Liquid cooling plate assembly and cooling liquid conveying device

By designing a continuous S-shaped flow channel and a transfer plate with increasing thermal conductivity within the substrate of the liquid-cooled plate assembly, combined with the coordination of the control system and branch pipes, the local overheating problem caused by the increase in the temperature of the coolant after heat absorption in the liquid-cooled plate assembly is solved, and more efficient heat exchange and stable electronic equipment performance are achieved.

CN120076281AActive Publication Date: 2025-05-30GUANGDONG HUACHUANG THERMAL CONTROL TECH CO LTD
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Patent Information

Application Number
CN202510552538.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-04-29
Publication Date
2025-05-30
Estimated Expiration
2045-04-29

AI Technical Summary

Technical Problem

During the use of the liquid-cooled plate assembly, the temperature of the coolant increases after absorbing heat, resulting in a decrease in heat exchange capacity and local overheating, affecting the overall performance of the electronic equipment.

Method used

A liquid-cooled plate assembly is designed, including a continuous S-shaped flow channel in the substrate. The flow channel is divided into a third, second and first zones that decrease in sequence. The flow rate of the coolant increases in sequence when flowing, and the coordination of the transfer plate and control system with the branch pipe with increasing thermal conductivity is ensured that the heat absorbed by the coolant in each area is approximately the same.

Benefits of technology

It effectively avoids the impact of the cooling liquid absorption temperature on subsequent heat absorption after the cooling liquid is increased, prevents local overheating, ensures that the performance of electronic equipment is not affected, and improves the heat exchange efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses a liquid cooling plate assembly and a cooling liquid conveying device, the liquid cooling plate assembly comprises a substrate, a plurality of partition plates are arranged in the substrate, and the plurality of partition plates are arranged on the inner wall of the substrate in a staggered manner; a continuous S-shaped circulation channel located in the base plate is formed among the partition plates, a third area, a second area and a first area which are sequentially communicated are formed in the circulation channel in the circulation direction, and the cross sections of the third area, the second area and the first area are sequentially decreased in the circulation direction of the circulation channel. A water outlet pipe is arranged on the base plate corresponding to the first area and communicated with the first area, and a water inlet pipe is arranged on the base plate corresponding to the third area and communicated with the third area. According to the invention, the continuous S-shaped circulation channel is arranged in the substrate to form the third area, the second area and the first area of which the cross sections are gradually reduced in sequence, so that the flow speed of the cooling liquid is gradually increased in sequence during circulation, the influence on subsequent heat absorption after the heat absorption temperature of the cooling liquid is increased is avoided, and the condition of local overheating is avoided.
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Description

Technical Field

[0001] The present invention relates to the field of liquid cooling systems, and particularly to a liquid cooling plate assembly and a coolant delivery device. Background Art

[0002] With the rapid development of electronic devices, especially in the fields of high-performance computing, data centers, and electric vehicles, the demand for thermal management technology is increasing day by day. As an efficient heat dissipation solution, liquid cooling technology has been widely used due to its good thermal conductivity and high heat capacity. The liquid cooling plate assembly is a key part of the liquid cooling system, and its main function is to effectively transfer heat from heat sources (such as CPUs, GPUs, etc.) to the coolant to achieve rapid cooling.

[0003] In the prior art, the liquid cooling plate assembly often faces the problem of the temperature rise of the coolant after heat absorption during use. Specifically, when the coolant enters the liquid cooling plate assembly, it absorbs heat from the heat source, resulting in a gradual increase in the coolant temperature. As the coolant temperature rises, its heat exchange capacity gradually decreases. When the heated coolant flows through the non-heat-absorbing area, the heat absorption effect of the heated coolant on this area decreases, and local overheating occurs, thereby affecting the overall performance of the electronic device.

[0004] Therefore, a liquid cooling plate assembly and a coolant delivery device are proposed to solve the problem of local overheating that occurs after the liquid cooling plate assembly works. Summary of the Invention

[0005] The purpose of the present invention is to provide a liquid cooling plate assembly and a coolant delivery device to solve the problem of local overheating that occurs after the liquid cooling plate assembly works.

[0006] To achieve this purpose, the present invention adopts the following technical solutions: A liquid cooling plate assembly includes a substrate, and a plurality of partition plates are arranged inside the substrate, and the plurality of partition plates are arranged on the inner wall of the substrate in a staggered manner; A continuous S-shaped flow channel located inside the substrate is formed between the plurality of partition plates. A third zone, a second zone, and a first zone that are sequentially communicated are formed in the flow channel along the flow direction, and the cross-sections of the third zone, the second zone, and the first zone decrease sequentially along the flow direction of the flow channel; An outlet pipe is arranged on the substrate corresponding to the first zone, and the outlet pipe is communicated with the first zone. An inlet pipe is arranged on the substrate corresponding to the third zone, and the inlet pipe is communicated with the third zone.

[0007] Preferably, the distances between the sides of the plurality of partition plates away from their fixed surfaces and the inner side wall of the substrate decrease sequentially along the flow direction of the flow channel.

[0008] Preferably, two grooves are formed in the side surface of the partition along its length direction. The two grooves are symmetrically distributed along the central axis of the partition, face the flow passage direction, and communicate with the flow passage.

[0009] Preferably, the two inner side walls of the groove corresponding to the flow passage are inclined surfaces inclined towards it. A transfer plate is vertically fixed in the groove, and a gap is formed between the transfer plate and the inclined surface. A plurality of openings are equidistantly formed in the transfer plate. One end of the opening communicates with the groove, and the other end communicates with the flow passage.

[0010] Preferably, the transfer plate is made of a heat-conducting material, and the heat-conducting coefficients of the plurality of transfer plates increase sequentially along the flow direction of the flow passage.

[0011] Preferably, the substrate includes a bottom plate and a sealing plate. The partition is fixed on the inner side wall of the sealing plate. The bottom surface of the partition is connected to the top surface of the bottom plate. The bottom plate is arranged corresponding to the heating unit, and the bottom plate is made of a heat-conducting material.

[0012] A coolant delivery device is applied to the liquid cooling plate assembly described above. The device includes a control system and a branch pipe. The control system is connected to the branch pipe and the water inlet pipe. The branch pipe is arranged on the substrate corresponding to the first area and communicates with the first area. The diameter of the branch pipe is smaller than that of the water inlet pipe.

[0013] Compared with the prior art, the present invention has the following beneficial effects: 1. In the liquid cooling plate assembly and the coolant delivery device, by arranging a continuous S-shaped flow passage in the substrate and dividing the flow passage into a third area, a second area, and a first area with gradually decreasing cross-sections in the flow direction, the flow rate of the coolant increases sequentially during flow, thereby avoiding the influence of the increased temperature of the coolant after heat absorption on subsequent heat absorption and preventing local overheating.

[0014] 2. In the liquid cooling plate assembly and the coolant delivery device, by arranging transfer plates with sequentially increasing heat-conducting coefficients along the flow direction of the flow passage on the partition, after the coolant is heated, the heat absorbed in the first area is approximately the same as that in the second area and the third area, avoiding affecting the heat transfer effect and preventing local overheating.

[0015] 3. In the liquid cooling plate assembly and the coolant delivery device, through the arranged control system and branch pipe, after the heated coolant enters the first area, a small amount of coolant can be delivered again to neutralize the temperature of the coolant entering the first area, so as to avoid the influence on the heat absorption of the coolant in the first area. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0017] The structures, proportions, sizes, etc. shown in the drawings of this specification are only used to cooperate with the content disclosed in the specification for those familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present invention. Therefore, they do not have technical essence. Any modification of the structure, change of the proportional relationship, or adjustment of the size, without affecting the effects that the present invention can produce and the purposes that can be achieved, should still fall within the scope that can be covered by the technical content disclosed in the present invention.

[0018] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a schematic diagram of the internal structure of the substrate in the present invention; Figure 3 It is a schematic diagram of the split structure of the sealing plate and the bottom plate in the present invention; Figure 4 It is a schematic diagram of the connection structure between the transfer plate and the groove in the present invention; Figure 5 It is a schematic diagram of the split structure of the partition plate and the transfer plate in the present invention; Figure 6 It is a schematic diagram of the connection structure between the substrate and the branch pipe in the present invention; Figure 7 It is a schematic diagram of the bottom view of the branch pipe in the present invention; Figure 8 It is a schematic diagram of the top view of the heat transfer plate in the present invention; Figure 9 It is a schematic diagram of the sectional view of the heat transfer plate in the present invention.

[0019] Illustration: 1. Substrate; 11. Sealing plate; 12. Bottom plate; 2. Flow channel; 21. First area; 22. Second area; 23. Third area; 3. Partition plate; 31. Groove; 32. Transfer plate; 33. Opening; 34. Inclined surface; 4. Water inlet pipe; 5. Water outlet pipe; 6. Branch pipe; 7. Control system; 8. Heat transfer plate; 81. First section; 82. Second section; 83. Third section; 84. Exchange port. Detailed implementation manners

[0020] In order to make the objectives, features, and advantages of the present invention more obvious and understandable, the following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the embodiments described below are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0021] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present invention. It should be noted that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be an intermediate component present at the same time.

[0022] The following further illustrates the technical solutions of the present invention with reference to the accompanying drawings and through specific embodiments.

[0023] Please refer to Figures 1 - 7 : The embodiment of the present invention provides a liquid cooling plate assembly, including a substrate 1, and a plurality of partition plates 3 are arranged inside the substrate 1, and the plurality of partition plates 3 are staggered and arranged on the inner wall of the substrate 1; A continuous S-shaped flow channel 2 located inside the substrate 1 is formed between the plurality of partition plates 3. In the flow channel 2, a third zone 23, a second zone 22, and a first zone 21 that are sequentially connected are formed along the flow direction. The cross-sections of the third zone 23, the second zone 22, and the first zone 21 decrease sequentially along the flow direction of the flow channel 2; A water outlet pipe 5 is arranged on the substrate 1 corresponding to the first zone 21, and the water outlet pipe 5 is communicated with the first zone 21. A water inlet pipe 4 is arranged on the substrate 1 corresponding to the third zone 23, and the water inlet pipe 4 is communicated with the third zone 23.

[0024] The distance between one side of the plurality of partition plates 3 away from their fixed surfaces and the inner side wall of the substrate 1 decreases sequentially along the flow direction of the flow channel 2.

[0025] Two grooves 31 are formed on the side surface of the partition plate 3 along its length direction. The two grooves 31 are symmetrically distributed along the central axis of the partition plate 3, and the grooves 31 face the flow channel 2 and are communicated with the flow channel 2.

[0026] The groove 31 is provided with inclined surfaces 34 on two inner side walls corresponding to the flow passage 2, which are inclined towards the flow passage 2. A transfer plate 32 is vertically fixed in the groove 31, and a gap is formed between the transfer plate 32 and the inclined surface 34. A plurality of openings 33 are equidistantly arranged on the transfer plate 32. One end of each opening 33 communicates with the groove 31, and the other end communicates with the flow passage 2.

[0027] The transfer plate 32 is made of a heat-conducting material, and the heat-conductivity coefficients of a plurality of transfer plates 32 increase sequentially along the flow direction of the flow passage 2.

[0028] The substrate 1 includes a bottom plate 12 and a sealing plate 11. The partition plate 3 is fixed on the inner side wall of the sealing plate 11, and the bottom surface of the partition plate 3 is connected to the top surface of the bottom plate 12. The bottom plate 12 is arranged corresponding to the heating unit, and the bottom plate 12 is made of a heat-conducting material.

[0029] A coolant delivery device includes a control system 7 and a branch pipe 6. The control system 7 is connected to the branch pipe 6 and the water inlet pipe 4. The branch pipe 6 is arranged on the substrate 1 corresponding to the first area 21 and communicates with the first area 21. The diameter of the branch pipe 6 is smaller than that of the water inlet pipe 4.

[0030] The additional technical features of the present invention are as follows: In the present invention, the sealing plate 11 is a cuboid with a hollow interior and a missing bottom surface; In the present invention, the length of the partition plate 3 in the second area 22 is greater than the length of the partition plate 3 in the first area 21 and less than the length of the partition plate 3 in the third area 23.

[0031] Embodiment 1: Please refer to Figures 1 - 5 , a liquid cooling plate assembly in this embodiment includes a substrate 1. A plurality of partition plates 3 are arranged inside the substrate 1, and the plurality of partition plates 3 are staggered on the inner wall of the substrate 1; a continuous S-shaped flow passage 2 is formed between the plurality of partition plates 3 inside the substrate 1. The third area 23, the second area 22, and the first area 21 are sequentially connected along the flow direction in the flow passage 2. The cross-sections of the third area 23, the second area 22, and the first area 21 decrease sequentially along the flow direction of the flow passage 2; a water outlet pipe 5 is arranged on the substrate 1 corresponding to the first area 21, and the water outlet pipe 5 communicates with the first area 21. A water inlet pipe 4 is arranged on the substrate 1 corresponding to the third area 23, and the water inlet pipe 4 communicates with the third area 23.

[0032] Specifically, the distances between one side of a plurality of partition plates 3 away from their fixed surfaces and the inner side wall of the substrate 1 decrease sequentially along the flow direction of the flow passage 2.

[0033] During application, the coolant is introduced into the substrate 1 above the heat source through the inlet pipe 4 and flows in the flow channel 2. When the coolant enters the third zone 23, it absorbs the heat generated by the heat source, thereby reducing the temperature of the corresponding part of the heat source and increasing the temperature of the coolant. Subsequently, the heated coolant flows through the second zone 22 and the first zone 21 in sequence and is finally discharged through the outlet pipe 5. After the coolant flows through the third zone 23 and enters the second zone 22, since the cross-section of the second zone 22 is smaller than that of the third zone 23, the flow rate of the coolant gradually increases when it flows in the second zone 22. Similarly, after passing through the second zone 22, the coolant enters the first zone 21 and the flow rate increases again. This design of gradually decreasing cross-sections makes the flow rate of the coolant in the third zone 23, the second zone 22, and the first zone 21 show a gradually increasing trend. By circulating the coolant in the above manner, the flow rate of the coolant flowing in the flow channel 2 gradually increases. Although the temperature of the coolant continuously rises during the flow process, the coolant absorbs approximately the same amount of heat in the third zone 23, the second zone 22, and the first zone 21, thus avoiding the situation of local overheating caused by the decrease in the heat absorption effect of the coolant and ensuring that the performance of the electronic device is not affected.

[0034] It should be noted that the S-shaped flow channel 2 increases the length of the path for the coolant to flow, allowing the coolant to absorb more heat, thereby improving the heat exchange efficiency.

[0035] Embodiment 2: Based on the basic content of Embodiment 1, the difference is as follows: Please refer to Figures 3 - 5 , in this embodiment, two grooves 31 are formed on the side surface of the partition 3 along its length direction. The two grooves 31 are symmetrically distributed along the central axis of the partition 3, and the grooves 31 face the direction of the flow channel 2 and communicate with the flow channel 2; the two inner side walls of the grooves 31 corresponding to the flow channel 2 are inclined surfaces 34 inclined towards it, a transfer plate 32 is vertically fixed in the grooves 31, and a gap is formed between the transfer plate 32 and the inclined surface 34. A plurality of openings 33 are equidistantly formed on the transfer plate 32. One end of the openings 33 communicates with the grooves 31, and the other end communicates with the flow channel 2.

[0036] During application, when the coolant flows in the flow channel 2, the coolant also enters the grooves 31 and flows in the grooves 31. During the flow of the coolant, the coolant also contacts the transfer plate 32 and absorbs the heat on the transfer plate 32. At the same time, the coolant entering the grooves 31 will also converge with the coolant in the flow channel 2 through the openings 33. By providing the transfer plate 32 and the openings 33, the coolant can absorb the maximum amount of heat during the flow process, improving the heat absorption effect.

[0037] Furthermore, the transfer plate 32 is made of a heat-conducting material, and the heat-conducting coefficients of several transfer plates 32 increase successively along the flow direction of the flow channel 2. After the coolant flows through the flow channel 2, it will successively contact the transfer plates 32 in the third zone 23, the second zone 22, and the first zone 21. However, the heat-conducting coefficients of the transfer plates 32 in the first zone 21, the transfer plates 32 in the second zone 22, and the transfer plates 32 in the third zone 23 decrease successively. Therefore, when the coolant flows, through the transfer plates 32 with different heat-conducting coefficients and different flow velocities of the coolant, the heat absorption and heat transfer efficiency of the coolant in the third zone 23, the second zone 22, and the first zone 21 are further made roughly the same.

[0038] It should be noted that the coolant flows in the flow channel 2 and gradually increases its flow velocity. At the same time, through the transfer plate 32 in the groove 31, the coolant can perform additional heat exchange to ensure that more heat is transferred to the coolant. Moreover, the heat-conducting coefficients of several transfer plates 32 corresponding to the flow channel 2 increase along the flow direction, so that the coolant with an increased temperature entering the first zone 21 can contact the transfer plate 32 with a high heat-conducting coefficient. Thus, when the coolant with an increased temperature entering the first zone 21 absorbs heat in the first zone 21, it is roughly the same as that in the second zone 22 and the third zone 23, further preventing the occurrence of local overheating.

[0039] Embodiment 3: The basic content is the same as that of Embodiment 1, except that: Please refer to Figure 3 , in this embodiment, the substrate 1 includes a bottom plate 12 and a sealing plate 11. The partition plate 3 is fixed on the inner side wall of the sealing plate 11, and the bottom surface of the partition plate 3 is connected to the top surface of the bottom plate 12. The bottom plate 12 is arranged corresponding to the heating unit, and the bottom plate 12 is made of a heat-conducting material.

[0040] In application, the bottom plate 12 is arranged on the heat source, and the heat-conducting bottom plate 12 can effectively transfer the heat on the heat source into the sealing plate 11, so that the coolant can absorb heat and cool down better when flowing.

[0041] In summary, the working principle of this liquid cooling plate assembly is as follows: After the coolant is introduced into the flow channel 2 in the substrate 1 through the water inlet pipe 4, it will successively flow through the third zone 23, the second zone 22, and the first zone 21. Since the cross-sections of the third zone 23, the second zone 22, and the first zone 21 decrease successively, when the coolant flows through the third zone 23, the second zone 22, and the first zone 21, its flow velocity will also increase successively, thus avoiding the situation of uneven heat absorption of the coolant in the flow channel 2 due to the same flow velocity of the coolant during flow and continuous temperature increase, resulting in local overheating.

[0042] Embodiment 4: The basic content is the same as that of Embodiment 1, except that: Please refer to Figures 6 - 7 In this embodiment, a coolant delivery device is applied to the liquid cooling plate assembly of Embodiment 1. The device includes a control system 7 and a branch pipe 6. The control system 7 is connected to the branch pipe 6 and the water inlet pipe 4. The branch pipe 6 is disposed on the substrate 1 corresponding to the first area 21 and communicates with the first area 21. The diameter of the branch pipe 6 is smaller than the diameter of the water inlet pipe 4.

[0043] During application, the control system 7 operates to introduce the coolant into the flow channel 2 through the water inlet pipe 4. After the coolant enters the flow channel 2, the coolant will sequentially pass through the third area 23, the second area 22, and the first area 21. After the coolant passes through the third area 23 and enters the second area 22, the temperature of the coolant will increase because it absorbs the heat at the third area 23. When the coolant enters the first area 21 from the second area 22, the heat absorption effect of the coolant will decrease. At this time, the control system 7 also introduces the non-heat-absorbed coolant into the first area 21 through the branch pipe 6 to neutralize the original heated coolant, so as to ensure the heat absorption effect of the coolant in the first area 21 and avoid local overheating.

[0044] Specifically, a temperature sensor is disposed on the substrate 1 corresponding to the first area 21. The control system 7 includes a control unit and two independent delivery units. The two independent delivery units are respectively connected to the water inlet pipe 4 and the branch pipe 6. The control unit is signal-connected to the temperature sensor. Preferably, the delivery unit is a pump body that delivers the coolant. The control connection of the temperature sensor, the control unit, and the delivery unit can be obtained by those skilled in the art, so no further elaboration will be made here. During application, the control unit controls the delivery unit corresponding to the water inlet pipe 4 to input the coolant into the substrate 1 through the water inlet pipe 4. When the temperature sensor monitors that the temperature of the coolant in the first area 21 increases, the control system 7 then inputs a small amount of non-heat-absorbed coolant into the first area 21 of the substrate 1 through the delivery unit corresponding to the branch pipe 6 to neutralize the temperature of the heated coolant and ensure the heat transfer efficiency of the coolant in the first area 21.

[0045] In summary, the working principle of this coolant delivery device is as follows: After the control system 7 introduces the coolant into the flow channel 2 in the substrate 1 through the water inlet pipe 4, the coolant flows through the third zone 23, the second zone 22, and the first zone 21 in sequence and begins to absorb heat. After the coolant flows to the first zone 21, the temperature of the coolant rises after absorbing heat. At this time, when the temperature sensor monitors that the temperature in the first zone 21 is too high, the temperature sensor transmits a signal to the control system 7. The control system 7 inputs the coolant into the first zone 21 through the branch pipe 6. At this time, the non-heat-absorbed coolant input by the branch pipe 6 will neutralize the heat-absorbed coolant, so as to ensure that when the coolant entering the first zone 21 absorbs heat inside, it absorbs heat approximately the same as the coolant in the third zone 23 and the second zone 22, so as to avoid the occurrence of local overheating.

[0046] Embodiment 5: The basic content is the same as that of Embodiment 1, except that: Please refer to Figures 3 - 7 , in this embodiment, two grooves 31 are formed on the side surface of the partition plate 3 along its length direction. The two grooves 31 are symmetrically distributed along the central axis of the partition plate 3, and the grooves 31 face the flow channel 2 and communicate with the flow channel 2; the two inner side walls of the grooves 31 corresponding to the flow channel 2 are inclined surfaces 34 inclined towards it. A transfer plate 32 is vertically fixed in the grooves 31, and a gap is formed between the transfer plate 32 and the inclined surface 34. A plurality of openings 33 are equidistantly arranged on the transfer plate 32. One end of the openings 33 communicates with the grooves 31, and the other end communicates with the flow channel 2.

[0047] In a specific embodiment, please refer to Figures 6 - 7 : A coolant delivery device is applied to the liquid cooling plate assembly of Embodiment 1. The device includes a control system 7 and a branch pipe 6. The control system 7 is connected to the branch pipe 6. The control system 7 is connected to the water inlet pipe 4. The branch pipe 6 is arranged on the substrate 1 corresponding to the first zone 21 and communicates with the first zone 21. The diameter of the branch pipe 6 is smaller than the diameter of the water inlet pipe 4.

[0048] During application, as the coolant flows through the flow channel 2, the flow rate of the coolant gradually increases. At the same time, in cooperation with the transfer plate 32 whose thermal conductivity increases along the flow direction of the flow channel 2, it can make the heat absorbed by the coolant in the third zone 23, the second zone 22 and the first zone 21 approximately the same, avoiding local overheating. At the same time, after the coolant enters the first zone 21, it absorbs the heat of the third zone 23 and the second zone 22. In order to ensure that the heated coolant can absorb the same amount of heat as the third zone 23 and the second zone 22 in the first zone 21, when the control system 7 inputs the coolant into the flow channel 2 through the water inlet pipe 4, it will also input a small amount of unabsorbed coolant into the first zone 21 through the branch pipe 6 to mix with the heated coolant entering the first zone 21. At this time, the overall temperature of the mixed coolant drops, and the first zone 21 is heated by the coolant with a lower temperature after mixing, further ensuring that the coolant can absorb approximately the same amount of heat in the first zone 21, the second zone 22 and the third zone 23, avoiding local overheating; the above method realizes that the heat absorbed by the coolant in each area is approximately the same when the coolant flows through the flow channel 2 by allowing the coolant with a lower temperature to contact the transfer plate 32 with a lower thermal conductivity, the coolant with a higher temperature to contact the transfer plate 32 with a higher thermal conductivity, and neutralizing the temperature of the coolant with a higher temperature.

[0049] It should be noted that a small amount of coolant is introduced into the first zone 21 through the branch pipe 6, causing a pressure drop at the first zone 21, so that the coolant transported by the second zone 22 and the coolant input by the branch pipe 6 combine to form a vortex or a turbulent flow at the input of the branch pipe 6. The formation of the vortex or the turbulent flow increases the opportunity for heat transfer between the coolant and the transfer plate 32. Under this perturbation, the heat exchange efficiency of the coolant in the first zone 21 is improved. At the same time, with the coolant introduced by the branch pipe 6, the problem of pressure fluctuation at the coolant outlet is reduced, the stable operation of the liquid cooling system is maintained, and the problem of too low heat absorption efficiency of the coolant in the high-temperature area is also avoided.

[0050] It can be seen that under the action of the above solution, the temperature gradient in the substrate 1 is made uniform and the thermal shock is reduced, reducing the loss of the liquid cooling plate assembly material caused by thermal stress and extending the service life of the equipment.

[0051] In a specific embodiment, please refer to Figures 7 - 9 : A heat transfer plate 8 is arranged in the substrate 1 along the flow direction in the flow channel 2, and the heat transfer plate 8 is located at the middle part of the flow channel 2. The heat transfer plate 8 successively includes a first section 81, a second section 82, and a third section 83 along the flow direction of the flow channel 2. The first section 81, the second section 82, and the third section 83 are respectively arranged in the flow channel 2 corresponding to the third zone 23, the second zone 22, and the first zone 21. The thermal conductivities of the first section 81, the second section 82, and the third section 83 increase in sequence, the thickness of the heat transfer plate 8 decreases in sequence along the flow direction of the flow channel 2, and exchange ports 84 are equally spaced inside the heat transfer plate 8.

[0052] During application, the coolant flows in the flow channel 2, contacts the heat transfer plate 8, and continuously passes through the exchange port 84. At the same time, during the flowing process, the coolant contacts the first section 81, the second section 82, and the third section 83 in sequence. Since the thermal conductivity of the first section 81, the second section 82, and the third section 83 increases in sequence, after the coolant contacts the heat transfer plate 8, the heat absorption amount of the coolant increases in sequence, so that the heat absorbed by the coolant in the third zone 23, the second zone 22, and the first zone 21 is approximately the same, avoiding local overheating. At the same time, with the cooperation of the heat transfer plate 8 and the transfer plate 32, the heat exchange efficiency of the coolant in the flow channel 2 is improved; since the flow channel 2 is a continuous S shape, when the coolant flows in the flow channel 2, the friction force between the coolant and the partition plate 3 will reduce the flow rate of the coolant close to the partition plate 3, thus forming laminar flow and turbulent flow in the flow channel 2, reducing the heat exchange efficiency of the coolant. However, the heat transfer plate 8 located in the flow channel 2 can contact the coolant with a faster flow rate, enabling the coolant to effectively carry out the heat exchange work.

[0053] As described above, the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A liquid cooling plate assembly, characterized in that: It comprises a base plate (1), wherein a plurality of partition plates (3) are arranged inside the base plate (1), and the plurality of partition plates (3) are arranged in a staggered manner on the inner wall of the base plate (1); A continuous S-shaped flow channel (2) located in the base plate (1) is formed between the plurality of partitions (3); a third area (23), a second area (22) and a first area (21) are formed in the flow channel (2) along the flow direction and are connected in sequence; and cross sections of the third area (23), the second area (22) and the first area (21) decrease in sequence along the flow direction of the flow channel (2); A water outlet pipe (5) is provided on the substrate (1) corresponding to the first zone (21), and the water outlet pipe (5) is in communication with the first zone (21); a water inlet pipe (4) is provided on the substrate (1) corresponding to the third zone (23), and the water inlet pipe (4) is in communication with the third zone (23).

2. The liquid cooling plate assembly according to claim 1, characterized in that: The distances between the side of the plurality of partitions (3) away from the fixing surface thereof and the inner side wall of the base plate (1) decrease in sequence along the flow direction of the flow channel (2).

3. The liquid cooling plate assembly according to claim 1, characterized in that: Two grooves (31) are provided on the side surface of the partition (3) along its length direction, the two grooves (31) are symmetrically distributed along the central axis of the partition (3), and the grooves (31) face the direction of the circulation channel (2) and are connected to the circulation channel (2).

4. The liquid cooling plate assembly according to claim 3, characterized in that: The two inner side walls of the groove (31) corresponding to the circulation channel (2) are arranged as inclined surfaces inclined thereto, a transfer plate (32) is vertically fixed in the groove (31), and a gap is formed between the transfer plate (32) and the inclined surface, and a plurality of openings (33) are formed on the transfer plate (32) at equal intervals, one end of the opening (33) is connected to the groove (31), and the other end is connected to the circulation channel (2).

5. The liquid cooling plate assembly according to claim 4, characterized in that: The transfer plates (32) are made of heat-conducting material, and the heat conductivity coefficients of a plurality of the transfer plates (32) increase in sequence along the flow direction of the flow channel (2).

6. The liquid cooling plate assembly according to claim 1, characterized in that: The substrate (1) comprises a bottom plate (12) and a sealing plate (11); the partition plate (3) is fixed on the inner side wall of the sealing plate (11); the bottom surface of the partition plate (3) is connected to the top surface of the bottom plate (12); the bottom plate (12) is arranged corresponding to the heating unit; and the bottom plate (12) is made of heat-conducting material.

7. A cooling liquid delivery device, characterized in that: The device is applied to the liquid cooling plate assembly according to any one of claims 1 to 6, and comprises a control system (7) and a branch pipe (6), wherein the control system (7) is connected to the branch pipe (6), and the control system (7) is connected to the water inlet pipe (4), and the branch pipe (6) is arranged on the base plate (1) corresponding to the first zone (21) and is connected to the first zone (21), and the diameter of the branch pipe (6) is smaller than the diameter of the water inlet pipe (4).

Citation Information

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