Substrate processing apparatus and substrate processing method using same

Abstract

Disclosed are a substrate processing apparatus and a substrate processing method using the same. The substrate processing apparatus includes: a stage including an electrostatic chuck for engaging a substrate; a separation module disposed on the stage and including a pushing member separating the substrate from the electrostatic chuck and a substrate holder supporting an edge of the substrate; and a loading module disposed under the stage and including a plurality of edge loading units pressing an edge of the substrate toward the electrostatic chuck and a plurality of center loading units pressing a portion of the substrate located inside from the edge of the substrate toward the electrostatic chuck.

Description

Technical Field

[0001] The present disclosure generally relates to a substrate processing apparatus. More specifically, the present disclosure relates to a substrate processing apparatus and a substrate processing method using the same. Background Art

[0002] With the development of information technology, the importance of display devices as a connection medium between users and information has become prominent. For example, the use of display devices such as liquid crystal display ("LCD") devices, organic light emitting display ("OLED") devices, plasma display panel ("PDP") devices, quantum dot display devices, etc. is increasing.

[0003] In the manufacturing process of display devices, an etching process is a process of creating a desired shape by etching unnecessary portions of the surface of a substrate using a physical or chemical method. Generally, the etching process can be performed by irradiating a laser beam onto the substrate to etch the substrate. To perform the etching process, the substrate can be lifted by a loading module and can be clamped in an electrostatic chuck. Summary of the Invention

[0004] Embodiments provide a substrate processing apparatus that prevents damage to a display panel unit and effectively separates a substrate from an electrostatic chuck.

[0005] Embodiments provide a substrate processing method that prevents damage to a display panel unit and effectively separates a substrate from an electrostatic chuck.

[0006] A substrate processing apparatus according to an embodiment of the present disclosure includes: a stage including an electrostatic chuck that clamps a substrate; a separation module disposed on the stage and including a pushing member that separates the substrate from the electrostatic chuck and a substrate holder that supports an edge of the substrate; and a loading module disposed under the stage and including: a plurality of edge loading units that press the edge of the substrate toward the electrostatic chuck; and a plurality of center loading units that press a portion of the substrate located inside from the edge of the substrate toward the electrostatic chuck.

[0007] In an embodiment, when the pushing member separates the substrate from the electrostatic chuck, the pushing member may press the substrate toward the loading module.

[0008] In an embodiment, the pushing member may include a sensor that measures an electrostatic force between the substrate and the electrostatic chuck.

[0009] In an embodiment, the separation module may further include a control portion that controls a speed of the pushing member in response to the electrostatic force.

[0010] In one embodiment, the apparatus may further include a camera disposed below the stage and measuring alignment marks of the substrate. The stage may be configured to align the substrate based on positions of the alignment marks.

[0011] In one embodiment, the substrate may include a first side extending in a first direction, a second side contacting the first side and extending in a second direction intersecting the first direction, a third side extending parallel to the first side and facing the first side, and a fourth side extending parallel to the second side and facing the second side. The substrate holder may not support one of the first side to the fourth side.

[0012] In one embodiment, the plurality of edge loading units may include: a plurality of first edge loading units pressing the side of the substrate not supported by the substrate holder; and a plurality of second edge loading units pressing the side of the substrate supported by the substrate holder.

[0013] In one embodiment, the substrate may include a first side extending in a first direction and a second side contacting the first side and extending in a second direction intersecting the first direction. A length of the first side may be less than a length of the second side. The plurality of center loading units may include: a plurality of first center loading units pressing a central portion of the substrate; and a plurality of second center loading units spaced apart from the plurality of first center loading units in the second direction and a direction opposite to the second direction.

[0014] In one embodiment, the plurality of first center loading units may be repeatedly disposed along the first direction. The plurality of second center loading units may be repeatedly disposed along the first direction. The plurality of second center loading units may be symmetrically positioned with respect to the plurality of first center loading units.

[0015] In one embodiment, the apparatus may further include elastic members disposed at ends of each of the plurality of edge loading units that contact the substrate.

[0016] A substrate processing method according to an embodiment of the present disclosure includes: conveying a substrate so that the substrate is located under a stage including an electrostatic chuck; raising a separation module located on the stage and including a pushing member and a substrate holder, and supporting an edge of the substrate with the substrate holder; aligning a position of the substrate by moving the stage; raising a plurality of center loading units located under the stage to press a portion of the substrate located inside from the edge of the substrate, and raising a plurality of edge loading units located under the stage to press the edge of the substrate; engaging the substrate with the electrostatic chuck; and separating the substrate from the electrostatic chuck by releasing the substrate from the electrostatic chuck and pressing the substrate with the pushing member.

[0017] In an embodiment, the separation of the substrate from the electrostatic chuck may include: measuring an electrostatic force between the substrate and the electrostatic chuck; and controlling a speed of the pushing member in response to the electrostatic force.

[0018] In an embodiment, the pushing member may include a sensor for measuring the electrostatic force. The separation module may further include a control portion for controlling the speed of the pushing member in response to the electrostatic force.

[0019] In an embodiment, the substrate may include a first side extending in a first direction, a second side contacting the first side and extending in a second direction intersecting the first direction, a third side extending parallel to the first side and facing the first side, and a fourth side extending parallel to the second side and facing the second side. In the supporting of the edge of the substrate with the substrate holder, the substrate holder may not support one of the first side to the fourth side.

[0020] In an embodiment, the method may further include raising some of the plurality of edge loading units to support the side of the substrate not supported by the substrate holder before the alignment of the position of the substrate.

[0021] In an embodiment, the substrate may include a first side extending in a first direction and a second side contacting the first side and extending in a second direction intersecting the first direction. A length of the first side may be less than a length of the second side. The plurality of center loading units may include: a plurality of first center loading units that press a central portion of the substrate; and a plurality of second center loading units that are spaced apart from the plurality of first center loading units in the second direction and a direction opposite to the second direction.

[0022] In one embodiment, the plurality of first center loading units may be repeatedly arranged along the first direction. The plurality of second center loading units may be repeatedly arranged along the first direction. The plurality of second center loading units may be symmetrically positioned relative to the plurality of first center loading units.

[0023] In one embodiment, during the elevation of the plurality of center loading units, the plurality of first center loading units may be elevated before the plurality of second center loading units.

[0024] In one embodiment, the separation of the substrate from the electrostatic chuck may include: lowering the pushing member and elevating the plurality of edge loading units toward the substrate; clamping the substrate by bringing the pushing member and the plurality of edge loading units into contact with the substrate at the edge of the substrate; and elevating the plurality of center loading units to contact the substrate.

[0025] In one embodiment, during the clamping of the substrate, the impact applied to the substrate may be alleviated by an elastic member provided at an end of each of the plurality of edge loading units in contact with the substrate.

[0026] A substrate processing apparatus according to an embodiment of the present disclosure may include: a stage including an electrostatic chuck for engaging a substrate; a separation module including a pushing member provided on the stage for separating the substrate from the electrostatic chuck and a substrate holder for supporting an edge of the substrate; and a loading unit for pressing the substrate.

[0027] Since the substrate holder supports the edge of the substrate, a process of aligning the substrate may be performed before the substrate comes into contact with the loading unit. Accordingly, the loading unit may not contact a unit area of the substrate where a display panel unit is provided, but may contact a dummy area of the substrate to be subsequently removed. Therefore, a problem in which the display panel unit is damaged due to contact with the loading unit can be effectively prevented.

[0028] The pushing member may press the substrate toward the loading unit. Accordingly, even when the substrate is not separated from the electrostatic chuck due to residual static charges between the substrate and the electrostatic chuck, the substrate can be effectively separated from the electrostatic chuck by the pushing member that presses the substrate toward the loading unit. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Exemplary non-limiting embodiments will be more clearly understood through the following detailed description in conjunction with the accompanying drawings.

[0030] Figure 1 FIG. is a cross-sectional view illustrating a substrate processing apparatus according to an embodiment of the present disclosure.

[0031] Figure 2 For illustrationFigure 1 Perspective view of a substrate processing apparatus.

[0032] Figure 3 For example, included in Figure 1 Perspective view of a separation module in a substrate processing apparatus.

[0033] Figure 4 Is Figure 3 Enlarged perspective view of region 'A' of

[0034] Figure 5 Flowchart illustrating a substrate processing method according to an embodiment of the present disclosure.

[0035] Figure 6 , Figure 7 , Figure 8 , Figure 9 , Figure 10 , Figure 11 , Figure 12 , Figure 13 , Figure 14 , Figure 15 , Figure 16 , Figure 17 And Figure 18 For example, illustrating Figure 5 Graph of a substrate processing method.

[0036] Figure 19 For example, included in Figure 5 Flowchart for separating a substrate from an electrostatic chuck in a substrate processing method.

[0037] Figure 20 , Figure 21 , Figure 22 And Figure 23 For example, illustrating Figure 19 Cross-sectional view of separating a substrate from an electrostatic chuck. Detailed Description

[0038] The terms used in this specification are for the purpose of describing particular embodiments only and are not intended to be limiting. Unless the context clearly indicates otherwise, as used herein, "a," "the," and "at least one" do not denote a limitation on quantity and are intended to include both the singular and the plural. For example, unless the context clearly indicates otherwise, "element" and "at least one element" have the same meaning. "At least one" is not to be construed as limiting "a." "Or" means "and / or." As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. Throughout the disclosure, the expression "at least one of a, b, and c" means only a, only b, only c, both a and b, both a and c, both b and c, all of a, b, and c, or variants thereof. It will be further understood that the terms "comprises" and / or "comprising," when used in this specification, specify the presence of the stated features, regions, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, regions, integers, steps, operations, elements, components, and / or groups thereof.

[0039] It will be understood that when an element is referred to as being "on" another element or "connected to" another element, it can be directly on the other element or directly connected to the other element, or there may be intervening elements therebetween. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements.

[0040] It will be understood that although the terms "first," "second," "third," etc. may be used herein to describe various elements, components, regions, layers, and / or sections, these elements, components, regions, layers, and / or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer, or section from another element, component, region, layer, or section. Thus, without departing from the teachings herein, the first element, component, region, layer, or section discussed below may be referred to as the second element, component, region, layer, or section.

[0041] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. The same reference numerals are used for the same components in the drawings, and redundant descriptions of the same components will be omitted.

[0042] Figure 1 FIG. is a cross-sectional view of a substrate processing apparatus according to an embodiment of the present disclosure.

[0043] In this specification, a plane may be defined by a first direction DR1 and a second direction DR2 intersecting the first direction DR1. For example, the first direction DR1 and the second direction DR2 may be perpendicular to each other. The direction perpendicular to the plane, i.e., the thickness direction of the substrate SUB, may be a third direction DR3. In other words, the third direction DR3 may be perpendicular to each of the first direction DR1 and the second direction DR2.

[0044] Reference Figure 1 According to an embodiment of the present disclosure, a substrate processing apparatus PRA may include a chamber CHA, a stage 100, a separation module 200, a loading module 300, a loading stage LST, a laser unit LAS, and a laser measurement unit CAL.

[0045] In one embodiment, the substrate processing apparatus PRA may perform a process of etching a substrate SUB. Specifically, the substrate processing apparatus PRA may perform a process of etching the substrate SUB by irradiating a laser beam onto the lower portion of the substrate SUB.

[0046] The chamber CHA may define a space for performing a process of processing the substrate SUB. For example, the substrate SUB may be a substrate used in a display device, a semiconductor substrate, a solar cell substrate, etc. In one embodiment, the substrate SUB may be a substrate used in a display device. In this case, the substrate SUB may be a multi-sided substrate including a plurality of display panel units. The substrate SUB may include a unit region provided with the display panel units and a dummy region surrounding the unit region. The display panel units may be manufactured into display panels through a processing process. The dummy region may refer to a region of the substrate SUB that is removed through subsequent processes.

[0047] A door may be provided on a side surface of the chamber CHA. The door may serve as a passage for the substrate SUB to move into and out of the chamber CHA. The substrate SUB may be transferred into the chamber CHA through the door using a substrate loading device such as a transfer arm. The chamber CHA may have a rectangular parallelepiped shape, but the present disclosure is not limited thereto.

[0048] A first chamber window CW1 may be provided on a lower surface of the chamber CHA. The first chamber window CW1 may allow a laser beam of a specific wavelength to pass through. The first chamber window CW1 may allow a laser beam emitted from the laser unit LAS provided outside the chamber CHA to pass through and reach the inside of the chamber CHA.

[0049] The laser unit LAS may be provided outside the chamber CHA. For example, the laser unit LAS may be positioned adjacent to the lower surface of the chamber CHA. The laser unit LAS may irradiate a laser beam onto the substrate SUB located inside the chamber CHA through the first chamber window CW1. The laser unit LAS may irradiate a laser beam onto the substrate SUB to etch the substrate SUB.

[0050] A second chamber window CW2 may be provided on an upper surface of the chamber CHA. The second chamber window CW2 may allow a laser beam of a specific wavelength to pass through. The second chamber window CW2 may allow a laser beam located inside the chamber CHA to pass through and reach the outside of the chamber CHA.

[0051] The laser measurement unit CAL can be arranged outside the chamber CHA. The laser measurement unit CAL can be positioned to face the laser unit LAS. For example, the laser measurement unit CAL can be positioned adjacent to the upper surface of the chamber CHA. The laser measurement unit CAL can receive the laser beam that has passed through the interior of the chamber CHA through the second chamber window CW2, and can measure the output of the laser beam. That is, the laser measurement unit CAL can check whether the laser unit LAS fails by monitoring the output of the laser beam.

[0052] The stage 100 can be arranged inside the chamber CHA. The stage 100 can include an electrostatic chuck (e.g., Figure 2 the electrostatic chuck 110). The electrostatic chuck can hold the substrate SUB by electrostatic force. Accordingly, the substrate SUB can be fixedly adsorbed to the lower surface of the electrostatic chuck. That is, the substrate SUB can be fixed such that the surface to be irradiated by the laser beam faces downward.

[0053] The stage 100 can move in the second direction DR2 or in the direction opposite to the second direction DR2. Accordingly, the stage 100 can convey the substrate SUB toward the laser unit LAS in the second direction DR2. Additionally, the stage 100 can convey the substrate SUB toward the loading module 300 in the direction opposite to the second direction DR2.

[0054] The stage 100 can align the position of the substrate SUB. Specifically, a camera (e.g., Figure 13 the camera 400) provided below the stage 100 can measure the alignment marks of the substrate SUB, and the stage 100 can align the position of the substrate SUB based on the positions of the alignment marks. In one embodiment, for example, the stage 100 can be a UVW stage.

[0055] The separation module 200 can be arranged on the stage 100. The separation module 200 can include a first main body part (e.g., Figure 3 the first main body part 210), a pushing member (e.g., Figure 3 the pushing member 220), and a substrate holder (e.g., Figure 3 the substrate holder 230). When unloading the substrate SUB, the pushing member 220 can separate the substrate SUB from the electrostatic chuck 110. When aligning the position of the substrate SUB, the substrate holder 230 can support the edge of the substrate SUB. A detailed description thereof will be provided below with reference to Figure 3 provide its detailed description.

[0056] The loading stage LST can be arranged outside the chamber CHA. In one embodiment, for example, the loading stage LST can be positioned adjacent to the lower surface of the chamber CHA.

[0057] The loading module 300 can be disposed under the stage 100. The loading module 300 can include a second body part 310, a plurality of edge loading units 320, a plurality of center loading units 330, and a bellows BEL. The second body part 310 can be disposed outside the chamber CHA. Additionally, the second body part 310 can be disposed on the upper surface of the loading stage LST.

[0058] The edge loading units 320 and the center loading units 330 can be disposed under the stage 100. Specifically, the edge loading units 320 and the center loading units 330 can be disposed under the substrate SUB. The edge loading units 320 and the center loading units 330 can be connected to the second body part 310. The edge loading units 320 and the center loading units 330 can penetrate the lower surface of the chamber CHA. The bellows BEL can surround each of the edge loading units 320 and each of the center loading units 330. The bellows BEL can seal the lower surface of the chamber CHA through which the edge loading units 320 and the center loading units 330 penetrate.

[0059] The edge loading unit 320 can penetrate the lower surface of the chamber CHA and be positioned inside the chamber CHA. The edge loading unit 320 can press (or support) the edge of the substrate SUB. Specifically, when the substrate SUB is engaged with the electrostatic chuck, the edge loading unit 320 can press the edge of the substrate SUB from below the substrate SUB toward the electrostatic chuck. Although Figure 1 not illustrated in, the edge loading units 320 can be repeatedly provided in the first direction DR1.

[0060] The edge loading unit 320 can be connected to an edge loading driver. The edge loading driver can raise or lower the edge loading unit 320. In other words, the edge loading driver can move the edge loading unit 320 in the third direction DR3 or in a direction opposite to the third direction DR3.

[0061] The center loading unit 330 can penetrate the lower surface of the chamber CHA and be positioned inside the chamber CHA. The center loading unit 330 can press (or support) the portion of the substrate SUB that is located inside from the edge of the substrate SUB. Specifically, when the substrate SUB is engaged with the electrostatic chuck, the center loading unit 330 can press the portion of the substrate SUB that is located inside from the edge of the substrate SUB from below the substrate SUB toward the electrostatic chuck.

[0062] Since the center loading unit 330 presses this portion of the substrate SUB, sagging of the substrate SUB when the substrate SUB is raised toward the electrostatic chuck can be prevented. Although Figure 1 not illustrated in, the center loading units 330 can be repeatedly provided in the first direction DR1.

[0063] The center loading unit 330 can be connected to a center loading driver. The center loading driver can raise or lower the center loading unit 330. In other words, the center loading driver can move the center loading unit 330 in the third direction DR3 or in a direction opposite to the third direction DR3.

[0064] The center loading driver can drive the center loading unit 330 in a time-sharing manner. In other words, the center loading driver can first raise some of the center loading units 330 and can later raise other portions of the center loading unit 330. A detailed description thereof will be provided below with reference to Figure 15 、 Figure 16 and Figure 17 .

[0065] Figure 2 is a perspective view of a substrate processing apparatus for illustration Figure 1 . Figure 3 is a perspective view of a separation module included in the substrate processing apparatus for illustration Figure 1 . Figure 4 is Figure 3 an enlarged perspective view of region 'A' of

[0066] Referring to Figure 2 、 Figure 3 and Figure 4 , a substrate processing apparatus PRA according to an embodiment of the present disclosure may include a stage 100, a separation module 200, a loading module 300, and a loading stage LST.

[0067] The stage 100 may include an electrostatic chuck 110. The electrostatic chuck 110 can engage the substrate SUB with an electrostatic force. Accordingly, the substrate SUB can be fixedly adsorbed to the lower surface of the electrostatic chuck 110. The stage 100 can align the position of the substrate SUB.

[0068] The separation module 200 may be disposed on the stage 100. The separation module 200 may include a first main body portion 210, a pushing member 220, a substrate holder 230, and a coupling portion 240.

[0069] The first main body portion 210 may be disposed on the stage 100. The first main body portion 210 may form a framework of the separation module 200. The first main body portion 210 may have a stepped shape. Specifically, the first main body portion 210 may include a first portion that extends in the first direction DR1 and a second portion that extends in the second direction DR2. The first portions may be spaced apart from each other in the second direction DR2. The second portions may be spaced apart from each other in the first direction DR1.

[0070] The pushing member 220 may be connected to the first body portion 210. The pushing member 220 may protrude from the first body portion 210 toward the electrostatic chuck 110. The pushing member 220 may penetrate through the electrostatic chuck 110. In one embodiment, for example, the electrostatic chuck 110 may define a through hole corresponding to the position of the pushing member 220. The pushing member 220 may separate the substrate SUB from the electrostatic chuck 110. Specifically, the pushing member 220 may penetrate through the electrostatic chuck 110 through the through hole and press the substrate SUB toward the loading module 300. The pushing member 220 may be repeatedly provided in the first direction DR1 and the second direction DR2. Accordingly, the pushing member 220 may press the substrate SUB over the entire area of the substrate SUB.

[0071] In one embodiment, as Figure 4 illustrated, the pushing member 220 may include a pushing body 221 and a sensor 222. The pushing body 221 may press the substrate SUB toward the loading module 300. That is, the pushing body 221 may be in direct contact with the substrate SUB. In one embodiment, for example, the pushing body 221 may have a cylindrical shape, but the present disclosure is not limited thereto.

[0072] The sensor 222 may be provided on the pushing body 221. In one embodiment, for example, the sensor 222 may be fixed to the pushing body 221 by a bracket. The sensor 222 may measure the electrostatic force between the substrate SUB and the electrostatic chuck 110. Specifically, the sensor 222 may measure the residual electrostatic charge amount between the substrate SUB and the electrostatic chuck 110 after releasing the substrate SUB from the electrostatic chuck 110.

[0073] In one embodiment, the separation module 200 may further include a control portion that controls the speed of the pushing member 220 in response to the electrostatic force between the substrate SUB and the electrostatic chuck 110. Specifically, the control portion may control the speed of the pushing body 221 in response to the residual electrostatic charge amount between the substrate SUB and the electrostatic chuck 110 measured by the sensor 222. In addition, the control portion may remove the electrostatic charge between the substrate SUB and the electrostatic chuck 110 using vacuum ultraviolet rays (“VUV”). The control portion may include a microprocessor, a motor, and a VUV light generator.

[0074] The substrate holder 230 can be connected to the first main body portion 210. The substrate holders 230 can be repeatedly provided along the periphery of the first main body portion 210. The first main body portion 210 can include a first side 21 extending in a first direction DR1, a second side 22 in contact with the first side 21 and extending in a second direction DR2, a third side 23 extending parallel to the first side 21 and facing the first side 21, and a fourth side 24 extending parallel to the second side 22 and facing the second side 22. In this case, the substrate holder 230 may not be provided at one of the first to fourth sides 21, 22, 23, and 24 of the first main body portion 210, such that the substrate SUB can be conveyed under the stage 100. For example, as Figure 2 and Figure 3 illustrated, the substrate holders 230 can be provided at the second to fourth sides 22, 23, and 24 of the first main body portion 210, and may not be provided at the first side 21 of the first main body portion 210. When aligning the position of the substrate SUB, the substrate holder 230 can support the edge of the substrate SUB.

[0075] The coupling portion 240 can be connected to the first main body portion 210. The first main body portion 210 can be coupled to the stage 100 through the coupling portion 240.

[0076] The separation module 200 can be connected to a separation module driver. The separation module driver can raise or lower the separation module 200. In other words, the separation module driver can move the separation module 200 in a third direction DR3 or in a direction opposite to the third direction DR3. Through the separation module driver, the first main body portion 210, the pushing member 220, and the substrate holder 230 can be simultaneously raised or lowered.

[0077] The loading module 300 can be provided under the stage 100. Additionally, the loading module 300 can be provided on a loading stage LST. The loading module 300 can include a second main body portion 310, a plurality of edge loading units 320, and a plurality of center loading units 330.

[0078] The second main body portion 310 can be provided under the stage 100. The second main body portion 310 can form the framework of the loading module 300. The second main body portion 310 can include a first portion 310a and a second portion 310b. The first portion 310a of the second main body portion 310 can have a rectangular shape with one side open in a plan view. In the plan view, the second portion 310b of the second main body portion 310 can overlap the open side of the first portion 310a. As used herein, a "plan view" is a view in the thickness direction (i.e., the third direction DR3) of the substrate SUB.

[0079] The first part 310a and the second part 310b of the second main body part 310 can be driven in a time-sharing manner. In one embodiment, for example, the second part 310b of the second main body part 310 can be raised first, and the first part 310a of the second main body part 310 can be raised later. However, the present disclosure is not limited thereto, and in another embodiment, the first part 310a and the second part 310b of the second main body part 310 can be driven simultaneously. In one embodiment, for example, the first part 310a and the second part 310b of the second main body part 310 can be lowered simultaneously.

[0080] The edge loading unit 320 may include a first edge loading unit 321 and a second edge loading unit 322. The first edge loading unit 321 may be connected to the second part 310b of the second main body part 310. The first edge loading unit 321 may protrude from the second part 310b of the second main body part 310 toward the electrostatic chuck 110. The first edge loading unit 321 may press (or support) one side of the substrate SUB that is not supported by the substrate holder 230 (e.g., Figure 6 the first side 11).

[0081] The first edge loading unit 321 may include a 1-1 edge loading unit 321a and a 1-2 edge loading unit 321b. The 1-1 edge loading unit 321a and the 1-2 edge loading unit 321b can be driven in a time-sharing manner. In one embodiment, for example, the 1-1 edge loading unit 321a can be raised first, and the 1-2 edge loading unit 321b can be raised later. However, the present disclosure is not limited thereto, and in another embodiment, the 1-1 edge loading unit 321a and the 1-2 edge loading unit 321b can be driven simultaneously. For example, the 1-1 edge loading unit 321a and the 1-2 edge loading unit 321b can be lowered simultaneously. Details thereof will be provided below with reference to Figure 8 、 Figure 9 、 Figure 10 and Figure 11 for a detailed description.

[0082] The second edge loading unit 322 may be connected to the first part 310a of the second main body part 310. The second edge loading unit 322 may be repeatedly provided along the periphery of the first part 310a of the second main body part 310. The second edge loading unit 322 may protrude from the first part 310a of the second main body part 310 toward the electrostatic chuck 110. The second edge loading unit 322 may press (or support) the side of the substrate SUB that is supported by the substrate holder 230.

[0083] Accordingly, the edge loading unit 320 can press (or support) the edge of the substrate SUB toward the electrostatic chuck 110. In one embodiment, an elastic member (e.g., Figure 21The elastic member (ELM) can be disposed at the end of each of the edge loading units 320. The end of each of the edge loading units 320 may refer to the portion in contact with the substrate SUB. When the edge loading unit 320 contacts the substrate SUB, the elastic member can relieve the impact applied to the substrate SUB. Details thereof will be provided below with reference to Figure 21 FIG.

[0084] The center loading unit 330 can be connected to the first portion 310a of the second body portion 310. The center loading unit 330 can be disposed inside the edge of the first portion 310a of the second body portion 310. The center loading unit 330 can protrude from the first portion 310a of the second body portion 310 toward the electrostatic chuck 110. The center loading unit 330 can press (or support) the portion of the substrate SUB located inside from the edge of the substrate SUB. As Figure 2 illustrated, the center loading unit 330 can include three groups arranged in a row in the first direction DR1, and these groups can be spaced apart from each other in the second direction DR2. However, the present disclosure is not limited thereto.

[0085] Figure 5 FIG. is a flowchart illustrating a substrate processing method according to an embodiment of the present disclosure. Figure 6 、 Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 、 Figure 11 、 Figure 12 、 Figure 13 、 Figure 14 、 Figure 15 、 Figure 16 、 Figure 17 and Figure 18 FIG. is a diagram illustrating a substrate processing method of Figure 5 . In Figure 6 、 Figure 8 、 Figure 10 、 Figure 12 and Figure 14 , Figure 2 the electrostatic chuck 110 illustrated in Figure 2 is illustrated, and Figure 2 the stage 100 illustrated in Figure 7 、 Figure 9 、 Figure 11 、 Figure 13 、 Figure 15 、 Figure 16 、 Figure 17 and Figure 18 the pusher member 220 and the substrate holder 230 are illustrated as being located outside the stage 100.

[0086] Reference Figure 1 、 Figure 2 and Figure 5 According to one embodiment of the present disclosure, a substrate processing method PRM may include transferring a substrate SUB toward a stage 100 (S100), raising a separation module 200 and a first-1 edge loading unit 321a (S200), removing a transfer arm and raising a first-2 edge loading unit 321b (S300), aligning the substrate SUB by moving the stage 100 (S400), raising a center loading unit 330 and a second edge loading unit 322 (S500), engaging the substrate SUB with an electrostatic chuck 110, and lowering the loading unit (S600), and separating the substrate SUB from the electrostatic chuck 110 (S700).

[0087] Reference Figure 6 and Figure 7 The substrate SUB may be transferred to be located below the stage 100 (S100). The stage 100 may include an electrostatic chuck 110.

[0088] The substrate SUB may be loaded on a transfer arm RBA. The transfer arm RBA may transfer the substrate SUB toward the lower surface of the stage 100. The substrate SUB may include a first side 11 extending in a first direction DR1, a second side 12 contacting the first side 11 and extending in a second direction DR2, a third side 13 extending parallel to the first side 11 and facing the first side 11, and a fourth side 14 extending parallel to the second side 12 and facing the second side 12. In one embodiment, the length of the first side 11 may be less than the length of the second side 12. That is, the substrate SUB may have a rectangular shape with the first side 11 as the short side and the second side 12 as the long side in a plan view.

[0089] The separation module 200 may be disposed on the stage 100. The separation module 200 may include a first body portion 210, a pushing member 220, a substrate holder 230, and a coupling portion 240. The pushing member 220 may be connected to the first body portion 210. The pushing member 220 may protrude from the first body portion 210 toward the electrostatic chuck 110. The substrate holder 230 may be connected to the first body portion 210. The substrate holder 230 may be repeatedly provided along the periphery of the first body portion 210. The substrate holder 230 may not be provided at one of the first side to the fourth side of the first body portion 210. That is, the substrate holder 230 may not be provided at one of the first side to the fourth side of the first body portion 210 such that the transfer arm RBA loaded with the substrate SUB may move below the stage 100.

[0090] The loading module 300 can be disposed below the stage 100. The loading module 300 can include a second body portion 310, an edge loading unit 320, and a center loading unit 330. The edge loading unit 320 can include a first edge loading unit 321 and a second edge loading unit 322.

[0091] The second body portion 310 can include a first portion 310a and a second portion 310b. The first portion 310a of the second body portion 310 can have a rectangular shape with one side open in a plan view. In the plan view, the second portion 310b of the second body portion 310 can overlap the open side of the first portion 310a.

[0092] The first edge loading unit 321 can be connected to the second portion 310b of the second body portion 310. The first edge loading unit 321 can protrude from the second portion 310b of the second body portion 310 toward the electrostatic chuck 110. The first edge loading unit 321 can include a 1-1 edge loading unit 321a and a 1-2 edge loading unit 321b.

[0093] The second edge loading unit 322 can be connected to the first portion 310a of the second body portion 310. The second edge loading unit 322 can be repeatedly provided along the periphery of the first portion 310a of the second body portion 310. The second edge loading unit 322 can protrude from the first portion 310a of the second body portion 310 toward the electrostatic chuck 110.

[0094] The center loading unit 330 can be connected to the first portion 310a of the second body portion 310. The center loading unit 330 can be disposed inside the edge of the first portion 310a of the second body portion 310. The center loading unit 330 can protrude from the first portion 310a of the second body portion 310 toward the electrostatic chuck 110.

[0095] Reference Figure 8 and Figure 9 According to, the separation module 200 and the 1-1 edge loading unit 321a can be raised (S200).

[0096] The separation module 200 can move in the third direction DR3. In other words, a separation module driver (not illustrated) can raise the separation module 200 in a direction away from the substrate SUB. Accordingly, the substrate holder 230 can move in the third direction DR3 and directly contact the edge of the substrate SUB. In other words, the substrate holder 230 can support the edge of the substrate SUB. The substrate holder 230 may not support one of the first to fourth sides 11, 12, 13, and 14 of the substrate SUB. In one embodiment, for example, as Figure 8As illustrated, the substrate holder 230 can support the second to fourth sides 12, 13, and 14 of the substrate SUB and can not support the first side 11 of the substrate SUB.

[0097] The 1-1 edge loading unit 321a can move in the third direction DR3. Specifically, the second part 310b of the second main body part 310 can rise toward the substrate SUB. Accordingly, the 1-1 edge loading unit 321a and the 1-2 edge loading unit 321b protruding from the second part 310b of the second main body part 310 can rise toward the substrate SUB. In addition, the 1-1 edge loading unit 321a can rise toward the substrate SUB independently of the second part 310b of the second main body part 310. That is, the 1-1 edge loading unit 321a can rise further toward the substrate SUB than the 1-2 edge loading unit 321b. The 1-1 edge loading unit 321a can press (or support) the first side 11 of the substrate SUB that is not supported by the substrate holder 230. The 1-1 edge loading unit 321a can pass through the transfer arm RBA and press the first side 11 of the substrate SUB. In one embodiment, the 1-1 edge loading unit 321a can rise simultaneously with the separation module 200.

[0098] Reference Figure 10 and Figure 11 and, the transfer arm RBA is removed, and the 1-2 edge loading unit 321b can rise (S300).

[0099] The substrate SUB can be supported by the substrate holder 230 and the 1-1 edge loading unit 321a, and the transfer arm RBA can be retracted (or removed).

[0100] After retracting the transfer arm RBA, the 1-2 edge loading unit 321b can move in the third direction DR3. In other words, the 1-2 edge loading unit 321b can rise toward the substrate SUB. The 1-2 edge loading unit 321b can press (or support) the first side 11 of the substrate SUB that is not supported by the substrate holder 230.

[0101] Accordingly, the first side 11 of the substrate SUB can be supported by the 1-1 edge loading unit 321a and the 1-2 edge loading unit 321b, and the second to fourth sides 12, 13, and 14 of the substrate SUB can be supported by the substrate holder 230.

[0102] Reference Figure 12 and Figure 13 and, the position of the substrate SUB can be aligned by the moving stage 100 (S400).

[0103] The camera 400 can be disposed under the stage 100. In one embodiment, for example, the camera 400 can be disposed on the loading stage LST. The camera 400 can measure the alignment marks of the substrate SUB. In one embodiment, for example, the camera 400 can be a line scan camera or an area scan camera. The stage 100 can align the position of the substrate SUB based on the position of the alignment marks. In one embodiment, for example, the stage 100 can be a UVW stage.

[0104] As the area of the substrate SUB becomes larger, the substrate SUB may become misaligned during the process of transferring the substrate SUB to the stage 100. When the substrate SUB contacts the loading unit (e.g., the center loading unit 330) while the substrate SUB is misaligned, the loading unit may contact the unit area of the substrate SUB where the display panel unit is disposed. Accordingly, there may be a problem of damage to the display panel unit.

[0105] To prevent damage to the display panel unit, the position of the substrate SUB can be aligned before the substrate SUB contacts the loading unit. Since the first side 11 of the substrate SUB is supported by the first edge loading unit 321, and the second to fourth sides 12, 13, and 14 of the substrate SUB are supported by the substrate holder 230, the process of aligning the substrate SUB can be performed before the substrate SUB contacts the loading unit. Accordingly, the loading unit may not contact the unit area of the substrate SUB where the display panel unit is disposed, but may contact the dummy area of the substrate SUB that will be subsequently removed. Accordingly, the problem of damage to the display panel unit due to contact with the loading unit can be effectively prevented.

[0106] Reference Figure 14 、 Figure 15 、 Figure 16 and Figure 17 , the center loading unit 330 and the second edge loading unit 322 can be raised (S500).

[0107] As Figure 15 、 Figure 16 and Figure 17 illustrated, the center loading unit 330 can include a first center loading unit 331, a second center loading unit 332, and a third center loading unit 333. In a plan view, the first center loading unit 331 can overlap with the central portion of the substrate SUB (e.g., the central portion in the second direction DR2). The second center loading unit 332 can be spaced apart from the first center loading unit 331 in the second direction DR2 and the direction opposite to the second direction DR2. The third center loading unit 333 can be spaced apart from the first center loading unit 331 in the second direction DR2 and the direction opposite to the second direction DR2, and is farther from the first center loading unit 331 than the second center loading unit 332.

[0108] The second center loading unit 332 and the third center loading unit 333 may be disposed relative to the first center loading unit 331 in a direction away from the central portion of the substrate SUB (e.g., in the second direction DR2 or in a direction opposite to the second direction DR2). The second center loading unit 332 may be closer to the central portion of the substrate SUB than the third center loading unit 333. In other words, the third center loading unit 333 may be closer to the edge of the substrate SUB than the second center loading unit 332.

[0109] In one embodiment, the first center loading unit 331 may be repeatedly disposed along the first direction DR1, the second center loading unit 332 may be repeatedly disposed along the first direction DR1, and the second center loading unit 332 may be symmetrically positioned relative to the first center loading unit 331. That is, the second center loading unit 332 may be symmetrically positioned relative to the first center loading unit 331 in the second direction DR2 and in a direction opposite to the second direction DR2. Additionally, the third center loading unit 333 may be repeatedly disposed along the first direction DR1 and may be symmetrically positioned relative to the first center loading unit 331. That is, the third center loading unit 333 may be symmetrically positioned relative to the first center loading unit 331 in the second direction DR2 and in a direction opposite to the second direction DR2.

[0110] In one embodiment, as Figure 15 illustrated, the first center loading unit 331 may be raised before the second center loading unit 332 and the third center loading unit 333 are raised. That is, the first center loading unit 331 among the first to third center loading units 331, 332, and 333 may first be raised toward the substrate SUB. Accordingly, the first center loading unit 331 may first press the central portion of the substrate SUB against the electrostatic chuck 110. In one embodiment, for example, the first center loading unit 331 may include three first groups arranged in a row along the first direction DR1, and the first groups may be spaced apart from each other in the second direction DR2. However, the present disclosure is not limited thereto.

[0111] As Figure 16 illustrated, the second center loading unit 332 may be raised toward the substrate SUB a second time. Accordingly, the second center loading unit 332 may secondarily press the area adjacent to the central portion of the substrate SUB against the electrostatic chuck 110. In one embodiment, for example, the second center loading unit 332 may include six second groups arranged in a row along the first direction DR1, and the second groups may be spaced apart from each other in the second direction DR2. However, the present disclosure is not limited thereto.

[0112] As Figure 17As illustrated, the third center loading unit 333 can be raised toward the substrate SUB for the third time. Accordingly, the third center loading unit 333 can press, for the third time, the area adjacent to the edge of the substrate SUB toward the electrostatic chuck 110. In one embodiment, for example, the third center loading unit 333 can include six third groups arranged in a row along the first direction DR1, and the third groups can be spaced apart from each other in the second direction DR2. However, the present disclosure is not limited thereto.

[0113] That is, the center loading unit 330 can be driven to rise such that the central portion of the substrate SUB has an upwardly convex curved surface. In other words, the first center loading unit 331 that presses the central portion of the substrate SUB can rise first, and the third center loading unit 333 that presses the area adjacent to the edge of the substrate SUB can rise last. Since the central portion of the substrate SUB rises to have an upwardly convex curved surface, the substrate SUB can be prevented from sagging during the rise toward the electrostatic chuck 110.

[0114] Accordingly, the first center loading unit 331, the second center loading unit 332, and the third center loading unit 333 can press the portion of the substrate SUB located inside from the edge of the substrate SUB toward the electrostatic chuck 110.

[0115] The second edge loading unit 322 can be raised toward the substrate SUB. Accordingly, the second edge loading unit 322 can press the edge of the substrate SUB toward the electrostatic chuck 110. Specifically, the second edge loading unit 322 can press the second to fourth sides 12, 13, and 14 of the substrate SUB supported by the substrate holder 230. In one embodiment, the second edge loading unit 322 can rise simultaneously with the third center loading unit 333. However, the present disclosure is not limited thereto, and the second edge loading unit 322 can rise later than the third center loading unit 333.

[0116] Reference Figure 18 , the substrate SUB can be engaged in the electrostatic chuck 110, and the loading unit can descend (S600).

[0117] The substrate SUB can be pressed by the edge loading unit 320 and the center loading unit 330 to rise toward the electrostatic chuck 110. The electrostatic chuck 110 can engage the substrate SUB with an electrostatic force. Accordingly, the substrate SUB can be fixedly adsorbed to the lower surface of the electrostatic chuck 110. That is, the substrate SUB can be fixed such that the surface to be irradiated with the laser beam faces downward.

[0118] After the substrate SUB is engaged with the electrostatic chuck 110, the edge loading unit 320 and the center loading unit 330 can descend in a direction away from the substrate SUB. In this case, the edge loading unit 320 and the center loading unit 330 can descend simultaneously.

[0119] After the substrate SUB is engaged with the electrostatic chuck 110, the stage 100 can transfer the substrate SUB toward the laser unit (e.g., Figure 1 the laser unit LAS). The process of etching the substrate SUB can be performed by irradiating a laser beam onto the substrate SUB through the laser unit.

[0120] Figure 19 For example, to illustrate the Figure 5 flowchart of separating the substrate from the electrostatic chuck included in the Figure 20 , Figure 21 , Figure 22 and Figure 23 For example, to illustrate the Figure 19 cross-sectional view of separating the substrate SUB from the electrostatic chuck. In Figure 20 , Figure 21 , Figure 22 and Figure 23 , the substrate holder 230 illustrated in Figure 6 and Figure 7 is not illustrated. As illustrated in Figure 2 , the pushing member 220 can be located inside the stage 100, but for ease of description, in Figure 20 , Figure 21 , Figure 22 and Figure 23 , the pushing member 220 is illustrated as being located outside the stage 100.

[0121] Referring to Figure 1 , Figure 2 and Figure 19 , separating the substrate SUB from the electrostatic chuck 110 (S700) can include releasing the substrate SUB from the electrostatic chuck 110, lowering the pushing member 220, and raising the edge loading unit 320 (S710), clamping the substrate SUB by bringing the pushing member 220 and the edge loading unit 320 into contact with the substrate SUB at the edge of the substrate SUB (S720), raising the center loading unit 330 to contact the substrate SUB (S730), and raising the pushing member 220 (S740).

[0122] Referring to Figure 20 , the substrate SUB can be released from the electrostatic chuck 110, the pushing member 220 can be lowered, and the edge loading unit 320 can be raised (S710).

[0123] After the substrate SUB is etched by the laser unit, the stage 100 may transfer the substrate SUB toward the loading module 300. The substrate SUB may be moved to overlap with the edge loading unit 320 and the center loading unit 330 in a plan view, and the substrate SUB may be released from the electrostatic chuck 110. At this time, when the engagement and release between the substrate SUB and the electrostatic chuck 110 are repeated, the substrate SUB may not be separated from the electrostatic chuck 110 due to the residual electrostatic charge between the substrate SUB and the electrostatic chuck 110. When the substrate SUB cannot be separated from the electrostatic chuck 110, the pushing member 220 may press the substrate SUB toward the loading module 300.

[0124] Specifically, the separation module driver may lower the separation module 200 toward the substrate SUB. That is, although not illustrated in Figure 20 , the first main body portion 210 and the substrate holder 230 may descend together with the pushing member 220. As the pushing member 220 descends toward the substrate SUB, the pushing member 220 may press the substrate SUB through the through hole defined in the electrostatic chuck 110. The pushing member 220 may be repeatedly provided in the first direction DR1 and the second direction DR2. Accordingly, the pushing member 220 may press the substrate SUB over the entire area of the substrate SUB.

[0125] In one embodiment, the pushing member 220 may include a sensor (e.g., Figure 4 sensor 222) for measuring the electrostatic force between the substrate SUB and the electrostatic chuck 110. Specifically, the sensor may measure the residual electrostatic charge amount between the substrate SUB and the electrostatic chuck 110 after releasing the substrate SUB from the electrostatic chuck 110.

[0126] In one embodiment, the separation module 200 may further include a control portion for controlling the speed of the pushing member 220 in response to the electrostatic force between the substrate SUB and the electrostatic chuck 110. Specifically, the control portion may control the speed of the pushing member 220 in response to the residual electrostatic charge amount between the substrate SUB and the electrostatic chuck 110 measured by the sensor. Accordingly, even when the substrate SUB is not separated from the electrostatic chuck 110 due to the residual electrostatic charge between the substrate SUB and the electrostatic chuck 110, the substrate SUB may be effectively separated from the electrostatic chuck 110 by pressing the substrate SUB toward the loading module 300 through the pushing member 220.

[0127] The edge loading unit 320 may be raised toward the substrate SUB. In one embodiment, raising the edge loading unit 320 toward the substrate SUB may be performed simultaneously with lowering the pushing member 220 toward the substrate SUB. The edge loading unit 320 may include a first edge loading unit 321 and a second edge loading unit 322.

[0128] Reference Figure 21, the pushing member 220 and the edge loading unit 320 can contact the substrate SUB at the edge of the substrate SUB and can clamp the substrate SUB (S720).

[0129] As the pushing member 220 descends toward the substrate SUB, the pushing member 220 can contact the entire area of the substrate SUB. As the edge loading unit 320 ascends toward the substrate SUB, the edge loading unit 320 can contact the edge of the substrate SUB. That is, at the edge of the substrate SUB, the pushing member 220 can contact the upper surface of the substrate SUB, and the edge loading unit 320 can contact the lower surface of the substrate SUB.

[0130] Accordingly, the pushing member 220 and the edge loading unit 320 can clamp the edge of the substrate SUB. Therefore, when the substrate SUB is loaded on the edge loading unit 320 and the center loading unit 330, the problem of the substrate SUB sliding can be effectively prevented.

[0131] In one embodiment, the elastic member ELM can be disposed at the end of each of the edge loading units 320 that contacts the substrate SUB. Accordingly, when clamping the substrate SUB, the elastic member ELM can relieve the impact applied to the substrate SUB. The elastic member ELM can include an elastic material such as rubber.

[0132] Reference Figure 22 , the center loading unit 330 can ascend and contact the substrate SUB (S730).

[0133] After the pushing member 220 and the edge loading unit 320 clamp the edge of the substrate SUB, the center loading unit 330 can ascend toward the substrate SUB. Accordingly, the center loading unit 330 can contact the lower surface of the substrate SUB that is located inside from the edge of the substrate SUB. Therefore, the substrate SUB can be loaded on the edge loading unit 320 and the center loading unit 330.

[0134] Reference Figure 23 , the substrate SUB can be supported by the loading unit, and the pushing member 220 can ascend (S740).

[0135] After the substrate SUB is loaded on the edge loading unit 320 and the center loading unit 330, the separation module driver can raise the separation module 200 in a direction away from the substrate SUB. That is, the first main body portion 210 and the substrate holder 230 can ascend together with the pushing member 220. Therefore, the substrate SUB can be separated from the electrostatic chuck 110.

[0136] The present disclosure can be applied to various display devices. For example, the present disclosure is applicable to various display devices, such as display devices for vehicles, ships, and aircraft, portable communication devices, display devices for exhibitions or information transmission, medical display devices, and the like.

[0137] The foregoing is an illustration of embodiments of the present disclosure and should not be construed as limiting the embodiments of the present disclosure. Although some embodiments have been described with reference to the figures, those skilled in the art will readily understand that many changes and modifications can be made therein without departing from the spirit and scope of the present disclosure as defined in the appended claims.

Claims

1. A substrate processing device, comprising: a stage including an electrostatic chuck configured to engage a substrate; a separation module disposed on the stage and including a pushing member configured to separate the substrate from the electrostatic chuck and a substrate holder configured to support an edge of the substrate; as well as a loading module disposed below the stage and comprising: a plurality of edge loading units configured to press the edge of the substrate toward the electrostatic chuck; and a plurality of center loading units configured to press a portion of the substrate located inside from the edge of the substrate toward the electrostatic chuck. 2 . The apparatus of claim 1 , wherein the urging member presses the substrate toward the loading module when the urging member separates the substrate from the electrostatic chuck. 3 . The apparatus of claim 1 , wherein the pushing member comprises a sensor configured to measure an electrostatic force between the substrate and the electrostatic chuck. 4 . The apparatus according to claim 3 , wherein the separation module further comprises a control portion configured to control a speed of the pushing member in response to the electrostatic force.

5. The apparatus according to claim 1, further comprising: a camera disposed below the stage and configured to measure an alignment mark of the substrate, Wherein the stage is configured to align the substrate based on the position of the alignment mark.

6. The apparatus according to claim 1, wherein the substrate includes a first side extending in a first direction, a second side contacting the first side and extending in a second direction intersecting the first direction, a third side extending parallel to the first side and facing the first side, and a fourth side extending parallel to the second side and facing the second side, and The substrate holder does not support one of the first to fourth sides.

7. The apparatus of claim 6, wherein the plurality of edge loading units comprises: a plurality of first edge loading units configured to press the side of the substrate that is not supported by the substrate holder; and A plurality of second edge loading units are configured to press a side of the substrate supported by the substrate holder.

8. The device according to claim 1, wherein the substrate includes a first side extending in a first direction and a second side contacting the first side and extending in a second direction intersecting the first direction, The length of the first side is less than the length of the second side, and The plurality of central loading units include: a plurality of first center loading units configured to press a center portion of the substrate; and a plurality of second central loading units spaced apart from the plurality of first central loading units in the second direction and in a direction opposite to the second direction.

9. The device according to claim 8, wherein the plurality of first central loading units are repeatedly arranged along the first direction, The plurality of second central loading units are repeatedly arranged along the first direction, and The plurality of second central loading units are positioned symmetrically with respect to the plurality of first central loading units.

10. The apparatus according to claim 1, further comprising: An elastic member is provided at an end portion of each of the plurality of edge loading units that contacts the substrate.

11. A substrate processing method, the method comprising: transferring a substrate so that the substrate is positioned below a stage including an electrostatic chuck; raising a separation module located on the stage and including a pushing member and a substrate holder, and supporting an edge of the substrate with the substrate holder; aligning the position of the substrate by moving the stage; raising a plurality of center loading units located under the stage to press a portion of the substrate located inside from the edge of the substrate, and raising a plurality of edge loading units located under the stage to press the edge of the substrate; clamping the substrate to the electrostatic chuck; as well as The substrate is separated from the electrostatic chuck by releasing the substrate from the electrostatic chuck and by pressing the substrate with the urging member.

12. The method of claim 11, wherein the separating of the substrate from the electrostatic chuck comprises: measuring an electrostatic force between the substrate and the electrostatic chuck; and The velocity of the urging member is controlled in response to the electrostatic force.

13. The method of claim 12, wherein the pushing member comprises a sensor configured to measure the electrostatic force, and The separation module further includes a control portion configured to control the speed of the pushing member in response to the electrostatic force.

14. The method according to claim 11, wherein the substrate includes a first side extending in a first direction, a second side contacting the first side and extending in a second direction intersecting the first direction, a third side extending parallel to the first side and facing the first side, and a fourth side extending parallel to the second side and facing the second side, and In the edge where the substrate is supported by the substrate holder, the substrate holder does not support one of the first to fourth sides.

15. The method according to claim 14, further comprising: Prior to the aligning of the position of the substrate, some of the plurality of edge loading units are raised to support the side of the substrate that is not supported by the substrate holder.

16. The method according to claim 11, wherein the substrate includes a first side extending in a first direction and a second side contacting the first side and extending in a second direction intersecting the first direction, The length of the first side is less than the length of the second side, and The plurality of central loading units include: a plurality of first center loading units configured to press a center portion of the substrate; and a plurality of second central loading units spaced apart from the plurality of first central loading units in the second direction and in a direction opposite to the second direction.

17. The method according to claim 16, wherein the plurality of first central loading units are repeatedly arranged along the first direction, The plurality of second central loading units are repeatedly arranged along the first direction, and The plurality of second central loading units are positioned symmetrically with respect to the plurality of first central loading units. 18 . The method of claim 16 , wherein in the raising of the plurality of central loading units, the plurality of first central loading units are raised before the plurality of second central loading units are raised.

19. The method of claim 11, wherein the separating of the substrate from the electrostatic chuck comprises: lowering the pushing member and raising the plurality of edge loading units toward the substrate; clamping the substrate by bringing the pushing member and the plurality of edge loading units into contact with the substrate at the edge of the substrate; as well as The plurality of center loading units are raised to contact the substrate.

20. The method of claim 19, wherein in said clamping of said substrate, An impact applied to the substrate is mitigated by an elastic member provided at an end portion of each of the plurality of edge loading units that contacts the substrate.

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