Epoxy resin composition for semiconductor encapsulation and semiconductor device

Abstract

Provided is an epoxy resin composition for semiconductor encapsulation, the epoxy resin composition being capable of achieving preferable flowability during molding, releasability of a cured product from a mold after molding, and high adherence of the cured product to a metal member such as a lead frame. The epoxy resin composition for semiconductor encapsulation contains an epoxy resin (A), a curing agent (B), an inorganic filler (C), and a release agent (D). The release agent (D) contains a reaction product (d1) of a copolymer of an alpha-olefin and maleic anhydride and a monofunctional aliphatic glycidyl ether.

Description

Technical Field

[0001] The present disclosure relates to an epoxy resin composition for semiconductor packaging and a semiconductor device, and more particularly to an epoxy resin composition for semiconductor packaging and a semiconductor device including a packaging portion formed of the epoxy resin composition for semiconductor packaging. Background Art

[0002] Patent Document 1 discloses an epoxy resin composition for packaging. The epoxy resin composition contains: an epoxy resin; a curing agent; and a release agent, wherein a phenolic curing agent is used as the curing agent, and a fatty acid amide and carnauba wax are used as the release agent.

[0003] Prior art documents

[0004] Patent documents

[0005] Patent Document 1: JP 3417283 B2 Summary of the Invention

[0006] An object of the present disclosure is to provide an epoxy resin composition for semiconductor packaging, which has good fluidity during molding, provides good releasability of the cured product of the epoxy resin composition for semiconductor packaging from a mold after molding, and enables the cured product to have high adhesion to a metal when the epoxy resin composition for semiconductor packaging is molded on a metal; and a semiconductor device.

[0007] The epoxy resin composition for semiconductor packaging according to one aspect of the present disclosure contains an epoxy resin (A), a curing agent (B), an inorganic filler (C), and a release agent (D). The release agent (D) contains a reaction product (d1) of an α-olefin-maleic anhydride copolymer and a monofunctional aliphatic glycidyl ether.

[0008] The semiconductor device according to one aspect of the present disclosure includes a semiconductor element and a packaging portion that packages the semiconductor element. The packaging portion contains a cured product of the epoxy resin composition for semiconductor packaging. Brief Description of the Drawings

[0009] Figure 1 is a schematic cross-sectional view of a semiconductor device according to an embodiment of the present disclosure. Detailed Description

[0010] (Embodiment)

[0011] (1) Overview

[0012] The process of completing the epoxy resin composition for semiconductor packaging (hereinafter also referred to as composition (X)) of the present disclosure will be described.

[0013] Based on the knowledge uniquely obtained by the present inventors during the research and development of the epoxy resin composition for encapsulation, the fluidity of the epoxy resin composition for encapsulation during molding and the mold release property of the cured product obtained by molding the epoxy resin composition can be improved. However, in this case, it is difficult to improve the adhesion of the cured product to metal members included in the semiconductor device, such as a lead frame.

[0014] Therefore, the present inventors conducted in-depth research to obtain an epoxy resin composition for semiconductor encapsulation that has good fluidity during molding, provides good mold release property of the cured product of the epoxy resin composition for semiconductor encapsulation after molding, and enables the cured product to have high adhesion to metal when the epoxy resin composition for semiconductor encapsulation is molded on metal. As a result, the present inventors conceived the concept of the present disclosure.

[0015] Reference will be made to Figure 1 Describe the embodiments. Note that the embodiments described below are merely examples of various embodiments of the present disclosure. In addition, various changes can be made to the embodiments described below as long as the object of the present disclosure is achieved.

[0016] The drawings referred to in the following description are schematic representations. Therefore, the dimensional ratios of the constituent elements in the drawings are not always in proportion compared to the actual dimensional ratios.

[0017] First, an overview of the composition (X) will be described. As described above, the composition (X) contains an epoxy resin (A), a curing agent (B), an inorganic filler (C), and a release agent (D). The release agent (D) contains a reaction product (d1) of an α-olefin-maleic anhydride copolymer and a monofunctional aliphatic glycidyl ether. Therefore, the composition (X) has good fluidity during molding, provides good mold release property of the cured product of the composition (X) after molding, and enables the cured product to have high adhesion to metal when the composition (X) is molded on metal.

[0018] This will be described in detail. The α-olefin-maleic anhydride copolymer has a portion derived from maleic anhydride. When the resin composition contains a copolymer having such a portion derived from maleic anhydride, the adhesion of the cured product of the resin composition to metal can be improved. That is, when the resin composition is molded on a metal member included in the semiconductor device, such as a lead frame, the cured product can have high adhesion to the metal.

[0019] In addition, in the case of such α-olefin-maleic anhydride copolymers, by reacting the moiety derived from maleic anhydride with a suitable compound, it is possible to impart to the resulting α-olefin-maleic anhydride copolymer the effects of improving the fluidity during molding and the releasability of the cured product from the mold after molding. However, in this case, depending on the compound used in the reaction, the effect of improving the adhesion of the cured product to metal possessed by the α-olefin-maleic anhydride copolymer may be impaired. At the same time, the present inventors have found that by reacting with a specific compound, namely a monofunctional aliphatic glycidyl ether, it is possible to impart to the α-olefin-maleic anhydride copolymer the effects of improving the fluidity during molding and the releasability of the cured product from the mold after molding, without impairing the effect of improving the adhesion of the cured product to metal imparted by the moiety derived from maleic anhydride. That is, the present inventors have found that when the composition (X) contains the reaction product (d1) of an α-olefin-maleic anhydride copolymer and a monofunctional aliphatic glycidyl ether, the composition (X) has good fluidity during molding, provides good releasability of the cured product of the composition (X) from the mold after molding, and enables the cured product to have a high adhesion to metal when the composition (X) is molded on metal.

[0020] In addition, the composition (X) as described above can be used for producing the semiconductor device 1. More specifically, the composition (X) can be used for forming the encapsulation portion 4 for encapsulating the semiconductor element 3 included in the semiconductor device 1. Note that the use of the composition (X) is not limited to only encapsulating the semiconductor element 3 included in the semiconductor device 1. That is, the composition (X) can be used for various purposes.

[0021] (2) Components

[0022] Details of the components of the composition (X) will be described.

[0023] (Epoxy resin)

[0024] As described above, the composition (X) contains an epoxy resin (A) as a component. In addition, when the composition (X) is heated, the epoxy resin (A) can react with the curing agent (B). This can cure the composition (X).

[0025] The epoxy resin (A) contains at least one component selected from the group consisting of, for example, glycidyl ether type epoxy resins, glycidyl amine type epoxy resins, glycidyl ester type epoxy resins, and olefin oxidation type (alicyclic) epoxy resins. More specifically, the epoxy resin (A) contains at least one component selected from the group consisting of, for example: alkylphenol-novolac type epoxy resins such as phenol-novolac type epoxy resins and cresol-novolac type epoxy resins; naphthol-novolac type epoxy resins; phenol-arylalkyl type epoxy resins having, for example, a phenylene skeleton or a biphenylene skeleton; biphenyl-arylalkyl type epoxy resins; naphthol-arylalkyl type epoxy resins having, for example, a phenylene skeleton or a biphenylene skeleton; polyfunctional type epoxy resins such as triphenol-methane type epoxy resins and alkyl-modified triphenol-methane type epoxy resins; triphenyl-methane type epoxy resins; tetraphenylethane type epoxy resins; dicyclopentadiene type epoxy resins; stilbene type epoxy resins; bisphenol type epoxy resins such as bisphenol A type epoxy resins and bisphenol F type epoxy resins; biphenyl type epoxy resins; naphthalene type epoxy resins; alicyclic epoxy resins; bromine-containing epoxy resins such as bisphenol A type bromine-containing epoxy resins; glycidyl amine type epoxy resins produced by the reaction of epichlorohydrin with polyamines such as diaminodiphenylmethane and isocyanuric acid; and glycidyl ester type epoxy resins produced by the reaction of polyacids such as phthalic acid and dimer acid with epichlorohydrin.

[0026] Among the above components, the epoxy resin (A) preferably contains at least one selected from the group consisting of biphenyl type epoxy resins, biphenyl-arylalkyl type epoxy resins, and naphthol-novolac type epoxy resins. In this case, the cured product can have improved heat resistance, and the fluidity during molding can be improved. Note that the epoxy resin (A) may contain only one component or may contain two or more components.

[0027] (Curing agent)

[0028] As described above, the composition (X) contains a curing agent (B) as a component. The curing agent (B) preferably contains a phenolic compound. When the curing agent (B) contains a phenolic compound, the curability of the epoxy resin (A) can be further improved because the phenolic compound has good reactivity with the epoxy resin (A).

[0029] The phenolic compound contains at least one selected from the group consisting of, for example, monomers, oligomers, and polymers each having two or more phenolic hydroxyl groups per molecule.

[0030] The phenolic compound contains at least one component selected from the group consisting of, for example, novolak-type resins such as phenol novolak resin, cresol novolak resin, and naphthol novolak resin; phenol-arylalkyl resins having a phenylene skeleton or a biphenylene skeleton; polyfunctional phenolic resins such as triphenolmethane-type resin; dicyclopentadiene-type phenolic resins such as dicyclopentadiene-type phenol novolak resin and dicyclopentadiene-type naphthol novolak resin; terpene-modified phenolic resins; bisphenol-type resins such as bisphenol A and bisphenol F resins; and triazine-modified phenol novolak resins. Note that the curing agent (B) is not limited to phenolic compounds as long as it causes a thermal curing reaction with the epoxy resin (A). For example, the curing agent (B) contains at least one component selected from phenolic compounds, acid anhydrides, imidazole compounds, or amine compounds.

[0031] The equivalent ratio of the epoxy resin (A) to the curing agent (B) is preferably 0.6 or more and 10.0 or less. When the equivalent ratio of the epoxy resin (A) to the curing agent (B) is 10.0 or less, good curability of the composition (X) and good heat resistance and strength of the cured product can be achieved. In addition, when the equivalent ratio of the epoxy resin (A) to the curing agent (B) is 0.6 or more, high moisture resistance of the cured product can be achieved. The equivalent ratio of the epoxy resin (A) to the curing agent (B) is preferably 0.8 or more. The equivalent ratio of the epoxy resin (A) to the curing agent (B) is more preferably 5.0 or less.

[0032] Note that as the curing agent (B), only one component can be used or two or more components can be used in combination.

[0033] (Inorganic filler)

[0034] As described above, the composition (X) contains the inorganic filler (C) as a component. Therefore, the cured product can have improved heat resistance. In addition, the inorganic filler (C) can make the cured product have a reduced coefficient of linear expansion.

[0035] The inorganic filler (C) contains at least one component selected from the group consisting of, for example, fused silica, crystalline silica, alumina, zircon, calcium silicate, calcium carbonate, potassium titanate, silicon carbide, silicon nitride, aluminum nitride, boron nitride, beryllium oxide, zirconia, zircon, forsterite, talc, spinel, mullite, and titanium dioxide. Note that as the inorganic filler (C), only one component can be used or two or more components can be used in combination.

[0036] The content of the inorganic filler (C) is preferably 75% by mass or more and 95% by mass or less with respect to the composition (X). In this case, the cured product can have further improved heat resistance and a further reduced coefficient of linear expansion.

[0037] (Release agent)

[0038] As described above, the composition (X) contains a release agent (D) as a component. The release agent (D) contains a reaction product (d1) of an α-olefin-maleic anhydride copolymer and a monofunctional aliphatic glycidyl ether. This can achieve good fluidity during molding and good releasability of the cured product from the mold after molding, and when the composition (X) is molded on a metal, the cured product can have improved adhesion to the metal. Note that the reaction product (d1) may contain a plurality of compounds.

[0039] [α-olefin-maleic anhydride copolymer]

[0040] As described above, the reaction product (d1) is produced from an α-olefin-maleic anhydride copolymer. Therefore, when the composition (X) is molded on a metal, the reaction product (d1) can make the cured product have improved adhesion to the metal.

[0041] Regarding the α-olefin-maleic anhydride copolymer, the number of carbon atoms of the α-olefin is preferably 28 or more and 60 or less. In this case, when the cured product is formed on a metal, the cured product can have improved adhesion to the metal, and after molding, the cured product can have improved releasability from the mold. More specifically, when the number of carbon atoms of the α-olefin is 28 or more, the reaction product (d1) is easily retained by the composition (X), and thus the reaction product (d1) hardly adheres to the mold. As a result, after molding, the cured product can have improved releasability from the mold. When the number of carbon atoms of the α-olefin is 60 or less, the effect of improving the adhesion to the metal possessed by the portion derived from maleic anhydride can be further maintained. When the composition (X) is molded on a metal, this can make the cured product have improved adhesion to the metal. Note that in the present disclosure, the releasability refers to continuous moldability, and the continuous moldability means that when the force (resistance value) applied when removing the cured product from the mold does not exceed a certain value, the operations of forming the cured product of the composition (X) in the mold and removing the cured product from the mold can be repeated.

[0042] The α-olefins used for producing the α-olefin-maleic anhydride copolymer include at least one compound selected from the group consisting of, for example, straight-chain α-olefins such as 1-octacosene, 1-triacontene, 1-hentriacontene, 1-dotriacontene, 1-tritriacontene, 1-tetratriacontene, 1-pentatriacontene, 1-hexatriacontene, 1-tetracontene, 1-hentetracontene, 1-dotetracontene, 1-tritetracontene, 1-tetratetracontene, 1-pentacontene, 1-henpentacontene, 1-dopentacontene, 1-tripentacontene, 1-pentapentacontene, and 1-hexacontene; and branched-chain α-olefins such as 3-methyl-1-triacontene, 3,4-dimethyl-triacontene, 3-methyl-1-tetracontene, and 3,4-dimethyl-tetracontene. In addition, among these compounds, one compound may be used alone or two or more compounds may be used in combination.

[0043] As the α-olefin-maleic anhydride copolymer, commercially available products can be used. Examples of commercially available products include Diacarna (registered trademark) 30M (manufactured by Mitsubishi Chemical Corporation) produced from 1-octacosene, 1-triacontene, 1-tetracontene, 1-pentacontene, 1-hexacontene, etc. as raw materials.

[0044] The α-olefin-maleic anhydride copolymer has a structural unit (UA) represented by the following formula (A) and a structural unit (UB) represented by the following formula (B).

[0045]

[0046] In formula (A), R 1 represents an alkyl group having 26 or more and 56 or less carbon atoms. The alkyl group may be straight-chain or branched-chain. In addition, regarding the α-olefin-maleic anhydride copolymer, the ratio of the structural unit (UA) to the structural unit (UB) is preferably 0.5 or more and 10 or less, and particularly preferably 1. This helps to maintain: the fluidity during molding; the mold release property of the cured product after molding; and the high adhesion of the cured product to the metal when the composition (X) is molded on the metal.

[0047] The α-olefin-maleic anhydride copolymer preferably contains at least one of the structures represented by the following formula (1) or the structure represented by the following formula (2). This can further improve the fluidity during molding and the mold release property of the cured product after molding, and when the composition (X) is molded on the metal, it can make the cured product have further improved adhesion to the metal.

[0048]

[0049] R in the above formulas (1) and (2) 1 may be the same as in the above formula (A) and represents an alkyl group having 26 or more and 56 or less carbon atoms. n is an integer of 1 or more and 15 or less. m represents the copolymerization ratio between the α-olefin and maleic anhydride. m is preferably 0.5 or more and 10 or less, and m is particularly preferably 1. That is, the α-olefin-maleic anhydride copolymer particularly preferably has a structure of an α-olefin / maleic anhydride alternating copolymer.

[0050] Any suitable polymerization method can be adopted for the production method of the α-olefin-maleic anhydride copolymer. For the polymerization, for example, an organic solvent in which the α-olefin and maleic anhydride are soluble can be used. Examples of the organic solvent include aromatic solvents such as toluene, ether solvents, and halogen solvents. Among these solvents, the organic solvent used in the reaction is preferably toluene. The polymerization temperature varies depending on the type of the organic solvent used, but from the viewpoint of productivity, the polymerization temperature is preferably 50°C or more and 200°C or less, more preferably 100°C or more and 150°C or less. From the viewpoint of productivity, the reaction time is preferably 1 hour or more and 30 hours or less, more preferably 2 hours or more and 15 hours or less, and still more preferably 4 hours or more and 10 hours or less.

[0051] After the polymerization is completed, for example, unreacted components and solvents can be removed under heating and reduced pressure conditions. Regarding the heating conditions, the temperature is preferably 100°C or more and 220°C or less, more preferably 120°C or more and 180°C or less. In addition, regarding the reduced pressure conditions, the pressure is preferably 13.3×10 3 Pa or less, more preferably 8×10 3 Pa or less. In addition, the time required for the removal is preferably 0.5 hour or more and 10 hours or less. In addition, a polymerization initiator can be used for the polymerization. Specific examples of the polymerization initiator include radical polymerization initiators such as azobisisobutyronitrile (AIBN) and benzoyl peroxide (BPO).

[0052] [Monofunctional aliphatic glycidyl ether]

[0053] As described above, the reaction product (d1) is produced from the monofunctional aliphatic glycidyl ether. Therefore, the reaction product (d1) can: maintain a high adhesion of the cured product to the metal when the composition (X) is formed on the metal; and improve the fluidity during the forming and the demoldability of the cured product from the mold after the forming.

[0054] The monofunctional aliphatic glycidyl ether is a compound represented by the following formula (3), for example.

[0055]

[0056] In formula (3), R 2is an alkyl group having 10 or more and 25 or less carbon atoms. The alkyl group may be linear or branched.

[0057] Regarding the monofunctional aliphatic glycidyl ether, the carbon number of the monofunctional aliphatic glycidyl ether is preferably 10 or more and 25 or less. In this case, when the composition (X) is formed on a metal, the high adhesion of the cured product to the metal can be further maintained, and the fluidity during forming and the mold release property of the cured product from the mold after forming can be further improved. More specifically, when the carbon number of the monofunctional aliphatic glycidyl ether is 10 or more, the reaction product (d1) is further easily retained by the composition (X), and thus the reaction product (d1) is less likely to adhere to the mold, thereby further improving the mold release property of the cured product from the mold after forming. In addition, the reaction of the maleic anhydride moiety derived from the α-olefin-maleic anhydride copolymer with the monofunctional aliphatic glycidyl ether having 10 or more carbon atoms can further improve the effect of the reaction product (d1) in improving the fluidity of the composition (X). This can further improve the fluidity during forming. Furthermore, when the carbon number of the monofunctional aliphatic glycidyl ether is 25 or less, the effect of the maleic anhydride moiety derived from the α-olefin-maleic anhydride copolymer in improving the adhesion to the metal can be further maintained. Therefore, when the composition (X) is formed on a metal, the high adhesion of the cured product to the metal can be further maintained. In addition, the carbon number of the monofunctional aliphatic glycidyl ether is more preferably 12 or more, and even more preferably 17 or more. The carbon number of the monofunctional aliphatic glycidyl ether is more preferably 22 or less, and even more preferably 20 or less.

[0058] The monofunctional aliphatic glycidyl ether contains at least one selected from the group consisting of, for example, decyl glycidyl ether, undecyl glycidyl ether, dodecyl glycidyl ether, tridecyl glycidyl ether, tetradecyl glycidyl ether, pentadecyl glycidyl ether, hexadecyl glycidyl ether, stearyl glycidyl ether, nonadecyl glycidyl ether, and eicosyl glycidyl ether. In addition, as the monofunctional aliphatic glycidyl ether, one of the above compounds may be used alone or two or more of the above compounds may be used in combination.

[0059] [Reaction product]

[0060] The reaction product (d1) can be produced by reacting an α-olefin-maleic anhydride copolymer with a monofunctional aliphatic glycidyl ether. More specifically, the reaction product (d1) can be produced by the reaction of the maleic anhydride moiety contained in the α-olefin-maleic anhydride copolymer with the monofunctional aliphatic glycidyl ether. In other words, the reaction product (d1) may have a structural unit (UC) represented by the following formula (C).

[0061]

[0062] R 3 and R 4 Each independently represents a hydrogen atom or a group formed by the reaction of a monofunctional aliphatic glycidyl ether represented by the above formula (3).

[0063] Note that the reaction product (d1) has a structural unit (UC) represented by the formula (C) and may have a plurality of structural units having different structures from each other. In this case, the different structural units (UC) may be different in at least one of R 3 or R 4 .

[0064] Furthermore, in order to produce the reaction product (d1) from the α-olefin-maleic anhydride copolymer, not all of the portions derived from maleic anhydride in the copolymer have to react with the monofunctional aliphatic glycidyl ether. That is, some of the portions derived from maleic anhydride may remain in the reaction product (d1), and the reaction product (d1) may have a structural unit (UB) in addition to the structural unit (UC). More specifically, the reaction product (d1) may have a structural unit (UA) and a structural unit (UB) in addition to the structural unit (UC).

[0065] In order to produce the reaction product (d1), the weight ratio between the α-olefin-maleic anhydride copolymer and the monofunctional aliphatic glycidyl ether used in the reaction can be adjusted. That is, the weight ratio between the α-olefin-maleic anhydride copolymer and the monofunctional aliphatic glycidyl ether used in the reaction can be adjusted so that the composition (X) has good fluidity during molding, provides good demolding of the cured product of the composition (X) from the mold after molding, and when the composition (X) is molded on a metal, enables the cured product to have a high degree of adhesion to the metal.

[0066] Furthermore, the weight ratio between the α-olefin-maleic anhydride copolymer and the monofunctional aliphatic glycidyl ether used in the reaction can be adjusted so that the ratios of the structural unit (UA), the structural unit (UB), and the structural unit (UC) contained in the reaction product (d1) can be adjusted to a preferred ratio. Furthermore, with respect to the structural unit (UC), the weight ratio between the α-olefin-maleic anhydride copolymer and the monofunctional aliphatic glycidyl ether used in the reaction can be adjusted so that the structure obtained by reacting only one monofunctional aliphatic glycidyl ether with one portion derived from maleic anhydride and the structure obtained by reacting two monofunctional aliphatic glycidyl ethers with one portion derived from maleic anhydride are included in an appropriate proportion.

[0067] Regarding the production of the reaction product (d1), the weight ratio between the α-olefin-maleic anhydride copolymer and the monofunctional aliphatic glycidyl ether is preferably 6:1 or more and 1:6 or less. This can achieve better fluidity during molding and better demolding of the cured product from the mold after molding, and when the composition (X) is molded on a metal, it can enable the cured product to have improved adhesion to the metal. The weight ratio of the α-olefin-maleic anhydride copolymer to the monofunctional aliphatic glycidyl ether is more preferably 4:1 or more and 1:4 or less, and particularly preferably 2:1.

[0068] In the reaction, for example, an organic solvent in which the α-olefin-maleic anhydride copolymer and the monofunctional aliphatic glycidyl ether are soluble can be used. Examples of the organic solvent include aromatic solvents such as toluene, ether solvents, and halogen solvents. Among these solvents, the organic solvent used in the reaction is preferably toluene. Note that the reaction can be carried out without using a solvent.

[0069] The reaction temperature can be adjusted accordingly according to the type of organic solvent used. The reaction temperature is preferably 50°C or more and 200°C or less. In this case, productivity can be improved. Furthermore, the reaction temperature is more preferably 100°C or more and 150°C or less. The reaction time is preferably 10 minutes or more and 30 hours or less. In this case, productivity can be improved. The reaction time is more preferably 30 minutes or more.

[0070] In addition, after the reaction, for example, unreacted components and solvents can be removed under heating and reduced pressure conditions. Regarding the heating conditions, the temperature is preferably 100°C or more and 220°C or less, and more preferably 120°C or more and 180°C or less. In addition, regarding the reduced pressure conditions, the pressure is preferably 13.3×10 3 Pa or less, and more preferably 8×10 3 Pa or less. In addition, the time required for removal is preferably 0.5 hours or more and 10 hours or less.

[0071] Furthermore, the reaction can use a reaction catalyst as needed. For example, amine catalysts such as triphenylphosphine, triethylamine, and N,N-dimethylaminopyridine, and acid catalysts such as sulfuric acid and p-toluenesulfonic acid.

[0072] As described above, the α-olefin-maleic anhydride copolymer preferably has at least one of the structures represented by the above formulas (1) and (2), for example. That is, the reaction product (d1) preferably has at least one of the structures represented by the following formulas (4) and (5).

[0073]

[0074]

[0075] R in the above formulas (4) and (5) 1 may be the same as R in the above formulas (1) and (2) 1 and is an alkyl group having 26 or more and 56 or less carbon atoms. m is preferably 0.5 or more and 10 or less, and particularly preferably 1.

[0076] R 3 and R 4 are each independently a hydrogen atom or a group formed by the reaction of a monofunctional aliphatic glycidyl ether represented by the above formula (3).

[0077] In addition, when the reaction product (d1) has at least one of the structures represented by the above formulas (4) and (5), R in the above formulas (4) and (5) 3 and R 4 are each preferably a group represented by the following formula (6). This can achieve particularly good fluidity during molding and the releasability of the cured product from the mold after molding. In addition, when the reaction product (d1) has at least one of the structures represented by the above formulas (4) and (5), R in the above formulas (4) and (5) 3 and R 4 are each preferably a group represented by the following formula (7). When the composition (X) is molded on a metal, this can make the cured product have particularly improved adhesion to the metal. That is, in the present embodiment, when the reaction product (d1) has at least one of the structures represented by the above formulas (4) and (5), R in the above formulas (4) and (5) 3 and R 4 are each preferably at least one of a group represented by the following formula (6) or a group represented by the following formula (7).

[0078]

[0079] R in the above formulas (6) and (7) 2 may be the same as R in the above formula (3) 2 and is an alkyl group having 10 or more and 25 or less carbon atoms. In addition, R 2 is preferably an alkyl group having 7 or more and 22 or less carbon atoms. In addition, the alkyl group may be linear or branched.

[0080] In addition, the content of the reaction product (d1) is preferably 10% by mass or more relative to the content of the release agent (D). This can particularly improve the fluidity during molding, the releasability of the cured product from the mold after molding, and the adhesion of the cured product to the metal when the composition (X) is molded on the metal. The content of the reaction product (d1) is more preferably 20% by mass or more, and even more preferably 30% by mass or more relative to the content of the release agent (D). The content of the reaction product (d1) is preferably 95% by mass or less, and more preferably 90% by mass or less relative to the content of the release agent (D).

[0081] Note that the release agent (D) may contain components other than the reaction product (d1) (hereinafter referred to as the release agent (d2)) in addition to the reaction product (d1). The release agent (d2) is at least one selected from the group consisting of, for example, natural carnauba waxes such as carnauba wax, and polyethylene waxes containing higher fatty acids such as stearic acid and montanic acid and carboxyl groups. Among these release agents (d2), one kind may be used alone or two or more kinds may be used in combination.

[0082] (Additive)

[0083] In addition to the epoxy resin (A), the curing agent (B), the inorganic filler (C), and the release agent (D), the composition (X) may further contain components other than the epoxy resin (A), the curing agent (B), the inorganic filler (C), and the release agent (D) (hereinafter referred to as the additive (E)). The additive (E) may contain at least one selected from the group consisting of, for example, a curing accelerator, a coupling agent, a pigment, a flame retardant, a colorant, and an adhesion promoter.

[0084] As described above, the composition (X) may further contain a curing accelerator. The curing accelerator contains at least one component selected from the group consisting of, for example, cyclic amidine compounds such as 1,8-diazabicyclo[5.4.0]undec-7-ene, 1,5-diazabicyclo[4.3.0]nonene, and 5,6-dibutylamino-1,8-diazabicyclo[5.4.0]undec-7-ene; tertiary amine compounds such as benzyldimethylamine, triethanolamine, dimethylaminoethanol, tris(dimethylaminomethyl)phenol, and derivatives thereof; imidazole compounds such as 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, and derivatives thereof; organic phosphorus compounds such as organic phosphines such as tributylphosphine, methyldiphenylphosphine, triphenylphosphine, tris(4-methylphenyl)phosphine, diphenylphosphine, and phenylphosphine, and compounds obtained by adding the following to these organic phosphines and having intramolecular polarization, compounds having a π bond such as bisphenol A, bisphenol F, bisphenol S, and phenolic resins, quinone compounds such as 1,4-benzoquinone, 2,5-toluquinone, 1,4-naphthoquinone, 2,3-dimethylbenzoquinone, 2,6-dimethylbenzoquinone, 2,3-dimethoxy-5-methyl-1,4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone, and phenyl-1,4-benzoquinone; and tetraphenylborate salts such as tetraphenylphosphonium tetraphenylborate, triphenylphosphine tetraphenylborate, and derivatives thereof. Among these components, one component may be used alone or two or more components may be used in combination.

[0085] As described above, the composition (X) may further contain a coupling agent. The coupling agent includes at least one selected from the group consisting of, for example, various silane compounds such as epoxy silane, mercapto silane, amino silane, alkyl silane, ureido silane, vinyl silane, titanium compounds, aluminum chelates, and aluminum / zirconium compounds.Specifically, the coupling agent includes at least one component selected from the group consisting of, for example, silane-based compounds such as vinyltriethoxysilane, vinyltris(β-methoxyethoxy)silane, γ-methacryloxypropyltrimethoxysilane, β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldimethoxysilane, γ-glycidoxypropyltriethoxysilane, vinyltriacetoxysilane, γ-mercaptopropyltrimethoxysilane, γ-mercaptopropylmethyldimethoxysilane, γ-mercaptopropyltriethoxysilane, γ-aminopropyltrimethoxysilane, γ-aminopropylmethyldimethoxysilane, γ-aminopropyltriethoxysilane, γ-anilinopropyltrimethoxysilane, γ-anilinopropylmethyldimethoxysilane, N-β-(aminoethyl)-γ-aminopropyltrimethoxysilane, γ-(β-aminoethyl)aminopropyldimethoxymethylsilane, N-(trimethoxysilylpropyl)ethylenediamine, N-(dimethoxymethylsilylisopropyl)ethylenediamine, N-β-(N-vinylbenzylaminoethyl)-γ-aminopropyltrimethoxysilane, γ-chloropropyltrimethoxysilane, hexamethyldisilane, and vinyltrimethoxysilane; and titanium-based compounds such as isopropyl triisostearoyl titanate, isopropyl tris(dioctyl pyrophosphate)titanate, isopropyl tris(N-aminoethyl-aminoethyl) titanate, tetraoctyl bis(ditridecyl phosphite)titanate, tetra(2,2-diallyl oxy methyl-1-butyl)bis(ditridecyl)phosphite titanate, bis(dioctyl pyrophosphate)oxy acetate titanate, bis(dioctyl pyrophosphate)oxy ethylene titanate, isopropyl trioctanoyl titanate, isopropyl dimethylacryloyl isostearoyl titanate, isopropyl tris(dodecyl)benzenesulfonyl titanate, isopropyl isostearoyl diacryloyl titanate, isopropyl tris(dioctyl phosphate)titanate, isopropyl tricumylphenyl titanate, and tetraisopropyl bis(dioctyl phosphite)titanate. Among these components, one component can be used alone or two or more components can be used in combination.

[0086] (3) Manufacturing method

[0087] The manufacturing method of composition (X) will be described.

[0088] Composition (X) can be prepared by any method as long as the method can uniformly disperse and mix various raw materials. Examples of common methods include the following methods: mixing raw materials in a specified compounding amount by using, for example, a mixer; then, melting and kneading the raw materials by using, for example, a mixing roll, a kneader, or an extruder to obtain a mixture; and cooling and pulverizing the mixture.

[0089] In addition, composition (X) pulverized in the above method can be used in the form of tablets. Optionally, composition (X) can be dissolved in various organic solvents to be used as a liquid resin composition. Thinly coating the liquid resin composition on a plate or a film and then removing the organic solvent enables composition (X) to be used as a sheet-like or film-like composition (X).

[0090] (4) Physical properties

[0091] The physical properties of composition (X) will be described.

[0092] [Gel time]

[0093] Regarding composition (X), for 1.67 mL of composition (X), the amount of time (gel time) required for the torque value measured under the condition of 170 °C to be 0.1 kgf·cm is, for example, 15 seconds or more and 80 seconds or less. When the gel time is 15 seconds or more, good fluidity when forming the encapsulation part from composition (X) can be maintained. When the gel time is 80 seconds or less, a good curing rate of composition (X) can be maintained. The gel time is preferably 30 seconds or more and preferably 60 seconds or less. Specifically, the torque value is measured by using a curelastometer test device, in which the temperatures of the upper and lower surfaces of the mold of the curelastometer test device are set to 170 °C, and a sample of 1.67 mL of composition (X) is injected into the mold. In the present disclosure, "the amount of time required for the torque value measured under the condition of 170 °C to be 0.1 kgf·cm for a 1.67 mL sample" is also referred to as the gel time. Note that, in order to measure the torque value and the gel time, 1.67 mL of composition (X) is used as the measurement sample, but this should not be construed as limiting the amount of composition (X) when producing a cured product in the present disclosure.

[0094] [Continuous formability]

[0095] The cured product of composition (X) can exhibit good continuous formability. Specifically, when pulling out the cured product obtained by forming composition (X) under the conditions of a forming temperature of 175 °C and a curing time of 180 seconds from the mold, the force (drag value) is preferably less than 40 N. More specifically, the case where the drag value is 40 N or more is preferably confirmed until a series of operations of producing the cured product in the mold and then pulling out the cured product from the mold are repeated more than 20 times. The case where the drag value is 40 N or more is more preferably confirmed until the operation is repeated more than 40 times. The case where the drag value is 40 N or more is even more preferably confirmed until the operation is repeated more than 60 times.

[0096] Note that the drag value can be measured by using a digital dynamometer. Examples of the forming method of composition (X) include a method using, for example, an appropriate forming machine.

[0097] [Adhesion to metal]

[0098] When composition (X) is formed on a metal, the cured product of composition (X) can have a high adhesion to the metal. For example, the adhesion of the cured product of composition (X) to the metal is 12 MPa or more. The adhesion to the metal can be confirmed as follows: making adhesion test pieces each of which is formed under the conditions of a forming temperature of 175 °C, an injection pressure of 9.8 MPa, and a curing time of 150 seconds by using a transfer molding machine adhere to the adherend; measuring the adhesion strength (shear strength) between the adhesion test piece and the adherend at room temperature by using an automatic die shear measurement device; and calculating the average value of the adhesion strength. Note that the number of adhesion test pieces is, for example, 6.

[0099] More specifically, by appropriately adjusting the components of the above-mentioned composition (X), the preferred properties of the above-mentioned composition (X) can be achieved. Note that the physical properties of composition (X) are not limited to the above physical properties.

[0100] (5) Application examples

[0101] The application examples of composition (X) will be described.

[0102] As described above, the composition (X) of the present embodiment is suitable for forming the encapsulation portion 4 of the semiconductor device 1. The semiconductor device 1 includes a semiconductor element 3 and an encapsulation portion 4 that encapsulates the semiconductor element 3. The encapsulation portion 4 is formed of composition (X). That is, the encapsulation portion 4 contains the cured product of composition (X) (refer to Figure 1 ). Hereinafter, examples of the semiconductor device 1 and the manufacturing method of the semiconductor device 1 will be described.

[0103] Examples of the semiconductor device 1 include single in-line package (SIP), zigzag in-line package (ZIP), dual in-line package (DIP), small outline package (SOP), small outline J-lead package (SOJ), small outline I-lead package (SOI), small outline F-lead package (SOF), quad flat package (QFP), quad flat J-lead package (QFJ), quad flat I-lead package (QFI), quad flat F-lead package (QFF), pin grid array package (PGA), plastic ball grid array package (PBGA), fine pitch ball grid array package (FBGA), wafer level package (WLP), panel level package (PLP), fan-out wafer level package (FO-WLP), fan-out panel level package (FO-PLP), flip chip ball grid array package (FC-BGA), package antenna (AiP), and system in package (SiP).

[0104] Figure 1 A cross-sectional view of the semiconductor device 1 according to the present embodiment is shown. The semiconductor device 1 includes a lead frame 2 made of metal, a semiconductor element 3 mounted on the lead frame 2, a wiring 5 that electrically connects the semiconductor element 3 to the lead frame 2, and a package portion 4 that packages the semiconductor element 3.

[0105] In the present embodiment, the lead frame 2 includes pads 6 (also referred to as chip pads) and pins 21, and each pin 21 has an inner lead 22 and an outer lead 23. The pins 21 are made of, for example, copper or a ferroalloy such as Alloy 42. The lead frame 2 further includes a plating layer 24 that covers the pins 21. This suppresses corrosion of the pins 21. The plating layer 24 includes at least one metal selected from the group consisting of, for example, silver, nickel, and palladium. The plating layer 24 may contain only one of silver, nickel, and palladium, or may contain an alloy containing at least one of silver, nickel, or palladium. The plating layer 24 may have a multilayer structure, and specifically may have a multilayer structure including at least one or more layers selected from the group consisting of, for example, a silver layer, a nickel layer, and a palladium layer that are stacked on each other. The thickness of the plating layer 24 is, for example, in the range of 1 μm or more and 20 μm or less, but is not particularly limited to this example.

[0106] Then, the semiconductor element 3 is fixed to the chip pad 6 of the lead frame 2 with an appropriate chip bonding material 7. In this way, the semiconductor element 3 can be mounted on the lead frame 2. The semiconductor element 3 is, for example, an integrated circuit, a large-scale integrated circuit, a transistor, a thyristor, a diode, or a solid-state imaging element. The semiconductor element 3 may be a new type of power device such as a SiC-based device or a GaN-based device.

[0107] Subsequently, the semiconductor element 3 is connected to the inner lead 22 of the lead frame 2 via the wiring 5. The wiring 5 can be made of gold and can contain at least one of silver or copper. For example, the wiring 5 can be made of silver or copper. When the wiring 5 contains at least one of silver or copper, the wiring 5 can be coated with a thin film of a metal such as palladium.

[0108] Subsequently, the composition (X) is formed to form the encapsulation part 4 that encapsulates the semiconductor element 3. Additionally, at this time, the wiring 5 can also be encapsulated in the encapsulation part 4. The encapsulation part 4 can further encapsulate the chip pad 6 and the inner lead 22, and in this case, the encapsulation part 4 is in contact with the lead frame 2. Furthermore, when the lead frame 2 includes the plating layer 24, the encapsulation part 4 can be in contact with the plating layer 24.

[0109] For example, the encapsulation part 4 can be formed by forming the composition (X) by a compression molding method. Examples of the compression molding method include an injection molding method, a transfer molding method, and a compression molding method. Additionally, the conditions for forming the composition (X) by the compression molding method are set accordingly according to the composition of the composition (X). For example, when the composition (X) is formed by the compression molding method, the molding pressure is, for example, 3.0 MPa or more, and the molding temperature is 120 °C or more.

[0110] In the case of the transfer molding method, in particular, the composition (X) is injected into the mold at an injection pressure of, for example, 3.0 MPa or more, preferably 4.0 MPa or more and 710 MPa or less. Additionally, the heating temperature (mold temperature) is preferably 120 °C or more, more preferably 160 °C or more and 190 °C or less. Additionally, the heating duration is, for example, 30 seconds or more and 300 seconds or less, more preferably 60 seconds or more and 180 seconds or less. Additionally, in the case of the transfer molding method, after the encapsulation part 4 is formed in the mold, post-curing can be performed by heating the encapsulation part 4 while the mold is kept closed, and then, the semiconductor device 1 can be taken out with the mold opened. The heating conditions for post-curing can include, for example, a heating duration of 160 °C or more and 190 °C or less and a heating duration of 2 hours or more and 8 hours or less.

[0111] After forming, the semiconductor device 1 is taken out of the mold. In this embodiment, the encapsulation part 4 of the semiconductor device 1 is formed of the composition (X). Therefore, the encapsulation part 4 has good mold release property from the mold, and thus the semiconductor device 1 is easily demolded from the mold. More specifically, the force (resistance) when pulling out the semiconductor device 1 from the mold is reduced, and the mold release agent (D) of the composition (X) is less likely to adhere to the mold, and thus the mold is less likely to be contaminated.

[0112] Thus, a semiconductor device 1 having an encapsulation portion 4 formed of the composition (X) is obtained. The encapsulation portion 4 included in the semiconductor device 1 is formed of the composition (X). When the composition (X) is formed on a metal, the composition (X) enables the cured product to have a high adhesion to the metal. That is, the adhesion between the encapsulation portion 4 and the lead frame 2 is good. Note that the manufacturing method of the semiconductor device 1 is not limited to the above method, as long as it can encapsulate electronic components such as a semiconductor element 3 of the semiconductor device 1 by filling the above composition (X).

[0113] (Summary)

[0114] As can be seen from the description of the above embodiments, the present disclosure has the following aspects. In the following description, in order to clarify the correspondence relationship of the constituent elements between the following aspects of the present disclosure and the above embodiments, reference numerals are inserted in parentheses.

[0115] The composition (X) of the first aspect of the present disclosure contains an epoxy resin (A), a curing agent (B), an inorganic filler (C), and a release agent (D). The release agent (D) contains a reaction product (d1) of an α-olefin-maleic anhydride copolymer and a monofunctional aliphatic glycidyl ether.

[0116] The first aspect can provide a composition (X) that has good fluidity during molding, provides good demoldability of the cured product of the composition (X) from the mold, and enables the cured product to have a high adhesion to the metal when the composition (X) is formed on the metal.

[0117] For the composition (X) of the second aspect of the present disclosure that cites the first aspect, the reaction product (d1) has a structural unit represented by the formula (C).

[0118]

[0119] Wherein R 3 and R 4 are each independently a hydrogen atom, a group represented by the formula (6), or a group represented by the formula (7), and at least one of R 3 or R 4 is a group represented by the formula (6) or a group represented by the formula (7).

[0120]

[0121] R in the formula (6) and the formula (7) 2 is an alkyl group having 10 or more and 25 or less carbon atoms.

[0122] In the composition (X) of the third aspect of the present disclosure that refers to the first or second aspect, the content of the reaction product (d1) is 10% by mass or more relative to the content of the release agent (D).

[0123] The third aspect can particularly improve the fluidity during molding, the mold release property of the cured product from the mold after molding, and the adhesion of the cured product to metal.

[0124] In the composition (X) of the fourth aspect of the present disclosure that refers to any one of the first to third aspects, the epoxy resin (A) contains at least one selected from the group consisting of biphenyl-type epoxy resins, biphenyl-arylalkyl-type epoxy resins, and naphthol-novolac-type epoxy resins.

[0125] The fourth aspect can make the cured product have improved heat resistance and improved fluidity during molding.

[0126] In the composition (X) of the fifth aspect of the present disclosure that refers to any one of the first to fourth aspects, the content of the inorganic filler (C) is 75% by mass or more and 95% by mass or less relative to the composition (X).

[0127] The fifth aspect can make the cured product have further improved heat resistance and further reduced coefficient of linear expansion.

[0128] In the composition (X) of the sixth aspect of the present disclosure that refers to any one of the first to fifth aspects, the number of carbon atoms of the monofunctional aliphatic glycidyl ether is 10 or more and 25 or less.

[0129] The sixth aspect enables the maintenance of a high adhesion of the cured product to metal, and further improves the fluidity during molding and the mold release property of the cured product from the mold after molding.

[0130] The semiconductor device (1) of the seventh aspect of the present disclosure includes a semiconductor element (3) and a package portion (4) that packages the semiconductor element (3). The package portion (4) contains a cured product of the composition (X) of any one of the first to sixth aspects.

[0131] Embodiment

[0132] Hereinafter, the present disclosure will be described in detail with reference to examples, but the present disclosure is not limited to these examples.

[0133] 1. Production method of resin composition

[0134] The production methods of the resin compositions of Examples 1 to 3 and Comparative Examples 1 to 4 will be described.

[0135] [Components]

[0136] The components of the resin compositions used in Production Examples 1 to 3 and Comparative Examples 1 to 4 will be described below.

[0137] (Epoxy resin)

[0138] Epoxy resin 1: Biphenyl type epoxy resin (manufactured by Mitsubishi Chemical Corporation, product name Epikote YX-4000H (epoxy equivalent 187 - 197 g / eq., melting point 105°C)).

[0139] Epoxy resin 2: Bisphenol A (biphenyl-aralkyl type) epoxy resin (manufactured by Mitsubishi Chemical Corporation, product name Epikote YL-6810 (epoxy equivalent 165 - 180 g / eq., melting point 45°C)).

[0140] Epoxy resin 3: Naphthalene ether type (naphthol-novolac type) epoxy resin (manufactured by DIC Corporation, product name EPICLON HP-6000L (epoxy equivalent 218 g / eq., softening point 59°C)).

[0141] (Curing agent)

[0142] Curing agent 1: Phenol-aralkyl type phenolic resin having a biphenyl skeleton (manufactured by MEIWA PLASTIC INDUSTRIES, LTD., product name MEH7851-SS).

[0143] Curing agent 2: Novolac type phenolic resin (manufactured by MEIWA PLASTIC INDUSTRIES, LTD., product name DL92).

[0144] (Inorganic filler)

[0145] Inorganic filler 1: Spherical alumina (manufactured by NIPPON STEEL Chemical & Material Co., LTD., product name AX3-20R).

[0146] Inorganic filler 2: Fused spherical silica (manufactured by Denka Company Limited, product name FB-5SDC).

[0147] Inorganic filler 3: Spherical silica (manufactured by Admatechs Company Limited, product name SO-25R).

[0148] (Release agent)

[0149] Release agent 1: Natural ester wax (manufactured by Dainichi Chemical Industry Co., LTD., product name Carnauba wax F1-100).

[0150] Release agent 2: Lignoceric acid diamide (manufactured by Dainichi Chemical Industry Co., LTD., product name J-900).

[0151] Release agent 3: α-olefin-maleic anhydride copolymer (manufactured by Mitsubishi Chemical Corporation, product name Diacarna (registered trademark) 30M).

[0152] Release agent 4: Reaction product obtained in Synthesis Example 1 below (reaction product of Diacarna (registered trademark) 30M and EpogoseyLA (D)).

[0153] Release agent 5: Reaction product obtained in Synthesis Example 2 below (reaction product of Diacarna (registered trademark) 30M and stearyl glycidyl ether).

[0154] Release agent 6: Reaction product obtained in Synthesis Example 3 below (reaction product of Diacarna (registered trademark) 30M and RIKARESIN BEO-60E).

[0155] (Curing accelerator)

[0156] Curing accelerator 1: Phosphorus-based curing accelerator (manufactured by San-Apro LTD., U-CAT RP701).

[0157] (Coupling agent)

[0158] Silane coupling agent 1: Silane coupling agent having an aniline structure as an organic functional group (manufactured by Shin-Etsu Silicone Co., LTD., product name KBM573).

[0159] Silane coupling agent 2: Silane coupling agent having a mercapto group as an organic functional group (manufactured by Shin-Etsu Silicone Co., LTD., product name KBM803).

[0160] (Pigment)

[0161] Pigment 1: Carbon black (manufactured by Mitsubishi Chemical Corporation, product name MA600).

[0162] (Regarding release agents 4 to 6)

[0163] According to the following methods (Synthesis Examples 1 to 3), an α-olefin-maleic anhydride copolymer was reacted with each glycidyl ether to produce mold release agents 4 to 6.

[0164] Synthesis Example 1: Mold release agent 4 was synthesized by reacting an α-olefin-maleic anhydride copolymer with a monofunctional aliphatic glycidyl ether having 15 carbon atoms.

[0165] 20 g of a copolymer of maleic anhydride and a mixture of, for example, 1-octacosene, 1-triacontene, 1-tetracontene, 1-pentacontene, and 1-hexacontene (manufactured by Mitsubishi Chemical Corporation, product name Diacarna (registered trademark) 30M), 10 g of lauryl glycidyl ether (manufactured by Yokkaichi Chemical Company Limited, product name Epogosey LA(D)), and 0.30 g of triphenylphosphine (manufactured by HOKKO CHEMICAL INDUSTRY CO., LTD., product name TX-TPP) were mixed and dissolved, and reacted at 120 °C for 0.5 hour to obtain mold release agent 4.

[0166] Synthesis Example 2: Mold release agent 5 was synthesized by reacting an α-olefin-maleic anhydride copolymer with a monofunctional aliphatic glycidyl ether having 19 carbon atoms.

[0167] Mold release agent 5 was obtained by the same method as described in Synthesis Example 1, except that 20 g of stearyl glycidyl ether (manufactured by Yokkaichi Chemical Company Limited, product name: stearyl glycidyl ether) was used as a substitute for lauryl glycidyl ether.

[0168] Synthesis Example 3: Mold release agent 6 was synthesized by reacting an α-olefin-maleic anhydride copolymer with a bifunctional aromatic glycidyl ether.

[0169] Mold release agent 6 was obtained by the same method as described in Synthesis Example 1, except that 20 g of bisphenol A bis(triethylene glycol glycidyl ether) ether (a bifunctional aromatic glycidyl ether having 33 carbon atoms) (manufactured by New Japan Chemical Co, LTD., product name RIKARESIN BEO-60E) was used as a substitute for lauryl glycidyl ether.

[0170] [Tabletting]

[0171] The resin compositions of Examples 1 to 3 and Comparative Examples 1 to 4 were tableted by the following method. First, the respective components shown in Table 1 in parts by mass were uniformly mixed and dispersed using a mixer, and melted and kneaded using a kneader at a kneading temperature of 90 to 140°C. Subsequently, the resin compositions of each of the Examples and Comparative Examples obtained by melting and kneading were cooled, then pulverized, and compressed to produce tablets of the resin compositions.

[0172] 2. Evaluation

[0173] The resin compositions of the Examples and Comparative Examples produced by the method described in "1. Production method of resin composition" were evaluated by the respective tests described below.

[0174] (1) Spiral flow

[0175] According to ASTM D3123, the resin compositions of each of the Examples and Comparative Examples were molded using a spiral flow die at a molding temperature of 170°C, an injection pressure of 70 kgf / cm 2 and a molding time of 180 seconds, and the distance (flow distance) flowed during 180 seconds from the start of molding was measured. The results are shown in Table 1.

[0176] (2) Gelation time

[0177] Using a curing breakdown tester test device (manufactured by JSR Corporation, product name Curelastometer IIIPS), the torque value of a 1.67 mL sample of the resin compositions of each of the Examples and Comparative Examples was measured at a temperature of 170°C on the upper and lower surfaces of the mold, and the amount of time required for the torque value to become 0.1 kgf·cm was read as the gelation time. The results are shown in Table 1.

[0178] (3) Evaluation of adhesion strength

[0179] Under the conditions of a molding temperature of 175°C, an injection pressure of 9.8 MPa, and a curing time of 150 seconds, using a transfer molding machine (manufactured by Marushichi Co., LTD., product name MF-030 type 30t press), using a 25 mm square high-conductivity heat-resistant alloy KFC (Kobe Steel, LTD., H grade) with a thickness of 0.5 mm as the adherend, six resin composition adhesion test pieces Molding. Then, the shear strength between each test piece and the adherend was measured at room temperature using an automatic die shear measurement device (manufactured by Nordson Advanced Technology LLC, product name DAGE4000 Optima). The average value of the measured shear strengths of six adhesion test pieces was calculated, and the results are shown in Table 1.

[0180] (4) Continuous moldability

[0181] After setting a substrate with dimensions of 70 mm × 70 mm in a plane view in the mold of a molding machine (manufactured by Dai-ichi Seiko Co., Ltd., product name S·Pot), the resin compositions of each example and comparative example prepared in the mold were molded under the conditions of a molding temperature of 175 °C and a curing time of 180 seconds, thereby producing a molded body in the mold. Immediately thereafter, the substrate was pulled out of the mold, so that the molded body was demolded from the mold.

[0182] One operation includes producing a molded body in the mold and demolding the molded body from the mold, and while measuring the force (drag value) required to pull the molded body out of the mold using a digital dynamometer (manufactured by IMADA Co., Ltd., product name ZTS-DPU-100N), the continuous moldability was evaluated based on the following criteria. The results are shown in Table 1.

[0183] A: It is possible to repeat the operation 60 times without the measured value showing a drag value of 40 N or more.

[0184] B: During the 41st to 60th operations, the drag value is 40 N or more.

[0185] C: During the 21st to 40th operations, the drag value is 40 N or more.

[0186] D: During the 0th to 20th operations, the drag value is 40 N or more.

[0187] Regarding the evaluation of continuous moldability, the operation is repeated 60 times, but if a measured value of 40 N or more is confirmed before the 60th operation, the measurement is ended at this time.

[0188] [Table 1]

[0189]

[0190] Compared with the resin compositions of Comparative Examples 1 to 3, the resin compositions of Examples 1 to 3 use a release agent obtained by the reaction of an α-olefin-maleic anhydride copolymer with a monofunctional aliphatic glycidyl ether, so that the fluidity and continuous moldability are good.

[0191] Unlike the resin composition of Comparative Example 4, the resin compositions of Examples 1 to 3 do not use a release agent obtained by the reaction of an α-olefin-maleic anhydride copolymer with a bifunctional glycidyl ether, but use a release agent obtained by the reaction of an α-olefin-maleic anhydride copolymer with a monofunctional aliphatic glycidyl ether, resulting in good adhesion strength and continuous formability.

[0192] In addition, unlike the resin composition of Comparative Example 4, the resin compositions of Examples 1 to 3 do not use a release agent obtained by the reaction of an α-olefin-maleic anhydride copolymer with a bifunctional glycidyl ether, but use a release agent obtained by the reaction of an α-olefin-maleic anhydride copolymer with a monofunctional aliphatic glycidyl ether, resulting in an increase in the length of the spiral flow and good fluidity.

[0193] Explanation of reference numerals

[0194] 1 Semiconductor device

[0195] 3 Semiconductor element

[0196] 4 Encapsulation part

Claims

1. An epoxy resin composition for semiconductor encapsulation, comprising: Epoxy resin (A); Curing agent (B); Inorganic filler (C); and Release agent (D), The release agent (D) includes a reaction product (d1) of an α-olefin-maleic anhydride copolymer and a monofunctional aliphatic glycidyl ether.

2. The epoxy resin composition for semiconductor encapsulation according to claim 1, wherein The reaction product (d1) has a structural unit represented by formula (C), Where R 3 and R 4 are each independently a hydrogen atom, a group represented by formula (6) or a group represented by formula (7), and R 3 or R 4 At least one of is a group represented by formula (6) or a group represented by formula (7), Where R in formula (6) and formula (7) 2 It is an alkyl group having 10 or more and 25 or less carbon atoms.

3. The epoxy resin composition for semiconductor encapsulation according to claim 1, wherein The content of the reaction product (d1) is 10% by mass or more relative to the content of the release agent (D).

4. The epoxy resin composition for semiconductor encapsulation according to claim 1, wherein The epoxy resin (A) includes at least one selected from the group consisting of biphenyl type epoxy resins, biphenyl-aralkyl type epoxy resins, and naphthol-novolac type epoxy resins.

5. The epoxy resin composition for semiconductor encapsulation according to claim 1, wherein The content of the inorganic filler (C) is 75% by mass or more and 95% by mass or less based on the epoxy resin composition for semiconductor encapsulation.

6. The epoxy resin composition for semiconductor encapsulation according to claim 1, wherein The monofunctional aliphatic glycidyl ether has 10 or more and 25 or less carbon atoms.

7. A semiconductor device comprising: Semiconductor components; and a packaging portion for packaging the semiconductor element, The encapsulating portion includes a cured product of the epoxy resin composition for semiconductor encapsulation according to any one of claims 1 to 6.

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