the air; h is the convective heat transfer coefficient of the air, with the unit of W / (m 2 .K), and its value depends on the rotational speed of the fan; A is the heat transfer area between the radiator and the air, that is, the outer surface area of the radiator, with the unit of m 2 , and Δt is the temperature difference between the radiator and the air, with the unit of K;

[0050] It can be obtained from the formula that reducing the air temperature can increase the temperature difference between the radiator and the air, that is, achieve an increase in the heat transfer amount, and further reduce the cold quantity loss at the cold end of the TEC, greatly improving its refrigeration effect and enhancing the comfort experience of users.

[0051] Especially when using the heat dissipation device in summer, due to the high air temperature, the refrigeration effect of the heat dissipation device will be affected. The solution in the embodiment of the present application can cool the air temperature at the air inlet by designing a cooling plate structure at the air inlet, thereby improving the heat dissipation effect.

[0052] Among them, a flow channel is formed inside the liquid cooling diaphragm 160, and a liquid heat dissipation medium is filled in the flow channel. The liquid heat dissipation medium can flow and circulate under the drive of the piezoelectric micropump, thereby achieving the purpose of conducting heat. The detailed structure of the liquid cooling diaphragm 160 is within the understanding of those skilled in the art and will not be elaborated here.

[0053] The material of the heat conduction protection sheet 170 can be silica gel doped with heat conduction particles, or the heat conduction protection sheet 170 is made of other heat conduction materials. On the one hand, it has the function of heat conduction, on the other hand, it prevents scratching of the electronic device, and plays a role in protecting the liquid cooling diaphragm 160. Among them, the thickness of the heat conduction protection sheet 170 is 0.05 - 0.2 mm, and the thermal conductivity is 0.2 - 100 W / mK.

[0054] The heat dissipation device in the embodiment of the present application can greatly improve the heat dissipation efficiency of the heat dissipation device by setting structures such as a semiconductor refrigerator and a liquid cooling diaphragm.

[0055] The heat dissipation device in the embodiment of the application utilizes the characteristics of the high water content of heat dissipation materials such as hydrogel to construct a phase change convection cooling inlet screen window of a heat dissipation layer / hydrogel layer / breathable layer, and designs an enhanced heat dissipation device (back clip) scheme for the cooling screen window. The phase change convection of the water swollen in the hydrogel realizes ultra-high heat dissipation performance to reduce the air temperature at the inlet, so as to increase the heat transfer amount between the radiator and the air, reduce the cold quantity loss at the cold end of the TEC, improve the refrigeration capacity, and is beneficial to enhancing the comfort experience of users.

[0056] Please refer to Figure 8 , Figure 8 which is a schematic block diagram of the structural composition of an embodiment of the electronic device of the present application. The electronic device can be a mobile phone, a tablet computer, a laptop computer, a wearable device, etc. In this embodiment, the mobile phone is taken as an example. The structure of the electronic device may include an RF circuit 910, a memory 920, an input unit 930, a display unit 940, a sensor 950, an audio circuit 960, a wifi module 970, a processor 980, and a power supply 990, etc. Among them, the RF circuit 910, the memory 920, the input unit 930, the display unit 940, the sensor 950, the audio circuit 960, and the wifi module 970 are respectively connected to the processor 980; the power supply 990 is used to provide electrical energy for the entire electronic device.

[0057] Specifically, the RF circuit 910 is used to receive and send wireless communication signals; the memory 920 is used to store data instruction information; the input unit 930 is used to input information, which may specifically include a touch panel 931 and other input devices 932 such as operation buttons; the display unit 940 may include a display panel 941, etc.; the sensor 950 includes an infrared sensor, a laser sensor, etc., which are used to detect user proximity signals, distance signals, etc.; the speaker 961 and the microphone (or microphone) 962 are connected to the processor 980 through the audio circuit 960 and are used to receive and send sound signals; the wifi module 970 is used to receive and transmit wifi signals, and the processor 980 is used to process the data information of the electronic device. Regarding the specific structural features of the electronic device, within the understanding of those skilled in the art, no further detailed introduction will be made here.

[0058] There are limitations in the contact area between the back clip type heat dissipation device and the outer surface of the mobile phone case, and the contact positions are mostly in the middle part of the outer surface of the mobile phone case (mainly corresponding to the battery compartment area of the mobile phone). The mobile phone motherboard with layout chips is mostly located at the upper and lower ends of the mobile phone, and the hottest point on the surface temperature of the mobile phone case is usually at the front / back outer shell surface temperature corresponding to the main heat generating chip of the motherboard. Therefore, the part where the heat dissipation back clip fits the mobile phone is far from the mobile phone motherboard and the hottest area of the outer surface temperature of the mobile phone case, and there is a certain conduction distance. When the heat dissipation back clip is worn and the mobile phone is started, when the temperature of the area where the back clip fits the mobile phone is rapidly decreased, the temperature drop rate of the motherboard chip and the hottest area of the outer surface temperature of the mobile phone case is delayed compared with the fitting area. The cooling capacity of the heat dissipation back clip is related to the TEC power, the liquid cooling film piezoelectric micropump, and the rotation speed of the heat dissipation fan. The increase in the fan rotation speed will bring an increase in noise. Since the current TEC power and fan rotation speed settings of the heat dissipation back clip cannot be adaptively adjusted according to the actual heat generation state of the electronic device, it is easy to cause the heat dissipation back clip to be unable to adjust the TEC power and fan rotation speed according to the temperature rise state of the actual mobile phone, resulting in poor user experience.

[0059] To improve the working efficiency of the heat dissipation device, an embodiment of the present application provides a heat dissipation device and a control method. The heat dissipation device can obtain the temperature value of the hottest area of the mobile phone motherboard chip / outer surface of the mobile phone housing in real time, and regulate the working state of the heat dissipation device in real time based on this value. Among them, the working state of the heat dissipation device includes but is not limited to: on / off / wind speed regulation, TEC power regulation, liquid cooling membrane piezoelectric micropump power regulation, etc.

[0060] Optionally, please continue to refer to Figure 1 , in the heat dissipation device of the embodiment of the present application, it further includes a control unit 181 and a signal transmission unit 182. Among them, the signal transmission unit 182 and the heat dissipation device are respectively connected to the control unit 181; among them, the heat dissipation device can be any one or more of the heat dissipation fan 120, the thermoelectric cooler 150, and the liquid cooling membrane 160 in the foregoing embodiment. The signal transmission unit 182 can be a wireless or limited communication unit, which is used to receive the temperature information from the electronic device 200 (the electronic device 200 can specifically complete the signal transmission with the signal transmission unit 182 of the heat dissipation device through the RF circuit 910 or other radio frequency modules). The control unit 181 is used to control the working state of the heat dissipation device according to the temperature information. The specific control method will be described in detail in the subsequent method embodiment.

[0061] In addition, please continue to refer to Figure 1 , optionally, the heat dissipation device in the embodiment of the present application may further include a control button 183. The control button 183 is connected to the control unit 181 and is used to control the on / off of the heat dissipation device or some specific instructions, etc.

[0062] The heat dissipation device provided by the embodiment of the present application can control the working state of the heat dissipation device by obtaining the temperature information of the electronic device, and can realize the intelligent regulation of the temperature of the electronic device, greatly improving the heat dissipation efficiency and user experience of the device-type heat dissipation device.

[0063] Please refer to Figure 9 , Figure 9 is a schematic flowchart of an embodiment of the control method of the heat dissipation device of the present application. Among them, the control method includes but is not limited to the following steps.

[0064] Step S100, obtain the temperature information of the electronic device.

[0065] Among them, the temperature information of the electronic device can include the chip temperature value, the virtual shell temperature value, etc. Among them, the virtual shell temperature value is a virtual outer shell temperature distribution map calculated based on the heat source distribution and power consumption of the electronic device. This virtual outer shell temperature distribution Figure 1Generally, the temperature is higher near the heat-generating devices with high power consumption and gradually decreases in the direction away from the heat-generating devices (of course, the combined effect of multiple heat-generating devices also needs to be considered comprehensively). This part of the content is within the understanding of those skilled in the art and will not be elaborated here.

[0066] Please continue to refer to Figure 9 , the control method in the embodiments of the present application further includes step S200 of controlling the working state of the heat dissipation device according to the temperature information.

[0067] In this step, controlling the working state of the heat dissipation device includes but is not limited to: turning on / off / speed regulation, TEC power regulation, liquid-cooled diaphragm piezoelectric micropump power regulation, etc.

[0068] Please refer to Figure 10 , Figure 10 is a schematic flowchart of another embodiment of the control method of the heat dissipation device in the present application. Among them, the control method includes but is not limited to the following steps.

[0069] Step S100, obtaining the temperature information of the electronic device.

[0070] Among them, the temperature information of the electronic device may include temperature values of power consumption devices (such as chips, cameras, etc.), virtual shell temperature values, etc. Among them, the virtual shell temperature value is a virtual outer shell temperature distribution map calculated based on the heat source distribution and power consumption situation of the electronic device. This virtual outer shell temperature distribution Figure 1 Generally, the temperature is higher near the heat-generating devices with high power consumption and gradually decreases in the direction away from the heat-generating devices (of course, the combined effect of multiple heat-generating devices also needs to be considered comprehensively). This part of the content is within the understanding of those skilled in the art and will not be elaborated here.

[0071] Please continue to refer to Figure 10 , the control method in the embodiments of the present application further includes step S200 of controlling the working state of the heat dissipation device according to the temperature information.

[0072] In this step, controlling the working state of the heat dissipation device includes but is not limited to: turning on / off / speed regulation, TEC power regulation, liquid-cooled diaphragm piezoelectric micropump power regulation, etc.

[0073] Please refer to Figure 11 , Figure 11 is a schematic flowchart of an embodiment of controlling the working state of the heat dissipation device according to the temperature information. Among them, it specifically includes the following steps.

[0074] Step S210, determining whether the temperature information exceeds a first preset value.

[0075] If so, proceed to step S220 to control the heat dissipation device to turn on or increase its operating power; if not, continue with step S210. When the temperature information exceeds the first preset value, it indicates that the temperature is too high and the heat dissipation device needs to start the heat dissipation program and increase the power.

[0076] Please refer to Figure 12 , Figure 12 which is a schematic flowchart of another embodiment for controlling the working state of the heat dissipation device of the heat dissipation device according to the temperature information. Specifically, it includes the following steps.

[0077] Step S210, determine whether the temperature information exceeds the first preset value.

[0078] If so, proceed to step S220 to control the heat dissipation device to turn on or increase its operating power; if not, repeat step S210. When the temperature information exceeds the first preset value, it indicates that the temperature is too high and the heat dissipation device needs to start the heat dissipation program and increase the power.

[0079] Step S230, determine whether the temperature information is less than the second preset value.

[0080] If so, proceed to step S240 to control the heat dissipation device to reduce its operating power or turn it off; if not, return to step S230. The second preset value is less than the first preset value. When the temperature information is less than the second preset value, it indicates that the temperature has dropped and the heat dissipation device needs to turn off the heat dissipation program or reduce the power.

[0081] Please continue to refer to Figure 10 , which is different from the foregoing embodiment. The control method in the embodiment of the present application further includes step S300, to display a prompt message on the heat dissipation device or the electronic device.

[0082] In step S300, the prompt message can be information notifying the user to move or change the relative connection position between the heat dissipation device and the electronic device, so that the heat dissipation device can be manually operated by the user to change the relative position with the electronic device (generally move to the area with high temperature), thereby improving the heat dissipation efficiency of the electronic device. Among them, the notification information can include the real-time virtual shell temperature distribution map of the electronic device, the chip temperature, and the temperatures of other power-consuming devices.

[0083] The mobile phone obtains the wearing information of the heat dissipation device: Method 1, when the heat dissipation device is worn on the mobile phone, toggle the wearing control switch of the heat dissipation device to the on state, and this on signal is sent to the control unit 181 (main control chip) of the heat dissipation device. The control unit 181 transmits the wearing information to the transmission and reception module on the mobile phone side through the signal transmission unit 182; Method 2, when the heat dissipation device is worn on the mobile phone, toggle the control switch of the mobile phone to the on state, and this on signal is sent to the main control chip of the mobile phone, and the main control chip of the mobile phone receives this signal;

[0084] When the mobile phone receives the information that the heat dissipation device has been worn, the mobile phone transmits the real-time temperature data of the mobile phone (such as the temperature value of the power-consuming device / virtual shell temperature value, etc.) to the transmission and reception module (signal transmission unit 182) of the heat dissipation device through the mobile phone transmission and emission module; the transmission and reception module of the heat dissipation device transmits the obtained real-time temperature data of the mobile phone (such as the temperature value of the power-consuming device / virtual shell temperature value, etc.) to the main control chip of the heat dissipation device; the main control chip of the heat dissipation device issues corresponding heat dissipation device control instructions (including but not limited to: turning on / off / speed regulation of the fan, TEC power regulation, power regulation of the piezoelectric micro-pump of the liquid cooling film, etc.) according to the received real-time temperature data of the mobile phone, so as to complete the intelligent control of the heat dissipation device.

[0085] Among them, the wearing control switch of the heat dissipation device can be set in the form of app startup or in the form of an external button. The external button can be triggered in the form of a sliding method or a single / double click. Its shape can be circular, square, oval, etc. It can be anywhere on the external structure of the heat dissipation device. According to the actual product definition, the function of the wearing control switch can also be combined with that of other external buttons.

[0086] Among them, the wearing control switch of the heat dissipation device of the mobile phone (electronic device) can be set in the form of app startup or in the form of an external button. The external button can be triggered in the form of a sliding method or a single / double click. Its shape can be circular, square, oval, etc. It can be anywhere on the external structure of the mobile phone. According to the actual product definition, the function of the wearing control switch can also be combined with that of other external buttons.

[0087] When the temperature of the power-consuming device / the virtual shell temperature value of the hot area, etc. exceeds a certain temperature control threshold, the heat dissipation device increases the refrigeration effect of the heat dissipation device by increasing the fan speed, increasing the TEC power, increasing the power of the piezoelectric micro-pump of the liquid cooling film, etc., and can also turn on the heat dissipation device after exceeding a certain temperature control threshold. When the temperature of the power-consuming device / the virtual shell temperature value of the hot area, etc. is lower than a certain temperature control threshold, the heat dissipation device reduces the refrigeration effect of the heat dissipation device by reducing the fan speed, reducing the TEC power, reducing the power of the piezoelectric micro-pump of the liquid cooling film, etc., and can also turn off the heat dissipation device after being lower than a certain temperature control threshold.

[0088] Through the above method, it can be accurately obtained whether an external auxiliary heat dissipation device is installed in the current mobile phone and other electronic devices. If so, the heat dissipation device can perform performance regulation according to the actual temperature of the power-consuming device of the mobile phone / the hottest temperature on the outer surface of the mobile phone housing, which can not only greatly improve the working efficiency of the heat dissipation device, but also ensure the comfort experience (such as noise) while enabling the user to obtain a better refrigeration effect (which can keep the mobile phone processor in a high-performance state, improve the processing speed, and enhance the user experience).

[0089] The heat dissipation device control method in the embodiments of the present application proposes a method and system that can intelligently regulate the operating state and start / stop of the heat dissipation device based on the real-time internal power consumption device temperature / external surface hot zone virtual housing temperature value of the electronic device, so as to solve the limitation that the current external heat dissipation back clip of the electronic device cannot perform performance regulation based on the real-time temperature state of the electronic device. Users do not need to manually adjust the back clip gear and switch state, which greatly improves the heat dissipation efficiency of the back clip and the user performance experience.

[0090] The above are only some embodiments of the present application, and thus do not limit the protection scope of the present application. Any equivalent device or equivalent process transformation made by using the content of the specification and drawings of the present application, or directly or indirectly applied in other related technical fields, shall be equally included in the patent protection scope of the present application.

Claims

1. A heat dissipation device for electronic equipment, characterized in that: The heat dissipation device is used to cooperate with the electronic device and dissipate heat for the electronic device; wherein the heat dissipation device includes a heat dissipation device, a control unit and a signal transmission unit, and the signal transmission unit and the heat dissipation device are respectively connected to the control unit; the signal transmission unit is used to receive temperature information from the electronic device, and the control unit is used to control the working state of the heat dissipation device according to the temperature information.

2. The heat dissipation device according to claim 1, characterized in that: The heat dissipation device includes any one or more of a heat dissipation fan, a semiconductor refrigerator and a liquid cooling diaphragm.

3. The heat dissipation device according to claim 1, characterized in that: The heat dissipation device also includes a control button, and the control button is connected to the control unit.

4. A control method for the heat dissipation device according to any one of claims 1 to 3, characterized in that: The control method comprises: Acquiring temperature information of the electronic device; The working state of the heat dissipation device of the heat dissipation apparatus is controlled according to the temperature information.

5. The control method according to claim 4, characterized in that: The control method further includes: displaying prompt information on the heat dissipation device or the electronic device.

6. The control method according to claim 4, characterized in that: The step of controlling the working state of the heat dissipation device of the heat dissipation device according to the temperature information includes: controlling at least one of a switch and an operating power of the heat dissipation device.

7. The control method according to claim 4, characterized in that: The step of controlling the working state of the heat dissipation device according to the temperature information includes: judging whether the temperature information exceeds a first preset value, and if so, controlling the heat dissipation device to turn on or increase the operating power.

8. The control method according to claim 7, characterized in that: The step of controlling the working state of the heat dissipation device according to the temperature information includes: determining whether the temperature information is less than a second preset value, and if so, controlling the heat dissipation device to reduce operating power or shut down operation; wherein the second preset value is less than the first preset value.

9. An electronic device component, characterized in that: The electronic device assembly comprises an electronic device and the heat dissipation device according to any one of claims 1 to 3, wherein the heat dissipation device is connected to the electronic device and is used to dissipate heat from the electronic device.

10. The electronic device assembly according to claim 9, characterized in that: The temperature information includes any one or more of a temperature value of a power consumption device and a virtual shell temperature value of the electronic device.

Images